US20100130107A1 - Method and apparatus for linear pad conditioning - Google Patents
Method and apparatus for linear pad conditioning Download PDFInfo
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- US20100130107A1 US20100130107A1 US12/615,216 US61521609A US2010130107A1 US 20100130107 A1 US20100130107 A1 US 20100130107A1 US 61521609 A US61521609 A US 61521609A US 2010130107 A1 US2010130107 A1 US 2010130107A1
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- Prior art keywords
- arm member
- coupled
- conditioning
- polishing
- gear
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Definitions
- Embodiments of the present invention generally relate to polishing a substrate, such as a semiconductor wafer.
- a feature side i.e., a deposit receiving surface
- planarization and polishing are procedures where previously deposited material is removed from the feature side of the substrate to form a generally even, planar or level surface.
- Chemical mechanical polishing is one process commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a semiconductor wafer by moving the feature side of the substrate in contact with a polishing pad while in the presence of a polishing fluid. Material is removed from the feature side of the substrate that is in contact with the polishing surface through a combination of chemical and mechanical activity.
- Periodic conditioning of the polishing surface is required to maintain a consistent roughness across the polishing surface to facilitate enhanced material removal.
- the conditioning is typically performed using a rotating conditioning disk that is urged against the polishing surface.
- the conditioning disk is coupled to a support member that moves the conditioning disk in a sweeping pattern relative to the polishing surface.
- the present invention generally provides an apparatus and method for conditioning a polishing pad using linear motion.
- an apparatus for conditioning a polishing pad is described.
- the apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base and an opposing second end, a second arm member having a first end pivotably coupled to a second end of the first arm member, and a conditioning disk coupled to a second end of the second arm member opposite the first end of the first arm member.
- a method of conditioning a polishing pad includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
- an apparatus for conditioning a polishing pad includes a base coupled to a platform, a first arm member coupled to the base, a second arm member coupled to the first arm member, a conditioning disk coupled to the second arm member opposite the base, and a joint member coupled between the first arm member and the second arm member, the joint member adapted to provide rotation of the first arm member relative to the second arm member.
- FIG. 1 is a plan view of a polishing module.
- FIG. 2 is a partial cross-sectional view of polishing module of FIG. 1 .
- FIG. 3A shows one embodiment of a conditioning module.
- FIG. 3B is a cross-sectional view of one embodiment of a conditioning arm assembly.
- FIG. 4A is a side view of a platen assembly showing one embodiment of a conditioning arm assembly in a partially extended position.
- FIG. 4B is top view of the platen assembly shown in FIG. 4A .
- FIG. 4C is a side view of the platen assembly of FIG. 4A showing the conditioning arm assembly in a partially retracted position.
- FIG. 4D is a top view of the platen assembly shown in FIG. 4C .
- FIG. 5A is a side view of a platen assembly showing another embodiment of a conditioning arm assembly in a partially extended position.
- FIG. 5B is top view of the platen assembly shown in FIG. 5A .
- FIG. 5C is a side view of the platen assembly of FIG. 5A showing the conditioning arm assembly in a partially retracted position.
- FIG. 5D is a top view of the platen assembly shown in FIG. 5C .
- Embodiments of the present invention generally provide a method and apparatus for conditioning a polishing surface of a polishing pad.
- a conditioning device having a linearly extendable arm configuration is described for use on a polishing pad having a circular configuration.
- embodiments of the conditioning device may be used on polishing pads having other shapes, such as rectangular polishing pads or belt-type polishing pads.
- FIG. 1 is a plan view of a polishing module 100 for processing one or more substrates, such as semiconductor wafers.
- the polishing module 100 includes a platform 106 that at least partially supports and houses a plurality of polishing stations 124 .
- Each of the plurality of polishing stations 124 are adapted to polish substrates that are retained in the one or more polishing heads 126 .
- the polishing stations 124 may be sized to interface with the one or more polishing heads 126 simultaneously so that polishing of one or a plurality of substrates may occur at a single polishing station 124 at the same time.
- the polishing heads 126 are coupled to a carriage 108 that is mounted to an overhead track 128 .
- the platform 106 also includes one or more load cups 122 adapted to facilitate transfer of a substrate between the polishing heads 126 and a factory interface (not shown) or other device (not shown) by a transfer robot.
- the load cups 122 generally facilitate transfer between a robot 108 and each of the polishing heads 126 .
- the overhead track 128 allows each carriage 108 to be selectively positioned around the polishing module 106 .
- the configuration of the overhead track 128 and carriages 108 facilitates positioning of the polishing heads 126 selectively over the polishing stations 124 and the load cups 122 .
- the overhead track 128 has a circular configuration (shown in phantom in FIG. 1 ) which allows the carriages 108 retaining the polishing heads 126 to be selectively rotated over and/or clear of the load cups 122 and the polishing stations 124 .
- the overhead track 128 may have other configurations including elliptical, oval, linear or other suitable orientation.
- polishing stations 124 are shown, located in opposite corners of the polishing module 106 .
- a third polishing station 124 (shown in phantom) may be positioned in the corner of the polishing module 126 opposite the load cups 122 .
- a second pair of load cups 122 (also shown in phantom) may be located in the corner of the polishing module 106 opposite the load cups 122 that are positioned proximate the robot 108 .
- Additional polishing stations 124 may be integrated in the polishing module 106 in systems having a larger footprint.
- each polishing station 124 may be a stand-alone unit adapted to couple to the platform 106 , other polishing stations 124 , and/or a facility floor.
- the polishing module 100 includes a modular capability wherein polishing stations, load cups, transfer devices or other equipment may be added or replaced within the platform 106 .
- Each polishing station 124 generally includes a polishing surface 130 , a conditioning module 132 and a polishing fluid delivery module 134 .
- the polishing surface 130 is supported on a platen assembly (not shown in FIG. 1 ) which rotates the polishing surface 130 during processing.
- the polishing surface 130 is suitable for at least one of a chemical mechanical polishing and/or an electrochemical mechanical polishing process.
- the polishing surface 130 is configured, in one embodiment, to accommodate polishing of at least two substrates simultaneously thereon.
- the polishing station 124 includes two conditioning modules 132 and two polishing fluid delivery modules 134 which condition and provide polishing fluid to the region of the polishing surface 130 just prior to interfacing with a respective substrate 170 .
- each of the polishing fluid delivery modules 134 are positioned to provide independently a predetermined distribution of polishing fluid on the polishing surface 130 so that a specific distribution of polishing fluid is respectively interfaced with each substrate during processing.
- FIG. 2 shows a partial cross-sectional view of polishing module 100 of FIG. 1 .
- the overhead track 128 is coupled to a support member 212 that is supported by a frame member 204 .
- the carriage 108 is utilized to position the polishing head 126 over the load cups 122 ( FIG. 1 ) or polishing surface 130 , to sweep the polishing head 126 across polishing surface 130 during processing, or to position the polishing head 126 clear of the load cups 122 and polishing surface 130 for maintenance of the polishing head 126 , the load cups 122 or polishing surface 130 .
- the carriage 108 is controllably positioned along the overhead track 128 by an actuator 205 .
- the actuator 205 may be in the form of a gear motor, servo motor, linear motor, sawyer motor or other motion control device suitable for accurately positioning the carriage 108 on the track 128 .
- each carriage 108 includes a linear motor that interfaces with a magnetic track coupled to the track 128 .
- the magnetic track comprises magnets arranged in alternating polarity so that each carriage 108 may be moved independently of the other carriages coupled to the overhead track 128 .
- the overhead track 128 is coupled to the frame member 204 while the polishing stations 124 are coupled to a polishing station platform 202 .
- each polishing station 124 can be provided as a stand-alone unit or a plurality of polishing stations 124 may be coupled together with the platform 202 .
- the polishing station platform 202 and frame member 204 are coupled to a floor 200 of the facility without being connected to each other. The decoupled polishing station platform 202 and frame member 204 allows vibrations associated with the movement of the carriages 108 to be substantially isolated from the polishing surface 130 , thereby minimizing potential impact to polishing results. Moreover, utilization of the polishing station platform 202 without a machine platform provides significant cost savings over conventional designs.
- the polishing head 126 is coupled to the carriage 108 by a shaft 232 .
- a motor 234 is coupled to the carriage 108 and is arranged to controllably rotate the shaft 232 , thereby rotating the polishing head 126 and a substrate 201 disposed therein during processing.
- At least one of the polishing head 126 or carriage 108 includes an actuator (not shown) for controlling the elevation of the polishing head 126 relative to the polishing surface 130 .
- the actuator allows the polishing head 126 to be pressed against the polishing surface 130 at about 6 psi or less, such as less than about 1.5 psi.
- a platen assembly 200 supports a polishing pad 218 that may be made entirely of a dielectric material or include conductive material disposed in a dielectric material. The upper surface of the pad 218 forms the polishing surface 130 .
- the platen assembly 200 is supported on the polishing station platform 202 by one or more bearings 214 .
- the platen 216 is coupled by a shaft 206 to a motor 208 that is utilized to rotate the platen assembly 200 .
- the motor 208 may be coupled by a bracket 210 to the polishing station platform 202 .
- the motor 208 is a direct drive motor. It is contemplated that other motors may be utilized to rotate the shaft 206 . In the embodiment depicted in FIG.
- the motor 208 is utilized to rotate the platen assembly 200 such that the pad 218 retained thereon is rotated during processing while the substrate 170 is retained against the polishing surface 130 by the polishing head 126 .
- the platen assembly 300 may be large enough to support a polishing pad 218 which will accommodate polishing of at least two substrates retained by different polishing heads 126 .
- the dielectric polishing pad 218 is greater than 30 inches in diameter, for example, between about 30 and about 52 inches, such as 42 inches.
- the pad unit area per number of substrate simultaneously polished thereon is much greater than conventional single substrate pads, thereby allowing the pad service life to be significantly extended, for example, approaching about 2000 substrates per pad.
- the conditioning module 132 is activated to contact and condition the polishing surface 130 . Additionally, polishing fluid is delivered through the polishing fluid delivery module 134 to the polishing surface 130 during processing and/or conditioning.
- the distribution of fluid provided by the polishing fluid delivery arm 132 may be selected to control the distribution of polishing fluid across the lateral surface of the polishing surface 130 . It should be noted that only one polishing head 126 , conditioning module 132 and polishing fluid delivery module 134 are depicted in FIG. 2 for the sake of clarity.
- FIG. 3A shows one embodiment of a conditioning module 132 .
- the conditioning module 132 is coupled to the polishing station platform 202 .
- the conditioning module 132 includes a base 302 having a conditioning arm assembly 304 extended therefrom in a cantilevered fashion.
- the distal end of the arm assembly 304 supports a conditioning head 306 .
- a conditioning disk 308 is removably attached to the conditioning head 306 .
- a first motor or actuator 312 is provided to rotate the arm assembly 304 over the polishing surface 130 during conditioning, and to position the arm assembly 304 clear of the polishing surface 130 when desired.
- the conditioning arm assembly 304 includes at least two articulatable arms or links, such as a first arm member 330 A and a second arm member 330 B.
- the conditioning arm assembly 304 also includes at least one pivot point or joint 332 coupling the first and second arm member 330 A, 330 B providing relative movement between the arm members 330 A, 330 B.
- a second motor 320 is utilized to move the first arm member 330 A relative to the second arm member 330 B.
- the second motor 320 is coupled to a transmission system 325 that, in one embodiment, includes a shaft 322 (shown in phantom) which is coupled to a drive member 309 , which in turn are coupled to one or more transmission members 326 , which may be belts, wires, or cables.
- the transmission members 326 such as belts are coupled to drive members 309 and the shaft 322 to facilitate movement of the first arm member 330 A relative to the second arm member 330 B such that angular changes are provided between the first arm member 330 A and the second arm member 330 B.
- Each of the drive members 309 may be a pulley or gear adapted to transfer rotational or translation motion from one element to another.
- the term “gear” as used herein is intended to generally describe a component that is rotationally coupled to a transmission member 326 , such as a belt, teeth, wires, cables, and is adapted to transmit motion from one element to another.
- a gear as used herein, may be a conventional gear type device or pulley type device, which may include but is not limited to components such as, a spur gear, bevel gear, rack and/or pinion, worm gear, a sheave, a timing pulley, and a v-belt pulley.
- the joint 332 may be a revolute joint, a screw joint, or other joint having one or more degrees of freedom.
- the elevation of the conditioning arm assembly 304 may be controlled by a vertical actuator 318 .
- the actuator 318 is coupled to a guide 314 that is coupled to the base 302 .
- the guide 314 may be positioned along a rail 316 which is coupled to the polishing station platform 202 so that the actuator 318 may control the elevation of the conditioning arm assembly 304 and the conditioning head 306 .
- a collar 324 is provided to prevent liquid from passing between the base 302 and an upper surface 310 of the polishing station platform 220 .
- FIG. 3B shows a cross-sectional view of one embodiment of a conditioning arm assembly 304 .
- the conditioning arm assembly 304 includes two transmission systems that may be used together or separately.
- a first transmission system 325 includes a first drive system 351 A coupled to a second drive system 351 B.
- the first drive system 351 A includes a first gear 352 A coupled to a shaft 353 extending from a first motor 356 A.
- the first gear 352 A is coupled to a second gear 352 B by a transmission member 354 A, such as a belt.
- the second gear 352 B is coupled to a shaft 322 that is coupled to a second drive system 351 B.
- the second drive system includes the third gear 352 C and a fourth gear 352 D which are coupled by a second transmission member 354 B, such as a belt.
- the fourth gear 352 D is fixedly coupled to a shaft 358 that extends from the first arm member 330 A and is fixedly coupled to the second arm member 330 B. Rotational movement from the first motor 356 A is transmitted to the shaft 358 to provide movement of the second arm member 330 B relative to the first arm member 330 A.
- the first transmission system 325 includes a transmission ratio (e.g., ratio of diameters, ratio of the number of gear teeth) of the first drive system 351 A and second drive system 351 B that is designed to achieve a desired shape and resolution of an actuation or extension path (e.g., element 450 A and/or 450 B in FIG. 4A ).
- the transmission ratio will be hereafter defined as the driving element size to the driven element size, or in this case, for example, the ratio of number of teeth of on third gear 352 C to the number of teeth on the fourth gear 352 D.
- gear ratio is meant to denote that n 1 number of turns of the first gear causes n 2 number of turns of the second gear, or an n 1 :n 2 ratio. Therefore, a 3:2 ratio means that three turns of the first gear will cause two turns of the second gear and thus the first gear must be about two thirds the size of the second gear.
- the gear ratio of the third gear 352 C to the fourth gear 352 D is between about 3:1 to about 4:3, such as between about 2:1 and about 3:2.
- a second transmission system 360 is provided on the conditioning arm assembly 304 that may be utilized along with the first transmission system 325 .
- the second transmission system 360 is configured to rotate the conditioning head 306 about a center axis.
- the second transmission system 360 includes a first gear 362 A coupled to a second motor 356 B by a shaft 361 .
- the first gear 362 A is coupled to a second gear 362 B and third gear 362 C by a transmission member 363 A. Rotational movement from the second motor 356 B is transmitted to the second gear 362 B and third gear 362 C by the transmission member 363 A.
- a second transmission member 363 B is coupled between the third gear 362 C and a fourth gear 362 D and fifth gear 362 E to transmit rotational movement from the second motor 356 B to the fifth gear 362 E.
- a sixth gear 362 F is rotationally coupled to the fifth gear 362 E by a third transmission member 363 C.
- the sixth gear 362 F is coupled to a shaft 364 that is coupled to the conditioning head 306 .
- bearings and/or seals for each of the gears and shafts may be provided.
- one or both of the first motor 356 A and second motor 356 B is a stepper motor or DC servomotor.
- a flexible sleeve or cover 350 may be coupled to the conditioning arm assembly 304 at the joint 332 to contain any particles that may be generated at the joint 332 .
- FIGS. 4A-4D are side and plan views of one embodiment of conditioning arm assembly 404 .
- FIGS. 4A and 4B show the conditioning arm assembly 404 in a partially extended position and FIGS. 4C and 4D show the conditioning arm assembly 404 in a partially retracted position.
- the conditioning arm assembly 404 may be configured similarly to the embodiment of the conditioning arm assembly 304 of FIGS. 3A and 3B , or include additional or alternative transmission systems.
- the conditioning arm assembly 404 may include a first transmission system 325 as described in FIGS. 3A and 3B and a second transmission system comprising a motor 415 coupled to the conditioning head 306 to rotate the conditioning head 306 .
- the conditioning arm assembly 404 includes arm members 330 A, 330 B, a first joint 432 A and a second joint 432 B.
- Each arm member 330 A, 330 B moves relative to the other in a horizontal plane (X direction).
- the first joint 432 A is proximate the base 302 and may be either fixed to the base 302 to move the first member with the base 302 or movably coupled to the base 302 such that the first arm member 330 A moves at least rotationally relative to the base 302 .
- the second joint 432 B is configured to pivotally couple the first arm member 330 A to the second arm member 330 B.
- the first joint 432 A may be coupled to the first transmission system 325 of FIG.
- the first joint 432 A may be coupled to an actuator 410 , such as a stepper motor or DC servomotor adapted to rotate the first arm member 330 A relative to the base 302 about axis A.
- a joint actuator 420 may be coupled at the second joint 432 B to move the first arm member 330 A relative to the second arm member 330 B about axis B.
- the conditioning head 306 may be coupled to the motor 415 coupled to the second arm member 330 B.
- the motor 415 may be a direct drive motor is adapted to provide rotational motion to the conditioning head 306 along axis C.
- FIG. 4B is a top view of the conditioning arm assembly 404 of FIG. 4A .
- the conditioning arm assembly 404 provides a first sweep path 450 A to condition the polishing surface 130 .
- the conditioning arm assembly 404 moves in a radial direction across the polishing surface 130 .
- the first sweep path 450 A may also include a linear directional component such as substantial back and forth movement in the Y direction.
- the conditioning head 306 moves across the polishing surface 130 from a position near the center of the polishing surface 130 to a position near an edge of the polishing surface 130 as shown in FIGS. 4C and 4D .
- the conditioning head 306 may be actuated to move in a second sweep path 450 B, such as an arcuate path.
- the conditioning head 306 may be moved in an arcuate orientation by actuating the conditioning arm assembly 404 to move about at least one or both of axes A and B.
- a downward pressure in a range between about 0.1 pound-force (lb-f) to about 10 lb-f, for example about 0.5 lb-f to about 8 lb-f, such as between about 1.0 lb-f to about 3 lb-f may be applied to conditioning head 306 having the conditioning disk coupled thereto.
- FIGS. 5A-5D are side and plan views of one embodiment of conditioning arm assembly 504 .
- FIGS. 5A and 5B show the conditioning arm assembly 504 in a partially extended position and
- FIGS. 5C and 5D show the conditioning arm assembly 504 in a partially retracted position.
- the conditioning arm assembly 504 may be configured similarly to the embodiment of the conditioning arm assembly 304 of FIGS. 3A and 3B , or include additional or alternative transmission systems.
- the conditioning arm assembly 504 includes arm members 330 A, 330 B, a first joint 532 A and a second joint 532 B.
- Each arm member 330 A, 330 B moves relative to the other in a vertical plane (Z direction).
- the first arm member 330 A is movably coupled by first joint 532 A to the base 302 to rotate the first arm member 330 A relative to the base 302 .
- the second joint 532 B is configured to pivotally couple the first arm member 330 A to the second arm member 330 B.
- the first joint 532 A may be coupled to the first transmission system 325 of FIG. 3B to move the first arm member 330 A and second arm member 330 B.
- the first joint 532 A may be coupled to an actuator 410 , such as a stepper motor or DC servomotor adapted to rotate the first arm member 330 A relative to the base 302 about axis A′.
- a joint actuator 520 may be coupled to the second joint 532 B to move the first arm member 330 A relative to the second arm member 330 B about axis B′.
- a third joint 532 C may be utilized to couple the conditioning head 306 to the second arm member 330 B.
- the third joint 532 C may be adapted to float or be configured as a gimbal to allow rotational movement along axis C′.
- the conditioning head 306 may be coupled to a motor 415 to rotate the conditioning head 306 .
- the motor 415 may be a direct drive motor is adapted to provide rotational motion to the conditioning head 306 .
- the motor 415 may be coupled to a gear box or transmission device (not shown) adapted to translate rotational actuation from the motor 415 to the conditioning head 306 , such as a right angle gear box.
- the embodiments of the conditioning arm assemblies 304 , 404 and 504 as described above provide a more accurate and controllable sweep pattern as compared to other conditioning apparatus.
- the configuration of the conditioning arm assemblies 304 , 404 and 504 use less space on a polishing module 100 which allows additional space for polishing heads, fluid delivery modules and other hardware used in or on the polishing module 100 .
- the movement configurations of the first arm member 330 A and the second arm member 330 B may be varied based on allocated space on the polishing module 100 . Factors such as height allowances, width allowances, and other dimensional constraints between other hardware disposed on the polishing module 100 may be considered and the conditioning arm assemblies 304 , 404 and 504 may be configured accordingly.
- the configuration of the conditioning arm assemblies 304 , 404 and 504 provides alternative sweep patterns to perform a conditioning process.
Abstract
A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
Description
- This application claims benefit of U.S. provisional patent application Ser. No. 61/117,536, filed Nov. 24, 2008, which is herein incorporated by reference.
- 1. Field of the Invention
- Embodiments of the present invention generally relate to polishing a substrate, such as a semiconductor wafer.
- 2. Description of the Related Art
- In the fabrication of integrated circuits and other electronic devices on substrates, multiple layers of conductive, semiconductive, and dielectric materials are deposited on or removed from a feature side, i.e., a deposit receiving surface, of a substrate. As layers of materials are sequentially deposited and removed, the feature side of the substrate may become non-planar and require planarization and/or polishing. Planarization and polishing are procedures where previously deposited material is removed from the feature side of the substrate to form a generally even, planar or level surface.
- Chemical mechanical polishing is one process commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a semiconductor wafer by moving the feature side of the substrate in contact with a polishing pad while in the presence of a polishing fluid. Material is removed from the feature side of the substrate that is in contact with the polishing surface through a combination of chemical and mechanical activity.
- Periodic conditioning of the polishing surface is required to maintain a consistent roughness across the polishing surface to facilitate enhanced material removal. The conditioning is typically performed using a rotating conditioning disk that is urged against the polishing surface. The conditioning disk is coupled to a support member that moves the conditioning disk in a sweeping pattern relative to the polishing surface. Providing a specific and/or consistent sweep pattern across the polishing surfaces creates challenges during conditioning that may result non-uniform roughness of the polishing surface. The non-uniform roughness may decrease material removal, which results in decreased throughput.
- Therefore, there is a need for a method and apparatus that facilitates selective and/or consistent conditioning of the polishing surface.
- The present invention generally provides an apparatus and method for conditioning a polishing pad using linear motion. In one embodiment, an apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base and an opposing second end, a second arm member having a first end pivotably coupled to a second end of the first arm member, and a conditioning disk coupled to a second end of the second arm member opposite the first end of the first arm member.
- In another embodiment, a method of conditioning a polishing pad is described. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
- In another embodiment, an apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member coupled to the base, a second arm member coupled to the first arm member, a conditioning disk coupled to the second arm member opposite the base, and a joint member coupled between the first arm member and the second arm member, the joint member adapted to provide rotation of the first arm member relative to the second arm member.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
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FIG. 1 is a plan view of a polishing module. -
FIG. 2 is a partial cross-sectional view of polishing module ofFIG. 1 . -
FIG. 3A shows one embodiment of a conditioning module. -
FIG. 3B is a cross-sectional view of one embodiment of a conditioning arm assembly. -
FIG. 4A is a side view of a platen assembly showing one embodiment of a conditioning arm assembly in a partially extended position. -
FIG. 4B is top view of the platen assembly shown inFIG. 4A . -
FIG. 4C is a side view of the platen assembly ofFIG. 4A showing the conditioning arm assembly in a partially retracted position. -
FIG. 4D is a top view of the platen assembly shown inFIG. 4C . -
FIG. 5A is a side view of a platen assembly showing another embodiment of a conditioning arm assembly in a partially extended position. -
FIG. 5B is top view of the platen assembly shown inFIG. 5A . -
FIG. 5C is a side view of the platen assembly ofFIG. 5A showing the conditioning arm assembly in a partially retracted position. -
FIG. 5D is a top view of the platen assembly shown inFIG. 5C . - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.
- Embodiments of the present invention generally provide a method and apparatus for conditioning a polishing surface of a polishing pad. A conditioning device having a linearly extendable arm configuration is described for use on a polishing pad having a circular configuration. Although not shown, embodiments of the conditioning device may be used on polishing pads having other shapes, such as rectangular polishing pads or belt-type polishing pads.
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FIG. 1 is a plan view of apolishing module 100 for processing one or more substrates, such as semiconductor wafers. Thepolishing module 100 includes aplatform 106 that at least partially supports and houses a plurality of polishingstations 124. Each of the plurality of polishingstations 124 are adapted to polish substrates that are retained in the one or more polishing heads 126. The polishingstations 124 may be sized to interface with the one or more polishing heads 126 simultaneously so that polishing of one or a plurality of substrates may occur at asingle polishing station 124 at the same time. The polishing heads 126 are coupled to acarriage 108 that is mounted to anoverhead track 128. Theplatform 106 also includes one ormore load cups 122 adapted to facilitate transfer of a substrate between the polishing heads 126 and a factory interface (not shown) or other device (not shown) by a transfer robot. The load cups 122 generally facilitate transfer between arobot 108 and each of the polishing heads 126. - The
overhead track 128 allows eachcarriage 108 to be selectively positioned around thepolishing module 106. The configuration of theoverhead track 128 andcarriages 108 facilitates positioning of the polishing heads 126 selectively over the polishingstations 124 and the load cups 122. In the embodiment depicted inFIGS. 1-2 , theoverhead track 128 has a circular configuration (shown in phantom inFIG. 1 ) which allows thecarriages 108 retaining the polishing heads 126 to be selectively rotated over and/or clear of the load cups 122 and the polishingstations 124. It is contemplated that theoverhead track 128 may have other configurations including elliptical, oval, linear or other suitable orientation. - Referring now primarily to
FIG. 1 , two polishingstations 124 are shown, located in opposite corners of thepolishing module 106. Optionally, a third polishing station 124 (shown in phantom) may be positioned in the corner of thepolishing module 126 opposite the load cups 122. Alternatively or additionally, a second pair of load cups 122 (also shown in phantom) may be located in the corner of thepolishing module 106 opposite the load cups 122 that are positioned proximate therobot 108. Additional polishingstations 124 may be integrated in thepolishing module 106 in systems having a larger footprint. In one embodiment, each polishingstation 124 may be a stand-alone unit adapted to couple to theplatform 106, other polishingstations 124, and/or a facility floor. In this embodiment, thepolishing module 100 includes a modular capability wherein polishing stations, load cups, transfer devices or other equipment may be added or replaced within theplatform 106. - Each polishing
station 124 generally includes a polishingsurface 130, aconditioning module 132 and a polishingfluid delivery module 134. The polishingsurface 130 is supported on a platen assembly (not shown inFIG. 1 ) which rotates the polishingsurface 130 during processing. In one embodiment, the polishingsurface 130 is suitable for at least one of a chemical mechanical polishing and/or an electrochemical mechanical polishing process. - The polishing
surface 130 is configured, in one embodiment, to accommodate polishing of at least two substrates simultaneously thereon. In such an embodiment, the polishingstation 124 includes twoconditioning modules 132 and two polishingfluid delivery modules 134 which condition and provide polishing fluid to the region of the polishingsurface 130 just prior to interfacing with a respective substrate 170. Additionally, each of the polishingfluid delivery modules 134 are positioned to provide independently a predetermined distribution of polishing fluid on the polishingsurface 130 so that a specific distribution of polishing fluid is respectively interfaced with each substrate during processing. -
FIG. 2 shows a partial cross-sectional view of polishingmodule 100 ofFIG. 1 . Specifically, the interface between theoverhead track 128 and thecarriage 108 is shown. Theoverhead track 128 is coupled to asupport member 212 that is supported by aframe member 204. Thecarriage 108 is utilized to position the polishinghead 126 over the load cups 122 (FIG. 1 ) or polishingsurface 130, to sweep the polishinghead 126 across polishingsurface 130 during processing, or to position the polishinghead 126 clear of the load cups 122 and polishingsurface 130 for maintenance of the polishinghead 126, the load cups 122 or polishingsurface 130. Thecarriage 108 is controllably positioned along theoverhead track 128 by anactuator 205. Theactuator 205 may be in the form of a gear motor, servo motor, linear motor, sawyer motor or other motion control device suitable for accurately positioning thecarriage 108 on thetrack 128. In one embodiment, eachcarriage 108 includes a linear motor that interfaces with a magnetic track coupled to thetrack 128. The magnetic track comprises magnets arranged in alternating polarity so that eachcarriage 108 may be moved independently of the other carriages coupled to theoverhead track 128. - In one embodiment, the
overhead track 128 is coupled to theframe member 204 while the polishingstations 124 are coupled to a polishingstation platform 202. In this embodiment, each polishingstation 124 can be provided as a stand-alone unit or a plurality of polishingstations 124 may be coupled together with theplatform 202. In one embodiment, the polishingstation platform 202 andframe member 204 are coupled to afloor 200 of the facility without being connected to each other. The decoupledpolishing station platform 202 andframe member 204 allows vibrations associated with the movement of thecarriages 108 to be substantially isolated from the polishingsurface 130, thereby minimizing potential impact to polishing results. Moreover, utilization of the polishingstation platform 202 without a machine platform provides significant cost savings over conventional designs. - The polishing
head 126 is coupled to thecarriage 108 by ashaft 232. Amotor 234 is coupled to thecarriage 108 and is arranged to controllably rotate theshaft 232, thereby rotating the polishinghead 126 and asubstrate 201 disposed therein during processing. At least one of the polishinghead 126 orcarriage 108 includes an actuator (not shown) for controlling the elevation of the polishinghead 126 relative to the polishingsurface 130. In one embodiment, the actuator allows the polishinghead 126 to be pressed against the polishingsurface 130 at about 6 psi or less, such as less than about 1.5 psi. - A
platen assembly 200 supports apolishing pad 218 that may be made entirely of a dielectric material or include conductive material disposed in a dielectric material. The upper surface of thepad 218 forms the polishingsurface 130. Theplaten assembly 200 is supported on the polishingstation platform 202 by one ormore bearings 214. Theplaten 216 is coupled by ashaft 206 to amotor 208 that is utilized to rotate theplaten assembly 200. Themotor 208 may be coupled by abracket 210 to the polishingstation platform 202. In one embodiment, themotor 208 is a direct drive motor. It is contemplated that other motors may be utilized to rotate theshaft 206. In the embodiment depicted inFIG. 2 , themotor 208 is utilized to rotate theplaten assembly 200 such that thepad 218 retained thereon is rotated during processing while the substrate 170 is retained against the polishingsurface 130 by the polishinghead 126. It is contemplated, as shown inFIG. 1 , that theplaten assembly 300 may be large enough to support apolishing pad 218 which will accommodate polishing of at least two substrates retained by different polishing heads 126. In one embodiment, thedielectric polishing pad 218 is greater than 30 inches in diameter, for example, between about 30 and about 52 inches, such as 42 inches. Even though thedielectric polishing pad 218 may be utilized to polish two substrates simultaneously, the pad unit area per number of substrate simultaneously polished thereon is much greater than conventional single substrate pads, thereby allowing the pad service life to be significantly extended, for example, approaching about 2000 substrates per pad. - During processing or when otherwise desired, the
conditioning module 132 is activated to contact and condition the polishingsurface 130. Additionally, polishing fluid is delivered through the polishingfluid delivery module 134 to the polishingsurface 130 during processing and/or conditioning. The distribution of fluid provided by the polishingfluid delivery arm 132 may be selected to control the distribution of polishing fluid across the lateral surface of the polishingsurface 130. It should be noted that only one polishinghead 126,conditioning module 132 and polishingfluid delivery module 134 are depicted inFIG. 2 for the sake of clarity. -
FIG. 3A shows one embodiment of aconditioning module 132. In this embodiment, theconditioning module 132 is coupled to the polishingstation platform 202. Theconditioning module 132 includes a base 302 having aconditioning arm assembly 304 extended therefrom in a cantilevered fashion. The distal end of thearm assembly 304 supports aconditioning head 306. Aconditioning disk 308 is removably attached to theconditioning head 306. In one embodiment, a first motor oractuator 312 is provided to rotate thearm assembly 304 over the polishingsurface 130 during conditioning, and to position thearm assembly 304 clear of the polishingsurface 130 when desired. - The
conditioning arm assembly 304 includes at least two articulatable arms or links, such as afirst arm member 330A and asecond arm member 330B. Theconditioning arm assembly 304 also includes at least one pivot point or joint 332 coupling the first andsecond arm member arm members second motor 320 is utilized to move thefirst arm member 330A relative to thesecond arm member 330B. Thesecond motor 320 is coupled to atransmission system 325 that, in one embodiment, includes a shaft 322 (shown in phantom) which is coupled to adrive member 309, which in turn are coupled to one ormore transmission members 326, which may be belts, wires, or cables. In one embodiment, thetransmission members 326, such as belts are coupled to drivemembers 309 and theshaft 322 to facilitate movement of thefirst arm member 330A relative to thesecond arm member 330B such that angular changes are provided between thefirst arm member 330A and thesecond arm member 330B. - Each of the
drive members 309 may be a pulley or gear adapted to transfer rotational or translation motion from one element to another. The term “gear” as used herein is intended to generally describe a component that is rotationally coupled to atransmission member 326, such as a belt, teeth, wires, cables, and is adapted to transmit motion from one element to another. In general, a gear, as used herein, may be a conventional gear type device or pulley type device, which may include but is not limited to components such as, a spur gear, bevel gear, rack and/or pinion, worm gear, a sheave, a timing pulley, and a v-belt pulley. The joint 332 may be a revolute joint, a screw joint, or other joint having one or more degrees of freedom. - In one embodiment, the elevation of the
conditioning arm assembly 304 may be controlled by avertical actuator 318. In one embodiment, theactuator 318 is coupled to aguide 314 that is coupled to thebase 302. Theguide 314 may be positioned along arail 316 which is coupled to the polishingstation platform 202 so that theactuator 318 may control the elevation of theconditioning arm assembly 304 and theconditioning head 306. Acollar 324 is provided to prevent liquid from passing between the base 302 and anupper surface 310 of the polishing station platform 220. -
FIG. 3B shows a cross-sectional view of one embodiment of aconditioning arm assembly 304. In this embodiment, theconditioning arm assembly 304 includes two transmission systems that may be used together or separately. Afirst transmission system 325 includes afirst drive system 351A coupled to asecond drive system 351B. Thefirst drive system 351A includes afirst gear 352A coupled to ashaft 353 extending from afirst motor 356A. Thefirst gear 352A is coupled to asecond gear 352B by atransmission member 354A, such as a belt. Thesecond gear 352B is coupled to ashaft 322 that is coupled to asecond drive system 351B. The second drive system includes thethird gear 352C and afourth gear 352D which are coupled by asecond transmission member 354B, such as a belt. Thefourth gear 352D is fixedly coupled to ashaft 358 that extends from thefirst arm member 330A and is fixedly coupled to thesecond arm member 330B. Rotational movement from thefirst motor 356A is transmitted to theshaft 358 to provide movement of thesecond arm member 330B relative to thefirst arm member 330A. - In one aspect, the
first transmission system 325 includes a transmission ratio (e.g., ratio of diameters, ratio of the number of gear teeth) of thefirst drive system 351A andsecond drive system 351B that is designed to achieve a desired shape and resolution of an actuation or extension path (e.g.,element 450A and/or 450B inFIG. 4A ). The transmission ratio will be hereafter defined as the driving element size to the driven element size, or in this case, for example, the ratio of number of teeth of onthird gear 352C to the number of teeth on thefourth gear 352D. Therefore, for example, where thefirst arm member 330A is rotated 270 degrees which causes thesecond arm member 330B to rotate 180 degrees equates to a 0.667 transmission ratio or alternately a 3:2 gear ratio. The term gear ratio is meant to denote that n1 number of turns of the first gear causes n2 number of turns of the second gear, or an n1:n2 ratio. Therefore, a 3:2 ratio means that three turns of the first gear will cause two turns of the second gear and thus the first gear must be about two thirds the size of the second gear. In one aspect, the gear ratio of thethird gear 352C to thefourth gear 352D is between about 3:1 to about 4:3, such as between about 2:1 and about 3:2. - In one embodiment, a
second transmission system 360 is provided on theconditioning arm assembly 304 that may be utilized along with thefirst transmission system 325. In this embodiment, thesecond transmission system 360 is configured to rotate theconditioning head 306 about a center axis. Thesecond transmission system 360 includes afirst gear 362A coupled to asecond motor 356B by ashaft 361. Thefirst gear 362A is coupled to asecond gear 362B andthird gear 362C by atransmission member 363A. Rotational movement from thesecond motor 356B is transmitted to thesecond gear 362B andthird gear 362C by thetransmission member 363A. Asecond transmission member 363B is coupled between thethird gear 362C and afourth gear 362D andfifth gear 362E to transmit rotational movement from thesecond motor 356B to thefifth gear 362E. Asixth gear 362F is rotationally coupled to thefifth gear 362E by athird transmission member 363C. Thesixth gear 362F is coupled to ashaft 364 that is coupled to theconditioning head 306. Thus, rotational movement of thesecond motor 356B is transmitted to theconditioning head 306 through theconditioning arm assembly 304. While not shown, bearings and/or seals for each of the gears and shafts may be provided. In one aspect, one or both of thefirst motor 356A andsecond motor 356B is a stepper motor or DC servomotor. A flexible sleeve or cover 350 may be coupled to theconditioning arm assembly 304 at the joint 332 to contain any particles that may be generated at the joint 332. -
FIGS. 4A-4D are side and plan views of one embodiment ofconditioning arm assembly 404.FIGS. 4A and 4B show theconditioning arm assembly 404 in a partially extended position andFIGS. 4C and 4D show theconditioning arm assembly 404 in a partially retracted position. In the embodiment shown inFIGS. 4A-4D , theconditioning arm assembly 404 may be configured similarly to the embodiment of theconditioning arm assembly 304 ofFIGS. 3A and 3B , or include additional or alternative transmission systems. In one embodiment, theconditioning arm assembly 404 may include afirst transmission system 325 as described inFIGS. 3A and 3B and a second transmission system comprising amotor 415 coupled to theconditioning head 306 to rotate theconditioning head 306. - In
FIGS. 4A-4D , theconditioning arm assembly 404 includesarm members arm member base 302 and may be either fixed to the base 302 to move the first member with the base 302 or movably coupled to the base 302 such that thefirst arm member 330A moves at least rotationally relative to thebase 302. The second joint 432B is configured to pivotally couple thefirst arm member 330A to thesecond arm member 330B. In one embodiment, the first joint 432A may be coupled to thefirst transmission system 325 ofFIG. 3B to move thefirst arm member 330A andsecond arm member 330B. In another embodiment, the first joint 432A may be coupled to anactuator 410, such as a stepper motor or DC servomotor adapted to rotate thefirst arm member 330A relative to the base 302 about axis A. Alternatively or additionally, ajoint actuator 420 may be coupled at the second joint 432B to move thefirst arm member 330A relative to thesecond arm member 330B about axis B. As another alternative, theconditioning head 306 may be coupled to themotor 415 coupled to thesecond arm member 330B. Themotor 415 may be a direct drive motor is adapted to provide rotational motion to theconditioning head 306 along axis C. -
FIG. 4B is a top view of theconditioning arm assembly 404 ofFIG. 4A . In one embodiment, theconditioning arm assembly 404 provides afirst sweep path 450A to condition the polishingsurface 130. In this embodiment, theconditioning arm assembly 404 moves in a radial direction across the polishingsurface 130. Thefirst sweep path 450A may also include a linear directional component such as substantial back and forth movement in the Y direction. Theconditioning head 306 moves across the polishingsurface 130 from a position near the center of the polishingsurface 130 to a position near an edge of the polishingsurface 130 as shown inFIGS. 4C and 4D . Alternatively or additionally, theconditioning head 306 may be actuated to move in asecond sweep path 450B, such as an arcuate path. For example, theconditioning head 306 may be moved in an arcuate orientation by actuating theconditioning arm assembly 404 to move about at least one or both of axes A and B. During conditioning, a downward pressure in a range between about 0.1 pound-force (lb-f) to about 10 lb-f, for example about 0.5 lb-f to about 8 lb-f, such as between about 1.0 lb-f to about 3 lb-f may be applied toconditioning head 306 having the conditioning disk coupled thereto. -
FIGS. 5A-5D are side and plan views of one embodiment ofconditioning arm assembly 504.FIGS. 5A and 5B show theconditioning arm assembly 504 in a partially extended position andFIGS. 5C and 5D show theconditioning arm assembly 504 in a partially retracted position. In the embodiment shown inFIGS. 5A-5D , theconditioning arm assembly 504 may be configured similarly to the embodiment of theconditioning arm assembly 304 ofFIGS. 3A and 3B , or include additional or alternative transmission systems. - In
FIGS. 5A-5D , theconditioning arm assembly 504 includesarm members arm member - The
first arm member 330A is movably coupled by first joint 532A to the base 302 to rotate thefirst arm member 330A relative to thebase 302. The second joint 532B is configured to pivotally couple thefirst arm member 330A to thesecond arm member 330B. In one embodiment, the first joint 532A may be coupled to thefirst transmission system 325 ofFIG. 3B to move thefirst arm member 330A andsecond arm member 330B. In another embodiment, the first joint 532A may be coupled to anactuator 410, such as a stepper motor or DC servomotor adapted to rotate thefirst arm member 330A relative to the base 302 about axis A′. Alternatively or additionally, ajoint actuator 520 may be coupled to the second joint 532B to move thefirst arm member 330A relative to thesecond arm member 330B about axis B′. A third joint 532C may be utilized to couple theconditioning head 306 to thesecond arm member 330B. The third joint 532C may be adapted to float or be configured as a gimbal to allow rotational movement along axis C′. In one embodiment, theconditioning head 306 may be coupled to amotor 415 to rotate theconditioning head 306. Themotor 415 may be a direct drive motor is adapted to provide rotational motion to theconditioning head 306. Themotor 415 may be coupled to a gear box or transmission device (not shown) adapted to translate rotational actuation from themotor 415 to theconditioning head 306, such as a right angle gear box. - The embodiments of the
conditioning arm assemblies conditioning arm assemblies polishing module 100 which allows additional space for polishing heads, fluid delivery modules and other hardware used in or on thepolishing module 100. For example, the movement configurations of thefirst arm member 330A and thesecond arm member 330B may be varied based on allocated space on thepolishing module 100. Factors such as height allowances, width allowances, and other dimensional constraints between other hardware disposed on thepolishing module 100 may be considered and theconditioning arm assemblies - Additionally, the configuration of the
conditioning arm assemblies - While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (26)
1. An apparatus for conditioning a polishing pad, comprising:
a base coupled to a platform;
a first arm member having a first end coupled to the base and an opposing second end;
a second arm member having a first end pivotably coupled to a second end of the first arm member; and
a conditioning disk coupled to a second end of the second arm member opposite the first end of the first arm member.
2. The apparatus of claim 1 , wherein the conditioning disk is coupled to a first actuator and a first transmission system disposed on one or both of the first arm member and the second arm member.
3. The apparatus of claim 1 , wherein the conditioning disk is coupled to a first actuator disposed on the second end of the second arm member.
4. The apparatus of claim 1 , wherein the base is coupled to a rotary actuator adapted to move the base relative to the platform.
5. The apparatus of claim 4 , wherein the first arm member is fixedly coupled to the base.
6. The apparatus of claim 4 , wherein the actuator is a vertical actuator providing vertical movement of the base relative to the platform.
7. The apparatus of claim 1 , wherein the first arm member and second arm member are coupled to a first drive assembly comprising:
a motor having a first gear;
a second gear coupled to the first end of the second arm member; and
a belt coupling the first gear and the second gear.
8. The apparatus of claim 7 , wherein the conditioning disk is coupled to a second drive assembly.
9. The apparatus of claim 8 , wherein the second drive assembly includes a direct drive motor coupled to the conditioning disk.
10. The apparatus of claim 7 , wherein the drive assembly articulates the first arm member and second arm member in a linear direction.
11. The apparatus of claim 10 , wherein first arm member and second arm member articulate in a vertical plane.
12. The apparatus of claim 10 , wherein first arm member and second arm member articulate in a horizontal plane.
13. A method of conditioning a polishing pad, comprising:
rotating a polishing pad;
urging a rotating conditioning disk against a polishing surface of the polishing pad; and
moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
14. The method of claim 13 , wherein the linear direction comprises a sweep pattern corresponding substantially to a radial dimension of the polishing surface.
15. The method of claim 13 , wherein the linear direction comprises movement of the conditioning disk from a perimeter of the polishing surface to near a center of the polishing surface.
16. The method of claim 13 , wherein the condition disk is coupled to an arm assembly moving in a horizontal direction during the conditioning process.
17. The method of claim 13 , wherein the condition disk is coupled to an arm assembly moving in a vertical direction during the conditioning process.
18. An apparatus for conditioning a polishing pad, comprising:
a base coupled to a platform;
a first arm member coupled to the base;
a second arm member coupled to the first arm member;
a conditioning disk coupled to the second arm member opposite the base; and
a joint member coupled between the first arm member and the second arm member, the joint member adapted to provide rotation of the first arm member relative to the second arm member.
19. The apparatus of claim 18 , further comprising:
a first transmission system coupled between the first arm member and the second arm member; and
a second transmission system coupled to the conditioning disk.
20. The apparatus of claim 18 , wherein the first arm member and second arm member are coupled to a first drive assembly comprising:
a motor having a first gear;
a second gear coupled to a first end of the second arm member; and
a belt coupling the first gear and the second gear.
21. The apparatus of claim 20 , further comprising:
a second drive assembly coupled to the conditioning disk.
22. The apparatus of claim 21 , wherein the second drive assembly comprises a direct drive motor.
23. The apparatus of claim 21 , wherein the second drive assembly comprises:
a motor coupled to the conditioning disk by one or more belts.
24. The apparatus of claim 19 , wherein the first drive assembly articulates the first arm member and second arm member in a linear direction.
25. The apparatus of claim 24 , wherein first arm member and second arm member articulate in a vertical plane.
26. The apparatus of claim 24 , wherein first arm member and second arm member articulate in a horizontal plane.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/615,216 US20100130107A1 (en) | 2008-11-24 | 2009-11-09 | Method and apparatus for linear pad conditioning |
JP2011537555A JP2012510160A (en) | 2008-11-24 | 2009-11-17 | Method and apparatus for conditioning a pad by linear motion |
KR1020117014644A KR20110101168A (en) | 2008-11-24 | 2009-11-17 | Method and apparatus for linear pad conditioning |
PCT/US2009/064855 WO2010059645A2 (en) | 2008-11-24 | 2009-11-17 | Method and apparatus for linear pad conditioning |
TW098139147A TW201021970A (en) | 2008-11-24 | 2009-11-18 | Method and apparatus for linear pad conditioning |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11753608P | 2008-11-24 | 2008-11-24 | |
US12/615,216 US20100130107A1 (en) | 2008-11-24 | 2009-11-09 | Method and apparatus for linear pad conditioning |
Publications (1)
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US20100130107A1 true US20100130107A1 (en) | 2010-05-27 |
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US12/615,216 Abandoned US20100130107A1 (en) | 2008-11-24 | 2009-11-09 | Method and apparatus for linear pad conditioning |
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US (1) | US20100130107A1 (en) |
JP (1) | JP2012510160A (en) |
KR (1) | KR20110101168A (en) |
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US20150036110A1 (en) * | 2013-08-05 | 2015-02-05 | Tokyo Electron Limited | Developing apparatus, developing method and storage medium |
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USD749937S1 (en) | 2014-03-12 | 2016-02-23 | Stonehedge Solutions, Inc. | Portable holder |
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Also Published As
Publication number | Publication date |
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KR20110101168A (en) | 2011-09-15 |
WO2010059645A3 (en) | 2010-08-26 |
JP2012510160A (en) | 2012-04-26 |
TW201021970A (en) | 2010-06-16 |
WO2010059645A2 (en) | 2010-05-27 |
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