US20070166866A1 - Overmolded optical package - Google Patents

Overmolded optical package Download PDF

Info

Publication number
US20070166866A1
US20070166866A1 US11/686,748 US68674807A US2007166866A1 US 20070166866 A1 US20070166866 A1 US 20070166866A1 US 68674807 A US68674807 A US 68674807A US 2007166866 A1 US2007166866 A1 US 2007166866A1
Authority
US
United States
Prior art keywords
substrate
chip
window
optical
supporter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/686,748
Inventor
Bernd Appelt
William Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Semiconductor Engineering Inc
Original Assignee
Advanced Semiconductor Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Engineering Inc filed Critical Advanced Semiconductor Engineering Inc
Priority to US11/686,748 priority Critical patent/US20070166866A1/en
Publication of US20070166866A1 publication Critical patent/US20070166866A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the present invention relates to an optical semiconductor package, and more particularly, to an optical package which is manufactured by the overmolding process.
  • the optical package 10 comprises a carrier or a substrate 12 and a chip 20 mounded on the substrate 12 .
  • the substrate 12 has a sidewall 16 which surrounds the substrate 12 .
  • a transparent lid 32 is mounted on the sidewall 16 by an adhesive 34 so as to form a hermetic cavity 30 and transmit the light interacting with the chip 20 .
  • the chip 20 has optical elements 22 , such as optical sensors or imaging sensors, and is disposed in the cavity 30 .
  • the chip 20 is electrically connected to a plurality of bonding pads 18 of the substrate 12 by a plurality of bonding wires 26 .
  • the bonding pads 18 on the upper surface of the substrate 12 are electrically connected to the solder pads 14 on the bottom surface thereof through traces or vias 19 .
  • the substrate 12 is typically made of caramel, i.e., the substrate 12 is a kind of ceramic substrate. Furthermore, the bonding pads 18 and the solder pads 14 are disposed on the upper surface and the bottom surface of the substrate 12 , respectively, so the substrate 12 is a multilayer structure.
  • the multilayer ceramic substrate 12 has long delivery lead times and is substantially expensive.
  • the bonding wires 26 are connected to the bonding pads 18 and the chip 20 which are recessed in the cavity 30 , so the cavity 30 or the space surrounded by the sidewall 16 has to be large enough that the wire bond tool (not shown) can gain access to the bonding pads 18 and the chip 20 . Therefore, the cost of the substrate 12 is further increased.
  • the ceramic substrate 12 is supplied typically as single units or small arrays and hence is assembled in single units or small arrays, rather than large matrix arrays, so the assembly cost of the package 10 is further increased.
  • the present invention provides an optical semiconductor package comprising a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant.
  • the chip is disposed on the substrate and has an optical element.
  • the bonding wires are used for electrically connecting the chip to the substrate.
  • the window is supported on the supporter and positioned over the optical element of the chip.
  • the encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.
  • the substrate of the optical semiconductor package does not have to be provided with a cavity for receiving the chip, so the substrate can be substantially planar and be an organic laminate or ceramic substrate such that the cost of the substrate is substantially reduced. Furthermore, according to the manufacturing processes of the present invention, the substrate in matrix array can be utilized for mass production and the cost of the optical semiconductor package can be further reduced.
  • FIG. 1 is a schematic cross-sectional view of an optical package in the prior art.
  • FIG. 2 is a schematic cross-sectional view of an optical package according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of an optical package according to another embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of an optical package according to a further embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of an optical package according to a still further embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of an optical package according to yet another embodiment of the present invention.
  • the optical semiconductor package 100 comprises a carrier or substrate 112 which is substantially planar and a chip 120 mounted on the substrate 112 .
  • the substrate 112 can be either an organic laminate or a ceramic substrate.
  • the chip 120 has optical elements 122 , such as optical sensors or imaging sensors, and is electrically connected to a plurality of bonding pads 118 of the substrate 112 by a plurality of bonding wires 126 .
  • the substrate 112 is further provided with solder balls 114 electrically connected to the bonding pads 118 for being electrically connected to an external printing circuit board (not shown).
  • a supporter 140 is disposed on the substrate 112 and is provided with a shoulder 144 for supporting and holding a window 142 . Then, an encapsulant 130 is formed by overmolding or insert molding process and the window 142 is kept in place.
  • the window 142 is typically positioned above the optical elements 122 of the chip 120 for receiving or transmitting the light interacting with the optical elements 122 .
  • the encapsulant 130 is transparent plastic, such as acrylate, nylon, polycarbonate, and the like.
  • the supporter 140 can be made of thermal conductive material for serving as a heat sink. Alternatively, the supporter 140 can be made of any plastic, such as PPS, Polycarbonate, LCP and the like, for reducing the cost.
  • the dimensions of the window 142 are designed such that the window 142 does not interfere with the bonding wires 126 .
  • the dimensions and shape of the supporter 140 depend on the height of the apexes of the bonding wires 126 , the dimensions of the chip 120 , and dimensions of the substrate 112 .
  • the space or gap between the window 142 and the optical elements 122 of the chip 120 is optimized for overmolding and for light transmission. That is, the gap needs to be large enough to allow the encapsulant 130 to be filled without disturbing the bonding wires 126 or the optical elements 122 and the gap needs to be small enough to permit sufficient transmission of light to ensure adequate operation of the optical sensor.
  • the material of the window 142 depends on the optical requirements.
  • the material of the window 142 can be glass for the light at the wavelength above 320 nm, or quartz for ultraviolet (UV) light.
  • the window 142 also can be made of optically transparent plastic, such as acrylate, nylon, polycarbonate, and the like.
  • the supporter 140 and the window 142 can be made integrally and made of plastic, such as acrylate, nylon, polycarbonate, and the like.
  • FIG. 3 it depicts an optical semiconductor package 200 according to another embodiment of the present invention.
  • the optical semiconductor package 200 is similar to the optical semiconductor package 100 , and the identical elements are designated with the similar reference numerals.
  • the optical semiconductor package 200 further comprises two paired snapping elements including a groove 244 and a protrusion 248 which are disposed on the supporter 240 and the window 242 , respectively.
  • the protrusion 248 of the window 242 is snapped with or held in the groove 244 of the supporter 240 so as to securely fix the window 242 on the supporter 240 and keep the window 242 in place during the overmolding process.
  • the paired snapping elements i.e.
  • the groove 244 and the protrusion 248 are cooperated with each other to seal the junction of the supporter 240 and the window 242 and further prevent the encapsulant 230 from flushing over the window 242 during the overmolding process. Besides, since the window 242 and the supporter 240 are joined together, the window 242 and the supporter 240 can be handled more easily.
  • FIG. 4 it depicts an optical semiconductor package 300 according to further another embodiment of the present invention.
  • the optical semiconductor package 300 is similar to the optical semiconductor package 100 , and the identical elements are designated with the similar reference numerals.
  • the optical semiconductor package 300 further comprises a lens 342 in place of the window 142 of the optical semiconductor package 100 .
  • the lens 342 is used for focusing the light on to the optical elements 322 of the chip 320 and thus increasing the intensity of the light, thereby increasing the sensitivity of the optical semiconductor package 300 .
  • FIG. 5 it depicts an optical semiconductor package 400 according to still another embodiment of the present invention.
  • the optical semiconductor package 400 is similar to the optical semiconductor package 100 , and the identical elements are designated with the similar reference numerals.
  • the optical semiconductor package 400 further comprises a window 442 directly disposed or mounted on the optical element 422 of the chip 420 by an adhesive 440 .
  • the adhesive 440 is a thin layer for retaining the high optical transmission to the chip, and can be made of a material which is of high optical transmission, such as acrylate. It will be apparent to those skilled in the art that the encapsulant 430 of the optical semiconductor package 400 can be made of an opaque material because the encapsulant 430 does not cover the optical elements 422 of the chip 420 .
  • the window 442 is further provided with a plurality of mold locks or ledges 444 for securing the window 442 in the encapsulant 430 .
  • FIG. 6 it depicts an optical semiconductor package 500 according to still another embodiment of the present invention.
  • the optical semiconductor package 500 is similar to the optical semiconductor package 200 , and the identical elements are designated with the similar reference numerals.
  • the optical semiconductor package 500 is provided with a supporter 540 which is hermetically disposed on the substrate 512 to form a cavity 550 .
  • the encapsulant 530 encapsulates the supporter 540 so as to fix the supporter 540 on the substrate 512 .
  • the chip 520 and the bonding wires 526 are positioned in the cavity 550 .
  • the window 542 is hermetically disposed on the supporter 540 for transmitting light into and out of the cavity 550 .
  • the substrate of the optical semiconductor package according to the present invention is not required to have a cavity for receiving the chip, so the substrate can be substantially planar and be an organic laminate or ceramic substrate such that the cost of the substrate is substantially reduced. Furthermore, according to the manufacturing processes of the present invention, the substrate in matrix array can be utilized for mass production and the cost of the optical semiconductor package can be further reduced.

Abstract

An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

Description

    RELATED APPLICATIONS
  • This application is a divisional of U.S. application Ser. No. 10/667,605, filed Sep. 23, 2003, the disclosure of which is incorporated herein by reference.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to an optical semiconductor package, and more particularly, to an optical package which is manufactured by the overmolding process.
  • 2. Description of the Related Art
  • Referring to FIG. 1, it depicts a typically optical package 10 in prior art. The optical package 10 comprises a carrier or a substrate 12 and a chip 20 mounded on the substrate 12. The substrate 12 has a sidewall 16 which surrounds the substrate 12. A transparent lid 32 is mounted on the sidewall 16 by an adhesive 34 so as to form a hermetic cavity 30 and transmit the light interacting with the chip 20. The chip 20 has optical elements 22, such as optical sensors or imaging sensors, and is disposed in the cavity 30. The chip 20 is electrically connected to a plurality of bonding pads 18 of the substrate 12 by a plurality of bonding wires 26. The bonding pads 18 on the upper surface of the substrate 12 are electrically connected to the solder pads 14 on the bottom surface thereof through traces or vias 19. Because of the requirements of the manufacturing process, the substrate 12 is typically made of caramel, i.e., the substrate 12 is a kind of ceramic substrate. Furthermore, the bonding pads 18 and the solder pads 14 are disposed on the upper surface and the bottom surface of the substrate 12, respectively, so the substrate 12 is a multilayer structure.
  • However, the multilayer ceramic substrate 12 has long delivery lead times and is substantially expensive. The bonding wires 26 are connected to the bonding pads 18 and the chip 20 which are recessed in the cavity 30, so the cavity 30 or the space surrounded by the sidewall 16 has to be large enough that the wire bond tool (not shown) can gain access to the bonding pads 18 and the chip 20. Therefore, the cost of the substrate 12 is further increased. The ceramic substrate 12 is supplied typically as single units or small arrays and hence is assembled in single units or small arrays, rather than large matrix arrays, so the assembly cost of the package 10 is further increased.
  • Accordingly, there exists a need for an optical package which can use a planar substrate and be mass-produced to reduce the manufacturing cost of the optical package.
    • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide an optical package with a planar substrate for mass-producing and reducing the manufacturing cost.
  • In order to achieve the above object, the present invention provides an optical semiconductor package comprising a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.
  • Accordingly, the substrate of the optical semiconductor package does not have to be provided with a cavity for receiving the chip, so the substrate can be substantially planar and be an organic laminate or ceramic substrate such that the cost of the substrate is substantially reduced. Furthermore, according to the manufacturing processes of the present invention, the substrate in matrix array can be utilized for mass production and the cost of the optical semiconductor package can be further reduced.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawing.
  • FIG. 1 is a schematic cross-sectional view of an optical package in the prior art.
  • FIG. 2 is a schematic cross-sectional view of an optical package according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of an optical package according to another embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of an optical package according to a further embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of an optical package according to a still further embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of an optical package according to yet another embodiment of the present invention.
    • DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIG. 2, it depicts an optical package 100 according to an embodiment of the present invention. The optical semiconductor package 100 comprises a carrier or substrate 112 which is substantially planar and a chip 120 mounted on the substrate 112. The substrate 112 can be either an organic laminate or a ceramic substrate. The chip 120 has optical elements 122, such as optical sensors or imaging sensors, and is electrically connected to a plurality of bonding pads 118 of the substrate 112 by a plurality of bonding wires 126. The substrate 112 is further provided with solder balls 114 electrically connected to the bonding pads 118 for being electrically connected to an external printing circuit board (not shown).
  • A supporter 140 is disposed on the substrate 112 and is provided with a shoulder 144 for supporting and holding a window 142. Then, an encapsulant 130 is formed by overmolding or insert molding process and the window 142 is kept in place. The window 142 is typically positioned above the optical elements 122 of the chip 120 for receiving or transmitting the light interacting with the optical elements 122. The encapsulant 130 is transparent plastic, such as acrylate, nylon, polycarbonate, and the like. The supporter 140 can be made of thermal conductive material for serving as a heat sink. Alternatively, the supporter 140 can be made of any plastic, such as PPS, Polycarbonate, LCP and the like, for reducing the cost.
  • The dimensions of the window 142 are designed such that the window 142 does not interfere with the bonding wires 126. The dimensions and shape of the supporter 140 depend on the height of the apexes of the bonding wires 126, the dimensions of the chip 120, and dimensions of the substrate 112. The space or gap between the window 142 and the optical elements 122 of the chip 120 is optimized for overmolding and for light transmission. That is, the gap needs to be large enough to allow the encapsulant 130 to be filled without disturbing the bonding wires 126 or the optical elements 122 and the gap needs to be small enough to permit sufficient transmission of light to ensure adequate operation of the optical sensor.
  • The material of the window 142 depends on the optical requirements. For example, the material of the window 142 can be glass for the light at the wavelength above 320 nm, or quartz for ultraviolet (UV) light. The window 142 also can be made of optically transparent plastic, such as acrylate, nylon, polycarbonate, and the like.
  • For high volume applications, the supporter 140 and the window 142 can be made integrally and made of plastic, such as acrylate, nylon, polycarbonate, and the like.
  • Now referring to FIG. 3, it depicts an optical semiconductor package 200 according to another embodiment of the present invention. The optical semiconductor package 200 is similar to the optical semiconductor package 100, and the identical elements are designated with the similar reference numerals. The optical semiconductor package 200 further comprises two paired snapping elements including a groove 244 and a protrusion 248 which are disposed on the supporter 240 and the window 242, respectively. The protrusion 248 of the window 242 is snapped with or held in the groove 244 of the supporter 240 so as to securely fix the window 242 on the supporter 240 and keep the window 242 in place during the overmolding process. Further, the paired snapping elements, i.e. the groove 244 and the protrusion 248, are cooperated with each other to seal the junction of the supporter 240 and the window 242 and further prevent the encapsulant 230 from flushing over the window 242 during the overmolding process. Besides, since the window 242 and the supporter 240 are joined together, the window 242 and the supporter 240 can be handled more easily.
  • Now referring to FIG. 4, it depicts an optical semiconductor package 300 according to further another embodiment of the present invention. The optical semiconductor package 300 is similar to the optical semiconductor package 100, and the identical elements are designated with the similar reference numerals. The optical semiconductor package 300 further comprises a lens 342 in place of the window 142 of the optical semiconductor package 100. The lens 342 is used for focusing the light on to the optical elements 322 of the chip 320 and thus increasing the intensity of the light, thereby increasing the sensitivity of the optical semiconductor package 300.
  • Now referring to FIG. 5, it depicts an optical semiconductor package 400 according to still another embodiment of the present invention. The optical semiconductor package 400 is similar to the optical semiconductor package 100, and the identical elements are designated with the similar reference numerals. The optical semiconductor package 400 further comprises a window 442 directly disposed or mounted on the optical element 422 of the chip 420 by an adhesive 440.
  • The adhesive 440 is a thin layer for retaining the high optical transmission to the chip, and can be made of a material which is of high optical transmission, such as acrylate. It will be apparent to those skilled in the art that the encapsulant 430 of the optical semiconductor package 400 can be made of an opaque material because the encapsulant 430 does not cover the optical elements 422 of the chip 420. The window 442 is further provided with a plurality of mold locks or ledges 444 for securing the window 442 in the encapsulant 430.
  • Now referring to FIG. 6, it depicts an optical semiconductor package 500 according to still another embodiment of the present invention. The optical semiconductor package 500 is similar to the optical semiconductor package 200, and the identical elements are designated with the similar reference numerals. The optical semiconductor package 500 is provided with a supporter 540 which is hermetically disposed on the substrate 512 to form a cavity 550. The encapsulant 530 encapsulates the supporter 540 so as to fix the supporter 540 on the substrate 512. The chip 520 and the bonding wires 526 are positioned in the cavity 550. The window 542 is hermetically disposed on the supporter 540 for transmitting light into and out of the cavity 550. As indicated in the foregoing description, the substrate of the optical semiconductor package according to the present invention is not required to have a cavity for receiving the chip, so the substrate can be substantially planar and be an organic laminate or ceramic substrate such that the cost of the substrate is substantially reduced. Furthermore, according to the manufacturing processes of the present invention, the substrate in matrix array can be utilized for mass production and the cost of the optical semiconductor package can be further reduced.
  • While the foregoing description and drawings represent the preferred embodiments of the present invention, it will be understood that various additions, modifications and substitutions may be made therein without departing from the spirit and scope of the principles of the present invention as defined in the accompanying claims. One skilled in the art will appreciate that the invention may be used with many modifications of form, structure, arrangement, proportions, materials, elements, and components and otherwise, used in the practice of the invention, which are particularly adapted to specific environments and operative requirements without departing from the principles of the present invention. The presently disclosed embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims and their legal equivalents, and not limited to the foregoing description.

Claims (8)

1. A method for manufacturing an optical semiconductor package, comprising the following steps of:
providing a substrate;
mounting a chip having an optical element on the substrate;
bonding a plurality of bonding wires to the chip and the substrate for electrically connecting the chip to the substrate;
providing a supporter;
disposing a window on the supporter;
mounting the supporter on the substrate;
positioning the window corresponding to the optical element of the chip; and
forming an encapsulant on the substrate for fixing the window and encapsulating the chip and the bonding wires.
2. The method as claimed in claim 1, wherein the encapsulant forming step further comprises the following step of:
overmolding the encapsulant.
3. The method as claimed in claim 1, further comprising the following step of:
joining the window and the supporter together.
4. The method as claimed in claim 1, wherein the window is a lens.
5. A method for manufacturing an optical semiconductor package, comprising the following steps of:
providing a substrate;
mounting a chip having an optical element on the substrate;
bonding a plurality of bonding wires to the chip and the substrate for electrically connecting the chip to the substrate;
mounting a window on the optical element of the chip; and
forming an encapsulant on the substrate for fixing the window and encapsulating the chip and the bonding wires.
6. The method as claimed in claim 5, wherein the encapsulant forming step further comprises the following step of:
overmolding the encapsulant.
7. The method as claimed in claim 5, wherein the window is a lens.
8. The method as claimed in claim 5, wherein the window mounting step further comprises the following step of:
providing an adhesive for mounting the window on the optical element of the chip.
US11/686,748 2003-09-23 2007-03-15 Overmolded optical package Abandoned US20070166866A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/686,748 US20070166866A1 (en) 2003-09-23 2007-03-15 Overmolded optical package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/667,605 US7199438B2 (en) 2003-09-23 2003-09-23 Overmolded optical package
US11/686,748 US20070166866A1 (en) 2003-09-23 2007-03-15 Overmolded optical package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/667,605 Division US7199438B2 (en) 2003-09-23 2003-09-23 Overmolded optical package

Publications (1)

Publication Number Publication Date
US20070166866A1 true US20070166866A1 (en) 2007-07-19

Family

ID=34393387

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/667,605 Expired - Lifetime US7199438B2 (en) 2003-09-23 2003-09-23 Overmolded optical package
US11/686,748 Abandoned US20070166866A1 (en) 2003-09-23 2007-03-15 Overmolded optical package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/667,605 Expired - Lifetime US7199438B2 (en) 2003-09-23 2003-09-23 Overmolded optical package

Country Status (2)

Country Link
US (2) US7199438B2 (en)
TW (1) TWI238540B (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080253140A1 (en) * 2007-03-19 2008-10-16 Fleischmann Eric L Light for vehicles
US20090184335A1 (en) * 2008-01-23 2009-07-23 Yoshiki Takayama Optical semiconductor device
US20090256229A1 (en) * 2005-11-16 2009-10-15 Sharp Kabushiki Kaisha Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device
WO2010011396A1 (en) * 2008-07-22 2010-01-28 National Semiconductor Corporation Molded optical package with fiber coupling feature
US7909482B2 (en) 2006-08-21 2011-03-22 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US8230575B2 (en) 2007-12-12 2012-07-31 Innotec Corporation Overmolded circuit board and method
US20120287580A1 (en) * 2009-11-20 2012-11-15 Thales Heat sinking device, notably for vertical components and/or components of complex form
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US9022631B2 (en) 2012-06-13 2015-05-05 Innotec Corp. Flexible light pipe
US10727086B2 (en) * 2018-03-24 2020-07-28 Maxim Integrated Products, Inc. Optical sensor packaging system

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
US7796187B2 (en) * 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
TWI246756B (en) * 2004-06-28 2006-01-01 Siliconware Precision Industries Co Ltd Semiconductor package having exposed heat sink and heat sink therein
EP1861880B1 (en) * 2005-03-25 2012-06-20 FUJIFILM Corporation Method of manufacturing solid state imaging device
JP2006276463A (en) * 2005-03-29 2006-10-12 Sharp Corp Module for optical device and method of manufacturing module for optical device
JP4233536B2 (en) * 2005-03-31 2009-03-04 シャープ株式会社 Module for optical equipment
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
US20070236591A1 (en) * 2006-04-11 2007-10-11 Tam Samuel W Method for mounting protective covers over image capture devices and devices manufactured thereby
US8092102B2 (en) 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
TWM320180U (en) * 2007-04-16 2007-10-01 Lingsen Precision Ind Ltd Package structure of optical sensor chip
WO2008133943A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
US20090045476A1 (en) * 2007-08-16 2009-02-19 Kingpak Technology Inc. Image sensor package and method for forming the same
JP2009081346A (en) * 2007-09-27 2009-04-16 Panasonic Corp Optical device and method for manufacturing same
JP2009099680A (en) * 2007-10-15 2009-05-07 Panasonic Corp Optical device and method of manufacturing the same
SG152086A1 (en) * 2007-10-23 2009-05-29 Micron Technology Inc Packaged semiconductor assemblies and associated systems and methods
US8488046B2 (en) * 2007-12-27 2013-07-16 Digitaloptics Corporation Configurable tele wide module
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
US7582954B1 (en) * 2008-02-25 2009-09-01 National Semiconductor Corporation Optical leadless leadframe package
US8452402B2 (en) * 2008-04-23 2013-05-28 Medtronic, Inc. Optical sensing device for use in a medical device
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
TWI398949B (en) * 2009-07-29 2013-06-11 Kingpak Tech Inc Manufacturing method for molding image sensor package structure and image sensor package structure thereof
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
CN103101875A (en) * 2011-11-11 2013-05-15 精材科技股份有限公司 Semiconductor package and method of fabricating the same
US10043924B1 (en) * 2012-12-04 2018-08-07 Maxim Integrated Products, Inc. Low cost optical sensor package
US9677950B2 (en) 2013-03-14 2017-06-13 Robert Bosch Gmbh Portable device with temperature sensing
JP6210818B2 (en) * 2013-09-30 2017-10-11 三菱電機株式会社 Semiconductor device and manufacturing method thereof
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
US9431442B2 (en) 2015-02-02 2016-08-30 Apple Inc. Overmolded reconstructed camera module
US9973669B2 (en) 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
CN106546327B (en) * 2015-09-17 2021-04-20 日月光半导体制造股份有限公司 Optical device, electric device and passive optical component
WO2017142487A1 (en) * 2016-02-19 2017-08-24 Heptagon Micro Optics Pte. Ltd. Optoelectronic module having dual encapsulation with opening for receiving an optical assembly
KR102193819B1 (en) * 2016-03-12 2020-12-23 닝보 써니 오포테크 코., 엘티디. Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
US10170508B2 (en) * 2016-06-21 2019-01-01 Kingpak Technology Inc. Optical package structure
CN107591420B (en) * 2016-07-06 2020-02-18 胜丽国际股份有限公司 Sensor package structure
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
US9722098B1 (en) 2016-10-18 2017-08-01 Ase Electronics (M) Sdn Bhd Semiconductor device package and method of manufacturing the same
US10522505B2 (en) * 2017-04-06 2019-12-31 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method for manufacturing the same
TWI640073B (en) * 2017-08-16 2018-11-01 勝麗國際股份有限公司 Sensor package structure
CN109427829B (en) * 2017-09-01 2020-09-15 胜丽国际股份有限公司 Sensor package structure
FR3073980A1 (en) * 2017-11-23 2019-05-24 Stmicroelectronics (Grenoble 2) Sas ENCAPSULATION COVER FOR ELECTRONIC HOUSING AND METHOD OF MANUFACTURE
CN111048534B (en) * 2018-10-11 2022-03-11 胜丽国际股份有限公司 Sensor package structure
CN112563155A (en) * 2019-09-26 2021-03-26 伟创力有限公司 Method of forming exposed cavities in a molded electronic device
CN114999934B (en) * 2022-07-18 2022-10-21 威海艾迪科电子科技股份有限公司 Semiconductor packaging structure and forming method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149958A (en) * 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US20010014486A1 (en) * 1999-06-03 2001-08-16 Glenn Thomas P. Method Of Making A Plastic Pakage For An Optical Integrated Circuit Device
US6900531B2 (en) * 2002-10-25 2005-05-31 Freescale Semiconductor, Inc. Image sensor device
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4732042A (en) * 1986-04-22 1988-03-22 Motorola Inc. Cast membrane protected pressure sensor
JPH061226B2 (en) * 1986-05-07 1994-01-05 日本電装株式会社 Semiconductor pressure sensor
JP2991014B2 (en) * 1993-10-08 1999-12-20 三菱電機株式会社 Pressure sensor
NL1003315C2 (en) * 1996-06-11 1997-12-17 Europ Semiconductor Assembly E Method for encapsulating an integrated semiconductor circuit.
US6191359B1 (en) * 1998-10-13 2001-02-20 Intel Corporation Mass reflowable windowed package
FR2798226B1 (en) * 1999-09-02 2002-04-05 St Microelectronics Sa METHOD FOR PACKAGING A SEMICONDUCTOR CHIP CONTAINING SENSORS AND PACKAGE OBTAINED
US6266197B1 (en) * 1999-12-08 2001-07-24 Amkor Technology, Inc. Molded window array for image sensor packages
EP1211721A1 (en) * 2000-11-30 2002-06-05 STMicroelectronics S.r.l. Improved electronic device package and corresponding manufacturing method
US6700190B2 (en) * 2002-07-26 2004-03-02 Stmicroelectronics, Inc. Integrated circuit device with exposed upper and lower die surfaces
US7274094B2 (en) * 2002-08-28 2007-09-25 Micron Technology, Inc. Leadless packaging for image sensor devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149958A (en) * 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US20010014486A1 (en) * 1999-06-03 2001-08-16 Glenn Thomas P. Method Of Making A Plastic Pakage For An Optical Integrated Circuit Device
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
US6900531B2 (en) * 2002-10-25 2005-05-31 Freescale Semiconductor, Inc. Image sensor device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090256229A1 (en) * 2005-11-16 2009-10-15 Sharp Kabushiki Kaisha Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device
US7909482B2 (en) 2006-08-21 2011-03-22 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US8764240B2 (en) 2006-08-21 2014-07-01 Innotec Corp. Electrical device having boardless electrical component mounting arrangement
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US20080253140A1 (en) * 2007-03-19 2008-10-16 Fleischmann Eric L Light for vehicles
US8230575B2 (en) 2007-12-12 2012-07-31 Innotec Corporation Overmolded circuit board and method
US7928547B2 (en) * 2008-01-23 2011-04-19 Panasonic Corporation Optical semiconductor device
US20110163328A1 (en) * 2008-01-23 2011-07-07 Panasonic Corporation Optical semiconductor device
US20090184335A1 (en) * 2008-01-23 2009-07-23 Yoshiki Takayama Optical semiconductor device
US7728399B2 (en) 2008-07-22 2010-06-01 National Semiconductor Corporation Molded optical package with fiber coupling feature
US20100019339A1 (en) * 2008-07-22 2010-01-28 National Semiconductor Corporation Molded optical package with fiber coupling feature
WO2010011396A1 (en) * 2008-07-22 2010-01-28 National Semiconductor Corporation Molded optical package with fiber coupling feature
TWI459062B (en) * 2008-07-22 2014-11-01 Nat Semiconductor Corp Integrated circuit package and optical concentrator for use in the integrated circuit package
US20120287580A1 (en) * 2009-11-20 2012-11-15 Thales Heat sinking device, notably for vertical components and/or components of complex form
US8891242B2 (en) * 2009-11-20 2014-11-18 Thales Heat sinking device, notably for vertical components and/or components of complex form
US9022631B2 (en) 2012-06-13 2015-05-05 Innotec Corp. Flexible light pipe
US10727086B2 (en) * 2018-03-24 2020-07-28 Maxim Integrated Products, Inc. Optical sensor packaging system

Also Published As

Publication number Publication date
TW200512944A (en) 2005-04-01
US7199438B2 (en) 2007-04-03
TWI238540B (en) 2005-08-21
US20050073036A1 (en) 2005-04-07

Similar Documents

Publication Publication Date Title
US7199438B2 (en) Overmolded optical package
US7791184B2 (en) Image sensor packages and frame structure thereof
US6906403B2 (en) Sealed electronic device packages with transparent coverings
US8624371B2 (en) Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
US7521770B2 (en) Image capturing device
CN107566691B (en) Photosensitive assembly, camera module and manufacturing method thereof
US20070241451A1 (en) Electronic component device
US20040041221A1 (en) Leadless packaging for image sensor devices and methods of assembly
US20060027479A1 (en) Optical or electronic module and method for its production
US20050285016A1 (en) Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
US20070210246A1 (en) Stacked image sensor optical module and fabrication method
US20060024857A1 (en) Image sensor package structure and method for fabricating the same
US6693364B2 (en) Optical integrated circuit element package and process for making the same
US8003426B2 (en) Method for manufacturing package structure of optical device
US7592197B2 (en) Image sensor chip package fabrication method
KR20060056851A (en) Optical device and optical apparatus
US5216805A (en) Method of manufacturing an optoelectronic device package
US6939456B2 (en) Miniaturized image sensor module
US20090117689A1 (en) Packaged integrated circuits
JPH02203561A (en) Manufacture of semiconductor device

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION