US20060146498A1 - CPU cooling device - Google Patents

CPU cooling device Download PDF

Info

Publication number
US20060146498A1
US20060146498A1 US10/609,059 US60905903A US2006146498A1 US 20060146498 A1 US20060146498 A1 US 20060146498A1 US 60905903 A US60905903 A US 60905903A US 2006146498 A1 US2006146498 A1 US 2006146498A1
Authority
US
United States
Prior art keywords
cpu
heat sink
engaging
retainer
cooling assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/609,059
Inventor
Chen Shih-Tsung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHUTTLE COMPUTER GROUP Inc
Shuttle Inc
Original Assignee
SHUTTLE COMPUTER GROUP Inc
Shuttle Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHUTTLE COMPUTER GROUP Inc, Shuttle Inc filed Critical SHUTTLE COMPUTER GROUP Inc
Assigned to SHUTTLE COMPUTER GROUP, INC. reassignment SHUTTLE COMPUTER GROUP, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIH-TSUNG, CHEN
Assigned to SHUTTLE COMPUTER GROUP, INC. reassignment SHUTTLE COMPUTER GROUP, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIH-TSUNG, CHEN
Assigned to SHUTTLE INC. reassignment SHUTTLE INC. CORRECTIVE DOCUMENT TO CORRECT ASSIGNEE NAME, PREVIOUSLY RECORDED AT REEL/FRAME 014086/0154 (ASSIGNMENT OF ASSIGNOR'S INTEREST) Assignors: SHIH-TSUNG, CHEN
Publication of US20060146498A1 publication Critical patent/US20060146498A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures

Definitions

  • the present invention relates generally to cooling a central processing unit (CPU) in a computer system, and in particular to cooling a CPU using a heat sink maintained in good thermal contact with the CPU.
  • CPU central processing unit
  • CPU central processing unit
  • heat dissipation is performed by way of attaching a heat sink on top of the CPU.
  • the heat sink includes a plurality of cooling fins on the top and/or sides of the heat sink so that heat is guided via conduction from the CPU to the bottom of the heat sink contacting with the CPU, and then to the cooling fins.
  • the conduction of heat out of the computer housing may be further facilitated by a cooling fan that passes a flow of air over the cooling fins.
  • a CPU cooling assembly for cooling a CPU installed in a CPU frame.
  • the cooling assembly can be used with a number of different types of CPU frames, one such type has a plurality of engaging juts extending outward from opposite lateral sides of the CPU frame.
  • the cooling assembly comprises a heat sink and a retainer.
  • the heat sink includes a plurality of spaced apart cooling fins at an upper portion of the heat sink for dissipating heat.
  • the heat sink further including a positioning groove for receiving the retainer.
  • the retainer includes opposing engaging plates coupled by a connecting bar. The connecting bar corresponding to the positioning groove of the heat sink so that the connecting bar is received within the positioning groove when the retainer is placed over the heat sink and engaged with the CPU frame.
  • the engaging plates of the retainer have a plurality of engaging holes that correspond to the engaging juts of the CPU frame.
  • the retainer may further include a turn plate attached to an engaging plate, wherein the engaging plate can be turned to engage or disengage with engaging juts by activation of the turn plate.
  • the heat sink is placed on the CPU frame, and the retainer engages with the CPU frame and is received within the positioning groove of the heat sink.
  • the result is to tightly secure the heat sink to the CPU frame and CPU, thereby creating a good thermal coupling between the CPU and the heat sink.
  • the retainer is disengaged from the CPU base by pressing on the turn plate, and the cooling assembly can then be removed form the CPU frame and CPU.
  • FIG. 1 is a disassembled view of a CPU cooling assembly in accordance with an embodiment of the present invention.
  • FIG. 2 is a front view of an assembled CPU cooling assembly in accordance with an embodiment of the present invention.
  • FIGS. 1 and 2 illustrate an embodiment of a CPU cooling assembly in accordance with an embodiment of the present invention.
  • FIG. 1 show a disassembled view of the CPU cooling assembly
  • FIG. 2 shows an assembled view of the same.
  • the CPU cooling assembly includes a heat sink 1 , a retainer 2 , and CPU frame 4 .
  • the heat sink 1 is configured to engage to the CPU frame 4 and make thermal contact with a CPU installed in the CPU frame 4 .
  • thermal contact or thermal coupling means that heat energy can pass from one object to another; actual physical contact is not necessarily required. Accordingly, two objects can be in thermal contact or thermally coupled, even though there may be a heat conductive element disposed therebetween.
  • the retainer 2 is used to secure the heat sink 1 in thermal contact with the CPU.
  • the CPU frame 4 may be a proprietary CPU frame or one defined by a standard specification.
  • the CPU frame 4 is a zero input force (ZIF) frame, such as a K7-type ZIF CPU frame.
  • ZIF zero input force
  • a CPU is placed in a cavity in the center of the ZIF CPU frame and removed from that cavity by way of operating a lateral push lever.
  • the ZIF CPU frame 4 includes at two opposing sides a plurality of engaging juts 41 extending therefrom.
  • Other types of CPU frames can also be used with the present invention.
  • the heat sink 1 is made of a heat conductive material—usually a metal—and the bottom thereof is adapted to make thermal contact with a CPU in an assembled state. Accordingly, the bottom of the heat sink 1 is typically flat, corresponding to the surface of a typical CPU.
  • the heat sink 1 includes a plurality of upright spaced apart cooling fins 11 .
  • the cooling fins 11 are typically disposed on a top surface of the heat sink 1 .
  • one or more positioning grooves 12 are formed in the cooing fins 11 as shown in FIG. 1 . In FIG. 1 , three positioning grooves 12 are provided in the cooling fins 11 , the three positioning grooves 12 corresponding to the engaging juts 41 of the CPU frame 41 ; however, any number of positioning grooves 12 can be arranged.
  • the retainer 2 includes a pair of opposing engaging plates 21 coupled by a connecting bar 23 .
  • the engaging plates are provided with engaging holes 22 that correspond to the engaging juts 41 .
  • a connecting bar 23 joins the engaging plates 21 , and the connecting bar 23 inclines downward from the engaging plates 21 to an intermediate position (which may or may not be an equal distance from each engaging plate 21 ).
  • two connecting bars 23 are illustrated in FIG. 1 , a single connecting bar 23 or any number of connecting bars 23 can be arranged.
  • a turn plate 24 extends from an engaging plate 21 at the top end thereof. The turn plate 24 is used to facilitate the engaging and disengaging of the retainer 2 with the CPU frame 4 .
  • the retainer 2 is made of a heat conductive metal to further facilitate the dissipation of heat from the CPU.
  • the retainer 2 may also be constructed from sheet metal and formed of an integral part by way of stamping.
  • a restraining element 3 is used to fixedly position the heat sink 1 .
  • the heat sink 1 is provided with a holding groove 13 to receive the restraining element 3 .
  • the holding groove 13 is formed within the cooling fins 11 .
  • the cooling fins 11 are shown parallel with the holding groove 3 and perpendicular to the positioning grooves, the cooling fins 11 may be oriented in any direction.
  • the restraining element 3 has a curved cross section and a length substantially corresponding to the holding groove 13 .
  • the width of the restraining element 3 is a little greater than the width of the holding groove 13 so that the restraining element 3 must be compressed to fit within the holding groove 13 . Accordingly, the restraining element 3 is resilient under a force.
  • the restraining element 3 may be made of a heat conductive material (such as a metal).
  • the cooling apparatus is installed over a CPU by placing the heat sink 1 over the CPU frame 4 in which a CPU is installed.
  • the retainer 2 is then placed over the heat sink 1 such that the positioning grooves 12 of the heat sink 1 receive the connecting bar 23 of the retainer 2 .
  • the engaging holes 22 of an engaging plate 21 of the retainer 22 are fitted over the engaging juts 41 of the CPU frame 4 .
  • the engaging holes 22 of an opposite engaging plate 21 of the retainer 2 are then fitted over the engaging juts 41 of the opposite side of the CPU frame 4 . This step is performed by way of the flexibility of the material of the retainer 2 .
  • the restraining element 3 is further compressed and inserted into the holding groove 13 with the open side of the restraining element 3 facing upward so that its internal force creates a sufficient frictional force with the holding groove 13 so that the restraining element 3 remains in place. With the restraining element 3 installed in the holding groove 13 , the retainer 2 will not fall out of the heat sink 1 if it is later disengaged form the CPU frame 4 .
  • the turn plate 24 of the retainer 2 is pressed inward so that the engaging holes 22 at the same lateral side thereof are detached from the engaging juts 41 of the CPU frame 4 .
  • the engaging holes 22 from the opposite lateral side are then detached from their respective engaging juts 41 , and the cooling assembly can be removed from the CPU frame 4 .
  • the restraining element 3 is compressed and removed from the top of the holding groove 3 .
  • the retainer 2 can then be removed from the heat sink 1 by slipping it out of the positioning grooves 12 of the heat sink 1 .
  • the CPU cooling assembly in accordance with the present invention enables the heat sink 1 to be secured and in good thermal contact with a CPU.
  • the cooling apparatus provides for easy and quick assembly without the need for special tools.
  • the cooling apparatus allows for heat to be guided continuously from a CPU. Because the cooling assembly can be tightly secured to a CPU frame and CPU, the invention allows for the use of a heat sink attached to an auxiliary cooling device (e.g., to a radiator coupled to the heat sink by one or more heat pipes), where the center of the gravity of the entire cooling apparatus deviates due to the addition of the auxiliary cooling device mounted to the heat sink.
  • an auxiliary cooling device e.g., to a radiator coupled to the heat sink by one or more heat pipes

Abstract

A CPU cooling assembly includes a heat sink and a retainer. The heat sink includes a plurality of cooling fins and a positioning groove formed therein for receiving the retainer. The retainer includes opposing engaging plates coupled by a connecting bar. When the retainer is placed over the heat sink and engaged with the CPU frame, the connecting bar is received within the positioning groove. The retainer may further include a turn plate attached to an engaging plate, wherein the engaging plate can be activated to engage or disengage the cooling assembly with the CPU frame.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims the right of priority based on Taiwan application serial no. 091209840, filed on Jun. 28, 2002, which is herein incorporated in its entirety by reference.
    • BACKGROUND
  • 1. Field of the Invention
  • The present invention relates generally to cooling a central processing unit (CPU) in a computer system, and in particular to cooling a CPU using a heat sink maintained in good thermal contact with the CPU.
  • 2. Background of the Invention
  • The function of a computer's central processing unit (CPU) plays an important role in the effectiveness of the computer. For this reason, manufactures conduct research and development to improve the functionality of the computer to meet the needs of users. Research and development continue to produce computers with increasing capacity, faster operational speeds, and more powerful functionalities. In large part, these improvements are due to the efforts to create a more powerful CPU.
  • In a conventional computer assembly, heat dissipation is performed by way of attaching a heat sink on top of the CPU. The heat sink includes a plurality of cooling fins on the top and/or sides of the heat sink so that heat is guided via conduction from the CPU to the bottom of the heat sink contacting with the CPU, and then to the cooling fins. The conduction of heat out of the computer housing may be further facilitated by a cooling fan that passes a flow of air over the cooling fins. Regardless of specific implementations, efficient heat dissipation from the CPU is promoted by good thermal contact between the CPU and the heat sink, which depends on how well the heat sink is secured to the CPU.
  • Existing methods for attaching a heat sink to a CPU have some drawbacks. One deficiency is that the heat sink and the CPU may not maintain good thermal contact to each other during operation of the computer. Keeping good thermal contact between the heat sink and the CPU is important for effective heat conduction; otherwise, the heat conduction from the CPU to the heat sink becomes less effective. Additionally, attaching a heat sink to the CPU may require special tools or joining components. Further, for heat sinks that have a lateral side attached to an auxiliary cooling device (e.g., by one or more heat pipes), the center of gravity of the heat sink and cooling device assembly is not aligned with the CPU. This may cause the heat sink to lift off from horizontal contact with the CPU unless the heat sink is secured to the CPU tightly.
    • SUMMARY OF THE INVENTION
  • In one embodiment of the invention, a CPU cooling assembly is provided for cooling a CPU installed in a CPU frame. Although the cooling assembly can be used with a number of different types of CPU frames, one such type has a plurality of engaging juts extending outward from opposite lateral sides of the CPU frame. The cooling assembly comprises a heat sink and a retainer. The heat sink includes a plurality of spaced apart cooling fins at an upper portion of the heat sink for dissipating heat. The heat sink further including a positioning groove for receiving the retainer. The retainer includes opposing engaging plates coupled by a connecting bar. The connecting bar corresponding to the positioning groove of the heat sink so that the connecting bar is received within the positioning groove when the retainer is placed over the heat sink and engaged with the CPU frame. The engaging plates of the retainer have a plurality of engaging holes that correspond to the engaging juts of the CPU frame. The retainer may further include a turn plate attached to an engaging plate, wherein the engaging plate can be turned to engage or disengage with engaging juts by activation of the turn plate.
  • In operation, the heat sink is placed on the CPU frame, and the retainer engages with the CPU frame and is received within the positioning groove of the heat sink. The result is to tightly secure the heat sink to the CPU frame and CPU, thereby creating a good thermal coupling between the CPU and the heat sink. The retainer is disengaged from the CPU base by pressing on the turn plate, and the cooling assembly can then be removed form the CPU frame and CPU.
  • The novel features of the invention are set forth with particularity in the appended claims. The invention will be best understood from the following description when read in conjunction with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a disassembled view of a CPU cooling assembly in accordance with an embodiment of the present invention.
  • FIG. 2 is a front view of an assembled CPU cooling assembly in accordance with an embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • FIGS. 1 and 2 illustrate an embodiment of a CPU cooling assembly in accordance with an embodiment of the present invention. FIG. 1 show a disassembled view of the CPU cooling assembly, and FIG. 2 shows an assembled view of the same. The CPU cooling assembly includes a heat sink 1, a retainer 2, and CPU frame 4. The heat sink 1 is configured to engage to the CPU frame 4 and make thermal contact with a CPU installed in the CPU frame 4. As used herein, thermal contact or thermal coupling means that heat energy can pass from one object to another; actual physical contact is not necessarily required. Accordingly, two objects can be in thermal contact or thermally coupled, even though there may be a heat conductive element disposed therebetween. The retainer 2 is used to secure the heat sink 1 in thermal contact with the CPU.
  • The CPU frame 4 may be a proprietary CPU frame or one defined by a standard specification. In one embodiment, the CPU frame 4 is a zero input force (ZIF) frame, such as a K7-type ZIF CPU frame. In a ZIF frame, a CPU is placed in a cavity in the center of the ZIF CPU frame and removed from that cavity by way of operating a lateral push lever. The ZIF CPU frame 4 includes at two opposing sides a plurality of engaging juts 41 extending therefrom. Other types of CPU frames can also be used with the present invention.
  • The heat sink 1 is made of a heat conductive material—usually a metal—and the bottom thereof is adapted to make thermal contact with a CPU in an assembled state. Accordingly, the bottom of the heat sink 1 is typically flat, corresponding to the surface of a typical CPU. To facilitate radiation of the heat from the heat sink 1 and to guide the heat out with an optional fan, the heat sink 1 includes a plurality of upright spaced apart cooling fins 11. The cooling fins 11 are typically disposed on a top surface of the heat sink 1. Additionally, to accommodate the retainer 2, one or more positioning grooves 12 are formed in the cooing fins 11 as shown in FIG. 1. In FIG. 1, three positioning grooves 12 are provided in the cooling fins 11, the three positioning grooves 12 corresponding to the engaging juts 41 of the CPU frame 41; however, any number of positioning grooves 12 can be arranged.
  • The retainer 2 includes a pair of opposing engaging plates 21 coupled by a connecting bar 23. The engaging plates are provided with engaging holes 22 that correspond to the engaging juts 41. A connecting bar 23 joins the engaging plates 21, and the connecting bar 23 inclines downward from the engaging plates 21 to an intermediate position (which may or may not be an equal distance from each engaging plate 21). Although two connecting bars 23 are illustrated in FIG. 1, a single connecting bar 23 or any number of connecting bars 23 can be arranged. In one embodiment, a turn plate 24 extends from an engaging plate 21 at the top end thereof. The turn plate 24 is used to facilitate the engaging and disengaging of the retainer 2 with the CPU frame 4.
  • In one embodiment, the retainer 2 is made of a heat conductive metal to further facilitate the dissipation of heat from the CPU. The retainer 2 may also be constructed from sheet metal and formed of an integral part by way of stamping.
  • In one embodiment, a restraining element 3 is used to fixedly position the heat sink 1. The heat sink 1 is provided with a holding groove 13 to receive the restraining element 3. The holding groove 13 is formed within the cooling fins 11. Although the cooling fins 11 are shown parallel with the holding groove 3 and perpendicular to the positioning grooves, the cooling fins 11 may be oriented in any direction. In the embodiment shown, the restraining element 3 has a curved cross section and a length substantially corresponding to the holding groove 13. The width of the restraining element 3 is a little greater than the width of the holding groove 13 so that the restraining element 3 must be compressed to fit within the holding groove 13. Accordingly, the restraining element 3 is resilient under a force. Furthermore, the restraining element 3 may be made of a heat conductive material (such as a metal).
  • With reference to FIGS. 1 and 2, the cooling apparatus is installed over a CPU by placing the heat sink 1 over the CPU frame 4 in which a CPU is installed. The retainer 2 is then placed over the heat sink 1 such that the positioning grooves 12 of the heat sink 1 receive the connecting bar 23 of the retainer 2. The engaging holes 22 of an engaging plate 21 of the retainer 22 are fitted over the engaging juts 41 of the CPU frame 4. The engaging holes 22 of an opposite engaging plate 21 of the retainer 2 are then fitted over the engaging juts 41 of the opposite side of the CPU frame 4. This step is performed by way of the flexibility of the material of the retainer 2. Once the retainer 2 is engaged with the CPU frame 4, the connecting bar 23 of the retainer 2 presses downward against the heat sink 1 to secure the heat sink 1 tightly against the CPU.
  • In one embodiment, the restraining element 3 is further compressed and inserted into the holding groove 13 with the open side of the restraining element 3 facing upward so that its internal force creates a sufficient frictional force with the holding groove 13 so that the restraining element 3 remains in place. With the restraining element 3 installed in the holding groove 13, the retainer 2 will not fall out of the heat sink 1 if it is later disengaged form the CPU frame 4.
  • To disengage the cooling assembly from the CPU frame 4, the turn plate 24 of the retainer 2 is pressed inward so that the engaging holes 22 at the same lateral side thereof are detached from the engaging juts 41 of the CPU frame 4. The engaging holes 22 from the opposite lateral side are then detached from their respective engaging juts 41, and the cooling assembly can be removed from the CPU frame 4.
  • To separate the retainer 2 from the heat sink 1 in an embodiment where a restraining element 3 is used, the restraining element 3 is compressed and removed from the top of the holding groove 3. The retainer 2 can then be removed from the heat sink 1 by slipping it out of the positioning grooves 12 of the heat sink 1.
  • It can be seen that the CPU cooling assembly in accordance with the present invention enables the heat sink 1 to be secured and in good thermal contact with a CPU. Moreover, the cooling apparatus provides for easy and quick assembly without the need for special tools. Beneficially, the cooling apparatus allows for heat to be guided continuously from a CPU. Because the cooling assembly can be tightly secured to a CPU frame and CPU, the invention allows for the use of a heat sink attached to an auxiliary cooling device (e.g., to a radiator coupled to the heat sink by one or more heat pipes), where the center of the gravity of the entire cooling apparatus deviates due to the addition of the auxiliary cooling device mounted to the heat sink.
  • The foregoing description of the embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Persons skilled in the relevant art can appreciate that many modifications and variations are possible in light of the above teaching. It is therefore intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.

Claims (6)

1. A CPU cooling assembly for cooling a CPU installed in a CPU frame, the CPU frame having a plurality of engaging juts extending outward from opposite lateral sides of the CPU frame, the CPU cooling assembly comprising:
a heat sink having a plurality of spaced apart cooling fins at an upper portion thereof for dissipating heat, the heat sink further including a positioning groove; and
a retainer including opposing engaging plates coupled by a connecting bar, the connecting bar corresponding to the positioning groove of the heat sink so that the connecting bar is received within the positioning groove when the retainer is placed over the heat sink and engaged with the CPU frame, the engaging plates of the retainer having a plurality of engaging holes that correspond to the engaging juts of the CPU frame for engaging therewith.
2. The CPU cooling assembly of claim 1, wherein the connecting bar inclines downward towards a position between the engaging plates, the connecting bar pressing against the heat sink when the cooling assembly is installed.
3. The CPU cooling assembly of claim 1, wherein the heat sink includes a plurality of positioning grooves, each positioning groove corresponding to an opposing pair of engaging juts on a CPU frame.
4. The CPU cooling assembly of claim 1, further comprising a restraining element, wherein the heat sink further includes a holding groove for accommodating the restraining element and substantially perpendicular to the positioning groove, the restraining element compressible to be inserted into the holding groove, thereby securing the retainer to the heat sink.
5. The CPU cooling assembly of claim 1, wherein the retainer further includes a turn plate attached to an engaging plate, wherein the engaging plate can be turned to engage or disengage with engaging juts by activation of the turn plate.
6. The cooling assembly of claim 1, wherein the cooling assembly is adapted to engage with a zero input force CPU frame.
US10/609,059 2002-06-28 2003-06-27 CPU cooling device Abandoned US20060146498A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW091209480 2002-06-28
TW91209480 2002-06-28

Publications (1)

Publication Number Publication Date
US20060146498A1 true US20060146498A1 (en) 2006-07-06

Family

ID=31989799

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/459,389 Expired - Fee Related US6980421B2 (en) 2002-06-28 2003-06-10 Front panel for personal computer
US10/609,059 Abandoned US20060146498A1 (en) 2002-06-28 2003-06-27 CPU cooling device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/459,389 Expired - Fee Related US6980421B2 (en) 2002-06-28 2003-06-10 Front panel for personal computer

Country Status (1)

Country Link
US (2) US6980421B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100181059A1 (en) * 2009-01-19 2010-07-22 Asia Vital Components Co., Ltd. Stress equalized heat sink unit
US20140362525A1 (en) * 2012-02-23 2014-12-11 Zheming Zhou Low-noise computer heat dissipation device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10256648A1 (en) * 2002-12-03 2004-06-17 Endress + Hauser Wetzer Gmbh + Co Kg Signal processing unit for process automation technology for mounting on a top-hat rail
AU2003294793A1 (en) * 2003-01-03 2004-07-29 Rhode And Schwarz Gmbh And Co. Kg Modules for a measuring device and measuring device
US7019962B2 (en) * 2003-09-23 2006-03-28 Hitachi Global Storage Technologies Netherlands B.V. Electronic system having a hard disk drive with transparent cover, flashing device, and with specially decorated top plate or hub for storage applications with a visually observable disk
US7119985B2 (en) * 2003-09-23 2006-10-10 Bandic Zvonimir Z Hard disk drive with transparent cover, flashing device, and with specially decorated top plate or hub for storage applications with a visually observable disk drive
US7111381B2 (en) * 2003-09-23 2006-09-26 Hitachi Global Storage Technologies Netherlands B.V. Method of making a hard disk drive more visually stimulating
US7130185B2 (en) * 2004-06-02 2006-10-31 Research In Motion Limited Handheld computing device having drop-resistant LCD display
CN2791729Y (en) * 2005-04-09 2006-06-28 鸿富锦精密工业（深圳）有限公司 Computer housing
CN101114184A (en) * 2006-07-26 2008-01-30 鸿富锦精密工业（深圳）有限公司 Computer cabinet
US8901417B2 (en) * 2007-05-11 2014-12-02 Hubbell Incorporated Network enclosure with removable and interchangeable sides
EP3577734B1 (en) 2017-02-02 2023-04-05 Lutron Technology Company LLC Wall box installation tool

Citations (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2948518A (en) * 1957-02-06 1960-08-09 Sperry Rand Corp Fluid circulation cooling systems
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US4394344A (en) * 1981-04-29 1983-07-19 Werner Richard W Heat pipes for use in a magnetic field
US4643245A (en) * 1985-01-31 1987-02-17 Smoot Iii Edmond System cooler for a computer
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5270572A (en) * 1991-06-26 1993-12-14 Hitachi, Ltd. Liquid impingement cooling module for semiconductor devices
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5446619A (en) * 1993-08-12 1995-08-29 Compaq Computer Corp. Card extender unit for computer
US5473507A (en) * 1991-12-11 1995-12-05 Hewlett-Packard Company Chassis of a device
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5505533A (en) * 1994-01-10 1996-04-09 Artecon Rackmount for computer and mass storage enclosure
US5586865A (en) * 1996-03-08 1996-12-24 Micronics Computers Inc. Fan with transition chamber for providing enhanced convective flow
US5600538A (en) * 1994-07-08 1997-02-04 Apple Computer, Inc. Personal computer and housing structure having circuit board removable horizontally and sub-chassis removable from the top thereof
US5671118A (en) * 1995-05-15 1997-09-23 Blomquist; Michael L. Heat sink and retainer for electronic integrated circuits
US5684674A (en) * 1996-01-16 1997-11-04 Micronics Computers Inc. Circuit board mounting brackets with convective air flow apertures
US5691883A (en) * 1995-12-27 1997-11-25 Intel Corporation Multiple intake duct microprocessor cooling system
US5701231A (en) * 1996-05-03 1997-12-23 Citicorp Development Center, Inc. Personal computer enclosure with peripheral device mounting system
US5934368A (en) * 1994-09-20 1999-08-10 Hitachi, Ltd. Air-cooled electronic apparatus with condensation prevention
US5959837A (en) * 1998-04-02 1999-09-28 Ideal Electronics Inc. Heat-radiating structure for CPU
US5964279A (en) * 1997-02-10 1999-10-12 Fujikura Ltd. Cooler for electronic devices
US5982616A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6034870A (en) * 1999-01-27 2000-03-07 Sun Microsystems, Inc. Computer system having a highly efficient forced air cooling subsystem
US6094347A (en) * 1999-01-08 2000-07-25 Intel Corporation Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station
US6094345A (en) * 1996-05-14 2000-07-25 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US6134108A (en) * 1998-06-18 2000-10-17 Hewlett-Packard Company Apparatus and method for air-cooling an electronic assembly
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6223815B1 (en) * 1999-03-19 2001-05-01 Kabushiki Kaisha Toshiba Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit
US6288895B1 (en) * 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US6299408B1 (en) * 1997-11-19 2001-10-09 Intel Corporation Cooling fan for computing devices with split motor and fan blades
US20010030851A1 (en) * 2000-04-17 2001-10-18 International Business Machines Corporation Docking station for portable computer and docking structure thereof
US6311765B1 (en) * 2000-03-31 2001-11-06 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6330155B1 (en) * 2000-03-28 2001-12-11 Qtera Corporation Method and apparatus for temperature control of electrical devices mounted on circuit boards
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US6381813B1 (en) * 2000-05-19 2002-05-07 Yaw-Huey Lai Device for retaining cooling piece
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6404634B1 (en) * 2000-12-06 2002-06-11 Hewlett-Packard Company Single piece heat sink for computer chip
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US20020084062A1 (en) * 2000-12-28 2002-07-04 Chen Yun Lung Heat sink assembly
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
US6459576B1 (en) * 1996-09-30 2002-10-01 Intel Corporation Fan based heat exchanger
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US20030005584A1 (en) * 1998-11-20 2003-01-09 Sumitomo Light Metal Industries, Ltd. Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly
US6519149B1 (en) * 2000-03-31 2003-02-11 Fujitsu Limited Radiator mechanism and electronic apparatus
US6525936B2 (en) * 2001-04-30 2003-02-25 Hewlett-Packard Company Air jet cooling arrangement for electronic systems
US6574101B2 (en) * 2000-05-12 2003-06-03 Fujitsu Limited Portable electronic device capable of efficiently cooling heat-generation electronic component
US6611999B1 (en) * 2002-03-28 2003-09-02 Glacialtech, Inc. Detent means for a heat sink
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component
US20030183373A1 (en) * 2002-03-28 2003-10-02 David Sarraf Video game console cooler
US6643133B1 (en) * 2002-08-13 2003-11-04 Jefferson Liu Buckling device of a heat dissipating module
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US6650540B2 (en) * 2001-11-29 2003-11-18 Kabushiki Kaisha Toshiba Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit
US6654243B2 (en) * 2001-08-24 2003-11-25 Uniwill Computer Corporation Heat dissipation of low flow resistance in a notebook computer
US6704976B1 (en) * 2002-08-27 2004-03-16 Wan-Tien Chen Fastener for a heat-radiator
US20040052055A1 (en) * 2002-09-17 2004-03-18 Liu Heben Fixing apparatus for heat sink
US6708754B2 (en) * 2001-07-25 2004-03-23 Wen-Chen Wei Flexible heat pipe
US6813149B2 (en) * 2001-06-29 2004-11-02 Intel Corporation High capacity air-cooling systems for electronic apparatus and associated methods
US6816376B2 (en) * 2002-03-06 2004-11-09 Tyco Electronics Corporation Pluggable electronic module and receptacle with heat sink

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2262388A (en) * 1991-12-12 1993-06-16 Lion Cabinets Ltd Front panel for a peripheral computer device enclosure
JP2672055B2 (en) * 1992-05-08 1997-11-05 信幸 山村 Liquid crystal display device, manufacturing method thereof, and display device using the same
US5351176A (en) * 1992-12-31 1994-09-27 North Atlantic Industries, Inc. Panel for a computer including a hinged door with integral display
US6219229B1 (en) * 1999-09-28 2001-04-17 Len-Ho Lee Multifunctional computer
CN1299224A (en) * 1999-12-06 2001-06-13 新得力塑胶五金(深圳)有限公司 Cold-light plate unit for incoming display on communication equipment
JP3594900B2 (en) * 2000-12-19 2004-12-02 株式会社日立製作所 Display integrated computer
TW535048B (en) * 2001-11-15 2003-06-01 Wistron Corp Liquid crystal display computer with a movable rear housing
US20030202318A1 (en) * 2002-04-26 2003-10-30 Kevin Lee Housing structure for computer host

Patent Citations (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2948518A (en) * 1957-02-06 1960-08-09 Sperry Rand Corp Fluid circulation cooling systems
US3892273A (en) * 1973-07-09 1975-07-01 Perkin Elmer Corp Heat pipe lobar wicking arrangement
US4394344A (en) * 1981-04-29 1983-07-19 Werner Richard W Heat pipes for use in a magnetic field
US4643245A (en) * 1985-01-31 1987-02-17 Smoot Iii Edmond System cooler for a computer
US5270572A (en) * 1991-06-26 1993-12-14 Hitachi, Ltd. Liquid impingement cooling module for semiconductor devices
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5473507A (en) * 1991-12-11 1995-12-05 Hewlett-Packard Company Chassis of a device
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5446619A (en) * 1993-08-12 1995-08-29 Compaq Computer Corp. Card extender unit for computer
US5505533A (en) * 1994-01-10 1996-04-09 Artecon Rackmount for computer and mass storage enclosure
US5600538A (en) * 1994-07-08 1997-02-04 Apple Computer, Inc. Personal computer and housing structure having circuit board removable horizontally and sub-chassis removable from the top thereof
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5934368A (en) * 1994-09-20 1999-08-10 Hitachi, Ltd. Air-cooled electronic apparatus with condensation prevention
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5671118A (en) * 1995-05-15 1997-09-23 Blomquist; Michael L. Heat sink and retainer for electronic integrated circuits
US5691883A (en) * 1995-12-27 1997-11-25 Intel Corporation Multiple intake duct microprocessor cooling system
US5684674A (en) * 1996-01-16 1997-11-04 Micronics Computers Inc. Circuit board mounting brackets with convective air flow apertures
US5586865A (en) * 1996-03-08 1996-12-24 Micronics Computers Inc. Fan with transition chamber for providing enhanced convective flow
US5701231A (en) * 1996-05-03 1997-12-23 Citicorp Development Center, Inc. Personal computer enclosure with peripheral device mounting system
US6094345A (en) * 1996-05-14 2000-07-25 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US6352103B1 (en) * 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US6459576B1 (en) * 1996-09-30 2002-10-01 Intel Corporation Fan based heat exchanger
US6288895B1 (en) * 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US5964279A (en) * 1997-02-10 1999-10-12 Fujikura Ltd. Cooler for electronic devices
US5982616A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6299408B1 (en) * 1997-11-19 2001-10-09 Intel Corporation Cooling fan for computing devices with split motor and fan blades
US5959837A (en) * 1998-04-02 1999-09-28 Ideal Electronics Inc. Heat-radiating structure for CPU
US6134108A (en) * 1998-06-18 2000-10-17 Hewlett-Packard Company Apparatus and method for air-cooling an electronic assembly
US20030005584A1 (en) * 1998-11-20 2003-01-09 Sumitomo Light Metal Industries, Ltd. Assembly including heat pipe and heat conductive member fixed to each other by plastic deformation of the latter, and method of manufacturing the assembly
US6094347A (en) * 1999-01-08 2000-07-25 Intel Corporation Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station
US6034870A (en) * 1999-01-27 2000-03-07 Sun Microsystems, Inc. Computer system having a highly efficient forced air cooling subsystem
US6223815B1 (en) * 1999-03-19 2001-05-01 Kabushiki Kaisha Toshiba Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6330155B1 (en) * 2000-03-28 2001-12-11 Qtera Corporation Method and apparatus for temperature control of electrical devices mounted on circuit boards
US6519149B1 (en) * 2000-03-31 2003-02-11 Fujitsu Limited Radiator mechanism and electronic apparatus
US6311765B1 (en) * 2000-03-31 2001-11-06 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US20010030851A1 (en) * 2000-04-17 2001-10-18 International Business Machines Corporation Docking station for portable computer and docking structure thereof
US6574101B2 (en) * 2000-05-12 2003-06-03 Fujitsu Limited Portable electronic device capable of efficiently cooling heat-generation electronic component
US6381813B1 (en) * 2000-05-19 2002-05-07 Yaw-Huey Lai Device for retaining cooling piece
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6404634B1 (en) * 2000-12-06 2002-06-11 Hewlett-Packard Company Single piece heat sink for computer chip
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
US20020084062A1 (en) * 2000-12-28 2002-07-04 Chen Yun Lung Heat sink assembly
US6525936B2 (en) * 2001-04-30 2003-02-25 Hewlett-Packard Company Air jet cooling arrangement for electronic systems
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component
US6813149B2 (en) * 2001-06-29 2004-11-02 Intel Corporation High capacity air-cooling systems for electronic apparatus and associated methods
US6708754B2 (en) * 2001-07-25 2004-03-23 Wen-Chen Wei Flexible heat pipe
US6654243B2 (en) * 2001-08-24 2003-11-25 Uniwill Computer Corporation Heat dissipation of low flow resistance in a notebook computer
US6650540B2 (en) * 2001-11-29 2003-11-18 Kabushiki Kaisha Toshiba Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit
US6816376B2 (en) * 2002-03-06 2004-11-09 Tyco Electronics Corporation Pluggable electronic module and receptacle with heat sink
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US20030183373A1 (en) * 2002-03-28 2003-10-02 David Sarraf Video game console cooler
US6611999B1 (en) * 2002-03-28 2003-09-02 Glacialtech, Inc. Detent means for a heat sink
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US6643133B1 (en) * 2002-08-13 2003-11-04 Jefferson Liu Buckling device of a heat dissipating module
US6704976B1 (en) * 2002-08-27 2004-03-16 Wan-Tien Chen Fastener for a heat-radiator
US20040052055A1 (en) * 2002-09-17 2004-03-18 Liu Heben Fixing apparatus for heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100181059A1 (en) * 2009-01-19 2010-07-22 Asia Vital Components Co., Ltd. Stress equalized heat sink unit
US8631856B2 (en) * 2009-01-19 2014-01-21 Asia Vital Components Co., Ltd. Stress equalized heat sink unit with tightening device
US20140362525A1 (en) * 2012-02-23 2014-12-11 Zheming Zhou Low-noise computer heat dissipation device

Also Published As

Publication number Publication date
US6980421B2 (en) 2005-12-27
US20040052042A1 (en) 2004-03-18

Similar Documents

Publication Publication Date Title
US6961243B2 (en) CPU heatsink fastener
US7457122B2 (en) Memory module assembly including a clip for mounting a heat sink thereon
US7375964B2 (en) Memory module assembly including a clamp for mounting heat sinks thereon
US7443679B2 (en) Heat dissipating device having a fin also functioning as a fan holder
US7142430B2 (en) Heat dissipating device assembly
US7363966B2 (en) Heat dissipating device
US7073568B2 (en) Heat dissipation device
US5982622A (en) CPU cooling arrangement
US7286363B2 (en) Heat dissipation device
US7515419B2 (en) Locking device for heat sink
US20060146498A1 (en) CPU cooling device
US20070044944A1 (en) Radiator module structure
US7564687B2 (en) Heat dissipation device having a fixing base
US8125782B2 (en) Heat sink assembly
US20070251676A1 (en) Heat dissipation apparatus
US7394656B1 (en) Heat dissipation device
US7551447B2 (en) Resilient fastener and heat dissipation apparatus incorporating the same
US20060198107A1 (en) Heat sink assembly
US7269012B2 (en) Heat dissipation device for heat-generating electronic component
US7167367B2 (en) Heat sink clip
US7347249B2 (en) Fixing device for a radiator
US7443669B2 (en) Heat dissipating device for data storage device
US20050082034A1 (en) Radiator with airflow guiding structure
US20110061847A1 (en) Heat dissipation device
US7283367B2 (en) Locking device for heat sink

Legal Events

Date Code Title Description
AS Assignment

Owner name: SHUTTLE COMPUTER GROUP, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIH-TSUNG, CHEN;REEL/FRAME:014086/0154

Effective date: 20031022

AS Assignment

Owner name: SHUTTLE COMPUTER GROUP, INC., CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIH-TSUNG, CHEN;REEL/FRAME:017278/0789

Effective date: 20031022

AS Assignment

Owner name: SHUTTLE INC., TAIWAN

Free format text: CORRECTIVE DOCUMENT TO CORRECT ASSIGNEE NAME, PREVIOUSLY RECORDED AT REEL/FRAME 014086/0154 (ASSIGNMENT OF ASSIGNOR'S INTEREST);ASSIGNOR:SHIH-TSUNG, CHEN;REEL/FRAME:017332/0226

Effective date: 20050601

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION