US20050199373A1 - Heat sink for an electronic power component - Google Patents
Heat sink for an electronic power component Download PDFInfo
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- US20050199373A1 US20050199373A1 US11/075,530 US7553005A US2005199373A1 US 20050199373 A1 US20050199373 A1 US 20050199373A1 US 7553005 A US7553005 A US 7553005A US 2005199373 A1 US2005199373 A1 US 2005199373A1
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- tube
- heat sink
- powder
- opening
- cooling liquid
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- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000002955 isolation Methods 0.000 claims abstract description 18
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical group N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000009702 powder compression Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract 1
- 239000002470 thermal conductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink for an electronic power component, for example, a thyristor, a triac, a MOS power transistor, or an insulated gate bipolar transistor (IGBT). More specifically, the present invention relates to a heat sink in which a cooling liquid is circulated to carry off calories provided by the electronic power component.
- an electronic power component for example, a thyristor, a triac, a MOS power transistor, or an insulated gate bipolar transistor (IGBT).
- IGBT insulated gate bipolar transistor
- the heat sink must ensure three main functions:
- a conventional heat sink generally comprises a parallelepipedal body on which is mounted the component to be cooled down, and which is formed of a material with a good thermal conductivity.
- the material forming the heat sink body generally also is a good electric conductor. It generally is metal, for example, copper or aluminum.
- the body is crossed by parallel cylindrical openings containing tubes conducting the cooling liquid.
- each tube is formed of an electric isolator to electrically isolate the cooling liquid from the electronic power component.
- Each tube is separated from the corresponding opening of the heat sink body by a gap filled with a metal alloy, to optimize the thermal exchange between the electronic power component and the cooling liquid.
- each tube must have walls of a thickness greater than a minimum thickness to obtain a sufficient electric isolation and to have a sufficient mechanical hold, especially to simplify the tube handling and assembly. This tends to decrease the thermal conductivity properties of the tube.
- the heat sink may comprise, in each tube, means for guiding the cooling liquid flow in the tube, called a “turbulator”.
- Turbulators enable increasing the local Reynolds coefficient of the cooling liquid flowing in the tubes to increase thermal exchanges between the cooling liquid and the tubes.
- the turbulators are maintained in the associated tubes via screws, which increases the complexity of the assembly of such a heat sink.
- the present invention aims at obtaining a heat sink for an electronic power component comprising a heat sink body, on which the component is assembled, crossed by tubes conducting a cooling liquid flows, the heat sink enabling increasing thermal exchanges between the cooling liquid and the heat sink body.
- Another object of the present invention consists of improving the electric isolation of the cooling liquid with respect to the component.
- Another object of the present invention consists, in the case where the cooling tubes are equipped with turbulators, of easing the turbulator assembly.
- the present invention provides a heat sink comprising a body made of a metallic material having a surface intended to support an electronic power component, the body comprising a plurality of openings axially crossed by tubes of circulation of a cooling liquid, each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.
- each tube is made of metal.
- the compressed powder is a boron nitride and/or aluminum nitride powder.
- the heat sink further comprises, at least in a tube, guiding means intended to accelerate the cooling liquid flow in contact with the tube are made of a material with a good thermal conductivity.
- the guiding means is only maintained by contact with the tube.
- the guiding means comprise a cylindrical portion on the circumference of which extend grooves separated by teeth, the grooves being adapted to the flowing of the cooling liquid, the teeth being in contact with the tube.
- the present invention also provides a method for manufacturing a heat sink, comprising the steps of:
- step b) comprises, for each opening, the arrangement of a tubular jointing sleeve crossed by an orifice at one end of the opening, the tube being maintained in the orifice of the jointing sleeve distantly from the body, the powder being then introduced, at step c), through the ring-shaped gap at the level of the axial end of the opening opposite to the jointing sleeve.
- step d) is followed by the arrangement of an additional tubular sleeve at the level of the end of the opening through which the powder has been introduced.
- the method comprises before step c), the arrangement of guiding means in at least one tube, the powder compression being performed to deform the tube so that it comes into contact with and maintains in place the guiding means.
- FIG. 1 is a simplified perspective view of an example of the forming of a heat sink according to the present invention on which is assembled an electronic power component to be cooled down;
- FIG. 2 is a top view of the heat sink of FIG. 1 ;
- FIG. 3 is a cross-section view of FIG. 2 along line III-III;
- FIG. 4 is an enlargement of a portion of FIG. 3 ;
- FIG. 5 is a cross-section view of FIG. 4 along line V-V;
- FIG. 6 is a simplified perspective view of an example of the forming of a turbulator.
- FIG. 1 schematically shows an example of the forming of a heat sink 10 according to the present invention, comprising a parallelepipedal body 12 , formed of a material which is both a good thermal conductor and a good electric conductor, for example, copper or aluminum, on which is attached an electronic power component 14 to be cooled down.
- FIG. 2 is a top view of heat sink 10 .
- Body 12 is crossed by parallel openings, not visible in FIG. 2 , of circular cross-section, in which flows a cooling liquid, for example, glycol water.
- the circulating of the liquid is ensured by an intake manifold 16 and an exhaust manifold 18 .
- Isolating connections 20 , 21 for example, made of silicon, are provided between body 12 and manifold 16 , 18 .
- FIG. 3 is a cross-section view of FIG. 2 along line III-III formed at the level of an opening 22 crossing body 12 of the heat sink.
- Opening 22 contains a metal tube 24 , for example, made of copper or aluminum, corresponding to a good thermal conductor, which is separated from opening 22 by a gap 26 .
- tube 24 has a radial thickness on the order of 0.5 mm and the gap has a radial thickness on the order of 2 mm.
- Gap 26 contains a compressed powder formed of a material which corresponds to a good electric isolator and to a good thermal conductor.
- the powder may also be formed of a mixture of materials that each correspond to a good electric isolator and to a good thermal conductor. It is for example boron nitride or aluminum nitride.
- Tube 24 comprises a first end portion 28 which prolongs out of opening 22 and which is mounted to intake manifold 16 and a second end portion 30 which prolongs out of opening 22 and which is mounted to exhaust manifold 18 .
- the connection between each end portion 28 , 30 of tube 24 and intake manifold 16 and exhaust manifold 18 may be formed by any known method, for example, by welding or by soldering.
- a portion of end portions 28 , 30 of tube 24 protruding out of body 12 is surrounded with an isolating jointing sleeve 32 , 34 , for example, made of glass fiber, slightly penetrating into opening 24 of body 12 , between tube 24 and body 12 .
- Isolating connections 20 , 21 surround end portions 28 , 30 of tube 24 and a portion of isolating sleeves 34 between body 12 and manifolds 16 , 18 to prevent the forming of electric arcs between body 12 and tube 24 .
- a turbulator 36 having the shape of a full profile, is arranged in tube 24 . Turbulator 36 delimits with the tube ducts 38 , extending along the entire length of opening 22 , conducting the cooling liquid.
- Inlet and exhaust manifolds 16 and 18 comprise internal openings, not shown, arranged to obtain a specific type of flow of the cooling liquid in body 12 of the heat sink.
- intake manifold 16 and exhaust manifold 18 may each comprise an opening into which all tubes 24 emerge so that the cooling liquid simultaneously flows in each tube 24 from intake manifold 16 to exhaust manifold 18 .
- intake manifold 16 and exhaust manifold 18 comprise orifices connecting tubes 24 in pairs so that the cooling liquid zigzags successively from a tube to an adjacent tube.
- FIG. 4 is an enlarged view of a portion of FIG. 3 at the level of an end of tube 24 .
- Opening 22 divides into a main opening 39 of constant circular cross-section which prolongs at each end in an end opening 40 , of larger diameter, connected to main opening 39 by a shoulder 41 .
- Each isolating end sleeve 34 comprises a main tubular portion 42 having its external diameter corresponding to the inner diameter of end opening 40 and having its inner diameter corresponding to the outer diameter of tube 24 .
- Main tubular portion 42 prolongs in a secondary tubular portion 43 having its outer diameter corresponding to the inner diameter of end opening 40 and having its inner diameter substantially corresponding to the inner diameter of main opening 39 .
- Secondary tubular portion 43 abuts against shoulder 41 , a portion of main tubular portion 42 then extending out of opening 22 .
- FIG. 5 is a cross-section view of FIG. 4 along line V-V and FIG. 6 is a perspective view of turbulator 36 .
- Turbulator 36 has the shape of a cylindrical tree of axis D on the circumference of which are distributed teeth 45 which extend parallel to axis D along the entire length of turbulator 36 .
- Passages 38 delimited between turbulator 36 and tube 24 correspond to the grooves between two adjacent teeth 45 .
- Turbulator 36 enables locally increasing the speed of the cooling liquid and thus increasing the local Reynolds coefficient of the cooling liquid which is representative of the thermal exchanges between the cooling liquid and tube 24 and between the cooling liquid and turbulator 36 .
- Turbulator 36 is in contact with tube 24 at the level of the ends of teeth 45 , which causes thermal exchanges between turbulator 36 and tube 24 .
- Turbulator 36 is then advantageously formed of a material with a good thermal conductivity and takes part in the carrying off of the calories provided by the component to be cooled down.
- turbulator 36 may be formed of the same material as tube 24 .
- the cross-section shown in FIG. 5 is particularly advantageous since it enables obtaining a significant thermal exchange surface area between turbulator 36 and tube 24 .
- the cross-section of turbulator 36 is defined according to the flow rate and to the head loss which is desired to be obtained for tube 24 while attempting to bring the thermal exchanges between turbulator 36 and tube 24 to a maximum.
- a hollow turbulator 36 may be provided, the cooling liquid being then able to flow through turbulator 36 and around it.
- teeth 45 may have a helical shape wound around axis D.
- An example of a method for manufacturing heat sink 10 according to the present invention comprises the steps of:
- Inlet and exhaust manifolds 16 and 18 are then fixed to the ends of tubes 24 and isolating connections 20 , 21 are arranged.
- the present invention has many advantages.
- the thermal conductivity criterion is the main criterion to be taken into account in the selection of the material forming tubes 24 .
- the electric isolation criterion is then not to be taken into account. This enables using metal tubes 24 which keep remarkable thermal conductivity properties even for significant thicknesses.
- the radial thickness of the tubes then no longer is a constraint and may be determined only according to the mechanical hold that the tube must have, especially to enable its mounting on the manifolds.
- the compromise between a good electric isolation and a good thermal conductivity concerns the compressed powder arranged between tubes 24 and body 12 of the heat sink. However, since it is a compressed powder, there is no specific mechanical hold constraint as in the case of a conventional heat sink where the tube itself ensures the electric isolation.
- the radial thickness of the gap containing the compressed powder may correspond to the minimum thickness ensuring a proper electric isolation. This enables degrading as little as possible the thermal conductivity of the electric isolation layer formed by the compressed powder.
- the radial thickness of the gap containing the compressed powder of a determined material is smaller than the thickness of a cooling liquid flow tube formed with the same electric isolating material implemented in a conventional heat sink.
- turbulators 36 when turbulators 36 are used, they are in direct contact with associated tubes 24 .
- Each turbulator 36 may then advantageously be formed of a material with a good thermal conductivity to take part in the thermal exchange between the cooling liquid and body 12 of the heat sink.
- turbulators 36 may be metallic.
Abstract
A heat sink comprising a body made of a metallic material with good thermal and electricity conduction properties having a surface intended to support an electronic power component forming a heat source. The body comprises a plurality of openings axially crossed by tubes of circulation of a cooling liquid. Each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.
Description
- 1. Field of the Invention
- The present invention relates to a heat sink for an electronic power component, for example, a thyristor, a triac, a MOS power transistor, or an insulated gate bipolar transistor (IGBT). More specifically, the present invention relates to a heat sink in which a cooling liquid is circulated to carry off calories provided by the electronic power component.
- 2. Discussion of the Related Art
- The heat sink must ensure three main functions:
-
- mechanically mounting the component to be cooled down;
- carrying off calories provided by the component; and
- electrically isolating the component from the cooling liquid.
- A conventional heat sink generally comprises a parallelepipedal body on which is mounted the component to be cooled down, and which is formed of a material with a good thermal conductivity. To ease the component assembly on the component and avoid generation of thermal resistances, the material forming the heat sink body generally also is a good electric conductor. It generally is metal, for example, copper or aluminum. The body is crossed by parallel cylindrical openings containing tubes conducting the cooling liquid.
- French application 2,729,044 filed by Atherm Company describes a heat sink in which each tube is formed of an electric isolator to electrically isolate the cooling liquid from the electronic power component. Each tube is separated from the corresponding opening of the heat sink body by a gap filled with a metal alloy, to optimize the thermal exchange between the electronic power component and the cooling liquid.
- It may however be difficult to find for all tubes a material which provides a convenient compromise between a good electric isolation and a good thermal conductivity. Indeed, each tube must have walls of a thickness greater than a minimum thickness to obtain a sufficient electric isolation and to have a sufficient mechanical hold, especially to simplify the tube handling and assembly. This tends to decrease the thermal conductivity properties of the tube.
- Further, the manufacturing of such a heat sink is relatively complex, especially to ensure a good mounting of the tubes with respect to the heat sink body.
- Further, according to French application 2,729,044, the heat sink may comprise, in each tube, means for guiding the cooling liquid flow in the tube, called a “turbulator”. Turbulators enable increasing the local Reynolds coefficient of the cooling liquid flowing in the tubes to increase thermal exchanges between the cooling liquid and the tubes. The turbulators are maintained in the associated tubes via screws, which increases the complexity of the assembly of such a heat sink.
- The present invention aims at obtaining a heat sink for an electronic power component comprising a heat sink body, on which the component is assembled, crossed by tubes conducting a cooling liquid flows, the heat sink enabling increasing thermal exchanges between the cooling liquid and the heat sink body.
- Another object of the present invention consists of improving the electric isolation of the cooling liquid with respect to the component.
- Another object of the present invention consists, in the case where the cooling tubes are equipped with turbulators, of easing the turbulator assembly.
- To achieve these objects, the present invention provides a heat sink comprising a body made of a metallic material having a surface intended to support an electronic power component, the body comprising a plurality of openings axially crossed by tubes of circulation of a cooling liquid, each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.
- According to an embodiment of the present invention, each tube is made of metal.
- According to an embodiment of the present invention, the compressed powder is a boron nitride and/or aluminum nitride powder.
- According to an embodiment of the present invention, the heat sink further comprises, at least in a tube, guiding means intended to accelerate the cooling liquid flow in contact with the tube are made of a material with a good thermal conductivity.
- According to an embodiment of the present invention, the guiding means is only maintained by contact with the tube.
- According to an embodiment of the present invention, the guiding means comprise a cylindrical portion on the circumference of which extend grooves separated by teeth, the grooves being adapted to the flowing of the cooling liquid, the teeth being in contact with the tube.
- The present invention also provides a method for manufacturing a heat sink, comprising the steps of:
-
- a) providing a heat sink body made of a metallic material having a surface intended to support an electronic power component, the body being crossed by a plurality of openings;
- b) placing in each opening a tube separated from the opening by a ring-shaped gap;
- c) filling each ring-shaped gap with a powder of at least one material with good electric isolation and thermal conduction properties; and
- d) compressing the powder in each gap.
- According to an embodiment of the present invention, step b) comprises, for each opening, the arrangement of a tubular jointing sleeve crossed by an orifice at one end of the opening, the tube being maintained in the orifice of the jointing sleeve distantly from the body, the powder being then introduced, at step c), through the ring-shaped gap at the level of the axial end of the opening opposite to the jointing sleeve.
- According to an embodiment of the present invention, step d) is followed by the arrangement of an additional tubular sleeve at the level of the end of the opening through which the powder has been introduced.
- According to an embodiment of the present invention, the method comprises before step c), the arrangement of guiding means in at least one tube, the powder compression being performed to deform the tube so that it comes into contact with and maintains in place the guiding means.
- The foregoing objects, features, and advantages of the present invention, as well as others, will be discussed in detail in the following non-limiting description of specific embodiments in connection with the accompanying drawings.
-
FIG. 1 is a simplified perspective view of an example of the forming of a heat sink according to the present invention on which is assembled an electronic power component to be cooled down; -
FIG. 2 is a top view of the heat sink ofFIG. 1 ; -
FIG. 3 is a cross-section view ofFIG. 2 along line III-III; -
FIG. 4 is an enlargement of a portion ofFIG. 3 ; -
FIG. 5 is a cross-section view ofFIG. 4 along line V-V; and -
FIG. 6 is a simplified perspective view of an example of the forming of a turbulator. -
FIG. 1 schematically shows an example of the forming of aheat sink 10 according to the present invention, comprising aparallelepipedal body 12, formed of a material which is both a good thermal conductor and a good electric conductor, for example, copper or aluminum, on which is attached anelectronic power component 14 to be cooled down. -
FIG. 2 is a top view ofheat sink 10.Body 12 is crossed by parallel openings, not visible inFIG. 2 , of circular cross-section, in which flows a cooling liquid, for example, glycol water. The circulating of the liquid is ensured by anintake manifold 16 and anexhaust manifold 18. Isolatingconnections body 12 andmanifold -
FIG. 3 is a cross-section view ofFIG. 2 along line III-III formed at the level of an opening 22crossing body 12 of the heat sink. The structure described hereafter is identical for each opening 22 ofbody 12 of the heat sink.Opening 22 contains ametal tube 24, for example, made of copper or aluminum, corresponding to a good thermal conductor, which is separated from opening 22 by agap 26. As an example,tube 24 has a radial thickness on the order of 0.5 mm and the gap has a radial thickness on the order of 2 mm.Gap 26 contains a compressed powder formed of a material which corresponds to a good electric isolator and to a good thermal conductor. The powder may also be formed of a mixture of materials that each correspond to a good electric isolator and to a good thermal conductor. It is for example boron nitride or aluminum nitride. Tube 24 comprises afirst end portion 28 which prolongs out of opening 22 and which is mounted tointake manifold 16 and asecond end portion 30 which prolongs out of opening 22 and which is mounted toexhaust manifold 18. The connection between eachend portion tube 24 andintake manifold 16 andexhaust manifold 18 may be formed by any known method, for example, by welding or by soldering. On either side ofbody 12 of the heat sink, a portion ofend portions tube 24 protruding out ofbody 12 is surrounded with an isolatingjointing sleeve body 12, betweentube 24 andbody 12. Isolatingconnections surround end portions tube 24 and a portion of isolatingsleeves 34 betweenbody 12 andmanifolds body 12 andtube 24. Aturbulator 36, having the shape of a full profile, is arranged intube 24.Turbulator 36 delimits with thetube ducts 38, extending along the entire length ofopening 22, conducting the cooling liquid. - Inlet and
exhaust manifolds body 12 of the heat sink. According to a first example,intake manifold 16 andexhaust manifold 18 may each comprise an opening into which alltubes 24 emerge so that the cooling liquid simultaneously flows in eachtube 24 fromintake manifold 16 toexhaust manifold 18. According to a second example,intake manifold 16 andexhaust manifold 18 compriseorifices connecting tubes 24 in pairs so that the cooling liquid zigzags successively from a tube to an adjacent tube. -
FIG. 4 is an enlarged view of a portion ofFIG. 3 at the level of an end oftube 24.Opening 22 divides into amain opening 39 of constant circular cross-section which prolongs at each end in anend opening 40, of larger diameter, connected tomain opening 39 by ashoulder 41. Each isolatingend sleeve 34 comprises a maintubular portion 42 having its external diameter corresponding to the inner diameter ofend opening 40 and having its inner diameter corresponding to the outer diameter oftube 24. Maintubular portion 42 prolongs in a secondarytubular portion 43 having its outer diameter corresponding to the inner diameter ofend opening 40 and having its inner diameter substantially corresponding to the inner diameter ofmain opening 39.Secondary tubular portion 43 abuts againstshoulder 41, a portion of maintubular portion 42 then extending out ofopening 22. -
FIG. 5 is a cross-section view ofFIG. 4 along line V-V andFIG. 6 is a perspective view ofturbulator 36.Turbulator 36 has the shape of a cylindrical tree of axis D on the circumference of which are distributedteeth 45 which extend parallel to axis D along the entire length ofturbulator 36.Passages 38 delimited betweenturbulator 36 andtube 24 correspond to the grooves between twoadjacent teeth 45.Turbulator 36 enables locally increasing the speed of the cooling liquid and thus increasing the local Reynolds coefficient of the cooling liquid which is representative of the thermal exchanges between the cooling liquid andtube 24 and between the cooling liquid andturbulator 36. -
Turbulator 36 is in contact withtube 24 at the level of the ends ofteeth 45, which causes thermal exchanges betweenturbulator 36 andtube 24.Turbulator 36 is then advantageously formed of a material with a good thermal conductivity and takes part in the carrying off of the calories provided by the component to be cooled down. As an example,turbulator 36 may be formed of the same material astube 24. The cross-section shown inFIG. 5 is particularly advantageous since it enables obtaining a significant thermal exchange surface area betweenturbulator 36 andtube 24. - More generally, the cross-section of
turbulator 36 is defined according to the flow rate and to the head loss which is desired to be obtained fortube 24 while attempting to bring the thermal exchanges betweenturbulator 36 andtube 24 to a maximum. In the case where it is necessary to have a relatively large flow rate run throughtube 24, ahollow turbulator 36 may be provided, the cooling liquid being then able to flow throughturbulator 36 and around it. - Further, it is possible for
turbulator 36 not to have a constant cross-section. As an example,teeth 45 may have a helical shape wound around axis D. - An example of a method for manufacturing
heat sink 10 according to the present invention comprises the steps of: -
- forming
openings 22 inbody 12 of the heat sink; - arranging isolating
sleeves 32 at the level ofend openings 40 ofopenings 22 located on a same side ofbody 12; - arranging
tubes 24 inopenings 22 by inserting an end of eachtube 24 into the corresponding isolatingsleeve tube 24 with respect to opening 22 and definesgap 26; - arranging a
turbulator 36 in eachtube 24. The diameter oftube 24 is then slightly greater than the maximum diameter ofturbulator 36 so thatturbulator 36 is not in contact withtube 24, or very slightly in contact withtube 24. This eases the insertion ofturbulator 36 intotube 24 but requires the use of a system for temporarily holdingturbulator 36; - for each
opening 22, fillinggap 26 with a powder, for example, boron nitride, through the end of opening 22 opposite to previously-arranged isolatingsleeve - compressing the powder with a piston to obtain a compact structure exhibiting the desired thermal conductivity and electric isolation properties. The compression causes a slight deformation of
tube 24 which then contacts turbulator 36; and - arranging isolating
sleeves openings 22 used for the powder introduction.
- forming
- Inlet and
exhaust manifolds tubes 24 and isolatingconnections - The present invention has many advantages.
- First, the thermal conductivity criterion is the main criterion to be taken into account in the selection of the
material forming tubes 24. The electric isolation criterion is then not to be taken into account. This enables usingmetal tubes 24 which keep remarkable thermal conductivity properties even for significant thicknesses. The radial thickness of the tubes then no longer is a constraint and may be determined only according to the mechanical hold that the tube must have, especially to enable its mounting on the manifolds. The compromise between a good electric isolation and a good thermal conductivity concerns the compressed powder arranged betweentubes 24 andbody 12 of the heat sink. However, since it is a compressed powder, there is no specific mechanical hold constraint as in the case of a conventional heat sink where the tube itself ensures the electric isolation. The radial thickness of the gap containing the compressed powder may correspond to the minimum thickness ensuring a proper electric isolation. This enables degrading as little as possible the thermal conductivity of the electric isolation layer formed by the compressed powder. In particular, for equivalent electric isolation performances, the radial thickness of the gap containing the compressed powder of a determined material is smaller than the thickness of a cooling liquid flow tube formed with the same electric isolating material implemented in a conventional heat sink. - Second, when turbulators 36 are used, they are in direct contact with associated
tubes 24. Eachturbulator 36 may then advantageously be formed of a material with a good thermal conductivity to take part in the thermal exchange between the cooling liquid andbody 12 of the heat sink. In particular, turbulators 36 may be metallic. - Third, when turbulators 36 are used, they are maintained by the contact forces between the turbulators and the associated tubes, such contact forces being created on compression of the powder. It is thus not necessary to provide an additional turbulator hold system, which simplifies the structure of the heat sink according to the present invention.
- Of course, the present invention is likely to have various alterations, modifications, and improvements which will readily occur to those skilled in the art. In particular, the thickness examples mentioned for the tubes and the gaps are given as an example and are to be adapted by those skilled in the art according to the envisaged application.
- Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and the scope of the present invention. Accordingly, the foregoing description is by way of example only and is not intended to be limiting. The present invention is limited only as defined in the following claims and the equivalents thereto.
Claims (10)
1. A heat sink (10) comprising a body (12) made of a metallic material having a surface intended to support an electronic power component (14), the body comprising a plurality of openings (22) axially crossed by tubes (24) of circulation of a cooling liquid, each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.
2. The heat sink of claim 1 , wherein each tube (24) is made of metal.
3. The heat sink of claim 1 , wherein the compressed powder is a boron nitride and/or aluminum nitride powder.
4. The heat sink of claim 1 , wherein the heat sink further comprises, at least in a tube (24), guiding means (36) intended to accelerate the cooling liquid flow in contact with the tube and made of a material with a good thermal conductivity.
5. The heat sink of claim 4 , wherein the guiding means (36) are maintained only by contact with the tube (24).
6. The heat sink of claim 4 , wherein the guiding means (36) comprise a cylindrical portion on the circumference of which extend grooves separated by teeth (45), the grooves being adapted to the flowing of the cooling liquid, the teeth being in contact with the tube.
7. A method for manufacturing a heat sink (10), comprising the steps of:
a) providing a heat sink body (12) made of a metallic material having a surface intended to support an electronic power component (14), the body being crossed by a plurality of openings (22);
b) placing in each opening a tube (24) separated from the opening by a ring-shaped gap (26);
c) filling each ring-shaped gap with a powder of at least one material with good electric isolation and thermal conduction properties; and
d) compressing the powder in each gap.
8. The method of claim 7 , wherein step b) comprises, for each opening (24), the arrangement of a tubular jointing sleeve (32, 34) crossed by an orifice at one end of the opening (12), the tube being maintained in the orifice of the jointing sleeve distantly from the body, the powder being then introduced, at step c), through the ring-shaped gap (26) at the level of the axial end of the opening opposite to the jointing sleeve.
9. The method of claim 8 , wherein step d) is followed by the arrangement of an additional tubular sleeve (32, 34) at the level of the end of the opening (24) through which the powder has been introduced.
10. The method of claim 7 , comprising, before step c), the arrangement of guiding means (36) in at least one tube (24), the powder compression being performed to deform the tube so that it comes into contact with and maintains in place the guiding means.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR04/50507 | 2004-03-12 | ||
FR0450507A FR2867608B1 (en) | 2004-03-12 | 2004-03-12 | COOLER FOR ELECTRONIC POWER COMPONENT |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050199373A1 true US20050199373A1 (en) | 2005-09-15 |
Family
ID=34855222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/075,530 Abandoned US20050199373A1 (en) | 2004-03-12 | 2005-03-09 | Heat sink for an electronic power component |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050199373A1 (en) |
EP (1) | EP1580807A1 (en) |
FR (1) | FR2867608B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8897010B2 (en) | 2011-08-22 | 2014-11-25 | General Electric Company | High performance liquid cooled heatsink for IGBT modules |
US11175102B1 (en) * | 2021-04-15 | 2021-11-16 | Chilldyne, Inc. | Liquid-cooled cold plate |
EP4199667A1 (en) * | 2021-12-17 | 2023-06-21 | Vitesco Technologies GmbH | Power electronics device and method for manufacturing a cooling system for a power electronics device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8897010B2 (en) | 2011-08-22 | 2014-11-25 | General Electric Company | High performance liquid cooled heatsink for IGBT modules |
US11175102B1 (en) * | 2021-04-15 | 2021-11-16 | Chilldyne, Inc. | Liquid-cooled cold plate |
EP4199667A1 (en) * | 2021-12-17 | 2023-06-21 | Vitesco Technologies GmbH | Power electronics device and method for manufacturing a cooling system for a power electronics device |
Also Published As
Publication number | Publication date |
---|---|
FR2867608B1 (en) | 2006-05-26 |
FR2867608A1 (en) | 2005-09-16 |
EP1580807A1 (en) | 2005-09-28 |
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