US20060066335A1 - Semiconductor test device with heating circuit - Google Patents
Semiconductor test device with heating circuit Download PDFInfo
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- US20060066335A1 US20060066335A1 US10/952,453 US95245304A US2006066335A1 US 20060066335 A1 US20060066335 A1 US 20060066335A1 US 95245304 A US95245304 A US 95245304A US 2006066335 A1 US2006066335 A1 US 2006066335A1
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 103
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
Definitions
- the invention is generally related to the field of semiconductor devices and, more particularly, to a semiconductor wafer having an integrally formed heating element.
- thermal reliability A well-known problem area affecting semiconductor reliability is thermal reliability. Consequently, thermal analysis is an important part of testing semiconductor devices. In particular, measurements of cyclic thermal loading on interconnect behavior, such as thermal fatigue and Joule heating that affect the known phenomena of electro-migration and stress migration of interconnects, are necessary to assess reliability of a semiconductor circuit.
- Conventional techniques for assessing the reliability of a semiconductor circuit include assembling the circuit in a ceramic or similar package, heating the package using external heating sources such as by placing the package in a temperature controlled chamber, applying heat to the package, while applying a direct current (DC) signal to the circuit and monitoring changes in the signal as the circuit is heated.
- DC direct current
- heat induced stress migration effects on a circuit may be studied by exposing the circuit to isothermal heating conditions and measuring the resistance change of the circuit.
- conventional thermal fatigue testing of a semiconductor circuit may become excessively time consuming due to the amount of time required to heat the circuit using external sources. For example, it may be difficult to ramp temperatures up and down as quickly as would be commonly experienced by a semiconductor device being used in the field.
- FIG. 1 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer.
- FIG. 2 shows a cross-sectional view of the semiconductor wafer of FIG. 1 taken along line 2 - 2 .
- FIG. 3 shows a cross-sectional view of an exemplary semiconductor test wafer comprising two layers, each layer comprising a reliability test circuit and heating circuit formed with the wafer.
- FIG. 4 shows a cross-sectional view of an exemplary semiconductor test wafer comprising three layers, a first portion of a heating circuit being positioned in a first layer, the reliability test circuit being positioned in a second layer below the first layer, and a second portion of the heating circuit being positioned in a third layer below the second layer.
- FIG. 5 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer.
- FIG. 6 shows a cross-sectional view of the semiconductor wafer of FIG. 5 taken along line 6 - 6 .
- FIG. 7 shows a cross-sectional view of the semiconductor wafer of FIG. 5 taken along line 7 - 7 .
- FIG. 8 depicts a transparent perspective view of the semiconductor wafer of FIG. 5 showing the heating circuit formed with the wafer.
- FIG. 9 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer.
- FIG. 10 shows a cross-sectional view of the semiconductor wafer of FIG. 9 taken along line 10 - 10 .
- FIG. 11 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer.
- FIG. 12 shows a cross-sectional view of an exemplary semiconductor test wafer comprising portions of a heating circuit surrounding a reliability test circuit.
- FIG. 13 depicts a transparent perspective view of the semiconductor wafer of FIG. 12 showing the heating circuit formed with the wafer.
- the conductor trace 16 is disposed coplanar with a horizontal plane of the test circuit 12 as indicated by line 11 shown in FIG. 2 .
- the conductor trace 16 may be connected to additional contacts (not shown) for applying different test signals and measuring electrical parameters corresponding to the different applied test signals.
- more than one conductor trace 16 may be used.
- a second conductor trace (not shown) may be positioned parallel to the conductor trace 16 and a capacitance or shorting characteristic between the conductor traces may be measured to monitor the effects of heating on the reliability test circuit 12 .
- the tester 20 may include a current source and/or voltage source for applying a desired constant or variable electrical signal.
- the tester 20 may also include appropriate meters for measuring electrical parameters of the test circuit 12 corresponding to an applied electrical signal.
- the heating circuit 14 may be integrally formed with the wafer, such as by using known semiconductor manufacturing processes, and includes a plurality of circuit meanders 22 positioned adjacent the conductor trace 16 .
- the meanders 22 may be oriented parallel with a plane of the reliability test circuit 12 , such as coplanar with the circuit 12 , and may surround a periphery 38 of the circuit 12 .
- the heating circuit 14 may be powered by an alternating current (AC) source 24 connected via contacts 26 for inducing heating in the heating circuit as a result of known I 2 R heating effects, where “I” is an amperage of the AC current provided to the heating circuit 14 , and “R” is the resistance of the heating circuit 14 .
- AC alternating current
- the AC source 24 may be controlled by controller 28 to provide a desired level of heating based on parameters such as amperage (measured, for example, as a root mean square of the amplitude of an AC signal) a frequency, and/or a duty cycle of the AC current.
- the controller 28 may control the AC source 24 to produce an AC current having an amperage and frequency sufficiently close to an amperage and frequency of an AC signal that a conductor trace may be subjected to when used in a semiconductor device.
- FIG. 4 shows a cross-sectional view of an exemplary semiconductor test wafer 10 having the heating circuit 14 positioned in a different layer of the wafer 10 than the reliability test circuit 12 .
- the wafer 10 depicted in FIG. 4 includes three layers, a first portion 15 of a heating circuit being positioned in a first layer 54 , the reliability test circuit 12 being positioned in a second layer 56 below the first layer 54 , and a second portion 17 of the heating circuit being positioned in a third layer 58 below the second layer 54 .
- the meanders 22 of the portions 15 , 17 of the heating circuit 14 may be oriented parallel with a plane of the test circuit 12 and surround a periphery 38 of the reliability test circuit 12 projected onto the respective layers 54 , 58 .
- the portions 15 , 17 may be powered by separate AC sources or connected together to be powered from the same AC source.
- FIG. 5 shows a top view of an exemplary embodiment of a multilayer semiconductor test wafer 10 cut away to reveal a reliability test circuit 12 positioned in a middle layer of the wafer 10 .
- the wafer 10 also includes a heating circuit 14 formed vertically with respect to a plane of the reliability test circuit 12 and extending throughout the layers.
- FIG. 6 shows a cross-sectional view of the semiconductor wafer 10 of FIG. 5 taken along line 6 - 6
- FIG. 7 shows a cross-sectional view of the semiconductor wafer of FIG. 5 taken along line 7 - 7 .
- FIGS. 1 shows a top view of an exemplary embodiment of a multilayer semiconductor test wafer 10 cut away to reveal a reliability test circuit 12 positioned in a middle layer of the wafer 10 .
- the wafer 10 also includes a heating circuit 14 formed vertically with respect to a plane of the reliability test circuit 12 and extending throughout the layers.
- FIG. 6 shows a cross-sectional view of the semiconductor wafer 10 of FIG. 5 taken along line
- the meanders of the heating circuit extend vertically though layers 54 , 56 , 58 and may be positioned to surround the periphery 38 of the reliability test circuit 12 .
- the meanders 22 may comprise horizontal traces 60 formed in layers 54 and 58 and extending in a plane parallel with a plane of the reliability test circuit 12 , and vertical vias 62 extending vertically through the layers 54 , 56 , 58 to connect the horizontal traces in layers 54 and 58 to form the heating circuit 14 .
- the vertical vias 62 may be allowed to stack on top of one another through respective “landing pads” 63 that are coplanar with the reliability test circuit 12 and conductor trace 16 . Accordingly, the heating circuit 14 forms a vertical “fence” through the layers 54 , 56 , 58 around a periphery 38 of the test circuit 12 as more clearly shown in FIG. 8 .
- FIG. 9 shows a top view of a multilayer semiconductor test wafer 10 cut away to reveal a reliability test circuit 12 in one of the layers.
- the wafer 10 also includes at least one heating circuit 14 formed in an adjacent layer 54 and overlapping a periphery 38 of the reliability test circuit 12 projected into the adjacent layer 54 .
- FIG. 10 shows a cross-sectional view of the semiconductor wafer 10 of FIG. 9 taken along line 10 - 10 .
- the wafer 10 may include three layers, a first portion 15 of a heating circuit being positioned in a first layer 54 , the reliability test circuit 12 being positioned in a second layer 56 below the first layer 54 , and a second portion 17 of the heating circuit 14 being positioned in a third layer 58 below the second layer 54 .
- the heating circuit 14 may be apportioned and each part of the apportioned heating circuit 14 may be powered separately by respective AC sources.
- the meanders themselves may be interdigitated or interleaved as shown in FIG. 12 .
Abstract
A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
Description
- The invention is generally related to the field of semiconductor devices and, more particularly, to a semiconductor wafer having an integrally formed heating element.
- A well-known problem area affecting semiconductor reliability is thermal reliability. Consequently, thermal analysis is an important part of testing semiconductor devices. In particular, measurements of cyclic thermal loading on interconnect behavior, such as thermal fatigue and Joule heating that affect the known phenomena of electro-migration and stress migration of interconnects, are necessary to assess reliability of a semiconductor circuit. Conventional techniques for assessing the reliability of a semiconductor circuit include assembling the circuit in a ceramic or similar package, heating the package using external heating sources such as by placing the package in a temperature controlled chamber, applying heat to the package, while applying a direct current (DC) signal to the circuit and monitoring changes in the signal as the circuit is heated. For example, heat induced stress migration effects on a circuit may be studied by exposing the circuit to isothermal heating conditions and measuring the resistance change of the circuit. However, conventional thermal fatigue testing of a semiconductor circuit may become excessively time consuming due to the amount of time required to heat the circuit using external sources. For example, it may be difficult to ramp temperatures up and down as quickly as would be commonly experienced by a semiconductor device being used in the field.
-
FIG. 1 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer. -
FIG. 2 shows a cross-sectional view of the semiconductor wafer ofFIG. 1 taken along line 2-2. -
FIG. 3 shows a cross-sectional view of an exemplary semiconductor test wafer comprising two layers, each layer comprising a reliability test circuit and heating circuit formed with the wafer. -
FIG. 4 shows a cross-sectional view of an exemplary semiconductor test wafer comprising three layers, a first portion of a heating circuit being positioned in a first layer, the reliability test circuit being positioned in a second layer below the first layer, and a second portion of the heating circuit being positioned in a third layer below the second layer. -
FIG. 5 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer. -
FIG. 6 shows a cross-sectional view of the semiconductor wafer ofFIG. 5 taken along line 6-6. -
FIG. 7 shows a cross-sectional view of the semiconductor wafer ofFIG. 5 taken along line 7-7. -
FIG. 8 depicts a transparent perspective view of the semiconductor wafer ofFIG. 5 showing the heating circuit formed with the wafer. -
FIG. 9 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer. -
FIG. 10 shows a cross-sectional view of the semiconductor wafer ofFIG. 9 taken along line 10-10. -
FIG. 11 shows a top view of an exemplary semiconductor test wafer cut away to reveal a reliability test circuit and heating circuit formed with the wafer. -
FIG. 12 shows a cross-sectional view of an exemplary semiconductor test wafer comprising portions of a heating circuit surrounding a reliability test circuit. -
FIG. 13 depicts a transparent perspective view of the semiconductor wafer ofFIG. 12 showing the heating circuit formed with the wafer. -
FIG. 14 shows a top view of an exemplary semiconductor test wafer cut away to reveal a plurality of test die and a plurality of heating circuits. - It is to be understood that the following detailed description is exemplary and explanatory only and is not to be viewed as being restrictive of the present, as claimed. These and other aspects, features and advantages of the present invention will become apparent after a review of the following description of the preferred embodiments and the appended claims.
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FIG. 1 shows a top view of an exemplary semiconductor test wafer 10 cut away to reveal areliability test circuit 12 and aninnovative heating circuit 14 integrally formed with thewafer 10 adjacent thereliability test circuit 12. In an aspect of the invention, thereliability test circuit 12 may include a known standard Joint Electron Device Engineering Council (JEDEC) tester, as described in JEDEC standard JESD87, or an extrusion test circuit used to measure metal extrusion phenomena during electro-migration testing, or a similar test structure used to assess interconnect reliability for resistance to electro-migration, stress-induced voiding, or stress migration. In an aspect of the invention, thereliability test circuit 12 may include one ormore conductor traces 16 havingcontacts 18 for applying and measuring electrical signals by atester 20 connected to thecontacts 18. Typically, theconductor trace 16 is disposed coplanar with a horizontal plane of thetest circuit 12 as indicated byline 11 shown inFIG. 2 . Theconductor trace 16 may be connected to additional contacts (not shown) for applying different test signals and measuring electrical parameters corresponding to the different applied test signals. In addition, more than oneconductor trace 16 may be used. For example, a second conductor trace (not shown) may be positioned parallel to theconductor trace 16 and a capacitance or shorting characteristic between the conductor traces may be measured to monitor the effects of heating on thereliability test circuit 12. Thetester 20 may include a current source and/or voltage source for applying a desired constant or variable electrical signal. Thetester 20 may also include appropriate meters for measuring electrical parameters of thetest circuit 12 corresponding to an applied electrical signal. - The
heating circuit 14 may be integrally formed with the wafer, such as by using known semiconductor manufacturing processes, and includes a plurality ofcircuit meanders 22 positioned adjacent theconductor trace 16. For example, themeanders 22 may be oriented parallel with a plane of thereliability test circuit 12, such as coplanar with thecircuit 12, and may surround aperiphery 38 of thecircuit 12. Theheating circuit 14 may be powered by an alternating current (AC)source 24 connected viacontacts 26 for inducing heating in the heating circuit as a result of known I2R heating effects, where “I” is an amperage of the AC current provided to theheating circuit 14, and “R” is the resistance of theheating circuit 14. The heat generated by theheating circuit 14 is conducted through the surrounding insulating or dielectric material 13 of thewafer 10 to impart heating to theconductor trace 16 of thetest circuit 12 positioned adjacent to theheating circuit 14. Themeanders 22 of theheating circuit 14 may be configured to provide a desired level of heating to theconductor trace 16 based on parameters such as ameander length 30, ameander width 32, aspacing 36 between meanders, and aspacing 34 between themeander 22 and theconductor trace 16. In an aspect of the invention depicted inFIG. 2 , a crosssectional width 44 andheight 42 of a heating circuit trace 40 may be about the same as awidth 48 andheight 46 of theconductor trace 16. The overall resistance of themeander 14 may be altered by adjusting parameters such asmeander length 30,meander width 32, spacing 36 between meanders andspacing 34 between themeander 22 and theconductor trace 16. - To provide additional control over heating the
reliability test circuit 12, theAC source 24 may be controlled bycontroller 28 to provide a desired level of heating based on parameters such as amperage (measured, for example, as a root mean square of the amplitude of an AC signal) a frequency, and/or a duty cycle of the AC current. For example, thecontroller 28 may control theAC source 24 to produce an AC current having an amperage and frequency sufficiently close to an amperage and frequency of an AC signal that a conductor trace may be subjected to when used in a semiconductor device. In another aspect of the invention, theAC source 24 may be cycled on and off in a desired duty cycle to expose theconductor trace 16 to cyclic thermal cycling, for example to simulate a cyclic thermal cycle that a conductor trace may be subjected to when used in a semiconductor device. Theheating circuit 14 is able to provide sufficient heat to thecircuit trace 16 of thetest circuit 12 by conducting an AC current having a higher amperage than a current used in typical semiconductor devices without the heating circuit being subject to electro-migration. Because theheating circuit 14 conducting such an AC current may not be affected by electro-migration, theheating circuit 14 may be allowed to operate at a temperature exceeding a standard operating temperature of the semiconductor device to study effects of heating. For example, for circuits having interconnects formed of aluminum alloys, the temperatures may be raised to as high as 450° Centigrade (C), and for copper interconnects, the temperatures may be raised to as high as 500° (C), taking into account the limitations of barriers and thermal properties of the materials used for the fabrication of the semiconductor wafer. -
FIG. 3 shows a cross-sectional view of an exemplarysemiconductor test wafer 10 comprising twolayers reliability test circuit 12 andheating circuit 14 formed with the wafer. Eachlayer wafer 10 may be configured as shown inFIGS. 1 and 2 so that theheating circuit 14 is coplanar and surrounds theperiphery 38. Theheating circuit 14 in eachlayer heating circuits 14 in eachlayer circuit 14 independently, while measurements are being made on thereliability test circuit 12 oflayers levels meanders 22 lie orthogonal to each other or using other design practices well known in the art. -
FIG. 4 shows a cross-sectional view of an exemplary semiconductor test wafer 10 having theheating circuit 14 positioned in a different layer of thewafer 10 than thereliability test circuit 12. For example, thewafer 10 depicted inFIG. 4 includes three layers, afirst portion 15 of a heating circuit being positioned in afirst layer 54, thereliability test circuit 12 being positioned in asecond layer 56 below thefirst layer 54, and asecond portion 17 of the heating circuit being positioned in athird layer 58 below thesecond layer 54. Themeanders 22 of theportions heating circuit 14 may be oriented parallel with a plane of thetest circuit 12 and surround aperiphery 38 of thereliability test circuit 12 projected onto therespective layers portions -
FIG. 5 shows a top view of an exemplary embodiment of a multilayer semiconductor test wafer 10 cut away to reveal areliability test circuit 12 positioned in a middle layer of thewafer 10. Thewafer 10 also includes aheating circuit 14 formed vertically with respect to a plane of thereliability test circuit 12 and extending throughout the layers.FIG. 6 shows a cross-sectional view of thesemiconductor wafer 10 ofFIG. 5 taken along line 6-6, andFIG. 7 shows a cross-sectional view of the semiconductor wafer ofFIG. 5 taken along line 7-7. As can be seen inFIGS. 6 and 7 , the meanders of the heating circuit extend vertically thoughlayers periphery 38 of thereliability test circuit 12. Themeanders 22 may comprisehorizontal traces 60 formed inlayers reliability test circuit 12, andvertical vias 62 extending vertically through thelayers layers heating circuit 14. Thevertical vias 62 may be allowed to stack on top of one another through respective “landing pads” 63 that are coplanar with thereliability test circuit 12 andconductor trace 16. Accordingly, theheating circuit 14 forms a vertical “fence” through thelayers periphery 38 of thetest circuit 12 as more clearly shown inFIG. 8 . -
FIG. 9 shows a top view of a multilayersemiconductor test wafer 10 cut away to reveal areliability test circuit 12 in one of the layers. Thewafer 10 also includes at least oneheating circuit 14 formed in anadjacent layer 54 and overlapping aperiphery 38 of thereliability test circuit 12 projected into theadjacent layer 54.FIG. 10 shows a cross-sectional view of thesemiconductor wafer 10 ofFIG. 9 taken along line 10-10. Thewafer 10 may include three layers, afirst portion 15 of a heating circuit being positioned in afirst layer 54, thereliability test circuit 12 being positioned in asecond layer 56 below thefirst layer 54, and asecond portion 17 of theheating circuit 14 being positioned in athird layer 58 below thesecond layer 54. The meanders 22 of theportions heating circuit 14 may be oriented parallel with a plane of theconductor trace 16 and overlap aperiphery 38 of thetest circuit 12 projected onto therespective layers portions FIG. 11 , themeanders 22 of theheating circuit 14, such as theportions FIG. 10 , may be interleaved, or interdigitated, between one another. In an interdigitated embodiment, theheating circuit 14 may be apportioned among the interdigitated meanders 22 and each part of the apportionedheating circuit 14 may be powered separately by respective AC sources 24. -
FIG. 12 shows a cross-sectional view of a multilayersemiconductor test wafer 10 comprising portions of aheating circuit 14 surroundingreliability test circuit 12. For example, the horizontally orientedmeander 22 configuration depicted inlayers FIGS. 9 and 10 may be combined with the vertically orientedmeander 22 configuration depicted inFIG. 8 to form a network of circuit meanders 22 positioned around thetest circuit 12 to enclose thetrace 16 within aspace 64 defined by themeanders 22. Accordingly, themeanders 22 form a “cage” (such as shown inFIG. 13 ) surrounding all sides of thetest circuit 12 so that theenclosed circuit 12 may be exposed on all sides to heat generated by a current running through the surrounding meanders 22. In an aspect of the invention, theheating circuit 14 may be apportioned and each part of the apportionedheating circuit 14 may be powered separately by respective AC sources. In yet another aspect, the meanders themselves may be interdigitated or interleaved as shown inFIG. 12 . -
FIG. 14 shows a top view of an exemplarysemiconductor test wafer 10 cut away to reveal a plurality of test die 66 and aheating circuit 14 associated with each test die 66. Each test die 66 may include areliability test circuit 12 that may include one or more conductor traces 16. Theheating circuit 14 associated with each die 66 may be configured as one of theheating circuits 14 described above and shown inFIGS. 1-13 . Eachheating circuit 14 may be connected to theAC power source 24, for example, through amultiplexer 70 for selectively providing an AC current to a desiredheating circuit 14. TheAC source 24 may be controlled bycontroller 28 to select desired parameters of the current produced, such as a frequency, an amperage and/or a duty cycle. The reliability test circuit may also be connected through amultiplexer 68 for selectively applying and measuring electrical signals by atester 20. TheAC source 24,multiplexer 70,controller 28,multiplexer 68, andtester 20 may be incorporated in a known wafer probe station to perform thermal testing of the dies 66, for example, during wafer-level testing. Multiple test die 66 may be distributed across thewafer 10 in different regions so that wafer electrical behavior in respective different regions of thewafer 10 in response to heating may be investigated. The multiple test die 66 may be removed from thewafer 10 using a dicing operation, packaged and subsequently tested for reliability using techniques well known in the art and/or in accordance with the present invention and its embodiments. - Although several embodiments of the present invention and its advantages have been described in detail, it should be understood that mutations, changes, substitutions, transformations, modifications, variations, and alterations can be made therein without departing from the teachings of the present invention, the spirit and scope of the invention being set forth by the appended claims. For example, a skilled artisan may develop different configurations of meanders, vias, and positions of meanders and vias in different layers of a semiconductor wafer, such as to form a fence or cage configuration, to produce a desired heating of one or more reliability test circuits. In addition, different portions of the heating circuit may be separately powered to achieve a desired heating effect.
Claims (27)
1. A semiconductor test device comprising:
a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit; and
a heating circuit, integrally formed with the semiconductor test device, comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
2. The semiconductor test device of claim 1 , wherein the meander of the heating circuit is oriented parallel with a plane of the test circuit.
3. The semiconductor test device of claim 2 , wherein the heating circuit is positioned to be coplanar with the test circuit.
4. The semiconductor test device of claim 2 , wherein the heating circuit surrounds a periphery of the test circuit.
5. The semiconductor test device of claim 2 , wherein the wafer comprises at least two layers, the heating circuit being positioned in a first layer and the test circuit being positioned in a second layer.
6. The semiconductor test device of claim 5 , wherein the heating circuit surrounds a periphery of the test circuit projected onto the first layer.
7. The semiconductor test device of claim 6 , wherein the heating circuit overlaps a periphery of the test circuit projected onto the first layer.
8. The semiconductor test device of claim 2 , wherein the wafer comprises at least three layers, a first portion of the heating circuit being positioned in a first layer, the test circuit being positioned in a second layer below the first layer, and a second portion of the heating circuit being positioned in a third layer below the second layer.
9. The semiconductor test device of claim 8 , wherein the heating circuit surrounds a periphery of the test circuit projected into the first layer.
10. The semiconductor test device of claim 9 , wherein the heating circuit overlaps a periphery of the test circuit projected into the first layer.
11. The semiconductor test device of claim 8 , wherein the second heating circuit surrounds a periphery of the test circuit projected into the third layer.
12. The semiconductor test device of claim 11 , wherein the second heating circuit overlaps a periphery of the test circuit projected into the third layer.
13. The semiconductor test device of claim 1 , the heating circuit comprising a plurality of meanders, wherein at least a first portion of the meanders of the heating circuit are oriented vertically with respect to a horizontal plane of the test circuit.
14. The semiconductor test device of claim 13 , wherein the at least some of the first portion of the meanders surrounds a periphery of the test circuit.
15. The semiconductor test device of claim 13 , wherein the semiconductor test device comprises at least three layers, the test circuit being positioned in a second layer between a first layer and third layer, the at least some of the first portion of the meanders being positioned in the three layers so that the at least some of the first portion of meanders extend into the first, second, and third layers.
16. The semiconductor test device of claim 15 , wherein the heating circuit surrounds the periphery of the test circuit.
17. The semiconductor test device of claim 15 , wherein the heating circuit further comprises a second plurality of meanders positioned in the first layer and oriented parallel with the plane of the test circuit.
18. The semiconductor test device of claim 15 , wherein the second plurality of meanders covers a periphery of the test circuit projected onto the first layer.
19. The semiconductor test device of claim 15 , wherein the heating circuit further comprises a third plurality of meanders positioned in the third layer and oriented parallel with the plane of the test circuit.
20. The semiconductor test device of claim 15 , wherein the third plurality of meanders covers a periphery of the test circuit projected onto the third layer.
21. The semiconductor test device of claim 1 , wherein the heating circuit receives an alternating current heating signal from a heating circuit controller.
22. The semiconductor test device of claim 21 , wherein the alternating current is turned on and off to expose the test circuit to temperature cycling at a rate corresponding to the rate at which the alternating current is turned on and off.
23. The semiconductor test device of claim 1 , wherein the heating circuit comprises a heating conductor trace having a trace width and trace height approximately the same as a trace width and trace height of a conductor trace in the test circuit.
24. The semiconductor test device of claim 1 further comprising a plurality of circuit meanders positioned around the test circuit to enclose the test circuit within a space defined by the plurality of circuit meanders.
25. A semiconductor test device comprising:
a plurality of test die having contacts for applying an electrical signal and measuring electrical parameters of the test die; and
a plurality of heating circuits, each heating circuit associated with a respective test die, each heating circuit integrally formed within the semiconductor test device and comprising at least one circuit meander positioned adjacent the respective test die for raising a temperature of the respective test die.
26. A method for evaluating reliability in a test circuit of a semiconductor device comprising:
integrally forming a heating circuit comprising a circuit meander positioned adjacent a test circuit in the semiconductor device;
applying an alternating current to the heating circuit to induce heating of the heating circuit; and
measuring an electrical parameter of the test circuit responsive to the heating of the heating circuit.
27. The method of claim 26 , further comprising turning the alternating current on and off to expose the test circuit to temperature cycling at a rate corresponding to the rate at which the alternating current is turned on and off.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/952,453 US20060066335A1 (en) | 2004-09-28 | 2004-09-28 | Semiconductor test device with heating circuit |
US11/673,714 US7804291B2 (en) | 2004-09-28 | 2007-02-12 | Semiconductor test device with heating circuit |
Applications Claiming Priority (1)
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