US20050199367A1 - Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device - Google Patents

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Download PDF

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Publication number
US20050199367A1
US20050199367A1 US10/522,349 US52234905A US2005199367A1 US 20050199367 A1 US20050199367 A1 US 20050199367A1 US 52234905 A US52234905 A US 52234905A US 2005199367 A1 US2005199367 A1 US 2005199367A1
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Prior art keywords
heat
mobile radio
metal foil
present
heat sink
Prior art date
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Abandoned
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US10/522,349
Inventor
Jorg Romahn
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Siemens AG
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Siemens AG
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Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROMAHN, JORG
Publication of US20050199367A1 publication Critical patent/US20050199367A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the present invention relates to a method for heat dissipation in mobile radio devices, and to a corresponding mobile radio device.
  • An operating range with an environmental temperature generally of +55° C. is specified in mobile telecommunications terminals and in mobile radio devices, such as mobile telephones, PDAs and laptops.
  • mobile radio devices are constructed like a shell for the electronic components, wherein the temperature rises from shell to shell towards the components.
  • the maximum temperature is functionally limited.
  • the temperature close to the individual components in this case may be an environmental temperature of 82° C., while the temperature of the component itself may be up to 100° C.
  • the electronic components convert the majority of the energy/power supplied to them to heat, which heats not only the component itself but also its immediate surrounding area. The power that is converted to heat is, accordingly, a power loss.
  • heat sinks or fans have been mounted on the temperature-critical components.
  • care must be taken to ensure that good thermal coupling is provided between the heat sink and the electrical component which is heated by the power loss.
  • spaces between the corresponding component and the heat sink are filled with thermally conductive sheets or thermally conductive pastes.
  • the distribution of the heat in electrical components can be influenced by a matched structure.
  • Thermally conductive sheets and thermally conductive pastes are admittedly better thermal conductors than air, but they are also not adequate to ensure satisfactory heat dissipation for electrical components.
  • the present invention seeks to provide a method which makes it possible to ensure good and satisfactory heat dissipation from electronic components in mobile radio devices, as well as a corresponding mobile radio device.
  • a method for heat dissipation in mobile radio devices having heat-emitting, electrical components, in which the heat-emitting components are brought into heat-dissipating contact with a metal foil.
  • the metal foil is corrugated and/or is structured in the form of a honeycomb.
  • the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb minimizes the resistance for heat dissipation.
  • the capability of the metal foil that is corrugated and/or is structured in the form of a honeycomb to deform results in any intermediate spaces which occur being completely filled, thus ensuring optimum heat dissipation.
  • the metal foil which is corrugated and/or in the form of a honeycomb can be arranged in an interlocking manner on the surfaces which can be brought into contact for heat dissipation.
  • the metal foil is brought into contact with a heat sink.
  • the heat sink may, for example, be a metallic body which either has a large area for radiated emission and/or a large volume as a heat sink.
  • the metal foil is itself used as a heat sink.
  • the magnitude of the heat loss to be dissipated determines whether the metal foil is itself adequate as a heat sink.
  • the honeycomb and/or corrugated structure provided according to the present invention offers a very large heat-emitting surface area.
  • the present invention covers a mobile radio device having heat-emitting electrical components, in which the components are each in heat-dissipating contact with a metal foil.
  • the metal foil is preferably corrugated and/or has a honeycomb structure.
  • the use of a metal foil which is corrugated or is structured in the form of a honeycomb enlarges the radiation-emitting surface area.
  • the heat dissipation resistance is minimized, on the one hand, by the use of a metallic foil as well as by its structure, which is corrugated or is in the form of a honeycomb.
  • the metal foil is in heat-dissipating contact with a heat sink.
  • the metal foil itself acts as a heat sink. Its honeycomb and/or corrugated structure results in it having a very large heat-emitting surface area.
  • the present invention covers the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb for heat dissipation from heat-emitting electrical components in mobile radio devices.
  • FIG. 1 shows a schematic illustration of one implemented embodiment of the method according to the present invention.
  • FIG. 2 shows a schematic illustration of another implemented embodiment of the method according to the present invention.
  • FIG. 3 shows a schematic illustration of a further implemented embodiment of the method according to the present invention.
  • FIG. 1 shows a printed circuit board 1 which is fitted on one side with components 2 which develop a large amount of heat.
  • a heat sink 4 in the form of a cold plate is arranged on the other side of the printed circuit board 1 via suitable connecting elements 3 which, for example, may be screws or rivets.
  • suitable connecting elements 3 which, for example, may be screws or rivets.
  • a metal foil 5 or a metal paste is, according to the present invention, inserted in the space which occurs between the printed circuit board 1 and the heat sink 4 .
  • FIG. 2 shows another possible implementation of the method according to the present invention.
  • FIG. 2 once again shows a printed circuit board 1 which is fitted with a component 2 , that produces heat losses, on one side.
  • a shielding cover 6 is also provided above the component 2 for shielding.
  • a heat sink 4 is arranged on the other side of the printed circuit board 1 .
  • This may be a heat sink, a battery or a chassis.
  • a metal foil 5 which is corrugated and/or structured in the form of a honeycomb, is arranged in the resultant spaces between the component 2 or the printed circuit board 1 and the shielding cover 6 or the heat sink 4 .
  • the metal foil 5 which is corrugated and/or structured in the form of a honeycomb, to deform allows very good contact for heat transfer.
  • the metal foil 5 may provide only the junction to a heat sink 4 , in this case, in the space between the heat sink 4 and the printed circuit board 1 .
  • the metal foil 5 could itself act as a heat sink. This is because the use of a metal foil 5 with a corrugated or honeycomb structure considerably enlarges the radiation-emitting surface area.
  • FIG. 3 shows a further possible implementation of the method according to the present invention.
  • FIG. 3 shows a printed circuit board 1 with a lossy component 2 arranged on one side of the printed circuit board 1 .
  • a plastic part 7 is arranged on the other side of the printed circuit board 1 .
  • a metal foil 5 which is in the form of a honeycomb and/or is corrugated is provided between the plastic part 7 and the printed circuit board 1 and can be matched to the respective surfaces by virtue of its capability to be deformed well.
  • the metal foil 5 itself has a very large heat-emitting surface area, which represents an additional beneficial factor.

Abstract

The present invention relates to a method for heat dissipation in mobile radio devices, with heat-radiating electrical components, whereby the heat-radiating components are brought into heat-dissipating contact with a metal film. The present invention further relates to a mobile radio device with heat-radiating electrical components, whereby each component is in effective heat-dissipating contact with a metal film.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a method for heat dissipation in mobile radio devices, and to a corresponding mobile radio device. An operating range with an environmental temperature generally of +55° C. is specified in mobile telecommunications terminals and in mobile radio devices, such as mobile telephones, PDAs and laptops. These mobile radio devices are constructed like a shell for the electronic components, wherein the temperature rises from shell to shell towards the components. The maximum temperature is functionally limited. The temperature close to the individual components in this case may be an environmental temperature of 82° C., while the temperature of the component itself may be up to 100° C. The electronic components convert the majority of the energy/power supplied to them to heat, which heats not only the component itself but also its immediate surrounding area. The power that is converted to heat is, accordingly, a power loss.
  • In new, future mobile radio devices with the introduction of data services via GPRS with a so-called Class 10, the power with two transmission time slots is doubled, which also results in the power loss produced by the electronic components also being virtually doubled. The subdivision into “classes” relates to details of the configuration of the transmission and reception time slots. In Class 10, two transmission time slots are possible, wherein not only the transmission power but also the power loss is doubled.
  • In even higher GPRS classes, such as GPRS Class 12, the power loss is up to a multiple of this. This results in a threat of the components being overheated after a certain operating time.
  • The following table provides a rough overview of the GPRS classes:
    Multislot Transmission Reception Number of slots
    Class slots slots (usable)
    1 1 1 2
    .
    .
    .
    8 1 4 5
    .
    .
    .
    10  2 4 5
    .
    .
    .
    12  4 4 5
  • This type of problem has not occurred in the past in the field of mobile telecommunications since this technology is only now being introduced. In the past, mobile radio devices have been implemented and operated on the basis of GPRS Class 8.
  • In other electronic devices, such as desktop computers, heat sinks or fans have been mounted on the temperature-critical components. When fitting heat sinks, care must be taken to ensure that good thermal coupling is provided between the heat sink and the electrical component which is heated by the power loss. In order to exclude air, as a poor thermal conductor, spaces between the corresponding component and the heat sink are filled with thermally conductive sheets or thermally conductive pastes.
  • Furthermore, the distribution of the heat in electrical components can be influenced by a matched structure.
  • Thermally conductive sheets and thermally conductive pastes are admittedly better thermal conductors than air, but they are also not adequate to ensure satisfactory heat dissipation for electrical components.
  • Accordingly, the present invention seeks to provide a method which makes it possible to ensure good and satisfactory heat dissipation from electronic components in mobile radio devices, as well as a corresponding mobile radio device.
    • SUMMARY OF THE INVENTION
  • Accordingly, a method is provided for heat dissipation in mobile radio devices having heat-emitting, electrical components, in which the heat-emitting components are brought into heat-dissipating contact with a metal foil.
  • In one preferred embodiment of the method according to the present invention, the metal foil is corrugated and/or is structured in the form of a honeycomb. The use of a metal foil which is corrugated and/or is structured in the form of a honeycomb minimizes the resistance for heat dissipation. The capability of the metal foil that is corrugated and/or is structured in the form of a honeycomb to deform results in any intermediate spaces which occur being completely filled, thus ensuring optimum heat dissipation. The metal foil which is corrugated and/or in the form of a honeycomb can be arranged in an interlocking manner on the surfaces which can be brought into contact for heat dissipation.
  • In a further preferred embodiment of the method according to the present invention, the metal foil is brought into contact with a heat sink. The heat sink may, for example, be a metallic body which either has a large area for radiated emission and/or a large volume as a heat sink.
  • In another preferred embodiment of the present invention, the metal foil is itself used as a heat sink. The magnitude of the heat loss to be dissipated, in particular, determines whether the metal foil is itself adequate as a heat sink. The honeycomb and/or corrugated structure provided according to the present invention offers a very large heat-emitting surface area.
  • Furthermore, the present invention covers a mobile radio device having heat-emitting electrical components, in which the components are each in heat-dissipating contact with a metal foil.
  • The metal foil is preferably corrugated and/or has a honeycomb structure. The use of a metal foil which is corrugated or is structured in the form of a honeycomb enlarges the radiation-emitting surface area. The heat dissipation resistance is minimized, on the one hand, by the use of a metallic foil as well as by its structure, which is corrugated or is in the form of a honeycomb.
  • Furthermore, in a further preferred embodiment of the mobile radio device according to the present invention, the metal foil is in heat-dissipating contact with a heat sink.
  • In another preferred embodiment of the mobile radio device according to the present invention, the metal foil itself acts as a heat sink. Its honeycomb and/or corrugated structure results in it having a very large heat-emitting surface area.
  • Furthermore, the present invention covers the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb for heat dissipation from heat-emitting electrical components in mobile radio devices.
  • Additional features and advantages of the present invention are described in, and will be apparent from, the following Detailed Description of the Invention and the Figures.
    • BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 shows a schematic illustration of one implemented embodiment of the method according to the present invention.
  • FIG. 2 shows a schematic illustration of another implemented embodiment of the method according to the present invention.
  • FIG. 3 shows a schematic illustration of a further implemented embodiment of the method according to the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 shows a printed circuit board 1 which is fitted on one side with components 2 which develop a large amount of heat. A heat sink 4 in the form of a cold plate is arranged on the other side of the printed circuit board 1 via suitable connecting elements 3 which, for example, may be screws or rivets. During the fitting of the heat sink 4, good thermal coupling between the heat sink and the electrical components 2 is a key factor ensuring that the components 2 are not excessively heated, which could possibly lead to destruction of the components 2. In order to avoid poor thermal conduction, a metal foil 5 or a metal paste is, according to the present invention, inserted in the space which occurs between the printed circuit board 1 and the heat sink 4.
  • FIG. 2 shows another possible implementation of the method according to the present invention. FIG. 2 once again shows a printed circuit board 1 which is fitted with a component 2, that produces heat losses, on one side. A shielding cover 6 is also provided above the component 2 for shielding. A heat sink 4 is arranged on the other side of the printed circuit board 1. This may be a heat sink, a battery or a chassis. According to the present invention, a metal foil 5, which is corrugated and/or structured in the form of a honeycomb, is arranged in the resultant spaces between the component 2 or the printed circuit board 1 and the shielding cover 6 or the heat sink 4. The capability of the metal foil 5, which is corrugated and/or structured in the form of a honeycomb, to deform allows very good contact for heat transfer. On the one hand, the metal foil 5 may provide only the junction to a heat sink 4, in this case, in the space between the heat sink 4 and the printed circuit board 1. Furthermore, the metal foil 5 could itself act as a heat sink. This is because the use of a metal foil 5 with a corrugated or honeycomb structure considerably enlarges the radiation-emitting surface area.
  • FIG. 3 shows a further possible implementation of the method according to the present invention. In this case as well, FIG. 3 shows a printed circuit board 1 with a lossy component 2 arranged on one side of the printed circuit board 1. Furthermore, a plastic part 7 is arranged on the other side of the printed circuit board 1. A metal foil 5 which is in the form of a honeycomb and/or is corrugated is provided between the plastic part 7 and the printed circuit board 1 and can be matched to the respective surfaces by virtue of its capability to be deformed well. By virtue of its structure, the metal foil 5 itself has a very large heat-emitting surface area, which represents an additional beneficial factor.
  • Although the present invention has been described with reference to specific embodiments, those of skill in the art will recognize that changes may be made thereto without departing from the spirit and scope of the present invention as set forth in the hereafter appended claims.

Claims (4)

1-3. (canceled)
4. A method for heat dissipation in mobile radio devices having heat-emitting electrical components, the method comprising:
providing that the heat-emitting electrical components be brought into heat-dissipating contact with a metal foil, wherein the metal foil is structured in at least one of corrugated form and honeycomb form; and
providing that the metal foil be brought into contact with a heat sink.
5. A mobile radio device having heat-emitting electrical components, comprising:
a metal foil which is structured in at least one of corrugated form and honeycomb form, wherein the heat-emitting electrical components are each in heat-dissipating contact with the metal foil; and
a heat sink, wherein the metal foil is in heat-dissipating contact with the heat sink.
6. A metal foil for heat dissipation from heat-emitting electrical components in a mobile radio device, comprising a structure which is in at least one of corrugated form and honeycomb form, wherein the heat-emitting electrical components are brought into heat-dissipating contact with the metal foil and the metal foil is in heat-dissipating contact with a heat sink.
US10/522,349 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Abandoned US20050199367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10234500.7 2002-07-23
DE10234500A DE10234500A1 (en) 2002-07-23 2002-07-23 Heat extraction in mobile radio equipment involves bringing electrical components into heat extraction contact with metal film with corrugated and/or honeycomb structure in contact with cooling body
PCT/DE2003/002441 WO2004017697A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices and a corresponding mobile radio device

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US (1) US20050199367A1 (en)
EP (1) EP1523870A1 (en)
JP (1) JP2005534197A (en)
CN (1) CN1669376A (en)
AU (1) AU2003250308A1 (en)
DE (1) DE10234500A1 (en)
WO (1) WO2004017697A1 (en)

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US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
CN105141727A (en) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 Mobile phone shell
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN107305292A (en) * 2016-04-20 2017-10-31 佳能株式会社 Head mounted display and grasping device
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

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KR20090009911A (en) 2006-04-27 2009-01-23 교세라 가부시키가이샤 Electronic device
KR101390082B1 (en) 2007-08-01 2014-05-28 삼성전자주식회사 Mobile communication terminal with projector
DE102015207893B3 (en) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Electronic assembly, in particular for a transmission control module
DE102020005527A1 (en) * 2020-09-10 2022-03-10 Daimler Ag Cooling arrangement and battery arrangement with a flat structure surrounded by thermal paste for thermal coupling

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US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US7682072B2 (en) * 2002-03-20 2010-03-23 Ngk Insulators, Ltd. Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
US10234916B2 (en) * 2008-06-27 2019-03-19 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN105141727A (en) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 Mobile phone shell
CN107305292A (en) * 2016-04-20 2017-10-31 佳能株式会社 Head mounted display and grasping device
EP3239762A1 (en) * 2016-04-20 2017-11-01 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US10477730B2 (en) 2016-04-20 2019-11-12 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Also Published As

Publication number Publication date
EP1523870A1 (en) 2005-04-20
AU2003250308A1 (en) 2004-03-03
CN1669376A (en) 2005-09-14
JP2005534197A (en) 2005-11-10
DE10234500A1 (en) 2004-02-19
WO2004017697A1 (en) 2004-02-26

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