US20030191037A1 - Detergent composition for cleaning precision parts - Google Patents
Detergent composition for cleaning precision parts Download PDFInfo
- Publication number
- US20030191037A1 US20030191037A1 US10/406,502 US40650203A US2003191037A1 US 20030191037 A1 US20030191037 A1 US 20030191037A1 US 40650203 A US40650203 A US 40650203A US 2003191037 A1 US2003191037 A1 US 2003191037A1
- Authority
- US
- United States
- Prior art keywords
- weight
- detergent composition
- organic solvent
- water
- ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 239000003599 detergent Substances 0.000 title claims abstract description 92
- 238000004140 cleaning Methods 0.000 title claims abstract description 37
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000003960 organic solvent Substances 0.000 claims abstract description 40
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 20
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 8
- 230000004907 flux Effects 0.000 claims description 41
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 claims description 17
- -1 glycol ether compound Chemical class 0.000 claims description 16
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 claims description 6
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 44
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 27
- 239000000758 substrate Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 210000002858 crystal cell Anatomy 0.000 description 11
- 239000011295 pitch Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 235000019445 benzyl alcohol Nutrition 0.000 description 9
- 238000004090 dissolution Methods 0.000 description 9
- 230000005496 eutectics Effects 0.000 description 9
- 239000002518 antifoaming agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000013008 thixotropic agent Substances 0.000 description 7
- 239000006071 cream Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 4
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000007127 saponification reaction Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 101100256637 Drosophila melanogaster senju gene Proteins 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1 -dodecene Natural products CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- QNLZIZAQLLYXTC-UHFFFAOYSA-N 1,2-dimethylnaphthalene Chemical compound C1=CC=CC2=C(C)C(C)=CC=C21 QNLZIZAQLLYXTC-UHFFFAOYSA-N 0.000 description 2
- BVOSSZSHBZQJOI-UHFFFAOYSA-N 1-Hexen-3-ol Chemical compound CCCC(O)C=C BVOSSZSHBZQJOI-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VSMOENVRRABVKN-UHFFFAOYSA-N oct-1-en-3-ol Chemical compound CCCCCC(O)C=C VSMOENVRRABVKN-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000003381 solubilizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- 229940095068 tetradecene Drugs 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- 239000001490 (3R)-3,7-dimethylocta-1,6-dien-3-ol Substances 0.000 description 1
- CDOSHBSSFJOMGT-JTQLQIEISA-N (R)-linalool Natural products CC(C)=CCC[C@@](C)(O)C=C CDOSHBSSFJOMGT-JTQLQIEISA-N 0.000 description 1
- SPWMFXSIAMGJPC-XQRVVYSFSA-N (z)-hex-2-en-3-ol Chemical compound CCC\C(O)=C\C SPWMFXSIAMGJPC-XQRVVYSFSA-N 0.000 description 1
- VSMOENVRRABVKN-MRVPVSSYSA-N 1-Octen-3-ol Natural products CCCCC[C@H](O)C=C VSMOENVRRABVKN-MRVPVSSYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- OHJYHAOODFPJOD-UHFFFAOYSA-N 2-(2-ethylhexoxy)ethanol Chemical compound CCCCC(CC)COCCO OHJYHAOODFPJOD-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- OKPDIVZFFUVTNZ-UHFFFAOYSA-N 2-heptylnonan-1-ol Chemical compound CCCCCCCC(CO)CCCCCCC OKPDIVZFFUVTNZ-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- YDXQPTHHAPCTPP-UHFFFAOYSA-N 3-Octen-1-ol Natural products CCCCC=CCCO YDXQPTHHAPCTPP-UHFFFAOYSA-N 0.000 description 1
- MQVMITUCTLYRNV-UHFFFAOYSA-N 3-hexoxypropane-1,2-diol Chemical compound CCCCCCOCC(O)CO MQVMITUCTLYRNV-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- GUPXYSSGJWIURR-UHFFFAOYSA-N 3-octoxypropane-1,2-diol Chemical compound CCCCCCCCOCC(O)CO GUPXYSSGJWIURR-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- DTDMYWXTWWFLGJ-JTQLQIEISA-N 4-Decanol Natural products CCCCCC[C@@H](O)CCC DTDMYWXTWWFLGJ-JTQLQIEISA-N 0.000 description 1
- AOIUKEFNGCYQBX-UHFFFAOYSA-N 7-methyl-2-(3-methylbutyl)octan-1-ol Chemical compound CC(C)CCCCC(CO)CCC(C)C AOIUKEFNGCYQBX-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- LMGZGXSXHCMSAA-UHFFFAOYSA-N cyclodecane Chemical compound C1CCCCCCCCC1 LMGZGXSXHCMSAA-UHFFFAOYSA-N 0.000 description 1
- HYPABJGVBDSCIT-UPHRSURJSA-N cyclododecene Chemical compound C1CCCCC\C=C/CCCC1 HYPABJGVBDSCIT-UPHRSURJSA-N 0.000 description 1
- DTDMYWXTWWFLGJ-UHFFFAOYSA-N decan-4-ol Chemical compound CCCCCCC(O)CCC DTDMYWXTWWFLGJ-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 229930007744 linalool Natural products 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N n-decene Natural products CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- LIXVMPBOGDCSRM-UHFFFAOYSA-N nonylbenzene Chemical compound CCCCCCCCCC1=CC=CC=C1 LIXVMPBOGDCSRM-UHFFFAOYSA-N 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadecene Natural products CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/18—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2034—Monohydric alcohols aromatic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C11D2111/22—
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
A detergent composition for cleaning a precision part, comprising an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water. The detergent composition can be used for cleaning a precision part such as a metal part, an electronic part, a semiconductor part or a liquid crystal display panel.
Description
- 1. Field of the Invention
- The present invention relates to a detergent composition for cleaning a precision part. More specifically, the present invention relates to a water-containing detergent composition for cleaning a precision part such as a metal part, an electronic part, a semiconductor part or a liquid crystal display panel.
- 2. Discussion of the Related Art
- Conventionally, wire connections of a printing substrate, a semiconductor package or the like have been carried out by solder connection via screen printing using cream solder. This cream solder comprises a eutectic solder component containing tin/lead, and a so-called flux component containing a resin, an active agent, an antioxidant, a thixotropic agent, and a solvent, which is used for the purposes of increasing screen printability and wiring reliability after connection. The flux component included herein has an important function of removing a metal oxide coating film at the connecting portion and the like. However, once the connection is completed, the flux component has a possibility that the reliability of the part is lowered thereafter, such as hygroscopicity, so that the flux component must be completely removed by cleaning the part.
- In the removal of this flux component, a fluorocarbon-based solvent and a chlorine-based solvent have been used up until the 1990's in order to utilize its characteristics such as high detergency and fire retardancy. However, the detergent using a chlorine-based solvent or a fluorocarbon-based solvent has serious problems in safety, toxicity, environmental pollutions, and the like, so that these solvents were totally banned. Therefore, as a process to be used in place of these solvents, there have been numerously marketed a so-called water-containing flux detergent which takes into consideration of a risk such as ignition property by solubilizing water in a non-water-soluble component such as an organic solvent.
- Recently, however, from the viewpoints of the development of finer wiring pitches and environmental protection needs, a composition of the flux has been modified in order to meet these needs in the cream solder component. Concretely, in order to increase the viscosity of the cream solder, the amount of the thixotropic agent in the composition of the flux tends to be increased. The reasons why the viscosity is to be increased are such that printing reliability in finer screen printing is improved and that edge rounding upon heating due to the modification of the non-lead-containing solder metal which has a higher melting point is prevented.
- On the other hand, this flux component showing low solubility has been known to have high solubility to benzyl alcohol. Therefore, there has been disclosed a flux detergent using benzyl alcohol as a dissolution aid. For instance, Japanese Patent Gazette No. 2041987 discloses a non-water-based detergent composition comprising benzyl alcohol (or 2-phenetyl alcohol) as a main component, and a nonionic surfactant being added thereto; Japanese Patent Laid-Open No. Hei 4-34000 discloses a non-water-based detergent composition comprising benzyl alcohol as a main component; Japanese Patent Laid-Open Nos. Hei 6-346094 and Hei 9-255995 each discloses a water-containing detergent composition comprising 3-methoxy-3-methylbutanol as a main component, and benzyl alcohol and water being added thereto; Japanese Patent Laid-Open No. 2000-8080 discloses a water-containing detergent composition comprising benzyl alcohol as a main component, and a water-soluble glycol ether, a nonionic surfactant and water being added thereto. Also, as the detergent containing a glyceryl ether, Japanese Patent Laid-Open No. Hei 6-346092 discloses a detergent composition containing a glyceryl ether having a hydrocarbon group having 1 to 18 carbon atoms. Among them, the present inventors have carried out a cleaning test for a so-called water-containing flux detergent which has taken into consideration a risk such as ignition property. As a result, although the detergent shows high flux detergency against a generally used eutectic solder containing tin/lead, the detergent shows unsatisfactory detergency to flux in a lead-free solder or a solder for fine pitches in which the amount of the thixotropic agent such as N,N-ethylenebisstearamide is increased. Also, the detergent using a glyceryl ether as a dissolution aid also has unsatisfactory detergency to flux in a lead-free solder or the like as mentioned above.
- In addition, as to the removal of the liquid crystal stains, the gap distance between the liquid crystal cells becomes even narrower with the development of thinner liquid crystal display panel, so that it has been becoming increasingly difficult to clean the liquid crystals existing in the gap. When the conventional detergent composition as mentioned above is used against the liquid crystal stains, the detergency is unsatisfactory for those liquid crystals existing in the gap, even though the detergency is excellent for the liquid crystals existing on the surface.
- An object of the present invention is to provide a water-containing detergent composition for cleaning a precision part, which shows high detergency to flux when a lead-free solder and a solder for fine pitches is used as a solder in addition to the eutectic solder, and shows high detergency against stains mainly composed of organic substances existing on the surface of a metal part, an electronic part or a semiconductor part, or liquid crystal stains in a liquid crystal display panel, and the detergent composition having excellent safety.
- These and other objects of the present invention will be apparent from the following description.
- As mentioned above, the water-containing detergent so far published is for instance, a detergent in which water is solubilized in a non-water-soluble component such as benzyl alcohol for the purpose of taking into consideration the risk such as ignition property. For this purpose, a water-soluble component such as a water-soluble glycol ether or a nonionic surfactant is usually added. In this case, although the causation is not clear, the flux solubility obtained by the non-water-soluble component alone tends to be dramatically lowered by solubilizing water in the mixture. Further, the cleaning failure as described above is especially markedly exhibited in the lead-free solder and the solder for fine pitches in which the amount of the thixotropic agent is increased.
- The present inventors have found for the first time that when a given amount of water is solubilized in a non-water-soluble component containing a given amount of a glyceryl ether having an alkyl group or alkenyl group having a specified structure, the flux solubility is not lowered, and excellent detergency against liquid crystal stains is exhibited.
- According to the present invention, there is provided a detergent composition for cleaning a precision part, comprising an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water.
- The detergent composition for cleaning a precision part of the present invention (hereinafter simply referred to as “detergent composition”), as mentioned above, comprises an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water. In the present invention, one of the great features resides in that the three components are used together at a specified ratio. By using the detergent composition having the composition as described above, the flux can be safely cleaned with easy handling in a lead-free solder or a solder for fine pitches in which the amount of thixotropic agent is increased as a solder in addition to the eutectic solder. Further, so-called “liquid crystal stains” which are liquid crystals existing in the gap of the liquid crystal cell can be cleaned. Especially, there is exhibited an excellent effect that those liquid crystal stains existing in the liquid crystal cells between the narrow gap distance which have been difficult to be cleaned with the conventional detergents can be cleaned.
- The organic solvent usable in the present invention is preferably an organic solvent having solubility of N,N-ethylenebisstearamide of 0.3% by weight or more at 70° C., from the viewpoint of detergency to flux. Here, the “organic solvent having solubility of N,N-ethylenebisstearamide of 0.3% by weight or more at 70° C.” refers to an organic solvent in which N,N-ethylenebisstearamide can be dissolved in an amount of 0.3 parts by weight or more, in 100 part by weight of the organic solvent kept at 70° C. This solubility can be obtained as follows.
- N,N-Ethylenebisstearamide and the organic solvent are accurately weighed in a screw tube, so that the concentration of N,N-ethylenebisstearamide is, for instance, 0.1 parts by weight, 0.2 parts by weight, and 0.3 parts by weight, based on 100 parts by weight of the organic solvent. Next, a mixture of N,N-ethylenebisstearamide and the organic solvent is heated to 70° C. The dissolution state of the mixture is confirmed by judging whether or not the resulting solution becomes transparent and soluble. Here, if the mixture becomes transparent and soluble with 0.2 parts by weight of N,N-ethylenebisstearamide but becomes white turbid with 0.3 parts by weight of N,N-ethylenebisstearamide, and this is defined as 0.2% by weight solubility. By repeating the above procedures, the obtained solubility can have increased precision.
- The organic solvent includes linear alcohols having 4 to 16 carbon atoms such as butanol (0.5% by weight or more), hexanol (0.5% by weight or more), octanol (0.5% by weight or more), lauryl alcohol (0.5% by weight or more) and stearyl alcohol (0.5% by weight or more); branched alcohols having 10 to 16 carbon atoms such as 4-decanol (0.5% by weight or more), 2-heptylnonanol (0.5% by weight or more), and 7-methyl-2-(3-methylbutyl)-1-octanol (0.5% by weight or more); unsaturated alcohols such as benzyl alcohol (0.3% by weight or more), 1-hexen-3-ol (1% by weight or more), 2-hexen-3-ol (0.75% by weight or more), 1-octen-3-ol (1% by weight or more), linalool (0.5% by weight or more), and ω-undecyl alcohol (0.5% by weight or more); dipropylene glycol monoalkyl ethers such as dipropylene glycol monopropyl ether (0.3% by weight or more) and dipropylene glycol monobutyl ether (0.3% by weight or more); and fatty acids such as acetic acid (0.5% by weight or more), propionic acid (2% by weight or more), hexanoic acid (1.75% by weight or more), and 2-ethylhexanoic acid (0.75% by weight or more) (Numerical figures inside the above parentheses show solubility of the organic solvent). Among them, benzyl alcohol, dipropylene glycol monopropyl ether and dipropylene glycol monobutyl ether are preferable.
- Also, the hydrocarbons having 10 to 18 carbon atoms are preferable, from the viewpoint of having excellent detergency against liquid crystal stains. The hydrocarbons having 10 to 18 carbon atoms include, for instance, linear or branched, saturated or unsaturated hydrocarbon-based solvents such as decane, dodecane, tetradecane, hexadecane, octadecane, decene, dodecene, tetradecene, hexadecene, and octadecene; aromatic hydrocarbon-based solvents such as alkylbenzenes such as nonylbenzene and dodecylbenzene, and naphthalene compounds such as methylnaphthalene and dimethylnaphthalene; alicyclic hydrocarbon-based solvents such as cyclocyclic compounds such as cyclodecane and cyclododecene; and the like. Among them, linear or branched, saturated or unsaturated hydrocarbons having 12 to 18 carbon atoms are preferable, and olefinic hydrocarbons are especially preferable.
- These organic solvents can be used alone or in admixture of two or more kinds.
- The glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms (hereinafter simply referred to as “glyceryl ether”) usable in the present invention may be those having an alkyl group or alkenyl group having 4 to 12 carbon atoms, preferably those having an alkyl group having 4 to 12 carbon atoms such as n-butyl group, isobutyl group, n-hexyl group, isohexyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group, and n-decyl group, especially preferably those having one or two alkyl groups each having 6 to 10 carbon atoms, more preferably 6 to 8 carbon atoms, especially one of the alkyl group, from the viewpoints of not reducing its detergency, and maintaining homogeneous and transparent properties of the manufactured detergent composition in an operable temperature range. Further, the glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms usable in the present invention may be a monoalkyl diglyceryl ether or a monoalkyl polyglyceryl ether in which two or more, preferably two to three, glyceryl groups are bonded via ether bonds. Especially, a monoalkyl glyceryl ether and a monoalkyl diglyceryl ether are preferable, from the viewpoint of excellent detergency against liquid crystal stains. These glyceryl ethers can be used alone or in admixture of two or more kinds. In the present invention, the dispersibility of the organic solvent with water can be stabilized by using the glyceryl ether, so that there are advantages such that more excellent detergency against flux and/or liquid crystal stains is obtained.
- Water usable in the present invention is not particularly limited. Water includes ion-exchanged water, pure water, and the like.
- In the detergent composition of the present invention, the content of the organic solvent is preferably from 1 to 90% by weight, more preferably from 50 to 90% by weight, still more preferably from 60 to 90% by weight, especially preferably from 65 to 85% by weight, from the viewpoint of obtaining excellent detergency to flux. Also, the content of the glyceryl ether is 5 to 30% by weight, and the content is preferably from 10 to 30% by weight, more preferably from 10 to 25% by weight, still more preferably from 10 to 20% by weight, from the viewpoints of obtaining excellent flux solubility and excellent detergency against organic stains. In addition, the content of water is 5% by weight or more, and the content is preferably from 5 to 30% by weight, more preferably from 5 to 20% by weight, especially preferably from 5 to 15% by weight, from the viewpoints of not causing ignition of the detergent composition and maintaining flux solubility. Among them, when the detergent composition of the present invention is used for cleaning flux stains in a lead-free solder or fine pitch solder containing N,N-ethylenebisstearamide in a large amount as a thixotropic agent, it is preferable that the content of the organic solvent is from 65 to 85% by weight, that the content of the glyceryl ether is from 10 to 20% by weight, and that the content of water is 5 to 15% by weight.
- In addition, the detergent composition of the present invention has the following Composition 1 or Composition 2, from the viewpoint of obtaining excellent detergency against liquid crystal stains.
- In Composition 1, the content of the organic solvent is preferably from 5 to 40% by weight, more preferably from 10 to 20% by weight. Also, the content of the glyceryl ether is from 5 to 30% by weight, and the content is preferably from 10 to 30% by weight, more preferably from 10 to 25% by weight, especially preferably from 10 to 20% by weight, from the viewpoint of obtaining excellent detergency against liquid crystal stains. In addition, the content of water is 5% by weight or more, and the content is preferably from 40 to 90% by weight, more preferably from 60 to 80% by weight, from the viewpoint of not causing ignition of the detergent composition and from the viewpoint of maintaining detergency against liquid crystal stains. Among them, the preferred combinations of the above-mentioned three components which have excellent detergency against liquid crystal stains are such that the content of the organic solvent is from 5 to 40% by weight, that the content of the glyceryl ether is from 5 to 30% by weight, and that the content of water is from 40 to 90% by weight. More preferred combinations are such that the content of the organic solvent is from 10 to 20% by weight, that the content of the glyceryl ether is from 10 to 20% by weight, and that the content of water is from 60 to 80% by weight.
- In Composition 2, the content of the organic solvent is preferably from 50 to 90% by weight, more preferably from 60 to 80% by weight. Also, the content of the glyceryl ether is from 5 to 30% by weight, and the content is preferably from 10 to 30% by weight, especially preferably from 10 to 25% by weight, from the viewpoint of obtaining excellent detergency against liquid crystal stains. In addition, the content of water is 5% by weight or more, and the content is preferably from 5 to 40% by weight, especially preferably from 5 to 30% by weight, from the viewpoint of maintaining detergency against liquid crystal stains. Among them, the preferred combinations of the above-mentioned three components which have excellent detergency against liquid crystal stains are such that the content of the organic solvent is from 50 to 90% by weight, that the content of the glyceryl ether is from 5 to 30% by weight, and that the content of water is from 5 to 40% by weight. More preferred combinations are such that the content of the organic solvent is from 60 to 80% by weight, that the content of the glyceryl ether is from 10 to 25% by weight, and that the content of water is from 5 to 30% by weight.
- In addition, when the detergent composition of the present invention is used for detergency to flux, the detergent composition may contain a flux saponification agent and a defoaming agent. As the flux saponification agent, there can be used an amine such as an alkylamine or an alkanolamine. Furthermore, as the defoaming agent, there can be used a silicone-based defoaming agent, a mineral oil-based defoaming agent, a glycol-based defoaming agent, and the like.
- The content of the flux saponification agent and the defoaming agent in the detergent composition is preferably from 0.1 to 5% by weight, more preferably from 0.5 to 3% by weight.
- When the detergent composition of the present invention is used for cleaning flux, the detergent composition having solubility of N,N-ethylenebisstearamide at 70° C. of 0.15% by weight or more is preferable, more preferably 0.2% by weight or more. Here, the “solubility of N,N-ethylenebisstearamide at 70° C. of 0.15% by weight or more” refers to a property that N,N-ethylenebisstearamide can dissolve in an amount of 0.15 parts by weight or more, in 100 parts by weight of the detergent composition kept at 70° C. Also, the solubility of N,N-ethylenebisstearamide in the detergent composition can be obtained in the same manner as the method for obtaining solubility in the case of the above-mentioned by using the detergent composition, except that the detergent composition is used in place of the organic solvent.
- Among them, when the detergent composition of the present invention is used for cleaning liquid crystal stains, it is preferable to add a glycol ether compound to the detergent composition, from the viewpoint of lowering the viscosity of the cleaning solution, thereby improving the detergency of the liquid crystals existing in the gap between liquid crystal cells. Concrete examples of the glycol ether compound include ethylene glycol monoalkyl(1 to 12 carbon atoms) ethers, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, and ethylene glycol mono2-ethylhexyl ether; diethylene glycol monoalkyl(1 to 12 carbon atoms) ethers, such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, and diethylene glycol mono2-ethylhexyl ether; propylene glycol or dipropylene glycol monoalkyl(1 to 12 carbon atoms) ethers, such as benzyl glycol, benzyl diglycol, phenyl glycol, propylene glycol monopropyl ether, dipropylene glycol monopropyl ether, propylene glycol monobutyl ether, and dipropylene glycol monobutyl ether; and the like. Among them, diethylene glycol monohexyl ether and dipropylene glycol monobutyl ether are preferable, and diethylene glycol monohexyl ether is especially preferable.
- The content of the glycol ether in the detergent composition of the present invention is preferably from 25 to 100 parts by weight, more preferably from 40 to 90 parts by weight, especially preferably from 50 to 80 parts by weight, based on 100 parts by weight of a total amount of the organic solvent, the glyceryl ether and water, from the viewpoints of lowering the viscosity of the detergent solution, increasing the penetrability into the gap of the liquid crystal cell and increasing the detergency of the liquid crystals.
- The detergent composition of the present invention having the above-mentioned constitution can be prepared by, for instance, mixing the above-mentioned organic solvent and the above-mentioned glyceryl ether with stirring, mixing other optional components as occasion demands, and finally adding water thereto.
- When the detergent composition of the present invention is used to carry out cleaning of a precision part, for instance, a precision part having flux stains, the detergent composition can be used for all sorts of cleaning procedures, including immersion cleaning process, stirring cleaning process, ultrasonic cleaning process, spray-type cleaning process, brush cleaning process and the like. In addition, when the detergent composition is used for cleaning a precision part having liquid crystal stains, the detergent composition can be used for all sorts of cleaning procedures, including immersion cleaning process, stirring cleaning process, ultrasonic cleaning process, brush cleaning process and the like.
- The flux to be cleaned by the detergent composition of the present invention is not particularly limited, as long as the flux is generated in wire connections of a printing substrate, a semiconductor package or the like. The detergent composition of the present invention especially shows high detergency against soldering flux. The solder includes eutectic solder composed of tin and lead, and a lead-free solder or a solder for fine pitches, in which an amount of a thixotropic agent is increased.
- In addition, the detergent composition of the present invention shows a high detergency against stains mainly composed of organic substances and the stains on liquid crystals such as a liquid crystal panel, in which the stains exist on a surface of, for instance, a metal part, an electronic part, a semiconductor part or the like. Especially, as to the liquid crystal panel, the detergent composition of the present invention shows a high detergency against liquid crystal stains of liquid crystal cells having a narrow gap distance of from 3 to 6 μm in addition to those of conventionally employed liquid crystal cells having a gap distance of from 7 to 10 μm.
- As described above, by using the detergent composition of the present invention for cleaning a precision part, wire of a printing substrate, a semiconductor package or the like and a liquid crystal display panel can be safely prepared with easy handling.
- <Preparation 1 of Test Substrate>
- A cream solder was screen-printed on a glass epoxy substrate on which cupper patterns had been printed. The glass epoxy substrate was heated at 250° C. for 30 seconds to give a test substrate.
- Each component was added and mixed so as to give the composition shown in Table 1, to give each of the detergent compositions of Examples 1 to 8 and Comparative Examples 1 to 3. Next, each detergent composition was placed in a cleaning vessel, and the above-mentioned test substrate was immersed in the detergent composition at 60° C. for 5 minutes. Thereafter, the test substrate was rinsed with ion-exchanged water at 60° C. for 1 minute. Subsequently, the rinsed substrate was dried at 80° C. for 20 minutes. The surface of the test substrate was visually observed, and detergency to flux was evaluated on the basis of the following evaluation criteria. The results are shown in Table 2.
[Evaluation Criteria for Detergency to Flux] A: Excellently cleaned (no remaining adhesion of the flux residue) B: Slightly poorly cleaned (slight remaining adhesion) C: Poorly cleaned (much remaining adhesion being recognized) D: Not cleaned at all - Here, the cream solders using the cleaning test are shown below. Inside quotation marks show trade names.
- Lead-free solder “M312-221BM5-42-11” (manufactured by Senju Kinzoku)
- Lead-free solder “Ecosolder M705” (manufactured by Senju Kinzoku)
- Lead-free solder “Solder Paste TLF-204-19A” (manufactured by Tamura Giken)
- Solder for fine-pitch “OZ63-331F4-9.5” (manufactured by Senju Kinzoku)
- Tin-lead eutectic solder “RX363-227DDO” (manufactured by Nihon Handa)
- High-melting point solder “RX305-92MYO” (manufactured by Nihon Handa)
TABLE 1 Ex. No. Comp. Ex. No. 1 2 3 4 5 6 7 8 1 2 3 Composition of Detergent Composition (% by weight) Organic Solvent Benzyl Alcohol (0.3% by wt or more)*) 75.0 75.0 75.0 80.0 73.2 36.6 75.0 Dipropylene Glycol Monopropyl Ether 73.2 (0.3% by wt or more) Dipropylene Glycol Monobutyl Ether 73.2 36.6 (0.3% by wt or more) Butyl Diglycol (0.1% by wt or less) 44.5 26.3 Hexyl Diglycol (0.1% by wt or less) 10.0 44.5 Glyceryl Ether 2-Ethylhexyl Glyceryl Ether 15.0 10.0 14.7 14.7 14.7 14.7 Hexyl Glyceryl Ether 15.0 Octyl Glyceryl Ether 15.0 Water 10.0 10.0 10.0 10.0 10.0 10.0 10.0 10.0 10.0 10.0 70.9 Surfactant Polyoxyalkylene Monophenyl Ether 5.0 (HLB: ca. 12) Polyoxyalkylene Monoalkyl Ether 0.7 (HLB: ca. 10) Additive Flux Saponification Agent 1.0 1.0 1.0 1.0 0.9 2.1 (Diethanolamine) Defoaming Agent (Silicone 1.1 1.1 1.1 1.1 0.1 Defoaming Agent) Total 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 100.0 Solubility of N,N-Ethylenebisstearamide 0.25 0.22 0.20 0.28 0.23 0.20 0.16 0.20 0.08 0.05 0.05 in Detergent Composition at 70° C. (% by wt.) -
TABLE 2 Ex. No. Comp. Ex. No. 1 2 3 4 5 6 7 8 1 2 3 Lead-Free Solder M312-221BM5-42-11 A A A A A A A A C C C Solder Paste TLF-204-19A A A A A A A A A D B D Ecosolder M705-221BM-5-42-11 A A A A A A A A D B D Solder for Fine Pitch A A A A A A A A C B C OZ63-331F4-9.5 Tin-Lead Eutectic Solder A A A A A A A A B A C RX363-227DDO High-Melting Point Solder A A A A A A A A D B D RX305-92MYO - It can be seen from the results of Table 2 that since the detergent compositions of Examples 1 to 8 show high solubility to N,N-ethylenebisstearamide, the detergent compositions have excellent detergency to flux against any of the lead-free solder, the solder for fine pitch, the tin-lead eutectic solder and the high-melting point solder, as compared to those of any of the detergent compositions of Comparative Examples 1 to 3. In addition, since all of the detergent compositions of Examples 1 to 8 contain water, there would be no risk of ignition at a cleaning treatment temperature of 60° C. or so, so that the detergent compositions have excellent safety.
- <Preparation 2 of Test Substrate>
- TFT liquid crystals were sealed into a gap between liquid crystal cells (distance between the gap: 5 μm), and the cells were allowed to stand at room temperature for 30 minutes, to give a test substrate.
- Each component was added and mixed so as to give the composition shown in Table 3, to give each of the detergent compositions of Examples 9 to 12 and Comparative Examples 4 to 6. The test substrate was subjected to ultrasonic cleaning for 5 minutes in each of detergent compositions prepared at 30° C. Thereafter, the test substrate was rinsed for 3 minutes in each of four pure water tanks (40° C.). Subsequently, the rinsed substrate was dried at 90° C. for 30 minutes with a hot air dryer, to be an observation sample.
- [Evaluation Method for Detergency]
- The liquid crystals remaining in the gap between the liquid crystal cells after cleaning, and a mixture of the liquid crystals not sufficiently discharged during rinsing and the detergent composition were observed by a polarization microscope (magnification: 25 times), and the detergency of the liquid crystal panel was evaluated.
- The evaluation for the detergency was shown by a value calculated by dividing an area resultant of subtraction of the portions at which the liquid crystals and a mixture of the liquid crystals and the detergent remained from an entire area of the observed gap by the entire area of the observed gap. The evaluation criteria were as defined as follows:
Evaluation Criteria for Detergency: ⊚: 90 to 100% ◯: 80% to less than 90% Δ: 40% to less than 80% X: less than 40% - [Dissolution Rate of Liquid Crystals]
- A liquid crystal cell test substrate in which TFT liquid crystals were filled prepared in the same manner as described above was immersed in a detergent composition at 30° C. for 5 minutes, and a distance at which the detergent composition penetrated in the gap was determined by an optical microscopic observation with the lens having a magnification of 25 times. The liquid crystal dissolution rate was defined as a value obtained by dividing the obtained penetration distance by time.
TABLE 3 Ex. No. Comp. Ex. No. 9 10 11 12 4 5 6 Composition (Parts by Weight) Organic Solvent Tetradecene 70 70 13 100 70 70 Dodecene 70 Glyceryl Ether 2-Ethylhexyl Glyceryl Ether 25 30 2-Ethylhexyl Diglyceryl Ether 25 25 20 Polyoxyethylene Alkyl Ether 20 (C12-14, Secondary Alcohol) Diethylene Glycol Monohexyl Ether 40* Water 5 5 5 67 5 Liquid Crystal Dissolution Rate 9.0 9.0 9.0 10.0 11.0 6.0 7.0 (μm/minute) Detergency of Liquid Crystals ◯ ◯ ◯ ⊚ X Δ Δ - It can be seen from the results of Table 3 that since the rinsing ability of the detergent compositions is excellent with maintaining a high liquid crystal dissolution rate in Examples 9 to 12, the detergent compositions are well penetrated in the narrow gap between the liquid crystal cells, so that the detergent compositions do not remain in the gap, whereby consequently having excellent detergency.
- On the other hand, in the detergent composition where an organic solvent is used alone (Comparative Example 4), it can be seen that the detergency of the detergent composition itself is worsened because exchange with water is worsened in the rinsing process in the cleaning test, even though the liquid crystal dissolution rate in the gaps became high.
- Also, in the detergent composition where no water is contained (Comparative Example 5) or no glyceryl ether is contained (Comparative Example 6), the detergency of the liquid crystal panel is worsened because the liquid crystal dissolution rate is lowered in any of the detergent compositions.
- Since the detergent composition for a precision part of the present invention can be handled safely and exhibits high detergency to flux even when the detergent composition is used for cleaning flux on a lead-free solder or a solder for fine pitch in addition to that on eutectic solder, printing substrates and wiring such as semiconductor package can be easily handled and safely prepared. In addition, when the detergent composition is used for cleaning liquid crystals, the detergent composition is penetrated well into a narrow gap between the liquid crystals, thereby showing high detergency. Therefore, precision parts such as electronic parts, semiconductor parts and liquid crystal display panels can be safely produced in high quality.
- The present invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Claims (8)
1. A detergent composition for cleaning a precision part, comprising:
an organic solvent,
5 to 30% by weight of a glyceryl ether having an alkyl group or alkenyl group having 4 to 12 carbon atoms, and
5% by weight or more of water.
2. The detergent composition according to claim 1 , wherein the organic solvent is contained in an amount of from 1 to 90% by weight.
3. The detergent composition according to claim 1 , which is usable for cleaning a precision part having flux stains, wherein the organic solvent is contained in an amount of from 50 to 90% by weight, and water is contained in an amount of from 5 to 30% by weight.
4. The detergent composition according to any one of claims 1 to 3 , wherein the organic solvent comprises an organic solvent having solubility of N,N-ethylenebisstearamide of 0.3% by weight or more at 70° C.
5. The detergent composition according to any one of claims 1 to 3 , wherein the organic solvent is at least one compound selected from the group consisting of benzyl alcohol, dipropylene glycol monopropyl ether and dipropylene glycol monobutyl ether.
6. The detergent composition according to claim 1 , which is usable for cleaning a precision part having liquid crystal stains, wherein each amount of the organic solvent and water is either:
(i) the organic solvent being in an amount of from 5 to 40% by weight, and water being in an amount of from 40 to 90% by weight; or
(ii) the organic solvent being in an amount of from 50 to 90% by weight, and water being in an amount of from 5 to 40% by weight.
7. The detergent composition according to claim 6 , further comprising a glycol ether compound.
8. The detergent composition according to claim 6 or 7, wherein the organic solvent is a hydrocarbon having 10 to 18 carbon atoms.
Applications Claiming Priority (2)
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JP2002103597 | 2002-04-05 | ||
JP2002-103597 | 2002-04-05 |
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US20030191037A1 true US20030191037A1 (en) | 2003-10-09 |
US7015182B2 US7015182B2 (en) | 2006-03-21 |
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US10/406,502 Expired - Fee Related US7015182B2 (en) | 2002-04-05 | 2003-04-04 | Detergent composition for cleaning precision parts |
Country Status (5)
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US (1) | US7015182B2 (en) |
JP (1) | JP4286021B2 (en) |
KR (1) | KR100972324B1 (en) |
CN (1) | CN1261556C (en) |
TW (1) | TWI230198B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070037724A1 (en) * | 2003-07-14 | 2007-02-15 | Kao Corporation | Cleaning composition for cip |
US20070057225A1 (en) * | 2005-09-09 | 2007-03-15 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
EP1849856A1 (en) * | 2004-12-21 | 2007-10-31 | Kao Corporation | Cleaner composition |
EP1962327A1 (en) * | 2005-11-22 | 2008-08-27 | Tokyo Ohka Kogyo Co., Ltd. | Washing liquid for photolithography, and method for washing exposure device using the same |
US20100210185A1 (en) * | 2005-09-09 | 2010-08-19 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive Hydrocarbon Fluid |
US20160108302A1 (en) * | 2013-05-31 | 2016-04-21 | Ntn Corporation | Water-soluble cutting/grinding fluid |
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---|---|---|---|---|
US7435711B2 (en) * | 2003-08-27 | 2008-10-14 | Kaken Tech Co., Ltd. | Cleaning agent for removing solder flux and method for cleaning solder flux |
JP5046714B2 (en) * | 2007-04-06 | 2012-10-10 | 花王株式会社 | Detergent composition for clothing |
US20090053085A1 (en) * | 2007-08-24 | 2009-02-26 | Thompson Loren M | Peristalitic pump assembly and method for attaching a cassette thereto |
JP5336173B2 (en) * | 2008-12-26 | 2013-11-06 | 花王株式会社 | Cleaning composition for hard surface |
JP5490774B2 (en) * | 2011-12-02 | 2014-05-14 | 花王株式会社 | Cleaning method for water-based pigment dispersion manufacturing apparatus |
CN104862124A (en) * | 2015-04-23 | 2015-08-26 | 深圳宣顶实业有限公司 | Part cleaning agent |
JP6598671B2 (en) * | 2015-12-24 | 2019-10-30 | 花王株式会社 | Cleaning composition for flux |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6074652A (en) * | 1996-05-20 | 2000-06-13 | Shiseido Co., Ltd. | Oil-in-water emulsified composition and oil-in-water emulsifying agent |
US6221816B1 (en) * | 1998-12-25 | 2001-04-24 | Kao Corporation | Detergent composition comprising a monoglyceryl ether |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0768551B2 (en) | 1989-10-26 | 1995-07-26 | 花王株式会社 | Cleaning composition |
JPH0434000A (en) | 1990-05-30 | 1992-02-05 | Hitachi Ltd | Flux cleanser and method for cleansing soldered electronic part with the same |
JPH06346094A (en) | 1993-06-02 | 1994-12-20 | Kuraray Co Ltd | Non-flammable cleanser composition |
JP3229711B2 (en) | 1993-06-08 | 2001-11-19 | 花王株式会社 | Detergent composition |
JP3044149B2 (en) * | 1993-06-18 | 2000-05-22 | 花王株式会社 | Cleaning composition for hard surfaces |
JPH09143495A (en) * | 1995-11-28 | 1997-06-03 | Dai Ichi Kogyo Seiyaku Co Ltd | Cleaning agent composition for hard surface and cleaning using the same |
JP3675941B2 (en) | 1996-03-22 | 2005-07-27 | 株式会社クラレ | Cleaning composition |
JPH11256200A (en) * | 1998-03-12 | 1999-09-21 | Kao Corp | Liquid detergent composition |
JP2000008080A (en) * | 1998-06-25 | 2000-01-11 | Dai Ichi Kogyo Seiyaku Co Ltd | Industrial detergent composition and cleaning using the same |
JP2001049293A (en) * | 1999-08-06 | 2001-02-20 | Lion Corp | Detergent composition |
JP2001354998A (en) * | 2000-06-15 | 2001-12-25 | Lion Corp | Detergent composition |
-
2003
- 2003-02-14 JP JP2003036257A patent/JP4286021B2/en not_active Expired - Lifetime
- 2003-04-01 KR KR1020030020378A patent/KR100972324B1/en active IP Right Grant
- 2003-04-02 TW TW092107525A patent/TWI230198B/en not_active IP Right Cessation
- 2003-04-04 CN CNB03109239XA patent/CN1261556C/en not_active Expired - Lifetime
- 2003-04-04 US US10/406,502 patent/US7015182B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6074652A (en) * | 1996-05-20 | 2000-06-13 | Shiseido Co., Ltd. | Oil-in-water emulsified composition and oil-in-water emulsifying agent |
US6221816B1 (en) * | 1998-12-25 | 2001-04-24 | Kao Corporation | Detergent composition comprising a monoglyceryl ether |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7786063B2 (en) * | 2003-07-14 | 2010-08-31 | Kao Corporation | Detergent composition for CIP comprising a C10-C14 aliphatic hydrocarbon and nonionic surfactant |
US20100093589A1 (en) * | 2003-07-14 | 2010-04-15 | Kiyoaki Yoshikawa | Detergent composition for cip |
US20070037724A1 (en) * | 2003-07-14 | 2007-02-15 | Kao Corporation | Cleaning composition for cip |
EP1849856A1 (en) * | 2004-12-21 | 2007-10-31 | Kao Corporation | Cleaner composition |
EP1849856A4 (en) * | 2004-12-21 | 2008-05-21 | Kao Corp | Cleaner composition |
US20080132439A1 (en) * | 2004-12-21 | 2008-06-05 | Akito Itoi | Cleaner Composition |
US20100210185A1 (en) * | 2005-09-09 | 2010-08-19 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive Hydrocarbon Fluid |
US7708904B2 (en) * | 2005-09-09 | 2010-05-04 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
US20070057225A1 (en) * | 2005-09-09 | 2007-03-15 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
KR101024835B1 (en) * | 2005-09-09 | 2011-03-28 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | Conductive hydrocarbon fluid |
US8353740B2 (en) | 2005-09-09 | 2013-01-15 | Saint-Gobain Ceramics & Plastics, Inc. | Conductive hydrocarbon fluid |
EP1962327A1 (en) * | 2005-11-22 | 2008-08-27 | Tokyo Ohka Kogyo Co., Ltd. | Washing liquid for photolithography, and method for washing exposure device using the same |
EP1962327A4 (en) * | 2005-11-22 | 2014-04-30 | Tokyo Ohka Kogyo Co Ltd | Washing liquid for photolithography, and method for washing exposure device using the same |
US20160108302A1 (en) * | 2013-05-31 | 2016-04-21 | Ntn Corporation | Water-soluble cutting/grinding fluid |
US10479917B2 (en) * | 2013-05-31 | 2019-11-19 | Ntn Corporation | Water-soluble cutting/grinding fluid |
Also Published As
Publication number | Publication date |
---|---|
JP4286021B2 (en) | 2009-06-24 |
JP2004002688A (en) | 2004-01-08 |
KR20030080208A (en) | 2003-10-11 |
KR100972324B1 (en) | 2010-07-26 |
CN1261556C (en) | 2006-06-28 |
CN1450156A (en) | 2003-10-22 |
TW200402469A (en) | 2004-02-16 |
TWI230198B (en) | 2005-04-01 |
US7015182B2 (en) | 2006-03-21 |
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