US20080179045A1 - Liquid cooled heat sink - Google Patents
Liquid cooled heat sink Download PDFInfo
- Publication number
- US20080179045A1 US20080179045A1 US11/701,293 US70129307A US2008179045A1 US 20080179045 A1 US20080179045 A1 US 20080179045A1 US 70129307 A US70129307 A US 70129307A US 2008179045 A1 US2008179045 A1 US 2008179045A1
- Authority
- US
- United States
- Prior art keywords
- casing
- fluid
- heat sink
- chamber
- liquid cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a casing and a pump mounted directly on the casing and in fluid communication with a lower chamber in the casing.
- a conventional heat dissipating device generally includes a radiator 2 having a fluid inlet 22 and a fluid outlet 21 , a heat sink 11 having a coolant inlet 111 and a coolant outlet 112 , an inlet conduit 12 , an outlet conduit 13 , and a pump 14 .
- the heat sink 11 is adapted to be connected to a heat source (not shown), such as a CPU or a heat-generating electronic component of a display.
- the outlet conduit 13 interconnects the coolant outlet 112 of the heat sink 11 and the fluid inlet 22 of the radiator 2 .
- the pump 14 is mounted on the inlet conduit 12 , and the inlet conduit 12 has a first conduit section 121 interconnecting the coolant inlet 111 of the heat sink 11 and the pump 14 , and a second conduit section 122 interconnecting the pump 14 and the fluid outlet 21 of the radiator 2 .
- a coolant is driven to circulate through the heat sink 11 , the outlet conduit 13 , the radiator 2 , and the inlet conduit 12 , and carries heat absorbed by the heat sink 11 to the radiator 2 so as to dissipate heat thereat.
- a larger space is required to accommodate the pump 14 and the first and second conduit sections 121 , 122 of the inlet conduit 12 .
- the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantages associated with the prior art.
- a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing defining an inner space and provided with a partitioning wall that divides the inner space into upper and lower chambers, the partitioning wall being formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet that is in fluid communication with the upper chamber and that is adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber for withdrawing fluid from the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from the lower chamber into the external cooling device so as to circulate the fluid through the upper and lower chambers and the external cooling device.
- FIG. 1 is a schematic view of a conventional heat dissipating device
- FIG. 2 is a fragmentary perspective view of the preferred embodiment of a heat dissipating assembly according to the present invention.
- FIG. 3 is a fragmentary sectional view of a heat sink of the preferred embodiment.
- the preferred embodiment of a heat dissipating assembly according to the present invention is shown to includes a liquid cooled heat sink and an external cooling device 3 connected to the liquid cooled heat sink.
- the liquid cooled heat sink is adapted to be attached to an electronic component 9 , and includes: a casing 5 defining an inner space and provided with a partitioning wall 43 that divides the inner space into upper and lower chambers 52 , 53 , the partitioning wall 43 being formed with a fluid passage 46 in fluid communication with the upper and lower chambers 52 , 53 , the casing 5 being formed with a fluid inlet 513 that is in fluid communication with the upper chamber 52 and that is adapted to be connected to the external cooling device 3 through a first conduit 8 ; a fin unit 42 provided in the lower chamber 53 ; and a pump 6 mounted directly on the casing 5 and having a suction end 611 disposed in the upper chamber 52 , extending through the partitioning wall 43 , and in fluid communication with the lower chamber 53 for withdrawing a coolant from the lower chamber 53 , and a discharging end 612 disposed in the upper chamber 52 and adapted to be connected to the external cooling device 3 through a second conduit 7 for discharging the coolant from the lower
- the casing 5 has a top wall 512 and a bottom wall that is formed with an attaching protrusion 41 adapted to be attached to the electronic component 9 .
- the top wall 512 is formed with a recess 517 defined by a recess-defining wall 514 .
- the pump 6 is mounted on the top wall 512 , and extends into the recess 517 .
- the suction end 611 of the pump 6 extends through the recess-defining wall 514 into the upper chamber 52 .
- the external cooling device 3 is in the form of a radiator that is made from metal and that includes first and second side tanks 31 , 32 adapted to store the coolant therein, a plurality of connecting conduits 36 interconnecting and in fluid communication with the first and second side tanks 31 , 32 , and a fin structure 33 connected to the connecting conduits 36 and the first and second side tanks 31 , 32 .
- the first side tank 31 has a coolant outlet 34 that is connected to the fluid inlet 513 of the heat sink through the first conduit 8 .
- the second side tank 32 has a coolant inlet 35 that is connected to the discharging end 612 of the pump 6 through the second conduit 7 .
- the casing 5 is made from a metal material with good heat conducting property, and further includes a plurality of dividing walls 44 extending between the partitioning wall 43 and the bottom wall of the casing 5 so as to form the lower chamber 53 into a tortuous fluid path 47 for flowing of the coolant therethrough before entering into the pump 6 .
- the coolant is filled in the first and second side tanks 31 , 32 , the connecting conduits 36 , the first and second conduits 8 , 7 , and the upper and lower chambers 52 , 53 in the casing.
- the pump 6 is started so that the coolant in the external cooling device 3 is pumped through the first conduit 8 into the upper chamber 52 in the casing 5 of the heat sink for heat exchange with the electronic component 9 .
- the heated coolant flows in sequence through the second conduit 7 , the second side tank 32 , the connecting conduits 36 , and the first side tank 31 .
- the fin structure 33 absorbs and dissipates heat thereat so that the coolant is cooled down before flowing into the first side tank 31 .
Abstract
Description
- 1. Field of the Invention
- The invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a casing and a pump mounted directly on the casing and in fluid communication with a lower chamber in the casing.
- 2. Description of the Related Art
- As shown in
FIG. 1 , a conventional heat dissipating device generally includes aradiator 2 having afluid inlet 22 and afluid outlet 21, aheat sink 11 having acoolant inlet 111 and acoolant outlet 112, aninlet conduit 12, anoutlet conduit 13, and apump 14. Theheat sink 11 is adapted to be connected to a heat source (not shown), such as a CPU or a heat-generating electronic component of a display. Theoutlet conduit 13 interconnects thecoolant outlet 112 of theheat sink 11 and thefluid inlet 22 of theradiator 2. Thepump 14 is mounted on theinlet conduit 12, and theinlet conduit 12 has afirst conduit section 121 interconnecting thecoolant inlet 111 of theheat sink 11 and thepump 14, and asecond conduit section 122 interconnecting thepump 14 and thefluid outlet 21 of theradiator 2. - When the
pump 14 is operated, a coolant is driven to circulate through theheat sink 11, theoutlet conduit 13, theradiator 2, and theinlet conduit 12, and carries heat absorbed by theheat sink 11 to theradiator 2 so as to dissipate heat thereat. - Although the conventional heat dissipating device has the heat dissipating effect, there are still some disadvantages:
- 1) An undesired high coolant vaporizing rate due to connection between the
pump 14 and the first andsecond conduit sections inlet conduit 12 occurs. - 2) A larger space is required to accommodate the
pump 14 and the first andsecond conduit sections inlet conduit 12. - 3) Assembly of the
pump 14 and the first andsecond conduit sections inlet conduit 12 is inconvenient when the space for accommodating the heat dissipating device is small. - Therefore, the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantages associated with the prior art.
- Accordingly, a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing defining an inner space and provided with a partitioning wall that divides the inner space into upper and lower chambers, the partitioning wall being formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet that is in fluid communication with the upper chamber and that is adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber for withdrawing fluid from the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from the lower chamber into the external cooling device so as to circulate the fluid through the upper and lower chambers and the external cooling device.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
-
FIG. 1 is a schematic view of a conventional heat dissipating device; -
FIG. 2 is a fragmentary perspective view of the preferred embodiment of a heat dissipating assembly according to the present invention; and -
FIG. 3 is a fragmentary sectional view of a heat sink of the preferred embodiment. - Referring to
FIGS. 2 and 3 , the preferred embodiment of a heat dissipating assembly according to the present invention is shown to includes a liquid cooled heat sink and anexternal cooling device 3 connected to the liquid cooled heat sink. - The liquid cooled heat sink is adapted to be attached to an electronic component 9, and includes: a
casing 5 defining an inner space and provided with a partitioningwall 43 that divides the inner space into upper andlower chambers wall 43 being formed with afluid passage 46 in fluid communication with the upper andlower chambers casing 5 being formed with afluid inlet 513 that is in fluid communication with theupper chamber 52 and that is adapted to be connected to theexternal cooling device 3 through afirst conduit 8; afin unit 42 provided in thelower chamber 53; and apump 6 mounted directly on thecasing 5 and having asuction end 611 disposed in theupper chamber 52, extending through thepartitioning wall 43, and in fluid communication with thelower chamber 53 for withdrawing a coolant from thelower chamber 53, and adischarging end 612 disposed in theupper chamber 52 and adapted to be connected to theexternal cooling device 3 through asecond conduit 7 for discharging the coolant from thelower chamber 53 into theexternal cooling device 3 so as to circulate the coolant through the upper andlower chambers external cooling device 3. - In this embodiment, the
casing 5 has atop wall 512 and a bottom wall that is formed with an attachingprotrusion 41 adapted to be attached to the electronic component 9. Thetop wall 512 is formed with arecess 517 defined by a recess-definingwall 514. Thepump 6 is mounted on thetop wall 512, and extends into therecess 517. Thesuction end 611 of thepump 6 extends through the recess-definingwall 514 into theupper chamber 52. - The
external cooling device 3 is in the form of a radiator that is made from metal and that includes first andsecond side tanks conduits 36 interconnecting and in fluid communication with the first andsecond side tanks fin structure 33 connected to the connectingconduits 36 and the first andsecond side tanks first side tank 31 has acoolant outlet 34 that is connected to thefluid inlet 513 of the heat sink through thefirst conduit 8. Thesecond side tank 32 has acoolant inlet 35 that is connected to thedischarging end 612 of thepump 6 through thesecond conduit 7. - The
casing 5 is made from a metal material with good heat conducting property, and further includes a plurality of dividingwalls 44 extending between thepartitioning wall 43 and the bottom wall of thecasing 5 so as to form thelower chamber 53 into atortuous fluid path 47 for flowing of the coolant therethrough before entering into thepump 6. - Before use, the coolant is filled in the first and
second side tanks conduits 36, the first andsecond conduits lower chambers pump 6 is started so that the coolant in theexternal cooling device 3 is pumped through thefirst conduit 8 into theupper chamber 52 in thecasing 5 of the heat sink for heat exchange with the electronic component 9. Thereafter, the heated coolant flows in sequence through thesecond conduit 7, thesecond side tank 32, the connectingconduits 36, and thefirst side tank 31. As the coolant flows through the connectingconduits 36, thefin structure 33 absorbs and dissipates heat thereat so that the coolant is cooled down before flowing into thefirst side tank 31. - By mounting the
pump 6 directly on thecasing 5 of the liquid cooled heat sink of this invention, the aforesaid drawbacks associated with the prior art can be eliminated. - While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/701,293 US7404433B1 (en) | 2007-01-31 | 2007-01-31 | Liquid cooled heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/701,293 US7404433B1 (en) | 2007-01-31 | 2007-01-31 | Liquid cooled heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
US7404433B1 US7404433B1 (en) | 2008-07-29 |
US20080179045A1 true US20080179045A1 (en) | 2008-07-31 |
Family
ID=39643227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/701,293 Active 2027-02-07 US7404433B1 (en) | 2007-01-31 | 2007-01-31 | Liquid cooled heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | US7404433B1 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090141451A1 (en) * | 2007-11-21 | 2009-06-04 | Shogo Mori | Heat dissipation apparatus |
US20090147479A1 (en) * | 2007-11-21 | 2009-06-11 | Shogo Mori | Heat dissipation apparatus |
US20110186270A1 (en) * | 2010-02-01 | 2011-08-04 | Suna Display Co. | Heat transfer device with anisotropic heat dissipating and absorption structures |
US20130000873A1 (en) * | 2011-06-29 | 2013-01-03 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US20140158326A1 (en) * | 2007-08-09 | 2014-06-12 | Coolit Systems Inc. | Fluid heat exchange systems |
US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
CN105992488A (en) * | 2015-01-28 | 2016-10-05 | 讯凯国际股份有限公司 | Liquid cooling-type radiating structure and manufacturing method thereof |
US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
US20170055370A1 (en) * | 2015-08-20 | 2017-02-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US11252839B2 (en) * | 2020-05-15 | 2022-02-15 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Computer liquid cooling system |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006011333A1 (en) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Device for cooling, in particular electronic components |
DE102006011331A1 (en) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling, in particular electronic components, gas coolers and evaporators |
TWM376804U (en) * | 2009-09-02 | 2010-03-21 | Micro Star Int Co Ltd | External thermal device and related electronic device |
US20160377356A1 (en) * | 2015-06-25 | 2016-12-29 | Asia Vital Components Co., Ltd. | Flexible and transformable water-cooling device |
CN106249827B (en) * | 2016-07-25 | 2023-04-28 | 东莞市真品科技有限公司 | CPU water pump radiator |
TWI616133B (en) * | 2016-08-26 | 2018-02-21 | 雙鴻科技股份有限公司 | Liquid cooler module |
TWI650520B (en) * | 2017-08-02 | 2019-02-11 | 萬在工業股份有限公司 | Phase change evaporator and phase change heat sink |
CN110377130A (en) * | 2019-07-04 | 2019-10-25 | 东莞市冰点智能科技有限公司 | A kind of water cooling radiator |
CN114641192B (en) * | 2022-05-19 | 2022-08-02 | 中荣精密金属制品(南通)有限公司 | Radiator for medical instrument |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
US20040052049A1 (en) * | 2002-09-13 | 2004-03-18 | Wu Bo Jiu | Integrated fluid cooling system for electronic components |
US20040052663A1 (en) * | 2002-09-13 | 2004-03-18 | Laing Thermotech, Inc. | Device for the local cooling or heating of an object |
US20040240179A1 (en) * | 2003-05-26 | 2004-12-02 | Shinya Koga | Cooling device and centrifugal pump to be used in the same device |
US20050243518A1 (en) * | 2004-04-28 | 2005-11-03 | Yukihiko Hata | Heat-receiving apparatus and electronic equipment |
US20060237172A1 (en) * | 2005-04-22 | 2006-10-26 | Cooler Master Co. Ltd. | Water-cooling heat exchanger and heat-dissipating device for the same |
US7156160B2 (en) * | 2003-11-07 | 2007-01-02 | Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. | Integrated liquid cooling system for electronic components |
US20070107880A1 (en) * | 2005-11-17 | 2007-05-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink structure |
US7255154B2 (en) * | 2004-05-12 | 2007-08-14 | Matsushita Electric Industrial Co., Ltd. | Cooling device |
US20070263354A1 (en) * | 2005-06-29 | 2007-11-15 | Crocker Michael T | Systems for low cost coaxial liquid cooling |
US7325591B2 (en) * | 2005-02-18 | 2008-02-05 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4397114B2 (en) * | 2000-09-12 | 2010-01-13 | 日本サーモスタット株式会社 | Electronic equipment cooling device |
-
2007
- 2007-01-31 US US11/701,293 patent/US7404433B1/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
US6529377B1 (en) * | 2001-09-05 | 2003-03-04 | Microelectronic & Computer Technology Corporation | Integrated cooling system |
US20040052049A1 (en) * | 2002-09-13 | 2004-03-18 | Wu Bo Jiu | Integrated fluid cooling system for electronic components |
US20040052663A1 (en) * | 2002-09-13 | 2004-03-18 | Laing Thermotech, Inc. | Device for the local cooling or heating of an object |
US20040240179A1 (en) * | 2003-05-26 | 2004-12-02 | Shinya Koga | Cooling device and centrifugal pump to be used in the same device |
US7156160B2 (en) * | 2003-11-07 | 2007-01-02 | Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. | Integrated liquid cooling system for electronic components |
US20050243518A1 (en) * | 2004-04-28 | 2005-11-03 | Yukihiko Hata | Heat-receiving apparatus and electronic equipment |
US7255154B2 (en) * | 2004-05-12 | 2007-08-14 | Matsushita Electric Industrial Co., Ltd. | Cooling device |
US7325591B2 (en) * | 2005-02-18 | 2008-02-05 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation apparatus |
US20060237172A1 (en) * | 2005-04-22 | 2006-10-26 | Cooler Master Co. Ltd. | Water-cooling heat exchanger and heat-dissipating device for the same |
US20070263354A1 (en) * | 2005-06-29 | 2007-11-15 | Crocker Michael T | Systems for low cost coaxial liquid cooling |
US20070107880A1 (en) * | 2005-11-17 | 2007-05-17 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink structure |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10274266B2 (en) | 2007-08-09 | 2019-04-30 | CoolIT Systems, Inc | Fluid heat exchange sytems |
US20140158326A1 (en) * | 2007-08-09 | 2014-06-12 | Coolit Systems Inc. | Fluid heat exchange systems |
US9057567B2 (en) * | 2007-08-09 | 2015-06-16 | Coolit Systems, Inc. | Fluid heat exchange systems |
US20090141451A1 (en) * | 2007-11-21 | 2009-06-04 | Shogo Mori | Heat dissipation apparatus |
US20090147479A1 (en) * | 2007-11-21 | 2009-06-11 | Shogo Mori | Heat dissipation apparatus |
US20110186270A1 (en) * | 2010-02-01 | 2011-08-04 | Suna Display Co. | Heat transfer device with anisotropic heat dissipating and absorption structures |
US20130000873A1 (en) * | 2011-06-29 | 2013-01-03 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
US11714432B2 (en) | 2011-08-11 | 2023-08-01 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US11661936B2 (en) | 2013-03-15 | 2023-05-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
CN105992488A (en) * | 2015-01-28 | 2016-10-05 | 讯凯国际股份有限公司 | Liquid cooling-type radiating structure and manufacturing method thereof |
US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
US10111362B2 (en) * | 2015-08-20 | 2018-10-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
US20170055370A1 (en) * | 2015-08-20 | 2017-02-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
US11452243B2 (en) | 2017-10-12 | 2022-09-20 | Coolit Systems, Inc. | Cooling system, controllers and methods |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11725890B2 (en) | 2019-04-25 | 2023-08-15 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11252839B2 (en) * | 2020-05-15 | 2022-02-15 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Computer liquid cooling system |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
Also Published As
Publication number | Publication date |
---|---|
US7404433B1 (en) | 2008-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7404433B1 (en) | Liquid cooled heat sink | |
US20080179044A1 (en) | Heat dissipating device | |
US20080169086A1 (en) | Heat dissipating device | |
US20090044929A1 (en) | Liquid cooling module | |
US7249625B2 (en) | Water-cooling heat dissipation device | |
US20160209120A1 (en) | Boiling heat transfer device | |
EP1574800B1 (en) | Thin-profile Condenser | |
US9921002B2 (en) | Radiator and electronic device having the same | |
US7753108B2 (en) | Liquid cooling device | |
JP6561846B2 (en) | Cooling device and electronic device | |
US20060021737A1 (en) | Liquid cooling device | |
US20070034355A1 (en) | Heat-dissipation structure and method thereof | |
US20070070604A1 (en) | Cooling device and electronic apparatus having cooling device | |
US7352577B2 (en) | Liquid-cooled heat dissipation module | |
US20060291168A1 (en) | Heat dissipating module and heat sink assembly using the same | |
US20070240849A1 (en) | Liquid cooling device | |
TW201302042A (en) | Heat dissipating system | |
JP2005228810A (en) | Liquid circulation cooling device | |
US20120241137A1 (en) | Cooling unit | |
US11252839B2 (en) | Computer liquid cooling system | |
US10921067B2 (en) | Water-cooling radiator structure with internal partition member | |
JP2023058613A (en) | cooling unit | |
US20080179041A1 (en) | Heat dissipating device for heat dissipation of an electronic component | |
US8240359B2 (en) | Liquid storage and cooling computer case | |
EP1696718A2 (en) | Liquid-Cooled heat dissipation module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MAN ZAI INDUSTRIAL CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HU, JEN-LU;LIN, HAO-HUI;SUN, TSUNG-CHING;REEL/FRAME:018969/0167 Effective date: 20070109 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2553); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Year of fee payment: 12 |