US20080055186A1 - Enclosures with integrated antennas that make use of the skin effect - Google Patents
Enclosures with integrated antennas that make use of the skin effect Download PDFInfo
- Publication number
- US20080055186A1 US20080055186A1 US11/757,754 US75775407A US2008055186A1 US 20080055186 A1 US20080055186 A1 US 20080055186A1 US 75775407 A US75775407 A US 75775407A US 2008055186 A1 US2008055186 A1 US 2008055186A1
- Authority
- US
- United States
- Prior art keywords
- enclosure
- antenna
- electronics assembly
- fabricated
- antennas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Definitions
- This invention relates generally to electronic enclosures and, in particular, to consolidated enclosures with integrated antennas that rely upon the skin effect.
- a problem with existing antennas is that they penetrate through the enclosure, resulting in “leak points” through which an unauthorized individual can open the enclosure or gather information about its contents.
- This invention solves problems associated with tampering by providing an enclosure concealing transmit/receive electronics with a thin layer or layers of electrically conductive material applied to the exterior surface of the enclosure, thereby talking advantage of the skin effect for antenna implementations.
- the various materials forming the enclosure and/or antenna are applied using an additive manufacturing process such as ultrasonic consolidation.
- the preferred embodiment includes an enclosure with a wall including a transmitter, receiver, or transceiver; at least one area of material disposed on the outer surface of the enclosure, thereby forming an antenna that relies upon the skin effect; and an electrical interconnection between the antenna and the transmitter, receiver, or transceiver.
- At least the electrical interconnection may be completely embedded within the wall of the enclosure.
- the transmitter, receiver, or transceiver and the electrical interconnection may also be completely embedded within the enclosure or the wall thereof.
- the invention is not limited in terms of the number, size or shape of the antenna pattern used.
- a pair of antennas may be provided to function as a dipole, for example.
- a plurality of antennas arranged to facilitate frequency tuning, beam steering, or other parameters.
- the antenna and enclosure are preferably fabricated from materials having different dielectric constants, including different metals.
- the enclosure may be fabricated from aluminum or stainless steel, while the antenna layer(s) may be fabricated from copper, gold, silver or other highly conductive materials.
- the antenna may be DC grounded, even at microwave frequencies, including 2.4 GHz or other frequencies used for wireless networking.
- FIG. 1 is a perspective-view drawing that shows how a “patch” of material comprising an antenna may be a single area, or, with multiple regions, on an enclosure to form dipole or other antenna configurations in conjunction with enclosed electronics; and
- FIG. 2 is a side-view cross-section showing how additive manufacturing techniques such as ultrasonic consolidation may be used to make an enclosure such that signal lines to/from the antenna patches may be entirely enclosed.
- antenna systems that support frequency-agile applications may be produced, including configurations affording greater bandwidth, while producing or eliminating frequency nulls.
- frequency tuning and/or steering may be achieved.
- an array pattern or one or more spirals may be implemented.
- antennas at certain frequencies which currently require a radome may be implemented without the radome, such as antennas associated with global positioning satellite (GPS) reception.
- GPS global positioning satellite
- signal lines to/from the antenna patches may be entirely enclosed.
- the electronics 202 itself may be embedded within consolidated layers 204 of metal, thereby achieving an extremely tamper-proof component.
- the patches used to form the antenna pattern 206 (or patterns) and/or feedthrough 208 may be applied using the same consolidation process.
Abstract
Description
- This application claims priority from U.S. Provisional Patent Application Ser. No. 60/810,681, filed Jun. 2, 2006, the entire content of which is incorporated herein by reference.
- This invention relates generally to electronic enclosures and, in particular, to consolidated enclosures with integrated antennas that rely upon the skin effect.
- There are many instances where it is desirable to encapsulate a transmitter, receiver or transceiver in a tamper-proof enclosure. In such cases, an external antenna is often necessary for a sufficient degree of performance.
- A problem with existing antennas is that they penetrate through the enclosure, resulting in “leak points” through which an unauthorized individual can open the enclosure or gather information about its contents.
- This invention solves problems associated with tampering by providing an enclosure concealing transmit/receive electronics with a thin layer or layers of electrically conductive material applied to the exterior surface of the enclosure, thereby talking advantage of the skin effect for antenna implementations. In the preferred embodiment, the various materials forming the enclosure and/or antenna are applied using an additive manufacturing process such as ultrasonic consolidation.
- The preferred embodiment includes an enclosure with a wall including a transmitter, receiver, or transceiver; at least one area of material disposed on the outer surface of the enclosure, thereby forming an antenna that relies upon the skin effect; and an electrical interconnection between the antenna and the transmitter, receiver, or transceiver.
- Using an additive manufacturing process of the type wherein layers of material are consolidated without melting the material in bulk, at least the electrical interconnection may be completely embedded within the wall of the enclosure. Indeed, the transmitter, receiver, or transceiver and the electrical interconnection may also be completely embedded within the enclosure or the wall thereof.
- The invention is not limited in terms of the number, size or shape of the antenna pattern used. A pair of antennas may be provided to function as a dipole, for example. Alternatively, a plurality of antennas arranged to facilitate frequency tuning, beam steering, or other parameters.
- The antenna and enclosure are preferably fabricated from materials having different dielectric constants, including different metals. As examples, the enclosure may be fabricated from aluminum or stainless steel, while the antenna layer(s) may be fabricated from copper, gold, silver or other highly conductive materials.
- An advantage of the inventive configuration is that the antenna may be DC grounded, even at microwave frequencies, including 2.4 GHz or other frequencies used for wireless networking.
-
FIG. 1 is a perspective-view drawing that shows how a “patch” of material comprising an antenna may be a single area, or, with multiple regions, on an enclosure to form dipole or other antenna configurations in conjunction with enclosed electronics; and -
FIG. 2 is a side-view cross-section showing how additive manufacturing techniques such as ultrasonic consolidation may be used to make an enclosure such that signal lines to/from the antenna patches may be entirely enclosed. - As shown in
FIG. 1 , a “patch” of material comprising an antenna may be a single area, or, with multiple regions, 104, 106 on theenclosure 102, dipole and other antenna configurations may be achieved in conjunction with enclosedelectronics 110. - Furthermore, by providing a plurality of patches, antenna systems that support frequency-agile applications may be produced, including configurations affording greater bandwidth, while producing or eliminating frequency nulls. With sufficient patch areas, including patches of different sizes or geometries, frequency tuning and/or steering may be achieved. For example, an array pattern or one or more spirals may be implemented.
- According to the invention, as long as the layers of patch material have a different dielectric constant than the material forming the enclosure, radiation will be achieved or detected through the skin effect, even if all-metal systems are used. For example, if the antenna patches are fabricated from a highly conductive material such as copper, gold or sliver, the enclosure may be aluminum, stainless steel or other material less electrically conductive and the antenna will still function, particularly at high frequencies. For example, at microwave frequencies, the skin effect dominates in terms of the mode of signal propagation. Depending on the size of the patch or patches used, the antenna may be tuned or geared toward particular frequencies, such as 2.4 gigahertz or other frequencies of interest.
- Another important aspect of the inventive antenna patterns is due to the fact that they are DC-grounded. As such, certain antennas at certain frequencies which currently require a radome may be implemented without the radome, such as antennas associated with global positioning satellite (GPS) reception.
- Referring to
FIG. 2 , in the event that additive manufacturing techniques such as ultrasonic consolidation is used to make the enclosure, signal lines to/from the antenna patches may be entirely enclosed. Indeed, theelectronics 202 itself may be embedded within consolidatedlayers 204 of metal, thereby achieving an extremely tamper-proof component. The patches used to form the antenna pattern 206 (or patterns) and/orfeedthrough 208 may be applied using the same consolidation process. - Commonly assigned U.S. Pat. No. 6,814,823, the entire content of which is incorporated herein by reference, describes a system and a method of fabricating a three-dimensional objects through the consolidation of material increments in accordance with a description of the object. The system uses a process that produces an atomically clean faying surface between the increments without melting the material in bulk. A CAD system interfaces with a numerical controller which controls an actuation system so that the ultrasonic consolidation of the layers takes place according to the CAD description of the object. In alternative embodiments, electrical resistance, frictional welding and laser cladding methodologies may be used for object consolidation according to this invention.
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/757,754 US20080055186A1 (en) | 2006-06-02 | 2007-06-04 | Enclosures with integrated antennas that make use of the skin effect |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81068106P | 2006-06-02 | 2006-06-02 | |
US11/757,754 US20080055186A1 (en) | 2006-06-02 | 2007-06-04 | Enclosures with integrated antennas that make use of the skin effect |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080055186A1 true US20080055186A1 (en) | 2008-03-06 |
Family
ID=39150748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/757,754 Abandoned US20080055186A1 (en) | 2006-06-02 | 2007-06-04 | Enclosures with integrated antennas that make use of the skin effect |
Country Status (1)
Country | Link |
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US (1) | US20080055186A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9219513B2 (en) * | 2012-11-22 | 2015-12-22 | Electronics And Telecommunications Research Institute | Wireless communication system |
CN108122812A (en) * | 2017-12-15 | 2018-06-05 | 威海万丰镁业科技发展有限公司 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
CN113594696A (en) * | 2020-04-30 | 2021-11-02 | Oppo广东移动通信有限公司 | Metal middle frame and processing method of feed point surface thereof, shell assembly and electronic equipment |
US11833590B2 (en) | 2018-04-24 | 2023-12-05 | Hamilton Sundstrand Corporation | Embedded electronics in metal additive manufacturing builds enabled by low-melting temperature transition zone using material gradients |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6262685B1 (en) * | 1997-10-24 | 2001-07-17 | Itron, Inc. | Passive radiator |
US6384587B2 (en) * | 2000-04-27 | 2002-05-07 | Jyunichi Aizawa | Non-contact signal and power transmission apparatus |
US6417816B2 (en) * | 1999-08-18 | 2002-07-09 | Ericsson Inc. | Dual band bowtie/meander antenna |
US6518933B2 (en) * | 2001-05-30 | 2003-02-11 | Ads Corporation | Low profile antenna |
US6642906B1 (en) * | 2002-06-14 | 2003-11-04 | Star-H Corporation | Self-righting assembly |
US6814823B1 (en) * | 1999-09-16 | 2004-11-09 | Solidica, Inc. | Object consolidation through sequential material deposition |
US20070222681A1 (en) * | 2006-03-22 | 2007-09-27 | Firefly Power Technologies, Inc. | Method and apparatus for implementation of a wireless power supply |
US7403165B2 (en) * | 2004-06-02 | 2008-07-22 | Research In Motion Limited | Mobile wireless communications device comprising non-planar internal antenna without ground plane overlap |
US7405697B2 (en) * | 2003-03-18 | 2008-07-29 | Zhinong Ying | Compact diversity antenna |
US7439917B2 (en) * | 2003-06-30 | 2008-10-21 | Nec Corporation | Antenna structure and communication apparatus |
-
2007
- 2007-06-04 US US11/757,754 patent/US20080055186A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6262685B1 (en) * | 1997-10-24 | 2001-07-17 | Itron, Inc. | Passive radiator |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US6417816B2 (en) * | 1999-08-18 | 2002-07-09 | Ericsson Inc. | Dual band bowtie/meander antenna |
US6814823B1 (en) * | 1999-09-16 | 2004-11-09 | Solidica, Inc. | Object consolidation through sequential material deposition |
US6384587B2 (en) * | 2000-04-27 | 2002-05-07 | Jyunichi Aizawa | Non-contact signal and power transmission apparatus |
US6518933B2 (en) * | 2001-05-30 | 2003-02-11 | Ads Corporation | Low profile antenna |
US6642906B1 (en) * | 2002-06-14 | 2003-11-04 | Star-H Corporation | Self-righting assembly |
US7405697B2 (en) * | 2003-03-18 | 2008-07-29 | Zhinong Ying | Compact diversity antenna |
US7439917B2 (en) * | 2003-06-30 | 2008-10-21 | Nec Corporation | Antenna structure and communication apparatus |
US7403165B2 (en) * | 2004-06-02 | 2008-07-22 | Research In Motion Limited | Mobile wireless communications device comprising non-planar internal antenna without ground plane overlap |
US20070222681A1 (en) * | 2006-03-22 | 2007-09-27 | Firefly Power Technologies, Inc. | Method and apparatus for implementation of a wireless power supply |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9219513B2 (en) * | 2012-11-22 | 2015-12-22 | Electronics And Telecommunications Research Institute | Wireless communication system |
CN108122812A (en) * | 2017-12-15 | 2018-06-05 | 威海万丰镁业科技发展有限公司 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
US11833590B2 (en) | 2018-04-24 | 2023-12-05 | Hamilton Sundstrand Corporation | Embedded electronics in metal additive manufacturing builds enabled by low-melting temperature transition zone using material gradients |
CN113594696A (en) * | 2020-04-30 | 2021-11-02 | Oppo广东移动通信有限公司 | Metal middle frame and processing method of feed point surface thereof, shell assembly and electronic equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SOLIDICA, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FORTSON, FREDERICK O.;SOOSIK, GREG;HANSON, RICHARD;REEL/FRAME:020145/0083;SIGNING DATES FROM 20070928 TO 20071120 Owner name: SOLLDICA, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FORTSON, FREDERICK O.;SOOSIK, GREG;HANSON, RICHARD;REEL/FRAME:020145/0123;SIGNING DATES FROM 20070928 TO 20071120 |
|
AS | Assignment |
Owner name: SOLIDICA, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FORTSON, FREDERICK O.;SOOSIK, GREG;HANSON, RICHARD;REEL/FRAME:020172/0338;SIGNING DATES FROM 20070928 TO 20071120 Owner name: SOLIDICA, INC., MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FORTSON, FREDERICK O.;SOOSIK, GREG;HANSON, RICHARD;REEL/FRAME:020172/0296;SIGNING DATES FROM 20070928 TO 20071120 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |