US20040035441A1 - Apparatus and method for cleaning substrate - Google Patents
Apparatus and method for cleaning substrate Download PDFInfo
- Publication number
- US20040035441A1 US20040035441A1 US10/647,475 US64747503A US2004035441A1 US 20040035441 A1 US20040035441 A1 US 20040035441A1 US 64747503 A US64747503 A US 64747503A US 2004035441 A1 US2004035441 A1 US 2004035441A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- cleaning
- cleaning module
- foreign substances
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
Abstract
A substrate cleaning apparatus and method for a liquid crystal display panel capable of removing foreign substances attached to the lower and upper surfaces of a substrate as well as onto the side surface thereof. The apparatus includes upper and lower cleaning modules arranged in such a manner as to contact the upper and lower surfaces of the substrate. Also, a side-cleaning module is arranged at the side surfaces of the substrate.
Description
- This application claims the benefit of Korean Patent Application No. 1999-44599, filed on Oct. 14, 1999, which is hereby incorporated by reference.
- 1. Field of the Invention
- The present invention relates to a liquid crystal display, and more particularly, to a substrate cleaning technique for a liquid crystal display.
- 2. Discussion of the Related Art
- Generally, a liquid crystal display (LCD) panel is manufactured by carrying out various processes such as a process of forming a thin film transistor (TFT) including an electrode material, a semiconductor layer and an insulating film on a substrate, an assembling of the lower substrate to the upper substrate and an injection and sealing of liquid crystal, etc. In such various fabrication process of the LCD panel, particles such as substrate fragments, and various alien or foreign substances occasionally stick or adhere to the substrate to contaminate the substrate. In order to reduce such a defect caused by the foreign substances, a fabrication process of the LCD panel includes a substrate cleaning process for each step thereof. In connection with each fabrication process requiring cleaning of the substrate, the substrate cleaning is performed in the following: (1) before and after a step of forming a TFT array on the substrate; (2) after a step of forming an orientation film and rubbing the orientation film for forming an orientation of a liquid crystal; (3) after a step of scribing for assembling the upper substrate with the lower substrate and then cutting away each panel from the whole substrate; and (4) after a step of injecting a liquid crystal to the panel and sealing the injected portion.
- Such substrate cleaning is carried out by means of a substrate-cleaning module, as shown in FIG. 1. Referring to FIG. 1, the conventional substrate cleaning apparatus includes
cleaning brushes 22 for cleaning the upper and lower surfaces of asubstrate 20. A pair ofcleaning brushes 22 is provided at each of the upper and lower sides in such a manner as to contact the upper and lower surfaces of thesubstrate 20. As shown in FIG. 1, the cleaning is initiated by passing thesubstrate 20 between the upper andlower cleaning brushes 22 in the direction of the arrow. Then, thecleaning brushes 22 are rotated at a high speed to remove undesired particles and foreign substances sticking to the upper and lower surfaces of thesubstrate 20. - In the conventional substrate cleaning apparatus, the
cleaning brushes 22 are formed to contact the upper and lower surfaces of thesubstrate 20 to remove foreign substances sticking to the upper and lower surfaces of thesubstrate 20. However, the conventional substrate cleaning apparatus cannot remove foreign substances adhering to the side surfaces of thesubstrate 20. Thesubstrate 20 used in the liquid crystal display panel has a thickness of about 0.7 mm and is susceptible of being contaminated by such foreign substances due to the significant surface area of the side surfaces. Thus, foreign substances generated in various processes during fabrication of the panel become attached to the upper and lower surfaces of thesubstrate 20 as well as to the side surfaces thereof. Particularly, in the scribing or grinding process, minute particles and fragments of the substrate may adhere to the side surfaces of thesubstrate 20 to contaminate thesubstrate 20. This is because in the scribing process, each panel is separated from the large glass substrate by cutting after the formation of the TFT and assembling of the upper substrate to the lower substrate and in the grinding process, the coarse side surfaces of thesubstrate 20, after being separated, undergo grinding. Such foreign substances sticking to the side surfaces of thesubstrate 20 cause defects during fabrication of the panel to reduce throughput (yield) and deteriorate the picture quality of the LCD panel. - Accordingly, the present invention is directed to an apparatus and a method for cleaning a substrate that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
- An object of the present invention is to provide a substrate cleaning apparatus and method for a liquid crystal display panel that is capable of removing foreign substances attached to the lower and upper surfaces of a substrate as well as to the side surfaces thereof.
- Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
- To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a substrate cleaning apparatus for a liquid crystal display panel according to one aspect of the present invention includes a side-cleaning module arranged at a side surface of the substrate.
- In another aspect of the present invention, a method of cleaning a substrate in a liquid crystal display panel includes rotating side cleaning brushes arranged in such a manner as to contact the side surface of the substrate to remove foreign substances sticking to the side surface of the substrate; rotating upper and lower cleaning brushes arranged in such a manner as to contact the upper and lower surfaces of the substrate, respectively, to remove foreign substances sticking to the upper and lower surfaces of the substrate; and jetting cleaning water carrying ultrasonic waves onto the side surface of the substrate at a high pressure to clean the side surface of the substrate.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
- In the drawings:
- FIG. 1 is a perspective view showing a conventional substrate cleaning apparatus; and
- FIG. 2 is a perspective view showing a substrate cleaning apparatus according to an embodiment of the present invention.
- Reference will now be made in detail to the preferred embodiment of the present invention, example of which is illustrated in the accompanying drawings.
- Referring to FIG. 2, there is shown a substrate cleaning apparatus according to an embodiment of the present invention. The substrate cleaning apparatus includes
upper cleaning brushes 34 andlower cleaning brushes 36 for cleaning the upper and lower surfaces of asubstrate 30, respectively, as well asside cleaning brushes 32 and a sonar (e.g., Fine DI Mega Sonic) 38 for cleaning the side surface of thesubstrate 30. Theside cleaning brushes 32 mounted on the side surface of thesubstrate 30 rotate to remove foreign substances sticking to the side surfaces of the substrate. Also, thesonar 38 jets or sprays cleaning water carrying ultrasonic waves onto the side surfaces of thesubstrate 30 at a high pressure to remove foreign substances sticking to the side surface of thesubstrate 30. - Hereinafter, an operation of the present substrate cleaning apparatus will be described. First, the
substrate 30 is transferred and mounted between the upper andlower cleaning brushes side cleaning brushes 32 and thesonar 38 are mounted within the cleaning module in such a manner as to contact the side surfaces of thesubstrate 30. As thesubstrate 32 begins to move, theside cleaning brushes 32 contacting the side surface of thesubstrate 30 are rapidly rotated to primarily remove foreign substances sticking to the side surface of thesubstrate 30. Next, while thesubstrate 30 is being transferred continuously, the upper andlower cleaning brushes substrate 30. Finally, thesonar 38 jets or sprays cleaning water at a high pressure onto the side surfaces of thesubstrate 30 to further clean the side surfaces of thesubstrate 30. The cleaning water jetted from a fine nozzle of thesonar 38 is de-ionized water and carries ultrasonic waves causing a minute vibration. Accordingly, the foreign substances adhering to the side surfaces of thesubstrate 30 are preferably completely removed by the high pressure of the cleaning water and the vibration from the ultrasonic waves. - By such cleaning technique using the side-cleaning module, the substrate cleaning apparatus of the present invention can completely remove sticking particles or foreign substances sticking to the upper and lower surfaces of the substrate as well as the side surfaces of the substrate. Accordingly, a defect ratio caused by the foreign substances during fabrication of the LCD panel is dramatically reduced to improve yield. Moreover, picture quality deterioration caused by the foreign substances at the side surfaces of the substrate as in the prior art can be eliminated.
- As described above, according to the present invention, sticking particles or foreign substances sticking to the upper and lower surfaces of the substrate as well as the side surfaces of the substrate are removed by the side brushes contacting the side surfaces of the substrate and a device for jetting or spraying cleaning water carrying ultrasonic waves at a high pressure. Accordingly, the fabrication yield of the LCD panel is improved and picture quality deterioration problem is solved.
- It will be apparent to those skilled in the art that various modifications and variation can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (27)
1. A substrate cleaning apparatus for cleaning a substrate of a liquid crystal display panel comprising:
a first cleaning module on a substrate, said substrate having upper and lower surfaces; and
a side-cleaning module at a side surface of the substrate.
2. The apparatus of claim 1 , wherein the side-cleaning module includes a brush cleaner.
3. The apparatus of claim 2 , wherein the brush cleaner extends partially along the side surface of the substrate.
4. The apparatus of claim 2 , wherein the brush cleaner of the side-cleaning module is rotatable.
5. The apparatus of claim 2 , wherein the side-cleaning module further comprises a water jet device.
6. The apparatus of claim 5 , wherein the water jet device generates ultrasonic waves onto the side surface of the substrate.
7. The apparatus of claim 5 , wherein the water jet device generates ultrasonic waves onto the side surface of the substrate at a high pressure.
8. The apparatus of claim 1 , wherein the side-cleaning module comprises a vibration generating device.
9. The apparatus of claim 8 , wherein the vibration generating device includes a sonar.
10. The apparatus of claim 8 , wherein the vibration generating device generates ultrasonic waves onto the side surface of the substrate.
11. The apparatus of claim 8 , wherein the vibration generating device jets water onto the side surface of the substrate.
12. The apparatus of claim 1 , wherein the first cleaning module includes a brush cleaner.
13. A method of cleaning a substrate of a liquid crystal display panel comprising:
providing a first cleaning module on a substrate, said substrate having upper and lower surfaces;
providing a side-cleaning module on a side surface of the substrate;
removing foreign substances on a side surface of the substrate using the side-cleaning module; and
removing foreign substances on the upper and lower surface of the substrate using the cleaning module.
14. The method of claim 13 , wherein the side-cleaning module is rotatable.
15. The method of claim 14 , wherein the side-cleaning module extends partially along the side surface of the substrate.
16. The method of claim 13 , wherein the first cleaning module is rotatable.
17. The method of claim 13 , wherein the first cleaning module includes upper and lower cleaning brushes.
18. The method of claim 17 , wherein the upper and lower cleaning brushes are arranged at the upper and lower surfaces of the substrate, respectively.
19. The method of claim 13 , further comprising cleaning the side surface of the substrate using a water jet device.
20. The method of claim 19 , wherein the water jet device generates ultrasonic waves.
21. The method of claim 19 , wherein the cleaning step includes jetting water onto the side surface of the substrate at a high pressure.
22. The method of claim 21 , wherein the water includes de-ionized water.
23. A method of cleaning a substrate of a liquid crystal display panel comprising:
providing a cleaning module at a substrate, said substrate having upper and lower surfaces;
providing a side-cleaning module arranged at a side surface of the substrate;
removing foreign substances on a side surface of the substrate using the side-cleaning module;
removing foreign substances on the upper and lower surface of the substrate using the cleaning module; and
cleaning the side surface of the substrate using a water jet device.
24. The method of claim 23 , wherein the water jet device causes vibration on the side surface of the substrate.
25. The method of claim 24 , wherein the vibration is generated by ultrasonic waves.
26. The method in claim 23 , wherein the cleaning step includes jetting water onto the side surface of the substrate at a high pressure.
27. The method of claim 26 , wherein the water includes de-ionized water.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/647,475 US20040035441A1 (en) | 1999-10-14 | 2003-08-26 | Apparatus and method for cleaning substrate |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990044599A KR20010037210A (en) | 1999-10-14 | 1999-10-14 | Apparatus and Method of Cleaning Substrate |
KRP99-44599 | 1999-10-14 | ||
US09/689,839 US6625836B1 (en) | 1999-10-14 | 2000-10-13 | Apparatus and method for cleaning substrate |
US10/647,475 US20040035441A1 (en) | 1999-10-14 | 2003-08-26 | Apparatus and method for cleaning substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/689,839 Division US6625836B1 (en) | 1999-10-14 | 2000-10-13 | Apparatus and method for cleaning substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040035441A1 true US20040035441A1 (en) | 2004-02-26 |
Family
ID=19615391
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/689,839 Expired - Lifetime US6625836B1 (en) | 1999-10-14 | 2000-10-13 | Apparatus and method for cleaning substrate |
US10/647,475 Abandoned US20040035441A1 (en) | 1999-10-14 | 2003-08-26 | Apparatus and method for cleaning substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/689,839 Expired - Lifetime US6625836B1 (en) | 1999-10-14 | 2000-10-13 | Apparatus and method for cleaning substrate |
Country Status (2)
Country | Link |
---|---|
US (2) | US6625836B1 (en) |
KR (1) | KR20010037210A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101006086B1 (en) * | 2003-12-31 | 2011-01-06 | 엘지디스플레이 주식회사 | Glass edge bead removal apparatus for LCD manufacturing process |
US7302727B2 (en) * | 2004-04-19 | 2007-12-04 | E-L Management Corporation | Pressed powder pan cleaning machine |
CN107030057A (en) * | 2017-05-11 | 2017-08-11 | 惠科股份有限公司 | A kind of oscillatory type cleaning device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
US5868866A (en) * | 1995-03-03 | 1999-02-09 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
US6059891A (en) * | 1997-07-23 | 2000-05-09 | Tokyo Electron Limited | Apparatus and method for washing substrate |
US6202658B1 (en) * | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
US6261378B1 (en) * | 1998-03-23 | 2001-07-17 | Tokyo Electron Limited | Substrate cleaning unit and cleaning method |
US6643882B1 (en) * | 1999-06-17 | 2003-11-11 | Ebara Corporation | Substrate cleaning apparatus |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4326553A (en) * | 1980-08-28 | 1982-04-27 | Rca Corporation | Megasonic jet cleaner apparatus |
JPS60143634A (en) * | 1983-12-29 | 1985-07-29 | Fujitsu Ltd | Wafer treatment and device thereof |
JPH04363022A (en) * | 1991-06-06 | 1992-12-15 | Enya Syst:Kk | Cleaning device for wafer mounter |
KR960019552A (en) * | 1994-11-04 | 1996-06-17 | 이헌조 | Substrate Cleaning Equipment |
TW316995B (en) * | 1995-01-19 | 1997-10-01 | Tokyo Electron Co Ltd | |
KR0175278B1 (en) * | 1996-02-13 | 1999-04-01 | 김광호 | Wafer Cleaner |
JP3278590B2 (en) * | 1996-08-23 | 2002-04-30 | 株式会社東芝 | Ultrasonic cleaning device and ultrasonic cleaning method |
EP0837493B8 (en) * | 1996-10-21 | 2007-11-07 | Ebara Corporation | Cleaning apparatus |
KR19980056129A (en) * | 1996-12-28 | 1998-09-25 | 김광호 | Substrate Edge Polishing Device |
JP3290910B2 (en) * | 1997-02-19 | 2002-06-10 | 東京エレクトロン株式会社 | Cleaning equipment |
US6079073A (en) * | 1997-04-01 | 2000-06-27 | Ebara Corporation | Washing installation including plural washers |
JPH10321572A (en) * | 1997-05-15 | 1998-12-04 | Toshiba Corp | Both-surface cleaning apparatus for semiconductor wafer and polishing method for semiconductor wafer |
JP3333733B2 (en) * | 1998-02-20 | 2002-10-15 | 東京エレクトロン株式会社 | Cleaning equipment |
TW392241B (en) * | 1998-09-15 | 2000-06-01 | Worldwild Semiconductor Mfg Co | Wafer cleaning device |
-
1999
- 1999-10-14 KR KR1019990044599A patent/KR20010037210A/en active Search and Examination
-
2000
- 2000-10-13 US US09/689,839 patent/US6625836B1/en not_active Expired - Lifetime
-
2003
- 2003-08-26 US US10/647,475 patent/US20040035441A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5868866A (en) * | 1995-03-03 | 1999-02-09 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
US5976267A (en) * | 1996-12-03 | 1999-11-02 | Intel Corporation | Method and apparatus for mechanically cleaning the edges of wafers |
US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US6059891A (en) * | 1997-07-23 | 2000-05-09 | Tokyo Electron Limited | Apparatus and method for washing substrate |
US6261378B1 (en) * | 1998-03-23 | 2001-07-17 | Tokyo Electron Limited | Substrate cleaning unit and cleaning method |
US6202658B1 (en) * | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
US6643882B1 (en) * | 1999-06-17 | 2003-11-11 | Ebara Corporation | Substrate cleaning apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR20010037210A (en) | 2001-05-07 |
US6625836B1 (en) | 2003-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LG DISPLAY CO., LTD., KOREA, REPUBLIC OF Free format text: CHANGE OF NAME;ASSIGNOR:LG. PHILIPS LCD CO., LTD.;REEL/FRAME:021773/0029 Effective date: 20080304 Owner name: LG DISPLAY CO., LTD.,KOREA, REPUBLIC OF Free format text: CHANGE OF NAME;ASSIGNOR:LG. PHILIPS LCD CO., LTD.;REEL/FRAME:021773/0029 Effective date: 20080304 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |