US20020016075A1 - Method of patterning an ITO layer - Google Patents
Method of patterning an ITO layer Download PDFInfo
- Publication number
- US20020016075A1 US20020016075A1 US09/883,969 US88396901A US2002016075A1 US 20020016075 A1 US20020016075 A1 US 20020016075A1 US 88396901 A US88396901 A US 88396901A US 2002016075 A1 US2002016075 A1 US 2002016075A1
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- Prior art keywords
- ito layer
- amorphous ito
- amorphous
- patterning
- layer
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000000059 patterning Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 14
- 238000004544 sputter deposition Methods 0.000 claims abstract description 10
- 238000005224 laser annealing Methods 0.000 claims abstract description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims abstract description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 21
- 235000006408 oxalic acid Nutrition 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000005530 etching Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method of patterning a transparent electrode of Indium Tin Oxide (ITO) and, more particularly, to a method of crystallizing the transparent electrode of ITO.
- ITO Indium Tin Oxide
- a transparent conductive layer of Indium Tin Oxide (ITO) is practically applied to the fabrication of a contact of contact panel, an electrode of liquid crystal display (LCD), a thermal reflective coating, a gas-sensing sensor, a static electricity-resistance coating, and an abrasion-resistance coating of glass.
- the ITO layer may be formed by a chemical film-forming method, such as spray, chemical evaporation, or dipping.
- the ITO layer may be formed by a physical film-forming method, such as vacuum evaporation or sputtering.
- sputtering can form an ITO layer of a low resistance and a uniform thickness on a substrate.
- the ITO layer is then patterned by conventional photolithography and etching with oxalic acid, the patterned ITO layer cannot fit in with the requirements for product properties.
- FIG. 1 is a flow chart of a conventional method of patterning an ITO layer.
- step 10 of sputtering an amorphous ITO layer is deposited on a substrate.
- conventional photolithography which comprises a step 12 of photoresist coating, a step 14 of soft baking, a step 16 of exposure, a step 18 of developing, a step 20 of hard baking, a step 22 of etching by oxalic acid, and a step 22 of photoresist stripping, is carried out on the amorphous ITO layer.
- the step 14 of soft baking drives out the solvents existing in the photoresist.
- the step 16 of exposure makes the photoresist absorb appropriate energy so as to proceed with photochemical transformation.
- the step 18 of developing forms the potential pattern that is transferred to the photoresist.
- the step 20 of hard baking is used to further reduce the solvent remaining in the photoresist and fix the profile of the patterned photoresist.
- the step 22 of etching by oxalic acid removes the amorphous ITO layer not covered by the patterned photoresist, thus forming the pattern of the amorphous ITO layer.
- annealing is performed in an oven to turn the amorphous ITO layer into a crystallized ITO layer.
- the ITO layer can achieve the expected resistance and transparency.
- the process temperature is lower than the process temperature in the subsequent step 20 of hard baking.
- the higher temperature in the step 20 of hard baking causes a microcrystalline phenomenon on the surface of the amorphous ITO layer.
- the process temperature is improperly controlled in sputtering or photolithography, the microcrystalline phenomenon can be formed. Since oxalic acid is not the excellent etchant for etching crystallized materials, the step 22 of etching cannot completely remove the crystalline area of the ITO layer and this decreases the accuracy of patterning the ITO layer.
- the present invention provides a method of patterning an ITO layer to pattern and crystallize the amorphous ITO layer at the same time so as to simplify the procedure.
- ITO indium tin oxide
- amorphous ITO layer is deposited on the glass substrate.
- ELA excimer laser annealing
- the amorphous ITO layer within a predetermined pattern is turned into a crystalline ITO layer.
- an etch solution the amorphous ITO layer outside the predetermine pattern is removed.
- Yet another object of the invention is to simply the method of patterning the ITO layer.
- FIG. 1 is a flow chart of a conventional method of patterning an ITO layer.
- FIG. 2 is a flow chart of the method of patterning an ITO layer according to the present invention.
- FIG. 3 is a schematic diagram of an ELA apparatus for patterning the ITO layer.
- the present invention provides a method of patterning an ITO layer that is suitable for fabricating the products, such as thin film transistor (TFT), liquid crystal display (LCD), organic light emitting diode (OLED), and plasma display panel (PDP).
- TFT thin film transistor
- LCD liquid crystal display
- OLED organic light emitting diode
- PDP plasma display panel
- FIG. 2 is a flow chart of the method of patterning an ITO layer according to the present invention.
- step 30 of sputtering with H 2 O an amorphous ITO layer of 200 ⁇ 800 ⁇ thickness is deposited on a glass substrate.
- a high-energy pulsed laser directs laser radiation at selected regions of the amorphous ITO layer to expose the amorphous ITO layer to very high temperatures for short durations.
- the amorphous ITO layer is crystallized without damage to the underlying glass substrate, and the crystalline ITO layer achieves the expected resistance and transparency.
- the step 34 of etching by oxalic acid removes the amorphous ITO layer outside the selected regions, thus precisely forming the expected pattern of the ITO layer.
- FIG. 3 is a schematic diagram of an ELA apparatus for patterning the ITO layer.
- laser emitter 42 emits a pulsed beam 44 that passes through a beam homogenizer 46 .
- the pulsed beam 44 is a high-energy coherent radiation at a selective wavelength.
- the use of laser depends on the required design (parameters), for example, XeCl lasers emit UV radiation at a wavelength of 308 nm; KrF lasers operate at a wavelength of 248 nm.
- the beam homogenizer 46 installed below the laser emitter 42 is an optical system that produces a substantially uniform beam profile. After the pulsed beam 44 passes through the beam homogenizer 46 , a homogenized beam 47 of a size between 10 mm 2 and 50 mm 2 is emerged.
- the homogenized beam 47 passes through a patterned photo mask disposed on a reticle scanning stage 48 , and then is centralized by a lens 50 to direct irradiate selected regions of an amorphous ITO layer 38 deposited on a glass substrate 36 .
- the selected regions of the amorphous ITO layer 38 is exposed to very high temperatures for short durations, resulting crystallization in selected regions of the amorphous ITO layer 38 .
- the glass substrate 36 is placed on a movable stage 52 that can move the glass substrate 36 to a proper position to ensure that the homogenized beam 47 accurately radiates the selected regions on the amorphous ITO layer 38 .
- the movable stage 52 can redirect the pulsed beam 44 to aim it at different target regions on the glass substrate by moving the laser emitter 42 and related optics to a fixed stage.
- the power level of the laser emitter 42 , the duration of the pulsed beam 44 , and the size of the homogenized beam 47 determine the number of exposures to the selected region on the glass substrate 36 .
- the ELA apparatus 40 is readily programmed to perform multiple exposures to properly anneal and crystallize the amorphous ITO layer 38 .
- the power level of the laser emitter 42 is 50 ⁇ 200 mJ/cm 2 .
- the step 32 of ELA replaces the conventional photolithography process.
- the series of complicated steps of photoresist coating, soft baking, exposure, developing, hard baking, and photoresist stripping are omitted.
- the amorphous ITO is turned into crystalline ITO. Therefore, the process of patterning the ITO layer is simplified, and the disadvantages of remaining photoresist, remaining developer solution, bended substrate, and contaminated ITO layer caused by man-made carelessness and improper process control are avoided.
- the present invention exposes the selected regions of the amorphous ITO layer to the high-temperature laser beam for short durations to crystallize the amorphous ITO layer. This can prevent a microcrystalline phenomenon on the surface of the amorphous ITO layer, and therefore the ITO layer is accurately patterned in the subsequent step of etching by oxalic acid.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a method of patterning a transparent electrode of Indium Tin Oxide (ITO) and, more particularly, to a method of crystallizing the transparent electrode of ITO.
- 2. Description of the Related Art
- A transparent conductive layer of Indium Tin Oxide (ITO) is practically applied to the fabrication of a contact of contact panel, an electrode of liquid crystal display (LCD), a thermal reflective coating, a gas-sensing sensor, a static electricity-resistance coating, and an abrasion-resistance coating of glass. The ITO layer may be formed by a chemical film-forming method, such as spray, chemical evaporation, or dipping. Alternatively, the ITO layer may be formed by a physical film-forming method, such as vacuum evaporation or sputtering. Generally, sputtering can form an ITO layer of a low resistance and a uniform thickness on a substrate. However, when the ITO layer is then patterned by conventional photolithography and etching with oxalic acid, the patterned ITO layer cannot fit in with the requirements for product properties.
- FIG. 1 is a flow chart of a conventional method of patterning an ITO layer. First, at
step 10 of sputtering, an amorphous ITO layer is deposited on a substrate. Then, conventional photolithography, which comprises astep 12 of photoresist coating, astep 14 of soft baking, astep 16 of exposure, astep 18 of developing, astep 20 of hard baking, astep 22 of etching by oxalic acid, and astep 22 of photoresist stripping, is carried out on the amorphous ITO layer. Thestep 14 of soft baking drives out the solvents existing in the photoresist. Thestep 16 of exposure makes the photoresist absorb appropriate energy so as to proceed with photochemical transformation. Thestep 18 of developing forms the potential pattern that is transferred to the photoresist. Thestep 20 of hard baking is used to further reduce the solvent remaining in the photoresist and fix the profile of the patterned photoresist. Thestep 22 of etching by oxalic acid removes the amorphous ITO layer not covered by the patterned photoresist, thus forming the pattern of the amorphous ITO layer. Finally, atstep 26, annealing is performed in an oven to turn the amorphous ITO layer into a crystallized ITO layer. Thus the ITO layer can achieve the expected resistance and transparency. - However, at the
step 10 of sputtering with H2O, when the amorphous ITO layer is continuously deposited to reach a thickness of more than 800 Å, the process temperature is lower than the process temperature in thesubsequent step 20 of hard baking. Thus, the higher temperature in thestep 20 of hard baking causes a microcrystalline phenomenon on the surface of the amorphous ITO layer. Also, when the process temperature is improperly controlled in sputtering or photolithography, the microcrystalline phenomenon can be formed. Since oxalic acid is not the excellent etchant for etching crystallized materials, thestep 22 of etching cannot completely remove the crystalline area of the ITO layer and this decreases the accuracy of patterning the ITO layer. - In addition, in the series of
steps 12˜24, exposured photoresist and developer solution are easily remained on the substrate, thus effecting the properties of the subsequent etching or deposition. Also, thecomplicated steps 12˜26 have high production costs and may cause the substrate to be bended, damaged or contaminated if man-made carelessness and improper process control occur. - Thus, a method of patterning an ITO layer solving the aforementioned problems is called for (desired).
- The present invention provides a method of patterning an ITO layer to pattern and crystallize the amorphous ITO layer at the same time so as to simplify the procedure.
- The method of patterning an indium tin oxide (ITO) layer is performed on a glass substrate. First, using sputtering, an amorphous ITO layer is deposited on the glass substrate. Then, using excimer laser annealing (ELA), the amorphous ITO layer within a predetermined pattern is turned into a crystalline ITO layer. Finally, using an etch solution, the amorphous ITO layer outside the predetermine pattern is removed.
- Accordingly, it is a principle object of the invention to provide excimer laser annealing for replacing the conventional photolithography process.
- It is another object of the invention to use excimer laser annealing to pattern and crystallize the amorphous ITO layer at the same time.
- Yet another object of the invention is to simply the method of patterning the ITO layer.
- It is a further object of the invention to accurately pattern the ITO layer.
- These and other objects of the present invention will become readily apparent upon further review of the following specification and drawings.
- FIG. 1 is a flow chart of a conventional method of patterning an ITO layer.
- FIG. 2 is a flow chart of the method of patterning an ITO layer according to the present invention.
- FIG. 3 is a schematic diagram of an ELA apparatus for patterning the ITO layer.
- Similar reference characters denote corresponding features consistently throughout the attached drawings.
- The present invention provides a method of patterning an ITO layer that is suitable for fabricating the products, such as thin film transistor (TFT), liquid crystal display (LCD), organic light emitting diode (OLED), and plasma display panel (PDP). Hereinafter, the method of patterning an ITO layer is applied to the formation of a transparent electrode in LCD. FIG. 2 is a flow chart of the method of patterning an ITO layer according to the present invention. First, at
step 30 of sputtering with H2O, an amorphous ITO layer of 200˜800 Å thickness is deposited on a glass substrate. Then, atstep 32 of excimer laser annealing (ELA), a high-energy pulsed laser directs laser radiation at selected regions of the amorphous ITO layer to expose the amorphous ITO layer to very high temperatures for short durations. Thus, the amorphous ITO layer is crystallized without damage to the underlying glass substrate, and the crystalline ITO layer achieves the expected resistance and transparency. Finally, thestep 34 of etching by oxalic acid removes the amorphous ITO layer outside the selected regions, thus precisely forming the expected pattern of the ITO layer. - FIG. 3 is a schematic diagram of an ELA apparatus for patterning the ITO layer. In an
ELA apparatus 40,laser emitter 42 emits apulsed beam 44 that passes through abeam homogenizer 46. Thepulsed beam 44 is a high-energy coherent radiation at a selective wavelength. The use of laser depends on the required design (parameters), for example, XeCl lasers emit UV radiation at a wavelength of 308 nm; KrF lasers operate at a wavelength of 248 nm. Thebeam homogenizer 46 installed below thelaser emitter 42 is an optical system that produces a substantially uniform beam profile. After thepulsed beam 44 passes through thebeam homogenizer 46, ahomogenized beam 47 of a size between 10 mm2 and 50 mm2 is emerged. - Next, the
homogenized beam 47 passes through a patterned photo mask disposed on areticle scanning stage 48, and then is centralized by alens 50 to direct irradiate selected regions of anamorphous ITO layer 38 deposited on aglass substrate 36. Thus, the selected regions of theamorphous ITO layer 38 is exposed to very high temperatures for short durations, resulting crystallization in selected regions of theamorphous ITO layer 38. - The
glass substrate 36 is placed on amovable stage 52 that can move theglass substrate 36 to a proper position to ensure that thehomogenized beam 47 accurately radiates the selected regions on theamorphous ITO layer 38. Alternatively, themovable stage 52 can redirect thepulsed beam 44 to aim it at different target regions on the glass substrate by moving thelaser emitter 42 and related optics to a fixed stage. The power level of thelaser emitter 42, the duration of thepulsed beam 44, and the size of thehomogenized beam 47 determine the number of exposures to the selected region on theglass substrate 36. TheELA apparatus 40 is readily programmed to perform multiple exposures to properly anneal and crystallize theamorphous ITO layer 38. Generally, the power level of thelaser emitter 42 is 50˜200 mJ/cm2. - In the present invention, the
step 32 of ELA replaces the conventional photolithography process. Thus the series of complicated steps of photoresist coating, soft baking, exposure, developing, hard baking, and photoresist stripping are omitted. Also, at the same time when the ITO layer is patterned, the amorphous ITO is turned into crystalline ITO. Therefore, the process of patterning the ITO layer is simplified, and the disadvantages of remaining photoresist, remaining developer solution, bended substrate, and contaminated ITO layer caused by man-made carelessness and improper process control are avoided. Further, compared with performing hard baking on the glass substrate, the present invention exposes the selected regions of the amorphous ITO layer to the high-temperature laser beam for short durations to crystallize the amorphous ITO layer. This can prevent a microcrystalline phenomenon on the surface of the amorphous ITO layer, and therefore the ITO layer is accurately patterned in the subsequent step of etching by oxalic acid. - It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims.
Claims (10)
Applications Claiming Priority (3)
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TW089115687A TWI256976B (en) | 2000-08-04 | 2000-08-04 | Method of patterning an ITO layer |
TW89115687A | 2000-08-04 | ||
TW89115687 | 2000-08-04 |
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