US20040026770A1 - Power source circuit device - Google Patents
Power source circuit device Download PDFInfo
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- US20040026770A1 US20040026770A1 US10/333,133 US33313303A US2004026770A1 US 20040026770 A1 US20040026770 A1 US 20040026770A1 US 33313303 A US33313303 A US 33313303A US 2004026770 A1 US2004026770 A1 US 2004026770A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- This invention relates to a power-supply circuit device, specifically, to a power-supply circuit device using an IC packaging improved in the shape of leads led out from a main packaging body.
- IC integrated circuit packaging in which an IC chip and leads (lead pins) are connected by wire bonding or the like and packaged in a main packaging body made of a resin has been employed.
- FIGS. 2 (A)- 2 (C) show, as an example, a conventional IC packaging with five lead pins.
- FIG. 2(A) is a top view
- FIG. 2(B) is a sectional view along line B-B of FIG. 2(A)
- FIG. 2(C) is a side view viewed from the arrow direction shown in FIG. 2(B).
- a monolithic IC a composite device or the like, which includes a power MOSFET (metal-oxide-semiconductor field effect transistor) 11 , because an IC 12 is mounted on the power MOSFET 11 , five lead pins with even pin-pitch intervals (d 3 ) are generally used. As shown in FIG. 2(A), on one side wall of this main packaging body 13 , five lead pins 14 are provided.
- MOSFET metal-oxide-semiconductor field effect transistor
- a third pin 14 c at the center is connected to a drain terminal of the MOSFET 11
- a fifth pin 14 e is connected to a source terminal of the MOSFET
- a first pin 14 a , a second pin 14 b , and a fourth pin 14 d are connected to corresponding control terminals of the IC 12 .
- the third pin 14 c and fifth pin 14 e are used so that the lead pins 14 are not adjacent.
- FIG. 2(B) shows a forming of this packaging.
- the first pin 14 a , third pin 14 c and fifth pin 14 e are bent upward, whereby separation distances from the adjacent second pin 14 b and the fourth pin 14 d are increased (see FIG. 2(C)).
- This method is used when an IC packaging having such a structure is mounted on a circuit board surface by soldering so as to suppress occurrence of a short circuit between adjacent lead pins and occurrence of solder bridging when an IC packaging is solder-jointed on a printed circuit board.
- lead pins are arranged at even intervals (d 3 ), and the back surface of an internal device is connected to the central pin.
- a drain electrode on its back surface is directly fixed by a conductive adhesive.
- Conventional power MOSFET packaging structures are of a three-pin structure and have sufficient separation distances between a terminal (central terminal), to which the drain receiving a high voltage is connected, and other adjacent terminals.
- a composite device or the like which includes a power MOSFET as described above, because the IC is mounted on the power MOSFET, five lead pins with even intervals are generally used.
- the center third pin is connected to the drain electrode of the power MOSFET. Therefore, when a power MOSFET having a high withstand voltage, such as 800V, is mounted, sufficient separation distances between the central third pin and other adjacent pins cannot be secured with the conventional lead pin structure that includes lead pins separated by even intervals. Namely, when an IC packaging of such a structure is mounted on a circuit board surface by soldering, if the separation distances between the third pin receiving a high voltage and adjacent second and fourth pins are small, a short circuit due to dusts or the like easily occurs. Furthermore, when an IC packaging is solder-jointed on a printed circuit board, solder bridging easily occurs since solders spread wider than the distances between lead pins.
- the separation distances need to be 1.9 mm.
- the separation distances are about 1.7 mm, safety standards may not be satisfied even with the forming of bending lead pins in the up-and-down direction.
- the separation distances cannot be sufficiently secured.
- header 14 h part which forms an integral part with the third pin and connected to the drain electrode receiving a voltage as high as 800V, is configured to exposed, product handling is not safe.
- the invention provides a power-supply circuit device that includes a MOSFET, a packaging sealing the MOSFET therein, and a plurality of lead pins led out from a side wall of the main body of this packaging.
- the drain terminal of the MOSFET is connected to the central lead pin of the plurality of lead pins.
- the packaging has a full-mold structure.
- an IC is mounted on the MOSFET.
- the invention provides a power-supply circuit device that includes-a MOSFET, a packaging sealing the MOSFET therein, and a plurality of lead pins led out from a side wall of the main body of this packaging.
- the drain terminal of the MOSFET is connected to the central lead pin of the plurality of lead pins.
- proper separation distances are obtained by making the intervals between the central lead pin of a high voltage and its adjacent lead pins greater than the intervals between the other lead pins.
- the lead pins of the lowest voltage of the plurality of lead pins are bent to a lower position, the central lead pin is bent to an upper position, and the other lead pins are bent to a middle position between the upper position and the lower position. This structure assures proper separation distances between the central lead pin of the high voltage and the lead pin of the low voltage.
- the packaging has a full-mold structure.
- an IC is mounted on the MOSFET.
- the invention provides a power-supply circuit device that includes a MOSFET, a packaging sealing the MOSFET therein, and five lead pins led out from a side wall of a main body of the packaging.
- the drain terminal of the MOSFET is connected to a third lead pin located at the center.
- proper separation distances between the third lead pin and adjacent second and fourth lead pins receiving a low voltage are obtained by making intervals between the third lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between the other lead pins.
- intervals between the third lead pin and the second and fourth lend pins is greater than the intervals between the first and second lead pins and the fourth and fifth lead pins.
- the packaging has a full-mold structure.
- an IC is mounted on the MOSFET.
- the frame on the back surface of the packaging which is formed in the same process step as the third pin, is not exposed. Therefore, the packaging can be safely handled even when the high voltage is applied to the drain terminal.
- FIG. 1(A) is a top view for explaining a power-supply circuit device of this invention
- FIG. 1(B) is a sectional view along A-A line of FIG. 1(A)
- FIG. 1(C) is a side view viewed from the arrow direction shown in FIG. 1(B).
- FIG. 2(A) is a top view for explaining a conventional power-supply circuit device
- FIG. 2(B) is a sectional view along the B-B line of FIG. 2(A)
- FIG. 2(C) is a side view viewed from the arrow direction shown in FIG. 2(B).
- FIGS. 1 (A)- 1 (B) An embodiment of this invention will be described in detail with reference to FIGS. 1 (A)- 1 (B) by taking a packaging with five lead pins as an example.
- FIG. 1(A) is a top view
- FIG. 1(B) is a sectional view along A-A line of FIG. 1(A)
- FIG. 1(C) is a side view viewed from the arrow direction shown in FIG. 1(B).
- a power-supply circuit device of this invention includes a MOSFET 1 , an IC 2 , and a packaging 3 , and five lead pins 4 .
- the MOSFET 1 contains a large number of MOSFET cells. Its back surface is a drain electrode, which is fixed by a conductive adhesive to a header 4 h that is formed as an integral unit with the third pin 4 c (see FIG. 1(B)).
- the IC 2 is mounted on the MOSFET 1 and connected to a source electrode and the drain electrode of the MOSFET 1 . Furthermore, respective control terminals are connected to a first pin 4 a , a second pin 4 b , and a fourth pin 4 d (see FIG. 1(B)).
- the packaging 3 is formed by sealing the MOSFET 1 and IC 2 with an insulating resin through transfer molding or the like. Since the packaging 3 is of a full-mold structure, the back surface of the header 4 h of the leads, to which the drain electrode of the MOSFET 1 is fixed, is covered by the resin and the header 4 h , to which a high voltage is applied, is not exposed. Therefore, handling of such a device is safe.
- the five lead pins 4 are led out from a side wall of the main packaging body 3 .
- a first pin 4 a , a second pin 4 b , a third pin 4 c , a fourth pin 4 d , and a fifth pin 4 e are provided in this order from one end.
- the third pin 4 c located at the center is formed as an integral unit with the header 4 h , and the drain electrode of the MOSFET 1 is connected to the header 4 .
- the third pin 4 c is a drain terminal
- the fifth pin 4 e is a source terminal.
- the first pin 4 a , second pin 4 b and fourth pin 4 d are control terminals of the IC 2 .
- intervals (d 2 ) between the third pin 4 c of the highest voltage and its adjacent second and fourth pins 4 b , 4 d are secured by the separation distances satisfying safety standards because the intervals are wider than the interval d 1 between the first pin 4 a and second pin 4 b and the interval d 1 between the fourth pin 4 d and fifth pin 4 e .
- the intervals d 2 between the third pin 4 c and second pin 4 b and between the third pin 4 c and fourth pin 4 d are about 2.54 mm
- the intervals d 1 between the first pin 4 a and second pin 4 b and between the fourth pin 4 d and fifth pin 4 e are about 0.5 mm.
- a safe separation distance for an operating voltage of 700V is about 1.9 mm, and it is about 2.1 mm for 800V.
- the intervals between the third pin 4 c of the high voltage and the second and fourth pins 4 b , 4 d are sufficient.
- the lead pins 4 led out from the packaging 3 are formed by bending the pins along the up-and-down direction, i.e., the vertical direction perpendicular to the header 4 h , into three positions, i.e., an upper position, a middle position and a lower position.
- the second pin 4 b and fourth pin 4 d are at the lower position without bending.
- the third pin 4 c is bent to the highest level to be at the upper position.
- the first pin 4 a and fifth pin 4 e are formed between the upper position and lower position to be at the middle position.
- the interval h 1 between the lower position and the middle position is about 2.3 mm
- the interval h 2 between the middle position and the upper position is about 2.8 mm.
- the distance between the tip portions of the lead pins 4 for soldering can be further expanded in the up-and-down directions to a desirable distance.
- a feature of this invention is the arrangement of the lead pins 4 .
- the separation distances between the third pin 4 c and the adjacent second and fourth pins 4 b , 4 d can also be increased in the vertical direction with respect to the header 4 h.
- the separation distances are expanded in the vertical direction as well, by forming the third pin 4 c of the highest voltage into the upper position and the adjacent second and fourth pins 4 b , 4 d into the lower position. This prevents the short circuits, and thus a safe packaging is realized.
- the packaging is of a full-mold structure, the back surface of the header 4 h , to which the drain electrode receiving the high voltage is fixed, is not exposed. Therefore, product handling is safe and easy.
- the separation distances is secured in the horizontal direction with respect to the header. Furthermore, by forming the third pin into the upper position, the first and fifth pins into the middle position, and the second and fourth pins into the lower position, the lead pins are made apart in the vertical direction with respect to the header as well. Thus, the separation distances between the third pin and the adjacent second and fourth pins can further be expanded. Expanding the separation distances prevents the short circuits due solder bridging and dusts on the printed wiring board.
- the separation distances of 2.1 mm is necessary with an application of 800V.
- the separation distance of about 1.7 mm is provided in the conventional device with five pins arranged at even intervals, the distances are not adequate for a safe operation.
- the intervals between the third pin and the adjacent second and fourth pins can be expanded to 2.54 mm.
- a distance as large as 5.8 mm can be secured between the upper position and the lower position.
- the distance between the tip portions of the lead pins can be further expanded depending on the angles of the forming. Therefore, the separation distances for a safe operation is secured.
- the packaging is of a full-mold structure, the back surface of the header 4 h , to which the drain electrode receiving the high voltage is fixed, is not exposed. Therefore, product handling is safe and easy.
Abstract
Description
- This invention relates to a power-supply circuit device, specifically, to a power-supply circuit device using an IC packaging improved in the shape of leads led out from a main packaging body.
- As widely known, IC (integrated circuit) packaging in which an IC chip and leads (lead pins) are connected by wire bonding or the like and packaged in a main packaging body made of a resin has been employed.
- FIGS.2(A)-2(C) show, as an example, a conventional IC packaging with five lead pins. FIG. 2(A) is a top view, FIG. 2(B) is a sectional view along line B-B of FIG. 2(A), and FIG. 2(C) is a side view viewed from the arrow direction shown in FIG. 2(B).
- In a monolithic IC, a composite device or the like, which includes a power MOSFET (metal-oxide-semiconductor field effect transistor)11, because an
IC 12 is mounted on thepower MOSFET 11, five lead pins with even pin-pitch intervals (d3) are generally used. As shown in FIG. 2(A), on one side wall of thismain packaging body 13, fivelead pins 14 are provided. In this case, athird pin 14 c at the center is connected to a drain terminal of theMOSFET 11, afifth pin 14 e is connected to a source terminal of the MOSFET, and afirst pin 14 a, asecond pin 14 b, and afourth pin 14 d are connected to corresponding control terminals of theIC 12. Normally, since a high voltage is applied to the drain terminal of theMOSFET 11 and the source terminal is grounded, the voltage difference between the terminals is extremely large. Therefore, thethird pin 14 c andfifth pin 14 e are used so that thelead pins 14 are not adjacent. - FIG. 2(B) shows a forming of this packaging. As shown in the drawing, the
first pin 14 a,third pin 14 c andfifth pin 14 e are bent upward, whereby separation distances from the adjacentsecond pin 14 b and thefourth pin 14 d are increased (see FIG. 2(C)). This method is used when an IC packaging having such a structure is mounted on a circuit board surface by soldering so as to suppress occurrence of a short circuit between adjacent lead pins and occurrence of solder bridging when an IC packaging is solder-jointed on a printed circuit board. - In general, for convenience of assembly, lead pins are arranged at even intervals (d3), and the back surface of an internal device is connected to the central pin. Namely, in a case of a power MOSFET, a drain electrode on its back surface is directly fixed by a conductive adhesive. Conventional power MOSFET packaging structures are of a three-pin structure and have sufficient separation distances between a terminal (central terminal), to which the drain receiving a high voltage is connected, and other adjacent terminals. However, in a monolithic integrated circuit, a composite device or the like, which includes a power MOSFET as described above, because the IC is mounted on the power MOSFET, five lead pins with even intervals are generally used. In this case as well, the center third pin is connected to the drain electrode of the power MOSFET. Therefore, when a power MOSFET having a high withstand voltage, such as 800V, is mounted, sufficient separation distances between the central third pin and other adjacent pins cannot be secured with the conventional lead pin structure that includes lead pins separated by even intervals. Namely, when an IC packaging of such a structure is mounted on a circuit board surface by soldering, if the separation distances between the third pin receiving a high voltage and adjacent second and fourth pins are small, a short circuit due to dusts or the like easily occurs. Furthermore, when an IC packaging is solder-jointed on a printed circuit board, solder bridging easily occurs since solders spread wider than the distances between lead pins. For example, if the operating voltage is 700V, the separation distances need to be 1.9 mm. Thus, in the conventional structure, if the separation distances are about 1.7 mm, safety standards may not be satisfied even with the forming of bending lead pins in the up-and-down direction. In short, in the conventional lead pin structure, the separation distances cannot be sufficiently secured.
- Furthermore, in the conventional packaging, since a
header 14 h part, which forms an integral part with the third pin and connected to the drain electrode receiving a voltage as high as 800V, is configured to exposed, product handling is not safe. - This invention is directed to solving above problems. First, the invention provides a power-supply circuit device that includes a MOSFET, a packaging sealing the MOSFET therein, and a plurality of lead pins led out from a side wall of the main body of this packaging. The drain terminal of the MOSFET is connected to the central lead pin of the plurality of lead pins. In this configuration, proper separation distances are obtained by making the intervals between the central lead pin of a high voltage and its adjacent lead pins greater than the intervals between the other lead pins.
- In addition, the packaging has a full-mold structure.
- In addition, an IC is mounted on the MOSFET.
- Second, the invention provides a power-supply circuit device that includes-a MOSFET, a packaging sealing the MOSFET therein, and a plurality of lead pins led out from a side wall of the main body of this packaging. The drain terminal of the MOSFET is connected to the central lead pin of the plurality of lead pins. In this configuration, proper separation distances are obtained by making the intervals between the central lead pin of a high voltage and its adjacent lead pins greater than the intervals between the other lead pins. Furthermore, the lead pins of the lowest voltage of the plurality of lead pins are bent to a lower position, the central lead pin is bent to an upper position, and the other lead pins are bent to a middle position between the upper position and the lower position. This structure assures proper separation distances between the central lead pin of the high voltage and the lead pin of the low voltage.
- In addition, the packaging has a full-mold structure.
- In addition, an IC is mounted on the MOSFET.
- Third, the invention provides a power-supply circuit device that includes a MOSFET, a packaging sealing the MOSFET therein, and five lead pins led out from a side wall of a main body of the packaging. The drain terminal of the MOSFET is connected to a third lead pin located at the center. In this configuration, proper separation distances between the third lead pin and adjacent second and fourth lead pins receiving a low voltage are obtained by making intervals between the third lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between the other lead pins.
- In addition, the intervals between the third lead pin and the second and fourth lend pins is greater than the intervals between the first and second lead pins and the fourth and fifth lead pins.
- In addition, by bending the second and fourth lead pins into a lower position, and the third lead pin, into an upper position, and the first and fifth lead pins, into a middle position between the upper position and lower position, desirable separation distances are provided between the third lead pin and the second and fourth lead pins.
- In addition, the packaging has a full-mold structure.
- Furthermore, an IC is mounted on the MOSFET.
- In short, by expanding the intervals between the third pin of the high voltage and its adjacent lead pins, and by forming the lead pins into three positions, i.e., an upper position, a middle position and a lower position, safe separation distances are secured.
- In addition, by creating the main packaging body of a full-mold structure, the frame on the back surface of the packaging, which is formed in the same process step as the third pin, is not exposed. Therefore, the packaging can be safely handled even when the high voltage is applied to the drain terminal.
- FIG. 1(A) is a top view for explaining a power-supply circuit device of this invention, FIG. 1(B) is a sectional view along A-A line of FIG. 1(A), and FIG. 1(C) is a side view viewed from the arrow direction shown in FIG. 1(B).
- FIG. 2(A) is a top view for explaining a conventional power-supply circuit device, FIG. 2(B) is a sectional view along the B-B line of FIG. 2(A), and FIG. 2(C) is a side view viewed from the arrow direction shown in FIG. 2(B).
- An embodiment of this invention will be described in detail with reference to FIGS.1(A)-1(B) by taking a packaging with five lead pins as an example.
- FIG. 1(A) is a top view, FIG. 1(B) is a sectional view along A-A line of FIG. 1(A), and FIG. 1(C) is a side view viewed from the arrow direction shown in FIG. 1(B).
- A power-supply circuit device of this invention includes a
MOSFET 1, anIC 2, and apackaging 3, and fivelead pins 4. - The
MOSFET 1 contains a large number of MOSFET cells. Its back surface is a drain electrode, which is fixed by a conductive adhesive to aheader 4 h that is formed as an integral unit with thethird pin 4 c (see FIG. 1(B)). - The
IC 2 is mounted on theMOSFET 1 and connected to a source electrode and the drain electrode of theMOSFET 1. Furthermore, respective control terminals are connected to afirst pin 4 a, asecond pin 4 b, and afourth pin 4 d (see FIG. 1(B)). - The
packaging 3 is formed by sealing theMOSFET 1 andIC 2 with an insulating resin through transfer molding or the like. Since thepackaging 3 is of a full-mold structure, the back surface of theheader 4 h of the leads, to which the drain electrode of theMOSFET 1 is fixed, is covered by the resin and theheader 4 h, to which a high voltage is applied, is not exposed. Therefore, handling of such a device is safe. - The five
lead pins 4 are led out from a side wall of themain packaging body 3. Herein, as illustrated, afirst pin 4 a, asecond pin 4 b, athird pin 4 c, afourth pin 4 d, and afifth pin 4 e are provided in this order from one end. Thethird pin 4 c located at the center is formed as an integral unit with theheader 4 h, and the drain electrode of theMOSFET 1 is connected to theheader 4. Thereby, thethird pin 4 c is a drain terminal, and thefifth pin 4 e is a source terminal. Thefirst pin 4 a,second pin 4 b andfourth pin 4 d are control terminals of theIC 2. The proper intervals (d2) between thethird pin 4 c of the highest voltage and its adjacent second andfourth pins first pin 4 a andsecond pin 4 b and the interval d1 between thefourth pin 4 d andfifth pin 4 e. Specifically, for example, the intervals d2 between thethird pin 4 c andsecond pin 4 b and between thethird pin 4 c andfourth pin 4 d are about 2.54 mm, and the intervals d1 between thefirst pin 4 a andsecond pin 4 b and between thefourth pin 4 d andfifth pin 4 e are about 0.5 mm. A safe separation distance for an operating voltage of 700V is about 1.9 mm, and it is about 2.1 mm for 800V. Thus, according to the structure of this invention, the intervals between thethird pin 4 c of the high voltage and the second andfourth pins - Furthermore, as shown in FIG. 1(B) and FIG. 1(C), the lead pins4 led out from the
packaging 3 are formed by bending the pins along the up-and-down direction, i.e., the vertical direction perpendicular to theheader 4 h, into three positions, i.e., an upper position, a middle position and a lower position. Herein, thesecond pin 4 b andfourth pin 4 d are at the lower position without bending. Thethird pin 4 c is bent to the highest level to be at the upper position. Thefirst pin 4 a andfifth pin 4 e are formed between the upper position and lower position to be at the middle position. Specifically, the interval h1 between the lower position and the middle position is about 2.3 mm, and the interval h2 between the middle position and the upper position is about 2.8 mm. Furthermore, depending on the angles of the forming, the distance between the tip portions of the lead pins 4 for soldering can be further expanded in the up-and-down directions to a desirable distance. - A feature of this invention is the arrangement of the lead pins4. By expanding the intervals between the
third pin 4 c of the high voltage and its adjacent second andfourth pins second pins fifth pins header 4 h can be secured. Furthermore, by forming thethird pin 4 c in the upper position, the first andfifth pins fourth pins third pin 4 c and the adjacent second andfourth pins header 4 h. - As mentioned above, even when sufficient separation distances are obtained before the forming, since solders spread on a printed circuit board when a device chip is mounted on the printed circuit board, it is preferable to secure the separation distances as large as possible for preventing short circuits due to solder bridging and dusts. That is, in addition to separating the lead pins4 in the horizontal direction by the forming, the separation distances are expanded in the vertical direction as well, by forming the
third pin 4 c of the highest voltage into the upper position and the adjacent second andfourth pins - In addition, since the packaging is of a full-mold structure, the back surface of the
header 4 h, to which the drain electrode receiving the high voltage is fixed, is not exposed. Therefore, product handling is safe and easy. - According to this invention, by expanding the intervals between the third pin of the high voltage and its adjacent lead pins so as to become wider than the intervals between other lead pins, the separation distances is secured in the horizontal direction with respect to the header. Furthermore, by forming the third pin into the upper position, the first and fifth pins into the middle position, and the second and fourth pins into the lower position, the lead pins are made apart in the vertical direction with respect to the header as well. Thus, the separation distances between the third pin and the adjacent second and fourth pins can further be expanded. Expanding the separation distances prevents the short circuits due solder bridging and dusts on the printed wiring board.
- Specifically, for example, the separation distances of 2.1 mm is necessary with an application of 800V. When the separation distance of about 1.7 mm is provided in the conventional device with five pins arranged at even intervals, the distances are not adequate for a safe operation. However, according to the structure of this invention, the intervals between the third pin and the adjacent second and fourth pins can be expanded to 2.54 mm. Furthermore, a distance as large as 5.8 mm can be secured between the upper position and the lower position. In addition, the distance between the tip portions of the lead pins can be further expanded depending on the angles of the forming. Therefore, the separation distances for a safe operation is secured.
- In addition, since the packaging is of a full-mold structure, the back surface of the
header 4 h, to which the drain electrode receiving the high voltage is fixed, is not exposed. Therefore, product handling is safe and easy.
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-149636 | 2001-05-18 | ||
JP2001149636 | 2001-05-18 | ||
PCT/JP2002/004774 WO2002095824A1 (en) | 2001-05-18 | 2002-05-17 | Power source circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20040026770A1 true US20040026770A1 (en) | 2004-02-12 |
US6861732B2 US6861732B2 (en) | 2005-03-01 |
Family
ID=18994775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/333,133 Expired - Lifetime US6861732B2 (en) | 2001-05-18 | 2002-05-17 | Power source circuit device |
Country Status (5)
Country | Link |
---|---|
US (1) | US6861732B2 (en) |
JP (1) | JP4118143B2 (en) |
KR (1) | KR100612165B1 (en) |
CN (1) | CN1312767C (en) |
WO (1) | WO2002095824A1 (en) |
Cited By (9)
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US20060004680A1 (en) * | 1998-12-18 | 2006-01-05 | Robarts James O | Contextual responses based on automated learning techniques |
US20090125490A1 (en) * | 2004-08-04 | 2009-05-14 | International Business Machines Corporation | System for locating documents a user has previously accessed |
US20090125513A1 (en) * | 2004-08-04 | 2009-05-14 | International Business Machines Corporation | System for remotely searching a local user index |
US20090212284A1 (en) * | 2008-02-22 | 2009-08-27 | Infineon Technologies Ag | Electronic device and manufacturing thereof |
CN104779234A (en) * | 2014-01-10 | 2015-07-15 | 万国半导体股份有限公司 | Semiconductor device for inhibiting creepage phenomenon and preparation method thereof |
US9236330B2 (en) | 2010-11-29 | 2016-01-12 | Toyota Jidosha Kabushiki Kaisha | Power module |
US20180041459A1 (en) * | 2004-03-31 | 2018-02-08 | Google Inc. | Email conversation management system |
US20180358287A1 (en) * | 2017-06-13 | 2018-12-13 | Infineon Technologies Ag | Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe |
CN112086409A (en) * | 2020-09-02 | 2020-12-15 | 东莞市柏尔电子科技有限公司 | Plastic package type triode and manufacturing process |
Families Citing this family (2)
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CN100464405C (en) * | 2005-10-31 | 2009-02-25 | 台达电子工业股份有限公司 | Method and structure for packaging power module |
US9035437B2 (en) * | 2013-03-12 | 2015-05-19 | Infineon Technologies Austria Ag | Packaged device comprising non-integer lead pitches and method of manufacturing the same |
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- 2002-05-17 KR KR1020037000701A patent/KR100612165B1/en not_active IP Right Cessation
- 2002-05-17 WO PCT/JP2002/004774 patent/WO2002095824A1/en active Application Filing
- 2002-05-17 CN CNB028016270A patent/CN1312767C/en not_active Expired - Fee Related
- 2002-05-17 JP JP2002592190A patent/JP4118143B2/en not_active Expired - Fee Related
- 2002-05-17 US US10/333,133 patent/US6861732B2/en not_active Expired - Lifetime
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US5814884A (en) * | 1996-10-24 | 1998-09-29 | International Rectifier Corporation | Commonly housed diverse semiconductor die |
US5814884C1 (en) * | 1996-10-24 | 2002-01-29 | Int Rectifier Corp | Commonly housed diverse semiconductor die |
US6459147B1 (en) * | 2000-03-27 | 2002-10-01 | Amkor Technology, Inc. | Attaching semiconductor dies to substrates with conductive straps |
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US20060004680A1 (en) * | 1998-12-18 | 2006-01-05 | Robarts James O | Contextual responses based on automated learning techniques |
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US8253225B2 (en) | 2008-02-22 | 2012-08-28 | Infineon Technologies Ag | Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof |
DE102009009874B4 (en) * | 2008-02-22 | 2014-05-15 | Infineon Technologies Ag | Electronic component with a semiconductor chip and multiple leads |
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US9236330B2 (en) | 2010-11-29 | 2016-01-12 | Toyota Jidosha Kabushiki Kaisha | Power module |
CN104779234A (en) * | 2014-01-10 | 2015-07-15 | 万国半导体股份有限公司 | Semiconductor device for inhibiting creepage phenomenon and preparation method thereof |
US20180358287A1 (en) * | 2017-06-13 | 2018-12-13 | Infineon Technologies Ag | Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe |
US11107754B2 (en) * | 2017-06-13 | 2021-08-31 | Infineon Technologies Ag | Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe |
CN112086409A (en) * | 2020-09-02 | 2020-12-15 | 东莞市柏尔电子科技有限公司 | Plastic package type triode and manufacturing process |
Also Published As
Publication number | Publication date |
---|---|
KR20030060870A (en) | 2003-07-16 |
WO2002095824A1 (en) | 2002-11-28 |
CN1312767C (en) | 2007-04-25 |
US6861732B2 (en) | 2005-03-01 |
JP4118143B2 (en) | 2008-07-16 |
JPWO2002095824A1 (en) | 2004-09-09 |
KR100612165B1 (en) | 2006-08-14 |
CN1462476A (en) | 2003-12-17 |
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