US20060245951A1 - Multilayer valve structures, methods of making, and pumps using same - Google Patents
Multilayer valve structures, methods of making, and pumps using same Download PDFInfo
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- US20060245951A1 US20060245951A1 US11/104,661 US10466105A US2006245951A1 US 20060245951 A1 US20060245951 A1 US 20060245951A1 US 10466105 A US10466105 A US 10466105A US 2006245951 A1 US2006245951 A1 US 2006245951A1
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- Prior art keywords
- flap
- layer
- interface
- interface layer
- cover layer
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- 238000000034 method Methods 0.000 title claims description 15
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 238000005086 pumping Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000000806 elastomer Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- 239000003351 stiffener Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/10—Valves; Arrangement of valves
- F04B53/1037—Flap valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/10—Valves; Arrangement of valves
- F04B53/1087—Valve seats
Definitions
- Valves have myriads of uses, and are particularly employed in the handling of fluids.
- the pump typically has an inlet port and an outlet port, one or both of which are selectively opened and closed by a valve, or other wise have a valve associated therewith.
- FIG. 1A illustrates an example pump 1410 in which flapper valves, shown in more detail in FIG. 1B and FIG. 1C , are situated.
- the diaphragm pump 1410 of FIG. 1A comprises pump body 1412 for at least partially defining a shallow cylindrical pumping chamber 1430 .
- the pumping chamber 1430 has an inlet port 1422 and an outlet port 1424 .
- Pump body 1412 has a body base 1413 and a body cover 1416 .
- the pump 1410 has a diaphragm 1414 situated in the pumping chamber 1430 .
- the diaphragm 1414 sits on a pumping chamber sealing washer 34 .
- the circular periphery of diaphragm 1414 is sandwiched between pumping chamber sealing washer 34 and O-ring seal 36 .
- the diaphragm 1414 acts upon a fluid in the pumping chamber 1430 .
- action of the diaphragm 1414 is in response to application of an electromagnetic field to a piezoelectric element.
- the piezoelectric element may actually comprise the diaphragm 1414 (in the manner of piezoelectric wafer 38 comprising actuator 14 in FIG. 3 , for example).
- the diaphragm 1414 may be mechanically connected to a piezoelectric member which moves, and which thereby causes the diaphragm 1414 to move, in response to application of the electromagnetic field.
- flapper valve 1450 is situated in a recessed seat 1454 provided on a chamber-facing surface of body base 1413 .
- flapper valve 1450 is situated in a recessed seat 1456 on a chamber-opposing face of body base 1413 .
- the flapper valves 1450 are held in place in their respective recessed seats 1454 by a retainer element 1457 which is pressed into place around the edges of the flapper valve 1450 .
- the flapper valve 1450 is particularly beneficial for replacing metal check valves or the like in small pumps.
- the thin flapper valve 1450 facilitates overall a thinner pump.
- conventional metal check valves have a thickness on the order of about 0.093 inch
- the flapper valve 1450 has a thickness of about 0.002 inch.
- such small thickness for flapper valve 1450 means that the pump 1410 can have an overall thickness (in the direction of arrow 1460 ) as small as 0.125 inch.
- the pump 1410 is particularly advantageous for use in fuel cells, fountains and cooling solutions as well as drug infusion pumps in the medical industry, or in any environment in which small but accurate flows are required.
- the entire pump 1410 can be either molded in ceramics, injection molded in plastic or milled in metal or plastic.
- valve structure in a fluid-handling environment. It is important that fluid-handling valves remain structurally stable for suitably responding in the course of valve operation to stimuli for opening or closing the valves, such as fluidic pressure or even electrical signal(s). However, the fluid being handled can have deleterious or corrosive effect upon exposed valve structure, particularly if valve structure provided for stability is metallic.
- What is needed, therefore, and an object of the present invention is a fluid-handling valve which has suitable resilience to facilitate valve opening, stability to maintaining valve closing when required, and substantial structurally immunity to the fluids.
- a multilayer valve subassembly comprises an interface layer having an interface layer flap; a cover layer having a cover layer flap; and, an intermediate layer positioned between the interface layer and the cover layer.
- the intermediate layer has an intermediate layer flap essentially aligned with the interface layer flap and the cover layer flap.
- a first bond adheres the cover layer to the interface layer; a flap bond seals the interface layer flap between the cover layer flap and the interface layer flap and thereby forms a multilayer valve flap which is insulated from fluid which travels through the valve.
- the interface layer is not in contact with the first bond or the second bond and has a size that permits the interface layer to float in a sandwich pocket formed between the interface layer and the cover layer.
- the intermediate layer serves as a stabilizing or stiffener layer and comprises, e.g., an electroconductive metal which is sealed by the first bond and the flap bond for protection from fluid.
- the cover layer comprises an elastomer.
- the interface layer has an interface layer first flap and an interface layer second flap.
- the intermediate layer has an intermediate layer first flap and an intermediate layer second flap.
- the cover layer has a cover layer first flap and a cover layer second flap.
- a first flap bonds the first flap of the interface layer to the first flap of the cover layer whereby the first flap of the intermediate layer sandwiched between the first flap of the interface layer and the first flap of the cover layer forms a first valve flap.
- a second flap bonds the second flap of the interface layer to the second flap of the cover layer whereby the second flap of the intermediate layer sandwiched between the second flap of the interface layer and the second flap of the cover layer forms a second valve flap.
- the intermediate layer first flap and the intermediate layer second flap are electrically isolated.
- the first valve flap is centrally formed with respect to the interface layer, the intermediate layer, and the cover layer.
- a multilayer structure formed by the bonding of the cover layer to the interface layer has a footprint which is substantially equal to a pump footprint.
- the multilayer structure formed by the bonding of the cover layer to the interface layer can have various shapes.
- At least one of the first bond and the second bond is an electromagnetic bond formed by absorption of electromagnetic energy.
- Other bonding techniques are also possible, such as use of adhesives, fasteners, heat treatment, for example.
- FIG. 1A is a schematic cross sectional front view of a thin chamber pump according to an example embodiment.
- FIG. 1C is a diagrammatic perspective view of an open flapper valve included in the pump of FIG. 1A .
- FIG. 2 is an exploded view showing structure of and steps for fabricating a valve subassembly for a pump.
- FIG. 3 is an exploded view showing structure of and steps for fabricating a second example embodiment of a pump according to electromagnetic bonding technology.
- FIG. 5 is a top isometric view of the pump fabricated by the steps of FIG. 3 .
- FIG. 2 illustrates, in exploded format, both structure of and steps for fabricating a valve subassembly 50 .
- the valve subassemblies described herein are advantageously suited for use with a fluid pump, but can also be utilized in other fluid handling apparatus and environments.
- Valve subassembly 50 comprises a pump interface layer 60 having an interface layer inlet flap 62 and an interface layer outlet flap 64 ; a subassembly cover layer 70 having a cover layer inlet flap 72 and a cover layer outlet flap 74 ; and, an intermediate layer 80 positioned between interface layer 60 and cover layer 70 , intermediate layer 80 having an intermediate layer inlet flap 82 and an intermediate layer outlet flap 84 .
- the intermediate layer 80 may serve as a stabilizing or stiffener layer, and can comprise an electroconductive metal.
- the cover layer may be an elastomer, for example.
- inlet valve weld or seam 92 bonds inlet flap 62 of interface layer 60 to inlet flap 72 of cover layer 70 for forming inlet valve 52 .
- inlet valve 52 comprises inlet flap 82 of intermediate layer 80 sandwiched between inlet flap 62 of interface layer 60 and inlet flap 72 of cover layer 70 .
- an outlet valve weld or seam 94 bonds outlet flap 64 of interface layer 60 to outlet flap 74 of cover layer 70 for forming outlet valve 54 .
- outlet valve 54 comprises outlet flap 84 of intermediate layer 80 sandwiched between outlet flap 64 of interface layer 60 and outlet flap 74 of cover layer 70 .
- the inlet valve weld or seam 92 and outlet valve weld or seam 94 are illustrated in exploded fashion in FIG. 2 for providing an understanding of the position and shape of the respective seams.
- intermediate layer 80 may comprise two discrete and separated segments, e.g., intermediate layer segment 80 I and intermediate layer segment 80 O.
- the intermediate layer segment 80 I bears intermediate layer inlet flap 82
- the intermediate layer segment 80 O bears intermediate layer outlet flap 84 .
- a tab 80 IT is provided at a circumference portion of intermediate layer segment 80 I
- a tab 80 OT is provided at a circumference portion of intermediate layer segment 80 O.
- the tabs 80 IT and 80 OT may be used as electrical leads in an implementation in which the segments of the intermediate layer 80 are metallic and are connected to receive an electrical signal. In other embodiments, rather than having two discrete and separated segments there is but one unitary segment.
- one or both of intermediate layer inlet flap 82 and intermediate layer outlet flap 84 can each have mounted or overlaid thereon a piezoelectric material so that one or both of inlet valve 52 and outlet valve 54 can function as active valves.
- the structure and operation of such an active valve arrangement is understood from U.S. patent application Ser. No. 11/024,937, filed Dec. 30, 2004, which is incorporated by reference herein in its entirety.
- Intermediate layer 80 or the segments comprising intermediate layer 80 , is/are thus embedded between two other layers, which preferably are elastomer layers, so that intermediate layer 80 (or the segments thereof) is/are sealed between pump interface layer 60 and subassembly cover layer 70 .
- This may be particularly beneficial in an implementation in which, for example, the interface layer is a metallic layer.
- the intermediate layer 80 may even have the capability of slightly floating within a pocket formed by the welding of pump interface layer 60 and subassembly cover layer 70 .
- valves 52 , 54 (which are comprised of the respective interface layer flaps 62 , 64 ; the respective intermediate layer flaps 82 , 84 ; and the respective cover layer flaps 72 , 74 ) can have any convenient shape.
- each flap and thus the valves 52 , 54 have an essentially U shape.
- the respective flaps may be formed by a U-shaped cut out in the respective layer.
- intermediate layer inlet flap 82 and intermediate layer outlet flap 84 are slightly smaller than the respective flaps 62 , 72 and 64 , 74 , with which they are aligned.
- the flaps of the different layers are aligned with respect to a width direction of the layers.
- valve subassembly 50 e.g., pump interface layer 60 , subassembly cover layer 70 , and intermediate layer 80 are illustrated as being essentially circular. However, in other embodiments layers of differing shapes can be utilized.
- the subassembly cover layer 70 may have alignment marks or indentations 98 thereon to serve as a template or guide for placement of intermediate layer 80 .
- alignment marks or indentations 98 essentially are an image of intermediate layer 80 , or segments comprising intermediate layer 80 .
- FIG. 2 also depicts basic, example steps for fabricating the valve subassembly 50 .
- Forming valve subassembly 50 comprises three basic steps.
- a first such step comprises forming at least one (and preferably two) flaps in each of the interface layer 60 (e.g., interface layer inlet flap 62 and interface layer outlet flap 64 ), the intermediate layer 80 (e.g., intermediate layer inlet flap 82 and intermediate layer outlet flap 84 ), and cover layer 70 (e.g., cover layer inlet flap 72 and cover layer outlet flap 74 ).
- interface layer 60 has an interface layer first flap 62 and an interface layer second flap 64 ; intermediate layer 80 has an intermediate layer first flap 82 and an intermediate layer second flap 84 ; and, cover layer 70 has a cover layer first flap 72 and a cover layer second flap 74 .
- a second step involves bonding the first flap 62 of the interface layer 60 to the first flap 72 of the cover layer 70 for forming a first valve flap or inlet valve 52 , the first valve flap or inlet valve 52 comprising the first flap 82 of the intermediate layer 80 sandwiched between first flap 62 of interface layer 60 and first flap 72 of cover layer 70 .
- Such bonding for forming inlet valve 52 is represented by inlet valve weld or seam 92 shown in FIG. 3 .
- the intermediate layer inlet flap 82 is preferably sized to be narrower than interface layer inlet flap 62 and cover layer inlet flap 72 , with the result that inlet valve weld or seam 92 does not contact intermediate layer inlet flap 82 .
- the second step also includes bonding second flap 62 of interface layer 60 to second flap 72 of cover layer 70 for forming a second valve flap or outlet valve 54 , the second valve flap or outlet valve 54 comprising second flap 84 of intermediate layer 80 sandwiched between second flap 64 of interface layer 60 and second flap 74 of cover layer 70 .
- Such bonding for forming outlet valve 54 is represented by outlet valve weld or seam 94 shown in FIG. 2 .
- the intermediate layer outlet flap 84 is preferably sized to be narrower than interface layer outlet flap 64 and cover layer outlet flap 74 , with the result that outlet valve weld or seam 94 does not contact intermediate layer outlet flap 84 .
- the third step of forming valve subassembly 50 comprises sealing the periphery of subassembly cover layer 70 to pump interface layer 60 , thereby encasing intermediate layer 80 between subassembly cover layer 70 and pump interface layer 60 so that fluid will not intrude to reach intermediate layer 80 .
- the step of bonding periphery of subassembly cover layer 70 to pump interface layer 60 can occur simultaneously with the preceding step of bonding the flaps.
- the valve subassembly 50 is now substantially complete as a stand alone part or subassembly.
- the bonding included in fabrication of the valve subassembly 50 can be performed in diverse manners, such as electromagnetic bonding, adhesive bonding, heat bonding, mechanical fasteners, just to name a few.
- the bonding included in the second step can be performed, for example, by directing a beam of electromagnetic energy in the pattern depicted by inlet valve weld or seam 92 and electromagnetic outlet valve weld or seam 94 as shown in FIG. 2 .
- the electromagnetic energy which is applied for the bonding comprises a laser beam, an infrared beam, or an ultrasonic beam having a wavelength suitable for polymer joining, e.g., polymer laser welding, infrared welding, or ultrasonic welding.
- the welding can be accomplished using an overlap technique wherein the pump interface layer 60 upon which the electromagnetic beam is first incident, permits transmission of the electromagnetic beam. After passing through pump interface layer 60 , the electromagnetic beam is incident upon subassembly cover layer 70 .
- the subassembly cover layer 70 is comprised of a dark, energy-absorbing material which is optically close to the wavelength of the electromagnetic energy used for the bonding.
- a bond or weld seam occurs where the electromagnetic is absorbed.
- inlet valve weld or seam 92 and electromagnetic outlet valve weld or seam 94 depict the positions where the electromagnetic weld is formed for securing subassembly cover layer 70 to pump interface layer 60 , with intermediate layer 80 being embedded therebetween.
- valve subassembly 50 comprises sealing the periphery of subassembly cover layer 70 to pump interface layer 60 , thereby encasing intermediate layer 80 between subassembly cover layer 70 and pump interface layer 60 so that fluid will not intrude to reach intermediate layer 80 .
- This third step can be accomplished by electromagnetic welding in similar manner as the second step, but with the electromagnetic beam positioned and directed to travel proximate but just inside the periphery of subassembly cover layer 70 , and thereby trace the cover weld or seam 100 shown in FIG. 3 .
- the step of bonding periphery of subassembly cover layer 70 to pump interface layer 60 can occur simultaneously with the preceding step of bonding the flaps.
- At least one of the interface layer 60 and the cover layer 80 is formed from an electromagnetically transmissive material.
- the electromagnetically transmissive material is a thermal polymer, a thermo-plastic elastomer, a thermoplast, or a combination thereof.
- the bonding of the second step and the third steps can be achieved using adhesive bonding.
- An adhesive can be applied at locations comparable to the welds or seams mentioned above. Suitable adhesives for such bonding can include, for example, epoxies and ultraviolet (UV) curable adhesives.
- valve subassembly 50 such as that described above has particular but not necessarily unique utility in a fluidic pump.
- valve subassembly 50 can be included in a pump 20 which is illustrated in exploded manner in FIG. 3 . As assembled, the pump 20 of FIG. 3 is also seen from the top in FIG. 4 and from the bottom in FIG. 5 .
- the pump 20 has a base plate or pump base member 22 and a diaphragm layer 24 .
- the pump base member 22 has a pump chamber surface 44 (see FIG. 4 ) and a valve interface surface 46 (see FIG. 3 and FIG. 5 ).
- An inlet port 36 and an outlet port 38 are provided in the pump base member.
- Piezoelectric diaphragm layer 24 is secured (e.g., by electromagnetically welded) to the pump chamber surface 44 for defining pumping chamber 26 between the pump base member 22 and diaphragm layer 24 .
- Diaphragm layer 24 of pump 20 comprises a piezoelectric central region 30 selectively deformable upon application of an electrical signal for pumping fluid into and out of the pumping chamber. If desired (as in the case of fabrication by electromagnetic bonding), an electromagnetically transmissive region 32 can surround the central piezoelectric region 30 .
- a bond (such as an electromagnetic weld) illustrated by seam 34 , bonds the region 32 of the diaphragm layer 24 to the base member 22 .
- Valve subassembly 50 is bonded or attached to valve interface surface 44 of the pump base member 22 for providing (as shown in FIG. 5 ) the inlet valve 52 which selectively opens and closes the inlet port 36 and the outlet valve 54 which selectively opens and closes the outlet port 38 .
- inlet valve 52 may have a dimple 99 formed on an underside surface.
- outlet valve 54 may have a dimple formed on an upper surface thereof in alignment with outlet port 38 (see FIG. 3 ).
- valve subassembly 50 has a footprint which is substantially the same as the pump, e.g., of pump base plate/member 22 .
- pump interface layer 60 is planar and coextensive in size with pump base member 22 , and has fastening apertures 96 which are aligned with fastening apertures 40 of pump base member 22 .
Abstract
Description
- This application is related to simultaneously-filed United States Patent Application Serial Number (Attorney Docket 4209-54), entitled ELECTROMAGNETICALLY BONDED PUMPS AND PUMP SUBASSEMBLIES AND METHODS OF FABRICATION, which is incorporated by reference herein in its entirety.
- The present invention pertains to valves suitable for use in handling fluids, such as a valve for use in a fluid pump, for example, and pumps which utilize such valves.
- Valves have myriads of uses, and are particularly employed in the handling of fluids. For example, when fluids are being pumped by a pump, typically the pump has an inlet port and an outlet port, one or both of which are selectively opened and closed by a valve, or other wise have a valve associated therewith.
- U.S. patent application Ser. No. 10/388,589, filed Mar. 17, 2003, entitled “PIEZOELECTRIC ACTUATOR AND PUMP USING SAME, incorporated herein by reference in its entirety, shows various examples of piezoelectric pumps. In the course of disclosing piezoelectric pump structures, flapper valve structures are also shown for placement in a seat of one or more of an inlet port and an outlet port of a pump chamber.
FIG. 1A illustrates anexample pump 1410 in which flapper valves, shown in more detail inFIG. 1B andFIG. 1C , are situated. - The
diaphragm pump 1410 ofFIG. 1A comprisespump body 1412 for at least partially defining a shallowcylindrical pumping chamber 1430. Thepumping chamber 1430 has aninlet port 1422 and anoutlet port 1424.Pump body 1412 has abody base 1413 and abody cover 1416. Thepump 1410 has adiaphragm 1414 situated in thepumping chamber 1430. Thediaphragm 1414 sits on a pumpingchamber sealing washer 34. The circular periphery ofdiaphragm 1414 is sandwiched between pumpingchamber sealing washer 34 and O-ring seal 36. - The
diaphragm 1414 acts upon a fluid in thepumping chamber 1430. Preferably action of thediaphragm 1414 is in response to application of an electromagnetic field to a piezoelectric element. The piezoelectric element may actually comprise the diaphragm 1414 (in the manner ofpiezoelectric wafer 38 comprising actuator 14 inFIG. 3 , for example). Alternatively, thediaphragm 1414 may be mechanically connected to a piezoelectric member which moves, and which thereby causes thediaphragm 1414 to move, in response to application of the electromagnetic field. - At least one, and preferably both, of
inlet port 1422 andoutlet port 1424 of thepump 1410 ofFIG. 1A is provided with aflapper valve 1450. Eachflapper valve 1450 is a thin wafer, preferably circular in shape (seeFIG. 14B ), having anarcuate cut 1452 formed therein. - For
inlet port 1422,flapper valve 1450 is situated in a recessedseat 1454 provided on a chamber-facing surface ofbody base 1413. Foroutlet port 1424,flapper valve 1450 is situated in a recessedseat 1456 on a chamber-opposing face ofbody base 1413. Theflapper valves 1450 are held in place in their respective recessedseats 1454 by aretainer element 1457 which is pressed into place around the edges of theflapper valve 1450. - Preferably each
flapper valve 1450 is a thin silicon wafer. In one implementation, theflapper valve 1450 has a diameter of about 0.37 inch and a thickness of about 0.002 inch. As shown inFIG. 1B , thearcuate cut 1452 is a substantially U-shaped cut. In the illustrated implementation, thearcuate cut 1452 extends along 0.25 inch of the diameter offlapper valve 1450. Thearcuate cut 1452 serves to form aflexible flapper 1458 which is shaped somewhat as a peninsula in the interior offlapper valve 1450. Theflapper 1458 offlapper valve 1450 has a modulus which forces theflapper valve 1450 to close after the piezoelectric element has functioned to fill thechamber 1430, but which also causes automatic closure ofvalve 1450 without requiring the pressure of the piezoelectric element for the closure. For example, considering aflapper valve 1450 installed ininlet port 1422, when thediaphragm 1414 moves to draw fluid intopumping chamber 1430 in the direction depicted byarrow 1460 inFIG. 1C , theflexible flapper 1458 flexes or moves also in the direction ofarrow 1460. Conversely, considering theflapper valve 1450 inoutlet port 1424, when thediaphragm 1414 is actuated to drive fluid out ofdiaphragm 1414 in the direction depicted by arrow 1464, theflexible flapper 1458 of theflapper valve 1450 inoutlet port 1424 also flexes in the direction ofarrow 1462. - The
flapper valve 1450 is particularly beneficial for replacing metal check valves or the like in small pumps. Advantageously, thethin flapper valve 1450 facilitates overall a thinner pump. Whereas conventional metal check valves have a thickness on the order of about 0.093 inch, theflapper valve 1450 has a thickness of about 0.002 inch. In the illustrated implementation, such small thickness forflapper valve 1450 means that thepump 1410 can have an overall thickness (in the direction of arrow 1460) as small as 0.125 inch. As such, thepump 1410 is particularly advantageous for use in fuel cells, fountains and cooling solutions as well as drug infusion pumps in the medical industry, or in any environment in which small but accurate flows are required. Theentire pump 1410 can be either molded in ceramics, injection molded in plastic or milled in metal or plastic. - The foregoing illustrates just one employment of one example embodiment of a valve in a fluid-handling environment. It is important that fluid-handling valves remain structurally stable for suitably responding in the course of valve operation to stimuli for opening or closing the valves, such as fluidic pressure or even electrical signal(s). However, the fluid being handled can have deleterious or corrosive effect upon exposed valve structure, particularly if valve structure provided for stability is metallic.
- What is needed, therefore, and an object of the present invention, is a fluid-handling valve which has suitable resilience to facilitate valve opening, stability to maintaining valve closing when required, and substantial structurally immunity to the fluids.
- A multilayer valve subassembly comprises an interface layer having an interface layer flap; a cover layer having a cover layer flap; and, an intermediate layer positioned between the interface layer and the cover layer. The intermediate layer has an intermediate layer flap essentially aligned with the interface layer flap and the cover layer flap. A first bond adheres the cover layer to the interface layer; a flap bond seals the interface layer flap between the cover layer flap and the interface layer flap and thereby forms a multilayer valve flap which is insulated from fluid which travels through the valve.
- In an example embodiment, the each of the interface layer flap, the cover layer flap, and the interface layer flap has a substantially U-shape.
- Preferably the interface layer is not in contact with the first bond or the second bond and has a size that permits the interface layer to float in a sandwich pocket formed between the interface layer and the cover layer. In one example implementation, the intermediate layer serves as a stabilizing or stiffener layer and comprises, e.g., an electroconductive metal which is sealed by the first bond and the flap bond for protection from fluid. In an example implementation, the cover layer comprises an elastomer.
- In another example embodiment, the interface layer has an interface layer first flap and an interface layer second flap. The intermediate layer has an intermediate layer first flap and an intermediate layer second flap. The cover layer has a cover layer first flap and a cover layer second flap. A first flap bond bonds the first flap of the interface layer to the first flap of the cover layer whereby the first flap of the intermediate layer sandwiched between the first flap of the interface layer and the first flap of the cover layer forms a first valve flap. A second flap bond bonds the second flap of the interface layer to the second flap of the cover layer whereby the second flap of the intermediate layer sandwiched between the second flap of the interface layer and the second flap of the cover layer forms a second valve flap. Preferably but not necessarily, the intermediate layer first flap and the intermediate layer second flap are electrically isolated. In an illustrated embodiment, the first valve flap is centrally formed with respect to the interface layer, the intermediate layer, and the cover layer.
- When utilized in conjunction with a pump, a multilayer structure formed by the bonding of the cover layer to the interface layer has a footprint which is substantially equal to a pump footprint. The multilayer structure formed by the bonding of the cover layer to the interface layer can have various shapes.
- In one example mode of fabrication, at least one of the first bond and the second bond is an electromagnetic bond formed by absorption of electromagnetic energy. Other bonding techniques are also possible, such as use of adhesives, fasteners, heat treatment, for example.
- The foregoing and other objects, features, and advantages of the invention will be apparent from the following more particular description of preferred embodiments as illustrated in the accompanying drawings in which reference characters refer to the same parts throughout the various views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
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FIG. 1A is a schematic cross sectional front view of a thin chamber pump according to an example embodiment. -
FIG. 1B is top view of a flapper valve included in the pump ofFIG. 1A . -
FIG. 1C is a diagrammatic perspective view of an open flapper valve included in the pump ofFIG. 1A . -
FIG. 2 is an exploded view showing structure of and steps for fabricating a valve subassembly for a pump. -
FIG. 3 is an exploded view showing structure of and steps for fabricating a second example embodiment of a pump according to electromagnetic bonding technology. -
FIG. 4 is a top isometric view of the pump fabricated by the steps ofFIG. 3 . -
FIG. 5 is a top isometric view of the pump fabricated by the steps ofFIG. 3 . - In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular architectures, interfaces, techniques, etc. in order to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
-
FIG. 2 illustrates, in exploded format, both structure of and steps for fabricating avalve subassembly 50. The valve subassemblies described herein are advantageously suited for use with a fluid pump, but can also be utilized in other fluid handling apparatus and environments. -
Valve subassembly 50 comprises apump interface layer 60 having an interfacelayer inlet flap 62 and an interfacelayer outlet flap 64; asubassembly cover layer 70 having a coverlayer inlet flap 72 and a coverlayer outlet flap 74; and, anintermediate layer 80 positioned betweeninterface layer 60 andcover layer 70,intermediate layer 80 having an intermediatelayer inlet flap 82 and an intermediatelayer outlet flap 84. Theintermediate layer 80 may serve as a stabilizing or stiffener layer, and can comprise an electroconductive metal. The cover layer may be an elastomer, for example. - An inlet valve weld or
seam 92bonds inlet flap 62 ofinterface layer 60 toinlet flap 72 ofcover layer 70 for forminginlet valve 52. Thus,inlet valve 52 comprisesinlet flap 82 ofintermediate layer 80 sandwiched betweeninlet flap 62 ofinterface layer 60 andinlet flap 72 ofcover layer 70. Similarly, an outlet valve weld orseam 94bonds outlet flap 64 ofinterface layer 60 tooutlet flap 74 ofcover layer 70 for formingoutlet valve 54. Accordingly,outlet valve 54 comprisesoutlet flap 84 ofintermediate layer 80 sandwiched betweenoutlet flap 64 ofinterface layer 60 andoutlet flap 74 ofcover layer 70. The inlet valve weld orseam 92 and outlet valve weld orseam 94 are illustrated in exploded fashion inFIG. 2 for providing an understanding of the position and shape of the respective seams. - As shown in
FIG. 2 , in some example implementationsintermediate layer 80 may comprise two discrete and separated segments, e.g., intermediate layer segment 80I and intermediate layer segment 80O. The intermediate layer segment 80I bears intermediatelayer inlet flap 82, the intermediate layer segment 80O bears intermediatelayer outlet flap 84. A tab 80IT is provided at a circumference portion of intermediate layer segment 80I, and similarly a tab 80OT is provided at a circumference portion of intermediate layer segment 80O. The tabs 80IT and 80OT may be used as electrical leads in an implementation in which the segments of theintermediate layer 80 are metallic and are connected to receive an electrical signal. In other embodiments, rather than having two discrete and separated segments there is but one unitary segment. - In a variation of the illustrated embodiment, one or both of intermediate
layer inlet flap 82 and intermediatelayer outlet flap 84 can each have mounted or overlaid thereon a piezoelectric material so that one or both ofinlet valve 52 andoutlet valve 54 can function as active valves. The structure and operation of such an active valve arrangement is understood from U.S. patent application Ser. No. 11/024,937, filed Dec. 30, 2004, which is incorporated by reference herein in its entirety. -
Intermediate layer 80, or the segments comprisingintermediate layer 80, is/are thus embedded between two other layers, which preferably are elastomer layers, so that intermediate layer 80 (or the segments thereof) is/are sealed betweenpump interface layer 60 andsubassembly cover layer 70. This may be particularly beneficial in an implementation in which, for example, the interface layer is a metallic layer. Moreover, depending on tolerances, theintermediate layer 80 may even have the capability of slightly floating within a pocket formed by the welding ofpump interface layer 60 andsubassembly cover layer 70. - The
valves 52, 54 (which are comprised of the respective interface layer flaps 62, 64; the respective intermediate layer flaps 82, 84; and the respective cover layer flaps 72, 74) can have any convenient shape. In the illustrated example, each flap and thus thevalves intermediate layer 80 betweenpump interface layer 60 andsubassembly cover layer 70, intermediatelayer inlet flap 82 and intermediatelayer outlet flap 84 are slightly smaller than therespective flaps - The shapes of the layers comprising
valve subassembly 50, e.g.,pump interface layer 60,subassembly cover layer 70, andintermediate layer 80 are illustrated as being essentially circular. However, in other embodiments layers of differing shapes can be utilized. - The
subassembly cover layer 70 may have alignment marks orindentations 98 thereon to serve as a template or guide for placement ofintermediate layer 80. Such alignment marks orindentations 98 essentially are an image ofintermediate layer 80, or segments comprisingintermediate layer 80. - In addition to illustrating the example structure of
valve subassembly 50,FIG. 2 also depicts basic, example steps for fabricating thevalve subassembly 50. Formingvalve subassembly 50 comprises three basic steps. A first such step comprises forming at least one (and preferably two) flaps in each of the interface layer 60 (e.g., interfacelayer inlet flap 62 and interface layer outlet flap 64), the intermediate layer 80 (e.g., intermediatelayer inlet flap 82 and intermediate layer outlet flap 84), and cover layer 70 (e.g., coverlayer inlet flap 72 and cover layer outlet flap 74). As such,interface layer 60 has an interface layerfirst flap 62 and an interface layersecond flap 64;intermediate layer 80 has an intermediate layerfirst flap 82 and an intermediate layersecond flap 84; and,cover layer 70 has a cover layerfirst flap 72 and a cover layersecond flap 74. - A second step involves bonding the
first flap 62 of theinterface layer 60 to thefirst flap 72 of thecover layer 70 for forming a first valve flap orinlet valve 52, the first valve flap orinlet valve 52 comprising thefirst flap 82 of theintermediate layer 80 sandwiched betweenfirst flap 62 ofinterface layer 60 andfirst flap 72 ofcover layer 70. Such bonding for forminginlet valve 52 is represented by inlet valve weld orseam 92 shown inFIG. 3 . As mentioned above, the intermediatelayer inlet flap 82 is preferably sized to be narrower than interfacelayer inlet flap 62 and coverlayer inlet flap 72, with the result that inlet valve weld orseam 92 does not contact intermediatelayer inlet flap 82. - For two valve embodiments, the second step also includes bonding
second flap 62 ofinterface layer 60 tosecond flap 72 ofcover layer 70 for forming a second valve flap oroutlet valve 54, the second valve flap oroutlet valve 54 comprisingsecond flap 84 ofintermediate layer 80 sandwiched betweensecond flap 64 ofinterface layer 60 andsecond flap 74 ofcover layer 70. Such bonding for formingoutlet valve 54 is represented by outlet valve weld orseam 94 shown inFIG. 2 . In like manner as described above, the intermediatelayer outlet flap 84 is preferably sized to be narrower than interfacelayer outlet flap 64 and coverlayer outlet flap 74, with the result that outlet valve weld orseam 94 does not contact intermediatelayer outlet flap 84. - The third step of forming
valve subassembly 50 comprises sealing the periphery ofsubassembly cover layer 70 to pumpinterface layer 60, thereby encasingintermediate layer 80 betweensubassembly cover layer 70 andpump interface layer 60 so that fluid will not intrude to reachintermediate layer 80. The step of bonding periphery ofsubassembly cover layer 70 to pumpinterface layer 60 can occur simultaneously with the preceding step of bonding the flaps. At this point, thevalve subassembly 50 is now substantially complete as a stand alone part or subassembly. - The bonding included in fabrication of the
valve subassembly 50 can be performed in diverse manners, such as electromagnetic bonding, adhesive bonding, heat bonding, mechanical fasteners, just to name a few. - The bonding included in the second step can be performed, for example, by directing a beam of electromagnetic energy in the pattern depicted by inlet valve weld or
seam 92 and electromagnetic outlet valve weld orseam 94 as shown inFIG. 2 . Preferably the electromagnetic energy which is applied for the bonding comprises a laser beam, an infrared beam, or an ultrasonic beam having a wavelength suitable for polymer joining, e.g., polymer laser welding, infrared welding, or ultrasonic welding. The welding can be accomplished using an overlap technique wherein thepump interface layer 60 upon which the electromagnetic beam is first incident, permits transmission of the electromagnetic beam. After passing throughpump interface layer 60, the electromagnetic beam is incident uponsubassembly cover layer 70. Thesubassembly cover layer 70 is comprised of a dark, energy-absorbing material which is optically close to the wavelength of the electromagnetic energy used for the bonding. A bond or weld seam occurs where the electromagnetic is absorbed. Thus, inlet valve weld orseam 92 and electromagnetic outlet valve weld orseam 94 depict the positions where the electromagnetic weld is formed for securingsubassembly cover layer 70 to pumpinterface layer 60, withintermediate layer 80 being embedded therebetween. - As mentioned above, the third step of forming
valve subassembly 50 comprises sealing the periphery ofsubassembly cover layer 70 to pumpinterface layer 60, thereby encasingintermediate layer 80 betweensubassembly cover layer 70 andpump interface layer 60 so that fluid will not intrude to reachintermediate layer 80. This third step can be accomplished by electromagnetic welding in similar manner as the second step, but with the electromagnetic beam positioned and directed to travel proximate but just inside the periphery ofsubassembly cover layer 70, and thereby trace the cover weld orseam 100 shown inFIG. 3 . The step of bonding periphery ofsubassembly cover layer 70 to pumpinterface layer 60 can occur simultaneously with the preceding step of bonding the flaps. - In the electromagnetic welding mode, at least one of the
interface layer 60 and the cover layer 80 (preferably the interface layer 60) is formed from an electromagnetically transmissive material. For the valve subassembly embodiments described that involve electromagnetic bonding, preferably the electromagnetically transmissive material is a thermal polymer, a thermo-plastic elastomer, a thermoplast, or a combination thereof. - Other aspects of electromagnetic bonding operations for a valve subassembly as well as for a pump are described in simultaneously-filed United States Patent Application Serial Number (Attorney Docket 4209-54), entitled ELECTROMAGNETICALLY BONDED PUMPS AND PUMP SUBASSEMBLIES AND METHODS OF FABRICATION, which is incorporated by reference herein in its entirety.
- In another mode, the bonding of the second step and the third steps can be achieved using adhesive bonding. An adhesive can be applied at locations comparable to the welds or seams mentioned above. Suitable adhesives for such bonding can include, for example, epoxies and ultraviolet (UV) curable adhesives.
- A
valve subassembly 50 such as that described above has particular but not necessarily unique utility in a fluidic pump. As an example,valve subassembly 50 can be included in apump 20 which is illustrated in exploded manner inFIG. 3 . As assembled, thepump 20 ofFIG. 3 is also seen from the top inFIG. 4 and from the bottom inFIG. 5 . Thepump 20 has a base plate or pumpbase member 22 and adiaphragm layer 24. Thepump base member 22 has a pump chamber surface 44 (seeFIG. 4 ) and a valve interface surface 46 (seeFIG. 3 andFIG. 5 ). Aninlet port 36 and anoutlet port 38 are provided in the pump base member.Piezoelectric diaphragm layer 24 is secured (e.g., by electromagnetically welded) to thepump chamber surface 44 for defining pumping chamber 26 between thepump base member 22 anddiaphragm layer 24.Diaphragm layer 24 ofpump 20 comprises a piezoelectriccentral region 30 selectively deformable upon application of an electrical signal for pumping fluid into and out of the pumping chamber. If desired (as in the case of fabrication by electromagnetic bonding), an electromagneticallytransmissive region 32 can surround the centralpiezoelectric region 30. A bond (such as an electromagnetic weld) illustrated byseam 34, bonds theregion 32 of thediaphragm layer 24 to thebase member 22. -
Valve subassembly 50 is bonded or attached tovalve interface surface 44 of thepump base member 22 for providing (as shown inFIG. 5 ) theinlet valve 52 which selectively opens and closes theinlet port 36 and theoutlet valve 54 which selectively opens and closes theoutlet port 38. As shown inFIG. 5 ,inlet valve 52 may have adimple 99 formed on an underside surface. In similar fashion,outlet valve 54 may have a dimple formed on an upper surface thereof in alignment with outlet port 38 (seeFIG. 3 ). - Preferably the
valve subassembly 50 has a footprint which is substantially the same as the pump, e.g., of pump base plate/member 22. For example, in one example implementation, preferably but not necessarily,pump interface layer 60 is planar and coextensive in size withpump base member 22, and hasfastening apertures 96 which are aligned withfastening apertures 40 ofpump base member 22. - Although various embodiments have been shown and described in detail, the claims are not limited to any particular embodiment or example. None of the above description should be read as implying that any particular element, step, range, or function is essential such that it must be included in the claims scope. The scope of patented subject matter is defined only by the claims. The extent of legal protection is defined by the words recited in the allowed claims and their equivalents. It is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements.
Claims (32)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/104,661 US20060245951A1 (en) | 2005-04-13 | 2005-04-13 | Multilayer valve structures, methods of making, and pumps using same |
PCT/US2006/013856 WO2006113346A2 (en) | 2005-04-13 | 2006-04-13 | Multilayer valve structures, methods of making, and pumps using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/104,661 US20060245951A1 (en) | 2005-04-13 | 2005-04-13 | Multilayer valve structures, methods of making, and pumps using same |
Publications (1)
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US20060245951A1 true US20060245951A1 (en) | 2006-11-02 |
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ID=37115698
Family Applications (1)
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US11/104,661 Abandoned US20060245951A1 (en) | 2005-04-13 | 2005-04-13 | Multilayer valve structures, methods of making, and pumps using same |
Country Status (2)
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US (1) | US20060245951A1 (en) |
WO (1) | WO2006113346A2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070129681A1 (en) * | 2005-11-01 | 2007-06-07 | Par Technologies, Llc | Piezoelectric actuation of piston within dispensing chamber |
US20110182453A1 (en) * | 2010-01-25 | 2011-07-28 | Sonion Nederland Bv | Receiver module for inflating a membrane in an ear device |
US20130000758A1 (en) * | 2011-06-30 | 2013-01-03 | Agilent Technologies, Inc. | Microfluidic device and external piezoelectric actuator |
US20140134715A1 (en) * | 2012-11-12 | 2014-05-15 | Samsung Electro-Mechanics Co., Ltd. | Micro-pump |
US20140131609A1 (en) * | 2011-05-23 | 2014-05-15 | Rausch & Pausch Gmbh | Valve-body arrangement and method for producing it, and valve having the valve-body arrangement |
CN104481864A (en) * | 2014-12-12 | 2015-04-01 | 成都思达高科软件有限公司 | Automatic draining pump |
US20160377072A1 (en) * | 2015-06-25 | 2016-12-29 | Koge Micro Tech Co., Ltd. | Piezoelectric pump and operating method thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2006A (en) * | 1841-03-16 | Clamp for crimping leather | ||
US5839467A (en) * | 1993-10-04 | 1998-11-24 | Research International, Inc. | Micromachined fluid handling devices |
US6116863A (en) * | 1997-05-30 | 2000-09-12 | University Of Cincinnati | Electromagnetically driven microactuated device and method of making the same |
US6590267B1 (en) * | 2000-09-14 | 2003-07-08 | Mcnc | Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods |
US20040000843A1 (en) * | 2000-09-18 | 2004-01-01 | East W. Joe | Piezoelectric actuator and pump using same |
US20040021398A1 (en) * | 2000-09-18 | 2004-02-05 | East W. Joe | Piezoelectric actuator and pump using same |
US20040234752A1 (en) * | 2000-09-18 | 2004-11-25 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
US20050000641A1 (en) * | 2001-09-29 | 2005-01-06 | Siegfried Hartmann | Method for laser welding plastic parts |
US20050000618A1 (en) * | 2002-07-16 | 2005-01-06 | Jenoptik Automatisierungstechnik Gmbh | Method for joining plastic structural component parts by means of laser radiation |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910008284A (en) * | 1989-10-17 | 1991-05-31 | 야마무라 가쯔미 | Micro pump |
-
2005
- 2005-04-13 US US11/104,661 patent/US20060245951A1/en not_active Abandoned
-
2006
- 2006-04-13 WO PCT/US2006/013856 patent/WO2006113346A2/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2006A (en) * | 1841-03-16 | Clamp for crimping leather | ||
US5839467A (en) * | 1993-10-04 | 1998-11-24 | Research International, Inc. | Micromachined fluid handling devices |
US6116863A (en) * | 1997-05-30 | 2000-09-12 | University Of Cincinnati | Electromagnetically driven microactuated device and method of making the same |
US6590267B1 (en) * | 2000-09-14 | 2003-07-08 | Mcnc | Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods |
US20040000843A1 (en) * | 2000-09-18 | 2004-01-01 | East W. Joe | Piezoelectric actuator and pump using same |
US20040021398A1 (en) * | 2000-09-18 | 2004-02-05 | East W. Joe | Piezoelectric actuator and pump using same |
US20040234752A1 (en) * | 2000-09-18 | 2004-11-25 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
US20050000641A1 (en) * | 2001-09-29 | 2005-01-06 | Siegfried Hartmann | Method for laser welding plastic parts |
US20050000618A1 (en) * | 2002-07-16 | 2005-01-06 | Jenoptik Automatisierungstechnik Gmbh | Method for joining plastic structural component parts by means of laser radiation |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070129681A1 (en) * | 2005-11-01 | 2007-06-07 | Par Technologies, Llc | Piezoelectric actuation of piston within dispensing chamber |
US20110182453A1 (en) * | 2010-01-25 | 2011-07-28 | Sonion Nederland Bv | Receiver module for inflating a membrane in an ear device |
US8526651B2 (en) * | 2010-01-25 | 2013-09-03 | Sonion Nederland Bv | Receiver module for inflating a membrane in an ear device |
US20140131609A1 (en) * | 2011-05-23 | 2014-05-15 | Rausch & Pausch Gmbh | Valve-body arrangement and method for producing it, and valve having the valve-body arrangement |
US9423043B2 (en) * | 2011-05-23 | 2016-08-23 | Rausch & Pausch Gmbh | Valve-body arrangement and method for producing it, and valve having the valve-body arrangement |
US9982796B2 (en) | 2011-05-23 | 2018-05-29 | Rausch & Pausch Gmbh | Valve-body arrangement and method for producing it, and valve having the valve-body arrangement |
US20130000758A1 (en) * | 2011-06-30 | 2013-01-03 | Agilent Technologies, Inc. | Microfluidic device and external piezoelectric actuator |
US20140134715A1 (en) * | 2012-11-12 | 2014-05-15 | Samsung Electro-Mechanics Co., Ltd. | Micro-pump |
US9157428B2 (en) * | 2012-11-12 | 2015-10-13 | Samsung Electro-Mechanics Co., Ltd. | Micro-pump |
CN104481864A (en) * | 2014-12-12 | 2015-04-01 | 成都思达高科软件有限公司 | Automatic draining pump |
US20160377072A1 (en) * | 2015-06-25 | 2016-12-29 | Koge Micro Tech Co., Ltd. | Piezoelectric pump and operating method thereof |
US10393109B2 (en) * | 2015-06-25 | 2019-08-27 | Koge Micro Tech Co., Ltd. | Piezoelectric pump having a vibrating piece having a vibrating piece having a central zone, a peripheral zone, a first recess, a stopper, at least one position limiting wall, and at least one through groove and operating method thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2006113346A3 (en) | 2007-12-13 |
WO2006113346A2 (en) | 2006-10-26 |
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