US20080175694A1 - Unit and method for transferring substrates and apparatus and method for treating substrates with the unit - Google Patents
Unit and method for transferring substrates and apparatus and method for treating substrates with the unit Download PDFInfo
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- US20080175694A1 US20080175694A1 US11/892,224 US89222407A US2008175694A1 US 20080175694 A1 US20080175694 A1 US 20080175694A1 US 89222407 A US89222407 A US 89222407A US 2008175694 A1 US2008175694 A1 US 2008175694A1
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- blade
- substrate
- chamber
- support
- substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Definitions
- the present invention relates to apparatuses and methods for use in manufacturing semiconductor substrates. More specifically, the present invention is directed to unit and method for transferring substrates and apparatus and method for treating substrates with the unit.
- a cluster-type apparatus has a configuration where a loadlock chamber and process chambers are disposed around a transfer chamber. Generally, wafers are placed in a loadlock chamber and vertically spaced to face each other. Two chucks, on which substrates are to be mounted, are provided inside one process chamber and disposed abreast in a side direction.
- a transfer unit is provided at a transfer chamber to transfer a wafer between a loadlock chamber and a process chamber and between one process chamber and another process chamber. Since the transfer unit has only one blade on which a wafer is placed, only one wafer can be transferred at one time. In order to mount wafers on their respective chucks, a transfer unit must carry wafers between a loadlock chamber and a process chamber twice. Thus, it takes much time to transfer wafers. In the case where two robots operating independently may be provided at a transfer chamber, an occupied area of the transfer chamber increases due to the two robots. Further, since the two robots cannot enter one loadlock chamber at the same time, one robot must wait until the other robot takes a wafer out of a loadlock chamber.
- a typical transfer unit includes only one holding part where a wafer is placed on a blade. After taking a processed wafer out of a process chamber and putting the wafer into a loadlock chamber, a blade takes another wafer out of the loadlock chamber and carries the wafer to the process chamber. Accordingly, until a process for the next wafer is performed inside a process chamber after a process for a wafer is performed, much time is required for transferring a wafer to significantly decrease a treating amount of the process chamber.
- Exemplary embodiments of the present invention are directed to a unit for transferring substrates.
- the unit may include: a blade member on which a substrate is placed; an arm member coupled with the blade member to carry the blade member; and a driving member configured to supply a driving force to the blade member or the arm member, wherein the blade member comprises: a bottom blade; and a top blade disposed over the bottom blade to change a relative position with respect to the bottom blade.
- the unit may include: a top blade including at least two support parts on which a substrate is placed; and a bottom blade including at least two support parts on which a substrate is placed, the bottom blade being disposed below the top blade, wherein the top and bottom blades are carried by means of one arm member, and wherein the top and bottom blades are provided to be converted to a folded state where they vertically face each other and an unfolded state where they are widened at a preset angle.
- the apparatus may include: a transfer chamber; at least one process chamber disposed at one side of the transfer chamber; a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber, wherein the transfer unit comprises: a blade member on which a substrate is placed; an arm member coupled with the blade member to carry the blade member; and a driving member configured to supply a driving force to the blade member and the arm member, and wherein the blade member comprises: a bottom blade; and a top blade disposed over the bottom blade, wherein the bottom and top blades are provided to change their relative positions.
- Exemplary embodiments of the present invention are directed to a method for transferring substrates.
- the method may include: simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction, wherein a transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions to place/take a substrate on/out of the first support plates under the folded state or place/take a substrate on/out of the second support plates under the unfolded state.
- Exemplary embodiments of the present invention are directed to a method for treating substrates.
- the method may include: treating a substrate by means of a substrate treating apparatus including a transfer chamber; at least one process chamber disposed at one side of the transfer chamber; a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber, wherein substrates are placed in the loadlock chamber to be vertically spaced to face each other, and substrates are placed in the process chamber to be arranged abreast in a lateral direction, wherein the transfer unit comprises a top blade and a bottom blade converted to a folded state where they vertically face each other and an unfolded state where they rotate at a preset angle in opposite directions, and wherein the transfer unit puts/takes a substrate into/out of the loadlock chamber under the folded state and puts/takes a substrate into/out of the process chamber under the unfold
- FIG. 1 is a top plan view of a substrate treating apparatus according to an embodiment of the present invention.
- FIG. 2 is a top plan view of a modified example of the substrate treating apparatus illustrated in FIG. 1 .
- FIG. 3 is a perspective view of a substrate transfer unit illustrated in FIG. 1 .
- FIG. 4 is a cross-sectional view of the substrate transfer unit illustrated in FIG. 3 .
- FIGS. 5 and 6 are perspective views showing unfolded and folded states of a substrate transfer unit, respectively.
- FIGS. 7 through 18 show the steps of transferring wafers during a substrate treatment.
- a substrate treating apparatus having a cluster-type structure will be described in the embodiments, the present invention is not limited thereto and a transfer unit according to the present invention may be applied to apparatuses having various structures.
- the workpiece is not limited to the wafer and may be various objects (e.g., glass substrate) having various plate shapes.
- FIG. 1 is a top plan view of a substrate treating apparatus 1 according to an embodiment of the present invention.
- the substrate treating apparatus 1 includes an equipment front end module 10 and a process equipment 20 .
- the equipment front end module 10 is installed in front of the process equipment 20 to carry a wafer W between the process equipment 20 and a container 16 in which wafers W are housed.
- the equipment front end module 10 includes a plurality of loadports 12 and a frame 14 .
- the container 16 is located on the loadport 12 by transporting means (not shown) such as an overhead transfer, an overhead conveyor or an automatic guided vehicle.
- the container 16 may be a sealing container such as a front opened unified pod (FOUP).
- a frame robot 18 is installed inside the frame 14 to carry a wafer W between the process equipment 20 and the container 16 located on the loadport 12 .
- a door opener (not shown) is installed inside the frame 14 to automatically open and close a door of the container 16 .
- a fan filter unit (not shown) may be provided at the frame 14 . The fan filter unit supplies clean air into the frame 14 to allow the clean air to flow from an upper portion to a lower portion in the frame 14 .
- the process equipment 20 includes a loadlock chamber 22 , a transfer chamber 24 , and a process chamber 26 .
- the transfer chamber 24 exhibits a polygonal shape, when view from the upside.
- the loadlock chamber 24 or the process chamber 26 is disposed at the side surface of the transfer chamber 24 .
- the loadlock chamber 22 is disposed at a side portion adjacent to the equipment front end module 10 , among side portions of the transfer chamber 24 , and the process chamber 26 is disposed at another side portion.
- One or at least two loadlock chambers 22 are provided.
- two loadlock chambers 22 are provided. Wafers W put into the process equipment 20 to perform a process may be contained in one loadlock chamber 22 , and wafers W processed to be taken out of the process equipment 20 may be contained in the other loadlock chamber 22 .
- one or at least two loadlock chambers 22 may be provided and a wafer may be loaded or unloaded at the respective loadlock chambers 22 .
- a plurality of slots 22 a may be provided at the loadlock chamber 22 to support a portion of a wafer edge region.
- the insides of the transfer chamber 24 and the process chamber 26 are kept sealed, and the inside of the loadlock chamber 22 is converted to vacuum and atmospheric pressure.
- the loadlock chamber 22 prevents external contaminants from entering the transfer chamber 24 and the process chamber 26 .
- a gate valve (not shown) is installed between the loadlock chamber 22 and the transfer chamber as well as between the loadlock chamber 22 and the equipment front end module 10 . In the case where a wafer W is carried between the equipment front end module 10 and the loadlock chamber 22 , the gate valve installed between the loadlock chamber 22 and the transfer chamber 24 is closed. In the case where a wafer W is carried between the loadlock chamber 22 and the transfer chamber 24 , the gate valve installed between the loadlock chamber 22 and the equipment front end module 10 is closed.
- a process chamber 26 is provided to perform a predetermined process for a wafer W.
- the predetermined process includes processes using plasma such as, for example, an ashing process, a deposition process, an etching process or a cleaning process.
- each of the process chambers 26 may perform the same process for a wafer W.
- they may perform a series of processes for a wafer W.
- the process chamber 26 includes a housing 72 , in which defined is a space where a process is performed, and a support member 74 .
- the support member 74 is provided inside the housing 72 to support a wafer W during a process.
- the support member 74 may be configured to hold a wafer W by means of mechanical clamping or electrostatic force.
- Two support members 74 are provided inside the housing 72 and arranged alongside each other.
- An entrance 76 is formed at a region facing the transfer chamber 24 , among the outer wall of the housing 72 .
- a wafer W enters or exits through the entrance 76 .
- the entrance 76 may be opened or closed by a door 78 .
- the entrance 76 has a width enough to allow two wafers W to enter or exit at the same time.
- entrances 76 may be provided with the same number as support members 74 provided inside the housing 72 .
- Each of the entrances 76 may have a width enough to allow one wafer W to enter or exit.
- the support members 74 provided inside the housing 72 may increase in number.
- FIG. 2 illustrates another example 1 ′ of the substrate treating apparatus 1 of FIG. 1 .
- a process chamber 26 in the substrate treating apparatus 1 ′ includes a housing 72 and a support member 74 .
- One entrance 76 is provided at the housing 72
- one support member 74 is provided inside the housing 72 .
- two process chambers 26 are arranged alongside each other to constitute one group.
- the entrance 76 may be opened or closed by a door 78 .
- Entrances 76 provided at two process chambers 26 may be opened or closed by one door 78 .
- a door 78 may be provided at the respective process chambers 26 .
- a transfer unit 30 is installed inside a transfer chamber 24 , carrying a wafer W between a process chamber 26 and a loadlock chamber 22 .
- the transfer unit 30 may carry a wafer W between the process chambers 26 .
- the transfer unit 30 includes a blade member 120 , an arm member 140 , a rotation body 160 , and a driving member 180 .
- a wafer W is placed on the blade member 120 .
- the blade member 120 travels with the arm member 140 and is provided to be rotatable with respect to the arm member 140 .
- the driving member 180 provides a driving force to the arm member 140 or the blade member 120 .
- the blade member 120 includes a top blade 120 a and a bottom blade 120 b , which enable two wafers W to be transferred at the same time.
- the bottom blade 120 b is installed on the arm member 140 .
- the top blade 120 a is disposed over the bottom blade 120 b .
- the top and bottom blades 120 a and 120 b are provided so that their relative positions are changeable.
- the top and bottom blades 120 a and 120 b change their positions between a folded state where the top blade is vertically disposed over the bottom blade and an unfolded state where the top and bottom blades rotate oppositely at a preset angle.
- the top and bottom blades 120 a and 120 b of the folded state rotate at a preset angle in opposite directions to be converted to the unfolded state.
- the top blade 120 a includes a first support part 122 , a second support part 124 , and a connecting part 126 .
- Each of the first and second support parts 122 and 124 is a portion on which a wafer W is placed, and the connecting part 126 connects the first and second parts 122 and 124 to each other.
- the connecting part 126 exhibits the shape of a rod.
- the first support part 122 extends from one end of the connecting part 126 in a length direction of the connecting part 126
- the second support part 124 extends from the other end of the connecting part 126 in the length direction of the connecting part 126 .
- the first support part 122 exhibits the same shape as the second support part 124 .
- the first and second support parts 122 and 124 may be provided with the shape of “C”. While the bottom blade 120 b roughly exhibits the same shape as the top blade 120 a , a through-hole is formed at the central region of the connecting part 126 and a rotation shaft is inserted into the through-hole to rotate the top blade 120 a.
- the blade member 120 is provided on the arm member 140 to travel with the arm member 140 .
- the arm member 140 includes a plurality of arms.
- the arm member 140 includes a top arm 140 a and a bottom arm 140 b .
- the top arm 140 a is disposed on the bottom arm 140 b and provided to be rotatable thereon.
- Each of the top and bottom arms 140 a and 140 b exhibits the shape of a long rod.
- formed is an empty space into which components of the driving member 180 are partly inserted.
- An aperture is formed at an upper wall of one end of the top arm 140 a
- an aperture is formed at an upper wall of one end of the bottom arm 140 b .
- the connecting part 126 is disposed on one end of the top arm 140 a , and the other end of the top arm 140 a is disposed on one end of the bottom arm 140 b.
- the rotation body 160 rotates and linearly moves the bottom arm 140 b up and down.
- the rotation body 160 exhibits the shape of a tube in which an empty space is formed.
- An aperture is formed at an upper wall of the rotation body 160 .
- the driving member 180 drives the rotation body 160 , the arm member 140 , and the blade member 120 .
- the driving member 180 includes a rotation body driver 200 , a bottom arm driver 300 , a top arm driver 400 , a bottom blade driver 500 , and a top blade driver 600 .
- the rotation body driver 200 includes a vertical mover 220 linearly moving the rotation body 160 up and down and a rotation driver 240 rotating the rotation body 160 .
- the rotation driver 240 includes a motor 242 , a first pulley 244 , a second pulley 246 , and a belt 248 .
- the first pulley 244 is connected to a motor 242
- the second pulley 246 is provided at the rotation body 160 .
- the first and second pulleys 244 and 246 are connected to each other by the belt 248 .
- a rotatory force of the motor 242 is transferred to the rotation body 160 through the first pulley 244 , the belt 248 , and the second pulley 246 .
- the vertical mover 220 may be provided with an assembly structure including a cylinder.
- the bottom arm driver 300 includes a motor 320 , a rotation shaft 341 , a first pulley 361 , a second pulley 362 , and a belt 381 .
- the motor 320 , the belt 381 , the first pulley 361 , and the second pulley 362 are disposed at a space in the rotation body 160 .
- the rotation shaft 341 extends downwardly from a lower wall of the other end of the bottom arm 140 b to be inserted into the space in the rotation body 160 through the aperture provided at the upper wall of the rotation body 160 .
- the first pulley 361 is connected to the motor 320
- the second pulley 362 is provided at a lower end region of the rotation shaft 341 .
- the belt 381 connects the first and second pulleys 361 and 362 to each other. A rotatory force of the motor 320 is transferred to the bottom arm 140 b through the first pulley 361 , the belt 381 , the second pulley 362 , and the rotation shaft 341 .
- the top arm driver 400 includes a motor 420 , a first rotation shaft 441 , a second rotation shaft 442 , first to fourth pulleys 461 - 464 , a first belt 481 , and a second belt 482 .
- the first rotation shaft 441 extends to a space in the rotation body 160 through the inside of the first rotation shaft 341 of the bottom arm driver 300 from the space in the bottom arm 140 b .
- the second rotation shaft 442 extends downwardly from a lower wall of the other wall of the top arm 140 a to be inserted into the space in the bottom arm 140 b through the aperture provided at an upper wall of one end of the bottom arm 140 b .
- the first pulley 461 is connected to the motor 420
- the second pulley 462 is provided at the bottom end of the first rotation shaft 441 .
- the first and second pulleys 461 and 462 are connected to each other by the first belt 481 .
- the third pulley 463 is provided at the top end of the first rotation shaft 441
- the fourth pulley 464 is provided at the bottom end of the second rotation shaft 442 .
- the third and fourth pulleys 463 and 464 are connected by the second belt 482 .
- a rotatory force of the motor 420 is transferred to the top arm 140 a through the first pulley 461 , the first belt 481 , the second pulley 462 , the first rotation shaft 441 , the third pulley 463 , the second belt 482 , and the second rotation shaft 442 .
- the bottom blade driver 500 includes a motor 520 , first to third rotation shafts 541 - 543 , first to sixth pulleys 561 - 566 , and first to third belts 581 - 583 .
- the first rotation shaft 541 extends to the space in the rotation body 160 from the space in the bottom arm 140 b through the inside of the first rotation shaft 341 of the bottom arm driver 300 .
- the second rotation shaft 542 extends to the space in the bottom arm 140 b from the space in the top arm 140 a through the inside of the second rotation shaft 442 of the top arm driver 400 .
- the third rotation shaft 543 extends downwardly from a lower wall of the connecting part 126 of the bottom blade 120 b to be inserted into the space in the top arm 140 a through the aperture provided at an upper wall of one end of the top arm 140 a .
- the first pulley 561 is connected to the motor 520
- the second pulley is provided at the bottom end of the first rotation shaft 541 .
- the first and second pulleys 561 and 562 are connected to each other by the first belt 581 .
- the third pulley is provided at the top end of the first rotation shaft 541
- the fourth pulley 564 is provide at the bottom end of the second rotation shaft 542 .
- the third and fourth pulleys 563 and 564 are connected to each other by the second belt 582 .
- the fifth pulley 565 is provided at the top end of the second rotation shaft 542
- the sixth pulley 566 is provided at the bottom end of the third rotation shaft 543 .
- the fifth and sixth pulleys 566 are connected to each other by the third belt 583 .
- a rotatory force of the motor 520 is transferred to the bottom blade 120 b through the first pulley 561 , the first belt 581 , the second pulley 562 , the first rotation shaft 541 , the third pulley 563 , the second belt 582 , the fourth pulley 564 , the second rotation shaft 542 , the fifth pulley 565 , the third belt 583 , and the third rotation shaft 543 .
- the top blade driver 600 includes a motor 620 , first to third rotation shafts 641 - 643 , first to sixth pulleys 661 - 666 , and first to third belts 681 - 683 .
- the first rotation shat 641 extends to the space in the rotation body 160 from the space in the bottom arm 140 b through the inside of the first rotation shaft 641 of the bottom blade driver 500 .
- the second rotation shaft 642 extends to the space in the bottom arm 140 b from the space in the top arm 140 a through the inside of the second rotation shaft 442 of the top arm driver 400 .
- the third rotation shaft 643 extends downwardly to the space in the top arm 140 a from a lower wall of the connecting part 126 of the top blade 120 a through the through-hole provided at the bottom blade 120 b and the inside of the third rotation shaft 543 of the bottom blade driver 500 .
- the first pulley 661 is connected to the motor 620
- the second pulley 662 is provided at the bottom end of the first rotation shaft 641 .
- the first and second pulleys 661 and 662 are connected to each other by the first belt 681 .
- the third pulley 663 is provided at the top end of the first rotation body 641
- the fourth pulley 664 is provided at the bottom end of the second rotation shaft 642 .
- the third and fourth pulleys 663 and 664 are connected to each other by the second belt 682 .
- the fifth pulley 665 is provided at the top end of the second rotation shaft 642
- the sixth pulley 666 is provided at the bottom end of the third rotation shaft 643 .
- the fifth and sixth pulleys 665 and 666 are connected to each other by the third belt 683 .
- a rotatory force of the motor 620 is transferred to the top blade 120 a through the first pulley 661 , the first belt 681 , the second pulley 662 , the first rotation shaft 641 , the third pulley 663 , the second belt 682 , the fourth pulley 664 , the second rotation shaft 642 , the fifth pulley 665 , the third belt 683 , the sixth pulley 666 , and the third rotation shaft 643 .
- the first rotation shaft 541 of the bottom blade driver 500 is inserted into the first rotation shaft 341 of the bottom arm driver 300 , both ends of the first rotation shaft 541 of the bottom blade driver 500 protrude from opposite ends of the first rotation shaft 341 of the bottom arm driver 600 .
- the first rotation shaft 641 of the top blade driver 600 is inserted into the first rotation shaft 541 of the bottom blade driver 500 , both ends of the first rotation shaft 641 of the top blade driver 600 further protrude from the opposite ends of the first rotation shaft 541 of the bottom blade driver 500 .
- the second rotation shaft 542 of the bottom blade driver 500 is inserted into the second rotation shaft 542 of the top blade driver 600 , both ends of the second rotation shaft 542 of the bottom blade driver 500 protrude from the opposite ends of the second rotation shaft 642 of the top blade driver 600 .
- the bottom arm 140 b , the top arm 140 a , the bottom blade 120 b , and the top blade 120 a are independently driven by their respective drivers 300 , 400 , 500 , and 600 ”, the bottom arm 140 and the top arm 140 a may gear with each other to be driven by one driver and the bottom blade 120 b and the top blade 120 a may gear with each other to be driven by one driver.
- the blade member 120 is maintained at a folded state when wafers W are taken out of or put into a loadlock chamber 22 where the wafers W are stacked.
- the blade member 120 is maintained at an unfolded state when wafers W are taken out of or put into a process chamber 26 where the wafers W are horizontally placed.
- FIG. 4 shows that wafers W are put into the process chamber 26 under an unfolded state of the blade member 120
- FIG. 5 shows that wafers W are put into a loadlock chamber 22 under a folded sate of the blade member 120 .
- each of the top blade 120 a and the bottom blade 120 b has a first support part 122 and a second support part 124 . Therefore, during a process for wafers W, the blade member 120 waits at a process chamber 26 in state that wafers W to be subjected to the next process are supported at their first support parts 122 . When the process is completed inside the process chamber 26 , the blade member 120 takes wafers W out of the process chamber 26 by using empty second support parts 124 . Immediately after the bottom blade 120 b and the top blade 120 a rotate with respect to an arm member 140 at an angle of 180 degrees, the wafers W placed at the first support parts 122 are put into the process chamber 26 . Thus, time required for placing new wafers W after taking wafers W out of the process chamber 26 is reduced to increase the treating amount of the process chamber 26 .
- two process chambers 26 are provided to sequentially perform a series of processes and two support members 74 are provided inside the respective process chambers 26 .
- Wafers W are stacked at a loadlock chamber 22 to be spaced apart from each other.
- a blade member 120 takes a first wafer W 1 and a second wafer W 2 out of the loadlock chamber 22 by using the first support parts 122 (see FIG. 7 ).
- a blade member 120 puts a first wafer W 1 and a second wafer W 2 into a first process chamber 26 a by using the first support parts 122 (see FIG. 8 ).
- a first process is performed for the first and second wafers W 1 and W 2 .
- the blade member 120 takes a third wafer W 3 and a fourth wafer W 4 out of the loadlock chamber 22 by using the first support parts 122 (see FIG. 9 ).
- the blade member 120 may take third and fourth wafers W 3 and W 4 out of the loadlock chamber 22 by using second support parts 124 instead of the first support parts 122 .
- the blade member 120 waits at the first process chamber 26 a until the process for the first and second wafers W 1 and W 2 are completed. When the process for the first and second wafers W 1 and W 2 is completed, the blade member 120 takes the first and second wafers W 1 and W 2 out of the first process chamber 26 a by using the second support parts 124 (see FIG. 10 ).
- the blade member 120 puts the first and second wafers W 1 and W 2 by using the second support parts 124 (see FIG. 11 ).
- a process for a first wafer W 1 and a second wafer W 2 is performed in a second process chamber 26 b .
- the blade member 120 puts a third wafer W 3 and a fourth wafer W 4 into the first process chamber 26 a (see FIG. 12 ).
- the blade member 120 puts the first and second wafers W 1 and W 2 into the second process chamber 26 b after putting the third and fourth wafers W 3 and W 4 into the first process chamber 26 a.
- a process for the third and fourth wafers W 3 and W 4 is performed in the first process chamber 26 a .
- the blade member 120 takes a fifth wafer W 5 and a sixth wafer W 6 out of the loadlock chamber 22 by using the first support parts 122 (see FIG. 13 ).
- the blade member 120 takes the first and second wafers W 1 and W 2 out of the second process chamber 26 b under the unfolded state by using the second support parts 124 (see FIG. 14 ).
- the blade member 120 puts the first and second wafers W 1 and W 2 into the loadlock chamber 22 by using the second support parts 124 (see FIG. 15 ).
- the blade member 120 takes the third and fourth wafers W 3 and W 4 under the unfolded state by using the second support parts 124 (see FIG. 16 ).
- the blade member 120 puts the third and fourth wafers W 3 and W 4 into the second process chamber 26 b by using the second support parts 124 (see FIG. 17 ).
- a process for the third and fourth wafers W 3 and W 4 is performed in the second process chamber 26 b .
- the blade member 120 puts the fifth and sixth wafers W 5 and W 6 into the first process chamber 26 a by using the first support parts 122 (see FIG. 18 ).
- the blade member 120 puts the third and fourth wafers W 3 and W 4 into the first process chamber 26 a after putting the fifth and sixth wafers W 5 and W 6 into the first process chamber 26 a.
- a process for the fifth and sixth wafers W 5 and W 6 is performed in the first process chamber 26 a , the blade member 120 takes new wafers W out of the loadlock chamber 22 and waits at the first process chamber 26 a , and the above-described steps are repeated until processes for all wafers W is completed.
- the present invention may be applied to any structure where two wafers are simultaneously transferred between first support plates on which wafers W are stacked to be spaced apart from each other and second support plates on which wafers W are placed in a lateral direction.
- the first support plates correspond to the slot 22 a provided at the loadlock chamber 22 and the second support plates correspond to support members.
- the method for transferring wafers W between the first support plates and the second support plates is similar to the method for transferring wafers W between the slot 22 a in the loadlock chamber 22 and the support members 74 inside the process chamber 26 and will not be described in further detail.
- each blade includes two support parts to put wafers into a process chamber immediately after taking the wafers out of the process chamber.
- the treating amount of the process chamber increases.
Abstract
The present invention is related to a method for transferring substrates. The method comprise simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction. The transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions. The transfer unit place/take a substrate on/out of the first support plates under the folded state and place/take a substrate on/out of the second support plates under the unfolded state.
Description
- This U.S. non-provisional patent application is a continuation-in-part application of U.S. patent application Ser. No. 11/655,182 filed on Jan. 9, 2007 and claims priority under 35 U.S.C § 119 of Korean Patent Application 2007-42599 filed on May 2, 2007, the entirety of both of which are hereby incorporated by reference.
- The present invention relates to apparatuses and methods for use in manufacturing semiconductor substrates. More specifically, the present invention is directed to unit and method for transferring substrates and apparatus and method for treating substrates with the unit.
- In recent years, cluster-type apparatuses are increasingly used to manufacture semiconductor devices. A cluster-type apparatus has a configuration where a loadlock chamber and process chambers are disposed around a transfer chamber. Generally, wafers are placed in a loadlock chamber and vertically spaced to face each other. Two chucks, on which substrates are to be mounted, are provided inside one process chamber and disposed abreast in a side direction.
- A transfer unit is provided at a transfer chamber to transfer a wafer between a loadlock chamber and a process chamber and between one process chamber and another process chamber. Since the transfer unit has only one blade on which a wafer is placed, only one wafer can be transferred at one time. In order to mount wafers on their respective chucks, a transfer unit must carry wafers between a loadlock chamber and a process chamber twice. Thus, it takes much time to transfer wafers. In the case where two robots operating independently may be provided at a transfer chamber, an occupied area of the transfer chamber increases due to the two robots. Further, since the two robots cannot enter one loadlock chamber at the same time, one robot must wait until the other robot takes a wafer out of a loadlock chamber.
- In addition, a typical transfer unit includes only one holding part where a wafer is placed on a blade. After taking a processed wafer out of a process chamber and putting the wafer into a loadlock chamber, a blade takes another wafer out of the loadlock chamber and carries the wafer to the process chamber. Accordingly, until a process for the next wafer is performed inside a process chamber after a process for a wafer is performed, much time is required for transferring a wafer to significantly decrease a treating amount of the process chamber.
- Exemplary embodiments of the present invention are directed to a unit for transferring substrates. In an exemplary embodiment, the unit may include: a blade member on which a substrate is placed; an arm member coupled with the blade member to carry the blade member; and a driving member configured to supply a driving force to the blade member or the arm member, wherein the blade member comprises: a bottom blade; and a top blade disposed over the bottom blade to change a relative position with respect to the bottom blade.
- In another exemplary embodiment, the unit may include: a top blade including at least two support parts on which a substrate is placed; and a bottom blade including at least two support parts on which a substrate is placed, the bottom blade being disposed below the top blade, wherein the top and bottom blades are carried by means of one arm member, and wherein the top and bottom blades are provided to be converted to a folded state where they vertically face each other and an unfolded state where they are widened at a preset angle.
- Exemplary embodiments of the present invention are directed to an apparatus for treating substrates. In an exemplary embodiment, the apparatus may include: a transfer chamber; at least one process chamber disposed at one side of the transfer chamber; a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber, wherein the transfer unit comprises: a blade member on which a substrate is placed; an arm member coupled with the blade member to carry the blade member; and a driving member configured to supply a driving force to the blade member and the arm member, and wherein the blade member comprises: a bottom blade; and a top blade disposed over the bottom blade, wherein the bottom and top blades are provided to change their relative positions.
- Exemplary embodiments of the present invention are directed to a method for transferring substrates. In an exemplary embodiment, the method may include: simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction, wherein a transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions to place/take a substrate on/out of the first support plates under the folded state or place/take a substrate on/out of the second support plates under the unfolded state.
- Exemplary embodiments of the present invention are directed to a method for treating substrates. In an exemplary embodiment, the method may include: treating a substrate by means of a substrate treating apparatus including a transfer chamber; at least one process chamber disposed at one side of the transfer chamber; a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber, wherein substrates are placed in the loadlock chamber to be vertically spaced to face each other, and substrates are placed in the process chamber to be arranged abreast in a lateral direction, wherein the transfer unit comprises a top blade and a bottom blade converted to a folded state where they vertically face each other and an unfolded state where they rotate at a preset angle in opposite directions, and wherein the transfer unit puts/takes a substrate into/out of the loadlock chamber under the folded state and puts/takes a substrate into/out of the process chamber under the unfolded state.
-
FIG. 1 is a top plan view of a substrate treating apparatus according to an embodiment of the present invention. -
FIG. 2 is a top plan view of a modified example of the substrate treating apparatus illustrated inFIG. 1 . -
FIG. 3 is a perspective view of a substrate transfer unit illustrated inFIG. 1 . -
FIG. 4 is a cross-sectional view of the substrate transfer unit illustrated inFIG. 3 . -
FIGS. 5 and 6 are perspective views showing unfolded and folded states of a substrate transfer unit, respectively. -
FIGS. 7 through 18 show the steps of transferring wafers during a substrate treatment. - The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention, however, may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In top plan views among the drawings, a hidden one of two vertically overlapped wafers is drawn by a dotted line and a hidden one of two vertically overlapped blades is also drawn by a dotted line.
- While a substrate treating apparatus having a cluster-type structure will be described in the embodiments, the present invention is not limited thereto and a transfer unit according to the present invention may be applied to apparatuses having various structures.
- In addition, while a wafer for manufacturing semiconductor chips will be described in the embodiments as a workpiece transferred by a transfer unit, the workpiece is not limited to the wafer and may be various objects (e.g., glass substrate) having various plate shapes.
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FIG. 1 is a top plan view of asubstrate treating apparatus 1 according to an embodiment of the present invention. Thesubstrate treating apparatus 1 includes an equipmentfront end module 10 and aprocess equipment 20. - The equipment
front end module 10 is installed in front of theprocess equipment 20 to carry a wafer W between theprocess equipment 20 and acontainer 16 in which wafers W are housed. The equipmentfront end module 10 includes a plurality ofloadports 12 and aframe 14. Thecontainer 16 is located on theloadport 12 by transporting means (not shown) such as an overhead transfer, an overhead conveyor or an automatic guided vehicle. Thecontainer 16 may be a sealing container such as a front opened unified pod (FOUP). Aframe robot 18 is installed inside theframe 14 to carry a wafer W between theprocess equipment 20 and thecontainer 16 located on theloadport 12. A door opener (not shown) is installed inside theframe 14 to automatically open and close a door of thecontainer 16. A fan filter unit (not shown) may be provided at theframe 14. The fan filter unit supplies clean air into theframe 14 to allow the clean air to flow from an upper portion to a lower portion in theframe 14. - The
process equipment 20 includes aloadlock chamber 22, atransfer chamber 24, and aprocess chamber 26. Thetransfer chamber 24 exhibits a polygonal shape, when view from the upside. Theloadlock chamber 24 or theprocess chamber 26 is disposed at the side surface of thetransfer chamber 24. - The
loadlock chamber 22 is disposed at a side portion adjacent to the equipmentfront end module 10, among side portions of thetransfer chamber 24, and theprocess chamber 26 is disposed at another side portion. One or at least twoloadlock chambers 22 are provided. In an exemplary embodiment, twoloadlock chambers 22 are provided. Wafers W put into theprocess equipment 20 to perform a process may be contained in oneloadlock chamber 22, and wafers W processed to be taken out of theprocess equipment 20 may be contained in theother loadlock chamber 22. Alternatively, one or at least twoloadlock chambers 22 may be provided and a wafer may be loaded or unloaded at therespective loadlock chambers 22. - Inside the
loadlock chamber 22, wafers are vertically spaced to face each other. A plurality of slots 22 a may be provided at theloadlock chamber 22 to support a portion of a wafer edge region. - The insides of the
transfer chamber 24 and theprocess chamber 26 are kept sealed, and the inside of theloadlock chamber 22 is converted to vacuum and atmospheric pressure. Theloadlock chamber 22 prevents external contaminants from entering thetransfer chamber 24 and theprocess chamber 26. A gate valve (not shown) is installed between theloadlock chamber 22 and the transfer chamber as well as between theloadlock chamber 22 and the equipmentfront end module 10. In the case where a wafer W is carried between the equipmentfront end module 10 and theloadlock chamber 22, the gate valve installed between theloadlock chamber 22 and thetransfer chamber 24 is closed. In the case where a wafer W is carried between theloadlock chamber 22 and thetransfer chamber 24, the gate valve installed between theloadlock chamber 22 and the equipmentfront end module 10 is closed. - A
process chamber 26 is provided to perform a predetermined process for a wafer W. The predetermined process includes processes using plasma such as, for example, an ashing process, a deposition process, an etching process or a cleaning process. In the event that a plurality ofprocess chambers 26 are provided, each of theprocess chambers 26 may perform the same process for a wafer W. Optionally in the event that a plurality ofprocess chambers 26 are provided, they may perform a series of processes for a wafer W. - The
process chamber 26 includes ahousing 72, in which defined is a space where a process is performed, and asupport member 74. Thesupport member 74 is provided inside thehousing 72 to support a wafer W during a process. Thesupport member 74 may be configured to hold a wafer W by means of mechanical clamping or electrostatic force. Twosupport members 74 are provided inside thehousing 72 and arranged alongside each other. Anentrance 76 is formed at a region facing thetransfer chamber 24, among the outer wall of thehousing 72. A wafer W enters or exits through theentrance 76. Theentrance 76 may be opened or closed by adoor 78. Theentrance 76 has a width enough to allow two wafers W to enter or exit at the same time. Optionally, entrances 76 may be provided with the same number assupport members 74 provided inside thehousing 72. Each of theentrances 76 may have a width enough to allow one wafer W to enter or exit. Thesupport members 74 provided inside thehousing 72 may increase in number. -
FIG. 2 illustrates another example 1′ of thesubstrate treating apparatus 1 ofFIG. 1 . Aprocess chamber 26 in thesubstrate treating apparatus 1′ includes ahousing 72 and asupport member 74. Oneentrance 76 is provided at thehousing 72, and onesupport member 74 is provided inside thehousing 72. Among a plurality ofprocess chambers 26, twoprocess chambers 26 are arranged alongside each other to constitute one group. Theentrance 76 may be opened or closed by adoor 78.Entrances 76 provided at twoprocess chambers 26 may be opened or closed by onedoor 78. Optionally, adoor 78 may be provided at therespective process chambers 26. - A
transfer unit 30 is installed inside atransfer chamber 24, carrying a wafer W between aprocess chamber 26 and aloadlock chamber 22. In the case where a plurality ofprocess chambers 26 are provided, thetransfer unit 30 may carry a wafer W between theprocess chambers 26. As illustrated inFIG. 3 , thetransfer unit 30 includes ablade member 120, anarm member 140, arotation body 160, and a driving member 180. A wafer W is placed on theblade member 120. Theblade member 120 travels with thearm member 140 and is provided to be rotatable with respect to thearm member 140. The driving member 180 provides a driving force to thearm member 140 or theblade member 120. - The
blade member 120 includes atop blade 120 a and abottom blade 120 b, which enable two wafers W to be transferred at the same time. Thebottom blade 120 b is installed on thearm member 140. Thetop blade 120 a is disposed over thebottom blade 120 b. The top andbottom blades bottom blades bottom blades - The
top blade 120 a includes afirst support part 122, asecond support part 124, and a connectingpart 126. Each of the first andsecond support parts part 126 connects the first andsecond parts part 126 exhibits the shape of a rod. Thefirst support part 122 extends from one end of the connectingpart 126 in a length direction of the connectingpart 126, and thesecond support part 124 extends from the other end of the connectingpart 126 in the length direction of the connectingpart 126. Thefirst support part 122 exhibits the same shape as thesecond support part 124. The first andsecond support parts bottom blade 120 b roughly exhibits the same shape as thetop blade 120 a, a through-hole is formed at the central region of the connectingpart 126 and a rotation shaft is inserted into the through-hole to rotate thetop blade 120 a. - The
blade member 120 is provided on thearm member 140 to travel with thearm member 140. Thearm member 140 includes a plurality of arms. In an exemplary embodiment, thearm member 140 includes atop arm 140 a and abottom arm 140 b. Thetop arm 140 a is disposed on thebottom arm 140 b and provided to be rotatable thereon. Each of the top andbottom arms bottom arms top arm 140 a, and an aperture is formed at an upper wall of one end of thebottom arm 140 b. The connectingpart 126 is disposed on one end of thetop arm 140 a, and the other end of thetop arm 140 a is disposed on one end of thebottom arm 140 b. - The
rotation body 160 rotates and linearly moves thebottom arm 140 b up and down. Therotation body 160 exhibits the shape of a tube in which an empty space is formed. An aperture is formed at an upper wall of therotation body 160. - The driving member 180 drives the
rotation body 160, thearm member 140, and theblade member 120. As illustrated inFIG. 6 , the driving member 180 includes arotation body driver 200, abottom arm driver 300, atop arm driver 400, abottom blade driver 500, and atop blade driver 600. Therotation body driver 200 includes avertical mover 220 linearly moving therotation body 160 up and down and arotation driver 240 rotating therotation body 160. Therotation driver 240 includes amotor 242, afirst pulley 244, asecond pulley 246, and abelt 248. Thefirst pulley 244 is connected to amotor 242, and thesecond pulley 246 is provided at therotation body 160. The first andsecond pulleys belt 248. A rotatory force of themotor 242 is transferred to therotation body 160 through thefirst pulley 244, thebelt 248, and thesecond pulley 246. Thevertical mover 220 may be provided with an assembly structure including a cylinder. - The
bottom arm driver 300 includes amotor 320, arotation shaft 341, afirst pulley 361, asecond pulley 362, and abelt 381. Themotor 320, thebelt 381, thefirst pulley 361, and thesecond pulley 362 are disposed at a space in therotation body 160. Therotation shaft 341 extends downwardly from a lower wall of the other end of thebottom arm 140 b to be inserted into the space in therotation body 160 through the aperture provided at the upper wall of therotation body 160. Thefirst pulley 361 is connected to themotor 320, and thesecond pulley 362 is provided at a lower end region of therotation shaft 341. Thebelt 381 connects the first andsecond pulleys motor 320 is transferred to thebottom arm 140 b through thefirst pulley 361, thebelt 381, thesecond pulley 362, and therotation shaft 341. - The
top arm driver 400 includes amotor 420, afirst rotation shaft 441, asecond rotation shaft 442, first to fourth pulleys 461-464, afirst belt 481, and asecond belt 482. Thefirst rotation shaft 441 extends to a space in therotation body 160 through the inside of thefirst rotation shaft 341 of thebottom arm driver 300 from the space in thebottom arm 140 b. Thesecond rotation shaft 442 extends downwardly from a lower wall of the other wall of thetop arm 140 a to be inserted into the space in thebottom arm 140 b through the aperture provided at an upper wall of one end of thebottom arm 140 b. Thefirst pulley 461 is connected to themotor 420, and thesecond pulley 462 is provided at the bottom end of thefirst rotation shaft 441. The first andsecond pulleys first belt 481. Thethird pulley 463 is provided at the top end of thefirst rotation shaft 441, and thefourth pulley 464 is provided at the bottom end of thesecond rotation shaft 442. The third andfourth pulleys second belt 482. A rotatory force of themotor 420 is transferred to thetop arm 140 a through thefirst pulley 461, thefirst belt 481, thesecond pulley 462, thefirst rotation shaft 441, thethird pulley 463, thesecond belt 482, and thesecond rotation shaft 442. - The
bottom blade driver 500 includes amotor 520, first to third rotation shafts 541-543, first to sixth pulleys 561-566, and first to third belts 581-583. Thefirst rotation shaft 541 extends to the space in therotation body 160 from the space in thebottom arm 140 b through the inside of thefirst rotation shaft 341 of thebottom arm driver 300. Thesecond rotation shaft 542 extends to the space in thebottom arm 140 b from the space in thetop arm 140 a through the inside of thesecond rotation shaft 442 of thetop arm driver 400. Thethird rotation shaft 543 extends downwardly from a lower wall of the connectingpart 126 of thebottom blade 120 b to be inserted into the space in thetop arm 140 a through the aperture provided at an upper wall of one end of thetop arm 140 a. Thefirst pulley 561 is connected to themotor 520, and the second pulley is provided at the bottom end of thefirst rotation shaft 541. The first andsecond pulleys first belt 581. The third pulley is provided at the top end of thefirst rotation shaft 541, and thefourth pulley 564 is provide at the bottom end of thesecond rotation shaft 542. The third andfourth pulleys second belt 582. Thefifth pulley 565 is provided at the top end of thesecond rotation shaft 542, and thesixth pulley 566 is provided at the bottom end of thethird rotation shaft 543. The fifth andsixth pulleys 566 are connected to each other by thethird belt 583. A rotatory force of themotor 520 is transferred to thebottom blade 120 b through thefirst pulley 561, thefirst belt 581, thesecond pulley 562, thefirst rotation shaft 541, thethird pulley 563, thesecond belt 582, thefourth pulley 564, thesecond rotation shaft 542, thefifth pulley 565, thethird belt 583, and thethird rotation shaft 543. - The
top blade driver 600 includes amotor 620, first to third rotation shafts 641-643, first to sixth pulleys 661-666, and first to third belts 681-683. The first rotation shat 641 extends to the space in therotation body 160 from the space in thebottom arm 140 b through the inside of thefirst rotation shaft 641 of thebottom blade driver 500. Thesecond rotation shaft 642 extends to the space in thebottom arm 140 b from the space in thetop arm 140 a through the inside of thesecond rotation shaft 442 of thetop arm driver 400. Thethird rotation shaft 643 extends downwardly to the space in thetop arm 140 a from a lower wall of the connectingpart 126 of thetop blade 120 a through the through-hole provided at thebottom blade 120 b and the inside of thethird rotation shaft 543 of thebottom blade driver 500. Thefirst pulley 661 is connected to themotor 620, and thesecond pulley 662 is provided at the bottom end of thefirst rotation shaft 641. The first andsecond pulleys first belt 681. Thethird pulley 663 is provided at the top end of thefirst rotation body 641, and thefourth pulley 664 is provided at the bottom end of thesecond rotation shaft 642. The third andfourth pulleys second belt 682. Thefifth pulley 665 is provided at the top end of thesecond rotation shaft 642, and thesixth pulley 666 is provided at the bottom end of thethird rotation shaft 643. The fifth andsixth pulleys third belt 683. A rotatory force of themotor 620 is transferred to thetop blade 120 a through thefirst pulley 661, thefirst belt 681, thesecond pulley 662, thefirst rotation shaft 641, thethird pulley 663, thesecond belt 682, thefourth pulley 664, thesecond rotation shaft 642, thefifth pulley 665, thethird belt 683, thesixth pulley 666, and thethird rotation shaft 643. - The
first rotation shaft 541 of thebottom blade driver 500 is inserted into thefirst rotation shaft 341 of thebottom arm driver 300, both ends of thefirst rotation shaft 541 of thebottom blade driver 500 protrude from opposite ends of thefirst rotation shaft 341 of thebottom arm driver 600. Thefirst rotation shaft 641 of thetop blade driver 600 is inserted into thefirst rotation shaft 541 of thebottom blade driver 500, both ends of thefirst rotation shaft 641 of thetop blade driver 600 further protrude from the opposite ends of thefirst rotation shaft 541 of thebottom blade driver 500. Thesecond rotation shaft 542 of thebottom blade driver 500 is inserted into thesecond rotation shaft 542 of thetop blade driver 600, both ends of thesecond rotation shaft 542 of thebottom blade driver 500 protrude from the opposite ends of thesecond rotation shaft 642 of thetop blade driver 600. - While it is described in the foregoing configuration that “the
bottom arm 140 b, thetop arm 140 a, thebottom blade 120 b, and thetop blade 120 a are independently driven by theirrespective drivers bottom arm 140 and thetop arm 140 a may gear with each other to be driven by one driver and thebottom blade 120 b and thetop blade 120 a may gear with each other to be driven by one driver. - The
blade member 120 is maintained at a folded state when wafers W are taken out of or put into aloadlock chamber 22 where the wafers W are stacked. Theblade member 120 is maintained at an unfolded state when wafers W are taken out of or put into aprocess chamber 26 where the wafers W are horizontally placed.FIG. 4 shows that wafers W are put into theprocess chamber 26 under an unfolded state of theblade member 120, andFIG. 5 shows that wafers W are put into aloadlock chamber 22 under a folded sate of theblade member 120. - As described above, each of the
top blade 120 a and thebottom blade 120 b has afirst support part 122 and asecond support part 124. Therefore, during a process for wafers W, theblade member 120 waits at aprocess chamber 26 in state that wafers W to be subjected to the next process are supported at theirfirst support parts 122. When the process is completed inside theprocess chamber 26, theblade member 120 takes wafers W out of theprocess chamber 26 by using emptysecond support parts 124. Immediately after thebottom blade 120 b and thetop blade 120 a rotate with respect to anarm member 140 at an angle of 180 degrees, the wafers W placed at thefirst support parts 122 are put into theprocess chamber 26. Thus, time required for placing new wafers W after taking wafers W out of theprocess chamber 26 is reduced to increase the treating amount of theprocess chamber 26. - A substrate treating method according to an embodiment of the present invention will now be described below. In this embodiment, two
process chambers 26 are provided to sequentially perform a series of processes and twosupport members 74 are provided inside therespective process chambers 26. - Wafers W are stacked at a
loadlock chamber 22 to be spaced apart from each other. - Under a folded state, a
blade member 120 takes a first wafer W1 and a second wafer W2 out of theloadlock chamber 22 by using the first support parts 122 (seeFIG. 7 ). - Under an unfolded state, a
blade member 120 puts a first wafer W1 and a second wafer W2 into afirst process chamber 26 a by using the first support parts 122 (seeFIG. 8 ). - In the
first process chamber 26 a, a first process is performed for the first and second wafers W1 and W2. Under the folded state, theblade member 120 takes a third wafer W3 and a fourth wafer W4 out of theloadlock chamber 22 by using the first support parts 122 (seeFIG. 9 ). Theblade member 120 may take third and fourth wafers W3 and W4 out of theloadlock chamber 22 by usingsecond support parts 124 instead of thefirst support parts 122. - The
blade member 120 waits at thefirst process chamber 26 a until the process for the first and second wafers W1 and W2 are completed. When the process for the first and second wafers W1 and W2 is completed, theblade member 120 takes the first and second wafers W1 and W2 out of thefirst process chamber 26 a by using the second support parts 124 (seeFIG. 10 ). - Under the unfolded state, the
blade member 120 puts the first and second wafers W1 and W2 by using the second support parts 124 (seeFIG. 11 ). - A process for a first wafer W1 and a second wafer W2 is performed in a
second process chamber 26 b. Under the unfolded state, theblade member 120 puts a third wafer W3 and a fourth wafer W4 into thefirst process chamber 26 a (seeFIG. 12 ). - Alternatively, the
blade member 120 puts the first and second wafers W1 and W2 into thesecond process chamber 26 b after putting the third and fourth wafers W3 and W4 into thefirst process chamber 26 a. - A process for the third and fourth wafers W3 and W4 is performed in the
first process chamber 26 a. Under a folded state, theblade member 120 takes a fifth wafer W5 and a sixth wafer W6 out of theloadlock chamber 22 by using the first support parts 122 (seeFIG. 13 ). - When the process for the first and second wafers W1 and W2 is completed in the
second process chamber 26 b, theblade member 120 takes the first and second wafers W1 and W2 out of thesecond process chamber 26 b under the unfolded state by using the second support parts 124 (seeFIG. 14 ). - Under the folded state, the
blade member 120 puts the first and second wafers W1 and W2 into theloadlock chamber 22 by using the second support parts 124 (seeFIG. 15 ). - When the process for the third and fourth wafers W3 and W4 is completed in the
first process chamber 26 a, theblade member 120 takes the third and fourth wafers W3 and W4 under the unfolded state by using the second support parts 124 (seeFIG. 16 ). - Under the unfolded state, the
blade member 120 puts the third and fourth wafers W3 and W4 into thesecond process chamber 26 b by using the second support parts 124 (seeFIG. 17 ). - A process for the third and fourth wafers W3 and W4 is performed in the
second process chamber 26 b. Under the unfolded state, theblade member 120 puts the fifth and sixth wafers W5 and W6 into thefirst process chamber 26 a by using the first support parts 122 (seeFIG. 18 ). - Alternatively, the
blade member 120 puts the third and fourth wafers W3 and W4 into thefirst process chamber 26 a after putting the fifth and sixth wafers W5 and W6 into thefirst process chamber 26 a. - A process for the fifth and sixth wafers W5 and W6 is performed in the
first process chamber 26 a, theblade member 120 takes new wafers W out of theloadlock chamber 22 and waits at thefirst process chamber 26 a, and the above-described steps are repeated until processes for all wafers W is completed. - While a method for transferring wafers W at a cluster-type substrate treating apparatus has been described, the present invention may be applied to any structure where two wafers are simultaneously transferred between first support plates on which wafers W are stacked to be spaced apart from each other and second support plates on which wafers W are placed in a lateral direction. In this case, the first support plates correspond to the slot 22 a provided at the
loadlock chamber 22 and the second support plates correspond to support members. The method for transferring wafers W between the first support plates and the second support plates is similar to the method for transferring wafers W between the slot 22 a in theloadlock chamber 22 and thesupport members 74 inside theprocess chamber 26 and will not be described in further detail. - As described so far, a substrate transfer unit can be converted to a folded state and an unfolded state. Thus, a transfer efficiency of wafers is significantly enhanced and an area occupied by the substrate transfer unit is reduced. In addition, each blade includes two support parts to put wafers into a process chamber immediately after taking the wafers out of the process chamber. Thus, the treating amount of the process chamber increases.
- Although the present invention has been described in connection with the embodiment of the present invention illustrated in the accompanying drawings, it is not limited thereto. It will be apparent to those skilled in the art that various substitutions, modifications and changes may be made without departing from the scope and spirit of the invention.
Claims (18)
1. The A unit for transferring substrates, comprising:
a blade member on which a substrate is placed;
an arm member coupled with the blade member to carry the blade member; and
a driving member configured to supply a driving force to the blade member or the arm member,
wherein the blade member comprises:
a bottom blade; and
a top blade disposed over the bottom blade that can change a relative position with respect to the bottom blade.
2. The unit as recited in claim 1 , wherein each of the bottom and top blades comprises:
a first support part on which a substrate is placed;
a second support part on which a substrate is placed; and
a connecting part configured to connect the first and second support parts.
3. The unit as recited in claim 2 , wherein the first support part extends from one end of the connecting part, and the second support part extends from the other end of the connecting part in a direction opposite to a direction in which the first support part extends from the connecting part, and
wherein a rotation shaft connecting the bottom blade to the arm member and a rotation shaft connecting the top blade to the arm member are coupled with the connecting part.
4. The unit as recited in claim 2 , wherein the top and bottom blades are provided to change their positions between a folded state where the top blade is vertically disposed over the bottom blade and an unfolded state where the top and bottom blades rotate oppositely at a preset angle.
5. The unit as recited in claim 1 , wherein the driving member comprises:
a blade driver configured to rotate the blade member independently of the arm member; and
a vertical mover configured to elevating the arm member and the blade member,
wherein the blade driver comprises:
a bottom blade driver configured to rotate the bottom blade; and
a top blade driver configured to rotate the top blade.
6. The unit as recited in claim 5 , wherein the bottom blade driver includes a rotation shaft extending to the inside of the arm member from a lower portion of the connecting part of the bottom blade through an aperture provided at an upper wall of the arm member, and
wherein the top blade driver includes a rotation shaft inserted into a through-hole provided at the connecting part of the bottom blade and the rotation shaft of the bottom blade driver to extend to the inside of the arm member from a lower portion of the connecting part of the top blade.
7. A unit for transferring substrates, comprising:
a top blade including at least two support parts on which a substrate is placed; and
a bottom blade including at least two support parts on which a substrate is placed, the bottom blade being disposed below the top blade,
wherein the top and bottom blades are carried by means of one arm member, and
wherein the top and bottom blades are provided to be converted to a folded state where they vertically face each other and an unfolded state where they are widened at a preset angle.
8. The unit as recited in claim 7 , wherein the top and bottom blades have the same shape,
wherein each of the top and bottom blades includes a rod-shaped connecting part rotatably coupled with the arm member, and
wherein the support part extends from opposite ends of the connecting part in a length direction of the connecting part.
9. An apparatus for treating substrates, comprising:
a transfer chamber;
at least one process chamber disposed at one side of the transfer chamber;
a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and
a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber,
wherein the transfer unit comprises:
a blade member on which a substrate is placed;
an arm member coupled with the blade member to carry the blade member; and
a driving member configured to supply a driving force to the blade member and the arm member, and
wherein the blade member comprises:
a bottom blade; and
a top blade disposed over the bottom blade,
wherein the bottom and top blades are provided to change their relative positions.
10. The apparatus as recited in claim 9 , wherein the process chamber comprises:
a housing with a sidewall where provided is an entrance through which substrates enter or exit; and
supporting members, arranged in a row inside the housing, on which a substrate is placed.
11. The apparatus as recited in claim 9 , wherein the process chamber comprises:
a housing with a sidewall where provided is an entrance through which substrates enter or exit; and
supporting members, arranged inside the housing, on which a substrate is placed, and the apparatus comprising:
a plurality of the process chambers, wherein at least two of the process chambers are arranged in a row.
12. The apparatus as recited in claim 9 , wherein the top and bottom blades are provided to be converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle from the folded state in opposite directions.
13. The apparatus as recited in claim 12 , wherein each of the bottom and top blades comprises:
a first support part on which a substrate is placed;
a second support part on which a substrate is placed; and
a connecting part configured to connect the first and second support parts,
wherein the first support part extends from one end of the connecting part, and the second support part extends from the other end of the connecting part in a direction opposite to a direction in which the first support part extends from the connecting part, and
wherein a rotation shaft connecting the bottom blade to the arm member is coupled with the connecting part of the bottom blade, and a rotation shaft connecting the top blade to the arm member is coupled with the connecting part of the top blade.
14. A method for transferring substrates, comprising:
simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction,
wherein the transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions to place/take a substrate on/out of the first support plates under the folded state and place/take a substrate on/out of the second support plates under the unfolded state.
15. The method as recited in claim 14 , wherein the top blade and the bottom blade comprise a first support part and a second support part disposed at their opposite ends, respectively, and a substrate is placed on each of the first and second support parts, and
wherein one of the first and second support parts takes out substrate placed on the second support parts while substrate to be placed on the second support plates are placed on the other support parts.
16. The method as recited in claim 15 , wherein the substrate placed on the one support part is placed on the second support plates while a substrate taken out of the second substrate plates is placed on the other support part.
17. A method of treating substrates, comprising:
treating a substrate by means of a substrate treating apparatus including a transfer chamber; at least one process chamber disposed at one side of the transfer chamber; a loadlock chamber, disposed at the other side of the transfer chamber, in which substrate are placed to be vertically spaced apart from each other; and a transfer unit provided at the transfer chamber to transfer substrates between the loadlock chamber and the process chamber,
wherein substrates are placed in the loadlock chamber to be vertically spaced to face each other, and substrates are placed in the process chamber to be arranged abreast in a lateral direction,
wherein the transfer unit comprises a top blade and a bottom blade converted to a folded state where they vertically face each other and an unfolded state where they rotate at a preset angle in opposite directions, and
wherein the transfer unit puts/takes a substrate into/out of the loadlock chamber under the folded state and puts/takes a substrate into/out of the process chamber under the unfolded state.
18. The method as recited in claim 17 , wherein the top blade and the bottom blade comprise a first support part and a second support part disposed at their opposite ends, respectively, and
wherein the transfer unit takes a processed substrate out of the process chamber by using one of the first and second support parts while the other support part contains a substrate to be processed at the process chamber.
Priority Applications (2)
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US11/892,224 US20080175694A1 (en) | 2007-01-19 | 2007-08-21 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
US12/458,098 US8007218B2 (en) | 2007-01-19 | 2009-06-30 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
Applications Claiming Priority (4)
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US11/655,182 US20080008569A1 (en) | 2006-07-04 | 2007-01-19 | Substrate transfer apparatus and substrate processing system using the same |
KR10-2007-0042599 | 2007-05-02 | ||
KR1020070042599A KR100803559B1 (en) | 2007-05-02 | 2007-05-02 | A unit and method for transferring substrates, and an apparatus and method for treating substrates with the unit |
US11/892,224 US20080175694A1 (en) | 2007-01-19 | 2007-08-21 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
Related Parent Applications (1)
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US11/655,182 Continuation-In-Part US20080008569A1 (en) | 2006-07-04 | 2007-01-19 | Substrate transfer apparatus and substrate processing system using the same |
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US12/458,098 Division US8007218B2 (en) | 2007-01-19 | 2009-06-30 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
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US20080175694A1 true US20080175694A1 (en) | 2008-07-24 |
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US12/458,098 Active US8007218B2 (en) | 2007-01-19 | 2009-06-30 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
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US12/458,098 Active US8007218B2 (en) | 2007-01-19 | 2009-06-30 | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
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