US20050257916A1 - Heat conductive pipe - Google Patents
Heat conductive pipe Download PDFInfo
- Publication number
- US20050257916A1 US20050257916A1 US11/014,427 US1442704A US2005257916A1 US 20050257916 A1 US20050257916 A1 US 20050257916A1 US 1442704 A US1442704 A US 1442704A US 2005257916 A1 US2005257916 A1 US 2005257916A1
- Authority
- US
- United States
- Prior art keywords
- heat conductive
- membrane
- working fluid
- seat
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat conductive pipe, and particularly to a heat conductive pipe which can efficiently dissipate heat from an electronic component.
- CPUs central processing units
- PSUs power supply units
- Heat pipes have been suggested for cooling electronic components.
- a heat pipe comprises an evaporator to take in heat and a condenser to expel heat.
- Working fluid is contained in the heat pipe to transfer heat from the evaporator to the condenser.
- the heat entering the evaporator of the heat pipe boils the fluid and turns it into a vapor.
- the vapor expands in volume and travels to the condenser where it condenses to a liquid and gives up its heat.
- the liquid is then returned to the evaporator by gravity or a wick and starts the process again.
- a conventional heat pipe does not work until electronic components to be cooled reach a certain high enough temperature, in general, between 30° C. and 40° C., to evaporate the working fluid.
- the electronic components must operate at a temperature at least above 30° C.
- a solution to decrease the threshold temperature of the working fluid is to heighten vacuum inside of the heat pipe.
- this requires high rigidity materials for the heat pipe shell and increases manufacturing cost of the heat pipe, or else, the heat pipe is prone to be damaged and a leak may be formed to increase the vacuum pressure of the heat pipe. As a result, the heat pipe fails to work.
- a conventional heat pipe has a variety of other limitations, such as capillary pumping limit, nucleate boiling limit and entrainment limit, constraining the ability of the heat pipe to cool the electronic components.
- the heat pipe stops operating when each of the limitations is reached.
- an object of the present invention is to provide a heat conductive pipe which can efficiently conduct heat from a heat generating component.
- a heat conductive pipe comprises a heat conductive body, a quantity of working fluid contained in the body, and a chamber.
- the body comprises a first end and a second end.
- the chamber is located at one end of the body.
- the volume of the chamber is changeable under control, wherein the working fluid flows from the first end to the second end when the volume is increasing and the working fluid flows from the second end to the first end when the volume is decreasing.
- FIG. 1 is a partially cross section view of a heat conductive pipe in accordance with a preferred embodiment of the present invention, along an axis of the heat conductive pipe;
- FIG. 2 is similar to FIG. 1 , but showing next state disposed inside of the heat conductive pipe;
- FIG. 3 is a partially cross section view of a heat conductive pipe in accordance with another embodiment of the present invention.
- FIGS. 1-2 show a heat conductive pipe 1 in accordance with a preferred embodiment of the present invention.
- the heat conductive pipe 1 comprises an electromagnetism switch 2 , a heat conductive body 3 , and a quantity of working fluid 4 contained in the body 3 .
- the heat conductive body 3 comprises an evaporator 30 at one end thereof and a condenser 40 at the opposite end thereof.
- the body 3 further comprises a pump 60 (shown as in the broken line) located at one end, near the evaporator 30 or the condenser 40 of the body 3 .
- the pump 60 will be described as being at the end near the evaporator 30 .
- the pump 60 comprises a seat member 600 by which the pump 60 is fixed onto the body 3 , and a first membrane 602 .
- the first membrane 602 is secured to a side of the seat member 600 , opposing inside of the body 3 .
- the seat member 600 comprises an upper seat 604 , a lower seat 606 , and a second membrane 608 sandwiched between the upper seat 604 and the lower seat 606 .
- the first and second membranes 602 , 608 corporately define a chamber 610 therebetween.
- a plurality of inlets 612 and outlets 614 extend through the upper seat 604 , the lower seat 606 and the second membrane 608 , to communicate the chamber 610 with an inside of the body 3 .
- a plurality of baffles 616 extending from the lower seat member 606 are in front of each of the inlets 612 and the outlets 614 respectively. This precaution can protect the inlets 612 or the outlets 614 from being damaged by the impingement of the working fluid 4 .
- the upper seat 604 can be omitted and the first membrane 602 can be directly attached to the second membrane 608 or the lower seat 606 to secure the first membrane 602 on the seat member 600 .
- the first membrane 602 is secured on the upper seat 604 with its outer periphery, shown as AB, CD.
- the first membrane 602 is made of magnetism material, such as FeNi, and is controlled by the switch 2 to move back and forth.
- other actuator can be used instead of the switch 2 to drive the first membrane 602 to move to change the volume of the chamber 610 .
- the volume of the chamber 610 changes due to the movement of the first membrane 602 .
- the working fluid 4 is sucked into the chamber 610 when the volume of the chamber 610 is inflated, and is impelled from the chamber 610 when the volume of the chamber is deflated. Simultaneously, the movement of the working fluid 4 between the evaporator 30 and the condenser 40 is accelerated.
- the switch 2 In operation of the heat conductive pipe 1 , the switch 2 generates a first magnetic field to magnetize the first membrane 602 towards a direction to increase the volume of the chamber 610 .
- the chamber 610 is inflated so that the pressure in the chamber 610 becomes lower than that inside the body 3 .
- the inlets 612 are opened, while the outlets 614 are closed.
- the working fluid 4 is pumped into the chamber 610 through the inlets 612 , until an average pressure occurs inside the chamber 610 and the body 3 . As a result, the working fluid 4 cooled in the condenser 40 is forced to flow to the evaporator 30 .
- the switch 2 generates a second magnetic field to magnetize the first membrane 602 towards a direction to decrease the volume of the chamber 610 .
- the chamber 610 is deflated so that the pressure in the chamber 610 becomes higher than that inside the body 3 .
- the outlets 614 are opened, while the inlets 612 are closed.
- the working fluid 4 is impelled from the chamber 610 through the outlets 614 , until an average pressure occurs inside the chamber 610 and the body 3 .
- the working fluid 4 pumped into the chamber 610 is forced to flow to the condenser 40 .
- the pump 60 is provided to drive the working fluid 4 to circulate between the evaporator 30 and the condenser 40 .
- the working fluid 4 heated in the evaporator 30 evaporated or not, is accelerated to flow to the condenser 40 to dissipate the heat.
- the working fluid 4 cooled in the condenser 40 is accelerated to flow to the evaporator 30 to cool down the evaporator 30 . Therefore, the present heat conductive pipe 1 can efficiently cool down an electronic components (not shown) at a desired low temperature even if the electronic components don't reach the temperature to vaporize the working fluid 4 .
- the heat conductive pipe 1 can cool the electronic components more efficiently.
- the present invention can eliminate the heat pipe limits.
- FIG. 3 illustrates an alternative heat conductive pipe 1 ′ of the present invention.
- the structure of the heat conductive pipe 1 ′ is substantially similar to that of the heat conductive pipe 1 in the preferred embodiment.
- the primary difference of the heat conductive pipe 1 ′ from the heat conductive pipe 1 is that the second membrane 608 ′ cooperating with the outlet 614 ′ is disposed beneath the seat member 600 ′.
Abstract
A heat conductive pipe (1) includes a heat conductive body (3), a quantity of working fluid (4) contained in the body, and a chamber (610). The body defines a first end and a second end. The chamber is located at one end of the body. The volume of the chamber is changeable under control, wherein the working fluid flows from the first end to the second end when the volume is increasing and the working fluid flows from the second end to the first end when the volume is decreasing.
Description
- The present invention relates to a heat conductive pipe, and particularly to a heat conductive pipe which can efficiently dissipate heat from an electronic component.
- As computer technology continues to advance, electronic components such as central processing units (CPUs), power supply units (PSUs) of computers are made to provide faster operational speeds and greater functional capabilities. When a CPU/PSU operates at a high speed in a computer enclosure, its temperature increases greatly. It is desirable to dissipate the heat generated by the CPU/PSU quickly.
- Heat pipes have been suggested for cooling electronic components. Conventionally, a heat pipe comprises an evaporator to take in heat and a condenser to expel heat. Working fluid is contained in the heat pipe to transfer heat from the evaporator to the condenser. The heat entering the evaporator of the heat pipe boils the fluid and turns it into a vapor. The vapor expands in volume and travels to the condenser where it condenses to a liquid and gives up its heat. The liquid is then returned to the evaporator by gravity or a wick and starts the process again.
- A conventional heat pipe does not work until electronic components to be cooled reach a certain high enough temperature, in general, between 30° C. and 40° C., to evaporate the working fluid. Thus, the electronic components must operate at a temperature at least above 30° C. A solution to decrease the threshold temperature of the working fluid is to heighten vacuum inside of the heat pipe. However, this requires high rigidity materials for the heat pipe shell and increases manufacturing cost of the heat pipe, or else, the heat pipe is prone to be damaged and a leak may be formed to increase the vacuum pressure of the heat pipe. As a result, the heat pipe fails to work.
- A conventional heat pipe has a variety of other limitations, such as capillary pumping limit, nucleate boiling limit and entrainment limit, constraining the ability of the heat pipe to cool the electronic components. The heat pipe stops operating when each of the limitations is reached.
- Thus, an improved heat conductive pipe which can efficiently conduct heat from a heat generating component is desired.
- Accordingly, an object of the present invention is to provide a heat conductive pipe which can efficiently conduct heat from a heat generating component.
- To achieve the above-mentioned object, a heat conductive pipe comprises a heat conductive body, a quantity of working fluid contained in the body, and a chamber. The body comprises a first end and a second end. The chamber is located at one end of the body. The volume of the chamber is changeable under control, wherein the working fluid flows from the first end to the second end when the volume is increasing and the working fluid flows from the second end to the first end when the volume is decreasing.
- Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of two preferred embodiments of the present invention with attached drawings, in which:
-
FIG. 1 is a partially cross section view of a heat conductive pipe in accordance with a preferred embodiment of the present invention, along an axis of the heat conductive pipe; -
FIG. 2 is similar toFIG. 1 , but showing next state disposed inside of the heat conductive pipe; and -
FIG. 3 is a partially cross section view of a heat conductive pipe in accordance with another embodiment of the present invention. -
FIGS. 1-2 show a heatconductive pipe 1 in accordance with a preferred embodiment of the present invention. The heatconductive pipe 1 comprises anelectromagnetism switch 2, a heatconductive body 3, and a quantity of workingfluid 4 contained in thebody 3. - The heat
conductive body 3 comprises anevaporator 30 at one end thereof and acondenser 40 at the opposite end thereof. Thebody 3 further comprises a pump 60 (shown as in the broken line) located at one end, near theevaporator 30 or thecondenser 40 of thebody 3. For convenient description, thepump 60 will be described as being at the end near theevaporator 30. Thepump 60 comprises aseat member 600 by which thepump 60 is fixed onto thebody 3, and afirst membrane 602. Thefirst membrane 602 is secured to a side of theseat member 600, opposing inside of thebody 3. - The
seat member 600 comprises anupper seat 604, alower seat 606, and asecond membrane 608 sandwiched between theupper seat 604 and thelower seat 606. The first andsecond membranes chamber 610 therebetween. A plurality ofinlets 612 andoutlets 614 extend through theupper seat 604, thelower seat 606 and thesecond membrane 608, to communicate thechamber 610 with an inside of thebody 3. Furthermore, a plurality ofbaffles 616 extending from thelower seat member 606 are in front of each of theinlets 612 and theoutlets 614 respectively. This precaution can protect theinlets 612 or theoutlets 614 from being damaged by the impingement of the workingfluid 4. Alternatively, theupper seat 604 can be omitted and thefirst membrane 602 can be directly attached to thesecond membrane 608 or thelower seat 606 to secure thefirst membrane 602 on theseat member 600. - The
first membrane 602 is secured on theupper seat 604 with its outer periphery, shown as AB, CD. Thefirst membrane 602 is made of magnetism material, such as FeNi, and is controlled by theswitch 2 to move back and forth. Alternatively, other actuator can be used instead of theswitch 2 to drive thefirst membrane 602 to move to change the volume of thechamber 610. The volume of thechamber 610 changes due to the movement of thefirst membrane 602. The workingfluid 4 is sucked into thechamber 610 when the volume of thechamber 610 is inflated, and is impelled from thechamber 610 when the volume of the chamber is deflated. Simultaneously, the movement of the workingfluid 4 between theevaporator 30 and thecondenser 40 is accelerated. - In operation of the heat
conductive pipe 1, theswitch 2 generates a first magnetic field to magnetize thefirst membrane 602 towards a direction to increase the volume of thechamber 610. Thechamber 610 is inflated so that the pressure in thechamber 610 becomes lower than that inside thebody 3. Theinlets 612 are opened, while theoutlets 614 are closed. The workingfluid 4 is pumped into thechamber 610 through theinlets 612, until an average pressure occurs inside thechamber 610 and thebody 3. As a result, the workingfluid 4 cooled in thecondenser 40 is forced to flow to theevaporator 30. - Next state, the
switch 2 generates a second magnetic field to magnetize thefirst membrane 602 towards a direction to decrease the volume of thechamber 610. Thechamber 610 is deflated so that the pressure in thechamber 610 becomes higher than that inside thebody 3. Theoutlets 614 are opened, while theinlets 612 are closed. The workingfluid 4 is impelled from thechamber 610 through theoutlets 614, until an average pressure occurs inside thechamber 610 and thebody 3. As a result, the workingfluid 4 pumped into thechamber 610 is forced to flow to thecondenser 40. - In the present invention, the
pump 60 is provided to drive the workingfluid 4 to circulate between theevaporator 30 and thecondenser 40. The workingfluid 4 heated in theevaporator 30, evaporated or not, is accelerated to flow to thecondenser 40 to dissipate the heat. The workingfluid 4 cooled in thecondenser 40 is accelerated to flow to theevaporator 30 to cool down theevaporator 30. Therefore, the present heatconductive pipe 1 can efficiently cool down an electronic components (not shown) at a desired low temperature even if the electronic components don't reach the temperature to vaporize the workingfluid 4. The heatconductive pipe 1 can cool the electronic components more efficiently. Furthermore, the present invention can eliminate the heat pipe limits. -
FIG. 3 illustrates an alternative heatconductive pipe 1′ of the present invention. The structure of the heatconductive pipe 1′ is substantially similar to that of the heatconductive pipe 1 in the preferred embodiment. The primary difference of the heatconductive pipe 1′ from the heatconductive pipe 1 is that thesecond membrane 608′ cooperating with theoutlet 614′ is disposed beneath theseat member 600′. - It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (18)
1. A heat conductive pipe comprising:
a heat conductive body comprising a first end and a second end;
a quantity of working fluid contained in the body; and
a chamber located at one end of the body, the volume of the chamber being changeable under control;
wherein the working fluid flows from the first end to the second end when the volume is increasing and the working fluid flows from the second end to the first end when the volume is decreasing.
2. The heat conductive pipe as claimed in claim 1 , wherein the chamber further comprises at least one inlet and at least one outlet, wherein the chamber communicates with an inside of the body through the inlet and the outlet.
3. The heat conductive pipe as claimed in claim 1 , wherein the chamber is defined by a seat member secured on the body, and a first membrane secured on the seat member.
4. The heat conductive pipe as claimed in claim 3 , wherein the first membrane can move back and forth under control to cause the volume of the chamber to change such that the working fluid is accelerated to flow back and forth between the first end and second end of the body.
5. The heat conductive pipe as claimed in claim 4 , wherein the first membrane is controlled by an actuator.
6. The heat conductive pipe as claimed in claim 3 , wherein the first membrane is made from NiFe.
7. The heat conductive pipe as claimed in claim 3 , wherein the seat member comprises an upper seat, a lower seat secured on the body, and a second membrane sandwiched between the upper seat and the lower seat.
8. The heat conductive pipe as claimed in claim 7 , wherein the chamber further comprises at least one inlet and at least one outlet, the inlet and the outlet defined on the second membrane and the seat member, wherein the chamber communicates with an inside of the body through the inlet and the outlet.
9. The heat conductive pipe as claimed in claim 8 , wherein the seat membrane further comprises:
at least one first baffle located before the inlet; and
at least one second baffle located before the outlet,
wherein the first baffle and the second baffle extend from the seat member protecting the inlet and the outlet from being damaged by the impingement of the working fluid.
10. The heat conductive pipe as claimed in claim 3 , wherein the seat member comprises an upper seat, a lower seat secured on the body, and a second membrane attached on the seat, the second membrane comprising:
a first part, sandwiched between the upper seat and the lower seat; and
a second part, extending from a side of the lower seat opposing inside of the body.
11. A heat conductive pipe comprising:
a heat conductive body comprising a first end and a second end;
a quantity of working fluid contained in the body; and
a pump located within the body, the pump comprising:
at least one inlet; and
at least one outlet;
wherein the pump is capable of sucking the working fluid thereinto via the inlet to accelerate the working fluid to flow from the first end to the second end, and of discharging the working fluid therein via the outlet to accelerate the working fluid to flow back.
12. The heat conductive pipe as claimed in claim 11 , wherein the pump further comprises:
a seat member, by which the pump is secured on the body; and
a first membrane attached on the seat membrane, wherein the seat member and the first membrane forms a chamber receiving the working fluid, and the volume of the chamber is changeable under control to provide a force to flow the working fluid.
13. The heat conductive pipe as claimed in claim 12 , wherein the seat member comprises:
an upper seat;
a lower seat attached on the body; and
a second membrane sandwiched between the upper seat and the lower seat,
wherein the inlets and the outlets are defined by the upper seat, the lower seat and the second membrane.
14. A heat conductive pipe comprising:
a heat conductive body comprising a first end and a second end;
a quantity of working fluid contained in the body; and
means for accelerating the working fluid to flow back and forth between the first end and second end of the body.
15. The heat conductive pipe as claimed in claim 14 , wherein the means comprises a pump located in the body, the pump comprising:
a chamber located at one end of the body, the volume of the chamber being changeable under control;
at least one inlet; and
at least one outlet, wherein the pump is capable of driving the working fluid to circuit between the first end and the second end in a manner that the working fluid is pumped into the chamber through the inlet when the volume is inflated, and then impelled out through the outlet to flow back when the volume is deflated.
16. The heat conductive pipe as claimed in claim 14 , wherein the chamber is defined by a seat member and a first membrane attached on the seat membrane, wherein the first membrane can move back and forth under control to change the volume of the chamber.
17. The heat conductive pipe as claimed in claim 16 , wherein the first membrane is made of NiFe, and is controlled to move by an actuator.
18. The heat conductive pipe as claimed in claim 17 , wherein the actuator is an electromagnetism switch.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100273645A CN100383960C (en) | 2004-05-18 | 2004-05-18 | Heat pipe |
CN200410027364.5 | 2004-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050257916A1 true US20050257916A1 (en) | 2005-11-24 |
Family
ID=35374073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/014,427 Abandoned US20050257916A1 (en) | 2004-05-18 | 2004-12-17 | Heat conductive pipe |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050257916A1 (en) |
CN (1) | CN100383960C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103427556A (en) * | 2013-09-02 | 2013-12-04 | 南京磁谷科技有限公司 | High-power high-speed electric machine and high-power high-speed draught fan |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104538372B (en) * | 2014-12-29 | 2018-05-22 | 华进半导体封装先导技术研发中心有限公司 | Heat-radiation type package structure and preparation method thereof, heat radiating type package substrate |
CN107462095A (en) * | 2017-08-31 | 2017-12-12 | 南昌大学 | A kind of thermal siphon of variable heat conduction |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4120172A (en) * | 1977-05-05 | 1978-10-17 | The United States Of America As Represented By The United States Department Of Energy | Heat transport system |
US4463798A (en) * | 1981-01-07 | 1984-08-07 | The Boeing Company | Electrostatically pumped heat pipe and method |
US4590993A (en) * | 1984-10-23 | 1986-05-27 | University Of Florida | Heat transfer device for the transport of large conduction flux without net mass transfer |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4799537A (en) * | 1987-10-13 | 1989-01-24 | Thermacore, Inc. | Self regulating heat pipe |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US5238056A (en) * | 1990-03-30 | 1993-08-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat exchanger with oscillating flow |
US5554014A (en) * | 1993-08-25 | 1996-09-10 | Knf Neuberger Gmbh | Diaphragm pump with at least two diaphragms |
US5599174A (en) * | 1994-05-18 | 1997-02-04 | Huntleigh Technology Plc. | Diaphragm pump with magnetic actuator |
US6033191A (en) * | 1997-05-16 | 2000-03-07 | Institut Fur Mikrotechnik Mainz Gmbh | Micromembrane pump |
US20020064292A1 (en) * | 2000-09-29 | 2002-05-30 | Pirmin Rombach | Micromachined magnetically balanced membrane actuator |
US20020075645A1 (en) * | 2000-12-20 | 2002-06-20 | Makoto Kitano | Liquid cooling system and personal computer using thereof |
US6413435B1 (en) * | 2000-09-22 | 2002-07-02 | Thermaco, Inc. | Separator unit capable of less-dense solids and/or buoyant solids removal |
US20030180164A1 (en) * | 2002-03-13 | 2003-09-25 | Teragenics, Inc. | Electromagnetic pump |
US6948918B2 (en) * | 2002-09-27 | 2005-09-27 | Novo Nordisk A/S | Membrane pump with stretchable pump membrane |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5005639A (en) * | 1988-03-24 | 1991-04-09 | The United States Of America As Represented By The Secretary Of The Air Force | Ferrofluid piston pump for use with heat pipes or the like |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
CN100428451C (en) * | 2001-02-21 | 2008-10-22 | 台达电子工业股份有限公司 | Heat radiator with magnetized heat-conducting liquid |
-
2004
- 2004-05-18 CN CNB2004100273645A patent/CN100383960C/en not_active Expired - Fee Related
- 2004-12-17 US US11/014,427 patent/US20050257916A1/en not_active Abandoned
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4120172A (en) * | 1977-05-05 | 1978-10-17 | The United States Of America As Represented By The United States Department Of Energy | Heat transport system |
US4463798A (en) * | 1981-01-07 | 1984-08-07 | The Boeing Company | Electrostatically pumped heat pipe and method |
US4590993A (en) * | 1984-10-23 | 1986-05-27 | University Of Florida | Heat transfer device for the transport of large conduction flux without net mass transfer |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US4799537A (en) * | 1987-10-13 | 1989-01-24 | Thermacore, Inc. | Self regulating heat pipe |
US5238056A (en) * | 1990-03-30 | 1993-08-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat exchanger with oscillating flow |
US5554014A (en) * | 1993-08-25 | 1996-09-10 | Knf Neuberger Gmbh | Diaphragm pump with at least two diaphragms |
US5599174A (en) * | 1994-05-18 | 1997-02-04 | Huntleigh Technology Plc. | Diaphragm pump with magnetic actuator |
US6033191A (en) * | 1997-05-16 | 2000-03-07 | Institut Fur Mikrotechnik Mainz Gmbh | Micromembrane pump |
US6413435B1 (en) * | 2000-09-22 | 2002-07-02 | Thermaco, Inc. | Separator unit capable of less-dense solids and/or buoyant solids removal |
US20020064292A1 (en) * | 2000-09-29 | 2002-05-30 | Pirmin Rombach | Micromachined magnetically balanced membrane actuator |
US20020075645A1 (en) * | 2000-12-20 | 2002-06-20 | Makoto Kitano | Liquid cooling system and personal computer using thereof |
US20030180164A1 (en) * | 2002-03-13 | 2003-09-25 | Teragenics, Inc. | Electromagnetic pump |
US6948918B2 (en) * | 2002-09-27 | 2005-09-27 | Novo Nordisk A/S | Membrane pump with stretchable pump membrane |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103427556A (en) * | 2013-09-02 | 2013-12-04 | 南京磁谷科技有限公司 | High-power high-speed electric machine and high-power high-speed draught fan |
Also Published As
Publication number | Publication date |
---|---|
CN100383960C (en) | 2008-04-23 |
CN1700455A (en) | 2005-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7552759B2 (en) | Loop-type heat exchange device | |
US7055341B2 (en) | High efficiency cooling system and heat absorbing unit | |
US7475718B2 (en) | Orientation insensitive multi chamber thermosiphon | |
US20070006994A1 (en) | Loop-type heat exchange device | |
JP4381998B2 (en) | Liquid cooling system | |
US20030205364A1 (en) | Method and apparatus for dissipating heat from an electronic device | |
US20060272798A1 (en) | Loop-type heat exchange device | |
CN101645430B (en) | Chip cooling device | |
JP2006229142A (en) | Cooling device and electronic apparatus comprising the same | |
JP2001196778A (en) | Cooling device by cpl | |
US20110167856A1 (en) | Apparatus for cooling computer body by introducing cooling air therein | |
US20070267182A1 (en) | Orientation insensitive compact thermosiphon with a remote auxiliary condenser | |
US20050257916A1 (en) | Heat conductive pipe | |
JP2004349551A (en) | Boiling cooling system | |
KR20080104874A (en) | Cooling unit for cooling heating element, cooling apparatus for heating element and electronic device having the same | |
JP2007103470A (en) | Cooling device, electronic apparatus having the same, and pump | |
US11953274B2 (en) | Fluid heat exchanger with pump | |
JP2019110199A (en) | Electronic component cooling apparatus | |
US20070144199A1 (en) | Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure | |
US11209215B2 (en) | Enhanced cooling of an electronic device using micropumps in thermosiphons | |
JP2011025163A (en) | Condensing apparatus for microgravity environment | |
JP2005019907A (en) | Cooler | |
CN114829753A (en) | Fluid phase change thermal management apparatus and method | |
US6364003B1 (en) | Device and method for absorbing and radiating heat in very small space by alternately pushing two fluids | |
TWI333050B (en) | Heat pipe and heat dissipation module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEU, CHARLES;CHEN, GA-LANE;YU, TAI-CHERNING;REEL/FRAME:016102/0759 Effective date: 20041210 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |