US20040050231A1 - Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use - Google Patents
Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use Download PDFInfo
- Publication number
- US20040050231A1 US20040050231A1 US10/243,708 US24370802A US2004050231A1 US 20040050231 A1 US20040050231 A1 US 20040050231A1 US 24370802 A US24370802 A US 24370802A US 2004050231 A1 US2004050231 A1 US 2004050231A1
- Authority
- US
- United States
- Prior art keywords
- sccu
- mpu
- heat exchanger
- coolant
- expansion tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/869—Means to drive or to guide tool
- Y10T83/8763—Convertible from tool path to another or from implement to machine
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/869—Means to drive or to guide tool
- Y10T83/8821—With simple rectilinear reciprocating motion only
- Y10T83/8822—Edge-to-edge of sheet or web [e.g., traveling cutter]
Definitions
- the present invention relates in general to the cooling of computer electronic components by liquid systems. More particularly, the invention relates to a scalable design for liquid cooling of electronics systems, utilizing removable modular pumping units and an integrated plate heat exchanger/expansion tank.
- Heat fluxes dissipated by electronic equipment are reaching levels that preclude air cooling as a means to control component temperature.
- Liquid cooling e.g. water cooling
- the liquid absorbs the heat dissipated by the components/modules in a very efficient matter (i.e. with minimal temperature rise from the liquid to the component being cooled).
- the heat ultimately has to be transferred from the liquid and out of the data center (i.e. room containing the electronic equipment) environment, otherwise, the liquid would continuously rise in temperature. From the 1970s through the early 1990s, IBM accomplished this task back by circulating the cooling liquid (i.e.
- system water via a coolant distribution unit (FIG. 1).
- the system water would flow through a liquid/liquid heat exchanger that was cooled by relatively low temperature water, known as site service or customer water, which was provided by the customer facility.
- site service or customer water which was provided by the customer facility.
- This unit stood separate from the electronics frames and would supply system water (maintained at about 22 C) to one or more electronics frames.
- SCCU Scalable Coolant Conditioning Unit
- the SCCU makes cooling water a customer supplied utility providing conditioned water (in terms of temperature and cleanliness) for cooling each frame as needed, much like a municipal water utility distributes water to each home as needed.
- FIG. 1 is a cooling distribution unit of the prior art
- FIG. 2 is a schematic of the Scalable Coolant Conditioning Unit (SCCU) of the present invention
- FIG. 3 shows an SCCU having a minimal number of pumps
- FIG. 4 shows an SCCU having an intermediate number of pumps
- FIG. 5 shows an SCCU having a maximum number of pumps
- FIG. 6 is a modular pumping unit (single in-line pump);
- FIG. 7 is a modular pumping unit (multiple in-line pumps);
- FIGS. 8A, 8B, and 8 C respectively, show top, side, and front views of a modular pump unit in position to be connected within an SCCU;
- FIG. 9 is a conceptual drawing of an integrated plate heat exchanger and expansion tank (customer water side not shown);
- FIG. 10 is an exploded view (isometric) of an integral plate heat exchanger/expansion tank
- FIG. 11 is a plate heat exchanger with supports for mounting a heat exchanger inside the tank.
- FIG. 12 is an isometric of an assembled integral plate heat exchanger/expansion tank.
- a cooling unit similar to that depicted in FIG. 1 was used to cool IBM's large bipolar systems back in the 1980s and early 1990s.
- the cooling unit 11 was relatively large and occupied more than what would now be considered as two full electronics frames.
- Within the cooling unit was a power/control element 12 , a reservoir/expansion tank 13 , a heat exchanger 14 , a pump 15 (often accompanied by a redundant second pump), customer water (or site or facility service water or coolant) in 16 and out 17 supply pipes, a supply manifold 18 directing water to the electronics frames 20 , and a return manifold 19 directing water from the electronics frames 20 .
- FIG. 2 illustrates elements of the scalable SCCU 21 of the present invention.
- a bulk power regulator and controls 22 Within the unit is a bulk power regulator and controls 22 .
- the coolant returning from the electronics frame 20 (“system coolant”) is collected by a return manifold 19 and directed through the expansion tank section of the integral heat exchanger/expansion tank 23 (described more fully below) and to another manifold 24 which supplies the coolant to multiple modular pumping units (MPUs) 27 .
- MPUs modular pumping units
- the higher pressure discharge of the MPUs is collected in another manifold 25 and directed to the “hot side” of the heat exchanger within the integral heat exchanger/expansion tank.
- the MPU's are connected to the manifolds via an insertion facilitation mechanism comprising automatic coupling assemblies 53 which are connected via flexible hoses to an isolation valve mechanism comprising a plurality of solenoid operated isolation valves 26 .
- the isolation valves could be manually operated either locally or remotely, and the automatic coupling assemblies could be replaced by manually operated quick disconnects.
- Isolation valves 26 are connected to manifolds 24 and 25 for isolating MPU's from the manifolds during installation or removal. (Note: FIG. 2 is a schematic and is not meant to show the actual location of the quick disconnects on the MPU's. This will be shown in detail later, e.g., in FIGS.
- the system liquid is sent to the supply manifold 18 which distributes the conditioned coolant to multiple electronics frames requiring cooling.
- the SCCU may also incorporate means to filter the system water and automatically add a corrosion inhibitor such as benzotriazole (BTA) as needed.
- BTA benzotriazole
- a two-way control valve 28 is used to regulate the flow rate of the customer water supplied to the heat exchanger within the integral heat exchanger/expansion tank, thereby controlling the temperature of system water delivered to the electronics frames 20 .
- a thermistor temperature sensing element 29 located at the inlet of the system water supply manifold 18 supplies an electronic signal to circuitry 30 controlling the operation of two-way valve 28 . If the supply water temperature is higher than desired, two-way valve 28 is commanded to open more allowing an increased flow of customer water through the heat exchanger resulting in a decrease in the temperature of the system water directed to the electronic frames from supply manifold 18 . Alternatively, if the supply water temperature is lower than desired, two-way valve 28 is commanded to close more providing a decreased flow of customer water through the heat exchanger resulting in an increase in the temperature of the system water directed to the electronic frames from supply manifold 18 .
- FIG. 3 shows a minimal number of MPU's 27 coupled to manifolds 24 and 25 , to accommodate a low system flow requirement (note the minimal number of connections to manifolds 18 and 19 because of low number of electronic frames 20 and the low heat load associated with these frames).
- FIG. 4 shows a greater number of MPU's 27 coupled to manifolds 24 and 25 , to accommodate a moderate coolant flow requirement (note the greater number of connections to manifolds 18 and 19 because of an increased number of frames 20 and the greater heat load associated with these frames 20 ).
- FIG. 3 shows a minimal number of MPU's 27 coupled to manifolds 24 and 25 , to accommodate a low system flow requirement (note the minimal number of connections to manifolds 18 and 19 because of low number of electronic frames 20 and the low heat load associated with these frames).
- FIG. 4 shows a greater number of MPU's 27 coupled to manifolds 24 and 25 , to accommodate a moderate coolant flow requirement (note the greater number of connections to manifolds 18
- FIGS. 6 and 7 An important element to the scalable SCCU is the modular pumping unit 27 .
- One or multiple pumps are housed in a package as illustrated in FIGS. 6 and 7, respectively.
- the pump motor 42 is disposed below the centrifugal pump 43 .
- An example of the pump motor 42 and centrifugal pump 43 would be the Bell & Gossett (8200 N. Austin Ave, Morton Grove, Ill., 60053) Series 90 in-line mounted centrifugal pump.
- the suction 40 and discharge 41 of the pump are brought out to the outer boundary of the pumping unit 27 , where they terminate in a male quick-disconnect fitting 50 .
- An electrical connection 44 to the pump motor is in turn brought out to an external connection 46 on the outer boundary of the pumping unit.
- FIG. 7 illustrates a modular pumping unit 27 having multiple in-line pumps (each comprising a pump motor 42 and centrifugal pump 43 ). Each pump motor has its own electrical connection 44 , and all electrical connections are connected to external connection 46 .
- FIGS. 8 A, 8 B,and 8 C show a modular pumping unit 27 in position to engage automatic coupling assembly 53 within an SCCU (top, side, and front views, respectively).
- the pump here is a volute centrifugal pump and is configured so that suction and discharge are on the same side of the MPU. It can be readily appreciated that multiple such pumps can be configured within the MPU as was described above in the case of the in-line configuration.
- the MPU is fitted with carrying handles 45 to facilitate transportation.
- the MPU is positioned within the SCCU atop an MPU mounting track 54 , which is in turn connected to the SCCU body by a connection mechanism (shown as shock-absorbers 55 in FIGS. 8B and 8C).
- the MPU and mounting plate are outfitted with cooperating seating mechanism (shown in FIG. 8C as a set of rollers 56 affixed to the MPU, seated within mounting track 54 affixed to the mounting plate). Rollers 56 allow the MPU to be rolled into position to engage or disengage automatic coupling assembly 53 comprised of mounting bracket 48 affixed to SCCU, female quick-disconnect fittings 51 , actuation plate 47 , and actuation solenoid 49 .
- Female quick-disconnect fittings 51 are held in a stationary position by mounting bracket 48 .
- Flexible hoses (not shown) attached to hose barbs 52 connect to solenoid-operated isolation valves ( 26 in FIG.
- Applicable solenoid-operated isolation valves (SOIV's) 26 are in their normal (non-actuated) position which is open.
- Applicable actuation solenoid (AS) 49 is in its normal position (when the actuation solenoid 49 is in its normal position, the locking-release collars on the female portion of the quick disconnects are in their normal locked position.)
- Stimulus is applied to ready MPU location for MPU install. This stimulus could be the entering of a computer command (when microcode controlled) or manual operation of an electrical switch. Two things happen when this stimulus is provided (in order):
- Applicable AS 49 is electrically energized (unlocking locking-release collar of female quick disconnect).
- Applicable AS 49 being electrically de-energized (locking-release collar on female portion of quick disconnect returns (under spring load) to its normal locked position)
- FIG. 9 The overall concept of a physically integrated plate heat exchanger/expansion tank can be seen in FIG. 9. Closed liquid loops typically require an expansion space or tank to account for the volumetric expansion of the liquid under varying environmental temperatures and/or the volumetric expansion of flexible (i.e., rubber) hoses when exposed to operating pressures. It should be noted that the size and cooling capacity of the integrated plate heat exchanger/expansion tank is set to accommodate the maximum heat load of the SCCU system (i.e., the load with all possible MPU's attached to the appropriate manifolds).
- the plate heat exchanger 1001 exists completely within the tank 1002 .
- the piping to 1003 /from 1004 the heat exchanger penetrates the tank wall.
- the structure can be assembled in a number of ways An example is shown in FIG. 10.
- a cover 1005 is attached to the tank after the heat exchanger is placed within the tank, and the piping 1003 / 1004 is attached to the heat exchanger after the heat exchanger is placed inside the tank. Since the plate heat exchanger and tank are made of stainless steel, the pipe can be welded to the tank wall to prevent leakage.
- a heat exchanger sub-assembly is made up of a plate heat exchanger 1001 with supports mounted to it.
- the detailed supports can be seen in FIG. 11.
- the axial (bottom) support 1201 would be designed to act as a spring so as to provide vertical compliance in the assembly.
- the lateral support 1202 would be designed to prevent lateral motion of the heat exchanger.
- a rubber gasket around the periphery of the lateral support (not shown) would provide lateral compliance during assembly.
- a top mounting plate 1203 would be bolted to supports provided on the tank to anchor the heat exchanger within the tank.
- FIG. 11 shows the completed assemblage of the expansion tank with the heat exchanger within.
Abstract
Description
- The present invention relates in general to the cooling of computer electronic components by liquid systems. More particularly, the invention relates to a scalable design for liquid cooling of electronics systems, utilizing removable modular pumping units and an integrated plate heat exchanger/expansion tank.
- Heat fluxes dissipated by electronic equipment, such as microprocessors and power supplies, are reaching levels that preclude air cooling as a means to control component temperature. Liquid cooling (e.g. water cooling) is a very attractive technology to manage the higher heat fluxes. The liquid absorbs the heat dissipated by the components/modules in a very efficient matter (i.e. with minimal temperature rise from the liquid to the component being cooled). The heat ultimately has to be transferred from the liquid and out of the data center (i.e. room containing the electronic equipment) environment, otherwise, the liquid would continuously rise in temperature. From the 1970s through the early 1990s, IBM accomplished this task back by circulating the cooling liquid (i.e. system water) via a coolant distribution unit (FIG. 1). The system water would flow through a liquid/liquid heat exchanger that was cooled by relatively low temperature water, known as site service or customer water, which was provided by the customer facility. This unit stood separate from the electronics frames and would supply system water (maintained at about 22 C) to one or more electronics frames.
- Back when the cooling distribution unit (CDU) was used, a single computer system could fill the entire data center. There was only a need for one CDU design point in terms of heat removal and system water flow rates. However, with current and future systems occupying a single frame, a cooling unit may be called upon to support anywhere from 1 to n number of systems. More importantly, computer customers customarily choose to scale up their computing requirements as their needs grow by adding more electronics within a frame or adding additional electronics frames. It is highly desirable, therefore, to be able to scale up the function of a cooling distribution unit.
- Power levels in computer equipment (primarily processors) have risen to the level where they can no longer be air cooled. These components will likely be water cooled. Heat dissipated by the processor will be transferred to the water via a water cooled cold plate. Water typically available at customer locations (i.e. data centers) is not suitable for use in these cold plates. First, condensation formation is a concern as the temperature of the data center water, ranging from 7 C to 15 C, is far below the room's dew point (typically 18-23 C). Second, the relatively poor quality of the water (its chemistry, cleanliness, etc.) impacts system reliability. It is therefore desirable to utilize a water cooling/conditioning unit that circulates high quality water to/from the electronics to be cooled and rejects the heat to the data center water.
- It is also desirable to provide the water cooling function in a considerably smaller volume, preferably within a single 19″ or 24″ rack. It would help to utilize a plate heat exchanger in lieu of the bulky shell and tube heat exchangers used in past systems, but something more is needed in terms of volume reduction. Furthermore, it is desirable to avoid the extra expense and volume associated with insulating the heat exchanger to prevent condensation formation. While some attempt at space consolidation has been made in the past (e.g., as disclosed in patent application entitled “Cooling System for Portable Electronic and Computer Devices” by Richard C. Chu et al., Ser. No. 09/893,135, Attorney Docket No. POU920010049) filed Aug. 17, 2001, and assigned to the assignee of the present invention, wherein an expansion space was provided within a heat exchanger in a personal computer environment), these did not deal with the rack-mounted frame environment nor take the novel approach presented herein.
- Disclosed herein is the concept of a Scalable Coolant Conditioning Unit (SCCU) which provides the means to scale the function of a CDU. This is accomplished by utilizing modular pumping units that can be added to the SCCU. Additionally, the SCCU takes advantage of an intergral heat exchanger/expansion tank that is sized to handle the maximum design point. The modular pumping units are arranged in a parallel flow configuration; additional pumps provide additional flow at a consistent pressure drop. The alternative to this concept would be to design, build, and inventory multiple CDUs and swap in successively larger units as the customer's requirements grow. It is far more cost effective to apply the concept disclosed here utilizing one common unit with the capability of accommodating multiple pumping units to scale-up flow and cooling capability as the customer's requirements grow. The SCCU makes cooling water a customer supplied utility providing conditioned water (in terms of temperature and cleanliness) for cooling each frame as needed, much like a municipal water utility distributes water to each home as needed.
- Also disclosed herein is the concept of physically integrating a plate heat exchanger within the expansion tank in order to reduce volume and prevent condensation formation on the heat exchanger without having to add bulky insulation.
- The recitation herein of desirable objects which are met by various embodiments of the present invention is not meant to imply or suggest that any or all of these objects are present as essential features, either individually or collectively, in the most general embodiment of the present invention or in any of its more specific embodiments.
- The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of practice, together with further objects and advantages thereof, may best be understood by reference to the following description taken in connection with the accompanying drawings in which:
- FIG. 1 is a cooling distribution unit of the prior art;
- FIG. 2 is a schematic of the Scalable Coolant Conditioning Unit (SCCU) of the present invention;
- FIG. 3 shows an SCCU having a minimal number of pumps;
- FIG. 4 shows an SCCU having an intermediate number of pumps;
- FIG. 5 shows an SCCU having a maximum number of pumps;
- FIG. 6 is a modular pumping unit (single in-line pump);
- FIG. 7 is a modular pumping unit (multiple in-line pumps);
- FIGS. 8A, 8B, and8C, respectively, show top, side, and front views of a modular pump unit in position to be connected within an SCCU;
- FIG. 9 is a conceptual drawing of an integrated plate heat exchanger and expansion tank (customer water side not shown);
- FIG. 10 is an exploded view (isometric) of an integral plate heat exchanger/expansion tank;
- FIG. 11 is a plate heat exchanger with supports for mounting a heat exchanger inside the tank; and
- FIG. 12 is an isometric of an assembled integral plate heat exchanger/expansion tank.
- A cooling unit similar to that depicted in FIG. 1 was used to cool IBM's large bipolar systems back in the 1980s and early 1990s. The cooling unit11 was relatively large and occupied more than what would now be considered as two full electronics frames. Within the cooling unit was a power/
control element 12, a reservoir/expansion tank 13, aheat exchanger 14, a pump 15 (often accompanied by a redundant second pump), customer water (or site or facility service water or coolant) in 16 and out 17 supply pipes, asupply manifold 18 directing water to theelectronics frames 20, and areturn manifold 19 directing water from theelectronics frames 20. - In accordance with preferred embodiments of the present invention, FIG. 2 illustrates elements of the
scalable SCCU 21 of the present invention. Within the unit is a bulk power regulator and controls 22. The coolant returning from the electronics frame 20 (“system coolant”) is collected by areturn manifold 19 and directed through the expansion tank section of the integral heat exchanger/expansion tank 23 (described more fully below) and to anothermanifold 24 which supplies the coolant to multiple modular pumping units (MPUs) 27. The higher pressure discharge of the MPUs is collected in anothermanifold 25 and directed to the “hot side” of the heat exchanger within the integral heat exchanger/expansion tank. The MPU's are connected to the manifolds via an insertion facilitation mechanism comprisingautomatic coupling assemblies 53 which are connected via flexible hoses to an isolation valve mechanism comprising a plurality of solenoid operatedisolation valves 26. Alternatively, the isolation valves could be manually operated either locally or remotely, and the automatic coupling assemblies could be replaced by manually operated quick disconnects.Isolation valves 26 are connected to manifolds 24 and 25 for isolating MPU's from the manifolds during installation or removal. (Note: FIG. 2 is a schematic and is not meant to show the actual location of the quick disconnects on the MPU's. This will be shown in detail later, e.g., in FIGS. 7 and 8.) Having been cooled by the site (or “facility”) service water flowing through the “cold side” of the heat exchanger (16, 17), the system liquid is sent to thesupply manifold 18 which distributes the conditioned coolant to multiple electronics frames requiring cooling. Although not shown here, the SCCU may also incorporate means to filter the system water and automatically add a corrosion inhibitor such as benzotriazole (BTA) as needed. A two-way control valve 28 is used to regulate the flow rate of the customer water supplied to the heat exchanger within the integral heat exchanger/expansion tank, thereby controlling the temperature of system water delivered to the electronics frames 20. A thermistortemperature sensing element 29 located at the inlet of the systemwater supply manifold 18 supplies an electronic signal tocircuitry 30 controlling the operation of two-way valve 28. If the supply water temperature is higher than desired, two-way valve 28 is commanded to open more allowing an increased flow of customer water through the heat exchanger resulting in a decrease in the temperature of the system water directed to the electronic frames fromsupply manifold 18. Alternatively, if the supply water temperature is lower than desired, two-way valve 28 is commanded to close more providing a decreased flow of customer water through the heat exchanger resulting in an increase in the temperature of the system water directed to the electronic frames fromsupply manifold 18. - FIGS. 3, 4, and5 illustrate different ranges of operation for the SCCU. FIG. 3 shows a minimal number of MPU's 27 coupled to
manifolds electronic frames 20 and the low heat load associated with these frames). FIG. 4 shows a greater number of MPU's 27 coupled tomanifolds frames 20 and the greater heat load associated with these frames 20). FIG. 5 shows the maximum number (for this configuration) of MPU's 27 coupled tomanifolds - An important element to the scalable SCCU is the
modular pumping unit 27. One or multiple pumps are housed in a package as illustrated in FIGS. 6 and 7, respectively. As shown in FIG. 6 (illustrating a single in-line centrifugal pump within an MPU), thepump motor 42 is disposed below thecentrifugal pump 43. An example of thepump motor 42 andcentrifugal pump 43 would be the Bell & Gossett (8200 N. Austin Ave, Morton Grove, Ill., 60053) Series 90 in-line mounted centrifugal pump. Thesuction 40 anddischarge 41 of the pump are brought out to the outer boundary of thepumping unit 27, where they terminate in a male quick-disconnect fitting 50. Anelectrical connection 44 to the pump motor is in turn brought out to anexternal connection 46 on the outer boundary of the pumping unit. - FIG. 7 illustrates a
modular pumping unit 27 having multiple in-line pumps (each comprising apump motor 42 and centrifugal pump 43). Each pump motor has its ownelectrical connection 44, and all electrical connections are connected toexternal connection 46. - FIGS.8A, 8B,and 8C show a
modular pumping unit 27 in position to engageautomatic coupling assembly 53 within an SCCU (top, side, and front views, respectively). The pump here is a volute centrifugal pump and is configured so that suction and discharge are on the same side of the MPU. It can be readily appreciated that multiple such pumps can be configured within the MPU as was described above in the case of the in-line configuration. The MPU is fitted with carryinghandles 45 to facilitate transportation. The MPU is positioned within the SCCU atop anMPU mounting track 54, which is in turn connected to the SCCU body by a connection mechanism (shown as shock-absorbers 55 in FIGS. 8B and 8C). To facilitate seating the MPU atop the mounting plate, the MPU and mounting plate are outfitted with cooperating seating mechanism (shown in FIG. 8C as a set ofrollers 56 affixed to the MPU, seated within mountingtrack 54 affixed to the mounting plate).Rollers 56 allow the MPU to be rolled into position to engage or disengageautomatic coupling assembly 53 comprised of mountingbracket 48 affixed to SCCU, female quick-disconnect fittings 51,actuation plate 47, andactuation solenoid 49. Female quick-disconnect fittings 51 are held in a stationary position by mountingbracket 48. Flexible hoses (not shown) attached tohose barbs 52 connect to solenoid-operated isolation valves (26 in FIG. 2 onmanifolds 24 and 25). The locking-release collar 55 of femalequick disconnects 51 is retained inactuation plate 47 which is connected to the shaft ofactuation solenoid 49. Energizingactuation solenoid 49causes actuation plate 47 and lockingcollar 55 of the female quick-disconnects 51 to move towards mountingbracket 48. Movement of locking-release collars 55 to the right in FIG. 8A permits male quick-disconnects 50 to engage or disengage female quick-disconnects 51. Alternatively, electrically operatedactuation solenoid 49 could be replaced with a manually operated actuation mechanism in FIGS. 8A, 8B, and 8C. - Following is a description of the sequence of actions/events involved in installing or removing an MPU (utilizing the insertion facilitation mechanism comprising an electrically actuated
automatic coupling assembly 53 and isolation valve mechanism comprising electrically operated solenoid isolation valves 26) while an SCCU continues to operate: - 1. Status of relevant SCCU components prior to modular pumping unit (MPU) installation or removal:
- Applicable solenoid-operated isolation valves (SOIV's)26 are in their normal (non-actuated) position which is open.
- Applicable actuation solenoid (AS)49 is in its normal position (when the
actuation solenoid 49 is in its normal position, the locking-release collars on the female portion of the quick disconnects are in their normal locked position.) - 2. Sequence of events when an MPU is installed in an operating SCCU:
- a) Stimulus is applied to ready MPU location for MPU install. This stimulus could be the entering of a computer command (when microcode controlled) or manual operation of an electrical switch. Two things happen when this stimulus is provided (in order):
- i) Applicable SOIV's26 are electrically energized (closed)
- ii)
Applicable AS 49 is electrically energized (unlocking locking-release collar of female quick disconnect). - b) Install MPU by manually pushing (from left-side in FIG. 8A) into position (resulting in insertion of male portion of quick disconnect into female portion of quick disconnect)
- c) Apply separate stimulus to ready MPU for operation in the SCCU resulting in (in order)
- i)
Applicable AS 49 being electrically de-energized (locking-release collar on female portion of quick disconnect returns (under spring load) to its normal locked position) - ii) Applicable SOIV's26 electrically de-energized (opened)
- 3. Sequence of events when a MPU is removed while SCCU is operating.
- a) Stimulus is applied to ready MPU location for MPU removal resulting in (in order)
- i) Applicable SOIV's26 being electrically energized (closed)
- ii)
Applicable AS 49 being electrically energized - b) Remove MPU (by manually pulling towards left-side in FIG. 8A)
- c) Apply separate stimulus to acknowledge MPU has been removed resulting in (in order)
- i)
Applicable AS 49 electrically de-energized - ii) Applicable SOIV's26 electrically de-energized (closed)
- It may be appreciated that alternatively install and un-install of MPUs may be accomplished by manually coupling and uncoupling male
quick disconnects 50 and femalequick disconnects 51 and replacing of solenoid-operatedisolation valves 26 with manually operated valves. - It will be appreciated by those skilled in the art that wherein the Scalable Cooling Conditioning Unit has been described herein with respect to water-cooling, the concept is readily adapted to use other types of coolant (e.g. brines, fluorocarbon liquids, or other similar chemical coolants) on the system-side while maintaining the advantages and unique features of this invention.
- The overall concept of a physically integrated plate heat exchanger/expansion tank can be seen in FIG. 9. Closed liquid loops typically require an expansion space or tank to account for the volumetric expansion of the liquid under varying environmental temperatures and/or the volumetric expansion of flexible (i.e., rubber) hoses when exposed to operating pressures. It should be noted that the size and cooling capacity of the integrated plate heat exchanger/expansion tank is set to accommodate the maximum heat load of the SCCU system (i.e., the load with all possible MPU's attached to the appropriate manifolds). The
plate heat exchanger 1001 exists completely within thetank 1002. The piping to 1003/from 1004 the heat exchanger penetrates the tank wall. The structure can be assembled in a number of ways An example is shown in FIG. 10. Acover 1005 is attached to the tank after the heat exchanger is placed within the tank, and thepiping 1003/1004 is attached to the heat exchanger after the heat exchanger is placed inside the tank. Since the plate heat exchanger and tank are made of stainless steel, the pipe can be welded to the tank wall to prevent leakage. - As shown in FIG. 10, a heat exchanger sub-assembly is made up of a
plate heat exchanger 1001 with supports mounted to it. The detailed supports can be seen in FIG. 11. The axial (bottom)support 1201 would be designed to act as a spring so as to provide vertical compliance in the assembly. Thelateral support 1202 would be designed to prevent lateral motion of the heat exchanger. A rubber gasket around the periphery of the lateral support (not shown) would provide lateral compliance during assembly. Atop mounting plate 1203 would be bolted to supports provided on the tank to anchor the heat exchanger within the tank. FIG. 11 shows the completed assemblage of the expansion tank with the heat exchanger within. - It has been shown, with a finite element thermal conduction analysis, that the warm water return from the electronics frame(s) prevents the tank walls from dropping below the dew point temperature therefore preventing condensation from forming on the outer walls. Additionally, it can be shown that to contain a 24.33″ long by 7.52″ wide by 4.41″ deep heat exchanger in an expansion tank 28.33″ long and provide 10 gallons worth of expansion volume requires a 12″ diameter tank versus a 10-gallon expansion tank (alone) 28.33″ long that must be 10.3″ in diameter. Factor in a minimum of 1″ insulation that would have to surround the heat exchanger if not mounted inside the expansion tank and the volume benefit associated with the integral concept becomes self evident.
- While the invention has been described in detail herein in accord with certain preferred embodiments thereof, many modifications and changes therein may be effected by those skilled in the art. Accordingly, it is intended by the appended claims to cover all such modifications and changes as fall within the true spirit and scope of the invention.
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/243,708 US6714412B1 (en) | 2002-09-13 | 2002-09-13 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/243,708 US6714412B1 (en) | 2002-09-13 | 2002-09-13 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
Publications (2)
Publication Number | Publication Date |
---|---|
US20040050231A1 true US20040050231A1 (en) | 2004-03-18 |
US6714412B1 US6714412B1 (en) | 2004-03-30 |
Family
ID=31991715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/243,708 Expired - Lifetime US6714412B1 (en) | 2002-09-13 | 2002-09-13 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
Country Status (1)
Country | Link |
---|---|
US (1) | US6714412B1 (en) |
Cited By (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040182551A1 (en) * | 2003-03-17 | 2004-09-23 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
US20040188066A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy, Inc. | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US20050084385A1 (en) * | 2002-09-23 | 2005-04-21 | David Corbin | Micro-fabricated electrokinetic pump |
US20050183845A1 (en) * | 2003-01-31 | 2005-08-25 | Mark Munch | Remedies to prevent cracking in a liquid system |
US20050211417A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy,Inc. | Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
US20050211427A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US20060007657A1 (en) * | 2004-07-07 | 2006-01-12 | Teradyne, Inc. | Thermally enhanced pressure regulation of electronics cooling systems |
US20060067047A1 (en) * | 2004-09-30 | 2006-03-30 | Pfahnl Andreas C | Modular liquid cooling of electronic assemblies |
US20060180300A1 (en) * | 2003-07-23 | 2006-08-17 | Lenehan Daniel J | Pump and fan control concepts in a cooling system |
US20060272342A1 (en) * | 2005-06-01 | 2006-12-07 | Bash Cullen E | Refrigeration system with parallel evaporators and variable speed compressor |
US20070034356A1 (en) * | 2002-11-01 | 2007-02-15 | Cooligy, Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US20070121287A1 (en) * | 2004-02-17 | 2007-05-31 | Doerrich Martin | Housing arrangement |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
US20070201210A1 (en) * | 2006-02-16 | 2007-08-30 | Norman Chow | Liquid cooling loops for server applications |
US20070224060A1 (en) * | 2006-03-27 | 2007-09-27 | Koenig Kevin J | Pump Header Body and Modular Manifold |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
US20070235167A1 (en) * | 2006-04-11 | 2007-10-11 | Cooligy, Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20070256825A1 (en) * | 2006-05-04 | 2007-11-08 | Conway Bruce R | Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
US7315448B1 (en) * | 2005-06-01 | 2008-01-01 | Hewlett-Packard Development Company, L.P. | Air-cooled heat generating device airflow control system |
US20080209931A1 (en) * | 2007-03-01 | 2008-09-04 | Jason Stevens | Data centers |
US20090044928A1 (en) * | 2003-01-31 | 2009-02-19 | Girish Upadhya | Method and apparatus for preventing cracking in a liquid cooling system |
US20090046423A1 (en) * | 2007-08-07 | 2009-02-19 | James Hom | Internal access mechanism for a server rack |
US7730731B1 (en) | 2005-11-01 | 2010-06-08 | Hewlett-Packard Development Company, L.P. | Refrigeration system with serial evaporators |
JP2010528486A (en) * | 2007-05-31 | 2010-08-19 | リーバート・コーポレイシヨン | Cooling system and method of use thereof |
US20100277863A1 (en) * | 2009-04-29 | 2010-11-04 | Tozer Robert | Data centers |
US20110155938A1 (en) * | 2006-03-27 | 2011-06-30 | Koenig Kevin J | Pump header and implementation thereof |
US20110220324A1 (en) * | 2008-06-30 | 2011-09-15 | Volker Lindenstruth | Building for a computer centre with devices for efficient cooling |
US8276397B1 (en) * | 2007-06-27 | 2012-10-02 | Exaflop Llc | Cooling and power paths for data center |
JP2013026526A (en) * | 2011-07-22 | 2013-02-04 | Fujitsu Ltd | Cooling unit |
US20130091706A1 (en) * | 2011-10-12 | 2013-04-18 | International Business Machines Corporation | Combined power and cooling rack supporting an electronics rack(s) |
US8526183B1 (en) * | 2007-09-28 | 2013-09-03 | Exaflop Llc | Data center cooling circulation |
US20140209272A1 (en) * | 2011-08-01 | 2014-07-31 | Gsi Helmholtzzentrum Fur Schwerionenforschung Gmbh | Mobile Data Centre Unit With Efficient Cooling Means |
US20150083363A1 (en) * | 2012-05-11 | 2015-03-26 | Ecube Computing Gmbh | Method for operating a data centre with efficient cooling means |
US20160157387A1 (en) * | 2013-03-15 | 2016-06-02 | Switch Ltd | Data Center Facility Design Configuration |
US20170127558A1 (en) * | 2013-05-06 | 2017-05-04 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
EP3171036A1 (en) * | 2015-11-19 | 2017-05-24 | Adwatec Oy | Liquid cooling station |
US9999166B1 (en) | 2007-06-14 | 2018-06-12 | Switch, Ltd. | Integrated wiring system for a data center |
US10178796B2 (en) | 2007-06-14 | 2019-01-08 | Switch, Ltd. | Electronic equipment data center or co-location facility designs and methods of making and using the same |
US20190104646A1 (en) * | 2017-09-29 | 2019-04-04 | Fujitsu Limited | Information processing apparatus |
CN110418554A (en) * | 2019-07-20 | 2019-11-05 | 中国船舶重工集团公司第七二四研究所 | A kind of half-closed liquid cooling source that can be in parallel |
US10888034B2 (en) | 2007-06-14 | 2021-01-05 | Switch, Ltd. | Air handling unit with a canopy thereover for use with a data center and method of using the same |
WO2021058397A1 (en) * | 2019-09-26 | 2021-04-01 | Robert Bosch Gmbh | Cooling system and cooling arrangement |
US11116114B2 (en) * | 2019-06-18 | 2021-09-07 | Baidu Usa Llc | Cooling system design for data centers |
US20210378137A1 (en) * | 2020-05-29 | 2021-12-02 | Ovh | Uninterruptible power supply having a liquid cooling device |
US11275413B2 (en) | 2007-06-14 | 2022-03-15 | Switch, Ltd. | Data center air handling unit including uninterruptable cooling fan with weighted rotor and method of using the same |
FR3134495A1 (en) * | 2022-04-12 | 2023-10-13 | Valeo Systemes Thermiques | Cooling module for computer hardware |
US11825627B2 (en) | 2016-09-14 | 2023-11-21 | Switch, Ltd. | Ventilation and air flow control with heat insulated compartment |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7630198B2 (en) * | 2006-03-08 | 2009-12-08 | Cray Inc. | Multi-stage air movers for cooling computer systems and for other uses |
DE10310282A1 (en) * | 2003-03-07 | 2004-09-16 | Rittal Gmbh & Co. Kg | Liquid cooling system |
US7508672B2 (en) * | 2003-09-10 | 2009-03-24 | Qnx Cooling Systems Inc. | Cooling system |
US7000467B2 (en) * | 2003-12-16 | 2006-02-21 | International Business Machines Corporation | Method, system and program product for monitoring rate of volume change of coolant within a cooling system |
US6958911B2 (en) * | 2004-01-30 | 2005-10-25 | Isothermal Systems Research, Inc. | Low momentum loss fluid manifold system |
US7864527B1 (en) * | 2004-03-31 | 2011-01-04 | Google Inc. | Systems and methods for close coupled cooling |
US20050241802A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Liquid loop with flexible fan assembly |
US7187549B2 (en) * | 2004-06-30 | 2007-03-06 | Teradyne, Inc. | Heat exchange apparatus with parallel flow |
DE102004033063B3 (en) * | 2004-07-08 | 2005-09-08 | Hertweck, Jürgen | Heat exchange system for electronic apparatus such as data processors has two cooling circuits with different and separated coolant |
US7086247B2 (en) * | 2004-08-31 | 2006-08-08 | International Business Machines Corporation | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack |
US7380409B2 (en) * | 2004-09-30 | 2008-06-03 | International Business Machines Corporation | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing |
US7408775B2 (en) * | 2004-10-19 | 2008-08-05 | Honeywell International Inc. | Electrical module and support therefor with integrated cooling |
US20070223193A1 (en) * | 2006-03-23 | 2007-09-27 | Hamman Brian A | Transport System |
US8240359B2 (en) * | 2006-04-17 | 2012-08-14 | Gerald Garrett | Liquid storage and cooling computer case |
US7832461B2 (en) * | 2006-04-28 | 2010-11-16 | Hewlett-Packard Development Company, L.P. | Cooling systems and methods |
US7701714B2 (en) * | 2006-05-26 | 2010-04-20 | Flextronics Ap, Llc | Liquid-air hybrid cooling in electronics equipment |
DK2032907T3 (en) | 2006-06-01 | 2018-07-02 | Google Llc | Hot cooling for electronics |
US7349213B2 (en) * | 2006-06-29 | 2008-03-25 | International Business Machines Corporation | Coolant control unit, and cooled electronics system and method employing the same |
US8919426B2 (en) * | 2007-10-22 | 2014-12-30 | The Peregrine Falcon Corporation | Micro-channel pulsating heat pipe |
US8387249B2 (en) * | 2007-11-19 | 2013-03-05 | International Business Machines Corporation | Apparatus and method for facilitating servicing of a liquid-cooled electronics rack |
US20090154091A1 (en) * | 2007-12-17 | 2009-06-18 | Yatskov Alexander I | Cooling systems and heat exchangers for cooling computer components |
US8170724B2 (en) * | 2008-02-11 | 2012-05-01 | Cray Inc. | Systems and associated methods for controllably cooling computer components |
CA2882998C (en) * | 2008-02-15 | 2016-10-18 | The Pnc Financial Services Group, Inc. | Systems and methods for computer equipment management |
US7898799B2 (en) * | 2008-04-01 | 2011-03-01 | Cray Inc. | Airflow management apparatus for computer cabinets and associated methods |
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
US8081459B2 (en) * | 2008-10-17 | 2011-12-20 | Cray Inc. | Air conditioning systems for computer systems and associated methods |
US7903403B2 (en) * | 2008-10-17 | 2011-03-08 | Cray Inc. | Airflow intake systems and associated methods for use with computer cabinets |
US20110232869A1 (en) * | 2008-12-05 | 2011-09-29 | Petruzzo Stephen E | Air Conditioner Eliminator System and Method for Computer and Electronic Systems |
WO2010141641A2 (en) | 2009-06-02 | 2010-12-09 | Stephen Petruzzo | Modular re-configurable computers and storage systems and methods |
US8472181B2 (en) | 2010-04-20 | 2013-06-25 | Cray Inc. | Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use |
EP2586281B1 (en) | 2010-06-23 | 2017-08-09 | Inertech IP LLC | Space-saving high-density modular data center and an energy-efficient cooling system |
WO2012118554A1 (en) | 2011-03-02 | 2012-09-07 | Ietip Llc | Modular it rack cooling assemblies and methods for assembling same |
US9151543B2 (en) * | 2011-07-15 | 2015-10-06 | International Business Machines Corporation | Data center coolant switch |
TWI445289B (en) * | 2011-08-19 | 2014-07-11 | Inventec Corp | Coolant pipe of sever rack |
US8711563B2 (en) * | 2011-10-25 | 2014-04-29 | International Business Machines Corporation | Dry-cooling unit with gravity-assisted coolant flow |
TWI445493B (en) * | 2011-11-11 | 2014-07-11 | Inventec Corp | Heat dissipation system |
WO2015192249A1 (en) | 2014-06-20 | 2015-12-23 | Nortek Air Solutions Canada, Inc. | Systems and methods for managing conditions in enclosed space |
WO2016057854A1 (en) | 2014-10-08 | 2016-04-14 | Inertech Ip Llc | Systems and methods for cooling electrical equipment |
SG10201913923WA (en) | 2015-05-15 | 2020-03-30 | Nortek Air Solutions Canada Inc | Using liquid to air membrane energy exchanger for liquid cooling |
WO2017117644A1 (en) | 2016-01-08 | 2017-07-13 | Moghaddam Davood Ghadiri | Integrated make-up air system in 100% air recirculation system |
KR20230152767A (en) | 2016-03-16 | 2023-11-03 | 이너테크 아이피 엘엘씨 | System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling |
CN108738279A (en) * | 2018-05-04 | 2018-11-02 | 英业达科技有限公司 | Liquid cooling system for equipment cabinet server |
TWI687640B (en) * | 2019-05-27 | 2020-03-11 | 雙鴻科技股份有限公司 | Cooling system amd coolant distribution module thereof |
US11576283B2 (en) * | 2021-04-13 | 2023-02-07 | Dell Products L.P. | Modular and highly available cooling distribution unit for information handling systems |
US20230164951A1 (en) * | 2021-11-22 | 2023-05-25 | Google Llc | Modular liquid cooling architecture for liquid cooling |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394141A (en) * | 1978-06-15 | 1983-07-19 | Valeo | Expansion tank and water box device for heat exchanger, such as a radiator of a motor vehicle |
US4567223A (en) * | 1984-08-31 | 1986-01-28 | Eastman Kodak Company | Polyolefin containing hot-melt adhesives having short set time and both good low and high temperature bond strength properties |
US4759424A (en) * | 1986-11-13 | 1988-07-26 | Rolleri Dennis A | Anti-theft device for automobile and automobile accessories |
US5050036A (en) * | 1989-10-24 | 1991-09-17 | Amdahl Corporation | Liquid cooled integrated circuit assembly |
US5086829A (en) * | 1990-07-12 | 1992-02-11 | Nec Corporation | Liquid cooling apparatus with improved leakage detection for electronic devices |
US5370178A (en) * | 1993-08-25 | 1994-12-06 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
US5482113A (en) * | 1993-08-25 | 1996-01-09 | International Business Machines Corporation | Convertible heat exchanger for air or water cooling of electronic circuit components and the like |
US5523640A (en) * | 1994-04-22 | 1996-06-04 | Cincinnati Milacron Inc. | Liquid cooling for electrical components of a plastics processing machine |
US5630326A (en) * | 1994-09-14 | 1997-05-20 | Zexel Corporation | Expansion valve mounting member |
US5744008A (en) * | 1996-01-02 | 1998-04-28 | Oceanit Laboratories, Inc. | Hurricane tower water desalination device |
US5871042A (en) * | 1997-11-04 | 1999-02-16 | Teradyne, Inc. | Liquid cooling apparatus for use with electronic equipment |
US6122166A (en) * | 1994-09-16 | 2000-09-19 | Fujikura Ltd. | Personal computer cooling device having hinged heat pipe |
US6182742B1 (en) * | 1996-06-21 | 2001-02-06 | Hitachi, Ltd. | Cooling apparatus for use in an electronic system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148394A (en) | 1982-02-26 | 1983-09-03 | Nippon Radiator Co Ltd | Method of coupling liquid flow pipes and retainer plate of heat exchanger |
FR2580060B1 (en) | 1985-04-05 | 1989-06-09 | Nec Corp | |
WO1987004781A1 (en) | 1986-02-06 | 1987-08-13 | Robert John Lauderdale | Heating exchange for potable water |
DE3641458A1 (en) | 1986-12-04 | 1988-06-09 | Funke Waerme Apparate Kg | HEAT EXCHANGER |
JPH0713586B2 (en) | 1987-02-20 | 1995-02-15 | 三機工業株式会社 | Mobile oil / water control system for automobile engine experiments |
US5323847A (en) * | 1990-08-01 | 1994-06-28 | Hitachi, Ltd. | Electronic apparatus and method of cooling the same |
JPH04257011A (en) | 1991-02-12 | 1992-09-11 | Hitachi Ltd | Abnormality processing system for water cooling device |
JPH06266474A (en) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | Electronic apparatus equipment and lap top electronic apparatus equipment |
JPH09184667A (en) | 1995-12-28 | 1997-07-15 | Zexel Corp | Heat exchanger |
US5943211A (en) * | 1997-04-18 | 1999-08-24 | Raytheon Company | Heat spreader system for cooling heat generating components |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
JPH10220982A (en) | 1997-02-04 | 1998-08-21 | Sanden Corp | Heat exchanger |
JP2001320187A (en) | 2000-02-29 | 2001-11-16 | Matsushita Electric Ind Co Ltd | Liquid type cooler for electronic part |
US6628520B2 (en) * | 2002-02-06 | 2003-09-30 | Hewlett-Packard Development Company, L.P. | Method, apparatus, and system for cooling electronic components |
-
2002
- 2002-09-13 US US10/243,708 patent/US6714412B1/en not_active Expired - Lifetime
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394141A (en) * | 1978-06-15 | 1983-07-19 | Valeo | Expansion tank and water box device for heat exchanger, such as a radiator of a motor vehicle |
US4567223A (en) * | 1984-08-31 | 1986-01-28 | Eastman Kodak Company | Polyolefin containing hot-melt adhesives having short set time and both good low and high temperature bond strength properties |
US4759424A (en) * | 1986-11-13 | 1988-07-26 | Rolleri Dennis A | Anti-theft device for automobile and automobile accessories |
US5050036A (en) * | 1989-10-24 | 1991-09-17 | Amdahl Corporation | Liquid cooled integrated circuit assembly |
US5086829A (en) * | 1990-07-12 | 1992-02-11 | Nec Corporation | Liquid cooling apparatus with improved leakage detection for electronic devices |
US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
US5370178A (en) * | 1993-08-25 | 1994-12-06 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
US5482113A (en) * | 1993-08-25 | 1996-01-09 | International Business Machines Corporation | Convertible heat exchanger for air or water cooling of electronic circuit components and the like |
US5523640A (en) * | 1994-04-22 | 1996-06-04 | Cincinnati Milacron Inc. | Liquid cooling for electrical components of a plastics processing machine |
US5620646A (en) * | 1994-04-22 | 1997-04-15 | Cincinnati Milacron Inc. | Method for cooling electrical components in a plastics processing machine |
US5630326A (en) * | 1994-09-14 | 1997-05-20 | Zexel Corporation | Expansion valve mounting member |
US6122166A (en) * | 1994-09-16 | 2000-09-19 | Fujikura Ltd. | Personal computer cooling device having hinged heat pipe |
US5744008A (en) * | 1996-01-02 | 1998-04-28 | Oceanit Laboratories, Inc. | Hurricane tower water desalination device |
US6182742B1 (en) * | 1996-06-21 | 2001-02-06 | Hitachi, Ltd. | Cooling apparatus for use in an electronic system |
US5871042A (en) * | 1997-11-04 | 1999-02-16 | Teradyne, Inc. | Liquid cooling apparatus for use with electronic equipment |
Cited By (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050084385A1 (en) * | 2002-09-23 | 2005-04-21 | David Corbin | Micro-fabricated electrokinetic pump |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US20040188066A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy, Inc. | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US7806168B2 (en) | 2002-11-01 | 2010-10-05 | Cooligy Inc | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US20070034356A1 (en) * | 2002-11-01 | 2007-02-15 | Cooligy, Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US20050211417A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy,Inc. | Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
US20050211427A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US20050183845A1 (en) * | 2003-01-31 | 2005-08-25 | Mark Munch | Remedies to prevent cracking in a liquid system |
US20090044928A1 (en) * | 2003-01-31 | 2009-02-19 | Girish Upadhya | Method and apparatus for preventing cracking in a liquid cooling system |
US20050183445A1 (en) * | 2003-01-31 | 2005-08-25 | Mark Munch | Remedies to prevent cracking in a liquid system |
US20040182551A1 (en) * | 2003-03-17 | 2004-09-23 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
US20060180300A1 (en) * | 2003-07-23 | 2006-08-17 | Lenehan Daniel J | Pump and fan control concepts in a cooling system |
US8602092B2 (en) | 2003-07-23 | 2013-12-10 | Cooligy, Inc. | Pump and fan control concepts in a cooling system |
US20070121287A1 (en) * | 2004-02-17 | 2007-05-31 | Doerrich Martin | Housing arrangement |
US7466549B2 (en) * | 2004-02-17 | 2008-12-16 | Rittal Gmbh & Co. Kg | Cooling arrangement for server blades |
US7257000B2 (en) | 2004-07-07 | 2007-08-14 | Amphenol Corporation | Thermally enhanced pressure regulation of electronics cooling system |
US20060007657A1 (en) * | 2004-07-07 | 2006-01-12 | Teradyne, Inc. | Thermally enhanced pressure regulation of electronics cooling systems |
US7355852B2 (en) | 2004-09-30 | 2008-04-08 | Amphenol Corporation | Modular liquid cooling of electronic assemblies |
US20060067047A1 (en) * | 2004-09-30 | 2006-03-30 | Pfahnl Andreas C | Modular liquid cooling of electronic assemblies |
US20060272342A1 (en) * | 2005-06-01 | 2006-12-07 | Bash Cullen E | Refrigeration system with parallel evaporators and variable speed compressor |
US20110120156A1 (en) * | 2005-06-01 | 2011-05-26 | Bash Cullen E | Refrigeration system with parallel evaporators and variable speed compressor |
US7895854B2 (en) | 2005-06-01 | 2011-03-01 | Hewlett-Packard Development Company, L.P. | Refrigeration system with parallel evaporators and variable speed compressor |
US7315448B1 (en) * | 2005-06-01 | 2008-01-01 | Hewlett-Packard Development Company, L.P. | Air-cooled heat generating device airflow control system |
US8561418B2 (en) | 2005-06-01 | 2013-10-22 | Hewlett-Packard Development Company, L.P. | Refrigeration system with parallel evaporators and variable speed compressor |
US7730731B1 (en) | 2005-11-01 | 2010-06-08 | Hewlett-Packard Development Company, L.P. | Refrigeration system with serial evaporators |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
US20070201210A1 (en) * | 2006-02-16 | 2007-08-30 | Norman Chow | Liquid cooling loops for server applications |
US7775762B2 (en) | 2006-03-27 | 2010-08-17 | Koenig Kevin J | Pump header body and modular manifold |
US20070224034A1 (en) * | 2006-03-27 | 2007-09-27 | Koenig Kevin J | Pump Header Body and Modular Manifold |
US20070224060A1 (en) * | 2006-03-27 | 2007-09-27 | Koenig Kevin J | Pump Header Body and Modular Manifold |
US8202040B2 (en) | 2006-03-27 | 2012-06-19 | Koenig Kevin J | Pump header and implementation thereof |
US7507066B2 (en) | 2006-03-27 | 2009-03-24 | Koenig Kevin J | Pump header body and modular manifold |
US20110155938A1 (en) * | 2006-03-27 | 2011-06-30 | Koenig Kevin J | Pump header and implementation thereof |
US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
US20070235167A1 (en) * | 2006-04-11 | 2007-10-11 | Cooligy, Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
WO2007120662A3 (en) * | 2006-04-11 | 2008-02-21 | Cooligy Inc | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
WO2007120662A2 (en) * | 2006-04-11 | 2007-10-25 | Cooligy, Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20070256825A1 (en) * | 2006-05-04 | 2007-11-08 | Conway Bruce R | Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect |
US20080209931A1 (en) * | 2007-03-01 | 2008-09-04 | Jason Stevens | Data centers |
JP2010528486A (en) * | 2007-05-31 | 2010-08-19 | リーバート・コーポレイシヨン | Cooling system and method of use thereof |
US10178796B2 (en) | 2007-06-14 | 2019-01-08 | Switch, Ltd. | Electronic equipment data center or co-location facility designs and methods of making and using the same |
US11275413B2 (en) | 2007-06-14 | 2022-03-15 | Switch, Ltd. | Data center air handling unit including uninterruptable cooling fan with weighted rotor and method of using the same |
US10356939B2 (en) | 2007-06-14 | 2019-07-16 | Switch, Ltd. | Electronic equipment data center or co-location facility designs and methods of making and using the same |
US11889630B2 (en) | 2007-06-14 | 2024-01-30 | Switch, Ltd. | Data center facility including external wall penetrating air handling units |
US11622484B2 (en) | 2007-06-14 | 2023-04-04 | Switch, Ltd. | Data center exterior wall penetrating air handling technology |
US9999166B1 (en) | 2007-06-14 | 2018-06-12 | Switch, Ltd. | Integrated wiring system for a data center |
US10356968B2 (en) | 2007-06-14 | 2019-07-16 | Switch, Ltd. | Facility including externally disposed data center air handling units |
US10888034B2 (en) | 2007-06-14 | 2021-01-05 | Switch, Ltd. | Air handling unit with a canopy thereover for use with a data center and method of using the same |
US8276397B1 (en) * | 2007-06-27 | 2012-10-02 | Exaflop Llc | Cooling and power paths for data center |
US20090046423A1 (en) * | 2007-08-07 | 2009-02-19 | James Hom | Internal access mechanism for a server rack |
US7746634B2 (en) | 2007-08-07 | 2010-06-29 | Cooligy Inc. | Internal access mechanism for a server rack |
US20090046430A1 (en) * | 2007-08-07 | 2009-02-19 | Richard Grant Brewer | Method and apparatus for providing supplemental cooling to server racks |
US8526183B1 (en) * | 2007-09-28 | 2013-09-03 | Exaflop Llc | Data center cooling circulation |
US9476605B2 (en) * | 2008-06-30 | 2016-10-25 | E3 Computing Gmbh | Building for a computer centre with devices for efficient cooling |
US20110220324A1 (en) * | 2008-06-30 | 2011-09-15 | Volker Lindenstruth | Building for a computer centre with devices for efficient cooling |
KR101738171B1 (en) * | 2008-06-30 | 2017-05-19 | 폴커 린덴스트루쓰 | Building for a computer centre with devices for efficient cooling |
US10309669B2 (en) | 2008-06-30 | 2019-06-04 | E3 Computing Gmbh | Methods and apparatus for temperature control of computer racks and computer data centres |
US20170254551A1 (en) * | 2008-06-30 | 2017-09-07 | E3 Computing Gmbh | Methods and apparatus for temperature control of computer racks and computer data centres |
US20100277863A1 (en) * | 2009-04-29 | 2010-11-04 | Tozer Robert | Data centers |
US7903404B2 (en) * | 2009-04-29 | 2011-03-08 | Hewlett-Packard Development Company, L.P. | Data centers |
JP2013026526A (en) * | 2011-07-22 | 2013-02-04 | Fujitsu Ltd | Cooling unit |
US20140209272A1 (en) * | 2011-08-01 | 2014-07-31 | Gsi Helmholtzzentrum Fur Schwerionenforschung Gmbh | Mobile Data Centre Unit With Efficient Cooling Means |
US9763365B2 (en) * | 2011-08-01 | 2017-09-12 | Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh | Mobile data centre unit with efficient cooling means |
US8824143B2 (en) * | 2011-10-12 | 2014-09-02 | International Business Machines Corporation | Combined power and cooling rack supporting an electronics rack(S) |
US20130091706A1 (en) * | 2011-10-12 | 2013-04-18 | International Business Machines Corporation | Combined power and cooling rack supporting an electronics rack(s) |
US20130094139A1 (en) * | 2011-10-12 | 2013-04-18 | International Business Machines Corporation | Combined power and cooling rack supporting an electronics rack(s) |
US8879257B2 (en) * | 2011-10-12 | 2014-11-04 | International Business Machines Corporation | Combined power and cooling rack supporting an electronics rack(s) |
US10653041B2 (en) * | 2012-05-11 | 2020-05-12 | Ecube Computing Gmbh | Fluid-cooled data centres without air conditioning, and methods for operating same |
US20150083363A1 (en) * | 2012-05-11 | 2015-03-26 | Ecube Computing Gmbh | Method for operating a data centre with efficient cooling means |
US20160157387A1 (en) * | 2013-03-15 | 2016-06-02 | Switch Ltd | Data Center Facility Design Configuration |
US9795061B2 (en) * | 2013-03-15 | 2017-10-17 | Switch, Ltd. | Data center facility design configuration |
US10624242B2 (en) * | 2013-05-06 | 2020-04-14 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
US20170127558A1 (en) * | 2013-05-06 | 2017-05-04 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
EP3171036A1 (en) * | 2015-11-19 | 2017-05-24 | Adwatec Oy | Liquid cooling station |
US10412857B2 (en) * | 2015-11-19 | 2019-09-10 | Adwatec Oy | Liquid cooling station |
US11825627B2 (en) | 2016-09-14 | 2023-11-21 | Switch, Ltd. | Ventilation and air flow control with heat insulated compartment |
JP2019067104A (en) * | 2017-09-29 | 2019-04-25 | 富士通株式会社 | Information processing apparatus |
JP7174512B2 (en) | 2017-09-29 | 2022-11-17 | 富士通株式会社 | Information processing equipment |
US10701834B2 (en) * | 2017-09-29 | 2020-06-30 | Fujitsu Limited | Information processing apparatus |
US20190104646A1 (en) * | 2017-09-29 | 2019-04-04 | Fujitsu Limited | Information processing apparatus |
US11116114B2 (en) * | 2019-06-18 | 2021-09-07 | Baidu Usa Llc | Cooling system design for data centers |
CN110418554A (en) * | 2019-07-20 | 2019-11-05 | 中国船舶重工集团公司第七二四研究所 | A kind of half-closed liquid cooling source that can be in parallel |
WO2021058397A1 (en) * | 2019-09-26 | 2021-04-01 | Robert Bosch Gmbh | Cooling system and cooling arrangement |
US20210378137A1 (en) * | 2020-05-29 | 2021-12-02 | Ovh | Uninterruptible power supply having a liquid cooling device |
US11612077B2 (en) * | 2020-05-29 | 2023-03-21 | Ovh | Uninterruptible power supply having a liquid cooling device |
FR3134495A1 (en) * | 2022-04-12 | 2023-10-13 | Valeo Systemes Thermiques | Cooling module for computer hardware |
WO2023198371A1 (en) * | 2022-04-12 | 2023-10-19 | Valeo Systemes Thermiques | Module for cooling computer hardware |
Also Published As
Publication number | Publication date |
---|---|
US6714412B1 (en) | 2004-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6714412B1 (en) | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use | |
US7088585B2 (en) | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems | |
US7086247B2 (en) | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack | |
US9913403B2 (en) | Flexible coolant manifold—heat sink assembly | |
CN107580804B (en) | Electronic equipment in cooling data center | |
CA2624308C (en) | Sub-cooling unit for cooling system and method | |
US9392727B2 (en) | Cooled electronic system | |
US7011143B2 (en) | Method and apparatus for cooling electronic components | |
US20080055852A1 (en) | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System | |
US10753236B2 (en) | Fuel vaporization using data center waste heat | |
US20080266726A1 (en) | Cooling system for electrical devices | |
US8342419B2 (en) | Prefabricated stand for hydronic systems | |
JP2009512190A5 (en) | ||
US11326830B2 (en) | Multiple module modular systems for refrigeration | |
CN105805838A (en) | Special precise air conditioner for full-sensible-heat energy-saving computer room/equipment cabinet | |
US6438990B1 (en) | Refrigeration system | |
TW200528952A (en) | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems | |
WO2010151454A1 (en) | Rotatable cooling module | |
US7216492B2 (en) | Portable refrigeration unit | |
JPH06213483A (en) | Water supplying system used both for cooling and heating | |
JP2010276229A (en) | Warm water type heating device | |
EP2046642A2 (en) | Galley cooling heat sink through water system | |
US20170311485A1 (en) | Cooling device and method of manufacturing the same | |
WO2020198079A1 (en) | Multiple module modular systems for refrigeration | |
US20230389425A1 (en) | Method and system for cooling of a device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHU, RICHARD C.;ELLSWORTH, MICHAEL J., JR.;SCHMIDT, ROGER R.;AND OTHERS;REEL/FRAME:013302/0249 Effective date: 20020913 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 12 |