US20020157760A1 - Method of producing ceramic multilayer substrate - Google Patents
Method of producing ceramic multilayer substrate Download PDFInfo
- Publication number
- US20020157760A1 US20020157760A1 US10/123,162 US12316202A US2002157760A1 US 20020157760 A1 US20020157760 A1 US 20020157760A1 US 12316202 A US12316202 A US 12316202A US 2002157760 A1 US2002157760 A1 US 2002157760A1
- Authority
- US
- United States
- Prior art keywords
- ceramic green
- inorganic composition
- glass
- ceramic
- green sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24959—Thickness [relative or absolute] of adhesive layers
Definitions
- the present invention relates to a method of producing a ceramic multilayer substrate on which semiconductor LSI, a chip components, or the like are mounted and wired to each other.
- Japanese Unexamined Patent Publication No. 5-102666 discloses a conventional method of producing a ceramic multilayer substrate.
- plural glass-ceramic green sheets made of a glass-ceramic, containing an organic binder and a plasticizer, and having a conductor pattern (not illustrated) formed on the surfaces thereof by use of a conductor paste composition are first laminated to form a laminate 101 .
- ceramic green sheets 102 and 103 containing as a major component an inorganic composition having a sintering temperature higher than that of the glass-ceramic green sheet 101 are formed on the back and front sides of the laminate 101 , respectively, and thereafter, pressure-bonded together to form a lamination pressure-bonding body 100 .
- the lamination pressure-bonding body 100 is fired under the firing conditions for the laminate 101 . Thereafter, the unsintered ceramic green sheets 102 and 103 are removed, whereby a ceramic multilayer substrate is obtained.
- the laminate 101 is inhibited from heat shrinking in the plane direction at firing, owing to the ceramic green sheets 102 and 103 of the lamination pressure-bonding body 100 .
- Such a conventional method of producing a ceramic multilayer substrate has the following problems.
- preferred embodiments of the present invention provides a method of producing a ceramic multilayer substrate in which the side faces of the laminate can be prevented from being distorted so as to be depressed toward the inside thereof, caused by the heat shrinkage at firing.
- One preferred embodiment of the present invention provides a method of producing a ceramic multilayer substrate by lamination of plural glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate, and firing of the laminate comprises the step of applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions having a higher sintering temperature than the glass-ceramic green sheets, the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets to form a part of the laminate, and the step of laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.
- the above described method may include the step of forming one of the glass-ceramic green sheets so as to have a smaller thickness than each of the other glass-ceramic green sheets, the step of applying to or overlaying on the surface of the glass-ceramic green sheet having a smaller thickness the inorganic composition, the step of arranging the glass-ceramic green sheet having a smaller thickness as the undermost layer of the laminate, and the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces thereof, whereby a part of or the whole of the laminate ranging from the vicinity of the undermost layer to the uppermost layer is formed.
- the above described method may include the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions provided on the surfaces thereof, whereby a part of or the whole of the laminate ranging from the undermost layer to the vicinity of the uppermost layer is formed, and the step of laminating the glass-ceramic green sheet as the uppermost layer of the laminate.
- the method may include the step of forming the glass-ceramic green sheets to constitute the undermost and uppermost layers of the laminate so as to have a smaller thickness than the respective glass-ceramic green sheets to constitute the other layers of the laminate.
- the method may include the step of forming opening portions through a plurality of the glass-ceramic green sheets arranged as the uppermost layer of the laminate and in its vicinities and also the inorganic compositions applied to or overlaid on the glass-ceramic green sheets, and the step of laminating a plurality of the glass-ceramic green sheets having the opening portions formed therein to form the laminate having a cavity formed of the opening portions of the plural glass-ceramic green sheets which are made continuous to each other.
- the inorganic compositions applied to or overlaid on the glass-ceramic green sheets may contain alumina as a major component.
- each of the inorganic compositions applied to or overlaid on the glass-ceramic green sheets may have a thickness of from about 1 to 20 ⁇ m.
- the differences between the sintering temperatures of the glass-ceramic green sheets and the sintering temperatures of the inorganic compositions applied to or overlaid on the glass-ceramic green sheets is at least about 100° C.
- the above described method may include the step of forming a glass-ceramic green sheet on a carrier film, and then applying to or overlaying on the glass-ceramic green sheet the inorganic composition to form an inorganic composition layer, the step of forming a perforation through each of the carrier film, the glass-ceramic green sheet and the inorganic composition layer, filling a conductor material into the perforation to produce a viahole, and further forming a conductor pattern on the inorganic composition layer, and the step of releasing the glass-ceramic green sheet having the viahole and the conductor pattern, together with the inorganic composition layer, from the carrier film and laminating the glass-ceramic green sheets with the inorganic composition layers, sequentially.
- the method may include the step of applying to or overlaying on a carrier film the inorganic composition to form an inorganic composition layer, and then forming a glass-ceramic green sheet on the inorganic composition layer, the step of forming a perforation through each of the carrier film, the inorganic composition layer and the glass-ceramic green sheet, then filling a conductor material into the perforation to form a viahole, and forming a conductor pattern on the glass-ceramic green sheet, and the step of releasing the glass-ceramic green sheet having the viahole and the conductor pattern, together with the inorganic composition layer, from the carrier film and laminating the glass-ceramic green sheets with the inorganic composition layers sequentially.
- a glass-ceramic green sheet having a viahole and a conductor pattern and a green sheet having a perforation not filled with a conductor material, corresponding to the viahole and containing the inorganic composition as a major component may be laminated to form a part of the laminate.
- the glass-ceramic green sheets and the inorganic compositions having a higher sintering temperature than the respective glass-ceramic green sheets are alternately arranged to form a laminate, and fired.
- the glass-ceramic green sheets constituting not only the undermost and uppermost layers of the laminate but also the internal layers are inhibited from heat shrinking in the plane direction. Accordingly, there is little danger that distortion of the laminate occurs at firing, that is, the side faces of the laminate are distorted so as to be depressed toward the inside. Therefore, the generation of cracks and the peeling of the glass-ceramic green sheets are prevented.
- the production of a high precision ceramic multilayer substrate is enabled.
- the sintered glass-ceramics after the laminate is fired can be used as the mounting surfaces of the ceramic multilayer substrate. Accordingly, the mounting surfaces are stable, and the ceramic multilayer substrate can be mounted without fail as compared with the surfaces made of unsintered inorganic compositions.
- the glass-ceramic green sheets constituting the undermost or uppermost layer of the laminate or both of them so as to have a smaller thickness than the respective glass-ceramic green sheets constituting the other layers of the laminate, the amount of change caused by heat shrinkage of the respective layers can be made equal to each other. Accordingly, the peeling or the generation of cracks can be prevented from occurring between the glass-ceramic green sheets.
- the inorganic composition having a higher sintering temperature than the glass-ceramic green sheet is exposed on the bottom of the cavity formed in the laminate. Accordingly, it is unnecessary to provide an inorganic composition on the bottom of the cavity after the cavity is formed. The bottom of the cavity can be simply protected from heat shrinking at firing.
- the unsintered inorganic compositions function as a buffering material against vibration, impact and thermal shock. Accordingly, cracks or breaks fatal to the laminate are not generated.
- the glass-ceramic green sheets constituting the laminate and the inorganic compositions for inhibiting the heat shrinkage at firing have different sintering temperatures, the co-firing of the whole laminate is possible, and the simplification of the manufacturing process and the reduction of the manufacturing cost can be realized.
- the materials for use in the inorganic composition to inhibit the heat shrinkage include no glass, even though the conductor constituting the internal electrodes is diffused was firing of the laminate, caused by the plastic flow of the glass-ceramic green sheets, diffusion can be inhibited owing to the inorganic compositions for inhibiting the heat shrinkage.
- FIG. 1 is a cross section showing a laminate produced by a conventional method of producing a ceramic multilayer substrate.
- FIG. 2 is a cross section showing the state that the laminate as shown in FIG. 1 is distorted.
- FIG. 3 is a schematic cross section of a glass-ceramic green sheet 2 c formed on a carrier film 1 in a first embodiment of the present invention.
- FIG. 4 is a schematic cross section showing an inorganic composition layer 3 c further formed in the above embodiment.
- FIG. 5 is a schematic cross section showing a viahole 4 c further formed in the above embodiment.
- FIG. 6 is a schematic cross section showing a conductor pattern 5 c further formed in the above embodiment.
- FIG. 7 consists of schematic cross sections showing the state that the respective glass-ceramic green sheets are laminated in the above embodiment.
- FIG. 8 is a schematic cross section of a lamination pressure-bonding body 10 in the above embodiment.
- FIG. 9 is a schematic cross section of a sintered body (ceramic multilayer substrate) obtained after the lamination pressure-bonding body is fired.
- FIG. 10 is a schematic cross section of a ceramic multilayer module 20 according to the present invention.
- FIG. 11 is a schematic cross section of a ceramic multilayer substrate 40 having a cavity 36 according to a second embodiment of the present invention.
- FIG. 12 is a schematic cross section showing an inorganic composition layer 52 c formed on a carrier film 51 in the third embodiment of the present invention.
- FIG. 13 is a schematic cross section showing a glass-ceramic layer 53 c formed in the above embodiment.
- FIG. 14 is a schematic cross section showing viahole 54 c further formed in the above embodiment.
- FIG. 15 is a schematic cross section showing a conductor pattern 55 c formed in the above embodiment.
- FIG. 16 is a schematic cross section showing the state that the glass-ceramic layers are laminated in the above embodiment.
- FIG. 17 is a schematic cross section of a lamination pressure-bonding body 60 .
- FIG. 18 is a schematic cross section of a ceramic multilayer substrate 70 according to a fourth embodiment of the present invention.
- FIG. 19 is a schematic cross section showing a manufacturing process for a ceramic multilayer substrate according to a fifth embodiment of the present invention.
- a method of producing a ceramic multilayer substrate according to a first embodiment of the present invention is described by use of the drawings.
- a paste (slurry) made of an inorganic oxide composition containing alumina as a major component is applied to the surfaces of the respective glass-ceramic green sheets constituting a laminate.
- this will be described in the order of formation.
- a glass-ceramic green sheet is formed as follows.
- a glass-ceramic which consists of a composition comprising lead borosilicate glass powder and alumina powder at a ratio by weight of 50:50 is added to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixed to form slurry.
- the slurry is sheet-formed on a carrier film 1 by the doctor-blade method as shown in FIG. 3, and dried to form a glass-ceramic green sheet 2 c.
- an inorganic composition layer 3 c is formed on the glass-ceramic green sheet 2 c which is formed on the carrier film 1 .
- the inorganic composition layer 3 c is formed by applying a paste (slurry) to the surface of the glass-ceramic green sheet 2 c and drying, the paste being produced by adding alumina powder to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixing them.
- the alumina has a higher sintering temperature than the glass-ceramic green sheet 2 c .
- the inorganic composition layer 3 c containing the alumina as a major component has a higher sintering temperature than the glass-ceramic green sheet 2 c . That is, the inorganic composition layer 3 c can not be sintered under the sintering conditions for the glass-ceramic green sheet 2 c.
- Zirconium oxide, aluminum nitride, boron nitride, mullite, magnesium oxide, silicon carbide, or the like, may be substituted for alumina used as a material for the inorganic composition layer 3 c.
- a vehicle comprising ethyl cellulose as an organic binder dissolved in terpineol is added to an inorganic component comprising 5 weight parts of glass frit and 100 weight parts of silver powder. Powders of copper, silver/palladium or silver/platinum or the like may be substituted for the silver powder used as an inorganic component of the conductor paste.
- a conductor paste is printed on the inorganic composition layer 3 c formed on the glass-ceramic green sheet 2 c by a screen printing method, whereby a conductor pattern 5 c connecting to the viaholes 4 c is formed.
- the conductor pattern 5 c may also be formed by use of metal foil or a metallic wire.
- metal foil or a metallic wire available are a method of hot pressing a punched metal foil or metal wire against a ceramic green sheet, or a method of forming a pattern on a resin film by vapor deposition, sputtering, plating or the like, and heat transferring the pattern onto a ceramic green sheet.
- a plurality of the glass-ceramic green sheets 2 c formed by the procedures (1) through (4) are peeled from the carrier films 1 , respectively.
- the glass-ceramic green sheets 2 c , together with the glass-ceramic green sheets 2 a , 2 b , 2 d prepared by a technique similar to the above-described one, are sequentially laminated, with the surface sides thereof where the inorganic composition layer 3 c and the conductor pattern 5 c are formed, being on the upper sides thereof.
- the inorganic composition layers 3 b and 3 d are formed on one of the main sides thereof, similarly to the glass-ceramic green sheet 2 c , viaholes 4 b and 4 d are formed so as to perforate through the glass-ceramic green sheets 2 b and 2 d , and the inorganic composition layers 3 b and 3 d , and conductor patterns 5 b and 5 d are formed on the surfaces of the surfaces of the inorganic composition layers 3 b and 3 d , respectively.
- the glass-ceramic green sheet 2 a constituting the undermost layer of the ceramic multilayer substrate, and the glass-ceramic green sheet 2 e constituting the uppermost layer of the ceramic multilayer substrate each have a thickness which is smaller than the glass-ceramic green sheets 2 b , 2 c , 2 d or the like constituting the other layers.
- a conductor pattern 8 to function as a surface electrode is also formed on the back side thereof where the inorganic composition layer 3 a is not provided and a conductor patterns 5 a is formed on the front side and the two conductors are interconnected by viahole 4 a .
- the conductor pattern 8 to function as a surface electrode may also be formed by printing the conductor pattern and baking after the ceramic multilayer substrate is fired.
- the glass-ceramic green sheet 2 e constituting the uppermost layer of the ceramic multilayer substrate with a conductor pattern 7 and viahole 4 e are formed in compliance with the procedures for producing ordinary glass-ceramic green sheets without the inorganic composition layer being formed thereon.
- the glass-ceramic green sheets 2 a through 2 e are hot pressure-bonding under the conditions of a temperature of 80° C. and a pressure of 200 kg/cm 2 , for example, to form a lamination pressure-bonded body.
- the glass-ceramic green sheets 2 a through 2 e are bonded to the inorganic composition layers 3 a through 3 d , owing to the anchor effects and so forth.
- FIG. 8 shows the lamination pressure-bonded body formed as described above.
- reference numeral 10 designates the lamination pressure-bonded body, in which the glass-ceramic green sheets 2 a through 2 e and the inorganic composition layers 3 a through 3 d are alternately arranged, and the conductor patterns 7 and 8 formed on the front and back sides thereof to function as surface electrodes and the conductor patterns 5 a through 5 d provided between the respective layers to function as internal electrodes are connected to each other through viaholes 4 a through 4 e.
- each of the glass-ceramic green sheets 2 b through 2 d constituting the lamination pressure-bonded body 10 the opposite sides thereof are coated with the inorganic composition layers 3 a through 3 d .
- the glass-ceramic green sheet 2 a constituting the undermost layer of the lamination pressure-bonded body 10 , and the glass-ceramic green sheet 2 e constituting the uppermost layer have a smaller thickness than the glass-ceramic green sheets 2 b through 2 d of the other layers.
- the lamination pressure-bonded body 10 is fired in the air or in the nitrogen atmosphere under the conditions of a temperature of 900° C. and 1 hour, for example.
- the glass-ceramic green sheets constituting the lamination pressure-bonded body 10 are allowed to heat-shrink in the x, y, and z directions.
- the glass-ceramic green sheets are “restrained” by the inorganic composition layers 3 a through 3 d , which are arranged alternately with the glass-ceramic green sheets. Accordingly, as shown in FIG. 9, the heat shrinkage in the plane direction (x-y direction) is restrained, and the green sheets considerably shrunk only in the thickness direction (2 direction).
- the glass-ceramic green sheets 2 a through 2 e as shown in FIG. 8 considerably shrink in the thickness direction to become the glass-ceramic bodies 2 a ′ through 2 e ′ in the sintered body (ceramic multilayer substrate) 11 as shown in FIG. 9.
- the restraint is brought about as follows. First, the glass components of the glass-ceramic green sheets 2 a through 2 e are diffused and permeated into the inorganic composition layers 3 a through 3 d at firing. Thus, the glass-ceramic green sheets 2 a through 2 e are strongly bonded to the inorganic composition layers 3 a through 3 d before the glass-ceramic green sheets 2 a through 2 e substantially start to shrink.
- the sintering of the inorganic composition layers 3 a through 3 d does not proceed.
- the heat shrinkage restraining degrees of the respective glass-ceramic green sheets 2 a and 2 e are small compared with the glass-ceramic green sheets 2 b , 2 c and 2 d since for each of the glass-ceramic green sheets 2 a and 2 e , only one of the main faces thereof is contacted with the inorganic composition layer. However, since the thicknesses of the glass-ceramic green sheets 2 a and 2 e are smaller than those of the glass-ceramic green sheets 2 b , 2 c and 2 d , respectively, the amount of change caused by the heat shrinkage are small.
- each thickness of the respective glass-ceramic green sheets of the uppermost and undermost layers is about 0.1-0.9 times, preferably about 0.3-0.7 times, that of the other glass-ceramic green sheets.
- the amount of change caused by heat shrinkage in the method of producing a ceramic multilayer substrate according to the first embodiment of the present invention between the glass-ceramic green sheets 2 a and 2 b , between the glass-ceramic green sheets 2 b and 2 c , between the glass-ceramic green sheets 2 c and 2 d , and between the glass-ceramic green sheets 2 d and 2 e are essentially equal to each other. Accordingly, a high precision ceramic multilayer substrate can be attained in which peeling between the respective glass-ceramic green sheets and the generation of cracks are prevented, and moreover warp and distortion are reduced.
- the ceramic multilayer substrate 11 as shown in FIG. 9 can be used as a substrate for a ceramic multilayer module 20 as shown in FIG. 10, for example.
- the ceramic multilayer module 20 contains a coil pattern, a capacitor pattern or the like, which is formed by internal electrodes 15 , viaholes 14 , or the like, and includes a substrate produced by alternately laminating glass-ceramic green sheets 12 and inorganic composition layers 13 .
- semiconductor devices 19 a and 19 b , a chip monolithic capacitor 19 c , and so forth are mounted on one of the main sides.
- Land electrodes 18 are formed on the other main side.
- the thicknesses of the glass-ceramic green sheets of the uppermost and undermost layers may be substantially equal to those of the other glass-ceramic green sheets in the ceramic multilayer module 20 . However, preferably, the thicknesses of the glass-ceramic green sheets as the uppermost and undermost layers are smaller than those of the other glass-ceramic green sheets, similarly to the above-described ceramic multilayer substrate 11 .
- Opening portions are formed in glass-ceramic green sheets 31 e through 31 h constituting the uppermost layer of the laminate and its vicinities so as to perforate through the glass-ceramic green sheets and the inorganic composition layers applied to or overlaid on the glass-ceramic green sheets by use of a perforator.
- the opening portions of the respective glass-ceramic green sheets are formed at positions corresponding to each other. In this embodiment, the opening portions are formed in the centers of the glass-ceramic green sheets.
- the glass-ceramic green sheets are laminated (5) to form a laminate.
- FIG. 11 shows the laminate.
- the laminate 40 has the lamination structure in which the glass-ceramic green sheets 31 a through 31 h and the inorganic composition layers 32 a through 32 g are alternately laminated.
- An external electrode 35 a is provided on the surface on the undermost layer side of the laminate 40 , and external electrodes 35 b are formed on the surface on the uppermost layer side.
- a predetermined wiring structure is formed by use of viaholes 33 and internal electrodes 34 .
- Opening portions are formed in the glass-ceramic green sheets 31 e , 31 f , 31 g and 31 h arranged in the uppermost layer of the laminate 40 and its vicinity.
- the opening portions are made continuous to form a cavity 36 .
- the bottom of the cavity 36 is composed of the glass-ceramic green sheet 31 d .
- the inorganic composition layer 32 d provided on the surface of the glass-ceramic green sheet 31 d is exposed as the bottom 37 of the cavity 36 .
- a surface electrode 35 c is arranged on the inorganic composition layer 32 d so as to be connectable to mounted components, not illustrated.
- the pressure-bonded (6) of the laminate 40 and firing (7) are carried out.
- the bottom of the cavity 36 of the laminate 40 is protected from heat shrinking by the inorganic composition layer 32 d , similarly to the other layers constituting the laminate 40 . Accordingly, the bottom has an excellent flatness.
- the inorganic composition layer 32 d for inhibiting the heat shrinkage at firing is exposed on the bottom of the cavity 36 formed in the laminate 40 . Accordingly, it is unnecessary newly to provide a ceramic green sheet or the like on the bottom of the cavity 36 after the cavity 36 is formed, and the bottom of the cavity 36 can be simply protected from heat shrinking at firing.
- the bottom of the cavity 36 may be formed in such a manner that the glass-ceramic green sheet is exposed.
- a paste (slurry) is prepared by adding alumina powder to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixing them.
- a sheet is formed on a carrier film 51 by the doctor blade method or the like, and dried whereby an inorganic composition layer (ceramic green sheet) 52 c is formed.
- the alumina has a higher sintering temperature than the respective glass-ceramic green sheets described later.
- An inorganic composition layer 52 c containing the alumina as a major component has a higher sintering temperature than the respective glass-ceramic green sheets. That is, the inorganic composition layer 52 c can not be sintered under the sintering conditions for the glass-ceramic green sheets.
- zirconium oxide, aluminum nitride, boron nitride, mullite, magnesium oxide, silicon carbide or the like can be substituted for alumina used as a material for the inorganic composition layer 52 c.
- a glass-ceramic green sheet (glass-ceramic layer) 53 c is formed on an inorganic composition layer 52 c which is formed on the carrier film 51 .
- the glass-ceramic layer 53 c is produced by shaping a slurry on the inorganic composition layer 52 c by the doctor blade method, and drying.
- the slurry is produced by adding to an organic binder comprising polyvinylbutyral or the like, a plasticizer comprising di-n-butylphthalate or the like, and a solvent produced e.g.
- a glass-ceramic which is a composition comprising lead borosilicate glass powder and alumina powder at a ratio by weight of 50:50, and mixing them.
- a vehicle comprising ethyl cellulose as an organic binder dissolved in terpineol is added to an inorganic component comprising 5 parts by weight of glass frit and 100 parts silver powder.
- Powder of copper, silver/palladium, silver/platinum or the like can be substituted for the silver powder used as an inorganic component of the conductor paste.
- the glass-ceramic layer 53 c formed on the inorganic composition layer 52 c is printed with a conductor paste by a screen printing method, whereby a conductor pattern 55 c connected to the viahole 54 c is formed.
- the conductor pattern 55 c may be formed by use of metal foil or a metallic wire, similarly to the above-described embodiments.
- available are a method of hot pressing a punched metal foil or a metal wire against a ceramic green sheet, or a method of forming a pattern on a resin film by vapor deposition, sputtering, plating, or the like, and heat transferring the pattern onto a ceramic green sheet.
- a plurality of the glass-ceramic layer 53 c formed by the procedures (1) through (4) are peeled from the carrier films 51 , and are laminated sequentially, together with the glass-ceramic layers 53 a , 53 b , 53 d and 53 e which are prepared by a technique similar to the above-described one with the surface side thereof where the conductor pattern 55 c is formed being the upper side thereof.
- the inorganic composition layers 52 b , 52 d and 52 e are formed on the one-side main face of the respective glass-ceramic layers 53 b , 53 d and 53 e , similarly to the glass-ceramic layer 53 c . Further, formed are viaholes 54 b , 54 d and 54 e perforating through each of the glass-ceramic layers and the inorganic composition layers, to conductor patterns 55 b , 55 d and 55 e.
- the glass-ceramic layer 53 a constituting the undermost layer of the ceramic multilayer substrate, and the glass-ceramic layer 53 e constituting the uppermost layer of the ceramic multilayer substrate have a smaller thickness as compared with the glass-ceramic layers 53 b , 53 c and 53 d constituting the other layers. Further, the glass-ceramic layer 53 a , having no inorganic composition layer formed thereon, is produced in compliance with the preparation procedures for ordinary glass-ceramic green sheets.
- a conductor pattern 55 a to function as an internal electrode and a conductor pattern 57 as an external electrode are printed on the opposite sides and connected by viahole 54 a.
- the glass-ceramic layer 53 a , and the glass-ceramic layers 52 b through 53 e provided with the inorganic composition layers 52 a through 52 d are heat pressure-bonded under the conditions of a temperature of 80° C. and a pressure of 200 kg/cm 2 , for example, to form a lamination pressure-bonded body.
- the glass-ceramic layers 53 a through 53 e and the inorganic composition layers 52 a through 52 d are bonded to each other, attributed to an anchor effect or the like.
- the opposite sides of the respective glass-ceramic layers 53 b through 53 d constituting the lamination pressure-bonded body 60 are coated with the inorganic composition layers 52 a through 52 d . Further, the glass-ceramic layer 53 a constituting the undermost layer of the lamination pressure-bonded body 60 , and the glass-ceramic layer 53 e constituting the uppermost layer, have a smaller thickness as compared with the other layers, than is, the glass-ceramic layers 53 b through 53 d.
- the lamination pressure-bonded body 60 is fired in the air or in a nitrogen atmosphere under the conditions of a temperature of 900° C. and 1 hour, for example.
- the glass-ceramic layers constituting the lamination pressure-bonded body 60 are about to heat-shrink in the x, y, and z directions, respectively.
- the glass-ceramic layers are “restrained” by the inorganic composition layers 52 a through 52 d which are arranged alternately with the glass-ceramic layers. Accordingly, the heat shrinkage in the plane direction (x-y direction) is restrained, and the green sheets considerably shrink only in the thickness direction (z direction).
- the heat shrinkage restraining degrees of the respective glass-ceramic layers 53 a and 53 e are lower as compared with the glass-ceramic layers 53 b , 53 c and 53 d since each of the glass-ceramic layers 53 a and 53 e is contacted with the inorganic composition layer only on one main side thereof.
- the change caused by the heat shrinkage are small since the thicknesses of the glass-ceramic layers 53 a and 53 e are smaller than those of the glass-ceramic layers 53 b , 53 c and 53 d , respectively.
- each thickness of the glass-ceramic layer of the uppermost or undermost layer is about 0.1-0.9 times, preferably, about 0.3-0.7 times that of the other glass-ceramic layers.
- the change caused by heat shrinkage between glass-ceramic layers 53 a and 53 b , between glass-ceramic layers 53 b and 53 c , between glass-ceramic layers 53 c and 53 d , and between glass-ceramic layers 53 d and 53 e are essentially equal to each other. Accordingly, a high precision ceramic multilayer substrate can be attained in which peeling between the respective glass-ceramic layers, and the deformation and the crack generation by heat shrinkage, are prevented, and warp and distortion are reduced.
- FIG. 18 shows a ceramic multilayer substrate of this embodiment.
- the ceramic multilayer substrate 70 has the structure in which glass-ceramic layers 71 a through 71 f and inorganic composition layers 72 a through 72 g are alternately laminated. Inside thereof, a capacitor pattern, a wiring pattern or the like are formed by viaholes 73 and internal conductors 74 , and on the surface thereof, surface electrodes 75 are formed.
- a ceramic multilayer substrate having a layer configuration containing the inorganic composition layers 72 a and 72 g as the upper side and underside surface layers can be realized similarly to the ceramic multilayer substrate 20 .
- each thickness of the inorganic composition layers 72 a and 72 g as the upper side and underside surface layers is preferably about the half of that of the other inorganic composition layers 72 b through 72 f.
- glass-ceramic green sheets 81 a , 81 b , 81 c , provided with viaholes 83 a , 83 b , 83 c , and conductor patterns 84 a , 84 b , 84 c , and ceramic green sheets 82 a , 82 b , each containing the above-described inorganic composition as a major component are alternately laminated, and fired under the firing conditions for the glass-ceramic green sheets, whereby a ceramic multilayer substrate is produced.
- perforations 85 a , 85 b are formed in the ceramic green sheets 82 a , 82 b containing the inorganic composition as a major component. No conductor material is filled into the perforations. That is, the thicknesses of the ceramic green sheets 82 a , 82 b are about 1-20 ⁇ m, or preferably 1-10 ⁇ m, and are extremely small as compared with those of the glass-ceramic green sheets 81 a , 81 b , 81 c .
- the viaholes 83 a , 83 b , 83 c formed in the glass-ceramic green sheets 81 a , 81 b , 81 c enter the perforations 85 a , 85 b upon pressure-bonded or firing, so that the conductor patterns on the respective glass-ceramic green sheets are connected to each other.
- TABLE 1 shows the first experimental results.
- the experiment was carried out to investigate how different the heat shrinkage ratios in the plane direction at firing of the laminates are, depending on the thicknesses of the inorganic composition layers.
- the compositions and the layer structures of the glass-ceramic green sheets and the inorganic composition layers are the same as described in the above first embodiment.
- the sintering temperatures of the glass-ceramic green sheets is 1000° C.
- the sintering temperature of the ceramic green sheets is 1500° C.
- the thickness of the glass-ceramic green sheets is 100 ⁇ m.
- the number of layers is 10.
- the heat shrinkage ratios are calculated as follows:
- heat shrinkage ratio (%) 100 (longitudinal or lateral size of the bottom of the laminate after firing)/(longitudinal or lateral size of the bottom of the laminate before firing) TABLE 1 thickness of 0.0 0.5 1.0 5.0 10 15 20 25 inorganic composition layer ( ⁇ m) shrinkage 83 95 97 98 98 98 NG ratio (%)
- the designation “NG” signifies that peeling or cracking was generated, caused by the differences between the thermal expansion ratios of the ceramic green sheets and those of the glass-ceramic green sheets.
- the thicknesses of the inorganic composition layers are preferably set to be in the range of about 1 to 20 ⁇ m.
- TABLE 2 shows the second experimental results. This experiment was carried out to investigate how different the heat shrinkage ratios in the plane direction of the laminates caused when the glass-ceramic green sheets are fired depend on sintering temperatures. In this experiment, as the glass-ceramic green sheets, those having a sintering temperature of 1000° C. were used, and the heat shrinkage ratios were calculated. TABLE 2 temperature (° C.) 700 800 900 925 950 975 1000 shrinkage ratio (%) 99.0 98.0 96.5 94.0 91.0 88.0 83.0
- the heat shrinkage ratios steeply decrease when the temperature becomes 900° C. or higher.
- the heat shrinkage of the glass-ceramic green sheets progresses steeply when the temperature is about 100° C. lower than the sintering temperature of 1000° C. or higher, that is, about 900° C. or higher. Accordingly the heat shrinkage in the plane direction of the glass-ceramic green sheets is inhibited if the ceramic green sheets are not heat shrunk in the range of 900° C. to 1000° C.
- the object of the present invention can be achieved when the difference between the sintering temperatures of the glass-ceramic green sheets and the inorganic composition layers (or the ceramic green sheets containing the inorganic composition as a major component) is at least 100° C.
- the glass-ceramic green sheets each having the inorganic composition (ceramic green sheet) overlaid thereon are laminated in such a manner that the glass-ceramic green sheets and the inorganic compositions are alternately arranged to form the whole configuration of the laminate.
- the glass-ceramic green sheets, without the inorganic composition being interposed may be laminated for the configuration.
- the glass-ceramic green sheets and the inorganic composition layers may be formed separately, and the glass-ceramic green sheets and the ceramic green sheets each containing the inorganic composition as a major component may be laminated to form a laminate.
- a glass-ceramic green sheet having an inorganic composition on both faces but of different thicknesses can be employed as the undermost layer.
- a conductor is filled into the viaholes formed in the laminate.
- a conductor material may be provided only on the inner walls of the viaholes.
- a cavity may be formed in the laminate described in the third embodiment according to the points of the above-described second embodiment.
Abstract
There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.
Description
- This is a divisional of U.S. patent application Ser. No. 09/504,919, filed Feb. 16, 2000.
- 1. Field of the Invention
- The present invention relates to a method of producing a ceramic multilayer substrate on which semiconductor LSI, a chip components, or the like are mounted and wired to each other.
- 2. Description of the Related Art
- Japanese Unexamined Patent Publication No. 5-102666 discloses a conventional method of producing a ceramic multilayer substrate. According to this production method, as shown in FIG. 1, plural glass-ceramic green sheets made of a glass-ceramic, containing an organic binder and a plasticizer, and having a conductor pattern (not illustrated) formed on the surfaces thereof by use of a conductor paste composition are first laminated to form a
laminate 101. Next, ceramicgreen sheets green sheet 101 are formed on the back and front sides of thelaminate 101, respectively, and thereafter, pressure-bonded together to form a lamination pressure-bondingbody 100. Next, the lamination pressure-bondingbody 100 is fired under the firing conditions for thelaminate 101. Thereafter, the unsintered ceramicgreen sheets laminate 101 is inhibited from heat shrinking in the plane direction at firing, owing to the ceramicgreen sheets body 100. - Such a conventional method of producing a ceramic multilayer substrate has the following problems.
- When the number of the laminated glass-ceramic green sheets becomes large, and the thickness of the
laminate 101 is increased, the vicinities of the ceramicgreen sheets laminate 101 are inhibited from heat shrinking in the plane direction. However, there have been some cases that thecentral portion 104 in the thickness direction of thelaminate 101 is distorted so as to be depressed toward the inside thereof as shown in FIG. 2. There has been a danger thatsuch distortion 104′ causes the inside of thelaminate 101 to because cracked and the glass-ceramic green sheets to peel away from each other. - In the case that a cavity for accommodating an electronic component, not illustrated, is formed in the
laminate 101, it has been difficult to provide a ceramic green sheet for inhibiting heat shrinkage on the bottom of the cavity. - To overcome the above described problems, preferred embodiments of the present invention provides a method of producing a ceramic multilayer substrate in which the side faces of the laminate can be prevented from being distorted so as to be depressed toward the inside thereof, caused by the heat shrinkage at firing. In addition, it is an object of the present invention to provide a method of producing a ceramic multilayer substrate in which an inorganic composition for inhibiting the heat shrinkage can be easily provided on the bottom of a cavity in the laminate.
- One preferred embodiment of the present invention provides a method of producing a ceramic multilayer substrate by lamination of plural glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate, and firing of the laminate comprises the step of applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions having a higher sintering temperature than the glass-ceramic green sheets, the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets to form a part of the laminate, and the step of laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.
- The above described method may include the step of forming one of the glass-ceramic green sheets so as to have a smaller thickness than each of the other glass-ceramic green sheets, the step of applying to or overlaying on the surface of the glass-ceramic green sheet having a smaller thickness the inorganic composition, the step of arranging the glass-ceramic green sheet having a smaller thickness as the undermost layer of the laminate, and the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces thereof, whereby a part of or the whole of the laminate ranging from the vicinity of the undermost layer to the uppermost layer is formed.
- The above described method may include the step of laminating a plurality of the glass-ceramic green sheets having the inorganic compositions provided on the surfaces thereof, whereby a part of or the whole of the laminate ranging from the undermost layer to the vicinity of the uppermost layer is formed, and the step of laminating the glass-ceramic green sheet as the uppermost layer of the laminate.
- Moreover, the method may include the step of forming the glass-ceramic green sheets to constitute the undermost and uppermost layers of the laminate so as to have a smaller thickness than the respective glass-ceramic green sheets to constitute the other layers of the laminate.
- Further, the method may include the step of forming opening portions through a plurality of the glass-ceramic green sheets arranged as the uppermost layer of the laminate and in its vicinities and also the inorganic compositions applied to or overlaid on the glass-ceramic green sheets, and the step of laminating a plurality of the glass-ceramic green sheets having the opening portions formed therein to form the laminate having a cavity formed of the opening portions of the plural glass-ceramic green sheets which are made continuous to each other.
- In the above described method, the inorganic compositions applied to or overlaid on the glass-ceramic green sheets may contain alumina as a major component.
- Further, each of the inorganic compositions applied to or overlaid on the glass-ceramic green sheets may have a thickness of from about 1 to 20 μm.
- Furthermore, the differences between the sintering temperatures of the glass-ceramic green sheets and the sintering temperatures of the inorganic compositions applied to or overlaid on the glass-ceramic green sheets is at least about 100° C.
- Further, the above described method may include the step of forming a glass-ceramic green sheet on a carrier film, and then applying to or overlaying on the glass-ceramic green sheet the inorganic composition to form an inorganic composition layer, the step of forming a perforation through each of the carrier film, the glass-ceramic green sheet and the inorganic composition layer, filling a conductor material into the perforation to produce a viahole, and further forming a conductor pattern on the inorganic composition layer, and the step of releasing the glass-ceramic green sheet having the viahole and the conductor pattern, together with the inorganic composition layer, from the carrier film and laminating the glass-ceramic green sheets with the inorganic composition layers, sequentially.
- Further, the method may include the step of applying to or overlaying on a carrier film the inorganic composition to form an inorganic composition layer, and then forming a glass-ceramic green sheet on the inorganic composition layer, the step of forming a perforation through each of the carrier film, the inorganic composition layer and the glass-ceramic green sheet, then filling a conductor material into the perforation to form a viahole, and forming a conductor pattern on the glass-ceramic green sheet, and the step of releasing the glass-ceramic green sheet having the viahole and the conductor pattern, together with the inorganic composition layer, from the carrier film and laminating the glass-ceramic green sheets with the inorganic composition layers sequentially.
- Moreover, a glass-ceramic green sheet having a viahole and a conductor pattern and a green sheet having a perforation not filled with a conductor material, corresponding to the viahole and containing the inorganic composition as a major component may be laminated to form a part of the laminate.
- According to the method of producing a ceramic multilayer substrate of the present invention, the glass-ceramic green sheets and the inorganic compositions having a higher sintering temperature than the respective glass-ceramic green sheets are alternately arranged to form a laminate, and fired. Owing to the inorganic compositions, the glass-ceramic green sheets constituting not only the undermost and uppermost layers of the laminate but also the internal layers are inhibited from heat shrinking in the plane direction. Accordingly, there is little danger that distortion of the laminate occurs at firing, that is, the side faces of the laminate are distorted so as to be depressed toward the inside. Therefore, the generation of cracks and the peeling of the glass-ceramic green sheets are prevented. The production of a high precision ceramic multilayer substrate is enabled.
- By forming the undermost layer of the laminate, or the undermost and uppermost layers thereof with the glass-ceramic green sheets, the sintered glass-ceramics after the laminate is fired can be used as the mounting surfaces of the ceramic multilayer substrate. Accordingly, the mounting surfaces are stable, and the ceramic multilayer substrate can be mounted without fail as compared with the surfaces made of unsintered inorganic compositions.
- By forming the glass-ceramic green sheets constituting the undermost or uppermost layer of the laminate or both of them so as to have a smaller thickness than the respective glass-ceramic green sheets constituting the other layers of the laminate, the amount of change caused by heat shrinkage of the respective layers can be made equal to each other. Accordingly, the peeling or the generation of cracks can be prevented from occurring between the glass-ceramic green sheets.
- Further, the inorganic composition having a higher sintering temperature than the glass-ceramic green sheet is exposed on the bottom of the cavity formed in the laminate. Accordingly, it is unnecessary to provide an inorganic composition on the bottom of the cavity after the cavity is formed. The bottom of the cavity can be simply protected from heat shrinking at firing.
- Since the inorganic compositions having a higher sintering temperature than the respective glass-ceramic green sheets are arranged inside of the laminate, the unsintered inorganic compositions function as a buffering material against vibration, impact and thermal shock. Accordingly, cracks or breaks fatal to the laminate are not generated.
- Since the glass-ceramic green sheets constituting the laminate and the inorganic compositions for inhibiting the heat shrinkage at firing have different sintering temperatures, the co-firing of the whole laminate is possible, and the simplification of the manufacturing process and the reduction of the manufacturing cost can be realized.
- In the case that the materials for use in the inorganic composition to inhibit the heat shrinkage include no glass, even though the conductor constituting the internal electrodes is diffused was firing of the laminate, caused by the plastic flow of the glass-ceramic green sheets, diffusion can be inhibited owing to the inorganic compositions for inhibiting the heat shrinkage.
- Other features and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings.
- FIG. 1 is a cross section showing a laminate produced by a conventional method of producing a ceramic multilayer substrate.
- FIG. 2 is a cross section showing the state that the laminate as shown in FIG. 1 is distorted.
- FIG. 3 is a schematic cross section of a glass-ceramic
green sheet 2 c formed on acarrier film 1 in a first embodiment of the present invention. - FIG. 4 is a schematic cross section showing an
inorganic composition layer 3 c further formed in the above embodiment. - FIG. 5 is a schematic cross section showing a
viahole 4 c further formed in the above embodiment. - FIG. 6 is a schematic cross section showing a
conductor pattern 5 c further formed in the above embodiment. - FIG. 7 consists of schematic cross sections showing the state that the respective glass-ceramic green sheets are laminated in the above embodiment.
- FIG. 8 is a schematic cross section of a lamination pressure-bonding
body 10 in the above embodiment. - FIG. 9 is a schematic cross section of a sintered body (ceramic multilayer substrate) obtained after the lamination pressure-bonding body is fired.
- FIG. 10 is a schematic cross section of a
ceramic multilayer module 20 according to the present invention. - FIG. 11 is a schematic cross section of a
ceramic multilayer substrate 40 having acavity 36 according to a second embodiment of the present invention. - FIG. 12 is a schematic cross section showing an
inorganic composition layer 52 c formed on acarrier film 51 in the third embodiment of the present invention. - FIG. 13 is a schematic cross section showing a glass-
ceramic layer 53 c formed in the above embodiment. - FIG. 14 is a schematic cross
section showing viahole 54 c further formed in the above embodiment. - FIG. 15 is a schematic cross section showing a
conductor pattern 55 c formed in the above embodiment. - FIG. 16 is a schematic cross section showing the state that the glass-ceramic layers are laminated in the above embodiment.
- FIG. 17 is a schematic cross section of a lamination pressure-bonding
body 60. - FIG. 18 is a schematic cross section of a
ceramic multilayer substrate 70 according to a fourth embodiment of the present invention. - FIG. 19 is a schematic cross section showing a manufacturing process for a ceramic multilayer substrate according to a fifth embodiment of the present invention.
- A method of producing a ceramic multilayer substrate according to a first embodiment of the present invention is described by use of the drawings. In this embodiment, for the inorganic composition layers comprising an inorganic composition having a higher sintering temperature than the respective glass-ceramic green sheets, a paste (slurry) made of an inorganic oxide composition containing alumina as a major component is applied to the surfaces of the respective glass-ceramic green sheets constituting a laminate. Hereinafter, this will be described in the order of formation.
- (1) Formation of Glass-Ceramic Green Sheet
- First, a glass-ceramic green sheet is formed as follows. A glass-ceramic which consists of a composition comprising lead borosilicate glass powder and alumina powder at a ratio by weight of 50:50 is added to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixed to form slurry. Next, the slurry is sheet-formed on a
carrier film 1 by the doctor-blade method as shown in FIG. 3, and dried to form a glass-ceramicgreen sheet 2 c. - (2) Formation of Inorganic Composition Layer
- As shown in FIG. 4, an
inorganic composition layer 3 c is formed on the glass-ceramicgreen sheet 2 c which is formed on thecarrier film 1. Theinorganic composition layer 3 c is formed by applying a paste (slurry) to the surface of the glass-ceramicgreen sheet 2 c and drying, the paste being produced by adding alumina powder to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixing them. - The alumina has a higher sintering temperature than the glass-ceramic
green sheet 2 c. Theinorganic composition layer 3 c containing the alumina as a major component has a higher sintering temperature than the glass-ceramicgreen sheet 2 c. That is, theinorganic composition layer 3 c can not be sintered under the sintering conditions for the glass-ceramicgreen sheet 2 c. - Zirconium oxide, aluminum nitride, boron nitride, mullite, magnesium oxide, silicon carbide, or the like, may be substituted for alumina used as a material for the
inorganic composition layer 3 c. - (3) Formation of Viahole
- Next, formed are perforations through each of the
carrier film 1, the glass-ceramicgreen sheet 2 c and theinorganic composition layer 3 c by means of a perforator. Into the perforations, a conductor material (conductor paste) is filled by screen printing or the like, whereby aviahole 4 c is formed through thecarrier film 1, the glass-ceramicgreen sheet 2 c and theinorganic composition layer 3 c, as shown in FIG. 5. - For use as the conductor paste, a vehicle comprising ethyl cellulose as an organic binder dissolved in terpineol is added to an inorganic component comprising 5 weight parts of glass frit and 100 weight parts of silver powder. Powders of copper, silver/palladium or silver/platinum or the like may be substituted for the silver powder used as an inorganic component of the conductor paste.
- (4) Formation of Conductor Pattern
- As shown in FIG. 6, a conductor paste is printed on the
inorganic composition layer 3 c formed on the glass-ceramicgreen sheet 2 c by a screen printing method, whereby aconductor pattern 5 c connecting to theviaholes 4 c is formed. - The
conductor pattern 5 c may also be formed by use of metal foil or a metallic wire. In this case, available are a method of hot pressing a punched metal foil or metal wire against a ceramic green sheet, or a method of forming a pattern on a resin film by vapor deposition, sputtering, plating or the like, and heat transferring the pattern onto a ceramic green sheet. - (5) Lamination
- As shown in FIG. 7, a plurality of the glass-ceramic
green sheets 2 c formed by the procedures (1) through (4) are peeled from thecarrier films 1, respectively. The glass-ceramicgreen sheets 2 c, together with the glass-ceramicgreen sheets inorganic composition layer 3 c and theconductor pattern 5 c are formed, being on the upper sides thereof. - In glass-ceramic
green sheets inorganic composition layers green sheet 2 c, viaholes 4 b and 4 d are formed so as to perforate through the glass-ceramicgreen sheets inorganic composition layers conductor patterns inorganic composition layers - The glass-ceramic
green sheet 2 a constituting the undermost layer of the ceramic multilayer substrate, and the glass-ceramicgreen sheet 2 e constituting the uppermost layer of the ceramic multilayer substrate each have a thickness which is smaller than the glass-ceramicgreen sheets green sheet 2 a, after the carrier film is released, aconductor pattern 8 to function as a surface electrode is also formed on the back side thereof where theinorganic composition layer 3 a is not provided and aconductor patterns 5 a is formed on the front side and the two conductors are interconnected byviahole 4 a. Theconductor pattern 8 to function as a surface electrode may also be formed by printing the conductor pattern and baking after the ceramic multilayer substrate is fired. The glass-ceramicgreen sheet 2 e constituting the uppermost layer of the ceramic multilayer substrate with aconductor pattern 7 andviahole 4 e are formed in compliance with the procedures for producing ordinary glass-ceramic green sheets without the inorganic composition layer being formed thereon. - (6) Pressure-Bonding
- The glass-ceramic
green sheets 2 a through 2 e are hot pressure-bonding under the conditions of a temperature of 80° C. and a pressure of 200 kg/cm2, for example, to form a lamination pressure-bonded body. Hereupon, the glass-ceramicgreen sheets 2 a through 2 e are bonded to theinorganic composition layers 3 a through 3 d, owing to the anchor effects and so forth. - FIG. 8 shows the lamination pressure-bonded body formed as described above. In this figure,
reference numeral 10 designates the lamination pressure-bonded body, in which the glass-ceramicgreen sheets 2 a through 2 e and theinorganic composition layers 3 a through 3 d are alternately arranged, and theconductor patterns conductor patterns 5 a through 5 d provided between the respective layers to function as internal electrodes are connected to each other throughviaholes 4 a through 4 e. - As to each of the glass-ceramic
green sheets 2 b through 2 d constituting the lamination pressure-bondedbody 10, the opposite sides thereof are coated with theinorganic composition layers 3 a through 3 d. The glass-ceramicgreen sheet 2 a constituting the undermost layer of the lamination pressure-bondedbody 10, and the glass-ceramicgreen sheet 2 e constituting the uppermost layer have a smaller thickness than the glass-ceramicgreen sheets 2 b through 2 d of the other layers. - (7) Firing
- The lamination pressure-bonded
body 10 is fired in the air or in the nitrogen atmosphere under the conditions of a temperature of 900° C. and 1 hour, for example. On this occasion, the glass-ceramic green sheets constituting the lamination pressure-bondedbody 10 are allowed to heat-shrink in the x, y, and z directions. However, the glass-ceramic green sheets are “restrained” by theinorganic composition layers 3 a through 3 d, which are arranged alternately with the glass-ceramic green sheets. Accordingly, as shown in FIG. 9, the heat shrinkage in the plane direction (x-y direction) is restrained, and the green sheets considerably shrunk only in the thickness direction (2 direction). That is, the glass-ceramicgreen sheets 2 a through 2 e as shown in FIG. 8 considerably shrink in the thickness direction to become the glass-ceramic bodies 2 a′ through 2 e′ in the sintered body (ceramic multilayer substrate) 11 as shown in FIG. 9. - It is speculated that the restraint is brought about as follows. First, the glass components of the glass-ceramic
green sheets 2 a through 2 e are diffused and permeated into theinorganic composition layers 3 a through 3 d at firing. Thus, the glass-ceramicgreen sheets 2 a through 2 e are strongly bonded to theinorganic composition layers 3 a through 3 d before the glass-ceramicgreen sheets 2 a through 2 e substantially start to shrink. Further, at the time when the glass-ceramicgreen sheets 2 a through 2 e substantially start to shrink, that is, under the firing conditions of the glass-ceramicgreen sheets 2 a through 2 e, the sintering of theinorganic composition layers 3 a through 3 d does not proceed. - Not only the vicinities of the undermost and uppermost layers of the lamination pressure-bonded
body 10, but also the glass-ceramicgreen sheets 2 b through 2 d constituting the internal layers, are inhibited from heat shrinking in the plane direction owing to the effects of theinorganic composition layers 3 a through 3 d. Accordingly, there is no danger that the lamination pressure-bondedbody 10 is distorted at firing, especially the side faces thereof being distorted so as to be depressed toward the inside thereof. Accordingly, the generation of cracks and the peeling of the glass-ceramicgreen sheets 2 a through 2 e are prevented. Thus, the production of a high precisionceramic multilayer substrate 11 can be produced. - Further, the heat shrinkage restraining degrees of the respective glass-ceramic
green sheets green sheets green sheets green sheets green sheets green sheets green sheets green sheets - As described above, the amount of change caused by heat shrinkage in the method of producing a ceramic multilayer substrate according to the first embodiment of the present invention, between the glass-ceramic
green sheets green sheets green sheets green sheets - The
ceramic multilayer substrate 11 as shown in FIG. 9 can be used as a substrate for aceramic multilayer module 20 as shown in FIG. 10, for example. Theceramic multilayer module 20 contains a coil pattern, a capacitor pattern or the like, which is formed byinternal electrodes 15,viaholes 14, or the like, and includes a substrate produced by alternately laminating glass-ceramicgreen sheets 12 and inorganic composition layers 13. On one of the main sides,semiconductor devices monolithic capacitor 19 c, and so forth are mounted.Land electrodes 18 are formed on the other main side. - The thicknesses of the glass-ceramic green sheets of the uppermost and undermost layers may be substantially equal to those of the other glass-ceramic green sheets in the
ceramic multilayer module 20. However, preferably, the thicknesses of the glass-ceramic green sheets as the uppermost and undermost layers are smaller than those of the other glass-ceramic green sheets, similarly to the above-described ceramicmultilayer substrate 11. - Hereinafter, a method of producing a ceramic multilayer substrate according to a second embodiment of the present invention will be described.
- Basically, according to the same points as those of the first embodiment, (1) the formation of glass-ceramic green sheets, (2) the formation of inorganic composition layers, (3) the filling of viaholes and (4) the formation of conductor patterns are carried out, whereby glass-ceramic
green sheets 31 a through 31 h (FIG. 11) having the surfaces coated with the inorganic composition layers are formed. - Opening portions are formed in glass-ceramic
green sheets 31 e through 31 h constituting the uppermost layer of the laminate and its vicinities so as to perforate through the glass-ceramic green sheets and the inorganic composition layers applied to or overlaid on the glass-ceramic green sheets by use of a perforator. The opening portions of the respective glass-ceramic green sheets are formed at positions corresponding to each other. In this embodiment, the opening portions are formed in the centers of the glass-ceramic green sheets. - The glass-ceramic green sheets are laminated (5) to form a laminate. FIG. 11 shows the laminate.
- In this figure, the laminate40 has the lamination structure in which the glass-ceramic
green sheets 31 a through 31 h and the inorganic composition layers 32 a through 32 g are alternately laminated. An external electrode 35 a is provided on the surface on the undermost layer side of the laminate 40, andexternal electrodes 35 b are formed on the surface on the uppermost layer side. Further, inside of the laminate 40, a predetermined wiring structure is formed by use ofviaholes 33 andinternal electrodes 34. - Opening portions are formed in the glass-ceramic
green sheets cavity 36. The bottom of thecavity 36 is composed of the glass-ceramicgreen sheet 31 d. Theinorganic composition layer 32 d provided on the surface of the glass-ceramicgreen sheet 31 d is exposed as the bottom 37 of thecavity 36. Asurface electrode 35 c is arranged on theinorganic composition layer 32 d so as to be connectable to mounted components, not illustrated. - Next, the pressure-bonded (6) of the laminate40 and firing (7) are carried out. Hereupon, the bottom of the
cavity 36 of the laminate 40 is protected from heat shrinking by theinorganic composition layer 32 d, similarly to the other layers constituting thelaminate 40. Accordingly, the bottom has an excellent flatness. - In this embodiment, as described above, the
inorganic composition layer 32 d for inhibiting the heat shrinkage at firing is exposed on the bottom of thecavity 36 formed in thelaminate 40. Accordingly, it is unnecessary newly to provide a ceramic green sheet or the like on the bottom of thecavity 36 after thecavity 36 is formed, and the bottom of thecavity 36 can be simply protected from heat shrinking at firing. However, it should be noted that the bottom of thecavity 36 may be formed in such a manner that the glass-ceramic green sheet is exposed. - Next, a method of producing a ceramic multilayer substrate according to a third embodiment of the present invention will be described.
- The method of producing a ceramic multilayer substrate of this embodiment will be described sequentially in the order of the working items by use of the drawings.
- (1) Formation of Inorganic Composition Layer
- First, a paste (slurry) is prepared by adding alumina powder to an organic binder comprising polyvinylbutyral, a plasticizer comprising di-n-butylphthalate, and a solvent produced by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, and mixing them. Subsequently, as shown in FIG. 12, with the paste, a sheet is formed on a
carrier film 51 by the doctor blade method or the like, and dried whereby an inorganic composition layer (ceramic green sheet) 52 c is formed. - The alumina has a higher sintering temperature than the respective glass-ceramic green sheets described later. An
inorganic composition layer 52 c containing the alumina as a major component has a higher sintering temperature than the respective glass-ceramic green sheets. That is, theinorganic composition layer 52 c can not be sintered under the sintering conditions for the glass-ceramic green sheets. Similarly to the above-described case, zirconium oxide, aluminum nitride, boron nitride, mullite, magnesium oxide, silicon carbide or the like can be substituted for alumina used as a material for theinorganic composition layer 52 c. - (2) Formation of Glass-Ceramic Green Sheet
- As shown in FIG. 13, a glass-ceramic green sheet (glass-ceramic layer)53 c is formed on an
inorganic composition layer 52 c which is formed on thecarrier film 51. The glass-ceramic layer 53 c is produced by shaping a slurry on theinorganic composition layer 52 c by the doctor blade method, and drying. The slurry is produced by adding to an organic binder comprising polyvinylbutyral or the like, a plasticizer comprising di-n-butylphthalate or the like, and a solvent produced e.g. by mixing toluene and isopropyl alcohol at a ratio by weight of 30:70, a glass-ceramic which is a composition comprising lead borosilicate glass powder and alumina powder at a ratio by weight of 50:50, and mixing them. - (3) Formation of Viahole
- Next, formed are perforations through each of the
carrier film 51, theinorganic composition layer 52 c and the glass-ceramic layer 53 c by means of a perforator. Into the perforations, a conductor material (conductor paste) is filled by a screen printing method or the like, whereby a viahole 54 c is formed through each of thecarrier film 51, theinorganic composition layer 52 c and the glass-ceramic layer 53 c, as shown in FIG. 14. - Hereupon, for use as the conductor paste, similarly to the above-described case, a vehicle comprising ethyl cellulose as an organic binder dissolved in terpineol is added to an inorganic component comprising 5 parts by weight of glass frit and 100 parts silver powder. Powder of copper, silver/palladium, silver/platinum or the like can be substituted for the silver powder used as an inorganic component of the conductor paste.
- (4) Formation of Conductor Pattern
- As shown in FIG. 15, the glass-
ceramic layer 53 c formed on theinorganic composition layer 52 c is printed with a conductor paste by a screen printing method, whereby aconductor pattern 55 c connected to the viahole 54 c is formed. - The
conductor pattern 55 c may be formed by use of metal foil or a metallic wire, similarly to the above-described embodiments. In this case, available are a method of hot pressing a punched metal foil or a metal wire against a ceramic green sheet, or a method of forming a pattern on a resin film by vapor deposition, sputtering, plating, or the like, and heat transferring the pattern onto a ceramic green sheet. - (5) Lamination
- As shown in FIG. 16, a plurality of the glass-
ceramic layer 53 c formed by the procedures (1) through (4) are peeled from thecarrier films 51, and are laminated sequentially, together with the glass-ceramic layers conductor pattern 55 c is formed being the upper side thereof. - That is, the inorganic composition layers52 b, 52 d and 52 e are formed on the one-side main face of the respective glass-
ceramic layers ceramic layer 53 c. Further, formed are viaholes 54 b, 54 d and 54 e perforating through each of the glass-ceramic layers and the inorganic composition layers, toconductor patterns - The glass-
ceramic layer 53 a constituting the undermost layer of the ceramic multilayer substrate, and the glass-ceramic layer 53 e constituting the uppermost layer of the ceramic multilayer substrate have a smaller thickness as compared with the glass-ceramic layers ceramic layer 53 a, having no inorganic composition layer formed thereon, is produced in compliance with the preparation procedures for ordinary glass-ceramic green sheets. Aconductor pattern 55 a to function as an internal electrode and aconductor pattern 57 as an external electrode are printed on the opposite sides and connected by viahole 54 a. - (6) Pressure-Bonded
- The glass-
ceramic layer 53 a, and the glass-ceramic layers 52 b through 53 e provided with the inorganic composition layers 52 a through 52 d are heat pressure-bonded under the conditions of a temperature of 80° C. and a pressure of 200 kg/cm2, for example, to form a lamination pressure-bonded body. Hereupon, the glass-ceramic layers 53 a through 53 e and the inorganic composition layers 52 a through 52 d are bonded to each other, attributed to an anchor effect or the like. - FIG. 17 shows a lamination pressure-bonded body formed as described above. In this figure,
reference numeral 60 designates the lamination pressure-bonded body in which the glass-ceramic layers 53 a through 53 e and the inorganic composition layers 52 a through 52 d are alternately arranged, andconductor patterns conductor patterns 55 a through 55 d provided between the respective layers to function as internal electrodes are connected to each other through the viaholes 54 a through 54 e. - The opposite sides of the respective glass-
ceramic layers 53 b through 53 d constituting the lamination pressure-bondedbody 60 are coated with the inorganic composition layers 52 a through 52 d. Further, the glass-ceramic layer 53 a constituting the undermost layer of the lamination pressure-bondedbody 60, and the glass-ceramic layer 53 e constituting the uppermost layer, have a smaller thickness as compared with the other layers, than is, the glass-ceramic layers 53 b through 53 d. - (7) Firing
- The lamination pressure-bonded
body 60 is fired in the air or in a nitrogen atmosphere under the conditions of a temperature of 900° C. and 1 hour, for example. On this occasion, the glass-ceramic layers constituting the lamination pressure-bondedbody 60 are about to heat-shrink in the x, y, and z directions, respectively. However, the glass-ceramic layers are “restrained” by the inorganic composition layers 52 a through 52 d which are arranged alternately with the glass-ceramic layers. Accordingly, the heat shrinkage in the plane direction (x-y direction) is restrained, and the green sheets considerably shrink only in the thickness direction (z direction). - The heat shrinkage in the plane direction is prevented not only in the vicinities of the undermost and uppermost layers of the lamination pressure-bonded
body 60 but also in the glass-ceramic layers 53 b through 53 d constituting the internal layers because of the effects of the inorganic composition layers 52 a through 52 d. Accordingly, there is no danger that the distortion occurs at firing, and especially, the side faces of the lamination pressure-bondedbody 60 being distorted so as to be depressed toward the inside. Accordingly, the generation of cracks and the peeling of the glass-ceramic layers 53 a through 53 e are prevented. Thus, the production of a high precision ceramic multilayer substrate is enabled. - Further, the heat shrinkage restraining degrees of the respective glass-
ceramic layers ceramic layers ceramic layers ceramic layers ceramic layers ceramic layers ceramic layers ceramic layers - In the method of producing a ceramic multilayer substrate according to the third embodiment of the present invention, the change caused by heat shrinkage between glass-
ceramic layers ceramic layers ceramic layers ceramic layers - FIG. 18 shows a ceramic multilayer substrate of this embodiment. The
ceramic multilayer substrate 70 has the structure in which glass-ceramic layers 71 a through 71 f and inorganic composition layers 72 a through 72 g are alternately laminated. Inside thereof, a capacitor pattern, a wiring pattern or the like are formed byviaholes 73 andinternal conductors 74, and on the surface thereof,surface electrodes 75 are formed. - According to the method of producing a ceramic multilayer substrate of the present invention, a ceramic multilayer substrate having a layer configuration containing the inorganic composition layers72 a and 72 g as the upper side and underside surface layers can be realized similarly to the
ceramic multilayer substrate 20. When the thicknesses of the glass-ceramic layers 71 a through 71 f are the same, and the materials are the same as in theceramic multilayer substrate 20, each thickness of the inorganic composition layers 72 a and 72 g as the upper side and underside surface layers is preferably about the half of that of the other inorganic composition layers 72 b through 72 f. - In this embodiment, as shown in FIG. 19, glass-ceramic
green sheets conductor patterns green sheets - Hereupon,
perforations green sheets green sheets green sheets green sheets perforations - Hereinafter, the experimental results of the methods of producing a ceramic multilayer substrate according to the respective embodiments will be described.
- TABLE 1 shows the first experimental results. The experiment was carried out to investigate how different the heat shrinkage ratios in the plane direction at firing of the laminates are, depending on the thicknesses of the inorganic composition layers. In this experiment, the compositions and the layer structures of the glass-ceramic green sheets and the inorganic composition layers are the same as described in the above first embodiment. The sintering temperatures of the glass-ceramic green sheets is 1000° C., and the sintering temperature of the ceramic green sheets is 1500° C. The thickness of the glass-ceramic green sheets is 100 μm. The number of layers is 10. The heat shrinkage ratios are calculated as follows:
- heat shrinkage ratio (%)=100 (longitudinal or lateral size of the bottom of the laminate after firing)/(longitudinal or lateral size of the bottom of the laminate before firing)
TABLE 1 thickness of 0.0 0.5 1.0 5.0 10 15 20 25 inorganic composition layer (μm) shrinkage 83 95 97 98 98 98 98 NG ratio (%) - The designation “NG” signifies that peeling or cracking was generated, caused by the differences between the thermal expansion ratios of the ceramic green sheets and those of the glass-ceramic green sheets.
- As seen in the experimental results, it can be suggested that the thicknesses of the inorganic composition layers (or the ceramic green sheets containing the inorganic composition as a major component) are preferably set to be in the range of about 1 to 20 μm.
- TABLE 2 shows the second experimental results. This experiment was carried out to investigate how different the heat shrinkage ratios in the plane direction of the laminates caused when the glass-ceramic green sheets are fired depend on sintering temperatures. In this experiment, as the glass-ceramic green sheets, those having a sintering temperature of 1000° C. were used, and the heat shrinkage ratios were calculated.
TABLE 2 temperature (° C.) 700 800 900 925 950 975 1000 shrinkage ratio (%) 99.0 98.0 96.5 94.0 91.0 88.0 83.0 - As seen in TABLE 2, for the glass-ceramic green sheets having a sintering temperature of 1000° C., the heat shrinkage ratios steeply decrease when the temperature becomes 900° C. or higher. The heat shrinkage of the glass-ceramic green sheets progresses steeply when the temperature is about 100° C. lower than the sintering temperature of 1000° C. or higher, that is, about 900° C. or higher. Accordingly the heat shrinkage in the plane direction of the glass-ceramic green sheets is inhibited if the ceramic green sheets are not heat shrunk in the range of 900° C. to 1000° C. Accordingly, it can be said that the object of the present invention can be achieved when the difference between the sintering temperatures of the glass-ceramic green sheets and the inorganic composition layers (or the ceramic green sheets containing the inorganic composition as a major component) is at least 100° C.
- In the respective above-described embodiments, described is the case where the glass-ceramic green sheets each having the inorganic composition (ceramic green sheet) overlaid thereon are laminated in such a manner that the glass-ceramic green sheets and the inorganic compositions are alternately arranged to form the whole configuration of the laminate. However, for a part of the laminate, only the glass-ceramic green sheets, without the inorganic composition being interposed, may be laminated for the configuration. In brief, it is important to form such a layer configuration that the ceramic multilayer substrate is inhibited from shrinking in the plane direction with the warp and distortion of the substrate being reduced.
- In the first and second embodiments, described is the case where a paste (slurry) is coated onto the front and back sides of the glass-ceramic green sheets and dried to form the inorganic composition layers. However, the glass-ceramic green sheets and the inorganic composition layers may be formed separately, and the glass-ceramic green sheets and the ceramic green sheets each containing the inorganic composition as a major component may be laminated to form a laminate. Likewise, a glass-ceramic green sheet having an inorganic composition on both faces but of different thicknesses can be employed as the undermost layer.
- In the above-described respective embodiments, described is the case where conductor patterns and viaholes are formed in the respective layers constituting the laminate. A layer having no conductor pattern and or no viahole may be provided as a part of the laminate.
- In the above-described embodiments, described is the case where a conductor is filled into the viaholes formed in the laminate. However, a conductor material may be provided only on the inner walls of the viaholes. Further, a cavity may be formed in the laminate described in the third embodiment according to the points of the above-described second embodiment.
- While the invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that the forgoing and other changes in form and details may be made therein without departing from the spirit of the invention.
Claims (26)
1. A method of producing a ceramic multilayer substrate which comprises laminating a plurality of ceramic green sheets to form a laminate and firing the laminate;
wherein at least one surface of at least one ceramic green sheet has a layer of inorganic composition whose sintering temperature is higher than that of the glass-ceramic green sheet thereon.
2. The method according to claim 1 , wherein one of the ceramic green sheets has a smaller thickness than composition layer thereon and said one sheet is positioned so as to be an outermost layer of the laminate.
3. The method according to claim 2 , wherein said one ceramic green sheet having a smaller thickness is positioned so the inorganic composition thereon is disposed in the interior of the laminate.
4. The method according to claim 1 , wherein a plurality of ceramic green sheets having said inorganic composition layer thereon are positioned adjacent to one another to form said laminate.
5. The method according to claim 4 , wherein at least one ceramic green sheet does not have said inorganic composition layer thereon is employed in forming said laminate.
6. The method according to claim 1 , wherein two ceramic green sheets having a smaller thickness than each of the other ceramic green sheets are positioned so as to be the two outermost layers of the laminate.
7. The method according to claim 1 , including the step of positioning a plurality of the ceramic green sheets have an opening therein such that the openings aline to form a cavity in said laminate.
8. The method according to claim 1 , wherein the inorganic composition comprises alumina.
9. The method according to claim 1 , wherein each inorganic composition layer on a ceramic green sheet has a thickness of from about 1 to 20 μm.
10. The method according to claim 1 , wherein each inorganic composition layer on a ceramic green sheet has a thickness of from 1 to 10 μm.
11. The method according to claim 1 , wherein the ceramic green sheet and inorganic composition are selected such that the difference between the sintering temperature of the ceramic green sheets and the sintering temperature of the inorganic composition is at least about 100° C.
12. The method according to claim 1 , including the steps of first forming one of a ceramic green sheet or an inorganic composition layer on a carrier film, and then forming the other of the ceramic green sheet and inorganic composition layer on the first formed layer.
13. The method according to claim 12 , including the steps of
forming a perforation through each of the carrier film, the ceramic green sheet and the inorganic composition layer,
introducing a conductor material into the perforation to produce a filled viahole;
forming a conductor pattern on the inorganic composition layer in electrical communication with the conductor material in said viahole;
separating the ceramic green sheet having the viahole and the inorganic composition layer from the carrier film, and
laminating the glass-ceramic green sheet thus obtained.
14. The method according to claim 12 , including the steps of
forming a perforation through each of the carrier film, the ceramic green sheet and the inorganic composition,
separating the ceramic green sheet having the perforation and the inorganic composition layer from the carrier film, and
positioning the ceramic green sheet thus obtained adjacent to a glass-ceramic green sheet having a viahole filled with a conductor material during said lamination step.
15. The method according to claim 1 , including the steps of forming one of said plurality of ceramic green sheets so as to have a smaller thickness than each of the other ceramic green sheets and forming an inorganic composition layer on the surface of said ceramic green sheet having smaller thickness.
16. The method according to claim 1 , including the step of laminating a ceramic green sheet as the uppermost layer of the laminate.
17. The method according to claim 1 , wherein each of the ceramic green sheets comprise glass-ceramic, organic binder and plasticizer.
18. The method according to claim 17 , wherein two ceramic green sheets having a smaller thickness than each of the other ceramic green sheets are positioned so as to be the two outermost layers of the laminate and wherein the ceramic green sheet and inorganic composition are selected such that the difference between the sintering temperature of the ceramic green sheets and the sintering temperature of the inorganic composition is at least about 100° C.
19. The method according to claim 18 , including the step of positioning a plurality of the ceramic green sheets having said inorganic composition layer thereon and having an opening therein such that the openings aline to form a cavity in said laminate and at least a part of the cavity surface comprises an inorganic composition layer.
20. The method according to claim 19 , wherein the inorganic composition comprises alumina and wherein each inorganic composition layer on a ceramic green sheet has a thickness of from about 1 to 20 μm.
21. The method according to claim 1 , wherein the lamination is effected such that the layer of inorganic material is sandwiched between ceramic green sheets.
22. The method according to claim 21 , wherein the lamination is effected such that the layer of inorganic material does not constitute an outermost layer of the resulting laminate.
23. The method according to claim 21 , wherein one of the ceramic green sheets has a smaller thickness than each of the other ceramic green sheets and has said inorganic composition layer thereon.
24. A ceramic multilayer substrate comprising a laminate comprising
a plurality of ceramic green sheets, and
a layer of inorganic composition having a sintering temperature higher than that of the ceramic green sheets disposed between a pair of ceramic green sheets and not constituting an outermost layer of the laminate.
25. A ceramic multilayer substrate according to claim 24 , having a cavity extending from an outermost surface of the laminate to the layer of inorganic composition and exposing the layer of inorganic composition to the interior of the cavity.
26. A ceramic multilayer substrate comprising:
a laminate comprising:
a plurality of green ceramic sheets;
a cavity having side surfaces and a bottom surface in the plurality of green ceramic sheets, and
a layer of an inorganic composition having a sintering temperature higher than that of the green ceramic sheets, wherein the layer of inorganic composition is disposed between two of the green ceramic sheets and the layer of inorganic composition is exposed at side surfaces and the bottom surface of the cavity.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/123,162 US20020157760A1 (en) | 1999-03-03 | 2002-04-17 | Method of producing ceramic multilayer substrate |
US10/454,481 US6815046B2 (en) | 1999-03-03 | 2003-06-05 | Method of producing ceramic multilayer substrate |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-55582 | 1999-03-03 | ||
JP5558299 | 1999-03-03 | ||
JP11-307083 | 1999-10-28 | ||
JP30708399A JP3656484B2 (en) | 1999-03-03 | 1999-10-28 | Manufacturing method of ceramic multilayer substrate |
US09/504,919 US6432239B1 (en) | 1999-03-03 | 2000-02-16 | Method of producing ceramic multilayer substrate |
US10/123,162 US20020157760A1 (en) | 1999-03-03 | 2002-04-17 | Method of producing ceramic multilayer substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/504,919 Division US6432239B1 (en) | 1999-03-03 | 2000-02-16 | Method of producing ceramic multilayer substrate |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/454,481 Division US6815046B2 (en) | 1999-03-03 | 2003-06-05 | Method of producing ceramic multilayer substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
US20020157760A1 true US20020157760A1 (en) | 2002-10-31 |
Family
ID=26396474
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/504,919 Expired - Lifetime US6432239B1 (en) | 1999-03-03 | 2000-02-16 | Method of producing ceramic multilayer substrate |
US10/123,162 Abandoned US20020157760A1 (en) | 1999-03-03 | 2002-04-17 | Method of producing ceramic multilayer substrate |
US10/454,481 Expired - Lifetime US6815046B2 (en) | 1999-03-03 | 2003-06-05 | Method of producing ceramic multilayer substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/504,919 Expired - Lifetime US6432239B1 (en) | 1999-03-03 | 2000-02-16 | Method of producing ceramic multilayer substrate |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/454,481 Expired - Lifetime US6815046B2 (en) | 1999-03-03 | 2003-06-05 | Method of producing ceramic multilayer substrate |
Country Status (4)
Country | Link |
---|---|
US (3) | US6432239B1 (en) |
EP (1) | EP1033749B1 (en) |
JP (1) | JP3656484B2 (en) |
DE (1) | DE60038756D1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070080329A1 (en) * | 2003-11-14 | 2007-04-12 | Masato Nomiya | Electrically conductive paste and multilayer ceramic substrate |
US20070248801A1 (en) * | 2005-07-01 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate, method for producing same, and composite green sheet for forming multilayer ceramic substrate |
US7691469B2 (en) | 2005-09-16 | 2010-04-06 | Murata Manufacturing Co., Ltd. | Ceramic multilayer substrate and method for manufacturing the same |
US7781065B2 (en) | 2005-07-01 | 2010-08-24 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate, method for making the same, and composite green sheet for making multilayer ceramic substrate |
US20100224396A1 (en) * | 2007-11-30 | 2010-09-09 | Murata Manufacturing Co., Ltd. | Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3656484B2 (en) * | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | Manufacturing method of ceramic multilayer substrate |
JP3633435B2 (en) * | 2000-04-10 | 2005-03-30 | 株式会社村田製作所 | Multilayer ceramic substrate, manufacturing method and designing method thereof, and electronic device |
JP2002084065A (en) * | 2000-09-07 | 2002-03-22 | Murata Mfg Co Ltd | Multilayer ceramics substrate, manufacturing method thereof, and electronic device |
JP3757788B2 (en) | 2000-11-27 | 2006-03-22 | 株式会社村田製作所 | Multilayer ceramic substrate and manufacturing method thereof |
JP2002368422A (en) * | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | Multilayer ceramic board and its manufacturing method |
JP2002368421A (en) * | 2001-06-08 | 2002-12-20 | Murata Mfg Co Ltd | Multilayer ceramic board and method for manufacturing the same |
US6627020B2 (en) * | 2001-08-31 | 2003-09-30 | International Business Machines Corporation | Method for sinter distortion control |
DE10145362C2 (en) * | 2001-09-14 | 2003-10-16 | Epcos Ag | Process for the production of a ceramic substrate |
JP2003110016A (en) * | 2001-09-28 | 2003-04-11 | Kobe Steel Ltd | Method of forming aerial metal wiring on semiconductor substrate |
US6743534B2 (en) | 2001-10-01 | 2004-06-01 | Heraeus Incorporated | Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same |
DE10150715A1 (en) * | 2001-10-13 | 2003-04-30 | Bosch Gmbh Robert | Green ceramic insert body, ceramic insert body, ceramic green body or composite body and the ceramic layer composite produced therewith |
JP3716783B2 (en) * | 2001-11-22 | 2005-11-16 | 株式会社村田製作所 | Method for manufacturing ceramic multilayer substrate and semiconductor device |
US7381283B2 (en) * | 2002-03-07 | 2008-06-03 | Yageo Corporation | Method for reducing shrinkage during sintering low-temperature-cofired ceramics |
US6776861B2 (en) * | 2002-06-04 | 2004-08-17 | E. I. Du Pont De Nemours And Company | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic |
US6827800B2 (en) * | 2003-01-30 | 2004-12-07 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of asymmetrically configured dielectric layers |
DE10252636A1 (en) * | 2002-11-11 | 2004-05-19 | Epcos Ag | Ceramic multi-layer substrate used in front end module for mobile radio, has uppermost layer with recess and stable intermediate layer below it |
EP1435651B1 (en) * | 2003-01-02 | 2012-11-07 | E.I. Du Pont De Nemours And Company | Process for the constrained sintering of asymetrically configured dielectric layers |
CN1751547B (en) * | 2003-02-13 | 2011-11-16 | 株式会社藤仓 | Multilayer board and its manufacturing method |
US6893710B2 (en) | 2003-04-18 | 2005-05-17 | Yageo Corporation | Multilayer ceramic composition |
EP1471041A1 (en) * | 2003-04-22 | 2004-10-27 | Yageo Corporation | Multilayer ceramic composition |
US7332805B2 (en) * | 2004-01-06 | 2008-02-19 | International Business Machines Corporation | Electronic package with improved current carrying capability and method of forming the same |
JP2005268692A (en) * | 2004-03-22 | 2005-09-29 | Mitsubishi Electric Corp | Method for manufacturing multilayer substrate |
US7279217B2 (en) * | 2004-05-24 | 2007-10-09 | Tdk Corporation | Multilayer ceramic device, method for manufacturing the same, and ceramic device |
US7508062B2 (en) * | 2005-03-11 | 2009-03-24 | Lsi Corporation | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs |
JP4826253B2 (en) * | 2005-12-30 | 2011-11-30 | 株式会社村田製作所 | Method for manufacturing ceramic multilayer substrate and ceramic multilayer substrate |
JP4858538B2 (en) * | 2006-02-14 | 2012-01-18 | 株式会社村田製作所 | Multilayer ceramic electronic component, multilayer ceramic substrate, and method of manufacturing multilayer ceramic electronic component |
US7901761B1 (en) * | 2006-04-17 | 2011-03-08 | Alfred E. Mann Foundation For Scientific Research | Hermetic vias utilizing metal-metal oxides |
EP2026379B1 (en) * | 2006-06-02 | 2012-08-15 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and method for manufacturing same |
JP4826348B2 (en) * | 2006-06-08 | 2011-11-30 | 株式会社村田製作所 | Method for producing multilayer ceramic electronic component with protruding electrodes |
JP4957117B2 (en) * | 2006-08-09 | 2012-06-20 | 株式会社村田製作所 | Method for producing multilayer ceramic substrate and composite green sheet for producing multilayer ceramic substrate |
JP2008159725A (en) * | 2006-12-22 | 2008-07-10 | Kyocera Corp | Ceramic multi-layered substrate, and its manufacturing method |
EP2129201B1 (en) | 2007-03-01 | 2017-04-12 | Murata Manufacturing Co. Ltd. | Multilayer wiring substrate |
WO2008126661A1 (en) * | 2007-04-11 | 2008-10-23 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate and process for producing the same |
DE102007022336A1 (en) * | 2007-05-12 | 2008-11-20 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor substrate with metal contact layer and manufacturing method thereof |
TWI362102B (en) * | 2007-07-11 | 2012-04-11 | Ind Tech Res Inst | Three-dimensional dice-stacking package structure and method for manufactruing the same |
WO2009014017A1 (en) * | 2007-07-26 | 2009-01-29 | Murata Manufacturing Co., Ltd. | Multilayer ceramic board and process for manufacturing the same |
KR100891824B1 (en) * | 2007-12-06 | 2009-04-07 | 삼성전기주식회사 | Laminated ceramic package |
JP2009252783A (en) * | 2008-04-01 | 2009-10-29 | Murata Mfg Co Ltd | Production method of ceramic multilayer substrate, and method for adjusting amount of warpage of ceramic multilayer substrate |
WO2009139272A1 (en) * | 2008-05-15 | 2009-11-19 | 株式会社村田製作所 | Multilayer ceramic substrate and method for producing the same |
EP2529390B1 (en) | 2010-01-28 | 2019-06-26 | Lumileds Holding B.V. | Burner with reduced height and method of manufacturing a burner |
JP5402776B2 (en) * | 2010-03-30 | 2014-01-29 | 株式会社村田製作所 | Manufacturing method of metal base substrate |
JP5693411B2 (en) * | 2010-11-02 | 2015-04-01 | 京セラ株式会社 | Manufacturing method of light emitting element mounting substrate |
JP5777997B2 (en) * | 2011-03-07 | 2015-09-16 | 日本特殊陶業株式会社 | Wiring board for electronic component inspection apparatus and manufacturing method thereof |
JP5798435B2 (en) | 2011-03-07 | 2015-10-21 | 日本特殊陶業株式会社 | Wiring board for electronic component inspection apparatus and manufacturing method thereof |
JP2013033914A (en) * | 2011-06-27 | 2013-02-14 | Toshiba Corp | Semiconductor device |
KR101506760B1 (en) * | 2011-08-31 | 2015-03-30 | 삼성전기주식회사 | Magnetic substrate and method for manufacturing magnetic substrate |
CN203015273U (en) * | 2012-12-24 | 2013-06-19 | 奥特斯(中国)有限公司 | Printed circuit board |
US10219384B2 (en) | 2013-11-27 | 2019-02-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
AT515101B1 (en) | 2013-12-12 | 2015-06-15 | Austria Tech & System Tech | Method for embedding a component in a printed circuit board |
AT515447B1 (en) | 2014-02-27 | 2019-10-15 | At & S Austria Tech & Systemtechnik Ag | Method for contacting a component embedded in a printed circuit board and printed circuit board |
US11523520B2 (en) | 2014-02-27 | 2022-12-06 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for making contact with a component embedded in a printed circuit board |
WO2018030192A1 (en) * | 2016-08-10 | 2018-02-15 | 株式会社村田製作所 | Ceramic electronic component |
KR102170221B1 (en) * | 2019-03-06 | 2020-10-28 | 주식회사 와이컴 | Space transformer for probe card and method for manufacturing the same |
US20220377912A1 (en) * | 2021-05-18 | 2022-11-24 | Mellanox Technologies, Ltd. | Process for laminating graphene-coated printed circuit boards |
US11963309B2 (en) | 2021-05-18 | 2024-04-16 | Mellanox Technologies, Ltd. | Process for laminating conductive-lubricant coated metals for printed circuit boards |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
US5102720A (en) * | 1989-09-22 | 1992-04-07 | Cornell Research Foundation, Inc. | Co-fired multilayer ceramic tapes that exhibit constrained sintering |
US5387474A (en) * | 1990-10-04 | 1995-02-07 | E. I. Du Pont De Nemours And Company | Green ceramic composite and method for making such composite |
US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5085720A (en) * | 1990-01-18 | 1992-02-04 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of green ceramic bodies |
JP2803421B2 (en) * | 1991-12-12 | 1998-09-24 | 松下電器産業株式会社 | Method for manufacturing multilayer ceramic substrate |
US5277724A (en) * | 1991-12-18 | 1994-01-11 | General Electric Co. | Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board |
JP2812605B2 (en) | 1992-04-30 | 1998-10-22 | 松下電器産業株式会社 | Method for manufacturing multilayer ceramic substrate |
EP0570855B1 (en) * | 1992-05-20 | 2000-04-19 | Matsushita Electric Industrial Co., Ltd. | Method for producing multilayered ceramic substrate |
JPH0661649A (en) * | 1992-08-07 | 1994-03-04 | Matsushita Electric Ind Co Ltd | Production of multilayer ceramic board |
US5456778A (en) * | 1992-08-21 | 1995-10-10 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
US5662755A (en) * | 1993-10-15 | 1997-09-02 | Matsushita Electric Industrial Co., Ltd. | Method of making multi-layered ceramic substrates |
JPH07202438A (en) * | 1993-12-29 | 1995-08-04 | Sumitomo Kinzoku Ceramics:Kk | Production of multilayer ceramic circuit board |
US5601672A (en) * | 1994-11-01 | 1997-02-11 | International Business Machines Corporation | Method for making ceramic substrates from thin and thick ceramic greensheets |
US5581876A (en) * | 1995-01-27 | 1996-12-10 | David Sarnoff Research Center, Inc. | Method of adhering green tape to a metal support substrate with a bonding glass |
WO1996039298A1 (en) * | 1995-06-06 | 1996-12-12 | Sarnoff Corporation | Method for the reduction of lateral shrinkage in multilayer circuit boards on a support |
JPH0992983A (en) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | Manufacture of ceramic multilayer board |
JP3780386B2 (en) * | 1996-03-28 | 2006-05-31 | 株式会社村田製作所 | Ceramic circuit board and manufacturing method thereof |
US5800761A (en) * | 1996-10-08 | 1998-09-01 | International Business Machines Corporation | Method of making an interface layer for stacked lamination sizing and sintering |
US5858145A (en) * | 1996-10-15 | 1999-01-12 | Sarnoff Corporation | Method to control cavity dimensions of fired multilayer circuit boards on a support |
US5866240A (en) * | 1997-03-06 | 1999-02-02 | Sarnoff Corporation | Thick ceramic on metal multilayer circuit board |
JP3601671B2 (en) * | 1998-04-28 | 2004-12-15 | 株式会社村田製作所 | Manufacturing method of composite laminate |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
JP3547327B2 (en) | 1998-11-02 | 2004-07-28 | 松下電器産業株式会社 | Manufacturing method of ceramic multilayer substrate |
US6245171B1 (en) * | 1998-11-23 | 2001-06-12 | International Business Machines Corporation | Multi-thickness, multi-layer green sheet lamination and method thereof |
US6258192B1 (en) * | 1999-02-10 | 2001-07-10 | International Business Machines Corporation | Multi-thickness, multi-layer green sheet processing |
JP3656484B2 (en) | 1999-03-03 | 2005-06-08 | 株式会社村田製作所 | Manufacturing method of ceramic multilayer substrate |
US6139666A (en) * | 1999-05-26 | 2000-10-31 | International Business Machines Corporation | Method for producing ceramic surfaces with easily removable contact sheets |
JP3687484B2 (en) | 1999-06-16 | 2005-08-24 | 株式会社村田製作所 | Method for manufacturing ceramic substrate and unfired ceramic substrate |
JP3601679B2 (en) | 1999-07-27 | 2004-12-15 | 株式会社村田製作所 | Method for producing composite laminate |
JP3666321B2 (en) * | 1999-10-21 | 2005-06-29 | 株式会社村田製作所 | Multilayer ceramic substrate and manufacturing method thereof |
JP3633435B2 (en) | 2000-04-10 | 2005-03-30 | 株式会社村田製作所 | Multilayer ceramic substrate, manufacturing method and designing method thereof, and electronic device |
JP2002368422A (en) | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | Multilayer ceramic board and its manufacturing method |
-
1999
- 1999-10-28 JP JP30708399A patent/JP3656484B2/en not_active Expired - Lifetime
-
2000
- 2000-02-16 US US09/504,919 patent/US6432239B1/en not_active Expired - Lifetime
- 2000-03-01 EP EP00104260A patent/EP1033749B1/en not_active Expired - Lifetime
- 2000-03-01 DE DE60038756T patent/DE60038756D1/en not_active Expired - Lifetime
-
2002
- 2002-04-17 US US10/123,162 patent/US20020157760A1/en not_active Abandoned
-
2003
- 2003-06-05 US US10/454,481 patent/US6815046B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102720A (en) * | 1989-09-22 | 1992-04-07 | Cornell Research Foundation, Inc. | Co-fired multilayer ceramic tapes that exhibit constrained sintering |
US5387474A (en) * | 1990-10-04 | 1995-02-07 | E. I. Du Pont De Nemours And Company | Green ceramic composite and method for making such composite |
US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070080329A1 (en) * | 2003-11-14 | 2007-04-12 | Masato Nomiya | Electrically conductive paste and multilayer ceramic substrate |
US7569162B2 (en) * | 2003-11-14 | 2009-08-04 | Murata Manufacturing Co., Ltd. | Electrically conductive paste and multilayer ceramic substrate |
US20090272566A1 (en) * | 2003-11-14 | 2009-11-05 | Murata Manufacturing Co., Ltd | Electrically conductive paste and multilayer ceramic substrate |
US20070248801A1 (en) * | 2005-07-01 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate, method for producing same, and composite green sheet for forming multilayer ceramic substrate |
US7781066B2 (en) | 2005-07-01 | 2010-08-24 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate, method for producing same, and composite green sheet for forming multilayer ceramic substrate |
US7781065B2 (en) | 2005-07-01 | 2010-08-24 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate, method for making the same, and composite green sheet for making multilayer ceramic substrate |
US7691469B2 (en) | 2005-09-16 | 2010-04-06 | Murata Manufacturing Co., Ltd. | Ceramic multilayer substrate and method for manufacturing the same |
US20100224396A1 (en) * | 2007-11-30 | 2010-09-09 | Murata Manufacturing Co., Ltd. | Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component |
US8304661B2 (en) | 2007-11-30 | 2012-11-06 | Murata Manufacturing Co., Ltd. | Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component |
Also Published As
Publication number | Publication date |
---|---|
US20030211302A1 (en) | 2003-11-13 |
DE60038756D1 (en) | 2008-06-19 |
EP1033749B1 (en) | 2008-05-07 |
EP1033749A2 (en) | 2000-09-06 |
US6815046B2 (en) | 2004-11-09 |
JP3656484B2 (en) | 2005-06-08 |
EP1033749A3 (en) | 2003-08-06 |
JP2000315864A (en) | 2000-11-14 |
US6432239B1 (en) | 2002-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6432239B1 (en) | Method of producing ceramic multilayer substrate | |
US4645552A (en) | Process for fabricating dimensionally stable interconnect boards | |
EP0244696A2 (en) | Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors | |
US6942833B2 (en) | Ceramic multilayer substrate manufacturing method and unfired composite multilayer body | |
JP3003413B2 (en) | Method for manufacturing multilayer ceramic substrate | |
US6488795B1 (en) | Multilayered ceramic substrate and method of producing the same | |
JP3351043B2 (en) | Method for manufacturing multilayer ceramic substrate | |
JPH05327218A (en) | Manufacture of multilayer ceramic base | |
JP2803414B2 (en) | Method for manufacturing multilayer ceramic substrate | |
US7204900B1 (en) | Method of fabricating structures using low temperature cofired ceramics | |
JPH06164143A (en) | Manufacture of multilayer hybrid circuit | |
JP3413880B2 (en) | Method for producing multilayer ceramic sintered body | |
JP2002118194A (en) | Method for manufacturing ceramic multilayer board for flip-chip | |
JP2812605B2 (en) | Method for manufacturing multilayer ceramic substrate | |
JPH0878849A (en) | Ceramic multilayered circuit board and its manufacture | |
JPH06326470A (en) | Manufacture of multilayered ceramic board | |
JP2002076628A (en) | Manufacturing method of glass ceramic substrate | |
JPH05327220A (en) | Manufacture of multilayer ceramic base | |
JPH0221157B2 (en) | ||
JPH07202372A (en) | Ceramic wiring board, its manufacture, and mounting structure | |
JP2515165B2 (en) | Method for manufacturing multilayer wiring board | |
JP2001339160A (en) | Method for producing ceramic multilayer wiring board | |
JP2551064B2 (en) | Manufacturing method of ceramic multilayer substrate | |
JP3491698B2 (en) | Method for manufacturing multilayer circuit board | |
JPH11135945A (en) | Manufacture of multilayer ceramic board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |