US20050034977A1 - Electrochemical deposition chambers for depositing materials onto microfeature workpieces - Google Patents
Electrochemical deposition chambers for depositing materials onto microfeature workpieces Download PDFInfo
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- US20050034977A1 US20050034977A1 US10/859,749 US85974904A US2005034977A1 US 20050034977 A1 US20050034977 A1 US 20050034977A1 US 85974904 A US85974904 A US 85974904A US 2005034977 A1 US2005034977 A1 US 2005034977A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/425—Electro-ultrafiltration
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the present invention is directed toward apparatus and methods for processing microfeature workpieces having a plurality of microdevices integrated in and/or on the workpiece.
- the microdevices can include submicron features.
- Particular aspects of the present invention are directed toward electrochemical deposition chambers having a fixed unit, a detachable unit that can be quickly removed from the fixed unit, and an electrode in the detachable unit.
- Microdevices are manufactured by depositing and working several layers of materials on a single substrate to produce a large number of individual devices. For example, layers of photoresist, conductive materials, and dielectric materials are deposited, patterned, developed, etched, planarized, and otherwise manipulated to form features in and/or on a substrate. The features are arranged to form integrated circuits, micro-fluidic systems, and other structures.
- FIG. 1 schematically illustrates an integrated tool 10 that can perform one or more wet chemical processes.
- the tool 10 includes a housing or cabinet 20 having a platform 22 , a plurality of wet chemical processing chambers 30 in the cabinet 20 , and a transport system 40 .
- the tool 10 also includes lift-rotate units 32 coupled to corresponding processing chambers 30 for loading/unloading the workpieces W.
- the processing chambers 30 can be rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, or other types of wet chemical processing vessels.
- the transport system 40 includes a linear track 42 and a robot 44 that moves along the track 42 to transport individual workpieces W within the tool 10 .
- the integrated tool 10 further includes a workpiece storage unit 60 having a plurality of containers 62 for holding workpieces W. In operation, the robot 44 transports workpieces to/from the containers 62 and the processing chambers 30 according to a predetermined workflow within the tool 10 .
- One problem with repairing or maintaining existing electrochemical deposition chambers is that the tool must be taken offline for an extended period of time to replace the electrodes or service other components in the processing chambers 30 .
- the electrodes are removed while the processing chamber 30 remains in-situ on the platform.
- the lift/rotate unit 32 is generally moved out of the way and other components above the electrodes are removed from the chamber 30 to provide access to the electrodes through the top of the chamber.
- the worn electrodes are then disconnected and removed through the top of the chamber, and new electrodes are installed in the chamber 30 .
- the other components are reinstalled in the chamber 30 above the electrodes. This process requires a significant amount of time to disassemble and then reassemble the chamber 30 .
- the present invention is directed toward electrochemical deposition chambers with at least one electrode in a quick-release detachable unit that reduces the downtime for replacing worn electrodes.
- one or more consumable electrodes are housed within a detachable unit that can be quickly removed and replaced with another detachable unit. Worn electrodes can accordingly be quickly replaced with new electrodes by simply removing the detachable unit with the worn electrodes and installing a replacement detachable unit with new electrodes.
- the detachable unit is generally a lower portion of the chamber that is accessible without having to move the lift-rotate unit or otherwise open the chamber from above.
- the detachable units are also coupled to the chamber by a quick-release mechanism that can be easily accessible.
- the downtime for repairing or maintaining electrodes is greatly reduced by locating the electrodes in quick-release detachable units that can be removed and replaced in only a few minutes compared to the several hours it normally takes for replacing electrodes on existing electrochemical deposition chambers.
- an electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly.
- the head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece.
- the vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit.
- the electrochemical deposition chamber also includes an electrode in the detachable unit.
- the detachable unit further includes a fluid inlet for providing the processing fluid to the vessel and a fluid outlet for discharging processing fluid from the vessel.
- FIG. 1 is a schematic top plan view of a wet chemical processing tool in accordance with the prior art.
- FIG. 2 is cross-sectional view schematically illustrating an electrochemical deposition chamber in a detached configuration in accordance with an embodiment of the invention.
- FIG. 3 is a cross-sectional view schematically illustrating an electrochemical deposition chamber in an assembled configuration in accordance with an embodiment of the invention.
- FIG. 4 is a cross-sectional view illustrating an electrochemical deposition chamber in accordance with an embodiment of the invention.
- FIG. 5 is a cross-sectional view illustrating the electrochemical deposition chamber of FIG. 4 along a different cross section.
- FIG. 6 is a cross-sectional view illustrating a vessel for an electrochemical deposition chamber in accordance with another embodiment of the invention.
- FIG. 7 is a bottom isometric view of an electrochemical deposition chamber in accordance with an embodiment of the invention.
- FIG. 8 is a cross-sectional view illustrating an electrochemical deposition chamber in accordance with another embodiment of the invention.
- FIG. 9A is a top isometric view of a carriage for loading/unloading a detachable unit from a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 9B is a bottom isometric view of a carriage for loading/unloading a detachable unit of a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 10 is a top plan view of wet chemical processing tool including an electrochemical deposition chamber in accordance with another aspect of the invention.
- FIG. 11 is an isometric view of a mounting module for holding a wet chemical processing chamber in a wet chemical processing tool in accordance with an embodiment of the invention.
- FIG. 12 is a cross-sectional view taken along line 12 - 12 of FIG. 11 of a mounting module for carrying a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 13 is a cross-sectional view showing a portion of a deck of a mounting module in greater detail.
- FIG. 14 is a cross-sectional isometric view schematically illustrating a wet chemical processing chamber carried by a mounting module of a wet chemical processing tool in accordance with an embodiment of the invention.
- microfeature workpiece or “workpiece” refer to substrates' on or in which microdevices are formed integrally.
- Typical microdevices include microelectronic circuits or components, thin-film recording heads, data storage elements, microfluidic devices, and other products.
- Micromachines or micromechanical devices are included within this definition because they are manufactured using much of the same technology as used in the fabrication of integrated circuits.
- the substrates can be semiconductive pieces (e.g., doped silicon wafers or gallium arsenide wafers), nonconductive pieces (e.g., various ceramic substrates) or conductive pieces.
- electrochemical deposition chambers for processing microfeature workpieces are particularly useful for electrolytically depositing metals or electrophoretic resist in or on structures of a workpiece.
- the electrochemical deposition chambers in accordance with the invention can accordingly be used in tools with wet chemical processing chambers for etching, rinsing, or other types of wet chemical processes in the fabrication of microfeatures in and/or on semiconductor substrates or other types of workpieces.
- FIGS. 2-14 Several embodiments of electrochemical deposition chambers and integrated tools in accordance with the invention are set forth in FIGS. 2-14 and the corresponding text to provide a thorough understanding of particular embodiments of the invention. A person skilled in the art will understand, however, that the invention may have additional embodiments or that the invention may be practiced without several of the details of the embodiments shown in FIG. 2-14 .
- FIG. 2 schematically illustrates a cross-section of an electrochemical deposition chamber 100 that enables quick replacement of electrodes and other components to reduce the downtime for maintaining processing chambers.
- the processing chamber 100 includes a wet chemical vessel 102 and a head 104 (shown schematically).
- the vessel 102 is carried by a deck 106 (shown schematically) of a tool that can include several other processing chambers (not shown) and a workpiece transport system (not shown) for automatically handling workpieces.
- the vessel 102 contains the processing fluid and several components for directing the processing fluid or otherwise imparting properties to the processing fluid for processing a workpiece.
- the head 104 is carried by a lift- rotate unit 108 (shown schematically) that moves the head 104 to load/unload the workpiece and to position the workpiece at a processing site 109 relative to the vessel 102 .
- the head 104 typically includes a workpiece holder 105 having a contact assembly with a plurality of electrical contacts configured to engage a conductive layer on the workpiece.
- Suitable workpiece holders are disclosed in U.S. Pat. No. 6,309,524, U.S. application Ser. No. 09/717,927, and U.S. application Ser. No. 09/823,948, all of which are herein incorporated by reference.
- the vessel 102 includes a fixed unit 110 mounted to the deck 106 and a detachable unit 120 carried by the fixed unit 110 .
- the fixed unit 110 can include a chassis 112 , a first flow system 114 (shown schematically), and a mounting fixture 116 .
- the chassis 112 can be a dielectric housing that is chemically compatible with the processing fluid.
- the chassis 112 for example, can be a high density polymer or other suitable material.
- the first flow system 114 can be configured to provide the desired flow to the processing site 109 . In electrochemical deposition chambers, the first flow system 114 can be configured to provide a flow that has a substantially uniform velocity in a direction normal to the workpiece along the processing site 109 .
- the mounting fixture 116 can be flanges or a ring projecting outwardly from the chassis 112 to engage the top surface of the deck 106 .
- the mounting fixture 116 can be configured to precisely locate the fixed unit 110 relative to the deck 106 .
- the fixed unit 110 can further include a processing component 118 to impart a property to the processing fluid flowing through the fixed unit 110 .
- the processing component 118 can be an electric field shaping element or field shaping module that shapes the electric field in the processing site 109 .
- the field shaping element can be a static dielectric insert that controls the current density in the processing site 109 .
- the field shaping element can also be a dynamic member that moves to alter or otherwise control the electrical field at the processing site 109 during a plating cycle.
- the processing component 118 can also be a filter, membrane, or any combination of these types of structures.
- the detachable unit 120 of the vessel 102 includes a container 122 and a second flow system 124 (shown schematically) configured to direct the processing fluid to and/or from the first flow system 114 of the fixed unit 110 .
- the second flow system 124 can include an inlet 126 to deliver processing fluid to the vessel 102 and an outlet 127 through which processing fluid exits the vessel 102 .
- the first and second flow systems operate together to provide a desired flow of processing fluid through the vessel 102 .
- the first and second flow systems 114 and 124 can be configured to provide a forward flow relative to the processing component 126 . In a forward flow system, at least a portion of the processing fluid passes the electrode 130 in the detachable unit 120 before the processing fluid reaches the processing site 109 .
- the first and second flow systems can also be configured to provide a reverse flow in which at least a portion of the processing fluid passes the electrode after the processing fluid has passed through the processing site 109 .
- the chamber 100 can also include one or more electrodes 130 (shown schematically) and optional processing components 150 (shown schematically) disposed in the detachable unit 120 .
- the processing component 150 can be a filter and/or a membrane. Several embodiments of electrodes, filters, and membranes are described below.
- the vessel 102 also includes an interface element 160 to prevent leaking or to otherwise control the flow of processing fluid between the fixed unit 110 and the detachable unit 120 .
- the interface element 160 can be a seal positioned between the fixed unit 110 and the detachable unit 120 .
- the seal can include at least one orifice to allow the processing fluid to flow between the first flow system 114 in the fixed unit 110 and the second flow system 124 in the detachable unit 120 .
- the interface element 160 is a gasket with a pattern of orifices to allow fluid to flow between the first and second flow systems 114 and 124 .
- the interface element 160 is typically a compressible member that prevents liquid from leaking between the various flow channels of the flow systems.
- the interface element 160 can also be made from a dielectric material that electrically isolates different fluid flows as they flow between the first and second flow systems 114 and 124 .
- Suitable materials for the interface element 160 include VITON® closed cell foams, closed cell silicon, elastomers, polymers, rubber and other materials.
- the vessel 102 also includes an attachment assembly 170 for attaching the detachable unit 120 to the fixed unit 110 .
- the attachment assembly 170 can be a quick-release unit, such as a clamp or a plurality of clamps, that securely holds the detachable unit 120 to the fixed unit 110 .
- the attachment assembly 170 can be configured to move from a first position in which the detachable unit 120 is secured to the fixed unit 110 and a second position in which the detachable unit 120 can be removed from the fixed unit 110 . In several embodiments, as the attachment assembly 170 moves from the second position to the first position, the attachment assembly 170 drives the detachable unit 120 toward the fixed unit 110 .
- the attachment assembly 170 can be a clamp ring, a plurality of latches, a plurality of bolts, or other types of fasteners.
- the fixed unit 110 can further include a plurality of hangers 180 arranged at a common radius with respect to a center line of the fixed unit 110 or in another configuration.
- the hangers 180 can include shoulders 182 to hold the attachment assembly 170 .
- the attachment assembly 170 can be a ring that springs radially outwardly to contact the hangers 180 and rest on the shoulders 182 in an open position.
- the fixed unit 110 further includes a beveled guide surface 183 , a bearing ring 184 above the beveled guide surface 183 , and a seal surface 186 .
- the guide surface 183 can be an annular surface or a series of arcuate segments inclined upwardly with increasing radius.
- the bearing ring 184 can be a metal ring having a bearing surface inclined upwardly with decreasing radius.
- the bearing ring 184 can also be made from other materials that are typically harder than the material of the chassis 112 .
- the detachable unit 120 can include a rim 190 having a lower surface 192 and an upper surface 194 .
- the lower surface 192 and the upper surface 194 can be inclined upwardly with increasing radius.
- the upper surface 194 more specifically, can be inclined at an angle to mate with the guide surface 183 of the fixed unit 110 .
- the detachable unit 120 can further include a seal surface 195 configured to retain the interface element 160 , slide channels 196 a and 196 b, and a bottom surface 197 .
- the attachment assembly 170 can include a first rim 172 configured to engage the lower surface 192 of the detachable unit 120 and a second rim 174 configured to engage the bearing surface of the bearing ring 184 .
- the attachment assembly 170 can include a latch (shown in FIG. 7 ) or lever that moves the ring radially inwardly and locks the ring into a fixed position.
- FIG. 3 illustrates the vessel 102 after the detachable unit 120 has been attached to the fixed unit 110 .
- the attachment assembly 170 moves radially inwardly so that the first rim 172 engages the lower surface 192 of the detachable unit 120 and the second rim 174 engages the bearing surface of the bearing ring 184 .
- the upper surface 194 engages the guide surface 183 to position the detachable unit 120 at a desired position with respect to the fixed unit 110 .
- the firm rim 172 and the second rim 174 of the attachment assembly 170 move radially inwardly along the bottom surface 192 and the bearing ring 184 , respectively, to clamp the interface element 160 between the seal surfaces 185 and 195 .
- a lever (shown in FIG. 7 ) on the attachment assembly 170 can be moved from an open position to a closed position to induce a hoop stress in the attachment assembly 170 for securely holding the detachable unit 120 to the fixed unit 110 .
- One advantage of the processing chamber 100 illustrated in FIGS. 2 and 3 is that worn electrodes can be quickly replaced with new or refurbished electrodes without shutting down the processing chamber 100 for a significant period of time.
- a detachable unit 120 with worn electrodes 130 can be quickly removed from the fixed unit 110 , and then a replacement detachable unit 120 with new electrodes 130 can be installed in only a matter of a few minutes. This significantly reduces the downtime for repairing electrodes or other processing components compared to conventional systems that require the components to be repaired in-situ on the tool or require the entire chamber to be removed from the tool.
- Another advantage of the processing chamber 100 is that the electrodes and/or other processing components 150 in the detachable units 120 can be replaced from a location that is easily accessible under the deck 106 . As a result, there is no need to move either the fixed unit 110 , the head 104 , or the lift-rotate unit 108 to replace worn processing components. This further reduces the downtime for maintaining processing components because the head 104 and lift- rotate unit 108 do not need to be repositioned with respect to the fixed unit 110 . Moreover, a workpiece transport system that delivers the workpieces to the head 104 and retrieves the workpieces from the head 104 does not need to be recalibrated to the processing chamber 100 because replacing the electrodes does not change the position between the head 104 and the workpiece transport system. The significant reduction in downtime for replacing processing components provided by the processing chamber 100 is expected to significantly increase the productivity of the tool compared to existing tools.
- FIGS. 4-6 illustrate aspects of embodiments of vessels having multiple electrodes for electrochemical deposition of materials. Many aspects of these embodiments are described in the context of having four independently operable electrodes in the detachable unit. Each electrode can be controlled independent of the other electrodes such that each electrode can generate an individual current density that can remain constant or can change dynamically during a plating cycle. Suitable processes for operating the electrodes are set forth in U.S. patent application Ser. Nos. 09/849,505; 09/866,391; and 09/866,463, all of which are herein incorporated by reference. Additionally, it will be appreciated that other embodiments of the multiple electrode vessels can have any combination of two or more electrodes such that the invention is not limited to having four electrodes.
- FIG. 4 is a cross-sectional view illustrating a vessel 400 having a fixed unit 402 configured to be fixedly attached to a deck (not shown) and a detachable unit 404 releasably attachable to the fixed unit 402 .
- the fixed unit 402 can include a mounting fixture 116 to fixedly attach the fixed unit 402 to the deck of a tool as described above.
- the detachable unit 404 can be releasably attached to the fixed unit 402 using a clamp ring 170 and hangers 180 as described above. Additionally, the detachable unit 404 has a rim 190 and the fixed unit 402 has an inclined guide surface 183 to position the detachable unit 404 with respect to the fixed unit 402 .
- the detachable unit 404 can accordingly be removed from the fixed unit 402 in a short period of time as described above with respect to the embodiments shown in FIGS. 2 and 3 .
- the fixed unit 402 includes a chassis 410 having a flow system 414 to direct the flow of processing fluid through the chassis 410 .
- the flow system 414 can be a separate component attached to the chassis 410 , or the flow system 414 can be a combination of fluid passageways formed in the chassis 410 and separate components attached to the chassis 410 .
- the flow system 414 includes an inlet 415 that receives a flow of processing fluid from the detachable unit 404 , a first flow guide 416 having a plurality of slots 417 , and an antechamber 418 .
- the slots 417 in the first flow guide 416 distribute the flow radially to the antechamber 418 .
- the flow system 414 further includes a second flow guide 420 that receives the flow from the antechamber 418 .
- the second flow guide 420 can include a sidewall 421 having a plurality of openings 422 and a flow projector 424 having a plurality of apertures 425 .
- the openings 422 can be horizontal slots arranged radially around the sidewall 421 to provide a plurality of flow components projecting radially inwardly toward the flow projector 424 .
- the apertures 425 in the flow projector can be a plurality of elongated slots or other openings that are inclined upwardly and radially inwardly.
- the flow projector 424 receives the radial flow components from the openings 422 and redirects the flow through the apertures 425 .
- the openings 422 and the apertures 425 can have several different configurations.
- the apertures 425 can project the flow radially inwardly without being canted upwardly, or the apertures 425 can be canted upwardly at a greater angle than the angle shown in FIG. 4 .
- the apertures can accordingly have an inclination ranging from 0°-45°, and in several specific embodiments the apertures can be canted upwardly at an angle of approximately 5°-25°.
- the fixed unit 402 can also include a field shaping insert 440 for shaping the electrical field(s) and directing the flow of processing fluid at the processing site.
- the field shaping insert 440 has a first partition 442 a with a first rim 443 a, a second partition 442 b with a second rim 443 b, and a third partition 442 c with a third rim 443 c.
- the first rim 443 a defines a first opening 444 a.
- the first rim 443 a and the second rim 443 b define a second opening 444 b
- the second rim 443 b and the third rim 443 c define a third opening 444 c.
- the fixed unit 402 can further include a weir 445 having a rim 446 over which the processing fluid can flow into a recovery channel 447 .
- the third rim 443 c and the weir 445 define a fourth opening 444 d.
- the field shaping unit 440 and the weir 445 are attached to the fixed unit 402 by a plurality of bolts or screws 448 , and a number of seals 449 are positioned between the fixed unit 402 and both the field shaping unit 440 and the weir 445 .
- FIG. 5 is a cross-sectional view of the vessel 400 shown in FIG. 4 taken along a different section that shows the interaction between the fixed unit 402 and the detachable unit 404 in greater detail.
- the detachable unit 404 includes a container 510 that houses an electrode assembly and a second flow system.
- the container 510 is also releasably attachable to the chassis 410 as described above.
- the container 510 includes a plurality of dividers or walls 512 that define a plurality of compartments 513 .
- the specific embodiment shown in FIGS. 4 and 5 has four compartments 513 , but in other embodiments the container 510 can include any number of compartments to house the electrodes individually.
- the compartments 513 can also define a part of a second flow system through which processing fluid can flow.
- the detachable unit 404 includes a flow system having an inlet 515 that provides the flow to the inlet 415 of the fixed unit 402 and an outlet 516 that receives the fluid flow from the compartments 513 .
- the flow system 414 in the fixed unit 402 further includes a first channel 520 a between the antechamber 418 and a first compartment 513 , a second channel 520 b between the first opening 444 b and a second compartment 513 , a third channel 520 c between the third opening 444 c and a third compartment 513 , and a fourth channel 520 d between the fourth opening 444 d and a fourth compartment 513 .
- the vessel 400 also includes an interface element 530 between the fixed unit 402 and the detachable unit 404 .
- the interface element 530 is a seal having a plurality of openings 532 to allow fluid communication between the channels 520 a-d and the corresponding compartments 513 .
- the seal is a dielectric material that electrically isolates the electric fields within the compartments 513 and the corresponding channels 520 a-d.
- the vessel 400 can further include a plurality of electrodes disposed in the detachable unit 404 .
- the vessel 400 includes a first electrode 551 in the first compartment 513 , a second electrode 552 in the second compartment 513 , a third electrode 553 in the third compartment 513 , and a fourth electrode 554 in the fourth compartment 513 .
- the electrodes 551 - 554 can be annular or circular conductive elements arranged concentrically with one another.
- the electrodes can be arcuate segments or have other shapes and arrangements.
- each electrode is coupled to an electrical connector 560 that extends through the container 510 of the detachable unit 404 to couple the electrodes to a power supply.
- the electrodes 551 - 554 can each provide a constant current throughout a plating cycle, or the current through one or more of the electrodes 551 - 554 can be changed during a plating cycle according to the particular parameters of the workpiece. Moreover, each electrode can have a unique current that is different than the current of the other electrodes.
- the fixed unit 402 , the detachable unit 404 , and the electrodes 551 - 554 operate together to provide a desired flow profile of processing fluid and electrical profile at the processing site 109 .
- the processing fluid enters through the inlets 515 and 415 and passes through the first flow guide 416 .
- the fluid flow then bifurcates with a portion of the fluid flowing up through the second fluid guide 420 via the antechamber 418 and another portion of the fluid flowing down across the first electrode 551 via the channel 520 a.
- the upward fluid flow through the second flow guide 420 passes through the flow projector 424 and the first opening 444 a.
- the first electrode 551 accordingly provides an electrical field that is effectively exposed to the processing site 109 through the first opening 444 a defined by the rim 443 a of the first partition 442 a ( FIGS. 4 ).
- the opening 444 a accordingly shapes the field of the first electrode 551 according to the configuration of the rim 443 a.
- a portion of the flow passes upwardly over the rim 443 a, goes through the processing site 109 , and then flows over the rim 446 of the weir 445 .
- Another portion of the processing fluid flows downwardly through each of the channels 520 b-d to the electrodes 552 - 554 .
- the portion of the flow passing through the second channel 520 b passes over the second electrode 552 such that the opening 444 b defined by the first rim 443 a and the second rim 443 b shapes the electrical field of the second electrode 552 .
- the flow through the third channel 520 c passes over the third electrode 553 and the flow through the fourth channel 520 d passes over the fourth electrode 554 .
- the opening 444 c accordingly shapes the electrical field from the third electrode 553
- the opening 444 d shapes the electrical field from the fourth electrode 554 .
- the flow then passes through the compartments 513 and exits the vessel 400 through the outlet 516 .
- This flow profile is a reverse flow in which the electrodes 551 - 554 are downstream from the processing site 109 so that bubbles or particulate matter in the processing fluid generated by the electrodes 551 - 554 is carried away from the processing site 109 .
- the downstream configuration is expected to be particularly useful for consumable electrodes because they are subject to generating bubbles and particulate matter that can cause defects on the plated surface of a workpiece.
- the vessel 400 is expected to significantly:reduce the downtime associated with replacing multiple electrodes compared to existing electrochemical deposition chambers.
- all of the electrodes 551 - 554 can be replaced with new electrodes by simply opening the attachment assembly 170 , removing the detachable unit 404 from the fixed unit 402 , positioning a replacement detachable unit with new electrodes under the fixed unit 402 , and then closing the attachment assembly 170 . Because the detachable unit 404 is located externally of the fixed unit 402 , an operator does not need to reach through the top opening of the fixed unit 402 to reach the electrodes 551 - 554 as in conventional chambers.
- Electrodes 551 - 554 do not need to be disassembled from the vessel while the chamber is off-line because the replacement detachable unit can be ready to install as soon as the detachable unit with the worn electrodes is removed.
- the electrochemical deposition chambers with embodiments of the vessels 102 or 400 can accordingly be brought back online in significantly less time than conventional chambers.
- FIG. 6 is a cross-sectional view of another embodiment of a vessel 400 .
- This embodiment is similar to the embodiment shown in FIGS. 4 and 5 , and thus like reference numbers refer to like components in these figures.
- the embodiment of the vessel 400 shown in FIG. 6 includes an interface element 610 having a gasket 620 and a liner 630 .
- the gasket 620 can be positioned between the fixed unit 402 and the detachable unit 404
- the liner 630 can be disposed in the detachable unit 404 and/or the fixed unit 402 .
- the liner 630 can be a membrane or filter that entraps bubbles or particulate matter in the compartments 513 to prevent them from migrating to the processing site 109 .
- the processing fluid flows through the liner 630 between the fixed unit 402 and the detachable unit 404 in accordance with the flow for either a forward flow system or a reverse flow system.
- the liner 630 can be impermeable to fluid flow but allow ions to pass from the electrodes 551 - 554 through the corresponding channels 520 a-d to provide ions for plating onto the surface of the workpiece.
- the liner 630 can have a plurality of discrete sections positioned in the compartments 513 and/or the channels 520 a-d.
- the gasket 620 can be attached to the liner 630 so the interface element 610 can be installed or removed as a single component.
- the embodiment of the chamber 400 shown in FIG. 6 is expected to be very useful in applications where bubbles and particulate matter create defects. It will be appreciated that the liner 630 should further impair bubbles or particulate matter from reaching the processing site 109 .
- the chamber 400 shown in FIG. 6 may also be useful in applications where one processing fluid is used in the fixed unit and another processing fluid is used in the detachable unit.
- the detachable liner 630 can be a membrane that allows ions to flow from the compartments 513 to the channels 520 a- 520 d, but does not allow the processing fluids to flow between the compartments 513 and the channels 520 a- 520 d.
- FIG. 7 is a bottom isometric view illustrating various aspects of the vessel 400 in accordance with additional embodiments of the invention.
- the vessel 400 can further includes a first fitting 701 to couple the inlet 515 with a supply of processing fluid and a second fitting 702 to connect the outlet 516 with a holding tank of processing fluid.
- the fitting 701 is a female fitting and the inlet 515 is a male fitting
- the fitting 702 is a male fitting and the outlet 516 is a female fitting.
- the processing fluid supply line can only be connected to the inlet 515 and the processing fluid exit line can only be connected to the outlet 516 . This configuration accordingly ensures that the detachable unit 404 is installed properly.
- FIG. 7 also illustrates the attachment assembly 170 in further detail.
- the attachment assembly 170 includes a clamp ring 708 and a latch 710 that moves the clamp ring between a first position having a first diameter and a second position having a second diameter less than the first diameter.
- the latch 710 moves the clamp ring from the first position to the second position, the diameter of the clamp ring 708 decreases to clamp the detachable unit 404 to the fixed unit 402 .
- FIG. 8 illustrates another embodiment of a vessel in accordance with the invention.
- the vessel 800 shown in FIG. 8 has a fixed unit 810 , a detachable unit 820 releasably attachable to the fixed unit 810 by a clamp 830 , and an interface element 840 between the fixed unit 810 and the detachable unit 820 .
- the primary difference between the vessel 800 and the vessel 400 is that the vessel 800 has a non-planer interface element 840 and the vessel 400 has a planer interface element 530 .
- the chambers 100 , 400 and 800 described above can further include carriages under the chambers to install and remove the detachable units.
- carriages are described below in the context of the detachable unit 404 , but it will be appreciated that the carriages can work with any detachable units of the invention.
- FIG. 9A is a top isometric view of a carriage 900 for installing and removing the detachable unit 404 ( FIG. 4 ).
- the carriage 900 can include a bracket 910 that mounts to the underside of the deck 106 ( FIG. 2 ) of the tool.
- the carriage 900 can further include guide rails 912 and an end stop 914 .
- the guide rails 912 receive the slide channels 196 a and 196 b ( FIGS. 2, 3 , 5 and 7 ) and the end stop 914 engages a rounded portion of the detachable unit 404 .
- an operator slides the detachable unit 404 along the rails 912 until the detachable unit engages the end stop 914 .
- FIG. 9B is a bottom isometric view illustrating additional aspects of the carriage 900 .
- the carriage 900 can further include an actuator 920 having a handle 922 , a shaft 924 , and lifters 926 that are moved by the shaft 924 .
- the actuator 920 can further include a rod 928 connected to the lifters 926 and positioned in a joint 929 . The rotation of the handle accordingly rotates the rod 928 within the joint 929 to raise and lower the lifters 926 .
- the actuator 920 is moved to a first position as shown in FIG. 9B , and a detachable unit is inserted along the rails 912 .
- the actuator 920 is then lifted upwardly (arrow R) to a second position, which causes the lifters 926 to raise the detachable unit 404 to the fixed unit 402 .
- the handle 922 passes through a gap 930 in a bottom flange 931 of the bracket 910 .
- the actuator 920 is held in the second position by sliding the handle 922 axially along the shaft 924 so that the flange 931 supports the handle 922 .
- the carriage 900 further enhances the process of replacing one detachable unit with another.
- the carriage 900 ensures that the detachable unit 404 is generally aligned with fixed unit 402 .
- the carriage ensures that the inlet 515 and the outlet 516 are aligned with the supply line and exit line.
- the carriage makes it easier to install and remove the detachable unit 404 because the operator does not need to hold the detachable unit 404 against the fixed unit 402 while simultaneously operating the attachment assembly 170 . Therefore, the carriage is expected to further reduce the time the replace one detachable unit with another.
- FIGS. 10-13 illustrate an embodiment of a processing tool in which the electrochemical deposition chambers can be used.
- FIG. 10 is a top plan view showing a portion of an integrated tool 1600 in accordance with an embodiment of the invention.
- the integrated tool 1600 includes a frame 1610 , a dimensionally stable mounting module 1620 mounted to the frame 1610 , a plurality of wet chemical processing chambers 1670 , and a plurality of lift-rotate units 1680 .
- the tool 1600 can also include a transport system 1690 .
- the mounting module 1620 carries the processing chambers 1670 , the lift-rotate units 1680 , and the transport system 1690 .
- the wet chemical processing chambers 1670 in the tool 1600 can include electrochemical deposition chambers having fixed units and detachable units as described above with reference to FIGS. 2-9B . As such, any of the embodiments of the electrochemical deposition chambers described above can be the wet chemical processing chambers 1670 in the integrated tool 1600 .
- the frame 1610 of the tool 1600 has a plurality of posts and cross-bars that are welded together in a manner known in the art.
- the mounting module 1620 is at least partially housed within the frame 1610 . In one embodiment, the mounting module 1620 is carried by the frame 1610 , but the mounting module 1620 can stand directly on the floor of the facility or other structures in other embodiments.
- the mounting module 1620 is a rigid, stable structure that maintains the relative positions between the wet chemical processing chambers 1670 , the lift- rotate units 1680 , and the transport system 1690 .
- One aspect of the mounting module 1620 is that it is much more rigid and has a significantly greater structural integrity compared to the frame 1610 so that the relative positions between the wet chemical processing chambers 1670 , the lift-rotate units 1680 , and the transport system 1690 do not change over time.
- Another aspect of the mounting module 1620 is that it includes a dimensionally stable deck 1630 with positioning elements at precise locations for positioning the processing chambers 1670 and the lift-rotate units 1680 at known locations on the deck 1630 .
- the transport system 1690 can be mounted directly to the deck 1630 .
- the mounting module 1620 also has a dimensionally stable platform 1650 and the transport system 1690 is mounted to the platform 1650 .
- the deck 1630 and the platform 1650 are fixedly positioned relative to each other so that positioning elements on the deck 1630 and positioning elements on the platform 1650 do not move relative to each other.
- the mounting module 1620 accordingly provides a system in which wet chemical processing chambers 1670 and lift-rotate units 1680 can be removed and replaced with interchangeable components in a manner that accurately positions the replacement components at precise locations on the deck 1630 .
- the tool 1600 is particularly suitable for applications that have demanding specifications which require frequent maintenance of the wet chemical processing chambers 1670 , the lift-rotate units 1680 , or the transport system 1690 .
- a wet chemical processing chamber 1670 can be repaired or maintained by simply detaching the chamber from the processing deck 1630 and replacing the chamber 1670 with an interchangeable chamber having mounting hardware configured to interface with the positioning elements on the deck 1630 . Because the mounting module 1620 is dimensionally stable and the mounting hardware of the replacement processing chamber 1670 interfaces with the deck 1630 , the chambers 1670 can be interchanged on the deck 1630 without having to recalibrate the transport system 1690 .
- This aspect of the tool 1600 is particularly useful when the fixed unit 110 ( FIG. 2 ) must be removed to repair the chamber, but it is also useful when only the detachable unit is removed from the fixed unit.
- the transport system 1690 retrieves workpieces from a load/unload module 1698 attached to the mounting module 1620 .
- the transport system 1690 includes a track 1692 , a robot 1694 , and at least one end-effector 1696 .
- the track 1692 is mounted to the platform 1650 . More specifically, the track 1692 interfaces with positioning elements on the platform 1650 to accurately position the track 1692 relative to the chambers 1670 and the lift-rotate units 1680 attached to the deck 1630 .
- the robot 1694 and end-effectors 1696 can accordingly move in a fixed, dimensionally stable reference frame established by the mounting module 1620 .
- the tool 1600 can further include a plurality of panels 1699 attached to the frame 1610 to enclose the mounting module 1620 , the wet chemical processing chambers 1670 , the lift-rotate units 1680 , and the transport system 1690 in a cabinet.
- the panels 1699 on one or both sides of the tool 1600 can be removed in the region above the processing deck 1630 to provide an open tool.
- FIG. 11 is an isometric view of a mounting module 1620 in accordance with an embodiment of the invention for use in the tool 1600 .
- the deck 1630 includes a rigid first panel 1631 and a rigid second panel 1632 superimposed underneath the first panel 1631 .
- the first panel 1631 can be an outer member and the second panel 1632 can be an interior member juxtaposed to the outer member.
- the first and second panels 1631 and 1632 can also have different configurations than the configuration in FIG. 11 .
- a plurality of chamber receptacles 1633 are disposed in the first and second panels 1631 and 1632 to receive the wet chemical processing chambers 1670 ( FIG. 10 ).
- the deck 1630 can further include a plurality of positioning elements 1634 and attachment elements 1635 arranged in a precise pattern across the first panel 1631 .
- the positioning elements 1634 can be holes machined in the first panel 1631 and dowels or pins that are positioned in the machined holes.
- the positioning elements 1634 can be pins, such as cylindrical pins or conical pins, that are not positioned in holes on the deck 1630 , but still project upwardly from the first panel 1631 to be received by mating structures in the wet chemical processing chambers 1670 .
- the deck 1630 has a first set of positioning elements 1634 located at each chamber receptacle 1633 to accurately position the individual wet chemical processing chambers at precise locations on the mounting module 1620 .
- the deck 1630 can also include a second set of positioning elements 1634 near each receptacle 1633 to accurately position individual lift-rotate units 1680 at precise locations on the mounting module 1620 .
- the attachment elements 1635 can be threaded holes in the first panel 1631 that receive bolts to secure the chambers 1670 and the lift-rotate units 1680 to the deck 1630 .
- the mounting module 1620 also includes exterior side plates 1660 along longitudinal outer edges of the deck 1630 , interior side plates 1661 along longitudinal inner edges of the deck 1630 , and endplates 1662 and 1664 attached to the ends of the deck 1630 .
- the transport platform 1650 is attached to the interior side plates 1661 and the end plates 1662 and 1664 .
- the transport platform 1650 includes positioning elements 1652 for accurately positioning the track 1692 ( FIG. 10 ) of the transport system 1690 on the mounting module 1620 .
- the transport platform 1650 can further include attachment elements, such as tapped holes, that receive bolts to secure the trackl 692 to the platform 1650 .
- FIG. 12 is a cross-sectional view illustrating one suitable embodiment of the internal structure of the deck 1630
- FIG. 13 is a detailed view of a portion of the deck shown in FIG. 12
- the deck 1630 includes bracing 1640 , such as joists, extending laterally between the exterior side plates 1660 and the interior side plates 1661 .
- the first panel 1631 is attached to the upper side of the bracing 1640
- the second panel 1632 is attached to the lower side of the bracing 1640 .
- the deck 1630 can further include a plurality of through-bolts 1642 and nuts 1644 that secure the first and second panels 1631 and 1632 to the bracing 1640 .
- the bracing 1640 has a plurality of holes 1645 through which the through-bolts 1642 extend.
- the nuts 1644 can be welded to the bolts 1642 to enhance the connection between these components.
- the panels and bracing of the deck 1630 can be made from stainless steel, other metal alloys, solid cast materials, or fiber-reinforced composites.
- the panels and plates can be made from Nitronic 50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxy filled with mica.
- the fiber- reinforced composites can include a carbon-fiber or Kevlar® mesh in a hardened resin.
- the material for the panels 1631 and 1632 should be highly rigid and compatible with the chemicals used in the wet chemical processes. Stainless steel is well-suited for many applications because it is strong but not affected by many of the electrolytic solutions or cleaning solutions used in wet chemical processes.
- the panels and plates 1631 , 1632 , 1660 , 1661 , 1662 and 1664 are 0.125 to 0.375 inch thick stainless steel, and more specifically they can be 0.250 inch thick stainless steel.
- the panels and plates, however, can have different thickness in other embodiments.
- the bracing 1640 can also be stainless steel, fiber-reinforced composite materials, other metal alloys, and/or solid cast materials.
- the bracing can be 0.5 to 2.0 inch wide stainless steel joists, and more specifically 1.0 inch wide by 2.0 inches tall stainless steel joists.
- the bracing 1640 can be a honey-comb core, a light-weight foamed metal or other type of foam, polymers, fiber glass or other materials.
- the mounting module 1620 is constructed by assembling the sections of the deck 1630 , and then welding or otherwise adhering the end plates 1662 and 1664 to the sections of the deck 1630 .
- the components of the deck 1630 are generally secured together by the through-bolts 1642 without welds.
- the outer side plates 1660 and the interior side plates 1661 are attached to the deck 1630 and the end plates 1662 and 1664 using welds and/or fasteners.
- the platform 1650 is then securely attached to the end plates 1662 and 1664 , and the interior side plates 1661 .
- the mounting module 1620 provides a heavy-duty, dimensionally stable structure that maintains the relative positions between the positioning elements 1634 on the deck 1630 and the positioning elements 1652 on the platform 1650 within a range that does not require the transport system 1690 to be recalibrated each time a replacement processing chamber 1670 or lift-rotate unit 1680 is mounted to the deck 1630 .
- the mounting module 1620 is generally a rigid structure that is sufficiently strong to maintain the relative positions between the positioning elements 1634 and 1652 when the wet chemical processing chambers 1670 , the lift-rotate units 1680 , and the transport system 1690 are mounted to the mounting module 1620 .
- the mounting module 1620 is configured to maintain the relative positions between the positioning elements 1634 and 1652 to within 0.025 inch.
- the mounting module is configured to maintain the relative positions between the positioning elements 1634 and 1652 to within approximately 0.005 to 0.015 inch.
- the deck 1630 often maintains a uniformly flat surface to within approximately 0.025 inch, and in more specific embodiments to approximately 0.005-0.015 inch.
- FIG. 14 is an isometric cross-sectional view showing the interface between a wet chemical processing chamber 1670 and the deck 1630 .
- the chamber 1670 can include the processing vessels 102 or 400 described above and a collar 1672 .
- the collar 1672 and the vessel 102 can be separate components that are connected together.
- the collar 1672 can be made from a dimensionally stable material, such as stainless steel, fiber- reinforced materials, steel alloys, cast solid materials, or other suitably rigid materials.
- the collar 1672 is integral with the vessel 102 and formed from a high-density polymer or other suitable material, such as the mounting fixture 116 shown in FIG. 2 .
- the collar 1672 includes a plurality of interface members 1674 that are arranged in a pattern to be aligned with the positioning elements 1634 on the deck 1630 .
- the positioning elements 1634 and the interface members 1674 are also configured to mate with one another to precisely position the collar 1672 , and thus the chamber 1670 , at a desired operating location on the deck 1630 to work with lift-rotate unit 1680 and the transport system 1690 .
- the positioning elements 1634 can be a set of precisely machined holes in the deck 1630 and dowels received in the holes.
- the interface members 1674 can accordingly be holes precisely machined in the collar 1672 to mate with the dowels.
- the dowels can be pins with cylindrical, spherical, conical or other suitable shapes to align and position the collar 1672 at a precise location relative to the deck 1630 .
- the collar 1672 can further include a plurality of fasteners 1675 arranged to be aligned with the attachment elements 1635 in the deck 1630 .
- the fasteners 1675 can be bolts or other threaded members that securely engage the attachment elements 1635 to secure the collar 1672 to the deck 1630 .
- the collar 1672 accordingly holds the processing vessel 102 at a fixed, precise location on the deck.
Abstract
An electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly. The head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece. The vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit. The electrochemical deposition chamber also includes an electrode in the detachable unit.
Description
- The present application claims the benefit of U.S. Application No. 60/476,786 filed on Jun. 6, 2003; 60/476,333 filed on Jun. 6, 2003; 60/476,881 filed on Jun. 6, 2003; and 60/476,776 filed on Jun. 6, 2003, all of which are incorporated herein in their entirety, including appendices, by reference. Additionally, U.S. Application No. 60/501,566 filed on Sep. 9, 2003 is also incorporated herein in its entirety by reference.
- The present invention is directed toward apparatus and methods for processing microfeature workpieces having a plurality of microdevices integrated in and/or on the workpiece. The microdevices can include submicron features. Particular aspects of the present invention are directed toward electrochemical deposition chambers having a fixed unit, a detachable unit that can be quickly removed from the fixed unit, and an electrode in the detachable unit.
- Microdevices are manufactured by depositing and working several layers of materials on a single substrate to produce a large number of individual devices. For example, layers of photoresist, conductive materials, and dielectric materials are deposited, patterned, developed, etched, planarized, and otherwise manipulated to form features in and/or on a substrate. The features are arranged to form integrated circuits, micro-fluidic systems, and other structures.
- Wet chemical processes are commonly used to form features on microfeature workpieces. Wet chemical processes are generally performed in wet chemical processing tools that have a plurality of individual processing chambers for cleaning, etching, electrochemically depositing materials, or performing combinations of these processes.
FIG. 1 schematically illustrates anintegrated tool 10 that can perform one or more wet chemical processes. Thetool 10 includes a housing orcabinet 20 having aplatform 22, a plurality of wetchemical processing chambers 30 in thecabinet 20, and atransport system 40. Thetool 10 also includes lift-rotate units 32 coupled tocorresponding processing chambers 30 for loading/unloading the workpieces W. Theprocessing chambers 30 can be rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, or other types of wet chemical processing vessels. Thetransport system 40 includes alinear track 42 and arobot 44 that moves along thetrack 42 to transport individual workpieces W within thetool 10. The integratedtool 10 further includes aworkpiece storage unit 60 having a plurality ofcontainers 62 for holding workpieces W. In operation, therobot 44 transports workpieces to/from thecontainers 62 and theprocessing chambers 30 according to a predetermined workflow within thetool 10. - One concern of integrated wet chemical processing tools is that the processing chambers must be maintained and/or repaired periodically. In electrochemical deposition chambers, for example, consumable electrodes degrade over time because the reaction between the electrodes and the electrolytic solution decomposes the electrodes. The consumable electrodes accordingly change causing variations in the electrical field. As a result, consumable electrodes must be replaced periodically to maintain the desired deposition parameters across the workpiece. The electrical contacts that contact the workpiece also may need to be cleaned or replaced periodically.
- One problem with repairing or maintaining existing electrochemical deposition chambers is that the tool must be taken offline for an extended period of time to replace the electrodes or service other components in the
processing chambers 30. In a typical application, the electrodes are removed while theprocessing chamber 30 remains in-situ on the platform. To remove the worn electrodes, the lift/rotate unit 32 is generally moved out of the way and other components above the electrodes are removed from thechamber 30 to provide access to the electrodes through the top of the chamber. The worn electrodes are then disconnected and removed through the top of the chamber, and new electrodes are installed in thechamber 30. Finally, the other components are reinstalled in thechamber 30 above the electrodes. This process requires a significant amount of time to disassemble and then reassemble thechamber 30. This process is also extremely cumbersome because there is only a limited amount of space to access the electrodes through the top opening of thechamber 30. Moreover, after the electrodes have been replaced, therobot 44 and the lift-rotate unit 32 are recalibrated to operate with the processing chamber. Thus, replacing worn electrodes requires a significant amount of time during which the tool cannot process workpieces. - This is not the only problem with existing electrochemical deposition tools. For example, when only one
processing chamber 30 of thetool 10 does not meet specifications, it is often more efficient to continue operating thetool 10 without stopping to repair the oneprocessing chamber 30 until more processing chambers do not meet the performance specifications. The loss of throughput of asingle processing chamber 30, therefore, is not as severe as the loss of throughput caused by taking thetool 10 offline to repair or maintain a single one of theprocessing chambers 30. - The practice of operating the
tool 10 until at least twoprocessing chambers 30 do not meet specifications severely impacts the throughput of thetool 10. For example, if thetool 10 is not repaired or maintained until at least two or threeprocessing chambers 30 are out of specification, then the tool operates at only a fraction of its full capacity for a period of time before it is taken offline for maintenance. This further increases the operating costs of thetool 10 because the throughput not only suffers while thetool 10 is offline to replace the electrodes and recalibrate therobot 44, but the throughput is also reduced while the tool is online because it operates at only a fraction of its full capacity. Moreover, as the feature sizes of devices decrease, theelectrochemical deposition chambers 30 must consistently meet much higher performance specifications. This causes theprocessing chambers 30 to fall out of specifications sooner, which results in shutting down the tool more frequently. Therefore, the downtime associated with replacing the electrodes is significantly increasing the cost of operating electrochemical deposition tools. - The present invention is directed toward electrochemical deposition chambers with at least one electrode in a quick-release detachable unit that reduces the downtime for replacing worn electrodes. In several embodiments of the inventive electrochemical deposition chambers, one or more consumable electrodes are housed within a detachable unit that can be quickly removed and replaced with another detachable unit. Worn electrodes can accordingly be quickly replaced with new electrodes by simply removing the detachable unit with the worn electrodes and installing a replacement detachable unit with new electrodes. The detachable unit is generally a lower portion of the chamber that is accessible without having to move the lift-rotate unit or otherwise open the chamber from above. The detachable units are also coupled to the chamber by a quick-release mechanism that can be easily accessible. As such, the downtime for repairing or maintaining electrodes is greatly reduced by locating the electrodes in quick-release detachable units that can be removed and replaced in only a few minutes compared to the several hours it normally takes for replacing electrodes on existing electrochemical deposition chambers.
- In one embodiment, an electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly. The head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece. The vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit. The electrochemical deposition chamber also includes an electrode in the detachable unit. In several particular embodiments, the detachable unit further includes a fluid inlet for providing the processing fluid to the vessel and a fluid outlet for discharging processing fluid from the vessel.
-
FIG. 1 is a schematic top plan view of a wet chemical processing tool in accordance with the prior art. -
FIG. 2 is cross-sectional view schematically illustrating an electrochemical deposition chamber in a detached configuration in accordance with an embodiment of the invention. -
FIG. 3 is a cross-sectional view schematically illustrating an electrochemical deposition chamber in an assembled configuration in accordance with an embodiment of the invention. -
FIG. 4 is a cross-sectional view illustrating an electrochemical deposition chamber in accordance with an embodiment of the invention. -
FIG. 5 is a cross-sectional view illustrating the electrochemical deposition chamber ofFIG. 4 along a different cross section. -
FIG. 6 is a cross-sectional view illustrating a vessel for an electrochemical deposition chamber in accordance with another embodiment of the invention. -
FIG. 7 is a bottom isometric view of an electrochemical deposition chamber in accordance with an embodiment of the invention. -
FIG. 8 is a cross-sectional view illustrating an electrochemical deposition chamber in accordance with another embodiment of the invention. -
FIG. 9A is a top isometric view of a carriage for loading/unloading a detachable unit from a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 9B is a bottom isometric view of a carriage for loading/unloading a detachable unit of a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 10 is a top plan view of wet chemical processing tool including an electrochemical deposition chamber in accordance with another aspect of the invention. -
FIG. 11 is an isometric view of a mounting module for holding a wet chemical processing chamber in a wet chemical processing tool in accordance with an embodiment of the invention. -
FIG. 12 is a cross-sectional view taken along line 12-12 ofFIG. 11 of a mounting module for carrying a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 13 is a cross-sectional view showing a portion of a deck of a mounting module in greater detail. -
FIG. 14 is a cross-sectional isometric view schematically illustrating a wet chemical processing chamber carried by a mounting module of a wet chemical processing tool in accordance with an embodiment of the invention. - As used herein, the terms “microfeature workpiece” or “workpiece” refer to substrates' on or in which microdevices are formed integrally. Typical microdevices include microelectronic circuits or components, thin-film recording heads, data storage elements, microfluidic devices, and other products. Micromachines or micromechanical devices are included within this definition because they are manufactured using much of the same technology as used in the fabrication of integrated circuits. The substrates can be semiconductive pieces (e.g., doped silicon wafers or gallium arsenide wafers), nonconductive pieces (e.g., various ceramic substrates) or conductive pieces.
- Several embodiments of electrochemical deposition chambers for processing microfeature workpieces are particularly useful for electrolytically depositing metals or electrophoretic resist in or on structures of a workpiece. The electrochemical deposition chambers in accordance with the invention can accordingly be used in tools with wet chemical processing chambers for etching, rinsing, or other types of wet chemical processes in the fabrication of microfeatures in and/or on semiconductor substrates or other types of workpieces. Several embodiments of electrochemical deposition chambers and integrated tools in accordance with the invention are set forth in
FIGS. 2-14 and the corresponding text to provide a thorough understanding of particular embodiments of the invention. A person skilled in the art will understand, however, that the invention may have additional embodiments or that the invention may be practiced without several of the details of the embodiments shown inFIG. 2-14 . - A. Embodiments of Wet Chemical Processing Chambers
-
FIG. 2 schematically illustrates a cross-section of anelectrochemical deposition chamber 100 that enables quick replacement of electrodes and other components to reduce the downtime for maintaining processing chambers. Theprocessing chamber 100 includes a wetchemical vessel 102 and a head 104 (shown schematically). Thevessel 102 is carried by a deck 106 (shown schematically) of a tool that can include several other processing chambers (not shown) and a workpiece transport system (not shown) for automatically handling workpieces. Thevessel 102 contains the processing fluid and several components for directing the processing fluid or otherwise imparting properties to the processing fluid for processing a workpiece. Thehead 104 is carried by a lift- rotate unit 108 (shown schematically) that moves thehead 104 to load/unload the workpiece and to position the workpiece at aprocessing site 109 relative to thevessel 102. Thehead 104 typically includes aworkpiece holder 105 having a contact assembly with a plurality of electrical contacts configured to engage a conductive layer on the workpiece. Suitable workpiece holders are disclosed in U.S. Pat. No. 6,309,524, U.S. application Ser. No. 09/717,927, and U.S. application Ser. No. 09/823,948, all of which are herein incorporated by reference. - The
vessel 102 includes a fixedunit 110 mounted to thedeck 106 and adetachable unit 120 carried by the fixedunit 110. The fixedunit 110 can include achassis 112, a first flow system 114 (shown schematically), and a mountingfixture 116. Thechassis 112 can be a dielectric housing that is chemically compatible with the processing fluid. Thechassis 112, for example, can be a high density polymer or other suitable material. Thefirst flow system 114 can be configured to provide the desired flow to theprocessing site 109. In electrochemical deposition chambers, thefirst flow system 114 can be configured to provide a flow that has a substantially uniform velocity in a direction normal to the workpiece along theprocessing site 109. The mountingfixture 116 can be flanges or a ring projecting outwardly from thechassis 112 to engage the top surface of thedeck 106. The mountingfixture 116 can be configured to precisely locate the fixedunit 110 relative to thedeck 106. The fixedunit 110 can further include aprocessing component 118 to impart a property to the processing fluid flowing through the fixedunit 110. For example, theprocessing component 118 can be an electric field shaping element or field shaping module that shapes the electric field in theprocessing site 109. The field shaping element can be a static dielectric insert that controls the current density in theprocessing site 109. The field shaping element can also be a dynamic member that moves to alter or otherwise control the electrical field at theprocessing site 109 during a plating cycle. Theprocessing component 118 can also be a filter, membrane, or any combination of these types of structures. - The
detachable unit 120 of thevessel 102 includes acontainer 122 and a second flow system 124 (shown schematically) configured to direct the processing fluid to and/or from thefirst flow system 114 of the fixedunit 110. Thesecond flow system 124 can include aninlet 126 to deliver processing fluid to thevessel 102 and an outlet 127 through which processing fluid exits thevessel 102. The first and second flow systems operate together to provide a desired flow of processing fluid through thevessel 102. The first andsecond flow systems processing component 126. In a forward flow system, at least a portion of the processing fluid passes theelectrode 130 in thedetachable unit 120 before the processing fluid reaches theprocessing site 109. The first and second flow systems can also be configured to provide a reverse flow in which at least a portion of the processing fluid passes the electrode after the processing fluid has passed through theprocessing site 109. - The
chamber 100 can also include one or more electrodes 130 (shown schematically) and optional processing components 150 (shown schematically) disposed in thedetachable unit 120. Theprocessing component 150 can be a filter and/or a membrane. Several embodiments of electrodes, filters, and membranes are described below. - The
vessel 102 also includes aninterface element 160 to prevent leaking or to otherwise control the flow of processing fluid between thefixed unit 110 and thedetachable unit 120. Theinterface element 160 can be a seal positioned between thefixed unit 110 and thedetachable unit 120. The seal can include at least one orifice to allow the processing fluid to flow between thefirst flow system 114 in the fixedunit 110 and thesecond flow system 124 in thedetachable unit 120. In many embodiments, theinterface element 160 is a gasket with a pattern of orifices to allow fluid to flow between the first andsecond flow systems interface element 160 is typically a compressible member that prevents liquid from leaking between the various flow channels of the flow systems. Theinterface element 160 can also be made from a dielectric material that electrically isolates different fluid flows as they flow between the first andsecond flow systems interface element 160 include VITON® closed cell foams, closed cell silicon, elastomers, polymers, rubber and other materials. - The
vessel 102 also includes anattachment assembly 170 for attaching thedetachable unit 120 to the fixedunit 110. Theattachment assembly 170 can be a quick-release unit, such as a clamp or a plurality of clamps, that securely holds thedetachable unit 120 to the fixedunit 110. Theattachment assembly 170 can be configured to move from a first position in which thedetachable unit 120 is secured to the fixedunit 110 and a second position in which thedetachable unit 120 can be removed from the fixedunit 110. In several embodiments, as theattachment assembly 170 moves from the second position to the first position, theattachment assembly 170 drives thedetachable unit 120 toward the fixedunit 110. This motion compresses theinterface element 160 and positions thedetachable unit 120 at a desired location with respect to the fixedunit 110. Theattachment assembly 170 can be a clamp ring, a plurality of latches, a plurality of bolts, or other types of fasteners. - In the embodiment shown in
FIG. 2 , the fixedunit 110,detachable unit 120, andattachment assembly 170 interact with each other to accurately position and secure thedetachable unit 120 to the fixedunit 110. The fixedunit 110 can further include a plurality ofhangers 180 arranged at a common radius with respect to a center line of the fixedunit 110 or in another configuration. Thehangers 180 can includeshoulders 182 to hold theattachment assembly 170. For example, theattachment assembly 170 can be a ring that springs radially outwardly to contact thehangers 180 and rest on theshoulders 182 in an open position. The fixedunit 110 further includes abeveled guide surface 183, abearing ring 184 above thebeveled guide surface 183, and a seal surface 186. Theguide surface 183 can be an annular surface or a series of arcuate segments inclined upwardly with increasing radius. Thebearing ring 184 can be a metal ring having a bearing surface inclined upwardly with decreasing radius. Thebearing ring 184 can also be made from other materials that are typically harder than the material of thechassis 112. - The
detachable unit 120 can include arim 190 having alower surface 192 and anupper surface 194. Thelower surface 192 and theupper surface 194 can be inclined upwardly with increasing radius. Theupper surface 194, more specifically, can be inclined at an angle to mate with theguide surface 183 of the fixedunit 110. Thedetachable unit 120 can further include aseal surface 195 configured to retain theinterface element 160,slide channels bottom surface 197. - The
attachment assembly 170 can include afirst rim 172 configured to engage thelower surface 192 of thedetachable unit 120 and asecond rim 174 configured to engage the bearing surface of thebearing ring 184. Theattachment assembly 170 can include a latch (shown inFIG. 7 ) or lever that moves the ring radially inwardly and locks the ring into a fixed position. -
FIG. 3 illustrates thevessel 102 after thedetachable unit 120 has been attached to the fixedunit 110. In operation, theattachment assembly 170 moves radially inwardly so that thefirst rim 172 engages thelower surface 192 of thedetachable unit 120 and thesecond rim 174 engages the bearing surface of thebearing ring 184. As thedetachable unit 120 moves upwardly, theupper surface 194 engages theguide surface 183 to position thedetachable unit 120 at a desired position with respect to the fixedunit 110. Thefirm rim 172 and thesecond rim 174 of theattachment assembly 170 move radially inwardly along thebottom surface 192 and thebearing ring 184, respectively, to clamp theinterface element 160 between the seal surfaces 185 and 195. A lever (shown inFIG. 7 ) on theattachment assembly 170 can be moved from an open position to a closed position to induce a hoop stress in theattachment assembly 170 for securely holding thedetachable unit 120 to the fixedunit 110. - One advantage of the
processing chamber 100 illustrated inFIGS. 2 and 3 is that worn electrodes can be quickly replaced with new or refurbished electrodes without shutting down theprocessing chamber 100 for a significant period of time. Adetachable unit 120 withworn electrodes 130 can be quickly removed from the fixedunit 110, and then a replacementdetachable unit 120 withnew electrodes 130 can be installed in only a matter of a few minutes. This significantly reduces the downtime for repairing electrodes or other processing components compared to conventional systems that require the components to be repaired in-situ on the tool or require the entire chamber to be removed from the tool. Another advantage of theprocessing chamber 100 is that the electrodes and/orother processing components 150 in thedetachable units 120 can be replaced from a location that is easily accessible under thedeck 106. As a result, there is no need to move either the fixedunit 110, thehead 104, or the lift-rotateunit 108 to replace worn processing components. This further reduces the downtime for maintaining processing components because thehead 104 and lift- rotateunit 108 do not need to be repositioned with respect to the fixedunit 110. Moreover, a workpiece transport system that delivers the workpieces to thehead 104 and retrieves the workpieces from thehead 104 does not need to be recalibrated to theprocessing chamber 100 because replacing the electrodes does not change the position between thehead 104 and the workpiece transport system. The significant reduction in downtime for replacing processing components provided by theprocessing chamber 100 is expected to significantly increase the productivity of the tool compared to existing tools. - B. Embodiments of Multiple Electrode Electrochemical Deposition Vessels
-
FIGS. 4-6 illustrate aspects of embodiments of vessels having multiple electrodes for electrochemical deposition of materials. Many aspects of these embodiments are described in the context of having four independently operable electrodes in the detachable unit. Each electrode can be controlled independent of the other electrodes such that each electrode can generate an individual current density that can remain constant or can change dynamically during a plating cycle. Suitable processes for operating the electrodes are set forth in U.S. patent application Ser. Nos. 09/849,505; 09/866,391; and 09/866,463, all of which are herein incorporated by reference. Additionally, it will be appreciated that other embodiments of the multiple electrode vessels can have any combination of two or more electrodes such that the invention is not limited to having four electrodes. -
FIG. 4 is a cross-sectional view illustrating avessel 400 having a fixedunit 402 configured to be fixedly attached to a deck (not shown) and adetachable unit 404 releasably attachable to the fixedunit 402. The fixedunit 402 can include a mountingfixture 116 to fixedly attach the fixedunit 402 to the deck of a tool as described above. Thedetachable unit 404 can be releasably attached to the fixedunit 402 using aclamp ring 170 andhangers 180 as described above. Additionally, thedetachable unit 404 has arim 190 and the fixedunit 402 has aninclined guide surface 183 to position thedetachable unit 404 with respect to the fixedunit 402. Thedetachable unit 404 can accordingly be removed from the fixedunit 402 in a short period of time as described above with respect to the embodiments shown inFIGS. 2 and 3 . - The fixed
unit 402 includes achassis 410 having aflow system 414 to direct the flow of processing fluid through thechassis 410. Theflow system 414 can be a separate component attached to thechassis 410, or theflow system 414 can be a combination of fluid passageways formed in thechassis 410 and separate components attached to thechassis 410. In this embodiment, theflow system 414 includes aninlet 415 that receives a flow of processing fluid from thedetachable unit 404, afirst flow guide 416 having a plurality ofslots 417, and anantechamber 418. Theslots 417 in thefirst flow guide 416 distribute the flow radially to theantechamber 418. - The
flow system 414 further includes asecond flow guide 420 that receives the flow from theantechamber 418. Thesecond flow guide 420 can include asidewall 421 having a plurality ofopenings 422 and aflow projector 424 having a plurality ofapertures 425. Theopenings 422 can be horizontal slots arranged radially around thesidewall 421 to provide a plurality of flow components projecting radially inwardly toward theflow projector 424. Theapertures 425 in the flow projector can be a plurality of elongated slots or other openings that are inclined upwardly and radially inwardly. Theflow projector 424 receives the radial flow components from theopenings 422 and redirects the flow through theapertures 425. It will be appreciated that theopenings 422 and theapertures 425 can have several different configurations. For example, theapertures 425 can project the flow radially inwardly without being canted upwardly, or theapertures 425 can be canted upwardly at a greater angle than the angle shown inFIG. 4 . The apertures can accordingly have an inclination ranging from 0°-45°, and in several specific embodiments the apertures can be canted upwardly at an angle of approximately 5°-25°. - The fixed
unit 402 can also include afield shaping insert 440 for shaping the electrical field(s) and directing the flow of processing fluid at the processing site. In this embodiment, thefield shaping insert 440 has afirst partition 442a with afirst rim 443a, asecond partition 442b with asecond rim 443b, and athird partition 442c with athird rim 443c. Thefirst rim 443a defines afirst opening 444a. Thefirst rim 443a and thesecond rim 443b define asecond opening 444b, and thesecond rim 443b and thethird rim 443c define athird opening 444c. The fixedunit 402 can further include aweir 445 having arim 446 over which the processing fluid can flow into arecovery channel 447. Thethird rim 443c and theweir 445 define afourth opening 444d. Thefield shaping unit 440 and theweir 445 are attached to the fixedunit 402 by a plurality of bolts or screws 448, and a number ofseals 449 are positioned between thefixed unit 402 and both thefield shaping unit 440 and theweir 445. -
FIG. 5 is a cross-sectional view of thevessel 400 shown inFIG. 4 taken along a different section that shows the interaction between thefixed unit 402 and thedetachable unit 404 in greater detail. Referring toFIGS. 4 and 5 together, thedetachable unit 404 includes acontainer 510 that houses an electrode assembly and a second flow system. Thecontainer 510 is also releasably attachable to thechassis 410 as described above. In this embodiment, thecontainer 510 includes a plurality of dividers orwalls 512 that define a plurality ofcompartments 513. The specific embodiment shown inFIGS. 4 and 5 has fourcompartments 513, but in other embodiments thecontainer 510 can include any number of compartments to house the electrodes individually. Thecompartments 513 can also define a part of a second flow system through which processing fluid can flow. - The
detachable unit 404 includes a flow system having aninlet 515 that provides the flow to theinlet 415 of the fixedunit 402 and anoutlet 516 that receives the fluid flow from thecompartments 513. In the specific embodiment shown inFIG. 5 , theflow system 414 in the fixedunit 402 further includes afirst channel 520a between theantechamber 418 and afirst compartment 513, asecond channel 520b between thefirst opening 444b and asecond compartment 513, athird channel 520c between thethird opening 444c and athird compartment 513, and afourth channel 520d between thefourth opening 444d and afourth compartment 513. - The
vessel 400 also includes aninterface element 530 between thefixed unit 402 and thedetachable unit 404. In this embodiment, theinterface element 530 is a seal having a plurality ofopenings 532 to allow fluid communication between thechannels 520a-d and the corresponding compartments 513. The seal is a dielectric material that electrically isolates the electric fields within thecompartments 513 and the correspondingchannels 520a-d. - The
vessel 400 can further include a plurality of electrodes disposed in thedetachable unit 404. In the embodiment shown inFIGS. 4 and 5 , thevessel 400 includes afirst electrode 551 in thefirst compartment 513, asecond electrode 552 in thesecond compartment 513, athird electrode 553 in thethird compartment 513, and afourth electrode 554 in thefourth compartment 513. The electrodes 551-554 can be annular or circular conductive elements arranged concentrically with one another. The electrodes, however, can be arcuate segments or have other shapes and arrangements. In this embodiment, each electrode is coupled to anelectrical connector 560 that extends through thecontainer 510 of thedetachable unit 404 to couple the electrodes to a power supply. The electrodes 551-554 can each provide a constant current throughout a plating cycle, or the current through one or more of the electrodes 551-554 can be changed during a plating cycle according to the particular parameters of the workpiece. Moreover, each electrode can have a unique current that is different than the current of the other electrodes. - Referring to
FIG. 5 , the fixedunit 402, thedetachable unit 404, and the electrodes 551-554 operate together to provide a desired flow profile of processing fluid and electrical profile at theprocessing site 109. In this particular embodiment, the processing fluid enters through theinlets first flow guide 416. The fluid flow then bifurcates with a portion of the fluid flowing up through thesecond fluid guide 420 via theantechamber 418 and another portion of the fluid flowing down across thefirst electrode 551 via thechannel 520a. The upward fluid flow through thesecond flow guide 420 passes through theflow projector 424 and thefirst opening 444a. Thefirst electrode 551 accordingly provides an electrical field that is effectively exposed to theprocessing site 109 through thefirst opening 444a defined by therim 443a of thefirst partition 442a (FIGS. 4 ). Theopening 444a accordingly shapes the field of thefirst electrode 551 according to the configuration of therim 443a. A portion of the flow passes upwardly over therim 443a, goes through theprocessing site 109, and then flows over therim 446 of theweir 445. Another portion of the processing fluid flows downwardly through each of thechannels 520b-d to the electrodes 552-554. The portion of the flow passing through thesecond channel 520b passes over thesecond electrode 552 such that theopening 444b defined by thefirst rim 443a and thesecond rim 443b shapes the electrical field of thesecond electrode 552. Similarly, the flow through thethird channel 520c passes over thethird electrode 553 and the flow through thefourth channel 520d passes over thefourth electrode 554. Theopening 444c accordingly shapes the electrical field from thethird electrode 553, and theopening 444d shapes the electrical field from thefourth electrode 554. The flow then passes through thecompartments 513 and exits thevessel 400 through theoutlet 516. This flow profile is a reverse flow in which the electrodes 551-554 are downstream from theprocessing site 109 so that bubbles or particulate matter in the processing fluid generated by the electrodes 551-554 is carried away from theprocessing site 109. The downstream configuration is expected to be particularly useful for consumable electrodes because they are subject to generating bubbles and particulate matter that can cause defects on the plated surface of a workpiece. - The
vessel 400 is expected to significantly:reduce the downtime associated with replacing multiple electrodes compared to existing electrochemical deposition chambers. Referring toFIG. 5 , all of the electrodes 551-554 can be replaced with new electrodes by simply opening theattachment assembly 170, removing thedetachable unit 404 from the fixedunit 402, positioning a replacement detachable unit with new electrodes under the fixedunit 402, and then closing theattachment assembly 170. Because thedetachable unit 404 is located externally of the fixedunit 402, an operator does not need to reach through the top opening of the fixedunit 402 to reach the electrodes 551-554 as in conventional chambers. This not only allows faster access to the electrodes 551-554, but it also saves time compared to conventional chambers because thefield shaping insert 440 does not need to be removed and then reinstalled. The electrodes 551-554, in fact, do not need to be disassembled from the vessel while the chamber is off-line because the replacement detachable unit can be ready to install as soon as the detachable unit with the worn electrodes is removed. The electrochemical deposition chambers with embodiments of thevessels -
FIG. 6 is a cross-sectional view of another embodiment of avessel 400. This embodiment is similar to the embodiment shown inFIGS. 4 and 5 , and thus like reference numbers refer to like components in these figures. The embodiment of thevessel 400 shown inFIG. 6 includes aninterface element 610 having agasket 620 and aliner 630. Thegasket 620 can be positioned between thefixed unit 402 and thedetachable unit 404, and theliner 630 can be disposed in thedetachable unit 404 and/or the fixedunit 402. Theliner 630 can be a membrane or filter that entraps bubbles or particulate matter in thecompartments 513 to prevent them from migrating to theprocessing site 109. In the case of a filter, the processing fluid flows through theliner 630 between thefixed unit 402 and thedetachable unit 404 in accordance with the flow for either a forward flow system or a reverse flow system. In the case of a membrane, theliner 630 can be impermeable to fluid flow but allow ions to pass from the electrodes 551-554 through the correspondingchannels 520a-d to provide ions for plating onto the surface of the workpiece. Theliner 630 can have a plurality of discrete sections positioned in thecompartments 513 and/or thechannels 520a-d. Thegasket 620 can be attached to theliner 630 so theinterface element 610 can be installed or removed as a single component. - The embodiment of the
chamber 400 shown inFIG. 6 is expected to be very useful in applications where bubbles and particulate matter create defects. It will be appreciated that theliner 630 should further impair bubbles or particulate matter from reaching theprocessing site 109. Thechamber 400 shown inFIG. 6 may also be useful in applications where one processing fluid is used in the fixed unit and another processing fluid is used in the detachable unit. In such an embodiment, thedetachable liner 630 can be a membrane that allows ions to flow from thecompartments 513 to thechannels 520a-520d, but does not allow the processing fluids to flow between thecompartments 513 and thechannels 520a- 520d. -
FIG. 7 is a bottom isometric view illustrating various aspects of thevessel 400 in accordance with additional embodiments of the invention. Thevessel 400 can further includes afirst fitting 701 to couple theinlet 515 with a supply of processing fluid and asecond fitting 702 to connect theoutlet 516 with a holding tank of processing fluid. In one particular embodiment, the fitting 701 is a female fitting and theinlet 515 is a male fitting, and the fitting 702 is a male fitting and theoutlet 516 is a female fitting. By having afemale fitting 701 coupled to theinlet 515 and amale fitting 702 coupled to theoutlet 516, the processing fluid supply line can only be connected to theinlet 515 and the processing fluid exit line can only be connected to theoutlet 516. This configuration accordingly ensures that thedetachable unit 404 is installed properly. -
FIG. 7 also illustrates theattachment assembly 170 in further detail. In this embodiment, theattachment assembly 170 includes aclamp ring 708 and alatch 710 that moves the clamp ring between a first position having a first diameter and a second position having a second diameter less than the first diameter. As thelatch 710 moves the clamp ring from the first position to the second position, the diameter of theclamp ring 708 decreases to clamp thedetachable unit 404 to the fixedunit 402. -
FIG. 8 illustrates another embodiment of a vessel in accordance with the invention. Several features ofFIG. 8 are similar to those described above with respect toFIGS. 4-7 . Thevessel 800 shown inFIG. 8 has a fixedunit 810, adetachable unit 820 releasably attachable to the fixedunit 810 by aclamp 830, and aninterface element 840 between thefixed unit 810 and thedetachable unit 820. The primary difference between thevessel 800 and thevessel 400 is that thevessel 800 has anon-planer interface element 840 and thevessel 400 has aplaner interface element 530. - C. Embodiments of Carriages for Installing/Removing Detachable Units
- The
chambers detachable unit 404, but it will be appreciated that the carriages can work with any detachable units of the invention. -
FIG. 9A is a top isometric view of acarriage 900 for installing and removing the detachable unit 404 (FIG. 4 ). Thecarriage 900 can include abracket 910 that mounts to the underside of the deck 106 (FIG. 2 ) of the tool. Thecarriage 900 can further includeguide rails 912 and anend stop 914. The guide rails 912 receive theslide channels FIGS. 2, 3 , 5 and 7) and theend stop 914 engages a rounded portion of thedetachable unit 404. In operation, an operator slides thedetachable unit 404 along therails 912 until the detachable unit engages theend stop 914. -
FIG. 9B is a bottom isometric view illustrating additional aspects of thecarriage 900. Thecarriage 900 can further include anactuator 920 having ahandle 922, ashaft 924, andlifters 926 that are moved by theshaft 924. Theactuator 920 can further include arod 928 connected to thelifters 926 and positioned in a joint 929. The rotation of the handle accordingly rotates therod 928 within the joint 929 to raise and lower thelifters 926. To install a detachable unit, theactuator 920 is moved to a first position as shown inFIG. 9B , and a detachable unit is inserted along therails 912. Theactuator 920 is then lifted upwardly (arrow R) to a second position, which causes thelifters 926 to raise thedetachable unit 404 to the fixedunit 402. As theactuator 920 rotates upwardly, thehandle 922 passes through agap 930 in abottom flange 931 of thebracket 910. Theactuator 920 is held in the second position by sliding thehandle 922 axially along theshaft 924 so that theflange 931 supports thehandle 922. - The
carriage 900 further enhances the process of replacing one detachable unit with another. First, thecarriage 900 ensures that thedetachable unit 404 is generally aligned with fixedunit 402. Second, the carriage ensures that theinlet 515 and theoutlet 516 are aligned with the supply line and exit line. Third, the carriage makes it easier to install and remove thedetachable unit 404 because the operator does not need to hold thedetachable unit 404 against the fixedunit 402 while simultaneously operating theattachment assembly 170. Therefore, the carriage is expected to further reduce the time the replace one detachable unit with another. - D. Embodiments of Wet Chemical Processing Tools
- The electrochemical processing chambers described above can be used in wet chemical processing tools having a plurality of electrochemical deposition chambers, other types of wet chemical processing chambers, annealing stations, metrology stations, and other types of processing equipment.
FIGS. 10-13 illustrate an embodiment of a processing tool in which the electrochemical deposition chambers can be used. -
FIG. 10 is a top plan view showing a portion of anintegrated tool 1600 in accordance with an embodiment of the invention. In this embodiment, theintegrated tool 1600 includes aframe 1610, a dimensionallystable mounting module 1620 mounted to theframe 1610, a plurality of wetchemical processing chambers 1670, and a plurality of lift-rotateunits 1680. Thetool 1600 can also include a transport system 1690. The mountingmodule 1620 carries theprocessing chambers 1670, the lift-rotateunits 1680, and the transport system 1690. The wetchemical processing chambers 1670 in thetool 1600 can include electrochemical deposition chambers having fixed units and detachable units as described above with reference toFIGS. 2-9B . As such, any of the embodiments of the electrochemical deposition chambers described above can be the wetchemical processing chambers 1670 in theintegrated tool 1600. - The
frame 1610 of thetool 1600 has a plurality of posts and cross-bars that are welded together in a manner known in the art. The mountingmodule 1620 is at least partially housed within theframe 1610. In one embodiment, the mountingmodule 1620 is carried by theframe 1610, but themounting module 1620 can stand directly on the floor of the facility or other structures in other embodiments. - The mounting
module 1620 is a rigid, stable structure that maintains the relative positions between the wetchemical processing chambers 1670, the lift- rotateunits 1680, and the transport system 1690. One aspect of the mountingmodule 1620 is that it is much more rigid and has a significantly greater structural integrity compared to theframe 1610 so that the relative positions between the wetchemical processing chambers 1670, the lift-rotateunits 1680, and the transport system 1690 do not change over time. Another aspect of the mountingmodule 1620 is that it includes a dimensionallystable deck 1630 with positioning elements at precise locations for positioning theprocessing chambers 1670 and the lift-rotateunits 1680 at known locations on thedeck 1630. In one embodiment (not shown), the transport system 1690 can be mounted directly to thedeck 1630. In other embodiments, the mountingmodule 1620 also has a dimensionallystable platform 1650 and the transport system 1690 is mounted to theplatform 1650. Thedeck 1630 and theplatform 1650 are fixedly positioned relative to each other so that positioning elements on thedeck 1630 and positioning elements on theplatform 1650 do not move relative to each other. The mountingmodule 1620 accordingly provides a system in which wetchemical processing chambers 1670 and lift-rotateunits 1680 can be removed and replaced with interchangeable components in a manner that accurately positions the replacement components at precise locations on thedeck 1630. - The
tool 1600 is particularly suitable for applications that have demanding specifications which require frequent maintenance of the wetchemical processing chambers 1670, the lift-rotateunits 1680, or the transport system 1690. A wetchemical processing chamber 1670 can be repaired or maintained by simply detaching the chamber from theprocessing deck 1630 and replacing thechamber 1670 with an interchangeable chamber having mounting hardware configured to interface with the positioning elements on thedeck 1630. Because the mountingmodule 1620 is dimensionally stable and the mounting hardware of thereplacement processing chamber 1670 interfaces with thedeck 1630, thechambers 1670 can be interchanged on thedeck 1630 without having to recalibrate the transport system 1690. This is expected to significantly reduce the downtime associated with repairing or maintainingprocessing chambers 1670 so that the tool can maintain a high throughput in applications that have stringent performance specifications. This aspect of thetool 1600 is particularly useful when the fixed unit 110 (FIG. 2 ) must be removed to repair the chamber, but it is also useful when only the detachable unit is removed from the fixed unit. - The transport system 1690 retrieves workpieces from a load/unload
module 1698 attached to themounting module 1620. The transport system 1690 includes atrack 1692, arobot 1694, and at least one end-effector 1696. Thetrack 1692 is mounted to theplatform 1650. More specifically, thetrack 1692 interfaces with positioning elements on theplatform 1650 to accurately position thetrack 1692 relative to thechambers 1670 and the lift-rotateunits 1680 attached to thedeck 1630. Therobot 1694 and end-effectors 1696 can accordingly move in a fixed, dimensionally stable reference frame established by the mountingmodule 1620. Thetool 1600 can further include a plurality ofpanels 1699 attached to theframe 1610 to enclose themounting module 1620, the wetchemical processing chambers 1670, the lift-rotateunits 1680, and the transport system 1690 in a cabinet. In other embodiments, thepanels 1699 on one or both sides of thetool 1600 can be removed in the region above theprocessing deck 1630 to provide an open tool. - E. Embodiments of Dimensionally Stable Mounting Modules
-
FIG. 11 is an isometric view of amounting module 1620 in accordance with an embodiment of the invention for use in thetool 1600. In this embodiment, thedeck 1630 includes a rigidfirst panel 1631 and a rigidsecond panel 1632 superimposed underneath thefirst panel 1631. Thefirst panel 1631 can be an outer member and thesecond panel 1632 can be an interior member juxtaposed to the outer member. The first andsecond panels FIG. 11 . A plurality ofchamber receptacles 1633 are disposed in the first andsecond panels FIG. 10 ). - The
deck 1630 can further include a plurality ofpositioning elements 1634 andattachment elements 1635 arranged in a precise pattern across thefirst panel 1631. Thepositioning elements 1634 can be holes machined in thefirst panel 1631 and dowels or pins that are positioned in the machined holes. In other embodiments, thepositioning elements 1634 can be pins, such as cylindrical pins or conical pins, that are not positioned in holes on thedeck 1630, but still project upwardly from thefirst panel 1631 to be received by mating structures in the wetchemical processing chambers 1670. Thedeck 1630 has a first set ofpositioning elements 1634 located at eachchamber receptacle 1633 to accurately position the individual wet chemical processing chambers at precise locations on themounting module 1620. Thedeck 1630 can also include a second set ofpositioning elements 1634 near eachreceptacle 1633 to accurately position individual lift-rotateunits 1680 at precise locations on themounting module 1620. Theattachment elements 1635 can be threaded holes in thefirst panel 1631 that receive bolts to secure thechambers 1670 and the lift-rotateunits 1680 to thedeck 1630. - The mounting
module 1620 also includesexterior side plates 1660 along longitudinal outer edges of thedeck 1630,interior side plates 1661 along longitudinal inner edges of thedeck 1630, andendplates deck 1630. Thetransport platform 1650 is attached to theinterior side plates 1661 and theend plates transport platform 1650 includes positioning elements 1652 for accurately positioning the track 1692 (FIG. 10 ) of the transport system 1690 on themounting module 1620. Thetransport platform 1650 can further include attachment elements, such as tapped holes, that receive bolts to secure the trackl 692 to theplatform 1650. -
FIG. 12 is a cross-sectional view illustrating one suitable embodiment of the internal structure of thedeck 1630, andFIG. 13 is a detailed view of a portion of the deck shown inFIG. 12 . In this embodiment, thedeck 1630 includes bracing 1640, such as joists, extending laterally between theexterior side plates 1660 and theinterior side plates 1661. Thefirst panel 1631 is attached to the upper side of the bracing 1640, and thesecond panel 1632 is attached to the lower side of the bracing 1640. Thedeck 1630 can further include a plurality of through-bolts 1642 and nuts 1644 that secure the first andsecond panels FIG. 13 , the bracing 1640 has a plurality ofholes 1645 through which the through-bolts 1642 extend. The nuts 1644 can be welded to thebolts 1642 to enhance the connection between these components. - The panels and bracing of the
deck 1630 can be made from stainless steel, other metal alloys, solid cast materials, or fiber-reinforced composites. For example, the panels and plates can be made from Nitronic 50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxy filled with mica. The fiber- reinforced composites can include a carbon-fiber or Kevlar® mesh in a hardened resin. The material for thepanels plates - The bracing 1640 can also be stainless steel, fiber-reinforced composite materials, other metal alloys, and/or solid cast materials. In one embodiment, the bracing can be 0.5 to 2.0 inch wide stainless steel joists, and more specifically 1.0 inch wide by 2.0 inches tall stainless steel joists. In other embodiments the bracing 1640 can be a honey-comb core, a light-weight foamed metal or other type of foam, polymers, fiber glass or other materials.
- The mounting
module 1620 is constructed by assembling the sections of thedeck 1630, and then welding or otherwise adhering theend plates deck 1630. The components of thedeck 1630 are generally secured together by the through-bolts 1642 without welds. Theouter side plates 1660 and theinterior side plates 1661 are attached to thedeck 1630 and theend plates platform 1650 is then securely attached to theend plates interior side plates 1661. - The mounting
module 1620 provides a heavy-duty, dimensionally stable structure that maintains the relative positions between thepositioning elements 1634 on thedeck 1630 and the positioning elements 1652 on theplatform 1650 within a range that does not require the transport system 1690 to be recalibrated each time areplacement processing chamber 1670 or lift-rotateunit 1680 is mounted to thedeck 1630. The mountingmodule 1620 is generally a rigid structure that is sufficiently strong to maintain the relative positions between thepositioning elements 1634 and 1652 when the wetchemical processing chambers 1670, the lift-rotateunits 1680, and the transport system 1690 are mounted to themounting module 1620. In several embodiments, the mountingmodule 1620 is configured to maintain the relative positions between thepositioning elements 1634 and 1652 to within 0.025 inch. In other embodiments, the mounting module is configured to maintain the relative positions between thepositioning elements 1634 and 1652 to within approximately 0.005 to 0.015 inch. As such, thedeck 1630 often maintains a uniformly flat surface to within approximately 0.025 inch, and in more specific embodiments to approximately 0.005-0.015 inch. - F. Embodiments of Wet Chemical Processing Chambers
-
FIG. 14 is an isometric cross-sectional view showing the interface between a wetchemical processing chamber 1670 and thedeck 1630. Thechamber 1670 can include theprocessing vessels collar 1672. Thecollar 1672 and thevessel 102 can be separate components that are connected together. In such cases, thecollar 1672 can be made from a dimensionally stable material, such as stainless steel, fiber- reinforced materials, steel alloys, cast solid materials, or other suitably rigid materials. In other embodiments, thecollar 1672 is integral with thevessel 102 and formed from a high-density polymer or other suitable material, such as the mountingfixture 116 shown inFIG. 2 . - The
collar 1672 includes a plurality ofinterface members 1674 that are arranged in a pattern to be aligned with thepositioning elements 1634 on thedeck 1630. Thepositioning elements 1634 and theinterface members 1674 are also configured to mate with one another to precisely position thecollar 1672, and thus thechamber 1670, at a desired operating location on thedeck 1630 to work with lift-rotateunit 1680 and the transport system 1690. As explained above, thepositioning elements 1634 can be a set of precisely machined holes in thedeck 1630 and dowels received in the holes. Theinterface members 1674 can accordingly be holes precisely machined in thecollar 1672 to mate with the dowels. The dowels can be pins with cylindrical, spherical, conical or other suitable shapes to align and position thecollar 1672 at a precise location relative to thedeck 1630. Thecollar 1672 can further include a plurality offasteners 1675 arranged to be aligned with theattachment elements 1635 in thedeck 1630. Thefasteners 1675 can be bolts or other threaded members that securely engage theattachment elements 1635 to secure thecollar 1672 to thedeck 1630. Thecollar 1672 accordingly holds theprocessing vessel 102 at a fixed, precise location on the deck. - From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the present invention is not limited except as by the appended claims.
Claims (50)
1. An electrochemical deposition chamber for depositing material onto microfeature workpieces having submicron features, comprising:
a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site;
a fixed unit having a first flow system to provide a processing fluid to the processing site and a mounting fixture for fixedly attaching the fixed unit to a support member of a tool;
a detachable unit having a second flow system in fluid communication with the first flow system of the fixed unit;
a seal to prevent leaking of the processing fluid between the fixed unit and the detachable unit;
an attachment assembly releasably coupling the detachable unit to the fixed unit; and
at least a first electrode in the detachable unit and at least a first electrical connector coupled to the first electrode.
2. The chamber of claim 1 , further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
3. The chamber of claim 1 , further comprising a filter in the first flow system and/or the second flow system.
4. The chamber of claim 1 , further comprising a membrane in the first flow system and/or the second flow system, wherein the membrane is configured to conduct electrical current.
5. The chamber of claim 1 , wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
6. The chamber of claim 1 wherein:
the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the seal; and
the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the seal.
7. The chamber of claim 1 wherein the fixed unit further comprises a field shaping module that shapes an electrical field in the processing fluid induced by the electrode.
8. The chamber of claim 1 further comprising:
a second electrode arranged concentrically with the first electrode in the detachable unit; and
a field shaping module in the fixed unit, wherein the field shaping module is composed of a dielectric material and has a first opening facing a first section of the processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the processing site through which ions influenced by the second electrode can pass.
9. The chamber of claim 8 further comprising a second electrical connector coupled to the second electrode, and the first and second electrodes are operable independently from each other.
10. The chamber of claim 1 further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
a filter in the fixed unit and/or the detachable unit.
11. The chamber of claim 1 further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
a membrane in the fixed unit and/or the detachable unit that conducts electrical current.
12. The chamber of claim 1 wherein the detachable unit is positioned externally underneath the fixed unit.
13. The chamber of claim 1 wherein the detachable unit further includes an externally accessible fluid fitting through which the processing fluid can flow.
14. An electrochemical deposition chamber for depositing material onto microfeature workpieces having submicron features, comprising:
a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site and electrical contacts arranged to provide electrical current to a layer on the workpiece;
a vessel having a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, an externally accessible detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment assembly releasably coupling the detachable unit to the fixed unit; and
an electrode in the detachable unit.
15. The chamber of claim 14 , further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
16. The chamber of claim 14 , further comprising a filter in the vessel.
17. The chamber of claim 14 , further comprising a membrane in the vessel configured to conduct electrical current.
18. The chamber of claim 14 , wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
19. The chamber of claim 14 wherein:
the interface element comprises a gasket between the fixed unit and the detachable unit; and
an externally accessible fluid fitting through which processing fluid can flow.
20. The chamber of claim 14 , further comprising:
a flow system in the vessel configured to direct a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
a field shaping module in the vessel that shapes an electrical field in the processing fluid induced by the electrode.
21. The chamber of claim 14 , further comprising:
a second electrode arranged concentrically with the first electrode in the detachable unit; and
a field shaping module in the vessel, the field shaping module being composed of a dielectric material, and the field shaping module having a first opening facing a first section of a workpiece processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the workpiece processing site through which ions influenced by the second electrode can pass.
22. The chamber of claim 14 , further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in the processing fluid generated by the first and second electrodes;
a flow system in the vessel having a wall that directs a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
filter in the vessel in fluid communication with the processing fluid.
23. The chamber of claim 14 wherein:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in a processing fluid within the vessel generated by the first and second electrodes;
a flow system in the vessel having a wall that directs the processing fluid to be at least substantially normal to a workpiece at the processing site; and
a membrane in the vessel that conducts an electrical current in the processing fluid.
24. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
a frame;
a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
an electrochemical deposition chamber comprising a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site, a fixed unit having a first flow system to provide a processing fluid to the processing site and a mounting fixture for fixedly attaching the fixed unit to a support member of a tool, a detachable unit having a second flow system in fluid communication with the first flow system of the fixed unit, a seal to prevent leaking of the processing fluid between the fixed unit and the detachable unit, an attachment assembly releasably coupling the detachable unit to the fixed unit, and at least a first electrode in the detachable unit;
a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
25. The tool of claim 24 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
26. The tool of claim 24 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
27. The tool of claim 24 , further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
28. The tool of claim 24 , further comprising a filter in the first flow system and/or the second flow system.
29. The tool of claim 24 , further comprising a membrane in the first flow system and/or the second flow system, wherein the membrane is configured to conduct electrical current.
30. The tool of claim 24 , wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
31. The tool of claim 24 wherein:
the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the seal; and
the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the seal.
32. The tool of claim 24 wherein the fixed unit further comprises a field shaping module that shapes an electrical field in the processing fluid induced by the electrode.
33. The tool of claim 24 further comprising:
a second electrode arranged concentrically with the first electrode in the detachable unit; and
a field shaping module in the fixed unit, wherein the field shaping module is composed of a dielectric material and has a first opening facing a first section of the processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the processing site through which ions influenced by the second electrode can pass.
34. The tool of claim 33 further comprising a second electrical connector coupled to the second electrode, and the first and second electrodes are operable independently from each other.
35. The tool of claim 24 further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
a filter in the fixed unit and/or the detachable unit.
36. The tool of claim 24 further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
a membrane in the fixed unit and/or the detachable unit that conducts electrical current.
37. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
a frame;
a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
an electrochemical deposition chamber comprising a head assembly and a vessel, the head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site and electrical contacts arranged to provide electrical current to a layer on the workpiece, and the vessel having a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, an externally accessible detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, an electrode in the detachable unit, and an attachment assembly releasably coupling the detachable unit to the fixed unit;
a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
38. The tool of claim 37 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
39. The tool of claim 37 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
40. The tool of claim 37 , further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
41. The tool of claim 37 , further comprising a filter in the vessel.
42. The tool of claim 37 , further comprising a membrane in the vessel configured to conduct electrical current.
43. The tool of claim 37 , wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
44. The tool of claim 37 wherein:
the interface element comprises a gasket between the fixed unit and the detachable unit;
the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the gasket; and
the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the gasket.
45. The tool of claim 37 , further comprising:
a flow system in the vessel configured to direct a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
a field shaping module in the vessel that shapes an electrical field in the processing fluid induced by the electrode.
46. The tool of claim 37 , further comprising:
a second electrode arranged concentrically with the first electrode in the detachable unit; and
a field shaping module in the vessel, the field shaping module being composed of a dielectric material, and the field shaping module having a first opening facing a first section of a workpiece processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the workpiece processing site through which ions influenced by the second electrode can pass.
47. The tool of claim 37 , further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in the processing fluid generated by the first and second electrodes;
a flow system in the vessel having a wall that directs a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
filter in the vessel in fluid communication with the processing fluid.
48. The tool of claim 37 , further comprising:
a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in a processing fluid within the vessel generated by the first and second electrodes;
a flow system in the vessel having a wall that directs the processing fluid to be at least substantially normal to a workpiece at the processing site; and
a membrane in the vessel that conducts an electrical current in the processing fluid.
49. A method for electrochemically depositing material onto a workpiece in an electrochemical deposition chamber comprising a head assembly having a workpiece holder and a vessel having a fixed unit with a processing location, a first detachable unit releasably attached to the fixed unit, and a first electrode in the first detachable unit, the method comprising:
depositing a layer onto a first workpiece having submicron features by positioning the first workpiece at the processing location of the fixed unit to contact a processing fluid in the vessel and establishing an electrical field between the first workpiece and the first electrode;
replacing the first electrode by releasing the first detachable unit from the fixed unit, removing the detachable unit from underneath the fixed unit, positioning a second detachable unit with a second electrode underneath the fixed unit, and releasably attaching the second detachable unit to the fixed unit; and
depositing a layer onto a second workpiece having submicron features by positioning the second workpiece at the processing location of the fixed unit to contact a processing fluid in the vessel and establishing an electrical field between the second workpiece and the second electrode.
50. A method of servicing an electrochemical chamber for depositing material onto a workpiece having submicron features, the method comprising:
providing an electrochemical deposition chamber comprising a head assembly having a workpiece holder and a vessel having a fixed unit with a processing location, a first detachable unit releasably attached to the fixed unit, and a first electrode in the first detachable unit;
removing the first detachable unit from the fixed unit by disconnecting the detachable unit from the fixed unit at an external location outside of the fixed unit; and
releasably attaching a second detachable unit having a second electrode to a portion of the fixed unit.
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040245094A1 (en) * | 2003-06-06 | 2004-12-09 | Mchugh Paul R. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US20050006241A1 (en) * | 2003-07-01 | 2005-01-13 | Mchugh Paul R. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
US20050035046A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20070018941A1 (en) * | 2003-11-03 | 2007-01-25 | Monolithic Power Systems, Inc. | Driver for light source having integrated photosensitive elements for driver control |
US20070144912A1 (en) * | 2003-07-01 | 2007-06-28 | Woodruff Daniel J | Linearly translating agitators for processing microfeature workpieces, and associated methods |
US20070166810A1 (en) * | 2005-12-23 | 2007-07-19 | Perkinelmer Las, Inc. | Methods and compositions for detecting enzymatic activity |
US20080110751A1 (en) * | 2000-01-03 | 2008-05-15 | Semitool, Inc. | Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
US20080178460A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods |
US20090024244A1 (en) * | 2007-07-16 | 2009-01-22 | Harris Randy A | High throughput semiconductor wafer processing |
US20090022574A1 (en) * | 2007-07-16 | 2009-01-22 | Eudy Steve L | Workpiece loading system |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060043750A1 (en) * | 2004-07-09 | 2006-03-02 | Paul Wirth | End-effectors for handling microfeature workpieces |
US20050050767A1 (en) * | 2003-06-06 | 2005-03-10 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US8118044B2 (en) | 2004-03-12 | 2012-02-21 | Applied Materials, Inc. | Single workpiece processing chamber with tilting load/unload upper rim |
US20060009047A1 (en) * | 2004-07-09 | 2006-01-12 | Wirth Paul Z | Modular tool unit for processing microelectronic workpieces |
US20060045666A1 (en) * | 2004-07-09 | 2006-03-02 | Harris Randy A | Modular tool unit for processing of microfeature workpieces |
US7531060B2 (en) * | 2004-07-09 | 2009-05-12 | Semitool, Inc. | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces |
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US20080155852A1 (en) * | 2006-12-29 | 2008-07-03 | Olgado Donald J K | Multiple substrate vapor drying systems and methods |
US20080181758A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods |
US7457686B2 (en) * | 2007-03-14 | 2008-11-25 | Ortho—Clinical Diagnostics, Inc. | Robotic arm alignment |
US7630471B1 (en) | 2007-05-08 | 2009-12-08 | Honda Motor Co., Ltd. | Encoder reset device and method |
US8752449B2 (en) * | 2007-05-08 | 2014-06-17 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
US9752615B2 (en) | 2007-06-27 | 2017-09-05 | Brooks Automation, Inc. | Reduced-complexity self-bearing brushless DC motor |
JP5663304B2 (en) | 2007-06-27 | 2015-02-04 | ブルックス オートメーション インコーポレイテッド | Multi-dimensional position sensor |
US8823294B2 (en) * | 2007-06-27 | 2014-09-02 | Brooks Automation, Inc. | Commutation of an electromagnetic propulsion and guidance system |
CN101790673B (en) * | 2007-06-27 | 2013-08-28 | 布鲁克斯自动化公司 | Position feedback for self bearing motor |
US8283813B2 (en) * | 2007-06-27 | 2012-10-09 | Brooks Automation, Inc. | Robot drive with magnetic spindle bearings |
US8659205B2 (en) | 2007-06-27 | 2014-02-25 | Brooks Automation, Inc. | Motor stator with lift capability and reduced cogging characteristics |
JP2011514652A (en) * | 2007-07-17 | 2011-05-06 | ブルックス オートメーション インコーポレイテッド | Substrate processing apparatus with motor integrated in chamber wall |
KR100929817B1 (en) * | 2007-10-23 | 2009-12-07 | 세메스 주식회사 | Substrate Processing Apparatus and Manufacturing Method of Substrate Processing Apparatus |
WO2009072007A2 (en) * | 2007-12-07 | 2009-06-11 | Foamix Ltd. | Carriers, formulations, methods for formulating unstable active agents for external application and uses thereof |
CN102094228B (en) * | 2009-12-09 | 2013-09-18 | 鸿富锦精密工业(深圳)有限公司 | Anodization production line |
TWI457199B (en) * | 2010-01-11 | 2014-10-21 | Hon Hai Prec Ind Co Ltd | Anodizing processing line |
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US8500968B2 (en) | 2010-08-13 | 2013-08-06 | Applied Materials, Inc. | Deplating contacts in an electrochemical plating apparatus |
US8968532B2 (en) * | 2011-10-06 | 2015-03-03 | Applied Materials, Inc. | Electrochemical processor alignment system |
US20130112606A1 (en) * | 2011-11-07 | 2013-05-09 | Medical Components, Inc. | Filter assembly for fluid path and method of manufacture |
US20130156530A1 (en) * | 2011-12-14 | 2013-06-20 | Intermolecular, Inc. | Method and apparatus for reducing contamination of substrate |
US9598788B2 (en) | 2012-09-27 | 2017-03-21 | Applied Materials, Inc. | Electroplating apparatus with contact ring deplating |
US9399827B2 (en) * | 2013-04-29 | 2016-07-26 | Applied Materials, Inc. | Microelectronic substrate electro processing system |
US10174437B2 (en) | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
CN109367309B (en) * | 2018-09-14 | 2020-03-27 | 滨州学院 | Design platform structure based on art design |
US20230099715A1 (en) * | 2020-03-16 | 2023-03-30 | Saint-Gobain Performance Plastics Corporation | Filter assembly with electrode |
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Citations (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4428814A (en) * | 1982-08-25 | 1984-01-31 | Sperry Corporation | Electroplating apparatus with constant velocity agitation |
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US4648774A (en) * | 1983-02-28 | 1987-03-10 | Methods, Inc. | Load/unload apparatus for disc-like workpieces |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US4868575A (en) * | 1986-12-04 | 1989-09-19 | Mok Chuck K | Phase slope equalizer for satellite antennas |
US4890756A (en) * | 1988-08-15 | 1990-01-02 | Hoover Group, Inc. | Cylindrical tank with flared upper end |
US4917421A (en) * | 1988-11-01 | 1990-04-17 | Federal-Hoffman, Inc. | Detachable fastener for electrical enclosures |
US4937998A (en) * | 1988-06-17 | 1990-07-03 | Howard Goldberg | Structural member |
US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5344539A (en) * | 1992-03-30 | 1994-09-06 | Seiko Instruments Inc. | Electrochemical fine processing apparatus |
US5402807A (en) * | 1993-07-21 | 1995-04-04 | Moore; David R. | Multi-modular device for wet-processing integrated circuits |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
US5476577A (en) * | 1991-11-28 | 1995-12-19 | May; Hans J. | Device for the electrolytic deposition of metal on metal strips |
US5486282A (en) * | 1994-11-30 | 1996-01-23 | Ibm Corporation | Electroetching process for seed layer removal in electrochemical fabrication of wafers |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US5531874A (en) * | 1994-06-17 | 1996-07-02 | International Business Machines Corporation | Electroetching tool using localized application of channelized flow of electrolyte |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US5567300A (en) * | 1994-09-02 | 1996-10-22 | Ibm Corporation | Electrochemical metal removal technique for planarization of surfaces |
US5635157A (en) * | 1992-04-13 | 1997-06-03 | Mease; Ronnie C. | Synthesis of 4-substituted-trans-1,2-diaminocyclohexyl polyaminocarboxylate metal chelating agents for the preparation of stable radiometal antibody immunoconjugates for therapy and spect and pet imaging |
US5683564A (en) * | 1996-10-15 | 1997-11-04 | Reynolds Tech Fabricators Inc. | Plating cell and plating method with fluid wiper |
US5733024A (en) * | 1995-09-13 | 1998-03-31 | Silicon Valley Group, Inc. | Modular system |
US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
US5925226A (en) * | 1994-09-15 | 1999-07-20 | Tokyo Electron Limited | Apparatus and method for clamping a substrate |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6024856A (en) * | 1997-10-10 | 2000-02-15 | Enthone-Omi, Inc. | Copper metallization of silicon wafers using insoluble anodes |
US6027631A (en) * | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6035804A (en) * | 1997-11-07 | 2000-03-14 | Tokyo Electron Limited | Process chamber apparatus |
US6037790A (en) * | 1997-02-25 | 2000-03-14 | International Business Machines Corporation | In-situ contact resistance measurement for electroprocessing |
US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US6082948A (en) * | 1992-11-06 | 2000-07-04 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
US6132586A (en) * | 1998-06-11 | 2000-10-17 | Integrated Process Equipment Corporation | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6168695B1 (en) * | 1999-07-12 | 2001-01-02 | Daniel J. Woodruff | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US6181057B1 (en) * | 1997-09-18 | 2001-01-30 | Tdk Corporation | Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |
US6197182B1 (en) * | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6228231B1 (en) * | 1997-05-29 | 2001-05-08 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US6251250B1 (en) * | 1999-09-03 | 2001-06-26 | Arthur Keigler | Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US6312522B1 (en) * | 1999-12-17 | 2001-11-06 | Xerox Corporation | Immersion coating system |
US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
US20020029973A1 (en) * | 2000-07-07 | 2002-03-14 | Applied Materials, Inc. | Coated anode apparatus and associated method |
US6379511B1 (en) * | 1999-09-23 | 2002-04-30 | International Business Machines Corporation | Paddle design for plating bath |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6391114B1 (en) * | 1998-09-21 | 2002-05-21 | Nissin Electric Co., Ltd. | Vacuum processing apparatus |
US20020088708A1 (en) * | 1999-03-23 | 2002-07-11 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6436267B1 (en) * | 2000-08-29 | 2002-08-20 | Applied Materials, Inc. | Method for achieving copper fill of high aspect ratio interconnect features |
US6478937B2 (en) * | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
US20030047337A1 (en) * | 2001-08-30 | 2003-03-13 | Jimenez Jorge A. | Methods and apparatus for forming a flexible junction |
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US6557237B1 (en) * | 1999-04-08 | 2003-05-06 | Applied Materials, Inc. | Removable modular cell for electro-chemical plating and method |
US6565622B1 (en) * | 1998-12-18 | 2003-05-20 | Usinor | Method for denitriding molten steel during its production |
US6565662B2 (en) * | 1999-12-22 | 2003-05-20 | Tokyo Electron Limited | Vacuum processing apparatus for semiconductor process |
US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
US6635157B2 (en) * | 1998-11-30 | 2003-10-21 | Applied Materials, Inc. | Electro-chemical deposition system |
US6660137B2 (en) * | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6672820B1 (en) * | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
US20050000817A1 (en) * | 2003-07-01 | 2005-01-06 | Mchugh Paul R. | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US20050035046A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US6875333B2 (en) * | 2002-02-14 | 2005-04-05 | Electroplating Engineers Of Japan Limited | Plating apparatus for wafer |
US6900132B2 (en) * | 1998-03-13 | 2005-05-31 | Semitool, Inc. | Single workpiece processing system |
US20050145499A1 (en) * | 2000-06-05 | 2005-07-07 | Applied Materials, Inc. | Plating of a thin metal seed layer |
US20050167275A1 (en) * | 2003-10-22 | 2005-08-04 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
US6941720B2 (en) * | 2000-10-10 | 2005-09-13 | James Hardie International Finance B.V. | Composite building material |
US6955747B2 (en) * | 2002-09-23 | 2005-10-18 | International Business Machines Corporation | Cam driven paddle assembly for a plating cell |
US7018517B2 (en) * | 2002-06-21 | 2006-03-28 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
US7198695B2 (en) * | 2001-02-28 | 2007-04-03 | Rhodia Acetow Gmbh | Method for separating hemicelluloses from a biomass containing hemicelluloses and biomass and hemicelluloses obtained by said method |
US7247223B2 (en) * | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62297495A (en) | 1986-06-17 | 1987-12-24 | Electroplating Eng Of Japan Co | Method for plating semiconductor wafer |
JPS62297494A (en) | 1986-06-17 | 1987-12-24 | Electroplating Eng Of Japan Co | Method for plating semiconductor wafer |
US5579444A (en) * | 1987-08-28 | 1996-11-26 | Axiom Bildverarbeitungssysteme Gmbh | Adaptive vision-based controller |
JPH01120827A (en) | 1987-11-04 | 1989-05-12 | Mitsubishi Electric Corp | Device for cleaning wafer with air |
EP0343502A3 (en) | 1988-05-23 | 1991-04-17 | Lam Research Corporation | Method and system for clamping semiconductor wafers |
US5230743A (en) | 1988-05-25 | 1993-07-27 | Semitool, Inc. | Method for single wafer processing in which a semiconductor wafer is contacted with a fluid |
US5177563A (en) * | 1989-02-01 | 1993-01-05 | Texas A&M University System | Method and apparatus for locating physical objects |
JPH05175158A (en) | 1991-12-20 | 1993-07-13 | Fujitsu Ltd | Plating device |
US5455497A (en) * | 1992-04-20 | 1995-10-03 | Honda Giken Kogyo Kabushiki Kaisha | Legged mobile robot and a system for controlling the same |
JP3118112B2 (en) | 1993-03-09 | 2000-12-18 | 徳山東芝セラミックス株式会社 | Semiconductor substrate cleaning equipment |
JPH07211724A (en) | 1994-01-25 | 1995-08-11 | Casio Comput Co Ltd | Plating device and method and substrate to be plated |
JPH07284738A (en) | 1994-04-19 | 1995-10-31 | Toppan Printing Co Ltd | Washing apparatus |
US5617515A (en) * | 1994-07-11 | 1997-04-01 | Dynetics, Inc. | Method and apparatus for controlling and programming a robot or other moveable object |
US5597469A (en) | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
JPH0989067A (en) | 1995-09-26 | 1997-03-31 | Koganei Corp | Electricmotordriven linear reciprocating motion device |
JP3677911B2 (en) | 1996-12-09 | 2005-08-03 | 株式会社デンソー | Method and apparatus for plating semiconductor wafer |
US6069068A (en) | 1997-05-30 | 2000-05-30 | International Business Machines Corporation | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity |
US6044308A (en) * | 1997-06-13 | 2000-03-28 | Huissoon; Jan Paul | Method and device for robot tool frame calibration |
EP1040393A4 (en) * | 1997-09-04 | 2004-03-10 | Dynalog Inc | Method for calibration of a robot inspection system |
US6110011A (en) | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
JP2000017480A (en) | 1998-07-03 | 2000-01-18 | Fujitsu Ltd | Plating method |
JP3331332B2 (en) | 1999-08-25 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Cup type plating equipment |
WO2001000173A1 (en) | 1999-06-24 | 2001-01-04 | Kyowa Hakko Kogyo Co., Ltd. | Method of regulating leakage of drug encapsulated in liposomes |
JP3729095B2 (en) * | 2001-06-29 | 2005-12-21 | 日産自動車株式会社 | Traveling path detection device |
US6587752B1 (en) * | 2001-12-25 | 2003-07-01 | National Institute Of Advanced Industrial Science And Technology | Robot operation teaching method and apparatus |
US6826452B1 (en) * | 2002-03-29 | 2004-11-30 | The Penn State Research Foundation | Cable array robot for material handling |
US20050050767A1 (en) * | 2003-06-06 | 2005-03-10 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US7198694B2 (en) * | 2003-06-06 | 2007-04-03 | Semitool, Inc. | Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems |
US6934606B1 (en) * | 2003-06-20 | 2005-08-23 | Novellus Systems, Inc. | Automatic calibration of a wafer-handling robot |
-
2004
- 2004-06-03 US US10/860,385 patent/US7313462B2/en not_active Expired - Fee Related
- 2004-06-03 US US10/860,384 patent/US20050035046A1/en not_active Abandoned
- 2004-06-03 US US10/859,749 patent/US20050034977A1/en not_active Abandoned
- 2004-06-03 US US10/860,593 patent/US7371306B2/en active Active
- 2004-06-07 TW TW093116307A patent/TWI275916B/en active
-
2007
- 2007-09-07 US US11/851,552 patent/US20070295600A1/en not_active Abandoned
Patent Citations (95)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4428814A (en) * | 1982-08-25 | 1984-01-31 | Sperry Corporation | Electroplating apparatus with constant velocity agitation |
US4648774A (en) * | 1983-02-28 | 1987-03-10 | Methods, Inc. | Load/unload apparatus for disc-like workpieces |
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US4868575A (en) * | 1986-12-04 | 1989-09-19 | Mok Chuck K | Phase slope equalizer for satellite antennas |
US5431421A (en) * | 1988-05-25 | 1995-07-11 | Semitool, Inc. | Semiconductor processor wafer holder |
US4937998A (en) * | 1988-06-17 | 1990-07-03 | Howard Goldberg | Structural member |
US4890756A (en) * | 1988-08-15 | 1990-01-02 | Hoover Group, Inc. | Cylindrical tank with flared upper end |
US4917421A (en) * | 1988-11-01 | 1990-04-17 | Federal-Hoffman, Inc. | Detachable fastener for electrical enclosures |
US5000827A (en) * | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5476577A (en) * | 1991-11-28 | 1995-12-19 | May; Hans J. | Device for the electrolytic deposition of metal on metal strips |
US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5344539A (en) * | 1992-03-30 | 1994-09-06 | Seiko Instruments Inc. | Electrochemical fine processing apparatus |
US5635157A (en) * | 1992-04-13 | 1997-06-03 | Mease; Ronnie C. | Synthesis of 4-substituted-trans-1,2-diaminocyclohexyl polyaminocarboxylate metal chelating agents for the preparation of stable radiometal antibody immunoconjugates for therapy and spect and pet imaging |
US6082948A (en) * | 1992-11-06 | 2000-07-04 | Applied Materials, Inc. | Controlled environment enclosure and mechanical interface |
US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
US5402807A (en) * | 1993-07-21 | 1995-04-04 | Moore; David R. | Multi-modular device for wet-processing integrated circuits |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5614076A (en) * | 1994-06-17 | 1997-03-25 | International Business Machines Corporation | Tool and method for electroetching |
US5531874A (en) * | 1994-06-17 | 1996-07-02 | International Business Machines Corporation | Electroetching tool using localized application of channelized flow of electrolyte |
US5567300A (en) * | 1994-09-02 | 1996-10-22 | Ibm Corporation | Electrochemical metal removal technique for planarization of surfaces |
US5925226A (en) * | 1994-09-15 | 1999-07-20 | Tokyo Electron Limited | Apparatus and method for clamping a substrate |
US5486282A (en) * | 1994-11-30 | 1996-01-23 | Ibm Corporation | Electroetching process for seed layer removal in electrochemical fabrication of wafers |
US5543032A (en) * | 1994-11-30 | 1996-08-06 | Ibm Corporation | Electroetching method and apparatus |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
US5733024A (en) * | 1995-09-13 | 1998-03-31 | Silicon Valley Group, Inc. | Modular system |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6672820B1 (en) * | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US5683564A (en) * | 1996-10-15 | 1997-11-04 | Reynolds Tech Fabricators Inc. | Plating cell and plating method with fluid wiper |
US6037790A (en) * | 1997-02-25 | 2000-03-14 | International Business Machines Corporation | In-situ contact resistance measurement for electroprocessing |
US6228231B1 (en) * | 1997-05-29 | 2001-05-08 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
US6181057B1 (en) * | 1997-09-18 | 2001-01-30 | Tdk Corporation | Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |
US6322674B1 (en) * | 1997-09-18 | 2001-11-27 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6139703A (en) * | 1997-09-18 | 2000-10-31 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6024856A (en) * | 1997-10-10 | 2000-02-15 | Enthone-Omi, Inc. | Copper metallization of silicon wafers using insoluble anodes |
US6035804A (en) * | 1997-11-07 | 2000-03-14 | Tokyo Electron Limited | Process chamber apparatus |
US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
US6027631A (en) * | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6900132B2 (en) * | 1998-03-13 | 2005-05-31 | Semitool, Inc. | Single workpiece processing system |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6132586A (en) * | 1998-06-11 | 2000-10-17 | Integrated Process Equipment Corporation | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
US6391114B1 (en) * | 1998-09-21 | 2002-05-21 | Nissin Electric Co., Ltd. | Vacuum processing apparatus |
US6635157B2 (en) * | 1998-11-30 | 2003-10-21 | Applied Materials, Inc. | Electro-chemical deposition system |
US6565622B1 (en) * | 1998-12-18 | 2003-05-20 | Usinor | Method for denitriding molten steel during its production |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6482300B2 (en) * | 1999-03-23 | 2002-11-19 | Electroplating Engineers Of Japan Limited | Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US20020088708A1 (en) * | 1999-03-23 | 2002-07-11 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
US6557237B1 (en) * | 1999-04-08 | 2003-05-06 | Applied Materials, Inc. | Removable modular cell for electro-chemical plating and method |
US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
US6660137B2 (en) * | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US6197182B1 (en) * | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
US6168695B1 (en) * | 1999-07-12 | 2001-01-02 | Daniel J. Woodruff | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US6251250B1 (en) * | 1999-09-03 | 2001-06-26 | Arthur Keigler | Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well |
US6379511B1 (en) * | 1999-09-23 | 2002-04-30 | International Business Machines Corporation | Paddle design for plating bath |
US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
US6312522B1 (en) * | 1999-12-17 | 2001-11-06 | Xerox Corporation | Immersion coating system |
US6565662B2 (en) * | 1999-12-22 | 2003-05-20 | Tokyo Electron Limited | Vacuum processing apparatus for semiconductor process |
US20040134774A1 (en) * | 2000-01-03 | 2004-07-15 | Daniel Woodruff | Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
US20030221953A1 (en) * | 2000-01-03 | 2003-12-04 | Oberlitner Thomas H. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US6773559B2 (en) * | 2000-01-03 | 2004-08-10 | Semitool, Inc. | Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
US20050145499A1 (en) * | 2000-06-05 | 2005-07-07 | Applied Materials, Inc. | Plating of a thin metal seed layer |
US20020029973A1 (en) * | 2000-07-07 | 2002-03-14 | Applied Materials, Inc. | Coated anode apparatus and associated method |
US6436267B1 (en) * | 2000-08-29 | 2002-08-20 | Applied Materials, Inc. | Method for achieving copper fill of high aspect ratio interconnect features |
US6941720B2 (en) * | 2000-10-10 | 2005-09-13 | James Hardie International Finance B.V. | Composite building material |
US6478937B2 (en) * | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
US7198695B2 (en) * | 2001-02-28 | 2007-04-03 | Rhodia Acetow Gmbh | Method for separating hemicelluloses from a biomass containing hemicelluloses and biomass and hemicelluloses obtained by said method |
US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
US6897372B2 (en) * | 2001-08-30 | 2005-05-24 | Tellabs Operations, Inc. | Methods and apparatus for forming a flexible junction |
US20030047337A1 (en) * | 2001-08-30 | 2003-03-13 | Jimenez Jorge A. | Methods and apparatus for forming a flexible junction |
US6875333B2 (en) * | 2002-02-14 | 2005-04-05 | Electroplating Engineers Of Japan Limited | Plating apparatus for wafer |
US7247223B2 (en) * | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
US7018517B2 (en) * | 2002-06-21 | 2006-03-28 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
US6955747B2 (en) * | 2002-09-23 | 2005-10-18 | International Business Machines Corporation | Cam driven paddle assembly for a plating cell |
US20050035046A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US20050061438A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US20050006241A1 (en) * | 2003-07-01 | 2005-01-13 | Mchugh Paul R. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
US20050000817A1 (en) * | 2003-07-01 | 2005-01-06 | Mchugh Paul R. | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US20050167275A1 (en) * | 2003-10-22 | 2005-08-04 | Arthur Keigler | Method and apparatus for fluid processing a workpiece |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080110751A1 (en) * | 2000-01-03 | 2008-05-15 | Semitool, Inc. | Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
US20050035046A1 (en) * | 2003-06-06 | 2005-02-17 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US20050061438A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US20040245094A1 (en) * | 2003-06-06 | 2004-12-09 | Mchugh Paul R. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US7393439B2 (en) * | 2003-06-06 | 2008-07-01 | Semitool, Inc. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US7371306B2 (en) | 2003-06-06 | 2008-05-13 | Semitool, Inc. | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US7390383B2 (en) | 2003-07-01 | 2008-06-24 | Semitool, Inc. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
US20050006241A1 (en) * | 2003-07-01 | 2005-01-13 | Mchugh Paul R. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
US20070144912A1 (en) * | 2003-07-01 | 2007-06-28 | Woodruff Daniel J | Linearly translating agitators for processing microfeature workpieces, and associated methods |
US7390382B2 (en) | 2003-07-01 | 2008-06-24 | Semitool, Inc. | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US20070018941A1 (en) * | 2003-11-03 | 2007-01-25 | Monolithic Power Systems, Inc. | Driver for light source having integrated photosensitive elements for driver control |
US20070166810A1 (en) * | 2005-12-23 | 2007-07-19 | Perkinelmer Las, Inc. | Methods and compositions for detecting enzymatic activity |
US20080178460A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods |
US20090024244A1 (en) * | 2007-07-16 | 2009-01-22 | Harris Randy A | High throughput semiconductor wafer processing |
US20090022574A1 (en) * | 2007-07-16 | 2009-01-22 | Eudy Steve L | Workpiece loading system |
US7934898B2 (en) | 2007-07-16 | 2011-05-03 | Semitool, Inc. | High throughput semiconductor wafer processing |
Also Published As
Publication number | Publication date |
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US20070295600A1 (en) | 2007-12-27 |
US20050109088A1 (en) | 2005-05-26 |
TWI275916B (en) | 2007-03-11 |
US7313462B2 (en) | 2007-12-25 |
TW200504476A (en) | 2005-02-01 |
US20050061438A1 (en) | 2005-03-24 |
US20050035046A1 (en) | 2005-02-17 |
US7371306B2 (en) | 2008-05-13 |
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