US20080029881A1 - Circuit board with cooling function - Google Patents
Circuit board with cooling function Download PDFInfo
- Publication number
- US20080029881A1 US20080029881A1 US11/598,643 US59864306A US2008029881A1 US 20080029881 A1 US20080029881 A1 US 20080029881A1 US 59864306 A US59864306 A US 59864306A US 2008029881 A1 US2008029881 A1 US 2008029881A1
- Authority
- US
- United States
- Prior art keywords
- circuit board
- cooling function
- main circuit
- thermal
- interface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Definitions
- Taiwan Application Serial Number 95128685 filed Aug. 4, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.
- the present invention relates to the manufacturing process of a circuit board and a circuit board using the foregoing manufacturing process. More particularly, the present invention relates to the manufacturing process of a circuit board with a cooling function and a circuit board with a cooling function using the foregoing manufacturing process.
- the power density of the circuit board is one of the design issues facing electronics systems as they continue to decrease in size and increase in performance. Decreased size and increased performance requires packing more circuitry into a given volume of the circuit board. Further, the electronic components disposed on the circuit board generate heat during the operation; however, the electronic circuits can only operate effectively and safely over a prescribed temperature range.
- MCPCB Metal Core Printed Circuit board
- a manufacturing process of a circuit board with a cooling function includes forming a thermal interface layer on a first metal thin layer of a thermal plate; joining a second metal thin layer of a main circuit board comprising at least one opening with the thermal interface layer; and reflowing the main circuit board with the joined thermal plate.
- a manufacturing process of a circuit board with a cooling function includes forming a thermal interface layer on a thermal plate; joining a main circuit board comprises at least one opening together with the thermal interface layer; and combining the thermal plate with the main circuit board.
- a circuit board with a cooling function includes a thermal plate, a main circuit board, and a thermal interface layer.
- the thermal interface layer is disposed between the thermal plate and the main circuit board, and is capable of combining the thermal plate with the main circuit board.
- the main circuit board further includes at least one opening disposed on the main circuit board, and is capable of disposing at least one electronic component. Wherein the electronic component is disposed on the opening, and heat generated by the electronic component is transmitted through the opening via the thermal interface layer to the thermal plate.
- FIG. 1 is a cross-sectional view of the electronic components disposed on the circuit board with a cooling function according to one embodiment of the present invention
- FIG. 2 and FIG. 3 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention
- FIG. 4 is a cross-sectional view of a circuit board with a cooling function according to another embodiment of the present invention.
- FIG. 5 and FIG. 6 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention.
- FIG. 1 is a cross-sectional view of the electronic component disposes on the circuit board with a cooling function according to one embodiment of the present invention.
- the circuit board 100 includes a thermal plate 110 , a first metal thin layer 108 , a thermal interface layer 106 , a second metal thin layer 104 , and a main circuit board 102 .
- the main circuit board 102 further includes at least one opening 112 .
- the first metal thin layer 108 is disposed on the thermal plate 110
- the thermal interface layer 106 is disposed on the first metal thin layer 108 .
- the second metal thin layer 104 is disposed between the main circuit board 102 and the thermal interface layer 106 .
- the second metal thin layer 104 is overlaid on the main circuit board 102 and avoids the opening 112 , or the second metal thin layer 104 is completely overlaid on the thermal interface layer 106 , or thermal interface layer 106 is overlaid on the first metal thin layer 108 and avoids the opening 112 , or the thermal interface layer 106 is completely overlaid on the first metal thin layer 108 .
- the thermal interface layer 106 may be a soldering paste
- the first metal thin layer 108 may be an electrically conductive material, for example, copper, silver, aluminum, tin, nickel, and lead.
- the second metal thin layer 104 may be an electrically conductive material, for example, copper, silver, aluminum, tin, nickel, and lead.
- the size of the opening 112 of the main circuit board 102 is equal to or larger than a corresponding electronic component 114 to transmit heat generated by the electronic component 114 through the opening to the thermal plate 110 (for example, via the thermal interface layer 106 , the first metal thin layer 108 , and then to the thermal plate 110 ; or directly from the first metal thin layer 108 to the thermal plate 110 ).
- the electronic component 114 has a heat conduction piece 116 disposed under the electronic component 114 and in the opening 112 .
- the heat conduction piece 116 may directly contact the thermal interface layer 106 , or via the heat medium, for example, the air, to transmit the heat to the thermal interface layer 106 .
- FIG. 2 and FIG. 3 show the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention.
- a first metal thin layer 108 is formed on a thermal plate 110 .
- electroplating forms the first metal thin layer 108 on the thermal plate 110 .
- the material used to form the first metal thin layer 108 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
- conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil is attached on a surface of the thermal plate 110 to form the first metal thin layer 108 .
- heat conduction material is applied on the first metal thin layer 108 to form a thermal interface layer 106 .
- the first metal thin layer 108 and the thermal interface layer 106 are formed using the compatible materials, and the thermal interface layer 106 is an electrically conductive material.
- soldering paste is used to form the thermal interface layer 106 , and the material of the first metal thin layer 108 is compatible with the soldering paste, for example, the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
- the main circuit board 102 further includes one opening 112 , and a second metal thin layer 104 is formed on a surface of the main circuit board 102 . Then, the second metal thin layer 104 of the main circuit board 102 is combined with the thermal interface layer 106 of the thermal plate 106 .
- the second metal thin layer 104 and the thermal interface layer 106 are formed using the compatible materials, and the second metal thin layer 104 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
- the conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil is attached on the surface of the main circuit board 102 to form the second metal thin layer 104 .
- the second thin metal layer 104 is formed by applying a second metal material on the surface of the main circuit board 102 and avoids the opening 112 , or the second metal thin layer 104 is formed by applying the second metal material completely on a surface of the main circuit board 102 , or applying heat conductive material that avoids the opening 112 on the second metal thin layer 104 to form the thermal interface layer 106 , or by applying heat conductive material completely on the second metal thin layer 104 to form the thermal interface layer 106 .
- an electronic component 114 may be disposed on the opening 112 of the main circuit board 102 shown in FIG. 1 .
- the size of the opening 112 of the main circuit board 102 is equal to or larger than the corresponding electronic component 114 .
- heat generated by the electronic component 114 is transmitted via the thermal interface layer 106 and the first metal thin layer 108 to the thermal plate 110 , or directly transmit via the first metal thin layer 108 to the thermal plate 110 .
- the electronic component 114 further includes a heat conduction piece 116 , and is disposed under the electronic component 114 in the opening 112 .
- the heat conduction piece 116 directly contact the thermal interface layer 106 to transmit the heat to the thermal interface layer 106 , or the heat conduction piece 116 is indirect contact with the thermal interface layer 106 to indirectly transmit the heat (for example, transmit via the heat medium, the air) to the thermal interface layer 106 .
- the thermal interface layer 106 is formed on the second metal thin layer 104 and avoids the opening 112 , and the heat conduction piece 116 directly contact the first metal thin layer 108 to transmit the heat to the thermal plate 110 , or the heat conduction piece 116 is indirect contact with the first metal thin layer 108 to indirectly transmit the heat (for example, transmit via the heat medium, the air) to the thermal plate 110 .
- the electronic component 114 may be a light emitting diode.
- the circuit board 100 has both a cooling function and an electronic component 114 disposed on the circuit board 100 during the reflowing process.
- FIG. 4 is a cross-sectional view of a circuit board with a cooling function according to another embodiment of the present invention.
- the circuit board 200 includes a thermal plate 206 , a main circuit board 202 with at least one opening 210 , and a thermal interface layer 204 .
- the thermal interface layer 204 is disposed between the thermal plate 206 and the main circuit board 202 to combine the thermal plate 206 and the main circuit board 202 .
- the thermal interface layer 204 is completely overlaid on the thermal plate 206 , or the thermal interface layer 204 is overlaid on the thermal plate 206 and avoids the opening 210 (not shown).
- the thermal interface layer 204 is a colloid, and is disposed between the thermal plate 206 and the main circuit board 202 .
- FIG. 5 and FIG. 6 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention.
- the thermal interface layer 204 is formed on the thermal plate 206 .
- a colloid may be used to form the thermal interface layer 204 .
- the thermal interface layer 204 is formed using an electrically conductive material, and the material of the thermal interface layer 204 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
- the thermal interface layer 204 is formed by applying an electrically conductive material on the main circuit board 202 and avoids the opening 210 , or by applying the electrically conductive material completely on the thermal plate 206 to form the thermal interface layer 204 .
- electroplating forms the thermal interface layer 204 on the thermal plate 206 , or attaches the conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil on a surface of the thermal plate 206 to form the thermal interface layer 204 .
- the main circuit board 202 has at least one opening 210 .
- heat generated by an electronic component is transmitted by the thermal interface layer 204 to the thermal plate 206 , or directly transmitted to the thermal plate 206 .
- the main circuit board 202 is combined with the thermal interface layer 204 of the thermal plate 206 without the need of the colloid.
- the main circuit board 202 further includes at least one locking element 208 , to fix the thermal plate 206 , the thermal interface layer 204 , and the main circuit board 202 together.
Abstract
The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
Description
- The present application is based on, and claims priority from, Taiwan Application Serial Number 95128685, filed Aug. 4, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.
- 1. Field of Invention
- The present invention relates to the manufacturing process of a circuit board and a circuit board using the foregoing manufacturing process. More particularly, the present invention relates to the manufacturing process of a circuit board with a cooling function and a circuit board with a cooling function using the foregoing manufacturing process.
- 2. Description of Related Art
- The power density of the circuit board is one of the design issues facing electronics systems as they continue to decrease in size and increase in performance. Decreased size and increased performance requires packing more circuitry into a given volume of the circuit board. Further, the electronic components disposed on the circuit board generate heat during the operation; however, the electronic circuits can only operate effectively and safely over a prescribed temperature range.
- Metal Core Printed Circuit board (MCPCB) is adopted to solve the foregoing heat dissipation problem of the circuit board during the operation. However, MCPCB requires a complicated manufacturing process and the thermal medium layers make the MCPCB more expensive.
- For the foregoing reasons, there is a need for a simplified manufacturing process of a circuit with a cooling functionality and a circuit board with a cooling function using the foregoing manufacturing process.
- It is therefore an aspect of the present invention to provide a manufacturing process of a circuit board with a cooling function to simplify the manufacturing of the circuit board.
- It is another aspect of the present invention to provide a circuit board with a cooling function that cuts down the layers of thermal interfaces required to increase the speed of the heat transmission.
- In accordance with the foregoing and other aspects of the present invention, a manufacturing process of a circuit board with a cooling function includes forming a thermal interface layer on a first metal thin layer of a thermal plate; joining a second metal thin layer of a main circuit board comprising at least one opening with the thermal interface layer; and reflowing the main circuit board with the joined thermal plate.
- In accordance with the foregoing and other aspects of the present invention, a manufacturing process of a circuit board with a cooling function includes forming a thermal interface layer on a thermal plate; joining a main circuit board comprises at least one opening together with the thermal interface layer; and combining the thermal plate with the main circuit board.
- In accordance with the foregoing and other aspects of the present invention, a circuit board with a cooling function includes a thermal plate, a main circuit board, and a thermal interface layer. The thermal interface layer is disposed between the thermal plate and the main circuit board, and is capable of combining the thermal plate with the main circuit board. The main circuit board further includes at least one opening disposed on the main circuit board, and is capable of disposing at least one electronic component. Wherein the electronic component is disposed on the opening, and heat generated by the electronic component is transmitted through the opening via the thermal interface layer to the thermal plate.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
-
FIG. 1 is a cross-sectional view of the electronic components disposed on the circuit board with a cooling function according to one embodiment of the present invention; -
FIG. 2 andFIG. 3 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention; -
FIG. 4 is a cross-sectional view of a circuit board with a cooling function according to another embodiment of the present invention; and -
FIG. 5 andFIG. 6 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention. - Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIG. 1 is a cross-sectional view of the electronic component disposes on the circuit board with a cooling function according to one embodiment of the present invention. - The
circuit board 100 includes athermal plate 110, a first metalthin layer 108, athermal interface layer 106, a second metalthin layer 104, and amain circuit board 102. Themain circuit board 102 further includes at least one opening 112. The first metalthin layer 108 is disposed on thethermal plate 110, and thethermal interface layer 106 is disposed on the first metalthin layer 108. The second metalthin layer 104 is disposed between themain circuit board 102 and thethermal interface layer 106. For example, the second metalthin layer 104 is overlaid on themain circuit board 102 and avoids theopening 112, or the second metalthin layer 104 is completely overlaid on thethermal interface layer 106, orthermal interface layer 106 is overlaid on the first metalthin layer 108 and avoids theopening 112, or thethermal interface layer 106 is completely overlaid on the first metalthin layer 108. Thethermal interface layer 106 may be a soldering paste, and the first metalthin layer 108 may be an electrically conductive material, for example, copper, silver, aluminum, tin, nickel, and lead. The second metalthin layer 104 may be an electrically conductive material, for example, copper, silver, aluminum, tin, nickel, and lead. - The size of the
opening 112 of themain circuit board 102 is equal to or larger than a correspondingelectronic component 114 to transmit heat generated by theelectronic component 114 through the opening to the thermal plate 110 (for example, via thethermal interface layer 106, the first metalthin layer 108, and then to thethermal plate 110; or directly from the first metalthin layer 108 to the thermal plate 110). Theelectronic component 114 has aheat conduction piece 116 disposed under theelectronic component 114 and in theopening 112. Theheat conduction piece 116 may directly contact thethermal interface layer 106, or via the heat medium, for example, the air, to transmit the heat to thethermal interface layer 106. -
FIG. 2 andFIG. 3 show the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention. A first metalthin layer 108 is formed on athermal plate 110. For example, electroplating forms the first metalthin layer 108 on thethermal plate 110. The material used to form the first metalthin layer 108 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. For example, conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil is attached on a surface of thethermal plate 110 to form the first metalthin layer 108. - Then, heat conduction material is applied on the first metal
thin layer 108 to form athermal interface layer 106. The first metalthin layer 108 and thethermal interface layer 106 are formed using the compatible materials, and thethermal interface layer 106 is an electrically conductive material. For example, soldering paste is used to form thethermal interface layer 106, and the material of the first metalthin layer 108 is compatible with the soldering paste, for example, the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. - Please refer to
FIG. 2 , themain circuit board 102 further includes oneopening 112, and a second metalthin layer 104 is formed on a surface of themain circuit board 102. Then, the second metalthin layer 104 of themain circuit board 102 is combined with thethermal interface layer 106 of thethermal plate 106. The second metalthin layer 104 and thethermal interface layer 106 are formed using the compatible materials, and the second metalthin layer 104 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. For example, the conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil is attached on the surface of themain circuit board 102 to form the second metalthin layer 104. The secondthin metal layer 104 is formed by applying a second metal material on the surface of themain circuit board 102 and avoids theopening 112, or the second metalthin layer 104 is formed by applying the second metal material completely on a surface of themain circuit board 102, or applying heat conductive material that avoids theopening 112 on the second metalthin layer 104 to form thethermal interface layer 106, or by applying heat conductive material completely on the second metalthin layer 104 to form thethermal interface layer 106. - Refer to
FIG. 3 , after combining the second metalthin layer 104 of themain circuit board 102 with thethermal interface layer 106, then using reflowing to combine the first metalthin layer 108, thethermal interface layer 106, the second metalthin layer 104, thethermal plate 110, and themain circuit board 102. - In the process of making the
circuit board 100, anelectronic component 114 may be disposed on theopening 112 of themain circuit board 102 shown inFIG. 1 . The size of theopening 112 of themain circuit board 102 is equal to or larger than the correspondingelectronic component 114. For example, heat generated by theelectronic component 114 is transmitted via thethermal interface layer 106 and the first metalthin layer 108 to thethermal plate 110, or directly transmit via the first metalthin layer 108 to thethermal plate 110. Theelectronic component 114 further includes aheat conduction piece 116, and is disposed under theelectronic component 114 in theopening 112. For example, theheat conduction piece 116 directly contact thethermal interface layer 106 to transmit the heat to thethermal interface layer 106, or theheat conduction piece 116 is indirect contact with thethermal interface layer 106 to indirectly transmit the heat (for example, transmit via the heat medium, the air) to thethermal interface layer 106. Thethermal interface layer 106 is formed on the second metalthin layer 104 and avoids theopening 112, and theheat conduction piece 116 directly contact the first metalthin layer 108 to transmit the heat to thethermal plate 110, or theheat conduction piece 116 is indirect contact with the first metalthin layer 108 to indirectly transmit the heat (for example, transmit via the heat medium, the air) to thethermal plate 110. Theelectronic component 114 may be a light emitting diode. For example, before the reflowing process, at least oneelectronic component 114 is disposed on theopening 112 of themain circuit board 102. Hence, thecircuit board 100 has both a cooling function and anelectronic component 114 disposed on thecircuit board 100 during the reflowing process. -
FIG. 4 is a cross-sectional view of a circuit board with a cooling function according to another embodiment of the present invention. - The
circuit board 200 includes athermal plate 206, amain circuit board 202 with at least oneopening 210, and athermal interface layer 204. Thethermal interface layer 204 is disposed between thethermal plate 206 and themain circuit board 202 to combine thethermal plate 206 and themain circuit board 202. Thethermal interface layer 204 is completely overlaid on thethermal plate 206, or thethermal interface layer 204 is overlaid on thethermal plate 206 and avoids the opening 210 (not shown). For example, thethermal interface layer 204 is a colloid, and is disposed between thethermal plate 206 and themain circuit board 202. -
FIG. 5 andFIG. 6 are the manufacturing processes of a circuit board with a cooling function according to one embodiment of the present invention. Refer toFIG. 5 . Thethermal interface layer 204 is formed on thethermal plate 206. For example, a colloid may be used to form thethermal interface layer 204. Thethermal interface layer 204 is formed using an electrically conductive material, and the material of thethermal interface layer 204 is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead. Thethermal interface layer 204 is formed by applying an electrically conductive material on themain circuit board 202 and avoids theopening 210, or by applying the electrically conductive material completely on thethermal plate 206 to form thethermal interface layer 204. For example, electroplating forms thethermal interface layer 204 on thethermal plate 206, or attaches the conventional copper foil, silver foil, aluminum foil, tin foil, nickel foil, or lead foil on a surface of thethermal plate 206 to form thethermal interface layer 204. - Refer to
FIG. 5 . Themain circuit board 202 has at least oneopening 210. For example, heat generated by an electronic component (not shown) is transmitted by thethermal interface layer 204 to thethermal plate 206, or directly transmitted to thethermal plate 206. - Refer to
FIG. 6 . Themain circuit board 202 is combined with thethermal interface layer 204 of thethermal plate 206 without the need of the colloid. For example, themain circuit board 202 further includes at least onelocking element 208, to fix thethermal plate 206, thethermal interface layer 204, and themain circuit board 202 together. - It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (20)
1. A manufacturing process of a circuit board with a cooling function, comprising:
forming a thermal interface layer on a first metal thin layer of a thermal plate;
joining a second metal thin layer of a main circuit board comprising at least one opening with the thermal interface layer; and
reflowing the main circuit board with the joined thermal plate.
2. The manufacturing process of the circuit board with a cooling function of claim 1 , further comprises forming the first metal thin layer on a surface of the thermal plate.
3. The manufacturing process of the circuit board with a cooling function of claim 1 , wherein the thermal interface layer is a solder paste.
4. The manufacturing process of the circuit board with a cooling function of claim 1 , wherein the material of the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
5. The manufacturing process of the circuit board with a cooling function of claim 1 , wherein the material of the second metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
6. The manufacturing process of the circuit board with a cooling function of claim 1 , further comprises disposing at least one electronic component on the opening of the main circuit board prior to the reflowing.
7. The manufacturing process of the circuit board with a cooling function of claim 1 , wherein the size of the opening of the main circuit board is equal to or larger than the corresponding electronic component to transmit heat generated by the electronic component through the opening to the thermal plate.
8. A manufacturing process of a circuit board with a cooling function, comprising:
forming a thermal interface layer on a thermal plate;
joining a main circuit board comprises at least one opening together with the thermal interface layer; and
combining the thermal plate with the main circuit board.
9. The manufacturing process of a circuit board with a cooling function of claim 8 , wherein combining the thermal plate with the main circuit board further comprises using at least one locking element, to fix the thermal plate, the thermal interface layer, and the main circuit board together.
10. The manufacturing process of a circuit board with a cooling function of claim 8 , wherein the thermal interface layer is a colloid.
11. The manufacturing process of a circuit board with a cooling function of claim 10 , wherein combining the thermal plate with the main circuit board further comprises using the colloid to bind and fix the thermal plate with the main circuit board.
12. A circuit board with a cooling function, comprising:
a thermal plate;
a main circuit board, comprises at least one opening disposes on the main circuit board, is capable of disposing at least one electronic component; and
a thermal interface layer, disposed between the thermal plate and the main circuit board, is capable of combining the thermal plate with the main circuit board;
wherein the electronic component is disposed on the opening, and heat generated by the electronic component is transmitted through the opening via the thermal interface layer to the thermal plate.
13. The circuit board with a cooling function of claim 12 , wherein the thermal interface layer is a colloid.
14. The circuit board with a cooling function of claim 12 , wherein the circuit board with a cooling function further comprises at least one locking element, disposed on the main circuit board, is capable of fixing the thermal plate, the thermal interface layer, and the main circuit board together.
15. The circuit board with a cooling function of claim 12 , wherein the thermal interface layer is a solder paste.
16. The circuit board with a cooling function of claim 15 , wherein the thermal plate further comprises a first metal thin layer, disposed between the thermal plate and the soldering paste, is capable of combing the thermal plate with the solder paste.
17. The circuit board with a cooling function of claim 16 , wherein the material of the first metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
18. The circuit board with a cooling function of claim 15 , wherein the circuit board with a cooling function further comprises a second metal thin layer, disposed between the main circuit board and the solder paste, is capable of combing the main circuit board with the solder paste.
19. The circuit board with a cooling function of claim 18 , wherein the material of the second metal thin layer is selected from the group consisting of copper, silver, aluminum, tin, nickel, and lead.
20. The circuit board with a cooling function of claim 12 , wherein the size of the opening of the main circuit board is equal to or larger than the corresponding electronic component to transmit heat generated by the electronic component through the opening to the thermal plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/465,040 US7808786B2 (en) | 2006-08-04 | 2009-05-13 | Circuit board with cooling function |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95128685 | 2006-08-04 | ||
TW095128685A TWI340010B (en) | 2006-08-04 | 2006-08-04 | Circuit board with cooling functionality |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/465,040 Division US7808786B2 (en) | 2006-08-04 | 2009-05-13 | Circuit board with cooling function |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080029881A1 true US20080029881A1 (en) | 2008-02-07 |
Family
ID=39028350
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/598,643 Abandoned US20080029881A1 (en) | 2006-08-04 | 2006-11-14 | Circuit board with cooling function |
US12/465,040 Expired - Fee Related US7808786B2 (en) | 2006-08-04 | 2009-05-13 | Circuit board with cooling function |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/465,040 Expired - Fee Related US7808786B2 (en) | 2006-08-04 | 2009-05-13 | Circuit board with cooling function |
Country Status (3)
Country | Link |
---|---|
US (2) | US20080029881A1 (en) |
JP (1) | JP2008042162A (en) |
TW (1) | TWI340010B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010050896A1 (en) * | 2008-10-29 | 2010-05-06 | Opulent Electronics International Pte Ltd | Insulated metal substrate and method of forming the same |
WO2011046396A2 (en) | 2009-10-15 | 2011-04-21 | Samsung Electronics Co., Ltd. | Apparatus and method for channel aggregation and guard channel indication for visible light communication |
US20120207426A1 (en) * | 2011-02-16 | 2012-08-16 | International Business Machines Corporation | Flip-chip packaging for dense hybrid integration of electrical and photonic integrated circuits |
CN103871997A (en) * | 2012-12-14 | 2014-06-18 | 常熟东南相互电子有限公司 | Encapsulation substrate and electronic assembly body |
US20150131277A1 (en) * | 2013-11-13 | 2015-05-14 | Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. | Led tube |
US20160345462A1 (en) * | 2015-05-22 | 2016-11-24 | Abb Technology Oy | Thermal interface foil |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039771B1 (en) | 2009-05-20 | 2011-06-09 | 권오국 | PCB manufacturing method using high radiation metal plate |
US20100302789A1 (en) * | 2009-05-28 | 2010-12-02 | Qing Li | LED Light Source Module and Method for Producing the Same |
US9303861B2 (en) | 2009-09-14 | 2016-04-05 | Us Vaopto, Inc. | Light emitting diode light source modules |
US20120106136A1 (en) * | 2010-11-11 | 2012-05-03 | Bridgelux, Inc. | Thermal heat transfer wire |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5583378A (en) * | 1994-05-16 | 1996-12-10 | Amkor Electronics, Inc. | Ball grid array integrated circuit package with thermal conductor |
US5675474A (en) * | 1994-07-15 | 1997-10-07 | Mitsubishi Materials Corporation | Highly heat-radiating ceramic package |
US5767577A (en) * | 1994-12-16 | 1998-06-16 | Hitachi, Ltd. | Method of solder bonding and power semiconductor device manufactured by the method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3431416A1 (en) * | 1984-08-27 | 1986-02-27 | Hoechst Ag, 6230 Frankfurt | METHOD FOR PRODUCING 2-HYDROXY-5,6,7,8-TETRAHYDROCARBAZOL, THE ALKALI AND EARTH ALKALINE SALTS OF 2-HYDROXY-5,6,7,8-TETRAHYDROCARBAZOL AND USE THEREOF |
JP2762639B2 (en) * | 1989-12-15 | 1998-06-04 | 富士通株式会社 | Head support arm |
JP2783882B2 (en) | 1989-12-25 | 1998-08-06 | 三洋電機株式会社 | Hybrid integrated circuit and method of manufacturing the same |
JP2529780B2 (en) | 1991-02-06 | 1996-09-04 | スカイアルミニウム株式会社 | Metal substrate |
KR100307465B1 (en) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | Power module |
JPH06232549A (en) | 1993-02-08 | 1994-08-19 | Hitachi Chem Co Ltd | Manufacture of metal base board |
JPH06334280A (en) | 1993-05-21 | 1994-12-02 | Nippon Rika Kogyosho:Kk | Circuit substrate |
JPH10224061A (en) | 1997-02-10 | 1998-08-21 | Matsushita Electric Ind Co Ltd | Heat sink unit and electronic equipment |
US5960535A (en) * | 1997-10-28 | 1999-10-05 | Hewlett-Packard Company | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
TW561799B (en) * | 1999-08-11 | 2003-11-11 | Fujikura Ltd | Chip assembly module of bump connection type using a multi-layer printed circuit substrate |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
US6518502B2 (en) * | 2001-05-10 | 2003-02-11 | Lamina Ceramics, In | Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
JP4045781B2 (en) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | Light emitting device |
US6563696B1 (en) * | 2001-10-17 | 2003-05-13 | Ciena Corporation | Solderless laser assembly |
JP4159861B2 (en) * | 2002-11-26 | 2008-10-01 | 新日本無線株式会社 | Method for manufacturing heat dissipation structure of printed circuit board |
US6999318B2 (en) * | 2003-07-28 | 2006-02-14 | Honeywell International Inc. | Heatsinking electronic devices |
US7044620B2 (en) * | 2004-04-30 | 2006-05-16 | Guide Corporation | LED assembly with reverse circuit board |
US7303315B2 (en) * | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
DE102005061208A1 (en) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | lighting device |
CN100464411C (en) * | 2005-10-20 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Encapsulation method and structure of light emitting diode |
-
2006
- 2006-08-04 TW TW095128685A patent/TWI340010B/en not_active IP Right Cessation
- 2006-11-14 US US11/598,643 patent/US20080029881A1/en not_active Abandoned
-
2007
- 2007-03-05 JP JP2007053888A patent/JP2008042162A/en active Pending
-
2009
- 2009-05-13 US US12/465,040 patent/US7808786B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5583378A (en) * | 1994-05-16 | 1996-12-10 | Amkor Electronics, Inc. | Ball grid array integrated circuit package with thermal conductor |
US5675474A (en) * | 1994-07-15 | 1997-10-07 | Mitsubishi Materials Corporation | Highly heat-radiating ceramic package |
US5767577A (en) * | 1994-12-16 | 1998-06-16 | Hitachi, Ltd. | Method of solder bonding and power semiconductor device manufactured by the method |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010050896A1 (en) * | 2008-10-29 | 2010-05-06 | Opulent Electronics International Pte Ltd | Insulated metal substrate and method of forming the same |
WO2011046396A2 (en) | 2009-10-15 | 2011-04-21 | Samsung Electronics Co., Ltd. | Apparatus and method for channel aggregation and guard channel indication for visible light communication |
US20120207426A1 (en) * | 2011-02-16 | 2012-08-16 | International Business Machines Corporation | Flip-chip packaging for dense hybrid integration of electrical and photonic integrated circuits |
CN103871997A (en) * | 2012-12-14 | 2014-06-18 | 常熟东南相互电子有限公司 | Encapsulation substrate and electronic assembly body |
US20150131277A1 (en) * | 2013-11-13 | 2015-05-14 | Shenzhen Jiawei Photovoltaic Lighting Co., Ltd. | Led tube |
US20160345462A1 (en) * | 2015-05-22 | 2016-11-24 | Abb Technology Oy | Thermal interface foil |
Also Published As
Publication number | Publication date |
---|---|
TW200810668A (en) | 2008-02-16 |
JP2008042162A (en) | 2008-02-21 |
US7808786B2 (en) | 2010-10-05 |
US20090219699A1 (en) | 2009-09-03 |
TWI340010B (en) | 2011-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7808786B2 (en) | Circuit board with cooling function | |
US8279607B2 (en) | Cooling module assembly method | |
JP4610414B2 (en) | Electronic component storage package, electronic device, and electronic device mounting structure | |
US9887338B2 (en) | Light emitting diode device | |
US20080278917A1 (en) | Heat dissipation module and method for fabricating the same | |
JP2011108924A (en) | Heat conducting substrate and method for mounting electronic component on the same | |
US7943855B2 (en) | Flexible printed circuit board and electronic component assembly | |
CN111132476A (en) | Preparation method of double-sided circuit radiating substrate | |
JPWO2007138771A1 (en) | Semiconductor device, electronic component module, and method of manufacturing semiconductor device | |
JP2006066725A (en) | Semiconductor device equipped with heat dissipation structure, and its assembly method | |
JP2006165114A (en) | Method for mounting semiconductor device, mounting structure and apparatus | |
KR101115403B1 (en) | Light emitting apparatus | |
JP5411174B2 (en) | Circuit board and manufacturing method thereof | |
JP6633151B2 (en) | Circuit module | |
JP6686467B2 (en) | Electronic component heat dissipation structure | |
JP2016076509A (en) | Circuit module | |
JP2007035843A (en) | Electronic circuit device | |
WO2020059239A1 (en) | Electronic control device | |
CN111354692A (en) | Power heat dissipation device | |
JP2004111633A (en) | Optical communication device | |
JP2006216674A (en) | Printed circuit with improved heat dissipation performance and circuit module comprising the same | |
US20100251536A1 (en) | Heat-dissipating structure on case of industrial computer and manufacturing method thereof | |
US11553616B2 (en) | Module with power device | |
KR101944756B1 (en) | Substrate for electronic component | |
US10973153B2 (en) | Power module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EVERLIGHT ELECTRONICS CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIANG, CHI-HAO;ZHONG, XIE-ZHI;KUO, HUI-YING;REEL/FRAME:018554/0502 Effective date: 20061023 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |