US20050145373A1 - Heat pipe structure - Google Patents
Heat pipe structure Download PDFInfo
- Publication number
- US20050145373A1 US20050145373A1 US10/750,966 US75096604A US2005145373A1 US 20050145373 A1 US20050145373 A1 US 20050145373A1 US 75096604 A US75096604 A US 75096604A US 2005145373 A1 US2005145373 A1 US 2005145373A1
- Authority
- US
- United States
- Prior art keywords
- tubular member
- support member
- heat pipe
- bottom portion
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat pipe structure includes a tubular member, and a wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member. Therefore, an end portion of a heat pipe can be used to contact a heat source for dissipation to provide more efficient dissipation and prevent from limitation of use.
Description
- The present invention relates to a heat pipe structure, and more particular, to a heat pipe structure of which a wick structure is attached to an inner surface of an end portion thereof such that a heat pipe can be used to contact a heat source with the end portion for dissipation.
- Heat pipes have been commonly used for dissipating heat generated by electronic products. The heat pipes have high thermal conducting ability, high thermal transmission, high thermal conductivity, light weight, non-mobile device, simple structure and versatile applications.
- As shown in
FIG. 1 , the conventional heat pipe structure 1 a includes two conoid ends converged from thetubular member 10 a. One of the conoid end 11 a is formed by soldering after awick structure 13 a is attached to an interior wall of the tubular member by a supportingmember 12 a. Thewick structure 13 a is includes a screen mesh with capillary function which is advantageous for transmission of working fluid in the heat pipe 1 a. - However, the conoid ends of the heat pipe 1 a do not have wick structure attached or with incomplete attachment. Therefore, conventional heat pipes can not use the end portion to contact the heat sink or heat source for dissipating.
- The present invention provides a heat pipe structure of which the wick structure is attached to the inner surface of the end portion thereof such that the heat pipe can be used to contact a heat source with the end portion for dissipation. Therefore, more availability for dissipating of the heat pipe can be obtained and further the limitation in use can be reduced too.
- The heat pipe structure provided by the present invention includes a tubular member, and a wick structure having a base portion formed at one end of the tubular member and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member. As such, an end portion of a heat pipe can be used to contact a heat source for dissipation.
- These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
- These, as well as other features of the present invention, will become apparent upon reference to the drawings wherein:
-
FIG. 1 shows a cross sectional view of the conventional heat pipe; -
FIG. 2 shows a cross sectional view of an exploded heat pipe according to the present invention; -
FIG. 3 shows a cross sectional view of the assembled heat pipe according to the present invention; -
FIG. 4 shows a perspective view of a wick structure according to the first embodiment; -
FIG. 5 shows a perspective view of a wick structure according to the second embodiment; -
FIG. 6 shows a cross sectional view of the first supporting member inFIG. 2 ; -
FIG. 7 shows a cross sectional view along line 7-7 ofFIG. 6 ; -
FIG. 8 shows a cross sectional view of the second supporting member inFIG. 2 ; and -
FIG. 9 shows a cross sectional view along line 9-9 ofFIG. 8 . - Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIGS. 2 and 3 illustrate cross sectional views of the exploded and assembled heat pipe the present invention, respectively. As shown, theheat pipe 1 includes atubular member 10, abottom portion 11, alid 12, afirst support member 13 and asecond support member 14. - The
tubular member 10 is hollow and includes twoopenings bottom portion 11 and thelid 12, respectively. Thebottom portion 11 has aninner surface 110 and anouter surface 111. Theinner surface 110 can be formed as a plane surface, a conical surface, a convex surface or a concave surface. Further, thebottom portion 11 can be integratedly formed with thetubular member 10. Thelid 12 includes a throughhole 120 for aninjection tube 121 being installed therein so that the working fluid can be filled into the heat pipe thereby. - Furthermore, a
wick structure 102 having abase portion 103 and a surroundingportion 104 extending therefrom is mounted inside thetubular member 10 of theheat pipe 1. Thebase portion 103 is attached to theinner surface 110 of thebottom portion 11 and the surroundingportion 104 is attached to the interior wall of thetubular member 10. Please refer toFIGS. 4 and 5 , which show different wick structures according to a first and a second preferred embodiments of the present invention. As shown inFIG. 4 , the surroundingportion 104 of thewick structure 102 is formed as a skirt structure including a plurality offrills 105. The skirt structure of the surroundingportion 104 is formed by folding thefrills 105 upwards from thebase portion 103. In another embodiment, as shown inFIG. 5 , the surroundingportion 104 of thewick structure 102 includes a plurality ofstrips 106 with smoother surface after thewick structure 102 is mounted to the heat pipe by sintering. -
FIGS. 6 and 7 illustrate the cross sectional view of the first support member and the cross sectional view along line 7-7 ofFIG. 6 , respectively. Thesupport member 13 installed inside thetubular member 10 includes apressing plate 130 and anelastic arm 131 extending therefrom. Thepressing plate 130 is for pressing thebase portion 103 of thewick structure 102 on theinner surface 110 of thebottom portion 11 of theheat pipe 1. Theelastic arm 131 is for pressing the surrounding portion of thewick structure 102 on the interior wall of thetubular member 10 of theheat pipe 1. Theelastic arm 131 can provide auxiliary force to secure the attachment of thewick structure 102 to thebottom portion 11. Further, thefirst support member 13 includes a plurality ofholes 132 on thepressing plate 130 and theelastic arm 131 for the working fluid flowing therethrough. -
FIGS. 8 and 9 illustrate the cross sectional view of the second support member and the cross sectional view along line 9-9 ofFIG. 8 , respectively. Thesecond support member 14 is also installed inside thetubular member 10, and is formed by curling aresilient sheet 140 with a plurality ofholes 141 thereon or formed as a spiraling spring (not shown). Thesecond support member 14 is mounted between theelastic arm 131 of thefirst support member 13 for further securing the surroundingportion 104 of thewick structure 102 being attached to thetubular member 10. Meanwhile, if there is nofirst support member 13, thesecond support member 14 can be directly mounted inside thetubular member 10 to press the surroundingportion 104 being attached to thetubular member 10. - As such, according to the above description, the heat pipe structure of the present invention is obtained.
- Finally, as shown in
FIG. 3 , thebottom portion 11 of theheat pipe 1 can be used to contact the heat source with theouter surface 111. The working fluid near thebottom portion 11 is gradually evaporated and then condensed to liquid on the interior wall of thetubular member 10. Thereafter, the liquid working fluid flows back to thebottom portion 11 and is heated to evaporate again. As such, theheat pipe 1 of the present invention can use an end portion for heat conduction and dissipation to provide more efficient dissipation and reduce the limitation in use of the heat pipe. The heat pipe structure of the present invention is more suitable to be used for the central processing unit (CPU) of a computer because the end portion of the heat pipe can be directly contact to the CPU for dissipation. - This disclosure provides exemplary embodiments of the present invention. The scope of this disclosure is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in shape, structure, dimension, type of material or manufacturing process may be implemented by one of skill in the art in view of this disclosure.
Claims (16)
1. A heat pipe structure, comprising:
a tubular member having a first end connecting bottom portion and a second end connecting a lid, where the bottom portion can be used as a heat input surface; and
a wick structure including a base portion formed at the bottom portion of the tubular member, and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member.
2. (canceled)
3. The structure of claim 1 , wherein an inner surface of the bottom portion is a plane surface.
4. The structure of claim 1 , wherein the bottom portion is integratedly formed with the tubular member.
5. The structure of claim 1 , wherein the lid has a through hole for installing an injection tube to fill working fluid.
6. The structure of claim 1 , wherein the surrounding portion is formed as a skirt structure with a plurality of frills.
7. The structure of claim 1 , wherein the surrounding portion includes a plurality of stripes strips extended from the base portion.
8. The structure of claim 1 , further comprising a first support member mounted inside the tubular member.
9. The structure of claim 8 , wherein the first support member includes a pressing plate and an elastic arm extending from the pressing plate, and a plurality of holes formed on the pressing plate and the elastic arm.
10. The structure of claim 8 , further comprising a second support member mounted to the first support member.
11. The structure of claim 10 , wherein the second support member is formed by curling a resilient sheet and a plurality of holes is formed on the resilient sheet.
12. The structure of claim 8 , further comprising a second support member mounted inside the tubular member.
13. The structure of claim 12 , wherein the second support member is formed by curling a resilient sheet and a plurality of holes is formed on the resilient sheet.
14. A heat pipe structure, comprising:
a tubular member having a first end connecting a bottom portion, a second end and a first supporting member inside the tubular member where the first supporting member includes a pressing plate and an elastic arm extending from the pressing plate, and a plurality of holes formed on the pressing plate and the elastic arm, where the bottom portion can be used as a beat input surface; and
a wick structure including a base portion formed at the bottom portion of the tubular member, and a surrounding portion extending from the base portion for attaching to an interior wall of the tubular member.
15. The structure of claim 14 , further comprising a second support member mounted to the first support member.
16. The structure of claim 15 , wherein the second support member is formed by curling a resilient sheet and a plurality of holes is formed on the resilient sheet.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/750,966 US20050145373A1 (en) | 2004-01-05 | 2004-01-05 | Heat pipe structure |
US11/297,370 US7322402B2 (en) | 2004-01-05 | 2005-12-09 | Heat pipe structure and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/750,966 US20050145373A1 (en) | 2004-01-05 | 2004-01-05 | Heat pipe structure |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/297,370 Continuation-In-Part US7322402B2 (en) | 2004-01-05 | 2005-12-09 | Heat pipe structure and method for fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050145373A1 true US20050145373A1 (en) | 2005-07-07 |
Family
ID=34711354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/750,966 Abandoned US20050145373A1 (en) | 2004-01-05 | 2004-01-05 | Heat pipe structure |
Country Status (1)
Country | Link |
---|---|
US (1) | US20050145373A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100413064C (en) * | 2005-07-22 | 2008-08-20 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
US20100032138A1 (en) * | 2007-01-19 | 2010-02-11 | Jen-Shyan Chen | Heat pipe with flat end and method of manufacturing the same |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3720988A (en) * | 1971-09-20 | 1973-03-20 | Mc Donnell Douglas Corp | Method of making a heat pipe |
US3779310A (en) * | 1971-04-05 | 1973-12-18 | G Russell | High efficiency heat transit system |
US3789920A (en) * | 1970-05-21 | 1974-02-05 | Nasa | Heat transfer device |
US3955619A (en) * | 1972-11-16 | 1976-05-11 | General Electric Company | Heat transfer device |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
US6330907B1 (en) * | 1997-03-07 | 2001-12-18 | Mitsubishi Denki Kabushiki Kaisha | Evaporator and loop-type heat pipe using the same |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US20050011633A1 (en) * | 2003-07-14 | 2005-01-20 | Garner Scott D. | Tower heat sink with sintered grooved wick |
-
2004
- 2004-01-05 US US10/750,966 patent/US20050145373A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3789920A (en) * | 1970-05-21 | 1974-02-05 | Nasa | Heat transfer device |
US3779310A (en) * | 1971-04-05 | 1973-12-18 | G Russell | High efficiency heat transit system |
US3720988A (en) * | 1971-09-20 | 1973-03-20 | Mc Donnell Douglas Corp | Method of making a heat pipe |
US3955619A (en) * | 1972-11-16 | 1976-05-11 | General Electric Company | Heat transfer device |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
US6330907B1 (en) * | 1997-03-07 | 2001-12-18 | Mitsubishi Denki Kabushiki Kaisha | Evaporator and loop-type heat pipe using the same |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US20050011633A1 (en) * | 2003-07-14 | 2005-01-20 | Garner Scott D. | Tower heat sink with sintered grooved wick |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100413064C (en) * | 2005-07-22 | 2008-08-20 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
US20100032138A1 (en) * | 2007-01-19 | 2010-02-11 | Jen-Shyan Chen | Heat pipe with flat end and method of manufacturing the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |