US20090101316A1 - Heat dissipating assembly with reduced thermal gradient - Google Patents
Heat dissipating assembly with reduced thermal gradient Download PDFInfo
- Publication number
- US20090101316A1 US20090101316A1 US11/874,655 US87465507A US2009101316A1 US 20090101316 A1 US20090101316 A1 US 20090101316A1 US 87465507 A US87465507 A US 87465507A US 2009101316 A1 US2009101316 A1 US 2009101316A1
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- US
- United States
- Prior art keywords
- recited
- base plate
- fins
- cooling fluid
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to devices for cooling electrical components and, more particularly, to liquid cooled waterblocks for dissipating heat energy.
- graphics cards In order to enable desktop and other computers to rapidly process graphics and game technology, add-on units generally referred to as “graphics cards” or “VGA” cards” are often installed in computer devices. Such cards include a separate processor, called a GPU, one or more memory chips, and other required circuitry, all mounted to a circuit board including an edge connector that is adapted to plug into an available slot in the associated computer device. Typically, GPU and/or memory chips generates substantial heat that if not dissipated will adversely affect operation of the graphics card.
- FIG. 1 shows a conventional liquid cooled waterblock 100 for dissipating heat energy generated by an active component.
- the waterblock 100 includes a top cover 102 and a body 104 sealingly secured to the top cover by a plurality of fasteners (not shown in FIG. 1 ) passing through the holes 106 .
- the body 104 includes a channel 110 that forms a passageway for cooling liquid with the bottom surface of the top cover 102 .
- the waterblock 100 may be disposed on and in contact with a heat generating component so that the heat energy generated by the component is conducted to the radiator 108 included in the body 104 .
- the cooling fluid flows into the channel 110 via an inlet pipe 112 , dissipate heat energy from the radiator 108 and body 104 , and exits the waterblock via the outlet pipe 114 .
- a thermal gradient may be established in the radiator 108 along the flow direction, which may induce a similar thermal gradient in the heat generating component disposed under the radiator 108 .
- the thermal gradient in the heat generating component may reduce the operational performance thereof and possibly shorten the life expectancy due to the heat damage on the lee side thereof.
- the cooling liquid may be pre-warmed before reaching the radiator 108 , reducing the efficiency in cooling the radiator 108 .
- a device for cooling a component includes: a base plate; a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby; a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space, the inlet pipe having a flow exit positioned over the fins; and an outlet pipe for exhausting the cooling fluid from the space.
- FIG. 1 shows an exploded perspective view of a conventional liquid cooled waterblock
- FIG. 2 shows a schematic perspective view of a liquid cooled waterblock in accordance with one embodiment of the present invention
- FIG. 3 shows a schematic cross sectional view of the waterblock in FIG. 2 , taken along the line III-III;
- FIG. 4 shows a schematic cross sectional view of the waterblock in FIG. 2 , taken along the line IV-IV;
- FIG. 5 shows a schematic cross sectional view of a waterblock in accordance with another embodiment of the present invention.
- FIG. 2 of the drawing a waterblock in accordance with one embodiment of the present invention is illustrated at 200 and includes a base plate 204 and an upper cover or housing 202 sealingly secured to the base.
- FIGS. 3 and 4 show schematic cross sectional diagrams of the waterblock 200 in FIG. 2 , taken along the lines III-III and IV-IV, respectively.
- Cooling fluid enters into the waterblock 200 through the inlet pipe 206 and exits through the outlet pipe 208 .
- the cooling fluid is preferably water or any other suitable liquid or gas for dissipating heat from the waterblock.
- a pump for circulating the cooling fluid through the inlet/outlet pipes and a cooling system for extracting heat energy from the cooling fluid are not shown in FIG. 2 .
- any suitable conventional pump and cooling system may be used with the waterblock 200 .
- the base plate 204 may be formed of heat conducting material, such as aluminum, copper, nickel, or any other suitable metal.
- the base plate 204 can be mounted on a heat generating component 214 to extract heat energy therefrom.
- the housing 202 may be formed of plastic that can stand the temperature of the cooling fluid.
- the housing 202 may be injection molded polyoxymethylene (POM) plastic.
- the inlet pipe 206 and outlet pipe 208 can be connected to a pump (not shown in FIG. 2 ) by use of a conventional fitting, such as “F” fitting.
- the waterblock 200 includes an upper chamber 212 and a lower chamber 213 separated by a middle plate 216 having one or more openings 218 for fluid communication between the upper and lower chambers.
- the middle plate 216 may be formed of metal or plastic that can stand the temperature of the cooling fluid.
- the middle plate 216 and housing 202 can be formed as an integral body.
- each fin having a dome-shaped top portion and a cylinder-shaped bottom portion.
- the cylinder-shaped bottom portion may have various cross sectional shapes, such as hexagon, rectangle, circle, oval, or the like.
- the fins 210 operate as radiator, i.e., the heat generated by the heat generating component 214 is conducted to the fins 210 via the base plate 204 .
- the fins 210 may be formed of heat conducting material, such copper, aluminum, nickel, or the like, and arranged in a two-dimensional array format, for instance. The number, size, and arrangement of the fins 210 may be determined by various design parameters, such as flow rate, pressure drop, and heat conduction rate.
- the inlet pipe 206 extends through the upper chamber 212 to the lower chamber 213 , thereby introducing cooling fluid directly into the lower chamber 213 .
- the inlet pipe 206 has a flow exit positioned over the fins 210 so that the cooling fluid exiting the inlet pipe 206 flows from the top portions of the fins 210 toward the base plate 204 , dissipating heat energy from the fins 210 and base plate 204 .
- the heated cooling fluid exits the lower chamber 213 to the upper chamber 212 through the openings 218 and thence exits the upper chamber through the outlet pipe 208 .
- cooling fluid flows generally in radial directions when seen from the top.
- the thermal gradient may be developed along the distance, D, between the inlet pipe wall and edges of the base plate 204 .
- the thermal gradient in the base plate 204 would be much smaller than that of the radiator 108 since the distance D is much smaller than the length of the radiator 108 .
- the cooling fluid contacts the fins 210 as soon as it exits the inlet pipe 206 . As such, the cooling fluid is not pre-warmed before reaching the fins 210 , providing an improved cooling efficiency compared to the conventional waterblock 100 .
- the fins 210 may be secured to the base plate 204 by fasteners, such as bolts, or by suitable adhesive, such as thermal epoxy.
- the fins 210 and base plate 204 may be formed as an integral body.
- the base plate 204 may be secured to the heat generating component 214 by suitable thermal epoxy.
- the form factors of the waterblock 200 may be determined by various parameters, such as the dimension of the heat generating component 214 . It should be apparent to those of ordinary skill that the base plate 204 may have a suitable shape, such as circle, and the housing 202 may also have a suitable shape, such as circular cylinder.
- FIG. 5 shows a schematic cross sectional view of a waterblock 300 in accordance with another embodiment of the present invention.
- the waterblock 300 may be similar to the waterblock 200 , with the difference that the inlet pipe 302 has a nozzle-shaped tip.
- the nozzle-shaped tip may enhance flow uniformity over the top portions of the fins 306 , thereby reducing the thermal gradient in the base plate 304 .
Abstract
A device to dissipate thermal energy generated by a heat generating component. The device includes a base plate and a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby. The device also includes a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space and an outlet pipe for exhausting the cooling fluid from the space. The inlet pipe has a flow exit positioned over the fins so that the cooling fluid flows from the top portions of the fins toward the base plate.
Description
- The present invention generally relates to devices for cooling electrical components and, more particularly, to liquid cooled waterblocks for dissipating heat energy.
- With the advance of main unit's operation speed, the thermal energy generated by active components of a computer, such as processor and memory chip, often becomes significant. For instance, in order to enable desktop and other computers to rapidly process graphics and game technology, add-on units generally referred to as “graphics cards” or “VGA” cards” are often installed in computer devices. Such cards include a separate processor, called a GPU, one or more memory chips, and other required circuitry, all mounted to a circuit board including an edge connector that is adapted to plug into an available slot in the associated computer device. Typically, GPU and/or memory chips generates substantial heat that if not dissipated will adversely affect operation of the graphics card.
- Heretofore, various approaches have been tried to dissipate or otherwise remove heat from the thermal energy generating components.
FIG. 1 shows a conventional liquid cooledwaterblock 100 for dissipating heat energy generated by an active component. As depicted, thewaterblock 100 includes atop cover 102 and abody 104 sealingly secured to the top cover by a plurality of fasteners (not shown inFIG. 1 ) passing through theholes 106. Thebody 104 includes achannel 110 that forms a passageway for cooling liquid with the bottom surface of thetop cover 102. Thewaterblock 100 may be disposed on and in contact with a heat generating component so that the heat energy generated by the component is conducted to theradiator 108 included in thebody 104. The cooling fluid flows into thechannel 110 via aninlet pipe 112, dissipate heat energy from theradiator 108 andbody 104, and exits the waterblock via theoutlet pipe 114. - As the cooling liquid flows through the
channel 110 in one direction, a thermal gradient may be established in theradiator 108 along the flow direction, which may induce a similar thermal gradient in the heat generating component disposed under theradiator 108. The thermal gradient in the heat generating component may reduce the operational performance thereof and possibly shorten the life expectancy due to the heat damage on the lee side thereof. Furthermore, as the cooling liquid flows through thechannel 110, the cooling liquid may be pre-warmed before reaching theradiator 108, reducing the efficiency in cooling theradiator 108. Thus, there is a need for an improved heat extraction or dissipation mechanism that can reduce the pre-warming of the cooling liquid and the thermal gradient of the heat generating component thereby to enhance the performance thereof. - In one aspect of the present invention, a device for cooling a component includes: a base plate; a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby; a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space, the inlet pipe having a flow exit positioned over the fins; and an outlet pipe for exhausting the cooling fluid from the space.
-
FIG. 1 shows an exploded perspective view of a conventional liquid cooled waterblock; -
FIG. 2 shows a schematic perspective view of a liquid cooled waterblock in accordance with one embodiment of the present invention; -
FIG. 3 shows a schematic cross sectional view of the waterblock inFIG. 2 , taken along the line III-III; -
FIG. 4 shows a schematic cross sectional view of the waterblock inFIG. 2 , taken along the line IV-IV; and -
FIG. 5 shows a schematic cross sectional view of a waterblock in accordance with another embodiment of the present invention. - The following detailed description is of the best currently contemplated modes of carrying out the invention. The description is not to be taken in a limiting sense, but is made merely for the purpose of illustrating the general principles of the invention, since the scope of the invention is best defined by the appended claims.
- Referring to
FIG. 2 of the drawing, a waterblock in accordance with one embodiment of the present invention is illustrated at 200 and includes abase plate 204 and an upper cover orhousing 202 sealingly secured to the base.FIGS. 3 and 4 show schematic cross sectional diagrams of thewaterblock 200 inFIG. 2 , taken along the lines III-III and IV-IV, respectively. Cooling fluid enters into thewaterblock 200 through theinlet pipe 206 and exits through theoutlet pipe 208. The cooling fluid is preferably water or any other suitable liquid or gas for dissipating heat from the waterblock. For brevity, a pump for circulating the cooling fluid through the inlet/outlet pipes and a cooling system for extracting heat energy from the cooling fluid are not shown inFIG. 2 . However, it should be apparent to those of ordinary skill that any suitable conventional pump and cooling system may be used with thewaterblock 200. - The
base plate 204 may be formed of heat conducting material, such as aluminum, copper, nickel, or any other suitable metal. Thebase plate 204 can be mounted on aheat generating component 214 to extract heat energy therefrom. Thehousing 202 may be formed of plastic that can stand the temperature of the cooling fluid. In one exemplary embodiment, thehousing 202 may be injection molded polyoxymethylene (POM) plastic. Theinlet pipe 206 andoutlet pipe 208 can be connected to a pump (not shown inFIG. 2 ) by use of a conventional fitting, such as “F” fitting. - The
waterblock 200 includes anupper chamber 212 and alower chamber 213 separated by amiddle plate 216 having one ormore openings 218 for fluid communication between the upper and lower chambers. Themiddle plate 216 may be formed of metal or plastic that can stand the temperature of the cooling fluid. In one exemplary embodiment, themiddle plate 216 andhousing 202 can be formed as an integral body. - Attached to the upper surface of the
base plate 204 are a plurality offins 210, each fin having a dome-shaped top portion and a cylinder-shaped bottom portion. The cylinder-shaped bottom portion may have various cross sectional shapes, such as hexagon, rectangle, circle, oval, or the like. Thefins 210 operate as radiator, i.e., the heat generated by theheat generating component 214 is conducted to thefins 210 via thebase plate 204. Thefins 210 may be formed of heat conducting material, such copper, aluminum, nickel, or the like, and arranged in a two-dimensional array format, for instance. The number, size, and arrangement of thefins 210 may be determined by various design parameters, such as flow rate, pressure drop, and heat conduction rate. - The
inlet pipe 206 extends through theupper chamber 212 to thelower chamber 213, thereby introducing cooling fluid directly into thelower chamber 213. Theinlet pipe 206 has a flow exit positioned over thefins 210 so that the cooling fluid exiting theinlet pipe 206 flows from the top portions of thefins 210 toward thebase plate 204, dissipating heat energy from thefins 210 andbase plate 204. The heated cooling fluid exits thelower chamber 213 to theupper chamber 212 through theopenings 218 and thence exits the upper chamber through theoutlet pipe 208. - It is noted that cooling fluid flows generally in radial directions when seen from the top. Thus, the thermal gradient may be developed along the distance, D, between the inlet pipe wall and edges of the
base plate 204. For a base plate having the same dimension as theradiator 108, the thermal gradient in thebase plate 204 would be much smaller than that of theradiator 108 since the distance D is much smaller than the length of theradiator 108. - It is also noted that the cooling fluid contacts the
fins 210 as soon as it exits theinlet pipe 206. As such, the cooling fluid is not pre-warmed before reaching thefins 210, providing an improved cooling efficiency compared to theconventional waterblock 100. - In one exemplary embodiment, the
fins 210 may be secured to thebase plate 204 by fasteners, such as bolts, or by suitable adhesive, such as thermal epoxy. In another exemplary embodiment, thefins 210 andbase plate 204 may be formed as an integral body. Thebase plate 204 may be secured to theheat generating component 214 by suitable thermal epoxy. The form factors of thewaterblock 200 may be determined by various parameters, such as the dimension of theheat generating component 214. It should be apparent to those of ordinary skill that thebase plate 204 may have a suitable shape, such as circle, and thehousing 202 may also have a suitable shape, such as circular cylinder. -
FIG. 5 shows a schematic cross sectional view of awaterblock 300 in accordance with another embodiment of the present invention. Thewaterblock 300 may be similar to thewaterblock 200, with the difference that theinlet pipe 302 has a nozzle-shaped tip. The nozzle-shaped tip may enhance flow uniformity over the top portions of thefins 306, thereby reducing the thermal gradient in thebase plate 304. - Notwithstanding that the present invention has been described above in terms of several alternative embodiments, it is anticipated that still other alterations and modifications will become apparent to those of ordinary skilled in the art after having read this disclosure. It is therefore intended that such disclosure be considered illustrative and not limiting, and that the appended claims be interpreted to include all such alterations, modifications and embodiments as fall within the true spirit and scope of the invention.
Claims (12)
1. A device for cooling a component, comprising:
a base plate;
a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby;
a plurality of fins secured to the base plate and disposed in the space;
an inlet pipe for introducing cooling fluid into the space, the inlet pipe having a flow exit positioned over the fins; and
an outlet pipe for exhausting the cooling fluid from the space.
2. A device as recited in claim 1 , further comprising:
a middle plate separating the space into upper and lower chambers and including one or more openings for fluid communication therebetween,
wherein the inlet pipe extends through the upper chamber to the lower chamber and the outlet pipe is operatively coupled to the upper chamber and the fins are disposed in the lower chamber.
3. A device as recited in claim 1 , wherein each said fin includes a dome-shaped top portion and a cylinder-shaped bottom portion.
4. A device as recited in claim 3 , wherein a cross section of the cylinder-shaped bottom portion has a shape selected from the group consisting of circle, oval, hexagon, and rectangle.
5. A device as recited in claim 1 , wherein the flow exit of the inlet pipe has an expanding nozzle shape.
6. A device as recited in claim 1 , wherein the base plate is formed of heat conducting material.
7. A device as recited in claim 6 , wherein the heat conducting material is selected from the group consisting of aluminum, copper, and nickel.
8. A device as recited in claim 1 , wherein the fins are formed of heat conducting material.
9. A device as recited in claim 8 , wherein the heat conducting material is selected from the group consisting of aluminum, copper, and nickel.
10. A device as recited in claim 1 , wherein the housing is formed of plastic.
11. A device as recited in claim 1 , further comprising:
a pump coupled to the inlet and outlet pipes and operative to circulating the cooling fluid through the inlet and outlet pipes.
12. A device as recited in claim 1 , further comprising:
a cooling system coupled to the inlet and outlet pipes and operative to extract heat energy from the cooling fluid.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/874,655 US20090101316A1 (en) | 2007-10-18 | 2007-10-18 | Heat dissipating assembly with reduced thermal gradient |
PCT/US2008/080539 WO2009052515A1 (en) | 2007-10-18 | 2008-10-20 | Heat dissipating assembly with reduced thermal gradient |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/874,655 US20090101316A1 (en) | 2007-10-18 | 2007-10-18 | Heat dissipating assembly with reduced thermal gradient |
Publications (1)
Publication Number | Publication Date |
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US20090101316A1 true US20090101316A1 (en) | 2009-04-23 |
Family
ID=40562273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/874,655 Abandoned US20090101316A1 (en) | 2007-10-18 | 2007-10-18 | Heat dissipating assembly with reduced thermal gradient |
Country Status (2)
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US (1) | US20090101316A1 (en) |
WO (1) | WO2009052515A1 (en) |
Cited By (14)
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---|---|---|---|---|
CN104134639A (en) * | 2013-05-03 | 2014-11-05 | 英飞凌科技股份有限公司 | Cooling system for molded module and corresponding manufacturing method |
US20160260654A1 (en) | 2015-03-03 | 2016-09-08 | Infineon Technologies Ag | Plastic cooler for semiconductor modules |
US20170192471A1 (en) * | 2015-12-30 | 2017-07-06 | Cooler Master Co., Ltd. | Cooling apparatus for electronic components |
US20190208665A1 (en) * | 2018-01-02 | 2019-07-04 | Cooler Master Co., Ltd. | Liquid cooling device combined on graphics card |
US10410955B2 (en) | 2015-01-28 | 2019-09-10 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
US10409341B2 (en) | 2016-02-15 | 2019-09-10 | Cooler Master Co., Ltd. | Cooling apparatus |
US10634336B1 (en) * | 2019-04-25 | 2020-04-28 | Evga Corporation | Replaceable water-cooled radiating device |
US10739084B2 (en) | 2015-01-28 | 2020-08-11 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
US10975876B2 (en) | 2019-04-19 | 2021-04-13 | Cooler Master Co., Ltd. | Cooling device |
DE102019219428A1 (en) * | 2019-12-12 | 2021-06-17 | Zf Friedrichshafen Ag | Cooling system |
DE102020107220A1 (en) | 2020-03-17 | 2021-09-23 | Seg Automotive Germany Gmbh | Device for cooling electronic components |
US11150034B2 (en) * | 2019-07-04 | 2021-10-19 | Dongguan Bingdian Intelligent Science & Technology Co., Ltd. | Water-cooling radiator |
US11460036B2 (en) | 2019-10-07 | 2022-10-04 | Cooler Master Co., Ltd. | Light emitting fan device and non-light emitting fan device |
US11460035B2 (en) | 2019-10-07 | 2022-10-04 | Cooler Master Co., Ltd. | Light emitting fan device and non-light emitting fan device |
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CN104134639A (en) * | 2013-05-03 | 2014-11-05 | 英飞凌科技股份有限公司 | Cooling system for molded module and corresponding manufacturing method |
US9449895B2 (en) * | 2013-05-03 | 2016-09-20 | Infineon Technologies Ag | Cooling system for molded modules and corresponding manufacturing methods |
US10739084B2 (en) | 2015-01-28 | 2020-08-11 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
US10410955B2 (en) | 2015-01-28 | 2019-09-10 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
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US9934990B2 (en) | 2015-03-03 | 2018-04-03 | Infineon Technologies Ag | Method of manufacturing a cooler for semiconductor modules |
US11061450B2 (en) | 2015-12-30 | 2021-07-13 | Cooler Master Development Corporation | Cooling apparatus for electronic components |
US20170192471A1 (en) * | 2015-12-30 | 2017-07-06 | Cooler Master Co., Ltd. | Cooling apparatus for electronic components |
US10509446B2 (en) * | 2015-12-30 | 2019-12-17 | Cooler Master Co., Ltd. | Cooling apparatus for electronic components |
US11474574B2 (en) | 2016-02-15 | 2022-10-18 | Cooler Master Development Corporation | Cooling apparatus |
US10409341B2 (en) | 2016-02-15 | 2019-09-10 | Cooler Master Co., Ltd. | Cooling apparatus |
US11334126B2 (en) | 2016-02-15 | 2022-05-17 | Cooler Master Development Corporation | Cooling apparatus |
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US10893631B2 (en) * | 2018-01-02 | 2021-01-12 | Cooler Master Co., Ltd. | Liquid cooling device combined on graphics card |
US20190208665A1 (en) * | 2018-01-02 | 2019-07-04 | Cooler Master Co., Ltd. | Liquid cooling device combined on graphics card |
US10975876B2 (en) | 2019-04-19 | 2021-04-13 | Cooler Master Co., Ltd. | Cooling device |
US10634336B1 (en) * | 2019-04-25 | 2020-04-28 | Evga Corporation | Replaceable water-cooled radiating device |
US11150034B2 (en) * | 2019-07-04 | 2021-10-19 | Dongguan Bingdian Intelligent Science & Technology Co., Ltd. | Water-cooling radiator |
US11460036B2 (en) | 2019-10-07 | 2022-10-04 | Cooler Master Co., Ltd. | Light emitting fan device and non-light emitting fan device |
US11460035B2 (en) | 2019-10-07 | 2022-10-04 | Cooler Master Co., Ltd. | Light emitting fan device and non-light emitting fan device |
DE102019219428A1 (en) * | 2019-12-12 | 2021-06-17 | Zf Friedrichshafen Ag | Cooling system |
DE102020107220A1 (en) | 2020-03-17 | 2021-09-23 | Seg Automotive Germany Gmbh | Device for cooling electronic components |
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