US20050155354A1

US20050155354A1 - Heat radiator

Info

Publication number: US20050155354A1
Application number: US10/760,310
Authority: US
Inventors: Hsin-mao Hsieh
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-01-21
Filing date: 2004-01-21
Publication date: 2005-07-21

Abstract

A heat radiator includes a water tank containing cooling liquid. A first radiating member has a top plate secured at top edges of the water tank. Multiple first fins are formed beneath the top plate and immersed in the cooling liquid. A heat insulating pad is adhered on the top plate. At least one semiconductor refrigerating component is mounted on the top plate and has a hot surface abutting the top plate and a cold surface exposed from the heat insulating pad. A second radiating member is positioned on the first radiating member and has a bottom plate with an area over the semiconductor refrigerating component. Multiple second fins are formed on the bottom plate. A fan is mounted on the second fins of the second radiating member.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat radiator, and more particularly to a cooling means for lowering a temperature of a device or element which generates significant amounts of heat in operation.
2. Description of Related Art
For lowering a temperature of a device or element such as a CPU, or electronic chips which generate lots of heat in operation, a heat radiator is generally mounted on the device or element.
A conventional heat radiator includes multiple fins formed on a body, and a fan installed on the fins. However, the fan in operation also will generate heat and gradually become hot, so the radiating effect of the conventional heat radiator is low.
A novel heat radiator assembled with a semiconductor refrigerating component utilizing the Peltire Effect is invented. The semiconductor refrigerating component includes a hot surface and a cold surface opposite to the hot surface with a temperature difference between the two surfaces. In operation, the cold surface will have a very low temperature to provide an improved radiating effect. However, the temperature of the hot surface will rise, so the cold surface cannot retain the predetermined low temperature and the heat radiator still does not have a satisfying radiating effect.
Therefore, the invention provides an improved heat radiator to mitigate or obviate the aforementioned problems.

SUMMARY OF THE INVENTION

The main objective of the present invention is to provide a heat radiator which has an improved radiating effect.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THF DRAWINGS

FIG. 1 is an exploded perspective view of a heat radiator in accordance with the invention;
FIG. 2 is a cross sectional view of the heat radiator without cooling liquid; and
FIG. 3 is a cross sectional view of the heat radiator with cooling liquid contained in a tank.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

With reference to FIGS. 1-2, a heat radiator in accordance with the invention is composed of a water tank (10), a first radiating member (20), a second radiating member (30), a fan (40), and a cover (50).
The water tank (10) has a hollow body (not numbered) for containing a cooling liquid such as water (11), as shown in FIG. 3. Multiple barbs (12) are formed at upper edges of the water tank (10). A rim (not numbered) is formed in the water tank (10) and beneath the upper edges.
The first radiating member (20) is made of aluminum or other metals with a high heat conductivity. A top plate (21) is formed at a top of the first radiating member (20) and supported by the rim of the water tank (10) so as to position the first radiating member (20) in the water tank (10). The top plate (21) and the rim can be sealed together to prevent the water (11) from leaking out from the water tank (10). Multiple first fins (22) are formed beneath the top plate (21) and immersed in the water (11). A heat insulating pad (24) is spread over the plate (21). At least one semiconductor refrigerating component (23) is mounted on the plate (21) and in the heat insulating pad (24). The refrigerating component (23) has a hot surface (not numbered) abutting the plate (21) and a cold surface (not numbered) exposed from the heat insulating pad (24).
A shield (25) is formed beneath the plate (21) and outside the first fins (22) with a length larger than the first fins (22). Thus, in an individually disposed status, the first member (20) can be supported by the shield (25), and the first fins (22) with a low strength are protected by the shield (25).
The second radiating member (30) is positioned on the first radiating member (20) and also made of aluminum or other metals with a high heat conductivity. A bottom plate (31) is formed at a bottom of the second radiating member (30) with an area over the semiconductor refrigerating component (23) and abuts the cold surface of the semiconductor refrigerating component (23). Multiple second fins (32) are formed on the bottom plate (31).
The fan (40) is secured on the second fins (32) of the second radiating member (30) by screws (not numbered). As usual, the fan (40) is composed of a frame (41), a stator (not numbered) and a rotor (42).
The cover (50) is detachably mounted on the water tank (10), and has multiple louvers (51) defined at top and side surfaces thereof. A handle (52) is formed on the cover (50) to facilitate a user to carry the heat radiator. Multiple hooks (53) are formed at lower edges of the cover (50), and the barbs (12) are respectively attached to the hooks (53) to fasten the cover (50) on the water tank (10).
With reference to FIG. 3, in use, the electrified semiconductor refrigerating components (23) will become cold at the cold surface, and the temperature of the second radiating member (30) is accordingly lowered. Air drawn in by the fan (40) through the louver (51) at the top surface of the cover (50) flows through the second radiating member (30) and become cold, and then the cold air is blown out from the louvers (51) at the side surface of the cover (50) for cooling a hot object. The heat generated at the hot surface of the semiconductor refrigerating component (23) is insulated by the heat insulating pad (24) and only transferred to the first fins (22) of the first radiating member (20). Cooled by the water (11) in the water tank (10), the hot surface (232) can retain a low temperature, so the cold surface (231) has an improved radiating effect. Furthermore, the water tank (10) can be provided with a temperature controller (not shown) for stopping the operation of the semiconductor refrigerating component (23) in a situation of the temperature of the water (11) reaching a predetermined value.
Therefore, because the hot surface is cooled by water and the cold surface can retain a low temperature, the heat radiator according to the present invention has a good radiating effect.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat radiator comprising:

a water tank having a hollow body, and cooling liquid contained in the hollow body;

a first radiating member having a top plate secured at top edges of the water tank, multiple first fins formed beneath the top plate and immersed in the cooling liquid, a heat insulating pad adhered on the top plate, and at least one semiconductor refrigerating component mounted on the top plate and having a hot surface abutting the top plate and a cold surface exposed from the heat insulating pad;

a second radiating member positioned on the first radiating member and having a bottom plate with an area over the at least one semiconductor refrigerating component, and multiple second fins formed on the bottom plate; and

a fan mounted on the second fins of the second radiating member.

2. The heat radiator as claimed in claim 1 further comprising a cover detachably mounted on the water tank to envelop the second radiating member and the fan, and louvers defined at top and side surfaces of the cover.

3. The heat radiator as claimed in claim 2, wherein the cover has a handle formed thereon.

4. The heat radiator as claimed in claim 1, wherein the first radiating member further has a shield formed beneath the plate and outside the first fins with a length larger than the first fins.

5. The heat radiator as claimed in claim 2, wherein the water tank has multiple barbs formed at the top edges of the hollow body, and the cover has multiple hooks formed at bottom edges of the cover and respectively attached to the barbs.