US20030127720A1 - Multi-chip stack package and fabricating method thereof - Google Patents

Multi-chip stack package and fabricating method thereof Download PDF

Info

Publication number
US20030127720A1
US20030127720A1 US10/248,296 US24829603A US2003127720A1 US 20030127720 A1 US20030127720 A1 US 20030127720A1 US 24829603 A US24829603 A US 24829603A US 2003127720 A1 US2003127720 A1 US 2003127720A1
Authority
US
United States
Prior art keywords
chip
back surface
bump
bumps
under
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/248,296
Inventor
Jen-Kuang Fang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Semiconductor Engineering Inc
Original Assignee
Advanced Semiconductor Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Engineering Inc filed Critical Advanced Semiconductor Engineering Inc
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC. reassignment ADVANCED SEMICONDUCTOR ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FANG, JEN-KUANG
Publication of US20030127720A1 publication Critical patent/US20030127720A1/en
Priority to US11/689,507 priority Critical patent/US7635610B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/0502—Disposition
    • H01L2224/05023—Disposition the whole internal layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05075—Plural internal layers
    • H01L2224/0508—Plural internal layers being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/171—Disposition
    • H01L2224/1718—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/17181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to a multi-chip stack package. More particularly, the present invention relates to a multi-chip stack package and fabricating method thereof that can improve the quality of a multi-chip stack package.
  • FIG. 1 is a cross-sectional view of a conventional multi-chip stack package.
  • a first chip 110 having a first active surface 112 and a first chip back surface 114 is provided.
  • the first chip 110 further includes a plurality of first bonding pads 116 positioned over the active surface 112.
  • a substrate 120 having a substrate surface 122 is also provided.
  • the substrate 120 has a plurality of first contacts 124 and a plurality of second contacts 126 on the substrate surface 122.
  • the first chip 110 and the substrate 120 are joined together using a conventional flip chip method.
  • a plurality of bumps 130 are formed over the first bonding pads 116 of the first chip 110.
  • the first chip 110 is positioned over the substrate 120 such that each bump 130 is aligned with a corresponding first contact 124 on the substrate surface 122.
  • a reflow process is conducted so that the bumps 130 and the first contacts 124 are bonded together.
  • filler material 132 is injected into the space between the chip 110 and the substrate 120 so that the filler material 132 encloses the bumps 130.
  • a second chip 140 having a second active surface 142 and corresponding second chip back surface 144 is provided.
  • the second chip 140 further includes a plurality of second bonding pads 146 positioned on the second active surface 142. Through an adhesive glue 150, the second chip back surface 144 of the second chip 140 is attached to the first chip back surface 114.
  • a wire-bonding operation is conducted to form a plurality of conductive wires 152 with one end bonded to the second bonding pads 146 of the second chip 140 and the other end bonded to the second contacts 126 on the substrate 120.
  • the first chip 110, the second chip 140 and the conductive wires 152 are encapsulated by injecting a packaging glue 150 in a molding process.
  • adhesive glue 150 is spread over the first chip back surface 114 before attaching the second chip 140 onto the first chip back surface 114 in the process of joining the first chip 110 and the second chip 140.
  • some adhesive material 150 will bleed out. That is, some of the adhesive glue 150 may be forced out from the attachment region of the second chip 140.
  • the adhesive glue 150 may "climb" to the second active surface 142 and hence affect the wire-bonding operation. If the adhesive glue 150 creeps into the second bonding pad 146 surface, the conductive wire 152 is no longer able to bond with the second bonding pad 146.
  • the wire-bonding head (not shown) of the wire-bonding machine may also drag up some adhesive material. Ultimately, the quality of electrical connections between the first chip 110 and the second chip 140 is likely to be affected.
  • one object of the present invention is to provide a multi-chip stack package and a fabricating method thereof that can improve bonding quality of the multi-chip stack.
  • the invention provides a multi-chip stack package.
  • the multi-chip stack package includes at least a substrate, a first chip, a second chip, a plurality of bumps, a plurality of junction interface bumps, a plurality of conductive wires, some first filler material, some second filler material and some packaging material.
  • the substrate has a substrate surface with a plurality of first contacts and a plurality of second contacts thereon.
  • the first chip has a first active surface and a first chip back surface.
  • the first chip also has a plurality of first bonding pads on the first active surface.
  • the first chip is attached to the empty area on the substrate surface such that the first active surface faces the substrate surface.
  • the second chip has a second active surface and a corresponding second chip back surface.
  • the second chip has a plurality of second bonding pads on the second active surface.
  • the second chip is attached to the empty area on the first chip back surface such that the second chip back surface faces the first chip back surface.
  • the bumps are positioned between the first bonding pads and the first contacts.
  • the junction interface bumps are positioned between first chip back surface and the second chip back surface. One end of each conductive wire is bonded to one of the second bonding pads while the other end of the conductive wire is bonded to the second contact.
  • the first filler material encloses the bumps.
  • the second filler material encloses the junction interface bumps.
  • the packaging material encloses the first chip, the second chip and the conductive wires.
  • an under-bump-metallurgy layer also may be formed on the first chip back surface and the second chip back surface.
  • the under-bump-metallurgy layer includes a barrier layer and a seed layer.
  • the barrier layer is fabricated using a material such as titanium, tungsten-titanium or chromium and the seed layer is fabricated using a material such as copper.
  • the junction interface bumps are fabricated using a material such as lead-tin alloy.
  • FIG. 1 is a cross-sectional view of a conventional multi-chip stack package
  • FIGs. 2 to 11 are schematic cross-sectional views showing the progression of steps for fabricating a multi-chip stack package according to a first preferred embodiment of this invention
  • FIG. 12 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a second preferred embodiment of this invention.
  • FIG. 13 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a third preferred embodiment of this invention.
  • FIG. 14 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fourth preferred embodiment of this invention.
  • FIG. 15 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fifth preferred embodiment of this invention.
  • FIG. 16 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a sixth preferred embodiment of this invention.
  • FIG. 17 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a seventh preferred embodiment of this invention.
  • FIGs. 2 to 11 are schematic cross-sectional views showing the progression of steps for fabricating a multi-chip stack package according to a first preferred embodiment of this invention.
  • a first chip 210 having a first active surface 212 and a first chip back surface 214 is provided.
  • the first chip 210 further includes a plurality of first bonding pads 216 positioned on the first active surface 212 of the first chip 210. Thereafter, a process is carried out to form an under-bump-metallurgy layer.
  • a sputtering process is conducted to form a first barrier layer 222 and a second barrier layer 232 over the first active surface 212 and the first chip back surface 214 of the first chip 210 respectively.
  • the first barrier layer 222 and the second barrier layer 232 are fabricated using a material such as titanium, tungsten titanium or chromium.
  • an electroplating is carried out to form a first seed layer 224 and a second seed layer 234 over the first barrier layer 222 and the second barrier layer 232 respectively.
  • the first seed layer and the second seed layer are fabricated using a metallic material such as copper.
  • a first under-bump-metallurgy layer 220 comprising of the first barrier layer 222 and the first seed layer 224 and a second under-bump-metallurgy layer 220 comprising of the second barrier layer 232 and the second seed layer 234 are formed.
  • a process for fabricating bumps is carried out.
  • a screen printing or a photolithographic/electroplating method is used to form a plurality of first bumps 226 over the first under-bump-metallurgy layer 220 and a plurality of second bumps 236 over the second under-bump-metallurgy layer 230.
  • the first bumps 226 must be positioned to correspond with the first bonding pads 216.
  • the first bumps 226 and the second bumps 236 are fabricated using a lead-tin alloy having a high lead content such as a tin-lead content of 5/95.
  • an etching operation is carried out using an etchant (not shown) that can remove the exposed first under-bump-metallurgy layer 220 and the second under-bump-metallurgy layer 230.
  • a reflow operation is carried out so that the first bumps 226 and the second bumps 236 are transformed into mass of lumps having a spherical profile.
  • a substrate 240 having a first substrate surface 242 is provided.
  • the substrate 240 also has a plurality of first contacts 244 and a plurality of second contacts 246 positioned on the substrate surface 242.
  • the second contacts 246 are located in a band that surrounds the first contacts 244.
  • a flip chip attachment process is carried out.
  • the first bumps 226 are aligned with the first contacts 244 and then a reflow process is conducted so that the first bumps 226 bond with corresponding first contacts 244.
  • the first chip 210 is firmly attached to the substrate 240.
  • a first filler material 228 is injected into the space between the first chip 210 and the substrate 240.
  • the first filler material 228 encloses the first bumps 226.
  • a second chip 250 having a second active surface 252 and a corresponding second chip back surface 254 is provided.
  • the second chip 250 further includes a plurality of second bonding pads 256 positioned around the peripheral region over the second active surface 252.
  • a third under-bump-metallurgy layer 260 and a plurality of third bumps 262 are formed on the second chip back surface 254.
  • the third under-bump-metallurgy layer 260 and the third bumps 262 are formed in a similar way as the second under-bump-metallurgy layer 230 and the second bumps 236 with one major difference.
  • the third bumps are fabricated using a lead-tin alloy having a low lead content such as a lead-tin alloy with a lead-tin ratio of 37/63.
  • the third bumps 262 and the second bumps 236 are properly aligned and then a reflow operation is carried out so that the third bumps 262 and their corresponding second bumps 236 are bonded together to form a plurality of junction interface bumps 264.
  • the second chip 250 is firmly attached to the first chip 210.
  • a second filler material 266 is injected into the space between the first chip 210 and the second chip 250.
  • the second filler material 266 encloses the interface junction bumps 264.
  • a wire-bonding operation is carried out to form a plurality of bonding wires 270.
  • One end of each wire 270 bonded to one of the second bonding pads on the second chip 250 and the other end bonded to one of the second contacts 246 on the substrate 240.
  • a packaging process is carried out by injecting a packaging material 280 to enclose the first chip 210, the second chip 250, the conductive wires 270, the first filler material 228, the second filler material 266 and the substrate surface 242.
  • a packaging material 280 is injection-dielectric material to enclose the first chip 210, the second chip 250, the conductive wires 270, the first filler material 228, the second filler material 266 and the substrate surface 242.
  • the junction interface bumps 264 creates a space between the first chip 210 and the second chip 250. Filling the space with the second filler material 266 prevents any filler material from squeezing out to form a patch of bled plastic material and improves the quality of junction between the first chip 210 and the second chip 250. Furthermore, since the junction interface bumps 264 are fabricated using lead-tin alloy, the junction interface bumps 264 provide better electrical properties than the conventional thermal conductive glue.
  • etching step is conducted in the aforementioned fabrication process to remove the exposed second under-bump-metallurgy layer and the third under-bump-metallurgy layer.
  • the step of etching the second under-bump-metallurgy layer or the third under-bump-metallurgy layer may be deleted in a second preferred embodiment of this invention.
  • Fig. 12 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a second preferred embodiment of this invention. Without conducting an etching operation, the second under-bump-metallurgy layer 330 and the third under-bump-metallurgy layer 360 cover the entire surface of the first chip back surface 314 and the second chip back surface 354 respectively.
  • FIG. 13 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a third preferred embodiment of this invention. Without an under-bump-metallurgy layer, the second bumps 436 and the third bumps 462 are directly formed on the first chip back surface 414 and the second chip back surface 454 respectively.
  • Fig. 14 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fourth preferred embodiment of this invention. In Fig.
  • the second bumps 536 over the second under-bump-metallurgy layer 530 on the first chip back surface 514 have a relatively low lead content and the third bumps 562 over the third under-bump-metallurgy layer 560 on the second chip back surface 554 have a relatively high lead content.
  • the second bumps 536 and the third bumps 562 may still join together to form a plurality of junction interface bumps.
  • Fig. 15 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fifth preferred embodiment of this invention.
  • a plurality of bumps 662 is formed over the third under-bump-metallurgy layer 660 on the second chip back surface 654 only.
  • the bumps 662 bond with the second under-bump-metallurgy layer 630 on the first chip back surface 614 to form junction interface bumps.
  • One end of the interface junction bump joins up with the third under-bump-metallurgy layer 660 while the other end joins up with the second under-bump-metallurgy layer 630.
  • the bumps 662 may be fabricated using a lead-tin alloy having a low lead content.
  • a first filler material is injected into the space between the first chip and the substrate after joining the first chip and the substrate together.
  • a second filler material is injected into the space between the second chip and the first chip after joining the second chip and the first chip together.
  • packaging material is used to enclose the chips.
  • Fig. 16 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a sixth preferred embodiment of this invention.
  • the first bumps 726 and the junction interface bumps 764 are enclosed when packaging material 780 flows into the space between the first chip 710 and the substrate 740 and the space between the second chip 750 and the first chip 710 in the final packaging process.
  • FIG. 17 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a seventh preferred embodiment of this invention.
  • Fig. 17 only one junction interface bump 864 with one end joining to the second under-bump-metallurgy layer 830 on the first chip back surface 814 and the other end joining to the third under-bump-metallurgy layer 860 on the second chip back surface 854 is used.
  • the packaging material 880 directly encloses the junction interface bump 864.
  • One major aspect of this invention is the positioning of at least one bump to join up the back surface of two chips.
  • the two chips have very similar expansion coefficiency.
  • the bump will not detach from the chip surfaces after repeated cyclic expansion and contraction even if the bumps joining the two chips are not enclosed by a filler material.
  • the multi-chip stack package has a plurality of junction interface bumps that creates a space between the first chip and the second chip.
  • the space is subsequently filled with a second filler material. In this way, out-bleeding of second filler material from a space is prevented and hence junction quality between the first chip and the second chip is improved.
  • junction interface bumps are fabricated using a lead-tin alloy, electrical properties of the interface junction bumps are much better than the chips joined by conventional thermal conductive plastics. Hence, electrical performance between the first and the second chip is improved.

Abstract

Abstract of Disclosure
A multi-chip stack package having a substrate, a first chip, a second chip, a plurality of bumps, a plurality of junction interface bumps, a plurality of conductive wires, a first filler material, a second filler material and an encapsulating material is provided. The substrate has a substrate surface with a plurality of first contacts and a plurality of second contacts. The first chip has a first active surface with a plurality of bonding pads thereon and a first chip back surface. The first chip is positioned over the substrate surface. The second chip has a second active surface with a plurality of bonding pads thereon and a second chip back surface. The second chip is positioned over the first chip back surface. The bumps are positioned between the first bonding pads and the first contacts. The junction interface bumps are positioned between the first chip back surface and the second chip back surface. The conductive wires electrically connect the second bonding pads and the second contacts. The first filler material encloses the bumps and the second filler material encloses the junction interface bumps. The encapsulating material encloses the first chip, the second chip and the conductive wires.

Description

    Cross Reference to Related Applications
  • This application claims the priority benefit of Taiwan application serial no. 91100096, filed January 7, 2002.[0001]
    • Background of Invention
  • Field of Invention[0002]
  • The present invention relates to a multi-chip stack package. More particularly, the present invention relates to a multi-chip stack package and fabricating method thereof that can improve the quality of a multi-chip stack package.[0003]
  • Description of Related Art[0004]
  • As electronic technologies continue to advance, more personalized, multi-functional high-tech electronic products are being introduced into the market. The newer electronic products are characteristically smaller, lighter and slimmer so that the product will occupy less space and be more portable. In semiconductor manufacturing, many types of packages now incorporate a multi-chip concept so that volume occupation of an integrated circuit is reduced and electrical performance is improved. In a multi-chip stack package, a few chips are stacked over each other and enclosed inside the package so that horizontal sectional area of the package is greatly reduced. [0005]
  • Fig. 1 is a cross-sectional view of a conventional multi-chip stack package. To fabricate a multi-chip stack package, a [0006] first chip 110 having a first active surface 112 and a first chip back surface 114 is provided. The first chip 110 further includes a plurality of first bonding pads 116 positioned over the active surface 112. A substrate 120 having a substrate surface 122 is also provided. The substrate 120 has a plurality of first contacts 124 and a plurality of second contacts 126 on the substrate surface 122. The first chip 110 and the substrate 120 are joined together using a conventional flip chip method. First, a plurality of bumps 130 are formed over the first bonding pads 116 of the first chip 110. Thereafter, the first chip 110 is positioned over the substrate 120 such that each bump 130 is aligned with a corresponding first contact 124 on the substrate surface 122. A reflow process is conducted so that the bumps 130 and the first contacts 124 are bonded together. Afterwards, filler material 132 is injected into the space between the chip 110 and the substrate 120 so that the filler material 132 encloses the bumps 130. A second chip 140 having a second active surface 142 and corresponding second chip back surface 144 is provided. The second chip 140 further includes a plurality of second bonding pads 146 positioned on the second active surface 142. Through an adhesive glue 150, the second chip back surface 144 of the second chip 140 is attached to the first chip back surface 114. A wire-bonding operation is conducted to form a plurality of conductive wires 152 with one end bonded to the second bonding pads 146 of the second chip 140 and the other end bonded to the second contacts 126 on the substrate 120. Finally, the first chip 110, the second chip 140 and the conductive wires 152 are encapsulated by injecting a packaging glue 150 in a molding process.
  • In the aforementioned fabrication process, adhesive glue 150 is spread over the first [0007] chip back surface 114 before attaching the second chip 140 onto the first chip back surface 114 in the process of joining the first chip 110 and the second chip 140. However, if too much attaching pressure is applied to the second chip 140, some adhesive material 150 will bleed out. That is, some of the adhesive glue 150 may be forced out from the attachment region of the second chip 140. In some cases, the adhesive glue 150 may "climb" to the second active surface 142 and hence affect the wire-bonding operation. If the adhesive glue 150 creeps into the second bonding pad 146 surface, the conductive wire 152 is no longer able to bond with the second bonding pad 146. In addition, the wire-bonding head (not shown) of the wire-bonding machine (not shown) may also drag up some adhesive material. Ultimately, the quality of electrical connections between the first chip 110 and the second chip 140 is likely to be affected.
    • Summary of Invention
  • Accordingly, one object of the present invention is to provide a multi-chip stack package and a fabricating method thereof that can improve bonding quality of the multi-chip stack. [0008]
  • To achieve these and other advantages and in accordance with the purpose of the invention as embodied and broadly described herein, the invention provides a multi-chip stack package. The multi-chip stack package includes at least a substrate, a first chip, a second chip, a plurality of bumps, a plurality of junction interface bumps, a plurality of conductive wires, some first filler material, some second filler material and some packaging material. The substrate has a substrate surface with a plurality of first contacts and a plurality of second contacts thereon. The first chip has a first active surface and a first chip back surface. The first chip also has a plurality of first bonding pads on the first active surface. The first chip is attached to the empty area on the substrate surface such that the first active surface faces the substrate surface. The second chip has a second active surface and a corresponding second chip back surface. The second chip has a plurality of second bonding pads on the second active surface. The second chip is attached to the empty area on the first chip back surface such that the second chip back surface faces the first chip back surface. The bumps are positioned between the first bonding pads and the first contacts. The junction interface bumps are positioned between first chip back surface and the second chip back surface. One end of each conductive wire is bonded to one of the second bonding pads while the other end of the conductive wire is bonded to the second contact. The first filler material encloses the bumps. The second filler material encloses the junction interface bumps. The packaging material encloses the first chip, the second chip and the conductive wires. [0009]
  • According to the embodiment of this invention, an under-bump-metallurgy layer also may be formed on the first chip back surface and the second chip back surface. The under-bump-metallurgy layer includes a barrier layer and a seed layer. The barrier layer is fabricated using a material such as titanium, tungsten-titanium or chromium and the seed layer is fabricated using a material such as copper. In addition, the junction interface bumps are fabricated using a material such as lead-tin alloy.[0010]
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.[0011]
    • Brief Description of Drawings
  • The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,[0012]
  • Fig. 1 is a cross-sectional view of a conventional multi-chip stack package;[0013]
  • Figs. 2 to 11 are schematic cross-sectional views showing the progression of steps for fabricating a multi-chip stack package according to a first preferred embodiment of this invention;[0014]
  • Fig. 12 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a second preferred embodiment of this invention;[0015]
  • Fig. 13 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a third preferred embodiment of this invention;[0016]
  • Fig. 14 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fourth preferred embodiment of this invention;[0017]
  • Fig. 15 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fifth preferred embodiment of this invention;[0018]
  • Fig. 16 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a sixth preferred embodiment of this invention; and[0019]
  • Fig. 17 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a seventh preferred embodiment of this invention.[0020]
    • Detailed Description
  • Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or similar parts.[0021]
  • Figs. 2 to 11 are schematic cross-sectional views showing the progression of steps for fabricating a multi-chip stack package according to a first preferred embodiment of this invention. As shown in Fig. 2, a [0022] first chip 210 having a first active surface 212 and a first chip back surface 214 is provided. The first chip 210 further includes a plurality of first bonding pads 216 positioned on the first active surface 212 of the first chip 210. Thereafter, a process is carried out to form an under-bump-metallurgy layer. To form the under-bump-metallurgy layer, a sputtering process is conducted to form a first barrier layer 222 and a second barrier layer 232 over the first active surface 212 and the first chip back surface 214 of the first chip 210 respectively. The first barrier layer 222 and the second barrier layer 232 are fabricated using a material such as titanium, tungsten titanium or chromium. Thereafter, an electroplating is carried out to form a first seed layer 224 and a second seed layer 234 over the first barrier layer 222 and the second barrier layer 232 respectively. The first seed layer and the second seed layer are fabricated using a metallic material such as copper. Hence, a first under-bump-metallurgy layer 220 comprising of the first barrier layer 222 and the first seed layer 224 and a second under-bump-metallurgy layer 220 comprising of the second barrier layer 232 and the second seed layer 234 are formed.
  • As shown in Fig. 3, a process for fabricating bumps is carried out. A screen printing or a photolithographic/electroplating method is used to form a plurality of [0023] first bumps 226 over the first under-bump-metallurgy layer 220 and a plurality of second bumps 236 over the second under-bump-metallurgy layer 230. The first bumps 226 must be positioned to correspond with the first bonding pads 216. The first bumps 226 and the second bumps 236 are fabricated using a lead-tin alloy having a high lead content such as a tin-lead content of 5/95.
  • As shown in Figs. 3 and 4, an etching operation is carried out using an etchant (not shown) that can remove the exposed first under-bump-[0024] metallurgy layer 220 and the second under-bump-metallurgy layer 230.
  • As shown in Fig. 5, a reflow operation is carried out so that the [0025] first bumps 226 and the second bumps 236 are transformed into mass of lumps having a spherical profile.
  • As shown in Fig. 6, a [0026] substrate 240 having a first substrate surface 242 is provided. The substrate 240 also has a plurality of first contacts 244 and a plurality of second contacts 246 positioned on the substrate surface 242. The second contacts 246 are located in a band that surrounds the first contacts 244. Next, a flip chip attachment process is carried out. The first bumps 226 are aligned with the first contacts 244 and then a reflow process is conducted so that the first bumps 226 bond with corresponding first contacts 244. Hence, the first chip 210 is firmly attached to the substrate 240.
  • As shown in Fig. 7, a [0027] first filler material 228 is injected into the space between the first chip 210 and the substrate 240. The first filler material 228 encloses the first bumps 226.
  • As shown in Figs. 7 an 8, a [0028] second chip 250 having a second active surface 252 and a corresponding second chip back surface 254 is provided. The second chip 250 further includes a plurality of second bonding pads 256 positioned around the peripheral region over the second active surface 252. Before carrying out a chip bonding process, a third under-bump-metallurgy layer 260 and a plurality of third bumps 262 are formed on the second chip back surface 254. The third under-bump-metallurgy layer 260 and the third bumps 262 are formed in a similar way as the second under-bump-metallurgy layer 230 and the second bumps 236 with one major difference. The third bumps are fabricated using a lead-tin alloy having a low lead content such as a lead-tin alloy with a lead-tin ratio of 37/63. In the chip bonding process, the third bumps 262 and the second bumps 236 are properly aligned and then a reflow operation is carried out so that the third bumps 262 and their corresponding second bumps 236 are bonded together to form a plurality of junction interface bumps 264. Hence, the second chip 250 is firmly attached to the first chip 210.
  • As shown in Fig. 9, a [0029] second filler material 266 is injected into the space between the first chip 210 and the second chip 250. The second filler material 266 encloses the interface junction bumps 264.
  • As shown in Fig. 10, a wire-bonding operation is carried out to form a plurality of [0030] bonding wires 270. One end of each wire 270 bonded to one of the second bonding pads on the second chip 250 and the other end bonded to one of the second contacts 246 on the substrate 240.
  • As shown in Fig. 11, a packaging process is carried out by injecting a [0031] packaging material 280 to enclose the first chip 210, the second chip 250, the conductive wires 270, the first filler material 228, the second filler material 266 and the substrate surface 242. Thus, fabrication of the multi-chip stack package 200 is complete.
  • In the aforementioned fabrication process, the junction interface bumps 264 creates a space between the [0032] first chip 210 and the second chip 250. Filling the space with the second filler material 266 prevents any filler material from squeezing out to form a patch of bled plastic material and improves the quality of junction between the first chip 210 and the second chip 250. Furthermore, since the junction interface bumps 264 are fabricated using lead-tin alloy, the junction interface bumps 264 provide better electrical properties than the conventional thermal conductive glue.
  • In addition, an etching step is conducted in the aforementioned fabrication process to remove the exposed second under-bump-metallurgy layer and the third under-bump-metallurgy layer. However, the step of etching the second under-bump-metallurgy layer or the third under-bump-metallurgy layer may be deleted in a second preferred embodiment of this invention. Fig. 12 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a second preferred embodiment of this invention. Without conducting an etching operation, the second under-bump-[0033] metallurgy layer 330 and the third under-bump-metallurgy layer 360 cover the entire surface of the first chip back surface 314 and the second chip back surface 354 respectively.
  • In the aforementioned fabrication process, an under-bump-metallurgy layer is formed on the back surface of both the first chip and the second chip. However, the package still functions even if the first chip back surface has no second under-bump-metallurgy layer and the second chip back surface has no third under-bump-metallurgy layer. In the third embodiment of this invention, no under-bump-metallurgy layer is formed on the first chip back surface and the second chip back surface. Fig. 13 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a third preferred embodiment of this invention. Without an under-bump-metallurgy layer, the second bumps 436 and the [0034] third bumps 462 are directly formed on the first chip back surface 414 and the second chip back surface 454 respectively.
  • In the aforementioned fabrication process, second bumps with a relatively high lead content are formed over the second under-bump-metallurgy layer on the first chip back surface and third bumps with a relatively low lead content are formed over the third under-bump-metallurgy layer on the second chip back surface. However, an alternative arrangement as shown in Fig. 14 may be used. Fig. 14 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fourth preferred embodiment of this invention. In Fig. 14, the [0035] second bumps 536 over the second under-bump-metallurgy layer 530 on the first chip back surface 514 have a relatively low lead content and the third bumps 562 over the third under-bump-metallurgy layer 560 on the second chip back surface 554 have a relatively high lead content. With this arrangement, the second bumps 536 and the third bumps 562 may still join together to form a plurality of junction interface bumps.
  • In the aforementioned fabrication process, bumps with relatively high lead content and bumps with relatively low lead content are formed on the back surface of the two chips before joining the chips together. However, it is equally feasible to form a plurality of bumps over the under-bump-metallurgy layer on the back surface of just one chip before joining the first and the second chips together as shown in Fig. 15. Fig. 15 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a fifth preferred embodiment of this invention. In Fig. 15, a plurality of [0036] bumps 662 is formed over the third under-bump-metallurgy layer 660 on the second chip back surface 654 only. Through a reflow process, the bumps 662 bond with the second under-bump-metallurgy layer 630 on the first chip back surface 614 to form junction interface bumps. One end of the interface junction bump joins up with the third under-bump-metallurgy layer 660 while the other end joins up with the second under-bump-metallurgy layer 630. The bumps 662 may be fabricated using a lead-tin alloy having a low lead content.
  • In the aforementioned fabrication process, a first filler material is injected into the space between the first chip and the substrate after joining the first chip and the substrate together. Similarly, a second filler material is injected into the space between the second chip and the first chip after joining the second chip and the first chip together. Finally, packaging material is used to enclose the chips. However, an alternative processing arrangement as shown in Fig. 16 may be implemented. Fig. 16 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a sixth preferred embodiment of this invention. In Fig. 16, the first bumps 726 and the junction interface bumps 764 are enclosed when packaging [0037] material 780 flows into the space between the first chip 710 and the substrate 740 and the space between the second chip 750 and the first chip 710 in the final packaging process.
  • In the aforementioned fabrication process, a plurality of junction interface bumps is used to bond the first chip and the second chip together. However, the fabrication process in this invention need not be restricted as such. Fig. 17 is a schematic cross-sectional view showing a step in the fabrication of a multi-chip stack package according to a seventh preferred embodiment of this invention. In Fig. 17, only one [0038] junction interface bump 864 with one end joining to the second under-bump-metallurgy layer 830 on the first chip back surface 814 and the other end joining to the third under-bump-metallurgy layer 860 on the second chip back surface 854 is used. In addition, the packaging material 880 directly encloses the junction interface bump 864.
  • Anyone familiar with fabrication technologies may notice that the multi-chip stack package according to this invention is not limited to the structural layout as shown in the figures. In fact, each embodiment may be applied singly or in combination with others to form a complete package.[0039]
  • One major aspect of this invention is the positioning of at least one bump to join up the back surface of two chips. In general, the two chips have very similar expansion coefficiency. Hence, the bump will not detach from the chip surfaces after repeated cyclic expansion and contraction even if the bumps joining the two chips are not enclosed by a filler material.[0040]
  • In summary, major advantages of this invention include:[0041]
  • 1. The multi-chip stack package has a plurality of junction interface bumps that creates a space between the first chip and the second chip. The space is subsequently filled with a second filler material. In this way, out-bleeding of second filler material from a space is prevented and hence junction quality between the first chip and the second chip is improved. [0042]
  • 2. Since the junction interface bumps are fabricated using a lead-tin alloy, electrical properties of the interface junction bumps are much better than the chips joined by conventional thermal conductive plastics. Hence, electrical performance between the first and the second chip is improved.[0043]
  • It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents. [0044]

Claims (21)

Claims
1. A multi-chip stack package, comprising:
a substrate having a substrate surface with a plurality of first contacts and a plurality of second contacts thereon;
a first chip having a first active surface and a corresponding first chip back surface, wherein the first chip has a plurality of first bonding pads on the first active surface and the first chip is over the substrate surfaces such that the first active surface faces the substrate surface;
a second chip having a second active surface and a corresponding second chip back surface, wherein the second chip has a plurality of second bonding pads on the second active surface and the second chip is over the first chip back surface such that the second chip back surface faces the first chip back surface;
a plurality of bumps connecting the first bonding pads and the first contacts;
a plurality of junction interface bumps connecting the first chip back surface and the second chip back surface;
a plurality of conductive wires with one end bonded to one of the second bonding pads and the other end bonded to one of the second contacts;
a first filler material enclosing the bumps;
a second filler material enclosing the junction interface bumps; and
an encapsulate material at least enclosing the first chip, the second chip and the conductive wires.
2. The multi-chip stack package of claim 1, wherein the package further includes an under-bump-metallurgy layer on the first chip back surface.
3. The multi-chip stack package of claim 2, wherein the under-bump-metallurgy layer includes a barrier layer over the first chip back surface.
4. The multi-chip stack package of claim 3, wherein the barrier layer is fabricated using a metallic material selected from the group consisting of titanium, titanium tungsten and chromium.
5. The multi-chip stack package of claim 4, wherein the under-bump-metallurgy layer further includes a seed layer over the barrier layer and the seed layer is fabricated using a metallic material .
6. The multi-chip stack package of claim 1, wherein the package further includes an under-bump-metallurgy layer on the second chip back surface.
7. The multi-chip stack package of claim 6, wherein the under-bump-metallurgy layer includes a barrier layer over the second chip back surface and the barrier layer is fabricated using a metallic material selected from the group consisting of titanium, titanium tungsten and chromium.
8. The multi-chip stack package of claim 7, wherein the under-bump-metallurgy layer further includes a seed layer over the barrier layer.
9. The multi-chip stack package of claim 8, wherein the seed layer is fabricated using a metallic material.
10. The multi-chip stack package of claim 1, wherein the junction interface bumps are fabricated using a lead-tin alloy.
11. A multi-chip bonded structure, at least comprising:
a first chip having a first chip back surface;
a second chip over the first chip back surface, wherein the second chip has a second chip back surface and the second chip back surface faces the first chip back surface; and
at least one bump between the first chip back surface and the second chip back surface.
12. The multi-chip bonded structure of claim 11, wherein the structure further includes an under-bump-metallurgy layer on the first chip back surface.
13. The multi-chip bonded structure of claim 12, wherein the under-bump-metallurgy layer includes a barrier layer over the first chip back surface.
14. The multi-chip bonded structure of claim 13, wherein the barrier layer is fabricated using a metallic material selected from the group consisting of titanium, titanium tungsten and chromium.
15. The multi-chip bonded structure of claim 13, wherein the under-bump-metallurgy layer further includes a seed layer over the barrier layer and that the seed layer is fabricated using a metallic material.
16. The multi-chip bonded structure of claim 11, wherein the package further includes an under-bump-metallurgy layer on the second chip back surface.
17. The multi-chip bonded structure of claim 16, wherein the under-bump-metallurgy layer includes a barrier layer over the second chip back surface and the barrier layer is fabricated using a metallic material selected from a group consisting of titanium, titanium tungsten and chromium.
18. The multi-chip bonded structure of claim 17, wherein the under-bump-metallurgy layer further includes a seed layer over the barrier layer.
19. The multi-chip bonded structure of claim 18, wherein the seed layer is fabricated using a metallic material including copper.
20. The multi-chip bonded structure of claim 11, wherein the bumps are fabricated using a lead-tin alloy.
21. The multi-chip bonded structure of claim 11, wherein the structure further includes a filler material that encloses the bumps.
US10/248,296 2002-01-07 2003-01-07 Multi-chip stack package and fabricating method thereof Abandoned US20030127720A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/689,507 US7635610B2 (en) 2002-01-07 2007-03-21 Multi-chip stack package and fabricating method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW091100096A TW529141B (en) 2002-01-07 2002-01-07 Stacking type multi-chip package and its manufacturing process
TW91100096 2002-01-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/689,507 Division US7635610B2 (en) 2002-01-07 2007-03-21 Multi-chip stack package and fabricating method thereof

Publications (1)

Publication Number Publication Date
US20030127720A1 true US20030127720A1 (en) 2003-07-10

Family

ID=21688170

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/248,296 Abandoned US20030127720A1 (en) 2002-01-07 2003-01-07 Multi-chip stack package and fabricating method thereof
US11/689,507 Expired - Lifetime US7635610B2 (en) 2002-01-07 2007-03-21 Multi-chip stack package and fabricating method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/689,507 Expired - Lifetime US7635610B2 (en) 2002-01-07 2007-03-21 Multi-chip stack package and fabricating method thereof

Country Status (2)

Country Link
US (2) US20030127720A1 (en)
TW (1) TW529141B (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040063304A1 (en) * 2002-09-24 2004-04-01 Robert-Christian Hagen Electronic component with a stack of semiconductor chips and a method for producing the electronic component
US20050003578A1 (en) * 2003-07-01 2005-01-06 Chi-Long Wu Method of fabricating organic electroluminescence panel package
US20050205982A1 (en) * 2004-03-19 2005-09-22 Nec Electronics Corporation Semiconductor device
US20050242426A1 (en) * 2004-04-30 2005-11-03 Samsung Electronics Co., Ltd. Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
US20080001272A1 (en) * 2006-06-30 2008-01-03 Chi-Chih Chu System-in-package structure
US20110045636A1 (en) * 2007-06-26 2011-02-24 Hynix Semiconductor Inc. Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same
CN104576416A (en) * 2013-10-24 2015-04-29 扬州倍英斯微电子有限公司 Double-layer convex-point diode chip preparation method
US20160172272A1 (en) * 2014-12-11 2016-06-16 Stmicroelectronics Pte Ltd Integrated circuit (ic) package with a solder receiving area and associated methods
US9679811B2 (en) 2008-12-31 2017-06-13 STATS ChipPAC Pte. Ltd. Semiconductor device and method of confining conductive bump material with solder mask patch
US10163871B2 (en) * 2015-10-02 2018-12-25 Qualcomm Incorporated Integrated device comprising embedded package on package (PoP) device
US20220093543A1 (en) * 2020-09-22 2022-03-24 Samsung Electronics Co., Ltd. Semiconductor package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4084834B2 (en) * 2005-03-29 2008-04-30 松下電器産業株式会社 Flip chip mounting method and bump forming method
US8766428B2 (en) * 2009-12-02 2014-07-01 Stats Chippac Ltd. Integrated circuit packaging system with flip chip and method of manufacture thereof
US9177944B2 (en) * 2010-12-03 2015-11-03 Xilinx, Inc. Semiconductor device with stacked power converter
US9362187B2 (en) * 2013-01-18 2016-06-07 Infineon Technologies Ag Chip package having terminal pads of different form factors
US20200402958A1 (en) * 2019-06-20 2020-12-24 Advanced Semiconductor Engineering, Inc. Semiconductor device packages and methods of manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399898A (en) * 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
US5726502A (en) * 1996-04-26 1998-03-10 Motorola, Inc. Bumped semiconductor device with alignment features and method for making the same
US6127724A (en) * 1996-10-31 2000-10-03 Tessera, Inc. Packaged microelectronic elements with enhanced thermal conduction
US6157080A (en) * 1997-11-06 2000-12-05 Sharp Kabushiki Kaisha Semiconductor device using a chip scale package
US6249044B1 (en) * 1999-06-17 2001-06-19 National Semiconductor Corp. Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices
US6353263B1 (en) * 1999-04-14 2002-03-05 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US6555917B1 (en) * 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315540A (en) * 1992-05-14 1993-11-26 Fujitsu Ltd Semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399898A (en) * 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
US5726502A (en) * 1996-04-26 1998-03-10 Motorola, Inc. Bumped semiconductor device with alignment features and method for making the same
US6127724A (en) * 1996-10-31 2000-10-03 Tessera, Inc. Packaged microelectronic elements with enhanced thermal conduction
US6157080A (en) * 1997-11-06 2000-12-05 Sharp Kabushiki Kaisha Semiconductor device using a chip scale package
US6353263B1 (en) * 1999-04-14 2002-03-05 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US6249044B1 (en) * 1999-06-17 2001-06-19 National Semiconductor Corp. Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices
US6555917B1 (en) * 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040063304A1 (en) * 2002-09-24 2004-04-01 Robert-Christian Hagen Electronic component with a stack of semiconductor chips and a method for producing the electronic component
US7190059B2 (en) * 2002-09-24 2007-03-13 Infineon Technologies Ag Electronic component with a stack of semiconductor chips and a method for producing the electronic component
US20050003578A1 (en) * 2003-07-01 2005-01-06 Chi-Long Wu Method of fabricating organic electroluminescence panel package
US7011987B2 (en) * 2003-07-01 2006-03-14 Ritdisplay Corporation Method of fabricating organic electroluminescence panel package
US20050205982A1 (en) * 2004-03-19 2005-09-22 Nec Electronics Corporation Semiconductor device
US7247935B2 (en) * 2004-03-19 2007-07-24 Nec Electronics Corporation Semiconductor device
US20070235885A1 (en) * 2004-03-19 2007-10-11 Nec Electronics Corporation Semiconductor device
US7405472B2 (en) 2004-03-19 2008-07-29 Nec Electronics Corporation Semiconductor device
US20050242426A1 (en) * 2004-04-30 2005-11-03 Samsung Electronics Co., Ltd. Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
US20080001272A1 (en) * 2006-06-30 2008-01-03 Chi-Chih Chu System-in-package structure
US20110045636A1 (en) * 2007-06-26 2011-02-24 Hynix Semiconductor Inc. Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same
US8343803B2 (en) * 2007-06-26 2013-01-01 Hynix Semiconductor Inc. Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same
US9679811B2 (en) 2008-12-31 2017-06-13 STATS ChipPAC Pte. Ltd. Semiconductor device and method of confining conductive bump material with solder mask patch
CN104576416A (en) * 2013-10-24 2015-04-29 扬州倍英斯微电子有限公司 Double-layer convex-point diode chip preparation method
US20160172272A1 (en) * 2014-12-11 2016-06-16 Stmicroelectronics Pte Ltd Integrated circuit (ic) package with a solder receiving area and associated methods
US9972557B2 (en) * 2014-12-11 2018-05-15 Stmicroelectronics Pte Ltd Integrated circuit (IC) package with a solder receiving area and associated methods
US10297534B2 (en) 2014-12-11 2019-05-21 Stmicroelectronics Pte Ltd Integrated circuit (IC) package with a solder receiving area and associated methods
US10529652B2 (en) 2014-12-11 2020-01-07 Stmicroelectronics Pte Ltd Integrated circuit (IC) package with a solder receiving area and associated methods
US10163871B2 (en) * 2015-10-02 2018-12-25 Qualcomm Incorporated Integrated device comprising embedded package on package (PoP) device
US10510733B2 (en) 2015-10-02 2019-12-17 Qualcomm Incorporated Integrated device comprising embedded package on package (PoP) device
US20220093543A1 (en) * 2020-09-22 2022-03-24 Samsung Electronics Co., Ltd. Semiconductor package
US11848293B2 (en) * 2020-09-22 2023-12-19 Samsung Electronics Co., Ltd. Semiconductor package

Also Published As

Publication number Publication date
TW529141B (en) 2003-04-21
US20070166879A1 (en) 2007-07-19
US7635610B2 (en) 2009-12-22

Similar Documents

Publication Publication Date Title
US7635610B2 (en) Multi-chip stack package and fabricating method thereof
US7723839B2 (en) Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
US6214642B1 (en) Area array stud bump flip chip device and assembly process
TWI482261B (en) Three-dimensional system-in-package package-on-package structure
US7242081B1 (en) Stacked package structure
US7148080B2 (en) Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
US7615871B2 (en) Method and apparatus for attaching microelectronic substrates and support members
US6759737B2 (en) Semiconductor package including stacked chips with aligned input/output pads
US8586412B1 (en) Semiconductor device and method for manufacturing thereof
US6781241B2 (en) Semiconductor device and manufacturing method thereof
US6528876B2 (en) Semiconductor package having heat sink attached to substrate
US20030025199A1 (en) Super low profile package with stacked dies
US20020106833A1 (en) Semiconductor device and method for fabricating same
US20130280865A1 (en) QFN Package and Manufacturing Process Thereof
US20060076665A1 (en) Package stack and manufacturing method thereof
US6635962B2 (en) Chip on chip semiconductor device
US20060022320A1 (en) Semiconductor device and manufacturing method thereof
US11869829B2 (en) Semiconductor device with through-mold via
US20070108623A1 (en) Chip and package structure
US7015591B2 (en) Exposed pad module integrating a passive device therein
US20040036154A1 (en) High performance thermally enhanced package and method of fabricating the same
US20020095784A1 (en) Bumping process for chip scale packaging
US7642639B2 (en) COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
US6001723A (en) Application of wire bond loop as integrated circuit package component interconnect
US20020187591A1 (en) Packaging process for semiconductor package

Legal Events

Date Code Title Description
AS Assignment

Owner name: ADVANCED SEMICONDUCTOR ENGINEERING, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FANG, JEN-KUANG;REEL/FRAME:013332/0311

Effective date: 20021226

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION