US20070159632A1

US20070159632A1 - Pattern forming method, pattern forming apparatus, and device manufacturing method

Info

Publication number: US20070159632A1
Application number: US11/646,559
Authority: US
Inventors: Yuichi Shibazaki
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2005-12-28
Filing date: 2006-12-28
Publication date: 2007-07-12
Also published as: US8411271B2

Abstract

To improve the throughput of the entire exposure process. [SOLUTION]

While wafer stage WST moves from a loading position where wafer W on wafer stage WST is exchanged to an exposure starting position where exposure of a wafer begins, at least a part of alignment systems ALG1 and ALG2 are moved and marks on wafer W are detected using alignment systems ALG1 and ALG2. Accordingly, time for mark detection does not have to be arranged separately from the movement time of the stage from the loading position to the exposure starting position, as in the conventional apparatus. Therefore, it becomes possible to increase the throughput of the entire exposure process.

Description

TECHNICAL FIELD TO THE INVENTION

The present invention relates to exposure methods, exposure apparatuses, and device manufacturing methods, and more particularly to an exposure method and an exposure apparatus for forming a pattern by exposing a substrate mounted on a stage, and a device manufacturing method that uses the exposure method.

DESCRIPTION OF THE BACKGROUND ART

In a lithography process for manufacturing microdevices such as a semiconductor, a liquid crystal display device or the like, an exposure apparatus is used that transfers a pattern formed on a mask or a reticle (hereinafter generally referred to as a “reticle”) onto a substrate on which a resist or the like is coated, e.g. a photosensitive object such as a wafer or a glass plate (hereinafter generally referred to as a “wafer”), via a projection optical system.
Semiconductor devices and the like are made by overlaying multiple layers of patterns on the wafer. Therefore, in the exposure apparatus, an operation (alignment) is required for making an optimal positional relation between a pattern formed on the wafer and the pattern formed on the reticle. As the alignment method, the EGA (Enhanced Global Alignment) method is mainly used. In the EGA method, a plurality of specific shot areas (also called sample shot areas or alignment shot areas) is selected in advance, and positional information of alignment marks (sample marks) arranged in the sample shot areas is sequentially measured. Then, static calculation is performed with a least squares method or the like using the measurement results and the designed arrangement information of the shot area, and the arrangement coordinates of the shot areas on the wafer are obtained. Therefore, in the EGA method, the arrangement coordinates of each shot area can be obtained with high precision and high throughput (for example, refer to Patent Document 1).
In the above alignment, in order to measure the alignment marks arranged in the plurality of sample shot areas, the wafer has to be moved along a path in which the plurality of alignment marks can be sequentially positioned in a detection area of a mark detection system (an alignment detection system). Conventionally, wafer alignment operation (the measurement operation of sample marks) was performed prior to the beginning of exposure of the wafer, therefore, when the number of sample shots increases more time has to be put into the measurement, which meant that the throughput of the exposure apparatus could decrease.
Therefore, recently, a stage unit by the so-called twin stage method has been developed in which the throughput of the entire apparatus is improved by executing a parallel processing where two wafer stages are prepared and while exposure is performed on one wafer stage, alignment is performed on the other wafer stage, and is employed in the exposure apparatus. However, because the twin stage is costly, requirements are pressing for a technology that can suppress the decrease in throughput caused by the alignment operation without using the twin stage.
[PATENT DOCUMENT 1] Kokai (Japanese Patent Unexamined Application Publication) No. 61-44429

DISCLOSURE OF THE INVENTION

Means for Solving the Problems

The present invention was made under the above situation, and according to a first aspect of the present invention, there is provided a first exposure method of forming a pattern by exposing a substrate mounted on a stage, the method comprising: a first process of detecting a mark on the substrate while the stage is moving, with at least a part of a mark detection system also being moved; and a second process of exposing the substrate using detection results of the mark.
According to this method, the mark on the substrate is detected while the stage is moving, with at least a part of the mark detection system also being moved. Therefore, time for mark detection does not have to be arranged separately from the movement time of a stage, as in the conventional apparatus. Accordingly, it becomes possible to improve the throughput of the entire exposure process.
In this case, the detection of the mark can be performed while the stage moves at least from a loading position where a substrate is mounted on a stage to a position where exposure of the substrate begins, or the detection of the mark can be performed at least after the beginning of exposing the substrate (at least during the exposure processing).
According to a second aspect of the present invention, there is provided a second exposure method of forming a pattern by exposing a substrate mounted on a stage, the method comprising: a first process of detecting a mark on the substrate while the stage is moving, with a detection area of a mark detection system also being moved; and a second process of exposing the substrate using detection results of the mark.
According to this method, the mark on the substrate is detected while the stage is moving, with the detection area of the mark detection system also being moved, therefore, by performing mark detection while the stage is moving, the time required for detection of the mark can be reduced, which makes it possible to improve the throughput of the entire exposure process.
According to a third aspect of the present invention, there is provided a first exposure apparatus that forms a pattern by exposing a substrate mounted on a stage, the apparatus comprising: a mark detection system that can have at least a part of the system moved; and a control unit that moves at least a part of the mark detection system so as to detect a mark on the substrate with the mark detection system while the stage is moving, and the control unit exposures the substrate using detection results of the mark.
According to this apparatus, while the stage is moving, the control unit moves at least a part of the mark detection system and detects the mark on the substrate with the mark detection system. Therefore, time for mark detection does not have to be arranged separately from the movement time of a stage, as in the conventional apparatus. Accordingly, it becomes possible to improve the throughput of the entire exposure process.
In this case, the control unit can control a movement of at least a part of the mark detection system so that detection of the mark is performed while the stage is moving at least from a loading position where a substrate is mounted on a stage to a position where exposure of the substrate begins, or the control unit can control a movement of at least a part of the mark detection system so that detection of the mark is performed at least after exposure has begun on the substrate (at least during the exposure processing).
According to a fourth aspect of the present invention, there is provided a second exposure apparatus that forms a pattern by exposing a substrate, the apparatus comprising: a stage that moves holding the substrate; a mark detection system that can have at least a part of the system moved; and a control unit that controls a movement of a detection area of the mark detection system so as to detect a mark on the substrate with the mark detection system while the stage is moving.
According to this apparatus, the control unit moves the detection area of the mark detection system while the stage is moving and detects the mark on the substrate with the mark detection system, therefore, by performing mark detection while the stage is moving, the time required for detection of the mark can be reduced, which accordingly, makes it possible to improve the throughput of the entire exposure process.
Further, by transferring a pattern on a sensitive object using the first or second exposure method of the present invention, the productivity of highly integrated microdevices can be improved. Accordingly, further from another aspect, it can be said that the present invention is also a device manufacturing method including a pattern transfer process on a sensitive object that uses the first or second exposure method of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

A FIRST EMBODIMENT

Hereinafter, a first embodiment of the present invention will be described, referring to FIGS. 1 to 11.
FIG. 1 shows an entire view of an arrangement of an exposure apparatus 100 related to the first embodiment. Exposure apparatus 100 is a scanning exposure apparatus based on a step-and-scan method, that is, the so-called scanner.
Exposure apparatus 100 is equipped with an illumination system ILS, a reticle stage RST that holds reticle R illuminated with an exposure light (illumination light) IL from illumination system ILS and moves in a predetermined scanning direction (in this case, in a Y-axis direction which is a vertical direction within the page surface of FIG. 1), a projection unit PU including a projection optical system PL that projects exposure light (illumination light) IL emitted from reticle R on a wafer W, a stage unit 150 including a wafer stage WST on which wafer W is mounted and a measurement stage MST used in measurement for exposure, alignment systems ALG1 and ALG2 (refer to FIG. 3 for alignment system ALG2), an alignment system stage unit 160 for moving alignment systems ALG1 and ALG2 within a two-dimensional plane (an XY plane), their control system and the like.
Illumination system ILS includes a light source and an illumination optical system. As the light source, for instance, an ArF excimer laser light source (output wavelength: 193 nm) is used. Further, the illumination optical system includes a beam shaping optical system, a rough energy adjuster, an optical integrator (a uniformizer, or a homogenizer), an illumination system aperture stop plate, a beam splitter, a relay lens, a reticle blind, a mirror for bending the optical path, a condenser (none are shown) and the like, which are placed in a predetermined positional relation. Details on the arrangement of illumination system ILS and the function of each optical member are disclosed in, for example, the pamphlet of International Publication WO202/103766 and the like. Therefore, details therein will be omitted.
On reticle stage RST, reticle R on which a circuit pattern or the like is formed on the pattern surface (the lower surface in FIG. 1) is fixed, for example, by vacuum suction. Reticle stage RST can be finely driven within an XY plane by a reticle stage drive system 55 that includes, for example, a linear motor or the like, and can also be driven at a designated scanning speed in the scanning direction (in the Y-axis direction).
The position of reticle stage RST within a stage movement surface (including rotation around the Z-axis) is constantly detected by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 53 via a movable mirror 65 (a Y movable mirror that has a reflection surface orthogonal to the Y-axis direction and an X movable mirror that has a reflection surface orthogonal to the X-axis direction are actually arranged) at a resolution of, for example, around 0.5 to 1 nm. The measurement values of reticle interferometer 53 is sent to main controller 50 (not shown in FIG. 1, refer to FIG. 6), and based on the measurement values of reticle interferometer 53, main controller 50 controls the position (and speed) of reticle stage RST in the X-axis direction, the Y-axis direction, and the θz direction (the rotational direction around the Z-axis) via stage reticle drive system 55.
Projection unit PU is arranged below reticle stage RST in FIG. 1, and is in a state where the lower body is inserted from above into an opening BDa formed in a body (including, for example, a holding mechanism that supports a base member with three or four struts in which vibration isolation units are arranged, respectively) BD placed on a floor surface (or a base plate), and is supported by body BD via a flange FLG that is arranged roughly at the center in the height direction. Projection unit PU is configured including a barrel 140, and projection optical system PL consisting of a plurality of optical elements held in a predetermined positional relation within barrel 140. As projection optical system PL, a dioptric system is used, consisting of a plurality of lenses (lens elements) that shares optical axis AX in a Z-axis direction. Projection optical system PL is, for example, a both-side telecentric dioptric system that has a predetermined projection magnification (such as one-quarter, one-fifth, or one-eighth times) is used. Therefore, when illumination light IL from illumination system ILS illuminates illumination area IAR on reticle R, a reduced image of the circuit pattern of reticle R within illumination area IAR (a partial reduced image of the circuit pattern) is formed on wafer W whose surface is coated with a resist on an area (hereinafter also referred to as an “exposure area”) IA conjugate with illumination area IAR by illumination light IL that has passed through reticle R, via projection optical system PL (projection unit PU). The projection optical system is not limited to a refracting system, and for example, the system can be a catadioptric system.
Further, in exposure apparatus 100 of the embodiment, in the vicinity of the lower end of projection unit PU, a liquid supply nozzle 131A and liquid recovery nozzle 131B that constitute a part of liquid immersion unit 132 are arranged.
Liquid supply nozzle 131A connects to the other end of a supply pipe that has one end connected to a part of liquid supply unit 138 (not shown in FIG. 1, refer to FIG. 6). Further, liquid recovery nozzle 131B connects to the other end of a recovery pipe that has one end connected to liquid recovery unit 139 (not shown in FIG. 1, refer to FIG. 6).
Liquid immersion 132 that includes liquid supply nozzle 131A and liquid recovery nozzle 131B is controlled by main controller 50 (refer to FIG. 6). Main controller 50 supplies liquid (e.g. pure water) Lq to the space in between the lowest optical element (such as a lens) of projection optical system PL and wafer W via liquid supply nozzle 131A and also recovers liquid Lq via liquid recovery nozzle 131B. In this case, main controller 50 controls so that the amount of liquid Lq supplied from liquid supply nozzle 131A and the amount of liquid Lq recovered via liquid supply nozzle 131B are constantly equal. Accordingly, a constant amount of liquid Lq (refer to FIG. 1) is held on wafer W. In this case, liquid Lq held on wafer W is constantly replaced.
In the case when measurement stage MST is also positioned below projection unit PU, liquid Lq can be filled in the space between measurement table MTB and projection unit PU as is described above.
In the above description, in order to simplify the description, one liquid supply nozzle and one liquid recovery nozzle were arranged. However, the present invention is not limited to this, and as is disclosed in, for example, the pamphlet of International Publication WO99/49504, a configuration that has many nozzles can be employed. Furthermore, liquid immersion unit 132 can be a unit that has a mechanism of also filling the space between the lowest optical element and its neighboring optical element with liquid. The point is that the configuration may be optional, as long as the liquid can be supplied in the space between at least the lowest optical element constituting projection optical system PL and wafer W.
As is shown in FIG. 1 and in FIG. 2, which is a planar view of stage unit 150, stage unit 150 is equipped with a base panel 112, wafer stage WST placed on base panel 112 and measurement stage MST, an interferometer system 118 (refer to FIG. 6) for measuring the position (positional information) of stages WST (wafer W) and MST, and a stage drive system 124 (refer to FIG. 6) that drives stages WST and MST. Although it is not shown in the drawings, base panel 112 is placed on the floor surface (or on a base plate) via, for example, four vibration isolation units.
On the bottom surface of wafer stage WST and measurement stage MST, non-contact bearings (not shown) such as for example, air bearings (also called air pads) are arranged in a plurality of areas, and by the air bearings, wafer stage WST and measurement stage MST are supported by levitation above the upper surface of base panel 112 via a clearance of around several μm. Further, each of the stages WST and MST are driven (including the θz rotation) independently within the XY plane by stage drive system 124.
More specifically, as is shown in FIG. 1, wafer stage WST is equipped with a wafer stage main section 91 that has the air bearings described above arranged on its bottom surface, and a wafer table WTB which is mounted on wafer stage main section 91 via a Z-leveling mechanism (not shown) (configured including an actuator such as, for example, a voice coil motor) and moves finely with respect to wafer stage main section 91 in the Z-axis direction, the rotational direction around the X-axis (θx direction), and the rotational direction around the Y-axis (θy direction).
On wafer table WTB, an auxiliary plate (liquid repellent plate) 128 that is substantially rectangular and has a circular opening formed in the center whose inner diameter is slightly larger than wafer W is arranged. Further, inside the circular opening, a wafer holder (not shown) that holds wafer W by vacuum suction or the like is arranged. The surface of auxiliary plate 128 is set substantially flush with wafer W held by suction on the wafer holder.
Measurement stage MST is equipped a measurement stage main section 92 that has the air bearings described above arranged on its bottom surface, and a measurement table MTB mounted on measurement stage main section 92 via Z-leveling mechanism (not shown).
Various measurement members are arranged with measurement table MTB (and measurement stage main section 92). These measurement members include a fiducial mark area FM on which a plurality of fiducial marks are formed whose details are disclosed in, for example, Kokai (Japanese Patent Unexamined Application Publication) No. 5-21314 (and the corresponding U.S. Pat. No. 5,243,195) and the like, a sensor (an illumination monitor, an uneven illuminance measuring sensor, an aerial image measuring instrument or the like) that receives illumination light IL via projection optical system PL and the like.
In the embodiment, according to the liquid immersion exposure performed in which wafer W is exposed by exposure light (illumination light) IL via projection optical system PL and liquid Lq, the above sensor (an illumination monitor, an uneven illuminance measuring sensor, an aerial image measuring instrument) used in the measurement that uses illumination light IL is to receive illumination light IL via projection optical system PL and liquid Lq. Further, a part of the sensor such as the optical system can be installed in measurement table MTB (and measurement stage main section 92), or the entire sensor can be arranged with measurement table MTB (and measurement stage main section 92).
Next, stage drive system 124 will be described. As is shown in the planar view in FIG. 2, on the +X side and −X side of base panel 112, a pair of Y-axis stators 86 and 87 extending in the Y-axis direction is placed, respectively. Y-axis stators 86 and 87 are configured by armature units that have a plurality of coils inside. To Y-axis stators 86 and 87, a pair of Y- axis movers 82 and 83, which are respectively arranged on both ends in the longitudinal direction of an X-axis stator 80 extending in the X-axis direction, is engaged in an inserted state. Further, to Y-axis stators 86 and 87, a pair of Y- axis movers 84 and 85, which are respectively arranged on both ends in the longitudinal direction of an X-axis stator 81 extending in the X-axis direction, is engaged in an inserted state. Y- axis movers 82, 84, 83, and 85 are each configured by a magnetic pole unit that has a plurality of permanent magnets.
More specifically, Y-axis stator 86 and Y-axis mover 82, and Y-axis mover 84 respectively constitute moving magnet type Y-axis linear motors that drive Y- axis movers 82 and 84 in the Y-axis direction, and Y-axis stator 87 and Y-axis mover 83, and Y-axis mover 85 respectively constitute moving magnet type Y-axis linear motors that drive Y- axis movers 83 and 85 in the Y-axis direction. In the description below, the above four Y-axis linear motors will be appropriately referred to as Y-axis linear motors 82 to 85, using the same reference numerals as Y-axis movers 82 to 85.
Of the above four Y-axis linear motors, the two Y-axis linear motors 82 and 83 drive measurement stage MST in the Y-axis direction integrally with X-axis stator 80, and the two remaining Y-axis linear motors 84 and 85 drive wafer stage WST in the Y-axis direction integrally with X-axis stator 81.
X-axis stators 80 and 81 are each configured, for example, by an armature unit that incorporates armature coils, which are placed along the X-axis direction at a predetermined interval. X-axis stator 81 is in a state inserted into an opening (not shown) formed in wafer stage main section 91 (refer to FIG. 1) that constitutes wafer stage WST. Inside the above opening of wafer stage main section 91, for example, an X-axis mover (not shown) consisting of a magnetic pole unit is arranged. That is, X-axis stator 81 and the X-axis mover constitute a moving magnet type X-axis linear motor that drives wafer stage WST in the X-axis direction. Hereinafter, the X-axis linear motor will be appropriately referred to as X-axis linear motor 81, using the same reference numeral as its stator, X-axis stator 81.
Further, X-axis stator 80 is in a state inserted into an opening (not shown) formed in measurement stage main section 92 (refer to FIG. 1) that constitutes measurement stage MST. Inside the above opening of measurement stage main section 92, for example, an X-axis mover (not shown) consisting of a magnetic pole unit is arranged. That is, X-axis stator 80 and the X-axis mover constitute a moving magnet type X-axis linear motor that drives measurement stage MST in the X-axis direction. Hereinafter, the X-axis linear motor will be appropriately referred to as X-axis linear motor 80, using the same reference numeral as its stator, X-axis stator 80.
In the embodiment, Y-axis linear motors 82 to 85, X-axis linear motors 80 and 81, and the Z-tilt mechanism in both wafer stage WST and measurement stage MST constitute stage drive system 124 shown in FIG. 6. Each of the above linear motors that constitute stage drive system 124 operates under the control of main controller 50 shown in FIG. 6. In the embodiment, on the opposite side (+Y side) of measurement stage MST with respect to projection optical system PL, a loading position WEP is set to which wafer W is carried by a carrier unit (wafer loader) (not shown). Wafer stage WST moves to loading position WEP, and then after wafer W is mounted on wafer stage WST, moves toward the position directly under projection optical system PL (the exposure area previously described). Then, after exposure treatment of wafer W has been completed, wafer stage WST moves to an unloading position (in the embodiment, the unloading position is to be at the same position as the loading position) and unloads wafer W that has been exposed, and also loads the wafer (wafer exchange) on which exposure treatment is to be performed next.
The positions of wafer stage WST (wafer W) and measurement stage MST that are constituted as described previously are detected at all times by interferometer system 118 in FIG. 6 via the side surface (a reflection surface that has been mirror polished) of wafer table WTB and measurement table MTB, at a resolution, for example, around 0.5 to 1 nm. Interferometer system 118 is constituted including a Y interferometer 16 for detecting the position of wafer stage WST in the Y-axis direction, a Y interferometer 18 for detecting the position of measurement stage MST in the Y-axis direction, X interferometers 24 and 26 for detecting the position of each stage in the X-axis direction as is shown in FIG. 2, a Z interferometer (not shown) for measuring the position of wafer table WTB in the Z-axis direction (including the position in the θx direction (the rotational direction around the X-axis) and the θy direction (the rotational direction around the Y-axis)) and the like. The measurement values of interferometer system 118 are sent to main controller 50, and based on the measurement values of interferometer system 118, main controller 50 controls the position (and the speed) of each of the stages WST and MST in the X-axis direction, the Y-axis direction and the θz direction (the rotational direction around the Z-axis) and the position of wafer table WTB in the Z-axis direction (including the positions in the θx direction (the rotational direction around the X-axis) and the θy direction (the rotational direction around the Y-axis) via stage drive system 124. Instead of mirror polishing the side surface of each table, movable mirrors can be arranged on each table.
Incidentally, along with or instead of measuring by the interferometer system, the position of each of the stages can be detected using a linear encoder or the like.
Furthermore, in exposure apparatus 100 of the embodiment, alignment systems ALG1 and ALG2 by the off-axis method are arranged that respectively have a detection area whose position is independently variable within a predetermined surface (XY plane) perpendicular to optical axis AX of projection optical system PL, between the loading position WEP and the exposure starting position of wafer W. In order to make the detection area move within the above predetermined surface, at least a part of alignment systems ALG1 and ALG2, such as for example, a part of the system (including an objective optical system, a photodetection element and the like) excluding the light source, is movable by alignment system stage unit 160. Accordingly, by moving a part of alignment systems ALG1 and ALG2 during the movement of wafer stage WST, the detection area moves in a predetermined positional relation with the marks on wafer stage WST (alignment marks or the like of wafer W), and detection of the marks become possible during the movement of wafer stage WST.
In the embodiment, because alignment systems ALG1 and ALG2 employ the image processing method, a part of the alignment systems ALG1 and ALG2 are moved so that the marks do not move away from the detection area during the movement of wafer stage WST. Therefore, it is preferable to move a part of the alignment systems ALG1 and ALG2 so that the relative speed between the marks and the detection area is almost zero at least during a predetermined time while the mark detection (imaging) is being performed. Further, in the embodiment, while wafer stage WST moves from loading position WEP previously described to the exposure starting position of wafer W, detection of a plurality of alignment marks on wafer W is performed by alignment systems ALG1 and ALG2, and the positional information of the plurality of marks that have been detected is used when scanning exposure of all M shot areas or a part of (1≦n≦ an integer of M-1) the M shot areas that is to be exposed on wafer W is performed. In this case, the exposure starting position of wafer W in the embodiment is the position of wafer W (wafer stage WST) when the first shot area that is to be exposed on wafer W is set at the scanning starting position (acceleration starting position). Furthermore, in the embodiment, mark detection by at least one of alignment systems ALG1 and ALG2 is performed even after the exposure of wafer W (the first shot area) has begun, and the positional information of the marks that have been detected is used for performing scanning exposure of all or a part of the shot areas from the second shot onward.
Further, in exposure apparatus 100 of the embodiment, a surface shape detection unit 125 (refer to FIG. 6) can be equipped in body BD that holds projection unit PU. Surface shape detection unit 125 includes, for example, an irradiation system that obliquely irradiates a linear beam longer than the diameter of wafer Won wafer stage WST, and a photodetection system that has a detector, which receives the reflection light of the beams irradiated by the irradiation system, such as for example, a one-dimensional CCD sensor, a line sensor or the like. In this case, the linear beam irradiated from the irradiation system is a beam formed by a plurality of spot-shaped (or slit-shaped) laser beams lined apart in the X-axis direction between, for example, the loading position WEP and the exposure starting position, and the irradiation area is actually a concentration of an irradiation area of a plurality of spot-shaped beams. Accordingly, in the same principle as the detection principle of the known multiple point AF system, with the plurality of spot-shaped irradiation areas serving as the measurement points, the Z position (positional information related to the Z-axis direction perpendicular to the predetermined surface (the XY plane) in which wafer W moves) of wafer W at each measurement point can be detected. And, based on the measurement results, main controller 50 can detect information related to the shape of the surface of wafer W subject to exposure.
Accordingly, in the embodiment, before the beginning of exposure (for example, during the movement from loading position WEP to the exposure starting position), when wafer W passes through the irradiation area of surface shape detection unit 125, main controller 50 computes the distribution of the Z positional information of the wafer surface, based on the measurement values (the position of the wafer) by interferometer system 118 and the detection results of surface shape detection unit 125. Then, on exposure operation, main controller 50 controls the position in the Z-axis direction and the attitude of wafer table WTB, based on the computation results.
As is shown in FIG. 1, alignment system stage unit 160 includes a frame FR arranged separately from body BD vibration wise, base platforms BS1 and BS2 (base platform BS2 not shown in FIG. 1, refer to FIG. 3) arranged on the lower surface side of frame FR, and alignment system stages AST1 and AST2 (refer to FIG. 3 for alignment system stage AST2) that support alignment systems ALG1 and ALG2, which move in the XY two-dimensional direction, with the lower surface of base platforms BS1 and BS2 serving as a movement reference plane.
Although it is not shown in the drawings, frame FR is supported in the four corners by four supporting columns set placed on the floor surface (or the base plate or the like) Frame FR consists of a member that has an inverted U-shaped YZ section, and on the +Y side end section and the −Y side end section, stators of a linear motor that drives alignment system stages AST1 and AST2 are arranged.
Base platforms BS1 and BS2 each consist of a plate shaped member that has a lower surface (the surface on the −Z side) whose degree of flatness is extremely high, and are each supported by suspension from frame FR via a plurality of (e.g. three) vibration isolation mechanisms 162. These vibration isolation mechanisms 162 have, for example, a piston and a cylinder, and include a support unit that supports the self-weight of base platform BS1 (or BS2) using the pressure of gas inside a gas chamber formed between the piston and the cylinder, and a voice coil motor that drives the piston of the support unit.
As is shown in FIG. 3, alignment system stage AST1 includes a Y stage 42 that is movable in the Y-axis direction, and an X stage that is movable in the X-axis direction with respect to Y stage 42.
Y stage 42 has a rough trapezoidal shape in a planar view (when viewed from below), and is driven along the Y-axis by a Y linear motor YLM1 that includes a Y-axis stator 46 fixed to frame FR and a Y-axis mover 48 fixed to the +X side edge section of Y stage 42. X stage 40 is driven along the X-axis by a pair of X linear motors XLM1 and XLM2 that includes a pair of X-axis stators 52A and 52B whose longitudinal direction is in the X-axis direction, fixed to the lower surface (the −Z side surface) of Y stage 42, and a pair of X-axis movers 54A and 54B fixed to the end sections of X stage 40 on the +Y side and −Y side.
Inside one of the X linear motors, XLM2, a voice coil motor that makes X stage 40 activate a drive force in the Y-axis direction is also arranged, which makes it possible to finely drive X stage 40 in the Y-axis direction. Further, by slightly changing the drive force along the X-axis of X linear motors XLM1 and XLM2, it becomes possible to rotationally drive X stage 40 around the Z-axis.
Alignment system ALG1 includes an optical system including an object lens and the like, a CCD and the like. In the periphery of the CCD that constitutes a part of alignment system ALG1, a piping in which a liquid flows is arranged, and the CCD is liquid-cooled by the liquid that flows in the piping. Accordingly, the CCD can be placed close to the optical system including the object lens and the like, which makes it possible to reduce the size of alignment system ALG1. In this case, as for the light source of alignment system ALG1, instead of moving the light source with the alignment system stage, the light source is arranged external to the alignment system stage and is connected by an optical fiber or the like. The present invention, however, is not limited to this, and a relay optical system that includes a mirror or the like that transmits a beam from a light source externally arranged to the optical system of alignment system ALG1 can also be used. Alignment system ALG1 is not limited to the image processing method, and sensors of other various methods can also be used. Further, the cooling method of the CCD is not limited to liquid-cooling, and air-cooling can also be employed.
As is shown in FIG. 3, on the lower surface (−Z side surface) of Y stage 42 and X stage 40, various optical members that constitute an alignment system interferometer system 69 (shown only in FIG. 6) are placed. Interferometer system 69 of the embodiment employs the double-pass method, and measures the positional information in the X-axis and Y-axis directions and the rotational information around each of the Z-axis, the X-axis and the Y-axis of alignment system stage AST1 (that is, alignment system ALG1).
Details on alignment system interferometer system 69 will be described below, referring to FIG. 4. Interferometer system 69 includes a sensor head section 68, a first bending mirror section 72 and a second bending mirror section 73 arranged on Y stage 42, two optical units 74 and 75 arranged on X stage 40, X fixed mirror 70X, and Y fixed mirror 70Y1 and the like, shown in FIG. 4. X fixed mirror 70X has the side surfaces on the +X side and the −X side mirror polished so that reflection surfaces are formed, and Y fixed mirror 70Y1 has the side surface on the −Y side mirror polished so that a reflection surface is formed. Sensor head section 68, X fixed mirror 70X, and Y fixed mirror 70Y are fixed to body BD that supports projection unit PU. X fixed mirror 70X is supported by suspension by a support member 77 (refer to FIG. 3) that connects to body BD, via an opening section formed in a part of frame FR.
Sensor head section 68 incorporates a light source, an optical system, and a plurality of analyzers (polarizers), a plurality of photoelectric conversion elements, a bending mirror and the like inside.
The first bending mirror section 72 and the second bending mirror section 73 each include a prism (or a mirror) The prism (or the mirror) has a reflection surface formed at an angle of 45 degrees with respect to an XZ plane and an YZ plane.
The first bending mirror section 72 reflects a beam BM1 (beam BM1 is actually configured of two beams separated apart in the vertical direction (the Z-axis direction), however, in order to avoid complication in the description below, the beams will be described as one beam) output from sensor head section 68, and makes the beam enter optical unit 74 previously described. Further, the second bending mirror section 73 bends the other beam BM2 (beam BM2 is actually configured of two beams separated apart in the vertical direction (the Z-axis direction)) and makes the beam enter optical unit 75.
Optical unit 74 on which beam BM1 is incident includes a mirror 74 a, and an optical member 74 b arranged a predetermined distance apart on the +Y side of mirror 74 a.
Optical member 74 b is made up of parts such as a polarization beam splitter (PBS) 49 a, a corner cube mirror 49 b, quarter-wave plates (λ/4 plates) 49 c and 49 d, a reference mirror 49 e, and the like which are integrated, as is shown enlarged in FIG. 5.
According to optical member 74 b, beam BM1 reflected off mirror 74 a enters polarization beam splitter 49 a from the −Y side to the +Y side. Then, beam BM1 that has entered polarization beam splitter 49 a is separated into a reference beam RBX consisting of an S polarization component that passes through a separating plane made of multilayer films inside polarization beam splitter 49 a, and a measurement beam MBX consisting of a P polarization component reflected off the separating plane made of the multilayer films.
Then, measurement beam MBX reflected off the above separating plane passes through λ/4 plate 49 c and is converted into a circular polarized light, and then is reflected by fixed mirror 70X.
The measurement beam reflected off fixed mirror 70X passes through λ/4 plate 49 c again and is converted to S polarization, and then passes through the above separating plane and is folded back at corner cube (retroreflector) 49 b. Then, measurement beam MBX that has been folded back passes through the above separating plane and λ/4 plate 49 c and becomes a circular polarized light, and then is reflected again by fixed mirror 70X, and the reflected measurement beam passes through λ/4 plate 49 c and is converted to P polarization and is reflected off the above separating plane, and then returns to sensor head section 68 via mirror 74 a and the first bending mirror section 72.
Meanwhile, the reference beam (S polarization component) that has passed through the above separating plane passes through λ/4 plate 49 d and is converted to a circular polarized light, which is reflected off the reflection surface of mirror 49 e, and then the light passes through λ/4 plate 49 d again in the opposite direction so that it becomes a P polarization and is reflected off the above separating plane and then is folded back at corner cube 49 b. Then the reference beam that has been folded back is reflected again off the above separating plane and passes through λ/4 plate 49 d and is converted to a circular polarized light, which is reflected off the reflection surface of mirror 49 e, and then the light passes through λ/4 plate 49 d again so that it becomes an S polarization and passes through the above separating plane and is synthesized concentrically with the return light of the measurement beam (P polarization) and is reflected off mirror 74 a and the first bending mirror section 72 and then passes through the analyzer of the detection unit inside sensor head section 68. Accordingly, an interference beam of measurement beam MBX and reference beam RBX is output from the analyzer, and the interference beam is received by the photoelectric conversion element and positional information of alignment system stage AST1 in the X-axis direction with fixed mirror 70X serving as a reference is sent to main controller 50. As is previously described, because beam BM1 is configured of two beams separated apart in the Z-axis direction, main controller 50 detects not only the positional information of alignment system stage AST1 (alignment system ALG1) in the X-axis direction but also the rotational information around the Y-axis (rolling amount) from the positional information in the X-axis direction which is obtained from the two beams.
Optical unit 75 includes optical members 75 a and 75 b, and bending mirrors 75 c and 75 d, as is shown enlarged in FIG. 5.
Optical member 75 a includes a polarization beam splitter 51 a, a λ/4 plate 51 c arranged on the side surface of polarization beam splitter 51 a on the +Y side, a half mirror 51 b, and a mirror 51 d. Optical member 75 b includes a polarization beam splitter 52 a, a λ/4 plate 52 c arranged in polarization beam splitter 52 a, a mirror 52 b, and a mirror 52 d.
In optical member 75 a, beam BM2 reflected off mirror 73 enters half mirror 51 b, and at half mirror 51 b, beam BM2 is separated into a first beam BM2 a reflected off half mirror 51 b and a second beam BM2 b that moves ahead.
The first beam BM2 a is divided into a measurement beam consisting of an S polarization component that passes through a separating plane made of multilayer films inside polarization beam splitter 51 a, and a reference beam consisting of a P polarization component reflected off the separating plane.
The measurement beam that has passed through the above separating plane passes through λ/4 plate 51 c and is converted into a circular polarized light, and then after the light is reflected by fixed mirror 70Y1, the light passes through λ/4 plate 51 c again and is converted to P polarization and is reflected off the above separating plane and mirror 51 d. Then the reflected measurement beam passes through λ/4 plate 51 c and is converted into a circular polarized light, and then is reflected by fixed mirror 70Y1 again, and after this the light passes through λ/4 plate 51 c and is converted to S polarization, and then passes through the above separating plane via mirror 51 d and returns to sensor head section 68 via the second bending mirror section 73 in FIG. 4.
Meanwhile, the reference beam is reflected off polarization beam splitter 51 a, and after this the beam returns to sensor head section 68 via the second bending mirror section 73. The reference beam is synthesized concentrically with the return light of the measurement beam (S polarization) and then passes through the analyzer of the detection unit inside sensor head section 68. Accordingly, an interference beam of the measurement beam and the reference beam is output from the analyzer, and the interference beam is received by the photoelectric conversion element and positional information of alignment system stage AST1 in the Y-axis direction with fixed mirror 70Y1 serving as a reference is sent to main controller 50.
Meanwhile, the second beam BM2 b that has passed through half mirror 51 b is reflected off mirror 52 b, and is divided into a measurement beam consisting of an S polarization component that passes through a separating plane made of multilayer films inside polarization beam splitter 52 a, and a reference beam consisting of a P polarization component reflected off the separating plane.
The measurement beam that has passed through a separating plane of polarization beam splitter 52 a passes through λ/4 plate 52 c and is converted into a circular polarized light, and then after the light is reflected by fixed mirror 70Y1, the light passes through λ/4 plate 52 c and is converted to P polarization and is reflected off the above separating plane and mirror 52 d. Then the reflected measurement beam passes through λ/4 plate 52 c and then is converted into a circular polarized light, and then is reflected by fixed mirror 70Y1 again, and after this the light passes through λ/4 plate 52 c and is converted to S polarization, and then passes through the above separating plane via mirror 52 d and returns to sensor head section 68 via mirrors 75 c and 75 d and the second bending mirror section 73 in FIG. 4.
Meanwhile, the reference beam is reflected off polarization beam splitter 52 a, and then returns to sensor head section 68 via mirrors 75 c and 75 d and the second bending mirror section 73. The reference beam is synthesized concentrically with the return light of the measurement beam (S polarization) and then passes through the analyzer of the detection unit inside sensor head section 68. Accordingly, an interference beam of the measurement beam and the reference beam is output from the analyzer, and the interference beam is received by the photoelectric conversion element and positional information of alignment system stage AST1 in the Y-axis direction with fixed mirror 70Y1 serving as a reference is sent to main controller 50. As is previously described, because beams BM2 a and BM2 b are each configured of two beams separated apart in the Z-axis direction, main controller 50 detects not only the positional information of alignment system stage AST1 (alignment system ALG1) in the Y-axis direction but also the rotational information around the Z-axis (yawing amount) and the rotational information around the X-axis (pitching amount) from the positional information in the Y-axis direction which is obtained from the four beams.
Referring back to FIG. 3, although the other alignment system stage AST2 that moves the other alignment system ALG2 is symmetric, alignment system stage AST2 has a configuration similar to alignment system stage AST1.
More specifically, alignment system stage AST2 includes a Y stage 142 movable in the Y-axis direction and an X stage 140 movable in the X-axis direction with respect to Y stage 142.
Y stage 142 is driven in the Y-axis direction by a Y linear motor YLM2 that includes a Y-axis stator 146 fixed to frame FR and a Y-axis mover 148 fixed to the −X side edge section of Y stage 142, and X stage 140 is driven in the X-axis direction and rotationally driven around the Z-axis by a pair of X linear motors XLM3 and XLM4 that includes a pair of X-axis stators 152A and 152B whose longitudinal direction is in the X-axis direction, fixed to the lower surface (the −Z side surface) of Y stage 142, and a pair of X-axis movers 154A and 154B fixed to the end sections of X stage 140 on the −Y side and +Y side. In X linear motor XLM4, a voice coil motor is arranged together as in X stage 40 previously described, so that X stage 140 can be finely driven in the Y-axis direction.
Alignment system ALG2 is an alignment system by the image processing method whose,configuration is completely the same as alignment system ALG1, therefore the description of the system therein will be omitted.
Further, on the lower surface (−Z side surface) of Y stage 142 and X stage 140, various optical members that constitute an alignment system interferometer system 169 (shown only in FIG. 6) are placed.
Although alignment system interferometer system 169 is symmetric, alignment system interferometer system 169 has a configuration similar to alignment system interferometer system 69, therefore, the details here will be omitted, however, the system is equipped with a sensor head section 168, and various optical members arranged on X stage 140 and Y stage 142. Interferometer system 169 of the embodiment can detect each positional information in the X-axis and Y-axis directions, and rotational information around each of the Z-axis, X-axis and Y-axis of alignment system stage AST2 (alignment system ALG2), with fixed mirrors 70X and 70Y2 arranged in a body serving as a reference.
In the embodiment, base platforms BS1 and BS2 were each supported by frame FR via vibration isolation mechanisms 162, however, frame FR can be installed on the floor surface (or on a base plate) via vibration isolation mechanisms 162, and base platforms BS1 and BS2 can simply be fixed to frame FR.
FIG. 6 shows a block diagram of the main configuration of a control system in exposure apparatus 100 of the embodiment. The control system in FIG. 6 is configured including a so-called microcomputer (or workstation) made up of a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and the like, and is mainly composed of main controller 50, which serves as a control unit that controls the overall operation of the entire apparatus.
Next, details on a parallel processing operation using wafer stage WST and measurement stage MST in exposure apparatus 100 of the embodiment that has the arrangement described above will be described, referring to FIGS. 7(A) toll. Each section operates under the control of main controller 50, however, in order to avoid complication in the description, details therein will be omitted other than when necessary. Further, during the operation below, main controller 50 controls the supply operation and recovery operation of the liquid of liquid immersion unit 132, and on the lower side of the lowest optical element of projection optical system PL, liquid Lq is constantly formed.
Further, the relation between a coordinate system of alignment system interferometer systems 69 and 169 for measuring the position of alignment systems ALG1 and ALG2 and a coordinate system of interferometer system 118 for measuring the position of wafer stage WST is to be measured in advance using, for example, reference marks or the like on a reticle alignment system (not shown) whose details are disclosed in, for example, Kokai (Japanese Patent Unexamined Application Publication) No. 7-176468 (and the corresponding U.S. Pat. No. 5,646,413) and measurement stage MST and the like.
FIG. 7(A) shows the state of stage unit 150 when the wafer on wafer stage WST is exchanged at the loading position previously described. At this point, the position of wafer stage WST is measured by X interferometer 24 and Y interferometer 16. However, wafer stage WST is in a state exposed to only one beam of the two beams of Y interferometer 16. Further, during the wafer exchange, measurement stage MST is placed under projection optical system PL instead of wafer stage WST, and various measurements such as aerial image measurement, wavefront aberration measurement and the like are appropriately performed.
When wafer W on wafer stage WST is exchanged by a wafer exchange mechanism (not shown) from this state, wafer stage WST moves in the +X direction. During this movement, because the two beams of Y interferometer 16 begin to irradiate wafer stage WST, interferometer combination is performed.
Then, wafer stage WST moves further in the +X direction, and at the point where wafer stage WST is positioned at the position shown in FIG. 7(B), a first detection operation of the alignment marks formed on wafer W is performed.
In this case, as is shown in FIG. 11, which is a graph that shows the speed of wafer stage WST in the Y-axis direction, on the first detection operation (the section shown as EGA1), wafer stage WST is stationary (speed 0), and alignment systems ALG1 and ALG2 are also positioned at predetermined positions and are stationary (speed 0). Accordingly, a first set of alignment marks on wafer W is set within each of the detection areas of alignment systems ALG1 and ALG2, and based on positional information of wafer stage WST measured by interferometers 16 and 24, positional information of alignment systems ALG1 and ALG2 measured by alignment system interferometer systems 69 and 169, and the shift amount of the alignment marks from the detection center detected using alignment systems ALG1 and ALG2, the positional information (the coordinate values) of the first set of alignment marks are each detected.
Search alignment using search alignment marks can be performed prior to the first detection operation of the alignment marks.
Next, at the point where the above first detection operation has been completed, wafer stage WST begins acceleration in the −Y direction. Further, alignment systems ALG1 and ALG2 also simultaneously begin to accelerate in the −Y direction accelerating at a level smaller than wafer stage WST, while alignment system ALG1 begins to move in the +X direction and alignment system ALG2 begins to move in the −X direction. Then, as is shown in FIG. 8(A), at the point where the speed of wafer stage WST and each of the alignment systems ALG1 and ALG2 reach a predetermined level (around 600 mm/s (refer to FIG. 11)), the stage and the systems each begin a constant movement (at this point, the movement of alignment systems ALG1 and ALG2 in the X-axis direction has been completed, and a second set of alignment marks on wafer W is also to be set within the detection areas of alignment systems ALG1 and ALG2). In the above movement, because the acceleration of wafer stage WST and alignment systems ALG1 and ALG2 differ, the relative positional relation between the wafer and the alignment systems in the Y-axis direction changes by a predetermined distance (the distance corresponding to an area S in FIG. 11) when compared with the case shown in FIG. 7(B).
Then, after the constant movement in the Y-axis direction begins, in a state continuing the constant movement, a second detection operation (the state EGA2 in FIG. 11) of the alignment marks is performed. In this case, because the speed of wafer stage WST coincides with the speed of alignment systems ALG1 and ALG2, the relative speed is zero. Accordingly, it is possible to perform mark detection under the same conditions as when wafer stage WST and alignment systems ALG1 and ALG2 are stationary.
Then, at the point where the second detection operation has been completed, alignment systems ALG1 and ALG2 begin deceleration, and after a predetermined period of time, wafer stage WST begins deceleration. And then, at the point where wafer stage WST and measurement stage MST are closest (or come into contact) as is shown in FIG. 8(B), the speed of wafer stage WST is to be zero. During the above deceleration, alignment system ALG1 moves in the +X direction while alignment system ALG2 moves in the −X direction, and alignment systems ALG1 and ALG2 are each positioned so that a third set of alignment marks on wafer W is set within the detection areas of alignment systems ALG1 and ALG2. Then, in a state where wafer stage WST and alignment systems ALG1 and ALG2 are stationary, a third detection operation (the state EGA3 in FIG. 11) of the alignment marks is performed.
Then, at the point where the third detection operation has been completed, wafer stage WST and alignment systems ALG1 and ALG2 begin acceleration, similar to the first measurement operation and the second measurement operation. In this case, wafer stage WST and measurement stage MST are driven in the −Y direction in a state where wafer stage WST and measurement stage MST are in contact (or in a state where a subtle distance is maintained) (that is, measurement stage MST is also accelerated by the same acceleration as wafer stage WST). Further, along with this operation, alignment systems ALG1 and ALG2 are also slightly driven in the +X and −X directions, respectively, and a fourth set of alignment marks on wafer W is set (FIG. 9(A)) within the detection areas of alignment systems ALG1 and ALG2. Then, at the point where wafer stage WST (and measurement stage MST) and each of the alignment systems ALG1 and ALG2 reach the same speed, a fourth detection operation (the state EGA4 in FIG. 11) of the alignment marks is performed. Also in this case, because the relative speed of wafer stage WST and alignment systems ALG1 and ALG2 is zero, it is possible to perform alignment under the same accuracy as when wafer stage WST and alignment systems ALG1 and ALG2 are stationary.
Then, at the point where the fourth detection operation has been completed, alignment systems ALG1 and ALG2 begin deceleration, and then, wafer stage WST (measurement stage MST) also begins deceleration. During this deceleration, both the beams of X interferometers 24 and 26 begin to irradiate wafer stage WST, therefore, at the point where the speed of wafer stage WST and alignment systems ALG1 and ALG2 become zero, interferometer combination is performed. Further, as is shown in FIG. 9(B), during the deceleration operation, liquid Lq is delivered onto wafer stage WST, and a fifth set of alignment marks on wafer W is set within the detection areas of alignment systems ALG1 and ALG2.
Then, at the point where the speed of wafer stage WST and alignment systems ALG1 and ALG2 become zero, a fifth detection operation (the state EGA5 in FIG. 11) of the alignment marks is performed. In the manner described above, ten alignment marks on wafer W can be detected, using alignment systems ALG1 and ALG2.
Then, as is shown in FIG. 10(A), wafer stage WST moves to the exposure starting position for performing exposure of the first shot area on wafer W, and at the point where the movement has been completed (or during the movement), the alignment mark in the center of wafer W is to be detected using alignment system ALG2.
When a total of 11 alignment marks have been detected in the manner described above, in the embodiment, the EGA (Enhanced Global Alignment) method is employed as is disclosed in, for example, Kokai (Japanese Patent Unexamined Application Publication) No. 61-44429, and main controller 50 performs a statistical calculation by the least squares method using the detection results of the alignment marks (the coordinate values on an orthogonal coordinate system XY set by interferometer system 118) and the designed arrangement information of the shot areas, and computes the arrangement coordinates of all or a part of (in the embodiment, half of the shot areas (the upper half) on the −Y side of wafer W) the shot areas subject to the exposure processing on wafer W. And, by moving wafer stage WST based on the arrangement coordinates that have been computed, exposure operation can be performed on half of the −Y side on wafer W. In this case, the exposure is performed by the step-and-scan method as in the conventional exposure. Therefore, details therein will be omitted.
Then, during the exposure operation of half of the −Y side, alignment marks on half of the +Y side (the lower half) of wafer W are detected using alignment systems ALG1 and ALG2 similar to the description above. In this case, for example, eight alignment marks are to be detected while exposure of the shot areas on half of the −Y side is being performed. Then using the positional information (coordinate values) of the alignment marks that have been detected, main controller 50 computes the arrangement information of the shot areas on half of the +Y side (the lower half) of wafer W by the EGA method.
Then, at the point where exposure on half of the −Y side has been completed, alignment by the EGA method (computation of the arrangement information of the shot areas) on half of the +Y side is also complete, therefore, after all the exposure operations on half of the −Y side have been completed, exposure of the shot areas on half of the +Y side is to begin.
At the point where exposure of the entire wafer W has been completed in the manner described above, wafer stage WST moves to loading position WEP previously described, and following the movement of wafer stage WST, measurement stage MST moves and liquid Lq is passed on to measurement stage MST. Then, wafer exchange is performed, and before wafer stage WST on which a wafer that is to undergo the next exposure processing is mounted finishes moving to the position shown in FIG. 7 (B), alignment systems ALG1 and ALG2 return to the initial position shown in FIG. 7 (B), and perform processing on the next wafer.
As is described in detail so far, according to the first embodiment, while wafer stage WST moves from the loading position (the position shown in FIG. 7(A)) to the exposure starting position (the position shown in FIG. 10(A)), a part of alignment systems ALG1 and ALG2 are moved and marks on the wafer are detected, using alignment systems ALG1 and ALG2. Therefore, time for mark detection does not have to be arranged separately from the movement time of wafer stage WST from the loading position to the exposure starting position, as in the conventional apparatus. Accordingly, the time required for the exposure processing of the wafer can be reduced, and the throughput of the entire exposure process can be improved. Further, more alignment marks can be measured when compared with the conventional apparatus, therefore, alignment with high precision can be performed, which allows exposure to be performed with high precision.
Further, according to the first embodiment, marks on the wafer are detected in a state where at least a part of alignment systems ALG1 and ALG2 follow wafer stage WST (a state where the relative speed of the detection areas previously described and the marks is substantially zero). Therefore, the marks can be detected with good precision using the alignment systems, even while wafer stage WST is moving. Accordingly, the detection time of the marks can be reduced without degrading the detection accuracy of the marks, which makes it possible to improve the throughput of the entire exposure process.
Further, in the first embodiment, alignment marks on the wafer are detected using two alignment systems, ALG1 and ALG2, therefore, more marks can be detected within a predetermined period of time compared with the case when only one alignment system is used.
Further, in the first embodiment, alignment systems ALG1 and ALG2 are moved also in the X-axis direction, therefore, even when wafer stage WST moves only in the Y-axis direction, an arbitrary alignment mark located on the wafer can be detected. Accordingly, even in the case when the movement of the wafer stage and the alignment operation are performed at the same time, the movement of the wafer stage does not have to be restricted.
Further, in the first embodiment, alignment systems ALG1 and ALG2 move with the lower surface of base platforms BS1 and BS2 serving as a reference plane, which are supported by frame FR separated vibration wise from body BD. Accordingly, this can keep the vibration due to the movement of alignment systems ALG1 and ALG2 from affecting the exposure accuracy. Meanwhile, because fixed mirrors 70X, 70Y1, and 70Y2 constituting the interferometer system that measures the position of alignment systems ALG1 and ALG2 are fixed on the body BD side, the position of alignment systems ALG1 and ALG2 can be detected with body BD serving as a reference.
In the above first embodiment, a total of 19 alignment marks are detected. The present invention, however, is not limited to this, and 20 or more alignment marks, or 18 or less alignment marks can be detected. Especially when exposure of half of the −Y side on wafer W is being performed, substantially all the area of half of the +Y side on wafer W passes through the area below alignment system ALG2, therefore, even if the number of alignment marks that are to be measured is increased, it does not affect the throughput.
In the above first embodiment, as alignment system stage unit 160, the configuration as the one shown in FIG. 3 was employed, however, the present invention is not limited to this, and a configuration can be employed where the stage unit is equipped with one Y stage that moves in the Y-axis direction and two X stages that move in the X-axis direction along the Y stage. The point is, as long as at least a part of alignment systems ALG1 and ALG2 are movable in the XY two-dimensional direction, then various configurations can be employed.
The present invention is not limited to the sequence described in the above first embodiment, and for example, a sequence like the one described in a second embodiment below can also be employed.

A SECOND EMBODIMENT

Next, a second embodiment of the present invention will be described. The configuration of the exposure apparatus and the like in the second embodiment is similar to the configuration in the above first embodiment, and only the detection sequence of the alignment marks on wafer stage WST is different. Therefore, in the description below, in order to avoid redundant explanations, the same reference numerals will be used for the sections that are the same as the first embodiment previously described, and the description thereabout will be omitted.
Similar to the first embodiment, FIG. 12(A) shows a state where a first detection operation of alignment marks is performed (corresponding to FIG. 7(B) in the first embodiment).
When the first detection of alignment marks is completed in the state shown in FIG. 12(A) (in this case, wafer stage WST and alignment systems ALG1 and ALG2 are in a stationary state), wafer stage WST and alignment systems ALG1 and ALG2 begin to move in the +Y direction (alignment systems ALG1 and ALG2 also begin to move in the X-axis direction).
Then, after wafer W has been moved in the Y-axis direction for a distance longer than the first embodiment (and is also in a constant movement state), a second detection operation of alignment marks is performed, as is shown in FIG. 12(B). As is shown in FIG. 12(B), it can be seen that the distance in the Y-axis direction of marks to be detected is set wider than the first embodiment (refer to FIG. 8(A)).
Then, when the second detection operation is completed, wafer stage WST and alignment systems ALG1 and ALG2 begin deceleration as in the first embodiment (alignment systems ALG1 and ALG2 also begin to move in the X-axis direction). Then, in a state where wafer stage WST and measurement stage MST are in contact (or closest) as is shown in FIG. 13(A), wafer stage WST becomes stationary. In this state, alignment systems ALG1 and ALG2 are also stationary, and a third detection operation of alignment marks is performed using alignment systems ALG1 and ALG2.
Then, when the third detection operation is completed, acceleration and movement of each section begin as in the first embodiment, and at the point where each section moves into a constant movement at a predetermined speed, and a fourth detection operation of alignment marks is performed as is shown in FIG. 13(B). And, after the fourth detection operation is completed, deceleration is performed and at the position where the speed becomes zero, a fifth detection operation of alignment marks is performed as is shown in FIG. 14(A).
Then, when the fifth detection operation is completed, wafer stage WST moves to the exposure starting position shown in FIG. 14(B), and in this state, the alignment mark positioned substantially in the center of wafer W is to be detected using alignment system ALG2.
As is described above, since 11 alignment marks are detected while wafer stage WST moves from the wafer exchange position to the exposure starting position, main controller 50 performs a statistical calculation on the detection results of the 11 alignment marks, and performs alignment by the EGA method (that is, computes the arrangement information of all the shot areas that are to be exposed on the wafer).
After performing the alignment, the exposure operation of the entire wafer W is performed by the step-and-scan method, based on the above alignment results.
As is described above, according to the second embodiment, while wafer stage WST moves from the loading position to the exposure starting position, a part of alignment systems ALG1 and ALG2 are moved and marks on the wafer are detected using alignment systems ALG1 and ALG2, as in the first embodiment. Therefore, time for mark detection does not have to be arranged separately from the movement time of wafer stage WST from the loading position to the exposure starting position, as in the conventional apparatus, which accordingly makes it possible to improve the throughput of the entire exposure process.
In the above second embodiment, the case has been described where measurement of 11 alignment marks was performed as an example, however, the measurement can be performed on 10 or less alignment marks, or 12 or more alignment marks. For example, in the case where measurement is performed on 11 or more alignment marks, by controlling alignment systems ALG1 and ALG2 in the order of deceleration→acceleration→constant speed and in a state where wafer stage WST is moving at a constant speed the relative position of wafer W and the alignment systems in the Y-axis direction is changed, which makes it possible to perform detection of marks.
In each of the above embodiments, the case has been described where wafer stage WST moves along the X-axis and Y-axis directions, however, the present invention is not limited to this, and wafer stage WST can be moved in a direction intersecting the X-axis and the Y-axis. In this case, the alignment systems are also to be moved in the direction intersecting the X-axis and the Y-axis so that the systems follow wafer stage WST.
Further, in each of the above embodiments, in the case of performing detection of the marks on wafer W while wafer stage WST is moving, wafer stage WST and alignment systems ALG1 and ALG2 were moved at a constant speed, however, wafer stage WST and alignment systems ALG1 and ALG2 do not necessarily have to move at a constant speed during mark detection. The point is the relative speed between the detection areas of alignment systems ALG1 and ALG2 and the mark only has to be substantially zero. Furthermore, in each of the above embodiments, wafer stage WST was moved along the Y-axis to the exposure starting position of the wafer after being moved in parallel with the X-axis from the loading position, however, the movement path of wafer stage WST from the loading position to the exposure starting position is not limited to this. For example, wafer stage WST can be moved along a path that has the shortest movement time from the loading position to the exposure starting position, and during this movement, the marks on the wafer can be detected using alignment systems ALG1 and ALG2. Further, the marks on the wafer were detected using alignment systems ALG1 and ALG2 during both the movement from the loading position to the exposure starting position and the exposure operation of the wafer in the above first embodiment, and only during the movement from the loading position to the exposure starting position in the above second embodiment. However, for example, the operation can be employed where the mark detection is performed only during the exposure operation of the wafer.
In each of the above embodiments, rotational information of alignment systems ALG1 and ALG2 is measured using alignment system interferometer systems 69 and 169, and the rotational information of alignment systems ALG1 and ALG2 can be used on exposure. In this case, for example, the positional information of the marks can be detected based on the positional information and rotational information of alignment systems ALG1 and ALG2 and the positional information of wafer W.
In each of the above embodiments, the case has been described where the apparatus is equipped with two alignment systems, however, the present invention is not limited to this, and the apparatus can be equipped with one alignment system or three or more alignment systems. Further, in each of the above embodiments, the detection areas were moved by moving alignment systems ALG1 and ALG2 using alignment system stages AST1 and AST2, however, instead of or combined with alignment system stages AST1 and AST2, a mechanism that optically moves the detection areas can be used.
Further, in each of the above embodiments, a separately placed frame FR was used, however, for example, a counter mass method can be applied with respect to stages AST1 and AST2.
Further, in each of the above embodiments, the case has been described where the present invention was employed in an exposure apparatus that has a wafer stage WST and a measurement stage MST. However, the present invention is not limited to this, and for example, the present invention can also be employed in an exposure apparatus that has a twin-stage type stage unit, which is equipped with two wafer stages. In this case, in parallel with the exposure operation of the wafer on one of the wafer stages, mark detection of the wafer can be performed on the other wafer stage, therefore, mark detection is not limited to the case of simply moving the wafer stage in one direction, but can be performed, for example, by making the wafer stage move back and forth along a uniaxial direction, or can be performed by making the wafer stage move along a uniaxial direction and a direction intersecting the uniaxial direction. In this case, by moving each of the alignment systems and the wafer, the time from a state where a mark subject to detection is within the detection field of the alignment system until a state where a mark subject to the next detection enters the detection field of the alignment system can be reduced. Accordingly, the number of marks that can be detected within a predetermined period of time can be increased, which makes it possible to improve the exposure accuracy.
In each of the above embodiments, the case has been described where the present invention was applied to a liquid immersion exposure apparatus, however, the present invention is not limited to this, and it is also possible to apply the present invention to an exposure apparatus other than the liquid immersion exposure apparatus.
In each of the above embodiments, the case has been described where the present invention was applied to an exposure apparatus that has a stage unit equipped with both a wafer stage WST and a measurement stage MST, however, the present invention is not limited to this, and it is also possible to apply the present invention to an exposure apparatus equipped that has a stage unit equipped with a single wafer stage. In this case, because the sequence where wafer stage WST and measurement stage MST move in a state where the stages are close together is not required, wafer stage WST does not decelerate between EGA2 and EGA4 in FIG. 11, and the relative positional relation between wafer W and alignment systems ALG1 and ALG2 can be adjusted by the deceleration and acceleration of only alignment systems ALG1 and ALG2.
In each of the above embodiments, the case has been described where interferometers were used as sensors for measuring the position of alignment systems ALG1 and ALG2, however, other sensors such as encoders or the like can be used.
In each of the above embodiments, the case has been described where the position of the wafer W surface in the height direction is measured using surface shape detection unit 125 during the movement of the wafer stage from the wafer exchange position to the exposure starting position. However, the measurement is not limited to this, and it is possible to use a focal position detection system by the oblique method, as in the conventional measurement.
Further, in each of the above embodiments, a transmittance type mask (reticle) was used, which is a transmissive substrate on which a predetermined light shielding pattern (or a phase pattern or a light attenuation pattern) is formed. Instead of this mask, however, as is disclosed in, for example, U.S. Pat. No. 6,778,257, an electron mask (a variable shaped mask) on which a light-transmitting pattern, a reflection pattern, or an emission pattern is formed according to electronic data of the pattern that is to be exposed can also be used. In the case of using such a variable shaped mask, by taking into consideration the detection results of the alignment marks previously described, on exposure of at least one different shot area on which exposure is to be performed after the shot areas that have been exposed during the alignment mark detection among the plurality of divided areas on the wafer, the light-transmitting pattern or the reflection pattern to be formed is to be changed according to the electronic data so that relative position control of the wafer and the pattern image can be performed.
Semiconductor devices are manufactured through the following steps: a step where the function/performance design of a device is performed; a step where a reticle based on the design step is manufactured; a step where a wafer is manufactured using materials such as silicon; a lithography step where the pattern formed on the reticle is transferred onto an object such as the wafer using the exposure methods described in the embodiments above; a device assembly step (including processes such as a dicing process, a bonding process, and a packaging process); an inspection step, and the like. In this case, in the lithography step, because the exposure methods in the embodiments above are used and device patterns are formed on objects, high integration devices can be manufactured with good yield.

INDUSTRIAL APPLICABILITY

As is described so far, an exposure method and exposure apparatus of the present invention are suitable for forming a pattern by exposing a substrate mounted on a stage. Further, a device manufacturing method of the present invention is suitable for manufacturing microdevices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view that shows a schematic configuration of an exposure apparatus related to a first embodiment.
FIG. 2 is a planar view that shows a stage unit in FIG. 1.
FIG. 3 is a view that shows a configuration of an alignment system stage unit.
FIG. 4 is a view used for describing a configuration of an alignment system interferometer system.
FIG. 5 is a view that shows a part of the alignment system interferometer system enlarged.
FIG. 6 is a block diagram that shows a control system of an exposure apparatus related to the first embodiment.
FIGS. 7(A) and 7(B) are views (No. 1) for describing a parallel processing operation performed by a wafer stage and a measurement stage.
FIGS. 8(A) and 8(B) are views (No. 2) for describing the parallel processing operation performed by the wafer stage and the measurement stage.
FIGS. 9(A) and 9(B) are views (No. 3) for describing the parallel processing operation performed by the wafer stage and the measurement stage.
FIGS. 10(A) and 10(B) are views (No. 4) for describing the parallel processing operation performed by the wafer stage and the measurement stage.
FIG. 11 is a graph that shows a movement speed of the wafer stage and the alignment system.
FIGS. 12(A) and 12(B) are views (No. 1) for describing a parallel processing operation performed by a wafer stage and a measurement stage related to a second embodiment.
FIGS. 13(A) and 13(B) are views (No. 2) for describing the parallel processing operation performed by the wafer stage and the measurement stage related to the second embodiment.
FIGS. 14(A) and 14(B) are views (No. 3) for describing the parallel processing operation performed by the wafer stage and the measurement stage related to the second embodiment.

DESCRIPTION OF REFERENCED LETTERS/NUMERALS

50 Controller
69, 169 Sensor (interferometer, alignment system interferometer system)
100 Exposure apparatus
125 Detection unit
132 Liquid immersion unit (liquid supply mechanism)
ALG1, ALG2 Alignment system (mark detection system)
BD Body
MST Measurement stage
PL Projection optical system
W Substrate (wafer)
WST Stage (wafer stage)

Claims

1. A pattern forming method of forming a pattern on an object, the method comprising:

a first process of detecting a mark while the object is being moved, with at least a part of a mark detection system also being moved; and

a second process of forming a pattern on the object using detection results of the mark.

2. The pattern forming method of claim 1 wherein

the object is moved by moving a moving section that holds the object.

3. The pattern forming method of claim 2 wherein

the detection of the mark is performed while the moving section moves at least from a loading position where object is held by the moving section to a position where pattern forming with respect to the object begins.

4. The pattern forming method of claim 1 wherein

the detection of the mark is performed at least after the beginning of pattern forming with respect to the object.

5. The pattern forming method of claim 4 wherein

the detection of the mark is performed also before the beginning of pattern forming with respect to the object.

6. The pattern forming method in of claim 1 wherein

in the first process, a plurality of marks are detected while changing a position relation between the object and the mark detection system.

7. The pattern forming method of claim 1 wherein

in the first process, after a mark detection, at least a part of the mark detection system moves in a direction different from a movement direction of the object until the next mark is detected.

8. The pattern forming method of claim 1 wherein

in the first process, a part of the marks necessary for forming a pattern on all divided areas subject to pattern forming on the object are detected, and the method further comprises:

a third process of detecting the rest of the marks necessary for forming a pattern on all the divided areas subject to pattern forming, which is performed in parallel with the second process where a pattern is formed on a divided area on which a pattern can be formed, based on the detection results of the marks in the first process.

9. The pattern forming method of claim 1 wherein

on the pattern forming, positional information of the mark detection system and positional information of the object are used.

10. The pattern forming method of claim 1 wherein

positional information of the mark is detected based on positional information of the mark detection system and positional information of the object.

11. The pattern forming method of claim 1 wherein

on the pattern forming, rotational information of the mark detection system is used.

12. The pattern forming method of claim 1 wherein

positional information of the mark is detected based on positional information and rotational information of the mark detection system and positional information of the object.

13. The pattern forming method of claim 1 wherein

in the first process, the plurality of marks are detected using a plurality of the mark detection system.

14. The pattern forming method of claim 1 wherein

in the first process, the mark is detected in a state where the object and the mark detection system are relatively stationary.

15-85. (canceled)

86. The pattern forming method of claim 1 wherein

information related to the surface shape of the object is detected while the object is being moved by a detection system different from the mark detection system, and the detection results are used in the pattern forming.

87. The pattern forming method of claim 86 wherein

at least a part of a detection operation of the information related to the surface shape is performed in parallel with a detection operation of the mark.

88. The pattern forming method of claim 1 wherein

a pattern is formed by exposing the object.

89. The pattern forming method of claim 88 wherein

liquid immersion exposure is performed on the object.

90. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming method of claim 1.

91. A pattern forming method of forming a pattern on an object, the method comprising:

a first process of detecting a mark on the object while the object is being moved, with a detection area of a mark detection system also being moved; and

92. The pattern forming method of claim 91 wherein

in the first process, the object is moved in a first direction in which a plurality of divided areas on which a pattern is to be formed are disposed on the object.

93. The pattern forming method of claim 92 wherein

in the first process, a plurality of marks are detected whose position in the first direction is different on the object.

94. The pattern forming method of claim 92 wherein

in the first process, marks on the object are detected by a plurality of mark detection systems that have detection areas of different positions in a second direction orthogonal to the first direction.

95. The pattern forming method of claim 94 wherein

in the first process, marks of different positions in the second direction on the object are detected by changing the distance of the plurality of detection areas in the second direction.

96. The pattern forming method of claim 91 wherein

in the second process, detection results of the mark on the object by the mark detection system after the beginning of pattern forming with respect to the object are also used.

97. The pattern forming method of claim 91 wherein

98. The pattern forming method of claim 97 wherein

99. The pattern forming method of claim 91 wherein

a pattern is formed by exposing the object.

100. The pattern forming method of claim 99 wherein liquid immersion exposure is performed on the object.

101. A device manufacturing method including a process of forming a

pattern on a sensitive object using the pattern forming method of claim 91.

102. A pattern forming method of forming a pattern on an object wherein

a mark on the object is detected by a mark detection system, and pattern forming with respect to the object begins using the detection results, whereby

a mark on the object is detected by the mark detection system even after the beginning of pattern forming, and the detection results are used in the pattern forming.

103. The pattern forming method of claim 102 wherein

a pattern is formed in each of a plurality of divided areas on the object, and among the plurality of divided areas, in a first group of divided areas including a divided area on which the pattern is formed first, detection results of the mark detected before the beginning of pattern forming are used, and in a second group of divided areas different from the first group of divided areas, detection results of the mark detected after the beginning of pattern forming are used.

104. The pattern forming method of claim 103 wherein

in the second group of divided areas, detection results of the mark detected before the beginning of pattern forming are also used.

105. The pattern forming method of claim 103 wherein

the pattern forming on the second group of divided areas is performed later than the pattern forming of the first group of divided areas.

106. The pattern forming method of claim 102 wherein

before the beginning of pattern forming, the object is moved in a first direction and a plurality of marks of different positions in the first direction are detected.

107. The pattern forming method of claim 106 wherein

marks on the object are detected by a plurality of mark detection systems that have detection areas of different positions in a second direction orthogonal to the first direction.

108. The pattern forming method of claim 107 wherein

marks of different positions in the second direction on the object are detected by changing the distance of the plurality of detection areas in the second direction.

109. The pattern forming method claim 106 wherein

110. The pattern forming method of claim 109 wherein

111. The pattern forming method of claim 102 wherein

before the beginning of pattern forming, the object is moved in a first direction in which a plurality of divided areas on which a pattern is to be formed are disposed on the object, and a plurality of marks of different positions in the first direction are detected.

112. The pattern forming method of claim 111 wherein

113. The pattern forming method of claim 112 wherein

114. The pattern forming method of claim 111 wherein

115. The pattern forming method of claim 114 wherein

116. The pattern forming method of claim 102 wherein

detection of the marks is performed moving the detection area while the object is being moved.

117. The pattern forming method of claim 116 wherein

118. The pattern forming method of claim 117 wherein

119. The pattern forming method of claim 102 wherein

a pattern is formed by exposing the object.

120. The pattern forming method of claim 119 wherein

liquid immersion exposure is performed on the object.

121. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming method of claim 102.

122. A pattern forming method of forming a pattern on an object wherein

the object is moved in a first direction, and a plurality of marks that have different positions in the first direction on the object are each detected by a plurality of mark detection systems that have detection areas of different positions in a second direction orthogonal to the first direction, and information related to the surface shape of the object is also detected by a detection system different from the mark detection system, whereby

a pattern is formed on the object using the two detection results.

123. The pattern forming method of claim 122 wherein

the plurality of marks include marks of different positions in the second direction, and detection areas of the plurality of mark detection systems are moved in the second direction.

124. The pattern forming method of claim 122 wherein

detection of each of the marks is performed moving the detection area while the object is being moved.

125. The pattern forming method of claim 122 wherein

a detection area of the detection system different is disposed between the position where the pattern forming is performed and the detection area of the mark detection system in the first direction.

126. The pattern forming method claim 122 wherein

127. The pattern forming method of claim 122 wherein

a pattern is formed by exposing the object.

128. The pattern forming method of claim 127 wherein

liquid immersion exposure is performed on the object.

129. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming method of claim 122.

130. A pattern forming apparatus that forms a pattern on an object held by a moving section, the apparatus comprising:

a mark detection system that can have at least a part of the system moved; and

a control unit that moves at least a part of the mark detection system so as to detect a mark on the object with the mark detection system while the moving section is being moved.

131. The pattern forming apparatus of claim 130 wherein

a pattern is formed on the object using detection results of the mark.

132. The pattern forming apparatus of claim 130 wherein

the control unit controls a movement of at least a part of the mark detection system so that detection of the mark is performed while the moving section is being moved at least from a loading position where the moving section holds the object to a position where pattern forming with respect to the object begins.

133. The pattern forming apparatus of claim 130 wherein

the control unit controls a movement of at least a part of the mark detection system so that detection of the mark is performed at least after pattern forming has begun on the object.

134. The pattern forming apparatus of claim 133 wherein

the control unit controls a movement of at least a part of the mark detection system so that detection of the mark is performed also before the beginning of pattern forming with respect to the object.

135. The pattern forming apparatus of claim 130 wherein

the control unit controls a movement of at least a part of the mark detection system so that at least a part of the mark detection system follows the movement of the moving section when detecting the mark on the object.

136. The pattern forming apparatus of claim 130 wherein

the control unit detects a plurality of marks on the object while changing the positional relation between the object and the mark detection system.

137. The pattern forming apparatus of claim 130 wherein

the control unit moves at least a part of the mark detection system in a direction different from a movement direction of the object after a mark detection until the next mark detection.

138. The pattern forming apparatus of claim 130 wherein

the control unit

detects a part of the marks necessary for forming a pattern on all divided areas subject to pattern forming on the object, and

also detects the rest of the marks necessary for forming a pattern on all divided areas subject to pattern forming, in parallel with forming a pattern on a divided area on which a pattern can be formed based on the detection results of a part of the marks necessary for forming the pattern.

139. The pattern forming apparatus of claim 130 wherein

the mark detection system has a photodetection element and a cooling mechanism for cooling the photodetection element.

140. The pattern forming apparatus of claim 130, the apparatus further comprising:

a sensor that detects positional information of the mark detection system, whereby

the positional information of the mark detection system and positional information of the object are used on pattern forming.

141. The pattern forming apparatus of claim 140 wherein

positional information of the mark is detected based on the positional information of the mark detection system detected by the sensor and the positional information of the object.

142. The pattern forming apparatus of claim 140 wherein

the sensor also detects rotational information of the mark detection system, whereby

the rotational information of the mark detection system is used on pattern forming.

143. The pattern forming apparatus of claim 142 wherein

positional information of the mark is detected based on the positional information and the rotational information of the mark detection system detected by the sensor and the positional information of the object.

144. The pattern forming apparatus of claim 140 wherein

the sensor includes an interferometer.

145. The pattern forming apparatus of claims 130, the apparatus further comprising:

a detection unit that detects positional information of the object in a direction perpendicular to a predetermined plane on which the object moves at a each of a plurality of measurement positions disposed between a loading position where the moving section holds the object and a pattern forming starting position with respect to the object.

146. The pattern forming apparatus of claim 145 wherein

the control unit computes information related to the surface shape of the object based on detection results of the detection unit.

147. The pattern forming apparatus of claim 145 wherein

the control unit performs at least a part of a detection operation by the detection unit in parallel with a detection operation of the mark.

148. The pattern forming apparatus of claim 130, the apparatus further comprising:

a measurement moving section that can move independently from the moving section, and performs measurement necessary for the pattern forming while the object on the moving section is exchanged.

149. The pattern forming apparatus of claim 130, the apparatus further comprising:

a separate moving section that can move independently from the moving section, and holds the object on which detection of the mark is performed by the mark detection system while pattern forming is performed with respect to the object held by the moving section.

150. The pattern forming apparatus of claim 130, the apparatus further comprising:

an optical system that irradiates an illumination light on the object, whereby

a pattern is formed by exposing the object with the illumination light.

151. The pattern forming apparatus of claim 150 wherein

the mark detection system is separated in a vibrating manner from a body that supports the optical system.

152. The pattern forming apparatus of claim 151, the apparatus further comprising:

a sensor that detects positional information of the mark detection system with the body serving as a reference.

153. The pattern forming apparatus of claim 152 wherein

the sensor includes an interferometer, and

of the interferometer, at least a branching optical system that branches light into a reference beam and a measurement beam moves with at least a part of the mark detection system, and a reflection surface on which the measurement beam is incident is arranged on the body.

154. The pattern forming apparatus of claim 150 wherein

the optical system includes a projection optical system that projects a pattern on the object, and at least the projection optical system is supported by the body.

155. The pattern forming apparatus of claim 154, the apparatus further comprising:

156. The pattern forming apparatus of claim 155 wherein

the sensor includes an interferometer, and

157. The pattern forming apparatus of claim 150, the apparatus further comprising:

a liquid supply mechanism that supplies liquid in a space between the optical system and the object, whereby

the object is exposed with the illumination light via the optical system and the liquid.

158. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming apparatus of claim 130.

159. A pattern forming apparatus that forms a pattern on an object held by a moving section, the apparatus comprising:

a mark detection system that can have at least a part of the system moved; and

a control unit that controls a movement of a detection area of the mark detection system so as to detect a mark on the object with the mark detection system while the moving section is being moved.

160. The pattern forming apparatus of claim 159 wherein

the control unit moves the moving section in a first direction where a plurality of divided areas on which a pattern is to be formed are disposed on the object, in parallel with moving the detection area of the mark detection system.

161. The pattern forming apparatus of claim 160 wherein

the mark detection system detects a plurality of marks of different positions in the first direction.

162. The pattern forming apparatus of claim 160, the apparatus comprising:

a plurality of the mark detection systems, whereby

each of the mark detection systems have detection areas of different positions in a second direction orthogonal to the first direction.

163. The pattern forming apparatus of claim 162 wherein

the control unit detects marks of different positions in the second direction on the object by changing the distance of the plurality of detection areas in the second direction on detection of the marks on the object with the mark detection system while the moving section is being moved.

164. The pattern forming apparatus of claim 159 wherein

the control unit forms a pattern on the object using detection results of the mark.

165. The pattern forming apparatus of claim 164 wherein

the control unit uses the detection results of the mark on the object by the mark detection system after the beginning of pattern forming with respect to the object.

166. The pattern forming apparatus of claim 159, the apparatus further comprising:

167. The pattern forming apparatus of claim 166 wherein

168. The pattern forming apparatus of claim 166 wherein

169. The pattern forming apparatus of claim 159, the apparatus further comprising:

170. The pattern forming apparatus of claim 159, the apparatus further comprising:

171. The pattern forming apparatus of claim 159, the apparatus further comprising:

an optical system that irradiates an illumination light on the object, whereby

a pattern is formed by exposing the object with the illumination light.

172. The pattern forming apparatus of claim 171 wherein

173. The pattern forming apparatus of claim 172, the apparatus further comprising:

174. The pattern forming apparatus of claim 173 wherein

the sensor includes an interferometer, and

175. The pattern forming apparatus of claim 171 wherein

176. The pattern forming apparatus of claim 175, the apparatus further comprising:

177. The pattern forming apparatus of claim 176 wherein

the sensor includes an interferometer, and

178. The pattern forming apparatus of claim 171, the apparatus further comprising:

179. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming apparatus of claim 159.

180. A pattern forming apparatus that forms a pattern on an object held by a moving section, the apparatus comprising:

a mark detection system that detects a mark on the object; and

a control unit that controls detection of the mark on the object using the mark detection system and pattern forming with respect to the object, wherein

the control unit detects the mark on the object with the mark detection system and begins pattern forming with respect to the object using the detection results, and after the beginning of pattern forming, continues to detect the mark on the object with the mark detection system and uses the detection results in the pattern forming.

181. The pattern forming apparatus of claim 180 wherein

the object has a plurality of divided areas in which a pattern is formed, and

the control unit uses

detection results of the mark detected before the beginning of pattern forming when forming a pattern with respect to a first group of divided areas including a divided area on which the pattern is formed first among the plurality of divided areas, and

detection results of the mark detected after the beginning of pattern forming when forming a pattern with respect to a second group of divided areas different from the first group of divided areas.

182. The pattern forming apparatus of claim 181 wherein

the control unit also uses detection results of a mark detected before the beginning of pattern forming when forming a pattern with respect to the second group of divided areas.

183. The pattern forming apparatus of claim 181 wherein

184. The pattern forming apparatus of claim 180 wherein

the control unit moves the moving section in a first direction before the beginning of pattern forming, and detects a plurality of marks of different positions in the first direction on the object.

185. The pattern forming apparatus of claim 184, the apparatus comprising:

a plurality of the mark detection systems, whereby

186. The pattern forming apparatus of claim 185 wherein

the control unit detects marks of different positions in the second direction on the object by changing the distance of the plurality of detection areas in the second direction.

187. The pattern forming apparatus of claim 180 wherein

the control unit moves the moving section in a first direction in which a plurality of divided areas on which a pattern is to be formed are disposed on the object before the beginning of pattern forming, and detects a plurality of marks of different positions in the first direction.

188. The pattern forming apparatus of claim 187, the apparatus comprising:

a plurality of the mark detection systems, whereby

189. The pattern forming apparatus of claim 188 wherein

190. The pattern forming apparatus of claim 180 wherein

the control unit performs detection of the mark moving the detection area while the object is being moved.

191. The pattern forming apparatus of claim 190 wherein

192. The pattern forming apparatus of claim 180, the apparatus further comprising:

193. The pattern forming apparatus of claim 192 wherein

194. The pattern forming apparatus of claim 192 wherein

195. The pattern forming apparatus of claim 180, the apparatus further comprising:

196. The pattern forming apparatus of claim 180, the apparatus further comprising:

197. The pattern forming apparatus of claim 180, the apparatus further comprising:

an optical system that irradiates an illumination light on the object, whereby

a pattern is formed by exposing the object with the illumination light.

198. The pattern forming apparatus of claim 197 wherein

199. The pattern forming apparatus of claim 198, the apparatus further comprising:

200. The pattern forming apparatus of claim 199 wherein

the sensor includes an interferometer, and

201. The pattern forming apparatus of claim 197 wherein

202. The pattern forming apparatus of claim 201, the apparatus further comprising:

203. The pattern forming apparatus of claim 202 wherein

the sensor includes an interferometer, and

204. The pattern forming apparatus of claim 197, the apparatus further comprising:

205. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming apparatus of claim 180.

206. A pattern forming apparatus that forms a pattern on an object held by a moving section that moves in at least a first direction, the apparatus comprising:

a plurality of mark detection systems that have detection areas of different positions in a second direction orthogonal to the first direction;

a detection unit that detects information related to the surface shape of the object; and

a control unit that detects a plurality of marks whose position is different in the first direction on the object using each of the plurality of mark detection systems and also detects information related to the surface shape of the object using the detection unit, and forms a pattern on the object using the two detection results while moving the moving section in the first direction.

207. The pattern forming apparatus of claim 206 wherein

the plurality of marks includes marks whose positions differ in the second direction, and

the control unit moves each of the detection areas of the plurality of mark detection systems in the second direction on detection of the marks.

208. The pattern forming apparatus of claim 206 wherein

the control unit moves the detection area while the moving section is being moved on detection of each of the marks.

209. The pattern forming apparatus of claim 206 wherein

a detection area of the detection unit is disposed between a position where the pattern forming is performed and the detection areas of the mark detection systems in the first direction.

210. The pattern forming apparatus of claim 206 wherein

211. The pattern forming apparatus of claim 206, the apparatus further comprising:

212. The pattern forming apparatus of claim 206, the apparatus further comprising:

213. The pattern forming apparatus of claim 206, the apparatus further comprising:

an optical system that irradiates an illumination light on the object, whereby

a pattern is formed by exposing the object with the illumination light.

214. The pattern forming apparatus of claim 213 wherein

215. The pattern forming apparatus of claim 214, the apparatus further comprising:

216. The pattern forming apparatus of claim 215 wherein

the sensor includes an interferometer, and

217. The pattern forming apparatus of claim 213 wherein

218. The pattern forming apparatus of claim 217, the apparatus further comprising:

219. The pattern forming apparatus of claim 218 wherein

the sensor includes an interferometer, and

220. The pattern forming apparatus of claim 213, the apparatus further comprising:

221. A device manufacturing method including a process of forming a pattern on a sensitive object using the pattern forming apparatus of claim 206.