US20070102143A1

US20070102143A1 - Heat dissipation module and heat pipe thereof

Info

Publication number: US20070102143A1
Application number: US11/493,650
Authority: US
Inventors: Min-Hui Yu; Chin-Ming Cheng; Chi-Feng Lin; Chin-Ming Chen
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2005-11-04
Filing date: 2006-07-27
Publication date: 2007-05-10
Also published as: TW200718912A; TWI307400B

Abstract

A heat dissipation module includes a heat pipe and a plurality of fins disposed around the heat pipe. The heat pipe includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around the top portion. The base is combined with the main body to form a closed chamber. The base is disposed corresponding to the top portion and has an uneven surface facing the top portion. The first wick is disposed on the sidewall portion and the top portion of the main body, the second wick is disposed on the base, and the working fluid is filled within the closed chamber.

Description

This Non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application Nos. 094138665 filed in Taiwan, Republic of China on Nov. 4, 2005, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of Invention
The invention relates to a heat dissipation module, and in particular to a heat dissipation module having a heat pipe with high dissipation efficiency.
2. Related Art
With the continuous progress of the industrial technology, the number of the transistors on unit area of an electronic element is increasing, which result in the increase of the heat produced during working time. Also, the working frequency of the electronic element becomes higher, and the switch loss during the transistor changing status (on/off) is also increasing. Thus, heat generated by the electronic element grows. If the heat can not be dissipated adequately, it will lower the operating speed of the chip or even damage the chip. In order to enhance the heat dissipation efficiency of the electronic element, a heat sink is frequently applied to the electronic element so as to dissipate heat to external environment by direct conduct and also a fan is applied in facilitating the dissipation by proving airflow.
Because a heat pipe can transfer a lot of heat by a considerable distance with a quite small cross-sectional area and a quite small temperature difference and the heat pipe can work without external power supply, the heat pipe has become one of the most widely used heat conducting elements in the electronic heat dissipation product.
FIG. 1 is a schematically cross-sectional view showing a conventional column-like heat pipe. The conventional column-like heat pipe 10 includes a main body 12 which has one open end and one close end, and a top cover 14 combined with the main body 12 to form an airtight hollow chamber.
The main body 12 is an integrally formed with a sidewall portion 122 and a bottom portion 124. There are wicks 16 a and 16 b respectively formed on the inner wall of the main body 12 (i.e., the inner surfaces of the sidewall portion 122 and the bottom portion 124). The heat pipe 10 is filled with a working fluid “W”. When the column-like heat pipe 10 is used in practice, the bottom portion 124 directly contacts a heat source (not shown, such as a electronic element) located below the heat pipe 10 so as to dissipate the heat generated by the heat source. The bottom portion 124 of the column-like heat pipe 10 is an evaporating end, while the sidewall portion 122 and the top cover 14 are condensing ends. The working fluid “W” at the evaporating end absorbs heat and evaporates into a vaporized working fluid and naturally flows toward the condensing end under the influence of the pressure difference. Then, the vaporized working fluid releases the latent heat at the condensing end and condenses into the liquid working fluid “W”. The condensed working fluid further flows back to the evaporating end by the capillary forces of the wicks 16 a and 16 b, and the procedures circulate again and again to achieve the effect of heat dissipation.
However, when the wicks 16 a and 16 b of the column-like heat pipe 10 are formed by powder sintering, the wick 16 b on the bottom portion 124 and the wick 16 a on the sidewall portion 122 are commonly filled with powder and then sintered but no wick is additionally formed on the inner surface of the top cover 14 under the limitation of the sintering mold and the manufacturing factors. Thus, the working fluid “W” condensed at the top cover 14 cannot flow back, and the condensing end “B” at the top cover 14 becomes invalid, thereby decreasing the fluctuation of the mass of the working fluid “W” in the heat pipe 10 and thus decreasing the heat conducting efficiency and the whole heat resistance of the heat pipe 10.
If it is desired to form a wick on the inner surface of the top cover 14, powder has to be filled within the evaporating end and the condensing end simultaneously and then be sintered. Thus, the controls of the shape of the wick and the powder particles become difficult, so the manufacturing processes cannot be utilized to achieve this object. Consequently, if the inner surface of the top cover 14 has to be formed with the wick, a copper mesh may be inserted such that a mesh wick is formed. However, because the wick at the top cover 14 and the wick 16 a on the sidewall portion 122 are not manufactured simultaneously and pertain to different kinds of wicks (one is a powder sintering wick, and the other is a mesh wick), the connection between these two different wicks is poor such that the working fluid cannot smoothly flow to the sidewall portion 122 from the top cover 14 owing to lacking enough capillary force there between. Thus, the overall heat dissipation property of the heat pipe 10 deteriorates.
Thus, it is an important subject of the invention to provide a heat pipe which has a low cost and can be manufactured easily so as to solve the above-mentioned problems.

SUMMARY OF THE INVENTION

In view of the foregoing, the invention is to provide a heat dissipation module and a heat pipe thereof with advantages of low cost and simple manufacture procedures. In addition, the invention solve the problem of poor connection between the sidewall portion and the top cover of the column-like heat pipe in the prior art. The invention also effectively enlarges heat exchanging area of the heat pipe and enhances the overall heat dissipation efficiency.
To achieve the above, a heat pipe of the invention includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around the top portion. When the base and the main body are assembled, the base and the main body are combined to form a closed chamber, and the base is disposed corresponding to the top portion. The working fluid is filled within the closed chamber. The base has an uneven surface facing the top portion, and the first wick is disposed on the sidewall portion and the top portion of the main body. The second wick is disposed on the uneven surface of the base and connected to the first wick.
As mentioned above, the sidewall portion and the top portion may be integrally formed as a single piece. Alternatively, the sidewall portion and the top portion are two separate components and are combined together to form the main body. The uneven surface of the base is formed with at least one protrusion, and the cross section of the protrusion on the base has a rectangular, semi-circular semi-spherical, arc, triangular, quadrangular or trapezoidal shape. The protrusions on the uneven surface of the base constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern.
The second wick is disposed on the uneven surface of the base such that the second wick faces the top portion and forms a plane. The second wick has a first thickness H1 and a second thickness H2, which is relatively smaller than the first thickness H1, in a direction perpendicular to the base. Or, the second wick is disposed along an uneven surface profile of the base and the thickness of the second wick has a uniform or varied thickness. Moreover, the inner surface of the sidewall portion may have even or uneven profiles. The inner surface of the sidewall portion is formed with at least one protrusion. The cross section of the protrusion on the sidewall portion constitutes a sawtooth ring pattern, a continuous semi-circular pattern or any other patterns constituted by the equivalent structure.
The sidewall portion of the main body has a shape like a hollow tube. The main body and the base are made of a material with high thermal conductivity, such as copper, silver, aluminum or alloy thereof. The material of the first wick and the second wick may be a plastic material, a metallic material, an alloy or a porous non-metallic material, and be formed by way of sintering, adhering, filing and depositing or any combinations thereof. The working fluid W may be an inorganic compound, pure water, alcohol, ketone, liquid metal, refrigerant, an organic compound or any mixtures thereof.
The invention also provides a heat dissipation module including a heat pipe and a plurality of fins, which are connected to and disposed around the heat pipe. The heat pipe includes a main body, a base, a first wick, a second wick and a working fluid. The main body has a top portion and a sidewall portion disposed around the top portion. When the base and the main body are assembled, the base and the main body are combined to form a closed chamber, and the base is disposed corresponding to the top portion. The base has an uneven surface, which faces the top portion, and the first wick is disposed on the sidewall portion and the top portion of the main body. The second wick is disposed on the uneven surface of the base and connected to the first wick. The working fluid is filled within the closed chamber.
The fins are manufactured by way of aluminum extrusion, pressing or other methods. The fins may be disposed in a horizontal interval distribution, a vertically interval distribution, a slantingly interval distribution, a radial distribution, or other distributions. The fins are disposed around the heat pipe and connected to the heat pipe. The fins are connected to the heat pipe by a way selected from welding, embedding, engaging or adhering. The heat pipe is embedded in and/or engaged with the fins by way of hot mounting. Alternatively, a soldering paste, a grease or a material capable of serving as a thermal conductive interface may be coated between the fins and the heat pipe.
In the heat dispassion module, the heat pipe may contact the heat source directly or indirectly through an external carrier to the fins. The carrier is a solid metal block, and the heat source is an electronic element, such as a CPU (Central Processing Unit), a transistor, a server, an advanced graphics card, a hard disk, a power supply, a mobile control system, a multimedia electronic mechanism, a wireless communication transceiver station or an advanced game machine, which generates the heat. In addition, a fan may be applied to the heat dissipation module, which facilitate heat dissipation more quickly.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
FIG. 1 is a schematically cross-sectional view showing a conventional column-like heat pipe;
FIG. 2 is a schematic illustration showing a heat pipe according to the preferred embodiment the invention;
FIGS. 3A and 3B are schematic illustrations showing the uneven surfaces of the base in FIG. 2;
FIGS. 3C and 3D are two schematic illustrations showing the base and the second wick in the FIG. 2;
FIG. 4 is a schematic illustration showing another heat pipe according to the preferred embodiment of the invention;
FIGS. 5A to 5C are schematic illustrations showing assembling process of a heat pipe of FIG. 4;
FIG. 6A is a schematic illustration showing another sidewall portion of the column-like heat pipe of FIG. 4;
FIG. 6B is a top view of the sidewall portion of the column-like heat pipe of FIG. 6A; and
FIGS. 7A and 7B are two schematic illustrations showing the column-like heat pipe applied into a heat dissipation module according to the preferred embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
Referring to FIG. 2, it is a schematic illustration showing a column-like heat pipe according to the preferred embodiment of the invention. The heat pipe 20 includes a main body 22, a base 28, a first wick 26 a and a working fluid W. The main body 22 has a top portion 224 and a sidewall portion 222 disposed around the top portion 224 and the sidewall portion 222, the top portion 224 may be integrally formed as a single piece, i.e. the main body 22. When the base 28 and the main body 22 are assembled, the base 28 and the main body 22 are combined to form a closed chamber, and the base 28 is disposed corresponding to the top portion 224. The working fluid W is filled within the closed chamber.
The base 28 has an uneven surface 281, which is formed with at least one protrusion 282, and the cross section of the protrusion 282 on the uneven surface 281 of the base has a rectangular, semi-circular semi-spherical, arc, triangular, quadrangular or trapezoidal shape. Herein, it is to be noted that the pattern and the number of the protrusion(s) 282 formed on the uneven surface 281 of the base 28 are not particularly limited. As shown in FIG. 3A, there are several protrusions 282 formed on the base 28. As shown in FIG. 3B, there is only one protrusion 282. The protrusions 282 on the base 28 constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern.
The first wick 26 a is disposed on the sidewall portion 222 and top portion 224, and the second wick 26 b is disposed on the uneven surface 281 of the base 28 and connected to the first wick 26 a. Referring to FIG. 3C, it is a schematic illustration showing the base and the second wick of FIG. 2. The second wick 26 b is disposed along the profile of the uneven surface 281 of the base 28. The second wick 26 b has a uniform thickness or a varied thickness. It is to be noted that the pattern and the number of the protrusion(s) formed on the uneven surface 281 of the base 28 are not particularly limited. For example, in FIG. 3C, several protrusions 282 are disposed on the base 28, but there is only one single protrusion 282 disposed on the base, as shown in FIG. 2.
In FIG. 3D, it is a schematic illustration showing another base and the first wick disposed thereon. The second wick 26 b is disposed over the uneven surface 281 of the base 28 such that the second wick 26 b facing the top portion 224 forms a plane. The second wick 26 b has a first thickness H1 and a second thickness H2 which is relatively smaller than the first thickness H1 in a direction perpendicular to the base 28. The first thickness H1 is the thickness of the second wick 26 b on the uneven surface 281 of the base 28 without any protrusion 282. The second thickness H2 is the thickness of the second wick 26 b on the uneven surface 281 with the protrusion 282. It is to be noted that the pattern and the number of the protrusion(s) formed on the inner surface of the base are not particularly limited. That is to say, the several protrusions 282 are formed on the base 28 in FIG. 3D is taken as an example, which is different from that of FIG. 2 only illustrating the single protrusion 282 for the purpose of clarity.
When the heat pipe 20 is actually used, the base 28 directly contacts a heat source (not shown) located below the heat pipe 20 so as to conduct the heat, which is generated by the heat source, away from the heat source. Alternatively, the heat pipe 20 may contact the heat source through an external carrier (not shown) located below the heat pipe 20 and above the heat source. When the heat pipe 20 is disposed above the heat source, the working fluid at the second wick 26 b (i.e., the evaporating end) near the heat source absorbs the heat generated by the heat source and becomes a vaporized working fluid. The vaporized working fluid flows to the condensing end naturally under the action of the pressure difference, and then releases the latent heat at the first wick 26 a (i.e., the condensing end B) of the end away from the heat source and becomes the liquid working fluid. The liquid working fluid W flows back to the evaporating end by the capillary force provided by the second wick 26 b. The circulation repeats to continuously dissipate heat of the heat source.
Because the main body 20 and the bases 28 are two separate components, the uneven surface 281 of the base 28 can be manufactured to form an uneven surface easily, so that the contact area between the base 28 and the second wick 26 b is increased to enhance the evaporating efficiency of heat pipe 20. Moreover, the first wick 26 a disposed on the sidewall portion of the main body 22 and the second wick 26 b disposed on the uneven surface 281 of the base 28 are disposed separately so as to enlarge the exposed surface area of the wick and to enhance the evaporating efficiency of the working fluid W and thus to enhance the heat dissipation performance of the heat pipe 20 at the evaporating end.
The main body 22 and the base 28 are made of a material with high thermal conductivity, such as Copper, silver, aluminum or alloy thereof. The first wick 26 a and the second wick 26 b may be made by plastic material, a metallic material, an alloy and a porous non-metallic material, and formed by way of sintering, adhering, filling and depositing or any combinations thereof. The working fluid W may be an inorganic compound, pure water, alcohol, ketone, liquid metal, refrigerant, an organic compound or any mixtures thereof.
The sidewall portion 222 and the top portion 224 may be integrally formed as a single piece and combined together to form the main body 22. Alternatively, the sidewall portion 222 has a shape of hollow tube, the sidewall portion 222 and the top portion 224 may be two separate components and be further combined together to form the main body 22. Refer to FIGS. 4, and 5A to 5C, another column-like heat pipe 40 is disclosed including a main body 42, a base 48, a first wick 46 a and a working fluid W.
The main body 42 has a top portion 424 and a sidewall portion 422 disposed around the top portion 424. Different from the previously mentioned heat pipe 20 of FIG. 2, the sidewall portion 422 and the top portion 424 of the main body 42 are two separate components, which are connected by way of welding, embedding, engaging or adhering to form a main body 42. Then, the first wick 46 a is disposed on the inner surfaces of the sidewall portion 422 and top portion 424, while the second wick 46 b is disposed on the uneven surface of the base 48. After the wicks are combined, the base 48 and the main body 42 are combined together, which makes a closed chamber in the heat pipe 40. The heat pipe 40 may have the same technological features as those of the heat pipes 20 of FIG. 2, and detailed descriptions thereof will be omitted.
In addition to the configuration of the uneven surface of the base 28, 48, it is feasible to configure the inner surface of the top portion or the inner surface of the sidewall portion of the main body 22 into uneven surfaces so as to enlarge the exposed surface area of the second wick 26 b. That is, the inner surface of the top portion 224 and/or 424 or the inner surface of the sidewall portion 222 and/or 422 may have even or uneven profiles.
As shown in FIG. 4, the inner surface of the top portion 424 is formed with a plurality of protrusions, and the protrusions may constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern. The first wick 46 a is disposed on the inner surface of the top portion 424 such that the first wick 46 a facing the base 48 forms a plane, and the first wick 46 a has a third thickness H3 and a fourth thickness H4 relatively smaller than the third thickness H3 in a direction perpendicular to the top portion 424.
Referring to FIG. 6A, it is a schematic illustration showing another sidewall portion of the column-like heat pipe of FIG. 4. As shown in the example of FIG. 6A, the base 68 and the sidewall portion 622 have uneven surfaces. Similar to the bases 28, 48 of FIGS. 2 and 4, the uneven surface of the base 68 and the inner surface of the sidewall portion 622 are respectively formed with at least one protrusion 682 a and at least one protrusion 682 b. The cross section of the protrusion 682 b on the sidewall portion 622 constitutes a sawtooth ring pattern (FIG. 6B), a continuous semi-circular pattern or any other patterns constituted by the equivalent structure. FIG. 6B is a top view showing the sidewall portion of the column-like heat pipe of FIG. 6A. Herein, it is to be noted that the patterns and numbers of the protrusions 682 a and 682 b formed on the uneven surface 681 of the base 68 and the inner surface of the sidewall portion 622 are not particularly limited. One single protrusion or multiple protrusions may be formed. Multiple protrusions 682 a on the base 68 constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern.
Similar to the disposed way of the first wick 26 a and the second wick 26 b of FIG. 2, the first wick 66 a is disposed on the inner surface of the sidewall portion 622 and the inner surface of the top portion 624, and the second wick 66 b is disposed on the uneven surface of the base 68 and connected to the first wick 66 a. The second wick 66 b is disposed along the profile of the uneven surface of the base 68 and the second wick 66 b has an even shape or an uneven shape. Alternatively, the second wick 66 b is disposed on the uneven surface of the base 68, such that the second wick 66 b faces to the top portion 624 to form a plane. The second wick 66 b has a first thickness H1 and a second thickness H2 in a direction perpendicular to the base 68. The first thickness H1 is relatively greater than the second thickness H2. The first thickness H1 is the thickness of the second wick 66 b on the uneven surface 681 of the base 68 without any protrusion 682 a. The second thickness H2 is the thickness of the second wick 66 b on the uneven surface 681 with the protrusion 682 a as shown in FIG. 6A. The first wick 66 a on the sidewall portion 622 can have the same technical feature with the second wick 66 b, the detailed description is omitted.
Referring to FIGS. 7A and 7B, there are two schematic illustrations showing column-like heat pipe applied into two heat dissipation modules according to the preferred embodiment of the invention. The heat dissipation module 50A and 50B may be applied to a heat source (not shown), and the heat pipe 20 contacts the heat source directly or indirectly through an external carrier. The heat source is an electronic element, such as a CPU (Central Processing Unit), a transistor, a server, an advanced graphics card, a hard disk, a power supply, a mobile control system, a multimedia electronic mechanism, a wireless communication transceiver station or an advanced game machine, which emits the heat. In addition, the heat dissipation module 50A, 50B may further be combined with a fan to dissipate heat, which is conducted by the heat dissipation module 50A, 50B, more quickly.
In FIG. 7A, the heat dissipation module 50A includes a heat pipe 20 and a plurality of heat dissipation fins 52 a. The heat pipe 20 may have the same technical feature of the FIG. 2, and the detailed description thereof is omitted. The fins 52 a, 52 b are manufactured by way of aluminum extrusion, pressing or other methods and are disposed around the heat pipe 20 and connected to the heat pipe 20. The fins 52 a, 52 b are connected to the heat pipe 20 by way of welding, embedding, engaging or adhering. The fins 52 a, 52 b may directly contact the heat pipe 20, or a soldering paste, a grease or a material capable of serving as a thermal conductive interface may be coated between the fins 52 a, 52 b and the heat pipe 20.
Multiple fins 52 a are disposed around the heat pipe 20 in radial distribution and connected to the heat pipe 20. The heat pipe 20 is embedded in and/or engaged with the fins 52 a, such as the heat pipe 20 is passed through by the fins 52 a. Alternatively, as shown in FIG. 7B, multiple fins 52 a may be disposed in a horizontal interval distribution. However, the distribution of the fins 52 a or 52 b are taken for examples, the invention is not limited by these. The fins 52 a, 52 b also can be a vertically interval distribution, a slantingly interval distribution, or other distributions.
In the heat dissipation module and the heat pipe thereof according to the embodiments, the heat dissipation module and the heat pipe thereof have advantages of low cost and simple manufacture procedures. Besides, the sidewall portion and the top portion of the main body are integrally formed or may be tightly fit with each other, and then the second wicks are simultaneously disposed on the inner surfaces of the sidewall portion and the top portion. Because the wicks on the sidewall portion and the top portion are continuous, the working fluid condensed at the wick on the top portion can flow to the wick on the sidewall portion smoothly. Thus, the invention not only solves the problems of poor connection between the sidewall portion and the top cover of the conventional column-like heat pipe in the prior art, but also effectively enlarges the heat exchanging area of the column-like heat pipe and thus enhances the overall heat dissipation efficiency.
Moreover, the main body and the bases are two separate components, and the uneven surface of the base can be manufactured to form an uneven surface easily, so that the contact area between the base and the second wick is enlarged to enhance the evaporating efficiency of heat pipe. In addition, the first wick disposed on the sidewall portion of the main body and the second wick disposed on the uneven surface of the base are disposed separately, so it is easy to form a wick with uniform or varied thickness to enlarge the surface area of the wick and to enhance the evaporating efficiency of the working fluid and thus to enhance the heat dissipation performance of the heat pipe at the evaporating end.
Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.

Claims

1. A heat pipe, comprising:

a main body comprising a top portion and a sidewall portion disposed around the top portion;

a base disposed corresponding to the top portion and having an uneven surface facing the top portion wherein the base and the main body are combined to form a closed chamber,

a first wick disposed on the sidewall portion and the top portion;

a second wick disposed on the base and connected to the first wick; and

a working fluid filled within the closed chamber.

2. The heat pipe according to claim 1, wherein the sidewall portion and the top portion are integrally formed as a single piece, or the sidewall portion and the top portion are two separate components and are combined to form the main body.

3. The heat pipe according to claim 1, wherein the uneven surface of the base is formed with at least one protrusion.

4. The heat pipe according to claim 3, wherein a cross section of the protrusion on the uneven surface of the base has a semi-spherical, arc, triangular, quadrangular, rectangular or trapezoidal shape.

5. The heat pipe according to claim 1, wherein the uneven surface of the base is formed with a plurality of protrusions, and the protrusions constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern.

6. The heat pipe according to claim 1, wherein the second wick is disposed over the uneven surface of the base such that the second wick facing the top portion forms a plane, and the second wick has a first thickness and a second thickness relatively smaller than the first thickness in a direction perpendicular to the base.

7. The heat pipe according to claim 1, wherein the second wick is disposed on the uneven surface of the base along a profile of the base, and the second wick has a uniform thickness or a varied thickness.

8. The heat pipe according to claim 1, wherein an inner surface of the top portion of the main body has an even shape, or an inner surface of the top portion of the main body has an uneven shape and is formed with at least one protrusion.

9. The heat pipe according to claim 8, wherein the inner surface of the top portion is formed with a plurality of protrusions, and the protrusions constitute a checkerboard pattern, an array pattern, a symmetrical pattern or an asymmetrical pattern.

10. The heat pipe according to claim 1, wherein the first wick is disposed on an inner surface of the top portion such that the first wick facing the base forms a plane, and the first wick has a third thickness and a fourth thickness relatively smaller than the third thickness in a direction perpendicular to the top portion.

11. The heat pipe according to claim 10, wherein the first wick is disposed on the inner surface of the top portion along a profile of the top portion, and the first wick has a uniform thickness or a varied thickness.

12. The heat pipe according to claim 1, wherein an inner surface of the sidewall portion of the main body has an uneven shape and is formed with at least one protrusion.

13. The heat pipe according to claim 12, wherein the inner surface of the sidewall portion of the main body is formed with a plurality of protrusions and a cross section of the sidewall portion constitutes a sawtooth ring pattern or a continuous semi-circular pattern.

14. The heat pipe according to claim 12, wherein the first wick is disposed on the inner surface of the sidewall portion such that the first wick facing the closed chamber forms a plane.

15. The heat pipe according to claim 14, wherein the first wick is disposed along a profile of the inner surface of the sidewall portion, and the first wick has a uniform thickness or a varied thickness.

16. The heat pipe according to claim 1, wherein the base has a circular, rectangular or other shape.

17. A heat dissipation module, comprising:

a heat pipe comprising a main body, a base, a first wick, a second wick and a working fluid, wherein the base and the main body are combined to form a closed chamber, the base has an uneven surface, the second wick is connected to the first wick, the first wick and the second wick are disposed on an inner surface of the main body; and the working fluid is filled in the closed chamber; and

a plurality of fins disposed around the heat pipe.

18. The heat dissipation module according to claim 17, wherein the main body comprises a top portion and a sidewall portion disposed around the top portion, the base is disposed corresponding to the top portion, the uneven surface of the base faces the top portion, and the first wick is disposed on the top portion and the sidewall portion of the main body.

19. The heat dissipation module according to claim 17, wherein the fins are arranged in a horizontal interval distribution, a vertically interval distribution, a slantingly interval distribution or a radial distribution.

20. The heat dissipation module according to claim 17, wherein the fins are formed by way of aluminum extrusion or pressing.