US20040235390A1 - Reclaiming virgin test wafers - Google Patents

Reclaiming virgin test wafers Download PDF

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Publication number
US20040235390A1
US20040235390A1 US10/822,585 US82258504A US2004235390A1 US 20040235390 A1 US20040235390 A1 US 20040235390A1 US 82258504 A US82258504 A US 82258504A US 2004235390 A1 US2004235390 A1 US 2004235390A1
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Prior art keywords
wafer
polishing
particles
pad
wafers
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Abandoned
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US10/822,585
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Hossein Rojhantalab
Chi-Hwa Tsang
Sean King
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Definitions

  • This invention relates to the field of semiconductor fabrication, and specifically to testing for surface defects and/or particles in semiconductor wafer production.
  • Surface defects may include particles that are added to the surface of a wafer.
  • the number of particles on a wafer surface may be determined and monitored to assure that production yield is maintained at an acceptable level, and to prevent defect density from reaching an unacceptable level.
  • one source of particles is semiconductor tools or equipment.
  • the number of particles added to a wafer per product pass through the tool may be determined or specified by running a test wafer through the tool before production semiconductor wafers are started.
  • periodic defect monitoring may be used to test the cleanliness or condition of a tool and/or process before production semiconductor wafers are processed or handled by that tool or process.
  • test wafers In periodic defect monitoring, one or more test wafers may be used.
  • a virgin test (“VT”) wafer is a bare silicon slice that has not been used or exposed to the conditions or steps of process characterization.
  • VT wafers may be suitable for monitoring particles or defects that are added by a particular tool or process. The number and type of particles added to the VT wafer may depend on the status and condition of the tool, for example.
  • a grinding, lapping or polishing tool may be used to remove silicon from the wafer surface, reducing the wafer thickness by between about 10 microns and about 20 microns or more. Typically, this reduction in wafer thickness means that the virgin test wafer cannot be reused again more than once or, at most, very few times.
  • a VT wafer may not be reused again.
  • test wafers having thin epitaxial surfaces of about 2 microns to about 4 microns cannot be reclaimed or reused because grinding, lapping or polishing processes remove a greater thickness.
  • VT wafers Use of VT wafers to monitor defects or particles added by semiconductor processing tools or equipment is very costly. For example, several VT wafers may be used for each new production wafer start, and the number of VT wafers used may vary depending on the maturity of the tool and the process.
  • a system and method are needed to extend the useful life of virgin test wafers and to allow them to be reclaimed and reused repeatedly in the testing for particles and surface defects produced in various tools and processes.
  • FIG. 1 is a schematic representation of a polishing system for reclaiming virgin test wafers according to one embodiment of the invention.
  • FIG. 2 is a side view representation of a virgin test wafer after addition of particles on the surface thereof.
  • FIG. 3 is a side view representation of a virgin test wafer after polishing to remove surface particles therefrom.
  • polishing system 100 is shown in which semiconductor wafer 101 is positioned and removably held by a polishing head 102 having a wafer carrier or wafer holder.
  • the back side of the wafer faces the polishing head and is held thereto by conventional means such as vacuum suction.
  • the polishing head may be rotated about its central axis 104 .
  • the polishing head may be adapted to move the wafer laterally or vertically.
  • the wafer may be a virgin test wafer, or a wafer that has been polished previously at least once using the method and system of the present invention.
  • a virgin test wafer may be polished and re-used as many as several hundred times or more using the method and process of this invention.
  • the polishing system includes polishing pad 105 which is mounted and secured on the top side of polishing platen 106 .
  • the platen may be rotated about its central axis 107 .
  • the amount of silicon or other material removed from the wafer surface may be controlled by the platen rotation speed and the down force applied to the wafer on the polishing head.
  • the platen rotation speed is between about 10 revolutions per minute and about 100 revolutions per minute.
  • the down force pressure applied to the wafer is between about 0.05 pounds per square inch and about 4.5 pounds per square inch, and most preferably less than about 1.0 pound per square inch.
  • the down force should be controlled within plus or minus 0.03 pounds per square inch to 0.08 pounds per square inch.
  • the low down force applied to the wafer limits the polish rate, and also helps prevent damage to the wafer surface and enhances the life of the polishing pad.
  • the total amount of silicon or other material removed from the wafer surface is less than about 500 Angstroms on single silicon crystal.
  • a total of not more than about 200 Angstroms is removed from the wafer surface.
  • the polish rate uniformity should be within about 10% to about 12%.
  • the polishing process may remove particles on the surface of the wafer including particles that may be chemically bonded, adhered or attached to the wafer surface.
  • particles may adhere to silicon or silicon dioxide by static forces, other electrical charges, or bonding with oxides on the surface of a wafer.
  • the polishing method may remove particles as small as 0.09 microns from the wafer surface.
  • FIG. 2 depicts a semiconductor wafer 201 after use for periodic defect monitoring, in which particles 202 are found on or adjacent the wafer surface. Before polishing, the wafer has thickness D 1 . Polishing according to one embodiment of the present invention breaks the surface attachments or bonding between the particles and the wafer.
  • wafer 301 after polishing to remove the particles from the wafer surface, wafer 301 has a thickness D 2 which is not more than 500 Angstroms thinner than D 1 .
  • the polishing system and process are not intended to reach or remove particles that are embedded more deeply than about 500 Angstroms into the wafer.
  • the present invention is directed to removal of surface particles and/or defects from or immediately adjacent the surface of a virgin semiconductor wafer, rather than to removal or eradication of internal defects.
  • the polishing system may include dispenser 109 which may provide an abrasive polishing slurry 110 that is poured onto the polishing pad.
  • the slurry includes a fluid having a pH in the range between about 8.0 and about 9.5.
  • the fluid may be an organic amino acid, an organic acid, an inorganic acid, or a combination of two or more of the above.
  • the slurry may have a specific gravity of about 1.01 to about 1.08, and average particle size may be between about 25 nanometers and about 50 nanometers, filtered through a 0.1 to 0.25 micron mesh filter.
  • An example of a slurry that may be used is ultra pure SiO 2 or Al 2 O 3 which may be diluted with de-ionized water in a ratio of one part slurry to one part de-ionized water, to one part slurry to 25 parts de-ionized water.
  • a gentle pad conditioner may be used to treat and condition the surface of polishing pad 105 after a wafer is polished, thus removing particles and/or byproduct debris from the polishing pad.
  • the pad conditioner is preferably bundles of different stiffness bristle brushes in the form of pellets mounted in the pad conditioner.
  • each conditioner may comprise about 400 to about 1200 mounted pellets on the conditioner head, with a bundle of bristles mounted in each pellet.
  • the bristle height should be between about 4 mm and 8 mm, with soft to medium-hard stiffness.
  • the pad conditioner may be held on a vertical cylinder, and rotated at between about 10 revolutions per minute ant about 150 revolutions per minute to condition the polishing pad between wafers.
  • the use of a pad conditioner is optional, for example to extend the life of the pad.
  • the wafer surface may be cleaned, rinsed and/or scrubbed with a chemical liquid and the wafer may be re-used again as a VT wafer for detection of particle contamination.
  • the silicon polish process may be used to generate a new VT wafer from a used VT wafer. Only a few hundred Angstroms of silicon are removed, so a VT wafer may be reused many times. Because only a few hundred Angstroms of silicon are removed from the wafer surface, this method also may be used for epi test wafers as well as VT wafers.

Abstract

A method and system for reclaiming virgin test wafers by polishing a very thin layer from the wafer surface, applying a low down force between the wafer and the pad, with a dilute, low basic slurry. By polishing only a few hundred Angstroms of silicon from the wafer surface, a virgin test wafer may be repeatedly reclaimed and reused for periodic defect monitoring.

Description

    BACKGROUND
  • This invention relates to the field of semiconductor fabrication, and specifically to testing for surface defects and/or particles in semiconductor wafer production. [0001]
  • It is critically important in semiconductor manufacturing to reduce or minimize surface defects in integrated circuits formed on wafers. Surface defects, for example, may include particles that are added to the surface of a wafer. The number of particles on a wafer surface may be determined and monitored to assure that production yield is maintained at an acceptable level, and to prevent defect density from reaching an unacceptable level. For example, one source of particles is semiconductor tools or equipment. The number of particles added to a wafer per product pass through the tool may be determined or specified by running a test wafer through the tool before production semiconductor wafers are started. Thus, periodic defect monitoring may be used to test the cleanliness or condition of a tool and/or process before production semiconductor wafers are processed or handled by that tool or process. [0002]
  • In periodic defect monitoring, one or more test wafers may be used. A virgin test (“VT”) wafer is a bare silicon slice that has not been used or exposed to the conditions or steps of process characterization. VT wafers may be suitable for monitoring particles or defects that are added by a particular tool or process. The number and type of particles added to the VT wafer may depend on the status and condition of the tool, for example. [0003]
  • After a VT wafer has been used for periodic defect monitoring, a grinding, lapping or polishing tool may be used to remove silicon from the wafer surface, reducing the wafer thickness by between about 10 microns and about 20 microns or more. Typically, this reduction in wafer thickness means that the virgin test wafer cannot be reused again more than once or, at most, very few times. [0004]
  • In some instances, such as where defect quality is measured on process films, a VT wafer may not be reused again. For example, test wafers having thin epitaxial surfaces of about 2 microns to about 4 microns cannot be reclaimed or reused because grinding, lapping or polishing processes remove a greater thickness. [0005]
  • Use of VT wafers to monitor defects or particles added by semiconductor processing tools or equipment is very costly. For example, several VT wafers may be used for each new production wafer start, and the number of VT wafers used may vary depending on the maturity of the tool and the process. [0006]
  • A system and method are needed to extend the useful life of virgin test wafers and to allow them to be reclaimed and reused repeatedly in the testing for particles and surface defects produced in various tools and processes.[0007]
    • BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1 is a schematic representation of a polishing system for reclaiming virgin test wafers according to one embodiment of the invention. [0008]
  • FIG. 2 is a side view representation of a virgin test wafer after addition of particles on the surface thereof. [0009]
  • FIG. 3 is a side view representation of a virgin test wafer after polishing to remove surface particles therefrom.[0010]
    • DETAILED DESCRIPTION
  • In FIG. 1, [0011] polishing system 100 is shown in which semiconductor wafer 101 is positioned and removably held by a polishing head 102 having a wafer carrier or wafer holder. The back side of the wafer faces the polishing head and is held thereto by conventional means such as vacuum suction. During polishing, the polishing head may be rotated about its central axis 104. In addition to rotating the wafer, the polishing head may be adapted to move the wafer laterally or vertically.
  • In one embodiment, the wafer may be a virgin test wafer, or a wafer that has been polished previously at least once using the method and system of the present invention. As will be described below, a virgin test wafer may be polished and re-used as many as several hundred times or more using the method and process of this invention. [0012]
  • The polishing system includes [0013] polishing pad 105 which is mounted and secured on the top side of polishing platen 106. The platen may be rotated about its central axis 107. The amount of silicon or other material removed from the wafer surface may be controlled by the platen rotation speed and the down force applied to the wafer on the polishing head.
  • In one embodiment, the platen rotation speed is between about 10 revolutions per minute and about 100 revolutions per minute. In one embodiment, the down force pressure applied to the wafer is between about 0.05 pounds per square inch and about 4.5 pounds per square inch, and most preferably less than about 1.0 pound per square inch. The down force should be controlled within plus or minus 0.03 pounds per square inch to 0.08 pounds per square inch. The low down force applied to the wafer limits the polish rate, and also helps prevent damage to the wafer surface and enhances the life of the polishing pad. [0014]
  • In one embodiment, the total amount of silicon or other material removed from the wafer surface is less than about 500 Angstroms on single silicon crystal. Preferably, during each polishing process, a total of not more than about 200 Angstroms is removed from the wafer surface. In one embodiment, the polish rate uniformity should be within about 10% to about 12%. [0015]
  • The polishing process may remove particles on the surface of the wafer including particles that may be chemically bonded, adhered or attached to the wafer surface. For example, particles may adhere to silicon or silicon dioxide by static forces, other electrical charges, or bonding with oxides on the surface of a wafer. In accordance with one embodiment, the polishing method may remove particles as small as 0.09 microns from the wafer surface. [0016]
  • FIG. 2 depicts a [0017] semiconductor wafer 201 after use for periodic defect monitoring, in which particles 202 are found on or adjacent the wafer surface. Before polishing, the wafer has thickness D1. Polishing according to one embodiment of the present invention breaks the surface attachments or bonding between the particles and the wafer.
  • As shown in FIG. 3, after polishing to remove the particles from the wafer surface, [0018] wafer 301 has a thickness D2 which is not more than 500 Angstroms thinner than D1. The polishing system and process are not intended to reach or remove particles that are embedded more deeply than about 500 Angstroms into the wafer. Thus, the present invention is directed to removal of surface particles and/or defects from or immediately adjacent the surface of a virgin semiconductor wafer, rather than to removal or eradication of internal defects.
  • Referring again to FIG. 1, in one embodiment, the polishing system may include [0019] dispenser 109 which may provide an abrasive polishing slurry 110 that is poured onto the polishing pad. In one embodiment, the slurry includes a fluid having a pH in the range between about 8.0 and about 9.5. For example, the fluid may be an organic amino acid, an organic acid, an inorganic acid, or a combination of two or more of the above. In one embodiment, the slurry may have a specific gravity of about 1.01 to about 1.08, and average particle size may be between about 25 nanometers and about 50 nanometers, filtered through a 0.1 to 0.25 micron mesh filter. An example of a slurry that may be used is ultra pure SiO2 or Al2O3 which may be diluted with de-ionized water in a ratio of one part slurry to one part de-ionized water, to one part slurry to 25 parts de-ionized water.
  • In one embodiment, a gentle pad conditioner may be used to treat and condition the surface of [0020] polishing pad 105 after a wafer is polished, thus removing particles and/or byproduct debris from the polishing pad. The pad conditioner is preferably bundles of different stiffness bristle brushes in the form of pellets mounted in the pad conditioner. For example, each conditioner may comprise about 400 to about 1200 mounted pellets on the conditioner head, with a bundle of bristles mounted in each pellet. In one embodiment, the bristle height should be between about 4 mm and 8 mm, with soft to medium-hard stiffness. The pad conditioner may be held on a vertical cylinder, and rotated at between about 10 revolutions per minute ant about 150 revolutions per minute to condition the polishing pad between wafers. The use of a pad conditioner is optional, for example to extend the life of the pad.
  • After polishing to remove a very thin layer of silicon from the wafer surface, the wafer surface may be cleaned, rinsed and/or scrubbed with a chemical liquid and the wafer may be re-used again as a VT wafer for detection of particle contamination. Thus, the silicon polish process may be used to generate a new VT wafer from a used VT wafer. Only a few hundred Angstroms of silicon are removed, so a VT wafer may be reused many times. Because only a few hundred Angstroms of silicon are removed from the wafer surface, this method also may be used for epi test wafers as well as VT wafers. [0021]
  • While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover all such modifications and variations as fall within the true spirit and scope of this present invention. [0022]

Claims (6)

1-10. (canceled).
11. A system comprising:
a polishing platen having a polishing pad mounted thereon, the polishing platen rotatable at between about 10 revolutions per minute and about 100 revolutions per minute; and
a polishing head to hold a semiconductor wafer and urge the wafer against the polishing pad at a down force pressure of between about 0.05 pounds per square inch and about 4.5 pounds per square inch.
12. The system of claim 11 further comprising a dispenser to hold an abrasive slurry and dispense the slurry onto the polishing pad.
13. The system of claim 11 further comprising a rotatable pad conditioner having a plurality of soft bristles mounted on pellets.
14. The system of claim 11 wherein the polishing head is rotatable.
15. The system of claim 11 wherein the total material removed is less than about 500 Angstroms.
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US6761625B1 (en) * 2003-05-20 2004-07-13 Intel Corporation Reclaiming virgin test wafers
US7098047B2 (en) * 2003-11-19 2006-08-29 Intel Corporation Wafer reuse techniques
US7442114B2 (en) * 2004-12-23 2008-10-28 Lam Research Corporation Methods for silicon electrode assembly etch rate and etch uniformity recovery
KR20080072905A (en) 2005-11-09 2008-08-07 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
US20100056410A1 (en) * 2006-09-25 2010-03-04 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
US20090233447A1 (en) * 2008-03-11 2009-09-17 Taiwan Semiconductor Manufacturing Co., Ltd. Control wafer reclamation process
KR101827031B1 (en) 2010-10-06 2018-02-07 엔테그리스, 아이엔씨. Composition and process for selectively etching metal nitrides
US20120255635A1 (en) * 2011-04-11 2012-10-11 Applied Materials, Inc. Method and apparatus for refurbishing gas distribution plate surfaces
CN112677016B (en) * 2020-12-23 2022-06-28 上海高仙自动化科技发展有限公司 Detection method, detection device, intelligent robot and readable storage medium

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