US20080043909A1 - X-Ray Alignment System For Fabricating Electronic Chips - Google Patents
X-Ray Alignment System For Fabricating Electronic Chips Download PDFInfo
- Publication number
- US20080043909A1 US20080043909A1 US11/758,961 US75896107A US2008043909A1 US 20080043909 A1 US20080043909 A1 US 20080043909A1 US 75896107 A US75896107 A US 75896107A US 2008043909 A1 US2008043909 A1 US 2008043909A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- screen
- pads
- printing
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Definitions
- This invention relates to the fabrication of electronic chips and, more particularly, to a system and method for aligning a stencil mask with the bonding pads of an electronic chip.
- Screen printing entails depositing a circuit pattern corresponding to that of the stencil pattern onto a chip.
- a chip is placed onto a positionable stage and lifted to a point just below a screen having solder paste thereon.
- a squeegee then moves horizontally across the screen to push solder paste through the screen to produce a stencil pattern.
- Chip attachment site fiducials are commonly used for alignment of the stencil mask to the actual chip carrier substrate to be printed. As the density of chips has increased dramatically, so have the chip carrier substrates, and the attachment site fiducials cannot be added to the design because they use up too much surface area on the substrate. Indeed, special technology is needed to increase the density of contacts on the surface of the chip, and space is at a premium.
- Flip chip interconnects are one way in which the density of chips is maximized.
- Flip chip technology involves the electrical and metallurgical joining of a chip and a carrier to form a package.
- the chip, or die has an array of die pads each having a solder bump positioned thereon. These solder bumps are commonly referred to as C4s, an acronym for controlled collapse chip connection.
- C4s an acronym for controlled collapse chip connection.
- a chip having an array of die pads and C4 bumps may be flipped over so that the C4s can be die-bonded to the contacts on a chip carrier or substrate, thereby electrically interconnecting the chip and the carrier.
- optical alignment systems In optical alignment systems, visible light is employed to perform measurements in alignment systems. However, when finer measurements need to be made, x-ray technology can be employed. Because of their smaller wavelengths, x-rays can provide resolution beyond the limits of conventional optical parameters.
- a method is provided to align a screen printing stencil having very fine pitch dimensions with a chip substrate for the screen printing of solder paste onto chip carrier or substrate.
- the fine pitch dimensions and low light contrast of ceramics of the gold plated receptor pads on a C4 flip chip substrate prevents the use of fiducials for aligning the printing stencil.
- the system of the present invention comprises the replacement of a conventional optical alignment system with an x-ray sub-assembly including an x-ray generator positioned either above or below the C4 flip chip substrate and an x-ray detector positioned on the opposite side of the substrate and detector for receiving and interpreting the x-rays and generating a visual image that may be used to properly align the C4 flip chip substrate to the printing stencil.
- the x-ray sub-assembly is able to align the gold plated receptor pads of low contrast substrates with a screen printing stencil having apertures of less than 125 microns.
- the method of the present invention comprises the steps of beaming x-rays through a chip carrier substrate and associated stencil, detecting the x-rays passing through the substrate and stencil, forming a visual image of the substrate and stencil, and aligning the printing screen with the receptor pads of the substrate based on the generated image.
- FIGS. 1 a - 1 c are perspective views of a prior art optical imaging assembly
- FIG. 2 is a diagram of the operation of a prior art optical imaging assembly
- FIG. 3 is a diagram of an x-ray imaging system according to the present invention.
- FIG. 4 is an image according to the present invention of a substrate having pads of 5 microns or less;
- FIG. 5 is an image according to the present invention of a fine pitch stencil
- FIG. 6 is an image according to the present invention of the stencil of FIG. 5 aligned with the pads depicted in FIG. 4 .
- FIG. 7 is a flow chart illustrating the process associated with the present invention.
- FIG. 1 a conventional optical alignment system 10 , such as Vision Probe system, for aligning a screen printing stencil with a ceramic chip carrier or substrate.
- Optical alignment system 10 includes illumination sources 12 and 14 positioned upwardly and downwardly, respectively, as well as a vision sensor 16 , such as an optical camera for capturing a visual image of stencil 18 and substrate 22 .
- vision system 10 is generally positioned in screen printing machine between a stencil 18 having apertures 20 for printing solder paste and a substrate 22 having receptor pads 24 to be stenciled with solder paste.
- Illumination sources 12 and 14 project visible light onto stencil 18 and substrate 22 , respectively, and sensor 16 detects or images the surface patterns on stencil 18 and substrate 22 , respectively.
- the images detected by sensor 16 may be electronically stored and/or provided to a display screen (not shown) for manual alignment, or processed by a microprocessor computer for automatic alignment of stencil 18 to substrate 22 using images captured by sensor 16 .
- Sensor 16 may be positioned on a shaft for rotation between upwardly and downwardly facing positions to image stencil 18 and substrate 22 independently, or system 10 may include a second, opposing sensor 16 to image stencil 18 and substrate 22 simultaneously.
- the present invention comprises the use of a real-time x-ray system 26 in the related solder plating machine rather than optical camera system 10 .
- X-ray system 26 generally comprises an x-ray source 28 , a steering element 30 , a motorized stage assembly 32 , a detector 34 , an x-ray sensitive camera 36 , and a display screen 38 .
- X-ray source 26 is positioned above stage 32 and generates x-rays which projected toward stage 32 and directed by steering element 30 .
- Stage assembly 32 supports stencil 18 and substrate 22 and includes conventional structure for moving stencil 18 and/or substrate 22 in two to three dimensions (or at least relative to each other), such as microprocessor controlled carriages having side-clamping mechanisms or pins, so that apertures 20 of stencil 18 and receptor pads 24 of substrate 22 may be brought into proper alignment.
- X-rays from source 28 pass through stencil 18 and substrate 22 and are received by detector 34 and directed to camera 36 .
- Camera 36 generates a real-time visual image representative of the relative positioning of apertures 20 and receptor pads 24 for display on screen 38 .
- Stage assembly 32 may then be operated to move stencil 18 and substrate 22 relative to each other until image generated by camera 36 indicates that apertures 20 and receptor pads 24 are properly aligned for screen printing of solder paste onto receptor pads 24 , thereby avoiding the need for visible fiducials.
- the various components for x-ray system 26 may be adapted from conventional systems used for inspecting semiconductor solder joints, such as the real-time x-ray imaging system manufactured by CR Technologies of Aliso Viejo, Calif.
- the real-time x-ray system 26 of the present invention is capable of aligning the gold plated receptor pads 24 of five microns or less disposed upon a low light contrast ceramic (9011 alumina) substrate 22 , as seen in FIG. 4 , with a screen printing stencil 18 having very small apertures 20 of less than 125 microns, as seen in FIG. 5 .
- apertures 20 of stencil 18 have been properly aligned with pads 24 of substrate 20 based on the visual x-ray information provided on display screen 38 so that screen printing of solder paste may commence.
- the method 40 of proper alignment of stencil 18 and substrate 22 begins with the step 42 of affixing stencil 18 and substrate 22 to stage assembly 32 .
- X-ray system 26 is then activated 44 , resulting in the generating real-time images of stencil 18 and substrate 22 which may be viewed 46 on screen 38 .
- decisional block 48 a decision is made whether stencil 18 and substrate 22 are in proper alignment. If not, stage assembly 32 is operated 50 to move stencil 18 relative to substrate 22 and the real-time image on screen 38 is viewed and the alignment checked 48 again. If stencil 18 and substrate 22 are aligned, the screen solder printing process may begin 52 .
- Decisional block 48 may be implemented manually by a user viewing stencil 18 and substrate 22 by then activating the appropriate moveable carriages of stage assembly 32 .
- Decisional block 48 may also be implemented automatically by using a microprocessor that is programmed with the image processing software available in conventional visual systems and interconnected to stage assembly 32 to move stencil 18 and substrate 22 into alignment.
Abstract
A system of using x-rays to align screen printing of flip chip using x-ray sub-assembly in a chip fabricating assembly. X-rays are directed onto a substrate having receptor pads and a printing screen having fine apertures. The substrate is aligned with the printing screen based on the detection and analysis of the real-time image generated from the x-rays passing through the substrate and printing screen. The x-ray alignment system is capable of aligning gold plated receptor pads of five microns or less and disposed upon a low light contrast ceramic (e.g., 9011 alumina) substrate with a screen printing stencil having very small apertures of less than 125 microns.
Description
- The present application is a continuation of and claims priority to Applicant's co-pending U.S. Non-Provisional patent application Ser. No. 11/124,653, now allowed, which is a continuation-in-part of Applicant's U.S. Non-Provisional patent application Ser. No. 10/217,920, filed on Aug. 13, 2002.
- 1. Field of Invention
- This invention relates to the fabrication of electronic chips and, more particularly, to a system and method for aligning a stencil mask with the bonding pads of an electronic chip.
- 2. Description of Prior Art
- The screen printing of solder paste with very fine pitch dimensions for the assembly of electronic (Flip) chips to chip carrier substrates is becoming more common in the art. Screen printing entails depositing a circuit pattern corresponding to that of the stencil pattern onto a chip. A chip is placed onto a positionable stage and lifted to a point just below a screen having solder paste thereon. A squeegee then moves horizontally across the screen to push solder paste through the screen to produce a stencil pattern.
- Chip attachment site fiducials are commonly used for alignment of the stencil mask to the actual chip carrier substrate to be printed. As the density of chips has increased dramatically, so have the chip carrier substrates, and the attachment site fiducials cannot be added to the design because they use up too much surface area on the substrate. Indeed, special technology is needed to increase the density of contacts on the surface of the chip, and space is at a premium.
- Flip chip interconnects are one way in which the density of chips is maximized. Flip chip technology involves the electrical and metallurgical joining of a chip and a carrier to form a package. The chip, or die, has an array of die pads each having a solder bump positioned thereon. These solder bumps are commonly referred to as C4s, an acronym for controlled collapse chip connection. A chip having an array of die pads and C4 bumps may be flipped over so that the C4s can be die-bonded to the contacts on a chip carrier or substrate, thereby electrically interconnecting the chip and the carrier.
- In order to properly align and print C4 solder bumps onto the corresponding die pads, conventional screen printers use a vision camera, such as the Vision Probe system available from Speedline Technologies of Franklin, Mass. (formerly MPM Corporation). Such cameras, however, are limited to approximately twenty microns minimum for feature size due to the resolution of the visual imaging systems. Therefore, pads whose sizes are 5 microns or less cannot be used as alignment targets. This problem is further complicated by the fact that the commonly used ceramic substrates present very little contrast with the pads. Therefore, screen printing is only of use in conjunction with high contrast substrates or large diameter pads
- In optical alignment systems, visible light is employed to perform measurements in alignment systems. However, when finer measurements need to be made, x-ray technology can be employed. Because of their smaller wavelengths, x-rays can provide resolution beyond the limits of conventional optical parameters.
- In U.S. Pat. No. 4,016,416 issued to Shepherd et al for “Phase Compensated Zone Plate Photodetector,” a zone plate with a photodetector mounted on the opposite face is illustrated.
- In U.S. Pat. No. 3,984,680 issued to Smith for “Soft X-Ray Mask Alignment System,” an x-ray mask alignment system is illustrated featuring x-ray fluorescence detectors mounted upon the mask. The x-ray detectors measure the x-ray fluorescent signal, which provides a low intensity output as compared with an electron flux.
- In U.S. Pat. No. 4,614,433 issued to Feldman for “Mask-to-Wafer Alignment Utilizing Zone Plates,” a mask to-wafer alignment using zone plates illuminated by light during alignment is illustrated.
- In U.S. Pat. No. 6,272,202 issued to Chiba et al on Aug. 7, 2001 for “Exposure Method and X-Ray Mask Structure for Use with the Same,” an exposure method for printing circuitry onto a silicon wafer is illustrated.
- In U.S. Pat. No. 6,237,218 issued to Ogawa et al on May 29, 2001 for “Method and Apparatus for Manufacturing, Multilayered Wiring Board and Multi-Layered Wiring Board,” a method of using alignment marks during the lamination steps and a specialized x-ray vision and mechanical alignment machine are illustrated for fabricating printed wire boards.
- In U.S. Pat. No. 5,168,513 issued to Maldonado et al on Dec. 1, 1992 for “X-Ray Metrology and Alignment Detection System,” a process for aligning an x-ray mask and a work piece with an alignment mark is depicted.
- In Japanese Disclosure Document No. JP05-315215 issued to Koji in 1993 for “A Semiconductor Manufacturing Apparatus,” an alignment method using x-ray radiation through an aperture is shown.
- In Japanese Disclosure Document No. JP62144325 issued to Shinichi on Jun. 27, 1987 for “Positioning Method,” the alignment of a wafer is shown using a fluorescent screen and a metal shielding x-ray pattern.
- It is a principal object and advantage of the present invention to provide an improved method and apparatus for aligning a low contrast substrate with a fine pitch printing screen having apertures of less than 125 microns.
- It is another object of this invention to provide an x-ray lithography system for aligning a work piece with a fine pitch mask.
- Other objects and advantages of the present invention will in part be obvious, and in part appear hereinafter.
- In accordance with the present invention, a method is provided to align a screen printing stencil having very fine pitch dimensions with a chip substrate for the screen printing of solder paste onto chip carrier or substrate. The fine pitch dimensions and low light contrast of ceramics of the gold plated receptor pads on a C4 flip chip substrate prevents the use of fiducials for aligning the printing stencil. The system of the present invention comprises the replacement of a conventional optical alignment system with an x-ray sub-assembly including an x-ray generator positioned either above or below the C4 flip chip substrate and an x-ray detector positioned on the opposite side of the substrate and detector for receiving and interpreting the x-rays and generating a visual image that may be used to properly align the C4 flip chip substrate to the printing stencil. The x-ray sub-assembly is able to align the gold plated receptor pads of low contrast substrates with a screen printing stencil having apertures of less than 125 microns. The method of the present invention comprises the steps of beaming x-rays through a chip carrier substrate and associated stencil, detecting the x-rays passing through the substrate and stencil, forming a visual image of the substrate and stencil, and aligning the printing screen with the receptor pads of the substrate based on the generated image.
- The present invention will be more fully understood and appreciated by reading the following Detailed Description in conjunction with the accompanying drawings, in which:
-
FIGS. 1 a-1 c are perspective views of a prior art optical imaging assembly; -
FIG. 2 is a diagram of the operation of a prior art optical imaging assembly; -
FIG. 3 is a diagram of an x-ray imaging system according to the present invention. -
FIG. 4 is an image according to the present invention of a substrate having pads of 5 microns or less; -
FIG. 5 is an image according to the present invention of a fine pitch stencil; and -
FIG. 6 is an image according to the present invention of the stencil ofFIG. 5 aligned with the pads depicted inFIG. 4 . -
FIG. 7 is a flow chart illustrating the process associated with the present invention. - Referring now to the drawing figures, wherein like numerals refer to like parts throughout, there is seen in
FIG. 1 a conventionaloptical alignment system 10, such as Vision Probe system, for aligning a screen printing stencil with a ceramic chip carrier or substrate.Optical alignment system 10 includesillumination sources vision sensor 16, such as an optical camera for capturing a visual image ofstencil 18 andsubstrate 22. - Referring to
FIG. 2 ,vision system 10 is generally positioned in screen printing machine between astencil 18 havingapertures 20 for printing solder paste and asubstrate 22 havingreceptor pads 24 to be stenciled with solder paste.Illumination sources stencil 18 andsubstrate 22, respectively, andsensor 16 detects or images the surface patterns onstencil 18 andsubstrate 22, respectively. The images detected bysensor 16 may be electronically stored and/or provided to a display screen (not shown) for manual alignment, or processed by a microprocessor computer for automatic alignment ofstencil 18 tosubstrate 22 using images captured bysensor 16.Sensor 16 may be positioned on a shaft for rotation between upwardly and downwardly facing positions to imagestencil 18 andsubstrate 22 independently, orsystem 10 may include a second, opposingsensor 16 to imagestencil 18 andsubstrate 22 simultaneously. - Referring to
FIG. 3 , the present invention comprises the use of a real-time x-ray system 26 in the related solder plating machine rather thanoptical camera system 10.X-ray system 26 generally comprises anx-ray source 28, asteering element 30, amotorized stage assembly 32, adetector 34, an x-raysensitive camera 36, and adisplay screen 38. X-raysource 26 is positioned abovestage 32 and generates x-rays which projected towardstage 32 and directed by steeringelement 30.Stage assembly 32 supports stencil 18 andsubstrate 22 and includes conventional structure for movingstencil 18 and/orsubstrate 22 in two to three dimensions (or at least relative to each other), such as microprocessor controlled carriages having side-clamping mechanisms or pins, so thatapertures 20 ofstencil 18 andreceptor pads 24 ofsubstrate 22 may be brought into proper alignment. X-rays fromsource 28 pass throughstencil 18 andsubstrate 22 and are received bydetector 34 and directed tocamera 36.Camera 36 generates a real-time visual image representative of the relative positioning ofapertures 20 andreceptor pads 24 for display onscreen 38.Stage assembly 32 may then be operated to movestencil 18 andsubstrate 22 relative to each other until image generated bycamera 36 indicates thatapertures 20 andreceptor pads 24 are properly aligned for screen printing of solder paste ontoreceptor pads 24, thereby avoiding the need for visible fiducials. The various components forx-ray system 26 may be adapted from conventional systems used for inspecting semiconductor solder joints, such as the real-time x-ray imaging system manufactured by CR Technologies of Aliso Viejo, Calif. - The real-
time x-ray system 26 of the present invention is capable of aligning the gold platedreceptor pads 24 of five microns or less disposed upon a low light contrast ceramic (9011 alumina)substrate 22, as seen inFIG. 4 , with ascreen printing stencil 18 having verysmall apertures 20 of less than 125 microns, as seen inFIG. 5 . Referring toFIG. 6 ,apertures 20 ofstencil 18 have been properly aligned withpads 24 ofsubstrate 20 based on the visual x-ray information provided ondisplay screen 38 so that screen printing of solder paste may commence. - Referring to
FIG. 7 , themethod 40 of proper alignment ofstencil 18 andsubstrate 22 begins with thestep 42 of affixingstencil 18 andsubstrate 22 to stageassembly 32.X-ray system 26 is then activated 44, resulting in the generating real-time images ofstencil 18 andsubstrate 22 which may be viewed 46 onscreen 38. Atdecisional block 48, a decision is made whetherstencil 18 andsubstrate 22 are in proper alignment. If not,stage assembly 32 is operated 50 to movestencil 18 relative tosubstrate 22 and the real-time image onscreen 38 is viewed and the alignment checked 48 again. Ifstencil 18 andsubstrate 22 are aligned, the screen solder printing process may begin 52.Decisional block 48 may be implemented manually by auser viewing stencil 18 andsubstrate 22 by then activating the appropriate moveable carriages ofstage assembly 32.Decisional block 48 may also be implemented automatically by using a microprocessor that is programmed with the image processing software available in conventional visual systems and interconnected to stageassembly 32 to movestencil 18 andsubstrate 22 into alignment.
Claims (10)
1. A system for aligning a screen having apertures for printing of solder bumps onto the receptor pads of a substrate, comprising:
a stage assembly including means for moving said screen relative to said substrate;
an x-ray generator for beaming x-rays through said screen and said substrate;
a detector for collecting x-rays passing through said screen and said substrate; and
a camera interconnected to said detector for generating a real-time image of said screen and said substrate based on x-rays passing through said screen and said substrate.
2. The system of claim 1 , wherein said printing screen is a fine pitch printing screen having apertures of less than approximately 125 microns.
3. The system of claim 1 , wherein said receptor pads comprise flip chip pads.
4. The system of claim 1 , wherein said receptor pads are gold plated.
5. The system of claim 1 , wherein said substrate is low contrast.
6. The system of claim 1 , wherein said receptor pads are spaced no more than approximately 5 microns from one another and said screen has a fine pitch of less than approximately 125 microns.
7. The system of claim 6 , wherein said receptor pads comprise flip chip pads.
8. The system of claim 6 , wherein said receptor pads are gold plated.
9. The system of claim 6 , wherein said substrate is low contrast.
10. A system for aligning a screen having apertures for printing of solder bumps onto the receptor pads of a substrate, comprising:
a motorized stage assembly including a carriage having a side clamping mechanism for retaining said screen and said substrate and for moving said screen relative to said substrate;
an x-ray generator for beaming x-rays through said screen and said substrate; a steering element for directing x-rays beamed by said x-ray generator at said screen and said substrate;
a detector for collecting x-rays passing through said screen and said substrate;
a x-ray sensitive camera interconnected to said detector for generating a real-time image of said screen and said substrate based on x-rays passing through said screen and said substrate; and
a display for displaying said images of said screen and said substrate in real-time, wherein said images are displayed at sufficient magnification to enable receptor pads spaced apart by a distance of no more than 5 microns to be distinguishable from apertures of a diameter of no greater than 125 microns formed in said screen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/758,961 US20080043909A1 (en) | 2002-08-13 | 2007-06-06 | X-Ray Alignment System For Fabricating Electronic Chips |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/217,920 US20040032931A1 (en) | 2002-08-13 | 2002-08-13 | X-ray alignment system for fabricaing electronic chips |
US11/124,653 US7270478B2 (en) | 2002-08-13 | 2005-05-09 | X-ray alignment system for fabricating electronic chips |
US11/758,961 US20080043909A1 (en) | 2002-08-13 | 2007-06-06 | X-Ray Alignment System For Fabricating Electronic Chips |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/124,653 Continuation US7270478B2 (en) | 2002-08-13 | 2005-05-09 | X-ray alignment system for fabricating electronic chips |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080043909A1 true US20080043909A1 (en) | 2008-02-21 |
Family
ID=31714459
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/217,920 Abandoned US20040032931A1 (en) | 2002-08-13 | 2002-08-13 | X-ray alignment system for fabricaing electronic chips |
US11/124,653 Expired - Fee Related US7270478B2 (en) | 2002-08-13 | 2005-05-09 | X-ray alignment system for fabricating electronic chips |
US11/758,961 Abandoned US20080043909A1 (en) | 2002-08-13 | 2007-06-06 | X-Ray Alignment System For Fabricating Electronic Chips |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/217,920 Abandoned US20040032931A1 (en) | 2002-08-13 | 2002-08-13 | X-ray alignment system for fabricaing electronic chips |
US11/124,653 Expired - Fee Related US7270478B2 (en) | 2002-08-13 | 2005-05-09 | X-ray alignment system for fabricating electronic chips |
Country Status (2)
Country | Link |
---|---|
US (3) | US20040032931A1 (en) |
JP (1) | JP3980532B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040032931A1 (en) * | 2002-08-13 | 2004-02-19 | International Business Machines Corporation | X-ray alignment system for fabricaing electronic chips |
US7627026B2 (en) * | 2004-07-01 | 2009-12-01 | Broadcom Corporation | Threshold setting using piecewise linear approximation for channel diagnostic systems |
EP2348347A3 (en) * | 2009-08-28 | 2012-07-04 | European Space Agency | Method for assembling two or more mirror plate stacks into a rigid unit |
US8694183B1 (en) | 2011-12-06 | 2014-04-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Partial automated alignment and integration system |
US9739727B2 (en) | 2015-01-21 | 2017-08-22 | The Boeing Company | Systems and methods for aligning an aperture |
US20200402871A1 (en) * | 2019-06-24 | 2020-12-24 | Magic Leap, Inc. | Polymer patterned disk stack manufacturing |
CN117329990B (en) * | 2023-09-26 | 2024-04-12 | 常州市三洋精密制版有限公司 | Screen plate making silk screen angle measuring device |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3401126A (en) * | 1965-06-18 | 1968-09-10 | Ibm | Method of rendering noble metal conductive composition non-wettable by solder |
US3429040A (en) * | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
US3968193A (en) * | 1971-08-27 | 1976-07-06 | International Business Machines Corporation | Firing process for forming a multilayer glass-metal module |
US3984680A (en) * | 1975-10-14 | 1976-10-05 | Massachusetts Institute Of Technology | Soft X-ray mask alignment system |
US4016416A (en) * | 1976-03-23 | 1977-04-05 | The United States Of America As Represented By The Secretary Of The Air Force | Phase compensated zone plate photodetector |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4614433A (en) * | 1984-07-09 | 1986-09-30 | At&T Bell Laboratories | Mask-to-wafer alignment utilizing zone plates |
US5060063A (en) * | 1990-07-30 | 1991-10-22 | Mpm Corporation | Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis |
US5168513A (en) * | 1991-10-11 | 1992-12-01 | International Business Machines Corporation | X-ray metrology and alignment detection system |
US5174201A (en) * | 1991-06-07 | 1992-12-29 | International Business Machines Corporation | Thick film mask separation detection system |
USRE34615E (en) * | 1987-11-02 | 1994-05-24 | Mpm Corporation | Video probe aligning of object to be acted upon |
US5623872A (en) * | 1994-04-14 | 1997-04-29 | Matsushita Electric Industrial Co. Ltd. | Apparatus and method for separating a mask plate and printed circuit board |
US5735203A (en) * | 1995-04-12 | 1998-04-07 | Matsushita Electric Industrial Co., Ltd. | Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board |
US6151380A (en) * | 1998-02-11 | 2000-11-21 | Glenbrook Technologies Inc. | Ball grid array re-work assembly with X-ray inspection system |
US6237218B1 (en) * | 1997-01-29 | 2001-05-29 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board |
US6272202B1 (en) * | 1998-10-29 | 2001-08-07 | Canon Kabushiki Kaisha | Exposure method and X-ray mask structure for use with the same |
US6278181B1 (en) * | 1999-06-28 | 2001-08-21 | Advanced Micro Devices, Inc. | Stacked multi-chip modules using C4 interconnect technology having improved thermal management |
US20010026638A1 (en) * | 2000-03-28 | 2001-10-04 | Katsuya Sangu | Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
US20010041437A1 (en) * | 1998-10-08 | 2001-11-15 | Cobbley Chad A. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6417573B1 (en) * | 1998-04-08 | 2002-07-09 | Agilent Technologies, Inc. | High temperature flip chip joining flux that obviates the cleaning process |
US20020146093A1 (en) * | 2001-04-10 | 2002-10-10 | Williams John J. | X-ray system alignment method and apparatus |
US6492251B1 (en) * | 1999-03-10 | 2002-12-10 | Tessera, Inc. | Microelectronic joining processes with bonding material application |
US20040032931A1 (en) * | 2002-08-13 | 2004-02-19 | International Business Machines Corporation | X-ray alignment system for fabricaing electronic chips |
-
2002
- 2002-08-13 US US10/217,920 patent/US20040032931A1/en not_active Abandoned
-
2003
- 2003-07-08 JP JP2003271680A patent/JP3980532B2/en not_active Expired - Fee Related
-
2005
- 2005-05-09 US US11/124,653 patent/US7270478B2/en not_active Expired - Fee Related
-
2007
- 2007-06-06 US US11/758,961 patent/US20080043909A1/en not_active Abandoned
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3401126A (en) * | 1965-06-18 | 1968-09-10 | Ibm | Method of rendering noble metal conductive composition non-wettable by solder |
US3429040A (en) * | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
US3968193A (en) * | 1971-08-27 | 1976-07-06 | International Business Machines Corporation | Firing process for forming a multilayer glass-metal module |
US3984680A (en) * | 1975-10-14 | 1976-10-05 | Massachusetts Institute Of Technology | Soft X-ray mask alignment system |
US4016416A (en) * | 1976-03-23 | 1977-04-05 | The United States Of America As Represented By The Secretary Of The Air Force | Phase compensated zone plate photodetector |
US4614433A (en) * | 1984-07-09 | 1986-09-30 | At&T Bell Laboratories | Mask-to-wafer alignment utilizing zone plates |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
USRE34615E (en) * | 1987-11-02 | 1994-05-24 | Mpm Corporation | Video probe aligning of object to be acted upon |
US5060063A (en) * | 1990-07-30 | 1991-10-22 | Mpm Corporation | Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis |
US5174201A (en) * | 1991-06-07 | 1992-12-29 | International Business Machines Corporation | Thick film mask separation detection system |
US5168513A (en) * | 1991-10-11 | 1992-12-01 | International Business Machines Corporation | X-ray metrology and alignment detection system |
US5623872A (en) * | 1994-04-14 | 1997-04-29 | Matsushita Electric Industrial Co. Ltd. | Apparatus and method for separating a mask plate and printed circuit board |
US5735203A (en) * | 1995-04-12 | 1998-04-07 | Matsushita Electric Industrial Co., Ltd. | Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board |
US6237218B1 (en) * | 1997-01-29 | 2001-05-29 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board |
US6151380A (en) * | 1998-02-11 | 2000-11-21 | Glenbrook Technologies Inc. | Ball grid array re-work assembly with X-ray inspection system |
US6417573B1 (en) * | 1998-04-08 | 2002-07-09 | Agilent Technologies, Inc. | High temperature flip chip joining flux that obviates the cleaning process |
US20010041437A1 (en) * | 1998-10-08 | 2001-11-15 | Cobbley Chad A. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6272202B1 (en) * | 1998-10-29 | 2001-08-07 | Canon Kabushiki Kaisha | Exposure method and X-ray mask structure for use with the same |
US6492251B1 (en) * | 1999-03-10 | 2002-12-10 | Tessera, Inc. | Microelectronic joining processes with bonding material application |
US6278181B1 (en) * | 1999-06-28 | 2001-08-21 | Advanced Micro Devices, Inc. | Stacked multi-chip modules using C4 interconnect technology having improved thermal management |
US20010026638A1 (en) * | 2000-03-28 | 2001-10-04 | Katsuya Sangu | Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
US20020146093A1 (en) * | 2001-04-10 | 2002-10-10 | Williams John J. | X-ray system alignment method and apparatus |
US20040032931A1 (en) * | 2002-08-13 | 2004-02-19 | International Business Machines Corporation | X-ray alignment system for fabricaing electronic chips |
Also Published As
Publication number | Publication date |
---|---|
JP3980532B2 (en) | 2007-09-26 |
US7270478B2 (en) | 2007-09-18 |
US20040032931A1 (en) | 2004-02-19 |
JP2004078201A (en) | 2004-03-11 |
US20050194427A1 (en) | 2005-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7270478B2 (en) | X-ray alignment system for fabricating electronic chips | |
US8125632B2 (en) | Fabrication method of semiconductor integrated circuit device | |
US7251883B2 (en) | Electronic-component alignment method and apparatus therefor | |
US4929845A (en) | Method and apparatus for inspection of substrates | |
JP2001517361A (en) | Automated system for element placement | |
US6671397B1 (en) | Measurement system having a camera with a lens and a separate sensor | |
KR100915128B1 (en) | Control method for mounting parts, mounting tester and mounting system | |
JP2539496B2 (en) | Printed circuit board inspection equipment | |
JP4734650B2 (en) | Defect detection method and apparatus for cream solder printing | |
JP2698213B2 (en) | Circuit board and circuit board position recognition method | |
JPH06140799A (en) | Component mounting method | |
JP3530517B2 (en) | Flip chip mounting device with alignment correction function | |
US6954272B2 (en) | Apparatus and method for die placement using transparent plate with fiducials | |
JP2000088542A (en) | Apparatus and method for inspecting soldering | |
JPH11245369A (en) | Image recognition device and cream solder printer | |
JP4264694B2 (en) | Solid-state camera and component mounting apparatus using the same | |
JP4631497B2 (en) | Proximity exposure equipment | |
JPH11219974A (en) | Chip recognizing device and chip mounting device comprising the same | |
JP2001156498A (en) | Method of detecting brought-back electronic component in surface-mounting machine | |
JPH0682227A (en) | Method and apparatus for inspecting appearance of electronic component | |
US20120135546A1 (en) | Alignment inspection | |
JP2001319951A (en) | Method and apparatus for connection test | |
JPH07283272A (en) | Electronic part loading equipment | |
JP3370419B2 (en) | Positioning method for mounting electronic components on circuit boards | |
JPH04158039A (en) | Aligning method and device between print screen and substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |