US20060003532A1 - Semiconductor device and method of manufacturing therefor - Google Patents
Semiconductor device and method of manufacturing therefor Download PDFInfo
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- US20060003532A1 US20060003532A1 US11/221,823 US22182305A US2006003532A1 US 20060003532 A1 US20060003532 A1 US 20060003532A1 US 22182305 A US22182305 A US 22182305A US 2006003532 A1 US2006003532 A1 US 2006003532A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 230000003647 oxidation Effects 0.000 claims abstract description 56
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 230000003449 preventive effect Effects 0.000 claims abstract description 37
- 238000011049 filling Methods 0.000 claims abstract description 18
- 239000001257 hydrogen Substances 0.000 claims abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 7
- 239000001301 oxygen Substances 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 7
- 238000002955 isolation Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 21
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 18
- 239000010703 silicon Substances 0.000 description 18
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 238000000137 annealing Methods 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 150000002500 ions Chemical group 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000010420 art technique Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28211—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a gaseous ambient using an oxygen or a water vapour, e.g. RTO, possibly through a layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
Definitions
- the present invention relates to a semiconductor device and a fabrication process therefor, and more particularly, to a semiconductor device forming an oxidation preventive film in a trench isolation structure therein and a fabrication process therefor.
- a stress is produced in the inner wall of a trench due to volume expansion of the inner wall of the trench, caused by oxidation in an oxidation process after formation of a trench isolation structure to thereby generate crystal defects such as dislocations and micro-defects in a silicon (Si) substrate.
- Si silicon
- FIGS. 18 to 24 are schematic sectional views showing a sequence of steps of a method of manufacturing a prior art semiconductor device. Referring to FIG. 18 , for example, an insulating film 102 is formed on a p type silicon substrate 101 .
- insulating film 102 is patterned by a photolithographic technique and an etching technique at the ordinary levels.
- etching technique such as anisotropic dry etching with the patterned insulating film 102 as a mask, a trench 103 of a prescribed depth is formed on a surface of silicon substrate 101 .
- a silicon oxide layer 104 is formed on the inner wall of trench 103 .
- Oxidation preventive film 106 is formed as a silicon nitride film at the interface between silicon substrate 101 and silicon oxide film 104 by annealing silicon substrate 101 in an atmosphere including nitrogen (N).
- a filling oxide film 107 constituted of a silicon oxide film is formed on insulating film 102 so as to fill trench 103 . Thereafter, by annealing silicon substrate 101 at a prescribed temperature in a prescribed atmosphere, filling oxide film 107 is densified. Thereafter, the surface of silicon substrate 101 is planarized by means of a CMP (Chemical Mechanical Polishing) method and subsequently, insulating film 102 on an active region is removed by wet etching.
- CMP Chemical Mechanical Polishing
- the CMP and the wet etching exposes the surface of silicon substrate 101 while leaving filling oxide film 107 so as to fill trench 103 , thus completing a trench isolation structure.
- a gate oxide film 108 is formed on the surface of silicon substrate 101 by oxidation.
- the oxidation is effected by introducing hydrogen gas and oxygen gas into a reaction vessel accommodating wafers after the gases react with each other, or introducing only oxygen gas into the reaction vessel.
- a gate electrode is formed on gate oxide film 108 and subsequent to this, an impurity is ion implanted into silicon substrate 101 with the gate electrode or the like as a mask, thereby forming a pair of source/drain regions on the surface of silicon substrate 101 .
- MOS Metal Oxide Semiconductor
- DRAM Dynamic Random Access Memory
- EEPROM Electrically Erasable Programmable Read Only Memory
- oxidation preventive film 106 is formed on the inner wall of a trench isolation structure. Therefore, a film thickness of gate oxide film 108 shows thinning as depicted in FIG. 25 at the top edge portion of the trench isolation structure (on the oxidation preventive film 106 ). That is, a film thickness TA 3 of gate oxide film 108 at the top edge portion of the trench isolation structure is thinner than those of the other parts, having resulted in a problem of difficulty in forming a high reliability gate oxide film 108 .
- a method of manufacturing a semiconductor device of the present invention includes the following steps.
- a trench is formed on a main surface of a semiconductor substrate. Then, an oxidation preventive film is formed along the inner wall of the trench. A filling layer is formed so as to fill the trench. A high oxidation capability is applied on the main surface of a semiconductor substrate in an atmosphere in which radicals of at least one kind of hydrogen radicals and oxygen radicals are generated to thereby form a gate oxide film on the main surface of a semiconductor substrate.
- a thickness of a gate oxide film, formed by this oxidation, directly above the oxidation preventive film at the top edge portion of the step in the trench can be of the same order as those of the gate oxide film in the other regions. With this, the film thickness of the gate oxide film can be uniform to thereby obtain a high reliability gate oxide film.
- the above method of manufacturing a semiconductor device preferably further includes: a step of forming a gate electrode on the gate oxide film; and a step of forming a pair of source/drain regions on the main surface of a semiconductor substrate so as to sandwich a region directly below the gate electrode between the source/drain regions.
- a transistor with a gate layer can be formed.
- the gate electrode is preferably formed so as to have a floating gate and a control gate, insulated from each other.
- a memory cell of a flash memory can be fabricated.
- the gate oxide film preferably has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode.
- the gate oxide film having a uniform thickness can be formed.
- the oxidation preventive film is preferably made from at least one of a silicon nitride film and a silicon oxynitride film.
- a semiconductor device of the present invention includes: a semiconductor substrate; an oxidation preventive film; a filling layer; a gate oxide film; and a gate electrode.
- the semiconductor substrate has a trench on a main surface of the semiconductor substrate.
- the oxidation preventive film is formed along the inner wall of the trench.
- the filling layer fills the trench.
- the gate oxide film is formed on the main surface of the semiconductor substrate and the oxidation preventive film.
- the gate electrode is formed on the gate oxide film.
- the gate oxide film has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode.
- the gate oxide film has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode, a thickness of the gate oxide film can be uniform. Thereby, a high reliability gate oxide film can be obtained.
- the gate electrode preferably has a floating gate electrode and a control gate, insulated from each other.
- a memory cell of a flash memory can be fabricated.
- the oxidation preventive film is preferably made from at least one of a silicon nitride film and a silicon oxynitride film.
- various kinds of films can be selected as an oxidation preventive film.
- FIGS. 1 to 7 are schematic sectional views showing a sequence of steps of a method of manufacturing a semiconductor device in a first embodiment of the present invention
- FIG. 8 is a schematic sectional view showing a structure of a MOS transistor formed after a gate oxide film of the semiconductor device in the first embodiment of the present invention is formed;
- FIG. 9 is a schematic sectional view for describing a film thickness of the gate oxide film of the semiconductor device of the first embodiment of the present invention.
- FIG. 10 is a schematic sectional view showing indispensable features combined of the first embodiment of the present invention, which is applied to a floating gate transistor;
- FIGS. 11 to 14 are schematic sectional views showing a sequence of steps of a method of manufacturing a semiconductor device in a second embodiment of the present invention.
- FIG. 15 is a schematic sectional view showing a structure of a MOS transistor formed after a gate oxide film of the semiconductor device in the second embodiment of the present invention is formed;
- FIG. 16 is a schematic sectional view for describing a film thickness of the gate oxide film of the semiconductor device of the second embodiment of the present invention.
- FIG. 17 is a schematic sectional view showing indispensable features combined of the second embodiment of the present invention, which is applied to a floating gate transistor;
- FIGS. 18 to 24 are schematic sectional views showing a sequence of steps of a method of manufacturing a prior art semiconductor device.
- FIG. 25 is a schematic sectional view for describing a film thickness of a gate oxide film of the prior art semiconductor device.
- an insulating film 2 is formed on a semiconductor substrate 1 made of silicon of a p conductivity type, for example.
- insulating film 2 is patterned by a photolithographic technique and an etching technique at the ordinary levels.
- etching technique such as anisotropic dry etching with patterned insulating film 2 as a mask, a trench 3 of a desired depth is formed on a surface of semiconductor substrate 1 .
- thermal oxidation is applied onto semiconductor substrate 1 .
- a silicon oxide film 4 is formed on the inner wall of trench 3 to a thickness of from 10 nm to 70 nm.
- annealing is applied to semiconductor substrate 1 in an atmosphere including at least one of NO gas, N 2 O gas and NH 3 gas at a temperature in the range of from 850° C. to 1000° C. With such annealing, an oxidation preventive film 6 made of a silicon nitride film is formed at the interface between semiconductor substrate 1 and silicon oxide film 4 .
- a silicon oxide film such as a TEOS (Tetra Ethyl Ortho Silicate) oxide film, a HDP (High Density Plasma) oxide film or the like is formed on insulating film 2 so as to fill the interior of trench 3 by means of a LPCVD (Low Pressure Chemical Vapor Deposition) method. Thereafter, annealing is performed on semiconductor substrate 1 at 800° C. to 1150° C. in a N 2 (nitrogen) atmosphere for densification of a filling oxide film 7 . After filling oxide film 7 is removed by CMP to planarize the surface of semiconductor substrate 1 , insulating film 2 on an active region is removed by wet etching.
- TEOS Tetra Ethyl Ortho Silicate
- HDP High Density Plasma oxide film or the like
- the surface of semiconductor substrate 1 is exposed by the above CMP and the wet etching to leave filling oxide film 7 only in trench 3 and complete trench isolation.
- a gate oxide film 8 is formed on the active region of semiconductor substrate 1 .
- Gate oxide film 8 is formed under a so-called steam condition, that is under an oxidative condition in which hydrogen radials and oxygen radicals are generated, and having so high an oxidative capability that oxidation preventive film 6 such as a silicon nitride film can be oxidized.
- hydrogen gas and oxygen gas are separately introduced into a reaction vessel accommodating wafers to react with each other directly above the wafers and thereby generate hydrogen radicals and oxygen radicals, which generates oxidation with a high capability. In such a manner, there are formed a trench isolation structure and gate oxide film 8 in the embodiment.
- Gate oxide film 8 thus formed can be used as a gate insulating film of an ordinary MOS transistor as shown in FIG. 8 , for example. Such a MOS transistor is formed in a way described below after the step of FIG. 7 .
- a conductive layer used in a gate electrode is formed on gate oxide film 8 and thereafter, patterned by a photolithographic technique and an etching technique at the ordinary levels to form a gate electrode 9 .
- An n type impurity such as arsenic or phosphorus is ion implanted in an active region of semiconductor substrate 1 with gate electrode 9 as a mask. With the ion implantation applied, a pair of source/drain regions 10 are formed on the surface of semiconductor substrate 1 so as to sandwich a region directly below gate electrode 9 between source/drain regions 10 to thereby complete a MOS transistor.
- the trench isolation structure is constituted of: silicon oxide film 4 formed along the inner wall of trench 3 provided on semiconductor substrate 1 ; oxidation preventive film 6 made of a silicon nitride film or the like formed at the interface between silicon oxide film 4 and semiconductor substrate 1 ; and filling oxide film 7 filling trench 3 .
- a MOS transistor is formed in the active region electrically isolated.
- the MOS transistor has: gate oxide film 8 ; gate electrode 9 : and pair of source/drain regions 10 .
- Gate oxide film 8 is formed on the active region of semiconductor substrate 1 and gate electrode 9 obtained by patterning is formed on gate oxide film 8 .
- Pair of source/drain regions 10 is formed on the surface of semiconductor substrate 1 so as to sandwich the region directly below gate electrode 9 between source/drain regions 10 .
- Gate oxide film 8 described above has a uniform thickness such that a thickness TA 1 of a region directly above oxidation preventive film 6 and a thickness TB 1 of a region directly below gate electrode 9 are equal to each other as shown in FIG. 9 .
- an oxidizing method is applied, in which hydrogen radicals and oxygen radicals are generated, and which has so high an oxidative capability that oxidation preventive film 6 made of a silicon nitride or the like can be oxidized, thereby forming gate oxide film 8 .
- oxidizing speeds on oxidation preventive film 6 made of a silicon nitride and semiconductor substrate 1 made of silicon can be the same as each other.
- gate oxide film 8 as shown in FIG. 9 comes to have almost the same thickness in a region directly above oxidation preventive film 6 and in a region directly below gate electrode 9 , thereby enabling prevention of thinning of gate oxide film 8 at the top edge portion of the trench isolation structure.
- gate oxide film 8 has a uniform thickness in such a way, gate oxide film 8 has difficulty in deterioration and increases a breakdown lifetime, thereby enabling a high reliability gate oxide film 8 to be achieved. Therefore, a device having good transistor characteristics can be obtained that is categorized in DRAM (Dynamic Random Access Memory) or the like.
- DRAM Dynamic Random Access Memory
- a floating gate transistor shown in FIG. 10 can also be formed, which will be described below.
- a floating electrode 9 a is formed on gate oxide film 8
- an insulating film 9 b and a control gate electrode 9 c are formed on floating gate electrode 9 a.
- An n type impurity such as arsenic or phosphorus is ion implanted with control gate electrode 9 c or the like as a mask. By doing so, pair of source/drain regions 10 is formed on the surface of semiconductor substrate 1 to thereby complete the floating gate transistor.
- the floating gate transistor thus fabricated has floating gate electrode 9 a and control gate electrode 9 c, insulated from each other. Since a structure of the floating gate transistor is almost the same as that of the above ordinary MOS transistor of FIG. 8 , the same symbols are attached to the same constituents and description thereof is omitted.
- gate oxide film 8 has difficulty in deterioration and a long breakdown lifetime, thereby enabling a flash memory having good transistor characteristics to be obtained.
- a fabrication process of the embodiment is different from that of the first embodiment by comparison in a step of forming an oxidation preventive film.
- a fabrication process of the embodiment follows a sequence of steps similar to that of the first embodiment shown in FIGS. 1 to 3 . Thereafter, there is formed an oxidation preventive film 5 constituted of a silicon nitride film (an SiN film) and a silicon oxynitride (an SiON film) to a thickness from 5 nm to 30 nm.
- a filling oxide film 7 is formed in a similar way to that of the first embodiment 1 so as to fill trench 3 . Thereafter, the surface of silicon substrate 1 is planarized by CMP, followed by removal of insulating film 2 on the active region with wet etching.
- an gate oxide film 8 is formed in conditions similar to those of the first embodiment.
- an oxidation method with a high capability is employed; therefore, oxidation preventive film 5 is also oxidized to form gate oxide film 8 in a region directly above oxidation preventive film 5 .
- the trench isolation structure and gate oxide film 8 in the embodiment are formed.
- Gate oxide film 8 thus formed can be used as a gate insulating film of an ordinary MOS transistor as shown in FIG. 15 , for example.
- Such a MOS transistor is formed after the step of FIG. 14 , similar to the first embodiment.
- the trench isolation structure is constituted of: silicon oxide film 4 formed along the inner wall of trench 3 formed on semiconductor substrate 1 ; oxidation preventive film 5 formed along the inner wall of silicon oxide film 4 ; and filling oxide film 7 filling trench 3 .
- a MOS transistor is formed in the active region electrically isolated by the trench isolation.
- the MOS transistor has: gate oxide film 8 ; gate electrode 9 ; and pair of source/drain regions 10 .
- Gate oxide film 8 is formed on the active region of semiconductor substrate 1 and gate electrode 9 obtained by patterning is formed on gate oxide film 8 .
- Pair of source/drain regions 10 are formed on the surface of semiconductor substrate 1 so as to sandwich a region directly below gate electrode 9 between source/drain regions 10 .
- Gate oxide film 8 described above has a uniform thickness such that a thickness TA 2 of a region directly above oxidation preventive film 5 and a thickness TB 2 of a region directly below gate electrode 9 are equal to each other as shown in FIG. 16 .
- gate oxide film 8 has a uniform film thickness. For this reason, gate oxide film 8 has difficulty in deterioration and increases a breakdown lifetime, thereby enabling a high reliability gate oxide film 8 to be attained. Therefore, a device having good transistor characteristics can be obtained that is categorized in DRAM or the like.
- gate oxide film 8 has difficulty in deterioration and a long breakdown life time, thereby enabling a flash memory with good transistor characteristics to be obtained.
- conductivity types associated with constituents of the above semiconductor device may be all inverted in polarity.
- conditions for oxidation with a high capability in gate oxide film formation are not limited to the above conditions, but any condition may be adopted as far as an oxidation preventive film such as a silicon nitride film can be oxidized at almost the same speed as is silicon.
Abstract
An active region on a semiconductor substrate is electrically isolated by trench isolation. A structure of the trench isolation is constituted of: a trench; a silicon oxide film formed on the inner wall of trench; an oxidation preventive film formed between silicon oxide film and semiconductor substrate; and a filling oxide film filling trench. Gate oxide film is formed by oxidation having a high capability by which radicals of at least one kind of hydrogen radicals and oxygen radicals are generated. Thereby, gate oxide film is formed so as to have a almost uniform thickness such that a thickness of a region directly above oxidation preventive film and a thickness of a region directly below gate electrode are almost the same is each other. According to the above procedure, there are obtained a semiconductor device having good transistor characteristics and a fabrication process therefor.
Description
- 1. Field of the Invention
- The present invention relates to a semiconductor device and a fabrication process therefor, and more particularly, to a semiconductor device forming an oxidation preventive film in a trench isolation structure therein and a fabrication process therefor.
- 2. Description of the Background Art
- A stress is produced in the inner wall of a trench due to volume expansion of the inner wall of the trench, caused by oxidation in an oxidation process after formation of a trench isolation structure to thereby generate crystal defects such as dislocations and micro-defects in a silicon (Si) substrate. In order to prevent generation of the crystal defects, there has been available a technique forming an oxidation preventive film on the inner wall of the trench. Description will be given of a prior art technique forming the oxidation preventive film below.
- FIGS. 18 to 24 are schematic sectional views showing a sequence of steps of a method of manufacturing a prior art semiconductor device. Referring to
FIG. 18 , for example, aninsulating film 102 is formed on a ptype silicon substrate 101. - Referring to
FIG. 19 ,insulating film 102 is patterned by a photolithographic technique and an etching technique at the ordinary levels. By use of any convenient etching technique such as anisotropic dry etching with the patternedinsulating film 102 as a mask, atrench 103 of a prescribed depth is formed on a surface ofsilicon substrate 101. - Referring to
FIG. 20 , in order to remove a damaged layer caused by the etching and furthermore, rounding the top edge portion oftrench 103, asilicon oxide layer 104 is formed on the inner wall oftrench 103. - Referring to
FIG. 21 , in order to prevent oxidation of the inner wall oftrench 103 in a subsequent oxidation step, an oxidationpreventive film 106 is formed. Oxidationpreventive film 106 is formed as a silicon nitride film at the interface betweensilicon substrate 101 andsilicon oxide film 104 by annealingsilicon substrate 101 in an atmosphere including nitrogen (N). - Referring to
FIG. 22 , a fillingoxide film 107 constituted of a silicon oxide film is formed on insulatingfilm 102 so as to filltrench 103. Thereafter, by annealingsilicon substrate 101 at a prescribed temperature in a prescribed atmosphere, fillingoxide film 107 is densified. Thereafter, the surface ofsilicon substrate 101 is planarized by means of a CMP (Chemical Mechanical Polishing) method and subsequently, insulatingfilm 102 on an active region is removed by wet etching. - Referring to
FIG. 23 , the CMP and the wet etching exposes the surface ofsilicon substrate 101 while leaving fillingoxide film 107 so as to filltrench 103, thus completing a trench isolation structure. - Referring to
FIG. 24 , agate oxide film 108 is formed on the surface ofsilicon substrate 101 by oxidation. The oxidation is effected by introducing hydrogen gas and oxygen gas into a reaction vessel accommodating wafers after the gases react with each other, or introducing only oxygen gas into the reaction vessel. Thereafter, a gate electrode is formed ongate oxide film 108 and subsequent to this, an impurity is ion implanted intosilicon substrate 101 with the gate electrode or the like as a mask, thereby forming a pair of source/drain regions on the surface ofsilicon substrate 101. In such a way, there are formed a MOS (Metal Oxide Semiconductor) transistor used in DRAM (Dynamic Random Access Memory) and others, and a floating-gate transistor used in EEPROM (Electrically Erasable Programmable Read Only Memory) and others. - In the above semiconductor device, oxidation
preventive film 106 is formed on the inner wall of a trench isolation structure. Therefore, a film thickness ofgate oxide film 108 shows thinning as depicted inFIG. 25 at the top edge portion of the trench isolation structure (on the oxidation preventive film 106). That is, a film thickness TA3 ofgate oxide film 108 at the top edge portion of the trench isolation structure is thinner than those of the other parts, having resulted in a problem of difficulty in forming a high reliabilitygate oxide film 108. - It is an object of the present invention to provide a semiconductor device capable of suppressing thinning of a gate oxide film at the top edge portion of a trench isolation structure therein and a method of manufacturing therefor.
- A method of manufacturing a semiconductor device of the present invention includes the following steps.
- First of all, a trench is formed on a main surface of a semiconductor substrate. Then, an oxidation preventive film is formed along the inner wall of the trench. A filling layer is formed so as to fill the trench. A high oxidation capability is applied on the main surface of a semiconductor substrate in an atmosphere in which radicals of at least one kind of hydrogen radicals and oxygen radicals are generated to thereby form a gate oxide film on the main surface of a semiconductor substrate.
- In a method of manufacturing a semiconductor device of the present invention, since an oxidation with a high capability is applied by which radicals of at least one kind of hydrogen radicals and oxygen radicals are generated, oxidation speeds of the semiconductor substrate and the oxidation preventive film can be almost the same as that of each other. Therefore, a thickness of a gate oxide film, formed by this oxidation, directly above the oxidation preventive film at the top edge portion of the step in the trench can be of the same order as those of the gate oxide film in the other regions. With this, the film thickness of the gate oxide film can be uniform to thereby obtain a high reliability gate oxide film.
- The above method of manufacturing a semiconductor device preferably further includes: a step of forming a gate electrode on the gate oxide film; and a step of forming a pair of source/drain regions on the main surface of a semiconductor substrate so as to sandwich a region directly below the gate electrode between the source/drain regions.
- With such steps added, a transistor with a gate layer can be formed.
- In the above method of manufacturing a semiconductor device, the gate electrode is preferably formed so as to have a floating gate and a control gate, insulated from each other.
- Thereby, a memory cell of a flash memory can be fabricated.
- In the above method of manufacturing a semiconductor device, the gate oxide film preferably has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode.
- In such a way, the gate oxide film having a uniform thickness can be formed.
- In the above method of manufacturing a semiconductor device, the oxidation preventive film is preferably made from at least one of a silicon nitride film and a silicon oxynitride film.
- In such a way, various kinds of films can be chosen as an oxidation preventive film.
- A semiconductor device of the present invention includes: a semiconductor substrate; an oxidation preventive film; a filling layer; a gate oxide film; and a gate electrode. The semiconductor substrate has a trench on a main surface of the semiconductor substrate. The oxidation preventive film is formed along the inner wall of the trench. The filling layer fills the trench. The gate oxide film is formed on the main surface of the semiconductor substrate and the oxidation preventive film. The gate electrode is formed on the gate oxide film. The gate oxide film has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode.
- In a semiconductor device of the present invention, since the gate oxide film has almost the same thickness in a region directly above the oxidation preventive film and a region directly below the gate electrode, a thickness of the gate oxide film can be uniform. Thereby, a high reliability gate oxide film can be obtained.
- In the above semiconductor device, the gate electrode preferably has a floating gate electrode and a control gate, insulated from each other.
- Thereby, a memory cell of a flash memory can be fabricated.
- In the above semiconductor device, the oxidation preventive film is preferably made from at least one of a silicon nitride film and a silicon oxynitride film.
- In such a way, various kinds of films can be selected as an oxidation preventive film.
- The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
- FIGS. 1 to 7 are schematic sectional views showing a sequence of steps of a method of manufacturing a semiconductor device in a first embodiment of the present invention;
-
FIG. 8 is a schematic sectional view showing a structure of a MOS transistor formed after a gate oxide film of the semiconductor device in the first embodiment of the present invention is formed; -
FIG. 9 is a schematic sectional view for describing a film thickness of the gate oxide film of the semiconductor device of the first embodiment of the present invention; -
FIG. 10 is a schematic sectional view showing indispensable features combined of the first embodiment of the present invention, which is applied to a floating gate transistor; - FIGS. 11 to 14 are schematic sectional views showing a sequence of steps of a method of manufacturing a semiconductor device in a second embodiment of the present invention;
-
FIG. 15 is a schematic sectional view showing a structure of a MOS transistor formed after a gate oxide film of the semiconductor device in the second embodiment of the present invention is formed; -
FIG. 16 is a schematic sectional view for describing a film thickness of the gate oxide film of the semiconductor device of the second embodiment of the present invention; -
FIG. 17 is a schematic sectional view showing indispensable features combined of the second embodiment of the present invention, which is applied to a floating gate transistor; - FIGS. 18 to 24 are schematic sectional views showing a sequence of steps of a method of manufacturing a prior art semiconductor device; and
-
FIG. 25 is a schematic sectional view for describing a film thickness of a gate oxide film of the prior art semiconductor device. - Description will be given of embodiments of the present invention below on the basis of the accompanying drawings.
- (First Embodiment)
- First of all, referring to
FIG. 1 , an insulatingfilm 2 is formed on asemiconductor substrate 1 made of silicon of a p conductivity type, for example. - Referring to
FIG. 2 , insulatingfilm 2 is patterned by a photolithographic technique and an etching technique at the ordinary levels. By use of any convenient etching technique such as anisotropic dry etching with patterned insulatingfilm 2 as a mask, atrench 3 of a desired depth is formed on a surface ofsemiconductor substrate 1. - Referring to
FIG. 3 , in order to remove a damaged layer caused by the etching and further, round the top edge portion oftrench 3, thermal oxidation is applied ontosemiconductor substrate 1. By doing so, asilicon oxide film 4 is formed on the inner wall oftrench 3 to a thickness of from 10 nm to 70 nm. - Referring to
FIG. 4 , in order to prevent oxidation of the inner wall oftrench 3 that would be caused by a subsequent oxidation step, annealing is applied tosemiconductor substrate 1 in an atmosphere including at least one of NO gas, N2O gas and NH3 gas at a temperature in the range of from 850° C. to 1000° C. With such annealing, an oxidationpreventive film 6 made of a silicon nitride film is formed at the interface betweensemiconductor substrate 1 andsilicon oxide film 4. - Referring to
FIG. 5 , a silicon oxide film such as a TEOS (Tetra Ethyl Ortho Silicate) oxide film, a HDP (High Density Plasma) oxide film or the like is formed on insulatingfilm 2 so as to fill the interior oftrench 3 by means of a LPCVD (Low Pressure Chemical Vapor Deposition) method. Thereafter, annealing is performed onsemiconductor substrate 1 at 800° C. to 1150° C. in a N2 (nitrogen) atmosphere for densification of a fillingoxide film 7. After fillingoxide film 7 is removed by CMP to planarize the surface ofsemiconductor substrate 1, insulatingfilm 2 on an active region is removed by wet etching. - Referring to
FIG. 6 , the surface ofsemiconductor substrate 1 is exposed by the above CMP and the wet etching to leave fillingoxide film 7 only intrench 3 and complete trench isolation. - Referring to
FIG. 7 , agate oxide film 8 is formed on the active region ofsemiconductor substrate 1.Gate oxide film 8 is formed under a so-called steam condition, that is under an oxidative condition in which hydrogen radials and oxygen radicals are generated, and having so high an oxidative capability that oxidationpreventive film 6 such as a silicon nitride film can be oxidized. To be concrete, hydrogen gas and oxygen gas are separately introduced into a reaction vessel accommodating wafers to react with each other directly above the wafers and thereby generate hydrogen radicals and oxygen radicals, which generates oxidation with a high capability. In such a manner, there are formed a trench isolation structure andgate oxide film 8 in the embodiment. -
Gate oxide film 8 thus formed can be used as a gate insulating film of an ordinary MOS transistor as shown inFIG. 8 , for example. Such a MOS transistor is formed in a way described below after the step ofFIG. 7 . - Referring to
FIG. 8 , a conductive layer used in a gate electrode is formed ongate oxide film 8 and thereafter, patterned by a photolithographic technique and an etching technique at the ordinary levels to form agate electrode 9. An n type impurity such as arsenic or phosphorus is ion implanted in an active region ofsemiconductor substrate 1 withgate electrode 9 as a mask. With the ion implantation applied, a pair of source/drain regions 10 are formed on the surface ofsemiconductor substrate 1 so as to sandwich a region directly belowgate electrode 9 between source/drain regions 10 to thereby complete a MOS transistor. - Then, description will be given of a structure of the semiconductor device fabricated as described above.
- Referring to
FIG. 8 , the active region ofsemiconductor substrate 1 is electrically isolated by trench isolation. The trench isolation structure is constituted of:silicon oxide film 4 formed along the inner wall oftrench 3 provided onsemiconductor substrate 1; oxidationpreventive film 6 made of a silicon nitride film or the like formed at the interface betweensilicon oxide film 4 andsemiconductor substrate 1; and fillingoxide film 7filling trench 3. - A MOS transistor is formed in the active region electrically isolated. The MOS transistor has:
gate oxide film 8; gate electrode 9: and pair of source/drain regions 10.Gate oxide film 8 is formed on the active region ofsemiconductor substrate 1 andgate electrode 9 obtained by patterning is formed ongate oxide film 8. Pair of source/drain regions 10 is formed on the surface ofsemiconductor substrate 1 so as to sandwich the region directly belowgate electrode 9 between source/drain regions 10. -
Gate oxide film 8 described above has a uniform thickness such that a thickness TA1 of a region directly above oxidationpreventive film 6 and a thickness TB1 of a region directly belowgate electrode 9 are equal to each other as shown inFIG. 9 . - In the embodiment, an oxidizing method is applied, in which hydrogen radicals and oxygen radicals are generated, and which has so high an oxidative capability that oxidation
preventive film 6 made of a silicon nitride or the like can be oxidized, thereby forminggate oxide film 8. For this reason, in the oxidation, oxidizing speeds on oxidationpreventive film 6 made of a silicon nitride andsemiconductor substrate 1 made of silicon can be the same as each other. Thereby,gate oxide film 8 as shown inFIG. 9 comes to have almost the same thickness in a region directly above oxidationpreventive film 6 and in a region directly belowgate electrode 9, thereby enabling prevention of thinning ofgate oxide film 8 at the top edge portion of the trench isolation structure. - Since
gate oxide film 8 has a uniform thickness in such a way,gate oxide film 8 has difficulty in deterioration and increases a breakdown lifetime, thereby enabling a high reliabilitygate oxide film 8 to be achieved. Therefore, a device having good transistor characteristics can be obtained that is categorized in DRAM (Dynamic Random Access Memory) or the like. - Not that after the step shown in
FIG. 7 , a floating gate transistor shown inFIG. 10 can also be formed, which will be described below. - Referring to
FIG. 10 , after a floatingelectrode 9 a is formed ongate oxide film 8, an insulatingfilm 9 b and acontrol gate electrode 9 c are formed on floatinggate electrode 9 a. An n type impurity such as arsenic or phosphorus is ion implanted withcontrol gate electrode 9 c or the like as a mask. By doing so, pair of source/drain regions 10 is formed on the surface ofsemiconductor substrate 1 to thereby complete the floating gate transistor. - The floating gate transistor thus fabricated has floating
gate electrode 9 a andcontrol gate electrode 9 c, insulated from each other. Since a structure of the floating gate transistor is almost the same as that of the above ordinary MOS transistor ofFIG. 8 , the same symbols are attached to the same constituents and description thereof is omitted. - In the above floating gate transistor, too, by preventing thinning of
gate oxide film 8 at the top edge portion of the trench isolation structure,gate oxide film 8 having a uniform thickness can be obtained. By doing so,gate oxide film 8 has difficulty in deterioration and a long breakdown lifetime, thereby enabling a flash memory having good transistor characteristics to be obtained. - (Second Embodiment)
- A fabrication process of the embodiment is different from that of the first embodiment by comparison in a step of forming an oxidation preventive film. A fabrication process of the embodiment follows a sequence of steps similar to that of the first embodiment shown in FIGS. 1 to 3. Thereafter, there is formed an oxidation
preventive film 5 constituted of a silicon nitride film (an SiN film) and a silicon oxynitride (an SiON film) to a thickness from 5 nm to 30 nm. - Referring to
FIG. 12 , a fillingoxide film 7 is formed in a similar way to that of thefirst embodiment 1 so as to filltrench 3. Thereafter, the surface ofsilicon substrate 1 is planarized by CMP, followed by removal of insulatingfilm 2 on the active region with wet etching. - Referring to
FIG. 13 , by removal of insulatingfilm 2, the surface ofsemiconductor substrate 1 is exposed, leaving fillingoxide film 7 intrench 3 only, to complete trench isolation. - Referring to
FIG. 14 , angate oxide film 8 is formed in conditions similar to those of the first embodiment. In formation ofgate oxide film 8, an oxidation method with a high capability is employed; therefore, oxidationpreventive film 5 is also oxidized to formgate oxide film 8 in a region directly above oxidationpreventive film 5. In such a way, the trench isolation structure andgate oxide film 8 in the embodiment are formed. -
Gate oxide film 8 thus formed can be used as a gate insulating film of an ordinary MOS transistor as shown inFIG. 15 , for example. Such a MOS transistor is formed after the step ofFIG. 14 , similar to the first embodiment. - Then, description will be given of a structure of the semiconductor device fabricated as described above.
- Referring to
FIG. 15 , the active region ofsemiconductor substrate 1 is electrically isolated by trench isolation. The trench isolation structure is constituted of:silicon oxide film 4 formed along the inner wall oftrench 3 formed onsemiconductor substrate 1; oxidationpreventive film 5 formed along the inner wall ofsilicon oxide film 4; and fillingoxide film 7filling trench 3. - A MOS transistor is formed in the active region electrically isolated by the trench isolation. The MOS transistor has:
gate oxide film 8;gate electrode 9; and pair of source/drain regions 10.Gate oxide film 8 is formed on the active region ofsemiconductor substrate 1 andgate electrode 9 obtained by patterning is formed ongate oxide film 8. Pair of source/drain regions 10 are formed on the surface ofsemiconductor substrate 1 so as to sandwich a region directly belowgate electrode 9 between source/drain regions 10. -
Gate oxide film 8 described above has a uniform thickness such that a thickness TA2 of a region directly above oxidationpreventive film 5 and a thickness TB2 of a region directly belowgate electrode 9 are equal to each other as shown inFIG. 16 . - In the embodiment as well, similar to the first embodiment, thinning of
gate oxide film 8 at the top edge portion of the trench isolation structure can be prevented from being produced andgate oxide film 8 has a uniform film thickness. For this reason,gate oxide film 8 has difficulty in deterioration and increases a breakdown lifetime, thereby enabling a high reliabilitygate oxide film 8 to be attained. Therefore, a device having good transistor characteristics can be obtained that is categorized in DRAM or the like. - Furthermore, while in
FIG. 15 , description is given of a structure of an ordinary MOS transistor, a fabrication process and structure of the embodiment, as shown inFIG. 17 , can be applied to a floating gate transistor as well. In this case,gate oxide film 8 has difficulty in deterioration and a long breakdown life time, thereby enabling a flash memory with good transistor characteristics to be obtained. - Note that conductivity types associated with constituents of the above semiconductor device may be all inverted in polarity.
- Furthermore, conditions for oxidation with a high capability in gate oxide film formation are not limited to the above conditions, but any condition may be adopted as far as an oxidation preventive film such as a silicon nitride film can be oxidized at almost the same speed as is silicon.
- Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.
Claims (2)
1. A method of manufacturing a semiconductor device comprising:
a step of forming a trench at a main surface of a semiconductor substrate;
a step of forming an oxidation preventive film along an inner wall of said trench;
a step of forming a filling layer so as to fill said trench; and
a step of applying an high oxidation capability on said main surface of a semiconductor substrate in an atmosphere in which radicals of at least one kind of hydrogen radicals and oxygen radicals are generated to thereby form a gate oxide film on said main surface of a semiconductor substrate.
2-8. (canceled)
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US12/706,659 US20100140681A1 (en) | 2001-07-11 | 2010-02-16 | Semiconductor device and method of manufacturing therefor |
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US11/221,823 US20060003532A1 (en) | 2001-07-11 | 2005-09-09 | Semiconductor device and method of manufacturing therefor |
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US20070138518A1 (en) | 2007-06-21 |
TWI283456B (en) | 2007-07-01 |
US20030011019A1 (en) | 2003-01-16 |
US20100140681A1 (en) | 2010-06-10 |
KR100502602B1 (en) | 2005-07-22 |
US7683455B2 (en) | 2010-03-23 |
DE10211898A1 (en) | 2003-01-30 |
US6964905B2 (en) | 2005-11-15 |
JP5121102B2 (en) | 2013-01-16 |
KR20030006938A (en) | 2003-01-23 |
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