US20050241809A1 - Pump, cooling system, and electronic apparatus - Google Patents
Pump, cooling system, and electronic apparatus Download PDFInfo
- Publication number
- US20050241809A1 US20050241809A1 US11/104,805 US10480505A US2005241809A1 US 20050241809 A1 US20050241809 A1 US 20050241809A1 US 10480505 A US10480505 A US 10480505A US 2005241809 A1 US2005241809 A1 US 2005241809A1
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- US
- United States
- Prior art keywords
- pump
- hydrophilic surface
- liquid coolant
- pump chamber
- metal case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/02—Selection of particular materials
- F04D29/026—Selection of particular materials especially adapted for liquid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/426—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2300/00—Materials; Properties thereof
- F05D2300/20—Oxide or non-oxide ceramics
- F05D2300/21—Oxide ceramics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2300/00—Materials; Properties thereof
- F05D2300/20—Oxide or non-oxide ceramics
- F05D2300/21—Oxide ceramics
- F05D2300/211—Silica
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2300/00—Materials; Properties thereof
- F05D2300/50—Intrinsic material properties or characteristics
- F05D2300/51—Hydrophilic, i.e. being or having wettable properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present invention relates to a pump, a cooling system, and electronic apparatus, and in particular, to a pump used in a liquid cooling system for cooling a heat generating unit, the cooling system, and electronic apparatus including the same.
- a heat sink is thermally connected to a heat generating unit such as a CPU and the heat sink is air-cooled.
- a heat generating unit such as a CPU
- the heat sink is air-cooled.
- some recent semiconductor devices cannot be cooled by such a method.
- the liquid cooling system can achieve higher cooling efficiency because a liquid having a specific heat higher than that of air is used as a coolant.
- Japanese Patent Nos. 3,431,024 and 3,452,059 disclose cooling systems including a closed circulation path for circulating a coolant, a radiator that dissipates the heat from the coolant, and a contact heat exchange pump.
- the pump is used for pressuring the coolant in order that the coolant circulates in the closed circulation path and is thermally brought into contact with a heating semiconductor.
- the heating semiconductor is cooled by heat exchange of the coolant.
- Jpn Pat. Publication No. 2003-172286 discloses a technology to reduce the thickness of the contact heat exchange pump.
- Jpn Pat. Publication No. 2003-68317 discloses a technology relating to a surface treatment of a cooling flow path for cooling a separator of a fuel cell. According to this technology, the surface of the cooling flow path is roughened so as to increase the heat transfer area. As a result, the thermal conductivity is increased.
- the above patent document also describes the application of a hydrophilic coating material, the hydrophilic coating material is applied in order to prevent the freezing of the coolant. Therefore, the application of the hydrophilic coating material does not directly affect the improvement in the cooling efficiency.
- the increase in the flow rate of the coolant to increase the flow volume significantly improves the cooling efficiency.
- the pump has an inner surface formed by, for example, pressing, injection molding, or die casting, a satisfactory heat transfer performance from a pump housing, which is a heat receiver, to a coolant is not necessarily achieved.
- the rough face has the maximum arithmetic mean roughness (Ra) of 3.5 ⁇ m.
- the present invention relates to the cooling of a heating semiconductor such as a CPU. A sufficient cooling performance cannot be expected with the above-cited technology.
- FIG. 1 is a first view showing the appearance of electronic apparatus according to an embodiment of the present invention
- FIG. 2 is a second view showing the appearance of the electronic apparatus according to the embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing an example of a mounting state of a cooling pump according to the present invention
- FIG. 4 is a view showing the structure of a cooling system provided in electronic apparatus according to an embodiment of the present invention.
- FIG. 5 is a view showing the structure of a radiator of the cooling system
- FIG. 6 is a first view showing the structure of a cooling pump according to an embodiment of the present invention.
- FIG. 7 is a second view showing the structure of the cooling pump according to the embodiment of the present invention.
- FIG. 8 is a cross-sectional view showing the structure of the cooling pump according to the present invention.
- FIG. 9A , FIG. 9B , and the graph disposed thereunder show an advantage of a surface-treated portion provided on the cooling pump according to the present invention.
- FIGS. 1 and 2 are views showing the appearance of a personal computer 1 that is an embodiment of electronic apparatus according to the present invention.
- the personal computer 1 includes a main unit 2 and a panel unit 3 .
- the main unit 2 of the personal computer 1 includes a main unit casing 4 having a thin box-shape.
- the main unit casing 4 includes a bottom wall 4 a , a top wall 4 b , a front wall 4 c , side walls 4 d disposed at the right and the left, and a back wall 4 e.
- a plurality of outlets 6 for releasing cooling air is provided at the back wall 4 e.
- the top wall 4 b of the main unit casing 4 holds a keyboard 5 .
- the panel unit 3 includes a panel unit casing 8 and a display unit 9 .
- the display unit 9 is held with the panel unit casing 8 and includes a display panel 9 a .
- the display panel 9 a is exposed from an opening 10 disposed at the front face of the panel unit casing 8 .
- the panel unit casing 8 is supported so as to be opened or closed freely with a hinge provided at the back end of the main unit casing 4 .
- FIG. 1 shows the appearance when the panel unit 3 is opened
- FIG. 2 shows the appearance when the panel unit 3 is closed.
- FIG. 3 is a cross-sectional view of a printed circuit board 12 provided in the main unit casing 4 , a semiconductor device such as a CPU 13 that is a heat generating unit mounted on the printed circuit board 12 , and a cooling pump 17 that is thermally connected to the CPU 13 .
- a semiconductor device such as a CPU 13 that is a heat generating unit mounted on the printed circuit board 12
- a cooling pump 17 that is thermally connected to the CPU 13 .
- the printed circuit board 12 is disposed, for example, in the direction parallel to the bottom wall 4 a of the main unit casing 4 .
- the CPU 13 is mounted on a surface, for example, the top surface, of the printed circuit board 12 .
- the CPU 13 includes a base substrate 14 and an IC chip 15 provided at the center of the top surface of the base substrate 14 . In order to maintain the operation of the CPU 13 , it is essential to cool the IC chip 15 efficiently.
- the outer surface of a bottom wall 25 of the cooling pump 17 forms a heat-receiving face 26 .
- the heat-receiving face 26 is thermally connected to the surface of the IC chip 15 with, for example, heat-transfer grease or a heat-transfer sheet therebetween.
- FIG. 4 shows an example of the structure of a cooling system 16 provided in the main unit 2 of the personal computer 1 .
- the cooling system 16 includes the cooling pump 17 , a radiator 18 , a circulation path 19 , and an electric fan 20 .
- the cooling pump 17 is disposed so as to cover the CPU 13 mounted on the printed circuit board 12 .
- Four corners of the cooling pump 17 are pierced with screws 47 .
- the screws 47 further pierce the printed circuit board 12 to screw with four bosses 46 fixed on the bottom wall 4 a of the main unit casing 4 .
- the cooling pump 17 is fixed with the printed circuit board 12 and the bottom wall 4 a of the main unit casing 4 and is thermally connected to the CPU 13 .
- the cooling pump 17 includes an inlet tube 32 for sucking a liquid coolant and an outlet tube 33 for discharging the liquid coolant.
- the cooling pump 17 , the inlet tube 32 , and the outlet tube 33 are formed as a single component.
- the radiator 18 includes a first passage 50 , a second passage 51 , and a third passage 52 through which the liquid coolant flows.
- FIG. 5 is a perspective view showing the structure of the radiator 18 in detail.
- the first passage 50 and the second passage 51 include pipes 53 and 54 having a flat cross-section, respectively.
- the pipes 53 and 54 are disposed such that the longitudinal direction of each cross-section is parallel to the bottom wall 4 a of the main unit casing 4 .
- the pipe 53 has a circular cross-section at the upstream end of the first passage 50 to form a coolant inlet 56 through which the liquid coolant is entered.
- the pipe 53 has the flat cross-section at the downstream end of the first passage 50 .
- the downstream end of the first passage 50 is connected to the upstream end of the third passage 52 .
- the pipe 54 has a circular cross-section at the downstream end of the second passage 51 to form a coolant outlet 57 through which the liquid coolant is discharged.
- the pipe 54 has the flat cross-section at the upstream end of the second passage 51 .
- the upstream end of the second passage 51 is connected to the downstream end of the third passage 52 .
- a plurality of cooling fins 63 are provided between a back face 53 a of the pipe 53 and a back face 54 a the pipe 54 .
- the cooling fins 63 are fixed on the back faces 53 a and 54 a by, for example, soldering. Thus, the cooling fins 63 are thermally connected to the pipes 53 and 54 .
- Spaces between the cooling fins 63 form a plurality of cooling air passages 62 .
- the circulation path 19 includes an upstream tube portion 70 and a downstream tube portion 71 .
- One end of the upstream tube portion 70 is connected to the outlet tube 33 of the cooling pump 17 and another end of the upstream tube portion 70 is connected to the coolant inlet 56 of the first passage 50 .
- one end of the downstream tube portion 71 is connected to the inlet tube 32 of the cooling pump 17 and another end of the downstream tube portion 71 is connected to the coolant outlet 57 of the second passage 51 .
- the electric fan 20 sends cooling air to the radiator 18 .
- the electric fan 20 includes a fan casing 73 and an impeller 74 of the fan provided in the fan casing 73 .
- the fan casing 73 includes a cooling air outlet 75 that discharges the cooling air and a duct 76 that guides the discharged cooling air to the radiator 18 .
- FIGS. 6 and 7 are views showing the structure of the cooling pump 17 according to an embodiment of the present invention.
- the cooling pump 17 includes a pump housing 21 serving as a heat-receiving portion.
- the pump housing 21 includes a case 22 and a cover 23 .
- the case 22 is composed of a metal having a high thermal conductivity, for example, copper or aluminum.
- the cover 23 is composed of a resin.
- the case 22 and the cover 23 are combined with an O-ring 22 a disposed therebetween.
- the case 22 includes a recess 24 opening in the upward direction in FIG. 7 .
- the bottom wall 25 of the recess 24 faces the CPU 13 .
- the under surface of the bottom wall 25 forms the heat-receiving face 26 that is thermally connected to the CPU 13 .
- the recess 24 is separated with a partition wall 27 to form a pump chamber 28 and a reserve chamber 29 .
- the reserve chamber 29 stores the liquid coolant.
- the partition wall 27 includes an inlet 30 and an outlet 31 .
- the inlet 30 is connected to the inlet tube 32 through which the liquid coolant is sucked in the pump chamber 28 .
- the outlet 31 is connected to the outlet tube 33 through which the liquid coolant is discharged from the pump chamber 28 .
- a rotor 39 is provided in the pump chamber 28 .
- the rotor 39 has a disc shape and includes a rotation axis 36 fixed at the center thereof. One end of the rotation axis 36 is rotatably supported at the center of the pump chamber 28 and another end of the rotation axis 36 is rotatably supported at the center of the cover 23 .
- the rotor 39 includes an impeller 35 that pressurizes the liquid coolant.
- a plurality of permanent magnets is embedded in an annular side wall 41 of the rotor 39 .
- the impeller 35 and the plurality of permanent magnets are rotated around the rotation axis 36 as a single united component.
- the cover 23 liquid-tightly seals the pump chamber 28 including the rotor 39 , and the reserve chamber 29 .
- a stator 38 is disposed in a recess 23 a formed on the upper surface of the cover 23 in FIG. 7 .
- the stator 38 includes a plurality of electromagnets 40 .
- a predetermined current is applied to the plurality of electromagnets 40 .
- the stator 38 generates a rotating magnetic field.
- a repulsive force caused by this rotating magnetic field of the stator 38 and a magnetic field of the permanent magnets provided in the rotor 39 generates torque to rotate the rotor 39 . Consequently, the impeller 35 provided on the rotor 39 pressurizes to circulate the liquid coolant.
- a control circuit board 42 is also disposed in the cover 23 .
- the control circuit board 42 controls the current applied to the electromagnets 40 .
- a lid 44 covers and protects the stator 38 and the control circuit board 42 .
- the lid 44 is fixed on the pump housing 21 with screws 43 .
- FIG. 8 is a schematic cross-sectional view of the cooling pump 17 .
- the case 22 and the cover 23 form the pump chamber 28 .
- a surface-treated portion 60 for improving hydrophilicity is provided on the inner surface of the pump chamber 28 .
- a silicon oxide film for example, a silicon dioxide (SiO 2 ) film is formed on the inner surface of the pump chamber 28 (i.e., a bottom face 25 a facing the heat-receiving face 26 and a side face 25 b continuous to the a bottom face 25 a ), an inner surface 32 a of the inlet tube 32 , and an inner surface 33 a of the outlet tube 33 .
- the silicon dioxide (SiO 2 ) film for example, the case 22 is immersed in a solution of silicon dioxide (SiO 2 ) and is then dried.
- the thickness of the silicon dioxide (SiO 2 ) film is, for example, 0.1 to 0.6 ⁇ m.
- a titanium oxide film for example, a titanium dioxide (TiO 2 ) film is formed on the inner surface of the pump chamber 28 , the inner surface 32 a of the inlet tube 32 , and the inner surface 33 a of the outlet tube 33 .
- the case 22 is immersed in a solution of titanium dioxide (TiO 2 ) and is then dried, as in the first embodiment.
- the thickness of the titanium dioxide (TiO 2 ) film is, for example, 0.1 to 0.6 ⁇ m.
- a treatment forming a rough face is performed on the inner surface of the pump chamber 28 , the inner surface 32 a of the inlet tube 32 , and the inner surface 33 a of the outlet tube 33 .
- the inner surface has an arithmetic mean roughness (Ra) of 0.5 to 100 ⁇ m.
- a method for forming the rough face is not particularly limited.
- the rough face can be formed by honing.
- FIG. 9A , FIG. 9B , and the graph disposed thereunder qualitatively explain an advantage of the hydrophilic surface 60 for improving hydrophilicity provided on the inner surface of the cooling pump 17 .
- FIG. 9A shows the case wherein the hydrophilic surface 60 for improving hydrophilicity is not provided.
- a surface has a low hydrophilicity, for example, a water droplet does not spread out on the surface.
- the liquid coolant flowing in the pump chamber 28 receives a resistance from the inner surface of the pump chamber 28 . As a result, the flow rate and the flow volume of the liquid coolant are restricted.
- FIG. 9B shows the case wherein the hydrophilic surface 60 according to the present invention for improving hydrophilicity is provided on the inner surface of the pump chamber 28 .
- a surface has a high hydrophilicity, for example, a water droplet can spread out on the surface.
- the resistance of the inner surface of the pump chamber 28 is decreased.
- the flow rate and the flow volume of the liquid coolant can be increased, compared with the case wherein the hydrophilic surface 60 for improving hydrophilicity is not provided.
- the quantity of heat removed from the heat-receiving face 26 generally has a positive correlation with the flow rate or the flow volume of fluid flowing on the heat-receiving face or a face thermally connected to the heat-receiving face. Therefore, when the hydrophilic surface 60 for improving hydrophilicity is provided on the inner surface of the pump chamber 28 , the quantity of heat removed from the heat-receiving face 26 is increased to improve the cooling performance.
- the CPU 13 which is a heat generating unit, is thermally connected to the heat-receiving face 26 of the case 22 shown in FIG. 8 with heat-transfer grease or a heat-transfer sheet (not shown) disposed therebetween.
- the heat generated from the CPU 13 is conducted from the heat-receiving face 26 to the inner surface of the pump chamber 28 on which the hydrophilic surface 60 is provided through the bottom wall 25 of the case 22 .
- a cooled liquid coolant flows in the pump chamber 28 from the inlet tube 32 through the inlet 30 .
- the heat from the CPU 13 conducted to the inner surface of the pump chamber 28 is conducted to the cooled liquid coolant.
- the liquid coolant receives the heat.
- the rotor 39 is rotated by receiving torque due to the rotating magnetic field generated from the stator 38 .
- the liquid coolant that has received the heat is pressurized by the rotation of the impeller 35 provided on the rotor 39 .
- the liquid coolant is discharged from the outlet tube 33 through the outlet 31 .
- the hydrophilic surface 60 for improving hydrophilicity is provided on the inner surface of the pump chamber 28 . Therefore, the liquid coolant circulating in the pump chamber 28 receives less resistance, compared with the case wherein the hydrophilic surface 60 is not provided.
- the increase in the flow rate or the flow volume of the liquid coolant circulating in the pump chamber 28 increases the quantity of heat removed from the CPU to improve the cooling performance.
- the hydrophilic surface 60 in the pump chamber 28 is a rough face described in the third embodiment, the heat-receiving area on the inner surface of the pump chamber 28 is increased. Thus, the cooling performance can be further improved.
- the liquid coolant that has received the heat is pressurized with the cooling pump 17 and is then discharged from the outlet tube 33 . Subsequently, the liquid coolant passes through the upstream tube portion 70 of the circulation path 19 and flows into the radiator 18 .
- the liquid coolant circulates in the first passage 50 , the third passage 52 , and the second passage 51 .
- the heat from the liquid coolant is transferred to the first passage 50 , the second passage 51 , and the cooling fins 63 , which are thermally connected to the first passage 50 and the second passage 51 .
- the cooling air generated by the rotation of the impeller 74 of the electric fan 20 blows on the first passage 50 , the second passage 51 , and the cooling fins 63 to remove the heat from these components.
- the cooling air is then released from the plurality of outlets 6 provided at the back wall 4 e of the main unit casing 4 .
- the liquid coolant that has received the heat is cooled during circulating in the radiator 18 .
- the cooled liquid coolant passes through the downstream tube portion 71 of the circulation path 19 and then returns to the pump chamber 28 through the inlet tube 32 of the cooling pump 17 .
- the present invention is not limited to the above embodiments.
- the present invention may be embodied by modifying the components without departing from the spirit and the scope of the present invention.
- the hydrophilic surface 60 may be provided on the entire inner surface of the recess 24 including the reserve chamber 29 .
- This structure can further improve the heat-receiving efficiency of the cooling pump 17 as a whole.
- the pump includes the heat-receiving portion that is thermally connected to the CPU.
- the heat-receiving portion that is thermally connected to the CPU and the pump may be separate components, and the pump may be disposed at a halfway position of the circulation path.
Abstract
A cooling pump includes a rotor including a rotation axis, a disc fixed with the rotation axis, an impeller fixed with the disc for pressurizing a liquid coolant, and a plurality of permanent magnets arrayed to be fixed with the disc in a ring shape; a case including a pump chamber holding the rotor rotatably, the pump chamber having an inlet and an outlet for the liquid coolant, wherein a part of the bottom wall forming the pump chamber is a heat-receiving portion; a cover including a recess, the cover sealing the case, i.e., pump housing, liquid-tightly; and a circular stator disposed in the recess, the stator generating a rotating magnetic field with a plurality of electromagnets to provide the rotor with torque around the rotation axis, wherein a hydrophilic surface is disposed on the inner surface of the pump chamber.
Description
- This application claims the benefit of priority of Japanese Patent Application No. 2004-134426, filed Apr. 28, 2004, the entire contents of which are incorporated herein by reference.
- 1. Field
- The present invention relates to a pump, a cooling system, and electronic apparatus, and in particular, to a pump used in a liquid cooling system for cooling a heat generating unit, the cooling system, and electronic apparatus including the same.
- 2. Description of the Related Art
- Recently, the data processing speed of electronic apparatus such as a personal computer has been significantly improved. In order to achieve this, the clock frequency for processing a central processing unit (CPU) or peripheral semiconductor devices has also become significantly higher than that in the known devices.
- Accordingly, the heating value from the CPU and other semiconductor devices has also been increased. In a known method, a heat sink is thermally connected to a heat generating unit such as a CPU and the heat sink is air-cooled. However, some recent semiconductor devices cannot be cooled by such a method.
- Meanwhile, a technology to apply a liquid cooling system to compact electronic apparatus such as a personal computer has been developed. The liquid cooling system can achieve higher cooling efficiency because a liquid having a specific heat higher than that of air is used as a coolant.
- For example, Japanese Patent Nos. 3,431,024 and 3,452,059 disclose cooling systems including a closed circulation path for circulating a coolant, a radiator that dissipates the heat from the coolant, and a contact heat exchange pump. The pump is used for pressuring the coolant in order that the coolant circulates in the closed circulation path and is thermally brought into contact with a heating semiconductor. Thus, the heating semiconductor is cooled by heat exchange of the coolant. In addition, Jpn Pat. Publication No. 2003-172286 discloses a technology to reduce the thickness of the contact heat exchange pump.
- In such a liquid cooling method, it is important to increase the thermal conductivity from a heat-receiving face for receiving the heat from a heat generating unit to a face being in contact with a flow path of a liquid coolant. Jpn Pat. Publication No. 2003-68317 discloses a technology relating to a surface treatment of a cooling flow path for cooling a separator of a fuel cell. According to this technology, the surface of the cooling flow path is roughened so as to increase the heat transfer area. As a result, the thermal conductivity is increased. Although the above patent document also describes the application of a hydrophilic coating material, the hydrophilic coating material is applied in order to prevent the freezing of the coolant. Therefore, the application of the hydrophilic coating material does not directly affect the improvement in the cooling efficiency.
- In order to cool a heat generating unit such as a CPU at a high cooling efficiency by circulating a coolant, it is extremely important to increase the flow rate of the coolant to increase the flow volume of the coolant per unit of time.
- In particular, in a pump for circulating a coolant by pressurizing, the increase in the flow rate of the coolant to increase the flow volume significantly improves the cooling efficiency.
- For example, in the above-cited Jpn Pat. Publication No. 2003-172286 disclosing a contact heat exchange pump having a very small thickness, a surface treatment on the inner surface of the pump chamber is not described.
- However, when the pump has an inner surface formed by, for example, pressing, injection molding, or die casting, a satisfactory heat transfer performance from a pump housing, which is a heat receiver, to a coolant is not necessarily achieved.
- According to the surface treatment technology of a flow path disclosed in the above-cited Jpn Pat. Publication No. 2003-68317, the rough face has the maximum arithmetic mean roughness (Ra) of 3.5 μm. Furthermore, the technical field of the above patent document relates to a fuel cell, which is different from the technical field of the present invention. The present invention relates to the cooling of a heating semiconductor such as a CPU. A sufficient cooling performance cannot be expected with the above-cited technology.
- The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.
-
FIG. 1 is a first view showing the appearance of electronic apparatus according to an embodiment of the present invention; -
FIG. 2 is a second view showing the appearance of the electronic apparatus according to the embodiment of the present invention; -
FIG. 3 is a cross-sectional view showing an example of a mounting state of a cooling pump according to the present invention; -
FIG. 4 is a view showing the structure of a cooling system provided in electronic apparatus according to an embodiment of the present invention; -
FIG. 5 is a view showing the structure of a radiator of the cooling system; -
FIG. 6 is a first view showing the structure of a cooling pump according to an embodiment of the present invention; -
FIG. 7 is a second view showing the structure of the cooling pump according to the embodiment of the present invention; -
FIG. 8 is a cross-sectional view showing the structure of the cooling pump according to the present invention; and -
FIG. 9A ,FIG. 9B , and the graph disposed thereunder show an advantage of a surface-treated portion provided on the cooling pump according to the present invention. - Embodiments of a cooling pump (pump), a cooling system, and electronic apparatus according to the present invention will now be described with reference to the attached drawings.
-
FIGS. 1 and 2 are views showing the appearance of apersonal computer 1 that is an embodiment of electronic apparatus according to the present invention. - The
personal computer 1 includes amain unit 2 and apanel unit 3. - The
main unit 2 of thepersonal computer 1 includes amain unit casing 4 having a thin box-shape. Themain unit casing 4 includes abottom wall 4 a, atop wall 4 b, afront wall 4 c,side walls 4 d disposed at the right and the left, and aback wall 4 e. - A plurality of
outlets 6 for releasing cooling air is provided at theback wall 4 e. - The
top wall 4 b of themain unit casing 4 holds akeyboard 5. - The
panel unit 3 includes apanel unit casing 8 and adisplay unit 9. Thedisplay unit 9 is held with thepanel unit casing 8 and includes adisplay panel 9 a. Thedisplay panel 9 a is exposed from anopening 10 disposed at the front face of thepanel unit casing 8. - The
panel unit casing 8 is supported so as to be opened or closed freely with a hinge provided at the back end of themain unit casing 4. -
FIG. 1 shows the appearance when thepanel unit 3 is opened, whereasFIG. 2 shows the appearance when thepanel unit 3 is closed. -
FIG. 3 is a cross-sectional view of a printedcircuit board 12 provided in themain unit casing 4, a semiconductor device such as aCPU 13 that is a heat generating unit mounted on the printedcircuit board 12, and acooling pump 17 that is thermally connected to theCPU 13. - The printed
circuit board 12 is disposed, for example, in the direction parallel to thebottom wall 4 a of themain unit casing 4. TheCPU 13 is mounted on a surface, for example, the top surface, of the printedcircuit board 12. - The
CPU 13 includes abase substrate 14 and anIC chip 15 provided at the center of the top surface of thebase substrate 14. In order to maintain the operation of theCPU 13, it is essential to cool theIC chip 15 efficiently. - The outer surface of a
bottom wall 25 of thecooling pump 17 forms a heat-receivingface 26. The heat-receivingface 26 is thermally connected to the surface of theIC chip 15 with, for example, heat-transfer grease or a heat-transfer sheet therebetween. -
FIG. 4 shows an example of the structure of acooling system 16 provided in themain unit 2 of thepersonal computer 1. - The
cooling system 16 includes thecooling pump 17, aradiator 18, acirculation path 19, and anelectric fan 20. - The cooling
pump 17 is disposed so as to cover theCPU 13 mounted on the printedcircuit board 12. Four corners of thecooling pump 17 are pierced withscrews 47. Thescrews 47 further pierce the printedcircuit board 12 to screw with fourbosses 46 fixed on thebottom wall 4 a of themain unit casing 4. - Thus, the cooling
pump 17 is fixed with the printedcircuit board 12 and thebottom wall 4 a of themain unit casing 4 and is thermally connected to theCPU 13. - The cooling
pump 17 includes aninlet tube 32 for sucking a liquid coolant and anoutlet tube 33 for discharging the liquid coolant. The coolingpump 17, theinlet tube 32, and theoutlet tube 33 are formed as a single component. - The
radiator 18 includes afirst passage 50, asecond passage 51, and athird passage 52 through which the liquid coolant flows. -
FIG. 5 is a perspective view showing the structure of theradiator 18 in detail. Referring toFIG. 5 , thefirst passage 50 and thesecond passage 51 includepipes pipes bottom wall 4 a of themain unit casing 4. - The
pipe 53 has a circular cross-section at the upstream end of thefirst passage 50 to form acoolant inlet 56 through which the liquid coolant is entered. On the other hand, thepipe 53 has the flat cross-section at the downstream end of thefirst passage 50. The downstream end of thefirst passage 50 is connected to the upstream end of thethird passage 52. - The
pipe 54 has a circular cross-section at the downstream end of thesecond passage 51 to form acoolant outlet 57 through which the liquid coolant is discharged. On the other hand, thepipe 54 has the flat cross-section at the upstream end of thesecond passage 51. The upstream end of thesecond passage 51 is connected to the downstream end of thethird passage 52. - A plurality of cooling
fins 63 are provided between aback face 53 a of thepipe 53 and aback face 54 a thepipe 54. The coolingfins 63 are fixed on the back faces 53 a and 54 a by, for example, soldering. Thus, the coolingfins 63 are thermally connected to thepipes - Spaces between the cooling
fins 63 form a plurality of coolingair passages 62. - As shown in
FIG. 4 , thecirculation path 19 includes anupstream tube portion 70 and adownstream tube portion 71. - One end of the
upstream tube portion 70 is connected to theoutlet tube 33 of thecooling pump 17 and another end of theupstream tube portion 70 is connected to thecoolant inlet 56 of thefirst passage 50. - On the other hand, one end of the
downstream tube portion 71 is connected to theinlet tube 32 of thecooling pump 17 and another end of thedownstream tube portion 71 is connected to thecoolant outlet 57 of thesecond passage 51. - The
electric fan 20 sends cooling air to theradiator 18. - The
electric fan 20 includes afan casing 73 and animpeller 74 of the fan provided in thefan casing 73. - The
fan casing 73 includes a coolingair outlet 75 that discharges the cooling air and aduct 76 that guides the discharged cooling air to theradiator 18. - The structure of the
cooling pump 17 will now be described in detail. -
FIGS. 6 and 7 are views showing the structure of thecooling pump 17 according to an embodiment of the present invention. - The cooling
pump 17 includes apump housing 21 serving as a heat-receiving portion. Thepump housing 21 includes acase 22 and acover 23. - The
case 22 is composed of a metal having a high thermal conductivity, for example, copper or aluminum. Thecover 23 is composed of a resin. Thecase 22 and thecover 23 are combined with an O-ring 22 a disposed therebetween. Thecase 22 includes arecess 24 opening in the upward direction inFIG. 7 . Thebottom wall 25 of therecess 24 faces theCPU 13. The under surface of thebottom wall 25 forms the heat-receivingface 26 that is thermally connected to theCPU 13. - The
recess 24 is separated with apartition wall 27 to form apump chamber 28 and areserve chamber 29. Thereserve chamber 29 stores the liquid coolant. - The
partition wall 27 includes aninlet 30 and anoutlet 31. Theinlet 30 is connected to theinlet tube 32 through which the liquid coolant is sucked in thepump chamber 28. Theoutlet 31 is connected to theoutlet tube 33 through which the liquid coolant is discharged from thepump chamber 28. - A
rotor 39 is provided in thepump chamber 28. - The
rotor 39 has a disc shape and includes arotation axis 36 fixed at the center thereof. One end of therotation axis 36 is rotatably supported at the center of thepump chamber 28 and another end of therotation axis 36 is rotatably supported at the center of thecover 23. - The
rotor 39 includes animpeller 35 that pressurizes the liquid coolant. A plurality of permanent magnets is embedded in anannular side wall 41 of therotor 39. Theimpeller 35 and the plurality of permanent magnets are rotated around therotation axis 36 as a single united component. - The
cover 23 liquid-tightly seals thepump chamber 28 including therotor 39, and thereserve chamber 29. - A
stator 38 is disposed in arecess 23 a formed on the upper surface of thecover 23 inFIG. 7 . Thestator 38 includes a plurality ofelectromagnets 40. - A predetermined current is applied to the plurality of
electromagnets 40. As a result, thestator 38 generates a rotating magnetic field. A repulsive force caused by this rotating magnetic field of thestator 38 and a magnetic field of the permanent magnets provided in therotor 39 generates torque to rotate therotor 39. Consequently, theimpeller 35 provided on therotor 39 pressurizes to circulate the liquid coolant. - A
control circuit board 42 is also disposed in thecover 23. Thecontrol circuit board 42 controls the current applied to theelectromagnets 40. - A
lid 44 covers and protects thestator 38 and thecontrol circuit board 42. Thelid 44 is fixed on thepump housing 21 withscrews 43. -
FIG. 8 is a schematic cross-sectional view of thecooling pump 17. - The
case 22 and thecover 23 form thepump chamber 28. In order to increase the flow rate of the liquid coolant and to improve the cooling performance, a surface-treatedportion 60 for improving hydrophilicity is provided on the inner surface of thepump chamber 28. - In a first embodiment of the
hydrophilic surface 60 for improving hydrophilicity, a silicon oxide film, for example, a silicon dioxide (SiO2) film is formed on the inner surface of the pump chamber 28 (i.e., abottom face 25 a facing the heat-receivingface 26 and aside face 25 b continuous to the abottom face 25 a), an inner surface 32 a of theinlet tube 32, and aninner surface 33 a of theoutlet tube 33. In order to form the silicon dioxide (SiO2) film, for example, thecase 22 is immersed in a solution of silicon dioxide (SiO2) and is then dried. - In terms of the cooling performance, the thickness of the silicon dioxide (SiO2) film is, for example, 0.1 to 0.6 μm.
- In a second embodiment of the
hydrophilic surface 60 for improving hydrophilicity, a titanium oxide film, for example, a titanium dioxide (TiO2) film is formed on the inner surface of thepump chamber 28, the inner surface 32 a of theinlet tube 32, and theinner surface 33 a of theoutlet tube 33. In order to form the titanium dioxide (TiO2) film, for example, thecase 22 is immersed in a solution of titanium dioxide (TiO2) and is then dried, as in the first embodiment. - In terms of the cooling performance, the thickness of the titanium dioxide (TiO2) film is, for example, 0.1 to 0.6 μm.
- In a third embodiment of the
hydrophilic surface 60 for improving hydrophilicity, a treatment forming a rough face is performed on the inner surface of thepump chamber 28, the inner surface 32 a of theinlet tube 32, and theinner surface 33 a of theoutlet tube 33. In terms of the cooling performance, for example, the inner surface has an arithmetic mean roughness (Ra) of 0.5 to 100 μm. - A method for forming the rough face is not particularly limited. For example, the rough face can be formed by honing.
-
FIG. 9A ,FIG. 9B , and the graph disposed thereunder qualitatively explain an advantage of thehydrophilic surface 60 for improving hydrophilicity provided on the inner surface of thecooling pump 17. -
FIG. 9A shows the case wherein thehydrophilic surface 60 for improving hydrophilicity is not provided. When a surface has a low hydrophilicity, for example, a water droplet does not spread out on the surface. In such a case, the liquid coolant flowing in thepump chamber 28 receives a resistance from the inner surface of thepump chamber 28. As a result, the flow rate and the flow volume of the liquid coolant are restricted. - In contrast,
FIG. 9B shows the case wherein thehydrophilic surface 60 according to the present invention for improving hydrophilicity is provided on the inner surface of thepump chamber 28. When a surface has a high hydrophilicity, for example, a water droplet can spread out on the surface. In such a case, the resistance of the inner surface of thepump chamber 28 is decreased. As a result, the flow rate and the flow volume of the liquid coolant can be increased, compared with the case wherein thehydrophilic surface 60 for improving hydrophilicity is not provided. - As shown in the graph disposed under
FIGS. 9A and 9B , the quantity of heat removed from the heat-receivingface 26 generally has a positive correlation with the flow rate or the flow volume of fluid flowing on the heat-receiving face or a face thermally connected to the heat-receiving face. Therefore, when thehydrophilic surface 60 for improving hydrophilicity is provided on the inner surface of thepump chamber 28, the quantity of heat removed from the heat-receivingface 26 is increased to improve the cooling performance. - The operation of the
cooling system 16 including thecooling pump 17 according to the present invention will now be described with reference toFIGS. 4 and 8 . - The
CPU 13, which is a heat generating unit, is thermally connected to the heat-receivingface 26 of thecase 22 shown inFIG. 8 with heat-transfer grease or a heat-transfer sheet (not shown) disposed therebetween. - The heat generated from the
CPU 13 is conducted from the heat-receivingface 26 to the inner surface of thepump chamber 28 on which thehydrophilic surface 60 is provided through thebottom wall 25 of thecase 22. - A cooled liquid coolant flows in the
pump chamber 28 from theinlet tube 32 through theinlet 30. The heat from theCPU 13 conducted to the inner surface of thepump chamber 28 is conducted to the cooled liquid coolant. As a result, the liquid coolant receives the heat. - Meanwhile, in the
pump chamber 28, therotor 39 is rotated by receiving torque due to the rotating magnetic field generated from thestator 38. The liquid coolant that has received the heat is pressurized by the rotation of theimpeller 35 provided on therotor 39. The liquid coolant is discharged from theoutlet tube 33 through theoutlet 31. - The
hydrophilic surface 60 for improving hydrophilicity is provided on the inner surface of thepump chamber 28. Therefore, the liquid coolant circulating in thepump chamber 28 receives less resistance, compared with the case wherein thehydrophilic surface 60 is not provided. - As a result, the flow rate of the liquid coolant circulating in the
pump chamber 28 is increased and the flow volume of the liquid coolant per unit of time is also increased. - The increase in the flow rate or the flow volume of the liquid coolant circulating in the
pump chamber 28 increases the quantity of heat removed from the CPU to improve the cooling performance. - Furthermore, when the
hydrophilic surface 60 in thepump chamber 28 is a rough face described in the third embodiment, the heat-receiving area on the inner surface of thepump chamber 28 is increased. Thus, the cooling performance can be further improved. - As shown in
FIG. 4 , the liquid coolant that has received the heat is pressurized with thecooling pump 17 and is then discharged from theoutlet tube 33. Subsequently, the liquid coolant passes through theupstream tube portion 70 of thecirculation path 19 and flows into theradiator 18. - In the
radiator 18, the liquid coolant circulates in thefirst passage 50, thethird passage 52, and thesecond passage 51. During this circulation, the heat from the liquid coolant is transferred to thefirst passage 50, thesecond passage 51, and the coolingfins 63, which are thermally connected to thefirst passage 50 and thesecond passage 51. - The cooling air generated by the rotation of the
impeller 74 of theelectric fan 20 blows on thefirst passage 50, thesecond passage 51, and the coolingfins 63 to remove the heat from these components. The cooling air is then released from the plurality ofoutlets 6 provided at theback wall 4 e of themain unit casing 4. - As described above, the liquid coolant that has received the heat is cooled during circulating in the
radiator 18. The cooled liquid coolant passes through thedownstream tube portion 71 of thecirculation path 19 and then returns to thepump chamber 28 through theinlet tube 32 of thecooling pump 17. - Repeating this cycle allows the heat generated from the
CPU 13 to be released to the outside of themain unit casing 4 continuously with the cooling air generated from theelectric fan 20. - The present invention is not limited to the above embodiments. The present invention may be embodied by modifying the components without departing from the spirit and the scope of the present invention. For example, the
hydrophilic surface 60 may be provided on the entire inner surface of therecess 24 including thereserve chamber 29. This structure can further improve the heat-receiving efficiency of thecooling pump 17 as a whole. In the above embodiments, the pump includes the heat-receiving portion that is thermally connected to the CPU. Alternatively, the heat-receiving portion that is thermally connected to the CPU and the pump may be separate components, and the pump may be disposed at a halfway position of the circulation path.
Claims (20)
1. A pump comprising:
a housing including a pump chamber;
an impeller disposed in the pump chamber; and
a stator for rotating the impeller,
wherein an inner surface of the pump chamber includes a hydrophilic surface.
2. The pump according to claim 1 , wherein the hydrophilic surface is a film mainly composed of a silicon oxide.
3. The pump according to claim 1 , wherein the hydrophilic surface is a film mainly composed of a titanium oxide.
4. The pump according to claim 1 , wherein the hydrophilic surface comprises a rough face.
5. The pump according to claim 1 , wherein the pump housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.
6. The pump according to claim 5 , wherein the metal case comprises an outlet tube for discharging the liquid coolant and an inlet tube for sucking the liquid coolant, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.
7. The pump according to claim 6 , wherein the metal case comprises the pump chamber and a reserve chamber, and the hydrophilic surface is provided on the inner surface of the reserve chamber.
8. An electronic apparatus comprising:
a casing;
a substrate disposed in the casing;
a heat generating unit mounted on the substrate; and
a cooling system thermally connected to the heat generating unit, the cooling system including
a radiator for dissipating the heat from the heat generating unit,
a circulation path for circulating a liquid coolant to the radiator, and
a pump for forcibly circulating the liquid coolant through the circulation path, the pump including
a housing including a pump chamber,
an impeller disposed in the pump chamber, and
a stator for rotating the impeller,
wherein an inner surface of the pump chamber includes a hydrophilic surface.
9. The electronic apparatus according to claim 8 , wherein the hydrophilic surface is a film mainly composed of a silicon oxide.
10. The electronic apparatus according to claim 8 , wherein the hydrophilic surface is a film mainly composed of a titanium oxide.
11. The electronic apparatus according to claim 8 , wherein the hydrophilic surface comprises a rough face.
12. The electronic apparatus according to claim 8 , wherein the housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.
13. The electronic apparatus according to claim 12 , wherein the metal case comprises an outlet tube for discharging the liquid coolant to the circulation path and an inlet tube for sucking the liquid coolant from the circulation path, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.
14. The electronic apparatus according to claim 13 , wherein the metal case comprises the pump chamber and a reserve chamber, and the hydrophilic surface is provided on the inner surface of the reserve chamber.
15. A cooling system thermally connected to a heat generating unit, the cooling system comprising:
a radiator for dissipating the heat from the heat generating unit;
a circulation path for circulating a liquid coolant to the radiator; and
a pump for forcibly circulating the liquid coolant through the circulation path, the pump including
a housing including a pump chamber,
an impeller disposed in the pump chamber, and
a stator for rotating the impeller,
wherein an inner surface of the pump chamber includes a hydrophilic surface.
16. The cooling system according to claim 15 , wherein the hydrophilic surface is a film mainly composed of a silicon oxide.
17. The cooling system according to claim 15 , wherein the hydrophilic surface is a film mainly composed of a titanium oxide.
18. The cooling system according to claim 15 , wherein the hydrophilic surface comprises a rough face.
19. The cooling system according to claim 15 , wherein the housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.
20. The cooling system according to claim 19 , wherein the metal case comprises an outlet tube for discharging the liquid coolant to the circulation path and an inlet tube for sucking the liquid coolant from the circulation path, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004134426A JP2005317796A (en) | 2004-04-28 | 2004-04-28 | Pump, cooling device, and electronic apparatus |
JPP2004-134426 | 2004-04-28 |
Publications (1)
Publication Number | Publication Date |
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US20050241809A1 true US20050241809A1 (en) | 2005-11-03 |
Family
ID=35185897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/104,805 Abandoned US20050241809A1 (en) | 2004-04-28 | 2005-04-13 | Pump, cooling system, and electronic apparatus |
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US (1) | US20050241809A1 (en) |
JP (1) | JP2005317796A (en) |
CN (1) | CN1691880A (en) |
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US11714432B2 (en) | 2011-08-11 | 2023-08-01 | Coolit Systems, Inc. | Flow-path controllers and related systems |
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US20140326442A1 (en) * | 2013-05-03 | 2014-11-06 | Control Techniques Limited | Method and system for cooling a device |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
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US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11725890B2 (en) | 2019-04-25 | 2023-08-15 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US11395443B2 (en) | 2020-05-11 | 2022-07-19 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
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CN1691880A (en) | 2005-11-02 |
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