US20100147495A1

US20100147495A1 - Heat dissipation apparatus

Info

Publication number: US20100147495A1
Application number: US12/485,326
Authority: US
Inventors: Liang-Liang Cao; Zhong-Yong Du; Yang Li; Lei Guo
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2008-12-17
Filing date: 2009-06-16
Publication date: 2010-06-17
Also published as: CN201336791Y

Abstract

A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to a heat dissipation apparatus.
2. Description of Related Art
With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements. The heat must be removed quickly. A commonly used heat dissipation apparatus includes a heat sink mounted on a CPU. The typical heat sink includes a plurality of parallel fins and several heat pipes passing therethrough. However, such apparatus is heavy and dissipating efficiency low.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded view of an embodiment of a heat dissipation apparatus.

FIG. 2 is an assembled view of the heat dissipation apparatus of FIG. 1.

DETAILED DESCRIPTION

FIG. 1 is an exploded view of an embodiment of a heat dissipation apparatus. The heat dissipation apparatus includes a heat sink 10, and a fan 20 configured to be fixed on the heat sink 10.
The heat sink 10 includes a base 11, and a plurality of radial fins 12 formed on a top surface of the base 11. A bottom surface of the base 11 is configured to contact a heat source, such as a central processing unit (CPU). The heat generated by the heat source is transmitted to the fins 12 via the base 11. The fins 12 angle upwardly from the top surface of the base 11 to form a truncated conical space in the middle of the heat sink 10. A cross section of the truncated conical space gradually increases from the top surface of the base 11 to a top end of the fins 12. A top of the truncated conical space forms an air inlet for the fan 20. A plurality of guiding members 13 is formed behind the outmost fins 12 to define a plurality of air outlets 14 between adjacent fins 12. The airflow from the air inlet passes through the fins 12, and out the air outlets 14.
Referring to FIG. 2, the fan 20 is mounted on the heat sink 10 aligned with the air inlet of the heat sink 10. The fan 20 is mounted to the heat sink 10.
When the fan 20 rotates, airflow generated passes through the fins 12. As a result of the shape of the truncated conical space in the middle of the heat sink 10, speed of the airflow is accelerated when passing therethrough, reaching a maximum value at the top surface of the base 11. The high speed airflow strongly affects the top surface of the base 11, and heat accumulated therearound is dissipated swiftly. Here, the fins 12 and guiding members 13 are integrally formed with the base 11, and the weight of the heat sink 10 is minimized.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation apparatus comprising:

a base with a bottom surface; and

a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space, a cross section area of the truncated conical space gradually increasing from the top surface of the base to a top of the fins, and a top of the truncated conical space forming an air inlet for the heat sink.

2. The heat dissipation apparatus of claim 1, further comprising two guiding members formed behind each outside fin to define an air outlet therebetween, with airflow from the air inlet passing through the fins and out the air outlet.

3. The heat dissipation apparatus of claim 2, wherein the fins and guiding members are integrally formed with the base.

4. A heat dissipation apparatus, comprising:

a fan configured to generate airflow; and

a heat sink configured to contact a heat source, comprising:

a base with a bottom surface contacting the heat source;

5. The heat dissipation apparatus of claim 4, further comprising two guiding members formed behind each outside fin to define an air outlet therebetween, with airflow from the fan passing through the fins and out the air outlet.

6. The heat dissipation apparatus of claim 5, wherein the fan is round and mounted to the air inlet of the heat sink.

7. The heat dissipation apparatus of claim 5, wherein the fan is mounted to the heat sink by glue.

8. The heat dissipation apparatus of claim 5, wherein the fins and guiding members are integrally formed with the base.