US20050092478A1 - Metal foam heat sink - Google Patents

Metal foam heat sink Download PDF

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Publication number
US20050092478A1
US20050092478A1 US10/697,839 US69783903A US2005092478A1 US 20050092478 A1 US20050092478 A1 US 20050092478A1 US 69783903 A US69783903 A US 69783903A US 2005092478 A1 US2005092478 A1 US 2005092478A1
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United States
Prior art keywords
heat sink
porous
heat
melting temperature
porous portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/697,839
Inventor
Vivek Jairazbhoy
Mohan Paruchuri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Visteon Global Technologies Inc
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Visteon Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visteon Global Technologies Inc filed Critical Visteon Global Technologies Inc
Priority to US10/697,839 priority Critical patent/US20050092478A1/en
Assigned to VISTEON GLOBAL TECHNOLOGIES, INC. reassignment VISTEON GLOBAL TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JAIRAZBHOY, VIVEK, PARUCHURI, MOHAN
Publication of US20050092478A1 publication Critical patent/US20050092478A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Definitions

  • the present invention generally relates to thermal management of a semiconductor device. More specifically, the invention relates to a metal foam heat sink for thermal management of a semiconductor device.
  • semiconductor devices can generate significant heat performing normal operations. This heat adversely affects the performance and reliability of the devices, if not dissipated. If the heat is not dissipated, the device may overheat such that the junction temperature increases to a level causing the device to fail or function improperly. Devices and interconnects may also fail due to the effects of thermal expansion caused by the overheating. For example, stress caused by a mismatch in thermal expansion between materials can cause solder joint cracking. Therefore, it is advantageous to maximize the capability of a device to remove heat and to minimize the effects of thermal expansion.
  • Heat dissipation from power devices is commonly accomplished with a metal heat sink, either on the top or bottom of the device.
  • the heat sink is typically a metal block or sheet and may include fins. Fins provide additional surface area for the dissipation of heat. Fin structures with high surface area, however, are bulky and expensive often requiring complex machining operations for fabrication.
  • metal foam has been used in place of fins to aid in the dissipation of heat.
  • the porosity of the metal foam creates an enormous surface area thereby providing high heat dissipation.
  • Metal foam may be attached to a metal block or directly to the semiconductor device.
  • utilizing metal foam in conjunction with a block heat sink requires an additional mechanical connection.
  • the mechanical connection may be accomplished using solder or a layer of thermally conductive adhesive. This additional connection increases thermal resistance and hinders effective dissipation of the heat.
  • the present invention provides a heat sink comprising a unitary body having both first and second portions, a porous and non-porous portion.
  • the non-porous portion provides for the transfer and spreading of heat while the porous portion provides for heat dissipation.
  • the non-porous portion of the heat sink is attached to the semiconductor die and configured to transfer heat to the porous portion, which dissipates the heat into the environment.
  • a method for manufacturing the heat sink includes the steps of forming a body having a first and a second portion, melting the second portion, and creating porosity in the second portion.
  • the heat sink is made of a metal material, preferably a copper alloy.
  • the alloy content of the portions may be varied such that the melting temperature of the second portion is lower than the melting temperature of the first portion.
  • the varying melting temperature allows porosity to be created in the second portion. This can be achieved by forcing gas through the second portion or by inserting a material into the second portion that may be removed, by burning or chemical reaction, after the second portion has solidified.
  • FIG. 1 is a cutaway side view of a heat dissipating system in accordance with the present invention and implemented in connection with a semiconductor module.
  • the system 10 generally includes a semiconductor die 12 and a heat sink 14 .
  • a semiconductor die 12 generates heat while performing its normal operations.
  • the die 12 is soldered to the metal vias 24 .
  • the metal vias 24 transfer the heat generated by the die 12 to the heat sink 14 at the opposite side of the printed circuit board 22 .
  • the heat sink 14 is attached to the thermal vias 24 and the printed circuit board 22 by a thermally conductive adhesive 20 .
  • other means of attachment including solder may be utilized.
  • the heat sink 14 includes a solid non-porous portion 16 and a porous portion 18 .
  • the non-porous portion 16 provides a thermal mass for heat spreading or sinking.
  • the non-porous portion 16 also provides the ability to absorb short term transients allowing quick transfer of the heat away from the die.
  • the porous portion 18 of the heat sink 14 provides an extremely large surface area for dissipation of the heat into the surrounding environment.
  • the heat sink 14 is described as a porous portion 18 and a non-porous portion 16 the heat sink is a single unitary structure thereby eliminating mechanical interfaces which may increase thermal resistance.
  • Natural convection may be used to dissipate heat from the porous portion 18 of the heat sink 14 .
  • air or liquid may also be forced through the porous section 18 of the heat sink 14 .
  • the flow of the gas or liquid cooling is illustrated by arrow 28 .
  • the heat sink 14 is preferably made of copper although aluminum or other metals may be used.
  • the pore sizes and the thickness of each portion may be manipulated based on the package size and amount of heat to be dissipated.
  • the heat sink will have a unitary body including a first and second portion.
  • the first portion can be a solid non-porous metal block, and may include a higher alloy content thereby causing the first portion to have a higher melting temperature than the second portion.
  • the second portion may be melted at a temperature such that the first portion remains solid.
  • a porosity is then created in the melted or second portion of the heat sink. The porosity may be created by forcing gas through the melted portion.
  • a foreign material may be inserted into the melted portion. With the foreign material integrated, the second portion may be allowed to solidify creating a porous surface area of the second portion. After solidification of the second portion, the foreign material may be removed by burning, chemical vaporization or other methods. Additional manufacturing operations may then be performed to the heat sink including milling, drilling, or similar operations.

Abstract

Further, a system is provided for dissipating heat from a semiconductor module including a semiconductor die and the unitary heat sink. The heat sink comprising a unitary body having both a porous and non-porous portion is provided. The non-porous portion is attached to the semiconductor die and configured to transfer heat to the porous portion for dissipation into the environment. In addition, a method for manufacturing the heat sink is provided.

Description

    BACKGROUND
  • 1. Field of the Invention
  • The present invention generally relates to thermal management of a semiconductor device. More specifically, the invention relates to a metal foam heat sink for thermal management of a semiconductor device.
  • 2. Description of Related Art
  • In electronic applications semiconductor devices can generate significant heat performing normal operations. This heat adversely affects the performance and reliability of the devices, if not dissipated. If the heat is not dissipated, the device may overheat such that the junction temperature increases to a level causing the device to fail or function improperly. Devices and interconnects may also fail due to the effects of thermal expansion caused by the overheating. For example, stress caused by a mismatch in thermal expansion between materials can cause solder joint cracking. Therefore, it is advantageous to maximize the capability of a device to remove heat and to minimize the effects of thermal expansion.
  • Heat dissipation from power devices is commonly accomplished with a metal heat sink, either on the top or bottom of the device. The heat sink is typically a metal block or sheet and may include fins. Fins provide additional surface area for the dissipation of heat. Fin structures with high surface area, however, are bulky and expensive often requiring complex machining operations for fabrication.
  • Recently, metal foam has been used in place of fins to aid in the dissipation of heat. The porosity of the metal foam creates an enormous surface area thereby providing high heat dissipation. Metal foam may be attached to a metal block or directly to the semiconductor device. However, utilizing metal foam in conjunction with a block heat sink requires an additional mechanical connection. The mechanical connection may be accomplished using solder or a layer of thermally conductive adhesive. This additional connection increases thermal resistance and hinders effective dissipation of the heat.
  • In view of the above, it is apparent that there exists a need for a heat sink that provides improved heat dissipation.
    • SUMMARY
  • In satisfying the above need, as well as overcoming the enumerated drawbacks and other limitations of the related art, the present invention provides a heat sink comprising a unitary body having both first and second portions, a porous and non-porous portion. The non-porous portion provides for the transfer and spreading of heat while the porous portion provides for heat dissipation. When implemented in a semiconductor module, including a semiconductor die and the heat sink, the non-porous portion of the heat sink is attached to the semiconductor die and configured to transfer heat to the porous portion, which dissipates the heat into the environment.
  • In yet another aspect of the invention, a method for manufacturing the heat sink is provided. The method includes the steps of forming a body having a first and a second portion, melting the second portion, and creating porosity in the second portion. The heat sink is made of a metal material, preferably a copper alloy. The alloy content of the portions may be varied such that the melting temperature of the second portion is lower than the melting temperature of the first portion. The varying melting temperature allows porosity to be created in the second portion. This can be achieved by forcing gas through the second portion or by inserting a material into the second portion that may be removed, by burning or chemical reaction, after the second portion has solidified.
  • Further objects, features and advantages of this invention will become readily apparent to persons skilled in the art after a review of the following description, with reference to the drawings and claims that are appended to and form a part of this specification.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a cutaway side view of a heat dissipating system in accordance with the present invention and implemented in connection with a semiconductor module.
    • DETAILED DESCRIPTION
  • Referring now to FIG. 1, a system embodying the principles of the present invention is illustrated therein and designated at 10. The system 10 generally includes a semiconductor die 12 and a heat sink 14.
  • A semiconductor die 12 generates heat while performing its normal operations. The die 12 is soldered to the metal vias 24. The metal vias 24 transfer the heat generated by the die 12 to the heat sink 14 at the opposite side of the printed circuit board 22. The heat sink 14 is attached to the thermal vias 24 and the printed circuit board 22 by a thermally conductive adhesive 20. However, other means of attachment including solder may be utilized.
  • The heat sink 14 includes a solid non-porous portion 16 and a porous portion 18. The non-porous portion 16 provides a thermal mass for heat spreading or sinking. The non-porous portion 16 also provides the ability to absorb short term transients allowing quick transfer of the heat away from the die. The porous portion 18 of the heat sink 14 provides an extremely large surface area for dissipation of the heat into the surrounding environment. Although, the heat sink 14 is described as a porous portion 18 and a non-porous portion 16 the heat sink is a single unitary structure thereby eliminating mechanical interfaces which may increase thermal resistance.
  • Natural convection may be used to dissipate heat from the porous portion 18 of the heat sink 14. However, air or liquid may also be forced through the porous section 18 of the heat sink 14. The flow of the gas or liquid cooling is illustrated by arrow 28. The heat sink 14 is preferably made of copper although aluminum or other metals may be used. In addition, the pore sizes and the thickness of each portion may be manipulated based on the package size and amount of heat to be dissipated.
  • In addition, a method for manufacturing the heat sink is provided. The heat sink will have a unitary body including a first and second portion. The first portion can be a solid non-porous metal block, and may include a higher alloy content thereby causing the first portion to have a higher melting temperature than the second portion. The second portion may be melted at a temperature such that the first portion remains solid. A porosity is then created in the melted or second portion of the heat sink. The porosity may be created by forcing gas through the melted portion. Alternatively, a foreign material may be inserted into the melted portion. With the foreign material integrated, the second portion may be allowed to solidify creating a porous surface area of the second portion. After solidification of the second portion, the foreign material may be removed by burning, chemical vaporization or other methods. Additional manufacturing operations may then be performed to the heat sink including milling, drilling, or similar operations.
  • As a person skilled in the art will readily appreciate, the above description is meant as an illustration of implementation of the principles this invention. This description is not intended to limit the scope or application of this invention in that the invention is susceptible to modification, variation and change, without departing from spirit of this invention, as defined in the following claims.

Claims (19)

1. A heat sink comprising a unitary body having first and second portions, the first portion being generally non-porous and the second portion being generally porous;
whereby the first portion transfers and spreads heat within the heat sink and the second portion substantially dissipates the heat from the heat sink.
2. The heat sink according to claim 1, wherein the first and second portions are made of a metal material.
3. The heat sink according to claim 1, wherein the first and second portions include a copper alloy.
4. The heat sink according to claim 1, wherein the first portion is generally solid.
5. The heat sink according to claim 1, wherein the second portion has a melting temperature that is lower than a melting temperature of the first portion.
6. A system for dissipating heat comprising:
a semiconductor die; and
a unitary heat sink attached to the semiconductor die, the heat sink including a non-porous portion and a porous portion.
7. The system according to claim 6, wherein the semiconductor die is soldered to the non-porous portion of the unitary heat sink.
8. The system according to claim 6, wherein the heat sink is made of a copper alloy.
9. The system according to claim 6, wherein a melting temperature of the porous portion is lower than a melting temperature of the non-porous portion.
10. The system according to claim 6, wherein a gas is forced through the porous portion of the heat sink.
11. The system according to claim 6, wherein a liquid is forced through the porous portion of the heat sink.
12. The system according to claim 11, wherein the fluid is a dielectric fluid.
13. A method for manufacturing a heat sink comprising the steps of:
forming a unitary body having a first portion therein and a second portion;
melting the second portion of the body; and
creating porosity in the second portion of the body.
14. The method according to claim 13, wherein the first portion has a higher melting temperature than the second portion.
15. The method according to claim 13, wherein the porosity is created by forcing a gas through the second portion.
16. The method according to claim 13, wherein the step of creating porosity includes the step of integrating a material into the second portion.
17. The method according to claim 16, further comprising the step of solidifying the second portion with the material integrated therein.
18. The method according to claim 17, further comprising the step of removing the material from the second portion.
19. The method according to claim 18, wherein the material is removed by a chemical interaction.
US10/697,839 2003-10-30 2003-10-30 Metal foam heat sink Abandoned US20050092478A1 (en)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070044941A1 (en) * 2005-08-30 2007-03-01 Ching-Lin Kuo Heatsink having porous fin
US20070069754A1 (en) * 2005-09-26 2007-03-29 International Business Machines Corporation Gel package structural enhancement of compression system board connections
US20070069358A1 (en) * 2005-09-26 2007-03-29 International Business Machines Corporation Gel package structural enhancement of compression system board connections
US20080089024A1 (en) * 2005-09-26 2008-04-17 International Business Machines Corporation Multi-Chip Module (MCM) of a Computer System
US20090139690A1 (en) * 2007-11-29 2009-06-04 Fraunhofer-Gesellschaft Zur, Foerderung Der Angewandten, Forschung E. V. Heat sink and method for producing a heat sink
US20110198067A1 (en) * 2006-06-08 2011-08-18 International Business Machines Corporation Sheet having high thermal conductivity and flexibility
US20170080554A1 (en) * 2016-11-30 2017-03-23 Caterpillar Inc. Hydraulic hammer assembly
BE1023686B1 (en) * 2015-11-12 2017-06-15 Maes Jonker Nv DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER
US10398020B2 (en) * 2017-10-24 2019-08-27 Autonetworks Technologies, Ltd. Circuit assembly and manufacturing method of circuit assembly
US20200107601A1 (en) * 2018-09-17 2020-04-09 Omius Inc. Dermal heatsink exhibiting hydrophilic and contaminant resistant properties and method for fabricating a dermal heatsink
EP3772246A1 (en) * 2019-08-02 2021-02-03 Hamilton Sundstrand Corporation Thermal management device and method of use
US20220029034A1 (en) * 2017-11-23 2022-01-27 Stmicroelectronics (Grenoble 2) Sas Encapsulation cover for an electronic package and fabrication process

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070044941A1 (en) * 2005-08-30 2007-03-01 Ching-Lin Kuo Heatsink having porous fin
US20070069754A1 (en) * 2005-09-26 2007-03-29 International Business Machines Corporation Gel package structural enhancement of compression system board connections
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US20080089024A1 (en) * 2005-09-26 2008-04-17 International Business Machines Corporation Multi-Chip Module (MCM) of a Computer System
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