US20070137279A1 - Transferring device - Google Patents
Transferring device Download PDFInfo
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- US20070137279A1 US20070137279A1 US11/603,119 US60311906A US2007137279A1 US 20070137279 A1 US20070137279 A1 US 20070137279A1 US 60311906 A US60311906 A US 60311906A US 2007137279 A1 US2007137279 A1 US 2007137279A1
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- workpiece
- transferring device
- transferring
- supporting hand
- rotation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A transferring device including a transferring device main body; a transferring arm which is coupled with the transferring device main body to transfer a workpiece; and a supporting hand which has a plurality of engaging parts coupled with the transferring arm and forming a predetermined angle therebetween to support the workpiece based on a force applied to the workpiece according to varying rotation speeds of the transferring arm. Thus, a transferring device can stably support a workpiece.
Description
- This application claims the benefit of Korean Patent Application No. 2005-0126046, filed on Dec. 20, 2005, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present general inventive concept relates to a transferring device to transfer a workpiece, and more particularly, to a transferring device which stably supports a workpiece.
- 2. Description of the Related Art
- Generally, a transferring device is used for various purposes in various processes. There is a type of a transferring device which transfers a wafer to a processing chamber in a semiconductor manufacturing process. The transferring device is installed between a loading/unloading chamber, which accommodates a plurality of wafers, and a reaction chamber, which receives the wafers to proceed with a predetermined process, and loads/unloads the wafers for an etching process and a deposition process. Various methods are introduced to transfer the wafers precisely and quickly and to reduce the transferring time between the processes, including raising the transferring speed or stably supporting the wafers.
- Korean Utility Model First Publication No. 20-173017 (Dec. 16, 1999) discloses a wafer transferring device which prevents errors and contamination while transferring wafers. US Patent First Publication No. 2003/85582 (May 8, 2003) discloses a transferring robot arm which has a projection to support a wafer. The conventional devices comprise a robot arm to support the wafer. Such a robot arm comprises a pin or a projection protruding from a plate surface to stably support the wafer.
- However, the conventional device has a complex configuration to support and hold the wafer and may cause damages to the wafer when holding the wafer using an air cylinder. Also, in the case that the wafer needs be processed in a vacuum, the air cylinder or a pipe may be damaged and begin to leak, and thus the overall processes of the wafer may be affected. Further, when the conventional device rotates faster than a predetermined speed while supporting the wafer, the wafer may be separated from the robot arm.
- The present general inventive concept provides a transferring device which can stably support a workpiece with a simplified method.
- Additional aspects and/or utilities of the present general inventive concept will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present invention.
- The foregoing and/or other aspects and utilities of the present general inventive concept are achieved by providing a transferring device, comprising a transferring device main body; a transferring arm which is coupled with the transferring device main body to transfer a workpiece; and a supporting hand which has a plurality of engaging parts coupled with the transferring arm and forming a predetermined angle therebetween to support the workpiece based on a force applied to the workpiece according to varying rotation speeds of the transferring arm.
- The supporting hand may comprise a coupling part which is coupled with the transferring arm and a plurality of blades which extend from the coupling part and spaced from each other.
- The engaging part may comprise a first engaging part formed on the coupling part, and a plurality of second engaging parts respectively formed on the blades, and the angle between the engaging parts is defined as an angle between the second engaging parts with respect to the center of the workpiece.
- The angle between the second engaging parts can be determined on the basis of a resultant force of a centrifugal force and a rotation inertial force applied to the workpiece according to the varying rotation speeds of the transferring arm.
- The engaging parts can be provided in a position where the resultant force of the centrifugal force and the rotation inertial force becomes the maximum.
- The engaging parts can be depressed from a planar surface of the supporting hand with a predetermined depth.
- The engaging parts can form a larger diameter than the workpiece.
- The supporting hand can comprise a spacer which is depressed inside the engaging parts.
- The spacer can have a smaller diameter than the workpiece.
- The supporting hand can comprise one of stainless steel and ceramic.
- The supporting hand can comprise an inclination part which is formed along edges of the engaging parts.
- The workpiece can comprise a wafer.
- The foregoing and/or other aspects and utilities of the present general inventive concept are also achieved by providing a transferring device to transfer a workpiece, comprising: a body; a transferring arm to extend away from and contract toward the body; and a supporting hand to connect with the transferring arm, the supporting hand comprising: a coupling part to engage with the transferring arm, two blades extending from the coupling part and spaced from each other by a predetermined amount, a stepped engaging part having a circular stepped portion extending about a circular region crossing the coupling part and an outer portion of the two blades, the stepped engaging part stepped down from a surface of the coupling part and having a diameter wider than the workpiece, and a spacer part stepped down from the stepped engaging part in a center portion thereof.
- An angle X formed at the center of the diameter of the stepped engaging part between a line extending to a center of the stepped engaging part crossing one of the blades and a line extending to a center of the stepped engaging part crossing the other one of the blades can be determined on the basis of a direction of a resultant force of a centrifugal force and a rotation inertial force applied to the workpiece according to a varying rotation speed of the transferring arm.
- The foregoing and/or other aspects and utilities of the present general inventive concept are also achieved by providing a supporting hand usable with a transferring device to transfer a workpiece, comprising: a coupling part provided on a first end to couple with a transferring arm of the transfer device; a couple of blades which extend from the coupling part and are spaced apart from each other; and a stepped engaging part stepped from the surface of the coupling part and having a predetermined diameter extending across the coupling part and the coupling blades to support the workpiece thereon, the stepped engaging part having a larger diameter than the workpiece.
- The foregoing and/or other aspects and utilities of the present general inventive concept are also achieved by providing a method of determining an angle between blades of a transfer device supporting hand to transfer a wafer, the method comprising: calculating an optimal rotation speed of a transferring device main body; and calculating an angle between a predetermined part of two blades with respect to a center portion of a wafer holding area of the supporting hand.
- The calculating an optimal rotation speed of the transferring device may comprise calculating a rotation speed in the speed increasing region where the transferring device main body starts rotating and reaches the optimal speed, the uniform speed region where the transferring device rotates at a uniform speed, and a speed decreasing region where the rotation speed of the transferring device main body becomes 0 from the optimal speed.
- These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
-
FIG. 1 illustrates an arrangement of a transferring device according to the present general inventive concept; -
FIG. 2 is a perspective view of the transferring device according to the present general inventive concept; -
FIG. 3 illustrates forces which are applied to a workpiece according as the transferring device rotates, according to the present general inventive concept; -
FIG. 4A is a plan view of a supporting hand according to the present general inventive concept; -
FIG. 4B is a side view of the supporting hand according to the present general inventive concept; -
FIGS. 5A through 5D are operational views of the transferring device according to the present general inventive concept; and -
FIG. 6 is a control flowchart of a workpiece supporting process of the transferring device according to the present general inventive concept. - Reference will now be made in detail to the embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. The embodiments are described below in order to explain the present general inventive concept by referring to the figures.
- Hereinafter, a transferring
device 10 according to an exemplarity embodiment of the present general inventive concept will be described. Aworkpiece 15 can comprise a wafer which is used in a semiconductor manufacturing process by way of example. - As illustrated in
FIGS. 1 through 3 , thetransferring device 10 according to the present general inventive concept can comprise a transferring devicemain body 20; a transferringarm 30 which is coupled with the transferring devicemain body 20 to transfer theworkpiece 15; and a supportinghand 50 coupled with the transferringarm 30. The transferringdevice 10 is disposed between a loading/unloading chamber 7 which accommodates the plurality ofworkpieces 15 and aprocessing chamber 5 which receives the workpiece(s) 15 to proceed with a predetermined process, and transfers the workpiece(s) 15. The transferringdevice 10 may transfer theworkpiece 15 under the condition of vacuum and/or a chemical reaction, such as a deposition process or an etching process. - The
workpiece 15 can have a predetermined thickness and diameter according to its standard. Theworkpiece 15 is supported by the supportinghand 50 and transferred by the transferring devicemain body 20 or by the transferringarm 30. Theworkpiece 15 may have a round shape, or alternatively, a rectangular shape, such as a small panel. - As illustrated in
FIG. 2 , the transferring devicemain body 20 can comprise a driver (not illustrated) which is coupled with the transferringarm 30 and transfers theworkpiece 15 in vertical and horizontal directions. The transferring devicemain body 20 may vary in optimal/fastest transferring speed to transfer theworkpiece 15, according to manufacturers. The transferring devicemain body 20 comprises rotational regions including: a region where the rotation speed increases from a suspension state; a region where the optimal rotation speed is uniformly maintained; and a region where the optimal rotation speed decreases, while rotating. - The transferring
arm 30 may comprise a driver (not illustrated) which is coupled with the transferring devicemain body 20 and provides a moving force to move between a loading/unloading position of loading and unloading theworkpiece 15 by the supportinghand 50 and a retraction position that is retracted to be adjacent to the transferring devicemain body 20. - As illustrated in
FIGS. 2 through 4B , the supportinghand 50 comprises a stepped engagingpart 51, which is coupled with the transferringarm 30 and has a predetermined diameter to support theworkpiece 15 based on a force applied to theworkpiece 15 according to the varying rotation speed of the transferringarm 30. The supportinghand 50 comprises a ceramic which has high resistance to a chemical process such as a deposition process or stainless steel which has corrosion resistance or high strength, but is not limited thereto. Alternatively, the supportinghand 50 may comprise various well-known materials as necessary in order to achieve the intended purposes of the general inventive concept as described herein. The supportinghand 50 comprises acoupling part 53 which is provided on a first end thereof and couples with the transferringarm 30; and a couple ofblades 55 which extend from thecoupling part 53 and are spaced from each other. The supportinghand 50 further comprises aspacer 57 which is depressed from a planar surface of the stepped engagingpart 51 with a predetermined depth. The supportinghand 50 further comprises aninclination part 59 which is formed along edges of theengaging part 51. - As illustrated in
FIGS. 4A and 4B , the engagingpart 51 is depressed from the planar surface of the supportinghand 50 and has a larger diameter than theworkpiece 15. The engagingpart 51 comprises a first engagingpart 51 a which is formed adjacent to thecoupling part 53; and a couple of secondengaging parts 51 b which are formed adjacent to theblades 55. More specifically, each second engagingpart 51 b is formed adjacent to a respective one of theblades 55. An angle (2X) between the two secondengaging parts 51 b is determined on the basis of a direction of a resultant force of a centrifugal force and a rotation inertial force applied to theworkpiece 15 according to the varying rotation speed of the transferringarm 30. - Hereinafter, a process of determining the angle (2X) between the second
engaging parts 51 b will be described. First, an optimal rotation speed of the transferring devicemain body 20 is calculated. That is, the rotation speed is calculated in the speed increasing region where the transferring devicemain body 20 starts rotating and reaches the optimal speed, the uniform speed region where the transferring devicemain body 20 rotates at an uniform speed, and a speed decreasing region where the rotation speed of the transferring devicemain body 20 becomes 0 from the optimal speed. The optimal rotation speed of the transferring devicemain body 20 may be determined from a speed range including the maximum speed, in consideration of the distance between the processes, the size of theworkpiece 15 and the type of the transferring devicemain body 20. Then, the angle (2X) between the secondengaging parts 51 b may be calculated as follows, based on the optimal speed change. - First, a centrifugal force according to the varying rotation speeds in the respective processes may be calculated as follows.
-
F (centrifugal) =mdω 2Formula 1 - Here, “m” refers to the weight of the
workpiece 15, “d” is distance from the rotation center of the transferring devicemain body 20 to the center of the workpiece 15 (seeFIG. 3 ), and “ω” is an angular velocity (radian/sec) of the transferring devicemain body 20. - Then, an angular acceleration may be calculated as follows.
-
α=ω/t Formula 2 - Here, “t” refers to acceleration time.
- The rotation inertial force according to the angular acceleration can be calculated as follows.
-
F (rotation) =mdα Formula 3 - Thus, the combined force of the centrifugal force and the rotation inertial force in
Formula 1 through 3 is as follows. -
F=√{square root over (F Q centrifugal +F Q rotation)}Formula 4 - Here, the engaging
part 51 is provided in a position where the resultant force of the centrifugal force and the rotation inertial force calculated through theFormula 4 becomes the maximum. - Here, the angle X (see, for example,
FIG. 3 ) between the resultant force and the centrifugal force may be calculated as follows. -
- Then, the
angle 2X is the angle between the secondengaging parts 51 b. The engagingpart 51 may vary in thickness (seeFIGS. 4A and 4B ) according to the size of theworkpiece 15 and the optimal rotation speed. - The engaging
part 51 is depressed from the plate surface of the supportinghand 50 with the predetermined depth. The depth thereof may vary according to the size and thickness of theworkpiece 15. Alternatively, the engagingpart 51 may protrude from the plate surface of the supportinghand 50 to a predetermined height or may be installed at a predetermined position as a plurality of pins protruding from the plate surface of the supportinghand 50, to have a predetermined inner diameter. - Thus, the engaging
part 51 of the supportinghand 50 can stably support theworkpiece 15 corresponding to the varying rotation speed of theworkpiece 15 since the engagingpart 51 is formed in consideration of the resultant force according to the optimal rotation speed. Also, the transferringdevice 10 can reduce the transferring time of theworkpiece 15. - As illustrated in
FIG. 4A , thecoupling part 53 comprises at least onecoupling hole 53 a which is formed on a side thereof to be coupled with the transferringarm 30 by a coupling member, such as a screw. - The
blades 55 are shaped like a plate and separated from each other, to thereby minimize the weight of the supportinghand 50. - the
spacer 57 is depressed from the planar surface of theengaging part 51 with a predetermined depth. Thespacer 57 has a smaller diameter than theworkpiece 15, and thus theworkpiece 15 supported by the engagingpart 51 is and not in contact with the planar surface of thespacer 57. Thus, the surface of theengaging part 51 which contacts theworkpiece 15 is minimized, thereby preventing contamination or damages to theworkpiece 15 due to contact with theworkpiece 15. - The
inclination part 59, formed along the edges of theengaging part 51, allows theworkpiece 15 to be stably seated by its own weight. - As described above, the
workpiece 15 may comprise a wafer according to the exemplary embodiment of the present general inventive concept, but is not limited thereto. The transferringdevice 10 according to the present general inventive concept may be applicable to transferring various types of workpieces, such a small display panel. - With the foregoing configuration, the rotating process of the transferring
device 10 according to the present general inventive concept will be described with reference toFIGS. 5A and 6 . - First, a method of providing the transferring
device 10 that supports theworkpiece 15 will be described with reference toFIG. 6 . - The transferring device
main body 20 comprises a driver (not illustrated) such as a robot to transfer theworkpiece 15 vertically and horizontally at a stage of constituting the transferring device main body 20 (operation S110). - The transferring
arm 30 is coupled with the transferring devicemain body 20 to support theworkpiece 15 and to transfer theworkpiece 15 between the loading/unloading position and the retraction position at the operation of coupling the transferring arm 30 (operation S115). - The optimal rotation speed is calculated in the speed increasing region where the transferring device
main body 20 starts rotating and reaches the optimal rotation speed, the uniform speed region where the transferring devicemain body 20 rotates at the uniform speed and the speed decreasing region where the rotation speed of the transferring devicemain body 20 is reduced to “0” from the optimal rotation speed, at the stage of determining the optimal rotation speed (operation S120). Here, the optimal rotation speed may be determined within the speed range including the maximum rotation speed of the transferring devicemain body 20 in consideration of the speed capability of the transferring devicemain body 20, the processing time and the type of theworkpiece 15. - Then, the
angle 2X between the two secondengaging parts 51 b is determined to support theworkpiece 15 based on the forces applied to theworkpiece 15 according to the varying rotation speeds of the transferring arm 30 (operation S125). Theangle 2X is calculated based on the resultant force of the centrifugal force and the rotation inertial force applied to theworkpiece 15 according to the varying rotation speeds of the transferringarm 30. - The engaging
part 51 is depressed from the planar surface of the supportinghand 50 considering theangle 2X calculated at the stage of operation S125 (operation S130). - The supporting
hand 50 having the engagingpart 51 is coupled with the transferringarm 30 by a screw or the like (operation S135). - A process of supporting and rotating the
workpiece 15 is illustrate inFIGS. 5A and 5D . - As illustrated in
FIG. 5A , the transferringarm 30 is moved to the loading/unloading position to load theworkpiece 15, and supports theworkpiece 15. As illustrated inFIG. 5B , while theworkpiece 15 is supported by the engagingpart 51 of the supportinghand 50, the transferringarm 30 is moved from the loading/unloading position to the retraction position adjacent to the transferring devicemain body 20. Then, as illustrated inFIG. 5C , the transferringarm 30 comprises the process of increasing the speed; the process of rotating at the uniform speed; and the process of being positioned at the predetermined position according to the decrease of the rotation speed while rotating according to the varying optimal rotation speed. The centrifugal force and the rotation inertial force are applied to theworkpiece 15 during the processes. The engagingpart 51 is provided in the position where the resultant force of the centrifugal force and the rotation inertial force becomes the maximum. As illustrated inFIG. 5D , the transferring devicemain body 20 rotates to a predetermined position, and theworkpiece 15 is transferred to the processing chamber (refer toFIG. 1 ). - As described above, the engaging
part 51 is provided in a direction where the maximum force is applied to the workpiece in consideration of varying optimal rotation speeds of the transferring device main body, thereby stably supporting the workpiece and preventing damages to the workpiece. Also, the rotation speed is maximized to reduce the processing time. - As described above, a workpiece is stably supported corresponding to varying rotation speeds according to the present general inventive concept, thereby preventing damages to the workpiece and reducing the processing time according to the transfer of the workpiece.
- Although a few embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the appended claims and their equivalents.
Claims (19)
1. A transferring device, comprising:
a transferring device main body;
a transferring arm that couples with the transferring device main body to transfer a workpiece; and
a supporting hand which has a plurality of engaging parts coupled with the transferring arm and forms a predetermined angle therebetween to support the workpiece based on a force applied to the workpiece according to varying rotation speeds of the transferring arm.
2. The transferring device according to claim 1 , wherein the supporting hand comprises a coupling part which couples with the transferring arm and a plurality of blades which extend from the coupling part and are spaced apart from each other.
3. The transferring device according to claim 2 , wherein the engaging part comprises a first engaging part formed on the coupling part, and a second engaging part formed on each of the blades, and the angle between the engaging parts is defined by an angle between the second engaging parts with respect to the center of the workpiece.
4. The transferring device according to claim 3 , wherein the angle between the second engaging parts is determined on the basis of a resultant force of a centrifugal force and a rotation inertial force applied to the workpiece according to the varying rotation speeds of the transferring arm.
5. The transferring device according to claim 4 , wherein the engaging parts is provided in a position where the resultant force of the centrifugal force and the rotation inertial force becomes the maximum.
6. The transferring device according to claim 3 , wherein the engaging parts are depressed from a planar surface of the supporting hand by a predetermined depth.
7. The transferring device according to claim 3 , wherein the engaging parts form a larger diameter than the workpiece.
8. The transferring device according to claim 3 , wherein the supporting hand comprises a spacer which is depressed inside the engaging parts.
9. The transferring device according to claim 8 , wherein the spacer has a smaller diameter than the workpiece.
10. The transferring device according to claim 3 , wherein the supporting hand comprises one of stainless steel and ceramic.
11. The transferring device according to claim 3 , wherein the supporting hand comprises an inclination part formed along edges of the engaging parts.
12. The transferring device according to claim 1 , wherein the workpiece comprises a wafer.
13. A transferring device to transfer a workpiece, comprising:
a body;
a transferring arm to extend away from and contract toward the body; and
a supporting hand to connect with the transferring arm, the supporting hand comprising:
a coupling part to engage with the transferring arm,
two blades extending from the coupling part and spaced from each other by a predetermined amount,
a stepped engaging part having a circular stepped portion extending about a circular region crossing the coupling part and an outer portion of the two blades, the stepped engaging part stepped down from a surface of the coupling part and having a diameter wider than the workpiece, and
a spacer part stepped down from the stepped engaging part in a center portion thereof.
14. The transferring device according to claim 13 , wherein an angle X formed at the center of the diameter of the stepped engaging part between a line extending to a center of the stepped engaging part crossing one of the blades and a line extending to a center of the stepped engaging part crossing the other one of the blades is determined on the basis of a direction of a resultant force of a centrifugal force and a rotation inertial force applied to the workpiece according to a varying rotation speed of the transferring arm.
15. The transferring device according to claim 14 , wherein the angle X is calculated as follows:
calculating a centrifugal force as F(centrifugal)=mdω2
where “m” refers to the weight of the workpiece 15, “d” is distance from the rotation center of the transferring device main body 20 to the center of the workpiece 15 (see FIG. 3 ), and “ω” is an angular velocity (radian/sec) of the transferring device main body,
calculating an angular acceleration α=ω/t,
where “t” refers to acceleration time,
calculating the rotation inertial force according to an angular acceleration as F(rotation)=mdα,
combining the calculated centrifugal force and the rotation inertial force as F=√{square root over (FQ centrifugal+FQ rotation)},
and calculating the angle X as
16. A supporting hand usable with a transferring device to transfer a workpiece, comprising:
a coupling part provided on a first end to couple with a transferring arm of the transfer device;
a couple of blades which extend from the coupling part and are spaced apart from each other; and
a stepped engaging part stepped from the surface of the coupling part and having a predetermined diameter extending across the coupling part and the coupling blades to support the workpiece thereon, the stepped engaging part having a larger diameter than the workpiece.
17. The supporting hand according to claim 16 , wherein an angle between the engaging part on the first blade and the engaging part on the second blade is determined on the basis of a direction of a resultant force of a centrifugal force and a rotation inertial force applied to the workpiece according to a varying rotation speed of the transferring arm.
18. A method of determining an angle between blades of a transfer device supporting hand to transfer a wafer, the method comprising:
calculating an optimal rotation speed of a transferring device main body; and
calculating an angle between a predetermined part of two blades with respect to a center portion of a wafer holding area of the supporting hand.
19. The method of according to claim 18 , wherein the calculating an optimal rotation speed of the transferring device comprises:
calculating a rotation speed in the speed increasing region where the transferring device main body starts rotating and reaches the optimal speed, the uniform speed region where the transferring device rotates at a uniform speed, and a speed decreasing region where the rotation speed of the transferring device main body becomes 0 from the optimal speed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR2005-126046 | 2005-12-20 | ||
KR1020050126046A KR100716299B1 (en) | 2005-12-20 | 2005-12-20 | Transferring unit and supporting method for the workpiece |
Publications (1)
Publication Number | Publication Date |
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US20070137279A1 true US20070137279A1 (en) | 2007-06-21 |
Family
ID=38171838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/603,119 Abandoned US20070137279A1 (en) | 2005-12-20 | 2006-11-22 | Transferring device |
Country Status (3)
Country | Link |
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US (1) | US20070137279A1 (en) |
KR (1) | KR100716299B1 (en) |
CN (1) | CN100472746C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200043774A1 (en) * | 2018-08-06 | 2020-02-06 | Kla Corporation | Low profile wafer manipulator |
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- 2006-12-19 CN CNB2006101687134A patent/CN100472746C/en not_active Expired - Fee Related
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US20200043774A1 (en) * | 2018-08-06 | 2020-02-06 | Kla Corporation | Low profile wafer manipulator |
US11062935B2 (en) * | 2018-08-06 | 2021-07-13 | Kla Corporation | Low profile wafer manipulator |
Also Published As
Publication number | Publication date |
---|---|
CN1988126A (en) | 2007-06-27 |
CN100472746C (en) | 2009-03-25 |
KR100716299B1 (en) | 2007-05-09 |
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