US20100108298A1 - Heat pipe with planished end surface - Google Patents
Heat pipe with planished end surface Download PDFInfo
- Publication number
- US20100108298A1 US20100108298A1 US12/684,264 US68426410A US2010108298A1 US 20100108298 A1 US20100108298 A1 US 20100108298A1 US 68426410 A US68426410 A US 68426410A US 2010108298 A1 US2010108298 A1 US 2010108298A1
- Authority
- US
- United States
- Prior art keywords
- pipe
- metal
- heat pipe
- planished
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49366—Sheet joined to sheet
- Y10T29/49368—Sheet joined to sheet with inserted tubes
Definitions
- the present invention relates to a heat pipe, which has a planished end surface.
- an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- the prior method for manufacturing sintered heat pipe is to seal an end of a metal pipe by fusing in high temperature. Then, a metal bar is placed into the pipe, and metal powder is filled into the pipe. After the sintering process, the manufacturing of the heat pipe is finished by pulling out the metal bar.
- the sealed end of the metal pipe, which is manufactured by the method is perfectly round and thicker than the circumferential wall, and the endpoint of the inner wall is lacking in capillarity. Therefore, the applications of the heat pipe nowadays are confined to the circumferential wall of the pipe rather than its end portion.
- a scope of the present invention provides a heat pipe that has a planished end surface.
- an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- the present invention provides a heat pipe that has a planished end surface.
- an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- the present invention provides a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- the heat pipe includes a sealed metal pipe and a porous capillary diversion layer.
- the metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe.
- the porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.
- the present invention uses stamping process to form a planished surface on an end of the heat pipe, and it disposes a porous capillary diversion layer to cover the planished end of the inner wall for the working fluid to smoothly circulate. Therefore, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe and has good heat dissipating effect.
- FIG. 1A is a schematic diagram of the external view of a heat pipe.
- FIG. 1B is a sectional diagram along the L-L line in FIG. 1A for illustrating the inner structure of a heat pipe.
- FIG. 2A to FIG. 2G illustrate the manufacturing process of the heat pipe of the first embodiment according to the present invention.
- the present invention provides a heat pipe that has a planished end surface.
- an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- the heat pipe of the present invention includes a sealed metal pipe and a porous capillary diversion layer.
- the metal pipe has a space in vacuum, and a working fluid is in the space, wherein the planished end surface is formed on the outer wall of a sealed end of the metal pipe.
- the porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.
- the planished end surface of the sealed metal pipe is formed by a stamping process.
- FIG. 1A is a schematic diagram the external view of a heat pipe.
- the heat pipe 1 includes a sealed metal pipe 12 and a planished sealed end 16 .
- FIG. 1B is a sectional diagram along the L-L line in FIG. 1A for illustrating the inner structure of a heat pipe.
- the heat pipe 1 further includes a porous capillary diversion layer 14 .
- the metal pipe 12 has a space in vacuum, and a working fluid is in the space.
- the porous capillary diversion layer 14 is disposed in the space, and it covers and includes the inner wall of the sealed end 16 of the metal pipe 12 .
- FIG. 2A to FIG. 2G illustrate the manufacturing process of the heat pipe of the first embodiment according to the present invention.
- the pipe body has an open end.
- the female mold has a flat bottom surface, and the female mold is adapted to receive the sealed end of the pipe body.
- the male mold has a flat top surface corresponding to the bottom surface of the female mold, and the male mold is adapted to be inserted into the pipe body from the open end of the pipe body.
- the sealed end 16 of the pipe body 12 is first fixed within the female mold 24 , and the male mold 26 is inserted into the pipe body 12 . Then, as shown in FIG. 2B , by use of the male mold 26 , press the sealed end 16 of the pipe body 12 with respect to the female mold 24 to form a planished surface at the sealed end 16 of the pipe body 12 . At this point, the pipe body 12 that has the planished end surface is finished.
- the pipe body which has the planished end surface, is produced into a heat pipe.
- a central bar is provided, and the diameter of the central bar is smaller than the diameter of the pipe body.
- a first metal powder 142 is placed into the pipe body 12 , the central bar 28 is inserted into the pipe body 12 from the open end of the pipe body 12 , and it presses against the first metal powder 142 .
- a second metal powder 144 is filled between the pipe body 12 and the central bar 28 .
- a sintering process is executed to fuse the second powder 144 with the first powder 142 , thus forming a porous capillary diversion layer 14 on the inner wall of the pipe body 12 .
- the central bar 28 is then taken out from the pipe body 12 .
- FIG. 2F as shown in FIG. 2F , a working fluid is injected into the pipe body 12 by using a tubule 20 . Finally, vacuum the pipe body 12 and seal the open end of the pipe body 12 . Then, the heat pipe shown in FIG. 2G is finished.
- the first powder and the second powder can be a copper powder, a nickel powder, a silver powder, a metal powder of which the surface is plated with copper, nickel or silver, or other similar metal powder.
- the inner wall of the pipe body that has the planished end surface has a plurality of tiny nicks which form an initial porous capillary diversion layer on the pipe wall.
- the manufacturing method of the heat pipe made from the pipe body with the planished end surface comprises the following steps. First, place a first metal powder into the pipe body, and insert the central bar into the pipe body from the open end of the pipe body and against the first metal powder. Then, execute a sintering process to fuse the metal powder with the initial porous capillary diversion layer located at the periphery of the inner wall of the pipe body, and form a porous capillary diversion layer which covers and comprises the inner wall of the sealed end of the metal pipe. Take the central bar out from the pipe body and inject a working fluid into the pipe body by using of a tubule. Finally, vacuum the pipe body and seal the open end of the pipe body.
- the manufacturing method of the heat pipe made from the pipe body which has the planished end surface, manufactures a plurality of tiny nicks by using a mechanical process to form a porous capillary diversion layer, it then injects a working fluid into the pipe body by using a tubule. Finally, the pipe body is vacuumed, and the open end of the pipe body is sealed.
- the manufacturing method of the heat pipe made from the pipe body, which has the planished end surface is described below. First, sinter a plurality of metal particles on the inner wall of the pipe body, and dispose a metal net on the inner wall to form a porous capillary diversion layer. Similarly, inject a working fluid into the pipe body by using a tubule, and vacuum the pipe body. Finally, seal the open end of the pipe body, and the heat pipe, which has a planished end surface is finished.
- the manufacturing method of the heat pipe made from the pipe body, which has the planished end surface is described below.
- the shape of the corrugated metal wire cloth is in triangular form, rectangular form, trapezoid form, or flexuous form.
- the shape of the planished end surface is tabular or fluted.
- the pipe body is made of a copper metal, a nickel metal, a silver metal, or other similar metal materials.
- the electronic device connected to the heat pipe can be a light emitting diode, a laser diode, or an integrated circuit.
- the pipe body when stamping the planished surface of the pipe body, the pipe body may be broken due to excess deformation.
- heating the pipe body and increasing the flexibility by heat pressing this can avoid forming cracks on the pipe body caused by stamping.
Abstract
The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.
Description
- 1. Field of the Invention
- The present invention relates to a heat pipe, which has a planished end surface. Particularly, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- 2. Description of the Prior Art
- With the progress of science and technology, the technologies of many electronic products all face problems of heat dissipation but can not break through. For example, a great deal of heat is generated by the central processing unit of a computer; the heat will have harmful effect on the whole system if the heat is not removed. Heat pipe plays a major role in the heat dissipating function of the central processing unit of a computer.
- The prior method for manufacturing sintered heat pipe is to seal an end of a metal pipe by fusing in high temperature. Then, a metal bar is placed into the pipe, and metal powder is filled into the pipe. After the sintering process, the manufacturing of the heat pipe is finished by pulling out the metal bar. The sealed end of the metal pipe, which is manufactured by the method, is perfectly round and thicker than the circumferential wall, and the endpoint of the inner wall is lacking in capillarity. Therefore, the applications of the heat pipe nowadays are confined to the circumferential wall of the pipe rather than its end portion.
- Accordingly, a scope of the present invention provides a heat pipe that has a planished end surface. Thereby, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- In order to achieve the above-mentioned purposes and solve the disadvantages discussed previously, the present invention provides a heat pipe that has a planished end surface. Thereby, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- The present invention provides a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.
- The present invention uses stamping process to form a planished surface on an end of the heat pipe, and it disposes a porous capillary diversion layer to cover the planished end of the inner wall for the working fluid to smoothly circulate. Therefore, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe and has good heat dissipating effect.
- The advantage and spirit of the invention may be understood by the following recitations together with the appended drawings.
-
FIG. 1A is a schematic diagram of the external view of a heat pipe. -
FIG. 1B is a sectional diagram along the L-L line inFIG. 1A for illustrating the inner structure of a heat pipe. -
FIG. 2A toFIG. 2G illustrate the manufacturing process of the heat pipe of the first embodiment according to the present invention. - The present invention provides a heat pipe that has a planished end surface. Particularly, an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe.
- The heat pipe of the present invention includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, and a working fluid is in the space, wherein the planished end surface is formed on the outer wall of a sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe. The planished end surface of the sealed metal pipe is formed by a stamping process.
- Referring to
FIG. 1A ,FIG. 1A is a schematic diagram the external view of a heat pipe. As shown inFIG. 1A , the heat pipe 1 includes a sealedmetal pipe 12 and a planished sealedend 16. -
FIG. 1B is a sectional diagram along the L-L line inFIG. 1A for illustrating the inner structure of a heat pipe. As shown inFIG. 1B , according to the first embodiment the present invention, the heat pipe 1 further includes a porouscapillary diversion layer 14. Themetal pipe 12 has a space in vacuum, and a working fluid is in the space. The porouscapillary diversion layer 14 is disposed in the space, and it covers and includes the inner wall of the sealedend 16 of themetal pipe 12. - The method for planishing a sealed end of a pipe body for making a heat pipe will be described blow. Referring to
FIG. 2A toFIG. 2G ,FIG. 2A toFIG. 2G illustrate the manufacturing process of the heat pipe of the first embodiment according to the present invention. - First, provide a pipe body, a female mold, and a male mold. The pipe body has an open end. The female mold has a flat bottom surface, and the female mold is adapted to receive the sealed end of the pipe body. The male mold has a flat top surface corresponding to the bottom surface of the female mold, and the male mold is adapted to be inserted into the pipe body from the open end of the pipe body.
- Referring to
FIG. 2A , as shown inFIG. 2A , the sealedend 16 of thepipe body 12 is first fixed within thefemale mold 24, and themale mold 26 is inserted into thepipe body 12. Then, as shown inFIG. 2B , by use of themale mold 26, press the sealedend 16 of thepipe body 12 with respect to thefemale mold 24 to form a planished surface at the sealedend 16 of thepipe body 12. At this point, thepipe body 12 that has the planished end surface is finished. - Then, the pipe body, which has the planished end surface, is produced into a heat pipe. A central bar is provided, and the diameter of the central bar is smaller than the diameter of the pipe body.
- Referring to
FIG. 2C , as shown inFIG. 2C , afirst metal powder 142 is placed into thepipe body 12, thecentral bar 28 is inserted into thepipe body 12 from the open end of thepipe body 12, and it presses against thefirst metal powder 142. As shown inFIG. 2D , asecond metal powder 144 is filled between thepipe body 12 and thecentral bar 28. Then, as shown inFIG. 2E , a sintering process is executed to fuse thesecond powder 144 with thefirst powder 142, thus forming a porouscapillary diversion layer 14 on the inner wall of thepipe body 12. Thecentral bar 28 is then taken out from thepipe body 12. Referring toFIG. 2F , as shown inFIG. 2F , a working fluid is injected into thepipe body 12 by using atubule 20. Finally, vacuum thepipe body 12 and seal the open end of thepipe body 12. Then, the heat pipe shown inFIG. 2G is finished. - The first powder and the second powder can be a copper powder, a nickel powder, a silver powder, a metal powder of which the surface is plated with copper, nickel or silver, or other similar metal powder.
- In one embodiment, the inner wall of the pipe body that has the planished end surface has a plurality of tiny nicks which form an initial porous capillary diversion layer on the pipe wall. The manufacturing method of the heat pipe made from the pipe body with the planished end surface comprises the following steps. First, place a first metal powder into the pipe body, and insert the central bar into the pipe body from the open end of the pipe body and against the first metal powder. Then, execute a sintering process to fuse the metal powder with the initial porous capillary diversion layer located at the periphery of the inner wall of the pipe body, and form a porous capillary diversion layer which covers and comprises the inner wall of the sealed end of the metal pipe. Take the central bar out from the pipe body and inject a working fluid into the pipe body by using of a tubule. Finally, vacuum the pipe body and seal the open end of the pipe body.
- In one embodiment, the manufacturing method of the heat pipe made from the pipe body, which has the planished end surface, manufactures a plurality of tiny nicks by using a mechanical process to form a porous capillary diversion layer, it then injects a working fluid into the pipe body by using a tubule. Finally, the pipe body is vacuumed, and the open end of the pipe body is sealed.
- In one embodiment, the manufacturing method of the heat pipe made from the pipe body, which has the planished end surface, is described below. First, sinter a plurality of metal particles on the inner wall of the pipe body, and dispose a metal net on the inner wall to form a porous capillary diversion layer. Similarly, inject a working fluid into the pipe body by using a tubule, and vacuum the pipe body. Finally, seal the open end of the pipe body, and the heat pipe, which has a planished end surface is finished.
- In one embodiment, the manufacturing method of the heat pipe made from the pipe body, which has the planished end surface is described below. First, lay a corrugated metal wire cloth on the inner wall of the pipe body, and dispose a flat metal net cloth on the inner wall to form a porous capillary diversion layer. Inject a working fluid into the pipe body by using a tubule, and vacuum the pipe body; then, seal the open end of the pipe body. The shape of the corrugated metal wire cloth is in triangular form, rectangular form, trapezoid form, or flexuous form.
- In one embodiment, the shape of the planished end surface is tabular or fluted. The pipe body is made of a copper metal, a nickel metal, a silver metal, or other similar metal materials.
- In one embodiment, the electronic device connected to the heat pipe can be a light emitting diode, a laser diode, or an integrated circuit.
- In practical application, when stamping the planished surface of the pipe body, the pipe body may be broken due to excess deformation. By heating the pipe body and increasing the flexibility by heat pressing, this can avoid forming cracks on the pipe body caused by stamping.
- With the example and explanations above, the features and spirits of the invention will be hopefully well described. Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teaching of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Claims (6)
1. A heat pipe having a planished end surface using the end surface flatten process, thereby an electronic device flatly being mounted on the planished surface of the heat pipe, the heat pipe comprising:
a sealed metal pipe having a space in vacuum, a working fluid being in the space, wherein the planished surface being formed at the outer wall of a sealed end of the metal pipe; and
a porous capillary diversion layer disposed in the space and covers and comprises the inner wall of the sealed end of the metal pipe.
2. The heat pipe of claim 1 , wherein the planished end surface of the sealed metal pipe is formed by a sealed end of the metal pipe through a stamping process.
3. The heat pipe of claim 1 , wherein the shape of the planished end surface is tabular or fluted.
4. The heat pipe of claim 1 , wherein the porous capillary diversion layer is sintered by a copper powder, a nickel powder, a silver powder, a metal powder which surface is plated with copper, nickel or silver, or other similar metal powder.
5. The heat pipe of claim 1 , wherein the sealed metal pipe is made of a copper metal, a nickel metal, a silver metal, or other similar metal materials.
6. The heat pipe of claim 1 , wherein the electronic device is one selected from the group consisting of a light emitting diode, a laser diode, and an integrated circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/684,264 US20100108298A1 (en) | 2005-03-28 | 2010-01-08 | Heat pipe with planished end surface |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005/10062451.9 | 2005-03-28 | ||
CN2005100624519A CN1840258B (en) | 2005-03-28 | 2005-03-28 | Method for manufacturing heat pipe with flat end surface |
CNPCT/CN2006/000521 | 2006-03-28 | ||
PCT/CN2006/000521 WO2006102838A1 (en) | 2005-03-28 | 2006-03-28 | An heat conductive pipe with flat end and its manufacturing method |
US88742607A | 2007-09-28 | 2007-09-28 | |
US12/684,264 US20100108298A1 (en) | 2005-03-28 | 2010-01-08 | Heat pipe with planished end surface |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US88742607A Division | 2005-03-28 | 2007-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100108298A1 true US20100108298A1 (en) | 2010-05-06 |
Family
ID=37029549
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/887,426 Expired - Fee Related US7895747B2 (en) | 2005-03-28 | 2006-03-28 | Method for manufacturing a heat pipe with a planished end surface |
US12/684,264 Abandoned US20100108298A1 (en) | 2005-03-28 | 2010-01-08 | Heat pipe with planished end surface |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/887,426 Expired - Fee Related US7895747B2 (en) | 2005-03-28 | 2006-03-28 | Method for manufacturing a heat pipe with a planished end surface |
Country Status (5)
Country | Link |
---|---|
US (2) | US7895747B2 (en) |
EP (1) | EP1884993A4 (en) |
JP (1) | JP2008534901A (en) |
CN (1) | CN1840258B (en) |
WO (1) | WO2006102838A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090249625A1 (en) * | 2008-04-02 | 2009-10-08 | Advanced Optoelectronic Technology, Inc. | Method for jointing a semiconductor element and a heat pipe |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005024315D1 (en) | 2005-03-31 | 2010-12-02 | Neobulb Technologies Inc | HIGH-PERFORMANCE LED LIGHTING DEVICE WITH HIGH THERMAL DIFFUSION CAPACITY |
JP2010516986A (en) * | 2007-01-19 | 2010-05-20 | ▲陳▼振▲賢▼ | Heat pipe having flat end and method for manufacturing the same |
CN101294698B (en) * | 2007-04-27 | 2010-06-02 | 新灯源科技有限公司 | Luminous diode lighting device |
US8235562B2 (en) * | 2007-04-27 | 2012-08-07 | Neobulb Technologies, Inc. | Light-emitting diode illumination apparatus |
WO2008131587A1 (en) * | 2007-04-28 | 2008-11-06 | Jenshyan Chen | Heat pipe and manufacturing method thereof |
CN101295685B (en) * | 2007-04-28 | 2011-03-23 | 新灯源科技有限公司 | Heat pipe and manufacturing method thereof |
WO2009111940A1 (en) * | 2008-03-10 | 2009-09-17 | Long Guoqing | Led lamp radiator and led lamp with the radiator |
CN101825235A (en) * | 2009-03-05 | 2010-09-08 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp and light engine thereof |
TWI381144B (en) * | 2009-07-31 | 2013-01-01 | Sintered heat pipe, manufacturing method thereof and manufacturing method for groove tube thereof | |
GB201005861D0 (en) * | 2010-04-08 | 2010-05-26 | S & P Coil Products Ltd | A method an an apoparatus for constructing a heat pipe |
RU2474888C2 (en) * | 2011-04-29 | 2013-02-10 | Общество с ограниченной ответственностью "Видео Интернет Технологии" (ООО "Видео Интернет Технологии") | Cooling device for electronic components |
TW201248946A (en) * | 2011-05-18 | 2012-12-01 | Neobulb Technologies Inc | Semiconductor optoelectronic converting system and the fabricating method thereof |
JP5809529B2 (en) * | 2011-11-07 | 2015-11-11 | 株式会社フジクラ | Manufacturing method of sintered heat pipe |
JP5700831B2 (en) * | 2011-11-07 | 2015-04-15 | 株式会社フジクラ | Manufacturing method of sintered heat pipe |
AT513616B1 (en) | 2013-05-28 | 2014-06-15 | Miba Sinter Austria Gmbh | Method for closing a hole |
CN103344141A (en) * | 2013-07-30 | 2013-10-09 | 黄斌 | Heat pipe heating device, heat pipe heat dissipation method and superconduction liquid |
CN105200403A (en) * | 2014-06-26 | 2015-12-30 | 江苏格业新材料科技有限公司 | Method for improving interface combination through surface silver deposition of foamy copper for heat pipe or vapor chamber |
KR200480995Y1 (en) * | 2014-09-22 | 2016-08-01 | 쯔성 까이 | Heating system |
CN105698575A (en) * | 2014-11-29 | 2016-06-22 | 黄斌 | Heat efficiency medium conductor |
CN205909724U (en) * | 2016-06-27 | 2017-01-25 | 富瑞精密组件(昆山)有限公司 | Modular electron device of heat pipe and applied this combination formula heat pipe |
TWI692920B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692607B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692608B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692610B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692611B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692606B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692605B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692609B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US6827133B1 (en) * | 2003-05-08 | 2004-12-07 | Chin-Kuang Luo | Heat pipe |
US20050022984A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
US6986383B2 (en) * | 2004-03-30 | 2006-01-17 | Hul-Chun Hsu | End surface structure of a heat pipe for contact with a heat source |
US7040382B2 (en) * | 2004-07-06 | 2006-05-09 | Hul-Chun Hsu | End surface capillary structure of heat pipe |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2130822A1 (en) | 1971-06-22 | 1973-01-11 | Bbc Brown Boveri & Cie | Heat tube - with dual porosity capillary structure |
JPS5224366A (en) * | 1975-07-22 | 1977-02-23 | Toyo Seisakusho:Kk | A heat pipe |
JPS5222156A (en) * | 1975-08-12 | 1977-02-19 | Sony Corp | Mounting method of heat source to heat pipe |
JPS5222151A (en) * | 1975-08-13 | 1977-02-19 | Sony Corp | Mounting method of heating element to heat pipe |
DE3034951C2 (en) * | 1980-09-17 | 1986-09-04 | SKF GmbH, 8720 Schweinfurt | Process for the non-cutting manufacture of a bearing bush |
JPS6166086A (en) * | 1984-09-07 | 1986-04-04 | Mitsubishi Heavy Ind Ltd | Heat pipe |
JPS62116797A (en) * | 1985-11-13 | 1987-05-28 | Mitsubishi Metal Corp | Formation of porous layer |
JPH09273882A (en) * | 1996-04-03 | 1997-10-21 | Fujikura Ltd | Heat pipe and its manufacture |
JP2936469B2 (en) * | 1996-09-20 | 1999-08-23 | 有限会社柿生精密 | Work burring method with weld for welding tubular fittings |
JP3953184B2 (en) * | 1998-04-13 | 2007-08-08 | 株式会社フジクラ | Heat pipe manufacturing method |
JP2000046487A (en) * | 1998-07-28 | 2000-02-18 | Fujikura Ltd | Heat pipe and its manufacture |
JP2002310578A (en) * | 2001-04-13 | 2002-10-23 | Showa Electric Wire & Cable Co Ltd | Heat pipe using copper silver alloy |
TW466329B (en) * | 2001-08-09 | 2001-12-01 | Auras Technology Ltd | Method for manufacturing cylinder-shaped heat conduction tube |
TW510961B (en) | 2001-11-21 | 2002-11-21 | Manhung Corp | Method of manufacturing heat pipe of heat dissipation plate |
CN2526894Y (en) | 2002-01-07 | 2002-12-18 | 业强科技股份有限公司 | Heat conducting pipe |
WO2004038759A2 (en) * | 2002-08-23 | 2004-05-06 | Dahm Jonathan S | Method and apparatus for using light emitting diodes |
CN2585162Y (en) * | 2002-09-06 | 2003-11-05 | 徐惠群 | Heat pipe structure of end face smooth and without taper |
JP2004322169A (en) * | 2003-04-25 | 2004-11-18 | Tsubakimoto Chain Co | Cylindrical shaft bushing member and its producing method |
CN1566888A (en) * | 2003-06-10 | 2005-01-19 | 业强科技股份有限公司 | Heat guiding tube manufacturing method and arrangement thereof |
TW593957B (en) * | 2003-10-27 | 2004-06-21 | Arro Superconducting Technolog | Method for manufacturing forged heat pipe and product thereof |
CN1312766C (en) * | 2004-11-15 | 2007-04-25 | 新灯源科技有限公司 | Method for pressing heat conduit end with levelling surface used as active element and its structure |
-
2005
- 2005-03-28 CN CN2005100624519A patent/CN1840258B/en not_active Expired - Fee Related
-
2006
- 2006-03-28 EP EP06722173A patent/EP1884993A4/en not_active Withdrawn
- 2006-03-28 US US11/887,426 patent/US7895747B2/en not_active Expired - Fee Related
- 2006-03-28 JP JP2008503354A patent/JP2008534901A/en active Pending
- 2006-03-28 WO PCT/CN2006/000521 patent/WO2006102838A1/en active Application Filing
-
2010
- 2010-01-08 US US12/684,264 patent/US20100108298A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US6827133B1 (en) * | 2003-05-08 | 2004-12-07 | Chin-Kuang Luo | Heat pipe |
US20050022984A1 (en) * | 2003-06-26 | 2005-02-03 | Rosenfeld John H. | Heat transfer device and method of making same |
US6986383B2 (en) * | 2004-03-30 | 2006-01-17 | Hul-Chun Hsu | End surface structure of a heat pipe for contact with a heat source |
US7040382B2 (en) * | 2004-07-06 | 2006-05-09 | Hul-Chun Hsu | End surface capillary structure of heat pipe |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090249625A1 (en) * | 2008-04-02 | 2009-10-08 | Advanced Optoelectronic Technology, Inc. | Method for jointing a semiconductor element and a heat pipe |
Also Published As
Publication number | Publication date |
---|---|
CN1840258B (en) | 2010-08-25 |
US7895747B2 (en) | 2011-03-01 |
CN1840258A (en) | 2006-10-04 |
EP1884993A4 (en) | 2010-10-27 |
EP1884993A1 (en) | 2008-02-06 |
US20090126908A1 (en) | 2009-05-21 |
JP2008534901A (en) | 2008-08-28 |
WO2006102838A1 (en) | 2006-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100108298A1 (en) | Heat pipe with planished end surface | |
US20100108297A1 (en) | Heat Pipe and Making Method Thereof | |
US20100326630A1 (en) | Heat spreader with vapor chamber and method for manufacturing the same | |
US20070039718A1 (en) | Heat pipe and manufacturing method for the same | |
CN101566440B (en) | Sintered soaking plate and manufacturing method thereof | |
CN207515592U (en) | Ultrathin flexible soaking plate | |
US20100126701A1 (en) | Plate-type heat pipe and method for manufacturing the same | |
US20130239410A1 (en) | Method for manufacturing heat pipe | |
CN104764350A (en) | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core | |
JP2004055774A (en) | Lid for sealing plate type substrate and its manufacturing method | |
US7032653B1 (en) | Tower-type heat pipe and method for making the same | |
JP5824495B2 (en) | Terminal manufacturing method, and terminal and electronic component core manufacturing method | |
US20140345137A1 (en) | Method for manufacturing flat heat pipe with sectional differences | |
US20150276323A1 (en) | Heat pipe and process for manufacturing the same | |
US20100032138A1 (en) | Heat pipe with flat end and method of manufacturing the same | |
CN101907416A (en) | Heat radiating plate and manufacture method thereof | |
TWI763967B (en) | Vapor chamber | |
CN206516569U (en) | The vacuum casting of HVDC relay | |
CN202196767U (en) | Brazing structure for ceramic and lead wire of air-impermeable encapsulating housing | |
CN101794755B (en) | Heat pipe with flat end face | |
JP6648420B2 (en) | Method for manufacturing metal molded body and apparatus for manufacturing metal molded body | |
US20090050297A1 (en) | Dissipating Module Structure for Heat Generating Device | |
JP4717708B2 (en) | Connector terminal molding method and connector terminal | |
JP2019214127A (en) | Exterior coating resin molding method of electronic part module | |
KR20110052230A (en) | Manufacturing method of the heatpipe having a base block, the heatpipe having a base block and a cooler having the heatpipe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |