US20040007394A1 - Cutter and method of manufacture thereof - Google Patents
Cutter and method of manufacture thereof Download PDFInfo
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- US20040007394A1 US20040007394A1 US10/064,817 US6481702A US2004007394A1 US 20040007394 A1 US20040007394 A1 US 20040007394A1 US 6481702 A US6481702 A US 6481702A US 2004007394 A1 US2004007394 A1 US 2004007394A1
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- substrate
- substrate component
- cutter
- components
- component
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- E—FIXED CONSTRUCTIONS
- E21—EARTH DRILLING; MINING
- E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
Definitions
- This invention relates to a cutter, and to a method of manufacture thereof.
- the invention relates, in particular, to a cutter suitable for use on a drill bit for the formation of subterranean well bores. It will be appreciated that the cutter may alternatively be used in other applications.
- One form of drill bit for use in the formation of subterranean wellbores comprises a bit body having a first end provided with a plurality of generally radially extending upstanding blades and a second end adapted to be secured to a drill string.
- Each of the blades carries a plurality of cutters.
- the cutters typically each comprise a tungsten carbide or other metallic substrate to which is bonded a layer of a superhard material, for example polycrystalline diamond.
- the substrate may be bonded directly to the bit body, or alternately may be bonded to a relatively long substrate which, in turn, is secured to the bit body.
- cutters are mounted upon rotatable cones mounted upon a bit body.
- Each cutter is typically manufactured by placing a sintered tungsten carbide substrate and diamond crystals into a container with a suitable binder catalyst material, and subjecting the container to high pressure, high temperature conditions such that the diamond crystals bond to one another and to the substrate.
- a number of different designs of cutter are known, the different designs arising from, for example, the use of substrates of different shapes.
- the substrate includes an upstanding peripheral wall extending around most, but not all of the circumference of the substrate.
- a cutter manufactured using a substrate of this shape includes a polycrystalline diamond table which only extends to the periphery of the cutter at the region where the peripheral wall is absent as shown in FIGS. 1 and 2. It has been found that in cutters of this type there is a tendency for the polycrystalline diamond table to crack. This is thought to be as a result of hoop stresses.
- a number of cutter designs provide the cutter with two or more cutting surfaces. This is achieved, in some designs, by providing two separate substrates, a first diamond layer located between the substrates and a second, isolated diamond layer located upon the second substrate.
- This type of cutter is shown in U.S. Pat. No. 5,722,499 and U.S. Pat. No. 5,667,028, both incorporated by reference herein for all they disclose.
- Another design includes separate diamond layers formed by providing grooves in the outer periphery of the substrate and introducing diamond crystals into the grooves prior to undertaking the high temperature high pressure process. Cutters of this type are illustrated in U.S. Pat. No. 5,979,578 and U.S. Pat. No. 5,667,028, both incorporated by reference herein for all they disclose. It will be appreciated that, in these arrangements, two or more independent, isolated regions of polycrystalline diamond are formed.
- the present invention provides a cutter with a reduced tendency for the polycrystalline diamond table to crack, and a method for manufacture of such a cutter.
- a method of manufacturing a cutter comprising assembling a first substrate component, a second substrate component and diamond crystals into a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the diamond crystals to bond to one another and to the first and second substrate components to form a cutter having a single body of polycrystalline diamond.
- the first and second substrate components may be arranged to engage one another, or alternatively may be separated from one another by at least some of the diamond crystals prior to subjecting the assembly to high temperature, high pressure conditions.
- the first and second substrate components are preferably of sintered tungsten carbide form. However, this need not be the case and other materials could be used.
- the second substrate component could be of a STELLITE (R) material.
- a binder catalyst material for example cobalt, may be included in the assembly. Although cobalt is the preferred binder catalyst material, other iron group elements may be used, if desired.
- the binder catalyst material may be included in either of the first and second substrate components, or mixed with the diamond powder, or provided in any combination of these locations.
- a method of forming an assembly by locating a powdered substrate component material, diamond crystals and a first substrate component within a container in a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the powdered substrate component material to form a second substrate component, and the diamond crystals to bond to one another and to the first and second substrate components to form a cutter having a single body of polycrystalline diamond.
- the powdered substrate component material is preferably powdered tungsten carbide.
- a binder catalyst material may be provided, for example mixed with the powdered substrate component material.
- the configuration of the powdered substrate component material within the assembly may be such as to result in the formation of at least one additional substrate component.
- the second and/or additional substrate components may be of annular or part-annular form.
- the invention also relates to a cutter manufactured using either of the methods described hereinbefore.
- FIG. 1 is a diagrammatic sectional view of a prior art cutter.
- FIG. 2 is an end view of the prior art cutter of FIG. 1.
- FIG. 3 is a perspective view of a drill bit.
- FIG. 4 is a perspective view of an alternative drill bit.
- FIGS. 5 and 6 are views similar to FIGS. 1 and 2 showing a cutter in accordance with an embodiment of the invention.
- FIG. 7 is a diagrammatic view illustrating part of the manufacturing operation.
- FIGS. 8 to 25 are cross-sectional and side views of other embodiments.
- FIG. 26 is a view similar to FIG. 7 illustrating an alternative manufacturing technique.
- FIG. 27 is a view of one orientation of the notches on the second substrate components.
- FIG. 28 is a view of a second orientation of the notches on the second substrate components.
- FIG. 29 is a partial view of an enlargement of the second substrate components showing a configuration of a notch.
- the drill bit for use in the formation of subterranean wellbores.
- the drill bit comprises a bit body 10 having a first end 12 upon which a plurality of blades 14 are provided, the blades 14 upstanding from the first end 12 and extending in generally radial directions.
- the bit body 10 further includes a second end 16 adapted to permit the drill bit to be secured to the remainder of a drill string whereby the drill bit can be driven for rotation about its longitudinal axis 18 .
- Each of the blades 14 is provided with a plurality of cutters 20 , each of the cutters 20 being arranged to engage the formation being drilled using the drill bit, in use, such that the combination of rotation of the drill bit and the application of a load, in a generally axial direction, upon the drill bit causes the cutters to scrape the material from the formation.
- the drill bit further includes a plurality of nozzles 22 supplied with fluid and arranged such that, in use, fluid supplied through the nozzles 22 serves to clean the cutters and to carry the material removed by the cutters away from the drill bit.
- the drill bit includes a gauge region 24 .
- the gauge region 24 is provided with a plurality of inserts 26 intended to enhance the ability of the drill bit to withstand wear of the gauge region.
- FIG. 4 illustrates an alternative type of drill bit.
- the bit body 110 has an upper portion 116 which form legs 124 shaped to define mounting regions which in turn carry rotatable rollers 128 of generally conical form.
- Each of the rollers 128 is provided with a plurality of cutters 120 .
- the drill bit of FIG. 4 is rotated about its axis 118 .
- the rollers 128 rotate about their own axes, this movement causing the cutters 120 to engage and scrape against the formation being drilled to remove material therefrom which, as in the arrangement illustrated in FIG. 3, is removed by the application of drilling fluid.
- gauge inserts 126 are also provided.
- Cutters 20 , 120 may have various shapes and sizes as shown. However, for ease of understanding, the references and explanations for cutters 20 in this specification apply equally to cutters 120 , as both types may be useful in both types of drill bits shown. The cutters 20 , 120 may also be useful in numerous other type of down hole tools and other devices employing highly wear resistant cutting elements.
- FIGS. 5 and 6 illustrate one of the cutters of the drill bits shown in FIGS. 3 and 4.
- the cutter 20 shown in FIG. 5 comprises a first tungsten carbide substrate component 30 of generally cylindrical form, a second substrate component 32 , also of tungsten carbide, and of part-annular form as shown in FIG. 6, and a polycrystalline diamond table 34 .
- the cutter 20 is manufactured by placing the second substrate component 32 into part of a suitable container 36 , positioning powdered diamond crystals 34 a in the region in which the table 34 of polycrystalline diamond is to be formed, and positioning the first substrate component 30 onto the second component 32 and diamond crystals 34 a .
- the container 36 is then closed and sealed, as shown in FIG.
- the assembly shown in FIG. 7 may further include a quantity of a suitable binder catalyst material.
- the binder catalyst material takes the form of cobalt.
- any iron group element may be used as the binder catalyst material.
- the binder catalyst material may be introduced into the assembly by mixing the binder catalyst material with the diamond crystals 34 a , or by incorporating the binder catalyst material into one or other, or both of the first and second substrate components 30 , 32 , or by including the binder catalyst material in the material of the container 36 , or by a combination of these techniques. Where the binder catalyst material is included in the substrate components, it will be appreciated that it infiltrates into the diamond material during the high pressure high temperature operation.
- the container 36 is removed and the cutter subjected to a suitable machining operation, if desired.
- the cutter 20 manufactured using this technique and as shown in FIGS. 5 and 6 is similar in appearance to the known cutter shown in FIGS. 1 and 2.
- the use of the two-part substrate results in the application of significantly lower magnitude hoop stressing to the polycrystalline diamond table, the separate second substrate component 32 being more compliant than arrangements in which a single substrate is used, and as a result the risk of cracking of the polycrystalline diamond table is significantly reduced.
- FIGS. 8 to 19 A number of possible cutter designs are shown in FIGS. 8 to 19 .
- the first and second substrate components 30 , 32 are spaced apart from one another by a part of the polycrystalline diamond table 34 .
- a cutter of this type may be produced simply by positioning the second substrate component 32 within one part of the container 36 , introducing the diamond crystals 34 a into the container 36 , the diamond crystals 34 a extending over the second substrate component 32 , and then introducing the first substrate component 30 so that diamond crystals 34 a are located between the substrate components 30 , 32 .
- the application of high pressure, high temperature conditions to such an assembly will result in the production of a cutter 20 of the type shown in FIGS. 8 and 9.
- the prior cutters shown in FIGS. 1 and 2 have an overall impact toughness averaging about 30 joules. Cutters 20 manufactured as described, with the second substrate component 32 as shown in FIGS. 5, 6, 7 and 9 have demonstrated a 30% (to about 40 joules) improvement in impact toughness and accompanying reduction in cracking of the diamond table compared to the prior cutters shown in FIGS. 1 and 2. A still further improvement is obtained when notches 33 are pre-formed in the second substrate component 32 , as shown in FIGS. 27 - 29 .
- the notches 33 allow the second substrate component 32 to crack in a controlled manner during processing, allowing additional relief of the stresses in the diamond table 34 . Providing these notches 33 for additional stress relief has resulted in an additional 25% (to about 50 joules) improvement in impact toughness over the cutters 20 made with un-notched second substrate components 32 . Stated differently, the second substrate component 32 with the notches 33 have a 60% improvement in impact toughness over the prior cutters shown in FIGS. 1 and 2.
- the notches 33 are formed into the second substrate component 32 either during its manufacture or the notches 33 are formed later by removing a portion of the material of the second substrate component 32 .
- the notches may be regularly spaced, as shown in FIGS. 28 and 29 or they may be irregularly spaced according to the size and orientation of the second substrate component 32 .
- the notches may be shaped with rounded ends 35 as shown in FIG. 29, or may have a variety of end configurations.
- the exact orientation of the notches is not particularly important, provided they provide a predictable path for the expansion of the second substrate component 32 during processing. This expansion often, but not necessarily always, leads to the aforementioned crack in the second substrate component 32 of the finished cutter 20 from the base of the notch 33 to the edge.
- the method for manufacturing the cutters 20 comprising a first substrate component 30 and a second substrate component 32 for this embodiment of the invention is providing one or more notches in the second substrate component 32 and assembling the first substrate component 30 and the second substrate component 32 and diamond crystals 34 a into a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the diamond crystals 34 a to bond to one another and to the first and second substrate components 30 , 32 to form a cutter 20 having a single body of polycrystalline diamond 34 .
- FIGS. 10 and 11 illustrate a cutter 20 which is similar to that of FIGS. 8 and 9 but in which an additional, third substrate component 38 is located between the first and second substrate components 30 , 32 .
- the polycrystalline diamond table 34 extends between the first and third substrate components 30 , 38 and between the third and second substrate components 38 , 32 .
- the manufacturing process used in the formation of a cutter 20 of this type simply requires the introduction of the second substrate component 32 into the container 36 , the application of diamond material into the container 36 covering the second substrate component 32 , the introduction of the third substrate component 38 into the container 36 , the application of more diamond material to cover the third substrate component 38 , and finally the introduction of the first substrate component 30 .
- FIGS. 12 and 13 The arrangement shown in FIGS. 12 and 13 is similar to that of FIGS. 10 and 11 but includes a fourth substrate component 42 .
- a further distinction between the arrangement of FIGS. 12 and 13 and that of FIGS. 10 and 11 is that no diamond material is provided between the various substrate components. It will be noted from FIGS. 11 and 13 that in each of these arrangements, the angular extent of the various part-annular substrate components are not equal resulting in the formation of steps in the polycrystalline diamond table 34 . This need not be the case.
- the arrangement of FIGS. 10 and 11 further differs from that of FIGS. 12 and 13 in that, as shown in FIG. 12, the various part-annular substrate components are of non-equal radial extent whereas in the arrangement shown in FIG. 10, the second and third substrate components 32 , 38 are of equal radial extent.
- the second and fourth substrate components, 32 , 42 are of equal radial extent and equal angular extent, the third substrate component 38 being of smaller radial and angular extent with the result that the polycrystalline diamond table 34 includes a radially extending projection 34 b around part of its periphery.
- FIGS. 16 and 17 The arrangement shown in FIGS. 16 and 17 is similar to that of FIG. 8, but differs therefrom in that the second substrate component 32 is not located at the surface of the cutter, but rather is buried within the polycrystalline diamond table 34 .
- the first substrate component 30 is of generally cylindrical form having a flat surface to which the other substrate components and/or the polycrystalline diamond table 34 is bonded.
- FIGS. 18 and 19 illustrate an arrangement in which the surface of the first substrate component 30 is grooved.
- the second substrate component 32 rests directly upon the first substrate component 30 , and in other regions thereof the second substrate component 32 is spaced from the first substrate component 30 .
- the polycrystalline diamond table 34 extends between the first and second substrate components, 30 , 32 .
- the polycrystalline diamond table 34 is in the form of a single element, rather than taking the form of two or more separate components spaced apart and isolated from one another by a component of the substrate.
- cutters 20 described hereinbefore are suitable for use with drill bits of the type illustrated in FIG. 3, it will be appreciated that by appropriate selection of the shape of the cutter, similar cutters may find application in drill bits of the type illustrated in FIG. 4.
- a cutter 20 more applicable for use in a drill bit of the type illustrated in FIG. 4 is shown in FIG. 20.
- the cutter 20 shown in FIG. 20 comprises a first tungsten carbide substrate component 30 of generally cylindrical form but having a domed upper surface 50 , in the orientation illustrated.
- a second substrate component 32 of annular form is positioned upon the first substrate component 30 , the space within the second substrate component 32 containing a polycrystalline diamond table 34 .
- the shapes of the second substrate component 32 and polycrystalline diamond table 34 are such as to define a domed surface 52 . It will be appreciated that this type of cutter can be manufactured using a technique very similar to those described above.
- the cutter of FIG. 20 for example to change its shape so that the surface 52 is of, for example, generally conical form.
- Other variations include spacing the second substrate component 32 from the first substrate component 30 , as shown in FIG. 21, or including additional substrate components, as shown in FIG. 22.
- the second and/or additional substrate components may be of annular or part-annular form. Where they are of curved, part-annular, form then depending upon their circumferential extent, two or more components may be provided at the same axial position as shown in FIG. 23.
- transition layers comprising a mixture of diamond and tungsten carbide between the tungsten carbide substrate and the polycrystalline diamond table.
- Such transition layers 54 may also be incorporated into the cutters shown in FIGS. 20 to 23 .
- the second substrate component may be positioned upon the transition layer 54 or layers, for example as shown in FIG. 24, or the transition layer 54 or layers may be at least partially encircled by the second substrate component, for example as shown in FIG. 25.
- the second and additional substrate components are of pre-sintered tungsten carbide form. It will be understood the other materials may be used, if desired. Where pre-sintered tungsten carbide substrate components are used, during the high pressure high temperature sintering operation the diamond will typically be compressed to a greater extent than the pre-sintered substrate components. This may result in, for example, a significant machining operation being required to produce a cutter having a flat or smooth face.
- this effect may be reduced by modifying the manufacturing technique so that, instead of locating a pre-sintered second substrate component 32 with the container 36 , and where appropriate instead of using pre-sintered third and fourth substrate components 38 , 42 , etc., a quantity of powdered tungsten carbide 56 is positioned in the container 36 , as shown in FIG. 26, in the areas in which the second substrate component 32 , and where applicable the third and fourth substrate components 38 , 42 , etc., are required.
- a binder catalyst material typically cobalt
- the binder catalyst material may be mixed with the diamond powder, the tungsten carbide powder, the pre-sintered first substrate component 30 , or in any combination of these locations.
- the tungsten carbide forming the second substrate component 32 and, where appropriate, the additional substrate components compresses at a rate similar to the powdered diamond with the result that a short, less complex machining operation may be required to produce a cutter with a generally flat or smooth surface.
- any of the secondary substrate components 32 , 38 , 42 which are performed may be provided with notches 33 to further improve impact toughness.
Abstract
Description
- 1. Field of the Invention
- This invention relates to a cutter, and to a method of manufacture thereof. The invention relates, in particular, to a cutter suitable for use on a drill bit for the formation of subterranean well bores. It will be appreciated that the cutter may alternatively be used in other applications.
- 2. Description of the Related Art
- One form of drill bit for use in the formation of subterranean wellbores comprises a bit body having a first end provided with a plurality of generally radially extending upstanding blades and a second end adapted to be secured to a drill string. Each of the blades carries a plurality of cutters. The cutters typically each comprise a tungsten carbide or other metallic substrate to which is bonded a layer of a superhard material, for example polycrystalline diamond. The substrate may be bonded directly to the bit body, or alternately may be bonded to a relatively long substrate which, in turn, is secured to the bit body.
- In another form of drill bit, cutters are mounted upon rotatable cones mounted upon a bit body. Each cutter is typically manufactured by placing a sintered tungsten carbide substrate and diamond crystals into a container with a suitable binder catalyst material, and subjecting the container to high pressure, high temperature conditions such that the diamond crystals bond to one another and to the substrate.
- A number of different designs of cutter are known, the different designs arising from, for example, the use of substrates of different shapes. In one example, the substrate includes an upstanding peripheral wall extending around most, but not all of the circumference of the substrate. A cutter manufactured using a substrate of this shape includes a polycrystalline diamond table which only extends to the periphery of the cutter at the region where the peripheral wall is absent as shown in FIGS. 1 and 2. It has been found that in cutters of this type there is a tendency for the polycrystalline diamond table to crack. This is thought to be as a result of hoop stresses.
- A number of cutter designs provide the cutter with two or more cutting surfaces. This is achieved, in some designs, by providing two separate substrates, a first diamond layer located between the substrates and a second, isolated diamond layer located upon the second substrate. This type of cutter is shown in U.S. Pat. No. 5,722,499 and U.S. Pat. No. 5,667,028, both incorporated by reference herein for all they disclose. Another design includes separate diamond layers formed by providing grooves in the outer periphery of the substrate and introducing diamond crystals into the grooves prior to undertaking the high temperature high pressure process. Cutters of this type are illustrated in U.S. Pat. No. 5,979,578 and U.S. Pat. No. 5,667,028, both incorporated by reference herein for all they disclose. It will be appreciated that, in these arrangements, two or more independent, isolated regions of polycrystalline diamond are formed.
- The present invention provides a cutter with a reduced tendency for the polycrystalline diamond table to crack, and a method for manufacture of such a cutter.
- According to the present invention there is provided a method of manufacturing a cutter comprising assembling a first substrate component, a second substrate component and diamond crystals into a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the diamond crystals to bond to one another and to the first and second substrate components to form a cutter having a single body of polycrystalline diamond.
- The first and second substrate components may be arranged to engage one another, or alternatively may be separated from one another by at least some of the diamond crystals prior to subjecting the assembly to high temperature, high pressure conditions.
- The first and second substrate components are preferably of sintered tungsten carbide form. However, this need not be the case and other materials could be used. For example the second substrate component could be of a STELLITE (R) material. A binder catalyst material, for example cobalt, may be included in the assembly. Although cobalt is the preferred binder catalyst material, other iron group elements may be used, if desired. The binder catalyst material may be included in either of the first and second substrate components, or mixed with the diamond powder, or provided in any combination of these locations.
- Also disclosed is a cutter with a single diamond table bonded to first substrate component of circular cross-section and to a second substrate component of annular or part-annular form. At least one further substrate component, for example of annular or part annular form, may additionally be provided.
- According to another aspect of the invention there is provided a method of forming an assembly by locating a powdered substrate component material, diamond crystals and a first substrate component within a container in a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the powdered substrate component material to form a second substrate component, and the diamond crystals to bond to one another and to the first and second substrate components to form a cutter having a single body of polycrystalline diamond.
- The powdered substrate component material is preferably powdered tungsten carbide. As mentioned hereinbefore, a binder catalyst material may be provided, for example mixed with the powdered substrate component material.
- The configuration of the powdered substrate component material within the assembly may be such as to result in the formation of at least one additional substrate component. The second and/or additional substrate components may be of annular or part-annular form.
- The invention also relates to a cutter manufactured using either of the methods described hereinbefore.
- The invention will further be described, by way of example only, with reference to the accompanying drawings.
- FIG. 1 is a diagrammatic sectional view of a prior art cutter.
- FIG. 2 is an end view of the prior art cutter of FIG. 1.
- FIG. 3 is a perspective view of a drill bit.
- FIG. 4 is a perspective view of an alternative drill bit.
- FIGS. 5 and 6 are views similar to FIGS. 1 and 2 showing a cutter in accordance with an embodiment of the invention.
- FIG. 7 is a diagrammatic view illustrating part of the manufacturing operation.
- FIGS.8 to 25 are cross-sectional and side views of other embodiments.
- FIG. 26 is a view similar to FIG. 7 illustrating an alternative manufacturing technique.
- FIG. 27 is a view of one orientation of the notches on the second substrate components.
- FIG. 28 is a view of a second orientation of the notches on the second substrate components.
- FIG. 29 is a partial view of an enlargement of the second substrate components showing a configuration of a notch.
- Referring now to FIG. 3 there is shown a drill bit for use in the formation of subterranean wellbores. The drill bit comprises a
bit body 10 having afirst end 12 upon which a plurality ofblades 14 are provided, theblades 14 upstanding from thefirst end 12 and extending in generally radial directions. Thebit body 10 further includes a second end 16 adapted to permit the drill bit to be secured to the remainder of a drill string whereby the drill bit can be driven for rotation about itslongitudinal axis 18. Each of theblades 14 is provided with a plurality ofcutters 20, each of thecutters 20 being arranged to engage the formation being drilled using the drill bit, in use, such that the combination of rotation of the drill bit and the application of a load, in a generally axial direction, upon the drill bit causes the cutters to scrape the material from the formation. The drill bit further includes a plurality ofnozzles 22 supplied with fluid and arranged such that, in use, fluid supplied through thenozzles 22 serves to clean the cutters and to carry the material removed by the cutters away from the drill bit. - As is common practice with drill bits of this type, the drill bit includes a
gauge region 24. In the arrangement shown, thegauge region 24 is provided with a plurality ofinserts 26 intended to enhance the ability of the drill bit to withstand wear of the gauge region. - FIG. 4 illustrates an alternative type of drill bit. In the drill bit of FIG. 4, the
bit body 110 has anupper portion 116 which formlegs 124 shaped to define mounting regions which in turn carryrotatable rollers 128 of generally conical form. Each of therollers 128 is provided with a plurality ofcutters 120. As with the drill bit illustrated in FIG. 3, in use, the drill bit of FIG. 4 is rotated about itsaxis 118. With the drill bit of FIG. 4, such rotation causes therollers 128 to rotate about their own axes, this movement causing thecutters 120 to engage and scrape against the formation being drilled to remove material therefrom which, as in the arrangement illustrated in FIG. 3, is removed by the application of drilling fluid. Similar to the drill bit of FIG. 3, gauge inserts 126 are also provided. -
Cutters cutters 20 in this specification apply equally tocutters 120, as both types may be useful in both types of drill bits shown. Thecutters - FIGS. 5 and 6 illustrate one of the cutters of the drill bits shown in FIGS. 3 and 4. The
cutter 20 shown in FIG. 5 comprises a first tungstencarbide substrate component 30 of generally cylindrical form, asecond substrate component 32, also of tungsten carbide, and of part-annular form as shown in FIG. 6, and a polycrystalline diamond table 34. Thecutter 20 is manufactured by placing thesecond substrate component 32 into part of asuitable container 36, positioning powdered diamond crystals 34 a in the region in which the table 34 of polycrystalline diamond is to be formed, and positioning thefirst substrate component 30 onto thesecond component 32 and diamond crystals 34 a. Thecontainer 36 is then closed and sealed, as shown in FIG. 7, the assembly then being subjected to high temperature, high pressure conditions to cause the diamond crystals 34 a to bond to one another and to the first andsecond substrate components second substrate components container 36, or by a combination of these techniques. Where the binder catalyst material is included in the substrate components, it will be appreciated that it infiltrates into the diamond material during the high pressure high temperature operation. - After completion of the high temperature, high pressure sintering operation, the
container 36 is removed and the cutter subjected to a suitable machining operation, if desired. - It will be appreciated that the
cutter 20 manufactured using this technique and as shown in FIGS. 5 and 6 is similar in appearance to the known cutter shown in FIGS. 1 and 2. However, the use of the two-part substrate results in the application of significantly lower magnitude hoop stressing to the polycrystalline diamond table, the separatesecond substrate component 32 being more compliant than arrangements in which a single substrate is used, and as a result the risk of cracking of the polycrystalline diamond table is significantly reduced. - Although the technique described hereinbefore with reference to FIGS. 5, 6 and7 can be used to produce a
cutter 20 which is similar to that of FIGS. 1 and 2, the same technique may be used to manufacture a wide range of other cutter designs. A number of possible cutter designs are shown in FIGS. 8 to 19. In the arrangement illustrated in FIGS. 8 and 9, the first andsecond substrate components second substrate component 32 within one part of thecontainer 36, introducing the diamond crystals 34 a into thecontainer 36, the diamond crystals 34 a extending over thesecond substrate component 32, and then introducing thefirst substrate component 30 so that diamond crystals 34 a are located between thesubstrate components cutter 20 of the type shown in FIGS. 8 and 9. - The prior cutters shown in FIGS. 1 and 2 have an overall impact toughness averaging about 30 joules.
Cutters 20 manufactured as described, with thesecond substrate component 32 as shown in FIGS. 5, 6, 7 and 9 have demonstrated a 30% (to about 40 joules) improvement in impact toughness and accompanying reduction in cracking of the diamond table compared to the prior cutters shown in FIGS. 1 and 2. A still further improvement is obtained whennotches 33 are pre-formed in thesecond substrate component 32, as shown in FIGS. 27-29. - The
notches 33 allow thesecond substrate component 32 to crack in a controlled manner during processing, allowing additional relief of the stresses in the diamond table 34. Providing thesenotches 33 for additional stress relief has resulted in an additional 25% (to about 50 joules) improvement in impact toughness over thecutters 20 made with un-notchedsecond substrate components 32. Stated differently, thesecond substrate component 32 with thenotches 33 have a 60% improvement in impact toughness over the prior cutters shown in FIGS. 1 and 2. - The
notches 33 are formed into thesecond substrate component 32 either during its manufacture or thenotches 33 are formed later by removing a portion of the material of thesecond substrate component 32. The notches may be regularly spaced, as shown in FIGS. 28 and 29 or they may be irregularly spaced according to the size and orientation of thesecond substrate component 32. The notches may be shaped with rounded ends 35 as shown in FIG. 29, or may have a variety of end configurations. The exact orientation of the notches is not particularly important, provided they provide a predictable path for the expansion of thesecond substrate component 32 during processing. This expansion often, but not necessarily always, leads to the aforementioned crack in thesecond substrate component 32 of thefinished cutter 20 from the base of thenotch 33 to the edge. - Accordingly, the method for manufacturing the
cutters 20 comprising afirst substrate component 30 and asecond substrate component 32 for this embodiment of the invention is providing one or more notches in thesecond substrate component 32 and assembling thefirst substrate component 30 and thesecond substrate component 32 and diamond crystals 34 a into a desired configuration, and subjecting the assembly to high temperature and high pressure conditions to cause the diamond crystals 34 a to bond to one another and to the first andsecond substrate components cutter 20 having a single body ofpolycrystalline diamond 34. - FIGS. 10 and 11 illustrate a
cutter 20 which is similar to that of FIGS. 8 and 9 but in which an additional,third substrate component 38 is located between the first andsecond substrate components third substrate components second substrate components cutter 20 of this type simply requires the introduction of thesecond substrate component 32 into thecontainer 36, the application of diamond material into thecontainer 36 covering thesecond substrate component 32, the introduction of thethird substrate component 38 into thecontainer 36, the application of more diamond material to cover thethird substrate component 38, and finally the introduction of thefirst substrate component 30. - The arrangement shown in FIGS. 12 and 13 is similar to that of FIGS. 10 and 11 but includes a
fourth substrate component 42. A further distinction between the arrangement of FIGS. 12 and 13 and that of FIGS. 10 and 11 is that no diamond material is provided between the various substrate components. It will be noted from FIGS. 11 and 13 that in each of these arrangements, the angular extent of the various part-annular substrate components are not equal resulting in the formation of steps in the polycrystalline diamond table 34. This need not be the case. The arrangement of FIGS. 10 and 11 further differs from that of FIGS. 12 and 13 in that, as shown in FIG. 12, the various part-annular substrate components are of non-equal radial extent whereas in the arrangement shown in FIG. 10, the second andthird substrate components - Turning to the arrangement shown in FIGS. 14 and 15, the second and fourth substrate components,32, 42 are of equal radial extent and equal angular extent, the
third substrate component 38 being of smaller radial and angular extent with the result that the polycrystalline diamond table 34 includes a radially extending projection 34 b around part of its periphery. - The arrangement shown in FIGS. 16 and 17 is similar to that of FIG. 8, but differs therefrom in that the
second substrate component 32 is not located at the surface of the cutter, but rather is buried within the polycrystalline diamond table 34. - In each of the arrangements described hereinbefore, the
first substrate component 30 is of generally cylindrical form having a flat surface to which the other substrate components and/or the polycrystalline diamond table 34 is bonded. This need not be the case, and FIGS. 18 and 19 illustrate an arrangement in which the surface of thefirst substrate component 30 is grooved. As a result, an arrangement is possible in which in some areas of thecutter 20, thesecond substrate component 32 rests directly upon thefirst substrate component 30, and in other regions thereof thesecond substrate component 32 is spaced from thefirst substrate component 30. In the regions where thesecond substrate component 32 is spaced from thefirst substrate component 30, as shown in FIG. 19, then the polycrystalline diamond table 34 extends between the first and second substrate components, 30, 32. - In each of the arrangements described hereinbefore, it is important to note that the polycrystalline diamond table34 is in the form of a single element, rather than taking the form of two or more separate components spaced apart and isolated from one another by a component of the substrate.
- Although the
cutters 20 described hereinbefore are suitable for use with drill bits of the type illustrated in FIG. 3, it will be appreciated that by appropriate selection of the shape of the cutter, similar cutters may find application in drill bits of the type illustrated in FIG. 4. Acutter 20 more applicable for use in a drill bit of the type illustrated in FIG. 4 is shown in FIG. 20. - The
cutter 20 shown in FIG. 20 comprises a first tungstencarbide substrate component 30 of generally cylindrical form but having a domedupper surface 50, in the orientation illustrated. Asecond substrate component 32 of annular form is positioned upon thefirst substrate component 30, the space within thesecond substrate component 32 containing a polycrystalline diamond table 34. The shapes of thesecond substrate component 32 and polycrystalline diamond table 34 are such as to define adomed surface 52. It will be appreciated that this type of cutter can be manufactured using a technique very similar to those described above. - It will be appreciated that a number of modifications can be made to the cutter of FIG. 20, for example to change its shape so that the
surface 52 is of, for example, generally conical form. Other variations include spacing thesecond substrate component 32 from thefirst substrate component 30, as shown in FIG. 21, or including additional substrate components, as shown in FIG. 22. The second and/or additional substrate components may be of annular or part-annular form. Where they are of curved, part-annular, form then depending upon their circumferential extent, two or more components may be provided at the same axial position as shown in FIG. 23. - With cutters of the type used on drill bits of the type shown in FIG. 4, it is common to provide one or more transition layers comprising a mixture of diamond and tungsten carbide between the tungsten carbide substrate and the polycrystalline diamond table. Such transition layers54 may also be incorporated into the cutters shown in FIGS. 20 to 23. The second substrate component may be positioned upon the transition layer 54 or layers, for example as shown in FIG. 24, or the transition layer 54 or layers may be at least partially encircled by the second substrate component, for example as shown in FIG. 25.
- In each of the arrangements described hereinbefore, the second and additional substrate components are of pre-sintered tungsten carbide form. It will be understood the other materials may be used, if desired. Where pre-sintered tungsten carbide substrate components are used, during the high pressure high temperature sintering operation the diamond will typically be compressed to a greater extent than the pre-sintered substrate components. This may result in, for example, a significant machining operation being required to produce a cutter having a flat or smooth face. It is thought that this effect may be reduced by modifying the manufacturing technique so that, instead of locating a pre-sintered
second substrate component 32 with thecontainer 36, and where appropriate instead of using pre-sintered third andfourth substrate components powdered tungsten carbide 56 is positioned in thecontainer 36, as shown in FIG. 26, in the areas in which thesecond substrate component 32, and where applicable the third andfourth substrate components - Once assembled, the application of the assembly to the high temperature, high pressure conditions will cause the
second substrate component 32, and the third andfourth components first substrate component 30 and to the newly formedsubstrate components first substrate component 30, or in any combination of these locations. - During the manufacturing operation, the tungsten carbide forming the
second substrate component 32 and, where appropriate, the additional substrate components, compresses at a rate similar to the powdered diamond with the result that a short, less complex machining operation may be required to produce a cutter with a generally flat or smooth surface. - It will be appreciated that this technique may be used in the manufacture of any of the
cutters 20 described hereinbefore, or modifications thereto. - Again, as previously described, in all the embodiments described herein any of the
secondary substrate components notches 33 to further improve impact toughness. - Whereas the present invention has been described in particular relation to the drawings attached hereto, it should be understood that other and further modifications apart from those shown or suggested herein, may be made within the scope and spirit of the present invention.
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/064,817 US20040007394A1 (en) | 2002-07-12 | 2002-08-21 | Cutter and method of manufacture thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/064,428 US20040007393A1 (en) | 2002-07-12 | 2002-07-12 | Cutter and method of manufacture thereof |
US10/064,817 US20040007394A1 (en) | 2002-07-12 | 2002-08-21 | Cutter and method of manufacture thereof |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/064,428 Continuation-In-Part US20040007393A1 (en) | 2002-07-12 | 2002-07-12 | Cutter and method of manufacture thereof |
Publications (1)
Publication Number | Publication Date |
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US20040007394A1 true US20040007394A1 (en) | 2004-01-15 |
Family
ID=29731615
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/064,428 Abandoned US20040007393A1 (en) | 2002-07-12 | 2002-07-12 | Cutter and method of manufacture thereof |
US10/064,817 Abandoned US20040007394A1 (en) | 2002-07-12 | 2002-08-21 | Cutter and method of manufacture thereof |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US10/064,428 Abandoned US20040007393A1 (en) | 2002-07-12 | 2002-07-12 | Cutter and method of manufacture thereof |
Country Status (5)
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US (2) | US20040007393A1 (en) |
EP (1) | EP1380719B1 (en) |
AT (1) | ATE312999T1 (en) |
DE (1) | DE60302722D1 (en) |
ZA (1) | ZA200305194B (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100288564A1 (en) * | 2009-05-13 | 2010-11-18 | Baker Hughes Incorporated | Cutting element for use in a drill bit for drilling subterranean formations |
US20100326742A1 (en) * | 2009-06-25 | 2010-12-30 | Baker Hughes Incorporated | Drill bit for use in drilling subterranean formations |
US20110024200A1 (en) * | 2009-07-08 | 2011-02-03 | Baker Hughes Incorporated | Cutting element and method of forming thereof |
US20110023377A1 (en) * | 2009-07-27 | 2011-02-03 | Baker Hughes Incorporated | Abrasive article and method of forming |
US20130168159A1 (en) * | 2011-12-30 | 2013-07-04 | Smith International, Inc. | Solid pcd cutter |
US20140069725A1 (en) * | 2012-09-07 | 2014-03-13 | Smith International, Inc. | Ultra-hard constructions with erosion resistance |
US8863864B1 (en) | 2011-05-26 | 2014-10-21 | Us Synthetic Corporation | Liquid-metal-embrittlement resistant superabrasive compact, and related drill bits and methods |
US8950519B2 (en) * | 2011-05-26 | 2015-02-10 | Us Synthetic Corporation | Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both |
US8978788B2 (en) | 2009-07-08 | 2015-03-17 | Baker Hughes Incorporated | Cutting element for a drill bit used in drilling subterranean formations |
US9062505B2 (en) | 2011-06-22 | 2015-06-23 | Us Synthetic Corporation | Method for laser cutting polycrystalline diamond structures |
US9297411B2 (en) | 2011-05-26 | 2016-03-29 | Us Synthetic Corporation | Bearing assemblies, apparatuses, and motor assemblies using the same |
WO2016099798A1 (en) * | 2014-12-17 | 2016-06-23 | Smith International, Inc. | Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten |
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US7776256B2 (en) | 2005-11-10 | 2010-08-17 | Baker Huges Incorporated | Earth-boring rotary drill bits and methods of manufacturing earth-boring rotary drill bits having particle-matrix composite bit bodies |
US7807099B2 (en) | 2005-11-10 | 2010-10-05 | Baker Hughes Incorporated | Method for forming earth-boring tools comprising silicon carbide composite materials |
US7802495B2 (en) * | 2005-11-10 | 2010-09-28 | Baker Hughes Incorporated | Methods of forming earth-boring rotary drill bits |
US8770324B2 (en) | 2008-06-10 | 2014-07-08 | Baker Hughes Incorporated | Earth-boring tools including sinterbonded components and partially formed tools configured to be sinterbonded |
US7775287B2 (en) | 2006-12-12 | 2010-08-17 | Baker Hughes Incorporated | Methods of attaching a shank to a body of an earth-boring drilling tool, and tools formed by such methods |
US7841259B2 (en) | 2006-12-27 | 2010-11-30 | Baker Hughes Incorporated | Methods of forming bit bodies |
US8261632B2 (en) | 2008-07-09 | 2012-09-11 | Baker Hughes Incorporated | Methods of forming earth-boring drill bits |
CN103237617B (en) * | 2010-07-23 | 2016-06-08 | 国民油井Dht公司 | Polycrystalline diamond cutting element and the method using it |
CN106209755A (en) * | 2015-04-24 | 2016-12-07 | 中兴通讯股份有限公司 | Realize the framework of multimedia communication, method and fusion device and UE |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300522A (en) * | 1978-08-28 | 1981-11-17 | General Electric Company | Compact dressing tool |
US4605343A (en) * | 1984-09-20 | 1986-08-12 | General Electric Company | Sintered polycrystalline diamond compact construction with integral heat sink |
US5370717A (en) * | 1992-08-06 | 1994-12-06 | Lloyd; Andrew I. G. | Tool insert |
US6187068B1 (en) * | 1998-10-06 | 2001-02-13 | Phoenix Crystal Corporation | Composite polycrystalline diamond compact with discrete particle size areas |
US6220375B1 (en) * | 1999-01-13 | 2001-04-24 | Baker Hughes Incorporated | Polycrystalline diamond cutters having modified residual stresses |
US6248447B1 (en) * | 1999-09-03 | 2001-06-19 | Camco International (Uk) Limited | Cutting elements and methods of manufacture thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5492188A (en) * | 1994-06-17 | 1996-02-20 | Baker Hughes Incorporated | Stress-reduced superhard cutting element |
US6193001B1 (en) * | 1998-03-25 | 2001-02-27 | Smith International, Inc. | Method for forming a non-uniform interface adjacent ultra hard material |
US6439327B1 (en) * | 2000-08-24 | 2002-08-27 | Camco International (Uk) Limited | Cutting elements for rotary drill bits |
-
2002
- 2002-07-12 US US10/064,428 patent/US20040007393A1/en not_active Abandoned
- 2002-08-21 US US10/064,817 patent/US20040007394A1/en not_active Abandoned
-
2003
- 2003-06-27 AT AT03254110T patent/ATE312999T1/en not_active IP Right Cessation
- 2003-06-27 EP EP03254110A patent/EP1380719B1/en not_active Expired - Lifetime
- 2003-06-27 DE DE60302722T patent/DE60302722D1/en not_active Expired - Lifetime
- 2003-07-04 ZA ZA200305194A patent/ZA200305194B/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300522A (en) * | 1978-08-28 | 1981-11-17 | General Electric Company | Compact dressing tool |
US4605343A (en) * | 1984-09-20 | 1986-08-12 | General Electric Company | Sintered polycrystalline diamond compact construction with integral heat sink |
US5370717A (en) * | 1992-08-06 | 1994-12-06 | Lloyd; Andrew I. G. | Tool insert |
US6187068B1 (en) * | 1998-10-06 | 2001-02-13 | Phoenix Crystal Corporation | Composite polycrystalline diamond compact with discrete particle size areas |
US6220375B1 (en) * | 1999-01-13 | 2001-04-24 | Baker Hughes Incorporated | Polycrystalline diamond cutters having modified residual stresses |
US6248447B1 (en) * | 1999-09-03 | 2001-06-19 | Camco International (Uk) Limited | Cutting elements and methods of manufacture thereof |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100288564A1 (en) * | 2009-05-13 | 2010-11-18 | Baker Hughes Incorporated | Cutting element for use in a drill bit for drilling subterranean formations |
US8887839B2 (en) | 2009-06-25 | 2014-11-18 | Baker Hughes Incorporated | Drill bit for use in drilling subterranean formations |
US20100326742A1 (en) * | 2009-06-25 | 2010-12-30 | Baker Hughes Incorporated | Drill bit for use in drilling subterranean formations |
US9957757B2 (en) | 2009-07-08 | 2018-05-01 | Baker Hughes Incorporated | Cutting elements for drill bits for drilling subterranean formations and methods of forming such cutting elements |
US8978788B2 (en) | 2009-07-08 | 2015-03-17 | Baker Hughes Incorporated | Cutting element for a drill bit used in drilling subterranean formations |
US9816324B2 (en) | 2009-07-08 | 2017-11-14 | Baker Hughes | Cutting element incorporating a cutting body and sleeve and method of forming thereof |
US10309157B2 (en) | 2009-07-08 | 2019-06-04 | Baker Hughes Incorporated | Cutting element incorporating a cutting body and sleeve and an earth-boring tool including the cutting element |
US8757299B2 (en) | 2009-07-08 | 2014-06-24 | Baker Hughes Incorporated | Cutting element and method of forming thereof |
US20110024200A1 (en) * | 2009-07-08 | 2011-02-03 | Baker Hughes Incorporated | Cutting element and method of forming thereof |
US9174325B2 (en) | 2009-07-27 | 2015-11-03 | Baker Hughes Incorporated | Methods of forming abrasive articles |
US20110023377A1 (en) * | 2009-07-27 | 2011-02-03 | Baker Hughes Incorporated | Abrasive article and method of forming |
US10012030B2 (en) | 2009-07-27 | 2018-07-03 | Baker Hughes, A Ge Company, Llc | Abrasive articles and earth-boring tools |
US8500833B2 (en) | 2009-07-27 | 2013-08-06 | Baker Hughes Incorporated | Abrasive article and method of forming |
US9744646B2 (en) | 2009-07-27 | 2017-08-29 | Baker Hughes Incorporated | Methods of forming abrasive articles |
US8950519B2 (en) * | 2011-05-26 | 2015-02-10 | Us Synthetic Corporation | Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both |
US9759015B2 (en) | 2011-05-26 | 2017-09-12 | Us Synthetic Corporation | Liquid-metal-embrittlement resistant superabrasive compacts |
US9297411B2 (en) | 2011-05-26 | 2016-03-29 | Us Synthetic Corporation | Bearing assemblies, apparatuses, and motor assemblies using the same |
US9334694B2 (en) | 2011-05-26 | 2016-05-10 | Us Synthetic Corporation | Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both |
US8863864B1 (en) | 2011-05-26 | 2014-10-21 | Us Synthetic Corporation | Liquid-metal-embrittlement resistant superabrasive compact, and related drill bits and methods |
US9999962B2 (en) | 2011-06-22 | 2018-06-19 | Us Synthetic Corporation | Method for laser cutting polycrystalline diamond structures |
US9062505B2 (en) | 2011-06-22 | 2015-06-23 | Us Synthetic Corporation | Method for laser cutting polycrystalline diamond structures |
US10946500B2 (en) | 2011-06-22 | 2021-03-16 | Us Synthetic Corporation | Methods for laser cutting a polycrystalline diamond structure |
US9482056B2 (en) * | 2011-12-30 | 2016-11-01 | Smith International, Inc. | Solid PCD cutter |
US20130168159A1 (en) * | 2011-12-30 | 2013-07-04 | Smith International, Inc. | Solid pcd cutter |
US10107042B2 (en) * | 2012-09-07 | 2018-10-23 | Smith International, Inc. | Ultra-hard constructions with erosion resistance |
US20140069725A1 (en) * | 2012-09-07 | 2014-03-13 | Smith International, Inc. | Ultra-hard constructions with erosion resistance |
WO2016099798A1 (en) * | 2014-12-17 | 2016-06-23 | Smith International, Inc. | Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten |
US10358705B2 (en) | 2014-12-17 | 2019-07-23 | Smith International, Inc. | Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten |
Also Published As
Publication number | Publication date |
---|---|
EP1380719A1 (en) | 2004-01-14 |
ZA200305194B (en) | 2004-05-17 |
US20040007393A1 (en) | 2004-01-15 |
ATE312999T1 (en) | 2005-12-15 |
EP1380719B1 (en) | 2005-12-14 |
DE60302722D1 (en) | 2006-01-19 |
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