US20090025784A1 - Thermal spray for solar concentrator fabrication - Google Patents

Thermal spray for solar concentrator fabrication Download PDF

Info

Publication number
US20090025784A1
US20090025784A1 US11/782,605 US78260507A US2009025784A1 US 20090025784 A1 US20090025784 A1 US 20090025784A1 US 78260507 A US78260507 A US 78260507A US 2009025784 A1 US2009025784 A1 US 2009025784A1
Authority
US
United States
Prior art keywords
optical element
solar cell
spraying
onto
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/782,605
Inventor
Hing Wah Chan
John S. Fitch
Michael C. Weisberg
David G. Duff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
Solfocus Inc
Sol Focus Inc
Original Assignee
Palo Alto Research Center Inc
Sol Focus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US11/782,605 priority Critical patent/US20090025784A1/en
Application filed by Palo Alto Research Center Inc, Sol Focus Inc filed Critical Palo Alto Research Center Inc
Assigned to PALO ALTO RESEARCH CENTER INCORPORATED reassignment PALO ALTO RESEARCH CENTER INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DUFF, DAVID G., FITCH, JOHN S., WEISBERG, MICHAEL C.
Assigned to SOLFOCUS, INC. reassignment SOLFOCUS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, HING WAH
Priority to PCT/US2008/050791 priority patent/WO2008097688A1/en
Priority to EP08727546A priority patent/EP2115787A1/en
Priority to AU2008214229A priority patent/AU2008214229A1/en
Priority to JP2009548352A priority patent/JP2010518255A/en
Publication of US20090025784A1 publication Critical patent/US20090025784A1/en
Assigned to NEW ENTERPRISE ASSOCIATES 12 LIMITED PARTNERSHIP, AS COLLATERAL AGENT reassignment NEW ENTERPRISE ASSOCIATES 12 LIMITED PARTNERSHIP, AS COLLATERAL AGENT SECURITY AGREEMENT Assignors: SOLFOCUS, INC.
Priority to US12/841,823 priority patent/US20100294364A1/en
Assigned to SOLFOCUS, INC. reassignment SOLFOCUS, INC. RELEASE OF SECURITY INTEREST AT REEL/FRAME 023973/0826 Assignors: NEW ENTERPRISE ASSOCIATES 12 LIMITED PARTNERSHIP
Assigned to CPV SOLAR LLC C/O HARPER CONSTRUCTION COMPANY, INC. reassignment CPV SOLAR LLC C/O HARPER CONSTRUCTION COMPANY, INC. SECURITY AGREEMENT Assignors: SOLFOCUS, INC.
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Definitions

  • Some embodiments generally relate to the collection and concentration of solar radiation. More specifically, embodiments may relate to systems to efficiently fabricate solar radiation collectors.
  • a concentrating solar radiation collector may convert received solar radiation (i.e., sunlight) into a concentrated beam and direct the concentrated beam onto a small photovoltaic cell.
  • the cell in turn, converts the photons of the received beam into electrical current.
  • a concentrating solar collector may include reflective material for directing received solar radiation, conductive material to carry electrical current generated from the solar radiation, and/or insulative material to isolate various conductors from one another. Fabrication of a solar radiation collector using one or more of these materials may be unsuitably complex and costly.
  • conventional techniques for depositing these materials may include evaporating or sputtering within an established vacuum.
  • Thin film lithographic techniques are employed to create desired patterns and features in the deposited materials. Such techniques require photoresist deposition, masking, UV exposure, and subsequent etching for each layer of material.
  • Thin film lithography may provide geometrically accuracy but entails significant expense.
  • some aspects provide a method, means and/or process steps to thermal spray a first material onto an optical element, and to couple a solar cell to the optical element.
  • Thermal spraying the first material may include spraying a molten metal powder onto the optical element.
  • spraying the molten metal powder onto the optical element may include placing a stencil on the optical element and spraying a molten metal powder onto the stencil and the optical element.
  • thermal spraying the first material includes powder coating a polymer onto the optical element.
  • a reflective material is deposited on a substantially-transparent core, an insulator is deposited on the reflective material, and thermal spraying the first material includes spraying a molten metal powder onto the insulator.
  • an optical element a thermal-sprayed material disposed on the optical element, and a solar cell coupled to the optical element.
  • the thermal-sprayed material may comprise a hardened metal powder.
  • the optical element may comprise an aperture from which light may pass out of the optical element, an electrical contact of the solar cell is coupled to the hardened metal powder, and an optically-active area of the solar cell is aligned with the aperture.
  • the thermal-sprayed material may comprise a polymer.
  • the optical element may comprise a substantially-transparent core, a reflective material disposed on the substantially-transparent core, and an insulator disposed on the reflective material, wherein the thermal-sprayed material is disposed on the insulator.
  • the insulator may include a powder-coated polymer.
  • FIG. 1 is a flow diagram of a method according to some embodiments.
  • FIG. 2A is a perspective view of a portion of an optical element and conductive material according to some embodiments.
  • FIG. 2B is a cross-sectional view of a portion of an optical element and conductive material according to some embodiments.
  • FIG. 3A is a perspective view of a portion of an optical element and a solar cell coupled thereto according to some embodiments.
  • FIG. 3B is a perspective view of a portion of an optical element and a solar cell coupled thereto according to some embodiments.
  • FIG. 4 is a flow diagram of a method according to some embodiments.
  • FIG. 5A is a perspective view of a transparent optical element according to some embodiments.
  • FIG. 5B is a cross-sectional view of a transparent optical element according to some embodiments.
  • FIG. 6A is a perspective view of a transparent optical element with reflective material disposed thereon according to some embodiments.
  • FIG. 6B is a cross-sectional view of a transparent optical element with reflective material disposed thereon according to some embodiments.
  • FIG. 7A is a perspective view of an optical element with an electrical isolator disposed thereon according to some embodiments.
  • FIG. 7B is a cross-sectional view of an optical element with an electrical isolator disposed thereon according to some embodiments.
  • FIG. 8A is a perspective view of an optical element with conductive material disposed thereon according to some embodiments.
  • FIG. 8B is a cross-sectional view of an optical element with conductive material disposed thereon according to some embodiments.
  • FIG. 9 is a cross-sectional view of an optical element and a solar cell according to some embodiments.
  • FIG. 1 is a flow diagram of process 100 according to some embodiments. Process 100 may be performed by any combination of machine, hardware, software and manual means.
  • a first material is thermal sprayed onto an optical element.
  • the first material may comprise any material that is capable of being thermally-sprayed.
  • Thermal spraying the first material may include heating a powder to a molten state and spraying the molten powder onto the optical element. The molten powder then cools on the optical element to produce a solid layer of material.
  • a stencil may be applied to the optical element before spraying the molten powder onto the optical element. The first material is therefore deposited in a pattern defined by the stencil.
  • the thermal spraying may be performed using a known twin wire arc process in a case that the first material is a metal.
  • Plasma spray techniques may be employed at S 110 if the first material is a metal or a ceramic.
  • the first material may be powder coated onto the optical element at S 110 .
  • the term thermal spraying encompasses at least twin wire arcing, plasma spraying (e.g., hot, cold, assisted), and powder coating.
  • Thermal spraying the first material onto the optical element may comprise spraying the first material onto other material(s) already deposited on the optical element.
  • the optical element may be configured to manipulate and/or pass desired wavelengths of light.
  • the optical element may comprise any number of disparate materials and/or elements (e.g., lenses, reflective surfaces and optically-transparent portions).
  • FIG. 2A is a perspective view of apparatus 200 according to some embodiments
  • FIG. 2B is a cross-sectional view of apparatus 200 as shown in FIG. 2A
  • Apparatus 200 includes optical element 220 and conductive material 210 sprayed thereon according to some embodiments of S 110 .
  • FIGS. 2A and 2B show only a portion of apparatus 200 in order to illustrate that apparatus 200 may exhibit any suitable shape or size.
  • Conductive material 210 may comprise any combination of one or more currently- or hereafter-known conductors, including but not limited to copper, gold and nickel. A thickness of material 210 on optical element 220 might not be as uniform as shown in FIG. 2B .
  • a solar cell is coupled to the optical element at S 120 .
  • the coupling at S 120 may comprise coupling the solar cell to other material(s) already deposited on the optical element.
  • an electrical contact of the solar cell may be coupled to conductive material deposited on the optical element.
  • Such a coupling may form an electrical and a mechanical interconnection between the conductive material and the solar cell.
  • Various flip-chip bonding techniques may be employed in some embodiments to couple an electrical contact of the solar cell to conductive material deposited on the optical element.
  • FIG. 3A is a perspective view of apparatus 200 after S 120 according to some embodiments.
  • FIG. 3B is a cross-sectional view corresponding to FIG. 3A .
  • Solder bumps 305 of solar cell 300 are coupled to conductive material 210 .
  • Solder bumps 305 may also be respectively coupled to unshown terminals of solar cell 300 .
  • Solar cell 300 may comprise a solar cell (e.g., a III-V cell, II-VI cell, etc.) for receiving photons from optical element 220 and generating electrical charge carriers in response thereto.
  • a solar cell e.g., a III-V cell, II-VI cell, etc.
  • some embodiments include an opening through dielectric conductive material 210 through which solar cell 300 may receive light from optical element 220 .
  • FIG. 4 is a flow diagram of process 400 according to some embodiments. Process 400 may be performed by any combination of machine, hardware, software and manual means.
  • Process 400 begins at S 410 , at which an optical element is obtained.
  • the optical element may be composed of any suitable material or combination of materials.
  • the optical element may be created using any combination of devices and systems that is or becomes known.
  • FIG. 5A is a perspective view of optical element 500 created at S 410 according to some embodiments
  • FIG. 5B is a cross-sectional view of element 500
  • Optical element 500 may be molded from low-iron glass at S 410 using known methods. Alternatively, separate pieces may be glued or otherwise coupled together to form element 500 .
  • Optical element 500 may comprise an element of a solar concentrator according to some embodiments.
  • Element 500 includes convex surface 510 , pedestal 520 , and concave surface 530 . The purposes of each portion of element 500 during operation according to some embodiments will become evident from the description below.
  • a reflective material is deposited on the optical element at S 420 .
  • the reflective material may be intended to create one or more mirrored surfaces. Any suitable reflective material may be used, taking into account factors such as but not limited to the wavelengths of light to be reflected, bonding of the reflective material to the optical element, and cost.
  • the reflective material may include a mirror coating, a dielectric enhancement coating, and/or a protective dielectric or polymer paint coating.
  • the reflective material may be deposited by sputtering or other physical vapor deposition, liquid deposition, etc.
  • FIGS. 6A and 6B show perspective and cross-sectional views, respectively, of optical element 500 after some embodiments of S 420 .
  • Reflective material 540 is deposited on convex surface 510 and concave surface 530 .
  • Reflective material 540 may comprise sputtered silver or aluminum.
  • the vertical and horizontal surfaces of pedestal 520 may be masked at S 420 such that reflective material 540 is not deposited thereon, or otherwise treated to remove any reflective material 540 that is deposited thereon.
  • a polymer is powder-coated onto the optical element.
  • the polymer may comprise an electrical insulator, and the powder-coating may proceed according to any method that is or becomes known.
  • the polymer may act as a mechanical buffer layer between the reflective material and conductive material. This buffer layer can also be deposited by other means such as spraying, dipping or lamination.
  • other suitable insulators such as any dielectrics, polyester, epoxy and polyurethane are powder-coated onto the optical element at S 430 .
  • S 430 Some embodiments of S 430 are depicted in FIGS. 7A and 7B .
  • Polymer 550 is deposited on convex surface 510 or, more particularly, on reflective material 540 .
  • S 615 may be executed such that polymer 550 is not deposited on the vertical and horizontal surfaces of pedestal 520 .
  • polymer 550 is not deposited on concave surface 530 (i.e., on reflective material 540 deposited on concave surface 530 ).
  • a stencil is placed on the optical element at S 440 and a molten metal powder is sprayed on the stencil and the optical element at S 450 .
  • the stencil may comprise a mechanical, hard or soft tooling.
  • the stencil may cover portions of the previously-deposited polymer that are not to receive the molten metal powder.
  • the molten metal powder may be composed of any combination of one or more metals (e.g., nickel, copper).
  • FIG. 8A is a perspective view and FIG. 8B is a cross-sectional view of optical element 500 after S 450 according to some embodiments.
  • Conductive material 560 covers pedestal 520 and portions of insulator 550 .
  • Conductive material 570 is also sprayed at S 450 and also covers portions of insulator 550 .
  • a stencil in the shape of the illustrated gap between conductive material 560 and conductive material 570 was placed at S 440 . The gap may facilitate electrical isolation between conductive material 560 and conductive material 570 .
  • Aperture 565 may comprise an exit window for light entering element 500 .
  • the stencil placed at S 440 may also define aperture 565 .
  • Such a stencil may comprise a mechanical, a liquid or a solid mask which is removed (i.e., peeled or dissolved) after S 450 .
  • Conductive materials 560 and 570 appear to extend to a uniform height above element 500 , this height need not be uniform. Conductive materials 560 and 570 may create a conductive path for electrical current generated by a photovoltaic (solar) cell coupled to element 500 . Conductive material 560 and conductive material 570 may also, as described in U.S. Patent Application Publication No. 2006/0231133, electrically link solar cells of adjacent solar concentrators in a solar concentrator array.
  • An electrical contact of a solar cell is coupled to the metal sprayed onto the optical element at S 460 .
  • the electrical contact may comprise a solder bump, and any number of intermediate conductive elements such as various layers of bonding pads may be used to couple the electrical contact to the exposed portion.
  • Coupling the electrical contact to the metal may comprise any flip-chip bonding techniques that are or become known.
  • the electrical contact may be placed on the metal using a pick-and-place machine, and the optical element and solar cell may be placed in a reflow oven to melt and subsequently cool the electrical contact.
  • FIG. 9 shows solder bumps 910 of solar cell 900 coupled to conductive material 560 .
  • Window 920 of solar cell 900 covers an optically-active area of solar cell 900 .
  • solder bumps 910 are coupled to conductive material 560 in some embodiments such that the optically-active area is aligned with aperture 565 .
  • Apparatus 500 of FIG. 9 may generally operate in accordance with the description of aforementioned U.S. Patent Application Publication No. 2006/0231133.
  • solar rays enter surface 598 and are reflected by reflective material 540 disposed on convex surface 510 .
  • the rays are reflected toward reflective material 540 on concave surface 530 , and are thereafter reflected toward aperture 565 .
  • the reflected rays pass through aperture 565 and are received by window 920 of solar cell 900 .
  • window 920 of solar cell 900 Those skilled in the art of optics will recognize that combinations of one or more other surface shapes may be utilized to concentrate solar rays onto a solar cell.
  • Solar cell 900 receives a substantial portion of the photon energy received at surface 598 and generates electrical current in response to the received photon energy.
  • the electrical current may be passed to external circuitry (and/or to similar serially-connected apparatuses) through conductive material 560 and conductive material 570 .
  • solar cell 900 may also comprise an electrical contact electrically coupled to conductive material 570 . Such a contact would exhibit a polarity opposite to the polarity of the contacts to which solder bumps 910 are coupled.

Abstract

A system may include an optical element, a thermal-sprayed material disposed on the optical element, and a solar cell coupled to the optical element. Some aspects provide thermal spraying of a first material onto an optical element, and coupling of a solar cell to the optical element. Thermal spraying the first material may include spraying a molten metal powder onto the optical element.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • The present application claims priority to U.S. Provisional Patent Application Ser. No. 60/899,150, filed on Feb. 2, 2007 and entitled “Concentrated Photovoltaic Energy Designs”, the contents of which are incorporated herein by reference for all purposes.
    • BACKGROUND
  • 1. Field
  • Some embodiments generally relate to the collection and concentration of solar radiation. More specifically, embodiments may relate to systems to efficiently fabricate solar radiation collectors.
  • 2. Brief Description
  • A concentrating solar radiation collector may convert received solar radiation (i.e., sunlight) into a concentrated beam and direct the concentrated beam onto a small photovoltaic cell. The cell, in turn, converts the photons of the received beam into electrical current.
  • U.S. Patent Application Publication No. 2006/0231133 describes several types of concentrating solar collectors. As described therein, a concentrating solar collector may include reflective material for directing received solar radiation, conductive material to carry electrical current generated from the solar radiation, and/or insulative material to isolate various conductors from one another. Fabrication of a solar radiation collector using one or more of these materials may be unsuitably complex and costly.
  • For example, conventional techniques for depositing these materials may include evaporating or sputtering within an established vacuum. Thin film lithographic techniques are employed to create desired patterns and features in the deposited materials. Such techniques require photoresist deposition, masking, UV exposure, and subsequent etching for each layer of material. Thin film lithography may provide geometrically accuracy but entails significant expense.
    • SUMMARY
  • To address at least the foregoing, some aspects provide a method, means and/or process steps to thermal spray a first material onto an optical element, and to couple a solar cell to the optical element. Thermal spraying the first material may include spraying a molten metal powder onto the optical element. Moreover, spraying the molten metal powder onto the optical element may include placing a stencil on the optical element and spraying a molten metal powder onto the stencil and the optical element.
  • In some aspects, thermal spraying the first material includes powder coating a polymer onto the optical element. According to still other aspects, a reflective material is deposited on a substantially-transparent core, an insulator is deposited on the reflective material, and thermal spraying the first material includes spraying a molten metal powder onto the insulator.
  • In other aspects, provided are an optical element, a thermal-sprayed material disposed on the optical element, and a solar cell coupled to the optical element. The thermal-sprayed material may comprise a hardened metal powder. In further aspects, the optical element may comprise an aperture from which light may pass out of the optical element, an electrical contact of the solar cell is coupled to the hardened metal powder, and an optically-active area of the solar cell is aligned with the aperture.
  • The thermal-sprayed material may comprise a polymer. Additionally or alternatively, the optical element may comprise a substantially-transparent core, a reflective material disposed on the substantially-transparent core, and an insulator disposed on the reflective material, wherein the thermal-sprayed material is disposed on the insulator. Further to the foregoing aspect, the insulator may include a powder-coated polymer.
  • The claims are not limited to the disclosed embodiments, however, as those in the art can readily adapt the description herein to create other embodiments and applications.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The construction and usage of embodiments will become readily apparent from consideration of the following specification as illustrated in the accompanying drawings, in which like reference numerals designate like parts.
  • FIG. 1 is a flow diagram of a method according to some embodiments.
  • FIG. 2A is a perspective view of a portion of an optical element and conductive material according to some embodiments.
  • FIG. 2B is a cross-sectional view of a portion of an optical element and conductive material according to some embodiments.
  • FIG. 3A is a perspective view of a portion of an optical element and a solar cell coupled thereto according to some embodiments.
  • FIG. 3B is a perspective view of a portion of an optical element and a solar cell coupled thereto according to some embodiments.
  • FIG. 4 is a flow diagram of a method according to some embodiments.
  • FIG. 5A is a perspective view of a transparent optical element according to some embodiments.
  • FIG. 5B is a cross-sectional view of a transparent optical element according to some embodiments.
  • FIG. 6A is a perspective view of a transparent optical element with reflective material disposed thereon according to some embodiments.
  • FIG. 6B is a cross-sectional view of a transparent optical element with reflective material disposed thereon according to some embodiments.
  • FIG. 7A is a perspective view of an optical element with an electrical isolator disposed thereon according to some embodiments.
  • FIG. 7B is a cross-sectional view of an optical element with an electrical isolator disposed thereon according to some embodiments.
  • FIG. 8A is a perspective view of an optical element with conductive material disposed thereon according to some embodiments.
  • FIG. 8B is a cross-sectional view of an optical element with conductive material disposed thereon according to some embodiments.
  • FIG. 9 is a cross-sectional view of an optical element and a solar cell according to some embodiments.
    •  DETAILED DESCRIPTION
  • The following description is provided to enable any person in the art to make and use the described embodiments and sets forth the best mode contemplated for carrying out some embodiments. Various modifications, however, will remain readily apparent to those in the art.
  • FIG. 1 is a flow diagram of process 100 according to some embodiments. Process 100 may be performed by any combination of machine, hardware, software and manual means.
  • Initially, at S110, a first material is thermal sprayed onto an optical element. The first material may comprise any material that is capable of being thermally-sprayed. Thermal spraying the first material may include heating a powder to a molten state and spraying the molten powder onto the optical element. The molten powder then cools on the optical element to produce a solid layer of material. In some embodiments, a stencil may be applied to the optical element before spraying the molten powder onto the optical element. The first material is therefore deposited in a pattern defined by the stencil.
  • The thermal spraying may be performed using a known twin wire arc process in a case that the first material is a metal. Plasma spray techniques may be employed at S110 if the first material is a metal or a ceramic. Moreover, if the first material is a polymer (e.g., polyester, epoxy, polyurethane, etc.), the first material may be powder coated onto the optical element at S110. Accordingly, the term thermal spraying encompasses at least twin wire arcing, plasma spraying (e.g., hot, cold, assisted), and powder coating.
  • Thermal spraying the first material onto the optical element may comprise spraying the first material onto other material(s) already deposited on the optical element. According to some embodiments, the optical element may be configured to manipulate and/or pass desired wavelengths of light. The optical element may comprise any number of disparate materials and/or elements (e.g., lenses, reflective surfaces and optically-transparent portions).
  • FIG. 2A is a perspective view of apparatus 200 according to some embodiments, and FIG. 2B is a cross-sectional view of apparatus 200 as shown in FIG. 2A. Apparatus 200 includes optical element 220 and conductive material 210 sprayed thereon according to some embodiments of S110. FIGS. 2A and 2B show only a portion of apparatus 200 in order to illustrate that apparatus 200 may exhibit any suitable shape or size.
  • Conductive material 210 may comprise any combination of one or more currently- or hereafter-known conductors, including but not limited to copper, gold and nickel. A thickness of material 210 on optical element 220 might not be as uniform as shown in FIG. 2B.
  • A solar cell is coupled to the optical element at S120. The coupling at S120 may comprise coupling the solar cell to other material(s) already deposited on the optical element. For example, an electrical contact of the solar cell may be coupled to conductive material deposited on the optical element. Such a coupling may form an electrical and a mechanical interconnection between the conductive material and the solar cell. Various flip-chip bonding techniques may be employed in some embodiments to couple an electrical contact of the solar cell to conductive material deposited on the optical element.
  • FIG. 3A is a perspective view of apparatus 200 after S120 according to some embodiments. FIG. 3B is a cross-sectional view corresponding to FIG. 3A. Solder bumps 305 of solar cell 300 are coupled to conductive material 210. Solder bumps 305 may also be respectively coupled to unshown terminals of solar cell 300.
  • Solar cell 300 may comprise a solar cell (e.g., a III-V cell, II-VI cell, etc.) for receiving photons from optical element 220 and generating electrical charge carriers in response thereto. In this regard, some embodiments include an opening through dielectric conductive material 210 through which solar cell 300 may receive light from optical element 220.
  • FIG. 4 is a flow diagram of process 400 according to some embodiments. Process 400 may be performed by any combination of machine, hardware, software and manual means.
  • Process 400 begins at S410, at which an optical element is obtained. The optical element may be composed of any suitable material or combination of materials. The optical element may be created using any combination of devices and systems that is or becomes known.
  • FIG. 5A is a perspective view of optical element 500 created at S410 according to some embodiments, and FIG. 5B is a cross-sectional view of element 500. Optical element 500 may be molded from low-iron glass at S410 using known methods. Alternatively, separate pieces may be glued or otherwise coupled together to form element 500. Optical element 500 may comprise an element of a solar concentrator according to some embodiments.
  • Element 500 includes convex surface 510, pedestal 520, and concave surface 530. The purposes of each portion of element 500 during operation according to some embodiments will become evident from the description below.
  • A reflective material is deposited on the optical element at S420. The reflective material may be intended to create one or more mirrored surfaces. Any suitable reflective material may be used, taking into account factors such as but not limited to the wavelengths of light to be reflected, bonding of the reflective material to the optical element, and cost. In some embodiments, the reflective material may include a mirror coating, a dielectric enhancement coating, and/or a protective dielectric or polymer paint coating. The reflective material may be deposited by sputtering or other physical vapor deposition, liquid deposition, etc.
  • FIGS. 6A and 6B show perspective and cross-sectional views, respectively, of optical element 500 after some embodiments of S420. Reflective material 540 is deposited on convex surface 510 and concave surface 530. Reflective material 540 may comprise sputtered silver or aluminum. The vertical and horizontal surfaces of pedestal 520 may be masked at S420 such that reflective material 540 is not deposited thereon, or otherwise treated to remove any reflective material 540 that is deposited thereon.
  • Next, at S430, a polymer is powder-coated onto the optical element. The polymer may comprise an electrical insulator, and the powder-coating may proceed according to any method that is or becomes known. The polymer may act as a mechanical buffer layer between the reflective material and conductive material. This buffer layer can also be deposited by other means such as spraying, dipping or lamination. According to some embodiments, other suitable insulators such as any dielectrics, polyester, epoxy and polyurethane are powder-coated onto the optical element at S430.
  • Some embodiments of S430 are depicted in FIGS. 7A and 7B. Polymer 550 is deposited on convex surface 510 or, more particularly, on reflective material 540. S615 may be executed such that polymer 550 is not deposited on the vertical and horizontal surfaces of pedestal 520. According to the illustrated embodiment, polymer 550 is not deposited on concave surface 530 (i.e., on reflective material 540 deposited on concave surface 530).
  • Returning to process 400, a stencil is placed on the optical element at S440 and a molten metal powder is sprayed on the stencil and the optical element at S450. The stencil may comprise a mechanical, hard or soft tooling. The stencil may cover portions of the previously-deposited polymer that are not to receive the molten metal powder. The molten metal powder may be composed of any combination of one or more metals (e.g., nickel, copper).
  • FIG. 8A is a perspective view and FIG. 8B is a cross-sectional view of optical element 500 after S450 according to some embodiments. Conductive material 560 covers pedestal 520 and portions of insulator 550. Conductive material 570 is also sprayed at S450 and also covers portions of insulator 550. A stencil in the shape of the illustrated gap between conductive material 560 and conductive material 570 was placed at S440. The gap may facilitate electrical isolation between conductive material 560 and conductive material 570.
  • Aperture 565 may comprise an exit window for light entering element 500. The stencil placed at S440 may also define aperture 565. Such a stencil may comprise a mechanical, a liquid or a solid mask which is removed (i.e., peeled or dissolved) after S450.
  • Although conductive materials 560 and 570 appear to extend to a uniform height above element 500, this height need not be uniform. Conductive materials 560 and 570 may create a conductive path for electrical current generated by a photovoltaic (solar) cell coupled to element 500. Conductive material 560 and conductive material 570 may also, as described in U.S. Patent Application Publication No. 2006/0231133, electrically link solar cells of adjacent solar concentrators in a solar concentrator array.
  • An electrical contact of a solar cell is coupled to the metal sprayed onto the optical element at S460. The electrical contact may comprise a solder bump, and any number of intermediate conductive elements such as various layers of bonding pads may be used to couple the electrical contact to the exposed portion. Coupling the electrical contact to the metal may comprise any flip-chip bonding techniques that are or become known. For example, the electrical contact may be placed on the metal using a pick-and-place machine, and the optical element and solar cell may be placed in a reflow oven to melt and subsequently cool the electrical contact.
  • FIG. 9 shows solder bumps 910 of solar cell 900 coupled to conductive material 560. Window 920 of solar cell 900 covers an optically-active area of solar cell 900. Accordingly, solder bumps 910 are coupled to conductive material 560 in some embodiments such that the optically-active area is aligned with aperture 565.
  • Apparatus 500 of FIG. 9 may generally operate in accordance with the description of aforementioned U.S. Patent Application Publication No. 2006/0231133. With reference to FIG. 9, solar rays enter surface 598 and are reflected by reflective material 540 disposed on convex surface 510. The rays are reflected toward reflective material 540 on concave surface 530, and are thereafter reflected toward aperture 565. The reflected rays pass through aperture 565 and are received by window 920 of solar cell 900. Those skilled in the art of optics will recognize that combinations of one or more other surface shapes may be utilized to concentrate solar rays onto a solar cell.
  • Solar cell 900 receives a substantial portion of the photon energy received at surface 598 and generates electrical current in response to the received photon energy. The electrical current may be passed to external circuitry (and/or to similar serially-connected apparatuses) through conductive material 560 and conductive material 570. In this regard, solar cell 900 may also comprise an electrical contact electrically coupled to conductive material 570. Such a contact would exhibit a polarity opposite to the polarity of the contacts to which solder bumps 910 are coupled.
  • The several embodiments described herein are solely for the purpose of illustration. Embodiments may include any currently or hereafter-known versions of the elements described herein. Therefore, persons in the art will recognize from this description that other embodiments may be practiced with various modifications and alterations.

Claims (19)

1. A method comprising:
thermal spraying a first material onto an optical element; and
coupling a solar cell to the optical element.
2. A method according to claim 1, wherein thermal spraying the first material comprises spraying a molten metal powder onto the optical element.
3. A method according to claim 2, wherein spraying the molten metal powder onto the optical element comprises:
placing a stencil on the optical element; and
spraying a molten metal powder onto the stencil and the optical element.
4. A method according to claim 3, further comprising:
removing the stencil to expose an aperture from which light may pass out of the optical element,
wherein coupling the solar cell to the optical element comprises:
coupling an electrical contact of the solar cell to the first material to align an optically-active area of the solar cell with the aperture.
5. A method according to claim 3, wherein the stencil comprises a mechanical, hard or soft tooling.
6. A method according to claim 1, wherein thermal spraying the first material comprises powder coating a polymer onto the optical element.
7. A method according to claim 1, further comprising:
depositing a reflective material on a substantially-transparent core; and
depositing an insulator on the reflective material;
wherein thermal spraying the first material comprises spraying a molten metal powder onto the insulator.
8. A method according to claim 7, wherein depositing the insulator comprises powder coating a polymer onto the reflective material.
9. A method according to claim 7, wherein depositing the reflective material comprises physical vapor deposition of the reflective material onto the substantially-transparent core.
10. A method according to claim 7, wherein thermal spraying the first material comprises:
placing a stencil on the insulator; and
spraying a molten metal powder onto the stencil and the insulator.
11. A method according to claim 1, wherein thermal spraying the first material onto the optical element comprises:
placing a stencil on the optical element; and
spraying the first material onto the stencil and the optical element.
12. A method according to claim 1, wherein coupling the solar cell to the optical element comprises coupling an electrical contact of the solar cell to the first material to align an optically-active area of the solar cell with an aperture from which light may pass out of the optical element.
13. An apparatus comprising:
an optical element;
a thermal-sprayed material disposed on the optical element; and
a solar cell coupled to the optical element.
14. An apparatus according to claim 13, wherein the thermal-sprayed material comprises a hardened metal powder.
15. An apparatus according to claim 14, wherein:
the optical element comprises an aperture from which light may pass out of the optical element,
an electrical contact of the solar cell is coupled to the hardened metal powder, and
an optically-active area of the solar cell is aligned with the aperture.
16. An apparatus according to claim 13, wherein the thermal-sprayed material comprises a polymer.
17. An apparatus according to claim 13, wherein the optical element comprises:
a substantially-transparent core;
a reflective material disposed on the substantially-transparent core; and
an insulator disposed on the reflective material,
wherein the thermal-sprayed material is disposed on the insulator.
18. An apparatus according to claim 17, wherein the insulator comprises a powder-coated polymer.
19. An apparatus according to claim 13, wherein:
the optical element comprises an aperture from which light may pass out of the optical element,
an electrical contact of the solar cell is coupled to the thermal-sprayed material, and
an optically-active area of the solar cell is aligned with the aperture.
US11/782,605 2007-02-02 2007-07-24 Thermal spray for solar concentrator fabrication Abandoned US20090025784A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/782,605 US20090025784A1 (en) 2007-02-02 2007-07-24 Thermal spray for solar concentrator fabrication
PCT/US2008/050791 WO2008097688A1 (en) 2007-02-02 2008-01-10 Thermal spray for solar concentrator fabrication
EP08727546A EP2115787A1 (en) 2007-02-02 2008-01-10 Thermal spray for solar concentrator fabrication
AU2008214229A AU2008214229A1 (en) 2007-02-02 2008-01-10 Thermal spray for solar concentrator fabrication
JP2009548352A JP2010518255A (en) 2007-02-02 2008-01-10 Thermal spraying for solar concentrator manufacturing
US12/841,823 US20100294364A1 (en) 2007-02-02 2010-07-22 Thermal Spray For Solar Concentrator Fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89915007P 2007-02-02 2007-02-02
US11/782,605 US20090025784A1 (en) 2007-02-02 2007-07-24 Thermal spray for solar concentrator fabrication

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/841,823 Division US20100294364A1 (en) 2007-02-02 2010-07-22 Thermal Spray For Solar Concentrator Fabrication

Publications (1)

Publication Number Publication Date
US20090025784A1 true US20090025784A1 (en) 2009-01-29

Family

ID=39675132

Family Applications (7)

Application Number Title Priority Date Filing Date
US11/782,605 Abandoned US20090025784A1 (en) 2007-02-02 2007-07-24 Thermal spray for solar concentrator fabrication
US11/782,359 Abandoned US20090025789A1 (en) 2007-02-02 2007-07-24 Alignment of optical element and solar cell
US11/782,376 Abandoned US20080185039A1 (en) 2007-02-02 2007-07-24 Conductor fabrication for optical element
US11/782,609 Abandoned US20080186593A1 (en) 2007-02-02 2007-07-24 Metal trace fabrication for optical element
US12/841,823 Abandoned US20100294364A1 (en) 2007-02-02 2010-07-22 Thermal Spray For Solar Concentrator Fabrication
US12/909,488 Active 2028-03-06 US8389851B2 (en) 2007-02-02 2010-10-21 Metal trace fabrication for optical element
US13/586,794 Active US8624102B2 (en) 2007-02-02 2012-08-15 Metal trace fabrication for optical element

Family Applications After (6)

Application Number Title Priority Date Filing Date
US11/782,359 Abandoned US20090025789A1 (en) 2007-02-02 2007-07-24 Alignment of optical element and solar cell
US11/782,376 Abandoned US20080185039A1 (en) 2007-02-02 2007-07-24 Conductor fabrication for optical element
US11/782,609 Abandoned US20080186593A1 (en) 2007-02-02 2007-07-24 Metal trace fabrication for optical element
US12/841,823 Abandoned US20100294364A1 (en) 2007-02-02 2010-07-22 Thermal Spray For Solar Concentrator Fabrication
US12/909,488 Active 2028-03-06 US8389851B2 (en) 2007-02-02 2010-10-21 Metal trace fabrication for optical element
US13/586,794 Active US8624102B2 (en) 2007-02-02 2012-08-15 Metal trace fabrication for optical element

Country Status (5)

Country Link
US (7) US20090025784A1 (en)
EP (2) EP2115787A1 (en)
JP (2) JP5869204B2 (en)
AU (2) AU2008214228B2 (en)
WO (1) WO2008097687A2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110079268A1 (en) * 2009-10-06 2011-04-07 Brightleaf Technologies, Inc. Solar collector and conversion array
US20110079269A1 (en) * 2009-10-06 2011-04-07 Brightleaf Technologies, Inc. Non-parabolic solar concentration to an area of controlled flux density conversion system and method
US20110146754A1 (en) * 2009-12-22 2011-06-23 Brightleaf Technologies, Inc. Solar conversion system having solar collector for forming a transposed image
US8659042B2 (en) 2010-12-21 2014-02-25 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method
US8695687B2 (en) 2010-12-10 2014-04-15 Palo Alto Research Center Incorporated Hybrid pin-fin micro heat pipe heat sink and method of fabrication

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906722B2 (en) * 2005-04-19 2011-03-15 Palo Alto Research Center Incorporated Concentrating solar collector with solid optical element
US7855335B2 (en) * 2006-04-26 2010-12-21 Palo Alto Research Center Incorporated Beam integration for concentrating solar collector
US7851693B2 (en) * 2006-05-05 2010-12-14 Palo Alto Research Center Incorporated Passively cooled solar concentrating photovoltaic device
US20090025784A1 (en) 2007-02-02 2009-01-29 Sol Focus, Inc. Thermal spray for solar concentrator fabrication
US20110174213A1 (en) * 2008-10-03 2011-07-21 Veeco Compound Semiconductor, Inc. Vapor Phase Epitaxy System
US20100206357A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Two-Part Solar Energy Collection System With Replaceable Solar Collector Component
US20100206379A1 (en) * 2009-02-18 2010-08-19 Palo Alto Research Center Incorporated Rotational Trough Reflector Array With Solid Optical Element For Solar-Electricity Generation
TW201110275A (en) * 2009-05-13 2011-03-16 Seiko Instr Inc Electronic component, manufacturing method for electronic component, and electronic device
KR101085475B1 (en) * 2009-12-21 2011-11-21 삼성전기주식회사 Solar Cell Module and Method for Manufacturing Thereof
US8040609B1 (en) 2010-11-29 2011-10-18 Palo Alto Research Center Incorporated Self-adjusting solar light transmission apparatus
US8884156B2 (en) 2010-11-29 2014-11-11 Palo Alto Research Center Incorporated Solar energy harvesting device using stimuli-responsive material
US8328077B1 (en) * 2011-11-01 2012-12-11 Flextronics Ap, Llc PV cell mass reflow
US20130153016A1 (en) * 2011-12-20 2013-06-20 Tong Hsing Electronic Industries, Ltd. Solar Cell Flip Chip Package Structure and Method for Manufacturing the same
DE102013204326A1 (en) 2012-03-13 2013-09-19 Robert Bosch Gmbh Solar module for electric power generation, has bumps that are provided at connection points, and insulating layer which is arranged between planar insulating support portion and solar cell rear portion
US8752380B2 (en) 2012-05-22 2014-06-17 Palo Alto Research Center Incorporated Collapsible solar-thermal concentrator for renewable, sustainable expeditionary power generator system
US9224626B2 (en) 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
US9227259B2 (en) 2012-08-22 2016-01-05 International Business Machines Corporation Increasing the efficiency of solar cells by transfer of solder
CN104779312B (en) * 2014-01-09 2017-10-10 讯芯电子科技（中山）有限公司 Concentrating solar photovoltaic module
JP6693889B2 (en) 2014-05-14 2020-05-13 カリフォルニア インスティチュート オブ テクノロジー Large Space Photovoltaic Power Station: Power Transmission Using Guided Beam
WO2015179213A2 (en) 2014-05-14 2015-11-26 California Institute Of Technology Large-scale space-based solar power station: multi-scale modular space power
JP6640116B2 (en) 2014-06-02 2020-02-05 カリフォルニア インスティチュート オブ テクノロジー Large Space Solar Power Plants: Efficient Power Generation Tiles
JP6715317B2 (en) 2015-07-22 2020-07-01 カリフォルニア インスティチュート オブ テクノロジー Large area structure for compact packaging
WO2017027633A1 (en) 2015-08-10 2017-02-16 California Institute Of Technology Systems and methods for controlling supply voltages of stacked power amplifiers
US10992253B2 (en) 2015-08-10 2021-04-27 California Institute Of Technology Compactable power generation arrays
KR102167221B1 (en) * 2017-02-10 2020-10-19 주식회사 엘지화학 Film having asymmetric transmittance
US11634240B2 (en) 2018-07-17 2023-04-25 California Institute Of Technology Coilable thin-walled longerons and coilable structures implementing longerons and methods for their manufacture and coiling
US11772826B2 (en) 2018-10-31 2023-10-03 California Institute Of Technology Actively controlled spacecraft deployment mechanism

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032008A (en) * 1956-05-07 1962-05-01 Polaroid Corp Apparatus for manufacturing photographic films
US4131485A (en) * 1977-08-08 1978-12-26 Motorola, Inc. Solar energy collector and concentrator
US4234351A (en) * 1978-07-14 1980-11-18 The Boeing Company Process for fabricating glass-encapsulated solar cell arrays and the product produced thereby
US4320251A (en) * 1980-07-28 1982-03-16 Solamat Inc. Ohmic contacts for solar cells by arc plasma spraying
US4331703A (en) * 1979-03-28 1982-05-25 Solarex Corporation Method of forming solar cell having contacts and antireflective coating
US4337758A (en) * 1978-06-21 1982-07-06 Meinel Aden B Solar energy collector and converter
US4476165A (en) * 1982-06-07 1984-10-09 Acumeter Laboratories, Inc. Method of and apparatus for multi-layer viscous fluid deposition such as for the application of adhesives and the like
US4490418A (en) * 1982-04-16 1984-12-25 Fuji Photo Film Co., Ltd. Coating method and apparatus
US4521457A (en) * 1982-09-21 1985-06-04 Xerox Corporation Simultaneous formation and deposition of multiple ribbon-like streams
US4602120A (en) * 1983-11-25 1986-07-22 Atlantic Richfield Company Solar cell manufacture
US4683348A (en) * 1985-04-26 1987-07-28 The Marconi Company Limited Solar cell arrays
US4938994A (en) * 1987-11-23 1990-07-03 Epicor Technology, Inc. Method and apparatus for patch coating printed circuit boards
US5000988A (en) * 1987-01-14 1991-03-19 Matsushita Electric Industrial Co., Ltd. Method of applying a coating of viscous materials
US5089055A (en) * 1989-12-12 1992-02-18 Takashi Nakamura Survivable solar power-generating systems for use with spacecraft
US5188789A (en) * 1990-09-14 1993-02-23 Fuji Photo Film Co., Ltd. Producing a photographic support
US5356488A (en) * 1991-12-27 1994-10-18 Rudolf Hezel Solar cell and method for its manufacture
US5449413A (en) * 1993-05-12 1995-09-12 Optical Coating Laboratory, Inc. UV/IR reflecting solar cell cover
US5501743A (en) * 1994-08-11 1996-03-26 Cherney; Matthew Fiber optic power-generating system
US5540216A (en) * 1994-11-21 1996-07-30 Rasmusson; James K. Apparatus and method for concentrating radiant energy emanated by a moving energy source
US5733608A (en) * 1995-02-02 1998-03-31 Minnesota Mining And Manufacturing Company Method and apparatus for applying thin fluid coating stripes
US6008449A (en) * 1997-08-19 1999-12-28 Cole; Eric D. Reflective concentrating solar cell assembly
US6091017A (en) * 1999-08-23 2000-07-18 Composite Optics Incorporated Solar concentrator array
US6118067A (en) * 1998-11-20 2000-09-12 Swales Aerospace Method and apparatus for improved solar concentration arrays
US6203621B1 (en) * 1999-05-24 2001-03-20 Trw Inc. Vacuum chuck for holding thin sheet material
US6232217B1 (en) * 2000-06-05 2001-05-15 Chartered Semiconductor Manufacturing Ltd. Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening
US20010008230A1 (en) * 1996-07-08 2001-07-19 David M. Keicher Energy-beam-driven rapid fabrication system
US6323415B1 (en) * 1998-09-18 2001-11-27 Hitachi, Ltd. Light concentrator photovoltaic module method of manufacturing same and light concentrator photovoltaic system
USRE37512E1 (en) * 1995-02-21 2002-01-15 Interuniversitair Microelektronica Centrum (Imec) Vzw Method of preparing solar cell front contacts
US6379521B1 (en) * 1998-01-06 2002-04-30 Canon Kabushiki Kaisha Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate
US20020056473A1 (en) * 2000-11-16 2002-05-16 Mohan Chandra Making and connecting bus bars on solar cells
US6410843B1 (en) * 1999-11-22 2002-06-25 Sanyo Electric Co., Ltd. Solar cell module
US20030015820A1 (en) * 2001-06-15 2003-01-23 Hidekazu Yamazaki Method of producing of cellulose ester film
US6531653B1 (en) * 2001-09-11 2003-03-11 The Boeing Company Low cost high solar flux photovoltaic concentrator receiver
US20030095175A1 (en) * 2001-11-16 2003-05-22 Applied Materials, Inc. Laser beam pattern generator having rotating scanner compensator and method
US20030129810A1 (en) * 2000-05-30 2003-07-10 Barth Kurt L. Apparatus and processes for the mass production of photovoltaic modules
US20040031517A1 (en) * 2002-08-13 2004-02-19 Bareis Bernard F. Concentrating solar energy receiver
US20050000566A1 (en) * 2003-05-07 2005-01-06 Niels Posthuma Germanium solar cell and method for the production thereof
US20050029236A1 (en) * 2002-08-05 2005-02-10 Richard Gambino System and method for manufacturing embedded conformal electronics
US20050081908A1 (en) * 2003-03-19 2005-04-21 Stewart Roger G. Method and apparatus for generation of electrical power from solar energy
US20050253308A1 (en) * 2002-05-07 2005-11-17 3D System, Inc. Flash curing in selective deposition modeling
US20060231133A1 (en) * 2005-04-19 2006-10-19 Palo Alto Research Center Incorporated Concentrating solar collector with solid optical element
US20060266235A1 (en) * 2005-05-24 2006-11-30 Micron Technology, Inc. Supercritical fluid-assisted direct write for printing integrated circuits
US7394016B2 (en) * 2005-10-11 2008-07-01 Solyndra, Inc. Bifacial elongated solar cell devices with internal reflectors
US20080186593A1 (en) * 2007-02-02 2008-08-07 Sol Focus, Inc. Metal trace fabrication for optical element

Family Cites Families (140)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US31517A (en) * 1861-02-19 Metallic spring
US2031387A (en) * 1934-08-22 1936-02-18 Schwarz Arthur Nozzle
US2789731A (en) * 1955-06-06 1957-04-23 Leonard L Marraffino Striping dispenser
US3923381A (en) * 1973-12-28 1975-12-02 Univ Chicago Radiant energy collection
US3973994A (en) * 1974-03-11 1976-08-10 Rca Corporation Solar cell with grooved surface
JPS5328751B2 (en) * 1974-11-27 1978-08-16
US3988166A (en) * 1975-01-07 1976-10-26 Beam Engineering, Inc. Apparatus for enhancing the output of photovoltaic solar cells
US4045246A (en) * 1975-08-11 1977-08-30 Mobil Tyco Solar Energy Corporation Solar cells with concentrators
US4021267A (en) * 1975-09-08 1977-05-03 United Technologies Corporation High efficiency converter of solar energy to electricity
US4053327A (en) * 1975-09-24 1977-10-11 Communications Satellite Corporation Light concentrating solar cell cover
US4114596A (en) * 1976-03-16 1978-09-19 Chang Wei Yi Method and apparatus for tracking the sun for use in a solar collector with linear focusing means
US4086485A (en) 1976-05-26 1978-04-25 Massachusetts Institute Of Technology Solar-radiation collection apparatus with tracking circuitry
US4095997A (en) * 1976-10-07 1978-06-20 Griffiths Kenneth F Combined solar cell and hot air collector apparatus
US4084985A (en) * 1977-04-25 1978-04-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing solar energy panels by automation
US4177083A (en) 1977-09-06 1979-12-04 Acurex Corporation Photovoltaic concentrator
US4148301A (en) 1977-09-26 1979-04-10 Cluff C Brent Water-borne rotating solar collecting and storage systems
US4296731A (en) * 1977-09-26 1981-10-27 Cluff C Brent Tracking booster and multiple mirror concentrator floating collector
US4153476A (en) * 1978-03-29 1979-05-08 Nasa Double-sided solar cell package
US4221468A (en) 1979-02-26 1980-09-09 Macken John A Multi-cavity laser mirror
US4254894A (en) * 1979-08-23 1981-03-10 The Continental Group, Inc. Apparatus for dispensing a striped product and method of producing the striped product
DE8033450U1 (en) * 1980-12-17 1982-07-22 Colgate-Palmolive Co., 10022 New York, N.Y. Long container for a donor for pastoeses good
DE3104690A1 (en) 1981-02-10 1982-08-26 Siemens AG, 1000 Berlin und 8000 München Solar-energy system
DE3107888A1 (en) 1981-03-02 1982-09-16 Imchemie Kunststoff Gmbh, 5632 Wermelskirchen SOLAR CONCENTRATOR
DE3205439A1 (en) 1981-03-02 1983-08-25 Imchemie Kunststoff Gmbh, 5632 Wermelskirchen Solar concentrator having concave mirrors
US4355196A (en) * 1981-03-11 1982-10-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Solar cell having improved back surface reflector
DE3308269A1 (en) * 1983-03-09 1984-09-13 Licentia Patent-Verwaltungs-Gmbh SOLAR CELL
US4841946A (en) 1984-02-17 1989-06-27 Marks Alvin M Solar collector, transmitter and heater
US4771764A (en) * 1984-04-06 1988-09-20 Cluff C Brent Water-borne azimuth-altitude tracking solar concentrators
US4711972A (en) 1985-07-05 1987-12-08 Entech, Inc. Photovoltaic cell cover for use with a primary optical concentrator in a solar energy collector
KR910000868B1 (en) 1985-08-27 1991-02-11 미쯔이도오 아쯔 가가꾸 가부시기가이샤 Process for the preparation of polyimides for heat-resistant adhesive
US4849028A (en) * 1986-07-03 1989-07-18 Hughes Aircraft Company Solar cell with integrated interconnect device and process for fabrication thereof
DE3633172A1 (en) 1986-09-30 1988-04-07 Man Technologie Gmbh Method for utilising solar energy and apparatus for carrying out the method
US5216543A (en) * 1987-03-04 1993-06-01 Minnesota Mining And Manufacturing Company Apparatus and method for patterning a film
US4747517A (en) * 1987-03-23 1988-05-31 Minnesota Mining And Manufacturing Company Dispenser for metering proportionate increments of polymerizable materials
US4826777A (en) * 1987-04-17 1989-05-02 The Standard Oil Company Making a photoresponsive array
US4792685A (en) * 1987-04-29 1988-12-20 Masami Yamakawa Photoelectric sensor
US4746370A (en) 1987-04-29 1988-05-24 Ga Technologies Inc. Photothermophotovoltaic converter
US4855884A (en) 1987-12-02 1989-08-08 Morpheus Lights, Inc. Variable beamwidth stage light
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
US5004319A (en) 1988-12-29 1991-04-02 The United States Of America As Represented By The Department Of Energy Crystal diffraction lens with variable focal length
US5017986A (en) * 1989-08-28 1991-05-21 At&T Bell Laboratories Optical device mounting apparatus
US4947825A (en) * 1989-09-11 1990-08-14 Rockwell International Corporation Solar concentrator - radiator assembly
US5062899A (en) * 1990-03-30 1991-11-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Wide acceptance angle, high concentration ratio, optical collector
DK170189B1 (en) * 1990-05-30 1995-06-06 Yakov Safir Process for the manufacture of semiconductor components, as well as solar cells made therefrom
US5213628A (en) * 1990-09-20 1993-05-25 Sanyo Electric Co., Ltd. Photovoltaic device
US5254388A (en) * 1990-12-21 1993-10-19 Minnesota Mining And Manufacturing Company Light control film with reduced ghost images
US5151377A (en) * 1991-03-07 1992-09-29 Mobil Solar Energy Corporation Method for forming contacts
US5167724A (en) 1991-05-16 1992-12-01 The United States Of America As Represented By The United States Department Of Energy Planar photovoltaic solar concentrator module
US5180441A (en) 1991-06-14 1993-01-19 General Dynamics Corporation/Space Systems Division Solar concentrator array
WO1993016932A2 (en) * 1992-02-25 1993-09-02 Cambridge Consultants Limited Fluid delivery apparatus
US5172170A (en) * 1992-03-13 1992-12-15 Xerox Corporation Electroded donor roll for a scavengeless developer unit
US5404869A (en) * 1992-04-16 1995-04-11 Tir Technologies, Inc. Faceted totally internally reflecting lens with individually curved faces on facets
US5288337A (en) 1992-06-25 1994-02-22 Siemens Solar Industries, L.P. Photovoltaic module with specular reflector
US5353813A (en) * 1992-08-19 1994-10-11 Philip Morris Incorporated Reinforced carbon heater with discrete heating zones
JP2613719B2 (en) 1992-09-01 1997-05-28 キヤノン株式会社 Method of manufacturing solar cell module
US5344496A (en) 1992-11-16 1994-09-06 General Dynamics Corporation, Space Systems Division Lightweight solar concentrator cell array
JPH06337366A (en) 1993-05-21 1994-12-06 Xerox Corp Exposure device for raster output scanner in electrophotography printer
WO1994028361A1 (en) 1993-06-02 1994-12-08 Stirbl Robert C Method for changing solar energy distribution
US5559677A (en) * 1994-04-29 1996-09-24 Motorola, Inc. Method of forming a device by selectively thermal spraying a metallic conductive material thereon
US5529054A (en) * 1994-06-20 1996-06-25 Shoen; Neil C. Solar energy concentrator and collector system and associated method
US5553747A (en) * 1994-12-07 1996-09-10 Smithkline Beecham Corporation Container for multisegmental toothpaste
US5569399A (en) * 1995-01-20 1996-10-29 General Electric Company Lasing medium surface modification
US5538563A (en) * 1995-02-03 1996-07-23 Finkl; Anthony W. Solar energy concentrator apparatus for bifacial photovoltaic cells
GB9507572D0 (en) * 1995-04-12 1995-05-31 Smithkline Beecham Plc Dispenser
US5929530A (en) * 1995-08-18 1999-07-27 Mcdonnell Douglas Corporation Advanced solar controller
DE69716403T2 (en) * 1996-01-31 2003-06-18 Airspray Int Bv SPRAYING DEVICE FOR DISPENSING MULTI-COMPONENT MATERIAL
US5902540A (en) * 1996-10-08 1999-05-11 Illinois Tool Works Inc. Meltblowing method and apparatus
US6014246A (en) * 1996-11-06 2000-01-11 University Of Pittsburgh Of The Commonwealth System Of Higher Education Thermally switchable optical devices
US5873495A (en) * 1996-11-21 1999-02-23 Saint-Germain; Jean G. Device for dispensing multi-components from a container
AUPO429396A0 (en) * 1996-12-20 1997-01-23 Solsearch Pty Ltd Solar energy collector system
US5969052A (en) * 1996-12-31 1999-10-19 Kimberly Clark Worldwide, Inc. Temperature sensitive polymers and water-dispersible products containing the polymers
AU7967798A (en) * 1997-07-01 1999-01-25 Smithkline Beecham Corporation Apparatus for inserting plural materials into containers
US6011307A (en) * 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
DE19735281A1 (en) 1997-08-14 1999-02-18 Rolf Hoericht Energy generating arrangement using solar radiation
AU9451098A (en) * 1997-10-14 1999-05-03 Patterning Technologies Limited Method of forming an electronic device
US6130465A (en) * 1997-10-29 2000-10-10 Light Point Systems Inc. Micro-solar assembly
EP0915523A3 (en) * 1997-10-29 2005-11-02 Canon Kabushiki Kaisha A photovoltaic element having a back side transparent and electrically conductive layer with a light incident side surface region having a specific cross section and a module comprising said photovoltaic element
US6185030B1 (en) * 1998-03-20 2001-02-06 James W. Overbeck Wide field of view and high speed scanning microscopy
US6278054B1 (en) 1998-05-28 2001-08-21 Tecstar Power Systems, Inc. Solar cell having an integral monolithically grown bypass diode
AUPP437598A0 (en) * 1998-06-29 1998-07-23 Unisearch Limited A self aligning method for forming a selective emitter and metallization in a solar cell
US6239353B1 (en) * 1998-10-14 2001-05-29 Christopher M. Hall Solar tracker
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6380729B1 (en) 1999-02-16 2002-04-30 Alien Technology Corporation Testing integrated circuit dice
US6020554A (en) 1999-03-19 2000-02-01 Photovoltaics International, Llc Tracking solar energy conversion unit adapted for field assembly
JP2000294813A (en) * 1999-04-07 2000-10-20 Bridgestone Corp Back cover material for solar cells and solar cell
US6257450B1 (en) * 1999-04-21 2001-07-10 Pechiney Plastic Packaging, Inc. Dual dispense container having cloverleaf orifice
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6527964B1 (en) * 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) * 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
ES2157846B1 (en) * 1999-12-02 2002-03-01 Univ Madrid Politecnica DEVICE WITH DISCONTINUOUS LENS WITH INTERNAL TOTAL REFLECTION AND ASPHERIC DIOPTRIC FOR CONCENTRATION OR COLIMATION OF RADIANT ENERGY.
JP4774146B2 (en) * 1999-12-23 2011-09-14 パナソニック株式会社 Method and apparatus for drilling holes with a pitch smaller than the wavelength using a laser
JP2001251039A (en) * 2000-03-07 2001-09-14 Seiko Epson Corp Glass substrate, its manufacturing method and semiconductor device
CA2402687C (en) 2000-03-16 2010-10-26 Led Products, Inc. High efficiency non-imaging optics
JP3865036B2 (en) * 2000-04-07 2007-01-10 セイコーエプソン株式会社 Optical module, method for manufacturing the same, and optical transmission device
KR100454225B1 (en) 2000-05-12 2004-10-26 황우성 Ultra-thin, High Concentration Light Energy Concentrator
US6423140B1 (en) * 2000-06-08 2002-07-23 Formosa Advanced Coating Technologies, Inc. Die set for preparing ABCABC multiple-stripe coating
US6398370B1 (en) * 2000-11-15 2002-06-04 3M Innovative Properties Company Light control device
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
JP2002289900A (en) * 2001-03-23 2002-10-04 Canon Inc Concentrating solar cell module and concentrating photovoltaic power generation system
US7186102B2 (en) * 2001-04-26 2007-03-06 Strandex Corporation Apparatus and method for low-density cellular wood plastic composites
US6498290B1 (en) * 2001-05-29 2002-12-24 The Sun Trust, L.L.C. Conversion of solar energy
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
CN2606309Y (en) 2001-06-22 2004-03-10 高增世 Solar mirror double grooved single-way light conducting energy-collecting board
US6555739B2 (en) * 2001-09-10 2003-04-29 Ekla-Tek, Llc Photovoltaic array and method of manufacturing same
US7208674B2 (en) 2001-09-11 2007-04-24 Eric Aylaian Solar cell having photovoltaic cells inclined at acute angle to each other
US6597510B2 (en) * 2001-11-02 2003-07-22 Corning Incorporated Methods and apparatus for making optical devices including microlens arrays
US20030201581A1 (en) * 2002-02-28 2003-10-30 Jan Weber Ultrasonic assisted processes
CA2422224A1 (en) * 2002-03-15 2003-09-15 Affymetrix, Inc. System, method, and product for scanning of biological materials
US6896381B2 (en) 2002-10-11 2005-05-24 Light Prescriptions Innovators, Llc Compact folded-optics illumination lens
JP2004288898A (en) * 2003-03-24 2004-10-14 Canon Inc Manufacturing method of solar cell module
US7388147B2 (en) * 2003-04-10 2008-06-17 Sunpower Corporation Metal contact structure for solar cell and method of manufacture
US7259323B2 (en) 2003-04-22 2007-08-21 The Aerospace Corporation Thin film solar cell thermal radiator
US6959993B2 (en) * 2003-07-10 2005-11-01 Energy Innovations, Inc. Solar concentrator array with individually adjustable elements
IL157716A0 (en) 2003-09-02 2004-03-28 Eli Shifman Solar energy utilization unit and solar energy utilization system
JP4121928B2 (en) * 2003-10-08 2008-07-23 シャープ株式会社 Manufacturing method of solar cell
US6958868B1 (en) 2004-03-29 2005-10-25 John George Pender Motion-free tracking solar concentrator
JP2005317225A (en) * 2004-04-27 2005-11-10 Enplas Corp Dye-sensitized solar cell, and photoelectrode for the same
JP4635474B2 (en) * 2004-05-14 2011-02-23 ソニー株式会社 Photoelectric conversion element and transparent conductive substrate used therefor
JP2006005252A (en) * 2004-06-18 2006-01-05 Nandei Electronics:Kk Circuit board, and method for manufacturing the same
US7045794B1 (en) * 2004-06-18 2006-05-16 Novelx, Inc. Stacked lens structure and method of use thereof for preventing electrical breakdown
JP2006083036A (en) * 2004-09-17 2006-03-30 Fujikura Ltd Glass etching method, manufacturing method of transparent conductive substrate and photoelectric transducer
US7199918B2 (en) * 2005-01-07 2007-04-03 Miradia Inc. Electrical contact method and structure for deflection devices formed in an array configuration
US20060207650A1 (en) * 2005-03-21 2006-09-21 The Regents Of The University Of California Multi-junction solar cells with an aplanatic imaging system and coupled non-imaging light concentrator
JP2006332351A (en) * 2005-05-26 2006-12-07 Fujikura Ltd Substrate for mounting light-emitting element, and light-emitting device
DE102005033272A1 (en) * 2005-06-03 2006-12-07 Solartec Ag Concentrator photovoltaic device, PV concentrator module formed therefrom and manufacturing method thereof
US20080047605A1 (en) 2005-07-28 2008-02-28 Regents Of The University Of California Multi-junction solar cells with a homogenizer system and coupled non-imaging light concentrator
US8283554B2 (en) 2005-12-19 2012-10-09 Corning Incorporated Method and apparatus for concentrating light
US20070137691A1 (en) * 2005-12-19 2007-06-21 Cobb Joshua M Light collector and concentrator
JP2009529791A (en) 2006-03-08 2009-08-20 ライト プレスクリプションズ イノベーターズ エルエルシー Solar concentrator
WO2007109901A1 (en) 2006-03-28 2007-10-04 Menova Energy Inc. Support structure kor a solar collector system
US7638708B2 (en) * 2006-05-05 2009-12-29 Palo Alto Research Center Incorporated Laminated solar concentrating photovoltaic device
TWI466304B (en) * 2006-07-07 2014-12-21 Energy Related Devices Inc Micro concentrators elastically coupled with spherical photovoltaic cells
WO2008153892A1 (en) * 2007-06-06 2008-12-18 Green Volts Inc. Reflective secondary optic for concentrated photovoltaic systems
WO2009023063A2 (en) * 2007-06-13 2009-02-19 Ausra, Inc. Solar energy receiver having optically inclined aperture
US20090056789A1 (en) * 2007-08-30 2009-03-05 Vladimir Draganov Solar concentrator and solar concentrator array
CN101227158A (en) 2008-01-21 2008-07-23 北京格物创道科技发明有限公司 Automatic tracking type solar generator
US9274266B2 (en) 2008-09-19 2016-03-01 The Regents Of The University Of California System and method for solar energy capture and related method of manufacturing

Patent Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032008A (en) * 1956-05-07 1962-05-01 Polaroid Corp Apparatus for manufacturing photographic films
US4131485A (en) * 1977-08-08 1978-12-26 Motorola, Inc. Solar energy collector and concentrator
US4337758A (en) * 1978-06-21 1982-07-06 Meinel Aden B Solar energy collector and converter
US4234351A (en) * 1978-07-14 1980-11-18 The Boeing Company Process for fabricating glass-encapsulated solar cell arrays and the product produced thereby
US4331703A (en) * 1979-03-28 1982-05-25 Solarex Corporation Method of forming solar cell having contacts and antireflective coating
US4320251A (en) * 1980-07-28 1982-03-16 Solamat Inc. Ohmic contacts for solar cells by arc plasma spraying
US4490418A (en) * 1982-04-16 1984-12-25 Fuji Photo Film Co., Ltd. Coating method and apparatus
US4476165A (en) * 1982-06-07 1984-10-09 Acumeter Laboratories, Inc. Method of and apparatus for multi-layer viscous fluid deposition such as for the application of adhesives and the like
US4521457A (en) * 1982-09-21 1985-06-04 Xerox Corporation Simultaneous formation and deposition of multiple ribbon-like streams
US4602120A (en) * 1983-11-25 1986-07-22 Atlantic Richfield Company Solar cell manufacture
US4683348A (en) * 1985-04-26 1987-07-28 The Marconi Company Limited Solar cell arrays
US5000988A (en) * 1987-01-14 1991-03-19 Matsushita Electric Industrial Co., Ltd. Method of applying a coating of viscous materials
US4938994A (en) * 1987-11-23 1990-07-03 Epicor Technology, Inc. Method and apparatus for patch coating printed circuit boards
US5089055A (en) * 1989-12-12 1992-02-18 Takashi Nakamura Survivable solar power-generating systems for use with spacecraft
US5188789A (en) * 1990-09-14 1993-02-23 Fuji Photo Film Co., Ltd. Producing a photographic support
US5356488A (en) * 1991-12-27 1994-10-18 Rudolf Hezel Solar cell and method for its manufacture
US5449413A (en) * 1993-05-12 1995-09-12 Optical Coating Laboratory, Inc. UV/IR reflecting solar cell cover
US5501743A (en) * 1994-08-11 1996-03-26 Cherney; Matthew Fiber optic power-generating system
US5540216A (en) * 1994-11-21 1996-07-30 Rasmusson; James K. Apparatus and method for concentrating radiant energy emanated by a moving energy source
US5733608A (en) * 1995-02-02 1998-03-31 Minnesota Mining And Manufacturing Company Method and apparatus for applying thin fluid coating stripes
USRE37512E1 (en) * 1995-02-21 2002-01-15 Interuniversitair Microelektronica Centrum (Imec) Vzw Method of preparing solar cell front contacts
US20010008230A1 (en) * 1996-07-08 2001-07-19 David M. Keicher Energy-beam-driven rapid fabrication system
US6008449A (en) * 1997-08-19 1999-12-28 Cole; Eric D. Reflective concentrating solar cell assembly
US6379521B1 (en) * 1998-01-06 2002-04-30 Canon Kabushiki Kaisha Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate
US6323415B1 (en) * 1998-09-18 2001-11-27 Hitachi, Ltd. Light concentrator photovoltaic module method of manufacturing same and light concentrator photovoltaic system
US6118067A (en) * 1998-11-20 2000-09-12 Swales Aerospace Method and apparatus for improved solar concentration arrays
US6203621B1 (en) * 1999-05-24 2001-03-20 Trw Inc. Vacuum chuck for holding thin sheet material
US6091017A (en) * 1999-08-23 2000-07-18 Composite Optics Incorporated Solar concentrator array
US6410843B1 (en) * 1999-11-22 2002-06-25 Sanyo Electric Co., Ltd. Solar cell module
US20030129810A1 (en) * 2000-05-30 2003-07-10 Barth Kurt L. Apparatus and processes for the mass production of photovoltaic modules
US6232217B1 (en) * 2000-06-05 2001-05-15 Chartered Semiconductor Manufacturing Ltd. Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening
US20020056473A1 (en) * 2000-11-16 2002-05-16 Mohan Chandra Making and connecting bus bars on solar cells
US20030015820A1 (en) * 2001-06-15 2003-01-23 Hidekazu Yamazaki Method of producing of cellulose ester film
US6531653B1 (en) * 2001-09-11 2003-03-11 The Boeing Company Low cost high solar flux photovoltaic concentrator receiver
US20030095175A1 (en) * 2001-11-16 2003-05-22 Applied Materials, Inc. Laser beam pattern generator having rotating scanner compensator and method
US20050253308A1 (en) * 2002-05-07 2005-11-17 3D System, Inc. Flash curing in selective deposition modeling
US20050029236A1 (en) * 2002-08-05 2005-02-10 Richard Gambino System and method for manufacturing embedded conformal electronics
US20040031517A1 (en) * 2002-08-13 2004-02-19 Bareis Bernard F. Concentrating solar energy receiver
US20050081908A1 (en) * 2003-03-19 2005-04-21 Stewart Roger G. Method and apparatus for generation of electrical power from solar energy
US20050000566A1 (en) * 2003-05-07 2005-01-06 Niels Posthuma Germanium solar cell and method for the production thereof
US20060231133A1 (en) * 2005-04-19 2006-10-19 Palo Alto Research Center Incorporated Concentrating solar collector with solid optical element
US20060266235A1 (en) * 2005-05-24 2006-11-30 Micron Technology, Inc. Supercritical fluid-assisted direct write for printing integrated circuits
US7394016B2 (en) * 2005-10-11 2008-07-01 Solyndra, Inc. Bifacial elongated solar cell devices with internal reflectors
US20080186593A1 (en) * 2007-02-02 2008-08-07 Sol Focus, Inc. Metal trace fabrication for optical element

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110079268A1 (en) * 2009-10-06 2011-04-07 Brightleaf Technologies, Inc. Solar collector and conversion array
US20110079269A1 (en) * 2009-10-06 2011-04-07 Brightleaf Technologies, Inc. Non-parabolic solar concentration to an area of controlled flux density conversion system and method
US9074795B2 (en) 2009-10-06 2015-07-07 Brightleaf Technologies, Inc. Solar collector and conversion array
US9231142B2 (en) 2009-10-06 2016-01-05 Brightleaf Technologies Inc. Non-parabolic solar concentration to an area of controlled flux density conversion system and method
US9231143B2 (en) 2009-10-06 2016-01-05 Brightleaf Technologies Inc. Non-parabolic solar concentration to an area of controlled flux density conversion system
US9692352B2 (en) 2009-10-06 2017-06-27 Brightleaf Technologies, Inc. Solar collector and conversion array
US20110146754A1 (en) * 2009-12-22 2011-06-23 Brightleaf Technologies, Inc. Solar conversion system having solar collector for forming a transposed image
US8695687B2 (en) 2010-12-10 2014-04-15 Palo Alto Research Center Incorporated Hybrid pin-fin micro heat pipe heat sink and method of fabrication
US8659042B2 (en) 2010-12-21 2014-02-25 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method
US8936954B2 (en) 2010-12-21 2015-01-20 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method

Also Published As

Publication number Publication date
EP2115781B1 (en) 2017-11-01
AU2008214229A1 (en) 2008-08-14
AU2008214228A1 (en) 2008-08-14
US20100294364A1 (en) 2010-11-25
EP2115781A4 (en) 2015-10-07
EP2115781A2 (en) 2009-11-11
JP2010518255A (en) 2010-05-27
JP5869204B2 (en) 2016-02-24
US20120305405A1 (en) 2012-12-06
US20080185039A1 (en) 2008-08-07
US8389851B2 (en) 2013-03-05
AU2008214228B2 (en) 2013-01-24
EP2115787A1 (en) 2009-11-11
US8624102B2 (en) 2014-01-07
WO2008097687A3 (en) 2008-10-02
US20090025789A1 (en) 2009-01-29
US20080186593A1 (en) 2008-08-07
JP2010518603A (en) 2010-05-27
US20110031211A1 (en) 2011-02-10
WO2008097687A2 (en) 2008-08-14

Similar Documents

Publication Publication Date Title
US20090025784A1 (en) Thermal spray for solar concentrator fabrication
US7638708B2 (en) Laminated solar concentrating photovoltaic device
US7906722B2 (en) Concentrating solar collector with solid optical element
US7851693B2 (en) Passively cooled solar concentrating photovoltaic device
US20070256725A1 (en) Solar Concentrating Photovoltaic Device With Resilient Cell Package Assembly
US20100236603A1 (en) Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Receivers and Methods of Forming Same
KR20080021706A (en) Concentrator photovoltaic device, pv concentrator module formed therefrom and production process therefor
CN115036390B (en) Preparation method of high-width-ratio increased welding spot column, electronic device and infrared detector
US20050205126A1 (en) Photovoltaic conversion device, its manufacturing method and solar energy system
US8574946B1 (en) Multi-element packaging of concentrator photovoltaic cells
WO2009090172A2 (en) Apparatus and method for manufacturing fast and low cost electrical contacts to solar modules
WO2008097688A1 (en) Thermal spray for solar concentrator fabrication
WO2008097805A2 (en) Conductor fabrication for optical element
Nakata et al. Performance of circular Fresnel lens photovoltaic concentrator
US20080203411A1 (en) Direct attachment of optically-active device to optical element
JP3849907B2 (en) Solar cell and method for manufacturing the same
JP2001274439A (en) Electrode forming method for spherical semiconductor device
WO2008097806A9 (en) Direct attachment of optically-active device to optical element

Legal Events

Date Code Title Description
AS Assignment

Owner name: PALO ALTO RESEARCH CENTER INCORPORATED, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FITCH, JOHN S.;WEISBERG, MICHAEL C.;DUFF, DAVID G.;REEL/FRAME:019958/0172

Effective date: 20070720

Owner name: SOLFOCUS, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHAN, HING WAH;REEL/FRAME:019958/0169

Effective date: 20070723

AS Assignment

Owner name: NEW ENTERPRISE ASSOCIATES 12 LIMITED PARTNERSHIP,

Free format text: SECURITY AGREEMENT;ASSIGNOR:SOLFOCUS, INC.;REEL/FRAME:023973/0826

Effective date: 20100222

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: SOLFOCUS, INC., CALIFORNIA

Free format text: RELEASE OF SECURITY INTEREST AT REEL/FRAME 023973/0826;ASSIGNOR:NEW ENTERPRISE ASSOCIATES 12 LIMITED PARTNERSHIP;REEL/FRAME:026464/0821

Effective date: 20100826

AS Assignment

Owner name: CPV SOLAR LLC C/O HARPER CONSTRUCTION COMPANY, INC

Free format text: SECURITY AGREEMENT;ASSIGNOR:SOLFOCUS, INC.;REEL/FRAME:029733/0583

Effective date: 20130201