US20070008699A1 - Method and apparatus for regulating airflow in a chassis - Google Patents
Method and apparatus for regulating airflow in a chassis Download PDFInfo
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- US20070008699A1 US20070008699A1 US11/178,530 US17853005A US2007008699A1 US 20070008699 A1 US20070008699 A1 US 20070008699A1 US 17853005 A US17853005 A US 17853005A US 2007008699 A1 US2007008699 A1 US 2007008699A1
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- regulator
- support frame
- airflow
- heat producing
- coupled
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present disclosure relates generally to information handling systems, and more particularly to a method and apparatus for regulating airflow in an information handling system chassis.
- An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- Information handling systems typically include a chassis which houses a variety of heat producing components. As these heat producing components provide various functions of the information handling system, they heat up, which can affect their performance and the performance of other components of the information handling system. The cooling of these components raises a number of issues.
- Conventional cooling solutions for information handling systems generally include at least one fan which either draws or pushes air past the heat producing component in order to cool it off.
- some information handling systems may include spaces in the chassis where there are no heat producing components.
- blanks are then installed in those spaces in the chassis which have no heat producing components, such that substantially all of the airflow from the fan will be moving over hot heat producing components rather than through empty spaces in the information handling system chassis.
- the blank when a heat producing component is added to the information handling system, the blank must be manually removed and then is generally disposed of. If that heat producing component is then later removed, either a new blank must be found and manually reinstalled in the information handling system chassis, or else the information handling system risks being damaged due to the lack of a blank in the information handling system chassis and a less than optimal airflow over the hot heat producing components in the information handling system chassis.
- an airflow regulating apparatus which includes a support frame for coupling to a chassis adjacent a heat producing component connector, the support frame defining a regulator channel, and also includes an airflow regulator moveably coupled to the support frame and operable to be positioned in the regulator channel.
- FIG. 1 is a schematic view illustrating an embodiment of an information handling system.
- FIG. 2 a is a perspective view illustrating an embodiment of a support frame.
- FIG. 2 b is a perspective view illustrating an embodiment of the support frame of FIG. 2 a.
- FIG. 2 c is a top view illustrating an embodiment of the support frame of FIG. 2 a.
- FIG. 2 d is a cross sectional view illustrating an embodiment of the support frame of FIG. 2 a.
- FIG. 3 a is a perspective view illustrating an embodiment of an airflow regulator used with the support frame of FIG. 2 a.
- FIG. 3 b is a perspective view illustrating an embodiment of the airflow regulator of FIG. 3 a.
- FIG. 3 c is a perspective view illustrating an embodiment of the airflow regulator of FIG. 3 a being coupled to the support frame of FIG. 2 a.
- FIG. 3 d is a cross sectional view illustrating an embodiment of the airflow regulator of FIG. 3 a coupled to the support frame of FIG. 2 a.
- FIG. 3 e is a cross sectional view illustrating an embodiment of the airflow regulator of FIG. 3 a coupled to the support frame of FIG. 2 a and biased into a regulator channel.
- FIG. 4 is a perspective view illustrating an embodiment of a heat producing component used with the support frame and airflow regulator of FIG. 3 d.
- FIG. 5 a is a perspective view illustrating an embodiment of a board used with the support frame and airflow regulator of FIG. 3 d and the heat producing component of FIG. 4 .
- FIG. 5 b is a perspective view illustrating an embodiment of the board of FIG. 5 a with the fan modules removed for clarity.
- FIG. 6 a is a flow chart illustrating an embodiment of a method for regulating airflow in a chassis.
- FIG. 6 b is a perspective view illustrating an embodiment of the heat producing component of FIG. 4 being coupled to the board of FIG. 5 b.
- FIG. 6 c is a perspective view illustrating an embodiment of the heat producing component of FIG. 4 coupled to the board of FIG. 5 b.
- FIG. 6 d is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d being coupled to the board and heat producing of FIG. 6 c.
- FIG. 6 e is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d coupled to the board and heat producing of FIG. 6 c.
- FIG. 6 f is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d coupled to the board and heat producing of FIG. 6 c with the fan modules illustrated.
- FIG. 6 g is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d being coupled to the board of FIG. 5 b.
- FIG. 6 h is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d coupled to the board of FIG. 5 b.
- FIG. 6 i is a perspective view illustrating an embodiment of the support frame and airflow regulator of FIG. 3 d coupled to the board of FIG. 5 b with the fan modules illustrated.
- FIG. 7 a is a perspective view illustrating an alternative embodiment of a support frame.
- FIG. 7 b is a perspective view illustrating an alternative embodiment of a board including a plurality of the heat producing components of FIG. 4 and used with the support frame of FIG. 7 a.
- FIG. 7 c is a perspective view illustrating the support frame of FIG. 7 a coupled to the board of FIG. 7 b.
- an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes.
- an information handling system may be a personal computer, a PDA, a consumer electronic device, a network server or storage device, a switch router or other network communication device, or any other suitable device and may vary in size, shape, performance, functionality, and price.
- the information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic.
- CPU central processing unit
- Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display.
- the information handling system may also include one or more buses operable to transmit communications between the various hardware components.
- information handling system 100 includes a microprocessor 102 , which is connected to a bus 104 .
- Bus 104 serves as a connection between microprocessor 102 and other components of computer system 100 .
- An input device 106 is coupled to microprocessor 102 to provide input to microprocessor 102 . Examples of input devices include keyboards, touchscreens, and pointing devices such as mouses, trackballs and trackpads.
- Programs and data are stored on a mass storage device 108 , which is coupled to microprocessor 102 .
- Mass storage devices include such devices as hard disks, optical disks, magneto-optical drives, floppy drives and the like.
- Information handling system 100 further includes a display 110 , which is coupled to microprocessor 102 by a video controller 112 .
- a system memory 114 is coupled to microprocessor 102 to provide the microprocessor with fast storage to facilitate execution of computer programs by microprocessor 102 .
- a chassis 116 houses some or all of the components of information handling system 100 . It should be understood that other busses and intermediate circuits can be deployed between the components described above and microprocessor 102 to facilitate interconnection between the components and the microprocessor.
- the support frame 200 includes an elongated base member 202 having a pair of opposing sides 202 a and 202 b, a front edge 202 c extending between the sides 202 a and 202 b, and defining a plurality of heat release apertures 202 d in a spaced apart relationship along the length of the support frame 200 .
- a leg 204 extends from the base member 202 and is located adjacent the side 202 b of the base member 202 .
- a leg 206 extends from the base member 202 , is located adjacent the side 202 a of the base member 202 and in a substantially parallel and spaced apart relationship from leg 204 .
- a wall 208 extends from the base member 202 and is located adjacent the leg 206 such that the leg 206 and the wall 208 define a regulator channel 210 between the leg 206 and the wall 208 .
- the regulator channel 210 includes a regulator stop edge 210 a which defines an upper end of the regulator channel 210 extending between the leg 206 and the wall 208 .
- the wall 208 , the base member 202 , and the leg 204 define a component channel 212 located between them and adjacent the regulator channel 210 .
- the base member 202 , the leg 206 , and the wall 208 define a regulator passageway 214 extending along the length of the leg 206 , through a portion of the base member 202 , along a portion of the wall 208 , and located above the regulator channel 210 .
- a plurality of regulator couplers 214 a, 214 b, and 214 c extend from the leg 206 and into the regulator passageway 214 .
- the regulator couplers 214 a and 214 b are located on opposite sides of the regulator passageway 214 and adjacent an end of the regulator channel 210
- the regulator coupler 214 c is located adjacent an end of the regulator channel 210 opposite the regulator couplers 214 a and 214 b.
- a chassis coupler 216 a extends from an upper portion of the leg 206 and adjacent the side 202 a of the base member 202
- a chassis coupler 216 b extends from the side 202 a of the base member 202 in a spaced apart relationship from the chassis coupler 216 a.
- a plurality of chassis couplers substantially similar in design and operation to the chassis couplers 216 a and 216 b may be included on the leg 204 and/or the side 202 b of the base member 202 .
- the airflow regulator 300 includes a base 302 having a front edge 302 a, a rear edge 302 b located opposite the front edge 302 a, a top edge 302 c extending between the front edge 302 a and the rear edge 302 b, a bottom edge 302 d extending between the front edge 302 a and the rear edge 302 b and located opposite the top edge 302 c, and a pair of opposing sides 302 e and 302 f extending between the front edge 302 a, the rear edge 302 b, the top edge 302 c, and the bottom edge 302 d.
- a regulator guide 304 a extends from the side 302 e of the base 302 , adjacent to and along the length of the rear end 302 b of the base 302 .
- a regulator guide 304 b extends from the side 302 f of the base 302 , adjacent to and along the length of the rear end 302 b of the base 302 .
- a plurality of regulator securing members 306 a extend from the side 302 e of the base 302 and are located adjacent the bottom edge 302 d of the base member 302 .
- a plurality of regulator securing members 306 b extend from the side 302 f of the base 302 and are located adjacent the bottom edge 302 d of the base member 302 .
- a regulator guide 308 extends from the side 302 f of the base member 302 in a substantially parallel and spaced apart relationship from the regulator guide 304 b and along the length of the base member 302 .
- the airflow regulator 300 is coupled to the support frame 200 .
- the airflow regulator 300 is positioned above the regulator passageway 214 on support frame 200 and moved in a direction A, as illustrated in FIG. 3c .
- the regulator coupler 214 a becomes positioned between the regulator guides 304 b and 308 ;
- the regulator coupler 214 b becomes positioned adjacent the regulator guide 304 a;
- the front edge 302 a becomes positioned adjacent the regulator guide 214 c, resulting in the coupling of the airflow regulator to the support frame and adjacent the regulator channel 210 .
- the airflow regulator 300 is biased into the regulator channel 210 by gravity, as illustrated in FIG. 3 d.
- the regulator securing members 306 a and 306 b operate to prevent the airflow regulator 300 from being decoupled from the support frame 200 by engaging the regulator stop edge 210 a when the airflow regulator 300 is moved from the regulator channel 210 to the regulator passageway 214 .
- the airflow regulator 300 may be coupled to the support frame 200 in substantially the same manner as described above, with the provision of a resilient member 308 such as, for example, a spring, between the airflow regulator 300 and the support frame 200 which biases the airflow regulator 300 into the regulator channel 210 .
- FIG. 3 e allows the support frame 200 to be used in a variety of orientations while still biasing the airflow regulator 300 into the regulator channel 210 .
- the airflow regulator 300 may be coupled to the support frame 200 in a variety of different manners known in the art such as, for example, pivotally connected.
- Heat producing component 400 includes a base 402 having a front edge 402 a, a rear edge 402 b located opposite the front edge 402 a, a top edge 402 c extending between the front edge 402 a and the rear edge 402 b, a bottom edge 402 d extending between the front edge 402 a and the rear edge 402 b and located opposite the top edge 402 c, and a pair of opposing sides 402 e and 402 f extending between the front edge 402 a, the rear edge 402 b, the top edge 402 c, and the bottom edge 402 d.
- a connector coupler 404 extends from the bottom edge 402 d of the base member 402 and is located adjacent the front edge 402 a.
- the heat producing component 400 may be an expansion card, a Dual Inline Memory Module (DIMM), a Voltage Regulator Module (VRM), a heat sink coupled to a heat producing component, and/or a variety of other heat producing components known in the art.
- DIMM Dual Inline Memory Module
- VRM Voltage Regulator Module
- Board 500 includes a base 502 which may be mounted to a chassis such as, for example, the chassis 116 described above with reference to FIG. 1 , and may include components of an information handling system such as, for example, the information handling system 100 described above with reference to FIG. 1 .
- the base 502 includes a heat producing component connector 504 which is mounted to the base 502 and defines a connector slot 504 a along its length.
- a plurality of heat dissipation components 506 a, 506 b, and 506 c are coupled to the base 502 and positioned adjacent the heat producing component connector 504 .
- the heat dissipation components 506 a, 506 b, and 506 c are coupled to heat producing components such as, for example, the microprocessor 102 described above with reference to FIG. 1 , which are mounted to the base 502 .
- a plurality of fan modules 508 a, 508 b, and 508 c are coupled to the board 502 and positioned adjacent the heat dissipation components 506 a, 506 b, and 506 c and the heat producing component connector 504 .
- the board 500 illustrated in FIG. 5 b has the fan modules 508 a, 508 b, and 508 c removed for clarity.
- the method 600 begins at step 602 where a chassis such as, for example, the chassis 116 described above with reference to FIG. 1 , is provided.
- the chassis includes the board 500 , illustrated in FIG. 5 b, mounted to it.
- the providing of a chassis in step 602 includes the coupling of the heat producing component 400 to the board 500 .
- the heat producing component 400 is positioned above the heat producing component connector 504 such that the connector coupler 404 on heat producing component 400 is lined up with the connector slot 504 a on the heat producing component connector 504 , as illustrated in FIG. 6 b.
- the heat producing component 400 is then moved in a direction B such that the connector coupler 404 matingly engages the the connector slot 504 a on the heat producing component connector 504 , as illustrated in FIG. 6 c.
- the method 600 proceeds to step 604 where the support frame 200 is coupled to the board 500 in the chassis.
- the support frame 200 is positioned above the board 500 such that leg 204 is adjacent heat dissipation component 506 c; leg 206 is adjacent heat producing component 400 ; the heat dissipation components 506 a, 506 b, and 506 c are adjacent the component channel 212 ; and the heat producing component 400 is adjacent the regulator channel 210 with the airflow regulator 300 biased into the regulator channel 210 , as illustrated in FIG. 6 d.
- the support frame 200 may be coupled to a wall of the chassis.
- the support frame 200 is then moved in a direction C such that the heat dissipation components 506 a, 506 b, and 506 c enter the component channel 212 on the support frame 200 , and the top edge 402 c of the heat producing component 400 engages the bottom edge 302 d of the airflow regulator.
- Engagement of the heat producing component 400 with the airflow regulator 300 moves the airflow regulator 300 out of the regulator channel 210 and allows the heat producing component 400 to enter the regulator channel 210 , as illustrated in FIG. 6 e.
- the support frame 200 may then be held in place by, for example, coupling the support frame to the board 500 using conventional methods known in the art, and/or by coupling the chassis couplers 216 a and 216 b extending from side 202 a of support frame 200 and the chassis couplers (not shown) extending from side 202 b of the support frame 200 to securing features (not shown) on the chassis.
- step 606 airflow is regulated through the chassis.
- the fan modules 508 a, 508 b, and 508 c engage the front edge of the support frame 200 such that any airflow from the fan modules 508 a, 508 b, and 508 c goes through the support frame 200 .
- the providing of a chassis in step 602 does not includes the coupling of the heat producing component 400 to the board 500 as described above with reference to FIGS. 6 b and 6 c.
- the method 600 proceeds to step 604 where the support frame 200 is coupled to the board 500 in the chassis.
- the support frame 200 is positioned above the board 500 such that leg 204 is adjacent heat dissipation component 506 c; leg 206 is adjacent heat producing component connector 504 ; the heat dissipation components 506 a, 506 b, and 506 c are adjacent the component channel 212 ; and the heat producing component connector 504 is adjacent the regulator channel 210 , with the airflow regulator 300 biased into the regulator channel 210 , as illustrated in FIG. 6 g.
- the support frame 200 may be coupled to a wall of the chassis.
- the support frame 200 is then moved in a direction D such that the heat dissipation components 506 a, 506 b, and 506 c enter the component channel 212 on the support frame 200 , while the airflow regulator 300 remains in the regulator channel 210 , as illustrated in FIG. 6 h.
- the support frame 200 may then be held in place by, for example, coupling the support frame 200 to the board 500 using conventional methods known in the art, and/or by coupling the chassis couplers 216 a and 216 b extending from side 202 a of support frame 200 and the chassis couplers (not shown) extending from side 202 b of the support frame 200 to securing features (not shown) on the chassis.
- step 606 airflow is regulated through the chassis.
- the fan modules 508 a, 508 b, and 508 c engage the front edge of the support frame 200 such that any airflow from the fan modules 508 a, 508 b, and 508 c goes through the support frame 200 .
- the airflow regulator 300 engages the base 502 of the board 500 between the heat producing component connector 504 and the fan modules 508 a, 508 b, and 508 c in order to prevent airflow through the regulator channel 210 .
- a method and apparatus are provided which regulate airflow through the chassis based on whether the heat producing component 400 is coupled to the board 500 .
- the method and apparatus optimizes the airflow through the chassis by preventing airflow through the regulator channel 210 when there is no heat producing component 400 in the regulator channel 210 . Furthermore, the method and apparatus require no manual configuration of the airflow regulator 300 , but rather automatically adjust the position of the airflow regulator based on the decision of a user to couple or decouple a heat producing component 400 with the board 500 .
- Support frame 700 includes a base 702 have a plurality of legs 704 , 706 , 708 , 710 , 712 , and 714 extending from the base 702 .
- a plurality of regulator passageways 704 a, 706 a, 708 a, 710 a, 712 a, and 714 a are defined by the base 702 and the legs 704 , 706 , 708 , 710 , 712 , and 714 , respectively.
- a regulator channel 704 b is defined by the leg 704 , the base 702 , and the leg 706 .
- a regulator channel 706 b is defined by the leg 706 , the base 702 , and the leg 708 .
- a regulator channel 708 b is defined by the leg 708 , the base 702 , and the leg 710 .
- a regulator channel 710 b is defined by the leg 710 , the base 702 , and the leg 712 .
- a regulator channel 712 b is defined by the leg 712 , the base 702 , and the leg 714 .
- a plurality of airflow regulators 300 are coupled to the support frame 200 through respective regulator passageways 704 a, 706 a, 708 a, 710 a, 712 a, and 714 a and biased into respective regulators channels 704 b, 706 b, 708 b, 710 b, 712 b, and 714 b.
- Board 716 includes a base 718 having a plurality of heat producing component connectors 720 a, 720 b, 720 c, 720 d, and 720 e mounted to the base 718 .
- a heat producing component 400 is coupled to the heat producing component connector 720 a and a heat producing component 400 is coupled to the heat producing component connector 720 d in substantially the same manner as described above for coupling the heat producing component 400 to the heat producing component connector 504 , illustrated in FIGS. 6 b and 6 c.
- the board 716 includes a plurality of fan modules coupled to the base 718 which are substantially similar in design and operation to the fan modules 508 a, 508 b, and 508 c described above with respect to FIG. 5 a, and which have been omitted for clarity.
- the support frame 700 is coupled to the board 716 in substantially the same manner as the support frame 200 is coupled to the board 500 , described above with respect to FIGS. 6 d and 6 e.
- the heat producing components 400 coupled to the heat producing component connectors 720 a and 720 d enter the regulator channels 704 b and 710 b by engaging the airflow regulators 300 in regulator channels 704 b and 710 b.
Abstract
Description
- The present disclosure relates generally to information handling systems, and more particularly to a method and apparatus for regulating airflow in an information handling system chassis.
- As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- Information handling systems typically include a chassis which houses a variety of heat producing components. As these heat producing components provide various functions of the information handling system, they heat up, which can affect their performance and the performance of other components of the information handling system. The cooling of these components raises a number of issues.
- Conventional cooling solutions for information handling systems generally include at least one fan which either draws or pushes air past the heat producing component in order to cool it off. However, because information handling systems are designed to allow the addition or removal of components in the information handling system chassis, some information handling systems may include spaces in the chassis where there are no heat producing components. In order to optimize the airflow from the fans through the information handling system chassis, blanks are then installed in those spaces in the chassis which have no heat producing components, such that substantially all of the airflow from the fan will be moving over hot heat producing components rather than through empty spaces in the information handling system chassis.
- However, when a heat producing component is added to the information handling system, the blank must be manually removed and then is generally disposed of. If that heat producing component is then later removed, either a new blank must be found and manually reinstalled in the information handling system chassis, or else the information handling system risks being damaged due to the lack of a blank in the information handling system chassis and a less than optimal airflow over the hot heat producing components in the information handling system chassis.
- Accordingly, it would be desirable to provide a method and apparatus for regulating airflow in a chassis absent the disadvantages found in the prior methods discussed above.
- According to one embodiment, an airflow regulating apparatus is provided which includes a support frame for coupling to a chassis adjacent a heat producing component connector, the support frame defining a regulator channel, and also includes an airflow regulator moveably coupled to the support frame and operable to be positioned in the regulator channel.
-
FIG. 1 is a schematic view illustrating an embodiment of an information handling system. -
FIG. 2 a is a perspective view illustrating an embodiment of a support frame. -
FIG. 2 b is a perspective view illustrating an embodiment of the support frame ofFIG. 2 a. -
FIG. 2 c is a top view illustrating an embodiment of the support frame ofFIG. 2 a. -
FIG. 2 d is a cross sectional view illustrating an embodiment of the support frame ofFIG. 2 a. -
FIG. 3 a is a perspective view illustrating an embodiment of an airflow regulator used with the support frame ofFIG. 2 a. -
FIG. 3 b is a perspective view illustrating an embodiment of the airflow regulator ofFIG. 3 a. -
FIG. 3 c is a perspective view illustrating an embodiment of the airflow regulator ofFIG. 3 a being coupled to the support frame ofFIG. 2 a. -
FIG. 3 d is a cross sectional view illustrating an embodiment of the airflow regulator ofFIG. 3 a coupled to the support frame ofFIG. 2 a. -
FIG. 3 e is a cross sectional view illustrating an embodiment of the airflow regulator ofFIG. 3 a coupled to the support frame ofFIG. 2 a and biased into a regulator channel. -
FIG. 4 is a perspective view illustrating an embodiment of a heat producing component used with the support frame and airflow regulator ofFIG. 3 d. -
FIG. 5 a is a perspective view illustrating an embodiment of a board used with the support frame and airflow regulator ofFIG. 3 d and the heat producing component ofFIG. 4 . -
FIG. 5 b is a perspective view illustrating an embodiment of the board ofFIG. 5 a with the fan modules removed for clarity. -
FIG. 6 a is a flow chart illustrating an embodiment of a method for regulating airflow in a chassis. -
FIG. 6 b is a perspective view illustrating an embodiment of the heat producing component ofFIG. 4 being coupled to the board ofFIG. 5 b. -
FIG. 6 c is a perspective view illustrating an embodiment of the heat producing component ofFIG. 4 coupled to the board ofFIG. 5 b. -
FIG. 6 d is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d being coupled to the board and heat producing ofFIG. 6 c. -
FIG. 6 e is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d coupled to the board and heat producing ofFIG. 6 c. -
FIG. 6 f is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d coupled to the board and heat producing ofFIG. 6 c with the fan modules illustrated. -
FIG. 6 g is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d being coupled to the board ofFIG. 5 b. -
FIG. 6 h is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d coupled to the board ofFIG. 5 b. -
FIG. 6 i is a perspective view illustrating an embodiment of the support frame and airflow regulator ofFIG. 3 d coupled to the board ofFIG. 5 b with the fan modules illustrated. -
FIG. 7 a is a perspective view illustrating an alternative embodiment of a support frame. -
FIG. 7 b is a perspective view illustrating an alternative embodiment of a board including a plurality of the heat producing components ofFIG. 4 and used with the support frame ofFIG. 7 a. -
FIG. 7 c is a perspective view illustrating the support frame ofFIG. 7 a coupled to the board ofFIG. 7 b. - For purposes of this disclosure, an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes. For example, an information handling system may be a personal computer, a PDA, a consumer electronic device, a network server or storage device, a switch router or other network communication device, or any other suitable device and may vary in size, shape, performance, functionality, and price. The information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic. Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components.
- In one embodiment,
information handling system 100,FIG. 1 , includes amicroprocessor 102, which is connected to abus 104.Bus 104 serves as a connection betweenmicroprocessor 102 and other components ofcomputer system 100. An input device 106 is coupled tomicroprocessor 102 to provide input tomicroprocessor 102. Examples of input devices include keyboards, touchscreens, and pointing devices such as mouses, trackballs and trackpads. Programs and data are stored on amass storage device 108, which is coupled tomicroprocessor 102. Mass storage devices include such devices as hard disks, optical disks, magneto-optical drives, floppy drives and the like.Information handling system 100 further includes adisplay 110, which is coupled tomicroprocessor 102 by avideo controller 112. Asystem memory 114 is coupled tomicroprocessor 102 to provide the microprocessor with fast storage to facilitate execution of computer programs bymicroprocessor 102. In an embodiment, achassis 116 houses some or all of the components ofinformation handling system 100. It should be understood that other busses and intermediate circuits can be deployed between the components described above andmicroprocessor 102 to facilitate interconnection between the components and the microprocessor. - Referring now to
FIGS. 2 a, 2 b, 2 c, and 2 d, asupport frame 200 is illustrated. Thesupport frame 200 includes anelongated base member 202 having a pair ofopposing sides front edge 202 c extending between thesides heat release apertures 202 d in a spaced apart relationship along the length of thesupport frame 200. Aleg 204 extends from thebase member 202 and is located adjacent theside 202 b of thebase member 202. Aleg 206 extends from thebase member 202, is located adjacent theside 202 a of thebase member 202 and in a substantially parallel and spaced apart relationship fromleg 204. Awall 208 extends from thebase member 202 and is located adjacent theleg 206 such that theleg 206 and thewall 208 define aregulator channel 210 between theleg 206 and thewall 208. Theregulator channel 210 includes aregulator stop edge 210a which defines an upper end of theregulator channel 210 extending between theleg 206 and thewall 208. Thewall 208, thebase member 202, and theleg 204 define acomponent channel 212 located between them and adjacent theregulator channel 210. Thebase member 202, theleg 206, and thewall 208 define aregulator passageway 214 extending along the length of theleg 206, through a portion of thebase member 202, along a portion of thewall 208, and located above theregulator channel 210. A plurality ofregulator couplers leg 206 and into theregulator passageway 214. Theregulator couplers regulator passageway 214 and adjacent an end of theregulator channel 210, and theregulator coupler 214 c is located adjacent an end of theregulator channel 210 opposite theregulator couplers chassis coupler 216 a extends from an upper portion of theleg 206 and adjacent theside 202 a of thebase member 202, and achassis coupler 216 b extends from theside 202 a of thebase member 202 in a spaced apart relationship from thechassis coupler 216 a. In an embodiment, a plurality of chassis couplers substantially similar in design and operation to thechassis couplers leg 204 and/or theside 202 b of thebase member 202. - Referring now to
FIGS. 3 a and 3 b, anairflow regulator 300 is illustrated. Theairflow regulator 300 includes a base 302 having afront edge 302 a, arear edge 302 b located opposite thefront edge 302 a, atop edge 302 c extending between thefront edge 302 a and therear edge 302 b, abottom edge 302 d extending between thefront edge 302 a and therear edge 302 b and located opposite thetop edge 302 c, and a pair of opposingsides front edge 302 a, therear edge 302 b, thetop edge 302 c, and thebottom edge 302 d. Aregulator guide 304 a extends from theside 302 e of thebase 302, adjacent to and along the length of therear end 302 b of thebase 302. Aregulator guide 304 b extends from theside 302 f of thebase 302, adjacent to and along the length of therear end 302 b of thebase 302. A plurality ofregulator securing members 306 a extend from theside 302 e of thebase 302 and are located adjacent thebottom edge 302 d of thebase member 302. A plurality ofregulator securing members 306 b extend from theside 302 f of thebase 302 and are located adjacent thebottom edge 302 d of thebase member 302. Aregulator guide 308 extends from theside 302 f of thebase member 302 in a substantially parallel and spaced apart relationship from theregulator guide 304 b and along the length of thebase member 302. - Referring now to
FIGS. 2 d, 3 a, 3 b, 3 c, 3 d, and 3 e, in assembly, theairflow regulator 300 is coupled to thesupport frame 200. Theairflow regulator 300 is positioned above theregulator passageway 214 onsupport frame 200 and moved in a direction A, as illustrated inFIG. 3c . As theairflow regulator 300 enters theregulator passageway 214, theregulator coupler 214 a becomes positioned between the regulator guides 304 b and 308; theregulator coupler 214 b becomes positioned adjacent theregulator guide 304 a; and thefront edge 302 a becomes positioned adjacent theregulator guide 214 c, resulting in the coupling of the airflow regulator to the support frame and adjacent theregulator channel 210. In an embodiment, theairflow regulator 300 is biased into theregulator channel 210 by gravity, as illustrated inFIG. 3 d. With theairflow regulator 300 in theregulator channel 210, theregulator securing members airflow regulator 300 from being decoupled from thesupport frame 200 by engaging theregulator stop edge 210 a when theairflow regulator 300 is moved from theregulator channel 210 to theregulator passageway 214. In an alternative embodiment, illustrated inFIG. 3 e, theairflow regulator 300 may be coupled to thesupport frame 200 in substantially the same manner as described above, with the provision of aresilient member 308 such as, for example, a spring, between theairflow regulator 300 and thesupport frame 200 which biases theairflow regulator 300 into theregulator channel 210. The embodiment illustrated inFIG. 3 e allows thesupport frame 200 to be used in a variety of orientations while still biasing theairflow regulator 300 into theregulator channel 210. In an alternative embodiment, theairflow regulator 300 may be coupled to thesupport frame 200 in a variety of different manners known in the art such as, for example, pivotally connected. - Referring now to
FIG. 4 , aheat producing component 400 is illustrated. Heat producingcomponent 400 includes a base 402 having afront edge 402 a, arear edge 402 b located opposite thefront edge 402 a, atop edge 402 c extending between thefront edge 402 a and therear edge 402 b, abottom edge 402 d extending between thefront edge 402 a and therear edge 402 b and located opposite thetop edge 402 c, and a pair of opposingsides front edge 402 a, therear edge 402 b, thetop edge 402 c, and thebottom edge 402 d. Aconnector coupler 404 extends from thebottom edge 402 d of thebase member 402 and is located adjacent thefront edge 402 a. In an embodiment, theheat producing component 400 may be an expansion card, a Dual Inline Memory Module (DIMM), a Voltage Regulator Module (VRM), a heat sink coupled to a heat producing component, and/or a variety of other heat producing components known in the art. - Referring now to
FIGS. 5 a and 5 b, aboard 500 is illustrated.Board 500 includes a base 502 which may be mounted to a chassis such as, for example, thechassis 116 described above with reference toFIG. 1 , and may include components of an information handling system such as, for example, theinformation handling system 100 described above with reference toFIG. 1 . Thebase 502 includes a heat producingcomponent connector 504 which is mounted to thebase 502 and defines aconnector slot 504 a along its length. A plurality ofheat dissipation components base 502 and positioned adjacent the heat producingcomponent connector 504. In an embodiment, theheat dissipation components microprocessor 102 described above with reference toFIG. 1 , which are mounted to thebase 502. A plurality offan modules board 502 and positioned adjacent theheat dissipation components component connector 504. Theboard 500 illustrated inFIG. 5 b has thefan modules - Referring now to
FIGS. 5 b, 6 a, and 6 b, amethod 600 for regulating airflow in a chassis is illustrated. Themethod 600 begins atstep 602 where a chassis such as, for example, thechassis 116 described above with reference toFIG. 1 , is provided. The chassis includes theboard 500, illustrated inFIG. 5 b, mounted to it. In an embodiment, the providing of a chassis instep 602 includes the coupling of theheat producing component 400 to theboard 500. Theheat producing component 400 is positioned above the heat producingcomponent connector 504 such that theconnector coupler 404 onheat producing component 400 is lined up with theconnector slot 504 a on the heat producingcomponent connector 504, as illustrated inFIG. 6 b. Theheat producing component 400 is then moved in a direction B such that theconnector coupler 404 matingly engages the theconnector slot 504 a on the heat producingcomponent connector 504, as illustrated inFIG. 6 c. - Referring now to
FIGS. 2 a, 6 a, 6 d, and 6 e, themethod 600 proceeds to step 604 where thesupport frame 200 is coupled to theboard 500 in the chassis. Thesupport frame 200 is positioned above theboard 500 such thatleg 204 is adjacentheat dissipation component 506 c;leg 206 is adjacentheat producing component 400; theheat dissipation components component channel 212; and theheat producing component 400 is adjacent theregulator channel 210 with theairflow regulator 300 biased into theregulator channel 210, as illustrated inFIG. 6 d. In an embodiment, thesupport frame 200 may be coupled to a wall of the chassis. Thesupport frame 200 is then moved in a direction C such that theheat dissipation components component channel 212 on thesupport frame 200, and thetop edge 402 c of theheat producing component 400 engages thebottom edge 302 d of the airflow regulator. Engagement of theheat producing component 400 with theairflow regulator 300 moves theairflow regulator 300 out of theregulator channel 210 and allows theheat producing component 400 to enter theregulator channel 210, as illustrated inFIG. 6 e. Thesupport frame 200 may then be held in place by, for example, coupling the support frame to theboard 500 using conventional methods known in the art, and/or by coupling thechassis couplers side 202 a ofsupport frame 200 and the chassis couplers (not shown) extending fromside 202 b of thesupport frame 200 to securing features (not shown) on the chassis. - Referring now to
FIGS. 2 a, 6 a, 6 e, and 6 f, themethod 600 proceeds to step 606 where airflow is regulated through the chassis. With thesupport frame 200 coupled to theboard 500, thefan modules support frame 200 such that any airflow from thefan modules support frame 200. When thefan modules heat dissipation components component channel 212 onsupport frame 200, as well as past theheat producing component 400 positioned in theregulator channel 210 on support frame, which results in cooling of theheat dissipation components heat producing component 400. - Referring now to
FIGS. 5 b and 6 a, in an alternative embodiment, the providing of a chassis instep 602 does not includes the coupling of theheat producing component 400 to theboard 500 as described above with reference toFIGS. 6 b and 6 c. - Referring now to
FIGS. 2 a, 6 a, 6 g, and 6 h, themethod 600 proceeds to step 604 where thesupport frame 200 is coupled to theboard 500 in the chassis. Thesupport frame 200 is positioned above theboard 500 such thatleg 204 is adjacentheat dissipation component 506 c;leg 206 is adjacent heat producingcomponent connector 504; theheat dissipation components component channel 212; and the heat producingcomponent connector 504 is adjacent theregulator channel 210, with theairflow regulator 300 biased into theregulator channel 210, as illustrated inFIG. 6 g. In an embodiment, thesupport frame 200 may be coupled to a wall of the chassis. Thesupport frame 200 is then moved in a direction D such that theheat dissipation components component channel 212 on thesupport frame 200, while theairflow regulator 300 remains in theregulator channel 210, as illustrated inFIG. 6 h. Thesupport frame 200 may then be held in place by, for example, coupling thesupport frame 200 to theboard 500 using conventional methods known in the art, and/or by coupling thechassis couplers side 202 a ofsupport frame 200 and the chassis couplers (not shown) extending fromside 202 b of thesupport frame 200 to securing features (not shown) on the chassis. - Referring now to
FIGS. 2 a, 6 a, 6 h, and 6 i, themethod 600 proceeds to step 606 where airflow is regulated through the chassis. With thesupport frame 200 coupled to theboard 500, thefan modules support frame 200 such that any airflow from thefan modules support frame 200. When thefan modules heat dissipation components component channel 212 onsupport frame 200, while theairflow regulator 300 prevents airflow through theregulator channel 210. In an embodiment, with thesupport frame 200 held in place, theairflow regulator 300 engages thebase 502 of theboard 500 between the heat producingcomponent connector 504 and thefan modules regulator channel 210. Thus, a method and apparatus are provided which regulate airflow through the chassis based on whether theheat producing component 400 is coupled to theboard 500. The method and apparatus optimizes the airflow through the chassis by preventing airflow through theregulator channel 210 when there is noheat producing component 400 in theregulator channel 210. Furthermore, the method and apparatus require no manual configuration of theairflow regulator 300, but rather automatically adjust the position of the airflow regulator based on the decision of a user to couple or decouple aheat producing component 400 with theboard 500. - Referring now to
FIGS. 3 a, 3 b, and 7 a, an alternative embodiment of asupport frame 700 is illustrated.Support frame 700 includes a base 702 have a plurality oflegs base 702. A plurality ofregulator passageways base 702 and thelegs regulator channel 704 b is defined by theleg 704, thebase 702, and theleg 706. Aregulator channel 706 b is defined by theleg 706, thebase 702, and theleg 708. Aregulator channel 708 b is defined by theleg 708, thebase 702, and theleg 710. Aregulator channel 710b is defined by theleg 710, thebase 702, and theleg 712. Aregulator channel 712 b is defined by theleg 712, thebase 702, and theleg 714. A plurality ofairflow regulators 300 are coupled to thesupport frame 200 throughrespective regulator passageways respective regulators channels - Referring now to
FIGS. 4 and 7 b, an alternative embodiment of aboard 716 is illustrated.Board 716 includes a base 718 having a plurality of heat producingcomponent connectors base 718. Aheat producing component 400 is coupled to the heat producingcomponent connector 720 a and aheat producing component 400 is coupled to the heat producingcomponent connector 720 d in substantially the same manner as described above for coupling theheat producing component 400 to the heat producingcomponent connector 504, illustrated inFIGS. 6 b and 6 c. Theboard 716 includes a plurality of fan modules coupled to the base 718 which are substantially similar in design and operation to thefan modules FIG. 5 a, and which have been omitted for clarity. - Referring now to
FIGS. 7 a, 7 b, and 7 c, in operation, thesupport frame 700 is coupled to theboard 716 in substantially the same manner as thesupport frame 200 is coupled to theboard 500, described above with respect toFIGS. 6 d and 6 e. With thesupport frame 700 coupled to theboard 716, theheat producing components 400 coupled to the heat producingcomponent connectors regulator channels airflow regulators 300 inregulator channels heat producing components 400 coupled to the heat producingcomponent connectors airflow regulators 300 inregulator channels regulator channels heat producing components 400 coupled to the heat producingcomponent connectors - Although illustrative embodiments have been shown and described, a wide range of modification, change and substitution is contemplated in the foregoing disclosure and in some instances, some features of the embodiments may be employed without a corresponding use of other features. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the embodiments disclosed herein.
Claims (20)
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US11/178,530 US7397660B2 (en) | 2005-07-11 | 2005-07-11 | Method and apparatus for regulating airflow in a chassis |
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US11/178,530 US7397660B2 (en) | 2005-07-11 | 2005-07-11 | Method and apparatus for regulating airflow in a chassis |
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US20070008699A1 true US20070008699A1 (en) | 2007-01-11 |
US7397660B2 US7397660B2 (en) | 2008-07-08 |
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US11/178,530 Active 2026-11-16 US7397660B2 (en) | 2005-07-11 | 2005-07-11 | Method and apparatus for regulating airflow in a chassis |
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