US20060018011A9 - Ultraviolet polarization beam splitter with minimum apodization - Google Patents
Ultraviolet polarization beam splitter with minimum apodization Download PDFInfo
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- US20060018011A9 US20060018011A9 US10/458,629 US45862903A US2006018011A9 US 20060018011 A9 US20060018011 A9 US 20060018011A9 US 45862903 A US45862903 A US 45862903A US 2006018011 A9 US2006018011 A9 US 2006018011A9
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- beamsplitter
- fluoride
- alternating layers
- coating
- coating interface
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- 230000010287 polarization Effects 0.000 title description 22
- 238000000576 coating method Methods 0.000 claims abstract description 78
- 239000011248 coating agent Substances 0.000 claims abstract description 75
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 45
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 claims description 75
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 50
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 claims description 46
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 26
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000005350 fused silica glass Substances 0.000 claims description 7
- 229910002319 LaF3 Inorganic materials 0.000 claims 3
- 229910017557 NdF3 Inorganic materials 0.000 claims 3
- 239000010410 layer Substances 0.000 description 85
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 69
- XRADHEAKQRNYQQ-UHFFFAOYSA-K trifluoroneodymium Chemical compound F[Nd](F)F XRADHEAKQRNYQQ-UHFFFAOYSA-K 0.000 description 39
- 230000003287 optical effect Effects 0.000 description 27
- 239000010409 thin film Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 9
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 8
- 229910001632 barium fluoride Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 210000000887 face Anatomy 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- APFWLFUGBMRXCS-UHFFFAOYSA-N 4,7-dihydroxy-3-phenylchromen-2-one Chemical compound O=C1OC2=CC(O)=CC=C2C(O)=C1C1=CC=CC=C1 APFWLFUGBMRXCS-UHFFFAOYSA-N 0.000 description 4
- OKOSPWNNXVDXKZ-UHFFFAOYSA-N but-3-enoyl chloride Chemical compound ClC(=O)CC=C OKOSPWNNXVDXKZ-UHFFFAOYSA-N 0.000 description 4
- QHEDSQMUHIMDOL-UHFFFAOYSA-J hafnium(4+);tetrafluoride Chemical compound F[Hf](F)(F)F QHEDSQMUHIMDOL-UHFFFAOYSA-J 0.000 description 4
- 210000001747 pupil Anatomy 0.000 description 4
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 description 4
- 229910001637 strontium fluoride Inorganic materials 0.000 description 4
- 239000012780 transparent material Substances 0.000 description 4
- TYIZUJNEZNBXRS-UHFFFAOYSA-K trifluorogadolinium Chemical compound F[Gd](F)F TYIZUJNEZNBXRS-UHFFFAOYSA-K 0.000 description 4
- RBORBHYCVONNJH-UHFFFAOYSA-K yttrium(iii) fluoride Chemical compound F[Y](F)F RBORBHYCVONNJH-UHFFFAOYSA-K 0.000 description 4
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001393 microlithography Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- OJIKOZJGHCVMDC-UHFFFAOYSA-K samarium(iii) fluoride Chemical compound F[Sm](F)F OJIKOZJGHCVMDC-UHFFFAOYSA-K 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- FWQVINSGEXZQHB-UHFFFAOYSA-K trifluorodysprosium Chemical compound F[Dy](F)F FWQVINSGEXZQHB-UHFFFAOYSA-K 0.000 description 2
- QGJSAGBHFTXOTM-UHFFFAOYSA-K trifluoroerbium Chemical compound F[Er](F)F QGJSAGBHFTXOTM-UHFFFAOYSA-K 0.000 description 2
- HPNURIVGONRLQI-UHFFFAOYSA-K trifluoroeuropium Chemical compound F[Eu](F)F HPNURIVGONRLQI-UHFFFAOYSA-K 0.000 description 2
- LKNRQYTYDPPUOX-UHFFFAOYSA-K trifluoroterbium Chemical compound F[Tb](F)F LKNRQYTYDPPUOX-UHFFFAOYSA-K 0.000 description 2
- AATUHDXSJTXIHB-UHFFFAOYSA-K trifluorothulium Chemical compound F[Tm](F)F AATUHDXSJTXIHB-UHFFFAOYSA-K 0.000 description 2
- XASAPYQVQBKMIN-UHFFFAOYSA-K ytterbium(iii) fluoride Chemical compound F[Yb](F)F XASAPYQVQBKMIN-UHFFFAOYSA-K 0.000 description 2
- 229940105963 yttrium fluoride Drugs 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
- G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
- G02B5/3041—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid comprising multiple thin layers, e.g. multilayer stacks
Definitions
- the present invention pertains to optics, and in particular, to beam splitters used in microlithography.
- Photolithography (also called microlithography) is a semiconductor fabrication technology. Photolithography uses ultraviolet or visible light to generate fine patterns in a semiconductor device design. Many types of semiconductor devices, such as, diodes, transistors, and integrated circuits, can be fabricated using photolithographic techniques. Exposure systems or tools are used to carryout photolithographic techniques, such as etching, in semiconductor fabrication.
- An exposure system can include a light source, reticle, optical reduction system, and a wafer alignment stage. An image of a semiconductor pattern is printed or fabricated on the reticle (also called a mask). A light source illuminates the reticle to generate an image of the particular reticle pattern. An optical reduction system is used to pass a high-quality image of the reticle pattern to a wafer. See, Nonogaki et al., Microlithography Fundamentals in Semiconductor Devices and Fabrication Technology , Marcel Dekker, Inc., New York, N.Y. (1998), incorporated in its entirety herein by reference.
- the minimum feature size (also called line width) refers to the smallest dimension of a semiconductor feature that can be fabricated within acceptable tolerances. As a result, it is increasingly important that photolithographic systems and techniques provide a higher resolution.
- NA numerical aperture
- Catadioptric optical reduction systems include a mirror that reflects the imaging light after it passes through the reticle onto a wafer.
- a beam splitter cube is used in the optical path of the system.
- a conventional beam splitter cube transmits about 50% of input light and reflects about 50% of the input light. Thus, depending upon the particular configuration of optical paths, significant light loss can occur at the beam splitter.
- Exposure time and the overall semiconductor fabrication time depends upon the intensity or magnitude of light output onto the wafer.
- a polarizing beam splitter and quarter-wave plates are used.
- polarizing beam splitters are designed for maximum optical throughput, but without a particular attention to the apodization they impose on the pupil of the projection optics.
- this is not a significant problem, since the natural bandwidth of the coating is typically large enough to cover the requirements.
- the coating designs become more complex, and result in an increase in undesirable performance fluctuations over the angular range of operation.
- the present invention embodies a technique for providing a beam splitter with a relatively flat apodization function.
- a beam splitter is provided whose product of the P transmittance and S transmittance is relatively flat.
- a beam splitter having the above characteristics that is usable for ultraviolet and deep ultraviolet photo lithographic applications.
- a beamsplitter including a first fluoride prism and a second fluoride prism.
- a coating interface is between the first and second fluoride prisms, wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ⁇ 2.74% in the range of 40-50 degrees of incidence.
- FIG. 1A is a perspective view of a conventional polarizing beam splitter cube
- FIG. 1B is a diagram showing a cross-section of a conventional coating interface for the polarizing beam splitter cube of FIG. 1A ;
- FIG. 2A illustrates how the polarizing beam splitter cube of FIG. 1A separates light into separate polarization states
- FIG. 2B illustrates how the polarizing beam splitter cube of FIG. 1A can be used as part of a catadioptric optical reduction system to improve transmission efficiency
- FIG. 3A is a perspective view of a UV polarizing beam splitter cube according to one embodiment of the present invention.
- FIG. 3B is a diagram showing a cross-section of a coating interface for the UV polarizing beam splitter cube of FIG. 3A ;
- FIGS. 4-8 illustrate exemplary beamsplitter transmission performance according to the present invention.
- beam splitter or “cube” used with respect to the present invention have a broad meaning that refers to a beam splitter that includes, but is not limited to, a beam splitter having an overall cubic shape, rectangular cubic shape, or truncated cubic shape, or approximating an overall cubic shape, rectangular cubic shape, or truncated cubic shape.
- long conjugate end refers to a plane at the object or reticle end of an optical reduction system.
- short conjugate end refers to the plane at the image or wafer end of an optical reduction system.
- wafer refers to the base material in semiconductor manufacturing, which goes through a series of photomasking, etching and/or implementation steps.
- wave plate refers to retardation plates or phase shifters made from materials which exhibit birefringence.
- FIGS. 1A and 1B illustrate an example conventional polarizing beam splitter cube 100 used in a conventional catadioptric optical reduction system.
- Polarizing beam splitter cuber 100 includes two prisms 110 , 150 , and a coating interface 120 .
- Prisms 120 , 150 are made of fused silica and are transmissive at wavelengths of 248 nm and 193 nm.
- Coating interface 120 is a multi-layer stack.
- the multi-layer stack includes alternating thin film layers.
- the alternating thin film layers are made of thin films having relatively high and low indices of refraction (n 1 and n 2 ).
- the alternating thin film layers and their respective indices of refraction are selected such that the MacNeille condition (also called Brewster condition) is satisfied.
- the high index of refraction thin film material is an aluminum oxide.
- the low index of refraction material is aluminum fluoride.
- a protective layer may be added during the fabrication of the stack. Cement or glue is included to attach one of the alternating layers to a prism 150 at face 152 or to attach the protective layer to prism 110 at face 112 .
- the MacNeille condition (as described in U.S. Pat. No. 2,403,731) is a condition at which light 200 incident upon the multi-layer stack is separated into two beams 260 , 280 having different polarization states.
- output beam 260 is an S-polarized beam
- output beam 280 is a P-polarized beam (or polarized at 90 degrees with respect to each other).
- FIG. 2B shows the advantage of using a polarizing beam splitter in a catadioptric optical reduction system to minimize light loss.
- Incident light 200 (usually having S and P polarization states) passes through a quarter-wave plate 210 .
- Quarter wave plate 210 converts all of incident light 200 to a linearly polarized beam in an S polarization state.
- Beam splitter cube 100 reflects all or nearly all of the S polarization to quarter wave plate 220 and mirror 225 .
- Quarter wave plate 220 when doubled passed acts like a half-waveplate.
- Quarter wave plate 220 converts the S polarization light to circular polarization, and after reflection from mirror 225 , converts light into P-polarized light.
- the P-polarized light is transmitted by beam splitter cube 100 and output as a P-polarized beam 290 toward the wafer.
- the polarizing beam splitter 100 and quarter wave plates 210 , 220 avoid light loss in a catadioptric optical reduction system that includes a mirror 225 .
- mirror 225 and quarter wave plate 220 can be positioned at face B of cube 100 , rather than at face A, and still achieve the same complete or nearly complete light transmission over a compact optical path length.
- the invention can be used in catadioptric photolithography systems. It can be used in any polarizing beamsplitter system in which the beamsplitter is used over a range of angles and in which the light passes through the beamsplitter twice at orthogonal polarizations.
- Typical polarizing beamsplitters as described above with reference to FIGS. 1A-2B , are designed for maximum optical throughput but without particular attention to the apodization they impose on the pupil of the projection optics. This is not a significant problem in systems with low numerical apertures (i.e., a lower range of operating angles at the beamsplitter coating), where the natural bandwidth of the coating was large enough to cover the requirement. At higher numerical apertures, coating designs become more complex, with a resultant increase in undesirable performance fluctuations over the angular range of operation.
- the present invention provides a ultraviolet (UV) polarizing beam splitter.
- the UV polarizing beam splitter is transmissive to light at wavelengths equal to or less than 200 nm, for example, at 193 nm or 157 nm.
- the UV polarizing beam splitter can image at high quality light incident over a wide range of reflectance and transmittance angles.
- the UV polarizing beam splitter can accommodate divergent light in an optical reduction system having a numeric aperture at a wafer plane greater than 0.6, and for example at 0.75.
- the UV polarizing beam splitter can have a cubic, rectangular cubic, or truncated cubic shape, or approximates a cubic, rectangular cubic, or truncated cubic shape.
- a UV polarizing beam splitter cube comprises a pair of prisms and a coating interface.
- the prisms are made of at least a fluoride material, such as, calcium fluoride (CaF 2 ) or barium fluoride (BaF 2 ).
- the coating interface has a plurality of layers of a thin film fluoride material.
- the coating interface includes a multi-layer stack of alternating layers of thin film fluoride materials.
- the alternating layers of thin film fluoride materials comprise first and second fluoride materials.
- the first and second fluoride materials have respective first and second refractive indices.
- the first refractive index is greater than (or higher than) the second refractive index.
- the first and second refractive indices form a stack of fluoride materials having relatively high and low refractive indices of refraction such that the coating interface separates UV light (including light at wavelengths less than 200 nm, for example, at 193 nm or 157 nm) depending on two polarized states.
- the coating interface comprises a multi-layer design of the form (H L) n H or (H L) n , where H indicates a layer of a first fluoride material having a relatively high refractive index.
- the first fluoride material can include, but is not limited to, gadolinium tri-fluoride (GdF 3 ), lanthanum tri-fluoride (LaF 3 ), samarium fluoride (SmF 3 ), europium fluoride (EuF 3 ), terbium fluoride (TbF 3 ), dysprosium fluoride (DyF 3 ), holmium fluoride (HoF 3 ), erbium fluoride (ErF 3 ), thulium fluoride (TmF 3 ), ytterbium fluoride (YbF 3 ), lutetium fluoride (LuF 3 ), zirconium fluoride (ZrF 4 ), hafnium fluoride (HfF 4 ), yttrium fluoride (YF 3 ), neodymium fluoride (NdF 3 ), any of the other lanthanide series tri-fluorides, metallic fluorides, or other high index
- the L indicates a layer of a second fluoride material having a relatively low refractive index.
- the second fluoride material can include, but is not limited to, magnesium fluoride (MgF 2 ), aluminum tri-fluoride (AlF 3 ), barium fluoride (BaF 2 ), strontium fluoride (SrF 2 ), calcium fluoride (CaF 2 ), lithium fluoride (LiF), and sodium fluoride (NaF), or other low index, ultraviolet transparent material.
- the value “n” indicates the basic (H L) group is repeated n times in a multi-layer stack, where n is a whole number equal to one or more.
- the prisms and coating interface are joined by optical contact. No cement is needed, although its use is not precluded.
- Multi-layer designs can be generated by computer iterated design. Layers in a multi-layer stack can also be graded across the hypotenuse face of a prism to adjust layer thicknesses at any point so as to compensate for changes in the incidence angle of the light.
- the present invention provides a method for splitting an incident light beam based on polarization state.
- the method includes the step of orienting a coating interface having a plurality of layers of a fluoride material at an angle relative to the incident light such that the coating interface transmits incident light in a first polarization state and reflects incident light in a second polarization state.
- the method further includes the step of selecting thicknesses of alternating thin film layers and their respective indices of refraction such that the coating interface transmits incident light at a wavelength equal to or less than 200 nm in a first polarization state and reflects incident light at a wavelength equal to or less than 200 nm in a second polarization state.
- FIG. 3A is a perspective view of a UV polarizing beam splitter cube 300 according to one embodiment of the present invention.
- UV polarizing beam splitter cube 300 has a pair of prisms 310 , 350 and a coating interface 320 .
- Prisms 310 , 350 are preferably made of a fluoride material.
- Coating interface 320 has a plurality of layers of a thin film fluoride material.
- prism 310 is a right angle prism having five faces. These five faces consist of two side faces, two end faces, and a hypotenuse face. The two side faces are square (or approximately square) at their perimeter and share right angle corners 314 and 316 . One side face B is shown in FIG. 3A , the other side face is not shown. The two end faces are both right triangles.
- One end face A, shown in FIG. 3A is a right triangle at its perimeter formed by a ninety degree (or approximately ninety degree) angle at corner 314 and two 45 degree (or approximately 45 degree) angles opposite corner 314 .
- the other end face (not shown) is the right triangle formed by a ninety degree (or approximately ninety degree) angle at corner 316 and two 45 degree (or approximately 45 degree) angles opposite corner 316 .
- the hypotenuse face is a planar face 312 which is on a hypotenuse side of right angle prism 310 opposite right angle corners 314 , 316 .
- Prism 350 is also a right angle prism having five faces. These five faces consist of two side faces, two end faces, and a hypotenuse face. The two side faces are square (or approximately square) at their perimeter and share right angle corners 354 and 356 . One side face D is shown in FIG. 3A , the other side face is not shown. The two end faces are both right triangles. One end face C, shown in FIG. 3A , is a right triangle at its perimeter formed by a ninety degree (or approximately ninety degree) angle at corner 354 and two 45 degree (or approximately 45 degree) angles opposite corner 354 .
- the other end face (not shown) is the right triangle formed by a ninety degree (or approximately ninety degree) angle at corner 356 and two 45 degree (or approximately 45 degree) angles opposite corner 356 .
- the hypotenuse face is a planar face 352 which is on a hypotenuse side of right angle prism 350 opposite right angle corners 354 , 356 .
- Coating interface 320 lies between hypotenuse faces 312 and 352 .
- UV polarizing beam splitter cube 300 has width, depth, and height dimensions equal to values d 1 , d 2 , and d 3 respectively, as shown in FIG. 3A .
- d 1 , d 2 , and d 3 are equal (or approximately equal) such that prisms 310 and 350 when coupled along their faces 312 and 352 have an overall cube or cube-like shape.
- prisms 310 , 350 are made of calcium fluoride (CaF 2 ) material, barium fluoride (BaF 2 ) material, or a combination thereof.
- FIG. 3B is a diagram showing a cross-section of an example coating interface 320 , used to achieve a relatively flat R(s)*T(p) function, in greater detail.
- Coating interface 320 includes a stack of alternating layers of thin film fluoride materials ( 331 - 337 , 341 - 346 ), and a protective layer 351 .
- Anti-reflection (AR) coatings (not shown) can also be included in coating interface 320 .
- Protective layer 351 and AR coatings are optional.
- the present invention in not limited to thirteen layers of alternating layers of thin film fluoride materials. In general, larger and smaller numbers of alternating layers of thin film fluoride materials can be used as would be apparent to a person skilled in the art given this description.
- FIG. 3B shows the coating interface 320 mounted on face 352 of prism 350 .
- the stack of alternating layers of thin film fluoride materials ( 331 - 337 , 341 - 346 ) and/or protective layer 351 are grown, etched, or fabricated on face 352 using conventional thin film techniques.
- Prism 310 is then placed in optical contact with the coating interface 320 . In this way, prisms 310 and 350 are coupled strongly through coating interface 320 resulting in a very strong polarizing beam splitter cube.
- One further feature of the present invention is that it applies this optical contact (where optical components are joined so closely together that van der Waal's forces couple the components to one another) in a complex geometry involving angled surfaces, such as, the hypotenuse face of prism 310 .
- the alternating layers of thin film fluoride materials include two groups of layers.
- the first group of layers 331 - 337 has a first index of refraction n 1 .
- the second group of layers 341 - 346 has a second index of refraction n 2 .
- the first and second refractive indices n 1 and n 2 are different.
- the second refractive index n 2 is relatively low compared to the first refractive index n 1 .
- coating interface 320 includes a stack of fluoride materials 331 - 337 , 341 - 346 having alternating relatively high and low refractive indices n 1 , n 2 such that the coating interface 320 separates incident UV light based on two different polarization states, such as S and P polarization states.
- polarizing beam splitter cube 300 can be used with light at wavelengths equal to or less than 200 nm, and in particular, at 193 or 157.6 nm, for example.
- the coating interface 320 comprises a multi-layer design of the form (H L) n H or (H L) n , where H indicates a layer of a first fluoride material having relatively high refractive index.
- the first fluoride material can include, but is not limited to, gadolinium tri-fluoride (GdF 3 ), lanthanum tri-fluoride (LaF 3 ), samarium fluoride (SmF 3 ), europium fluoride (EuF 3 ), terbium fluoride (TbF 3 ), dysprosium fluoride (DyF 3 ), holmium fluoride (HoF 3 ), erbium fluoride (ErF 3 ), thulium fluoride (TmF 3 ), ytterbium fluoride (YbF 3 ), lutetium fluoride (LuF 3 ), zirconium fluoride (ZrF 4 ), hafnium fluoride (HfF 4 ), yttrium fluoride (YF 3 ), neodymium fluoride (NdF 3 ), any of the other lanthanide series tri-fluorides, metallic fluorides, or other high index
- the second fluoride material can include, but is not limited to, magnesium fluoride (MgF 2 ), aluminum tri-fluoride (AlF 3 ), barium fluoride (BaF 2 ), strontium fluoride (SrF 2 ), calcium fluoride (CaF 2 ), lithium fluoride (LiF), and sodium fluoride (NaF), or other low index, ultraviolet transparent material.
- MgF 2 magnesium fluoride
- AlF 3 aluminum tri-fluoride
- BaF 2 barium fluoride
- SrF 2 strontium fluoride
- CaF 2 calcium fluoride
- LiF lithium fluoride
- NaF sodium fluoride
- the superscript value “n” indicates the basic (H L) group is repeated n times in a multi-layer stack, where n is a whole number equal to one or more.
- This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 70.85 to a minimum of 65.37, or a delta of 5.48% ( ⁇ 2.74%).
- This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 67.9% to a minimum of 66.15%, or a delta of 1.74% ( ⁇ 0.87%).
- This example provides a relatively flat R(s)*T(p) function between 40 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 72.69% to a minimum of 71.80% or a delta of 0.89% ( ⁇ 0.445%).
- This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 72.55% to a minimum 71.24%, or a delta of 1.31% ( ⁇ 0.655%).
- This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 74.60% to a minimum of 70.38%, or a delta of 4.33$ ( ⁇ 2.11%).
- Table 11 illustrates another example of a coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 21 alternating layers of LaF 3 and MgF 2 .
- This example provides a relatively flat R(s)*T(p) function between 44 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 68.08% to a minimum of 67.95%, or a delta of 0.128% ( ⁇ 0.064%).
- Table 13 below illustrates another example of a coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 11 alternating layers of LaF 3 and MgF 2 .
- This example provides a relatively flat R(s)*T(p) function between 44 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 63.11% to a minimum of 62.897%, or a delta of 0.21% ( ⁇ 0.1%).
Abstract
A beamsplitter includes a first fluoride prism and a second fluoride prism. A coating interface is between the first and second fluoride prisms, wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 40-50 degrees of incidence.
Description
- 1. Field of the Invention
- The present invention pertains to optics, and in particular, to beam splitters used in microlithography.
- 2. Related Art
- Photolithography (also called microlithography) is a semiconductor fabrication technology. Photolithography uses ultraviolet or visible light to generate fine patterns in a semiconductor device design. Many types of semiconductor devices, such as, diodes, transistors, and integrated circuits, can be fabricated using photolithographic techniques. Exposure systems or tools are used to carryout photolithographic techniques, such as etching, in semiconductor fabrication. An exposure system can include a light source, reticle, optical reduction system, and a wafer alignment stage. An image of a semiconductor pattern is printed or fabricated on the reticle (also called a mask). A light source illuminates the reticle to generate an image of the particular reticle pattern. An optical reduction system is used to pass a high-quality image of the reticle pattern to a wafer. See, Nonogaki et al., Microlithography Fundamentals in Semiconductor Devices and Fabrication Technology, Marcel Dekker, Inc., New York, N.Y. (1998), incorporated in its entirety herein by reference.
- Integrated circuit designs are becoming increasingly complex. The number of components and integration density of components in layouts is increasing. Demand for an ever-decreasing minimum feature size is high. The minimum feature size (also called line width) refers to the smallest dimension of a semiconductor feature that can be fabricated within acceptable tolerances. As a result, it is increasingly important that photolithographic systems and techniques provide a higher resolution.
- One approach to improve resolution is to shorten the wavelength of light used in fabrication. Increasing the numerical aperture (NA) of the optical reduction system also improves resolution. Indeed, commercial exposure systems have been developed with decreasing wavelengths of light and increasing NA.
- Catadioptric optical reduction systems include a mirror that reflects the imaging light after it passes through the reticle onto a wafer. A beam splitter cube is used in the optical path of the system. A conventional beam splitter cube, however, transmits about 50% of input light and reflects about 50% of the input light. Thus, depending upon the particular configuration of optical paths, significant light loss can occur at the beam splitter.
- In UV photolithography, however, it is important to maintain a high light transmissivity through an optical reduction system with little or no loss. Exposure time and the overall semiconductor fabrication time depends upon the intensity or magnitude of light output onto the wafer. To reduce light loss at the beam splitter, a polarizing beam splitter and quarter-wave plates are used.
- Generally, polarizing beam splitters are designed for maximum optical throughput, but without a particular attention to the apodization they impose on the pupil of the projection optics. In optical systems having low numerical apertures (i.e., on numerical apertures corresponding to a lower range of operating angles at the beam splitter coating), this is not a significant problem, since the natural bandwidth of the coating is typically large enough to cover the requirements. However, at higher numerical apertures, the coating designs become more complex, and result in an increase in undesirable performance fluctuations over the angular range of operation.
- Accordingly, what is needed is a beamsplitter with a relatively flat apodization function over a wide angular range that is usable in UV photolithography.
- The present invention embodies a technique for providing a beam splitter with a relatively flat apodization function.
- In an embodiment of the present invention, a beam splitter is provided whose product of the P transmittance and S transmittance is relatively flat.
- In another embodiment of the present invention, a beam splitter is provided having the above characteristics that is usable for ultraviolet and deep ultraviolet photo lithographic applications.
- In one aspect of the invention, there is provided a beamsplitter including a first fluoride prism and a second fluoride prism. A coating interface is between the first and second fluoride prisms, wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 40-50 degrees of incidence.
- Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
- To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, there is provided a
- The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the invention. In the drawings:
-
FIG. 1A is a perspective view of a conventional polarizing beam splitter cube; -
FIG. 1B is a diagram showing a cross-section of a conventional coating interface for the polarizing beam splitter cube ofFIG. 1A ; -
FIG. 2A illustrates how the polarizing beam splitter cube ofFIG. 1A separates light into separate polarization states; -
FIG. 2B illustrates how the polarizing beam splitter cube ofFIG. 1A can be used as part of a catadioptric optical reduction system to improve transmission efficiency; -
FIG. 3A is a perspective view of a UV polarizing beam splitter cube according to one embodiment of the present invention; -
FIG. 3B is a diagram showing a cross-section of a coating interface for the UV polarizing beam splitter cube ofFIG. 3A ; and -
FIGS. 4-8 illustrate exemplary beamsplitter transmission performance according to the present invention. - The present invention will now be described with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Additionally, the left-most digit(s) of a reference number identifies the drawing in which the reference number first appears.
- While the present invention is described herein with reference to illustrative embodiments for particular applications, it should be understood that the invention is not limited thereto. Those skilled in the art with access to the teachings provided herein will recognize additional modifications, applications, and embodiments within the scope thereof and additional fields in which the present invention would be of significant utility.
- Terminology
- The terms “beam splitter” or “cube” used with respect to the present invention have a broad meaning that refers to a beam splitter that includes, but is not limited to, a beam splitter having an overall cubic shape, rectangular cubic shape, or truncated cubic shape, or approximating an overall cubic shape, rectangular cubic shape, or truncated cubic shape.
- The term “long conjugate end” refers to a plane at the object or reticle end of an optical reduction system.
- The term “short conjugate end” refers to the plane at the image or wafer end of an optical reduction system.
- The term “wafer” refers to the base material in semiconductor manufacturing, which goes through a series of photomasking, etching and/or implementation steps.
- The term “wave plate” refers to retardation plates or phase shifters made from materials which exhibit birefringence.
-
FIGS. 1A and 1B illustrate an example conventional polarizingbeam splitter cube 100 used in a conventional catadioptric optical reduction system. Polarizingbeam splitter cuber 100 includes twoprisms coating interface 120.Prisms Coating interface 120 is a multi-layer stack. The multi-layer stack includes alternating thin film layers. The alternating thin film layers are made of thin films having relatively high and low indices of refraction (n1 and n2). The alternating thin film layers and their respective indices of refraction are selected such that the MacNeille condition (also called Brewster condition) is satisfied. In one example, the high index of refraction thin film material is an aluminum oxide. The low index of refraction material is aluminum fluoride. A protective layer may be added during the fabrication of the stack. Cement or glue is included to attach one of the alternating layers to aprism 150 atface 152 or to attach the protective layer toprism 110 atface 112. - As shown in
FIG. 2A , the MacNeille condition (as described in U.S. Pat. No. 2,403,731) is a condition at which light 200 incident upon the multi-layer stack is separated into twobeams output beam 260 is an S-polarized beam, andoutput beam 280 is a P-polarized beam (or polarized at 90 degrees with respect to each other).FIG. 2B shows the advantage of using a polarizing beam splitter in a catadioptric optical reduction system to minimize light loss. Incident light 200 (usually having S and P polarization states) passes through a quarter-wave plate 210.Quarter wave plate 210 converts all of incident light 200 to a linearly polarized beam in an S polarization state.Beam splitter cube 100 reflects all or nearly all of the S polarization to quarter wave plate 220 andmirror 225. Quarter wave plate 220 when doubled passed acts like a half-waveplate. Quarter wave plate 220 converts the S polarization light to circular polarization, and after reflection frommirror 225, converts light into P-polarized light. The P-polarized light is transmitted bybeam splitter cube 100 and output as a P-polarizedbeam 290 toward the wafer. In this way, thepolarizing beam splitter 100 andquarter wave plates 210, 220 avoid light loss in a catadioptric optical reduction system that includes amirror 225. Note, as an alternative,mirror 225 and quarter wave plate 220 can be positioned at face B ofcube 100, rather than at face A, and still achieve the same complete or nearly complete light transmission over a compact optical path length. - The invention, which will be further described below, can be used in catadioptric photolithography systems. It can be used in any polarizing beamsplitter system in which the beamsplitter is used over a range of angles and in which the light passes through the beamsplitter twice at orthogonal polarizations.
- Typical polarizing beamsplitters, as described above with reference to
FIGS. 1A-2B , are designed for maximum optical throughput but without particular attention to the apodization they impose on the pupil of the projection optics. This is not a significant problem in systems with low numerical apertures (i.e., a lower range of operating angles at the beamsplitter coating), where the natural bandwidth of the coating was large enough to cover the requirement. At higher numerical apertures, coating designs become more complex, with a resultant increase in undesirable performance fluctuations over the angular range of operation. - In the beamsplitter of the present invention, light passes through the beamsplitter twice, first in S polarization and then again in P polarization. The two performance curves (S and P as functions of angle) multiplied together determine the overall apodization function that the coating introduces into the system pupil. Previous efforts to design coatings with lower pupil apodization focused on flattening the S and P performance curves individually. In the design of the beamsplitter coating it is relatively easy to effect changes in the performance for the S polarization, and more difficult to effect changes in the P polarization performance. If the beamsplitter is doubled-passed in the system, P polarization performance variations can be compensated for by a coating whose S polarization performance has the opposite “signature.” When the two functions R(s) and T(p) are multiplied together, they produce an apodization function R(s)*T(p) that is relatively flat.
- To achieve a relatively flat R(s)*T(p) function, the present invention provides a ultraviolet (UV) polarizing beam splitter. The UV polarizing beam splitter is transmissive to light at wavelengths equal to or less than 200 nm, for example, at 193 nm or 157 nm. The UV polarizing beam splitter can image at high quality light incident over a wide range of reflectance and transmittance angles. The UV polarizing beam splitter can accommodate divergent light in an optical reduction system having a numeric aperture at a wafer plane greater than 0.6, and for example at 0.75. In different embodiments, the UV polarizing beam splitter can have a cubic, rectangular cubic, or truncated cubic shape, or approximates a cubic, rectangular cubic, or truncated cubic shape.
- In one embodiment, a UV polarizing beam splitter cube comprises a pair of prisms and a coating interface. The prisms are made of at least a fluoride material, such as, calcium fluoride (CaF2) or barium fluoride (BaF2). The coating interface has a plurality of layers of a thin film fluoride material. In one example implementation, the coating interface includes a multi-layer stack of alternating layers of thin film fluoride materials. The alternating layers of thin film fluoride materials comprise first and second fluoride materials. The first and second fluoride materials have respective first and second refractive indices. The first refractive index is greater than (or higher than) the second refractive index. In one feature of the present invention, the first and second refractive indices form a stack of fluoride materials having relatively high and low refractive indices of refraction such that the coating interface separates UV light (including light at wavelengths less than 200 nm, for example, at 193 nm or 157 nm) depending on two polarized states.
- In one example, to achieve a relatively flat R(s)*T(p) function, the coating interface comprises a multi-layer design of the form (H L)n H or (H L)n, where H indicates a layer of a first fluoride material having a relatively high refractive index. The first fluoride material can include, but is not limited to, gadolinium tri-fluoride (GdF3), lanthanum tri-fluoride (LaF3), samarium fluoride (SmF3), europium fluoride (EuF3), terbium fluoride (TbF3), dysprosium fluoride (DyF3), holmium fluoride (HoF3), erbium fluoride (ErF3), thulium fluoride (TmF3), ytterbium fluoride (YbF3), lutetium fluoride (LuF3), zirconium fluoride (ZrF4), hafnium fluoride (HfF4), yttrium fluoride (YF3), neodymium fluoride (NdF3), any of the other lanthanide series tri-fluorides, metallic fluorides, or other high index, ultraviolet transparent material. L indicates a layer of a second fluoride material having a relatively low refractive index. The second fluoride material can include, but is not limited to, magnesium fluoride (MgF2), aluminum tri-fluoride (AlF3), barium fluoride (BaF2), strontium fluoride (SrF2), calcium fluoride (CaF2), lithium fluoride (LiF), and sodium fluoride (NaF), or other low index, ultraviolet transparent material. The value “n” indicates the basic (H L) group is repeated n times in a multi-layer stack, where n is a whole number equal to one or more.
- According to a further feature, the prisms and coating interface are joined by optical contact. No cement is needed, although its use is not precluded.
- Further multi-layer designs can be generated by computer iterated design. Layers in a multi-layer stack can also be graded across the hypotenuse face of a prism to adjust layer thicknesses at any point so as to compensate for changes in the incidence angle of the light.
- The present invention provides a method for splitting an incident light beam based on polarization state. The method includes the step of orienting a coating interface having a plurality of layers of a fluoride material at an angle relative to the incident light such that the coating interface transmits incident light in a first polarization state and reflects incident light in a second polarization state. In one example, the method further includes the step of selecting thicknesses of alternating thin film layers and their respective indices of refraction such that the coating interface transmits incident light at a wavelength equal to or less than 200 nm in a first polarization state and reflects incident light at a wavelength equal to or less than 200 nm in a second polarization state.
- UV Polarizing Beam Splitter
-
FIG. 3A is a perspective view of a UV polarizingbeam splitter cube 300 according to one embodiment of the present invention. UV polarizingbeam splitter cube 300 has a pair ofprisms coating interface 320.Prisms Coating interface 320 has a plurality of layers of a thin film fluoride material. - In the example shown in
FIG. 3A ,prism 310 is a right angle prism having five faces. These five faces consist of two side faces, two end faces, and a hypotenuse face. The two side faces are square (or approximately square) at their perimeter and shareright angle corners FIG. 3A , the other side face is not shown. The two end faces are both right triangles. One end face A, shown inFIG. 3A , is a right triangle at its perimeter formed by a ninety degree (or approximately ninety degree) angle atcorner 314 and two 45 degree (or approximately 45 degree) angles oppositecorner 314. The other end face (not shown) is the right triangle formed by a ninety degree (or approximately ninety degree) angle atcorner 316 and two 45 degree (or approximately 45 degree) angles oppositecorner 316. The hypotenuse face is aplanar face 312 which is on a hypotenuse side ofright angle prism 310 oppositeright angle corners -
Prism 350 is also a right angle prism having five faces. These five faces consist of two side faces, two end faces, and a hypotenuse face. The two side faces are square (or approximately square) at their perimeter and shareright angle corners FIG. 3A , the other side face is not shown. The two end faces are both right triangles. One end face C, shown inFIG. 3A , is a right triangle at its perimeter formed by a ninety degree (or approximately ninety degree) angle atcorner 354 and two 45 degree (or approximately 45 degree) angles oppositecorner 354. The other end face (not shown) is the right triangle formed by a ninety degree (or approximately ninety degree) angle atcorner 356 and two 45 degree (or approximately 45 degree) angles oppositecorner 356. The hypotenuse face is aplanar face 352 which is on a hypotenuse side ofright angle prism 350 oppositeright angle corners Coating interface 320 lies between hypotenuse faces 312 and 352. - UV polarizing
beam splitter cube 300 has width, depth, and height dimensions equal to values d1, d2, and d3 respectively, as shown inFIG. 3A . In one example implementation, d1, d2, and d3 are equal (or approximately equal) such thatprisms faces prisms - Coating Interface
-
FIG. 3B is a diagram showing a cross-section of anexample coating interface 320, used to achieve a relatively flat R(s)*T(p) function, in greater detail.Coating interface 320 includes a stack of alternating layers of thin film fluoride materials (331-337, 341-346), and aprotective layer 351. Anti-reflection (AR) coatings (not shown) can also be included incoating interface 320.Protective layer 351 and AR coatings are optional. Also, the present invention in not limited to thirteen layers of alternating layers of thin film fluoride materials. In general, larger and smaller numbers of alternating layers of thin film fluoride materials can be used as would be apparent to a person skilled in the art given this description. - Further,
FIG. 3B shows thecoating interface 320 mounted onface 352 ofprism 350. The stack of alternating layers of thin film fluoride materials (331-337, 341-346) and/orprotective layer 351 are grown, etched, or fabricated onface 352 using conventional thin film techniques.Prism 310 is then placed in optical contact with thecoating interface 320. In this way,prisms coating interface 320 resulting in a very strong polarizing beam splitter cube. One further feature of the present invention is that it applies this optical contact (where optical components are joined so closely together that van der Waal's forces couple the components to one another) in a complex geometry involving angled surfaces, such as, the hypotenuse face ofprism 310. - The alternating layers of thin film fluoride materials include two groups of layers. The first group of layers 331-337 has a first index of refraction n1. The second group of layers 341-346 has a second index of refraction n2. According to one feature of the present invention, the first and second refractive indices n1 and n2 are different. In particular, the second refractive index n2 is relatively low compared to the first refractive index n1. In this way,
coating interface 320 includes a stack of fluoride materials 331-337, 341-346 having alternating relatively high and low refractive indices n1, n2 such that thecoating interface 320 separates incident UV light based on two different polarization states, such as S and P polarization states. According to the present invention, polarizingbeam splitter cube 300 can be used with light at wavelengths equal to or less than 200 nm, and in particular, at 193 or 157.6 nm, for example. - As noted above, to achieve a relatively flat R(s)*T(p) function, the
coating interface 320 comprises a multi-layer design of the form (H L)n H or (H L)n, where H indicates a layer of a first fluoride material having relatively high refractive index. The first fluoride material can include, but is not limited to, gadolinium tri-fluoride (GdF3), lanthanum tri-fluoride (LaF3), samarium fluoride (SmF3), europium fluoride (EuF3), terbium fluoride (TbF3), dysprosium fluoride (DyF3), holmium fluoride (HoF3), erbium fluoride (ErF3), thulium fluoride (TmF3), ytterbium fluoride (YbF3), lutetium fluoride (LuF3), zirconium fluoride (ZrF4), hafnium fluoride (HfF4), yttrium fluoride (YF3), neodymium fluoride (NdF3), any of the other lanthanide series tri-fluorides, metallic fluorides, or other high index, ultraviolet-transparent material. L indicates a layer of a second fluoride material having relatively low refractive index. The second fluoride material can include, but is not limited to, magnesium fluoride (MgF2), aluminum tri-fluoride (AlF3), barium fluoride (BaF2), strontium fluoride (SrF2), calcium fluoride (CaF2), lithium fluoride (LiF), and sodium fluoride (NaF), or other low index, ultraviolet transparent material. The superscript value “n” indicates the basic (H L) group is repeated n times in a multi-layer stack, where n is a whole number equal to one or more. - Other designs for a
multi-layer coating interface 320, 520 can be generated through a computer iterated technique as would be apparent to a person skilled in the art given this description. - The examples below are illustrative of how a flat overall R(s)*T(p) function can be achieved using a number of alternating coating layers.
- The table below illustrates one example of a
coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 27 alternating layers (n=13) of MgF2 and LaF3. This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 70.85 to a minimum of 65.37, or a delta of 5.48% (±2.74%).TABLE 1 Mechanical Optical Thickness Layer Thickness Layer Index (quarter-waves at Number Material (nm) (at 157.6 nm) 157.6 nm) exit medium CaF2 massive 1 MgF2 37.14 1.465 1.381 2 LaF3 9.18 1.78 0.415 3 MgF2 36.58 1.465 1.360 4 LaF3 16.11 1.78 0.728 5 MgF2 45.68 1.465 1.699 6 LaF3 8.92 1.78 0.403 7 MgF2 42.92 1.465 1.596 8 LaF3 22.20 1.78 1.003 9 MgF2 32.03 1.465 1.191 10 LaF3 19.82 1.78 0.895 11 MgF2 30.10 1.465 1.119 12 LaF3 24.30 1.78 1.098 13 MgF2 31.56 1.465 1.173 14 LaF3 25.91 1.78 1.171 15 MgF2 30.78 1.465 1.144 16 LaF3 24.27 1.78 1.096 17 MgF2 28.51 1.465 1.060 18 LaF3 23.46 1.78 1.060 19 MgF2 31.52 1.465 1.172 20 LaF3 27.37 1.78 1.237 21 MgF2 35.97 1.465 1.337 22 LaF3 29.89 1.78 1.350 23 MgF2 39.21 1.465 1.458 24 LaF3 30.97 1.78 1.399 25 MgF2 42.48 1.465 1.580 26 LaF3 30.31 1.78 1.369 27 MgF2 31.33 1.465 1.165 entrance CaF2 massive medium - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 4 in graphical form, and are illustrated in the Table 2 below in tabular form:TABLE 2 Wavelength 157.6 nm Range 35-55 degrees Substrate CaF2 H LaF3 L MgF2 angle T(p) R(s) R(s) * T(p) 30.0 41.67 84.81 35.34 30.5 44.75 84.78 37.94 31.0 47.94 84.93 40.71 31.5 51.23 85.21 43.65 32.0 54.62 85.60 46.75 32.5 58.10 86.03 49.98 33.0 61.66 86.45 53.30 33.5 65.24 86.79 56.62 34.0 68.77 87.02 59.84 34.5 72.13 87.08 62.82 35.0 75.18 86.96 65.37 35.5 77.77 86.60 67.35 36.0 79.83 85.98 68.64 36.5 81.33 85.07 69.19 37.0 82.35 83.89 69.08 37.5 83.00 82.48 68.46 38.0 83.45 81.02 67.60 38.5 83.85 79.72 66.84 39.0 84.33 78.83 66.47 39.5 84.94 78.47 66.65 40.0 85.72 78.57 67.35 40.5 86.61 78.91 68.35 41.0 87.57 79.25 69.39 41.5 88.51 79.38 70.26 42.0 89.37 79.19 70.78 42.5 90.11 78.63 70.85 43.0 90.71 77.69 70.48 43.5 91.18 76.49 69.74 44.0 91.52 75.23 68.85 44.5 91.77 74.19 68.08 45.0 91.94 73.68 67.74 45.5 92.05 73.80 67.93 46.0 92.10 74.42 68.54 46.5 92.09 75.26 69.31 47.0 92.00 76.02 69.94 47.5 91.82 76.49 70.23 48.0 91.51 76.59 70.09 48.5 91.07 76.34 69.52 49.0 90.47 75.85 68.63 49.5 89.77 75.35 67.64 50.0 89.02 75.10 66.85 50.5 88.30 75.29 66.48 51.0 87.70 75.94 66.60 51.5 87.27 76.86 67.08 52.0 87.00 77.80 67.69 52.5 86.84 78.53 68.19 53.0 86.72 78.88 68.40 53.5 86.59 78.81 68.24 54.0 86.48 78.31 67.72 54.5 86.48 77.43 66.96 55.0 86.72 76.24 66.11 55.5 87.29 74.80 65.30 56.0 88.13 73.13 64.45 56.5 88.95 71.10 63.24 57.0 89.26 68.38 61.04 57.5 88.54 64.44 57.06 58.0 86.61 58.46 50.63 58.5 83.78 49.39 41.38 59.0 80.81 36.52 29.52 59.5 78.60 21.85 17.17 60.0 77.82 13.52 10.52 60.5 78.79 19.28 15.19 61.0 81.31 33.46 27.20 61.5 84.46 46.33 39.13 62.0 86.54 54.54 47.19 62.5 85.76 58.28 49.98 63.0 81.71 58.10 47.47 63.5 75.84 53.92 40.90 64.0 70.32 44.86 31.55 64.5 66.72 29.85 19.92 65.0 65.78 11.20 7.37 - Table 3 below illustrates another example of a
coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 29 alternating layers (n=14) of MgF2 and LaF3. This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 67.9% to a minimum of 66.15%, or a delta of 1.74% (±0.87%).TABLE 3 Mechanical Optical Thickness Layer Thickness Layer Index (quarter-waves at Number Material (nm) (at 157.6 nm) 157.6 nm) exit medium CaF2 massive 1 MgF2 36.50 1.465 1.357 2 LaF3 7.94 1.78 0.359 3 MgF2 36.32 1.465 1.350 4 LaF3 16.76 1.78 0.757 5 MgF2 38.91 1.465 1.447 6 LaF3 14.25 1.78 0.644 7 MgF2 34.13 1.465 1.269 8 LaF3 22.09 1.78 0.998 9 MgF2 32.09 1.465 1.193 10 LaF3 23.17 1.78 1.047 11 MgF2 29.18 1.465 1.085 12 LaF3 22.79 1.78 1.030 13 MgF2 29.33 1.465 1.091 14 LaF3 24.78 1.78 1.120 15 MgF2 30.99 1.465 1.152 16 LaF3 25.57 1.78 1.155 17 MgF2 30.99 1.465 1.152 18 LaF3 23.80 1.78 1.075 19 MgF2 29.45 1.465 1.095 20 LaF3 21.68 1.78 0.979 21 MgF2 32.53 1.465 1.210 22 LaF3 25.53 1.78 1.153 23 MgF2 39.95 1.465 1.485 24 LaF3 29.40 1.78 1.328 25 MgF2 44.37 1.465 1.650 26 LaF3 28.78 1.78 1.300 27 MgF2 41.05 1.465 1.526 28 LaF3 25.76 1.78 1.164 29 MgF2 24.85 1.465 0.924 entrance CaF2 massive medium - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 5 in graphical form, and are illustrated in the Table 2 below in tabular form:TABLE 4 Wavelength 157.6 nm Range 35-55 degrees Substrate CaF2 H LaF3 L MgF2 angle T(p) R(s) R(s) * T(p) 30.0 47.96 82.40 39.52 30.5 51.50 82.73 42.61 31.0 54.89 83.39 45.77 31.5 58.15 84.21 48.97 32.0 61.31 85.06 52.15 32.5 64.38 85.83 55.26 33.0 67.36 86.45 58.23 33.5 70.17 86.85 60.95 34.0 72.73 87.03 63.30 34.5 74.94 86.96 65.17 35.0 76.75 86.63 66.49 35.5 78.15 86.05 67.25 36.0 79.21 85.22 67.50 36.5 80.02 84.20 67.38 37.0 80.73 83.06 67.05 37.5 81.43 81.93 66.71 38.0 82.21 80.90 66.51 38.5 83.10 80.07 66.53 39.0 84.08 79.40 66.77 39.5 85.13 78.84 67.11 40.0 86.16 78.26 67.43 40.5 87.13 77.58 67.59 41.0 87.99 76.74 67.52 41.5 88.71 75.77 67.22 42.0 89.31 74.77 66.78 42.5 89.80 73.90 66.36 43.0 90.22 73.32 66.15 43.5 90.57 73.14 66.24 44.0 90.88 73.30 66.61 44.5 91.15 73.65 67.13 45.0 91.39 73.99 67.61 45.5 91.57 74.15 67.90 46.0 91.67 74.06 67.89 46.5 91.68 73.72 67.58 47.0 91.58 73.24 67.07 47.5 91.37 72.82 66.53 48.0 91.07 72.67 66.18 48.5 90.71 72.93 66.15 49.0 90.32 73.60 66.47 49.5 89.91 74.50 66.99 50.0 89.49 75.42 67.49 50.5 89.02 76.16 67.80 51.0 88.46 76.65 67.81 51.5 87.83 76.87 67.51 52.0 87.18 76.88 67.02 52.5 86.62 76.78 66.51 53.0 86.34 76.66 66.19 53.5 86.44 76.53 66.15 54.0 86.97 76.28 66.35 54.5 87.83 75.74 66.52 55.0 88.73 74.63 66.22 55.5 89.32 72.61 64.85 56.0 89.26 69.21 61.78 56.5 88.48 63.81 56.46 57.0 87.19 55.64 48.51 57.5 85.85 44.32 38.05 58.0 84.93 31.55 26.79 58.5 84.71 22.80 19.32 59.0 85.20 23.04 19.63 59.5 86.12 29.65 25.53 60.0 86.96 36.61 31.84 60.5 87.25 40.65 35.46 61.0 86.82 40.89 35.50 61.5 85.90 37.21 31.97 62.0 84.99 29.67 25.21 62.5 84.49 19.04 16.09 63.0 84.52 8.16 6.90 63.5 84.74 1.86 1.58 64.0 84.60 2.87 2.43 64.5 83.62 8.46 7.07 65.0 81.86 13.91 11.38 - Table 5 below illustrates another example of a
coating interface 320 that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 26 alternating layers (n=13) of MgF2 and LaF3. This example provides a relatively flat R(s)*T(p) function between 40 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 72.69% to a minimum of 71.80% or a delta of 0.89% (±0.445%).TABLE 5 Mechanical Optical Thickness Layer Thickness Layer Index (quarter-waves at Number Material (nm) (at 157.6 nm) 157.6 nm) exit medium CaF2 massive 1 MgF2 38.09 1.465 1.416 2 LaF3 8.56 1.78 0.387 3 MgF2 40.19 1.465 1.494 4 LaF3 25.39 1.78 1.147 5 MgF2 25.43 1.465 0.946 6 LaF3 20.00 1.78 0.904 7 MgF2 29.25 1.465 1.088 8 LaF3 27.49 1.78 1.242 9 MgF2 36.72 1.465 1.365 10 LaF3 16.23 1.78 0.733 11 MgF2 27.28 1.465 1.014 12 LaF3 29.49 1.78 1.332 13 MgF2 120.76 1.465 4.490 14 LaF3 30.60 1.78 1.382 15 MgF2 38.55 1.465 1.433 16 LaF3 30.80 1.78 1.391 17 MgF2 39.70 1.465 1.476 18 LaF3 31.34 1.78 1.416 19 MgF2 40.71 1.465 1.514 20 LaF3 30.44 1.78 1.375 21 MgF2 45.04 1.465 1.675 22 LaF3 21.30 1.78 0.962 23 MgF2 23.64 1.465 0.879 24 LaF3 8.82 1.78 0.398 25 MgF2 51.75 1.465 1.924 26 LaF3 25.88 1.78 1.169 entrance CaF2 massive medium - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 6 in graphical form, and are illustrated in the Table 2 below in tabular form:TABLE 6 Wavelength 157.6 nm Range 40-60 degrees Substrate CaF2 H LaF3 L MgF2 angle T(p) R(s) R(s) * T(p) 30.0 63.71 69.28 44.14 30.5 62.12 72.74 45.19 31.0 61.84 74.61 46.14 31.5 62.88 75.10 47.22 32.0 65.23 74.22 48.41 32.5 68.80 71.69 49.32 33.0 73.37 66.88 49.07 33.5 78.53 58.54 45.97 34.0 83.64 44.72 37.40 34.5 87.91 24.45 21.50 35.0 90.68 6.05 5.48 35.5 91.68 9.93 9.11 36.0 91.12 32.89 29.97 36.5 89.56 53.91 48.29 37.0 87.66 67.30 59.00 37.5 85.91 75.18 64.59 38.0 84.62 79.80 67.53 38.5 83.91 82.50 69.23 39.0 83.75 84.01 70.36 39.5 84.04 84.70 71.18 40.0 84.62 84.82 71.78 40.5 85.36 84.49 72.12 41.0 86.15 83.84 72.22 41.5 86.92 82.99 72.13 42.0 87.65 82.09 71.95 42.5 88.35 81.28 71.81 43.0 89.01 80.67 71.80 43.5 89.64 80.23 71.92 44.0 90.21 79.90 72.08 44.5 90.69 79.59 72.18 45.0 91.07 79.25 72.17 45.5 91.33 78.91 72.07 46.0 91.46 78.64 71.93 46.5 91.47 78.53 71.83 47.0 91.37 78.64 71.85 47.5 91.15 78.96 71.97 48.0 90.79 79.43 72.12 48.5 90.28 79.97 72.20 49.0 89.59 80.54 72.16 49.5 88.69 81.18 72.00 50.0 87.58 82.02 71.83 50.5 86.30 83.16 71.76 51.0 84.91 84.60 71.83 51.5 83.52 86.18 71.98 52.0 82.24 87.69 72.12 52.5 81.15 88.96 72.19 53.0 80.28 89.92 72.19 53.5 79.63 90.57 72.13 54.0 79.19 90.94 72.02 54.5 78.97 91.05 71.90 55.0 78.99 90.93 71.83 55.5 79.29 90.61 71.84 56.0 79.86 90.10 71.95 56.5 80.62 89.44 72.10 57.0 81.40 88.66 72.17 57.5 82.07 87.80 72.05 58.0 82.68 86.89 71.83 58.5 83.52 85.95 71.78 59.0 84.91 84.98 72.15 59.5 86.63 83.91 72.69 60.0 87.12 82.49 71.87 60.5 83.25 80.23 66.79 61.0 72.90 76.04 55.43 61.5 58.52 67.52 39.51 62.0 45.05 48.70 21.94 62.5 35.16 13.70 4.82 63.0 29.00 16.06 4.66 63.5 25.91 58.38 15.12 64.0 25.40 78.80 20.01 64.5 27.46 86.76 23.82 65.0 32.39 90.12 29.19 - Table 7 below illustrates another example of a
coating interface 320 that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 32 alternating layers (n=16) of AlF3 and NdF3. This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum of 72.55% to a minimum 71.24%, or a delta of 1.31% (±0.655%).TABLE 7 Mechanical Optical Thickness Layer Thickness Layer Index (quarter-waves at Number Material (nm) (at 157.6 nm) 193 nm) exit medium CaF2 massive 1 NdF3 28.95 1.7 1.0200 2 AlF3 39.10 1.417 1.1483 3 NdF3 24.88 1.7 0.8766 4 AlF3 39.09 1.417 1.1480 5 NdF3 28.67 1.7 1.0101 6 AlF3 38.99 1.417 1.1451 7 NdF3 23.93 1.7 0.8431 8 AlF3 35.48 1.417 1.0420 9 NdF3 28.67 1.7 1.0101 10 AlF3 44.86 1.417 1.3174 11 NdF3 35.18 1.7 1.2395 12 AlF3 46.91 1.417 1.3776 13 NdF3 36.51 1.7 1.2864 14 AlF3 48.21 1.417 1.4158 15 NdF3 37.64 1.7 1.3262 16 AlF3 50.12 1.417 1.4719 17 NdF3 38.90 1.7 1.3706 18 AlF3 53.67 1.417 1.5762 19 NdF3 41.69 1.7 1.4689 20 AlF3 95.59 1.417 2.8073 21 NdF3 48.10 1.7 1.6947 22 AlF3 55.92 1.417 1.6423 23 NdF3 40.70 1.7 1.4340 24 AlF3 126.79 1.417 3.7236 25 NdF3 30.49 1.7 1.0743 26 AlF3 46.76 1.417 1.3732 27 NdF3 23.50 1.7 0.8280 28 AlF3 42.27 1.417 1.2414 29 NdF3 26.20 1.7 0.9231 30 AlF3 42.51 1.417 1.2484 31 NdF3 17.93 1.7 0.6317 32 AlF3 140.21 1.417 4.1177 entrance CaF2 massive medium - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 7 in graphical form, and are illustrated in the Table 8 below in tabular form:TABLE 8 Wavelength 193 nm Range 35-55 degrees Substrate CaF2 H NdF3 L AlF3 angle T(p) R(s) R(s) * T(p) 30.0 44.49 89.57 39.85 30.5 45.29 89.66 40.60 31.0 48.52 88.81 43.08 31.5 54.32 86.62 47.06 32.0 62.78 81.91 51.42 32.5 73.33 71.24 52.24 33.0 84.11 44.86 37.73 33.5 92.02 2.27 2.09 34.0 94.70 29.38 27.83 34.5 92.54 66.24 61.30 35.0 88.02 81.04 71.33 35.5 83.48 87.12 72.73 36.0 80.13 89.90 72.03 36.5 78.27 91.18 71.37 37.0 77.73 91.65 71.24 37.5 78.13 91.58 71.55 38.0 79.05 91.09 72.01 38.5 80.17 90.26 72.36 39.0 81.30 89.15 72.48 39.5 82.43 87.88 72.44 40.0 83.58 86.58 72.36 40.5 84.81 85.34 72.37 41.0 86.13 84.13 72.46 41.5 87.50 82.90 72.54 42.0 88.87 81.61 72.53 42.5 90.17 80.34 72.44 43.0 91.35 79.22 72.37 43.5 92.37 78.38 72.39 44.0 93.21 77.78 72.50 44.5 93.88 77.28 72.55 45.0 94.38 76.71 72.41 45.5 94.71 76.07 72.04 46.0 94.87 75.51 71.63 46.5 94.85 75.30 71.43 47.0 94.70 75.56 71.56 47.5 94.47 76.13 71.91 48.0 94.21 76.70 72.26 48.5 93.98 77.05 72.41 49.0 93.76 77.10 72.30 49.5 93.52 77.01 72.02 50.0 93.17 77.01 71.75 50.5 92.62 77.32 71.61 51.0 91.80 78.01 71.61 51.5 90.64 79.04 71.63 52.0 89.16 80.32 71.61 52.5 87.49 81.80 71.56 53.0 85.80 83.39 71.55 53.5 84.26 84.97 71.60 54.0 82.90 86.48 71.69 54.5 81.61 87.87 71.71 55.0 80.20 89.14 71.49 55.5 78.33 90.27 70.71 56.0 75.36 91.20 68.73 56.5 70.40 91.87 64.68 57.0 63.00 92.21 58.10 57.5 54.11 92.16 49.87 58.0 45.72 91.74 41.94 58.5 39.42 91.35 36.01 59.0 35.88 91.88 32.96 59.5 35.19 93.20 32.79 60.0 37.40 94.28 35.26 60.5 42.56 94.80 40.35 61.0 50.07 94.83 47.49 61.5 57.74 94.41 54.52 62.0 62.06 93.47 58.01 62.5 60.65 91.77 55.66 63.0 53.77 88.93 47.82 63.5 44.08 84.65 37.31 64.0 35.18 79.69 28.03 64.5 29.30 76.59 22.44 65.0 26.97 78.20 21.09 - Table 9 below illustrates another example of a
coating interface 320 for 193 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 30 alternating layers (n=15) of AlF3 and NdF3. This example provides a relatively flat R(s)*T(p) function between 35 and 55 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 74.60% to a minimum of 70.38%, or a delta of 4.33$ (±2.11%).TABLE 9 Mechanical Optical Thickness Layer Thickness Layer Index (quarter-waves at Number Material (nm) (at 157.6 nm) 193 nm) exit fused silica massive medium 1 NdF3 26.46 1.7 0.9323 2 AlF3 23.86 1.417 0.7007 3 NdF3 33.23 1.7 1.1708 4 AlF3 44.51 1.417 1.3072 5 NdF3 27.74 1.7 0.9774 6 AlF3 27.66 1.417 0.8123 7 NdF3 31.81 1.7 1.1208 8 AlF3 58.21 1.417 1.7095 9 NdF3 4.19 1.7 0.1476 10 AlF3 49.37 1.417 1.4499 11 NdF3 39.27 1.7 1.3836 12 AlF3 43.00 1.417 1.2628 13 NdF3 40.45 1.7 1.4252 14 AlF3 43.96 1.417 1.2910 15 NdF3 41.24 1.7 1.4530 16 AlF3 44.88 1.417 1.3180 17 NdF3 41.57 1.7 1.4646 18 AlF3 45.85 1.417 1.3465 19 NdF3 42.57 1.7 1.4999 20 AlF3 65.98 1.417 1.9377 21 NdF3 70.52 1.7 2.4846 22 AlF3 60.70 1.417 1.7826 23 NdF3 41.06 1.7 1.4467 24 AlF3 122.77 1.417 3.6055 25 NdF3 51.95 1.7 1.8304 26 AlF3 40.83 1.417 1.1991 27 NdF3 7.85 1.7 0.2766 28 AlF3 61.42 1.417 1.8038 29 NdF3 96.34 1.7 3.3944 30 AlF3 123.13 1.417 3.6161 entrance fused silica massive medium - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 8 in graphical form, and are illustrated in the Table 10 below in tabular form:TABLE 10 Wavelength 193 nm Range 35-55 degrees Substrate fused silica H NdF3 L AlF3 angle T(p) R(s) R(s) * T(p) 30.0 63.31 77.30 48.94 30.5 64.24 76.82 49.35 31.0 67.59 73.70 49.81 31.5 73.17 66.26 48.48 32.0 80.32 50.57 40.62 32.5 87.57 22.59 19.79 33.0 92.81 8.04 7.46 33.5 94.47 37.85 35.76 34.0 92.68 64.77 60.03 34.5 89.04 77.91 69.37 35.0 85.31 84.09 71.74 35.5 82.57 87.09 71.91 36.0 81.16 88.44 71.77 36.5 80.96 88.78 71.88 37.0 81.63 88.39 72.15 37.5 82.76 87.41 72.34 38.0 84.03 86.00 72.27 38.5 85.31 84.40 72.00 39.0 86.56 82.95 71.80 39.5 87.83 81.82 71.87 40.0 89.14 80.89 72.11 40.5 90.43 79.93 72.28 41.0 91.62 78.83 72.23 41.5 92.63 77.71 71.98 42.0 93.40 76.84 71.76 42.5 93.94 76.42 71.79 43.0 94.27 76.41 72.03 43.5 94.44 76.50 72.25 44.0 94.50 76.45 72.24 44.5 94.43 76.26 72.01 45.0 94.23 76.15 71.75 45.5 93.85 76.40 71.71 46.0 93.32 77.04 71.90 46.5 92.70 77.83 72.15 47.0 92.09 78.45 72.24 47.5 91.52 78.78 72.10 48.0 91.00 78.92 71.81 48.5 90.38 79.25 71.63 49.0 89.48 80.19 71.75 49.5 88.11 81.82 72.09 50.0 86.26 83.77 72.27 50.5 84.28 85.50 72.06 51.0 82.80 86.62 71.72 51.5 82.57 86.88 71.73 52.0 83.99 86.04 72.26 52.5 86.74 83.77 72.66 53.0 89.69 80.03 71.78 53.5 91.59 76.84 70.38 54.0 92.04 78.08 71.86 54.5 90.69 82.25 74.60 55.0 84.32 85.21 71.85 55.5 68.51 85.56 58.62 56.0 47.66 83.36 39.73 56.5 31.16 84.45 26.31 57.0 21.39 91.43 19.56 57.5 16.45 94.99 15.63 58.0 14.61 96.15 14.04 58.5 15.24 96.33 14.68 59.0 18.89 95.92 18.12 59.5 27.56 94.84 26.13 60.0 43.58 92.61 40.36 60.5 59.39 88.45 52.53 61.0 54.07 83.58 45.19 61.5 29.58 84.97 25.13 62.0 11.69 90.40 10.57 62.5 4.76 93.82 4.47 63.0 2.36 94.86 2.24 63.5 1.49 95.34 1.42 64.0 1.21 97.88 1.19 64.5 1.35 98.57 1.33 65.0 2.33 98.89 2.30 - Table 11 below illustrates another example of a
coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 21 alternating layers of LaF3 and MgF2. This example provides a relatively flat R(s)*T(p) function between 44 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 68.08% to a minimum of 67.95%, or a delta of 0.128% (±0.064%).TABLE 11 Index of refraction Thickness Material (at 157.6) (nm) Exit medium CaF2 1.558 massive Layer 1 LaF3 1.78 6.58 Layer 2MgF2 1.465 26.99 Layer 3LaF3 1.78 26.67 Layer 4MgF2 1.465 13.76 Layer 5LaF3 1.78 43.26 Layer 6MgF2 1.465 15.96 Layer 7LaF3 1.78 26.76 Layer 8 MgF2 1.465 22.79 Layer 9 LaF3 1.78 30.06 Layer 10MgF2 1.465 21.23 Layer 11 LaF3 1.78 41.81 Layer 12 MgF2 1.465 30.49 Layer 13 LaF3 1.78 39.32 Layer 14 MgF2 1.465 30.48 Layer 15 LaF3 1.78 40.11 Layer 16 MgF2 1.465 31.22 Layer 17 LaF3 1.78 47.42 Layer 18 MgF2 1.465 20.04 Layer 19 LaF3 1.78 28.12 Layer 20MgF2 1.465 89.08 Layer 21 LaF3 1.78 45.99 Entrance medium CaF2 1.558 massive - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 9 in graphical form, and are illustrated in the Table 12 below in tabular form:TABLE 12 Wavelength 157.6 nm Range 44-60 degrees Substrate CaF2 H LaF3 L MgF2 Efficiency Angle R(s) T(p) (Rs * Tp) 30 58.9139 69.5322 40.96413078 30.5 59.2118 70.3769 41.67142927 31 58.9692 71.5766 42.20814841 31.5 58.1352 73.1124 42.50403996 32 56.6385 74.9485 42.44970617 32.5 54.387 77.0295 41.89403417 33 51.2722 79.278 40.64757472 33.5 47.1894 81.5955 38.50442688 34 42.0867 83.8674 35.29702104 34.5 36.0681 85.9728 31.00875548 35 29.5641 87.7991 25.95701372 35.5 23.5225 89.2587 20.99587771 36 19.4119 90.3033 17.52958629 36.5 18.7295 90.9307 17.03086546 37 22.0851 91.1835 20.13796716 37.5 28.6865 91.1384 26.14441712 38 36.8679 90.8907 33.50949239 38.5 45.0672 90.5386 40.80321194 39 52.3501 90.1693 47.20371872 39.5 58.3732 89.851 52.44890393 40 63.1419 89.6287 56.59326413 40.5 66.8075 89.5251 59.80948118 41 69.5546 89.5433 62.28148414 41.5 71.5537 89.6718 64.16349076 42 72.9471 89.8899 65.57207524 42.5 73.851 90.1731 66.59373608 43 74.3622 90.4966 67.29526269 43.5 74.5655 90.8379 67.73373432 44 74.5416 91.1777 67.96531642 44.5 74.3703 91.4985 68.04770895 45 74.1315 91.7828 68.03996638 45.5 73.9005 92.0117 67.99710636 46 73.7397 92.1631 67.96079345 46.5 73.6918 92.2131 67.95349323 47 73.7764 92.1366 67.97506656 47.5 73.9948 91.9112 68.00950862 48 74.3402 91.5192 68.03555632 48.5 74.8088 90.9504 68.03890284 49 75.4066 90.2031 68.0190908 49.5 76.1483 89.2848 67.98885736 50 77.0487 88.2121 67.96627629 50.5 78.1109 87.01 67.96429409 51 79.3161 85.712 67.98341563 51.5 80.6216 84.3595 68.01197865 52 81.9672 83.0007 68.03334977 52.5 83.2877 81.6874 68.03555665 53 84.5248 80.4707 68.01769823 53.5 85.6345 79.3955 67.98993945 54 86.5885 78.4947 67.96738331 54.5 87.3719 77.7853 67.96249453 55 87.9786 77.267 67.97842486 55.5 88.4071 76.9249 68.00707327 56 88.6567 76.7374 68.03284651 56.5 88.7245 76.6865 68.03971369 57 88.6036 76.7707 68.02160395 57.5 88.2817 77.0131 67.9884739 58 87.7394 77.4623 67.96495725 58.5 86.9495 78.1816 67.97851029 59 85.8754 79.2247 68.03452802 59.5 84.4685 80.5999 68.08152653 60 82.6643 82.2249 67.97063801 60.5 80.3745 83.8828 67.42038109 61 77.4752 85.2016 66.01011 61.5 73.7899 85.6985 63.23683745 62 69.0744 84.9216 58.65908567 62.5 63.0206 82.6559 52.09024412 63 55.3373 79.0697 43.7550371 63.5 46.0352 74.6757 34.37710785 64 36.0758 70.1277 25.2991288 64.5 28.1251 65.998 18.5620035 65 25.8553 62.6575 16.2002846 P-V 0.128033306 (44-60) - Table 13 below illustrates another example of a
coating interface 320 for 157.6 nm that satisfies the requirements of a flat R(s)*T(p) apodization function using a total of 11 alternating layers of LaF3 and MgF2. This example provides a relatively flat R(s)*T(p) function between 44 and 60 degrees incident. In that range, the R(s)*T(p) function ranges from a maximum 63.11% to a minimum of 62.897%, or a delta of 0.21% (±0.1%).TABLE 13 Index of refraction Material (at 157.6) (nm) Exit medium CaF2 1.558 massive Layer 1 LaF3 1.78 58.48 Layer 2MgF2 1.465 60.07 Layer 3LaF3 1.78 55.11 Layer 4MgF2 1.465 47.98 Layer 5LaF3 1.78 31.71 Layer 6MgF2 1.465 40.26 Layer 7LaF3 1.78 31 Layer 8 MgF2 1.465 38.79 Layer 9 LaF3 1.78 27.29 Layer 10MgF2 1.465 37.73 Layer 11 LaF3 1.78 65.71 Entrance medium CaF2 1.558 massive - The R(s), T(p) and the overall R(s)*T(p) functions are shown in
FIG. 10 in graphical form, and are illustrated in the Table 14 below in tabular form:TABLE 14 Wavelength 157.6 nm Range 44-60 degrees Substrate CaF2 H LaF3 L MgF2 Efficiency Angle R(s) T(p) (Rs * Tp) 30 4.2925 94.1131 4.039804818 30.5 4.9315 94.151 4.643056565 31 6.2593 94.054 5.887122022 31.5 8.34 93.8199 7.82457966 32 11.1766 93.4551 10.44510271 32.5 14.7035 92.9743 13.6704762 33 18.7935 92.3995 17.36510003 33.5 23.2756 91.7586 21.3573647 34 27.9613 91.0837 25.46818661 34.5 32.6691 90.4083 29.53557794 35 37.2438 89.7656 33.43212053 35.5 41.5667 89.1865 37.0718849 36 45.5572 88.698 40.40832526 36.5 49.1694 88.3219 43.4273483 37 52.385 88.0741 46.13761729 37.5 55.2061 87.9641 48.56154901 38 57.6482 87.9947 50.72736065 38.5 59.7349 88.1623 52.66366174 39 61.4939 88.457 54.39565912 39.5 62.9544 88.8633 55.94335734 40 64.1456 89.3609 57.32108547 40.5 65.0956 89.9258 58.53773906 41 65.8314 90.5318 59.59835139 41.5 66.3789 91.1519 60.50562855 42 66.7633 91.76 61.26200408 42.5 67.0091 92.3328 61.87137828 43 67.1408 92.8507 62.34070279 43.5 67.1827 93.2989 62.68072009 44 67.1593 93.668 62.90677312 44.5 67.0943 93.9534 63.03737606 45 67.0105 94.1549 63.09366926 45.5 66.929 94.2753 63.09751554 46 66.8681 94.3193 63.06952384 46.5 66.8428 94.2921 63.02747982 47 66.8641 94.1984 62.98491237 47.5 66.9396 94.0412 62.95080312 48 67.0734 93.8216 62.92933705 48.5 67.2673 93.5386 62.92089068 49 67.522 93.1893 62.92327915 49.5 67.8382 92.769 62.93281976 50 68.218 92.2721 62.94618118 50.5 68.6649 91.6927 62.96070076 51 69.1845 91.0251 62.97526031 51.5 69.7837 90.2651 62.99032659 52 70.4695 89.4101 63.00685042 52.5 71.2471 88.4607 63.02568339 53 72.118 87.421 63.04627678 53.5 73.0774 86.3001 63.06586928 54 74.1132 85.1126 63.07967146 54.5 75.205 83.8797 63.08172839 55 76.3256 82.6292 63.06723268 55.5 77.4426 81.3954 63.03471404 56 78.5213 80.2182 62.98837348 56.5 79.5277 79.1413 62.93925564 57 80.4303 78.2084 62.90325075 57.5 81.2007 77.4598 62.89789982 58 81.8137 76.9248 62.9350251 58.5 82.2453 76.614 63.01141414 59 82.47 76.5069 63.09524043 59.5 82.4576 76.5366 63.11024348 60 82.168 76.572 62.91768096 60.5 81.5458 76.4036 62.30392685 61 80.5115 75.743 60.98182545 61.5 78.9521 74.2563 58.62690823 62 76.7092 71.6439 54.95746254 62.5 73.574 67.7567 49.85131446 63 69.3133 62.6944 43.45555756 63.5 63.7968 56.8124 36.2444932 64 57.3686 50.6164 29.03792005 64.5 51.5131 44.6044 22.97710918 65 49.0297 39.1471 19.19370569 P-V 0.212343663 (44-60) - While specific embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims (44)
1. A beamsplitter comprising:
a first fluoride prism;
a second fluoride prism;
a coating interface between the first and second fluoride prisms,
wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 40-50 degrees of incidence.
2. The beamsplitter of claim 1 , wherein the coating interface includes alternating layers of MgF2 and LaF3.
3. The beamsplitter of claim 1 , wherein the coating interface includes at least 27 alternating layers of high and low refractive index materials.
4. The beamsplitter of claim 1 , wherein the coating interface includes at least 27 alternating layers of high and low refractive index materials.
5. The beamsplitter of claim 1 , wherein the coating interface includes alternating layers of NdF3 and AlF3.
6. The beamsplitter of claim 1 , wherein the coating interface includes at least 30 alternating layers of high and low refractive index materials.
7. The beamsplitter of claim 1 , wherein the coating interface includes at least 32 alternating layers of high and low refractive index materials.
8. The beamsplitter of claim 1 , wherein the coating interface includes at least 11 alternating layers of high and low refractive index materials.
9. The beamsplitter of claim 1 , wherein the coating interface includes at least 21 alternating layers of high and low refractive index materials.
10. The beamsplitter of claim 1 , wherein the first and second prisms include CaF2.
11. The beamsplitter of claim 1 , wherein the first and second prisms include fused silica.
12. The beamsplitter of claim 1 , wherein the overall R(s)*T(p) function of the beamsplitter varies no more than ±0.87% in the range of 35-55 degrees of incidence.
13. The beamsplitter of claim 1 , wherein the overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 35-55 degrees of incidence.
14. The beamsplitter of claim 1 , wherein the beamsplitter operates at about 157.6 nm.
15. The beamsplitter of claim 1 , wherein the beamsplitter operates at about 193 nm.
16. A beamsplitter comprising:
a first fluoride prism;
a second fluoride prism;
a coating interface between the first and second fluoride prisms,
wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±0.445% in the range of 40-50 degrees of incidence.
17. The beamsplitter of claim 16 , wherein the coating interface includes alternating layers of MgF2 and LaF3.
18. The beamsplitter of claim 16 , wherein the coating interface includes at least 27 alternating layers of high and low refractive index materials.
19. The beamsplitter of claim 16 , wherein the coating interface includes at least 29 alternating layers of high and low refractive index materials.
20. The beamsplitter of claim 16 , wherein the coating interface includes alternating layers of NdF3 and AlF3.
21. The beamsplitter of claim 16 , wherein the coating interface includes at least 30 alternating layers of high and low refractive index materials.
22. The beamsplitter of claim 16 wherein the coating interface includes at least 32 alternating layers of high and low refractive index materials.
23. The beamsplitter of claim 16 , wherein the coating interface includes at least 11 alternating layers of high and low refractive index materials.
24. The beamsplitter of claim 16 , wherein the coating interface includes at least 21 alternating layers of high and low refractive index materials.
25. The beamsplitter of claim 16 , wherein the first and second prisms include CaF2.
26. The beamsplitter of claim 16 , wherein the first and second prisms include fused silica.
27. The beamsplitter of claim 16 , wherein an overall R(s)*T(p) function of the beamsplitter varies no more than 0.87% in the range of 35-55 degrees of incidence in the ultraviolet range.
28. A beamsplitter comprising:
a first fluoride prism;
a second fluoride prism;
a coating interface between the first and second fluoride prisms,
wherein an apodization function of the beamsplitter is relatively flat in the range of 40-50 degrees of incidence.
29. A beamsplitter comprising:
a first fluoride prism;
a second fluoride prism;
a coating interface between the first and second fluoride prisms,
wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±0.1% in the range of 44-60 degrees of incidence.
30. The beamsplitter of claim 29 , wherein the overall R(s)*T(p) function of the beamsplitter varies no more than ±0.064% in the range of 44-60 degrees of incidence
31. The beamsplitter of claim 29 , wherein the coating interface includes at least 21 alternating layers of high and low refractive index materials.
32. The beamsplitter of claim 29 , wherein the first and second prisms include CaF2.
33. A method of forming a beamsplitter comprising the steps of:
forming a coating on a first fluoride prism, wherein an apodization function of the beamsplitter is relatively flat in the range of 40-50 degrees of incidence; and
joining the first fluoride prism with the second fluoride prism to form the beamsplitter.
34. The method of claim 33 , wherein the step of forming the coating includes the step of forming alternating layers of MgF2 and LaF3.
35. The method of claim 29 , wherein the step of forming alternating layers of MgF2 and LaF3 forms at least 27 alternating layers.
36. The method of claim 33 , wherein the step of forming the coating includes the step of forming alternating layers of NdF3 and AlF3.
37. The method of claim 33 , comprising providing the first and second prisms as CaF2 prisms.
38. The method of claim 33 , comprising providing the first and second prisms as fused silica prisms.
39. The method of claim 33 , comprising forming the coating so that the overall R(s)*T(p) function of the beamsplitter varies no more than ±0.87% in the range of 35-55 degrees of incidence.
40. The method of claim 33 , comprising forming the coating so that the overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 35-55 degrees of incidence.
41. The method of claim 33 , comprising forming the coating so that the beamsplitter operates at about 157.6 nm.
42. The method of claim 33 , comprising forming the coating so that the beamsplitter operates at about 193 nm.
43. The method of claim 33 , comprising forming the coating so that the apodization function of the beamsplitter varies no more than ±0.87% in the range of 35-55 degrees of incidence.
44. The method of claim 33 , comprising forming the coating so that the apodization function of the beamsplitter varies no more than ±2.74% in the range of 35-55 degrees of incidence.
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US10/458,629 US7414785B2 (en) | 2000-02-24 | 2003-06-11 | Ultraviolet polarization beam splitter with minimum apodization |
JP2004173912A JP2005049827A (en) | 2003-06-11 | 2004-06-11 | Ultraviolet polarizing beam splitter with minimum apodization |
JP2008161730A JP4769271B2 (en) | 2003-06-11 | 2008-06-20 | Ultraviolet polarizing beam splitter with minimal apodization |
US12/178,519 US20080278813A1 (en) | 2000-02-24 | 2008-07-23 | Ultraviolet Polarization Beam Splitter with Minimum Apodization |
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US18478200P | 2000-02-24 | 2000-02-24 | |
US09/538,529 US6480330B1 (en) | 2000-02-24 | 2000-03-30 | Ultraviolet polarization beam splitter for microlithography |
US10/264,318 US6680794B2 (en) | 2000-02-24 | 2002-10-04 | Polarization beam splitter for photolithography |
US10/458,629 US7414785B2 (en) | 2000-02-24 | 2003-06-11 | Ultraviolet polarization beam splitter with minimum apodization |
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