STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
REFERENCE TO A MICROFICHE APPENDIX
BACKGROUND—FIELD OF INVENTION
The present invention relates to silicon-based Micro-Electro-Mechanical Systems (MEMS) and MEMS components.
BACKGROUND—DESCRIPTION OF PRIOR ART
Micro-Electro-Mechanical Systems (MEMS), the technology of integrating mechanical elements, sensors, actuators and electronics into complex micrometer-sized machines—also referred to as micromachines and microsystems technology (MST)—has matured into a ubiquitous and pervasive technology used for a fast growing number of high-volume commercial applications such as automotive airbag sensors, micromotors, actuators, sensors, heat exchangers, filters, microvalves and pumps, medical instruments, biomedical implants, avionics equipment, etc.
Today's MEMS manufacturing technology is based virtually exclusively on the high volume, batch processing methodologies of the integrated circuit (IC) industry and therefore, like ICs, MEMS devices are made from silicon.
The most basic method used to fabricate MEMS devices is to successively deposit and etch thin films of structural polycrystalline silicon layers, each about 2-4 micrometers thick. With each deposition/etch cycle protrusions, holes or undercuts are created. Typical applications for this method range from simple mirrors to actuators, electrostatic motors and complex accelerometers such as the ones used in airbag deployment. The use of thin films is often cited as the major limitation to the development of MEMS devices while the deposition/etch cycles restrict design freedom.
Because MEMS technology uses the costly IC fabrication processes, it is not universally accessible today and many companies desirous to explore the potential of MEMS technology have limited options for getting devices prototyped or manufactured. Advanced simulation and modelling tools for MEMS design are also lacking, resulting in a relatively inaccurate prediction of dimensional accuracy. As a result, the MEMS design process is usually performed in a trial-and-error fashion, requiring several iterations before the specification requirements are satisfied. This non-ideal design methodology combined with the length of time and high cost associated with MEMS prototyping results in a very inefficient and ineffective scenario of commercial product development.
One of the most serious obstacles to the development of commercial MEMS applications is their packaging. MEMS packaging is much more complicated than microelectronics packaging due to the diversity of MEMS devices and the requirement that they be in continuous and intimate contact with their environment. Presently, virtually any new MEMS development requires that an ad hoc package be designed. Consequently, most companies find that packaging is the single most expensive and time-consuming task in their MEMS development programs. The cost of the package is a sizeable part of the total cost of a MEMS component, often ranging from 20-95% of the product's total cost. In addition, the size of a MEMS device is often dwarfed by the size of its final package. A sensing or actuating element of a few microns can end up in a package with an overall size in centimeters. As a result, the benefits of miniaturization are often lost because of inadequate packaging. The high cost and the undesirable bulky packages are major stumbling blocks in capitalizing the market potential of MEMS products.
A more recent new but general problem plaguing the IC, photovoltaics (PV) and MEMS industries is the growing shortage of silicon which has already caused the price of polysilicon to double over the past six or seven years.
BRIEF SUMMARY OF THE INVENTION
In accordance with the present invention many of the problems of the prior art are substantially overcome by recovering crystalline silicon metal from sawing kerf generated during wiresaw cutting of single crystal silicon ingots and wafers and compounding said recovered silicon metal kerf into a thermoplastic molding feedstock. The thus obtained silicon metal feedstock is molded into green MEMS or MEMS components from which the organic binder is extracted. The resulting binder-free MEMS or MEMS component preforms are then sintered in accordance with prior art practices.
OBJECTS AND ADVANTAGES
It is a primary object and advantage of this invention to provide an economic, simple, energy and material efficient process to mass-produce MEMS and MEMS components from silicon kerf, thereby obviating the costly IC manufacturing processes currently used to fabricate MEMS.
Another advantage of this invention resides in the savings resulting from the use of silicon kerf—itself a waste from another industry—as raw material for MEMS and MEMS components.
It is also an object of this invention to provide a waste-free method to fabricate MEMS and MEMS components since the thermoplastic silicon kerf molding compound made in accordance with this invention is 100% recyclable.
Still another advantage of this invention is to overcome the design limitations of the prior art by providing a method to fabricate MEMS and MEMS components with complex design features such as deep holes, rounded shapes, angled slots, threaded holes, etc., not achievable via the IC manufacturing processes currently used to fabricate MEMS.
Yet another advantage of this invention is to overcome the dimensional limitations of the prior art by the use of submicrometer-sized particles of silicon kerf thus allowing the achievement of the extremely fine design features and high definition demanded by advanced MEMS applications.
It is still another object of this invention to provide a method to fabricate MEMS and MEMS components without the trial and error methods and iterations of the prior art in order to arrive at the correct final dimensions.
A still further object of this invention is to provide a manufacturing process for MEMS and MEMS components which lends itself easily to automated mass-production as it makes use of well-established prior art techniques such as casting, machining, molding, sintering, etc.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS