US20100108372A1 - Electronic component package and manufacturing method thereof - Google Patents
Electronic component package and manufacturing method thereof Download PDFInfo
- Publication number
- US20100108372A1 US20100108372A1 US12/585,509 US58550909A US2010108372A1 US 20100108372 A1 US20100108372 A1 US 20100108372A1 US 58550909 A US58550909 A US 58550909A US 2010108372 A1 US2010108372 A1 US 2010108372A1
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- United States
- Prior art keywords
- electronic component
- insulation layer
- solder ball
- component package
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Definitions
- the present invention relates to an electronic component package and a manufacturing method thereof.
- a BOC is a board specially developed for the properties of the electronic component, with the pad of the electronic component positioned in the center and with a structure allowing direct connection from the pad to the board for increased signal processing speed.
- a slot is formed in the portion where the pad is positioned through which the wire bonding may be implemented.
- An aspect of the present invention is to provide an electronic component package and manufacturing method thereof, with which a high-capacity electronic component can be installed on a single metal layer.
- One aspect of the invention provides a method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board and forming a circuit pattern, which includes a bonding pad and a solder ball pad, on the surface of the insulation layer; mounting an electronic component on the surface of the insulation layer and electrically connecting the electronic component and the bonding pad; and removing the first carrier board and the protrusion part.
- This electronic component package allows the mounting of the electronic component with just a single circuit pattern layer.
- the method may further include removing a portion of the insulation layer to expose the solder ball pad, after the operation of removing the first carrier board and the protrusion part.
- the solder ball pad is the portion where a solder ball is to be attached, and thus it may be exposed to the exterior.
- the operation of forming a protrusion part may include attaching two of the first carrier boards such that the first carrier boards face opposite directions, and the operation of removing a portion of the dry film may include forming the protrusion part on each of the two first carrier boards.
- the operation of stacking an insulation layer and forming a circuit pattern may include: stacking a seed layer on a second carrier board; forming the circuit pattern on the seed layer; stacking the second carrier board on the insulation layer such that the circuit pattern faces the insulation layer; removing the second carrier board; and removing the seed layer.
- the method may further include the operations of stacking a dry film on the seed layer and removing a portion of the dry film to expose the seed layer on the side of the bonding pad; removing the seed layer around the bonding pad; and surface-treating the bonding pad by supplying a voltage to the remaining seed layer, between the operation of removing the second carrier board and the operation of removing the seed layer.
- This is a method of performing surface-treatment utilizing the seed layer as a lead wire.
- an electronic component package which includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer, which includes a bonding pad and a solder ball pad, and which has a surface exposed at one side of the insulation layer; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad.
- an electronic component is mounted with just a single circuit pattern layer.
- solder ball pad becomes the point where a solder ball is attached.
- FIG. 1 a is a perspective view of an electronic component package according to prior art.
- FIG. 1 b is a cross-sectional view of an electronic component package according to prior art.
- FIG. 2 is a flowchart of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention.
- FIG. 3 is a process diagram of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention.
- FIG. 4 is a process diagram of a method of manufacturing an electronic component package according to a second disclosed embodiment of the invention.
- FIG. 5 is a process diagram of a method of manufacturing an electronic component package according to a third disclosed embodiment of the invention.
- FIG. 6 is a process diagram of a method of manufacturing an electronic component package according to a fourth disclosed embodiment of the invention.
- FIG. 7 is cross-sectional view of an electronic component package according to a fourth disclosed embodiment of the invention.
- FIG. 2 is a flowchart of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention
- FIG. 3 is a process diagram of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention.
- an electronic component package 30 a first carrier board 31 a, a second carrier board 31 b, seed layers 32 a, 32 b, protrusion parts 33 , an insulation layer 34 , holes 35 , solder ball pads 36 a, a circuit pattern 36 , bonding pads 36 c, solder resist 37 , an electronic component 38 , chip pads 38 a, and mold material 39 .
- S 21 of FIG. 2 is an operation of forming protrusion parts on a first carrier board, the corresponding process of which is shown in (a) of FIG. 3 .
- the operation of forming the protrusion parts 33 on the first carrier board 31 a can be divided into an operation of preparing a flat first carrier board 31 a, stacking a seed layer 32 a on the first carrier board 31 a by electroless plating, and forming the protrusion part 33 on the surface of the seed layer 32 a in correspondence with the solder ball pads 36 a.
- the protrusion parts 33 are formed by stacking a dry film on the surface of the seed layer 32 a and then removing the remaining dry film besides the protrusion parts 33 , through exposure and development processes. Meanwhile, the seed layer 32 a is formed so that the first carrier board 31 a may be detached readily. Therefore, if the first carrier board 31 a can be removed readily without an interposed seed layer 32 a, the process of stacking the seed layer 32 a is unnecessary.
- S 22 of FIG. 2 is an operation of stacking an insulation layer 34 on the first carrier board 31 a, and forming a circuit pattern 36 , which includes bonding pads 36 c and solder ball pads 36 a, on the surface of the insulation layer 34 , and the corresponding processes are shown in (b) to (e) of FIG. 3 .
- a second carrier board 31 b on which the circuit pattern 36 including the bonding pads 36 c and solder ball pads 36 a are formed, is aligned with the first carrier board 31 a, which was formed previously in process (a) of FIG. 3 , with an insulation layer 34 interposed in-between.
- the aligning is such that the protrusion parts 33 of the first carrier board 31 a and the circuit pattern 36 of the second carrier board 31 b face each other.
- the circuit pattern 36 illustrated in (b) of FIG. 3 is manufactured on the surface of the second carrier board 31 b using a semi-additive method. Specifically, the seed layer 32 b and a dry film are stacked in order on the surface of the second carrier board 31 b. Afterwards, exposure and development processes are performed to remove portions of the dry film where the circuit pattern 36 is to be formed. Then, plating the removed portions and removing the remaining dry film results in the circuit pattern 36 formed on the surface of the second carrier board 31 b, as illustrated in (b) of FIG. 3 .
- Drawing (c) of FIG. 3 shows the first carrier board 31 a and second carrier board 31 b stacked collectively, where the protrusion parts 33 and the circuit pattern 36 including the solder ball pads 36 a and bonding pads 36 c are embedded inside the insulation layer 34 .
- the protrusion parts 33 are stacked in positions that correspond with the solder ball pads 36 a.
- the protrusion parts 33 be formed beforehand in process (a) at points that correspond with the solder ball pad 36 a.
- the protrusion parts 33 be formed to have such a thickness that does not allow the insulation layer 34 to be interposed between the protrusion parts 33 and the solder ball pads 36 a.
- the material used for the insulation layer 34 is of a low hardness, so that the protrusion parts 33 may be embedded within.
- An example of such a material is pure resin.
- Drawing (d) of FIG. 3 shows a process of removing the second carrier board 31 b and the seed layer 32 b.
- the seed layer 32 b is removed by flash etching.
- Flash etching is an etching process performed with a lower intensity than in regular etching, for removing the thin film of seed layer.
- the result after the completion of this etching process is complete is as shown in (d) of FIG. 3 .
- the circuit pattern 36 including the solder ball pads 36 a and bonding pads 36 c is embedded in the insulation layer 34 .
- Drawing (e) of FIG. 3 shows a process of surface-treating the bonding pads 36 c, in which solder resist 37 is applied on the portions except for the bonding pad 36 c portions. Afterwards, a Ni layer is stacked on the bonding pads 36 c by electroless plating, and gold plating is performed on the surface of the Ni layer by electroplating.
- S 23 of FIG. 2 is an operation of mounting an electronic component 38 on the surface of the insulation layer 34 and electrically connecting the electronic component 38 and the bonding pads 36 c.
- the bonding pads 36 c are formed in positions that correspond with the chip pads 38 a of the electronic component 38 , and after positioning the chip pads 38 a on the surfaces of the bonding pads 36 c, they are attached by flooring. Also, to protect the electronic component 38 , a finishing is provided around the electronic component 38 and insulation layer 34 using a mold material 39 .
- S 24 of FIG. 2 is an operation of removing the first carrier board 31 a and protrusion parts 33 , the corresponding processes of which are shown in (g) and (h) of FIG. 3 .
- Drawing (g) of FIG. 3 shows a process of removing the first carrier board 31 a and removing the seed layer 32 a.
- the first carrier board 31 a is a sort of support, and is removed after the electronic component 38 is mounted.
- the seed layer 32 a is removed.
- the protrusion parts 33 are exposed.
- the exposed protrusion parts 33 are removed by a wet treatment.
- Drawing (h) of FIG. 3 shows the form of the electronic component package 30 after the protrusion parts 33 are removed. Holes 35 are formed when the protrusion parts 33 are removed, and the solder ball pads 36 a are exposed to the exterior inside the holes 35 . As portions of the insulation layer 34 may remain on the solder ball pads 36 a, a desmearing process may further be performed to remove these.
- FIG. 4 is a process diagram of a method of manufacturing an electronic component package according to a second disclosed embodiment of the invention.
- an electronic component package 40 first carrier boards 41 , seed layers 42 a, 42 b, protrusion parts 43 , insulation layers 44 , solder ball pads 46 a, circuit patterns 46 , bonding pads 46 c, solder resist 47 , electronic components 48 , chip pads 48 a, and mold material 49 .
- the efficiency is increased in the manufacture of the electronic component packages 40 , by performing the procedures with two first carrier boards 41 attached together.
- the memory packages 40 are manufactured with greater efficiency by proceeding with the processes with two first carrier boards 41 a attached together. The following describes this embodiment with reference to the process diagram of FIG. 4 .
- Drawing (a) of FIG. 4 shows the same process as (a) of FIG. 3 , which is a process of forming the protrusion parts 43 on the first carrier board 41 a.
- two first carrier boards 41 a are attached facing opposite directions, such that the protrusion part 43 are exposed to the exterior, based on which the insulation layers 44 and the second carrier boards 41 b, having circuit patterns 46 that include the solder ball pads 46 a and bonding pads 46 c, are aligned in symmetry.
- the two first carrier boards 41 a attached together allows the processes to be performed simultaneously.
- Drawing (c) of FIG. 4 shows the insulation layers 44 and second carrier boards 41 b stacked symmetrically with respect to the two first carrier boards 41 a attached together.
- the protrusion parts 43 of the first carrier boards 41 a and the circuit patterns 46 of the second carrier boards 41 b are embedded in the insulation layers 44 . It may be desirable to use a material low in hardness for the insulation layers 44 , and in this embodiment, pure resin is used.
- Drawing (d) of FIG. 4 shows a process of removing the second carrier boards 41 b and the seed layers 42 b. As the second carrier boards 41 b and seed layers 42 b are removed, the circuit patterns 46 are uncovered at the surfaces of the insulation layers 44 .
- FIG. 4 shows a process of applying solder resist 47 on portions excluding the bonding pads 46 c and afterwards surface-treating the bonding pads 46 c.
- the bonding pads 46 c are the portions that will later be attached to the chip pads 38 a of the electronic components 38 .
- Drawing (f) of FIG. 4 shows a process of separating the two first carrier boards 41 a, and mounting an electronic component 38 on the bonding pads 46 c of each first carrier board 41 a. While the two first carrier boards 41 a are used attached together up until the process (e) of FIG. 4 , the processes are performed with the first carrier boards 41 a separated, starting from process (f) of FIG. 4 .
- Drawing (f) of FIG. 4 shows a process of attaching the chip pads 38 a and bonding pads 46 c to be in correspondence and mounting the electronic components 38 on the surfaces of the bonding pads 46 c.
- the mold material 49 is filled around the electronic component 38 . Epoxy resin is used for the mold material 49 .
- FIG. 5 is a process diagram of a method of manufacturing an electronic component package according to a third disclosed embodiment of the invention.
- an electronic component package 50 a first carrier board 51 a, a second carrier board 51 b, seed layers 52 a, 52 b, protrusion parts 53 , an insulation layer 54 , solder ball pads 56 a, a circuit pattern 56 , bonding pads 56 c, resist 57 , an electronic component 58 , chip pads 58 a, and mold material 59 .
- This embodiment shows a process of performing surface-treatment on the bonding pads 56 c, utilizing the seed layer 52 b as a lead wire.
- the processes (a) to (c) of FIG. 5 are the same as the processes (a) to (c) of FIG. 3 .
- Drawing (d) of FIG. 5 shows a process of removing the second carrier board 52 b. When the second carrier board 51 b is removed, the seed layer 52 b is uncovered.
- Drawing (e) of FIG. 5 shows a process of removing the seed layer 52 b on the surface of and around the bonding pads 56 c to which the surface-treatment is to be applied and stacking resist 57 on the surface of the remaining seed layer 52 b.
- a dry film is used for the resist 57 .
- Portions of the seed layer 52 b that are not removed act as a lead wire that supplies an electrical current to the bonding pads 56 c.
- This process utilizes the seed layer 52 b as a lead wire, instead of forming a separate lead wire.
- the resist 57 prevents surface-treatment on portions other than the bonding pads 56 c.
- Drawing (f) of FIG. 5 shows a process of mounting an electronic component 58 .
- the seed layer 52 b and resist 57 are removed in (e) of FIG. 5 . Leaving the seed layer 52 b may result in the circuit pattern 56 becoming electrically connected to undesired portions, and thus it may be advantageous to remove the seed layer 52 b.
- the process of mounting the electronic component 58 after removing the seed layer 52 b is the same as that for FIG. 3 , and thus detailed descriptions will not be provided on this matter.
- FIG. 6 is a process diagram of a method of manufacturing an electronic component package according to a fourth disclosed embodiment of the invention.
- an electronic component package 60 first carrier boards 61 a, seed layers 62 a, copper foils 62 b, protrusion parts 63 , copper clad laminates 64 , solder ball pads 66 a, circuit patterns 66 , bonding pads 66 c, solder resist 67 , electronic components 68 , chip pads 68 a, and mold material 69 .
- This embodiment shows a process of stacking a copper clad laminate 64 on the first carrier board 61 a, and afterwards removing the copper foil 62 b to form the circuit pattern 66 .
- (a) of FIG. 6 shows the same process as (a) of FIG. 3 , which is a process of forming protrusion parts 63 on the first carrier board 61 a.
- Drawing (b) of FIG. 6 shows a process of attaching two first carrier boards 61 a such that the protrusion parts 63 face outward, and aligning the copper clad laminates 64 in symmetry.
- the copper clad laminates 64 and first carrier boards 61 a are collectively stacked.
- the two first carrier boards 61 a are attached in consideration of the fact that they will be separated in a subsequent process.
- Drawing (d) of FIG. 6 shows a process of removing portions of the copper foils 62 b to form the circuit patterns 66 , including the solder ball pads 66 a and bonding pads 66 c.
- Drawing (e) of FIG. 6 shows a process of performing surface-treatment on the bonding pads 66 c
- drawing (f) shows a process of separating the two first carrier boards 61 a and afterwards mounting the electronic components 68 .
- the following processes are the processes of removing the first carrier boards 61 a, seed layers 62 a, and protrusion parts 63 , as has been described for the embodiment of FIG. 3 .
- FIG. 7 is cross-sectional view of an electronic component package according to a fourth disclosed embodiment of the invention.
- an electronic component package 70 an insulation layer 74 , solder ball pads 76 a, a circuit pattern 76 , bonding pads 76 c, solder resist 77 , an electronic component 78 , chip pads 78 a, and mold material 79 .
- the bonding pads 76 c which are to be electrically connected with the electronic component 78 , are formed on one side of a single layer of circuit pattern 76 , and the solder ball pads 76 a, which are to be connected with solder balls, are formed on the other side.
- These solder ball pads 76 a and bonding pads 76 c are portions of the circuit pattern 76 , and are concurrently formed when forming the circuit pattern 76 .
- the electronic component 78 has the form of a flip chip, with several chip pads 78 a formed on the bottom surface. These chip pads 78 a are formed in positions that correspond with the bonding pads 76 c, and are electrically connected to each other. Meanwhile, the electronic component 78 is secured by means of the mold material 79 .
- the solder ball pads 76 a have surfaces exposed to the exterior, where surface-treatment is applied to the exposed portions. The surface-treatment is for enhancing the adhesion to the solder balls.
- the lengths of signal lines are shortened compared to the case of conventional electronic component packages, which allows quicker signal processing. Also, by means of the semi-additive method, it is possible to form high-density circuits. In addition, since there is no wire bonding as in prior art, it is not necessary to process holes, and as the circuit pattern is made of a single layer, a superb heat-releasing effect is obtained.
Abstract
An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.
Description
- This application is a U.S. divisional application filed under 35 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 11/708,567 filed in the United States on Feb. 21, 2007, which claims earlier priority benefit to Korean Patent Application No. 10-2006-0050015 filed with the Korean Intellectual Property Office on Jun. 2, 2006, the disclosures of which are incorporated herein by reference.
- 1. Field
- The present invention relates to an electronic component package and a manufacturing method thereof.
- 2. Description of the Related Art
- With advances in the electronics industry, there is a rapid increase in the use of electronic component packages, which are electronic devices equipped with electronic components. Accordingly, there is an increase in the number of companies that manufacture and supply these electronic component packages, as well as companies that are expanding their business with regards electronic component packages. These market conditions have intensified competition in the pricing of electronic component packages, whereby the prices of electronic component packages are gradually decreasing, and there are several proposals being made for ways to reduce costs.
- At present, most electronic component packages are implemented, as in
FIGS. 1 a and 1 b, by the method of connecting an electronic component (memory chip) using wire bonding to a substrate to provide a package, where this board is referred to as a BOC (Board-on-Chip). A BOC is a board specially developed for the properties of the electronic component, with the pad of the electronic component positioned in the center and with a structure allowing direct connection from the pad to the board for increased signal processing speed. In order to attach the electronic component at the bottom of the board and directly connect the pad to the board, a slot is formed in the portion where the pad is positioned through which the wire bonding may be implemented. Thus, only one layer is needed for the metal layer of the board, which enables a low manufacturing cost and provides an advantage in the price competitiveness of the electronic component package. - However, with the highly rapid development of semiconductor manufacturing technology, the capacity of the electronic component package has also increased. Due to these developments in technology, there have been cases of signal loss at the wires when using a conventional BOC.
- An aspect of the present invention is to provide an electronic component package and manufacturing method thereof, with which a high-capacity electronic component can be installed on a single metal layer.
- One aspect of the invention provides a method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board and forming a circuit pattern, which includes a bonding pad and a solder ball pad, on the surface of the insulation layer; mounting an electronic component on the surface of the insulation layer and electrically connecting the electronic component and the bonding pad; and removing the first carrier board and the protrusion part. This electronic component package allows the mounting of the electronic component with just a single circuit pattern layer.
- The method may further include removing a portion of the insulation layer to expose the solder ball pad, after the operation of removing the first carrier board and the protrusion part. The solder ball pad is the portion where a solder ball is to be attached, and thus it may be exposed to the exterior.
- It may be advantageous for the operation of forming a protrusion part to include: stacking a seed layer on the first carrier board; stacking a dry film on the seed layer; and removing a portion of the dry film to form the protrusion part.
- Also, the operation of forming a protrusion part may include attaching two of the first carrier boards such that the first carrier boards face opposite directions, and the operation of removing a portion of the dry film may include forming the protrusion part on each of the two first carrier boards. By using two first carrier boards, the efficiency of the process may be increased.
- The operation of stacking an insulation layer and forming a circuit pattern may include: stacking a seed layer on a second carrier board; forming the circuit pattern on the seed layer; stacking the second carrier board on the insulation layer such that the circuit pattern faces the insulation layer; removing the second carrier board; and removing the seed layer.
- Also, the method may further include the operations of stacking a dry film on the seed layer and removing a portion of the dry film to expose the seed layer on the side of the bonding pad; removing the seed layer around the bonding pad; and surface-treating the bonding pad by supplying a voltage to the remaining seed layer, between the operation of removing the second carrier board and the operation of removing the seed layer. This is a method of performing surface-treatment utilizing the seed layer as a lead wire.
- Another aspect of the invention provides an electronic component package, which includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer, which includes a bonding pad and a solder ball pad, and which has a surface exposed at one side of the insulation layer; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In this package, an electronic component is mounted with just a single circuit pattern layer.
- Meanwhile, it may be desirable that a portion of the insulation layer be removed in correspondence with the position of the solder ball pad, such that the solder ball pad is exposed at the other side of the insulation layer. The solder ball pad becomes the point where a solder ball is attached.
- Additional aspects and advantages of the invention will become apparent and more readily appreciated from the following description, including the appended drawings and claims, or may be learned by practice of the invention.
-
FIG. 1 a is a perspective view of an electronic component package according to prior art. -
FIG. 1 b is a cross-sectional view of an electronic component package according to prior art. -
FIG. 2 is a flowchart of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention. -
FIG. 3 is a process diagram of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention. -
FIG. 4 is a process diagram of a method of manufacturing an electronic component package according to a second disclosed embodiment of the invention. -
FIG. 5 is a process diagram of a method of manufacturing an electronic component package according to a third disclosed embodiment of the invention. -
FIG. 6 is a process diagram of a method of manufacturing an electronic component package according to a fourth disclosed embodiment of the invention. -
FIG. 7 is cross-sectional view of an electronic component package according to a fourth disclosed embodiment of the invention. - Embodiments of the invention will be described below in more detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, those components are rendered the same reference number that are the same or are in correspondence, regardless of the figure number, and redundant explanations are omitted.
-
FIG. 2 is a flowchart of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention, andFIG. 3 is a process diagram of a method of manufacturing an electronic component package according to a first disclosed embodiment of the invention. InFIG. 3 are illustrated anelectronic component package 30, afirst carrier board 31 a, asecond carrier board 31 b,seed layers protrusion parts 33, aninsulation layer 34,holes 35,solder ball pads 36 a, acircuit pattern 36,bonding pads 36 c,solder resist 37, anelectronic component 38,chip pads 38 a, andmold material 39. - S21 of
FIG. 2 is an operation of forming protrusion parts on a first carrier board, the corresponding process of which is shown in (a) ofFIG. 3 . The operation of forming theprotrusion parts 33 on thefirst carrier board 31 a can be divided into an operation of preparing a flatfirst carrier board 31 a, stacking aseed layer 32 a on thefirst carrier board 31 a by electroless plating, and forming theprotrusion part 33 on the surface of theseed layer 32 a in correspondence with thesolder ball pads 36 a. Theprotrusion parts 33 are formed by stacking a dry film on the surface of theseed layer 32 a and then removing the remaining dry film besides theprotrusion parts 33, through exposure and development processes. Meanwhile, theseed layer 32 a is formed so that thefirst carrier board 31 a may be detached readily. Therefore, if thefirst carrier board 31 a can be removed readily without an interposedseed layer 32 a, the process of stacking theseed layer 32 a is unnecessary. - S22 of
FIG. 2 is an operation of stacking aninsulation layer 34 on thefirst carrier board 31 a, and forming acircuit pattern 36, which includesbonding pads 36 c andsolder ball pads 36 a, on the surface of theinsulation layer 34, and the corresponding processes are shown in (b) to (e) ofFIG. 3 . As in (b) ofFIG. 3 , asecond carrier board 31 b, on which thecircuit pattern 36 including thebonding pads 36 c andsolder ball pads 36 a are formed, is aligned with thefirst carrier board 31 a, which was formed previously in process (a) ofFIG. 3 , with aninsulation layer 34 interposed in-between. The aligning is such that theprotrusion parts 33 of thefirst carrier board 31 a and thecircuit pattern 36 of thesecond carrier board 31 b face each other. - Meanwhile, the
circuit pattern 36 illustrated in (b) ofFIG. 3 is manufactured on the surface of thesecond carrier board 31 b using a semi-additive method. Specifically, theseed layer 32 b and a dry film are stacked in order on the surface of thesecond carrier board 31 b. Afterwards, exposure and development processes are performed to remove portions of the dry film where thecircuit pattern 36 is to be formed. Then, plating the removed portions and removing the remaining dry film results in thecircuit pattern 36 formed on the surface of thesecond carrier board 31 b, as illustrated in (b) ofFIG. 3 . - Drawing (c) of
FIG. 3 shows thefirst carrier board 31 a andsecond carrier board 31 b stacked collectively, where theprotrusion parts 33 and thecircuit pattern 36 including thesolder ball pads 36 a andbonding pads 36 c are embedded inside theinsulation layer 34. - Here, the
protrusion parts 33 are stacked in positions that correspond with thesolder ball pads 36 a. Thus, it may be desirable that theprotrusion parts 33 be formed beforehand in process (a) at points that correspond with thesolder ball pad 36 a. Also, it may be desirable that theprotrusion parts 33 be formed to have such a thickness that does not allow theinsulation layer 34 to be interposed between theprotrusion parts 33 and thesolder ball pads 36 a. Meanwhile, the material used for theinsulation layer 34 is of a low hardness, so that theprotrusion parts 33 may be embedded within. An example of such a material is pure resin. - Drawing (d) of
FIG. 3 shows a process of removing thesecond carrier board 31 b and theseed layer 32 b. Theseed layer 32 b is removed by flash etching. Flash etching is an etching process performed with a lower intensity than in regular etching, for removing the thin film of seed layer. The result after the completion of this etching process is complete is as shown in (d) ofFIG. 3 . As in (d) ofFIG. 3 , thecircuit pattern 36 including thesolder ball pads 36 a andbonding pads 36 c is embedded in theinsulation layer 34. - Drawing (e) of
FIG. 3 shows a process of surface-treating thebonding pads 36 c, in which solder resist 37 is applied on the portions except for thebonding pad 36 c portions. Afterwards, a Ni layer is stacked on thebonding pads 36 c by electroless plating, and gold plating is performed on the surface of the Ni layer by electroplating. - S23 of
FIG. 2 is an operation of mounting anelectronic component 38 on the surface of theinsulation layer 34 and electrically connecting theelectronic component 38 and thebonding pads 36 c. Thebonding pads 36 c are formed in positions that correspond with thechip pads 38 a of theelectronic component 38, and after positioning thechip pads 38 a on the surfaces of thebonding pads 36 c, they are attached by flooring. Also, to protect theelectronic component 38, a finishing is provided around theelectronic component 38 andinsulation layer 34 using amold material 39. - S24 of
FIG. 2 is an operation of removing thefirst carrier board 31 a andprotrusion parts 33, the corresponding processes of which are shown in (g) and (h) ofFIG. 3 . - Drawing (g) of
FIG. 3 shows a process of removing thefirst carrier board 31 a and removing theseed layer 32 a. Thefirst carrier board 31 a is a sort of support, and is removed after theelectronic component 38 is mounted. After thefirst carrier board 31 a is removed, theseed layer 32 a is removed. When theseed layer 32 a is removed, theprotrusion parts 33 are exposed. The exposedprotrusion parts 33 are removed by a wet treatment. - Drawing (h) of
FIG. 3 shows the form of theelectronic component package 30 after theprotrusion parts 33 are removed.Holes 35 are formed when theprotrusion parts 33 are removed, and thesolder ball pads 36 a are exposed to the exterior inside theholes 35. As portions of theinsulation layer 34 may remain on thesolder ball pads 36 a, a desmearing process may further be performed to remove these. -
FIG. 4 is a process diagram of a method of manufacturing an electronic component package according to a second disclosed embodiment of the invention. InFIG. 4 are illustrated anelectronic component package 40, first carrier boards 41, seed layers 42 a, 42 b,protrusion parts 43, insulation layers 44,solder ball pads 46 a,circuit patterns 46,bonding pads 46 c, solder resist 47,electronic components 48,chip pads 48 a, andmold material 49. In this embodiment, the efficiency is increased in the manufacture of the electronic component packages 40, by performing the procedures with two first carrier boards 41 attached together. - Although this embodiment is generally the same as the first disclosed embodiment of
FIG. 3 , the memory packages 40 are manufactured with greater efficiency by proceeding with the processes with twofirst carrier boards 41 a attached together. The following describes this embodiment with reference to the process diagram ofFIG. 4 . - Drawing (a) of
FIG. 4 shows the same process as (a) ofFIG. 3 , which is a process of forming theprotrusion parts 43 on thefirst carrier board 41 a. - In (b) of
FIG. 4 , twofirst carrier boards 41 a are attached facing opposite directions, such that theprotrusion part 43 are exposed to the exterior, based on which the insulation layers 44 and thesecond carrier boards 41 b, havingcircuit patterns 46 that include thesolder ball pads 46 a andbonding pads 46 c, are aligned in symmetry. Thus using the twofirst carrier boards 41 a attached together allows the processes to be performed simultaneously. - Drawing (c) of
FIG. 4 shows the insulation layers 44 andsecond carrier boards 41 b stacked symmetrically with respect to the twofirst carrier boards 41 a attached together. Theprotrusion parts 43 of thefirst carrier boards 41 a and thecircuit patterns 46 of thesecond carrier boards 41 b are embedded in the insulation layers 44. It may be desirable to use a material low in hardness for the insulation layers 44, and in this embodiment, pure resin is used. - Drawing (d) of
FIG. 4 shows a process of removing thesecond carrier boards 41 b and the seed layers 42 b. As thesecond carrier boards 41 b andseed layers 42 b are removed, thecircuit patterns 46 are uncovered at the surfaces of the insulation layers 44. - Drawing (e) of
FIG. 4 shows a process of applying solder resist 47 on portions excluding thebonding pads 46 c and afterwards surface-treating thebonding pads 46 c. Thebonding pads 46 c are the portions that will later be attached to thechip pads 38 a of theelectronic components 38. - Drawing (f) of
FIG. 4 shows a process of separating the twofirst carrier boards 41 a, and mounting anelectronic component 38 on thebonding pads 46 c of eachfirst carrier board 41 a. While the twofirst carrier boards 41 a are used attached together up until the process (e) ofFIG. 4 , the processes are performed with thefirst carrier boards 41 a separated, starting from process (f) ofFIG. 4 . Drawing (f) ofFIG. 4 shows a process of attaching thechip pads 38 a andbonding pads 46 c to be in correspondence and mounting theelectronic components 38 on the surfaces of thebonding pads 46 c. To protect theelectronic component 38, themold material 49 is filled around theelectronic component 38. Epoxy resin is used for themold material 49. - Descriptions for (g) and (h) of
FIG. 4 will be omitted, as they are sufficiently described for the first disclosed embodiment ofFIG. 3 . -
FIG. 5 is a process diagram of a method of manufacturing an electronic component package according to a third disclosed embodiment of the invention. InFIG. 5 are illustrated anelectronic component package 50, afirst carrier board 51 a, asecond carrier board 51 b, seed layers 52 a, 52 b,protrusion parts 53, aninsulation layer 54,solder ball pads 56 a, acircuit pattern 56,bonding pads 56 c, resist 57, anelectronic component 58,chip pads 58 a, andmold material 59. - This embodiment shows a process of performing surface-treatment on the
bonding pads 56 c, utilizing theseed layer 52 b as a lead wire. The processes (a) to (c) ofFIG. 5 are the same as the processes (a) to (c) ofFIG. 3 . Drawing (d) ofFIG. 5 shows a process of removing thesecond carrier board 52 b. When thesecond carrier board 51 b is removed, theseed layer 52 b is uncovered. - Drawing (e) of
FIG. 5 shows a process of removing theseed layer 52 b on the surface of and around thebonding pads 56 c to which the surface-treatment is to be applied and stacking resist 57 on the surface of the remainingseed layer 52 b. A dry film is used for the resist 57. Portions of theseed layer 52 b that are not removed act as a lead wire that supplies an electrical current to thebonding pads 56 c. This process utilizes theseed layer 52 b as a lead wire, instead of forming a separate lead wire. The resist 57 prevents surface-treatment on portions other than thebonding pads 56 c. - Drawing (f) of
FIG. 5 shows a process of mounting anelectronic component 58. In order to mount theelectronic component 58, theseed layer 52 b and resist 57 are removed in (e) ofFIG. 5 . Leaving theseed layer 52 b may result in thecircuit pattern 56 becoming electrically connected to undesired portions, and thus it may be advantageous to remove theseed layer 52 b. The process of mounting theelectronic component 58 after removing theseed layer 52 b is the same as that forFIG. 3 , and thus detailed descriptions will not be provided on this matter. -
FIG. 6 is a process diagram of a method of manufacturing an electronic component package according to a fourth disclosed embodiment of the invention. InFIG. 6 are illustrated anelectronic component package 60,first carrier boards 61 a, seed layers 62 a, copper foils 62 b,protrusion parts 63, copper cladlaminates 64,solder ball pads 66 a,circuit patterns 66,bonding pads 66 c, solder resist 67,electronic components 68,chip pads 68 a, andmold material 69. - This embodiment shows a process of stacking a copper clad
laminate 64 on thefirst carrier board 61 a, and afterwards removing thecopper foil 62 b to form thecircuit pattern 66. Looking at this embodiment with reference toFIG. 6 , (a) ofFIG. 6 shows the same process as (a) ofFIG. 3 , which is a process of formingprotrusion parts 63 on thefirst carrier board 61 a. - Drawing (b) of
FIG. 6 shows a process of attaching twofirst carrier boards 61 a such that theprotrusion parts 63 face outward, and aligning the copper cladlaminates 64 in symmetry. In (c) ofFIG. 6 , the copper cladlaminates 64 andfirst carrier boards 61 a are collectively stacked. Here, the twofirst carrier boards 61 a are attached in consideration of the fact that they will be separated in a subsequent process. - Drawing (d) of
FIG. 6 shows a process of removing portions of the copper foils 62 b to form thecircuit patterns 66, including thesolder ball pads 66 a andbonding pads 66 c. Drawing (e) ofFIG. 6 shows a process of performing surface-treatment on thebonding pads 66 c, and drawing (f) shows a process of separating the twofirst carrier boards 61 a and afterwards mounting theelectronic components 68. The following processes are the processes of removing thefirst carrier boards 61 a, seed layers 62 a, andprotrusion parts 63, as has been described for the embodiment ofFIG. 3 . -
FIG. 7 is cross-sectional view of an electronic component package according to a fourth disclosed embodiment of the invention. InFIG. 7 are illustrated anelectronic component package 70, aninsulation layer 74,solder ball pads 76 a, acircuit pattern 76,bonding pads 76 c, solder resist 77, anelectronic component 78,chip pads 78 a, andmold material 79. - In this embodiment, the
bonding pads 76 c, which are to be electrically connected with theelectronic component 78, are formed on one side of a single layer ofcircuit pattern 76, and thesolder ball pads 76 a, which are to be connected with solder balls, are formed on the other side. Thesesolder ball pads 76 a andbonding pads 76 c are portions of thecircuit pattern 76, and are concurrently formed when forming thecircuit pattern 76. - The
electronic component 78 has the form of a flip chip, withseveral chip pads 78 a formed on the bottom surface. Thesechip pads 78 a are formed in positions that correspond with thebonding pads 76 c, and are electrically connected to each other. Meanwhile, theelectronic component 78 is secured by means of themold material 79. Thesolder ball pads 76 a have surfaces exposed to the exterior, where surface-treatment is applied to the exposed portions. The surface-treatment is for enhancing the adhesion to the solder balls. - According the embodiments set forth above, the lengths of signal lines are shortened compared to the case of conventional electronic component packages, which allows quicker signal processing. Also, by means of the semi-additive method, it is possible to form high-density circuits. In addition, since there is no wire bonding as in prior art, it is not necessary to process holes, and as the circuit pattern is made of a single layer, a superb heat-releasing effect is obtained.
- While the present invention has been described with reference to particular embodiments, it is to be appreciated that various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention, as defined by the appended claims and their equivalents.
Claims (2)
1. An electronic component package comprising:
an insulation layer;
a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and
an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad.
2. The electronic component package of claim 1 , wherein a portion of the insulation layer is removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/585,509 US20100108372A1 (en) | 2006-06-02 | 2009-09-16 | Electronic component package and manufacturing method thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020060050015A KR100734403B1 (en) | 2006-06-02 | 2006-06-02 | Electro component package and manufacturing method thereof |
KR10-2006-0050015 | 2006-06-02 | ||
US11/708,567 US7607222B2 (en) | 2006-06-02 | 2007-02-21 | Method of manufacturing an electronic component package |
US12/585,509 US20100108372A1 (en) | 2006-06-02 | 2009-09-16 | Electronic component package and manufacturing method thereof |
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Application Number | Title | Priority Date | Filing Date |
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US11/708,567 Division US7607222B2 (en) | 2006-06-02 | 2007-02-21 | Method of manufacturing an electronic component package |
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US20100108372A1 true US20100108372A1 (en) | 2010-05-06 |
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US11/708,567 Expired - Fee Related US7607222B2 (en) | 2006-06-02 | 2007-02-21 | Method of manufacturing an electronic component package |
US12/585,509 Abandoned US20100108372A1 (en) | 2006-06-02 | 2009-09-16 | Electronic component package and manufacturing method thereof |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/708,567 Expired - Fee Related US7607222B2 (en) | 2006-06-02 | 2007-02-21 | Method of manufacturing an electronic component package |
Country Status (4)
Country | Link |
---|---|
US (2) | US7607222B2 (en) |
JP (1) | JP4763639B2 (en) |
KR (1) | KR100734403B1 (en) |
CN (1) | CN100539059C (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8201325B2 (en) | 2007-11-22 | 2012-06-19 | International Business Machines Corporation | Method for producing an integrated device |
US20100052186A1 (en) * | 2008-08-27 | 2010-03-04 | Advanced Semiconductor Engineering, Inc. | Stacked type chip package structure |
TWI463620B (en) * | 2012-08-22 | 2014-12-01 | 矽品精密工業股份有限公司 | Method of forming package substrate |
SG10201400396WA (en) * | 2014-03-05 | 2015-10-29 | Delta Electronics Int’L Singapore Pte Ltd | Package structure and stacked package module with the same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6111317A (en) * | 1996-01-18 | 2000-08-29 | Kabushiki Kaisha Toshiba | Flip-chip connection type semiconductor integrated circuit device |
US6208521B1 (en) * | 1997-05-19 | 2001-03-27 | Nitto Denko Corporation | Film carrier and laminate type mounting structure using same |
US6256207B1 (en) * | 1998-07-06 | 2001-07-03 | Shinko Electric Industries Co., Ltd. | Chip-sized semiconductor device and process for making same |
US6897096B2 (en) * | 2002-08-15 | 2005-05-24 | Micron Technology, Inc. | Method of packaging semiconductor dice employing at least one redistribution layer |
US20050116299A1 (en) * | 2003-12-01 | 2005-06-02 | Koning Paul A. | Component packaging apparatus, systems, and methods |
US6964201B2 (en) * | 2003-02-25 | 2005-11-15 | Palo Alto Research Center Incorporated | Large dimension, flexible piezoelectric ceramic tapes |
US7018866B2 (en) * | 2002-01-23 | 2006-03-28 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
US7169652B2 (en) * | 2002-09-26 | 2007-01-30 | Seiko Epson Corporation | Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate |
US7351608B1 (en) * | 2004-08-19 | 2008-04-01 | The United States Of America As Represented By The Director Of The National Security Agency | Method of precisely aligning components in flexible integrated circuit module |
-
2006
- 2006-06-02 KR KR1020060050015A patent/KR100734403B1/en active IP Right Grant
-
2007
- 2007-02-21 US US11/708,567 patent/US7607222B2/en not_active Expired - Fee Related
- 2007-03-13 CN CNB2007100867401A patent/CN100539059C/en not_active Expired - Fee Related
- 2007-03-27 JP JP2007080461A patent/JP4763639B2/en not_active Expired - Fee Related
-
2009
- 2009-09-16 US US12/585,509 patent/US20100108372A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6111317A (en) * | 1996-01-18 | 2000-08-29 | Kabushiki Kaisha Toshiba | Flip-chip connection type semiconductor integrated circuit device |
US6208521B1 (en) * | 1997-05-19 | 2001-03-27 | Nitto Denko Corporation | Film carrier and laminate type mounting structure using same |
US6256207B1 (en) * | 1998-07-06 | 2001-07-03 | Shinko Electric Industries Co., Ltd. | Chip-sized semiconductor device and process for making same |
US7018866B2 (en) * | 2002-01-23 | 2006-03-28 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
US6897096B2 (en) * | 2002-08-15 | 2005-05-24 | Micron Technology, Inc. | Method of packaging semiconductor dice employing at least one redistribution layer |
US7169652B2 (en) * | 2002-09-26 | 2007-01-30 | Seiko Epson Corporation | Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate |
US6964201B2 (en) * | 2003-02-25 | 2005-11-15 | Palo Alto Research Center Incorporated | Large dimension, flexible piezoelectric ceramic tapes |
US20050116299A1 (en) * | 2003-12-01 | 2005-06-02 | Koning Paul A. | Component packaging apparatus, systems, and methods |
US7351608B1 (en) * | 2004-08-19 | 2008-04-01 | The United States Of America As Represented By The Director Of The National Security Agency | Method of precisely aligning components in flexible integrated circuit module |
Also Published As
Publication number | Publication date |
---|---|
JP2007324569A (en) | 2007-12-13 |
KR100734403B1 (en) | 2007-07-02 |
CN100539059C (en) | 2009-09-09 |
JP4763639B2 (en) | 2011-08-31 |
CN101083215A (en) | 2007-12-05 |
US20070278651A1 (en) | 2007-12-06 |
US7607222B2 (en) | 2009-10-27 |
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