US20050219327A1 - Features in substrates and methods of forming - Google Patents
Features in substrates and methods of forming Download PDFInfo
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- US20050219327A1 US20050219327A1 US10/817,716 US81771604A US2005219327A1 US 20050219327 A1 US20050219327 A1 US 20050219327A1 US 81771604 A US81771604 A US 81771604A US 2005219327 A1 US2005219327 A1 US 2005219327A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims description 25
- 238000003754 machining Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims 2
- 239000012530 fluid Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 14
- 230000004888 barrier function Effects 0.000 description 13
- 238000007639 printing Methods 0.000 description 12
- 238000010304 firing Methods 0.000 description 10
- 239000010409 thin film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1625—Manufacturing processes electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Definitions
- microdevices include substrates having features formed therein. Existing feature shapes, dimensions, and/or orientations can limit microdevice design.
- FIG. 1 illustrates a front elevational view of a diagrammatic representation of an exemplary printer in accordance with one exemplary embodiment.
- FIG. 2 illustrates a perspective view of a diagrammatic representation of a print cartridge suitable for use in the exemplary printer shown in FIG. 1 in accordance with one exemplary embodiment.
- FIGS. 3-3 a illustrate diagrammatic representations of a cross-sectional view of a portion of an exemplary print cartridge.
- FIG. 4 illustrates a diagrammatic representation of a cross-sectional view of an exemplary substrate in accordance with one exemplary embodiment.
- FIGS. 4 a - 4 b illustrate diagrammatic representations of top and bottom views respectively of the substrate illustrated in FIG. 4 in accordance with one embodiment.
- FIG. 5 illustrates a diagrammatic representation of a perspective view of a portion of a print cartridge in accordance with one exemplary embodiment.
- FIG. 6 illustrates a diagrammatic representation of a top view of an exemplary substrate in accordance with one exemplary embodiment.
- FIG. 6 a illustrates a diagrammatic representation of a perspective cut-away view of the exemplary substrate illustrated in FIG. 6 in accordance with one exemplary embodiment.
- FIG. 6 b illustrates_a diagrammatic representation of a cross-sectional view of the exemplary substrate illustrated in FIG. 6 in accordance with one exemplary embodiment.
- FIG. 6 c illustrates a_diagrammatic representation of a cross-sectional view of an alternative configuration of the view represented in FIG. 6 b in accordance with one exemplary embodiment.
- FIG. 7 illustrates a diagrammatic representation of a cross-sectional view of an exemplary substrate in accordance with one exemplary embodiment.
- FIG. 8 illustrates a diagrammatic representation of a perspective view of an exemplary substrate in accordance with one exemplary embodiment.
- FIGS. 8 a - 8 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment.
- FIGS. 9 a - 9 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment.
- FIGS. 10 a - 10 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment.
- FIGS. 11 a - 11 c illustrate process steps for forming an exemplary substrate in accordance with one exemplary embodiment.
- Feature(s) can have various configurations including blind features and through features.
- a blind feature passes through less than an entirety of the substrate's thickness.
- a feature which extends totally through the thickness becomes a through feature.
- a blind feature may be further processed into a through feature during subsequent processing steps.
- Exemplary substrates having features formed therein can be utilized in various microdevices such as microchips and fluid-ejecting devices among others. Fluid-ejecting devices such as print heads are utilized in printing applications. Fluid-ejecting devices also are utilized in medical and laboratory applications among others. Exemplary substrates also can be utilized in various other applications. For example, display devices may comprise features formed into a glass substrate to create a visual display.
- features comprise fluid-handling slots (“slots”). These techniques can be applicable equally to other types of features formed into a substrate.
- FIG. 1 shows a diagrammatic representation of an exemplary printing device that can utilize an exemplary print cartridge.
- the printing device comprises a printer 100 .
- the printer shown here is embodied in the form of an inkjet printer.
- the printer 100 can be capable of printing in black-and-white and/or color.
- the term “printing device” refers to any type of printing device and/or image forming device that employs slotted substrate(s) to achieve at least a portion of its functionality. Examples of such printing devices can include, but are not limited to, printers, facsimile machines, and photocopiers.
- the slotted substrates comprise a portion of a print head which is incorporated into a print cartridge, an example of which is described below.
- FIG. 2 shows a diagrammatic representation of an exemplary print cartridge 202 that can be utilized in an exemplary printing device.
- the print cartridge is comprised of a print head 204 and a cartridge body 206 that supports the print head. Though a single print head 204 is employed on this print cartridge 202 other exemplary configurations may employ multiple print heads on a single print cartridge.
- Print cartridge 202 is configured to have a self-contained fluid or ink supply within cartridge body 206 .
- Other print cartridge configurations may alternatively or additionally be configured to receive fluid from an external supply.
- Other exemplary configurations will be recognized by those of skill in the art. Though the term ink is utilized below, it should be understood that fluid-ejecting devices can deliver a diverse range of fluids.
- Print cartridge failure can result from a failure of the print cartridge components. Such component failure can be caused by cracking. As such, various embodiments described below can provide print heads with a reduced propensity to crack.
- Reliability of print cartridge 202 also can be affected by bubbles contained within the print cartridge, especially within the print head 204 .
- bubbles can be formed in the ink as a byproduct of operation of a printing device.
- bubbles can be formed as a byproduct of the ejection process in the printing device's print cartridge when ink is ejected from one or more firing chambers of the print head.
- bubbles can occlude ink flow to some or all of the firing chambers and can cause the print head to malfunction.
- Some embodiments can evacuate bubbles from the print head to decrease the likelihood of such a malfunction as will become apparent below.
- An additional desire in designing print cartridges is the reduction of their cost.
- One way to reduce such cost is to reduce the dimensions, and therefore the material and fabrication costs, of print head 204 .
- FIG. 3 illustrates a side-sectional diagrammatic representation of a portion of the exemplary print head 204 as indicated in FIG. 2 .
- FIG. 3 a illustrates an alternative print head configuration sometimes referred to as an edge feed configuration.
- FIG. 3 The view of FIG. 3 is taken transverse an axis normal to first substrate surface (“first surface”) 302 , the axis extending into and out of the plane of the page upon which FIG. 3 appears.
- this axis is the long axis which lies between the first and second surfaces and extends generally parallel to those surfaces.
- a substrate 300 has a thickness t which extends between a first surface 302 and a second substrate surface (“second surface”) 303 .
- three features 305 a - c comprising fluid-feed slots (“slots”) pass through substrate 300 between first and second surfaces 302 , 303 .
- slot and “feature” are utilized interchangeably. Examples of other feature types are described below in relation to FIGS. 9 a - 9 b and FIGS. 10 a - 10 b.
- substrate 300 comprises silicon which either can be doped or undoped.
- substrate materials can include, but are not limited to, gallium arsenide, gallium phosphide, indium phosphide, glass, quartz, ceramic or other material.
- Substrate thickness t can have any suitable dimensions that are appropriate for an intended application. In some embodiments substrate thicknesses t can range from less than 100 microns to more than 2000 microns. One exemplary embodiment can utilize a substrate that is approximately 675 microns thick. Though a single substrate is discussed herein, other suitable embodiments may comprise a substrate that has multiple layers during fabrication and/or in the finished product. For example, one such embodiment may employ a substrate having a first component and a second sacrificial component which is discarded at some point during processing.
- one or more thin-film layers 314 are positioned over substrate's second surface 303 .
- a barrier layer 316 and an orifice plate or orifice layer 318 are positioned over the thin-film layers 314 .
- one or more thin-film layers 314 can comprise one or more conductive traces (not shown) and electrical components such as transistors (not shown), and resistors 320 . Individual resistors can be controlled selectively via the electrical traces.
- Thin-film layers 314 also can at least partially define in some embodiments, a wall or surface of multiple fluid-feed passageways 322 through which fluid can pass.
- Thin-film layers 314 also can comprise among others, a field or thermal oxide layer.
- Barrier layer 316 can define, at least in part, multiple firing chambers 324 .
- fluid-feed passageways 322 may be defined in barrier layer 316 , alone or in combination with thin-film layers 314 .
- Orifice layer 318 can define multiple firing nozzles 326 . Individual firing nozzles can be aligned respectively with individual firing chambers 324 .
- Barrier layer 316 and orifice layer 318 can be formed in any suitable manner.
- both barrier layer 316 and orifice layer 318 comprise thick-film material, such as a photo-imagable polymer material.
- the photo-imagable polymer material can be applied in any suitable manner.
- the material can be “spun-on” as will be recognized by the skilled artisan.
- barrier layer 316 After being spun-on, barrier layer 316 then can be patterned to form, at least in part, desired features such as passageways and firing chambers therein. In one embodiment patterned areas of the barrier layer can be filled with a sacrificial material in what is commonly referred to as a ‘lost wax’ process.
- orifice layer 318 can be comprised of the same material as the barrier layer and can be formed over barrier layer 316 . In one such example orifice layer material can be ‘spun-on’ over the barrier layer. Orifice layer 318 then can be patterned as desired to form nozzles 326 over respective chambers 324 . The sacrificial material then can be removed from the barrier layer's chambers 324 and passageways 322 .
- barrier layer 316 comprises a thick-film
- the orifice layer 318 comprises an electroformed nickel or other suitable metal material.
- the orifice layer can be a polymer, such as “Kapton” or “Oriflex”, with laser ablated nozzles.
- Other suitable embodiments may employ an orifice layer which performs the functions of both a barrier layer and an orifice layer.
- a housing 330 of cartridge body 206 can be positioned over substrate's first surface 302 .
- housing 330 can comprise a polymer, ceramic and/or other suitable material(s).
- An adhesive though not specifically shown, may be utilized to bond or otherwise join housing 330 to substrate 300 .
- a fluid such as ink
- Fluid can enter slots 305 a - c from the cartridge body 206 .
- Fluid then can flow through individual passageways 322 into an individual firing chamber 324 .
- Fluid can be ejected from the firing chamber when an electrical current is passed through an individual resistor 320 or other ejection means.
- the electrical current can heat the resistor sufficiently to heat some of the fluid contained in the firing chamber to its boiling point so that it expands to eject a portion of the fluid from a respectively positioned nozzle 326 .
- the ejected fluid then can be replaced by additional fluid from passageway 322 .
- slot 305 b 1 extends between first and second surfaces 302 , 303 .
- Slots 305 a 1 , 305 c 1 extend to second surface 303 from first and second sidewalls 340 , 342 that are orthogonal or oblique to the second surface.
- Such a configuration may allow reduced print head die sizes to be used that provide the same functionality as larger die sizes.
- FIG. 4 illustrates a diagrammatic representation of substrate 300 illustrated in FIG. 3 .
- each slot 305 a - c extends through substrate 300 along a bore axis b 1 , b 2 , and b 3 respectively.
- a bore axis intersects the first and second surfaces and can generally correspond to a direction of intended fluid flow through the slot.
- Slot 305 b extends along bore axis b 2 which is transverse to second surface 303 .
- Slots 305 a and 305 c extend along bores b 1 , b 3 which are not transverse to second surface 303 .
- Individual slots 305 a , 305 c lie at angles ⁇ 1 , ⁇ 2 with respect to second surface 303 .
- Angles ⁇ 1 , ⁇ 2 can comprise any angle less than 90 degrees relative to second surface 303 with some embodiments having a value in the range of 10 degrees to 80 degrees. In some embodiments angles ⁇ 1 , ⁇ 2 can range from about 60 degrees to about 80 degrees. In other embodiments angles ⁇ 1 , ⁇ 2 can range from about 40 degrees to about 59 degrees. In still other embodiments angles ⁇ 1 , ⁇ 2 can range from about 20 degrees to about 39 degrees. In this particular embodiment angles ⁇ 1 , ⁇ 2 each comprise about 62 degrees, another particular embodiment has angles of about 45 degrees. Though in this embodiment angles ⁇ 1 , ⁇ 2 comprise similar values, other embodiments may have dissimilar values.
- angle ⁇ 1 can have a value of 45 degrees while angle ⁇ 2 has a value of 55 degrees.
- Having one or more angled slots can allow greater options in print cartridge design, as well in the design of other microdevices, as will be described in more detail below.
- slots 305 a , 305 c are angled relative the second surface 303 when viewed transverse the long axis.
- other embodiments may be angled relative to second surface 303 when viewed along the long axis. Examples of such a configuration will be described in more detail below in relation to FIGS. 8-8 b .
- Embodiments having one or more angled slots can allow greater design flexibility. For example, angled slots can allow a first geometry at first surface 302 and a second different geometry at second surface 303 .
- FIGS. 4 a and 4 b illustrate top views of substrate's first surface 302 and second surface 303 respectively.
- slots 305 a - 305 c define a first footprint 402 a at first surface 302 and a second different footprint 402 b at second surface 303 .
- First footprint 402 a defines a first area while second footprint 402 b defines a second area.
- the first area can be at least about 10 percent greater than the second area.
- first area is about 20 percent greater than second area.
- the increased area is due predominately to a greater width w a of footprint 402 a when compared to width w b of footprint 402 b.
- FIG. 5 shows a cut-away perspective view of a portion of another exemplary print cartridge 202 a .
- Substrate 300 a is positioned proximate housing 330 a in an orientation in which the two components might be bonded together to form print cartridge 202 a .
- three slots 305 d - 305 f are defined, at least in part, by substrate material remaining between the slots.
- This substrate material remaining between the slots is referred to herein as “beam(s)” 502 a - 502 d which extend generally parallel to the long axis of the slots.
- Beams 502 a and 502 d can be referred to as external beams as they define a slot on one side and a substrate edge on the other.
- beams 502 b - 502 c can be referred to as internal beams as they define slots on two sides.
- Beams 502 a - 502 d have widths w 1 -w 4 respectively at first surface 302 a as measured transverse the slots' long axes.
- Some print cartridge designs achieve effective integration of substrate 300 a with cartridge body housing 330 a by maintaining the widest possible beam width of the substrate's narrowest beam relative to first surface 302 a . Such a configuration can among other factors aid in molding cartridge body housing 330 a .
- beam widths w 1 -w 4 are generally equal.
- Beams 502 a - 502 d also define widths w 5 -w 8 respectively at second surface 303 a as measured transverse the slots' long axes.
- Some print cartridge designs configure substrate's second surface 303 a so that external beams 502 a , 502 d are relatively wider than internal beams 502 b , 502 c to allow placement of various electrical components overlying second surface 303 a on the external beams.
- print head substrate 300 a incorporating one or more angled slots can achieve both a desired first surface configuration and a desired second surface configuration.
- internal beams 502 b , 502 c of substrate 300 a are stronger and less likely to crack than a configuration where second surface widths w 6 , W 7 are maintained through the substrate' thickness t.
- FIG. 5 has generally continuous slots when viewed along the long axis.
- Other embodiments may have substrate material or ‘ribs’ extending across the substrate's long axis from a beam defining one side of a slot to another beam defining an opposing side of the slot.
- FIGS. 6-6 c illustrate one example where ribs 602 extend generally across an axis of slots 305 g - 305 i .
- FIG. 6 illustrates a top view of substrate's second surface 303 b .
- FIG. 6 a illustrates a cut-away view of substrate 300 b as indicated in FIG. 6 .
- FIGS. 6 b - 6 c illustrate views taken generally orthogonally to the y-axis which provide two exemplary rib configurations.
- FIGS. 6-6 a ribs 602 extend between beams 502 e and 502 f , beams 502 f and 502 g , and beams 502 g and 502 h .
- FIG. 6 b illustrates rib 602 illustrated in FIG. 6 a in a little more detail, while FIG. 6 c comprises a view similar to that illustrated in FIG. 6 b of another exemplary rib configuration.
- FIG. 6 b illustrates an embodiment where rib 602 tapers from a first width w 1 proximate first surface 302 b to a second width w 2 proximate second surface 303 b .
- This is but one exemplary configuration.
- other embodiments may maintain a generally uniform width between the first and second surfaces.
- rib 602 can approximate a frustrum.
- Such a configuration may supply generally uniform fluid flow to various chambers, described above, which can be supplied by slot 305 g .
- Other embodiments may utilize other rib shapes.
- height h of rib 602 equals thickness t of substrate 300 b.
- FIG. 6 c illustrates an alternative configuration where rib height h is less than thickness t.
- rib 602 a extends from first surface 302 b but does not reach second surface 303 b .
- Configurations which utilize a height h less than thickness t may contribute to a uniform fluid environment for various chambers supplied by slot 305 g.
- FIG. 7 illustrates a cross-sectional representation of another exemplary substrate 300 c .
- This cross-sectional view is similar to the view illustrated in FIG. 4 and is transverse the long axis.
- Two slots 305 j , 305 k extend through substrate 300 c along bores b 4 , b 5 respectively which are not transverse to first surface 302 c .
- bores b 4 , b 5 intersect midpoints of widths w 8 , w 9 and w 10 , w 11 respectively.
- slot 305 j is defined, at least in part, by a first sidewall 702 a and a second sidewall 702 b .
- slot 305 k is defined, at least in part, by a first sidewall 702 c and a second sidewall 702 d.
- bubbles may occur.
- a bubble is indicated generally at 704 .
- Buoyancy forces acting upon bubble 704 are directed along the z-axis.
- Fluid flow along bore b 5 can be represented as a vector having both y-axis and z-axis components. Generally only the z-axis component of the fluid flow acts against the bubble's buoyancy forces and the bubble is more likely to migrate toward first surface 302 c and ultimately from the slot.
- bubble 704 may migrate toward first sidewall 702 c and then up the first sidewall toward first surface 302 c.
- the bubbles may migrate toward and up first sidewall 702 c . Following a common path may tend to force the bubbles together leading to agglomeration. If the bubbles agglomerate they may pass out of the slot more quickly than they otherwise would. Agglomeration may assist with bubble removal because the buoyant force acts to move the bubble upwards against the ink flow. This buoyant force may become increasingly dominant as the bubbles agglomerate and grow because it increases with the cube of the bubble diameter whereas the drag force induced by the downward ink flow increases only with the square of the bubble diameter.
- width w 8 of slot 305 j at first surface 302 c is greater than width w 9 at second surface 303 c .
- width w 10 of slot 305 k at first surface 302 c is greater than width w 11 at second surface 303 c .
- slots 305 j , 305 k have a slot profile which generally increases from second surface 303 c toward first surface 302 c .
- bubble 704 has a volume sufficient to contact both sidewalls 702 c , 702 d simultaneously the less constrictive width environment progressively available toward first surface 302 c can provide a driving force to move bubble 704 toward the first surface 302 c and ultimately out of the print head.
- FIGS. 8-8 b represent another substrate 300 d .
- FIG. 8 represents a perspective view
- FIG. 8 a represents a cross-sectional view taken along line a-a indicated in FIG. 8
- FIG. 8 b represents a cross-sectional view taken along line b-b.
- line a-a is generally parallel to a long axis of slot 3051 and line b-b is generally orthogonal the long axis.
- slot 3051 when viewed along its long axis slot 3051 generally approximates a portion of a parallelogram 804 as best can be appreciated from FIG. 8 a . Also, in this particular embodiment slot 3051 approximates a portion of a parallelogram 806 when viewed transverse the long axis as best can be appreciated from FIG. 8 b .
- Other slots can approximate other geometric shapes. Various slot shapes can allow increased flexibility of print head design over standard slot configurations.
- FIGS. 9 a - 9 b and 10 a - 10 b represent exemplary features and process steps for forming the features.
- the term feature is employed.
- the feature may be a bind feature or a through feature comprising a slot.
- FIGS. 9 a - 9 b represent cross-sectional views of substrate 300 e .
- FIG. 9 a represents an intermediary step in forming a feature in the substrate
- FIG. 9 b represents feature 905 formed in substrate 300 e .
- Feature 905 can be utilized as a fluid-handling slot or electrical interconnect, e.g. a via, among other uses.
- Feature 905 defines a bore axis b 7 which is not transverse first surface 302 e and which intersects a midpoint of the feature width w 12 , w 13 at the first surface 302 e and the second surface 303 e respectively.
- Feature 905 is defined, at least in part, by one or more sidewalls.
- two sidewalls 902 a , 902 b are indicated.
- individual sidewalls 902 a , 902 b have a first sidewall portion 904 a , 904 b respectively that is generally transverse to first surface 302 e .
- individual sidewalls 902 a , 902 b have a second different sidewall portion 906 a , 906 b that is not transverse the first surface.
- Feature 905 can be formed with one or more substrate removal techniques. Examples of suitable substrate removal techniques are described below in relation to FIGS. 11 a - 11 c .
- One suitable formation method can involve removing substrate material from second surface 303 e as indicated generally at 910 .
- the substrate removal process indicated at 910 can form first sidewall portions 904 a , 904 b .
- the same removal process and/or one or more different removal processes can be utilized to remove substrate material indicated generally at 912 .
- the sidewall removal process indicated generally at 912 can form sidewall portions 906 a , 906 b .
- the second removal process can be accomplished from either first surface 302 e , second surface 303 e or a combination thereof.
- Other embodiments may conduct the substrate removal process indicated at 912 before the substrate removal process indicated at 910 .
- FIGS. 10 a - 10 b show feature 905 a formed in substrate 300 f .
- Feature 905 a defines a bore axis b 8 which is not transverse first surface 302 f and intersects a midpoint of the feature width w 14 , w 15 at the first surface 302 f and at a bottom surface 1000 respectively.
- feature 905 a can comprise a first region 1001 a and a second region 1001 b .
- the two regions 1001 a , 1001 b can be formed in distinct steps or as a single process.
- Feature 905 a can be defined, at least in part, by one or more sidewalls.
- two sidewalls 1002 a , 1002 b are indicated.
- individual sidewalls 1002 a , 1002 b have a first sidewall portion 1004 a , 1004 b respectively that is not transverse to first surface 302 f and lies at a first angle ⁇ 4 relative to first surface 302 f
- individual sidewalls 1002 a , 1002 b have a second different sidewall portion 1006 a , 1006 b respectively that is not transverse the first surface and which lies at a second different angle ⁇ 5 relative to first surface 302 f .
- These exemplary sidewall configurations can allow greater microdevice design flexibility.
- FIGS. 11 a - 11 c show process steps for forming an exemplary feature in a substrate.
- FIG. 11 a illustrates a laser machine 1102 for removing substrate material sufficient to form feature 905 b in a substrate.
- Feature 905 b generally can approximate a circle, an ellipsoid, a rectangle, or any other desired shape whether regular or irregular.
- an individual substrate 300 g is illustrated here. Other embodiments may act upon a wafer or other material which subsequently can be separated or can be diced into individual substrates.
- laser machine 1102 comprises a laser source 1106 configured to generate laser beam 1108 for laser machining substrate 300 g .
- Exemplary laser beams such as laser beam 1108 can provide sufficient energy to energize substrate material at which the laser beam is directed.
- Energizing can comprise melting, vaporizing, exfoliating, phase exploding, ablating, reacting, and/or a combination thereof, among others processes.
- Some exemplary laser machines may utilize a gas assist and/or liquid assist process to aid in substrate removal.
- substrate 300 g is positioned on a fixture or stage 1112 for processing.
- Suitable fixtures should be recognized by the skilled artisan. Some such fixtures may be configured to move the substrate along x, y, and/or z coordinates.
- Various exemplary embodiments can utilize one or more mirrors 1114 , galvanometers 1116 and/or lenses 1118 to direct laser beam 1108 at first surface 302 g .
- laser beam 1108 can be focused in order to increase its energy density to machine the substrate more effectively.
- the laser beam can be focused to achieve a desired beam geometry where the laser beam contacts the substrate 300 g.
- Laser machine 1102 further includes a controller 1120 coupled to laser source 1106 , stage 1112 , and galvanometer 1116 .
- Controller 1120 can comprise a processor for executing computer readable instructions contained on one or more of hardware, software, and firmware. Controller 1120 can control laser source 1106 , stage 1112 and/or galvanometer 1116 to form feature 905 b . Other embodiments may control some or all of the processes manually or with a combination of controllers and manual operation.
- laser beam 1108 is forming feature 905 b into substrate 300 g .
- Feature 905 b is formed with stage 1112 orienting substrate's first surface 302 g generally transverse to laser beam 1108 .
- Feature 905 b extends along a bore axis which is generally transverse to first surface 302 g .
- the bore axis of feature 905 b can be represented by laser beam 1108 proximate the substrate.
- FIG. 11 b illustrates a subsequent process step where stage 1112 has repositioned substrate 300 g to form feature 905 c .
- stage 1112 can orient substrate 300 g at an angle ⁇ less than 90 degrees relative to laser beam 1108 .
- Various embodiments can utilize angles ranging from about 10 degrees to about 80 degrees.
- angle ⁇ can range from about 60 degrees to about 80 degrees.
- angle ⁇ can range from about 40 degrees to about 59 degrees.
- angle ⁇ can range from about 20 degrees to about 39 degrees.
- angle ⁇ comprises about 70 degrees.
- adjustments can be made to stage 1112 , lens 1118 and/or galvanometer 1116 to maintain focus of the laser beam on the substrate.
- FIG. 11 b illustrates one exemplary configuration where stage 1112 and substrate 300 g are angled relative to laser beam 1108
- other exemplary configurations may angle the laser beam and/or laser machine relative to the substrate to achieve a desired orientation.
- Still other embodiments may angle both the laser beam and the substrate to achieve a desired orientation of the laser beam to the substrate.
- FIG. 11 c illustrates a further process step forming another feature 905 d .
- Stage 1112 repositioned substrate 300 g relative to laser beam 1108 to form feature 905 d having a desired orientation.
- the skilled artisan should recognize other suitable configurations.
Abstract
The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
Description
- Many microdevices include substrates having features formed therein. Existing feature shapes, dimensions, and/or orientations can limit microdevice design.
- The same components are used throughout the drawings to reference like features and components wherever feasible. Alphabetic suffixes are utilized to designate different embodiments.
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FIG. 1 illustrates a front elevational view of a diagrammatic representation of an exemplary printer in accordance with one exemplary embodiment. -
FIG. 2 illustrates a perspective view of a diagrammatic representation of a print cartridge suitable for use in the exemplary printer shown inFIG. 1 in accordance with one exemplary embodiment. -
FIGS. 3-3 a illustrate diagrammatic representations of a cross-sectional view of a portion of an exemplary print cartridge. -
FIG. 4 illustrates a diagrammatic representation of a cross-sectional view of an exemplary substrate in accordance with one exemplary embodiment. -
FIGS. 4 a-4 b illustrate diagrammatic representations of top and bottom views respectively of the substrate illustrated inFIG. 4 in accordance with one embodiment. -
FIG. 5 illustrates a diagrammatic representation of a perspective view of a portion of a print cartridge in accordance with one exemplary embodiment. -
FIG. 6 illustrates a diagrammatic representation of a top view of an exemplary substrate in accordance with one exemplary embodiment. -
FIG. 6 a illustrates a diagrammatic representation of a perspective cut-away view of the exemplary substrate illustrated inFIG. 6 in accordance with one exemplary embodiment. -
FIG. 6 b illustrates_a diagrammatic representation of a cross-sectional view of the exemplary substrate illustrated inFIG. 6 in accordance with one exemplary embodiment. -
FIG. 6 c illustrates a_diagrammatic representation of a cross-sectional view of an alternative configuration of the view represented inFIG. 6 b in accordance with one exemplary embodiment. -
FIG. 7 illustrates a diagrammatic representation of a cross-sectional view of an exemplary substrate in accordance with one exemplary embodiment. -
FIG. 8 illustrates a diagrammatic representation of a perspective view of an exemplary substrate in accordance with one exemplary embodiment. -
FIGS. 8 a-8 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment. -
FIGS. 9 a-9 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment. -
FIGS. 10 a-10 b illustrate a diagrammatic representation of cross-sectional views of an exemplary substrate in accordance with one exemplary embodiment. -
FIGS. 11 a-11 c illustrate process steps for forming an exemplary substrate in accordance with one exemplary embodiment. - The embodiments described below pertain to methods and systems for forming features in a substrate and to microdevices incorporating such substrates. Feature(s) can have various configurations including blind features and through features. A blind feature passes through less than an entirety of the substrate's thickness. A feature which extends totally through the thickness becomes a through feature. A blind feature may be further processed into a through feature during subsequent processing steps.
- Exemplary substrates having features formed therein can be utilized in various microdevices such as microchips and fluid-ejecting devices among others. Fluid-ejecting devices such as print heads are utilized in printing applications. Fluid-ejecting devices also are utilized in medical and laboratory applications among others. Exemplary substrates also can be utilized in various other applications. For example, display devices may comprise features formed into a glass substrate to create a visual display.
- Several embodiments are provided below where the features comprise fluid-handling slots (“slots”). These techniques can be applicable equally to other types of features formed into a substrate.
- Slotted substrates can be incorporated into fluid ejection devices such as ink jet print heads and/or print cartridges, among other uses. The various components described below may not be illustrated to scale. Rather, the included figures are intended as diagrammatic representations to illustrate to the reader various inventive principles that are described herein.
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FIG. 1 shows a diagrammatic representation of an exemplary printing device that can utilize an exemplary print cartridge. In this embodiment the printing device comprises aprinter 100. The printer shown here is embodied in the form of an inkjet printer. Theprinter 100 can be capable of printing in black-and-white and/or color. The term “printing device” refers to any type of printing device and/or image forming device that employs slotted substrate(s) to achieve at least a portion of its functionality. Examples of such printing devices can include, but are not limited to, printers, facsimile machines, and photocopiers. In this exemplary printing device the slotted substrates comprise a portion of a print head which is incorporated into a print cartridge, an example of which is described below. -
FIG. 2 shows a diagrammatic representation of anexemplary print cartridge 202 that can be utilized in an exemplary printing device. The print cartridge is comprised of aprint head 204 and acartridge body 206 that supports the print head. Though asingle print head 204 is employed on thisprint cartridge 202 other exemplary configurations may employ multiple print heads on a single print cartridge. -
Print cartridge 202 is configured to have a self-contained fluid or ink supply withincartridge body 206. Other print cartridge configurations may alternatively or additionally be configured to receive fluid from an external supply. Other exemplary configurations will be recognized by those of skill in the art. Though the term ink is utilized below, it should be understood that fluid-ejecting devices can deliver a diverse range of fluids. - Reliability of
print cartridge 202 is desirable for proper functioning ofprinter 100. Further, failure of print cartridges during manufacture increases production costs. Print cartridge failure can result from a failure of the print cartridge components. Such component failure can be caused by cracking. As such, various embodiments described below can provide print heads with a reduced propensity to crack. - Reliability of
print cartridge 202 also can be affected by bubbles contained within the print cartridge, especially within theprint head 204. Among other origins, bubbles can be formed in the ink as a byproduct of operation of a printing device. For example, bubbles can be formed as a byproduct of the ejection process in the printing device's print cartridge when ink is ejected from one or more firing chambers of the print head. - If bubbles accumulate within the print head the bubbles can occlude ink flow to some or all of the firing chambers and can cause the print head to malfunction. Some embodiments can evacuate bubbles from the print head to decrease the likelihood of such a malfunction as will become apparent below.
- An additional desire in designing print cartridges, is the reduction of their cost. One way to reduce such cost, is to reduce the dimensions, and therefore the material and fabrication costs, of
print head 204. -
FIG. 3 illustrates a side-sectional diagrammatic representation of a portion of theexemplary print head 204 as indicated inFIG. 2 .FIG. 3 a illustrates an alternative print head configuration sometimes referred to as an edge feed configuration. - The view of
FIG. 3 is taken transverse an axis normal to first substrate surface (“first surface”) 302, the axis extending into and out of the plane of the page upon whichFIG. 3 appears. In this particular embodiment this axis is the long axis which lies between the first and second surfaces and extends generally parallel to those surfaces. Here asubstrate 300 has a thickness t which extends between afirst surface 302 and a second substrate surface (“second surface”) 303. In this embodiment threefeatures 305 a-c comprising fluid-feed slots (“slots”) pass throughsubstrate 300 between first andsecond surfaces FIGS. 9 a-9 b andFIGS. 10 a-10 b. - In this particular embodiment,
substrate 300 comprises silicon which either can be doped or undoped. Other substrate materials can include, but are not limited to, gallium arsenide, gallium phosphide, indium phosphide, glass, quartz, ceramic or other material. - Substrate thickness t can have any suitable dimensions that are appropriate for an intended application. In some embodiments substrate thicknesses t can range from less than 100 microns to more than 2000 microns. One exemplary embodiment can utilize a substrate that is approximately 675 microns thick. Though a single substrate is discussed herein, other suitable embodiments may comprise a substrate that has multiple layers during fabrication and/or in the finished product. For example, one such embodiment may employ a substrate having a first component and a second sacrificial component which is discarded at some point during processing.
- In this particular embodiment, one or more thin-
film layers 314 are positioned over substrate'ssecond surface 303. In at least some embodiments, wheresubstrate 300 is incorporated into a fluid ejection device, abarrier layer 316 and an orifice plate ororifice layer 318 are positioned over the thin-film layers 314. - In one embodiment one or more thin-
film layers 314 can comprise one or more conductive traces (not shown) and electrical components such as transistors (not shown), andresistors 320. Individual resistors can be controlled selectively via the electrical traces. Thin-film layers 314 also can at least partially define in some embodiments, a wall or surface of multiple fluid-feed passageways 322 through which fluid can pass. Thin-film layers 314 also can comprise among others, a field or thermal oxide layer.Barrier layer 316 can define, at least in part, multiple firingchambers 324. In some embodiments fluid-feed passageways 322 may be defined inbarrier layer 316, alone or in combination with thin-film layers 314.Orifice layer 318 can definemultiple firing nozzles 326. Individual firing nozzles can be aligned respectively withindividual firing chambers 324. -
Barrier layer 316 andorifice layer 318 can be formed in any suitable manner. In one particular implementation bothbarrier layer 316 andorifice layer 318 comprise thick-film material, such as a photo-imagable polymer material. The photo-imagable polymer material can be applied in any suitable manner. For example, the material can be “spun-on” as will be recognized by the skilled artisan. - After being spun-on,
barrier layer 316 then can be patterned to form, at least in part, desired features such as passageways and firing chambers therein. In one embodiment patterned areas of the barrier layer can be filled with a sacrificial material in what is commonly referred to as a ‘lost wax’ process. In thisembodiment orifice layer 318 can be comprised of the same material as the barrier layer and can be formed overbarrier layer 316. In one such example orifice layer material can be ‘spun-on’ over the barrier layer.Orifice layer 318 then can be patterned as desired to formnozzles 326 overrespective chambers 324. The sacrificial material then can be removed from the barrier layer'schambers 324 andpassageways 322. - In another embodiment,
barrier layer 316 comprises a thick-film, while theorifice layer 318 comprises an electroformed nickel or other suitable metal material. Alternatively the orifice layer can be a polymer, such as “Kapton” or “Oriflex”, with laser ablated nozzles. Other suitable embodiments may employ an orifice layer which performs the functions of both a barrier layer and an orifice layer. - A
housing 330 ofcartridge body 206 can be positioned over substrate'sfirst surface 302. In some embodiments,housing 330 can comprise a polymer, ceramic and/or other suitable material(s). An adhesive, though not specifically shown, may be utilized to bond or otherwise joinhousing 330 tosubstrate 300. - In operation, a fluid, such as ink, can enter
slots 305 a-c from thecartridge body 206. Fluid then can flow throughindividual passageways 322 into anindividual firing chamber 324. Fluid can be ejected from the firing chamber when an electrical current is passed through anindividual resistor 320 or other ejection means. The electrical current can heat the resistor sufficiently to heat some of the fluid contained in the firing chamber to its boiling point so that it expands to eject a portion of the fluid from a respectively positionednozzle 326. The ejected fluid then can be replaced by additional fluid frompassageway 322. - As represented in
FIG. 3 a,slot 305 b 1 extends between first andsecond surfaces Slots second surface 303 from first andsecond sidewalls -
FIG. 4 illustrates a diagrammatic representation ofsubstrate 300 illustrated inFIG. 3 . In this embodiment eachslot 305 a-c extends throughsubstrate 300 along a bore axis b1, b2, and b3 respectively. A bore axis intersects the first and second surfaces and can generally correspond to a direction of intended fluid flow through the slot. Slot 305 b extends along bore axis b2 which is transverse tosecond surface 303.Slots second surface 303.Individual slots second surface 303. - Angles α1, α2 can comprise any angle less than 90 degrees relative to
second surface 303 with some embodiments having a value in the range of 10 degrees to 80 degrees. In some embodiments angles α1, α2 can range from about 60 degrees to about 80 degrees. In other embodiments angles α1, α2 can range from about 40 degrees to about 59 degrees. In still other embodiments angles α1, α2 can range from about 20 degrees to about 39 degrees. In this particular embodiment angles α1, α2 each comprise about 62 degrees, another particular embodiment has angles of about 45 degrees. Though in this embodiment angles α1, α2 comprise similar values, other embodiments may have dissimilar values. For example in an alternative embodiment angle α1 can have a value of 45 degrees while angle α2 has a value of 55 degrees. Having one or more angled slots can allow greater options in print cartridge design, as well in the design of other microdevices, as will be described in more detail below. - In this
embodiment slots second surface 303 when viewed transverse the long axis. Alternatively or additionally, other embodiments may be angled relative tosecond surface 303 when viewed along the long axis. Examples of such a configuration will be described in more detail below in relation toFIGS. 8-8 b. Embodiments having one or more angled slots can allow greater design flexibility. For example, angled slots can allow a first geometry atfirst surface 302 and a second different geometry atsecond surface 303. -
FIGS. 4 a and 4 b illustrate top views of substrate'sfirst surface 302 andsecond surface 303 respectively. In thisembodiment slots 305 a-305 c define afirst footprint 402 a atfirst surface 302 and a seconddifferent footprint 402 b atsecond surface 303.First footprint 402 a defines a first area whilesecond footprint 402 b defines a second area. In some embodiments the first area can be at least about 10 percent greater than the second area. In this particular embodiment first area is about 20 percent greater than second area. Further, in this embodiment the increased area is due predominately to a greater width wa offootprint 402 a when compared to width wb offootprint 402 b. -
FIG. 5 shows a cut-away perspective view of a portion of another exemplary print cartridge 202 a.Substrate 300 a is positionedproximate housing 330 a in an orientation in which the two components might be bonded together to form print cartridge 202 a. In this embodiment threeslots 305 d-305 f are defined, at least in part, by substrate material remaining between the slots. This substrate material remaining between the slots is referred to herein as “beam(s)” 502 a-502 d which extend generally parallel to the long axis of the slots.Beams 502 a and 502 d can be referred to as external beams as they define a slot on one side and a substrate edge on the other. Similarly, beams 502 b-502 c can be referred to as internal beams as they define slots on two sides. Beams 502 a-502 d have widths w1-w4 respectively atfirst surface 302 a as measured transverse the slots' long axes. - Some print cartridge designs achieve effective integration of
substrate 300 a withcartridge body housing 330 a by maintaining the widest possible beam width of the substrate's narrowest beam relative tofirst surface 302 a. Such a configuration can among other factors aid in moldingcartridge body housing 330 a. In this illustrated embodiment beam widths w1-w4 are generally equal. - Beams 502 a-502 d also define widths w5-w8 respectively at
second surface 303 a as measured transverse the slots' long axes. Some print cartridge designs configure substrate'ssecond surface 303 a so thatexternal beams 502 a, 502 d are relatively wider thaninternal beams second surface 303 a on the external beams. As shown inFIG. 5 print head substrate 300 a incorporating one or more angled slots can achieve both a desired first surface configuration and a desired second surface configuration. Further,internal beams substrate 300 a are stronger and less likely to crack than a configuration where second surface widths w6, W7 are maintained through the substrate' thickness t. - The embodiment shown in
FIG. 5 has generally continuous slots when viewed along the long axis. Other embodiments may have substrate material or ‘ribs’ extending across the substrate's long axis from a beam defining one side of a slot to another beam defining an opposing side of the slot. -
FIGS. 6-6 c illustrate one example whereribs 602 extend generally across an axis ofslots 305 g-305 i.FIG. 6 illustrates a top view of substrate'ssecond surface 303 b.FIG. 6 a illustrates a cut-away view ofsubstrate 300 b as indicated inFIG. 6 .FIGS. 6 b-6 c illustrate views taken generally orthogonally to the y-axis which provide two exemplary rib configurations. - As illustrated in
FIGS. 6-6 aribs 602 extend betweenbeams FIG. 6 b illustratesrib 602 illustrated inFIG. 6 a in a little more detail, whileFIG. 6 c comprises a view similar to that illustrated inFIG. 6 b of another exemplary rib configuration. -
FIG. 6 b illustrates an embodiment whererib 602 tapers from a first width w1 proximatefirst surface 302 b to a second width w2 proximatesecond surface 303 b. This is but one exemplary configuration. For example other embodiments may maintain a generally uniform width between the first and second surfaces. In thisinstance rib 602 can approximate a frustrum. Such a configuration may supply generally uniform fluid flow to various chambers, described above, which can be supplied byslot 305 g. Other embodiments may utilize other rib shapes. In the embodiment illustrated inFIGS. 6 a-6 b height h ofrib 602 equals thickness t ofsubstrate 300 b. -
FIG. 6 c illustrates an alternative configuration where rib height h is less than thickness t. In thisparticular instance rib 602 a extends fromfirst surface 302 b but does not reachsecond surface 303 b. Configurations which utilize a height h less than thickness t may contribute to a uniform fluid environment for various chambers supplied byslot 305 g. -
FIG. 7 illustrates a cross-sectional representation of anotherexemplary substrate 300 c. This cross-sectional view is similar to the view illustrated inFIG. 4 and is transverse the long axis. Twoslots substrate 300 c along bores b4, b5 respectively which are not transverse tofirst surface 302 c. In this instance bores b4, b5 intersect midpoints of widths w8, w9 and w10, w11 respectively. - In this
embodiment slot 305 j is defined, at least in part, by afirst sidewall 702 a and asecond sidewall 702 b. Similarly, slot 305 k is defined, at least in part, by afirst sidewall 702 c and asecond sidewall 702 d. - During operation of a print
cartridge incorporating substrate 300 c bubbles may occur. Some of the described embodiments can allow a bubble to evacuate more readily from the print head compared to a traditional print head design. In this particular embodiment, a bubble is indicated generally at 704. Buoyancy forces acting uponbubble 704 are directed along the z-axis. Fluid flow along bore b5 can be represented as a vector having both y-axis and z-axis components. Generally only the z-axis component of the fluid flow acts against the bubble's buoyancy forces and the bubble is more likely to migrate towardfirst surface 302 c and ultimately from the slot. In someinstances bubble 704 may migrate towardfirst sidewall 702 c and then up the first sidewall towardfirst surface 302 c. - Where multiple bubbles occur the bubbles may migrate toward and up
first sidewall 702 c. Following a common path may tend to force the bubbles together leading to agglomeration. If the bubbles agglomerate they may pass out of the slot more quickly than they otherwise would. Agglomeration may assist with bubble removal because the buoyant force acts to move the bubble upwards against the ink flow. This buoyant force may become increasingly dominant as the bubbles agglomerate and grow because it increases with the cube of the bubble diameter whereas the drag force induced by the downward ink flow increases only with the square of the bubble diameter. - As represented in
FIG. 7 width w8 ofslot 305 j atfirst surface 302 c is greater than width w9 atsecond surface 303 c. Similarly, width w10 ofslot 305 k atfirst surface 302 c is greater than width w11 atsecond surface 303 c. In thisembodiment slots second surface 303 c towardfirst surface 302 c. As such ifbubble 704 has a volume sufficient to contact bothsidewalls first surface 302 c can provide a driving force to movebubble 704 toward thefirst surface 302 c and ultimately out of the print head. -
FIGS. 8-8 b represent anothersubstrate 300 d.FIG. 8 represents a perspective view, whileFIG. 8 a represents a cross-sectional view taken along line a-a indicated inFIG. 8 andFIG. 8 b represents a cross-sectional view taken along line b-b. In this embodiment line a-a is generally parallel to a long axis ofslot 3051 and line b-b is generally orthogonal the long axis. - In this embodiment, when viewed along its
long axis slot 3051 generally approximates a portion of aparallelogram 804 as best can be appreciated fromFIG. 8 a. Also, in thisparticular embodiment slot 3051 approximates a portion of aparallelogram 806 when viewed transverse the long axis as best can be appreciated fromFIG. 8 b. Other slots can approximate other geometric shapes. Various slot shapes can allow increased flexibility of print head design over standard slot configurations. -
FIGS. 9 a-9 b and 10 a-10 b represent exemplary features and process steps for forming the features. In these two embodiments the term feature is employed. The feature may be a bind feature or a through feature comprising a slot. -
FIGS. 9 a-9 b represent cross-sectional views ofsubstrate 300 e.FIG. 9 a represents an intermediary step in forming a feature in the substrate, whileFIG. 9 b represents feature 905 formed insubstrate 300 e. Feature 905 can be utilized as a fluid-handling slot or electrical interconnect, e.g. a via, among other uses.Feature 905 defines a bore axis b7 which is not transversefirst surface 302 e and which intersects a midpoint of the feature width w12, w13 at thefirst surface 302 e and thesecond surface 303 e respectively. -
Feature 905 is defined, at least in part, by one or more sidewalls. In this embodiment twosidewalls individual sidewalls first sidewall portion first surface 302 e. Further in this embodimentindividual sidewalls different sidewall portion - Feature 905 can be formed with one or more substrate removal techniques. Examples of suitable substrate removal techniques are described below in relation to
FIGS. 11 a-11 c. One suitable formation method can involve removing substrate material fromsecond surface 303 e as indicated generally at 910. The substrate removal process indicated at 910 can formfirst sidewall portions sidewall portions first surface 302 e,second surface 303 e or a combination thereof. Other embodiments may conduct the substrate removal process indicated at 912 before the substrate removal process indicated at 910. -
FIGS. 10 a-10 b show feature 905 a formed insubstrate 300 f. Feature 905 a defines a bore axis b8 which is not transversefirst surface 302 f and intersects a midpoint of the feature width w14, w15 at thefirst surface 302 f and at abottom surface 1000 respectively. In this embodiment feature 905 a can comprise afirst region 1001 a and a second region 1001 b. In some embodiments the tworegions 1001 a, 1001 b can be formed in distinct steps or as a single process. - Feature 905 a can be defined, at least in part, by one or more sidewalls. In this embodiment two
sidewalls individual sidewalls first sidewall portion first surface 302 f and lies at a first angle α4 relative tofirst surface 302 f Further in this embodimentindividual sidewalls different sidewall portion first surface 302 f. These exemplary sidewall configurations can allow greater microdevice design flexibility. -
FIGS. 11 a-11 c show process steps for forming an exemplary feature in a substrate. -
FIG. 11 a, illustrates alaser machine 1102 for removing substrate material sufficient to form feature 905 b in a substrate. Feature 905 b generally can approximate a circle, an ellipsoid, a rectangle, or any other desired shape whether regular or irregular. For purposes of explanation, anindividual substrate 300 g is illustrated here. Other embodiments may act upon a wafer or other material which subsequently can be separated or can be diced into individual substrates. - In this embodiment,
laser machine 1102 comprises alaser source 1106 configured to generatelaser beam 1108 forlaser machining substrate 300 g. Exemplary laser beams such aslaser beam 1108 can provide sufficient energy to energize substrate material at which the laser beam is directed. Energizing can comprise melting, vaporizing, exfoliating, phase exploding, ablating, reacting, and/or a combination thereof, among others processes. Some exemplary laser machines may utilize a gas assist and/or liquid assist process to aid in substrate removal. - In this
embodiment substrate 300 g is positioned on a fixture orstage 1112 for processing. Suitable fixtures should be recognized by the skilled artisan. Some such fixtures may be configured to move the substrate along x, y, and/or z coordinates. - Various exemplary embodiments can utilize one or
more mirrors 1114,galvanometers 1116 and/orlenses 1118 to directlaser beam 1108 atfirst surface 302 g. In some embodiments,laser beam 1108 can be focused in order to increase its energy density to machine the substrate more effectively. In these exemplary embodiments the laser beam can be focused to achieve a desired beam geometry where the laser beam contacts thesubstrate 300 g. -
Laser machine 1102 further includes acontroller 1120 coupled tolaser source 1106,stage 1112, andgalvanometer 1116.Controller 1120 can comprise a processor for executing computer readable instructions contained on one or more of hardware, software, and firmware.Controller 1120 can controllaser source 1106,stage 1112 and/orgalvanometer 1116 to form feature 905 b. Other embodiments may control some or all of the processes manually or with a combination of controllers and manual operation. - As illustrated in
FIG. 11 a,laser beam 1108 is formingfeature 905 b intosubstrate 300 g. Feature 905 b is formed withstage 1112 orienting substrate'sfirst surface 302 g generally transverse tolaser beam 1108. Feature 905 b extends along a bore axis which is generally transverse tofirst surface 302 g. In this instance the bore axis offeature 905 b can be represented bylaser beam 1108 proximate the substrate. -
FIG. 11 b illustrates a subsequent process step wherestage 1112 has repositionedsubstrate 300 g to form feature 905 c. In thisembodiment stage 1112 can orientsubstrate 300 g at an angle β less than 90 degrees relative tolaser beam 1108. Various embodiments can utilize angles ranging from about 10 degrees to about 80 degrees. In some embodiments angle β can range from about 60 degrees to about 80 degrees. In other embodiments angle β can range from about 40 degrees to about 59 degrees. In still other embodiments angle β can range from about 20 degrees to about 39 degrees. In this particular embodiment angle β comprises about 70 degrees. During laser machining, adjustments can be made to stage 1112,lens 1118 and/orgalvanometer 1116 to maintain focus of the laser beam on the substrate. This process can be utilized to form blind features and/or through features. ThoughFIG. 11 b illustrates one exemplary configuration wherestage 1112 andsubstrate 300 g are angled relative tolaser beam 1108, other exemplary configurations may angle the laser beam and/or laser machine relative to the substrate to achieve a desired orientation. Still other embodiments may angle both the laser beam and the substrate to achieve a desired orientation of the laser beam to the substrate. -
FIG. 11 c illustrates a further process step forming another feature 905 d.Stage 1112 repositionedsubstrate 300 g relative tolaser beam 1108 to form feature 905 d having a desired orientation. The skilled artisan should recognize other suitable configurations. - Although specific structural features and methodological steps are described, it is to be understood that the inventive concepts defined in the appended claims are not necessarily limited to the specific features or steps described. Rather, the specific features and steps are disclosed as forms of implementation of the inventive concepts.
Claims (50)
1. A microdevice comprising:
a substrate having a first substrate surface and a generally opposing second substrate surface; and,
multiple features formed through the substrate between the first surface and the second surface, wherein at least one feature extends into and out of the substrate along a bore axis, and wherein the bore axis is not transverse to the first surface.
2. The microdevice of claim 1 , wherein at least some of the multiple features comprise electrical interconnects.
3. The microdevice of claim 1 , wherein at least some of the multiple features comprise fluid-handling slots.
4. The microdevice of claim 1 , wherein at least some features extend within the substrate along a long axis and have a generally uniform width between the first surface and the second surface as measured transverse to the long axis.
5. The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle of less than 90 degrees relative to a plane of the first surface.
6. The microdevice of claim 1 , wherein the at least one features extends along a long axis that defines an angle in a range of 10 degrees to 80 degrees relative to a plane the first surface.
7. The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle of less than 90 degrees relative to a plane of the first surface.
8. The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle in a range of 10 degrees to 80 degrees relative to a plane of the first surface.
9. The microdevice of claim 1 , wherein a first feature of the multiple features has a bore axis that is transverse to the first surface and a second feature of the multiple features has a bore axis that is not transverse to the first surface.
10. The microdevice of claim 1 , wherein an individual feature of the multiple features extends between the first surface and the second surface along a long axis that is generally parallel to the first surface, wherein a cross-sectional area of the individual feature is substantially a parallelogram.
11. The microdevice of claim 1 embodied as a print head.
12. A microdevice comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and,
at least one feature formed into the substrate along a bore axis that is not transverse to the first surface and is not parallel to the first surface.
13. The microdevice of claim 12 , wherein the feature is formed in a substrate sidewall surface.
14. The microdevice of claim 13 , wherein the feature extends between the substrate sidewall surface and the first surface.
15. The microdevice of claim 13 , wherein the substrate sidewall surface is oriented obliquely to the first substrate surface.
16. The microdevice of claim 13 , wherein the substrate sidewall surface extends between the first substrate surface and the second substrate surface.
17. The microdevice of claim 12 , wherein the feature is defined by at least one sidewall and wherein a first portion of the sidewall is generally transverse the first surface and a second different portion of the sidewall is not transverse the first surface.
18. The microdevice of claim 12 , wherein the feature is defined by at least one sidewall and wherein a first portion of the sidewall and a second portion of the sidewall are not transverse the first surface, and the first portion lies at a first angle relative the first surface and the second portion lies at a second different angle.
19. The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates an ellipsoid at the first surface.
20. The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates a rectangle at the first surface.
21. The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates a regular geometric shape at the first surface.
22. The microdevice of claim 12 , wherein the feature extends between the first surface and the second surface.
23. The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 10 degrees to about 80 degrees relative to the first surface.
24. The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 60 degrees to about 80 degrees relative to the first surface.
25. The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 40 degrees to about 59 degrees relative to the first surface.
26. The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 20 degrees to about 39 degrees relative to the first surface.
27. The microdevice of claim 12 embodied as a display device.
28. The microdevice of claim 12 embodied as an integrated circuit.
29. A microdevice comprising:
a substrate defined at least in part by a first substrate surface; and,
at least one feature formed into the substrate along a bore axis that is not transverse to the first surface and is not parallel to the first surface.
30. The microdevice of claim 29 , wherein the feature is formed in the first surface.
31. The microdevice of claim 29 , wherein the feature extends between the first surface and a second surface.
32. The microdevice of claim 31 , wherein the second surface is oriented obliquely to the first surface.
33. The microdevice of claim 31 , wherein the second surface is oriented orthogonally to the first surface.
34. A print head comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and,
multiple fluid-handling slots formed through the substrate between the first surface and the second surface, wherein at the first surface the multiple slots define a first footprint having a first area and wherein at the second surface the multiple slots define a second footprint having a second area, and wherein the first area is at least about 10 percent greater than the second area.
35. The print head of claim 34 , wherein the first footprint has a first width taken orthogonally to a long axis of the slots and the second footprint has a second width taken orthogonally to the long axis of the slots, and wherein the first width is at least about 10 percent greater than the second width.
36. The print head of claim 35 , wherein the first width is at least about 20 percent greater than the second width.
37. A fluid-ejecting device comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and,
at least one fluid-handling slot extending between the first surface and the second surface along a long axis that is generally parallel to the first surface, wherein when viewed transverse the long axis the slot has a first width at the first surface defining a first midpoint and a second width at the second surface defining a second midpoint and wherein a line intersecting the first midpoint and the second midpoint is not orthogonal to the first surface.
38. The fluid-ejecting device of claim 37 , wherein the first width is greater than the second width.
39. The fluid-ejecting device of claim 38 , wherein the at least one slot has a slot profile when viewed transverse the long axis that generally tapers from the second surface to the first surface.
40. A microdevice forming method comprising:
removing substrate material from a first surface of a substrate to form a feature therein, and,
wherein the feature extends along a bore axis that is not transverse the first surface.
41. The method of claim 40 , further comprising removing substrate material from a second substrate surface which in combination with said removing substrate material from a first surface forms the feature.
42. The method of claim 41 , wherein said removing substrate material from a second substrate surface occurs prior to said removing substrate material from a first surface.
43. The method of claim 41 , wherein said removing substrate material from a second substrate surface comprises one or more of etching, sawing and laser machining and said removing substrate material from a first surface comprises one or more of etching, sawing and laser machining.
44. The method of claim 40 , wherein the removing comprises laser machining the substrate at least in part by directing a laser beam at the substrate at a first angle relative to the first surface and then directing the laser beam at a second different angle relative to the first surface.
45. The method of claim 40 , wherein the removing comprises laser machining the substrate at least in part by directing a laser beam at the substrate at a first angle relative to the first surface and from a direction sufficient to contact the first surface before contacting a second surface and then directing the laser beam at a second different angle relative to the first surface and from a direction sufficient to contact the second surface before contacting the first surface.
46. The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 10 degrees to about 80 degrees relative to the first surface.
47. The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 60 degrees to about 80 degrees relative to the first surface.
48. The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 40 degrees to about 59 degrees relative to the first surface.
49. The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 20 degrees to about 39 degrees relative to the first surface.
50. The method of claim 40 , wherein the removing forms the feature extending between the first surface and a generally opposing second surface.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/817,716 US20050219327A1 (en) | 2004-03-31 | 2004-03-31 | Features in substrates and methods of forming |
TW094106036A TWI357883B (en) | 2004-03-31 | 2005-03-01 | Features in substrates and methods of forming |
EP08075905A EP2042323A1 (en) | 2004-03-31 | 2005-03-29 | Features in substrates and methods of forming |
PCT/US2005/010430 WO2005097506A2 (en) | 2004-03-31 | 2005-03-29 | Features in substrates and methods of forming |
JP2007506450A JP2007531645A (en) | 2004-03-31 | 2005-03-29 | Features in a substrate and method for forming the same |
KR1020067020191A KR101099952B1 (en) | 2004-03-31 | 2005-03-29 | Features in substrates and methods of forming |
CN2005800101158A CN1938158B (en) | 2004-03-31 | 2005-03-29 | Printing head and fluid jet device |
EP05731317A EP1729966A2 (en) | 2004-03-31 | 2005-03-29 | Features in substrates and methods of forming |
US11/803,179 US7833426B2 (en) | 2004-03-31 | 2007-05-11 | Features in substrates and methods of forming |
JP2009252060A JP4970524B2 (en) | 2004-03-31 | 2009-11-02 | Method for forming a fluid ejection microdevice and method for forming an inkjet printhead |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/817,716 US20050219327A1 (en) | 2004-03-31 | 2004-03-31 | Features in substrates and methods of forming |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/803,179 Division US7833426B2 (en) | 2004-03-31 | 2007-05-11 | Features in substrates and methods of forming |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050219327A1 true US20050219327A1 (en) | 2005-10-06 |
Family
ID=34964324
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/817,716 Abandoned US20050219327A1 (en) | 2004-03-31 | 2004-03-31 | Features in substrates and methods of forming |
US11/803,179 Expired - Fee Related US7833426B2 (en) | 2004-03-31 | 2007-05-11 | Features in substrates and methods of forming |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/803,179 Expired - Fee Related US7833426B2 (en) | 2004-03-31 | 2007-05-11 | Features in substrates and methods of forming |
Country Status (7)
Country | Link |
---|---|
US (2) | US20050219327A1 (en) |
EP (2) | EP2042323A1 (en) |
JP (2) | JP2007531645A (en) |
KR (1) | KR101099952B1 (en) |
CN (1) | CN1938158B (en) |
TW (1) | TWI357883B (en) |
WO (1) | WO2005097506A2 (en) |
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Also Published As
Publication number | Publication date |
---|---|
TWI357883B (en) | 2012-02-11 |
TW200540100A (en) | 2005-12-16 |
KR101099952B1 (en) | 2011-12-28 |
JP2007531645A (en) | 2007-11-08 |
WO2005097506A3 (en) | 2006-02-16 |
EP1729966A2 (en) | 2006-12-13 |
CN1938158A (en) | 2007-03-28 |
US7833426B2 (en) | 2010-11-16 |
US20070210031A1 (en) | 2007-09-13 |
CN1938158B (en) | 2010-04-21 |
JP4970524B2 (en) | 2012-07-11 |
JP2010018042A (en) | 2010-01-28 |
EP2042323A1 (en) | 2009-04-01 |
WO2005097506A2 (en) | 2005-10-20 |
KR20060131936A (en) | 2006-12-20 |
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