US20080179045A1 - Liquid cooled heat sink - Google Patents

Liquid cooled heat sink Download PDF

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Publication number
US20080179045A1
US20080179045A1 US11/701,293 US70129307A US2008179045A1 US 20080179045 A1 US20080179045 A1 US 20080179045A1 US 70129307 A US70129307 A US 70129307A US 2008179045 A1 US2008179045 A1 US 2008179045A1
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United States
Prior art keywords
casing
fluid
heat sink
chamber
liquid cooled
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Granted
Application number
US11/701,293
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US7404433B1 (en
Inventor
Jen-Lu Hu
Hao-Hui Lin
Tsung-Ching Sun
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Man Zai Industrial Co Ltd
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Man Zai Industrial Co Ltd
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Priority to US11/701,293 priority Critical patent/US7404433B1/en
Assigned to MAN ZAI INDUSTRIAL CO., LTD. reassignment MAN ZAI INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HU, JEN-LU, LIN, Hao-hui, SUN, TSUNG-CHING
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Publication of US7404433B1 publication Critical patent/US7404433B1/en
Publication of US20080179045A1 publication Critical patent/US20080179045A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a casing and a pump mounted directly on the casing and in fluid communication with a lower chamber in the casing.
  • a conventional heat dissipating device generally includes a radiator 2 having a fluid inlet 22 and a fluid outlet 21 , a heat sink 11 having a coolant inlet 111 and a coolant outlet 112 , an inlet conduit 12 , an outlet conduit 13 , and a pump 14 .
  • the heat sink 11 is adapted to be connected to a heat source (not shown), such as a CPU or a heat-generating electronic component of a display.
  • the outlet conduit 13 interconnects the coolant outlet 112 of the heat sink 11 and the fluid inlet 22 of the radiator 2 .
  • the pump 14 is mounted on the inlet conduit 12 , and the inlet conduit 12 has a first conduit section 121 interconnecting the coolant inlet 111 of the heat sink 11 and the pump 14 , and a second conduit section 122 interconnecting the pump 14 and the fluid outlet 21 of the radiator 2 .
  • a coolant is driven to circulate through the heat sink 11 , the outlet conduit 13 , the radiator 2 , and the inlet conduit 12 , and carries heat absorbed by the heat sink 11 to the radiator 2 so as to dissipate heat thereat.
  • a larger space is required to accommodate the pump 14 and the first and second conduit sections 121 , 122 of the inlet conduit 12 .
  • the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantages associated with the prior art.
  • a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing defining an inner space and provided with a partitioning wall that divides the inner space into upper and lower chambers, the partitioning wall being formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet that is in fluid communication with the upper chamber and that is adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber for withdrawing fluid from the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from the lower chamber into the external cooling device so as to circulate the fluid through the upper and lower chambers and the external cooling device.
  • FIG. 1 is a schematic view of a conventional heat dissipating device
  • FIG. 2 is a fragmentary perspective view of the preferred embodiment of a heat dissipating assembly according to the present invention.
  • FIG. 3 is a fragmentary sectional view of a heat sink of the preferred embodiment.
  • the preferred embodiment of a heat dissipating assembly according to the present invention is shown to includes a liquid cooled heat sink and an external cooling device 3 connected to the liquid cooled heat sink.
  • the liquid cooled heat sink is adapted to be attached to an electronic component 9 , and includes: a casing 5 defining an inner space and provided with a partitioning wall 43 that divides the inner space into upper and lower chambers 52 , 53 , the partitioning wall 43 being formed with a fluid passage 46 in fluid communication with the upper and lower chambers 52 , 53 , the casing 5 being formed with a fluid inlet 513 that is in fluid communication with the upper chamber 52 and that is adapted to be connected to the external cooling device 3 through a first conduit 8 ; a fin unit 42 provided in the lower chamber 53 ; and a pump 6 mounted directly on the casing 5 and having a suction end 611 disposed in the upper chamber 52 , extending through the partitioning wall 43 , and in fluid communication with the lower chamber 53 for withdrawing a coolant from the lower chamber 53 , and a discharging end 612 disposed in the upper chamber 52 and adapted to be connected to the external cooling device 3 through a second conduit 7 for discharging the coolant from the lower
  • the casing 5 has a top wall 512 and a bottom wall that is formed with an attaching protrusion 41 adapted to be attached to the electronic component 9 .
  • the top wall 512 is formed with a recess 517 defined by a recess-defining wall 514 .
  • the pump 6 is mounted on the top wall 512 , and extends into the recess 517 .
  • the suction end 611 of the pump 6 extends through the recess-defining wall 514 into the upper chamber 52 .
  • the external cooling device 3 is in the form of a radiator that is made from metal and that includes first and second side tanks 31 , 32 adapted to store the coolant therein, a plurality of connecting conduits 36 interconnecting and in fluid communication with the first and second side tanks 31 , 32 , and a fin structure 33 connected to the connecting conduits 36 and the first and second side tanks 31 , 32 .
  • the first side tank 31 has a coolant outlet 34 that is connected to the fluid inlet 513 of the heat sink through the first conduit 8 .
  • the second side tank 32 has a coolant inlet 35 that is connected to the discharging end 612 of the pump 6 through the second conduit 7 .
  • the casing 5 is made from a metal material with good heat conducting property, and further includes a plurality of dividing walls 44 extending between the partitioning wall 43 and the bottom wall of the casing 5 so as to form the lower chamber 53 into a tortuous fluid path 47 for flowing of the coolant therethrough before entering into the pump 6 .
  • the coolant is filled in the first and second side tanks 31 , 32 , the connecting conduits 36 , the first and second conduits 8 , 7 , and the upper and lower chambers 52 , 53 in the casing.
  • the pump 6 is started so that the coolant in the external cooling device 3 is pumped through the first conduit 8 into the upper chamber 52 in the casing 5 of the heat sink for heat exchange with the electronic component 9 .
  • the heated coolant flows in sequence through the second conduit 7 , the second side tank 32 , the connecting conduits 36 , and the first side tank 31 .
  • the fin structure 33 absorbs and dissipates heat thereat so that the coolant is cooled down before flowing into the first side tank 31 .

Abstract

A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber and adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to an external cooling device.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a casing and a pump mounted directly on the casing and in fluid communication with a lower chamber in the casing.
  • 2. Description of the Related Art
  • As shown in FIG. 1, a conventional heat dissipating device generally includes a radiator 2 having a fluid inlet 22 and a fluid outlet 21, a heat sink 11 having a coolant inlet 111 and a coolant outlet 112, an inlet conduit 12, an outlet conduit 13, and a pump 14. The heat sink 11 is adapted to be connected to a heat source (not shown), such as a CPU or a heat-generating electronic component of a display. The outlet conduit 13 interconnects the coolant outlet 112 of the heat sink 11 and the fluid inlet 22 of the radiator 2. The pump 14 is mounted on the inlet conduit 12, and the inlet conduit 12 has a first conduit section 121 interconnecting the coolant inlet 111 of the heat sink 11 and the pump 14, and a second conduit section 122 interconnecting the pump 14 and the fluid outlet 21 of the radiator 2.
  • When the pump 14 is operated, a coolant is driven to circulate through the heat sink 11, the outlet conduit 13, the radiator 2, and the inlet conduit 12, and carries heat absorbed by the heat sink 11 to the radiator 2 so as to dissipate heat thereat.
  • Although the conventional heat dissipating device has the heat dissipating effect, there are still some disadvantages:
  • 1) An undesired high coolant vaporizing rate due to connection between the pump 14 and the first and second conduit sections 121, 122 of the inlet conduit 12 occurs.
  • 2) A larger space is required to accommodate the pump 14 and the first and second conduit sections 121, 122 of the inlet conduit 12.
  • 3) Assembly of the pump 14 and the first and second conduit sections 121, 122 of the inlet conduit 12 is inconvenient when the space for accommodating the heat dissipating device is small.
  • SUMMARY OF THE INVENTION
  • Therefore, the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantages associated with the prior art.
  • Accordingly, a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing defining an inner space and provided with a partitioning wall that divides the inner space into upper and lower chambers, the partitioning wall being formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet that is in fluid communication with the upper chamber and that is adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber for withdrawing fluid from the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from the lower chamber into the external cooling device so as to circulate the fluid through the upper and lower chambers and the external cooling device.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
  • FIG. 1 is a schematic view of a conventional heat dissipating device;
  • FIG. 2 is a fragmentary perspective view of the preferred embodiment of a heat dissipating assembly according to the present invention; and
  • FIG. 3 is a fragmentary sectional view of a heat sink of the preferred embodiment.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 2 and 3, the preferred embodiment of a heat dissipating assembly according to the present invention is shown to includes a liquid cooled heat sink and an external cooling device 3 connected to the liquid cooled heat sink.
  • The liquid cooled heat sink is adapted to be attached to an electronic component 9, and includes: a casing 5 defining an inner space and provided with a partitioning wall 43 that divides the inner space into upper and lower chambers 52, 53, the partitioning wall 43 being formed with a fluid passage 46 in fluid communication with the upper and lower chambers 52, 53, the casing 5 being formed with a fluid inlet 513 that is in fluid communication with the upper chamber 52 and that is adapted to be connected to the external cooling device 3 through a first conduit 8; a fin unit 42 provided in the lower chamber 53; and a pump 6 mounted directly on the casing 5 and having a suction end 611 disposed in the upper chamber 52, extending through the partitioning wall 43, and in fluid communication with the lower chamber 53 for withdrawing a coolant from the lower chamber 53, and a discharging end 612 disposed in the upper chamber 52 and adapted to be connected to the external cooling device 3 through a second conduit 7 for discharging the coolant from the lower chamber 53 into the external cooling device 3 so as to circulate the coolant through the upper and lower chambers 52, 53 and the external cooling device 3.
  • In this embodiment, the casing 5 has a top wall 512 and a bottom wall that is formed with an attaching protrusion 41 adapted to be attached to the electronic component 9. The top wall 512 is formed with a recess 517 defined by a recess-defining wall 514. The pump 6 is mounted on the top wall 512, and extends into the recess 517. The suction end 611 of the pump 6 extends through the recess-defining wall 514 into the upper chamber 52.
  • The external cooling device 3 is in the form of a radiator that is made from metal and that includes first and second side tanks 31, 32 adapted to store the coolant therein, a plurality of connecting conduits 36 interconnecting and in fluid communication with the first and second side tanks 31, 32, and a fin structure 33 connected to the connecting conduits 36 and the first and second side tanks 31, 32. The first side tank 31 has a coolant outlet 34 that is connected to the fluid inlet 513 of the heat sink through the first conduit 8. The second side tank 32 has a coolant inlet 35 that is connected to the discharging end 612 of the pump 6 through the second conduit 7.
  • The casing 5 is made from a metal material with good heat conducting property, and further includes a plurality of dividing walls 44 extending between the partitioning wall 43 and the bottom wall of the casing 5 so as to form the lower chamber 53 into a tortuous fluid path 47 for flowing of the coolant therethrough before entering into the pump 6.
  • Before use, the coolant is filled in the first and second side tanks 31, 32, the connecting conduits 36, the first and second conduits 8, 7, and the upper and lower chambers 52, 53 in the casing. In use, the pump 6 is started so that the coolant in the external cooling device 3 is pumped through the first conduit 8 into the upper chamber 52 in the casing 5 of the heat sink for heat exchange with the electronic component 9. Thereafter, the heated coolant flows in sequence through the second conduit 7, the second side tank 32, the connecting conduits 36, and the first side tank 31. As the coolant flows through the connecting conduits 36, the fin structure 33 absorbs and dissipates heat thereat so that the coolant is cooled down before flowing into the first side tank 31.
  • By mounting the pump 6 directly on the casing 5 of the liquid cooled heat sink of this invention, the aforesaid drawbacks associated with the prior art can be eliminated.
  • While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.

Claims (2)

1. A liquid cooled heat sink adapted to be attached to an electronic component, said liquid cooled heat sink comprising:
a casing defining an inner space and provided with a partitioning wall that divides said inner space into upper and lower chambers, said partitioning wall being formed with a fluid passage in fluid communication with said upper and lower chambers, said casing being formed with a fluid inlet that is in fluid communication with said upper chamber and that is adapted to be connected to an external cooling device;
a fin unit provided in said lower chamber; and
a pump mounted on said casing and having a suction end disposed in said upper chamber, extending through said partitioning wall, and in fluid communication with said lower chamber for withdrawing fluid from said lower chamber, and a discharging end disposed in said upper chamber and adapted to be connected to a connecting pipe for discharging the fluid from said lower chamber into the external cooling device so as to circulate the fluid through said upper and lower chambers and the external cooling device.
2. The liquid cooled heat sink as claim in claim 1, wherein said casing has a top wall and a bottom wall that is formed with an attaching protrusion adapted to be attached to the electronic component, said top wall being formed with a recess defined by a recess-defining wall, said pump being mounted on said top wall and extending into said recess, said suction end of said pump extending through said recess-defining wall.
US11/701,293 2007-01-31 2007-01-31 Liquid cooled heat sink Active 2027-02-07 US7404433B1 (en)

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Cited By (18)

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US20090141451A1 (en) * 2007-11-21 2009-06-04 Shogo Mori Heat dissipation apparatus
US20090147479A1 (en) * 2007-11-21 2009-06-11 Shogo Mori Heat dissipation apparatus
US20110186270A1 (en) * 2010-02-01 2011-08-04 Suna Display Co. Heat transfer device with anisotropic heat dissipating and absorption structures
US20130000873A1 (en) * 2011-06-29 2013-01-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
US20140158326A1 (en) * 2007-08-09 2014-06-12 Coolit Systems Inc. Fluid heat exchange systems
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
CN105992488A (en) * 2015-01-28 2016-10-05 讯凯国际股份有限公司 Liquid cooling-type radiating structure and manufacturing method thereof
US20160309618A1 (en) * 2015-04-17 2016-10-20 Cooler Master Co., Ltd. Liquid cooling heat dissipation structure and method of manufacturing the same
US20170055370A1 (en) * 2015-08-20 2017-02-23 Cooler Master Co., Ltd. Liquid-cooling heat dissipation device
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US11252839B2 (en) * 2020-05-15 2022-02-15 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Computer liquid cooling system
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

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DE102006011333A1 (en) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Device for cooling, in particular electronic components
DE102006011331A1 (en) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Apparatus for cooling, in particular electronic components, gas coolers and evaporators
TWM376804U (en) * 2009-09-02 2010-03-21 Micro Star Int Co Ltd External thermal device and related electronic device
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device
CN106249827B (en) * 2016-07-25 2023-04-28 东莞市真品科技有限公司 CPU water pump radiator
TWI616133B (en) * 2016-08-26 2018-02-21 雙鴻科技股份有限公司 Liquid cooler module
TWI650520B (en) * 2017-08-02 2019-02-11 萬在工業股份有限公司 Phase change evaporator and phase change heat sink
CN110377130A (en) * 2019-07-04 2019-10-25 东莞市冰点智能科技有限公司 A kind of water cooling radiator
CN114641192B (en) * 2022-05-19 2022-08-02 中荣精密金属制品(南通)有限公司 Radiator for medical instrument

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US10274266B2 (en) 2007-08-09 2019-04-30 CoolIT Systems, Inc Fluid heat exchange sytems
US20140158326A1 (en) * 2007-08-09 2014-06-12 Coolit Systems Inc. Fluid heat exchange systems
US9057567B2 (en) * 2007-08-09 2015-06-16 Coolit Systems, Inc. Fluid heat exchange systems
US20090141451A1 (en) * 2007-11-21 2009-06-04 Shogo Mori Heat dissipation apparatus
US20090147479A1 (en) * 2007-11-21 2009-06-11 Shogo Mori Heat dissipation apparatus
US20110186270A1 (en) * 2010-02-01 2011-08-04 Suna Display Co. Heat transfer device with anisotropic heat dissipating and absorption structures
US20130000873A1 (en) * 2011-06-29 2013-01-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
US11714432B2 (en) 2011-08-11 2023-08-01 Coolit Systems, Inc. Flow-path controllers and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US11661936B2 (en) 2013-03-15 2023-05-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
CN105992488A (en) * 2015-01-28 2016-10-05 讯凯国际股份有限公司 Liquid cooling-type radiating structure and manufacturing method thereof
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
US9818671B2 (en) * 2015-02-10 2017-11-14 Dynatron Corporation Liquid-cooled heat sink for electronic devices
US20160309618A1 (en) * 2015-04-17 2016-10-20 Cooler Master Co., Ltd. Liquid cooling heat dissipation structure and method of manufacturing the same
US10111362B2 (en) * 2015-08-20 2018-10-23 Cooler Master Co., Ltd. Liquid-cooling heat dissipation device
US20170055370A1 (en) * 2015-08-20 2017-02-23 Cooler Master Co., Ltd. Liquid-cooling heat dissipation device
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11725890B2 (en) 2019-04-25 2023-08-15 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11252839B2 (en) * 2020-05-15 2022-02-15 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Computer liquid cooling system
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

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