US20050269063A1 - Heat pipe having a wick structure containing phase change materials - Google Patents
Heat pipe having a wick structure containing phase change materials Download PDFInfo
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- US20050269063A1 US20050269063A1 US10/882,980 US88298004A US2005269063A1 US 20050269063 A1 US20050269063 A1 US 20050269063A1 US 88298004 A US88298004 A US 88298004A US 2005269063 A1 US2005269063 A1 US 2005269063A1
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- heat
- particles
- wick
- micro
- heat pipe
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Definitions
- the present invention relates to heat pipes for heat dissipation, and more particularly, to heat pipes having a wick structure comprised of micro-encapsulated phase change materials.
- Heat pipes are highly efficient devices for transferring large quantities of heat from a heat source to an area where the heat can be dissipated.
- a heat pipe generally consists of a vacuum tight envelope, a wick structure and a working fluid. The heat pipe is evacuated and then back-filled with a small quantity of working fluid, typically just enough to saturate the wick.
- the atmosphere inside the heat pipe is set by an equilibrium of liquid and vapor. As heat enters at the evaporator, this equilibrium is upset generating vapor at a slightly higher pressure. This higher pressure vapor travels to the condenser end where the slightly lower temperatures cause the vapor to condense giving up its latent heat of vaporization.
- the condensed fluid is then pumped back to the evaporator by the capillary forces developed in the wick structure. This continuous cycle transfers large quantities of heat with very low thermal gradients.
- a heat pipe's operation is passive being driven only by the heat that is transferred.
- Heat pipes are currently used for a variety of applications including lasers, nuclear energy, dehumidification and air conditioning, thermal control in spacecrafts, cooling of electronics systems and cryogenics. Heat pipes can be designed to operate over a broad range of temperatures from cryogenic applications ( ⁇ 243° C.) to high temperature applications (>2000° C.). The material for the heat pipe container, wick structure and working fluid are selected based on the application for which the heat pipe will be used.
- Heat pipes are generally designed to perform within a particular operating temperature range, which is dependent on the application. When operating within this range, a heat pipe will provide highly reliable heat transfer for years. However, operation outside of this range causes degradation or even failure. Such a limitation is a disadvantage in applications where there may be peak loads which can cause a sudden temperature rise outside of the operating range of the heat pipe. Not only can this cause failure of the heat pipe, but also may cause damage to the system which is being cooled.
- PCMs phase change materials
- PCMs e.g., wax
- PCMs provide a temperature load-leveling capability via the latent heat effect.
- PCMs store or release heat as they change phase between a liquid and solid state or, in the case of solid-solid PCMs, as they undergo reversible crystal structure transitions.
- the relatively high thermal capacity of PCMs make them advantageous for temperature control in high heat generating systems and for systems prone to transient peak loads.
- Electronics systems are one such system where PCMs may be particularly advantageous.
- PCMs in heat transfer devices
- U.S. Pat. No. 5,224,356 to Colvin et al. a method is disclosed whereby a plurality of microcapsules in the form of a powder are placed in contact with an object to be cooled.
- the microcapsules have a shell and contain an enhanced thermal energy absorbing material.
- the absorbing material may be a phase change material.
- U.S. Pat. No. 5,007,478 to Sengupta discloses a heat sink device adjacent to an article to be thermally controlled.
- the heat sink defines a chamber which contains a slurry of micro-encapsulated PCMs.
- U.S. Pat. No. 5,831,831 to Freeland discloses a bonding material/phase change material system for electronic device heat burst dissipation.
- the system comprises a phase change material disposed on a substrate and encircled by a bonding material.
- An electronic device having a heatspreader portion is positioned atop the phase change material and bonding material.
- U.S. Pat. No. 5,555,932 to Dudley discloses a heat shield for an automotive vehicle.
- the heat shield utilizes a phase change material to absorb excess heat generated by a heat source within the vehicle.
- the heat shield insulates a component adjacent to the heat source and prevents the transmission of heat to the component.
- U.S. Pat. No. 4,911,232 to Colvin et al. discloses a method of obtaining enhanced heat transfer in a closed loop thermodynamic system.
- the system includes a two-component heat transfer fluid comprising a carrier fluid and a plurality of discrete reversible latent energy transition material particles.
- the fluid slurry is circulated about the loop and the loop is tuned so that a minimum temperature differential exists between the thermal source and sink in order to maximize the latent heat transport by adjustment of the heat transfer fluid flow rate, the rate of thermal energy input into the heat transfer fluid and the rate of cooling of heat transfer fluid.
- This method has the disadvantage of needing an outside energy source to pump the heat transferring slurry.
- the above disclosures all relate to thermal regulating systems wherein the PCMs are contained within a structure which is substantially completely adjacent to the heat source.
- the PCMs release the absorbed heat, as well as absorb the heat, at a location proximate the heat source. They lack the advantage of having the heat released at a location distant from the heat source.
- the present invention provides a wick for use in a heat pipe comprising particles comprising micro-encapsulated phase change materials (PCMs).
- PCMs phase change materials
- the particles are bonded together to form a wick structure for the heat pipe.
- the micro-encapsulated PCM particles may be of uniform or varying sizes and may be bonded together using different techniques including sintering or gluing.
- the present invention also provides a heat transfer device comprising a heat pipe which includes an envelope, a working fluid and a wick formed from micro-encapsulated PCM particles.
- the heat transfer device may also include a heat sink.
- the heat sink may have micro-encapsulated PCM particles attached to an outside surface of the heat sink or, alternatively, have micro-encapsulated PCM particles contained within the heat sink.
- the heat transfer device may include a first heat pipe and a second heat pipe having an envelope, a working fluid and a wick formed from or comprising micro-encapsulated PCM particles.
- the first heat pipe may be a conventional heat pipe or may have a wick comprised of micro-encapsulated PCM particles.
- the heat transfer device may further include a heat sink.
- FIG. 1 is a perspective view, partially in cross-section, of a heat pipe formed according to the present invention
- FIG. 2 is a transverse cross-sectional view of a micro-encapsulated phase change material particle
- FIG. 3 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention.
- FIG. 4 is a longitudinal cross-sectional view of a first heat pipe and secondary heat pipe formed according to one embodiment of the present invention
- FIG. 5 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention.
- FIG. 6 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention.
- the quantity of working fluid 120 in heat transfer device 10 should be just enough to saturate wick 130 .
- wick 130 comprises a plurality of micro-encapsulated PCM particles 132 ( FIGS. 2 and 3 - 6 ).
- Micro-encapsulated PCM particles 132 have an outer shell wall 134 surrounding a phase change material 136 .
- Shell 134 may be formed from materials that are suitable for heat transfer applications of the type known to those in the art, e.g., metals such as, silver, gold, copper, aluminum, titanium or their alloys.
- Polymeric materials useful in this invention include any material useful in the electronics industry for heat transfer applications, including, without limitation, thermoplastics (crystalline or non-crystalline, cross-linked or non-cross-linked), thermosetting resins, elastomers or blends or composites thereof.
- thermoplastic polymers include, without limitation, polyolefins, such as polyethylene or polypropylene, copolymers (including terpolymers, etc.) of olefins such as ethylene and propylene, with each other and with other monomers such as vinyl esters, acids or esters of unsaturated organic acids or mixtures thereof, halogenated vinyl or vinylidene polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride and copolymers of these monomers with each other or with other unsaturated monomers, polyesters, such as poly(hexamethylene adipate or sebacate), poly(ethylene terephthalate) and poly(tetramethylene terephthalate), polyamides such as Nylon-6, Nylon-6,6, Nylon-6,10, Versamids, polystyrene, polyacrylonitrile, thermoplastic silicone resins, thermoplastic polyethers, thermoplastic polyethers, thermo
- elastomeric resins examples include, without limitation, rubbers, elastomeric gums and thermoplastic elastomers.
- elastomeric gum refers to polymers which are noncrystalline and which exhibit after cross-linking rubbery or elastomeric characteristics.
- thermoplastic elastomer refers to materials which exhibit, in various temperature ranges, at least some elastomer properties. Such materials generally contain thermoplastic and elastomeric moieties.
- the elastomer resin can be cross-linked or non cross-linked when used in the inventive compositions.
- Illustrative examples of some suitable elastomeric gums for use in this invention include, without limitation, polyisoprene (both natural and synthetic), ethylene-propylene random copolymers, poly(isobutylene), styrene-butadiene random copolymer rubbers, styrene-acrylonitrile-butadiene terpolymer rubbers with and without added copolymerized amounts of unsaturated carboxylic acids, polyacrylate rubbers, polyurethane gums, random copolymers of vinylidene fluoride and, for example, hexafluoropropylene, polychloroprene, chlorinated polyethylene, chlorosulphonated polyethylene, polyethers, plasticized poly(vinyl chloride), substantially non-crystalline random co- or ter-polymers of ethylene with vinyl esters or acids and esters of unsaturated acids, silicone gums and base polymers, for example, poly(dimethyl siloxane), poly(methylphen
- thermoplastic elastomers suitable for use in the invention include, without limitation, graft and block copolymers, such as random copolymers of ethylene and propylene grafted with polyethylene or polypropylene side chains, and block copolymers of—olefins such as polyethylene or polypropylene with ethylene/propylene or ethylene/propylene/diene rubbers, polystyrene with polybutadiene, polystyrene with polyisoprene, polystyrene with ethylene-propylene rubber, poly(vinylcyclohexane) with ethylene-propylene rubber, poly(-methylstyrene) with polysiloxanes, polycarbonates with polysiloxanes, poly(tetramethylene terephthalate) with poly(tetramethylene oxide) and thermoplastic polyurethane rubbers.
- graft and block copolymers such as random copolymers of ethylene and propylene grafted with polyethylene
- thermosetting resins useful herein include, without limitation, epoxy resins, such as resins made from epichlorohydrin and bisphenol A or epichlorohydrin and aliphatic polyols, such as glycerol, and which can be conventionally cured using amine or amide curing agents.
- epoxy resins such as resins made from epichlorohydrin and bisphenol A or epichlorohydrin and aliphatic polyols, such as glycerol
- Other examples include phenolic resins obtained by condensing a phenol with an aldehyde, e.g., phenol-formaldehyde resin.
- Other additives can also be present in the composition, including for example fillers, pigments, antioxidants, fire retardants, cross-linking agents, adjuvants and the like.
- Shell 134 will possess a melting point that is substantially higher than the melting point of PCM 136 , and higher than the expected temperature of the heat generating source. Thus, selection of the shell material will be dependent upon the application. Shell 134 should also be resilient so as to withstand cyclic expansions and contractions of PCM 136 . The thickness of shell 134 may vary depending upon the material used.
- PCM 136 may comprise a variety of materials depending on the application and the operating temperature range. Suitable materials include, without limitation, organic waxes and paraffins, inorganic multi-phase metal alloys, eutectic salts, and other materials known in the art. Selection and quantity of PCM 136 will depend upon the desired PCM melting point and how much heat will need to be absorbed. PCM 136 may also be a blend of different compounds to obtain the desired phase transition temperature or range. Also, different types of PCMs may be used in a single wick structure to increase the temperature range over which the heat pipe will be effective.
- solid-solid PCMs such as, polymer crystals
- Solid-solid PCMs undergo reversible solid-state crystal structure transitions at temperatures ranging from ambient up to about 100° C.
- Transition temperatures can be selected by forming solid solutions of different organic compounds.
- a solid-solid PCM is employed without the use of shell 134 . Transition of these solid-solid PCMs can occur over a fairly limited temperature range.
- PCMs 136 can be encapsulated by any means known to those in the art. Such methods include coacervation, interfacial polymerization, air suspension and centrifugal extrusion.
- the size of particles 132 may be fairly uniform or, may be variable as desired. Preferably, the size ranges for particles 132 vary from about one micron to about one mm. The size of particles 132 will dictate the size of pores 138 between the particles (See FIG. 3 ). Pore size often determines the maximum capilliary pumping pressure of the wick and also effects wick permeability. Thus, a wick comprising particles having different sizes can be utilized depending upon the application of the heat pipe and its required orientation.
- PCM particles 132 are very often spherical in shape, but also may be cylindrically shaped, or may be elongated particles, cubes, monofilaments or fibers.
- micro-encapsulated PCM particles 132 are bonded together to form a wick structure 130 .
- the method by which micro-encapsulated PCM particles 132 are bonded will depend on the composition of shell 134 . Where shells 134 comprise a metal, the particles are preferably sintered together. Where shells 134 comprise a polymer material, the particles are preferably adhered together by means of an adhesive or binder. Other methods known to those skilled in the art may also be employed.
- Wick 130 formed from a plurality of micro-encapsulated PCM particles 132 functions in much the same way as a conventional heat pipe wick structure, i.e., capillary pressure is employed to pump working fluid from a condenser portion of the heat pipe to an evaporator portion.
- a wick structure comprising micro-encapsulated PCM particles has the added advantage of using the wick structure as an additional heat absorber and repository. This feature greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak loads.
- micro-encapsulated PCM particles may be incorporated into a conventional screen mesh type wick structure.
- PCM particles may also be bonded to a pre-sintered metal powder wick structure.
- Heat transfer device 10 also may include a heat sink 200 that is mounted to a portion of envelope 110 of heat pipe 100 for further dissipating the absorbed thermal energy.
- Heat sink 200 may be in the form of folded of stamped fins 210 , as shown in FIG. 3 , or may take any other shape or form known to those skilled in the art.
- Wick 130 may be formed separately from envelope 120 , and then placed in the envelope 110 where it lines an inner surface 112 of envelope 110 just as with a conventional wick. Alternatively, PCM particles 132 may be formed into a wick in situ. Envelope 110 is then evacuated and back-filled with a small quantity of working fluid 120 , preferably just enough to wet the wick 130 . Heat pipe 100 is then hermetrically sealed. Fins 210 may be attached to heat pipe 100 to act as a heat sink 200 for further dissipation of heat.
- first heat pipe 300 may be a conventional heat pipe, i.e., containing a wick structure previously known and used in the art such as sintered powdered metal, screen meshes, grooved tube, or cable/fibers.
- first heat pipe 300 may be a heat pipe as described above, containing a wick 330 comprising micro-encapsulated PCM particles 332 .
- Second heat pipe 400 comprises an envelope 410 , a working fluid (not shown) and a wick 430 comprising micro-encapsulated PCM particles 432 , wherein wick structure 430 preferably essentially fills the entire volume of heat pipe 400 .
- wick structure 430 is made from small and large encapsulated PCM particles 432 (as shown in FIG. 4 ) so as to have small and large pore sizes in between the individual particles 432 .
- the pores may range from 10 ⁇ 3 mm to 2 mm more or less.
- the large pores facilitate transport of the vapor, while the small pores provide capillary action for the heat pipe working fluid.
- the working fluid will not entirely fill up the voids between the micro-encapsulated PCM particles 432 .
- a heat sink 200 may also be attached to first heat pipe 300 , such as fins 210 as shown in FIG. 4 .
- Heat pipe 100 may be a conventional heat pipe containing a traditional wick, or may have a wick structure comprising micro-encapsulated PCM particles 232 as described above, and as shown in FIG. 5 .
- Heat sink 200 (shown as fins 210 in FIG. 5 ) includes micro-encapsulated PCM particles 232 attached to the outside surface 212 of heat sink 200 .
- PCM particles 232 enhance the heat absorption capacity of the heat sink.
- 200 comprises a hollow material and contains micro-encapsulated PCM particles 232 within it.
Abstract
A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.
Description
- The present invention relates to heat pipes for heat dissipation, and more particularly, to heat pipes having a wick structure comprised of micro-encapsulated phase change materials.
- Heat pipes are highly efficient devices for transferring large quantities of heat from a heat source to an area where the heat can be dissipated. A heat pipe generally consists of a vacuum tight envelope, a wick structure and a working fluid. The heat pipe is evacuated and then back-filled with a small quantity of working fluid, typically just enough to saturate the wick. The atmosphere inside the heat pipe is set by an equilibrium of liquid and vapor. As heat enters at the evaporator, this equilibrium is upset generating vapor at a slightly higher pressure. This higher pressure vapor travels to the condenser end where the slightly lower temperatures cause the vapor to condense giving up its latent heat of vaporization. The condensed fluid is then pumped back to the evaporator by the capillary forces developed in the wick structure. This continuous cycle transfers large quantities of heat with very low thermal gradients. A heat pipe's operation is passive being driven only by the heat that is transferred.
- Heat pipes are currently used for a variety of applications including lasers, nuclear energy, dehumidification and air conditioning, thermal control in spacecrafts, cooling of electronics systems and cryogenics. Heat pipes can be designed to operate over a broad range of temperatures from cryogenic applications (<−243° C.) to high temperature applications (>2000° C.). The material for the heat pipe container, wick structure and working fluid are selected based on the application for which the heat pipe will be used.
- Heat pipes are generally designed to perform within a particular operating temperature range, which is dependent on the application. When operating within this range, a heat pipe will provide highly reliable heat transfer for years. However, operation outside of this range causes degradation or even failure. Such a limitation is a disadvantage in applications where there may be peak loads which can cause a sudden temperature rise outside of the operating range of the heat pipe. Not only can this cause failure of the heat pipe, but also may cause damage to the system which is being cooled.
- Temperature control devices using phase change materials (PCMs) have been employed in a variety of temperature stabilization applications including automotive, electronics and clothing applications. Often, PCMs, e.g., wax, are encapsulated in a durable, thermally conductive shell. PCMs provide a temperature load-leveling capability via the latent heat effect. PCMs store or release heat as they change phase between a liquid and solid state or, in the case of solid-solid PCMs, as they undergo reversible crystal structure transitions. The relatively high thermal capacity of PCMs make them advantageous for temperature control in high heat generating systems and for systems prone to transient peak loads. Electronics systems are one such system where PCMs may be particularly advantageous.
- The increasing miniaturization of electronic components has made heat transfer a critical design concern as these systems create very high heat fluxes. In order for electronic devices to perform correctly and reliably, suitable operating temperatures must be maintained and temperature variations must be minimized. Due to the increasingly high heat generated from these systems, and their proneness for transient peak loads, common heat transfer technologies such as heat sinks, cold plates, direct impingement cooling systems and conventional heat pipes are approaching their heat transfer limits.
- The use of PCMs in heat transfer devices is known in the art. For example, in U.S. Pat. No. 5,224,356 to Colvin et al., a method is disclosed whereby a plurality of microcapsules in the form of a powder are placed in contact with an object to be cooled. The microcapsules have a shell and contain an enhanced thermal energy absorbing material. The absorbing material may be a phase change material.
- U.S. Pat. No. 5,007,478 to Sengupta, discloses a heat sink device adjacent to an article to be thermally controlled. The heat sink defines a chamber which contains a slurry of micro-encapsulated PCMs.
- U.S. Pat. No. 5,831,831 to Freeland, discloses a bonding material/phase change material system for electronic device heat burst dissipation. The system comprises a phase change material disposed on a substrate and encircled by a bonding material. An electronic device having a heatspreader portion is positioned atop the phase change material and bonding material.
- U.S. Pat. No. 5,555,932 to Dudley, discloses a heat shield for an automotive vehicle. The heat shield utilizes a phase change material to absorb excess heat generated by a heat source within the vehicle. The heat shield insulates a component adjacent to the heat source and prevents the transmission of heat to the component.
- U.S. Pat. No. 4,911,232 to Colvin et al., discloses a method of obtaining enhanced heat transfer in a closed loop thermodynamic system. The system includes a two-component heat transfer fluid comprising a carrier fluid and a plurality of discrete reversible latent energy transition material particles. The fluid slurry is circulated about the loop and the loop is tuned so that a minimum temperature differential exists between the thermal source and sink in order to maximize the latent heat transport by adjustment of the heat transfer fluid flow rate, the rate of thermal energy input into the heat transfer fluid and the rate of cooling of heat transfer fluid. This method has the disadvantage of needing an outside energy source to pump the heat transferring slurry.
- The above disclosures all relate to thermal regulating systems wherein the PCMs are contained within a structure which is substantially completely adjacent to the heat source. Thus, the PCMs release the absorbed heat, as well as absorb the heat, at a location proximate the heat source. They lack the advantage of having the heat released at a location distant from the heat source.
- The present invention provides a wick for use in a heat pipe comprising particles comprising micro-encapsulated phase change materials (PCMs). The particles are bonded together to form a wick structure for the heat pipe. The micro-encapsulated PCM particles may be of uniform or varying sizes and may be bonded together using different techniques including sintering or gluing.
- The present invention also provides a heat transfer device comprising a heat pipe which includes an envelope, a working fluid and a wick formed from micro-encapsulated PCM particles. The heat transfer device may also include a heat sink. The heat sink may have micro-encapsulated PCM particles attached to an outside surface of the heat sink or, alternatively, have micro-encapsulated PCM particles contained within the heat sink.
- According to another aspect of the invention, the heat transfer device may include a first heat pipe and a second heat pipe having an envelope, a working fluid and a wick formed from or comprising micro-encapsulated PCM particles. The first heat pipe may be a conventional heat pipe or may have a wick comprised of micro-encapsulated PCM particles. The heat transfer device may further include a heat sink.
- These and other features and advantages of the present invention will be more fully disclosed in, or rendered obvious by, the following detailed description of the preferred embodiments of the invention, which are to be considered together with the accompanying drawings wherein like numbers refer to like parts and further wherein:
-
FIG. 1 is a perspective view, partially in cross-section, of a heat pipe formed according to the present invention; -
FIG. 2 is a transverse cross-sectional view of a micro-encapsulated phase change material particle; -
FIG. 3 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention; -
FIG. 4 is a longitudinal cross-sectional view of a first heat pipe and secondary heat pipe formed according to one embodiment of the present invention; -
FIG. 5 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention; and -
FIG. 6 is a longitudinal cross-sectional view of a heat pipe and heat sink formed according to one embodiment of the present invention. - This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus viscosities, high surface tension and acceptable freezing or pour point. Preferably, the quantity of working
fluid 120 inheat transfer device 10 should be just enough to saturatewick 130. - In one embodiment,
wick 130 comprises a plurality of micro-encapsulated PCM particles 132 (FIGS. 2 and 3 -6).Micro-encapsulated PCM particles 132 have anouter shell wall 134 surrounding aphase change material 136.Shell 134 may be formed from materials that are suitable for heat transfer applications of the type known to those in the art, e.g., metals such as, silver, gold, copper, aluminum, titanium or their alloys. Polymeric materials useful in this invention include any material useful in the electronics industry for heat transfer applications, including, without limitation, thermoplastics (crystalline or non-crystalline, cross-linked or non-cross-linked), thermosetting resins, elastomers or blends or composites thereof. - Illustrative examples of useful thermoplastic polymers include, without limitation, polyolefins, such as polyethylene or polypropylene, copolymers (including terpolymers, etc.) of olefins such as ethylene and propylene, with each other and with other monomers such as vinyl esters, acids or esters of unsaturated organic acids or mixtures thereof, halogenated vinyl or vinylidene polymers such as polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride and copolymers of these monomers with each other or with other unsaturated monomers, polyesters, such as poly(hexamethylene adipate or sebacate), poly(ethylene terephthalate) and poly(tetramethylene terephthalate), polyamides such as Nylon-6, Nylon-6,6, Nylon-6,10, Versamids, polystyrene, polyacrylonitrile, thermoplastic silicone resins, thermoplastic polyethers, thermoplastic modified cellulose, polysulphones and the like.
- Examples of some useful elastomeric resins include, without limitation, rubbers, elastomeric gums and thermoplastic elastomers. The term “elastomeric gum”, refers to polymers which are noncrystalline and which exhibit after cross-linking rubbery or elastomeric characteristics. The term “thermoplastic elastomer” refers to materials which exhibit, in various temperature ranges, at least some elastomer properties. Such materials generally contain thermoplastic and elastomeric moieties. For purposes of this invention, the elastomer resin can be cross-linked or non cross-linked when used in the inventive compositions.
- Illustrative examples of some suitable elastomeric gums for use in this invention include, without limitation, polyisoprene (both natural and synthetic), ethylene-propylene random copolymers, poly(isobutylene), styrene-butadiene random copolymer rubbers, styrene-acrylonitrile-butadiene terpolymer rubbers with and without added copolymerized amounts of unsaturated carboxylic acids, polyacrylate rubbers, polyurethane gums, random copolymers of vinylidene fluoride and, for example, hexafluoropropylene, polychloroprene, chlorinated polyethylene, chlorosulphonated polyethylene, polyethers, plasticized poly(vinyl chloride), substantially non-crystalline random co- or ter-polymers of ethylene with vinyl esters or acids and esters of unsaturated acids, silicone gums and base polymers, for example, poly(dimethyl siloxane), poly(methylphenyl siloxane) and poly(dimethyl vinyl siloxanes).
- Some illustrative examples of thermoplastic elastomers suitable for use in the invention include, without limitation, graft and block copolymers, such as random copolymers of ethylene and propylene grafted with polyethylene or polypropylene side chains, and block copolymers of—olefins such as polyethylene or polypropylene with ethylene/propylene or ethylene/propylene/diene rubbers, polystyrene with polybutadiene, polystyrene with polyisoprene, polystyrene with ethylene-propylene rubber, poly(vinylcyclohexane) with ethylene-propylene rubber, poly(-methylstyrene) with polysiloxanes, polycarbonates with polysiloxanes, poly(tetramethylene terephthalate) with poly(tetramethylene oxide) and thermoplastic polyurethane rubbers.
- Examples of some thermosetting resins useful herein include, without limitation, epoxy resins, such as resins made from epichlorohydrin and bisphenol A or epichlorohydrin and aliphatic polyols, such as glycerol, and which can be conventionally cured using amine or amide curing agents. Other examples include phenolic resins obtained by condensing a phenol with an aldehyde, e.g., phenol-formaldehyde resin. Other additives can also be present in the composition, including for example fillers, pigments, antioxidants, fire retardants, cross-linking agents, adjuvants and the like.
-
Shell 134 will possess a melting point that is substantially higher than the melting point ofPCM 136, and higher than the expected temperature of the heat generating source. Thus, selection of the shell material will be dependent upon the application.Shell 134 should also be resilient so as to withstand cyclic expansions and contractions ofPCM 136. The thickness ofshell 134 may vary depending upon the material used. -
PCM 136 may comprise a variety of materials depending on the application and the operating temperature range. Suitable materials include, without limitation, organic waxes and paraffins, inorganic multi-phase metal alloys, eutectic salts, and other materials known in the art. Selection and quantity ofPCM 136 will depend upon the desired PCM melting point and how much heat will need to be absorbed.PCM 136 may also be a blend of different compounds to obtain the desired phase transition temperature or range. Also, different types of PCMs may be used in a single wick structure to increase the temperature range over which the heat pipe will be effective. - In addition to the liquid-solid PCMs listed, solid-solid PCMs, such as, polymer crystals, may also be used in connection with the present invention. Solid-solid PCMs undergo reversible solid-state crystal structure transitions at temperatures ranging from ambient up to about 100° C. Various of the polumer materials identified herein above are suitable for this application. Transition temperatures can be selected by forming solid solutions of different organic compounds. In one embodiment of the invention, a solid-solid PCM is employed without the use of
shell 134. Transition of these solid-solid PCMs can occur over a fairly limited temperature range. -
PCMs 136 can be encapsulated by any means known to those in the art. Such methods include coacervation, interfacial polymerization, air suspension and centrifugal extrusion. The size ofparticles 132 may be fairly uniform or, may be variable as desired. Preferably, the size ranges forparticles 132 vary from about one micron to about one mm. The size ofparticles 132 will dictate the size ofpores 138 between the particles (SeeFIG. 3 ). Pore size often determines the maximum capilliary pumping pressure of the wick and also effects wick permeability. Thus, a wick comprising particles having different sizes can be utilized depending upon the application of the heat pipe and its required orientation.PCM particles 132 are very often spherical in shape, but also may be cylindrically shaped, or may be elongated particles, cubes, monofilaments or fibers. - Referring to
FIG. 3 ,micro-encapsulated PCM particles 132 are bonded together to form awick structure 130. The method by whichmicro-encapsulated PCM particles 132 are bonded will depend on the composition ofshell 134. Whereshells 134 comprise a metal, the particles are preferably sintered together. Whereshells 134 comprise a polymer material, the particles are preferably adhered together by means of an adhesive or binder. Other methods known to those skilled in the art may also be employed. -
Wick 130 formed from a plurality ofmicro-encapsulated PCM particles 132 functions in much the same way as a conventional heat pipe wick structure, i.e., capillary pressure is employed to pump working fluid from a condenser portion of the heat pipe to an evaporator portion. However, use of a wick structure comprising micro-encapsulated PCM particles has the added advantage of using the wick structure as an additional heat absorber and repository. This feature greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak loads. Also, micro-encapsulated PCM particles may be incorporated into a conventional screen mesh type wick structure. In addition, PCM particles may also be bonded to a pre-sintered metal powder wick structure. -
Heat transfer device 10 also may include aheat sink 200 that is mounted to a portion ofenvelope 110 ofheat pipe 100 for further dissipating the absorbed thermal energy.Heat sink 200 may be in the form of folded of stampedfins 210, as shown inFIG. 3 , or may take any other shape or form known to those skilled in the art. -
Wick 130 may be formed separately fromenvelope 120, and then placed in theenvelope 110 where it lines aninner surface 112 ofenvelope 110 just as with a conventional wick. Alternatively,PCM particles 132 may be formed into a wick in situ.Envelope 110 is then evacuated and back-filled with a small quantity of workingfluid 120, preferably just enough to wet thewick 130.Heat pipe 100 is then hermetrically sealed.Fins 210 may be attached toheat pipe 100 to act as aheat sink 200 for further dissipation of heat. - Referring to
FIG. 4 , another embodiment ofheat transfer device 10 comprises afirst heat pipe 300, asecond heat pipe 400 and aheat sink 200.First heat pipe 300 may be a conventional heat pipe, i.e., containing a wick structure previously known and used in the art such as sintered powdered metal, screen meshes, grooved tube, or cable/fibers. Alternatively,first heat pipe 300 may be a heat pipe as described above, containing awick 330 comprisingmicro-encapsulated PCM particles 332. -
Second heat pipe 400 comprises anenvelope 410, a working fluid (not shown) and awick 430 comprisingmicro-encapsulated PCM particles 432, whereinwick structure 430 preferably essentially fills the entire volume ofheat pipe 400. Preferably,wick structure 430 is made from small and large encapsulated PCM particles 432 (as shown inFIG. 4 ) so as to have small and large pore sizes in between theindividual particles 432. The pores may range from 10−3 mm to 2 mm more or less. The large pores facilitate transport of the vapor, while the small pores provide capillary action for the heat pipe working fluid. Preferably, the working fluid will not entirely fill up the voids between themicro-encapsulated PCM particles 432. Aheat sink 200 may also be attached tofirst heat pipe 300, such asfins 210 as shown inFIG. 4 . - Referring to
FIG. 5 , another embodiment ofheat transfer device 10 comprises aheat pipe 100 and aheat sink 200.Heat pipe 100 may be a conventional heat pipe containing a traditional wick, or may have a wick structure comprisingmicro-encapsulated PCM particles 232 as described above, and as shown inFIG. 5 . Heat sink 200 (shown asfins 210 inFIG. 5 ) includesmicro-encapsulated PCM particles 232 attached to theoutside surface 212 ofheat sink 200.PCM particles 232 enhance the heat absorption capacity of the heat sink. In an alternative embodiment (FIG. 6 ) heat sink, 200 comprises a hollow material and containsmicro-encapsulated PCM particles 232 within it. - It is to be understood that the present invention is by no means limited only to the particular constructions herein disclosed and shown in the drawings, but also comprises any modifications or equivalents within the scope of the claims.
Claims (16)
1. A wick for use in a heat pipe, including a plurality of particles wherein said particles comprise micro-encapsulated phase change materials.
2. The wick of claim 1 wherein said particles of micro encapsulated phase change material are of varying sizes.
3. The wick of claim 1 wherein said particles are adhered to one another.
4. The wick of claim 1 wherein said particles are sintered.
5. A heat pipe comprising:
an envelope;
a wick including particles comprising micro-encapsulated phase change materials secured within said envelope; and
a working fluid disposed within said envelope.
6. A heat transfer device comprising:
a heat pipe having an envelope, a working fluid and a wick comprising micro-encapsulated phase change particles bonded together to form said wick; and
a heat sink mounted to said heat pipe.
7. The heat transfer device of claim 6 wherein said heat sink includes particles of micro-encapsulated phase change material attached to an outside surface of said heat sink.
8. The heat transfer device of claim 6 wherein said heat sink includes particles of micro-encapsulated phase change material contained within said heat sink.
9-13. (canceled)
14. A heat transfer device comprising:
a heat pipe comprising an envelope, a wick secured within the envelope, and a working fluid; and
a heat sink adjacent to said heat pipe, said heat sink including particles of micro-encapsulated phase change material.
15. The heat transfer device of claim 14 wherein said particles of micro-encapsulated phase change material are attached to an outside surface of said heat sink.
16. The heat transfer device of claim 14 wherein said heat sink is hollow and further wherein said particles of micro-encapsulated phase change material are contained within said heat sink.
17. A wick for use in a heat pipe formed from a plurality of micro-encapsulated phase change particles.
18. The wick of claim 17 wherein said particles of micro-encapsulated phase change particles are of varying sizes.
19. The wick of claim 17 wherein said particles are adhered to one another.
20. The wick of claim 17 wherein said particles are sintered.
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008118417A1 (en) * | 2007-03-27 | 2008-10-02 | Dk Innovations Inc. | Heat- removal device |
US20100294467A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
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US20110067843A1 (en) * | 2008-11-14 | 2011-03-24 | Vasiliev Jr Leonid | Heat exchange device made of polymeric material |
US20130327501A1 (en) * | 2012-06-08 | 2013-12-12 | Rung-An Chen | Phase change type heat dissipating device |
US20150060017A1 (en) * | 2013-09-05 | 2015-03-05 | National Central University | Cooling apparatus using solid-liquid phase change material |
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Families Citing this family (111)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003078269A (en) * | 2001-09-04 | 2003-03-14 | Hitachi Ltd | Electronic apparatus |
DE10157671A1 (en) * | 2001-11-24 | 2003-06-05 | Merck Patent Gmbh | Optimized use of PCM in cooling devices |
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CN100413061C (en) * | 2004-06-07 | 2008-08-20 | 鸿富锦精密工业(深圳)有限公司 | Thermal tube and producing method thereof |
US20050284614A1 (en) * | 2004-06-22 | 2005-12-29 | Machiroutu Sridhar V | Apparatus for reducing evaporator resistance in a heat pipe |
US7713849B2 (en) * | 2004-08-20 | 2010-05-11 | Illuminex Corporation | Metallic nanowire arrays and methods for making and using same |
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US8109324B2 (en) * | 2005-04-14 | 2012-02-07 | Illinois Institute Of Technology | Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling |
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US20070032610A1 (en) * | 2005-08-08 | 2007-02-08 | General Electric Company | Energy responsive composition and associated method |
US7705342B2 (en) * | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
US7548421B2 (en) * | 2005-10-25 | 2009-06-16 | Hewlett-Packard Development Company, L.P. | Impingement cooling of components in an electronic system |
US20070151709A1 (en) * | 2005-12-30 | 2007-07-05 | Touzov Igor V | Heat pipes utilizing load bearing wicks |
CN100529640C (en) * | 2006-04-14 | 2009-08-19 | 富准精密工业(深圳)有限公司 | Heat pipe |
US20070268668A1 (en) * | 2006-05-19 | 2007-11-22 | I-Ming Lin | Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit) |
FR2903222B1 (en) * | 2006-06-28 | 2008-12-26 | Eads Astrium Sas Soc Par Actio | PASSIVE THERMAL CONTROL ARRANGEMENT BASED ON DIPHASIC FLUID LOOP WITH CAPILLARY PUMPING WITH THERMAL CAPACITY. |
US7433190B2 (en) * | 2006-10-06 | 2008-10-07 | Honeywell International Inc. | Liquid cooled electronic chassis having a plurality of phase change material reservoirs |
US8073096B2 (en) * | 2007-05-14 | 2011-12-06 | Stc.Unm | Methods and apparatuses for removal and transport of thermal energy |
US9188086B2 (en) * | 2008-01-07 | 2015-11-17 | Mcalister Technologies, Llc | Coupled thermochemical reactors and engines, and associated systems and methods |
US9102857B2 (en) * | 2008-03-02 | 2015-08-11 | Lumenetix, Inc. | Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled |
US7810965B2 (en) | 2008-03-02 | 2010-10-12 | Lumenetix, Inc. | Heat removal system and method for light emitting diode lighting apparatus |
CN102149987A (en) * | 2008-07-10 | 2011-08-10 | 英飞尼亚有限公司 | Thermal energy storage device |
US8188595B2 (en) | 2008-08-13 | 2012-05-29 | Progressive Cooling Solutions, Inc. | Two-phase cooling for light-emitting devices |
TWM362513U (en) * | 2009-01-22 | 2009-08-01 | Yeh Chiang Technology Corp | Packaging structure for LED |
US7969075B2 (en) | 2009-02-10 | 2011-06-28 | Lumenetix, Inc. | Thermal storage system using encapsulated phase change materials in LED lamps |
US20110203776A1 (en) * | 2009-02-17 | 2011-08-25 | Mcalister Technologies, Llc | Thermal transfer device and associated systems and methods |
US8441361B2 (en) | 2010-02-13 | 2013-05-14 | Mcallister Technologies, Llc | Methods and apparatuses for detection of properties of fluid conveyance systems |
TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
US20100294475A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
CN101900503A (en) * | 2009-05-27 | 2010-12-01 | 富瑞精密组件(昆山)有限公司 | Heat pipe |
US8123389B2 (en) * | 2010-02-12 | 2012-02-28 | Lumenetix, Inc. | LED lamp assembly with thermal management system |
TWI415305B (en) * | 2010-05-25 | 2013-11-11 | Neobulb Technologies Inc | Led illumination device |
US8953314B1 (en) * | 2010-08-09 | 2015-02-10 | Georgia Tech Research Corporation | Passive heat sink for dynamic thermal management of hot spots |
TWI498074B (en) * | 2010-09-23 | 2015-08-21 | Foxconn Tech Co Ltd | Heat dissipation apparatus for portable consumer electronic device |
US20110083459A1 (en) * | 2010-12-15 | 2011-04-14 | Salyer Ival O | Heat exchanger with integral phase change material for heating and cooling applications |
US20110083827A1 (en) * | 2010-12-15 | 2011-04-14 | Salyer Ival O | Cooling system with integral thermal energy storage |
US20110081134A1 (en) * | 2010-12-15 | 2011-04-07 | Salyer Ival O | Water heating unit with integral thermal energy storage |
TW201239595A (en) * | 2011-03-29 | 2012-10-01 | Asia Vital Components Co Ltd | Centrifugal heat dissipation structure and motor having centrifugal heat dissipation structure |
US9071098B2 (en) * | 2011-03-29 | 2015-06-30 | Asia Vital Components Co., Ltd. | Centrifugal heat dissipation device and motor using same |
CN102723810A (en) * | 2011-03-29 | 2012-10-10 | 奇鋐科技股份有限公司 | Centrifugal type heat radiation structure and motor equipped with centrifugal type heat radiation structure |
GB201110569D0 (en) * | 2011-06-22 | 2011-08-03 | Wellstream Int Ltd | Method and apparatus for maintaining a minimum temperature in a fluid |
GB2493387A (en) * | 2011-08-04 | 2013-02-06 | Isis Innovation | Thermal buffer unit comprising a heat pipe having a thermal store contained therein |
US8734546B2 (en) | 2011-08-12 | 2014-05-27 | Mcalister Technologies, Llc | Geothermal energization of a non-combustion chemical reactor and associated systems and methods |
US8911703B2 (en) | 2011-08-12 | 2014-12-16 | Mcalister Technologies, Llc | Reducing and/or harvesting drag energy from transport vehicles, including for chemical reactors, and associated systems and methods |
WO2013025650A1 (en) | 2011-08-12 | 2013-02-21 | Mcalister Technologies, Llc | Mobile transport platforms for producing hydrogen and structural materials and associated systems and methods |
US9039327B2 (en) | 2011-08-12 | 2015-05-26 | Mcalister Technologies, Llc | Systems and methods for collecting and processing permafrost gases, and for cooling permafrost |
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US9522379B2 (en) | 2011-08-12 | 2016-12-20 | Mcalister Technologies, Llc | Reducing and/or harvesting drag energy from transport vehicles, including for chemical reactors, and associated systems and methods |
WO2013025655A2 (en) | 2011-08-12 | 2013-02-21 | Mcalister Technologies, Llc | Systems and methods for providing supplemental aqueous thermal energy |
US8694065B2 (en) * | 2011-09-23 | 2014-04-08 | General Electric Company | Cryogenic cooling system with wicking structure |
US9223138B2 (en) | 2011-12-23 | 2015-12-29 | Microsoft Technology Licensing, Llc | Pixel opacity for augmented reality |
US8934235B2 (en) * | 2012-01-23 | 2015-01-13 | Microsoft Corporation | Heat transfer device with phase change material |
US9606586B2 (en) | 2012-01-23 | 2017-03-28 | Microsoft Technology Licensing, Llc | Heat transfer device |
US9297996B2 (en) | 2012-02-15 | 2016-03-29 | Microsoft Technology Licensing, Llc | Laser illumination scanning |
US9779643B2 (en) | 2012-02-15 | 2017-10-03 | Microsoft Technology Licensing, Llc | Imaging structure emitter configurations |
US9726887B2 (en) | 2012-02-15 | 2017-08-08 | Microsoft Technology Licensing, Llc | Imaging structure color conversion |
US9599408B1 (en) * | 2012-03-03 | 2017-03-21 | Advanced Cooling Technologies, Inc. | Loop heat pipe evaporator including a second heat pipe |
US9578318B2 (en) | 2012-03-14 | 2017-02-21 | Microsoft Technology Licensing, Llc | Imaging structure emitter calibration |
US9205515B2 (en) * | 2012-03-22 | 2015-12-08 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Heat dissipation substrate and method for manufacturing the same |
US11068049B2 (en) | 2012-03-23 | 2021-07-20 | Microsoft Technology Licensing, Llc | Light guide display and field of view |
US10191515B2 (en) | 2012-03-28 | 2019-01-29 | Microsoft Technology Licensing, Llc | Mobile device light guide display |
US9558590B2 (en) | 2012-03-28 | 2017-01-31 | Microsoft Technology Licensing, Llc | Augmented reality light guide display |
US9717981B2 (en) | 2012-04-05 | 2017-08-01 | Microsoft Technology Licensing, Llc | Augmented reality and physical games |
US10502876B2 (en) | 2012-05-22 | 2019-12-10 | Microsoft Technology Licensing, Llc | Waveguide optics focus elements |
US8989535B2 (en) | 2012-06-04 | 2015-03-24 | Microsoft Technology Licensing, Llc | Multiple waveguide imaging structure |
US9311909B2 (en) | 2012-09-28 | 2016-04-12 | Microsoft Technology Licensing, Llc | Sensed sound level based fan speed adjustment |
US10192358B2 (en) | 2012-12-20 | 2019-01-29 | Microsoft Technology Licensing, Llc | Auto-stereoscopic augmented reality display |
WO2014160301A1 (en) | 2013-03-14 | 2014-10-02 | Mcalister Technologies, Llc | Method and apparatus for generating hydrogen from metal |
US20150257249A1 (en) * | 2014-03-08 | 2015-09-10 | Gerald Ho Kim | Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same |
US9304235B2 (en) | 2014-07-30 | 2016-04-05 | Microsoft Technology Licensing, Llc | Microfabrication |
US10254942B2 (en) | 2014-07-31 | 2019-04-09 | Microsoft Technology Licensing, Llc | Adaptive sizing and positioning of application windows |
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US10592080B2 (en) | 2014-07-31 | 2020-03-17 | Microsoft Technology Licensing, Llc | Assisted presentation of application windows |
JP5788069B1 (en) * | 2014-08-29 | 2015-09-30 | 古河電気工業株式会社 | Flat type heat pipe |
US10356945B2 (en) * | 2015-01-08 | 2019-07-16 | General Electric Company | System and method for thermal management using vapor chamber |
US9535253B2 (en) | 2015-02-09 | 2017-01-03 | Microsoft Technology Licensing, Llc | Display system |
US9827209B2 (en) | 2015-02-09 | 2017-11-28 | Microsoft Technology Licensing, Llc | Display system |
US9513480B2 (en) | 2015-02-09 | 2016-12-06 | Microsoft Technology Licensing, Llc | Waveguide |
US10018844B2 (en) | 2015-02-09 | 2018-07-10 | Microsoft Technology Licensing, Llc | Wearable image display system |
US9423360B1 (en) | 2015-02-09 | 2016-08-23 | Microsoft Technology Licensing, Llc | Optical components |
US9372347B1 (en) | 2015-02-09 | 2016-06-21 | Microsoft Technology Licensing, Llc | Display system |
US10317677B2 (en) | 2015-02-09 | 2019-06-11 | Microsoft Technology Licensing, Llc | Display system |
US9429692B1 (en) | 2015-02-09 | 2016-08-30 | Microsoft Technology Licensing, Llc | Optical components |
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US10837712B1 (en) | 2015-04-15 | 2020-11-17 | Advanced Cooling Technologies, Inc. | Multi-bore constant conductance heat pipe for high heat flux and thermal storage |
US9909448B2 (en) | 2015-04-15 | 2018-03-06 | General Electric Company | Gas turbine engine component with integrated heat pipe |
US10638639B1 (en) | 2015-08-07 | 2020-04-28 | Advanced Cooling Technologies, Inc. | Double sided heat exchanger cooling unit |
US10386127B2 (en) | 2015-09-09 | 2019-08-20 | General Electric Company | Thermal management system |
KR101810167B1 (en) * | 2015-11-11 | 2017-12-19 | 전남대학교산학협력단 | A device for three dimensional heat absorption |
US9897393B2 (en) * | 2016-05-27 | 2018-02-20 | Asia Vital Components Co., Ltd. | Heat dissipating module |
US10209009B2 (en) | 2016-06-21 | 2019-02-19 | General Electric Company | Heat exchanger including passageways |
JP6705365B2 (en) * | 2016-11-03 | 2020-06-03 | 株式会社デンソー | Method for manufacturing latent heat storage body |
US10782014B2 (en) | 2016-11-11 | 2020-09-22 | Habib Technologies LLC | Plasmonic energy conversion device for vapor generation |
US10451356B2 (en) * | 2016-12-08 | 2019-10-22 | Microsoft Technology Licensing, Llc | Lost wax cast vapor chamber device |
DE102017200524A1 (en) * | 2017-01-13 | 2018-07-19 | Siemens Aktiengesellschaft | Cooling device with a heat pipe and a latent heat storage, method for producing the same and electronic circuit |
US20190354148A1 (en) * | 2018-05-17 | 2019-11-21 | Microsoft Technology Licensing, Llc | Conducting heat through a hinge |
US11067343B2 (en) * | 2018-10-25 | 2021-07-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same |
US10948241B2 (en) | 2018-10-25 | 2021-03-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Vapor chamber heat spreaders having improved transient thermal response and methods of making the same |
US10575393B1 (en) * | 2018-11-13 | 2020-02-25 | International Business Machines Corporation | Heat-shielding microcapsules for protecting temperature sensitive components |
US11187469B2 (en) * | 2018-12-20 | 2021-11-30 | General Electric Company | Tunable wicking structures and a system for a wicking structure |
US10679923B1 (en) * | 2019-01-09 | 2020-06-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Encapsulated phase change porous layer |
US11260953B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11352120B2 (en) | 2019-11-15 | 2022-06-07 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11267551B2 (en) | 2019-11-15 | 2022-03-08 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
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Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3596713A (en) * | 1969-01-27 | 1971-08-03 | Astro Dynamics Inc | Liquid-solid heat transport system |
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3786861A (en) * | 1971-04-12 | 1974-01-22 | Battelle Memorial Institute | Heat pipes |
US3788388A (en) * | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
US4046190A (en) * | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4616699A (en) * | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
US4756958A (en) * | 1987-08-31 | 1988-07-12 | Triangle Research And Development Corporation | Fiber with reversible enhanced thermal storage properties and fabrics made therefrom |
US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4830097A (en) * | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
US4911232A (en) * | 1988-07-21 | 1990-03-27 | Triangle Research And Development Corporation | Method of using a PCM slurry to enhance heat transfer in liquids |
US5007478A (en) * | 1989-05-26 | 1991-04-16 | University Of Miami | Microencapsulated phase change material slurry heat sinks |
US5053446A (en) * | 1985-11-22 | 1991-10-01 | University Of Dayton | Polyolefin composites containing a phase change material |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US5224356A (en) * | 1991-09-30 | 1993-07-06 | Triangle Research & Development Corp. | Method of using thermal energy absorbing and conducting potting materials |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US5446318A (en) * | 1992-09-08 | 1995-08-29 | Hitachi, Ltd. | Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement |
US5456852A (en) * | 1992-02-28 | 1995-10-10 | Mitsubishi Paper Mills Limited | Microcapsule for heat-storing material |
US5555932A (en) * | 1993-04-02 | 1996-09-17 | Ford Motor Company | Heat shield for an automotive vehicle |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5662161A (en) * | 1995-08-10 | 1997-09-02 | The United States Of America As Represented By The Secretary Of The Navy | Breathing gas cooling and heating device |
US5767573A (en) * | 1995-10-26 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US5831831A (en) * | 1997-03-27 | 1998-11-03 | Ford Motor Company | Bonding material and phase change material system for heat burst dissipation |
US5883426A (en) * | 1996-04-18 | 1999-03-16 | Nec Corporation | Stack module |
US5986884A (en) * | 1998-07-13 | 1999-11-16 | Ford Motor Company | Method for cooling electronic components |
US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
US6139783A (en) * | 1999-02-12 | 2000-10-31 | Chip Coolers, Inc. | Method of molding a thermally conductive article |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6154364A (en) * | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6237223B1 (en) * | 1999-05-06 | 2001-05-29 | Chip Coolers, Inc. | Method of forming a phase change heat sink |
US6310775B1 (en) * | 1999-03-24 | 2001-10-30 | Mitsubishi Materials Corporation | Power module substrate |
US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
US20020033247A1 (en) * | 2000-06-08 | 2002-03-21 | Merck Patent Gmbh | Use of PCMs in heat sinks for electronic components |
US6381845B2 (en) * | 1998-10-21 | 2002-05-07 | Furakawa Electric Co., Ltd. | Method of manufacturing plate type heat pipe |
US6387482B1 (en) * | 1996-10-25 | 2002-05-14 | Vought Aircraft Industries, Inc. | Heat absorbing surface coating |
US6550530B1 (en) * | 2002-04-19 | 2003-04-22 | Thermal Corp. | Two phase vacuum pumped loop |
US20040035558A1 (en) * | 2002-06-14 | 2004-02-26 | Todd John J. | Heat dissipation tower for circuit devices |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766028B2 (en) | 1989-12-26 | 1995-07-19 | 安藤電気株式会社 | Cooling structure of test head for IC tester |
-
2003
- 2003-02-18 US US10/370,349 patent/US6889755B2/en not_active Expired - Fee Related
-
2004
- 2004-07-01 US US10/882,980 patent/US20050269063A1/en not_active Abandoned
Patent Citations (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3596713A (en) * | 1969-01-27 | 1971-08-03 | Astro Dynamics Inc | Liquid-solid heat transport system |
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3788388A (en) * | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
US3786861A (en) * | 1971-04-12 | 1974-01-22 | Battelle Memorial Institute | Heat pipes |
US4046190A (en) * | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4616699A (en) * | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
US5053446A (en) * | 1985-11-22 | 1991-10-01 | University Of Dayton | Polyolefin composites containing a phase change material |
US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4830097A (en) * | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
US4756958A (en) * | 1987-08-31 | 1988-07-12 | Triangle Research And Development Corporation | Fiber with reversible enhanced thermal storage properties and fabrics made therefrom |
US4911232A (en) * | 1988-07-21 | 1990-03-27 | Triangle Research And Development Corporation | Method of using a PCM slurry to enhance heat transfer in liquids |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US5007478A (en) * | 1989-05-26 | 1991-04-16 | University Of Miami | Microencapsulated phase change material slurry heat sinks |
US5224356A (en) * | 1991-09-30 | 1993-07-06 | Triangle Research & Development Corp. | Method of using thermal energy absorbing and conducting potting materials |
US5456852A (en) * | 1992-02-28 | 1995-10-10 | Mitsubishi Paper Mills Limited | Microcapsule for heat-storing material |
US5446318A (en) * | 1992-09-08 | 1995-08-29 | Hitachi, Ltd. | Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5555932A (en) * | 1993-04-02 | 1996-09-17 | Ford Motor Company | Heat shield for an automotive vehicle |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5662161A (en) * | 1995-08-10 | 1997-09-02 | The United States Of America As Represented By The Secretary Of The Navy | Breathing gas cooling and heating device |
US5767573A (en) * | 1995-10-26 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5947193A (en) * | 1996-01-29 | 1999-09-07 | Sandia Corporation | Heat pipe with embedded wick structure |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US5883426A (en) * | 1996-04-18 | 1999-03-16 | Nec Corporation | Stack module |
US6387482B1 (en) * | 1996-10-25 | 2002-05-14 | Vought Aircraft Industries, Inc. | Heat absorbing surface coating |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
US5831831A (en) * | 1997-03-27 | 1998-11-03 | Ford Motor Company | Bonding material and phase change material system for heat burst dissipation |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US5986884A (en) * | 1998-07-13 | 1999-11-16 | Ford Motor Company | Method for cooling electronic components |
US6381845B2 (en) * | 1998-10-21 | 2002-05-07 | Furakawa Electric Co., Ltd. | Method of manufacturing plate type heat pipe |
US6154364A (en) * | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
US6139783A (en) * | 1999-02-12 | 2000-10-31 | Chip Coolers, Inc. | Method of molding a thermally conductive article |
US6310775B1 (en) * | 1999-03-24 | 2001-10-30 | Mitsubishi Materials Corporation | Power module substrate |
US6237223B1 (en) * | 1999-05-06 | 2001-05-29 | Chip Coolers, Inc. | Method of forming a phase change heat sink |
US20020033247A1 (en) * | 2000-06-08 | 2002-03-21 | Merck Patent Gmbh | Use of PCMs in heat sinks for electronic components |
US6550530B1 (en) * | 2002-04-19 | 2003-04-22 | Thermal Corp. | Two phase vacuum pumped loop |
US20040035558A1 (en) * | 2002-06-14 | 2004-02-26 | Todd John J. | Heat dissipation tower for circuit devices |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008118417A1 (en) * | 2007-03-27 | 2008-10-02 | Dk Innovations Inc. | Heat- removal device |
US20110067843A1 (en) * | 2008-11-14 | 2011-03-24 | Vasiliev Jr Leonid | Heat exchange device made of polymeric material |
US20100294467A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
WO2011025487A1 (en) * | 2009-08-27 | 2011-03-03 | Hewlett-Packard Development Company, L.P. | Heat storage by phase-change material |
US9019704B2 (en) | 2009-08-27 | 2015-04-28 | Hewlett-Packard Development Company, L.P. | Heat storage by phase-change material |
US20130327501A1 (en) * | 2012-06-08 | 2013-12-12 | Rung-An Chen | Phase change type heat dissipating device |
US20150060017A1 (en) * | 2013-09-05 | 2015-03-05 | National Central University | Cooling apparatus using solid-liquid phase change material |
US20150204612A1 (en) * | 2014-01-21 | 2015-07-23 | Drexel University | Systems and Methods of Using Phase Change Material in Power Plants |
US9476648B2 (en) * | 2014-01-21 | 2016-10-25 | Drexel University | Systems and methods of using phase change material in power plants |
US10890383B2 (en) | 2014-01-21 | 2021-01-12 | Drexel University | Systems and methods of using phase change material in power plants |
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US6889755B2 (en) | 2005-05-10 |
US20040159422A1 (en) | 2004-08-19 |
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