US20080142497A1 - Rapid conductive cooling using a secondary process plane - Google Patents
Rapid conductive cooling using a secondary process plane Download PDFInfo
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- US20080142497A1 US20080142497A1 US11/611,061 US61106106A US2008142497A1 US 20080142497 A1 US20080142497 A1 US 20080142497A1 US 61106106 A US61106106 A US 61106106A US 2008142497 A1 US2008142497 A1 US 2008142497A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/14—Substrate holders or susceptors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the void 446 is in communication with the coolant source 485 A by a port 324 coupled to the bottom 322 and the port 324 is in communication with a plenum 445 that is in fluid communication with the void 446 by a plenum port 415 .
- the plate 423 may include a plurality of channels or grooves 428 formed therein to increase the surface area available to the cooling fluid, thus enhancing heat dissipation from the radiant heat source 106 .
Abstract
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
Description
- 1. Field of the Invention
- Embodiments of the present invention generally relate to a method and apparatus for processing semiconductor substrates. More specifically, to a method and apparatus for thermally treating semiconductor substrates.
- 2. Description of the Related Art
- Integrated circuits have evolved into complex devices that can include millions of transistors, capacitors, and resistors on a single chip. The evolution of chip design continually requires faster circuitry and greater circuit density that demand increasingly precise fabrication processes. One fabrication process frequently used is ion implantation.
- Ion implantation is particularly important in forming transistor structures on semiconductor substrates and may be repeated many times during chip fabrication. During ion implantation, a semiconductor substrate, typically comprising a silicon material and/or a silicon containing film, is bombarded by a beam of electrically charged ions, commonly called dopants. Ion implantation changes the properties of the material in which the dopants are implanted in order to achieve a particular level of electrical performance. Dopant concentration may be determined by controlling the number of ions in a beam of energy projected on the substrate and the number of times the substrate passes through the beam. The dopants are accelerated to an energy level that will enable the dopants to penetrate the silicon material or implant into the film at a desired depth. The energy level of the beam typically determines the depth at which the dopants are placed.
- During ion implantation, the implanted film may develop a high level of internal stress. In order to relieve the stress and further control the resulting properties of the implanted film, the film is typically subjected to a thermal process, such as annealing. Post-ion implantation annealing is typically performed in a rapid thermal processing (RTP) chamber that subjects the substrate to a very brief, yet highly controlled thermal cycle that can heat the substrate from room temperature to approximately 450° C. to about 1400° C. RTP typically minimizes or relieves the stress induced during implantation and can be used to further modify film properties, such as changing the electrical characteristics of the film by controlling dopant diffusion.
- The RTP heating regime generally includes heating from a radiant heat source, such as lamps and/or resistive heating elements. In a conventional RTP system, the substrate is heated to a desired temperature, and then the radiant heat source is turned off, which causes the substrate to cool. In some systems, a gas may be flowed onto the substrate to enhance cooling. However, as processing parameters continue to evolve, temperature ramp up and heating uniformity during RTP requires closer monitoring and control. While conventional RTP chambers rely on the radiant heat source to rapidly heat the substrate to a desired temperature, the challenges arise when the substrate requires cooling to improve heating uniformity, and/or when the substrate needs to be rapidly cooled. For example, if a significant temperature gradient exists across the substrate, the substrate may plastically deform or warp, which may be detrimental to subsequent processes performed on the substrate. Further, the faster cooling and/or enhanced temperature control of the substrate may result in higher throughput and enhanced dopant uniformity.
- Therefore, what is needed is an apparatus and method for rapid heating and cooling of a semiconductor substrate, with enhanced control of heat uniformity.
- The present invention generally describes a method and apparatus for thermally processing a substrate. The apparatus includes a chamber having an active heating means and an active cooling means disposed therein. The chamber also includes a substrate support movable between the heating means and the cooling means. In one embodiment, the active cooling means is a cooling plate having at least one fluid channel disposed therein. In another embodiment, the active cooling means includes a coolant source coupled to an inlet for supplying a cooling gas to an interior volume of the chamber. In one embodiment, the heating means is a plurality of heat lamps, which is disposed opposite the cooling means.
- In one embodiment, a substrate processing apparatus is described. The apparatus includes a chamber, a magnetically driven substrate support disposed in the chamber and comprising an annular body configured to support the substrate on an upper surface thereof, and a window coupled to the annular body, wherein the window is disposed below the substrate and is transparent to light and heat.
- In another embodiment, a substrate processing apparatus is described. The apparatus includes a chamber having an interior volume which includes an upper portion and a lower portion, a cooling plate and a heat source disposed in the interior volume, the cooling plate opposing the heat source, and a levitating substrate support configured to move the substrate between the upper portion and the lower portion.
- In another embodiment, a method for thermally treating a substrate is described. The method includes providing a chamber having a levitating substrate support disposed therein, moving the substrate to a first position, heating the substrate in the first position, moving the substrate to a second position adjacent an active cooling means, and cooling the substrate in the second position, wherein the first and second positions are disposed in the chamber.
- In another embodiment, a method for thermally treating a substrate is described. The method includes providing a substrate to a chamber at a first temperature, heating the substrate in a first time period to a second temperature, heating the substrate to third temperature in a second time period, cooling the substrate to the second temperature in the second time period, and cooling the substrate to the first temperature in a third time period, wherein the second time period is less than about 2 seconds.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
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FIG. 1 is a simplified isometric view of one embodiment of a rapid thermal processing (RTP) chamber. -
FIG. 2 is an isometric view of one embodiment of a substrate support. -
FIG. 3 is a schematic side view of another embodiment of an RTP chamber. -
FIG. 4 is a partial schematic side view of another embodiment of an RTP chamber. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.
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FIG. 1 is a simplified isometric view of one embodiment of a rapidthermal processing chamber 100. Examples of rapid thermal processing chambers that may be adapted to benefit from the invention are Quantum X plus and CENTURA® thermal processing systems, both available from Applied Materials, Inc., located in Santa Clara, Calif. Although the apparatus is described as utilized within a rapid thermal processing chamber, embodiments described herein may be utilized in other processing systems and devices where at least two temperature zones within one processing region is desired, such as substrate support platforms adapted for robot handoffs, orientation devices, deposition chambers, etch chambers, electrochemical processing apparatuses and chemical mechanical polishing devices, among others, particularly where the minimization of particulate generation is desired. - The
processing chamber 100 includes a contactless or magneticallylevitated substrate support 104, achamber body 102, havingwalls 108, abottom 110, and atop 112 defining aninterior volume 120. Thewalls 108 typically include at least onesubstrate access port 148 to facilitate entry and egress of a substrate 140 (a portion of which is shown inFIG. 1 ). The access port may be coupled to a transfer chamber (not shown) or a load lock chamber (not shown) and may be selectively sealed with a valve, such as a slit valve (not shown). In one embodiment, thesubstrate support 104 is annular and thechamber 100 includes aradiant heat source 106 disposed in an inside diameter of thesubstrate support 104. Examples of an RTP chamber that may be modified and a substrate support that may be used is described in U.S. Pat. No. 6,800,833, filed Mar. 29, 2002 and issued on Oct. 5, 2004, U.S. patent application Ser. No. 10/788,979, filed Feb. 27, 2004 and published as U.S. patent Publication No. 2005/0191044 on Sep. 1, 2005, both of which are incorporated by reference in their entireties. - The
substrate support 104 is adapted to magnetically levitate and rotate within theinterior volume 120. Thesubstrate support 104 is capable of rotating while raising and lowering vertically during processing, and may also be raised or lowered without rotation before, during, or after processing. This magnetic levitation and/or magnetic rotation prevents or minimizes particle generation due to the absence or reduction of moving parts typically required to raise/lower and/or rotate the substrate support. - The
chamber 100 also includes awindow 114 made from a material transparent to heat and light of various wavelengths, which may include light in the infra-red (IR) spectrum, through which photons from theradiant heat source 106 may heat thesubstrate 140. In one embodiment, thewindow 114 is made of a quartz material, although other materials that are transparent to light may be used, such as sapphire. Thewindow 114 may also include a plurality of lift pins 144 coupled to an upper surface of thewindow 114, which are adapted to selectively contact and support thesubstrate 140, to facilitate transfer of the substrate into and out of thechamber 100. Each of the plurality of lift pins 144 are configured to minimize absorption of energy from theradiant heat source 106 and may be made from the same material used for thewindow 114, such as a quartz material. The plurality of lift pins 144 may be positioned and radially spaced from each other to facilitate passage of an end effector coupled to a transfer robot (not shown). Alternatively, the end effector and/or robot may be capable of horizontal and vertical movement to facilitate transfer of thesubstrate 140. - In one embodiment, the
radiant heat source 106 includes a lamp assembly formed from a housing which includes a plurality ofhoneycomb tubes 160 in a coolant assembly 360 (shown inFIG. 3 ) coupled to acoolant source 183. Thecoolant source 183 may be one or a combination of water, ethylene glycol, nitrogen (N2), and helium (He). The housing may be made of a copper material or other suitable material having suitable coolant channels formed therein for flow of the coolant from thecoolant source 183. Eachtube 160 may contain a reflector and a high-intensity lamp assembly or an IR emitter from which is formed a honeycomb-like pipe arrangement. This close-packed hexagonal arrangement of pipes provides radiant energy sources with high-power density and good spatial resolution. In one embodiment, theradiant heat source 106 provides sufficient radiant energy to thermally process the substrate, for example, annealing a silicon layer disposed on thesubstrate 140. Theradiant heat source 106 may further comprise annular zones, wherein the voltage supplied to the plurality oftubes 160 by thecontroller 124 may varied to enhance the radial distribution of energy from thetubes 160. Dynamic control of the heating of thesubstrate 140 may be effected by the one or more temperature sensors 117 (described in more detail below) adapted to measure the temperature across thesubstrate 140. - A
stator assembly 118 circumscribes thewalls 108 of thechamber body 102 and is coupled to one ormore actuator assemblies 122 that control the elevation of thestator assembly 118 along the exterior of thechamber body 102. In one embodiment (not shown), thechamber 100 includes threeactuator assemblies 122 disposed radially about the chamber body, for example, at about 120° angles about thechamber body 102. Thestator assembly 118 is magnetically coupled to thesubstrate support 104 disposed within theinterior volume 120 of thechamber body 102. Thesubstrate support 104 may comprise or include a magnetic portion to function as a rotor, thus creating a magnetic bearing assembly to lift and/or rotate thesubstrate support 104. In one embodiment, at least a portion of thesubstrate support 104 is partially surrounded by a trough 412 (shown inFIG. 4 ) that is coupled to afluid source 186, which may include water, ethylene glycol, nitrogen (N2), helium (He), or combinations thereof, adapted as a heat exchange medium for the substrate support. Thestator assembly 118 may also include ahousing 190 to enclose various parts and components of thestator assembly 118. In one embodiment, thestator assembly 118 includes adrive coil assembly 168 stacked on asuspension coil assembly 170. Thedrive coil assembly 168 is adapted to rotate and/or raise/lower thesubstrate support 104 while thesuspension coil assembly 170 may be adapted to passively center thesubstrate support 104 within theprocessing chamber 100. Alternatively, the rotational and centering functions may be performed by a stator having a single coil assembly. - An
atmosphere control system 164 is also coupled to theinterior volume 120 of thechamber body 102. Theatmosphere control system 164 generally includes throttle valves and vacuum pumps for controlling chamber pressure. Theatmosphere control system 164 may additionally include gas sources for providing process or other gases to theinterior volume 120. Theatmosphere control system 164 may also be adapted to deliver process gases for thermal deposition processes. - The
chamber 100 also includes acontroller 124, which generally includes a central processing unit (CPU) 130,support circuits 128 andmemory 126. TheCPU 130 may be one of any form of computer processor that can be used in an industrial setting for controlling various actions and sub-processors. Thememory 126, or computer-readable medium, may be one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote, and is typically coupled to theCPU 130. Thesupport circuits 128 are coupled to theCPU 130 for supporting thecontroller 124 in a conventional manner. These circuits include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like. - In one embodiment, each of the
actuator assemblies 122 generally comprise aprecision lead screw 132 coupled between twoflanges 134 extending from thewalls 108 of thechamber body 102. Thelead screw 132 has anut 158 that axially travels along thelead screw 132 as the screw rotates. Acoupling 136 is coupled between thestator 118 andnut 158 so that as thelead screw 132 is rotated, thecoupling 136 is moved along thelead screw 132 to control the elevation of thestator 118 at the interface with thecoupling 136. Thus, as thelead screw 132 of one of theactuators 122 is rotated to produce relative displacement between thenuts 158 of theother actuators 122, the horizontal plane of thestator 118 changes relative to a central axis of thechamber body 102. - In one embodiment, a
motor 138, such as a stepper or servo motor, is coupled to thelead screw 132 to provide controllable rotation in response to a signal by thecontroller 124. Alternatively, other types ofactuators 122 may be utilized to control the linear position of thestator 118, such as pneumatic cylinders, hydraulic cylinders, ball screws, solenoids, linear actuators and cam followers, among others. - The
chamber 100 also includes one ormore sensors 116, which are generally adapted to detect the elevation of the substrate support 104 (or substrate 140) within theinterior volume 120 of thechamber body 102. Thesensors 116 may be coupled to thechamber body 102 and/or other portions of theprocessing chamber 100 and are adapted to provide an output indicative of the distance between thesubstrate support 104 and the top 112 and/orbottom 110 of thechamber body 102, and may also detect misalignment of thesubstrate support 104 and/orsubstrate 140. - The one or
more sensors 116 are coupled to thecontroller 124 that receives the output metric from thesensors 116 and provides a signal or signals to the one ormore actuator assemblies 122 to raise or lower at least a portion of thesubstrate support 104. Thecontroller 124 may utilize a positional metric obtained from thesensors 116 to adjust the elevation of thestator 118 at eachactuator assembly 122 so that both the elevation and the planarity of thesubstrate support 104 andsubstrate 140 seated thereon may be adjusted relative to and a central axis of theRTP chamber 100 and/or theradiant heat source 106. For example, thecontroller 124 may provide signals to raise the substrate support by action of oneactuator 122 to correct axial misalignment of thesubstrate support 104, or the controller may provide a signal to allactuators 122 to facilitate simultaneous vertical movement of thesubstrate support 104. - The one or
more sensors 116 may be ultrasonic, laser, inductive, capacitive, or other type of sensor capable of detecting the proximity of thesubstrate support 104 within thechamber body 102. Thesensors 116, may be coupled to thechamber body 102 proximate the top 112 or coupled to thewalls 108, although other locations within and around thechamber body 102 may be suitable, such as coupled to thestator 118 outside of thechamber 100. In one embodiment, one ormore sensors 116 may be coupled to thestator 118 and are adapted to sense the elevation and/or position of the substrate support 104 (or substrate 140) through thewalls 108. In this embodiment, thewalls 108 may include a thinner cross-section to facilitate positional sensing through thewalls 108. - The
chamber 100 also includes one ormore temperature sensors 117, which may be adapted to sense temperature of thesubstrate 140 before, during, and after processing. In the embodiment depicted inFIG. 1 , thetemperature sensors 117 are disposed through the top 112, although other locations within and around thechamber body 102 may be used. Thetemperature sensors 117 may be optical pyrometers, as an example, pyrometers having fiber optic probes. Thesensors 117 may be adapted to couple to the top 112 in a configuration to sense the entire diameter of the substrate, or a portion of the substrate. Thesensors 117 may comprise a pattern defining a sensing area substantially equal to the diameter of the substrate, or a sensing area substantially equal to the radius of the substrate. For example, a plurality ofsensors 117 may be coupled to the top 112 in a radial or linear configuration to enable a sensing area across the radius or diameter of the substrate. In one embodiment (not shown), a plurality ofsensors 117 may be disposed in a line extending radially from about the center of the top 112 to a peripheral portion of the top 112. In this manner, the radius of the substrate may be monitored by thesensors 117, which will enable sensing of the diameter of the substrate during rotation. - The
RTP chamber 100 also includes acooling block 180 adjacent to, coupled to, or formed in the top 112. Generally, thecooling block 180 is spaced apart and opposing theradiant heat source 106. Thecooling block 180 comprises one ormore coolant channels 184 coupled to aninlet 181A and anoutlet 181B. Thecooling block 180 may be made of a process resistant material, such as stainless steel, aluminum, a polymer, or a ceramic material. Thecoolant channels 184 may comprise a spiral pattern, a rectangular pattern, a circular pattern, or combinations thereof and thechannels 184 may be formed integrally within thecooling block 180, for example by casting thecooling block 180 and/or fabricating thecooling block 180 from two or more pieces and joining the pieces. Additionally or alternatively, thecoolant channels 184 may be drilled into thecooling block 180. - As described herein, the
chamber 100 is adapted to receive a substrate in a “face-up” orientation, wherein the deposit receiving side or face of the substrate is oriented toward thecooling block 180 and the “backside” of the substrate is facing theradiant heat source 106. The “face-up” orientation may allow the energy from theradiant heat source 106 to be absorbed more rapidly by thesubstrate 140 as the backside of the substrate is typically less reflective than the face of the substrate. - Although the
cooling block 180 andradiant heat source 106 is described as being positioned in an upper and lower portion of theinterior volume 120, respectively, the position of thecooling block 180 and theradiant heat source 106 may be reversed. For example, thecooling block 180 may be sized and configured to be positioned within the inside diameter of thesubstrate support 104, and theradiant heat source 106 may be coupled to the top 112. In this arrangement, thequartz window 114 may be disposed between theradiant heat source 106 and thesubstrate support 104, such as adjacent theradiant heat source 106 in the upper portion of thechamber 100. Although thesubstrate 140 may absorb heat more readily when the backside is facing theradiant heat source 106, thesubstrate 140 could be oriented in a face-up orientation or a face down orientation in either configuration. - The
inlet 181A andoutlet 181B may be coupled to acoolant source 182 by valves and suitable plumbing and thecoolant source 182 is in communication with thecontroller 124 to facilitate control of pressure and/or flow of a fluid disposed therein. The fluid may be water, ethylene glycol, nitrogen (N2), helium (He), or other fluid used as a heat exchange medium. -
FIG. 2 is an isometric view of one embodiment of asubstrate support 104. Thesubstrate support 104 includes anannular body 220 having aninside diameter 209 sized to receive the radiant heat source and other hardware (not shown in this view). Thesubstrate support 104 is at least partially comprised of amagnetic ring section 208 and asupport section 212. Themagnetic ring section 208 may be at least partially comprised of a magnetic material, such as a ferrous containing material, to facilitate magnetic coupling of thesubstrate support 104 to thestator 118. The ferrous containing material includes low carbon steel, stainless steel, which may include a plating, such as a nickel plating. In one embodiment, themagnetic ring section 208 is comprised of a plurality of permanent magnets disposed in a polar array about a central axis. Themagnetic ring section 208 may additionally include an outer surface having one ormore channels 223 formed therein. In one embodiment, themagnetic ring section 208 includes a shaped profile, such as an “E” shape or “C” shape having one ormore channels 223 formed therein. - The
support section 212 is generally adapted to minimize energy loss, such as heat and/or light, from theradiant heat source 106, such that a substantial portion of energy from theradiant heat source 106 is contained within the region between the lower surface of thesubstrate 140 and the upper end of the radiant heat source 106 (not shown in this Figure). Thesupport section 212 may be anannular extension 214 extending from an upper surface of themagnetic ring section 208. Thesupport section 212 may also include asupport ring 210 that, in one embodiment, facilitates alignment and provides aseating surface 202 for thesubstrate 140. In one embodiment, at least a portion of thesupport ring 210 is made from a material that is transparent to energy from theradiant heat source 106, such as a quartz material. In another embodiment, thesupport ring 210 comprises a silicon carbide material that may be sintered. Thesupport ring 210 may further include an oxide coating or layer, which may comprise nitrogen. An example of asupport ring 210 that may be used is described in U.S. Pat. No. 6,888,104, filed Feb. 5, 2004, and issued on May 3, 2005, which is incorporated by reference in its entirety. - The
support ring 210 generally includes aninner wall 222 and asupport lip 219 extending inwardly from theinner wall 222. Theinner wall 222 may be sized slightly larger than the substrate in a stepwise or sloped fashion and facilitates alignment and/or centering of thesubstrate 140 when thesubstrate support 104 is raised. The substrate may then be seated on thesupport lip 219 and substrate centering is maintained during lifting and/or rotation of thesubstrate support 104. Thesupport ring 210 may also include anouter wall 223 that extends downward from the upper surface of thesupport ring 210 opposite theinner wall 222. The area between theouter wall 223 andinner wall 222 forms achannel 224 that facilitates alignment of thesupport ring 210 on theannular extension 214. Thesupport section 212 may be coupled to themagnetic ring section 208 by fastening, bonding, or gravitationally, and is adapted to support thesubstrate 140 during processing. In one embodiment, thesupport ring 210 functions as an edge ring and may be gravitationally attached to theannular extension 214 for easy removal and replacement. - The
support section 212 may be fabricated from a material that reduces potential scratching, chemical or physical contamination, and/or marring of the substrate, for example, materials such as silicon carbide, stainless steel, aluminum, ceramic, or a high temperature polymer may be used. Alternatively, thesupport section 212 may be fabricated as a unitary member from the material of themagnetic ring section 208. At least a portion of thesupport section 212 may be fabricated or coated with a reflective material, or made of or coated with a black material to absorb heat similar to a black body, depending on process parameters. It is to be noted that a black material as used herein may include dark colors, such as the color black, but is not limited to dark colored materials or coatings. More generally, a black material, a black finish, or a black coating refers to the lack of reflectivity or the ability the material, finish, or coating to absorb energy, such as heat and/or light, similar to a black body. -
FIG. 3 is a schematic side view of another embodiment of anRTP chamber 300 which includes achamber body 102, havingwalls 108, a bottom 110, and a top 112, defining aninterior volume 120 as inFIG. 1 . Thechamber 300 also includes a contactless or magnetically levitatedsubstrate support 104 as inFIG. 1 , but the stator and other components outside the chamber 200 are not shown for clarity. In this embodiment, thesubstrate support 104 is depicted in an exchange position, wherein the plurality of lift pins 144 are supporting thesubstrate 140 to facilitate transfer of the substrate. - In this embodiment, a portion of the
substrate support 104 and/or themagnetic ring section 208 may rest at or near an upper surface of the bottom 110 of thechamber body 102, and thewindow 114 is supported by one of the upper surface of themagnetic ring section 208 and/or anextension 312 coupled to or otherwise supported by the upper surface of the bottom 110. Theextension 312 may be sidewalls of acoolant assembly 360 around a portion of theradiant heat source 106 disposed in the inside diameter of thesubstrate support 104, or theextensions 312 may be support members coupled to the upper surface of the bottom 110 within the inside diameter of thesubstrate support 104 and outside of thecoolant assembly 360. Anadaptor plate 315 may also be coupled to thechamber bottom 110 to facilitate connection of wires and other support devices for theradiant heat source 106 and/or thecoolant assembly 360. - The
support section 212 may be anannular extension 214 extending from an upper surface of thesubstrate support 104 or themagnetic ring section 208. Thesupport section 212 may also include asupport ring 210 that provides alignment and a seating surface for thesubstrate 140. Thesupport ring 210 includes aninner wall 222 and asupport lip 219 extending inwardly from theinner wall 222. Theinner wall 222 may be sized slightly larger than the substrate and facilitates alignment and/or centering of thesubstrate 140 when thesubstrate support 104 is raised. Thesubstrate 140 may then be seated on thesupport lip 219 and substrate centering is maintained during lifting and/or rotation of thesubstrate support 104. - In one embodiment, the
cooling block 180 includes a plurality ofcoolant channels 348A-348C for circulating a cooling fluid as described above. The coolant channels may be separate channels or discrete flow paths, or the coolant channels may comprise a plurality of closed flow paths coupled to thecoolant source 182. In one embodiment, thecooling block 180 comprises multiple cooling zones, such as an outer zone defined generally by thecoolant channel 348A, an inner zone defined generally bycoolant channel 348C, and an intermediate zone generally defined bycoolant channel 348B. The outer zone may correspond to the periphery of thesubstrate 140 while the inner and intermediate zones may correspond to a central portion of thesubstrate 140. The coolant temperature and/or coolant flow may be controlled in these zones to provide, for example, more cooling on the periphery of thesubstrate 140 relative to the center of the substrate. In this manner, thecooling block 180 may provide enhanced temperature control of thesubstrate 140 by providing more or less cooling in regions of the substrate where cooling is needed or desired. - The
cooling block 180 may be formed from a material such as aluminum, stainless steel, nickel, a ceramic, or a process resistant polymer. Thecooling block 180 may comprise a reflective material, or include a reflective coating configured to reflect heat onto the substrate surface. Alternatively, thecooling block 180 may comprise a black material (such as a black material configured to absorb energy substantially similar to a black body) or otherwise coated or finished with a black material or surface that is configured to absorb heat from the substrate and/or theinterior volume 120. Thecooling block 180 may also include a face orouter surface 332 that may be roughened or polished to promote reflectivity or absorption of radiant energy in the form of heat and/or light. Theouter surface 332 may also include a coating or finish to promote reflectivity or absorption, depending on the process parameters. In one embodiment, thecooling block 180 may be a black material or a material resembling a black material, or otherwise coated or finished with a black material or resembling a black material, to have an emissivity or emittance near 1, such as an emissivity between about 0.70 to about 0.95. - As shown in
FIG. 3 , theinterior volume 120 comprises atemperature transition zone 305, or processing zone depicted as distance D3, which includes aheating region 306A and acooling region 306B that thesubstrate 140 may be exposed to during processing. Theregions substrate 140 during processing in theinterior volume 120. As an example,heating region 306A may enable a temperature on the face of thesubstrate 140 that is between about 450° C. to about 1400° C. during processing, and thecooling zone 306B may cool the face of thesubstrate 140 to about room temperature or lower during processing, depending on process parameters. - For example, the substrate may be transferred to the RTP chamber at room temperature, or some temperature above room temperature provided by a heating means in a load lock chamber, or other peripheral chamber or transfer device. The temperature of the substrate before, during, or after transfer of the substrate to the RTP chamber may be referred to as the first or introduction temperature, from which the RTP process may be initiated. In one embodiment, the introduction temperature may be between about room temperature, to about 600 C. Once the substrate is introduced to the chamber, the substrate may be rapidly heated, taking the temperature of the substrate from the introduced temperature to a second temperature of between about 800° C. to about 1200° C., such as about 900° C. to about 1150° C. In one embodiment, power to the radiant heat source is varied and monitored, using feedback from the
sensors 117, to enable a second temperature of about 900° C. to about 1150° C. across the substrate in a heating step or first heating period. - In one embodiment, the first heating period is configured to raise the temperature of the substrate from the introduction temperature to about 900° C. to about 1150° C. across the substrate in about 2 minutes or less, such as between about 50 seconds and about 90 seconds, for example, between about 55 seconds and about 75 seconds. After the substrate has reached the second temperature in the heating period, a spike or transition period may begin, which includes a second heating period. The second heating period may include heating the substrate to a third temperature of about 25° C. to about 100° C. higher than the second temperature. The transition period also includes lowering the temperature of the substrate to a fourth temperature, which is about 25° C. to about 100° C. lower than the third temperature. In one embodiment, the third temperature and the fourth temperature are within about 5° C. to about 20° C. of each other, and in another embodiment, the third temperature and the fourth temperature are substantially equal. The transition period may include a third period of about 3 seconds or less, such as about 0.1 seconds to about 2 seconds, for example, between about 0.3 seconds to about 1.8 seconds.
- After the transition period, the substrate may be placed adjacent the
cooling block 180 and rapidly cooled by one or both of thecooling block 180 and coolant source 315 (described in more detail below). The substrate may be cooled to a temperature substantially equal to the first or introduction temperature in a fourth period that may be less than 10 seconds, such as about 2 seconds to about 6 seconds. The substrate may be cooled rapidly to a desired temperature, including a temperature at or near room temperature, or be cooled to a temperature above room temperature that enables transfer, which may enhance throughput. - The rapid heating and cooling of the substrate, as described above, provides many benefits. The temperature of the substrate is constantly monitored by feed back from the
sensors 117, and enhanced control of the substrate temperature may be facilitated by moving the substrate relative thecooling block 180 and/or theradiant heat source 106. Dopant diffusion control may be enhanced by the rapid and controlled heating and cooling of the substrate, and device performance may be improved. Additionally, the lessened heating and cooling times may increase throughput. - To enable the rapid heating and cooling of the substrate, the substrate may travel in the
temperature transition zone 305. The travel of thesubstrate 140 in theinterior volume 120 and theregions substrate 140 is placed in a processing position, theheating region 306A of thetemperature transition zone 305 may include a travel distance D1 for the substrate 140 (or substrate support 104), for example, between about 0.5 inches to about 1.5 inches. Thecooling region 306B of the temperature transition zone may include a travel distance D2 for the substrate 140 (or substrate support 104) between about 0.5 inches to about 1.5 inches. In one embodiment, the total travel of the substrate 140 (or substrate support 104) within the interior volume, such as between theradiant heat source 106 and thecooling block 180, is between about 0.75 inches to about 3.25 inches, for example, between about 1.0 inches and about 2.75 inches, such as about 2 inches. In one embodiment, the distance D1 comprises about one half of the distance D3, and the distance D2 comprises about one half of the distance D3. Thesubstrate support 104 may be configured to raise the substrate to a position that is in close proximity to thesubstrate 140, depending on the flatness of the substrate and other physical properties of the substrate, and the mechanical characteristics of the substrate support. Assuming the substrate has a suitable flatness, and thesubstrate support 104 and substrate disposed thereon is substantially parallel to thecooling block 180, the substrate may be raised to be within about 0.005 inches to about 0.025 inches from the lower surface of thecooling block 180. Bringing the substrate in close proximity to the cooling block enables rapid heat transfer and enhanced cooling of the substrate. - In one embodiment, the
chamber 300 includes agas port 310 coupled to acoolant source 315. Thegas port 310 may be a manifold or a plurality of openings that are formed or otherwise coupled to the upper portion of thechamber wall 108, and may be formed as, or adapted to couple to, a nozzle that enables laminar flow through thecooling region 306B, for example adjacent to theouter surface 332 of thecooling block 180. To enable a more enhanced flow path, the chamber also includes anexit port 320 formed in thechamber wall 108, typically opposing thegas port 310. Theexit port 320 may be coupled to a vacuum source configured to assist the atmosphere control system 164 (FIG. 1 ) and remove excess gas provided by thegas port 310. Thecoolant source 315 includes a cooling fluid, such as helium (He), nitrogen (N2), or other suitable cooling fluid, and is directed or configured to flow within thecooling region 306B. The cooling fluid from thegas port 310 enables more rapid cooling of thesubstrate 140 when the substrate is positioned in thecooling region 306B. - As described in reference to
FIG. 1 , theradiant heat source 106 is coupled to acoolant assembly 360 that is adapted to maintain a suitable temperature and/or cool thehoneycomb tubes 160 of theradiant heat source 106. Thecoolant assembly 360 includessidewalls 312 and a bottom 314 that is adapted to contain a fluid. The bottom 314 includesports coolant source 183, which may be water, ethylene glycol, or other suitable cooling fluid. Thecoolant assembly 360 may also include a plurality of fluid channels formed therein (described in reference toFIG. 4 ) for enhanced thermal transfer from the cooling fluid and theradiant heat source 106. -
FIG. 4 is partial side view of another embodiment of an RTP chamber 400 in a processing position and details of thecoolant assembly 360 will be described. Thecoolant assembly 360 includes a bottom 322 andsidewalls 312 as shown in other Figures, and also includes abody 427, which comprises a plurality ofpartitions 426 separating the plurality ofhoneycomb tubes 160. The body may also comprise aplate 423 opposing the bottom 322, to form a void 446 therebetween, which is configured to contain the coolant from afirst coolant source 485A and separate the void 446 from the plurality ofhoneycomb tubes 160. Thevoid 446 is in communication with thecoolant source 485A by aport 324 coupled to the bottom 322 and theport 324 is in communication with aplenum 445 that is in fluid communication with the void 446 by aplenum port 415. Theplate 423 may include a plurality of channels orgrooves 428 formed therein to increase the surface area available to the cooling fluid, thus enhancing heat dissipation from theradiant heat source 106. - In operation, a cooling fluid is supplied from the
first source 485A to the void 446 by theport 322, and the coolant at least partially fills thevoid 446. The coolant may be continually flowed into the void to dissipate heat and exits the void through theplenum port 415 to theplenum 445. The coolant may be removed from theplenum 445 by theport 324 and returned to thefirst source 485A. The coolant may be replenished and/or cooled before cycling through thevoid 446. In this manner, the temperature of theradiant heat source 106 is controlled. - The
coolant assembly 360 may also includes a plurality offluid channels 425 formed in at least a portion of the plurality ofpartitions 426. Thefluid channels 425 are configured to flow a cooling fluid, such as water, ethylene glycol, nitrogen (N2), helium (He), or other fluid used as a heat exchange medium, from a secondfluid source 485B. Thefluid channels 425 are coupled to the secondfluid source 485B by at least one inlet and outlet (not shown). The flowing of coolant from the first andsecond sources radiant heat source 106. - The
chamber 100 also includes a magnetically levitated orcontactless substrate support 104 having asupport member 210 and anannular extension 212 coupled to anannular body 220 disposed in a channel ortrough 412. Thetrough 412 is coupled to afluid source 186 through aport 420 for supplying a coolant to thetrough 412, thus dissipating heat that may be transferred from theradiant heat source 106 and/or heat created by rotation of theannular body 220 during processing. Thefluid source 186 may include cooling fluids, such as water, ethylene glycol, nitrogen (N2), helium (He), or other fluid used as a heat exchange medium. Agap 418 may also be formed between thesidewall 312 of thecoolant assembly 360 and a sidewall of thetrough 412 to facilitate insulation between theannular body 220 of thesubstrate support 104 and theradiant heat source 106. - While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (29)
1. A substrate processing apparatus, comprising:
a chamber;
a magnetically driven substrate support disposed in the chamber and comprising an annular body configured to support the substrate on an upper surface thereof;
an annular extension coupled to the annular body; and
a window coupled to the annular body, wherein the window is disposed below the substrate and is transparent to light and heat.
2. The apparatus of claim 1 , further comprising:
a heat source disposed in the chamber.
3. The apparatus of claim 2 , wherein the heat source is disposed below the window.
4. The apparatus of claim 1 , further comprising:
an annular ring detachably coupled to the annular extension.
5. The apparatus of claim 1 , wherein the annular body is configured to magnetically couple to a stator assembly.
6. The apparatus of claim 1 , further comprising:
a plurality of lift pins extending from an upper surface of the window.
7. A substrate processing apparatus, comprising:
a chamber having an interior volume which includes an upper portion and a lower portion;
a cooling source and a heat source disposed in the interior volume, the cooling source opposing the heat source; and
a levitating substrate support configured to move the substrate between the upper portion and the lower portion.
8. The apparatus of claim 7 , wherein the cooling source is disposed in an upper portion of the interior volume and the heat source is disposed in a lower portion of the interior volume.
9. The apparatus of claim 7 , wherein the cooling source comprises a black material.
10. The apparatus of claim 7 , wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.
11. The apparatus of claim 7 , wherein the substrate support has an inside diameter sized to receive the heat source.
12. The apparatus of claim 7 , wherein the substrate support has a support ring configured to receive and support the substrate.
13. The apparatus of claim 7 , further comprising:
a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.
14-28. (canceled)
29. A substrate processing apparatus, comprising:
a chamber having an interior volume which includes an upper portion and a lower portion;
a cooling source in communication with the upper portion and a heat source disposed in the lower portion of the interior volume;
a levitating substrate support configured to move the substrate between the upper portion and the lower portion; and
a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.
30. The apparatus of claim 29 , wherein the cooling source comprises a cooling plate.
31. The apparatus of claim 30 , wherein the cooling plate comprises a black material.
32. The apparatus of claim 30 , wherein the cooling plate has an emissivity between about 0.70 to about 0.95.
33. The apparatus of claim 29 , wherein the cooling source is a gas port coupled to a coolant source.
34. The apparatus of claim 29 , wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.
35. The apparatus of claim 29 , wherein the cooling source comprises a cooling plate having at least one channel for flowing a coolant therein, and a gas port coupled to a coolant source.
36. The apparatus of claim 29 , wherein the window includes a plurality of lift pins extending from an upper surface thereof.
37. A substrate processing apparatus, comprising:
a chamber having an interior volume which includes an upper portion and a lower portion;
a heat source disposed in the lower portion;
a cooling source disposed in the upper portion;
a magnetically driven substrate support at least partially disposed in the interior volume, the substrate support comprising an annular body configured to support the substrate on an upper surface thereof; and
a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.
38. The apparatus of claim 37 , wherein the window includes a plurality of lift pins extending from an upper surface thereof.
39. The apparatus of claim 37 , wherein the cooling source comprises a cooling plate.
40. The apparatus of claim 39 , wherein the cooling plate comprises a black material.
41. The apparatus of claim 39 , wherein the cooling plate has an emissivity between about 0.70 to about 0.95.
42. The apparatus of claim 37 , wherein the cooling source is a gas port coupled to a coolant source.
43. The apparatus of claim 37 , wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.
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JP2007265808A JP5473206B2 (en) | 2006-12-14 | 2007-10-11 | Rapid conduction cooling using a secondary processing plane |
KR1020070102466A KR20080055608A (en) | 2006-12-14 | 2007-10-11 | Rapid conductive cooling using a secondary process plane |
TW102128330A TWI545655B (en) | 2006-12-14 | 2007-10-12 | Rapid conductive cooling using a secondary process plane |
TW096138277A TWI401746B (en) | 2006-12-14 | 2007-10-12 | Rapid conductive cooling using a secondary process plane |
EP07020053A EP1933368A3 (en) | 2006-12-14 | 2007-10-12 | A substrate processing apparatus |
CN201410136512.0A CN103943537B (en) | 2006-12-14 | 2007-10-12 | Quick heating and the device of cooling for Semiconductor substrate |
CNA2007101635933A CN101207010A (en) | 2006-12-14 | 2007-10-12 | A substrate processing apparatus |
TW102102343A TWI407511B (en) | 2006-12-14 | 2007-10-12 | Rapid conductive cooling using a secondary process plane |
US11/925,600 US7812286B2 (en) | 2006-12-14 | 2007-10-26 | Rapid conductive cooling using a secondary process plane |
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KR1020110058682A KR101381313B1 (en) | 2006-12-14 | 2011-06-16 | Rapid conductive cooling using a secondary process plane |
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KR1020130113984A KR101464931B1 (en) | 2006-12-14 | 2013-09-25 | Rapid conductive cooling using a secondary process plane |
JP2013207395A JP2014057073A (en) | 2006-12-14 | 2013-10-02 | Rapid conduction cooling using sub-processing plane |
US14/189,696 US9209049B2 (en) | 2006-12-14 | 2014-02-25 | Rapid conductive cooling using a secondary process plane |
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Also Published As
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US20080141556A1 (en) | 2008-06-19 |
CN103943537B (en) | 2017-08-11 |
US20120270166A1 (en) | 2012-10-25 |
US20110008740A1 (en) | 2011-01-13 |
CN103943537A (en) | 2014-07-23 |
US20140199786A1 (en) | 2014-07-17 |
KR20110079597A (en) | 2011-07-07 |
TWI407511B (en) | 2013-09-01 |
KR101464931B1 (en) | 2014-11-25 |
JP5473206B2 (en) | 2014-04-16 |
TW200826199A (en) | 2008-06-16 |
JP2014057073A (en) | 2014-03-27 |
TW201351507A (en) | 2013-12-16 |
KR20080055608A (en) | 2008-06-19 |
KR20100014208A (en) | 2010-02-10 |
TWI545655B (en) | 2016-08-11 |
CN101207010A (en) | 2008-06-25 |
US8227729B2 (en) | 2012-07-24 |
US7812286B2 (en) | 2010-10-12 |
TWI401746B (en) | 2013-07-11 |
US7378618B1 (en) | 2008-05-27 |
EP1933368A2 (en) | 2008-06-18 |
KR20130114628A (en) | 2013-10-17 |
JP2008166706A (en) | 2008-07-17 |
US8658947B2 (en) | 2014-02-25 |
TW201322338A (en) | 2013-06-01 |
KR101381313B1 (en) | 2014-04-04 |
KR101168795B1 (en) | 2012-07-25 |
US9209049B2 (en) | 2015-12-08 |
EP1933368A3 (en) | 2008-08-27 |
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