US20040207825A1 - Optical arrangement and projection exposure system for microlithography with passive thermal compensation - Google Patents
Optical arrangement and projection exposure system for microlithography with passive thermal compensation Download PDFInfo
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- US20040207825A1 US20040207825A1 US10/826,823 US82682304A US2004207825A1 US 20040207825 A1 US20040207825 A1 US 20040207825A1 US 82682304 A US82682304 A US 82682304A US 2004207825 A1 US2004207825 A1 US 2004207825A1
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- optical element
- optical
- projection exposure
- exposure system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Definitions
- FIG. 8 shows, in schematic section, a mirror with different cooling effected by webs of different materials
- FIG. 3 b shows how the part 3 extends to the neighborhood of the illuminated region 10 in the direction A-A of the length of the slit
- FIG. 3 c shows that the distance is kept large in the transverse direction B-B.
Abstract
An optical arrangement with a light source includes an optical element that is fastened in a mount. The light source emits radiation and the optical element is acted on thereby such that the heat that results lacks symmetry corresponding to the shape of the optical element. A connecting structure is provided between the optical element and the mount and has a symmetry that does not correspond to the shape of the optical element and effects an at least partial homogenization of the temperature distribution in the optical element.
Description
- This application is a Continuation of patent application Ser. No. 09/934,817 filed Aug. 21, 2001, of the same inventors, the priority of which under 35 USC 120 is claimed for this application.
- Not applicable.
- 1. Field of the Invention
- This invention relates to an optical arrangement with a light source and an optical element, and more particularly to projection exposure systems for microlithography, in which a thermal effect that is not rotationally symmetrical that results from the irradiation from the light source is compensated. Microlithography notoriously is the art of producing structures in the micrometer and submicrometer range—inter alia for microelectronic devices—by photolithography.
- This situation is of particular importance in wafer scanners with a slit-shaped image field: either a narrow rectangle slit with a width to length ratio of e.g. typically 1:5 to 1:9, or an arcuate shape, particularly in mirror systems.
- 2. Discussion of Relevant Art
- Active compensation of the imaging errors resulting from asymmetric thermal effects is known from European Patent EP-
A 0 678 768, and its counterpart U.S. Pat. No. 5,805,273 to Unno by regulated or controlled non-rotationally-symmetrical heating or cooling and also, by way of a suggestion, by mechanical stressing. - The like was described earlier in European Patent EP-
B1 0 532 236, preferably as heating for mirrors. - The invention has as its object to markedly reduce or render symmetrical, by the simplest possible means, the change of the properties of optical elements due to light absorption and the resulting heating, particularly in projection exposure systems.
- This object is achieved by an optical arrangement and by projection exposure systems having an optical arrangement with the following features:
- An optical arrangement with a light source, that emits radiation, having a mount, and an optical element fastened in the mount. The optical element, is acted on by the radiation such that heat results from the radiation that lacks symmetry corresponding to the shape of the optical element. A connecting structure between the optical element and the mount has a symmetry that does not correspond to the shape of the optical element and effects an at least partial homogenization of temperature distribution in the optical element.
- Active, controlled or regulated operations on the optical elements are dispensed with. The total energy input into the arrangement is reduced by the avoidance of active elements and particularly of a heating system.
- On the other hand, the invention with asymmetrical cooling departs from the proven constructional principles of mountings with high symmetry, which principles particularly for projection exposure systems have heretofore been driven to the utmost.
- The invention will be described in more detail hereinbelow with reference to the accompanying drawings, in which
- FIG. 1 shows schematically a lens with a slit-shaped illumination and tab connections of different materials;
- FIG. 2 shows schematically a lens with dipole-like illumination and connections to the mounting, of different cross sections;
- FIG. 3a shows schematically a lens with a slit-shaped illumination in a symmetrical mounting with a cooling body of non-rotationally-symmetrical shape;
- FIG. 3b shows a section along section line IIIb-IIIb of FIG. 3a;
- FIG. 3c shows a section along section line IIIc-IIIc FIG. 3a;
- FIG. 4 shows schematically in cross section a variant with a cooling tab and heat conducting cable;
- FIG. 5a shows a FEM model with symmetrically arranged like cooling bodies;
- FIG. 5b shows schematically in cross section another variant with a cooling tab and heat conducting cable;
- FIG. 6 shows a FEM model similar to FIG. 5a, but with the cooling body varied in position, size and material;
- FIG. 7 shows a variant with a cooling body with temperature-induced variation of the cooling effect;
- FIG. 8 shows, in schematic section, a mirror with different cooling effected by webs of different materials; and
- FIG. 9 shows schematically a general view of a projection exposure system.
- The arrangement of FIG. 1 shows a
lens mount 2 in which alens 1 is held as free as possible from stress and fixed exactly in position, by numerous webs 21-28 (eight are shown). The webs 21-28 (spokes, tabs) are adhered to the edge of the lens, or connected by other jointing methods. - The
lens 1 is illuminated in a slit-shaped cross section 10. The problem in just those projection exposure systems that operate in the VUV (vacuum ultraviolet) and DUV (deep ultraviolet) region is that the lens materials have a considerable absorption, and consequently there is a considerable supply of heat into thecross section 10. The related rise in temperature brings about a change of the refractive index, and in addition a deformation due to thermal expansion. The overall result is a change of the lens operation, with astigmatic operation. - Cooling takes place to only a small extent by means of the surrounding gas (usually helium in projection exposure systems) and by thermal radiation. The heat is transferred to the
mount 2 primarily via thelens body 1, the joint spot (adhesive), and the gas in the surroundings of the joint spot, and the webs 21-28. - According to the invention, the webs21-28 in this embodiment are constituted of different materials, so that they have different thermal conductivities. For example, the
webs shaped cross section 10 are of silver, with very good thermal conductivity; those furthest away 23, 27 are of lead, with a low thermal conductivity, and the webs in between 22, 24, 26, 28 are of aluminum with medium thermal conductivity. The temperature distribution in thelens 1 is thus relatively lowered between thewebs webs lens 1. - In practice, further properties of the materials used, such as their strength, elasticity, and thermal expansion are to be considered. Simulation calculations for the mechanical, thermal and optical properties, using the Finite Element Method, make possible an optimized selection and embodiment of the arrangement.
- An alternative, which however is also suitable for combination with the above described embodiment, is shown in FIG. 2. Here the
lens 1 andmount 2 are connected by means of webs 211-214 (for clarity, only four are shown; in practice there are more) with different cross sections and thus different thermal conduction. Different mechanical properties are prevented by means of each web 211-214 having similar spring joints 221-224. The thermal conduction over the adjacently situated narrow gaps (only minimal mobility of the joints is required) takes place sufficiently effectively by means of the filling gas (helium) or by a flexible metal cable (stranded conductor) (see FIG. 6b). - The exact combination is established here also with the support of simulation calculations. A combination with the use of different materials as shown in FIG. 1 opens up wider possibilities of matching.
- Additionally, a “dipole” illumination of the lens with two eccentric light spots101, 102 is shown in this FIG. 2, as occurs in the region of the diaphragm plane and equivalent planes of projection exposure systems with symmetrical oblique illumination. Astigmatic errors due to light absorption also arise therewith, and can be reduced by passive compensating cooling.
- FIGS. 3a-3 c show a variant of the invention with an additional thermally conducting
element 3, which is provided only for the equalizing cooling. - The
lens 1 andmount 2 are in this case connected with uniform webs or with selectively cooling webs according to FIG. 1 or 2. Any other mounting technique is likewise usable. - The
thermally conducting element 3 is connected fast to themount 2 with good thermal conduction, and covers portions of thelens 1 through which no light passes and which are thus outside the illuminatedsurface 10, also shown here as a slit. - This covering is preferably free from contact, at a spacing of about 0.1 mm, so that a good thermal transfer is assured by means of the filling gas, but no stresses can be transmitted into the
lens 1. Better thermal conduction of course results when the gap between thelens 1 and the thermally conductingelement 3 is filled with adhesive, a gel, liquid crystals, or the like material which transmits as little stress as possible. - The thermal conduction and its local distribution is set by the shape of the thermally conducting
part 3; FIG. 3b shows how thepart 3 extends to the neighborhood of the illuminatedregion 10 in the direction A-A of the length of the slit, and FIG. 3c shows that the distance is kept large in the transverse direction B-B. - With the embodiment shown in FIG. 3a of the thermally conducting
element 3, with numerous fingers or spokes, their width, shape, and distribution can be made use of for the adjustment of the thermal conduction. In an embodiment as an unbroken disk or as a perforated diaphragm, the thickness of the thermally conducting element can be locally different. It is also possible to make the individual fingers, analogously to the webs 21-28 of FIG. 1, of different thermally conducting materials. The thermally conductingelement 3 can of course also be arranged on both sides of thelens 1. - FIG. 4 shows, in an illustration corresponding to FIG. 3b, a manner in which the
cooling element 3 can be brought into material contact or shape-fitting contact with thelens 1 without impairing the mechanical properties of themount 2 and the connectingportions 21. For this purpose, thecooling element 3 is provided with a flexible, heat-conductingcable 30—e.g., a stranded copper wire—and is connected to aheat sink 20. - FIG. 5a shows in plain view the finite element model of a quadrant of a
lens 1 of quartz glass (middle thickness 14.4 mm, upper radius of curvature 1600 mm, lower radius of curvature 220 mm, biconvex, diameter 160 mm). Eight solid tabs (51, 52, 53) of aluminum are uniformly distributed, arranged on thelens 1 in the manner which will be apparent from the cross section, FIG. 5b. They are 30 mm wide, 2 mm thick above the lens and covering it for 6 mm radially, outside which they are a further 8 mm long radially, with a thickness of 4 mm. At the outer edge, they are kept to the base temperature by flexible, thermally conductive strandedwires 50, for example. - The displayed surface of the
lens 1 is exposed to an introduction of 1 W/cm2 of heat by light absorption in the region 4, which approximates to about a right angle in the selected element division. The temperature increase in the middle point then reaches 7.6 milli-degrees. The isotherms 0.1-0.9 are shown drawn in and indicate the course of the lines with the corresponding fraction of this temperature increase. With a higher introduction of heat, the temperature increase is linearly scaled over a wide range. - It is quite evident that in this embodiment with a symmetrical cooling arrangement, the temperature distribution which is obtained is distributed with marked asymmetry over the whole lens.
- In the embodiment according to the invention, which is shown in FIG. 6, the cooling tabs situated on the Y-axis are omitted. The cooling
tabs 510 situated on the X-axis are doubled in width and in addition are made of silver, which conducts heat better. Thetabs 52 between remain unaltered, as likewise the heat supply in the region 4. - The temperature increase at the middle point now becomes 9.2 milli-degrees. The isotherms now show good rotational symmetry up to about 0.7 times the maximum temperature increase and to half the lens diameter.
- The mechanical mounting of the
lens 1 can either take place by means of the coolingtabs - FIG. 7 shows a variant, similar to FIGS. 3a-c, in which the
fingers bimetal strip 31 is bent away from thelens 1 at the low temperature t1, and can take up only little heat. To the right in the Figure, thebimetal strip 32 is straight at the higher temperature T2 and is situated at a small spacing from thelens 1, so that it can carry away much heat. - The invention can of course also be applied to prismatic parts, gratings, or mirrors, and likewise to all optical components subject to uneven heat loading, in addition to the lenses as shown in the foregoing embodiments.
- FIG. 8 shows an embodiment specially adapted to a
mirror 6. Themirror 6 is supported on a mounting 7 by means of supports 71-77, which are individual webs or support rings, distributed on its back side. - The cooling action is adjusted according to requirements, to match the illuminated
surface 10, by the distribution of the supports 71-77 on the back side of themirror 6, by their shape, and also by means of the specific thermal conductivity of their material (e.g., silver at the middle 74, lead 72, 76 at theedges outer edge - The different thermal expansion of the materials for the supports71-77 can be used if necessary in order to compensate for deformations of the
mirror 6 due to heating, or else to cause them in a targeted manner. In the latter case, disturbances of other optical elements which cooperate in a system with themirror 6 can be compensated. - FIG. 9 shows, in a schematic overview, the complete optical system of a projection exposure system for microlithography. A DUV excimer laser serves as the
light source 61. A beam-formingoptics 62 withzoom axicon objective 63 an optional diaphragm 64 (e.g. variable, conventional, ring aperture, dipole aperture, quadrupole aperture) and a homogenizingquartz rod 65 illuminates theREMA diaphragm 66, which is imaged by the followingREMA objective 67 as a sharp-edged homogeneous light spot, in particular as a narrow scanning slit, on themask 68. - The following reducing
projection objective 69 images themask 68 onto thewafer 70. Thelenses REMA objective projection objective 69 are situated in near field planes and therefore are now preferred optical elements on which the cooling according to the invention is used. This cooling reduces the imaging errors arising due to the narrow slit-shaped illuminated field in a scanner in which themask 68 andwafer 70 are synchronously scanned. - The
lens 691 is arranged nearest theaperture diaphragm 690 of theprojection objective 69. It is specially strained by special kinds of illumination, for example, a dipole aperture (see FIG. 2). However, this disturbance can also be reduced by the asymmetric cooling according to the invention. - It is clear that the description of the Figures only describes examples for the invention. In particular, multifarious combinations of the described features are possible according to the invention, and the cooling can be adjustably embodied, in order to adjust, to adapt to changes, and so on.
Claims (90)
1. An optical arrangement, comprising:
a light source that emits radiation,
a mount,
an optical element fastened in said mount,
wherein said optical element is acted on by said radiation such that a heat supply results from said radiation that lacks symmetry corresponding to the shape of said optical element, and
a connecting structure between said optical element and said mount, having a symmetry characteristic that does not correspond to the shape of the optical element.
2. An optical arrangement, comprising:
a light source that emits radiation,
a mount,
an optical element fastened in said mount,
wherein said optical element is acted on by said radiation such that heat that results from said radiation lacks symmetry corresponding to the shape of said optical element, and
a single- or multi-part thermally conducting element arranged in operative connection with said optical element and said mount and having a form of heat transport that effects an at least partial compensation of the asymmetry of temperature distribution in said optical element.
3. A projection exposure system for microlithography, comprising:
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
a cooling system for said optical element that lacks rotational symmetry, said cooling system including passive thermally conducting devices that effect cooling.
4. A projection exposure system for microlithography, comprising
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
at least one passively thermally conducting part arranged in thermal contact with said optical element, which part covers a portion of the cross section of said optical element which is not exposed to said radiation, and which part reduces temperature gradients in said optical element.
5. The optical arrangement according to claim 1 , in which said optical element comprises a transmitting element.
6. The optical arrangement according to claim 5 , in which said transmitting element comprises a lens.
7. The optical arrangement according to claim 2 , in which said optical element comprises a transmitting element.
8. The optical arrangement according to claim 7 , in which said transmitting element comprises a lens.
9. The projection exposure system according to claim 3 , in which said optical element comprises a transmitting element.
10. The projection exposure system according to claim 9 , in which said transmitting element comprises a lens.
11. The projection exposure system according to claim 4 , in which said optical element comprises a transmitting element.
12. The projection exposure system according to claim 11 , in which said transmitting element comprises a lens.
13. The optical arrangement according to claim 1 , in which said optical element comprises a mirror.
14. The optical arrangement according to claim 2 , in which said optical element comprises a mirror.
15. The projection exposure system according to claim 3 , in which said optical element comprises a mirror.
16. The projection exposure system according to claim 4 , in which said optical element comprises a mirror.
17. The optical arrangement according to claim 1 , having a slit-shaped image field.
18. The optical arrangement according to claim 2 , having a slit-shaped image field.
19. The projection exposure system according to claim 3 , having a slit-shaped image field.
20. The projection exposure system according to claim 4 , having a slit-shaped image field.
21. The optical arrangement according to claim 5 , in which said optical element is arranged near a field plane.
22. The optical arrangement according to claim 7 , in which said optical element is arranged near a field plane.
23. The projection exposure system according to claim 9 , in which said optical element is arranged near a field plane.
24. The projection exposure system according to claim 11 , in which said optical element is arranged near a field plane.
25. The optical arrangement according to claim 1 , further comprising a reticle, the illumination of which lacks rotational symmetry.
26. The optical arrangement according to claim 25 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
27. The optical arrangement according to claim 2 , further comprising a reticle, the illumination of which lacks rotational symmetry.
28. The optical arrangement according to claim 27 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
29. The projection exposure system according claim 3 , further comprising a reticle, the illumination of which lacks rotational symmetry.
30. The projection exposure system according to claim 29 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
31. The projection exposure system according to claim 29 , in which said optical element is arranged near a pupil plane.
32. The projection exposure system according to claim 4 , further comprising a reticle, the illumination of which lacks rotational symmetry.
33. The projection exposure system according to claim 32 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
34. The projection exposure system according to claim 32 , in which said optical element is arranged near a pupil plane.
35. The optical arrangement according to claim 1 , in which said connecting structure comprises portions of different materials.
36. An optical arrangement comprising:
a light source that emits radiation,
a mount,
an optical element fastened to said mount,
wherein said optical element is acted on by said radiation such that heat that results from said radiation lacks symmetry corresponding to the shape of said optical element, and
a single- or multi-part passive thermally conducting element arranged in operative connection with said optical element and said mount and having a form of heat transport that effects an at least partial compensation of the asymmetry of temperature distribution in said optical element,
wherein said passive thermally conducting element comprises an assembly of portions of different material.
37. A projection exposure system for microlithography, comprising:
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
a cooling system for said optical element that lacks rotational symmetry, said cooling system including passive thermally conducting devices that effect cooling,
wherein said passive thermally conducting devices comprise portions of different material.
38. The projection exposure system according to claim 4 , in which said at least one part of a thermal conductor in thermal contact with said optical element comprises a plurality of different materials.
39. The optical arrangement according to claim 1 , in which said connecting structure comprises adjustable portions.
40. The optical arrangement according to claim 2 , in which said thermally conducting element is adjustable.
41. The projection exposure system according to claim 3 , in which said thermally conducting elements comprise adjustable portions.
42. The projection exposure system according to claim 4 , in which said at least one part of a thermal conductor in thermal contact with said optical element is at least partially adjustable.
43. An optical arrangement, comprising:
a light source,
at least one optical element, and
a passive compensator of thermal effects caused by radiation from said light source, which compensator lacks rotational symmetry.
44. A projection exposure system for microlithography, comprising:
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
a cooling system that lacks rotational symmetry for said optical element, said cooling system comprising passive thermally conducting devices.
45. An optical arrangement, comprising:
a light source that emits radiation,
a mount,
an optical element fastened in said mount,
wherein said optical element is acted on by said radiation such that a heat supply results from said radiation that lacks symmetry corresponding to the shape of said optical element, and
a connecting structure between said mount and said optical element, having a symmetry characteristic that substantially does not correspond to the shape of the optical element.
46. An optical arrangement, comprising:
a light source that emits radiation,
a mount,
an optical element fastened in said mount,
wherein said optical element is acted on by said radiation such that heat that results from said radiation lacks symmetry corresponding to the shape of said optical element, and
a single- or multi-part thermally conducting element arranged in operative connection with said optical element and said mount and having a form of heat transport that effects an at least partial compensation of the asymmetry of temperature distribution in said optical element.
47. A projection exposure system for microlithography, comprising:
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
a cooling system for said optical element that lacks rotational symmetry, said cooling system including passive thermally conducting elements that effect cooling, in which said thermally conducting elements comprise adjustable portions.
48. A projection exposure system for microlithography, comprising
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
at least one passive thermally conducting part arranged in thermal contact with said optical element, which part covers a portion of the cross section of said optical element which is not exposed to said radiation, and which part reduces temperature gradients in said optical element, in which said at least one passive thermally conducting part of a thermal conductor in thermal contact with said optical element comprises a plurality of different materials and in which said at least one passive thermally conducting part of a thermal conductor in thermal contact with said optical element is at least partially adjustable.
49. The optical arrangement according to claim 80 , in which said optical element comprises a transmitting element.
50. The optical arrangement according to claim 49 , in which said transmitting element comprises a lens.
51. The optical arrangement according to claim 88 , in which said optical element comprises a transmitting element.
52. The optical arrangement according to claim 51 , in which said transmitting element comprises a lens.
53. The projection exposure system according to claim 48 , in which said optical element comprises a transmitting element.
54. The projection exposure system according to claim 53 , in which said transmitting element comprises a lens.
55. The projection exposure system according to claim 84 , in which said optical element comprises a transmitting element.
56. The projection exposure system according to claim 55 , in which said transmitting element comprises a lens.
57. The optical arrangement according to claim 80 , in which said optical element comprises a mirror.
58. The optical arrangement according to claim 88 , in which said optical element comprises a mirror.
59. The projection exposure system according to claim 48 , in which said optical element comprises a mirror.
60. The projection exposure system according to claim 84 , in which said optical element comprises a mirror.
61. The optical arrangement according to claim 80 , having a slit-shaped image field.
62. The optical arrangement according to claim 88 , having a slit-shaped image field.
63. The projection exposure system according to claim 48 , having a slit-shaped image field.
64. The projection exposure system according to claim 84 , having a slit-shaped image field.
65. The optical arrangement according to claim 80 , in which said optical element is arranged near a field plane.
66. The optical arrangement according to claim 65 , in which said optical element is arranged near a field plane.
67. The projection exposure system according to claim 48 , in which said optical element is arranged near a field plane.
68. The projection exposure system according to claim 84 , in which said optical element is arranged near a field plane.
69. The optical arrangement according to claim 80 , further comprising a reticle, the illumination of which lacks rotational symmetry.
70. The optical arrangement according to claim 69 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination.
71. The optical arrangement according to claim 88 , further comprising a reticle, the illumination of which lacks rotational symmetry.
72. The optical arrangement according to claim 71 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
73. The projection exposure system according claim 48 , further comprising a reticle, the illumination of which lacks rotational symmetry.
74. The projection exposure system according to claim 73 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
75. The projection exposure system according to claim 48 , in which said optical element is arranged near a pupil plane.
76. The projection exposure system according to claim 84 , further comprising a reticle, the illumination of which lacks rotational symmetry.
77. The projection exposure system according to claim 76 , in which said reticle illumination consists of off-axis, dipole or quadrupole illumination type.
78. The projection exposure system according to claim 84 , in which said optical element is arranged near a pupil plane.
79. The optical arrangement according to claim 88 , in which said connecting structure comprises portions of different materials.
80. An optical arrangement comprising:
a light source that emits radiation,
a mount,
an optical element fastened to said mount,
wherein said optical element is acted on by said radiation such that heat that results from said radiation lacks symmetry corresponding to the shape of said optical element, and
a single- or multi-part passive thermally conducting element arranged in operative connection with said optical element and said mount and having a form of heat transport that effects an at least partial compensation of the asymmetry of temperature distribution in said optical element,
wherein said passive thermally conducting element comprises an assembly of portions of different material.
81. The optical arrangement according to claim 80 , in which said connecting structure comprises adjustable portions.
82. The optical arrangement according to claim 84 , in which said thermally conducting element is adjustable.
83. The projection exposure system according to claim 84 , in which said thermally conducting elements comprise adjustable portions.
84. A projection exposure system comprising:
an optical element that is heated by radiation in a manner that lacks rotational symmetry, and
a cooling system for said optical element that lacks rotational symmetry, said cooling system including passive thermally conducting devices that effect cooling,
wherein said passive thermally conducting devices comprise portions of different material.
85. A reflective mirror for use in an optical system, the mirror comprising
a mirror body defining a mirror surface,
an illuminated region of the mirror surface, and
at least one thermally conducting element attached to the mirror outside the illuminated region, the thermally conducting element having flexibility and forming a heat conducting connection away from the mirror.
86. The reflective mirror according to claim 85 , wherein the thermally conducting element has a cable-like or longitudinally extended configuration.
87. The reflective mirror according to claim 85 , wherein the mirror body has a shape, and the at least one thermally conducting element has a symmetry characteristic that does not correspond to said shape.
88. An optical arrangement, comprising
a mount,
an optical element fastened in the mount,
an additional flexible thermal conductor at said optical element.
89. An optical arrangement according to claim 88 , wherein said optical element is selected from a group consisting of mirrors, lenses, prisms and transmitting elements.
90. An optical arrangement according to claim 80 , wherein said optical element is selected from a group consisting of mirrors, lenses, prisms and transmitting elements.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/826,823 US20040207825A1 (en) | 1998-02-20 | 2004-04-15 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
US12/119,693 US20080212052A1 (en) | 1998-02-20 | 2008-05-13 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19807094.2 | 1998-02-20 | ||
DE19807094A DE19807094A1 (en) | 1998-02-20 | 1998-02-20 | Optical arrangement and projection exposure system of microlithography with passive thermal compensation |
US09/934,817 US7274430B2 (en) | 1998-02-20 | 2001-08-21 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
US10/826,823 US20040207825A1 (en) | 1998-02-20 | 2004-04-15 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US09/934,817 Continuation US7274430B2 (en) | 1998-02-20 | 2001-08-21 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US12/119,693 Continuation US20080212052A1 (en) | 1998-02-20 | 2008-05-13 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US20040207825A1 true US20040207825A1 (en) | 2004-10-21 |
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US09/934,817 Expired - Fee Related US7274430B2 (en) | 1998-02-20 | 2001-08-21 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
US10/826,823 Abandoned US20040207825A1 (en) | 1998-02-20 | 2004-04-15 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
US12/119,693 Abandoned US20080212052A1 (en) | 1998-02-20 | 2008-05-13 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US09/934,817 Expired - Fee Related US7274430B2 (en) | 1998-02-20 | 2001-08-21 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US12/119,693 Abandoned US20080212052A1 (en) | 1998-02-20 | 2008-05-13 | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
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US20050110966A1 (en) * | 2003-08-29 | 2005-05-26 | Noriyasu Hasegawa | Exposure apparatus, and device manufacturing method using the same |
US20110025992A1 (en) * | 2009-07-31 | 2011-02-03 | Carl Zeiss Laser Optics Gmbh | Optical system having an optical arrangement |
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Also Published As
Publication number | Publication date |
---|---|
US7274430B2 (en) | 2007-09-25 |
US20080212052A1 (en) | 2008-09-04 |
US20020008858A1 (en) | 2002-01-24 |
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