US20080279658A1 - Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory - Google Patents
Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory Download PDFInfo
- Publication number
- US20080279658A1 US20080279658A1 US11/747,372 US74737207A US2008279658A1 US 20080279658 A1 US20080279658 A1 US 20080279658A1 US 74737207 A US74737207 A US 74737207A US 2008279658 A1 US2008279658 A1 US 2008279658A1
- Authority
- US
- United States
- Prior art keywords
- work
- end effector
- array end
- pieces
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims description 24
- 239000012636 effector Substances 0.000 claims description 138
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000003780 insertion Methods 0.000 description 26
- 230000037431 insertion Effects 0.000 description 26
- 238000003491 array Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/02—Gripping heads and other end effectors servo-actuated
- B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
- B25J15/0226—Gripping heads and other end effectors servo-actuated comprising articulated grippers actuated by cams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Definitions
- Embodiments of the present invention generally describe automated equipment for batch array work-piece handling and processing in a high productivity factory architecture sized for producing 1,000 or more work-pieces an hour and as high as 40,000 per hour or more.
- Solar energy from the sun may be converted to electricity by utilizing a solar power technology called photovoltaics (PV) that uses solar cells tiled into modules.
- PV photovoltaics
- Solar cells produce direct current electricity from the sun's rays, which can be used to power equipment, to recharge batteries, or be converted to AC power for on-grid applications.
- a processing tool may comprise one or more chambers coupled together.
- a processing tool that performs a vacuum based process may comprise one or more processing chambers and one or more load lock chambers coupled together.
- the processing tool may comprise one or more metrology chambers.
- the present invention generally comprises equipment for an automated high volume work-piece manufacturing architecture comprising array work-piece handling and array work-piece processing organized in a regular fashion from a group of lines comprising parallel channels.
- factory architecture supports a river of work-pieces comprising streams (lines) which are further sub-divided into one or more channels.
- Channels may operate in a continuous conveyor in some cases and in segmented piece-wise continuous batches in others.
- the batch array may be 1 or 2 dimensions, (i.e., 1 ⁇ n or n ⁇ m work-pieces).
- the work-pieces may be transported or presented to the equipment from a stacked supply to a parallel array of channels comprising a stream. Additionally, the work-pieces may be transferred between manufacturing architecture entities by an array to array batch transfer of channels. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation as opposed to one work-piece at a time.
- the robotic operations on the streams of work-pieces may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
- a work-piece batch transfer apparatus comprises a track extending between a plurality of chambers of a processing system, a first robot coupled with the track for movement on the track, a first array end effector disposed on the first robot, the first array end effector having a plurality of first fingers between which one or more work-pieces may be disposed, a second robot coupled with the track for movement along the track, and a second array end effector disposed on the second robot, the second array end effector having a plurality of second fingers and each of the second fingers aligned on a common axis with a corresponding first finger.
- a work-piece transfer method comprises moving a first array end effector having a plurality of work-pieces disposed thereon from a first load lock chamber into a processing chamber, the first array end effector moving along a track, elevating the plurality of work-pieces by raising a plurality of lift pins, retracting the first array end effector to the first load lock chamber along the track, moving a second array end effector from a second load lock chamber into the processing chamber along the track, lowering the plurality of lift pins to dispose the plurality of work-pieces on the second array end effector, and retracting the second array end effector to the second load lock chamber.
- a work-piece transfer method comprises moving a first array end effector along a track between a first load lock chamber and a processing chamber, the first array end effector having a plurality of first fingers having a plurality of work-pieces disposed therebetween, disposing the plurality of work-pieces on a plurality of lift pins in the processing chamber, retracting the first array end effector from the processing chamber, moving a second array end effector along the track between a second load lock chamber and the processing chamber, the second array end effector having a plurality of second fingers with each finger aligned along a common axis with a corresponding first finger, retrieving the plurality of work-pieces from the plurality of lift pins, and retracting the second array end effector from the processing chamber.
- FIG. 1 is a top view of a processing system according to an embodiment of the invention.
- FIG. 2 is a side view of the processing system of FIG. 1 .
- FIG. 3A is a front view of the processing system of FIG. 1 .
- FIG. 3B is a perspective view of the processing system of FIG. 1 showing the linear array of work-pieces picked up from the stack.
- FIGS. 4A-4D show a sequence of transferring a work-piece from a stack arrangement to a linear array arrangement according to an embodiment of the invention.
- FIGS. 5A-5C show a sequence of gripping a work-piece by the processing system according to an embodiment of the invention.
- FIG. 6 is a front view of the processing system of FIG. 1 having a plurality of work-pieces retrieved from a stack of work-pieces as a linear array.
- FIG. 7 is a top view of the processing system of FIG. 1 having a plurality of work-pieces positioned over an array end effector on the insertion robot.
- FIGS. 8A-8C show a sequence of disposing work-pieces onto the array end effector of the insertion robot according to an embodiment of the invention.
- FIG. 9A is a front view of a plurality of work-pieces being disposed onto the array end effector of the insertion robot according to an embodiment of the invention.
- FIG. 9B is a close up view of FIG. 9A .
- FIG. 10 is a top view of the processing system of FIG. 1 having the array end effector of the insertion robot partially inserted into the processing tool.
- FIG. 11 is top view of the processing system of FIG. 1 having the array end effector of the insertion robot inserted into the processing tool.
- FIGS. 12A-12D show a sequence of disposing the work-pieces onto the work-piece receivers in the processing tool according to an embodiment of the invention.
- FIG. 13 is a top view of the processing system of FIG. 1 having a plurality of work-pieces disposed within the processing tool and the array end effector of the insertion robot retracted to receive additional work-pieces.
- FIG. 14 is a top view of a processing system according to another embodiment of the invention.
- FIG. 15 is a top view of the array end effector of a transfer robot extending into the processing tool according to one embodiment of the invention.
- FIG. 16 a top view of the array end effector of the transfer robot of FIG. 15 having retrieved a plurality of work-pieces from the processing tool.
- FIG. 17 is a top view of the array end effector of the transfer robot of FIG. 16 rotating.
- FIG. 18 is a top view of the array end effector of the transfer robot of FIG. 17 rotated to insert the work-pieces into another processing tool.
- FIG. 19 is a top view of the array end effector of the transfer robot of FIG. 18 inserted into another processing tool.
- FIG. 20 is a top view of the processing system of FIG. 14 having the plurality of work-pieces disposed within another processing tool.
- FIG. 21 is a top view of the array end effector of a work-piece unloading robot extending into a processing tool to retrieve a plurality of work-pieces.
- FIG. 22 is a top view of the array end effector of the work-piece unloading robot unloading a plurality of work-pieces.
- FIGS. 23A and 23B are schematic views of a plurality of processing tools coupled together.
- FIG. 24 is a top view of a parallel to parallel transfer arrangement for a processing tool according to one embodiment of the invention.
- FIG. 25 is a top view of the processing tool of FIG. 24 with an array end effector extending into the processing chamber.
- FIG. 26 is a cross sectional view of FIG. 25 .
- FIG. 27 is a cross sectional view of the processing tool of FIG. 24 with the array end effector extending into the processing chamber.
- FIG. 28 is a cross sectional view of the processing tool of FIG. 24 with the work-pieces received on lift pins in the processing chamber.
- FIG. 29 is a cross sectional view of the processing tool of FIG. 24 with another array end effector entered into the processing chamber to retrieve the work-pieces.
- FIG. 30 is a top view of the processing tool of FIG. 24 with a plurality of work-pieces inserted into the processing chamber.
- FIG. 31 is a top view of the processing tool of FIG. 24 with a plurality of work-pieces retrieved from the processing chamber into the unload lock chamber.
- FIG. 32 is a schematic view of a FAB within which photovoltaic work-pieces may be processed.
- FIG. 32 shows a schematic view of a FAB, sometimes referred to as a factory, within which photovoltaic work-pieces may be processed by introducing the work-pieces to a processing line.
- Processing lines may alternatively be referred to as streams.
- a plurality of identical processing lines within a FAB may be referred to as a river.
- the work-pieces may initially be stacked one on top of another, but transferred from the stacked arrangement to an array arrangement before introduction to the processing line.
- the individual arrays within the processing lines or streams, arranged adjacent to each other as shown by the arrows, may be referred to as array channels.
- the work-pieces may be transferred between processing tools along a processing line or stream by an array to array transfer whereby an array of work-pieces may be transferred from one processing tool to another processing tool as an array rather than individually transferring the work-pieces one at a time.
- the various processing tools may include one or more metrology tools.
- the processing tool may be arranged in a flow through manner whereby the processing tools are arranged in a linear fashion, a flow-by arrangement whereby the processing tools are arranged in a non-linear fashion, or a combination of flow through and flow-by arrangements.
- the work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation.
- the robotic operations for the transfers may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
- work-pieces may be routed around the shut-down processing tool by transferring the work-pieces to an adjacent processing line within the FAB at an interchange node.
- the plurality of work-pieces may be transferred to other processing lines or streams through buffer or stocker stations.
- a buffer station may permit transfer between adjacent processing lines or streams while a stocker station may permit transfer between non-adjacent processing lines or streams.
- the buffer stations may additionally be used to store work-pieces while waiting to be disposed into the next processing tool.
- the work-pieces may be transferred back to the processing line containing the shut-down processing tool through buffer or stocker stations. After the processing within the processing line or stream is completed, the work-pieces may be transferred from an array arrangement back to a stack arrangement.
- the other processing lines within the FAB may increase their throughput in order to maintain a substantially constant optimum throughput for the FAB over a given period of time.
- the term array sometimes referred to as a matrix, may be understood to encompass an arrangement of work-pieces in an n ⁇ m manner where n ⁇ 1 and m ⁇ 1 where at least one or n or m is greater than 1.
- An array is a set of photovoltaic work-pieces laid out in tabular form, often in rows, columns, or rows and columns.
- a batch array is a group of arrays. Batch array transferring refers to transferring a group of arrays.
- FIG. 1 is a top view of a processing system 100 according to an embodiment of the invention.
- the processing system 100 may include a processing tool 102 , a stack-to-parallel loader robot 104 , and an insertion robot 106 .
- the processing tool 102 may comprise a plurality of walls 108 that may bound a processing space for the processing tool 102 . While only shown as one chamber, it is to be understood that the processing tool 102 refers to one or more chambers coupled together to accomplish one or more processing steps in a manufacturing process.
- the one or more chambers may comprise load lock chambers, processing chambers, metrology chambers, etc.
- the processing chambers may comprise chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, etching chambers, cleaning chambers, etc.
- the work-pieces, during processing, may be disposed on one or more receivers 110 within the processing tool 102 .
- the receivers 110 may comprise one or more lift pins or a plurality of rods that span the chamber.
- the work-pieces may comprise solar cell work-pieces.
- the work-pieces may be inserted into the processing tool 102 by an insertion robot 106 .
- the insertion robot 106 may be movable along a track 116 between a position where work-pieces may be disposed onto the insertion robot 106 and a position for disposing the work-pieces into the processing chamber 102 .
- the insertion robot 106 may comprise an array end effector having one or more fingers 112 that extend from a palm portion 114 .
- An end effector may comprise a device at the end of a robotic arm, designed to interact with an environment. The exact nature of the end effector depends on the application of the robot. The end effector is, in essence, the “hand” connected to a robot's arm which may retain the photovoltaic work-pieces.
- An array end effector is an end effector capable of retaining one or more arrays of photovoltaic work-pieces as opposed to a single work-piece.
- Each finger 112 may comprise one or more slots 126 for holding one or more work-pieces.
- the array end effector may comprise eight fingers 112 with each finger 112 comprising eight slots 126 .
- the slots 126 may be arranged on the array end effector to have a plurality of rows of slots 126 along the plurality of fingers 112 . While the invention is described below within regards to eight fingers 112 having eight slots 125 , it is to be understood that more or less fingers 112 having more or less slots 126 may be utilized depending upon the desired batch work-piece size and required equipment throughput.
- the work-pieces may be disposed onto the array end effector by a stack-to-parallel loader robot 104 .
- the loader robot 104 may comprise one or more work-piece retrievers 124 disposed on a bar 122 .
- the one or more work-piece retrievers 124 may comprise eight work-piece retrievers 124 .
- the bar 122 may be movable within a plane perpendicular to track 116 upon which the insertion robot 106 may move.
- the bar 122 may extend from a movement mechanism 120 that moves along a track 118 for positioning the work-piece retrievers 124 selectively over the work-pieces and the slots 126 on the fingers 112 of the array end effector.
- FIG. 2 is a side view of the processing system of FIG. 1 .
- the processing tool 102 may comprise a top 202 and bottom 204 .
- Sidewalls 218 that extend within a plane parallel to the track 118 upon which the bar 122 moves may extend between the top 202 and bottom 204 of the processing tool 102 .
- the sidewalls 218 may each comprise an opening 208 a , 208 b .
- the array end effector of the insertion robot 106 may enter the processing tool 102 through the opening 208 a to dispose the work-pieces within the processing tool 102 .
- another robot (not shown) may enter the processing tool 102 from the opening 208 b and retrieve the work-pieces after processing.
- the processing tool 102 may be elevated from the ground by a plurality of legs 206 .
- the track 118 upon which the movement mechanism 120 of the stack-to-parallel loader robot 104 moves may be positioned above the fingers 112 of the array end effector of the insertion robot 106 by a post 210 .
- the movement mechanism 120 may move the bar 122 upon which the one or more work-piece retrievers 124 are disposed over the fingers 112 of the array end effector as well as a stack of work-pieces 216 disposed in a work-piece dispenser 214 disposed on top of a post 212 .
- the stack of work-pieces 216 in the work-piece dispenser 214 saves valuable storage space because the work-pieces are vertically stacked within the work-piece dispenser 214 .
- the movement mechanism 120 positions the appropriate work-piece retriever 124 over the stack of work-pieces 216 as shown in FIG. 3A .
- An actuator 302 then moves the work-piece dispenser 214 vertically, as represented by arrow “A” shown in FIG. 3B , so that a work-piece 304 may be retrieved by the work-piece retriever 124 .
- the work-piece 304 once retrieved by the work-piece retriever 124 , may additionally be supported on the side by a side support 306 disposed adjacent the work-piece retrievers 124 .
- the side supports 306 may align the work-piece 304 within the work-piece retriever 124 .
- FIGS. 4A-4D show a sequence of transferring a work-piece 304 from a stack arrangement to a parallel arrangement according to an embodiment of the invention.
- a work-piece retriever 124 is initially disposed over a stack of work-pieces 216 disposed on the work-piece dispenser 214 ( FIG. 4A ). Although one retriever is depicted, more than one can operate at the same time.
- the work-piece dispenser 214 may then be vertically actuated as shown by arrow “B” by the actuator 302 ( FIG. 4B ).
- the work-piece dispenser 214 may extend upon one or more legs 402 .
- the work-piece retriever 124 may then grip the work-piece 304 ( FIG. 4C ). Following work-piece 304 retrieval by the work-piece retriever 124 , the work-piece dispenser 214 may lower down to the original position by the actuator 302 ( FIG. 4D ).
- FIGS. 5A-5C show a sequence of gripping a work-piece by the work-piece retrieval system according to an embodiment of the invention.
- the work-piece retriever 124 may comprise one or more arms 502 which extend out beyond the work-piece 304 .
- One or more grippers 504 may be disposed on the end of the arms 502 ( FIG. 5A ).
- the arms 502 close around the work-piece 304 enabling the grippers 504 to grip the work-piece 304 ( FIG. 5B ).
- the work-piece dispenser 214 retracts to the original, lowered position ( FIG. 5C ). Simultaneous with the work-piece dispenser 214 retraction, the side supports 306 adjacent the work-piece retriever 124 , lower to support/align the work-piece 304 from the side.
- the movement mechanism 120 moves the bar 122 along the track 118 as shown by arrow “C” ( FIG. 6 ).
- the work-piece retrievers 124 are each positioned over the work-piece dispenser 214 where each work-piece retriever 124 may retrieve a work-piece 304 .
- the work-piece retrievers 124 are linearly actuated with the bar 122 by the movement mechanism 120 , the work-piece retrievers 124 begin to be positioned over the fingers 112 of the array end effector.
- each work-piece retriever 124 has retrieved a work-piece 304 from the work-piece dispenser 214 , the movement mechanism 120 disposes each work-piece retriever 124 over a corresponding slot 126 on a finger 112 of the array end effector ( FIG. 7 ). The work-pieces 304 are then disposed within the slots 126 of the fingers 112 .
- FIGS. 8A-8C show a sequence of disposing work-pieces onto the array end effector of the insertion robot according to an embodiment of the invention.
- the work-pieces 304 on the work-piece retrievers 124 are initially disposed over the fingers 112 of the array end effector by the movement mechanism 120 ( FIG. 8A ).
- the fingers 112 and correspondingly the entire array end effector, elevates as shown by arrow “D” to engage the work-piece retrievers 124 ( FIG. 8B ).
- the grippers 504 on the end of the arms 502 of the work-piece retrievers 124 then release the work-pieces 304 into the slots 126 .
- the side supports 306 raise to their original position.
- the fingers 112 and correspondingly the entire array end effector, lower. After the fingers 112 lower, the insertion robot 106 then advances the array end effector as shown by arrow “E” so that the next row of slots 126 are disposed below the work-piece retrievers 124 .
- FIG. 9A is a front view of a plurality of work-pieces 304 being disposed onto the array end effector of the insertion robot 106 according to an embodiment of the invention.
- the insertion robot 106 moves the array end effector upward as shown by arrow “F” to meet the work-piece retrievers 124 .
- Each work-piece retriever 124 is disposed over a corresponding slot 126 of a corresponding finger 112 .
- FIG. 9B is a close up view of FIG. 9A .
- the work-pieces 304 are released into the slots 126 disposed on the fingers 112 .
- the array end effector of the insertion robot 106 begins to enter into the processing tool 102 through the opening 208 a as shown in FIG. 10 .
- the work-pieces 304 are disposed above the one or more work-piece receivers 110 disposed within the processing tool 102 .
- FIGS. 12A-12D show a sequence of disposing the work-pieces onto the work-piece receivers in the processing tool 102 according to an embodiment of the invention.
- the work-pieces 304 disposed on the fingers 112 are positioned within the processing tool 102 above the plurality of work-piece receivers 110 .
- FIG. 12A is a cross sectional view of the processing tool 102 having the fingers 112 and work-pieces 304 disposed therein.
- FIG. 12B shows a close-up view of the fingers 112 and work-pieces 304 within the processing tool 102 above the work-piece receivers 110 .
- the work-piece receivers 110 each have a notch 1202 within which the work-pieces 304 may rest once disposed on the work-piece receivers 110 .
- the fingers 112 then lower and the work-pieces 304 are supported from on their edges by the work-piece receivers 110 within the processing tool 102 ( FIG. 12C ).
- FIG. 12D when the fingers 112 are lowered, each work-piece rests on the work-piece receivers 110 .
- the edges of the work-pieces 304 may be disposed within the notches 1202 of the work-piece receivers 110 .
- the array end effector may be retracted by the insertion robot 106 along the track 116 from the processing tool 102 . While the work-pieces 304 are processed within the processing tool 102 , additional work-pieces 304 may be disposed onto the array end effector of the insertion robot 102 by the stack-to-parallel loader robot 104 . Following the completion of processing, the work-pieces 304 may be removed from the processing tool 102 through the slot 208 b by a robot having a similar arrangement as the insertion robot 106 .
- the work-pieces may be unloaded from the removing robot by a parallel-to-stack unloading robot similar to the stack-to-parallel loader robot 104 .
- the work-pieces 304 may be removed from the processing tool 102 after processing by the array end effector of the insertion robot 106 and unloaded from the array end effector of the insertion robot 106 by the stack-to-parallel loader robot 104 .
- FIG. 14 is a top view of a processing system 1400 according to another embodiment of the invention.
- the processing system 1400 includes a plurality of processing tools 1408 .
- a stack-to-parallel robot 1410 may load/unload work-pieces from a robot 1412 having an array end effector that inserts/removes a plurality of work-pieces from the processing tools 1408 .
- a transfer robot 1402 having an array end effector 1406 may retrieve a plurality of work-pieces from a processing tool 1408 and transfer the work-pieces 1408 to another processing tool 1408 .
- the transfer robot 1402 may move the array end effector 1406 between processing tools 1408 on a track 1404 .
- the array end effector 1406 may include a plurality of fingers 1414 .
- One or more slots 1416 may be present on each finger 1414 .
- One or more work-pieces may be disposed within the slots 1416 during work-piece transfer.
- each processing tool 1408 refers to one or more chambers coupled together to accomplish one or more processing steps in a manufacturing process.
- the one or more chambers may comprise load lock chambers, processing chambers, metrology chambers, etc.
- the processing chambers may comprise CVD chambers, PVD chambers, etching chambers, cleaning chambers, etc.
- the transfer robot 1402 may be surrounded by as many processing tools 1408 as will fit within the processing space. When more than two processing tools 1408 are present, it may be necessary to provide branches in the track 1404 to permit the array end effector 1406 of the transfer robot 1402 to access the additional processing tools 1408 .
- the array end effector 1406 of the transfer robot 1402 extends into a processing tool 1408 .
- the transfer robot 1402 moves the array end effector 1406 along the track 1404 such that the fingers 1414 of the array end effector 1406 extend into the processing tool 1408 under the plurality of work-pieces 1502 disposed in the processing tool 1408 .
- a slot 1416 on the fingers 1414 may be positioned underneath each work-piece 1502 disposed in the processing tool 1408 .
- the array end effector 1406 may retrieve the work-pieces in a manner similar to that discussed above in relation to FIGS. 12A-12D except that the sequence of retrieving the work-pieces 1502 may occur in the opposite order as compared to inserting the work-pieces. It should be noted that the transfer robot 1402 enables array to array transfer of the work-pieces 1502 between processing tools 1408 . Array to array transfer means maintaining the work-pieces within substantially the same plane while transferring the work-pieces from one processing tool to another processing tool.
- the robot 1402 retracts the array end effector 1406 from the processing tool 1408 as shown in FIG. 16 .
- the transfer robot 1402 may need to rotate the array end effector 1406 as shown by arrow “G” about an axis of rotation 1702 as shown in FIG. 17 .
- the array end effector 1406 may rotate about 180 degrees to a position for inserting the work-pieces into the processing tool 1408 as shown in FIG. 18 . It is to be understood that the amount that the array end effector 1406 may need to rotate will depend upon the location of the next processing tool 1408 .
- the work-pieces 1502 may be disposed onto a plurality of work-piece receivers 1802 .
- the transfer robot 1402 moves the array end effector 1406 along the track 1404 to extend the fingers 1414 into the processing tool 1408 as shown in FIG. 19 .
- the work-pieces 1502 may be disposed into the processing tool 1408 for processing.
- the robot 1402 retracts, rotates, and prepares the array end effector 1406 to retrieve additional work-pieces 1502 for further processing.
- Another robot 1412 having an array end effector positioned along a track 2002 prepares to retrieve the work-pieces 1502 from the processing tool 1408 as shown in FIG. 20 .
- the robot 1412 extends the array end effector into the processing tool 1408 and retrieves the work-pieces 1502 as shown in FIG. 21 .
- the work-pieces 1502 may be positioned in a plurality of slots 2202 (see FIG. 22 ) disposed on the plurality of fingers 2102 present on the array end effector of the robot 1412 .
- the work-pieces 1502 may be unloaded from the array end effector of the robot 1412 by a parallel-to-stack unloading robot 1410 .
- the unloading robot 1410 operates the same as the stack-to-parallel loader robot 104 discussed above in relation to FIGS. 1-13 , except that the unloading robot 1410 retrieves the work-pieces from a parallel orientation and stacks the work-pieces vertically.
- FIGS. 23A and 23B are schematic views of a plurality of processing tools coupled together in a FAB 2300 , 2350 .
- the processing lines 2302 , 2304 , 2306 , 2308 may be substantially identical with a plurality of processing tools 2312 arranged therein.
- Array end effectors 2318 may move along a common track 2310 for each processing line 2302 , 2304 , 2306 , 2308 with each array end effector 2318 able to access multiple processing tools 2312 .
- the array end effector 2318 may move either to the left as shown by arrow “J” or to the right as shown by arrow “K” along the track 2310 as shown by the array end effector 2318 in shadow.
- the array end effectors 2318 may also extend as shown by arrows “L” to access a processing tool 2312 or extend to access a buffer station 2314 to permit transfer of work-pieces between adjacent processing lines 2302 , 2304 , 2306 , 2308 .
- a stocker station 2316 may be used to transfer work-pieces.
- the stocker station 2316 may transfer work-pieces up and over to additional processing lines 2302 , 2304 , 2306 , 2308 or permit transfer over distances greater than an array end effector 2318 may extend.
- the processing lines 2352 , 2354 , 2356 , 2358 may be substantially identical with a plurality of processing tools 2362 arranged therein.
- Array end effectors 2358 may move along a track 2360 with each array end effector 2368 able to access multiple processing tools 2362 .
- the array end effector 2368 may move as shown by arrow “M” to access the processing tools 2362 or rotate and extend as shown by arrows “N” to a buffer station 2364 to permit transfer of work-pieces between adjacent processing lines 2352 , 2354 , 2356 , 2358 .
- a stocker station 2366 may be used to transfer work-pieces.
- the stocker station 2366 may transfer work-pieces up and over to additional processing lines 2352 , 2354 , 2356 , 2358 or permit transfer over distances greater than an array end effector 2368 may extend.
- FIG. 24 is a top view of a parallel to parallel transfer arrangement 2400 for a processing tool 2404 according to one embodiment of the invention.
- the arrangement 2400 includes an array end effector 2402 that may insert a plurality of work-pieces 2424 into a load lock chamber 2408 .
- the work-pieces 2424 may be received on receivers 2422 of an array end effector 2414 in the load lock chamber 2408 .
- the array end effector 2414 may then extend from the load lock chamber 2408 into the processing chamber 2412 .
- FIG. 25 is a top view of the processing tool of FIG. 24 with the array end effector 2414 extended into the processing chamber 2412 .
- the processing chamber 2412 may be one or more processing chambers 2412 and may comprise CVD chambers, PVD chambers, etching chambers, cleaning chambers, etc.
- FIG. 26 is a cross sectional view of FIG. 25 .
- a plurality of lift pins 2418 may be disposed.
- the lift pins 2418 may be disposed on a lift plate 2604 .
- the lift pins 2418 may raise as shown by arrows “H” to meet the plurality of work-pieces 2424 to lift the work-pieces 2424 from the receivers 2422 of the array end effector 2414 .
- the lift pins 2418 may comprise about 4 lift pins 2418 per work-piece 2424 .
- the lift pins 2418 may be disposed within the processing chamber 2412 such that the lift pins 2418 may be between the receivers 2422 of the array end effector 2414 .
- FIG. 27 is a cross sectional view of the processing tool of FIG. 24 with the array end effector extending into the processing chamber. After the lift pins 2418 raise the work-pieces 2424 from the array end effector 2414 , the array end effector retracts from the processing chamber 2412 along a track 2602 ( FIG. 28 ).
- FIG. 30 is a top view of the processing tool of FIG. 24 with a plurality of work-pieces inserted into the processing chamber. For clarity, the track is not shown within FIGS. 26-29 within the processing chamber 2412 , but it is to be understood that the track 2602 may extend within the processing chamber 2412 . If multiple processing chambers 2412 are present, the array end effector 2414 may extend along the track 2602 into multiple processing chambers 2412 .
- FIG. 29 is a cross sectional view of the processing tool arrangement 2400 of FIG. 24 with another array end effector 2416 entered into the processing chamber 2412 to retrieve the work-pieces 2424 .
- the array end effector 2416 may extend into the processing chamber 2412 from an unload lock chamber 2410 .
- the array end effector 2416 may comprise a plurality of receivers 2420 for receiving the plurality of work-pieces 2424 from the processing chamber 2412 .
- FIG. 31 is a top view of the processing tool of FIG. 24 with a plurality of work-pieces 2424 retrieved from the processing chamber 2412 into the unload lock chamber 2410 .
- the array end effector 2416 retrieves the work-pieces from the processing chamber 2412 , the work-pieces 2424 may then be retrieved from the unload lock chamber by another array end effector 2406 . The work-pieces may then be transferred to another processing tool or stored.
- Transferring the work-pieces from one processing tool to another by maintaining the work-pieces in a parallel orientation may improve work-piece throughput.
- By storing the work-pieces in a vertical stack and then loading the work-pieces parallel across an array end effector valuable space within a factory may be saved. Additionally, a great number of work-pieces may be loaded onto the array end effector for simultaneous processing within a processing tool.
- a parallel to parallel transfer of the work-pieces within a processing tool may permit multiple chambers to be coupled together within a processing tool.
- the present invention saves valuable floor space within a factory while providing a large work-piece throughput.
Abstract
The present invention generally comprises equipment for an automated high volume batch work-piece manufacturing factory comprising work-piece handling and work-piece processing in a high productivity factory architecture capable of producing 1,000 or more work-piece an hour. The work-pieces may be presented to the equipment from a stacked supply to a parallel array. Additionally, the work-pieces may be transferred between manufacturing architectures by an array to array batch transfer. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation. The robotic operations may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
Description
- This application is related to U.S. patent application Ser. No. ______ (Attorney Docket No. APPM/011215/NBD/NBNP/KCHANG), filed on an even date herewith, U.S. patent application Ser. No. ______ (Attorney Docket No. APPM/011212/NBD/NBNP/KCHANG), filed on an even date herewith, U.S. patent application Ser. No. ______ (Attorney Docket No. APPM/011213/NBD/NBNP/KCHANG), filed on an even date herewith. Each of the aforementioned patent applications is hereby incorporated by reference.
- 1. Field of the Invention
- Embodiments of the present invention generally describe automated equipment for batch array work-piece handling and processing in a high productivity factory architecture sized for producing 1,000 or more work-pieces an hour and as high as 40,000 per hour or more.
- 2. Description of the Related Art
- Solar energy from the sun may be converted to electricity by utilizing a solar power technology called photovoltaics (PV) that uses solar cells tiled into modules. Solar cells produce direct current electricity from the sun's rays, which can be used to power equipment, to recharge batteries, or be converted to AC power for on-grid applications.
- Increased productivity for manufacturing of PV cells and modules requires batch processing of multiple solar cell work-pieces simultaneously if supply is to meet customer demand. To produce the PV cells and modules, numerous processes may need to be performed upon a work-piece. The work-piece may thus need to be moved from one processing tool to another processing tool with an efficient method. A processing tool may comprise one or more chambers coupled together. For example, a processing tool that performs a vacuum based process may comprise one or more processing chambers and one or more load lock chambers coupled together. For a non-vacuum process such as metrology, the processing tool may comprise one or more metrology chambers.
- Therefore, there is a need in the art for achieving high productivity and low cost automated robotic handling of a plurality of solar cell work-pieces from one robotic device to another connecting process chambers and process equipment.
- The present invention generally comprises equipment for an automated high volume work-piece manufacturing architecture comprising array work-piece handling and array work-piece processing organized in a regular fashion from a group of lines comprising parallel channels. For descriptive purposes, factory architecture supports a river of work-pieces comprising streams (lines) which are further sub-divided into one or more channels. Channels may operate in a continuous conveyor in some cases and in segmented piece-wise continuous batches in others. The batch array may be 1 or 2 dimensions, (i.e., 1×n or n×m work-pieces).
- The work-pieces may be transported or presented to the equipment from a stacked supply to a parallel array of channels comprising a stream. Additionally, the work-pieces may be transferred between manufacturing architecture entities by an array to array batch transfer of channels. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation as opposed to one work-piece at a time. The robotic operations on the streams of work-pieces may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
- In one embodiment, a work-piece batch transfer apparatus is disclosed. The apparatus comprises a track extending between a plurality of chambers of a processing system, a first robot coupled with the track for movement on the track, a first array end effector disposed on the first robot, the first array end effector having a plurality of first fingers between which one or more work-pieces may be disposed, a second robot coupled with the track for movement along the track, and a second array end effector disposed on the second robot, the second array end effector having a plurality of second fingers and each of the second fingers aligned on a common axis with a corresponding first finger.
- In another embodiment, a work-piece transfer method is disclosed. The method comprises moving a first array end effector having a plurality of work-pieces disposed thereon from a first load lock chamber into a processing chamber, the first array end effector moving along a track, elevating the plurality of work-pieces by raising a plurality of lift pins, retracting the first array end effector to the first load lock chamber along the track, moving a second array end effector from a second load lock chamber into the processing chamber along the track, lowering the plurality of lift pins to dispose the plurality of work-pieces on the second array end effector, and retracting the second array end effector to the second load lock chamber.
- In yet another embodiment, a work-piece transfer method is disclosed. The method comprises moving a first array end effector along a track between a first load lock chamber and a processing chamber, the first array end effector having a plurality of first fingers having a plurality of work-pieces disposed therebetween, disposing the plurality of work-pieces on a plurality of lift pins in the processing chamber, retracting the first array end effector from the processing chamber, moving a second array end effector along the track between a second load lock chamber and the processing chamber, the second array end effector having a plurality of second fingers with each finger aligned along a common axis with a corresponding first finger, retrieving the plurality of work-pieces from the plurality of lift pins, and retracting the second array end effector from the processing chamber.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention with particular one and two dimensional arrays and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
-
FIG. 1 is a top view of a processing system according to an embodiment of the invention. -
FIG. 2 is a side view of the processing system ofFIG. 1 . -
FIG. 3A is a front view of the processing system ofFIG. 1 . -
FIG. 3B is a perspective view of the processing system ofFIG. 1 showing the linear array of work-pieces picked up from the stack. -
FIGS. 4A-4D show a sequence of transferring a work-piece from a stack arrangement to a linear array arrangement according to an embodiment of the invention. -
FIGS. 5A-5C show a sequence of gripping a work-piece by the processing system according to an embodiment of the invention. -
FIG. 6 is a front view of the processing system ofFIG. 1 having a plurality of work-pieces retrieved from a stack of work-pieces as a linear array. -
FIG. 7 is a top view of the processing system ofFIG. 1 having a plurality of work-pieces positioned over an array end effector on the insertion robot. -
FIGS. 8A-8C show a sequence of disposing work-pieces onto the array end effector of the insertion robot according to an embodiment of the invention. -
FIG. 9A is a front view of a plurality of work-pieces being disposed onto the array end effector of the insertion robot according to an embodiment of the invention. -
FIG. 9B is a close up view ofFIG. 9A . -
FIG. 10 is a top view of the processing system ofFIG. 1 having the array end effector of the insertion robot partially inserted into the processing tool. -
FIG. 11 is top view of the processing system ofFIG. 1 having the array end effector of the insertion robot inserted into the processing tool. -
FIGS. 12A-12D show a sequence of disposing the work-pieces onto the work-piece receivers in the processing tool according to an embodiment of the invention. -
FIG. 13 is a top view of the processing system ofFIG. 1 having a plurality of work-pieces disposed within the processing tool and the array end effector of the insertion robot retracted to receive additional work-pieces. -
FIG. 14 is a top view of a processing system according to another embodiment of the invention. -
FIG. 15 is a top view of the array end effector of a transfer robot extending into the processing tool according to one embodiment of the invention. -
FIG. 16 a top view of the array end effector of the transfer robot ofFIG. 15 having retrieved a plurality of work-pieces from the processing tool. -
FIG. 17 is a top view of the array end effector of the transfer robot ofFIG. 16 rotating. -
FIG. 18 is a top view of the array end effector of the transfer robot ofFIG. 17 rotated to insert the work-pieces into another processing tool. -
FIG. 19 is a top view of the array end effector of the transfer robot ofFIG. 18 inserted into another processing tool. -
FIG. 20 is a top view of the processing system ofFIG. 14 having the plurality of work-pieces disposed within another processing tool. -
FIG. 21 is a top view of the array end effector of a work-piece unloading robot extending into a processing tool to retrieve a plurality of work-pieces. -
FIG. 22 is a top view of the array end effector of the work-piece unloading robot unloading a plurality of work-pieces. -
FIGS. 23A and 23B are schematic views of a plurality of processing tools coupled together. -
FIG. 24 is a top view of a parallel to parallel transfer arrangement for a processing tool according to one embodiment of the invention. -
FIG. 25 is a top view of the processing tool ofFIG. 24 with an array end effector extending into the processing chamber. -
FIG. 26 is a cross sectional view ofFIG. 25 . -
FIG. 27 is a cross sectional view of the processing tool ofFIG. 24 with the array end effector extending into the processing chamber. -
FIG. 28 is a cross sectional view of the processing tool ofFIG. 24 with the work-pieces received on lift pins in the processing chamber. -
FIG. 29 is a cross sectional view of the processing tool ofFIG. 24 with another array end effector entered into the processing chamber to retrieve the work-pieces. -
FIG. 30 is a top view of the processing tool ofFIG. 24 with a plurality of work-pieces inserted into the processing chamber. -
FIG. 31 is a top view of the processing tool ofFIG. 24 with a plurality of work-pieces retrieved from the processing chamber into the unload lock chamber. -
FIG. 32 is a schematic view of a FAB within which photovoltaic work-pieces may be processed. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- The present invention generally comprises equipment for an automated high volume work-piece manufacturing architecture comprising work-piece handling and work-piece processing.
FIG. 32 shows a schematic view of a FAB, sometimes referred to as a factory, within which photovoltaic work-pieces may be processed by introducing the work-pieces to a processing line. Processing lines may alternatively be referred to as streams. A plurality of identical processing lines within a FAB may be referred to as a river. The work-pieces may initially be stacked one on top of another, but transferred from the stacked arrangement to an array arrangement before introduction to the processing line. The individual arrays within the processing lines or streams, arranged adjacent to each other as shown by the arrows, may be referred to as array channels. - The work-pieces may be transferred between processing tools along a processing line or stream by an array to array transfer whereby an array of work-pieces may be transferred from one processing tool to another processing tool as an array rather than individually transferring the work-pieces one at a time. The various processing tools may include one or more metrology tools. The processing tool may be arranged in a flow through manner whereby the processing tools are arranged in a linear fashion, a flow-by arrangement whereby the processing tools are arranged in a non-linear fashion, or a combination of flow through and flow-by arrangements. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation. The robotic operations for the transfers may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
- Whenever a processing tool within any processing line is shut-down, rather than shut-down the entire processing line containing the shut-down processing tool, work-pieces may be routed around the shut-down processing tool by transferring the work-pieces to an adjacent processing line within the FAB at an interchange node. The plurality of work-pieces may be transferred to other processing lines or streams through buffer or stocker stations. A buffer station may permit transfer between adjacent processing lines or streams while a stocker station may permit transfer between non-adjacent processing lines or streams. The buffer stations may additionally be used to store work-pieces while waiting to be disposed into the next processing tool. At a location after the shut-down processing tool, the work-pieces may be transferred back to the processing line containing the shut-down processing tool through buffer or stocker stations. After the processing within the processing line or stream is completed, the work-pieces may be transferred from an array arrangement back to a stack arrangement. During the time period that the processing tool is shut-down, the other processing lines within the FAB may increase their throughput in order to maintain a substantially constant optimum throughput for the FAB over a given period of time. As used throughout this application, the term array, sometimes referred to as a matrix, may be understood to encompass an arrangement of work-pieces in an n×m manner where n≧1 and m≧1 where at least one or n or m is greater than 1. An array is a set of photovoltaic work-pieces laid out in tabular form, often in rows, columns, or rows and columns. A batch array is a group of arrays. Batch array transferring refers to transferring a group of arrays.
- While the description herein may comprise a discussion of batch work-piece transfer within processing tools, array to array transfer of work-pieces between tools, and stack to array work-piece transferring, the claims that follow may be directed to batch work-piece transfer of photovoltaic work-pieces within processing tools.
-
FIG. 1 is a top view of aprocessing system 100 according to an embodiment of the invention. Theprocessing system 100 may include aprocessing tool 102, a stack-to-parallel loader robot 104, and aninsertion robot 106. Theprocessing tool 102 may comprise a plurality ofwalls 108 that may bound a processing space for theprocessing tool 102. While only shown as one chamber, it is to be understood that theprocessing tool 102 refers to one or more chambers coupled together to accomplish one or more processing steps in a manufacturing process. The one or more chambers may comprise load lock chambers, processing chambers, metrology chambers, etc. The processing chambers may comprise chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, etching chambers, cleaning chambers, etc. The work-pieces, during processing, may be disposed on one ormore receivers 110 within theprocessing tool 102. Thereceivers 110 may comprise one or more lift pins or a plurality of rods that span the chamber. In one embodiment, the work-pieces may comprise solar cell work-pieces. - The work-pieces may be inserted into the
processing tool 102 by aninsertion robot 106. Theinsertion robot 106 may be movable along atrack 116 between a position where work-pieces may be disposed onto theinsertion robot 106 and a position for disposing the work-pieces into theprocessing chamber 102. Theinsertion robot 106 may comprise an array end effector having one ormore fingers 112 that extend from apalm portion 114. An end effector may comprise a device at the end of a robotic arm, designed to interact with an environment. The exact nature of the end effector depends on the application of the robot. The end effector is, in essence, the “hand” connected to a robot's arm which may retain the photovoltaic work-pieces. An array end effector is an end effector capable of retaining one or more arrays of photovoltaic work-pieces as opposed to a single work-piece. Eachfinger 112 may comprise one ormore slots 126 for holding one or more work-pieces. In one embodiment, the array end effector may comprise eightfingers 112 with eachfinger 112 comprising eightslots 126. Theslots 126 may be arranged on the array end effector to have a plurality of rows ofslots 126 along the plurality offingers 112. While the invention is described below within regards to eightfingers 112 having eight slots 125, it is to be understood that more orless fingers 112 having more orless slots 126 may be utilized depending upon the desired batch work-piece size and required equipment throughput. - The work-pieces may be disposed onto the array end effector by a stack-to-
parallel loader robot 104. Theloader robot 104 may comprise one or more work-piece retrievers 124 disposed on abar 122. In one embodiment, the one or more work-piece retrievers 124 may comprise eight work-piece retrievers 124. Thebar 122 may be movable within a plane perpendicular to track 116 upon which theinsertion robot 106 may move. Thebar 122 may extend from amovement mechanism 120 that moves along atrack 118 for positioning the work-piece retrievers 124 selectively over the work-pieces and theslots 126 on thefingers 112 of the array end effector. -
FIG. 2 is a side view of the processing system ofFIG. 1 . As may be seen fromFIG. 2 , theprocessing tool 102 may comprise a top 202 andbottom 204.Sidewalls 218 that extend within a plane parallel to thetrack 118 upon which thebar 122 moves may extend between the top 202 andbottom 204 of theprocessing tool 102. Thesidewalls 218 may each comprise anopening insertion robot 106 may enter theprocessing tool 102 through the opening 208 a to dispose the work-pieces within theprocessing tool 102. Similarly, another robot (not shown) may enter theprocessing tool 102 from theopening 208 b and retrieve the work-pieces after processing. Theprocessing tool 102 may be elevated from the ground by a plurality oflegs 206. - The
track 118 upon which themovement mechanism 120 of the stack-to-parallel loader robot 104 moves may be positioned above thefingers 112 of the array end effector of theinsertion robot 106 by apost 210. Themovement mechanism 120 may move thebar 122 upon which the one or more work-piece retrievers 124 are disposed over thefingers 112 of the array end effector as well as a stack of work-pieces 216 disposed in a work-piece dispenser 214 disposed on top of apost 212. The stack of work-pieces 216 in the work-piece dispenser 214 saves valuable storage space because the work-pieces are vertically stacked within the work-piece dispenser 214. - During processing, the
movement mechanism 120 positions the appropriate work-piece retriever 124 over the stack of work-pieces 216 as shown inFIG. 3A . Anactuator 302 then moves the work-piece dispenser 214 vertically, as represented by arrow “A” shown inFIG. 3B , so that a work-piece 304 may be retrieved by the work-piece retriever 124. The work-piece 304, once retrieved by the work-piece retriever 124, may additionally be supported on the side by aside support 306 disposed adjacent the work-piece retrievers 124. The side supports 306 may align the work-piece 304 within the work-piece retriever 124. -
FIGS. 4A-4D show a sequence of transferring a work-piece 304 from a stack arrangement to a parallel arrangement according to an embodiment of the invention. A work-piece retriever 124 is initially disposed over a stack of work-pieces 216 disposed on the work-piece dispenser 214 (FIG. 4A ). Although one retriever is depicted, more than one can operate at the same time. The work-piece dispenser 214 may then be vertically actuated as shown by arrow “B” by the actuator 302 (FIG. 4B ). The work-piece dispenser 214 may extend upon one ormore legs 402. The work-piece retriever 124 may then grip the work-piece 304 (FIG. 4C ). Following work-piece 304 retrieval by the work-piece retriever 124, the work-piece dispenser 214 may lower down to the original position by the actuator 302 (FIG. 4D ). -
FIGS. 5A-5C show a sequence of gripping a work-piece by the work-piece retrieval system according to an embodiment of the invention. The work-piece retriever 124 may comprise one ormore arms 502 which extend out beyond the work-piece 304. One ormore grippers 504 may be disposed on the end of the arms 502 (FIG. 5A ). Once the work-piece dispenser 214 is raised to meet the work-piece retriever 124, thearms 502 close around the work-piece 304 enabling thegrippers 504 to grip the work-piece 304 (FIG. 5B ). Once the work-piece 304 is effectively gripped, the work-piece dispenser 214 retracts to the original, lowered position (FIG. 5C ). Simultaneous with the work-piece dispenser 214 retraction, the side supports 306 adjacent the work-piece retriever 124, lower to support/align the work-piece 304 from the side. - After each work-
piece 304 is retrieved, themovement mechanism 120 moves thebar 122 along thetrack 118 as shown by arrow “C” (FIG. 6 ). The work-piece retrievers 124 are each positioned over the work-piece dispenser 214 where each work-piece retriever 124 may retrieve a work-piece 304. As the work-piece retrievers 124 are linearly actuated with thebar 122 by themovement mechanism 120, the work-piece retrievers 124 begin to be positioned over thefingers 112 of the array end effector. - Once each work-
piece retriever 124 has retrieved a work-piece 304 from the work-piece dispenser 214, themovement mechanism 120 disposes each work-piece retriever 124 over acorresponding slot 126 on afinger 112 of the array end effector (FIG. 7 ). The work-pieces 304 are then disposed within theslots 126 of thefingers 112. -
FIGS. 8A-8C show a sequence of disposing work-pieces onto the array end effector of the insertion robot according to an embodiment of the invention. The work-pieces 304 on the work-piece retrievers 124 are initially disposed over thefingers 112 of the array end effector by the movement mechanism 120 (FIG. 8A ). Thefingers 112, and correspondingly the entire array end effector, elevates as shown by arrow “D” to engage the work-piece retrievers 124 (FIG. 8B ). Thegrippers 504 on the end of thearms 502 of the work-piece retrievers 124 then release the work-pieces 304 into theslots 126. As the work-piece retrievers 124 release the work-pieces 304, the side supports 306 raise to their original position. Thefingers 112, and correspondingly the entire array end effector, lower. After thefingers 112 lower, theinsertion robot 106 then advances the array end effector as shown by arrow “E” so that the next row ofslots 126 are disposed below the work-piece retrievers 124. -
FIG. 9A is a front view of a plurality of work-pieces 304 being disposed onto the array end effector of theinsertion robot 106 according to an embodiment of the invention. As may be seen fromFIG. 9A , theinsertion robot 106 moves the array end effector upward as shown by arrow “F” to meet the work-piece retrievers 124. Each work-piece retriever 124 is disposed over acorresponding slot 126 of acorresponding finger 112.FIG. 9B is a close up view ofFIG. 9A . The work-pieces 304 are released into theslots 126 disposed on thefingers 112. - As more and more work-
pieces 304 are retrieved by the work-piece retrievers 124 on the stack-to-parallel loader robot 104, the array end effector of theinsertion robot 106 begins to enter into theprocessing tool 102 through the opening 208 a as shown inFIG. 10 . As the array end effector begins to enter theprocessing tool 102, the work-pieces 304 are disposed above the one or more work-piece receivers 110 disposed within theprocessing tool 102. - After all of the work-pieces have been disposed into the
processing tool 102 by the insertion robot 106 (FIG. 11 ), the work-pieces may then be disposed onto the work-piece receivers 110 disposed within theprocessing tool 102.FIGS. 12A-12D show a sequence of disposing the work-pieces onto the work-piece receivers in theprocessing tool 102 according to an embodiment of the invention. The work-pieces 304 disposed on thefingers 112 are positioned within theprocessing tool 102 above the plurality of work-piece receivers 110.FIG. 12A is a cross sectional view of theprocessing tool 102 having thefingers 112 and work-pieces 304 disposed therein.FIG. 12B shows a close-up view of thefingers 112 and work-pieces 304 within theprocessing tool 102 above the work-piece receivers 110. The work-piece receivers 110 each have anotch 1202 within which the work-pieces 304 may rest once disposed on the work-piece receivers 110. Thefingers 112 then lower and the work-pieces 304 are supported from on their edges by the work-piece receivers 110 within the processing tool 102 (FIG. 12C ). As may be seen inFIG. 12D , when thefingers 112 are lowered, each work-piece rests on the work-piece receivers 110. The edges of the work-pieces 304 may be disposed within thenotches 1202 of the work-piece receivers 110. - Once the work-
pieces 304 have been disposed within theprocessing tool 102, the array end effector may be retracted by theinsertion robot 106 along thetrack 116 from theprocessing tool 102. While the work-pieces 304 are processed within theprocessing tool 102, additional work-pieces 304 may be disposed onto the array end effector of theinsertion robot 102 by the stack-to-parallel loader robot 104. Following the completion of processing, the work-pieces 304 may be removed from theprocessing tool 102 through theslot 208 b by a robot having a similar arrangement as theinsertion robot 106. The work-pieces may be unloaded from the removing robot by a parallel-to-stack unloading robot similar to the stack-to-parallel loader robot 104. In one embodiment, the work-pieces 304 may be removed from theprocessing tool 102 after processing by the array end effector of theinsertion robot 106 and unloaded from the array end effector of theinsertion robot 106 by the stack-to-parallel loader robot 104. -
FIG. 14 is a top view of aprocessing system 1400 according to another embodiment of the invention. Theprocessing system 1400 includes a plurality ofprocessing tools 1408. A stack-to-parallel robot 1410 may load/unload work-pieces from arobot 1412 having an array end effector that inserts/removes a plurality of work-pieces from theprocessing tools 1408. Atransfer robot 1402 having anarray end effector 1406 may retrieve a plurality of work-pieces from aprocessing tool 1408 and transfer the work-pieces 1408 to anotherprocessing tool 1408. Thetransfer robot 1402 may move thearray end effector 1406 betweenprocessing tools 1408 on atrack 1404. Thearray end effector 1406 may include a plurality offingers 1414. One ormore slots 1416 may be present on eachfinger 1414. One or more work-pieces may be disposed within theslots 1416 during work-piece transfer. - It should be understood that while only two
processing tools 1408 have been exemplified,more processing tools 1408 are possible. Additionally, eachprocessing tool 1408 refers to one or more chambers coupled together to accomplish one or more processing steps in a manufacturing process. The one or more chambers may comprise load lock chambers, processing chambers, metrology chambers, etc. The processing chambers may comprise CVD chambers, PVD chambers, etching chambers, cleaning chambers, etc. - The
transfer robot 1402 may be surrounded by asmany processing tools 1408 as will fit within the processing space. When more than twoprocessing tools 1408 are present, it may be necessary to provide branches in thetrack 1404 to permit thearray end effector 1406 of thetransfer robot 1402 to access theadditional processing tools 1408. - As may be seen in
FIG. 15 , thearray end effector 1406 of thetransfer robot 1402 extends into aprocessing tool 1408. Thetransfer robot 1402 moves thearray end effector 1406 along thetrack 1404 such that thefingers 1414 of thearray end effector 1406 extend into theprocessing tool 1408 under the plurality of work-pieces 1502 disposed in theprocessing tool 1408. Aslot 1416 on thefingers 1414 may be positioned underneath each work-piece 1502 disposed in theprocessing tool 1408. - The
array end effector 1406 may retrieve the work-pieces in a manner similar to that discussed above in relation toFIGS. 12A-12D except that the sequence of retrieving the work-pieces 1502 may occur in the opposite order as compared to inserting the work-pieces. It should be noted that thetransfer robot 1402 enables array to array transfer of the work-pieces 1502 betweenprocessing tools 1408. Array to array transfer means maintaining the work-pieces within substantially the same plane while transferring the work-pieces from one processing tool to another processing tool. - Once the
array end effector 1406 has retrieved the work-pieces 1502, therobot 1402 retracts thearray end effector 1406 from theprocessing tool 1408 as shown inFIG. 16 . To dispose the work-pieces 1502 into anotherprocessing tool 1408, thetransfer robot 1402 may need to rotate thearray end effector 1406 as shown by arrow “G” about an axis of rotation 1702 as shown inFIG. 17 . In one embodiment, thearray end effector 1406 may rotate about 180 degrees to a position for inserting the work-pieces into theprocessing tool 1408 as shown inFIG. 18 . It is to be understood that the amount that thearray end effector 1406 may need to rotate will depend upon the location of thenext processing tool 1408. Upon insertion, the work-pieces 1502 may be disposed onto a plurality of work-piece receivers 1802. - Once the
array end effector 1406 is in position, thetransfer robot 1402 moves thearray end effector 1406 along thetrack 1404 to extend thefingers 1414 into theprocessing tool 1408 as shown inFIG. 19 . The work-pieces 1502 may be disposed into theprocessing tool 1408 for processing. Once the work-pieces 1502 are disposed in theprocessing tool 1408, therobot 1402 retracts, rotates, and prepares thearray end effector 1406 to retrieve additional work-pieces 1502 for further processing. Anotherrobot 1412 having an array end effector positioned along atrack 2002 prepares to retrieve the work-pieces 1502 from theprocessing tool 1408 as shown inFIG. 20 . - The
robot 1412 extends the array end effector into theprocessing tool 1408 and retrieves the work-pieces 1502 as shown inFIG. 21 . The work-pieces 1502 may be positioned in a plurality of slots 2202 (seeFIG. 22 ) disposed on the plurality offingers 2102 present on the array end effector of therobot 1412. The work-pieces 1502 may be unloaded from the array end effector of therobot 1412 by a parallel-to-stack unloading robot 1410. Theunloading robot 1410 operates the same as the stack-to-parallel loader robot 104 discussed above in relation toFIGS. 1-13 , except that theunloading robot 1410 retrieves the work-pieces from a parallel orientation and stacks the work-pieces vertically. -
FIGS. 23A and 23B are schematic views of a plurality of processing tools coupled together in aFAB FAB 2300, theprocessing lines processing tools 2312 arranged therein.Array end effectors 2318 may move along acommon track 2310 for eachprocessing line array end effector 2318 able to accessmultiple processing tools 2312. Thearray end effector 2318 may move either to the left as shown by arrow “J” or to the right as shown by arrow “K” along thetrack 2310 as shown by thearray end effector 2318 in shadow. Thearray end effectors 2318 may also extend as shown by arrows “L” to access aprocessing tool 2312 or extend to access abuffer station 2314 to permit transfer of work-pieces betweenadjacent processing lines processing lines processing lines stocker station 2316 may be used to transfer work-pieces. Thestocker station 2316 may transfer work-pieces up and over toadditional processing lines array end effector 2318 may extend. - Similarly, for a linearly arranged
FAB 2350, theprocessing lines processing tools 2362 arranged therein.Array end effectors 2358 may move along a track 2360 with eacharray end effector 2368 able to accessmultiple processing tools 2362. Thearray end effector 2368 may move as shown by arrow “M” to access theprocessing tools 2362 or rotate and extend as shown by arrows “N” to abuffer station 2364 to permit transfer of work-pieces betweenadjacent processing lines processing lines stocker station 2366 may be used to transfer work-pieces. Thestocker station 2366 may transfer work-pieces up and over toadditional processing lines array end effector 2368 may extend. -
FIG. 24 is a top view of a parallel toparallel transfer arrangement 2400 for aprocessing tool 2404 according to one embodiment of the invention. Thearrangement 2400 includes anarray end effector 2402 that may insert a plurality of work-pieces 2424 into aload lock chamber 2408. The work-pieces 2424 may be received onreceivers 2422 of anarray end effector 2414 in theload lock chamber 2408. Thearray end effector 2414 may then extend from theload lock chamber 2408 into theprocessing chamber 2412.FIG. 25 is a top view of the processing tool ofFIG. 24 with thearray end effector 2414 extended into theprocessing chamber 2412. Theprocessing chamber 2412 may be one ormore processing chambers 2412 and may comprise CVD chambers, PVD chambers, etching chambers, cleaning chambers, etc. -
FIG. 26 is a cross sectional view ofFIG. 25 . Within theprocessing chamber 2412, a plurality oflift pins 2418 may be disposed. The lift pins 2418 may be disposed on alift plate 2604. The lift pins 2418 may raise as shown by arrows “H” to meet the plurality of work-pieces 2424 to lift the work-pieces 2424 from thereceivers 2422 of thearray end effector 2414. In one embodiment, the lift pins 2418 may comprise about 4lift pins 2418 per work-piece 2424. The lift pins 2418 may be disposed within theprocessing chamber 2412 such that the lift pins 2418 may be between thereceivers 2422 of thearray end effector 2414. -
FIG. 27 is a cross sectional view of the processing tool ofFIG. 24 with the array end effector extending into the processing chamber. After the lift pins 2418 raise the work-pieces 2424 from thearray end effector 2414, the array end effector retracts from theprocessing chamber 2412 along a track 2602 (FIG. 28 ).FIG. 30 is a top view of the processing tool ofFIG. 24 with a plurality of work-pieces inserted into the processing chamber. For clarity, the track is not shown withinFIGS. 26-29 within theprocessing chamber 2412, but it is to be understood that thetrack 2602 may extend within theprocessing chamber 2412. Ifmultiple processing chambers 2412 are present, thearray end effector 2414 may extend along thetrack 2602 intomultiple processing chambers 2412. - After processing, the work-
pieces 2424 may be removed from theprocessing chamber 2412.FIG. 29 is a cross sectional view of theprocessing tool arrangement 2400 ofFIG. 24 with anotherarray end effector 2416 entered into theprocessing chamber 2412 to retrieve the work-pieces 2424. Thearray end effector 2416 may extend into theprocessing chamber 2412 from an unloadlock chamber 2410. Thearray end effector 2416 may comprise a plurality ofreceivers 2420 for receiving the plurality of work-pieces 2424 from theprocessing chamber 2412.FIG. 31 is a top view of the processing tool ofFIG. 24 with a plurality of work-pieces 2424 retrieved from theprocessing chamber 2412 into the unloadlock chamber 2410. After thearray end effector 2416 retrieves the work-pieces from theprocessing chamber 2412, the work-pieces 2424 may then be retrieved from the unload lock chamber by anotherarray end effector 2406. The work-pieces may then be transferred to another processing tool or stored. - Transferring the work-pieces from one processing tool to another by maintaining the work-pieces in a parallel orientation may improve work-piece throughput. By storing the work-pieces in a vertical stack and then loading the work-pieces parallel across an array end effector, valuable space within a factory may be saved. Additionally, a great number of work-pieces may be loaded onto the array end effector for simultaneous processing within a processing tool. A parallel to parallel transfer of the work-pieces within a processing tool may permit multiple chambers to be coupled together within a processing tool. Thus, the present invention saves valuable floor space within a factory while providing a large work-piece throughput.
- While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
1. A photovoltaic work-piece batch transfer apparatus for transferring photovoltaic work-pieces within a processing tool, comprising:
a track extending between a plurality of chambers of a processing tool;
a first robot coupled with the track for movement on the track;
a first array end effector disposed on the first robot, the first array end effector having a plurality of first fingers between which one or more work-pieces may be disposed, whereby the first array end effector may translate along the track between a plurality of chambers within the processing tool;
a second robot coupled with the track for movement along the track; and
a second array end effector disposed on the second robot, the second array end effector having a plurality of second fingers and each of the second fingers aligned on a common axis with a corresponding first finger, whereby the second array end effector may translate along the same track as the first array end effector between a plurality of chambers within the processing tool, and whereby the second array end effector and the first array end effector may each translate into a common chamber.
2. The apparatus of claim 1 , further comprising:
a plurality of lift pins capable of raising up to raise the photovoltaic work-pieces from the first array end effector or the second array end effector, the plurality of lift pins disposed within the common chamber.
3. The apparatus of claim 2 , wherein the plurality of lift pins are disposed at a location corresponding to an area between adjacent fingers of the plurality of first fingers and the plurality of second fingers.
4. The apparatus of claim 1 , wherein the plurality of first fingers are coupled together at a first hand portion of the first array end effector.
5. The apparatus of claim 4 , wherein the plurality of first fingers extend above the first hand portion.
6. The apparatus of claim 1 , wherein the plurality of second fingers are coupled together at a second hand portion of the second array end effector.
7. The apparatus of claim 6 , wherein the plurality of second fingers extend above the second hand portion.
8. A photovoltaic work-piece transfer method, comprising:
moving a first array end effector having a plurality of work-pieces disposed thereon from a first load lock chamber into a processing chamber, the first array end effector moving along a track;
elevating the plurality of work-pieces from the first array end effector by raising a plurality of lift pins;
retracting the first array end effector to the first load lock chamber along the track;
moving a second array end effector from a second load lock chamber into the processing chamber along the track;
lowering the plurality of lift pins to dispose the plurality of work-pieces on the second array end effector; and
retracting the second array end effector to the second load lock chamber.
9. The method of claim 8 , wherein the track is disposed within both the first load lock chamber and the processing chamber.
10. The method of claim 8 , wherein the track is disposed within the first load lock chamber, the second load lock chamber, and the processing chamber.
11. The method of claim 10 , wherein the track is linear between the first load lock chamber, the processing chamber, and the second load lock chamber.
12. The method of claim 8 , wherein the retracting the second array end effector comprises retracting the second array end effector along the track.
13. The method of claim 8 , wherein the first array end effector comprises a plurality of fingers extending therefrom, and wherein each of the plurality of work-pieces is coupled with a plurality of the fingers.
14. The method of claim 13 , wherein each of the plurality of fingers are aligned on a common axis with a corresponding finger on the second array end effector.
15. A photovoltaic work-piece transfer method, comprising:
moving a first array end effector along a track between a first load lock chamber and a processing chamber, the first array end effector having a plurality of first fingers having a plurality of work-pieces disposed therebetween;
disposing the plurality of work-pieces on a plurality of lift pins in the processing chamber;
retracting the first array end effector from the processing chamber;
moving a second array end effector along the track between a second load lock chamber and the processing chamber, the second array end effector having a plurality of second fingers with each second finger aligned along a common axis with a corresponding first finger;
retrieving the plurality of work-pieces from the plurality of lift pins; and
retracting the second array end effector from the processing chamber.
16. The method of claim 15 , wherein the track is disposed within the first load lock chamber, the second load lock chamber, and the processing chamber.
17. The method of claim 16 , wherein the track is linear between the first load lock chamber, the processing chamber, and the second load lock chamber.
18. The method of claim 15 , wherein the disposing comprises raising the plurality of lift pins to raise the plurality of work-pieces above the plurality of first fingers.
19. The method of claim 18 , wherein each work-piece is raised by a plurality of lift pins.
20. The method of claim 19 , wherein the plurality of lift pins are disposed at a location corresponding to an area between adjacent fingers of the plurality of first fingers and the plurality of second fingers.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/747,372 US20080279658A1 (en) | 2007-05-11 | 2007-05-11 | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
CN200880018087A CN101680084A (en) | 2007-05-11 | 2008-05-09 | Batch equipment robotic arm and method during the equipment work-piece of photovoltaic factory transmits |
TW097117269A TW200903829A (en) | 2007-05-11 | 2008-05-09 | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
PCT/US2008/063259 WO2008141191A1 (en) | 2007-05-11 | 2008-05-09 | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/747,372 US20080279658A1 (en) | 2007-05-11 | 2007-05-11 | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080279658A1 true US20080279658A1 (en) | 2008-11-13 |
Family
ID=39969679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/747,372 Abandoned US20080279658A1 (en) | 2007-05-11 | 2007-05-11 | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080279658A1 (en) |
CN (1) | CN101680084A (en) |
TW (1) | TW200903829A (en) |
WO (1) | WO2008141191A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180282864A1 (en) * | 2017-03-28 | 2018-10-04 | Lawrence Chung-Lai Lei | Apparatus and method of turning over a substrate in a substrate processing system |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105150227A (en) * | 2015-04-08 | 2015-12-16 | 吴明杰 | Manipulator |
Citations (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4237598A (en) * | 1965-09-13 | 1980-12-09 | Molins Limited | Manufacturing processes using machine tools |
US4668365A (en) * | 1984-10-25 | 1987-05-26 | Applied Materials, Inc. | Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition |
US4875327A (en) * | 1988-11-29 | 1989-10-24 | Applied Material Handling, Inc. | Container filling apparatus and method |
US5046909A (en) * | 1989-06-29 | 1991-09-10 | Applied Materials, Inc. | Method and apparatus for handling semiconductor wafers |
US5174707A (en) * | 1989-06-30 | 1992-12-29 | Ohbayashi Corp. | Three-dimensional manufacturing and assembly plant |
US5183370A (en) * | 1989-12-29 | 1993-02-02 | Commissariat A L'energie Atomique | Apparatus for placing or storing flat articles in a cassette with intermediate racks |
US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
US5462080A (en) * | 1993-08-31 | 1995-10-31 | Applied Materials, Inc. | Heated removable throttle valve |
US5525024A (en) * | 1994-08-17 | 1996-06-11 | Applied Materials, Inc. | Cassette loader having compound translational motion |
US5700127A (en) * | 1995-06-27 | 1997-12-23 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
US5810549A (en) * | 1996-04-17 | 1998-09-22 | Applied Materials, Inc. | Independent linear dual-blade robot and method for transferring wafers |
US5882165A (en) * | 1986-12-19 | 1999-03-16 | Applied Materials, Inc. | Multiple chamber integrated process system |
US5957648A (en) * | 1996-12-11 | 1999-09-28 | Applied Materials, Inc. | Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers |
US6016611A (en) * | 1998-07-13 | 2000-01-25 | Applied Komatsu Technology, Inc. | Gas flow control in a substrate processing system |
US6134482A (en) * | 1997-10-15 | 2000-10-17 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for controlling semiconductor wafer fabrication equipment based on a remaining process time applicable to the processors |
US6158941A (en) * | 1995-10-27 | 2000-12-12 | Brooks Automation, Inc. | Substrate transport apparatus with double substrate holders |
US6238161B1 (en) * | 1997-09-05 | 2001-05-29 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
US6267851B1 (en) * | 1999-10-28 | 2001-07-31 | Applied Komatsu Technology, Inc. | Tilted sputtering target with shield to block contaminants |
US20010015074A1 (en) * | 1999-11-03 | 2001-08-23 | Applied Materials, Inc. | Consecutive deposition system |
US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
US6287386B1 (en) * | 1997-06-04 | 2001-09-11 | Applied Materials, Inc. | Carousel wafer transfer system |
US20010024609A1 (en) * | 1998-05-20 | 2001-09-27 | Applied Materials, Inc. | Method and apparatus for substrate transfer and processing |
US6298685B1 (en) * | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US6308932B1 (en) * | 1998-05-20 | 2001-10-30 | Applied Komatsu Technology, Inc. | Isolation valves |
US20010041122A1 (en) * | 1998-09-28 | 2001-11-15 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
US6359250B1 (en) * | 1998-07-13 | 2002-03-19 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6371712B1 (en) * | 1999-09-21 | 2002-04-16 | Applied Komatsu Technology, Inc. | Support frame for substrates |
US6406359B1 (en) * | 1999-06-01 | 2002-06-18 | Applied Materials, Inc. | Apparatus for transferring semiconductor substrates using an input module |
US20020090282A1 (en) * | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
US20020096114A1 (en) * | 2001-01-22 | 2002-07-25 | Applied Materials, Inc. | Series chamber for substrate processing |
US6430468B1 (en) * | 2000-11-17 | 2002-08-06 | Applied Materials, Inc. | Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber |
US6435868B2 (en) * | 1998-05-20 | 2002-08-20 | Applied Komatsu Technology, Inc. | Multi-function chamber for a substrate processing system |
US6471459B2 (en) * | 1998-05-20 | 2002-10-29 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6477980B1 (en) * | 2000-01-20 | 2002-11-12 | Applied Materials, Inc. | Flexibly suspended gas distribution manifold for plasma chamber |
US20020187024A1 (en) * | 2001-06-12 | 2002-12-12 | Applied Materials, Inc. | Apparatus for storing and moving a carrier |
US6506693B2 (en) * | 1997-07-28 | 2003-01-14 | Applied Materials, Inc. | Multiple loadlock system |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6520839B1 (en) * | 1997-09-10 | 2003-02-18 | Speedfam-Ipec Corporation | Load and unload station for semiconductor wafers |
US6540466B2 (en) * | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6572321B1 (en) * | 2000-10-05 | 2003-06-03 | Applied Materials, Inc. | Loader conveyor for substrate processing system |
US20030141820A1 (en) * | 2002-01-30 | 2003-07-31 | Applied Materials, Inc. | Method and apparatus for substrate processing |
US6616394B1 (en) * | 1998-12-30 | 2003-09-09 | Silicon Valley Group | Apparatus for processing wafers |
US6647993B2 (en) * | 1998-07-13 | 2003-11-18 | Applied Komatsu Technology, Inc. | Surface-treated shower head for use in a substrate processing chamber |
US6679755B1 (en) * | 1999-12-09 | 2004-01-20 | Applied Materials Inc. | Chemical mechanical planarization system |
US6698991B1 (en) * | 2000-03-02 | 2004-03-02 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
US20040062633A1 (en) * | 2002-08-31 | 2004-04-01 | Applied Materials, Inc. | System for transporting substrate carriers |
US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
US20040081545A1 (en) * | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
US20040081546A1 (en) * | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
US20040191030A1 (en) * | 2003-01-27 | 2004-09-30 | Applied Materials, Inc. | Methods and apparatus for transporting substrate carriers |
US6841728B2 (en) * | 2002-01-04 | 2005-01-11 | G.T. Equipment Technologies, Inc. | Solar cell stringing machine |
US20050005808A1 (en) * | 2003-07-10 | 2005-01-13 | Trecenti Technologies, Inc. | Transfer system and semiconductor manufacturing system |
US6847730B1 (en) * | 1998-05-20 | 2005-01-25 | Applied Materials, Inc. | Automated substrate processing system |
US20050081785A1 (en) * | 2003-10-15 | 2005-04-21 | Applied Materials, Inc. | Apparatus for electroless deposition |
US6893171B2 (en) * | 2002-05-01 | 2005-05-17 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US20050105991A1 (en) * | 2002-07-22 | 2005-05-19 | Christopher Hofmeister | Substrate processing apparatus |
US20050121293A1 (en) * | 2003-11-13 | 2005-06-09 | Applied Materials, Inc. | Break-away positioning conveyor mount for accommodating conveyor belt bends |
US20050145464A1 (en) * | 2003-11-13 | 2005-07-07 | Applied Materials, Inc. | Stabilizing substrate carriers during overhead transport |
US20050186063A1 (en) * | 2003-11-13 | 2005-08-25 | Applied Materials, Inc. | Calibration of high speed loader to substrate transport system |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US20050224315A1 (en) * | 2003-11-13 | 2005-10-13 | Applied Materials, Inc. | Dynamically balanced substrate carrier handler |
US20050260345A1 (en) * | 2003-10-06 | 2005-11-24 | Applied Materials, Inc. | Apparatus for electroless deposition of metals onto semiconductor substrates |
US7076326B2 (en) * | 2003-10-06 | 2006-07-11 | Intel Corporation | Proactive staging for distributed material handling |
US20070073430A1 (en) * | 2005-09-29 | 2007-03-29 | Nirmal Govind | Optimization-based process scheduling method and system |
US20070148336A1 (en) * | 2005-11-07 | 2007-06-28 | Robert Bachrach | Photovoltaic contact and wiring formation |
US20070158654A1 (en) * | 2006-01-03 | 2007-07-12 | Kholodenko Arnold V | Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application |
US20070219660A1 (en) * | 2005-11-24 | 2007-09-20 | Tomohiro Kaneko | Substrate transporting and processing apparatus, fault management method for substrate transport and processing apparatus, and storage medium storing fault management program |
US20070231109A1 (en) * | 2006-03-28 | 2007-10-04 | Pak Samuel S | Apparatus and method for processing substrates using one or more vacuum transfer chamber units |
-
2007
- 2007-05-11 US US11/747,372 patent/US20080279658A1/en not_active Abandoned
-
2008
- 2008-05-09 TW TW097117269A patent/TW200903829A/en unknown
- 2008-05-09 WO PCT/US2008/063259 patent/WO2008141191A1/en active Application Filing
- 2008-05-09 CN CN200880018087A patent/CN101680084A/en active Pending
Patent Citations (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4237598A (en) * | 1965-09-13 | 1980-12-09 | Molins Limited | Manufacturing processes using machine tools |
US4668365A (en) * | 1984-10-25 | 1987-05-26 | Applied Materials, Inc. | Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition |
US5882165A (en) * | 1986-12-19 | 1999-03-16 | Applied Materials, Inc. | Multiple chamber integrated process system |
US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
US4875327A (en) * | 1988-11-29 | 1989-10-24 | Applied Material Handling, Inc. | Container filling apparatus and method |
US5046909A (en) * | 1989-06-29 | 1991-09-10 | Applied Materials, Inc. | Method and apparatus for handling semiconductor wafers |
US5174707A (en) * | 1989-06-30 | 1992-12-29 | Ohbayashi Corp. | Three-dimensional manufacturing and assembly plant |
US5183370A (en) * | 1989-12-29 | 1993-02-02 | Commissariat A L'energie Atomique | Apparatus for placing or storing flat articles in a cassette with intermediate racks |
US5223112A (en) * | 1991-04-30 | 1993-06-29 | Applied Materials, Inc. | Removable shutter apparatus for a semiconductor process chamber |
US5462080A (en) * | 1993-08-31 | 1995-10-31 | Applied Materials, Inc. | Heated removable throttle valve |
US5525024A (en) * | 1994-08-17 | 1996-06-11 | Applied Materials, Inc. | Cassette loader having compound translational motion |
US5700127A (en) * | 1995-06-27 | 1997-12-23 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
US6158941A (en) * | 1995-10-27 | 2000-12-12 | Brooks Automation, Inc. | Substrate transport apparatus with double substrate holders |
US5810549A (en) * | 1996-04-17 | 1998-09-22 | Applied Materials, Inc. | Independent linear dual-blade robot and method for transferring wafers |
US5993141A (en) * | 1996-04-17 | 1999-11-30 | Applied Materials, Inc. | Independent linear dual-blade robot and method for transferring wafers |
US5789878A (en) * | 1996-07-15 | 1998-08-04 | Applied Materials, Inc. | Dual plane robot |
US5957648A (en) * | 1996-12-11 | 1999-09-28 | Applied Materials, Inc. | Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers |
US20030113190A1 (en) * | 1996-12-11 | 2003-06-19 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6540466B2 (en) * | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US6287386B1 (en) * | 1997-06-04 | 2001-09-11 | Applied Materials, Inc. | Carousel wafer transfer system |
US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
US6506693B2 (en) * | 1997-07-28 | 2003-01-14 | Applied Materials, Inc. | Multiple loadlock system |
US6238161B1 (en) * | 1997-09-05 | 2001-05-29 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
US6520839B1 (en) * | 1997-09-10 | 2003-02-18 | Speedfam-Ipec Corporation | Load and unload station for semiconductor wafers |
US6134482A (en) * | 1997-10-15 | 2000-10-17 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for controlling semiconductor wafer fabrication equipment based on a remaining process time applicable to the processors |
US6308932B1 (en) * | 1998-05-20 | 2001-10-30 | Applied Komatsu Technology, Inc. | Isolation valves |
US6517048B2 (en) * | 1998-05-20 | 2003-02-11 | Applied Materials, Inc. | Isolation valves |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US20030021658A1 (en) * | 1998-05-20 | 2003-01-30 | Applied Materials, Inc. | Substrate transfer shuttle having a magnetic drive |
US6679671B2 (en) * | 1998-05-20 | 2004-01-20 | Applied Materials, Inc. | Substrate transfer shuttle having a magnetic drive |
US20010024609A1 (en) * | 1998-05-20 | 2001-09-27 | Applied Materials, Inc. | Method and apparatus for substrate transfer and processing |
US6471459B2 (en) * | 1998-05-20 | 2002-10-29 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US20020050581A1 (en) * | 1998-05-20 | 2002-05-02 | Applied Materials, Inc. | Isolation valves |
US6435868B2 (en) * | 1998-05-20 | 2002-08-20 | Applied Komatsu Technology, Inc. | Multi-function chamber for a substrate processing system |
US6847730B1 (en) * | 1998-05-20 | 2005-01-25 | Applied Materials, Inc. | Automated substrate processing system |
US6746198B2 (en) * | 1998-05-20 | 2004-06-08 | Applied Materials, Inc. | Substrate transfer shuttle |
US6552297B2 (en) * | 1998-07-13 | 2003-04-22 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6647993B2 (en) * | 1998-07-13 | 2003-11-18 | Applied Komatsu Technology, Inc. | Surface-treated shower head for use in a substrate processing chamber |
US6286230B1 (en) * | 1998-07-13 | 2001-09-11 | Applied Komatsu Technology, Inc. | Method of controlling gas flow in a substrate processing system |
US6359250B1 (en) * | 1998-07-13 | 2002-03-19 | Applied Komatsu Technology, Inc. | RF matching network with distributed outputs |
US6016611A (en) * | 1998-07-13 | 2000-01-25 | Applied Komatsu Technology, Inc. | Gas flow control in a substrate processing system |
US6719516B2 (en) * | 1998-09-28 | 2004-04-13 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
US20010041122A1 (en) * | 1998-09-28 | 2001-11-15 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
US20020031420A1 (en) * | 1998-09-28 | 2002-03-14 | Applied Material Inc. | Single wafer load lock with internal wafer transport |
US6616394B1 (en) * | 1998-12-30 | 2003-09-09 | Silicon Valley Group | Apparatus for processing wafers |
US6406359B1 (en) * | 1999-06-01 | 2002-06-18 | Applied Materials, Inc. | Apparatus for transferring semiconductor substrates using an input module |
US6371712B1 (en) * | 1999-09-21 | 2002-04-16 | Applied Komatsu Technology, Inc. | Support frame for substrates |
US6267851B1 (en) * | 1999-10-28 | 2001-07-31 | Applied Komatsu Technology, Inc. | Tilted sputtering target with shield to block contaminants |
US6298685B1 (en) * | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US20010015074A1 (en) * | 1999-11-03 | 2001-08-23 | Applied Materials, Inc. | Consecutive deposition system |
US6460369B2 (en) * | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
US6679755B1 (en) * | 1999-12-09 | 2004-01-20 | Applied Materials Inc. | Chemical mechanical planarization system |
US6477980B1 (en) * | 2000-01-20 | 2002-11-12 | Applied Materials, Inc. | Flexibly suspended gas distribution manifold for plasma chamber |
US6698991B1 (en) * | 2000-03-02 | 2004-03-02 | Applied Materials, Inc. | Fabrication system with extensible equipment sets |
US6572321B1 (en) * | 2000-10-05 | 2003-06-03 | Applied Materials, Inc. | Loader conveyor for substrate processing system |
US6430468B1 (en) * | 2000-11-17 | 2002-08-06 | Applied Materials, Inc. | Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber |
US20020090282A1 (en) * | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
US20030202868A1 (en) * | 2001-01-05 | 2003-10-30 | Applied Materials, Inc. | Actuatable loadport system |
US20020096114A1 (en) * | 2001-01-22 | 2002-07-25 | Applied Materials, Inc. | Series chamber for substrate processing |
US20020187024A1 (en) * | 2001-06-12 | 2002-12-12 | Applied Materials, Inc. | Apparatus for storing and moving a carrier |
US6841728B2 (en) * | 2002-01-04 | 2005-01-11 | G.T. Equipment Technologies, Inc. | Solar cell stringing machine |
US20030141820A1 (en) * | 2002-01-30 | 2003-07-31 | Applied Materials, Inc. | Method and apparatus for substrate processing |
US6893171B2 (en) * | 2002-05-01 | 2005-05-17 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
US20050105991A1 (en) * | 2002-07-22 | 2005-05-19 | Christopher Hofmeister | Substrate processing apparatus |
US20040081545A1 (en) * | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
US20040062633A1 (en) * | 2002-08-31 | 2004-04-01 | Applied Materials, Inc. | System for transporting substrate carriers |
US20040081546A1 (en) * | 2002-08-31 | 2004-04-29 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
US20040191030A1 (en) * | 2003-01-27 | 2004-09-30 | Applied Materials, Inc. | Methods and apparatus for transporting substrate carriers |
US20050005808A1 (en) * | 2003-07-10 | 2005-01-13 | Trecenti Technologies, Inc. | Transfer system and semiconductor manufacturing system |
US7076326B2 (en) * | 2003-10-06 | 2006-07-11 | Intel Corporation | Proactive staging for distributed material handling |
US20050260345A1 (en) * | 2003-10-06 | 2005-11-24 | Applied Materials, Inc. | Apparatus for electroless deposition of metals onto semiconductor substrates |
US20050081785A1 (en) * | 2003-10-15 | 2005-04-21 | Applied Materials, Inc. | Apparatus for electroless deposition |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US20050186063A1 (en) * | 2003-11-13 | 2005-08-25 | Applied Materials, Inc. | Calibration of high speed loader to substrate transport system |
US20050224315A1 (en) * | 2003-11-13 | 2005-10-13 | Applied Materials, Inc. | Dynamically balanced substrate carrier handler |
US20050145464A1 (en) * | 2003-11-13 | 2005-07-07 | Applied Materials, Inc. | Stabilizing substrate carriers during overhead transport |
US20050121293A1 (en) * | 2003-11-13 | 2005-06-09 | Applied Materials, Inc. | Break-away positioning conveyor mount for accommodating conveyor belt bends |
US20070073430A1 (en) * | 2005-09-29 | 2007-03-29 | Nirmal Govind | Optimization-based process scheduling method and system |
US20070148336A1 (en) * | 2005-11-07 | 2007-06-28 | Robert Bachrach | Photovoltaic contact and wiring formation |
US20070219660A1 (en) * | 2005-11-24 | 2007-09-20 | Tomohiro Kaneko | Substrate transporting and processing apparatus, fault management method for substrate transport and processing apparatus, and storage medium storing fault management program |
US20070158654A1 (en) * | 2006-01-03 | 2007-07-12 | Kholodenko Arnold V | Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application |
US20070231109A1 (en) * | 2006-03-28 | 2007-10-04 | Pak Samuel S | Apparatus and method for processing substrates using one or more vacuum transfer chamber units |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180282864A1 (en) * | 2017-03-28 | 2018-10-04 | Lawrence Chung-Lai Lei | Apparatus and method of turning over a substrate in a substrate processing system |
US10854497B2 (en) * | 2017-03-28 | 2020-12-01 | Lawrence Chung-Lai Lei | Apparatus and method of selective turning over a row of substrates in an array of substrates in a processing system |
Also Published As
Publication number | Publication date |
---|---|
CN101680084A (en) | 2010-03-24 |
TW200903829A (en) | 2009-01-16 |
WO2008141191A1 (en) | 2008-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5696135B2 (en) | Wafer handling system and method | |
TWI446477B (en) | Apparatus and methods for transporting and processing substrates | |
US8738174B2 (en) | Substrate processing apparatus and method for loading and unloading substrates | |
US9728436B2 (en) | Transfer mechanism with multiple wafer handling capability | |
KR101027050B1 (en) | Loading and unloading apparatus for wafer of solar battery | |
US7640071B2 (en) | Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots | |
US20130108406A1 (en) | High-throughput workpiece handling | |
JP2015524614A (en) | Electrostatic removal of solar cell gripper | |
WO1999010257A1 (en) | Wafer handler for multi-station tool | |
US11600503B2 (en) | High-throughput, multi-chamber substrate processing system | |
US7934898B2 (en) | High throughput semiconductor wafer processing | |
US9669552B2 (en) | System and method for quick-swap of multiple substrates | |
US20080279658A1 (en) | Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory | |
CN108305846B (en) | Silicon wafer feeding/discharging transmission system and working method thereof | |
US20080292433A1 (en) | Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory | |
US20080279672A1 (en) | Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory | |
US20130269615A1 (en) | Vertical wafer boat | |
KR20100033282A (en) | Loading and unloading apparatus for wafer of solar battery | |
US20090022574A1 (en) | Workpiece loading system | |
KR101717815B1 (en) | Casette pick-up unit and Deposition system having the same | |
KR100301701B1 (en) | Large Wafer Transfer System | |
KR20130084920A (en) | Apparatus for transferring substrate | |
JP2002329768A (en) | Apparatus for manufacturing semiconductor, method for transferring wafer in apparatus for manufacturing semiconductor, and method for manufacturing semiconductor element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BACHRACH, ROBERT Z.;TEPMAN, AVI;POLYAK, ALEXANDER S.;REEL/FRAME:019281/0287;SIGNING DATES FROM 20070423 TO 20070425 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |