US20040072927A1 - Two-part epoxy adhesives with improved flexibility and process for making and using same - Google Patents

Two-part epoxy adhesives with improved flexibility and process for making and using same Download PDF

Info

Publication number
US20040072927A1
US20040072927A1 US10/269,800 US26980002A US2004072927A1 US 20040072927 A1 US20040072927 A1 US 20040072927A1 US 26980002 A US26980002 A US 26980002A US 2004072927 A1 US2004072927 A1 US 2004072927A1
Authority
US
United States
Prior art keywords
accelerator
epoxy resin
resin
mixture
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/269,800
Inventor
Zakar Hachikian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Priority to US10/269,800 priority Critical patent/US20040072927A1/en
Assigned to ILLINOIS TOOL WORKS INC. reassignment ILLINOIS TOOL WORKS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HACHIKIAN, ZAKAR RAFFI
Priority to US10/659,805 priority patent/US7547373B2/en
Priority to CA 2444382 priority patent/CA2444382A1/en
Publication of US20040072927A1 publication Critical patent/US20040072927A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00Presence of epoxy resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Definitions

  • This invention relates to two-part epoxy adhesives which have improved flexibility and a process for making and using them. More particularly, this invention relates to an improved epoxy adhesive which has good adhesions to various substrates, especially where a high level of elongation is needed due to thermal expansion and contraction of the substrates or where the substrates are exposed to thermal shock. It can also be used at low operating temperatures.
  • the present invention which provides a two-part epoxy adhesive with improved flexibility and provides a process for adhering at least two substrate surfaces to each other with that adhesive.
  • the two-part epoxy adhesive has a resin component made up of a mixture of an epoxy resin such as a standard, undiluted, liquid Bishpenol-A resin, and an internally flexibilized epoxy resin which is also preferably a Bisphenol A type resin.
  • the resin component may also contain a plasticizer/accelerator, such as a phenol base plasticizer/accelerator, a coupling agent such as an epoxide functional silane base coupling agent, fillers, such as limestone filler and titanium dioxide white pigment, and a thixotropic agent.
  • the two-part epoxy adhesive has a hardener component made up of a mixture of a flexibilizer, such as an amine terminated butadiene acrylonitrile adduct, and an unmodified aliphatic amine, such as an unmodified glycol ether base aliphatic amine or a modified aliphatic amine such as an Aminoethyl-piperozine (AEP) base modified amine, or combinations thereof.
  • the hardener component may also contain an accelerator, which is preferably a tertiary amine accelerator, as well as a thixotropic agent.
  • the most preferred two-part epoxy adhesive has:
  • a resin component comprising a mixture of:
  • a hardener component comprising a mixture of:
  • the cured epoxy adhesive has a tensile elongation at room temperature of greater than 30%, and the most preferred embodiment thereof has a tensile elongation at room temperature of greater than 120%.
  • the reactive mixture of resin component and hardener component has an initial cure time of less than 3 hours, and the most preferred embodiment thereof has an internal cure time of about 1.5-2 hours. The complete cure takes place in approximately 24 hours.
  • the epoxy adhesive of the present invention has good adhesion to various substrates including concrete, metals, plastics, and wood and is especially useful in applications where a high level of elongation (for example, when bonding to flexible PVC) is needed due to thermal expansion and contraction of the substrates (for example when bonding metal to plastic) or where the substrates are exposed to thermal shock. It is also useful in applications having low operating temperatures. While the preferred application temperature range is 40-100° F., it may be used at temperatures of up to about 180-200° F.
  • an adhesive formed from the reactive mixture of the resin component and the hardener component disclosed above, by applying these components in equal amounts (parts by volume) from a double-barreled cartridge, mixing well until the mixture is relatively homogeneous and applied relatively evenly to the substrates, and then allowing the adhesive to cure.
  • the present invention provides an improved two-part epoxy adhesive having a resin component and a hardener component which can be dispensed from a double-barreled cartridge in equal parts by volume concurrently and then mixed until relatively homogeneous.
  • dispensing and mixing may be prior to application of the relatively homogeneous mixture to one or more of the substrates, or it may take place on one or more of the substrates.
  • a double-barreled cartridge need not be used; the resin component and hardener component can be dispensed from separate containers and, then mixed. In any event, the reactive mixture of components is applied relatively evenly between substrates which are joined, and the adhesive is allowed to cure.
  • the initial cure takes place in less than 3 hours, and, with the two-part epoxy adhesive of the preferred embodiment, it has been found that generally the initial curing time is about 1.5 to 2.0 hours. Complete cure then takes place in about 24 hours.
  • the epoxy adhesive of the present invention has a tensile elongation at room temperature of greater than 30%, and with the two-part epoxy adhesive of the preferred embodiment it can exceed 120%. Elongation is important when bonding flexible materials like flexible polyvinyl chloride (PVC) or acrylonitrile-butadiene-styrene (ABS) and in those applications where there is a large amount of displacement between substrates or where the degree of thermal expansion and contraction is of concern.
  • PVC flexible polyvinyl chloride
  • ABS acrylonitrile-butadiene-styrene
  • the improved flexibility of the two-part epoxy resin of the present invention is achieved by using a resin component and a hardener component having a unique combination of ingredients.
  • the resin component is a mixture of epoxy resin, which may be a standard, undiluted, liquid Bisphenol A resin such as EPON 828 from Shell Oil Company, Houston, Tex., and an internally flexibilized Bisphenol A type epoxy resin such as Araldite PY 322 available from Ciba Specialty Chemicals, Tarrytown, N.Y.
  • the internally flexibilized epoxy resins have flexible segments in their backbone. Therefore when they react and become a part of the adhesive network, they provide flexibility into the rigid polymer via their soft/flexible segments. While Bisphenol A type resins are preferred, Bispehnol-F type resins or mixtures of the two can be used as either the core epoxy resin, or the internally flexibilized epoxy resin, or both.
  • the resin component may also contain a plasticizer/accelerator which may be a phenol base plasticizer/accelerator such as Nonylphenol from GE Specialty Chemicals, Morgantown, W. Va. Other plasticizers/accelerators may be used but Nonylphenol is preferred since it has minimal effect on physical properties and is a mild accelerator.
  • a plasticizer/accelerator which may be a phenol base plasticizer/accelerator such as Nonylphenol from GE Specialty Chemicals, Morgantown, W. Va.
  • Other plasticizers/accelerators may be used but Nonylphenol is preferred since it has minimal effect on physical properties and is a mild accelerator.
  • a small amount of coupling agent is also preferably added to the resin component.
  • Preferred is an epoxide functional silane base coupling agent such as Silane Z-6040 from Dow Corning Corporation, Midland, Mich. That type of coupling agent, has dual reactivity, meaning that silanes, as is known, possess both organic and inorganic functionality that allow them to react with organic polymers and inorganic surfaces. An amino silane or other types of coupling agents could be used to get the same effect.
  • fillers can be added to the resin component.
  • limestone filler such as Marble White 325 from Filler Products Inc. and Titanium Dioxide R-900 white pigment from DuPont de Nemours, Wilmington, Del.
  • Other white fillers and white pigments may be used for a white or off white colored resin component. If another color is desired, then fillers and pigments of the desired color would be used.
  • the resin component can contain a thixotropic agent such as Cab-o-Sil 720 from Cabot Corporation, Boston, Mass.
  • a thixotropic agent such as Cab-o-Sil 720 from Cabot Corporation, Boston, Mass.
  • thixotropic agents that could be used along with the fillers to obtain a resin component having the desired viscosity, i.e. one which permits dispensing as discussed above.
  • the core epoxy resin EPON 828
  • the reactive flexibilizer Araldite PY 322
  • the plasticizer/accelerator Nonylphenol
  • the coupling agent Silane Z-6040
  • the fillers Marble White 325 and Titanium Dioxide R-900
  • the thixotropic agent Cab-o-Sil 720
  • the preferred weight percentage range of the ingredients in the resin component and the most preferred range are as follows: RESIN COMPONENT Preferred Most Preferred Epoxy Resin 30-75 40-45 Internally Flexibilized Resin 5-40 8-15 Plasticizer/Accelerator 5-40 10-20 Coupling Agent 0.1-1 0.3-0.6 Limestone Filler 10-40 15-25 White Pigment 1-5 0.5-2 Thixotropic Agent 1-8 4-6
  • the hardener component contains a mixture of a flexibilizer, which may be an amine terminated butadiene acrylonitrile adduct, such as Hycor ATBN 1300 ⁇ 16 from B.F. Goodrich, Akron, Ohio, and an unmodified aliphatic amine, such as an unmodified glycol ether base aliphatic amine (i.e. Ancamine 1922A from Air Products, Pittsburgh, Pa.), or a modified base aliphatic amine such as an Aminoethyl-piperozine (AEP) base modified (Ancamine 1767, also from Air Products), or preferably a combination of the two.
  • a flexibilizer which may be an amine terminated butadiene acrylonitrile adduct, such as Hycor ATBN 1300 ⁇ 16 from B.F. Goodrich, Akron, Ohio
  • an unmodified aliphatic amine such as an unmodified glycol ether base aliphatic amine (i.e. Ancamine 1922
  • the flexibilizer does not have to be an amine terminated butadient acrylonitrile (ATBN) but it should be similar in mixture.
  • ATBN amine terminated butadient acrylonitrile
  • CBN carboxyl terminated butadiene acrylonitride
  • unmodified aliphatic amines other than glycol ether based ones can be used as long as they contribute to the toughness
  • modified aliphatic amines other than AEP based ones can be used as long as they contribute to the toughness and speed up the cure, as do the AEP based ones.
  • the hardener component may also contain an accelerator, which may be a tertiary amine accelerator, such as Ancamine K-54 also from Air Products and a thixotropic agent, which can be the same as the one used in the resin component such as Cab-o-Sil 720 from Cabot. As was the case with the resin component, any thixotropic agent in an amount sufficient to give the desired viscosity may be used.
  • an accelerator which may be a tertiary amine accelerator, such as Ancamine K-54 also from Air Products and a thixotropic agent, which can be the same as the one used in the resin component such as Cab-o-Sil 720 from Cabot.
  • a thixotropic agent which can be the same as the one used in the resin component such as Cab-o-Sil 720 from Cabot.
  • any thixotropic agent in an amount sufficient to give the desired viscosity may be used.
  • the preferred weight percentage range of the ingredients in the hardener component and the most preferred range are as follows: Hardener: Component Preferred % Most Preferred % Flexibilizer 20-80 40-45 Unmodified Aliphatic Amine 5-30 7-15 Modified Aliphatic Amine 10-50 25-40 Accelerator 1-10 5-8 Thixotropic Agent 1-8 5-8
  • two-part epoxy adhesives of the present invention are preferably used at 40-100° F. they may be at temperatures up to about 180-200° F., and are particularly useful at low temperatures down below about 0° F. They may be used for indoor or outdoor repair situations or in manufacturing OEM products where strong, flexible, but relatively permanent bonds are desired. They have good adhesion to various substrates including concrete, metals, such as steel, aluminum, brass, etc, plastics, such as ABS, PVC, flexible PVC, fiberglass, acrylics, polyurethanes, etc., and wood.
  • the resin component and hardener component were prepared by mixing the following ingredients as described above to prepare the two-part epoxy adhesive of the present invention: Parts by Tradename Ingredient Weight RESIN Epon 828 Bisphenol A Epoxy Resin 49.5 Araldite PY322 Internally Flexibilized 10.0 Bisphenol A Epoxy Resin Nonylphenol Plasticizer/Accelerator 16.5 Silene Z-6040 Coupling Agent 0.5 Marble White 325 Limestone Filler 17.0 Titanium Dioxide R-900 White Pigment 1.0 Cab-o-Sil 720 Thixotrophic Agent 5.5 HARDENER Hycar ATBN 1300x-16 Flexibilizer 41.7 Ancamine 1922A Unmodified Aliphatic Amine 10.6 Ancamine 1767 Modified Aliphatic Amine 35.0 Ancamine K-54 Accelerator 6.7 Cab-o-Sil 720 Thixotrophic Agent 6.0

Abstract

A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer and an unmodified or modified aliphatic amine or combinations thereof. The resin component and hardener component are mixed and applied to substrates, or applied to substrates and mixed, an then allowed to cure yielding a cured epoxy resin having a tensile elongation at room temperature of greater than 30%. The initial curing time is less than 3 hours.

Description

    BACKGROUND OF THE INVENTION
  • This invention relates to two-part epoxy adhesives which have improved flexibility and a process for making and using them. More particularly, this invention relates to an improved epoxy adhesive which has good adhesions to various substrates, especially where a high level of elongation is needed due to thermal expansion and contraction of the substrates or where the substrates are exposed to thermal shock. It can also be used at low operating temperatures. [0001]
  • Polymeric compositions based on the commercially available Bisphenol A based epoxy resins cured by one or more of the active hydrogen compounds such as polyamines, polyacids, polyphenols, and the like exhibit good adhesion properties towards various substrates including metal and plastics, but most of these adhesives are rigid, stiff and brittle polymers. There is also a problem of shrinkage occurring in the epoxide adhesive during the curing, thus building undesired stress in the substrates as well as the adhesive at the glue line. Accordingly, it has been suggested that flexibilizers such as butadiene rubbers, urethane elastomers, and the like be added to the epoxy resins. [0002]
  • Past attempts to modify epoxies involved reacting them with copolymers of butadiene, acrylonitrile or other “rubber”-based compositions. See Journal of Applied Polymer Science, Vol. 26, pp. 907-919 (1981). By reacting an epoxy with those compounds and then processing the modified composition to induce in situ phase separation, “rubber rich” domains within the epoxy composition are created. Those domains improve the toughness of the cured epoxy matrix once it is formed. However, while such modified epoxy compositions are tougher and less brittle at room temperature, improvements at lower temperatures prove to be, at best, marginal. Further, using the above-mentioned rubber-based material incurs processing problems due to an increase in viscosity of the adhesive mixture. [0003]
  • Accordingly, various epoxy adhesive formulations have been proposed to address these problems. See, for example U.S. Pat. No. 4,728,384; 5,098,505; 5,218,063; 5,367,006 and 5,679,730. More recently, there has been introduced Mr. Sticky's Underwater Glue. According to the website at underwaterglue.com, this is an improved two-part epoxy glue having a flexibility (elongation) of 30%, very good shock dampening, and flexible bonds. It has a mixture working life of 30-60 minutes and an initial curing time of 3-4 hours. The complete curing time is 24 hours. [0004]
  • Still, there is a need for an even more improved two-part epoxy adhesive. [0005]
  • SUMMARY OF THE INVENTION
  • That need is met by the present invention which provides a two-part epoxy adhesive with improved flexibility and provides a process for adhering at least two substrate surfaces to each other with that adhesive. [0006]
  • The two-part epoxy adhesive has a resin component made up of a mixture of an epoxy resin such as a standard, undiluted, liquid Bishpenol-A resin, and an internally flexibilized epoxy resin which is also preferably a Bisphenol A type resin. The resin component may also contain a plasticizer/accelerator, such as a phenol base plasticizer/accelerator, a coupling agent such as an epoxide functional silane base coupling agent, fillers, such as limestone filler and titanium dioxide white pigment, and a thixotropic agent. [0007]
  • The percentages by weight in the preferred embodiment of the resin component are: [0008]
  • 30-75% epoxy resin, [0009]
  • 5-40% plasticizer/accelerator, [0010]
  • 0.1-1% coupling agent, [0011]
  • 11-45% filler, and [0012]
  • 1-8% thixotropic agent. [0013]
  • The two-part epoxy adhesive has a hardener component made up of a mixture of a flexibilizer, such as an amine terminated butadiene acrylonitrile adduct, and an unmodified aliphatic amine, such as an unmodified glycol ether base aliphatic amine or a modified aliphatic amine such as an Aminoethyl-piperozine (AEP) base modified amine, or combinations thereof. The hardener component may also contain an accelerator, which is preferably a tertiary amine accelerator, as well as a thixotropic agent. [0014]
  • The percentages by weight in the preferred embodiment of the hardener component are: [0015]
  • 20-80% flexibilizer, [0016]
  • 5-30% unmodified aliphatic amine, [0017]
  • 1-10% accelerator, [0018]
  • 10-50% modified aliphatic amine, and [0019]
  • 1-8% thixotropic agent. [0020]
  • The most preferred two-part epoxy adhesive has: [0021]
  • a) a resin component comprising a mixture of: [0022]
  • 40-45% Bisphenol A epoxy resin, [0023]
  • 8-15% internally flexibilized Bisphenol A type epoxy resin, [0024]
  • 10-20% phenol base plasticizer/accelerator, [0025]
  • 0.3-0.6% epoxide functional silane base coupling agent, [0026]
  • 15-25% limestone filler, [0027]
  • 0.5-2% white pigrnent and [0028]
  • 4-6% thixotropic agent, and [0029]
  • b) a hardener component comprising a mixture of: [0030]
  • 40-45% amine terminated butadiene acrylonitrile adduct, [0031]
  • 7-15% unmodified glycol ether base aliphatic amine, [0032]
  • 5-8% tertiary amine accelerator, [0033]
  • 25-40% AEP base modified amine, and [0034]
  • 1-8% thixotropic agent. [0035]
  • After the resin component and hardener component are mixed and reacted the cured epoxy adhesive has a tensile elongation at room temperature of greater than 30%, and the most preferred embodiment thereof has a tensile elongation at room temperature of greater than 120%. [0036]
  • In addition, the reactive mixture of resin component and hardener component has an initial cure time of less than 3 hours, and the most preferred embodiment thereof has an internal cure time of about 1.5-2 hours. The complete cure takes place in approximately 24 hours. [0037]
  • The epoxy adhesive of the present invention has good adhesion to various substrates including concrete, metals, plastics, and wood and is especially useful in applications where a high level of elongation (for example, when bonding to flexible PVC) is needed due to thermal expansion and contraction of the substrates (for example when bonding metal to plastic) or where the substrates are exposed to thermal shock. It is also useful in applications having low operating temperatures. While the preferred application temperature range is 40-100° F., it may be used at temperatures of up to about 180-200° F. and down to below zero to adhere at least two substrate surfaces to each other by intercalating between those surfaces an adhesive, formed from the reactive mixture of the resin component and the hardener component disclosed above, by applying these components in equal amounts (parts by volume) from a double-barreled cartridge, mixing well until the mixture is relatively homogeneous and applied relatively evenly to the substrates, and then allowing the adhesive to cure. [0038]
  • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention provides an improved two-part epoxy adhesive having a resin component and a hardener component which can be dispensed from a double-barreled cartridge in equal parts by volume concurrently and then mixed until relatively homogeneous. As is known, dispensing and mixing may be prior to application of the relatively homogeneous mixture to one or more of the substrates, or it may take place on one or more of the substrates. Likewise, a double-barreled cartridge need not be used; the resin component and hardener component can be dispensed from separate containers and, then mixed. In any event, the reactive mixture of components is applied relatively evenly between substrates which are joined, and the adhesive is allowed to cure. [0039]
  • The initial cure takes place in less than 3 hours, and, with the two-part epoxy adhesive of the preferred embodiment, it has been found that generally the initial curing time is about 1.5 to 2.0 hours. Complete cure then takes place in about 24 hours. [0040]
  • After cure, the epoxy adhesive of the present invention has a tensile elongation at room temperature of greater than 30%, and with the two-part epoxy adhesive of the preferred embodiment it can exceed 120%. Elongation is important when bonding flexible materials like flexible polyvinyl chloride (PVC) or acrylonitrile-butadiene-styrene (ABS) and in those applications where there is a large amount of displacement between substrates or where the degree of thermal expansion and contraction is of concern. [0041]
  • The improved flexibility of the two-part epoxy resin of the present invention is achieved by using a resin component and a hardener component having a unique combination of ingredients. The resin component is a mixture of epoxy resin, which may be a standard, undiluted, liquid Bisphenol A resin such as EPON 828 from Shell Oil Company, Houston, Tex., and an internally flexibilized Bisphenol A type epoxy resin such as Araldite PY 322 available from Ciba Specialty Chemicals, Tarrytown, N.Y. The internally flexibilized epoxy resins have flexible segments in their backbone. Therefore when they react and become a part of the adhesive network, they provide flexibility into the rigid polymer via their soft/flexible segments. While Bisphenol A type resins are preferred, Bispehnol-F type resins or mixtures of the two can be used as either the core epoxy resin, or the internally flexibilized epoxy resin, or both. [0042]
  • The resin component may also contain a plasticizer/accelerator which may be a phenol base plasticizer/accelerator such as Nonylphenol from GE Specialty Chemicals, Morgantown, W. Va. Other plasticizers/accelerators may be used but Nonylphenol is preferred since it has minimal effect on physical properties and is a mild accelerator. [0043]
  • A small amount of coupling agent is also preferably added to the resin component. Preferred is an epoxide functional silane base coupling agent such as Silane Z-6040 from Dow Corning Corporation, Midland, Mich. That type of coupling agent, has dual reactivity, meaning that silanes, as is known, possess both organic and inorganic functionality that allow them to react with organic polymers and inorganic surfaces. An amino silane or other types of coupling agents could be used to get the same effect. [0044]
  • Any number of types of fillers can be added to the resin component. Preferred are limestone filler such as Marble White 325 from Filler Products Inc. and Titanium Dioxide R-900 white pigment from DuPont de Nemours, Wilmington, Del. Other white fillers and white pigments may be used for a white or off white colored resin component. If another color is desired, then fillers and pigments of the desired color would be used. [0045]
  • Finally, the resin component can contain a thixotropic agent such as Cab-o-Sil 720 from Cabot Corporation, Boston, Mass. There are numerous other thixotropic agents that could be used along with the fillers to obtain a resin component having the desired viscosity, i.e. one which permits dispensing as discussed above. [0046]
  • In preparation of the resin component, the core epoxy resin (EPON 828), the reactive flexibilizer (Araldite PY 322), the plasticizer/accelerator (Nonylphenol), and the coupling agent (Silane Z-6040) are mixed until the mixture is relatively homogenous, and then the fillers (Marble White 325 and Titanium Dioxide R-900) are added and mixed. As the last step, the thixotropic agent (Cab-o-Sil 720) is added and mixed until it is dispersed therein. [0047]
  • The preferred weight percentage range of the ingredients in the resin component and the most preferred range are as follows: [0048]
    RESIN COMPONENT Preferred Most Preferred
    Epoxy Resin 30-75 40-45
    Internally Flexibilized Resin  5-40  8-15
    Plasticizer/Accelerator  5-40 10-20
    Coupling Agent 0.1-1   0.3-0.6
    Limestone Filler 10-40 15-25
    White Pigment 1-5 0.5-2  
    Thixotropic Agent 1-8 4-6
  • The hardener component contains a mixture of a flexibilizer, which may be an amine terminated butadiene acrylonitrile adduct, such as Hycor ATBN 1300×16 from B.F. Goodrich, Akron, Ohio, and an unmodified aliphatic amine, such as an unmodified glycol ether base aliphatic amine (i.e. Ancamine 1922A from Air Products, Pittsburgh, Pa.), or a modified base aliphatic amine such as an Aminoethyl-piperozine (AEP) base modified (Ancamine 1767, also from Air Products), or preferably a combination of the two. The flexibilizer does not have to be an amine terminated butadient acrylonitrile (ATBN) but it should be similar in mixture. For example, a carboxyl terminated butadiene acrylonitride (CTBN) can be used. Likewise, unmodified aliphatic amines other than glycol ether based ones can be used as long as they contribute to the toughness, resiliency and shock resistance of the cured adhesive and modified aliphatic amines other than AEP based ones can be used as long as they contribute to the toughness and speed up the cure, as do the AEP based ones. [0049]
  • The hardener component may also contain an accelerator, which may be a tertiary amine accelerator, such as Ancamine K-54 also from Air Products and a thixotropic agent, which can be the same as the one used in the resin component such as Cab-o-Sil 720 from Cabot. As was the case with the resin component, any thixotropic agent in an amount sufficient to give the desired viscosity may be used. [0050]
  • In preparation of the hardener component, all of the liquids, i.e., everything except the thixotropic agent, are blended and then the thixotropic agent is added and mixed until well dispersed therein. [0051]
  • The preferred weight percentage range of the ingredients in the hardener component and the most preferred range are as follows: [0052]
    Hardener: Component Preferred % Most Preferred %
    Flexibilizer 20-80 40-45
    Unmodified Aliphatic Amine  5-30  7-15
    Modified Aliphatic Amine 10-50 25-40
    Accelerator  1-10 5-8
    Thixotropic Agent 1-8 5-8
  • While two-part epoxy adhesives of the present invention are preferably used at 40-100° F. they may be at temperatures up to about 180-200° F., and are particularly useful at low temperatures down below about 0° F. They may be used for indoor or outdoor repair situations or in manufacturing OEM products where strong, flexible, but relatively permanent bonds are desired. They have good adhesion to various substrates including concrete, metals, such as steel, aluminum, brass, etc, plastics, such as ABS, PVC, flexible PVC, fiberglass, acrylics, polyurethanes, etc., and wood.[0053]
  • EXAMPLE
  • The resin component and hardener component were prepared by mixing the following ingredients as described above to prepare the two-part epoxy adhesive of the present invention: [0054]
    Parts by
    Tradename Ingredient Weight
    RESIN
    Epon 828 Bisphenol A Epoxy Resin 49.5
    Araldite PY322 Internally Flexibilized 10.0
    Bisphenol A Epoxy Resin
    Nonylphenol Plasticizer/Accelerator 16.5
    Silene Z-6040 Coupling Agent 0.5
    Marble White 325 Limestone Filler 17.0
    Titanium Dioxide R-900 White Pigment 1.0
    Cab-o-Sil 720 Thixotrophic Agent 5.5
    HARDENER
    Hycar ATBN 1300x-16 Flexibilizer 41.7
    Ancamine 1922A Unmodified Aliphatic Amine 10.6
    Ancamine 1767 Modified Aliphatic Amine 35.0
    Ancamine K-54 Accelerator 6.7
    Cab-o-Sil 720 Thixotrophic Agent 6.0
  • The properties of the two-part epoxy adhesive were then compared to Mr. Sticky's Underwater Glue with the following results: [0055]
    Mr Sticky's
    Underwater Underwater Present
    Mr Sticky's Glue (data Glue (tested Invention
    Properties reported) data) (tested data)
    Color Off-White Off-White Off-White
    Viscosity @ 20° C.
    Resin 35,000
    Hardener 200,000 36,000
    Mixed Viscosity 35,000
    Density (gr./cc)
    Resin 1.25 1.25
    Hardener 0.94 0.97
    Mixing Ratio
    by weight 4:3 1.2:1
    by volume 1 to 1 1 to 1
    Working Life 30-60 minutes 25-30 minutes
    Gell Time (25 gram) 3-4 hours 1.5-2 hours
    Full Cure 24 hours 24 hours
    Application Temperature 40°-100° F. 40°-100° F.
    TYPICAL PROPERTIES
    OF CURED PRODUCT
    Tensile elongation 30% 125%
    Tensile Modulus 76,000 psi
    Tensile Strength 2,000 psi 1,540 psi
    Flexural Modulus 82,000 psi
    LAP SHEAR TESTING
    CRS/CRS @ .010″ 1,800 psi 1,600 psi 1,600 psi
    RIGID PVC/PVC 1,300 psi 500 psi 1,100 psi
    ABRAIDED RIGID PVC/PVC 1,800 psi 850 psi 1,140 psi
    ABS/AB 400 psi 400 psi 800 psi
    ABRAIDED ABS/ABS 600 psi 710 psi 875 psi
    180° T-PEEL TESTING
    RIGID PVC/FLEXIBLE PVC 12.6 pli 10.4 pli 10.5 pli
    ABRAIDED RIGID PVC/
    FLEXIBLE PVC 25.4 pli 6 pli 10.1 pli
    ABS/FLEXIBLE/PVC 13.0 pli 3 pli 10 pli
    ABRAIDED ABS/FLEXIBLE/ N/A 11.1 pli 13.4 pli
    PVC

Claims (21)

What is claimed is:
1. A two-part epoxy adhesive comprising:
a) a resin component comprising a mixture of epoxy resin and an internally flexibilized epoxy resin, and
b) a hardener component comprising a mixture of a flexibilizer and an unmodified or modified aliphatic amine or combinations thereof,
wherein after said resin component and said hardener component are mixed and reacted the cured epoxy adhesive has a tensile elongation at room temperature of greater than 30%.
2. The two-part epoxy adhesive of claim 1 wherein the epoxy adhesive has an initial curing time of less than 3 hours.
3. The two-part epoxy adhesive of claim 1 wherein said resin-component further includes a plasticizer/accelerator, a coupling agent, fillers, and a thixotropic agent.
4. The two-part epoxy adhesive of claim 1 wherein said hardener component further includes an accelerator and a thixotropic agent.
5. The two-part epoxy adhesive of claim 1 wherein said resin component comprises by weight:
30-75% epoxy resin,
5-40% internally flexibilized epoxy resin,
5-40% plasticizer/accelerator,
0.1-1% coupling agent,
11-45% filler, and
1-8% thixotrophic agent.
6. The two-part epoxy adhesive of claim 5 wherein said epoxy resin is a Bisphenol A epoxy resin, said internally flexibilized epoxy resin is an internally flexibilized Bisphenol A type epoxy resin, said plasticizer/accelerator is a phenol based plasticizer/accelerator, said coupling agent is an epoxide functional silane base coupling agent and said filler is a mixture of limestone filler and white pigment.
7. The two-part epoxy adhesive of claim 6 wherein said hardener component comprises by weight:
20-80% flexibilizer
5-30% unmodified aliphatic amine,
1-10% accelerator
10-50% modified aliphatic amine, and
1-8% thixotropic agent.
8. The two-part epoxy adhesive of claim 7 wherein said flexibilizer is an amine terminated butadiene acrylonitrile adduct, said unmodified aliphatic amine is an unmodified glycol ether base aliphatic amine, said accelerator is a tertiary amine accelerator, and said modified aliphatic amine is an AEP base modified amine.
9. A two-part epoxy adhesive comprising:
a) a resin component comprising a mixture of epoxy resin and an internally flexibilized epoxy resin, and
b) a hardener component comprising a mixture of flexibilizer and an unmodified or modified aliphatic amine or combinations thereof,
wherein the reactive mixture of said resin component and said hardener component has an initial curing time of about 1.5-2 hours and after curing the epoxy adhesive has a tensile elongation at room temperature of greater than 120%.
10. The two-part epoxy adhesive of claim 9 comprising:
a) a resin component comprising a mixture of:
40-45% Bisphenol A epoxy resin,
8-15% internally flexibilized Bisphenol A type epoxy resin,
10-20% phenol base plasticizer/accelerator,
0.3-0.6% epoxide functional silane base coupling agent,
15-25% limestone filler,
0.5-2% white pigment and
4-6% thixotrophic agent, and
b) a hardener component comprising a mixture of:
40-45% amine terminated butadiene acrylonitrile adduct,
7-15% unmodified glycol ether base aliphatic amine
5-8% tertiary amine accelerator,
25-40% AEP base modified amine, and
1-8% thixotrophic agent.
11. The process of adhering at least two substrate surfaces to each other comprising the acts of:
intercalating between said surfaces an adhesive comprising a reactive mixture of:
a. a resin component comprising a mixture of epoxy resin and internally flexible epoxy resin, and
b. a hardener component comprising a mixture of a flexibilizer and an unmodified or modified aliphatic amine or combinations thereof,
and allowing said adhesive to cure, whereby said cured adhesive has a tensile elongation at room temperature of greater than 30%.
12. The process of claim 11 wherein in said act of curing it takes less than 3 hours for initial curing.
13. The process of claim 12 wherein said act of intercalating includes dispensing the resin component and hardener component in equal parts by volume and mixing until the mixture is relatively homogeneous and is applied relatively evenly to the substrates.
14. The process of claim 11 wherein said resin-component further includes a plasticizer/accelerator, a coupling agent, fillers, and a thixotropic agent.
15. The process of claim 11 wherein said hardener component further includes an accelerator and a thixotropic agent.
16. The process of claim 11 wherein said resin component comprises by weight:
30-75% epoxy resin,
5-40% internally flexibilized epoxy resin,
5-40% plasticizer/accelerator,
0.1-1% coupling agent,
11-45% filler, and
1-8% thixotrophic agent.
17. The process of claim 16 wherein said epoxy resin is a Bisphenol A epoxy resin, said internally flexibilized epoxy resin is an internally flexibilized Bisphenol A type epoxy resin, said plasticizer/accelerator is a phenol based plasticizer/accelerator, said coupling agent is an epoxide functional silane base coupling agent and said filler is a mixture of limestone filler and white pigment.
18. The process of claim 17 wherein said hardener component comprises by weight:
20-80% flexibilizer
5-30% unmodified aliphatic amine,
1-10% accelerator
10-50% modified aliphatic amine, and
1-8% thixotropic agent.
19. The process of claim 18 wherein said flexibilizer is an amine terminated butadiene acrylonitrile adduct, said unmodified aliphatic amine is an unmodified glycol ether base aliphatic amine, said accelerator is a tertiary amine accelerator, and said modified aliphatic amine is an AEP base modified amine.
20. The process of claim 11 wherein:
a) said resin component comprises a mixture of:
40-45% Bisphenol A epoxy resin,
8-15% internally flexibilized Bisphenol A type epoxy resin,
10-20% phenol base plasticizer/accelerator,
0.3-0.6% epoxide functional silane base coupling agent,
15-25% limestone filler,
0.5-2% white pigment and
4-6% thixotrophic agent, and
b) said hardener component comprises a mixture of:
40-45% amine terminated butadiene acrylonitrile adduct,
7-15% unmodified glycol ether base aliphatic amine,
5-8% tertiary amine accelerator,
25-40% AEP base modified amine, and
1-8% thixotrophic agent.
21. A process for making a two-part epoxy adhesive comprising:
preparing a resin component by mixing an epoxy resin, an internally flexibilized epoxy resin, a plasticizer/accelerator, a coupling agent, fillers, and a thixotropic agent, and
preparing a hardener component comprising a mixture of a flexibilizer, an unmodified or modified aliphatic amine or combinations thereof, an accelerator a thixotropic agent.
US10/269,800 2002-10-14 2002-10-14 Two-part epoxy adhesives with improved flexibility and process for making and using same Abandoned US20040072927A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/269,800 US20040072927A1 (en) 2002-10-14 2002-10-14 Two-part epoxy adhesives with improved flexibility and process for making and using same
US10/659,805 US7547373B2 (en) 2002-10-14 2003-09-11 Two-part epoxy adhesives with improved flexibility and process for making and using same
CA 2444382 CA2444382A1 (en) 2002-10-14 2003-10-07 Two-part epoxy adhesives with improved flexibility and process for making and using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/269,800 US20040072927A1 (en) 2002-10-14 2002-10-14 Two-part epoxy adhesives with improved flexibility and process for making and using same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/659,805 Continuation-In-Part US7547373B2 (en) 2002-10-14 2003-09-11 Two-part epoxy adhesives with improved flexibility and process for making and using same

Publications (1)

Publication Number Publication Date
US20040072927A1 true US20040072927A1 (en) 2004-04-15

Family

ID=32068879

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/269,800 Abandoned US20040072927A1 (en) 2002-10-14 2002-10-14 Two-part epoxy adhesives with improved flexibility and process for making and using same
US10/659,805 Expired - Fee Related US7547373B2 (en) 2002-10-14 2003-09-11 Two-part epoxy adhesives with improved flexibility and process for making and using same

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/659,805 Expired - Fee Related US7547373B2 (en) 2002-10-14 2003-09-11 Two-part epoxy adhesives with improved flexibility and process for making and using same

Country Status (2)

Country Link
US (2) US20040072927A1 (en)
CA (1) CA2444382A1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040197563A1 (en) * 2003-03-24 2004-10-07 Jihong Kye Two-component epoxy adhesive formulation for high elongation with low modulus
US20120024477A1 (en) * 2009-02-06 2012-02-02 Kropp Michael A Room temperature curing epoxy adhesive
CN102417805A (en) * 2011-08-17 2012-04-18 长沙蓝星化工新材料有限公司 Room-temperature cured epoxy resin flexible sealant and preparation method thereof
CN102838961A (en) * 2012-08-29 2012-12-26 北京斯瑞曼科技有限公司 Two-component epoxy end-blocking glue for membrane components and application thereof
US20130137796A1 (en) * 2010-08-10 2013-05-30 3M Innovative Properties Company Epoxy Adhesive
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
CN104050385A (en) * 2014-06-27 2014-09-17 南京工程学院 Method for building model for forecasting thermal expansion coefficient of cement mortar
CN105925228A (en) * 2016-06-06 2016-09-07 北京中德新亚建筑技术有限公司 Multi-purpose modified epoxy resin adhesive
WO2017081216A1 (en) 2015-11-10 2017-05-18 Saint-Gobain Performance Plastics France Adhesive bonding process
CN107236508A (en) * 2016-12-29 2017-10-10 北京奥宇可鑫表面工程技术有限公司 The method of bimetallic joint sealant and repairing metal device
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN110734729A (en) * 2018-07-18 2020-01-31 李武 multi-base-surface epoxy resin-based composite bonding structure layer material special for solar power generation road surface
FR3092583A1 (en) 2019-02-13 2020-08-14 Saint-Gobain Performance Plastics France Self-adhesive joint assembly and method of manufacturing such an assembly
CN112175557A (en) * 2020-09-24 2021-01-05 江苏锋芒复合材料科技集团有限公司 Adhesive for ultra-wide grinding belt
US10947428B2 (en) 2010-11-19 2021-03-16 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN113372535A (en) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 Preparation method and use method of modified epoxy resin curing agent

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100594508B1 (en) * 2006-03-25 2006-06-30 (주)콘스코 Reinforcing methods using as silane modified epoxy composition for underwater structure
ES2662646T3 (en) * 2008-06-12 2018-04-09 Henkel IP & Holding GmbH Highly reinforced, new generation two-part structural epoxy adhesive compositions
CN101818037B (en) * 2009-02-27 2014-12-31 汉高(中国)投资有限公司 Room-temperature curing epoxy structural adhesive composition and preparation method thereof
US9085710B2 (en) * 2011-08-30 2015-07-21 Illinois Tool Works Inc. Toughened epoxy system for abrasion resistant coatings
CN102408861A (en) * 2011-10-21 2012-04-11 北京清大奇士新材料技术有限公司 Double-component epoxy structural adhesive and preparation method thereof
FR3004719B1 (en) * 2013-04-22 2015-04-10 Arkema France THERMODY MATERIALS WITH IMPROVED BREAKAGE
EP3024908B1 (en) * 2013-07-24 2020-12-16 Blue Cube IP LLC Curable compositions
CN104388027A (en) * 2014-12-01 2015-03-04 石狮国高电子科技有限公司 Solvent-free double-component boat epoxy and preparation method thereof
CN104403617A (en) * 2014-12-01 2015-03-11 石狮国高电子科技有限公司 Double-component flexible epoxy structural adhesive and preparation method thereof
CN104592922B (en) * 2014-12-31 2016-04-20 湖北绿色家园精细化工股份有限公司 A kind of transparent, high rigidity, color inhibition epoxy ornaments glue and preparation technology thereof
US20200140727A1 (en) * 2017-08-15 2020-05-07 Ddp Specialty Electronics Materials Us, Inc. Two-component room temperature curable toughened epoxy adhesives
CN108504314A (en) * 2018-03-12 2018-09-07 合肥尚涵装饰工程有限公司 A kind of high-performance interior decoration plate sealing bonded adhesives and preparation method thereof
CN110205937A (en) * 2019-05-23 2019-09-06 长沙理工大学 Orthotropic plate-ultra-high performance concrete combined bridge deck structure and construction method
CN112480787B (en) * 2020-12-16 2022-06-14 中国科学院兰州化学物理研究所 Polymer mineral gap filler for engine containment ring and preparation method thereof
CN114687214A (en) * 2020-12-28 2022-07-01 北京同益中新材料科技股份有限公司 High-strength light-weight stab-resistant material and preparation method thereof
CN114044882A (en) * 2021-10-28 2022-02-15 瑞奇化工(湖北)有限公司 Flexible curing agent and preparation method and application thereof
CN115418187A (en) * 2022-08-30 2022-12-02 海程新材料(芜湖)有限公司 High-thermal-conductivity epoxy structural adhesive for bi-component power battery and preparation method thereof

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019388A (en) * 1976-03-11 1977-04-26 Bailey Meter Company Glass to metal seal
US4278384A (en) * 1979-01-10 1981-07-14 Wam Dei Fratelli Marchesini S.N.C. Apparatus for severing packages containing granular or powder-like matter and severing the matter therefrom
US4728384A (en) * 1986-06-23 1988-03-01 Ashland Oil, Inc. Two component epoxy structural adhesives with improved flexibility
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
US4916187A (en) * 1987-02-24 1990-04-10 Ashland Oil, Inc. Epoxy resin with polyamine-polyphenol solid salt in liquid poly(alkylene oxide) polyamine-polyphenol
US4943604A (en) * 1987-11-30 1990-07-24 Sunstar Giken Kabushiki Kaisha Structural adhesive having excellent anti-corrosion properties
US5019608A (en) * 1987-07-30 1991-05-28 Lord Corporation Rubber-modified epoxy adhesive compositions
US5098505A (en) * 1986-06-23 1992-03-24 Ashland Oil, Inc. Epoxy resin, thermoplastic polymer and hardener adhesive
US5218063A (en) * 1991-06-26 1993-06-08 W. R. Grace & Co.-Conn. Epoxy adhesives and methods of using cured compositions therefrom
US5367006A (en) * 1992-03-16 1994-11-22 Hughes Aircraft Company Superior thermal transfer adhesive
US5575956A (en) * 1995-07-19 1996-11-19 Hughes Aircraft Company Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives
US5679730A (en) * 1995-06-06 1997-10-21 Nisshinbo Industries, Inc. Epoxy resin composition and epoxy resin-based adhesive
US5929141A (en) * 1996-06-18 1999-07-27 Raytheon Company Adhesive of epoxy resin, amine-terminated ban and conductive filler
US6060539A (en) * 1995-07-19 2000-05-09 Raytheon Company Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives
US6069023A (en) * 1996-06-28 2000-05-30 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE793700A (en) * 1972-01-07 1973-07-05 Schering Ag HARDENERS FOR EPOXIDIC RESINS
US3892684A (en) * 1972-10-20 1975-07-01 Procter & Gamble Clear flexibilized epoxy resins
US4107142A (en) * 1973-11-14 1978-08-15 National Research Development Corporation Epoxide materials
US4762864A (en) * 1986-06-19 1988-08-09 Ashland Oil Inc. High performance induction curable two-component structural adhesive with nonsagging behavior
US5075034A (en) * 1989-09-08 1991-12-24 The Dexter Corporation Induction curable two-component structural adhesive with improved process ability
DE4342722A1 (en) * 1993-12-15 1995-06-22 Hoechst Ag Elastic epoxy resin hardener system
EP0754742B1 (en) * 1995-07-19 2001-10-24 Raytheon Company Room-temperature stable, one-component, flexible epoxy adhesives
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
US6645341B1 (en) * 2002-08-06 2003-11-11 National Starch And Chemical Investment Holding Corporation Two part epoxide adhesive with improved strength
US7157143B2 (en) * 2003-03-24 2007-01-02 Dow Global Technologies Inc. Two-component epoxy adhesive formulation for high elongation with low modulus

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019388A (en) * 1976-03-11 1977-04-26 Bailey Meter Company Glass to metal seal
US4278384A (en) * 1979-01-10 1981-07-14 Wam Dei Fratelli Marchesini S.N.C. Apparatus for severing packages containing granular or powder-like matter and severing the matter therefrom
US4728384A (en) * 1986-06-23 1988-03-01 Ashland Oil, Inc. Two component epoxy structural adhesives with improved flexibility
US5098505A (en) * 1986-06-23 1992-03-24 Ashland Oil, Inc. Epoxy resin, thermoplastic polymer and hardener adhesive
US4916187A (en) * 1987-02-24 1990-04-10 Ashland Oil, Inc. Epoxy resin with polyamine-polyphenol solid salt in liquid poly(alkylene oxide) polyamine-polyphenol
US5019608A (en) * 1987-07-30 1991-05-28 Lord Corporation Rubber-modified epoxy adhesive compositions
US4943604A (en) * 1987-11-30 1990-07-24 Sunstar Giken Kabushiki Kaisha Structural adhesive having excellent anti-corrosion properties
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
US5218063A (en) * 1991-06-26 1993-06-08 W. R. Grace & Co.-Conn. Epoxy adhesives and methods of using cured compositions therefrom
US5367006A (en) * 1992-03-16 1994-11-22 Hughes Aircraft Company Superior thermal transfer adhesive
US5679730A (en) * 1995-06-06 1997-10-21 Nisshinbo Industries, Inc. Epoxy resin composition and epoxy resin-based adhesive
US5575956A (en) * 1995-07-19 1996-11-19 Hughes Aircraft Company Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives
US6060539A (en) * 1995-07-19 2000-05-09 Raytheon Company Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives
US5929141A (en) * 1996-06-18 1999-07-27 Raytheon Company Adhesive of epoxy resin, amine-terminated ban and conductive filler
US6069023A (en) * 1996-06-28 2000-05-30 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7157143B2 (en) * 2003-03-24 2007-01-02 Dow Global Technologies Inc. Two-component epoxy adhesive formulation for high elongation with low modulus
US20040197563A1 (en) * 2003-03-24 2004-10-07 Jihong Kye Two-component epoxy adhesive formulation for high elongation with low modulus
US20120024477A1 (en) * 2009-02-06 2012-02-02 Kropp Michael A Room temperature curing epoxy adhesive
US20130137796A1 (en) * 2010-08-10 2013-05-30 3M Innovative Properties Company Epoxy Adhesive
US8729197B2 (en) * 2010-08-10 2014-05-20 3M Innovative Properties Company Epoxy structural adhesive
US9562175B2 (en) 2010-11-19 2017-02-07 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US10947428B2 (en) 2010-11-19 2021-03-16 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US11629276B2 (en) 2010-11-19 2023-04-18 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN102417805A (en) * 2011-08-17 2012-04-18 长沙蓝星化工新材料有限公司 Room-temperature cured epoxy resin flexible sealant and preparation method thereof
CN102838961A (en) * 2012-08-29 2012-12-26 北京斯瑞曼科技有限公司 Two-component epoxy end-blocking glue for membrane components and application thereof
CN104050385A (en) * 2014-06-27 2014-09-17 南京工程学院 Method for building model for forecasting thermal expansion coefficient of cement mortar
WO2017081216A1 (en) 2015-11-10 2017-05-18 Saint-Gobain Performance Plastics France Adhesive bonding process
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US11674062B2 (en) 2015-12-10 2023-06-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US11518844B2 (en) 2015-12-10 2022-12-06 Ppg Industries Ohio, Inc. Method for producing an aminimide
CN105925228A (en) * 2016-06-06 2016-09-07 北京中德新亚建筑技术有限公司 Multi-purpose modified epoxy resin adhesive
CN107236508A (en) * 2016-12-29 2017-10-10 北京奥宇可鑫表面工程技术有限公司 The method of bimetallic joint sealant and repairing metal device
CN110734729A (en) * 2018-07-18 2020-01-31 李武 multi-base-surface epoxy resin-based composite bonding structure layer material special for solar power generation road surface
WO2020165347A1 (en) 2019-02-13 2020-08-20 Saint-Gobain Performance Plastics France Self-adhesive seal assembly and method of making such an assembly
FR3092583A1 (en) 2019-02-13 2020-08-14 Saint-Gobain Performance Plastics France Self-adhesive joint assembly and method of manufacturing such an assembly
CN112175557A (en) * 2020-09-24 2021-01-05 江苏锋芒复合材料科技集团有限公司 Adhesive for ultra-wide grinding belt
CN113372535A (en) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 Preparation method and use method of modified epoxy resin curing agent

Also Published As

Publication number Publication date
US20040069405A1 (en) 2004-04-15
CA2444382A1 (en) 2004-04-14
US7547373B2 (en) 2009-06-16

Similar Documents

Publication Publication Date Title
US7547373B2 (en) Two-part epoxy adhesives with improved flexibility and process for making and using same
CN101679828B (en) Heat-resistant structural epoxy resins
US6528595B1 (en) Adhesive of thiirane and oxirane-containing compound and oxirane-containing compound
US4623702A (en) Two-component adhesive or sealing composition
US4728384A (en) Two component epoxy structural adhesives with improved flexibility
US20110020652A1 (en) Two-Component Epoxy Adhesive Composition
JP2007505200A (en) Epoxy adhesive and bonding substrate
WO2007149377A2 (en) Epoxy adhesive composition and use thereof
BR112013010668A2 (en) one-part structural adhesive and method of applying structural adhesive
CN110050052A (en) It is resistant to the epoxy adhesive of open pearl humidity exposure
SK8632001A3 (en) Shock-resistant epoxide resin compositions
KR20110045046A (en) 1-part epoxy resin structural adhesives containing elastomer tougheners capped with phenol and hydroxy-terminated acrylate or hydroxy-terminated methacrylate
CN105925228A (en) Multi-purpose modified epoxy resin adhesive
KR20180052645A (en) Blocked polyurethane toughening agents for epoxy adhesives
US20170022402A1 (en) Epoxy resin compositions for pre-gel ovens
CN103052681A (en) Hardener for epoxy resins
US4916187A (en) Epoxy resin with polyamine-polyphenol solid salt in liquid poly(alkylene oxide) polyamine-polyphenol
US20220228033A1 (en) Shape memory material and use thereof for bonding of substrates
WO2021190970A1 (en) One-component thermosetting epoxy composition with improved adhesion
JP4475698B2 (en) Primer composition and method for joining concrete and mortar using the same
US4775728A (en) Sag resistant, high performance, two component epoxy structural adhesives
JPH11279519A (en) Adhesive composition
US5153296A (en) Epoxide resin mixtures which harden at room temperature
CZ2004491A3 (en) Low read-through epoxy-bonded SMC
JP2000273151A (en) Epoxy resin curing agent composition

Legal Events

Date Code Title Description
AS Assignment

Owner name: ILLINOIS TOOL WORKS INC., ILLINOIS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HACHIKIAN, ZAKAR RAFFI;REEL/FRAME:013561/0573

Effective date: 20021025

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION