US20070041190A1 - Bottom lighting module - Google Patents
Bottom lighting module Download PDFInfo
- Publication number
- US20070041190A1 US20070041190A1 US11/267,511 US26751105A US2007041190A1 US 20070041190 A1 US20070041190 A1 US 20070041190A1 US 26751105 A US26751105 A US 26751105A US 2007041190 A1 US2007041190 A1 US 2007041190A1
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- US
- United States
- Prior art keywords
- face
- pcb
- lighting module
- led
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
Description
- The present invention relates to a bottom lighting module, more particularly to an LED light source of the bottom lighting module.
- Nowadays, the liquid crystal displays (LCD) are generally used in all kind of information displays. The main structure of the LCD can comprise a panel module and a back light module. The panel module roughly comprises an Indium Tin Oxide (ITO) conductive glass substrate, a liquid crystal layer, an alignment film, color filters, polarizing sheets and a driver integrated circuit. The back light module mainly comprises a light source, a light guide plate, a prism sheet, a reflection sheet, a diffusion sheet and various optical sheets. The back light module is to provide the light source to the LCD. Generally, the performance of the LCD reflects the quality of every individual element. For example, the back light module plays an important role in the screen's brightness, intensity, contrast and visual angle.
- The back light module can be generally classified into an extremity type and a bottom type, based on the light source. The light source of the extremity type is located at the side face of the back light module and thereby the thickness of the back light module can be reduced. In the market now, most light sources of the LCDs belong to this type of back light module. On the other hand, the light source of the bottom type is located under the back light module and thus better even brightness can be obtained. For the bottom type can provide a larger mounting space, it can contain more light sources and is suitful to be applied to the display requiring higher brightness and wider visual angle.
- Due to rapid advance in the electronic manufacture technology, a recent breakthrough in the light effect of the LED can greatly help to improve the display ability of the LCD screens. Technically speaking, it is hoped that, by the year 2005, the light effect of the LED can exceed that of the cold cathode tube. Due to its swift response and feature in emitting visible light such as red, blue and green, the LED has a great opportunity to play a leading role in the light source of the LCD industry.
- Referring to
FIGS. 1A and 1B ,FIG. 1A is an exploded view of a bottom lighting module with a conventional LED, andFIG. 1B is an cross-sectional view of the bottom lighting module ofFIG. 1A in an assembled state. Theback light module 1 comprises aPCB 10, a plurality of light-emitting diodes (LEDs) 14 and aheat sink 16. The PCB 10 has afirst face 101, asecond face 102 opposing to thefirst face 101, and ahole 103 connecting spatially thefirst face 101 and thesecond face 102. - The
LED 14 disposed in thehole 103 comprises a light-emittingportion 141 and an LED-base 142. The LED-base 142 is inserted into therespective hole 103 to leave the light-emittingportion 141 above thePCB 10. The LED-base 142 comprises at least twoelectrodes 143 connected to thesecond face 102 of thePCB 10. For the twoelectrodes 143 electrically connects with thePCB 10, thePCB 10 can control to theLED 14. - The
heat sink 16 comprises amain body 161 and a plurality offins 162. One side of themain body 161 is set under thesecond face 102 of thePCB 10, while another face is used to form thefins 162. Theheat sink 16 is usually made of a heat conduction material like aluminum or copper. Further, aheat sink medium 17 is accommodated in the sealed space formed between theheat sink 16 and thesecond face 102 of thePCB 10. Theheat medium 17 is used to transport the heat generated by the LED-base 142 to theheat sink 16. - As illustrated in
FIG. 1B , theback light module 1 uses ascrew 19 to fasten firmly thePCB 10 and theheat sink 16. The PCB 10 has at least oneaperture 122 for thescrew 19 to penetrate downward through thePCB 10. - As illustrated in
FIG. 2 , a top view ofFIG. 1B with theheat sink 16 locking firmly to thePCB 10 by thescrew 19 is shown. Thefirst face 101 of thePCB 10 has a plurality ofholes 103 for inserting therespective LEDs 14. - As described above in
FIG. 2 , thePCB 10 needs to form a plurality ofholes 103 in advance so that a corresponding number of theLEDs 14 can be inserted into theholes 103 one by one. In this process, using a mill machine to fabricate theholes 103 is usually expensive. Therefore, how to lessen above cost problem is deserved to discuss. - In addition, the connection way by screwing causes another drawback that affects light efficiency of the back light module. In the
back light module 1, thefirst face 101 of thePCB 10 is usually adhered by areflection sheet 18 and located under adiffusion sheet 15 that spaces from thereflection sheet 18 by a predetermined spacing. The light of theLED 14 would have a mixing effect in the sealed space formed between thereflection sheet 18 and thediffusion sheet 15 - Hence, when the
screw 19 integrates firmly thePCB 10 and thereflection sheet 18, theLED 14 emits the light to thediffusion sheet 15 and the LED light will reflect between thereflection sheet 18 and thediffusion sheet 15. However, the slit area around thescrew 19 makes thereflection sheet 18 area piece-wise and would make the reflective LED light uneven. Definitely, the brightness and color of the light of theback light module 1 in accordance with the present invention would be greatly affected. - The object of the present invention is to provide a back lighting module, which has the LED as the light source of the bottom light module.
- In accordance with the present invention, a bottom lighting module can comprise a PCB, a reflection sheet and a plurality of light-emitting diodes (LEDs). The PCB has a first face, a second face opposing to the first face, and an opening connecting spatially the first face and the second face. The reflection sheet is disposed on the first face and has a plurality of holes. At least two of the holes are located in a predetermined range of the opening. Each LED disposed in one hole and the corresponding opening comprises a light-emitting portion and an LED-base. The LED-base comprises at least two electrodes connected with the second face of the PCB.
- In a preferred embodiment, the bottom lighting module further comprises a heat sink disposed at the side of the second face and contacted with the LED-base. Also, the module further comprises a first combiner (a nut for example) and a second combiner (a screw for example), that the first combiner (nut) is secured on the second face. By engaging the first combiner (nut) and the second combiner (screw), the heat sink in between can be firmly sandwiched. The LED-base has an around section which is set on the second face for holding the PCB. In addition, a heat-dissipation paste is used to hold together the heat sink and the LED-base.
- In a preferred embodiment, the PCB includes at least two PCBs, in which a space between these two PCBs are formed as the opening. In another embodiment, the PCB includes a single PCB and the opening is formed in the PCB. The opening has a first trough-wall and a second trough-wall for holding a plurality of LEDs. The PCB can be an island shape, a fin shape or an I-shape.
- Other features and advantages of this invention will become more apparent in the following detailed description of the preferred embodiments of this invention, with reference to the accompanying drawings, in which:
-
FIG. 1A is an exploded view of a conventional bottom lighting module having LEDs as the light source; -
FIG. 1B is a lateral view of theFIG. 1A in an assembled state; -
FIG. 2 is a top view of the LEDs in the conventional bottom lighting module resembling that inFIG. 1A or 1B; -
FIG. 3 is an exploded view of a preferred bottom lighting module according to the present invention; -
FIG. 4 is a fragmentary sectional view ofFIG. 3 in an assembled state according to the present invention; -
FIG. 5A is a top view of the LEDs as well as the PCB in another preferred embodiment according to the present invention, in which the PCB is formed as an island shape; -
FIG. 5B is a top view of the LEDs as well as the PCB in a further embodiment according to the present invention, in which the PCB is formed as a fin shape; and -
FIG. 5C is a top view of the LEDs as well as the PCB in one more embodiment according to the present invention, in which the PCB is formed as an I-shape. - Referring to
FIG. 3 , an exploded view of a preferred bottom lighting module according to the present invention is shown. Thebottom lighting module 2 comprises aPCB 20, areflection sheet 22 and a plurality ofLEDs 24. ThePCB 20 has afirst face 201, asecond face 202 opposing to thefirst face 201, and at least aopening 203 connecting spatially thefirst face 201 and thesecond face 202. - The
LEDs 24 can be connected on thePCB 20. Thereflection sheet 22 adhered to thefirst face 201 of thePCB 20 has a plurality ofholes 221 to exposerespective LEDs 24. As shown, eachopening 203 is accounted for at least twoholes 221 of the reflection sheet 22 (threeholes 221 for eachopening 22 inFIG. 3 ). - Each
LED 24 disposed in onerespective hole 221 and thecorresponding opening 203 comprises a light-emittingportion 241 and an LED-base 242. The light-emittingportion 241 is located on thefirst face 201 of thePCB 20. Due to the LED-base 242 is the major heat source, so the LED-base 242 is purposely located under thesecond face 202 of thePCB 22. Upon such an arrangement, the heat generated at the LED-base 242 will not influence the light efficiency over thefirst face 201 of thePCB 20. Except for helping the light from theLED 24 to mix evenly before emitted out of thebottom lighting module 2, thereflection sheet 22 can also provide auxiliary support to locate and hold theLEDs 24 in theopening 203. - Referring to
FIG. 4 , a fragmentary sectional view ofFIG. 3 in an assembled state according to the present invention is shown. The LED-base 242 comprises at least twoelectrodes 243 connected with thesecond face 202 of thePCB 20. Eachelectrode 243 bridges electrically theLED 24 and thePCB 20. Also, a bonus of theelectrodes 243 is to solidly connect theLED 24 and thePCB 20. In this embodiment, the LED-base 242 has anaround section 244 to touch thesecond face 202 and thus to hold or support thePCB 20. - The
bottom lighting module 2 further comprises aheat sink 26. Theheat sink 26 comprises amain body 261 and a plurality ofheat sink fins 262. The upper side 261 (i.e. the main body 261) of theheat sink 26 is set under thesecond face 202 of thePCB 20, while the lower side of theheat sink 26 is formed as theheat sink fins 262. Theheat sink 26 can be made of a material with a high heat-conduction property such as the aluminum or the copper. In addition, a layer of heat-dissipation medium 271 such as a heat-dissipation paste or a soft heat-conduction gluing material can be applied between theheat sink 26 and thesecond face 202 of thePCB 20 for enhancing the heat transportation from the LED-base 242 to theheat sink 26. Preferably, theheat medium 271 can be disposed under thesecond face 202 and contact the LED-base 242 ofLED 24. - The
bottom lighting module 2 comprises a first combiner, anut 28 for example, and a second combiner to engage with the first combiner, ascrew 29 for example. The first combiner (nut 28) disposed at thesecond face 202 is used to aheat sink 26 disposed under thesecond face 202 so as to contact the LED-base and sandwiched between the first combiner (screw 29) and the second combiner. The first combiner (nut 28) can be tight disposed in advance at thesecond face 202 of thePCB 20 by embedding or welding. As shown, theheat sink 26 can have vertical drilled holes for the respective second combiners (screws 29) to pass and to further engage with the corresponding holes of the first combiners (nuts 28). - Moreover, the
bottom lighting module 2 further comprises aback bezel 21. Theback bezel 21 comprises abase 211 and asidewall 2111. Thebase 211 is set under theheat sink 26 and thesidewall 2111 is to support and thus accommodate inside thereflection sheet 22, thePCB 20 and theheat medium 271. Thebase 211 and thesidewall 2111 can be integrated as a one piece or separated to different pieces. Thebase 211 and theheat sink 26 can be held firmly by screws. Theheat sink 26 can be a heat fin, a heat pipe assembly, or a fan device. - By utilizing the difference between the reflectivity of the diffusing
plate 212 and that of the air, part of the light hitting the diffusingplate 212 can be reflected reciprocally between the diffusingplate 212 and thereflection sheet 22 so as to thoroughly mix the light emitted by theLEDs 24. Upon such an arrangement, the light leaving the diffusingplate 212 can have homogeneous brightness and color-ness. - In another embodiment of the present invention, the
PCB 20 can be consisted of at least twoPCBs 200, arranged side by side, as shown inFIG. 5A (threePCBs 200 in the figure) and the space formed between any twoadjacent PCBs 200 can be arranged as theopening 203. Theopening 203 then has a first trough-wall 2031 accounting for onePCB 200 and a second trough-wall 2032 accounting for anotherPCB 200 to hold a plurality ofLEDs 24 therein. In the present invention, thePCB 200 can be an island shape (as shown inFIG. 5A ), a fin shape (as shown inFIG. 5B ), an I-shape (as shown inFIG. 5C ) or any other relevant shape. Theopening 203 can be a simple hole as that shown inFIG. 3 , a open slot formed by twoadjacent PCBs 200 as shown inFIG. 5A , a one-end-open slot as shown inFIG. 5B or 5C. - The merits from adopting the second combiner (screw) and the opening according to the present invention are as follows.
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- 1. Easy manufacturing of the openings of the PCB.
- 2. By providing the holes of the reflection sheet, locating of the LEDs can be much convenient.
- 3. By locating the second combiner (screw) to the second face of the PCB, lighting above the first face will not be affected.
- To sum up, the bottom lighting module of the present invention provides a simple design of opening to improve the drawbacks of making holes in the convention technology.
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW094128093 | 2005-08-17 | ||
TW094128093A TWI333576B (en) | 2005-08-17 | 2005-08-17 | Bottom lighting module |
Publications (2)
Publication Number | Publication Date |
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US7175329B1 US7175329B1 (en) | 2007-02-13 |
US20070041190A1 true US20070041190A1 (en) | 2007-02-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/267,511 Active US7175329B1 (en) | 2005-08-17 | 2005-11-07 | Bottom lighting module |
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US (1) | US7175329B1 (en) |
TW (1) | TWI333576B (en) |
Cited By (22)
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US20060139947A1 (en) * | 2004-12-28 | 2006-06-29 | Innolux Display Corp. | Diffusion plate and backlight module using the same |
US20060215420A1 (en) * | 2005-03-25 | 2006-09-28 | Au Optronics Corp. | Direct backlight module |
US20070109788A1 (en) * | 2005-11-11 | 2007-05-17 | Pan Bor-Jyh | Backlight module |
US20080158882A1 (en) * | 2006-12-30 | 2008-07-03 | Pei-Choa Wang | Light Source Structure Of Backlight Module |
US20080259609A1 (en) * | 2007-04-20 | 2008-10-23 | Hon Hai Precision Industry Co., Ltd. | Led lamp assembly |
US20080274641A1 (en) * | 2007-05-01 | 2008-11-06 | Tyco Electronics Corporation | Led connector assembly with heat sink |
US20090015134A1 (en) * | 2007-07-13 | 2009-01-15 | Kai-Yu Lin | Heat dissipation arrangement of a light emitting module |
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US20090146918A1 (en) * | 2007-12-11 | 2009-06-11 | Kline Daniel S | Large scale LED display |
US20090146919A1 (en) * | 2007-12-11 | 2009-06-11 | Kline Daniel S | Large Scale LED Display |
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US7470034B2 (en) * | 2006-03-29 | 2008-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light guide with indirect light source |
US8596845B2 (en) | 2006-06-30 | 2013-12-03 | Dialight Corporation | Apparatus for using heat pipes in controlling temperature of an LED light unit |
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TWI333576B (en) | 2010-11-21 |
US7175329B1 (en) | 2007-02-13 |
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