US20100007259A1 - Organic electroluminescence device panel - Google Patents
Organic electroluminescence device panel Download PDFInfo
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- US20100007259A1 US20100007259A1 US12/565,985 US56598509A US2010007259A1 US 20100007259 A1 US20100007259 A1 US 20100007259A1 US 56598509 A US56598509 A US 56598509A US 2010007259 A1 US2010007259 A1 US 2010007259A1
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- 238000005401 electroluminescence Methods 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000002411 adverse Effects 0.000 abstract description 5
- 239000011521 glass Substances 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 17
- 239000005394 sealing glass Substances 0.000 description 14
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000007789 sealing Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000004904 shortening Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 230000008719 thickening Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Definitions
- the present invention relates to an organic electroluminescence (hereinafter, abbreviated to “EL”) device panel.
- EL organic electroluminescence
- the organic EL device which functions as a self-luminous device has been attracting attention for use in a flat panel display.
- the organic EL device generally has a sandwich structure in which an organic light emitting layer is sandwiched between two electrodes on a glass substrate.
- a transparent electrode is used as one of the electrodes, generally, an indium tin oxide (ITO) transparent electrode is used as an anode.
- ITO indium tin oxide
- the organic EL device that emits light by the principle as described above is used for a display of an in-vehicle audio system, a cellular phone, or the like, or as a display device thereof, since the organic EL device is excellent in visibility and flexibility and can emit light of various colors.
- display pixels of the organic EL device panel having those characteristics are driven by a current.
- the organic EL device panel has a current dependent characteristic in which a light emission brightness of a pixel varies substantially proportional to a driving current.
- heat is generated locally at a time of driving.
- a contact resistance portion is provided between the lead-out wiring and a power source wiring, and heat is generated locally to increase a temperature of the lead-out wiring through which the current flows in a concentrated manner, in particular, a temperature of the contact resistance portion between the lead-out wiring and the power source wiring. Accordingly, there has been a problem of deterioration such as shortening of a lifetime of pixels of the organic EL device in the vicinity of the high-temperature portion, or generation and increase of a non-light emitting portion.
- the lead-out wiring of a liquid crystal display necessitates connections of a narrow pitch for realizing a display of high fineness.
- the narrow pitch connection can be realized by using solder or an anisotropic conductive film (hereinafter, abbreviated to “ACF”).
- ACF anisotropic conductive film
- the connection with an FPC or a TCP corresponding to a plurality of lead-out wirings is preferably made through heat press bonding by using the ACF.
- the ACF is generally used for mounting the TCP on a liquid crystal display cell.
- the heat press bonding for the connection of the lead-out wiring has been performed in a state where the lead-out wiring and an organic EL device portion are apart from each other to an extent that the deterioration is not generated so that the organic light emitting layer does not become equal to or higher than the temperature at which the deterioration is generated.
- an interval between a press bonding portion of the lead-out wiring and the organic EL device portion becomes large, so an outline of the organic EL device panel is increased, leading to a hindrance of miniaturization of the frame thereof.
- Japanese Patent Application Laid-Open No. H11-204256 proposes a method of manufacturing an organic EL device panel, a frame of which can be made small without causing deterioration due to heat press bonding by subjecting the organic EL device to a cooling process at a time of performing the heat press bonding using an ACF so as not to increase a temperature of the organic EL device.
- the method of manufacturing an organic EL device panel disclosed in Japanese Patent Application Laid-Open No. H11-204256 involves only the cooling process at the time of manufacturing the panel. Therefore, a problem concerning deterioration due to heat at the time of driving after the panel is formed has not yet been solved. In short, the problem of the conventional organic EL device panel at the time of driving the organic EL device panel still remains. Accordingly, a temperature of the contact resistance portion between the lead-out wiring and the power source wiring becomes high due to the locally generated heat. As a result, deterioration such as shortening of a lifetime of pixels of the organic EL device in the vicinity of the high-temperature portion or generation and increase of the non-light emitting portion cannot be avoided.
- the deterioration due to heat generated at the time of driving can be reduced by increasing the number of the lead-out wiring or by thickening the wiring.
- the increase in number of the lead-out wiring or the thickening of the wiring may hinder the narrowing of the pitch of the lead-out wiring or the miniaturization of the frame of the organic EL device panel.
- the present invention provides an organic EL device panel in which an organic EL device is not adversely affected by heat at a time of manufacturing and driving of the panel, and in which deterioration of pixels of the organic EL device is not generated.
- an organic EL device panel including: a substrate; a plurality of organic electroluminescence devices each of which is formed on the substrate and includes a first electrode, an organic compound layer, and a second electrode in the stated order from the substrate; a power source wiring including a first power source wiring electrically connected to the first electrode and a second power source wiring electrically connected to the second electrode; a lead-out wiring including a first lead-out wiring electrically connected to the first power source wiring and a second lead-out wiring electrically connected to the second power source wiring; and a heat dissipation member formed on the lead-out wiring.
- the organic EL device panel according to the present invention has a heat dissipation portion formed on the lead-out wiring electrically connected to the first electrode or the second electrode. Therefore, heat generation can be suppressed at the time of driving without providing the plurality of lead-out wirings or thickening the wiring. Further, heat generation can be suppressed even when the lead-out wiring has a narrow pitch connection. In addition, even at the time of manufacturing, an amount of heat to be transferred to the organic EL device can be suppressed. Thus, the organic EL device is not adversely affected by heat, and deterioration such as shortening of the lifetime of image quality of the organic EL device or generation and increase of the non-light emitting portion is not produced.
- FIG. 1A is a plan view schematically illustrating an organic EL device panel according to the present invention
- FIG. 1B is a sectional view taken along the line 1 B- 1 B of FIG. 1A
- FIG. 1C is a view for illustrating a contact resistance portion between a lead-out wiring and a power source wiring.
- FIG. 2 is a partially enlarged sectional view illustrating an organic EL device panel according to Example 1 of the present invention.
- FIG. 3A is a plan view schematically illustrating an organic EL device panel according to Example 2 of the present invention
- FIG. 3B is a sectional view taken along the line 3 B- 3 B of FIG. 3A .
- FIG. 1A is a plan view schematically illustrating the organic EL device panel.
- FIG. 1B is a sectional view taken along the line 1 B- 1 B of FIG. 1A .
- FIG. 1C is an explanatory view illustrating a contact resistance portion between a lead-out wiring and a power source wiring. The contact resistance portion is an extremely small portion.
- FIG. 1C schematically illustrates an enlarged view of the contact resistance portion.
- the organic EL device panel includes a glass substrate 1 , a lead-out wiring 2 , a first electrode 3 , an organic light emitting layer 4 , an ITO film (second electrode) 5 , a heat dissipation member 6 , an insulating layer 7 , a metal film 8 , a sealing glass (sealing member) 9 , a power source wiring 10 , and a contact resistance portion R.
- a first lead-out wiring 2 a of the lead-out wiring 2 is connected to the first electrode 3 via the power source wiring 10 .
- a second lead-out wiring 2 b of the lead-out wiring 2 is connected to the second electrode 5 via the power source wiring 10 .
- a first power source wiring 10 a of the power source wiring 10 is connected to the first electrode 3
- a second power source wiring 10 b of the power source wiring 10 is connected to the second electrode 5 .
- the contact resistance portion R between the lead-out wiring 2 and the power source wiring 10 is a part of the lead-out wiring 2 , so a portion in contact with the power source wiring 10 is referred to as “contact resistance portion R” in particular.
- the organic EL device panel illustrated in FIGS. 1A to 1 C includes as main components, the first electrode 3 , the organic light emitting layer 4 , and the second electrode 5 , all of which are formed on the glass substrate 1 , and the sealing glass 9 seals the organic EL devices such as the organic light emitting layer 4 .
- a current to be supplied to each of the devices is supplied to the first electrode 3 of each device via the lead-out wiring 2 and the power source wiring 10 from a current supplying portion (not shown).
- the lead-out wiring 2 and the power source wiring 10 are electrically connected through the contact resistance portion R.
- the heat dissipation member 6 is formed on the lead-out wiring 2 (note that a press-bonded portion with the FPC or the like is excluded) electrically connected with the power source wiring 10 via the contact resistance portion R and in the peripheral region thereof (region where no lead-out wiring 2 or first electrode 3 is formed on the glass substrate 1 ).
- the heat dissipation member 6 includes the insulating layer 7 formed on the lead-out wiring 2 and the metal film 8 formed on and in the peripheral region of the insulating layer 7 in a continuous manner (note that the metal film 8 need not be continuous).
- the heat dissipation member 6 is formed on the lead-out wiring 2 .
- the heat dissipation member 6 may be formed on the power source wiring 10 , which enables further reduction of influence of heat.
- the heat dissipation member 6 is formed to extend from within the sealing glass 9 to the outside thereof so that the heat generated at the time of driving is not accumulated in the sealing glass 9 .
- the sealing glass 9 keeps the organic EL device in an airtight space and protects the organic EL device from substances that damage the organic EL device, such as moisture and oxygen.
- the state where the heat dissipation member 6 is formed to extend from within the sealing glass 9 to the outside thereof means that the heat dissipation member 6 extends from within the airtight space to the outside thereof.
- the insulating layer 7 may be formed of any material as long as the material is an insulating material, but is preferably formed of a material with good heat conductivity.
- the metal film 8 may be formed of any material as long as a metal film can be formed, but is preferably formed of a material with good heat conductivity.
- the metal film 8 exhibits higher heat dissipation effect as the thickness increases, which is preferable.
- Specific examples of the material with good heat conductivity include Ag, Cu, Au, and Al.
- a manufacturing process can be further simplified. Incidentally, bonding of a metal piece (not shown) to a part of the metal film 8 increases a surface area of the heat dissipation member, leading to further enhancement of the heat dissipation effect, which is preferable. The larger the number of the metal pieces, the higher the heat dissipation effect.
- the surface area of the heat dissipation member is also increased by employing a structure of, for example, a heat sink, in which fine protrusions or a plurality of plate-like members (fins) are aligned with a regularity on a surface of the metal film, leading to an increase in the heat dissipation effect.
- the metal piece may be bonded within the airtight space. Further, the heat dissipation effect is further increased when the metal piece is bonded within and outside the airtight space.
- the organic EL device panel having the structure as described above, heat generated at the contact resistance portion R between the lead-out wiring 2 and the power source wiring 10 at the time of driving is dissipated from the heat dissipation member 6 . Therefore, even when the lead-out wiring 2 has a narrow pitch connection, heat generation of the lead-out wiring 2 and the contact resistance portion R can be suppressed without increasing the number of or thickening the lead-out wiring 2 . In addition, heat transfer to the organic EL device can be suppressed also at the time of manufacturing. Thus, the organic EL device is not adversely affected by heat, so deterioration such as shortening of lifetime of image quality of the organic EL device or generation and increase of the non-light emitting portion is not caused.
- the organic EL device panel illustrated in FIGS. 1A to 1 C is manufactured as described below.
- a TFT circuit is formed on the glass substrate 1 , and a flattening film (not shown) is formed thereafter.
- a device separation film (not shown) is formed after the lead-out wiring 2 and the first electrode 3 are formed by an anode metal material.
- the organic light emitting layer 4 is formed on the first electrode 3 via the device separation film, and the ITO film 5 is formed.
- the lead-out wiring 2 and the first electrode 3 are formed through a single step. However, the two members may be formed in different steps.
- the insulating layer 7 is formed on the lead-out wiring 2 .
- the metal film 8 is formed on and in the peripheral region of the insulating layer 7 in a continuous manner.
- the sealing glass 9 and the glass substrate 1 are sealed by curing an adhesive.
- mounting of the FPC and sealing and curing of a resin are performed to complete the organic EL device panel.
- the heat dissipation member 6 is formed on the lead-out wiring 2 electrically connected with the first electrode 3 .
- the heat dissipation member 6 may be formed on the lead-out wiring (not shown) electrically connected with the second electrode 5 .
- the first electrode 3 is used as an anode electrode and the second electrode 5 is used as a cathode electrode in this embodiment mode.
- this embodiment mode can be carried out with the first electrode 3 being the cathode electrode and the second electrode 5 being the anode electrode.
- the organic EL device panel according to this embodiment mode is a top emission type panel.
- the organic EL device panel may be a bottom emission type panel.
- the insulating layer 7 is formed on the lead-out wiring 2 and the metal film 8 is formed on the insulating layer 7 .
- the metal film 8 when the metal film 8 is selectively arranged such that a short circuit is not caused between the first lead-out wiring 2 a and the second lead-out wiring 2 b , the metal film 8 can be arranged directly on the lead-out wiring 2 .
- only the insulating layer 7 may be formed on the lead-out wiring 2 . In short, it is only necessary that the heat dissipation member 6 be formed on the lead-out wiring 2 .
- organic EL device panel according to an example of the present invention will be described in accordance with manufacturing steps. It should be noted that the organic EL device panel according to the present invention is not limited to that in the following embodiment and may be variously modified without departing from the gist of the present invention.
- the organic EL device panel illustrated in FIG. 2 is an active drive type organic EL device panel.
- FIG. 2 is a partially enlarged sectional view of the organic EL device panel.
- the organic EL device panel includes a glass substrate 11 on which a TFT circuit 20 is formed, a lead-out wiring 12 , a first electrode 13 , an organic light emitting layer 14 , an ITO film (second electrode) 15 , a heat dissipation member 16 , an insulating layer 17 , a metal film 18 , and a sealing glass 19 .
- a configuration of a contact resistance portion between the lead-out wiring 12 and the power source wiring is similar to that illustrated in FIG. 1C .
- a Cr film having a thickness of 100 nm was formed on the glass substrate 11 on which the TFT circuit 20 was formed, by DC sputtering of a Cr target.
- the lead-out wiring 12 was formed on an outer circumferential portion of the glass substrate 11 and the first electrode 13 was formed at a position corresponding to each pixel, by a photo-etching method.
- the power source wiring is omitted in FIG. 2 .
- the power source wiring and the lead-out wiring 12 had a laminate structure, each of the layers being formed of a Cr film.
- a positive resist type photosensitive organic resin material was applied with a film thickness of 1 ⁇ m by a spin coating method and a pre-bake was performed thereafter, a portion corresponding to a light emitting portion on the Cr electrode and the outer circumferential portion of a display region were exposed to light by using a photo-mask. After that, the exposed portions were removed with a developer and the resin was cured through a post-bake at 230° C., thereby forming the insulating layer 17 .
- the glass substrate 11 on which the layers up to the insulating layer 17 had been formed was transferred from a pre-process room to a film formation room. After air in the film formation room was exhausted down to 1 ⁇ 10 ⁇ 4 Pa, the organic light emitting layer 14 having the film thickness of 15 nm was formed by a resistance heating deposition method using Alq3, which was an alkylate complex, under the condition of a film forming rate of 0.2 to 0.3 nm/sec.
- the glass substrate 11 on which layers up to the organic light emitting layer 14 had been formed was transferred to another film formation room.
- the ITO film 15 which was the second electrode was formed on the organic light emitting layer 14 by covering a Cr pixel electrode through mask formation so that the ITO film 15 had a film thickness of 130 nm, by a DC magnetron sputtering method using an ITO target.
- the organic EL device having the lead-out wiring 12 , the first electrode 13 , the insulating layer 17 , the organic light emitting layer 14 , and the ITO film 15 formed on the glass substrate 11 was formed.
- the glass substrate 11 on which the organic EL devices had been formed was transferred to another film formation room.
- the Cr film which was the metal film 18 was formed in a continuous manner by the DC sputtering of the Cr target and by the mask formation to cover the insulating layer 17 and a peripheral region thereof on the glass substrate 11 .
- the metal film 18 and the insulating layer 17 formed the heat dissipation member 16 .
- the glass substrate 11 on which layers up to the metal film 18 had been formed was sealed with the sealing glass 19 .
- a bottom portion of the circumference of the sealing glass 19 was applied with an ultraviolet-curable adhesive (not shown) to be cured by irradiation of light for 60 seconds.
- the organic EL device panel according to the present invention was formed by the above-mentioned steps.
- an ACF (not shown) was temporarily press-bonded to the lead-out wiring 12 of the organic EL device panel. Subsequently, an alignment mark of the lead-out wiring 12 and an alignment mark of the FPC (not shown) were aligned. After that, the lead-out wiring 12 and the FPC were placed below a heater head (temperature: 230° C.) to thereby perform bonding of the FPC by carrying out heat press bonding under a pressure of 3 MPa for 12 seconds via a Teflon (registered trademark) tape having a thickness of 50 ⁇ m.
- a heater head temperature: 230° C.
- the manufactured organic EL device panel was connected to the driving circuit substrate, and the organic EL device panel was driven for a long time by causing a current of 150 mA to flow through a single lead-out wiring 12 . Even when the organic EL device panel was driven for a long time, heat generation of the contact resistance portion between the lead-out wiring 12 and the power source wiring due to the current was suppressed. In addition, heat transfer to the organic EL device in the mounting step (at the time of manufacturing) was also suppressed at a low level.
- the organic EL device was hardly affected by heat, so deterioration such as the shortening of lifetime of image quality of the organic EL device or the generation and increase of the non-light emitting portion was not produced. Further, the frame of the organic EL device panel could be made narrow.
- FIGS. 3A and 3B are passive drive type organic EL device panel.
- FIG. 3A is a plan view schematically illustrating the organic EL device panel.
- FIG. 3B is a partial sectional view taken along the line 3 B- 3 B of FIG. 3A .
- FIGS. 3A and 3B are passive drive type organic EL device panel.
- the organic EL device panel includes a grass substrate 21 , a lead-out wiring 22 , a first electrode 23 , an organic light emitting layer 24 , an ITO film (second electrode) 25 , a heat dissipation member 26 , an insulating layer 27 , a metal film 28 , a sealing glass 29 , and a metal piece 30 .
- the manufacturing steps of the organic EL device panel according to this example is similar to those of Example 1 except that a shape and film thickness of a mask are slightly different through steps of formation of the lead-out wiring 22 to formation of the ITO film 25 . Therefore, description thereof will be omitted.
- the glass substrate 21 on which the organic EL devices had been formed was transferred from the ITO film formation room to another film formation room.
- the Cr film which was the metal film 28 was formed in a continuous manner by the DC sputtering of the Cr target and the mask formation so as to cover the insulating layer 27 on the glass substrate 21 and the four corners of the glass substrate 21 on which the lead-out wiring 22 or the first electrode 23 was not formed.
- the metal film 28 and the insulating layer 27 formed the heat dissipation member 26 .
- the metal film 28 was formed on all four corners (outer circumferential portion) of the glass substrate 21 .
- the glass substrate 21 on which layers up to the metal film 28 had been formed was sealed with the sealing glass 29 .
- a bottom portion of the circumference of the sealing glass 29 was applied with an ultraviolet-curable adhesive (not shown) to be cured by irradiation of light for 60 seconds, thereby forming the organic EL device panel.
- an ACF (not shown) was temporarily press-bonded to the lead-out wiring 22 of the organic EL device panel. Subsequently, an alignment mark of the lead-out wiring 22 and an alignment mark of the FPC (not shown) were aligned. After that, the lead-out wiring 22 and the FPC were placed below a heater head (temperature: 230° C.) to thereby perform bonding of the FPC by carrying out heat press bonding under a pressure of 3 MPa for 12 seconds via a Teflon (registered trademark) tape having a thickness of 50 ⁇ m.
- the FPC bonding with respect to the organic EL device panel was completed when the above-mentioned step was carried out on all four corners of the organic EL device panel.
- the organic EL device panel had been manufactured through the above-mentioned steps was connected to the driving circuit substrate, thereby driving the organic EL device panel for a long time.
- heat generation of the contact resistance portion between the lead-out wiring 22 and the power source wiring due to the current was suppressed.
- heat transfer to the organic EL device in the mounting step was also suppressed at a low level. Accordingly, even when the lead-out wiring 22 was connected with a narrow pitch, the organic EL device was not adversely affected by heat, so deterioration such as the shortening of lifetime of image quality of the organic EL device or the generation and increase of the non-light emitting portion was not produced. Further, the frame of the organic EL device panel could be made narrow.
Abstract
There is provided an organic electroluminescence (EL) device panel including a heat dissipation member formed on a lead-out wiring electrically connected to a first electrode or a second electrode. According to the organic EL device panel of the present invention, the organic EL device is not adversely affected by heat at a time of manufacturing and driving, so deterioration of pixels of the organic EL device is not generated.
Description
- 1. Field of the Invention
- The present invention relates to an organic electroluminescence (hereinafter, abbreviated to “EL”) device panel.
- 2. Description of the Related Art
- In recent years, an organic EL device which functions as a self-luminous device has been attracting attention for use in a flat panel display. The organic EL device generally has a sandwich structure in which an organic light emitting layer is sandwiched between two electrodes on a glass substrate. To allow light emitted from the organic light emitting layer to be extracted to an outside of the device, a transparent electrode is used as one of the electrodes, generally, an indium tin oxide (ITO) transparent electrode is used as an anode. Further, while an outer circumferential surface of the organic EL device is sealed with a sealing material, a current is caused to flow therein by an external driving circuit to thereby emit light.
- The organic EL device that emits light by the principle as described above is used for a display of an in-vehicle audio system, a cellular phone, or the like, or as a display device thereof, since the organic EL device is excellent in visibility and flexibility and can emit light of various colors.
- Incidentally, display pixels of the organic EL device panel having those characteristics are driven by a current. In addition, the organic EL device panel has a current dependent characteristic in which a light emission brightness of a pixel varies substantially proportional to a driving current. In particular, in an active drive type organic EL device panel, heat is generated locally at a time of driving. For example, in a case where the number of pixels of the panel is 320×240 pixels, when a current for one pixel is 750 nA, the current can be expressed by 750 nA×3×320×240=173 mA, which means that the current of about 173 mA flows through a single lead-out wiring. A contact resistance portion is provided between the lead-out wiring and a power source wiring, and heat is generated locally to increase a temperature of the lead-out wiring through which the current flows in a concentrated manner, in particular, a temperature of the contact resistance portion between the lead-out wiring and the power source wiring. Accordingly, there has been a problem of deterioration such as shortening of a lifetime of pixels of the organic EL device in the vicinity of the high-temperature portion, or generation and increase of a non-light emitting portion.
- On the other hand, the lead-out wiring of a liquid crystal display (hereinafter, abbreviated to “LCD”) necessitates connections of a narrow pitch for realizing a display of high fineness. The narrow pitch connection can be realized by using solder or an anisotropic conductive film (hereinafter, abbreviated to “ACF”). In order to cope with the narrow pitch of several hundred μm or less, the connection with an FPC or a TCP corresponding to a plurality of lead-out wirings is preferably made through heat press bonding by using the ACF. The ACF is generally used for mounting the TCP on a liquid crystal display cell.
- However, in order to realize a display having high fineness using the organic EL device, when heat press bonding is performed to establish an electrical connection of the lead-out wiring with the FPC as in the case of the LCD, there has been a problem in that image quality of the organic EL device is deteriorated due to heat transfer at the time of performing the press bonding. This is because the organic EL device is sensitive to heat and device characteristics are deteriorated, that is, light emitting efficiency is decreased or the lifetime thereof is shortened, due to the deterioration of the organic light emitting layer accompanying the heating. Thus, the heat press bonding for the connection of the lead-out wiring has been performed in a state where the lead-out wiring and an organic EL device portion are apart from each other to an extent that the deterioration is not generated so that the organic light emitting layer does not become equal to or higher than the temperature at which the deterioration is generated. However, with this method, an interval between a press bonding portion of the lead-out wiring and the organic EL device portion becomes large, so an outline of the organic EL device panel is increased, leading to a hindrance of miniaturization of the frame thereof.
- In view of this, Japanese Patent Application Laid-Open No. H11-204256 proposes a method of manufacturing an organic EL device panel, a frame of which can be made small without causing deterioration due to heat press bonding by subjecting the organic EL device to a cooling process at a time of performing the heat press bonding using an ACF so as not to increase a temperature of the organic EL device.
- The method of manufacturing an organic EL device panel disclosed in Japanese Patent Application Laid-Open No. H11-204256 involves only the cooling process at the time of manufacturing the panel. Therefore, a problem concerning deterioration due to heat at the time of driving after the panel is formed has not yet been solved. In short, the problem of the conventional organic EL device panel at the time of driving the organic EL device panel still remains. Accordingly, a temperature of the contact resistance portion between the lead-out wiring and the power source wiring becomes high due to the locally generated heat. As a result, deterioration such as shortening of a lifetime of pixels of the organic EL device in the vicinity of the high-temperature portion or generation and increase of the non-light emitting portion cannot be avoided. As a countermeasure, the deterioration due to heat generated at the time of driving can be reduced by increasing the number of the lead-out wiring or by thickening the wiring. However, there is a problem in that the increase in number of the lead-out wiring or the thickening of the wiring may hinder the narrowing of the pitch of the lead-out wiring or the miniaturization of the frame of the organic EL device panel.
- The present invention provides an organic EL device panel in which an organic EL device is not adversely affected by heat at a time of manufacturing and driving of the panel, and in which deterioration of pixels of the organic EL device is not generated.
- To solve the above-mentioned problems of the background art, according to an aspect of the present invention, there is provided an organic EL device panel, including: a substrate; a plurality of organic electroluminescence devices each of which is formed on the substrate and includes a first electrode, an organic compound layer, and a second electrode in the stated order from the substrate; a power source wiring including a first power source wiring electrically connected to the first electrode and a second power source wiring electrically connected to the second electrode; a lead-out wiring including a first lead-out wiring electrically connected to the first power source wiring and a second lead-out wiring electrically connected to the second power source wiring; and a heat dissipation member formed on the lead-out wiring.
- The organic EL device panel according to the present invention has a heat dissipation portion formed on the lead-out wiring electrically connected to the first electrode or the second electrode. Therefore, heat generation can be suppressed at the time of driving without providing the plurality of lead-out wirings or thickening the wiring. Further, heat generation can be suppressed even when the lead-out wiring has a narrow pitch connection. In addition, even at the time of manufacturing, an amount of heat to be transferred to the organic EL device can be suppressed. Thus, the organic EL device is not adversely affected by heat, and deterioration such as shortening of the lifetime of image quality of the organic EL device or generation and increase of the non-light emitting portion is not produced.
- Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
-
FIG. 1A is a plan view schematically illustrating an organic EL device panel according to the present invention,FIG. 1B is a sectional view taken along theline 1B-1B ofFIG. 1A , andFIG. 1C is a view for illustrating a contact resistance portion between a lead-out wiring and a power source wiring. -
FIG. 2 is a partially enlarged sectional view illustrating an organic EL device panel according to Example 1 of the present invention. -
FIG. 3A is a plan view schematically illustrating an organic EL device panel according to Example 2 of the present invention, andFIG. 3B is a sectional view taken along theline 3B-3B ofFIG. 3A . - Hereinafter, an organic EL device panel according to an embodiment mode of the present invention will be described with reference to the drawings.
-
FIG. 1A is a plan view schematically illustrating the organic EL device panel.FIG. 1B is a sectional view taken along theline 1B-1B ofFIG. 1A .FIG. 1C is an explanatory view illustrating a contact resistance portion between a lead-out wiring and a power source wiring. The contact resistance portion is an extremely small portion.FIG. 1C schematically illustrates an enlarged view of the contact resistance portion. InFIGS. 1A to 1C , the organic EL device panel includes aglass substrate 1, a lead-outwiring 2, afirst electrode 3, an organiclight emitting layer 4, an ITO film (second electrode) 5, aheat dissipation member 6, an insulatinglayer 7, ametal film 8, a sealing glass (sealing member) 9, a power source wiring 10, and a contact resistance portion R. A first lead-outwiring 2 a of the lead-outwiring 2 is connected to thefirst electrode 3 via the power source wiring 10. A second lead-outwiring 2 b of the lead-outwiring 2 is connected to thesecond electrode 5 via the power source wiring 10. Further, a first power source wiring 10 a of the power source wiring 10 is connected to thefirst electrode 3, and a second power source wiring 10 b of the power source wiring 10 is connected to thesecond electrode 5. The contact resistance portion R between the lead-outwiring 2 and the power source wiring 10 is a part of the lead-outwiring 2, so a portion in contact with the power source wiring 10 is referred to as “contact resistance portion R” in particular. - The organic EL device panel illustrated in
FIGS. 1A to 1C includes as main components, thefirst electrode 3, the organiclight emitting layer 4, and thesecond electrode 5, all of which are formed on theglass substrate 1, and the sealingglass 9 seals the organic EL devices such as the organiclight emitting layer 4. - A current to be supplied to each of the devices is supplied to the
first electrode 3 of each device via the lead-outwiring 2 and the power source wiring 10 from a current supplying portion (not shown). The lead-outwiring 2 and the power source wiring 10 are electrically connected through the contact resistance portion R. Theheat dissipation member 6 is formed on the lead-out wiring 2 (note that a press-bonded portion with the FPC or the like is excluded) electrically connected with the power source wiring 10 via the contact resistance portion R and in the peripheral region thereof (region where no lead-outwiring 2 orfirst electrode 3 is formed on the glass substrate 1). - The
heat dissipation member 6 includes the insulatinglayer 7 formed on the lead-outwiring 2 and themetal film 8 formed on and in the peripheral region of the insulatinglayer 7 in a continuous manner (note that themetal film 8 need not be continuous). Theheat dissipation member 6 is formed on the lead-outwiring 2. However, theheat dissipation member 6 may be formed on the power source wiring 10, which enables further reduction of influence of heat. Theheat dissipation member 6 is formed to extend from within the sealingglass 9 to the outside thereof so that the heat generated at the time of driving is not accumulated in the sealingglass 9. The sealingglass 9 keeps the organic EL device in an airtight space and protects the organic EL device from substances that damage the organic EL device, such as moisture and oxygen. In other words, the state where theheat dissipation member 6 is formed to extend from within the sealingglass 9 to the outside thereof means that theheat dissipation member 6 extends from within the airtight space to the outside thereof. The insulatinglayer 7 may be formed of any material as long as the material is an insulating material, but is preferably formed of a material with good heat conductivity. Themetal film 8 may be formed of any material as long as a metal film can be formed, but is preferably formed of a material with good heat conductivity. Themetal film 8 exhibits higher heat dissipation effect as the thickness increases, which is preferable. Specific examples of the material with good heat conductivity include Ag, Cu, Au, and Al. However, as in the examples described below, when themetal film 8 is formed of the same material as that of the lead-out wiring or the first electrode, that is, Cr, a manufacturing process can be further simplified. Incidentally, bonding of a metal piece (not shown) to a part of themetal film 8 increases a surface area of the heat dissipation member, leading to further enhancement of the heat dissipation effect, which is preferable. The larger the number of the metal pieces, the higher the heat dissipation effect. Alternatively, the surface area of the heat dissipation member is also increased by employing a structure of, for example, a heat sink, in which fine protrusions or a plurality of plate-like members (fins) are aligned with a regularity on a surface of the metal film, leading to an increase in the heat dissipation effect. The metal piece may be bonded within the airtight space. Further, the heat dissipation effect is further increased when the metal piece is bonded within and outside the airtight space. - In the organic EL device panel having the structure as described above, heat generated at the contact resistance portion R between the lead-out
wiring 2 and the power source wiring 10 at the time of driving is dissipated from theheat dissipation member 6. Therefore, even when the lead-outwiring 2 has a narrow pitch connection, heat generation of the lead-outwiring 2 and the contact resistance portion R can be suppressed without increasing the number of or thickening the lead-outwiring 2. In addition, heat transfer to the organic EL device can be suppressed also at the time of manufacturing. Thus, the organic EL device is not adversely affected by heat, so deterioration such as shortening of lifetime of image quality of the organic EL device or generation and increase of the non-light emitting portion is not caused. - The organic EL device panel illustrated in
FIGS. 1A to 1C is manufactured as described below. - First, a TFT circuit is formed on the
glass substrate 1, and a flattening film (not shown) is formed thereafter. Next, a device separation film (not shown) is formed after the lead-outwiring 2 and thefirst electrode 3 are formed by an anode metal material. Then, the organiclight emitting layer 4 is formed on thefirst electrode 3 via the device separation film, and theITO film 5 is formed. It should be noted that in this embodiment mode, the lead-outwiring 2 and thefirst electrode 3 are formed through a single step. However, the two members may be formed in different steps. - The insulating
layer 7 is formed on the lead-outwiring 2. Next, themetal film 8 is formed on and in the peripheral region of the insulatinglayer 7 in a continuous manner. After that, the sealingglass 9 and theglass substrate 1 are sealed by curing an adhesive. Finally, mounting of the FPC and sealing and curing of a resin are performed to complete the organic EL device panel. - In the embodiment mode described above, the
heat dissipation member 6 is formed on the lead-outwiring 2 electrically connected with thefirst electrode 3. However, theheat dissipation member 6 may be formed on the lead-out wiring (not shown) electrically connected with thesecond electrode 5. In addition, thefirst electrode 3 is used as an anode electrode and thesecond electrode 5 is used as a cathode electrode in this embodiment mode. However, this embodiment mode can be carried out with thefirst electrode 3 being the cathode electrode and thesecond electrode 5 being the anode electrode. Further, the organic EL device panel according to this embodiment mode is a top emission type panel. However, the organic EL device panel may be a bottom emission type panel. - In the embodiment mode described above, the insulating
layer 7 is formed on the lead-outwiring 2 and themetal film 8 is formed on the insulatinglayer 7. This is because a short circuit is caused between the first lead-outwiring 2 a and the second lead-outwiring 2 b when themetal film 8 is directly formed on the lead-outwiring 2. However, when themetal film 8 is selectively arranged such that a short circuit is not caused between the first lead-outwiring 2 a and the second lead-outwiring 2 b, themetal film 8 can be arranged directly on the lead-outwiring 2. Further, only the insulatinglayer 7 may be formed on the lead-outwiring 2. In short, it is only necessary that theheat dissipation member 6 be formed on the lead-outwiring 2. - An organic EL device panel according to an example of the present invention will be described in accordance with manufacturing steps. It should be noted that the organic EL device panel according to the present invention is not limited to that in the following embodiment and may be variously modified without departing from the gist of the present invention.
- The organic EL device panel illustrated in
FIG. 2 is an active drive type organic EL device panel.FIG. 2 is a partially enlarged sectional view of the organic EL device panel. InFIG. 2 , the organic EL device panel includes aglass substrate 11 on which aTFT circuit 20 is formed, a lead-out wiring 12, afirst electrode 13, an organiclight emitting layer 14, an ITO film (second electrode) 15, aheat dissipation member 16, an insulatinglayer 17, ametal film 18, and a sealingglass 19. A configuration of a contact resistance portion between the lead-out wiring 12 and the power source wiring is similar to that illustrated inFIG. 1C . - (Formation of Lead-
Out Wiring 12 and First Electrode 13) - A Cr film having a thickness of 100 nm was formed on the
glass substrate 11 on which theTFT circuit 20 was formed, by DC sputtering of a Cr target. After that, the lead-out wiring 12 was formed on an outer circumferential portion of theglass substrate 11 and thefirst electrode 13 was formed at a position corresponding to each pixel, by a photo-etching method. The power source wiring is omitted inFIG. 2 . The power source wiring and the lead-out wiring 12 had a laminate structure, each of the layers being formed of a Cr film. - (Formation of Insulating Layer 17)
- After a positive resist type photosensitive organic resin material was applied with a film thickness of 1 μm by a spin coating method and a pre-bake was performed thereafter, a portion corresponding to a light emitting portion on the Cr electrode and the outer circumferential portion of a display region were exposed to light by using a photo-mask. After that, the exposed portions were removed with a developer and the resin was cured through a post-bake at 230° C., thereby forming the insulating
layer 17. - (Formation of Organic Light Emitting Layer 14)
- The
glass substrate 11 on which the layers up to the insulatinglayer 17 had been formed was transferred from a pre-process room to a film formation room. After air in the film formation room was exhausted down to 1×10−4 Pa, the organiclight emitting layer 14 having the film thickness of 15 nm was formed by a resistance heating deposition method using Alq3, which was an alkylate complex, under the condition of a film forming rate of 0.2 to 0.3 nm/sec. - (Formation of ITO Film 15 (Cathode Electrode))
- The
glass substrate 11 on which layers up to the organiclight emitting layer 14 had been formed was transferred to another film formation room. TheITO film 15 which was the second electrode was formed on the organiclight emitting layer 14 by covering a Cr pixel electrode through mask formation so that theITO film 15 had a film thickness of 130 nm, by a DC magnetron sputtering method using an ITO target. - Through the above-mentioned steps, the organic EL device having the lead-
out wiring 12, thefirst electrode 13, the insulatinglayer 17, the organiclight emitting layer 14, and theITO film 15 formed on theglass substrate 11 was formed. - (Formation of Metal Film 18)
- The
glass substrate 11 on which the organic EL devices had been formed was transferred to another film formation room. The Cr film which was themetal film 18 was formed in a continuous manner by the DC sputtering of the Cr target and by the mask formation to cover the insulatinglayer 17 and a peripheral region thereof on theglass substrate 11. As a result, themetal film 18 and the insulatinglayer 17 formed theheat dissipation member 16. - (Sealing Step)
- The
glass substrate 11 on which layers up to themetal film 18 had been formed was sealed with the sealingglass 19. A bottom portion of the circumference of the sealingglass 19 was applied with an ultraviolet-curable adhesive (not shown) to be cured by irradiation of light for 60 seconds. - The organic EL device panel according to the present invention was formed by the above-mentioned steps.
- (Mounting Step)
- Mounting of the FPC which was necessary for connecting the organic EL device panel with a driving circuit for driving the organic EL device panel was carried out.
- First, an ACF (not shown) was temporarily press-bonded to the lead-
out wiring 12 of the organic EL device panel. Subsequently, an alignment mark of the lead-out wiring 12 and an alignment mark of the FPC (not shown) were aligned. After that, the lead-out wiring 12 and the FPC were placed below a heater head (temperature: 230° C.) to thereby perform bonding of the FPC by carrying out heat press bonding under a pressure of 3 MPa for 12 seconds via a Teflon (registered trademark) tape having a thickness of 50 μm. - (Resin Sealing Step)
- Sealing of the organic EL device panel with a resin, which was bonded with the FPC was carried out. A portion at which the lead-
out wiring 12 of the organic EL device panel and the FPC were press-bonded was applied with an acrylic ultraviolet-curable resin (not shown), and light was irradiated for 15 seconds to cure the sealing resin. - Through the above-mentioned steps, the manufactured organic EL device panel was connected to the driving circuit substrate, and the organic EL device panel was driven for a long time by causing a current of 150 mA to flow through a single lead-
out wiring 12. Even when the organic EL device panel was driven for a long time, heat generation of the contact resistance portion between the lead-out wiring 12 and the power source wiring due to the current was suppressed. In addition, heat transfer to the organic EL device in the mounting step (at the time of manufacturing) was also suppressed at a low level. Accordingly, the organic EL device was hardly affected by heat, so deterioration such as the shortening of lifetime of image quality of the organic EL device or the generation and increase of the non-light emitting portion was not produced. Further, the frame of the organic EL device panel could be made narrow. - Another example of the organic EL device panel according to the present invention will be described in accordance with the manufacturing steps. The organic EL device panel illustrated in
FIGS. 3A and 3B is a passive drive type organic EL device panel.FIG. 3A is a plan view schematically illustrating the organic EL device panel.FIG. 3B is a partial sectional view taken along theline 3B-3B ofFIG. 3A . InFIGS. 3A and 3B , the organic EL device panel includes agrass substrate 21, a lead-out wiring 22, afirst electrode 23, an organiclight emitting layer 24, an ITO film (second electrode) 25, aheat dissipation member 26, an insulatinglayer 27, ametal film 28, a sealingglass 29, and ametal piece 30. It should be noted that the manufacturing steps of the organic EL device panel according to this example is similar to those of Example 1 except that a shape and film thickness of a mask are slightly different through steps of formation of the lead-out wiring 22 to formation of theITO film 25. Therefore, description thereof will be omitted. - (Formation of Metal Film 28)
- The
glass substrate 21 on which the organic EL devices had been formed was transferred from the ITO film formation room to another film formation room. The Cr film which was themetal film 28 was formed in a continuous manner by the DC sputtering of the Cr target and the mask formation so as to cover the insulatinglayer 27 on theglass substrate 21 and the four corners of theglass substrate 21 on which the lead-out wiring 22 or thefirst electrode 23 was not formed. As a result, themetal film 28 and the insulatinglayer 27 formed theheat dissipation member 26. At this time, unlike the first embodiment, themetal film 28 was formed on all four corners (outer circumferential portion) of theglass substrate 21. - (Sealing Step)
- The
glass substrate 21 on which layers up to themetal film 28 had been formed was sealed with the sealingglass 29. A bottom portion of the circumference of the sealingglass 29 was applied with an ultraviolet-curable adhesive (not shown) to be cured by irradiation of light for 60 seconds, thereby forming the organic EL device panel. - (Bonding Step of Metal Piece 30)
- The
metal films 28 at the four corners, which were extended to the outside of the sealingglass 29, were respectively bonded with themetal pieces 30 by soldering. - (Mounting Step)
- Mounting of the FPC which was necessary for connecting the organic EL device panel with the driving circuit for driving the organic EL device panel was carried out.
- First, an ACF (not shown) was temporarily press-bonded to the lead-
out wiring 22 of the organic EL device panel. Subsequently, an alignment mark of the lead-out wiring 22 and an alignment mark of the FPC (not shown) were aligned. After that, the lead-out wiring 22 and the FPC were placed below a heater head (temperature: 230° C.) to thereby perform bonding of the FPC by carrying out heat press bonding under a pressure of 3 MPa for 12 seconds via a Teflon (registered trademark) tape having a thickness of 50 μm. The FPC bonding with respect to the organic EL device panel was completed when the above-mentioned step was carried out on all four corners of the organic EL device panel. - (Resin Sealing Step)
- Sealing of the organic EL device panel with a resin, which was bonded with the FPC was carried out. Portions at which the lead-
out wiring 22 of the organic EL device panel and the FPC were press-bonded, that is, outer circumferential portion of the organic EL device panel, were applied with an acrylic ultraviolet-curable resin, and light was irradiated for 15 seconds each to cure the sealing resin. - The organic EL device panel had been manufactured through the above-mentioned steps was connected to the driving circuit substrate, thereby driving the organic EL device panel for a long time. However, heat generation of the contact resistance portion between the lead-
out wiring 22 and the power source wiring due to the current was suppressed. In addition, heat transfer to the organic EL device in the mounting step was also suppressed at a low level. Accordingly, even when the lead-out wiring 22 was connected with a narrow pitch, the organic EL device was not adversely affected by heat, so deterioration such as the shortening of lifetime of image quality of the organic EL device or the generation and increase of the non-light emitting portion was not produced. Further, the frame of the organic EL device panel could be made narrow. - Further, because the
metal pieces 30 were respectively bonded to portions of themetal films 28, heat was dissipated from each of themetal pieces 30 at the time of both the driving and manufacturing of the organic EL device panel. Therefore, deterioration due to heat transfer to the organic EL device could be further suppressed. - While the present invention has been described with reference to examples, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
- This application claims the benefit of Japanese Patent Application No. 2006-054370, filed Mar. 1, 2006, and Japanese Patent Application No. 2007-026706, filed Feb. 6, 2007, which are hereby incorporated by reference herein in their entirety.
Claims (5)
1. An organic electroluminescence device panel, comprising:
a substrate;
a plurality of organic electroluminescence devices each of which is formed on the substrate and includes a first electrode, an organic compound layer, and a second electrode in the stated order from the substrate;
a power source wiring including a first power source wiring electrically connected to the first electrode and a second power source wiring electrically connected to the second electrode;
a lead-out wiring including a first lead-out wiring electrically connected to the first power source wiring and a second lead-out wiring electrically connected to the second power source wiring; and
a heat dissipation member formed on the second lead-out wiring.
2. (canceled)
3. The organic electroluminescence device panel according to claim 1 , wherein the heat dissipation member comprises an insulating layer formed on the second lead-out wiring and a metal film formed on the insulating layer.
4. The organic electroluminescence device panel according to claim 3 , wherein the metal film is formed to extend to a peripheral region of the second lead-out wiring in a continuous manner.
5. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/565,985 US20100007259A1 (en) | 2006-03-01 | 2009-09-24 | Organic electroluminescence device panel |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006054370 | 2006-03-01 | ||
JP2006/054370 | 2006-03-01 | ||
JP2007026706A JP4886540B2 (en) | 2006-03-01 | 2007-02-06 | Organic EL element panel |
JP2007/026706 | 2007-02-06 | ||
US11/675,382 US7615924B2 (en) | 2006-03-01 | 2007-02-15 | Organic electroluminescence device panel |
US12/565,985 US20100007259A1 (en) | 2006-03-01 | 2009-09-24 | Organic electroluminescence device panel |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/675,382 Division US7615924B2 (en) | 2006-03-01 | 2007-02-15 | Organic electroluminescence device panel |
Publications (1)
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US20100007259A1 true US20100007259A1 (en) | 2010-01-14 |
Family
ID=38517086
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US11/675,382 Expired - Fee Related US7615924B2 (en) | 2006-03-01 | 2007-02-15 | Organic electroluminescence device panel |
US12/565,985 Abandoned US20100007259A1 (en) | 2006-03-01 | 2009-09-24 | Organic electroluminescence device panel |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US11/675,382 Expired - Fee Related US7615924B2 (en) | 2006-03-01 | 2007-02-15 | Organic electroluminescence device panel |
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US (2) | US7615924B2 (en) |
JP (1) | JP4886540B2 (en) |
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US20070188082A1 (en) * | 2003-03-25 | 2007-08-16 | Yoshifumi Kato | Organic el device and liquid crystal display |
US20050023965A1 (en) * | 2003-07-29 | 2005-02-03 | Shoichi Maeda | Organic electroluminescence device |
US20050184662A1 (en) * | 2004-02-24 | 2005-08-25 | Eastman Kodak Company | OLED display haivng thermally conductive backplate |
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US20070063648A1 (en) * | 2005-09-22 | 2007-03-22 | Tohoku Pioneer Corporation | Self-emission unit and method of manufacturing the same |
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US8698131B2 (en) | 2009-03-26 | 2014-04-15 | Seiko Epson Corporation | Organic EL apparatus, method of manufacturing organic EL apparatus, electronic apparatus |
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US20180244190A1 (en) * | 2017-02-27 | 2018-08-30 | Panasonic Intellectual Property Management Co., Lt d. | Light source module, illumination device and moving body |
US10618454B2 (en) * | 2017-02-27 | 2020-04-14 | Panasonic Intellectual Property Management Co., Ltd. | Light source module, illumination device and moving body |
Also Published As
Publication number | Publication date |
---|---|
US20070216298A1 (en) | 2007-09-20 |
US7615924B2 (en) | 2009-11-10 |
JP4886540B2 (en) | 2012-02-29 |
JP2007265968A (en) | 2007-10-11 |
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