US20060104799A1

US20060104799A1 - Methods and apparatus for reducing an electronic device manufacturing tool footprint

Info

Publication number: US20060104799A1
Application number: US11/179,037
Authority: US
Inventors: Janusz Jozwiak
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2004-07-12
Filing date: 2005-07-11
Publication date: 2006-05-18
Also published as: TW200614328A; KR20060050063A; JP4567541B2; CN1802084B; KR100648321B1; TWI297906B; CN1802084A; JP2006041509A

Abstract

In at least one aspect, a method includes positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint. Additionally, or alternatively, a mainframe controller may be placed so that the footprint thereof substantially overlaps the footprint of the load lock. Numerous other aspects are also provided.

Description

The present application claims priority from U.S. Provisional Patent Application Ser. No. 60/587,110, Filed Jul. 12, 2004 (Attorney Docket No. 9081/L), which is hereby incorporated by reference herein in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to electronic device manufacturing, and more particularly to methods and apparatus for reducing an electronic device manufacturing tool footprint.

BACKGROUND

FIG. 1 illustrates a conventional electronic device manufacturing tool (or system) 101. With reference to FIG. 1, the electronic device manufacturing tool 101 includes components, such as a mainframe power supply (e.g., a mainframe power box) 103 and a mainframe controller 105, coupled to a mainframe 107. The mainframe 107 may include one or more processing chambers 109, each of which is coupled to a respective processing chamber power box 110 and processing chamber controller 111, and a transfer chamber 112 coupled to a load lock 113. A footprint of the electronic device manufacturing tool 101 is the area of a floor (e.g., in a clean room) 115 occupied by the electronic device manufacturing tool 101. The mainframe power box 103 and mainframe controller 105 are coupled to a rack 117 (e.g., an enclosure rack) separate from the mainframe 107. Therefore, the mainframe power box 103 and controller 105 occupy a floor space 118 separate from the mainframe of the electronic device manufacturing tool 101, thereby increasing the electronic device manufacturing tool's footprint.
Further, the mainframe power box 103 and controller 105 are coupled to the mainframe 107 via wiring 119, which extends from the separate rack 117 to the mainframe 107. Therefore, the farther the separate rack 117 is located from the mainframe 107, the more wiring 119 is required by the electronic device manufacturing tool 101, which reduces system integration. As described below, reducing the electronic device manufacturing tool footprint may increase tool (or system) integration.
Accordingly, methods and apparatus for reducing an electronic device manufacturing tool footprint are desired.

SUMMARY OF THE INVENTION

In a first aspect of the invention, a first method is provided for reducing an electronic device manufacturing tool's footprint. The first method includes the steps of (1) positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and (2) positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.
In a second aspect of the invention, a second method is provided for reducing an electronic device manufacturing tool footprint. The second method includes the steps of (1) positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and (2) positioning a mainframe controller in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.
In a third aspect of the invention, a third method is provided for reducing an electronic device manufacturing tool shipping cost. The third method includes the steps of (1) placing a load lock and a mainframe power supply of an electronic device manufacturing tool into a container; and (2) shipping the container.
In a fourth aspect of the invention, a fourth method is provided for reducing an electronic device manufacturing tool shipping cost. The fourth method includes the steps of (1) placing a load lock and a mainframe controller of an electronic device manufacturing tool into a container; and (2) shipping the container.
In a fifth aspect of the invention, a first apparatus is provided for reducing an electronic device manufacturing tool footprint. The first apparatus includes (1) a load lock frame; (2) a load lock of an electronic device manufacturing tool coupled to the load lock frame such that the load lock occupies a first floor area; and (3) a mainframe power supply coupled to the load lock frame such that the mainframe power supply occupies a second floor area. A substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.
In a sixth aspect of the invention, a second apparatus is provided for reducing an electronic device manufacturing tool footprint. The second apparatus includes (1) a load lock frame; (2) a load lock of an electronic device manufacturing tool coupled to the load lock frame such that the load lock occupies a first floor area; and (3) a mainframe controller coupled to the load lock frame such that the mainframe controller occupies a second floor area. A substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.
In a seventh aspect of the invention, a third apparatus is provided that includes (1) an electronic device manufacturing tool having a mainframe that occupies a first footprint, and (2) a mainframe power supply that occupies a second footprint that substantially overlaps the first footprint.
In an eighth aspect of the invention, a fourth apparatus is provided that includes (1) an electronic device manufacturing tool having a mainframe that occupies a first footprint, and (2) a mainframe controller that occupies a second footprint that substantially overlaps the first footprint. Numerous other aspects are provided, as are systems and apparatus in accordance with these and other aspects of the invention.
Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates a conventional electronic device manufacturing tool.
FIG. 2 illustrates an exemplary electronic device manufacturing tool in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION

The present invention relates to increasing the integration and reducing the footprint of an electronic device manufacturing tool (or system). FIG. 2 illustrates an exemplary electronic device manufacturing tool (or system) 201 in accordance with an embodiment of the present invention. The electronic device manufacturing tool 201 may be employed to manufacture and/or process substrates such as glass or polymer substrates used to manufacture flat panel displays, semiconductor wafers, etc. With reference to FIG. 2, the configuration of the exemplary electronic device manufacturing tool 201 is similar to the configuration of the conventional electronic device manufacturing tool 101 of FIG. 1. More specifically, the exemplary electronic device manufacturing tool 201 includes a mainframe 203. The mainframe 203 includes one or more processing chambers 205, each of which is coupled to a respective processing chamber power box 206 and processing chamber controller 207, a transfer chamber 208 and a load lock 209. The load lock 209 is supported by a load lock rack 211.
A mainframe power box (e.g., power supply) 213 of the exemplary electronic device manufacturing tool 201, which provides power to the mainframe 203 and to each processing chamber power box 206, is positioned differently than is the mainframe power box 103 of the conventional electronic device manufacturing tool 101. More specifically, the load lock 209 is positioned (e.g., on the load lock rack 211) such that the load lock 209 occupies a first floor area 215, and the mainframe power box 213 is positioned to occupy a second floor area 217, a substantial portion of which is included in the first floor area 215. For example, the first floor area 215 may include the entire second floor area 217. The mainframe power box 213 is adapted to couple to the load lock rack 211. For example, the mainframe power box 213 may couple to and be supported by the load lock rack 211 and/or be an integral part of the load lock 209. For example, the mainframe power box 213 may be positioned below the load lock 209. However, the mainframe power box 213 may assume other positions, such as above the load lock 209. Therefore, according to the configuration of the exemplary electronic device manufacturing tool 201, the load lock 209 and the mainframe power box 213 occupy at least substantially overlapping floor areas. In this manner, the footprint of the electronic device manufacturing tool 201 is reduced. Reducing the electronic device manufacturing tool footprint may reduce a required clean room size, which may lower the cost of operating the tool.
Alternatively or additionally, in a similar manner to that described above, a mainframe controller 218 of the exemplary electronic device manufacturing tool 201 may be positioned differently than is the mainframe controller 105 of the conventional electronic device manufacturing tool 101. For example, in embodiments in which both the mainframe power box 213 and the mainframe controller 218 are positioned so as to reduce the footprint of the manufacturing tool 101, the mainframe controller 218 is positioned to occupy a floor area (e.g., a third floor area) 219, a substantial portion of which is included within the first floor area 215. For example, the first floor area 215 may include at least 50 percent of, or preferably the entire third floor area 219. The mainframe controller 218 may be adapted to couple to and be supported by the load lock rack 211. For example, the mainframe controller 218 may couple to a side of the load lock rack 211 opposite the side of the load lock rack 211 to which the mainframe power box 213 is coupled. Alternatively, the mainframe controller 218 may be coupled to other portions or sides of the load lock rack 211. Further, the mainframe controller 218 may be positioned above or below the load lock 209. Therefore, according to the exemplary configuration shown in FIG. 2, the load lock 209 and the mainframe controller 218 occupy overlapping floor areas. In this manner, the footprint of the electronic device manufacturing tool 201 is reduced.
The position of the mainframe power box 213 and/or the mainframe controller 218 of the inventive electronic device manufacturing tool 201 may allow wiring 220 between the mainframe power box 213 and/or the mainframe controller 218 and other components of the electronic device manufacturing tool 201 to be reduced. More specifically, because of the position of the mainframe power box 213 and/or the mainframe controller 218, the electronic device manufacturing tool 201 does not require wiring to be run from a separate enclosure to the mainframe 203 in order to couple the mainframe power box 213 and/or the mainframe controller 218 to the mainframe 203. The wiring 220 between the mainframe power box 213 and/or the mainframe controller 218 and the mainframe 203 may fit compactly within the mainframe footprint. Therefore, in addition to reducing the footprint of the electronic device manufacturing tool, the present methods and apparatus may increase system integration and reduce system complexity.
In accordance with an embodiment of the present invention the exemplary electronic device manufacturing tool 201 may be transported (e.g., shipped) more efficiently than the conventional electronic device manufacturing tool 101. More specifically, conventionally, the mainframe power box 103 and mainframe controller 105 are shipped separately from the load lock 113 of the conventional electronic device manufacturing tool 101. In contrast, the mainframe power box 213 of the inventive electronic device manufacturing tool 201 may be shipped with the load lock 209. As described above, the mainframe power box 213 may be adapted to couple to the load lock rack 211 and occupy an overlapping footprint with the load lock 209. Therefore, the load lock 209 and the mainframe power box 213 of the inventive electronic device manufacturing tool 201 (e.g., which may both be assembled to the load lock rack 209) may be shipped in the same container. By shipping the load lock 209 and the mainframe power box 213 in the same container, a total number of containers required to ship the exemplary electronic device manufacturing tool 201 is reduced. Consequently, the electronic device manufacturing tool shipping cost is reduced. Alternatively or additionally, in a similar manner, the mainframe controller 218 may be shipped in the same container as the load lock 209.
The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. In one or more embodiments, a substantial portion (e.g., at least 50 percent, and preferably 100 percent) of the floor area occupied by the mainframe power box 213 and/or the mainframe controller 218 (e.g., a second and/or third floor area, respectively) is within the floor area occupied by the load lock 209 (e.g., a first floor area 215). However, in other embodiments, a substantial portion of the floor area occupied by the mainframe power box 213 and/or the mainframe controller 218 may be within the floor area occupied by another component of the electronic device manufacturing tool 201. For example, the mainframe power box 213 and/or the mainframe controller 218 may be coupled to another component of the electronic device manufacturing tool 201 or to a support rack of that component.
Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.

Claims

1. A method of reducing an electronic device manufacturing tool footprint, comprising:

positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and

positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

2. The method of claim 1 wherein positioning the mainframe power supply in the second floor area, wherein a substantial portion of the second floor area is within the first floor area, includes positioning the mainframe power supply in the second floor area, wherein all of the second floor area is within the first floor area.

3. The method of claim 1 further comprising reducing wiring required by the electronic device manufacturing tool.

4. The method of claim 1 further comprising positioning a mainframe controller in a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

5. The method of claim 4 wherein positioning the mainframe controller in the third floor area, wherein a substantial portion of the third floor area is within the first floor area, includes positioning the mainframe controller in the third floor area, wherein all of the third floor area is within the first floor area.

6. A method of reducing an electronic device manufacturing tool footprint, comprising:

positioning a mainframe controller in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

7. The method of claim 6 wherein positioning the mainframe controller in the second floor area, wherein a substantial portion of the second floor area is within the first floor area, includes positioning the mainframe controller in the second floor area, wherein all of the second floor area is within the first floor area.

8. The method of claim 6 further comprising reducing wiring required by the electronic device manufacturing tool.

9. The method of claim 6 further comprising positioning a mainframe power supply in a third floor area, wherein all of the third floor area is within the first floor area.

10. A method of reducing an electronic device manufacturing tool shipping cost, comprising:

placing a load lock and at least one of a mainframe power supply and a mainframe controller of an electronic device manufacturing tool into a container; and

shipping the container.

11. The method of claim 10 further comprising placing both the main frame power supply and the mainframe controller of the electronic device manufacturing tool into the container prior to shipping.

12. An apparatus for reducing an electronic device manufacturing tool footprint, comprising:

a load lock frame;

a load lock of an electronic device manufacturing tool coupled to the load lock frame such that the load lock occupies a first floor area; and

a mainframe power supply coupled to the load lock frame, such that the mainframe power supply occupies a second floor area wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

13. The apparatus of claim 12 wherein all of the second floor area is within the first floor area.

14. The apparatus of claim 12 further comprising a mainframe controller coupled to the load lock frame such that the mainframe controller occupies a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

15. The apparatus of claim 14 wherein all of the third floor area is within the first floor area.

16. An apparatus for reducing an electronic device manufacturing tool footprint, comprising:

a load lock frame;

a mainframe controller coupled to the load lock frame such that the mainframe controller occupies a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

17. The apparatus of claim 16 wherein all of the second floor area is within the first floor area.

18. The apparatus of claim 17 further comprising a mainframe power supply coupled to the load lock frame such that the mainframe power supply occupies a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.

19. The apparatus of claim 18 wherein all of the third floor area is within the first floor area.

20. An apparatus comprising:

an electronic device manufacturing tool having a mainframe that occupies a first footprint, and

a mainframe power supply that occupies a second footprint that substantially overlaps the first footprint.

21. The apparatus of claim 20 further comprising a mainframe controller that occupies a third footprint that substantially overlaps the first footprint.