US20020014688A1 - Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials - Google Patents
Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials Download PDFInfo
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- US20020014688A1 US20020014688A1 US09/261,849 US26184999A US2002014688A1 US 20020014688 A1 US20020014688 A1 US 20020014688A1 US 26184999 A US26184999 A US 26184999A US 2002014688 A1 US2002014688 A1 US 2002014688A1
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- integrated circuit
- underfill material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Definitions
- the present invention relates to an integrated circuit package.
- FIG. 1 shows a type of integrated circuit package that is commonly referred to as flip chip or C 4 package.
- the integrated circuit 1 contains a number of solder bumps 2 that are soldered to a top surface of a substrate 3 .
- the substrate 3 is typically constructed from a composite material which has a coefficient of thermal expansion that is different than the coefficient of thermal expansion for the integrated circuit. Any variation in the temperature of the package may cause a resultant differential expansion between the integrated circuit 1 and the substrate 3 . The differential expansion may induce stresses that can crack the solder bumps 2 . The solder bumps 2 carry electrical current between the integrated circuit 1 and the substrate 3 so that any crack in the bumps 2 may affect the operation of the circuit 1 .
- the package may include an underfill material 4 that is located between the integrated circuit 1 and the substrate 3 .
- the underfill material 4 is typically an epoxy which strengthens the solder joint reliability and the thermo-mechanical moisture stability of the IC package.
- the package may have hundreds of solder bumps 2 arranged in a two dimensional array across the bottom of the integrated circuit 1 .
- the epoxy 4 is typically applied to the solder bump interface by dispensing a single line of uncured epoxy material along one side of the integrated circuit. The epoxy then flows between the solder bumps. The epoxy 4 must be dispensed in a manner that covers all of the solder bumps 2 .
- the epoxy 4 It is desirable to dispense the epoxy 4 at only one side of the integrated circuit to insure that air voids are not formed in the underfill. Air voids weaken the structural integrity of the integrated circuit/substrate interface. Additionally, the underfill material 4 must have good adhesion strength with both the substrate 3 and the integrated circuit 1 to prevent delamination during thermal and moisture loading. The epoxy 4 must therefore be a material which is provided in a state that can flow under the entire integrated circuit/substrate interface while having good adhesion properties.
- the substrate 3 is typically constructed from a ceramic material. Ceramic materials are relatively expensive to produce in mass quantities. It would therefore be desirable to provide an organic substrate for a C 4 package. Organic substrates tend to absorb moisture which may be released during the underfill process. The release of moisture during the underfill process may create voids in the underfill material. Organic substrates also tend to have a higher coefficient of thermal expansion compared to ceramic substrates that may result in higher stresses in the die, underfill and solder bumps. The higher stresses in the epoxy may lead to cracks during thermal loading which propagate into the substrate and cause the package to fail by breaking metal traces. The higher stresses may also lead to die failure during thermal loading and increase the sensitivity to air and moisture voiding. The bumps may extrude into the voids during thermal loading, particularly for packages with a relatively high bump density. It would be desirable to provide a C4 package that utilizes an organic substrate.
- One embodiment of the present invention is an integrated circuit package which may include an integrated circuit that is mounted to a substrate.
- the package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate.
- FIG. 1 is a side view of an integrated circuit package of the prior art
- FIG. 2 is a top view of an embodiment of an integrated circuit package of the present invention.
- FIG. 3 is an enlarged side view of the integrated circuit package
- FIG. 4 is a schematic showing a process for assembling the integrated circuit package.
- FIGS. 2 and 3 show an embodiment of an integrated circuit package 10 of the present invention.
- the package 10 may include a substrate 12 which has a first surface 14 and a second opposite surface 16 .
- An integrated circuit 18 may be attached to the first surface 14 of the substrate 12 by a plurality of solder bumps 20 .
- the solder bumps 20 may be arranged in a two-dimensional array across the integrated circuit 18 .
- the solder bumps 20 may be attached to the integrated circuit 18 and to the substrate 12 with a process commonly referred to as controlled collapse chip connection (C4).
- C4 controlled collapse chip connection
- the solder bumps 20 may carry electrical current between the integrated circuit 18 and the substrate 12 .
- the substrate 12 may include an organic dielectric material.
- the package 10 may include a plurality of solder balls 22 that are attached to the second surface 16 of the substrate 12 .
- the solder balls 22 can be reflowed to attach the package 10 to a printed circuit board (not shown).
- the substrate 12 may contain routing traces, power/ground planes, vias, etc. which electrically connect the solder bumps 20 on the first surface 14 to the solder balls 22 on the second surface 16 .
- the integrated circuit 18 may be encapsulated by an encapsulant (not shown). Additionally, the package 10 may incorporate a thermal element (not shown) such as a heat slug or a heat sink to remove heat generated by the integrated circuit 18 .
- the package 10 may include a first underfill material 24 that is attached to the integrated circuit 18 and the substrate 12 .
- the package 10 may also include a second underfill material 26 which is attached to the substrate 12 and the integrated circuit 18 .
- the second underfill material 26 may form a circumferential fillet that surrounds and seals the edges of the IC and the first underfill material 24 .
- the sealing function of the second material 26 may inhibit moisture migration, cracking of the integrated circuit and cracking of the first underfill material.
- the first underfill material 24 may be an epoxy produced by Shin-Itsu of Japan under the product designation Semicoat 5230-JP.
- the Semicoat 5230-JP material provides favorable flow and adhesion properties.
- the second underfill material 26 may be an anhydride epoxy produced by Shin-Itsu under the product designation Semicoat 122X.
- the Semicoat 122X material has lower adhesion properties than the Semicoat 5230-JP material, but much better fracture/crack resistance.
- FIG. 4 shows a process for assembling the package 10 .
- the substrate 12 may be initially baked in an oven 28 in step 1 to remove moisture from the substrate material.
- the substrate 12 is preferably baked at a temperature greater than the process temperatures of the remaining underfill process steps to insure that moisture is not released from the substrate 12 in the subsequent steps.
- the substrate 12 may be baked at 163 degrees centigrade (° C.).
- the integrated circuit 18 may be mounted to the substrate 12 .
- the integrated circuit 18 is typically mounted by reflowing the solder bumps 20 .
- the first underfill material 24 may be dispensed onto the substrate 12 along one side of the integrated circuit 18 at a first dispensing station 30 .
- the first underfill material 24 may flow between the integrated circuit 18 and the substrate 12 under a wicking action.
- the first underfill material 24 may be dispensed at a temperature between 110 to 120° C. There may be a series of dispensing steps to fully fill the space between the integrated circuit 18 and the substrate 12 .
- the second underfill material 26 may be dispensed onto the substrate 12 along all four sides of the integrated circuit 18 at a second dispensing station 34 .
- the second material 26 may dispensed in a manner which creates a fillet that encloses and seals the first material 24 .
- the second underfill material 26 may be dispensed at a temperature of approximately 80 to 120° C.
- the first 24 and second 26 underfill materials may be cured into a hardened state.
- the materials may be cured at a temperature of approximately 150° C.
- solder balls 22 may be attached to the second surface 16 of the substrate 12 .
Abstract
An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.
Description
- 1. Field of the Invention
- The present invention relates to an integrated circuit package.
- 2. Background Information
- Integrated circuits are typically assembled into a package that is soldered to a printed circuit board. FIG. 1 shows a type of integrated circuit package that is commonly referred to as flip chip or C4 package. The integrated circuit 1 contains a number of
solder bumps 2 that are soldered to a top surface of asubstrate 3. - The
substrate 3 is typically constructed from a composite material which has a coefficient of thermal expansion that is different than the coefficient of thermal expansion for the integrated circuit. Any variation in the temperature of the package may cause a resultant differential expansion between the integrated circuit 1 and thesubstrate 3. The differential expansion may induce stresses that can crack thesolder bumps 2. Thesolder bumps 2 carry electrical current between the integrated circuit 1 and thesubstrate 3 so that any crack in thebumps 2 may affect the operation of the circuit 1. - The package may include an underfill material4 that is located between the integrated circuit 1 and the
substrate 3. The underfill material 4 is typically an epoxy which strengthens the solder joint reliability and the thermo-mechanical moisture stability of the IC package. - The package may have hundreds of
solder bumps 2 arranged in a two dimensional array across the bottom of the integrated circuit 1. The epoxy 4 is typically applied to the solder bump interface by dispensing a single line of uncured epoxy material along one side of the integrated circuit. The epoxy then flows between the solder bumps. The epoxy 4 must be dispensed in a manner that covers all of thesolder bumps 2. - It is desirable to dispense the epoxy4 at only one side of the integrated circuit to insure that air voids are not formed in the underfill. Air voids weaken the structural integrity of the integrated circuit/substrate interface. Additionally, the underfill material 4 must have good adhesion strength with both the
substrate 3 and the integrated circuit 1 to prevent delamination during thermal and moisture loading. The epoxy 4 must therefore be a material which is provided in a state that can flow under the entire integrated circuit/substrate interface while having good adhesion properties. - The
substrate 3 is typically constructed from a ceramic material. Ceramic materials are relatively expensive to produce in mass quantities. It would therefore be desirable to provide an organic substrate for a C4 package. Organic substrates tend to absorb moisture which may be released during the underfill process. The release of moisture during the underfill process may create voids in the underfill material. Organic substrates also tend to have a higher coefficient of thermal expansion compared to ceramic substrates that may result in higher stresses in the die, underfill and solder bumps. The higher stresses in the epoxy may lead to cracks during thermal loading which propagate into the substrate and cause the package to fail by breaking metal traces. The higher stresses may also lead to die failure during thermal loading and increase the sensitivity to air and moisture voiding. The bumps may extrude into the voids during thermal loading, particularly for packages with a relatively high bump density. It would be desirable to provide a C4 package that utilizes an organic substrate. - One embodiment of the present invention is an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate.
- FIG. 1 is a side view of an integrated circuit package of the prior art;
- FIG. 2 is a top view of an embodiment of an integrated circuit package of the present invention;
- FIG. 3 is an enlarged side view of the integrated circuit package;
- FIG. 4 is a schematic showing a process for assembling the integrated circuit package.
- Referring to the drawings more particularly by reference numbers, FIGS. 2 and 3 show an embodiment of an integrated
circuit package 10 of the present invention. Thepackage 10 may include asubstrate 12 which has afirst surface 14 and a secondopposite surface 16. Anintegrated circuit 18 may be attached to thefirst surface 14 of thesubstrate 12 by a plurality ofsolder bumps 20. Thesolder bumps 20 may be arranged in a two-dimensional array across the integratedcircuit 18. Thesolder bumps 20 may be attached to the integratedcircuit 18 and to thesubstrate 12 with a process commonly referred to as controlled collapse chip connection (C4). - The
solder bumps 20 may carry electrical current between the integratedcircuit 18 and thesubstrate 12. In one embodiment thesubstrate 12 may include an organic dielectric material. Thepackage 10 may include a plurality ofsolder balls 22 that are attached to thesecond surface 16 of thesubstrate 12. Thesolder balls 22 can be reflowed to attach thepackage 10 to a printed circuit board (not shown). - The
substrate 12 may contain routing traces, power/ground planes, vias, etc. which electrically connect thesolder bumps 20 on thefirst surface 14 to thesolder balls 22 on thesecond surface 16. Theintegrated circuit 18 may be encapsulated by an encapsulant (not shown). Additionally, thepackage 10 may incorporate a thermal element (not shown) such as a heat slug or a heat sink to remove heat generated by the integratedcircuit 18. - The
package 10 may include afirst underfill material 24 that is attached to theintegrated circuit 18 and thesubstrate 12. Thepackage 10 may also include asecond underfill material 26 which is attached to thesubstrate 12 and the integratedcircuit 18. Thesecond underfill material 26 may form a circumferential fillet that surrounds and seals the edges of the IC and thefirst underfill material 24. The sealing function of thesecond material 26 may inhibit moisture migration, cracking of the integrated circuit and cracking of the first underfill material. - The
first underfill material 24 may be an epoxy produced by Shin-Itsu of Japan under the product designation Semicoat 5230-JP. The Semicoat 5230-JP material provides favorable flow and adhesion properties. Thesecond underfill material 26 may be an anhydride epoxy produced by Shin-Itsu under the product designation Semicoat 122X. The Semicoat 122X material has lower adhesion properties than the Semicoat 5230-JP material, but much better fracture/crack resistance. - FIG. 4 shows a process for assembling the
package 10. Thesubstrate 12 may be initially baked in anoven 28 in step 1 to remove moisture from the substrate material. Thesubstrate 12 is preferably baked at a temperature greater than the process temperatures of the remaining underfill process steps to insure that moisture is not released from thesubstrate 12 in the subsequent steps. By way of example, thesubstrate 12 may be baked at 163 degrees centigrade (° C.). - After the baking process, the
integrated circuit 18 may be mounted to thesubstrate 12. Theintegrated circuit 18 is typically mounted by reflowing the solder bumps 20. - The
first underfill material 24 may be dispensed onto thesubstrate 12 along one side of theintegrated circuit 18 at a first dispensingstation 30. Thefirst underfill material 24 may flow between theintegrated circuit 18 and thesubstrate 12 under a wicking action. By way of example, thefirst underfill material 24 may be dispensed at a temperature between 110 to 120° C. There may be a series of dispensing steps to fully fill the space between theintegrated circuit 18 and thesubstrate 12. - The
package 10 may be moved through anoven 32 to complete a flow out and partial gel of thefirst underfill material 24. By way of example, theunderfill material 24 may be heated to a temperature of 120-145° C. in theoven 32 to partially gel theunderfill material 24. Partial gelling may reduce void formation and improve the adhesion between theintegrated circuit 18 and theunderfill material 24. The improvement in adhesion may decrease moisture migration and delamination betweenunderfill material 24 and theIC 18 as well as delamination betweenunderfill material 24 and the substrate. The reduction in void formation may decrease the likelihood of bump extrusion during thermal loading. The package may be continuously moved through theoven 32 which heats the underfill material during the wicking process. Continuously moving thesubstrate 12 during the wicking process decreases the time required to underfill the integrated circuit and thus reduces the cost of producing the package. Thesubstrate 12 can be moved betweenstations oven 32 on a conveyer (not shown). - The
second underfill material 26 may be dispensed onto thesubstrate 12 along all four sides of theintegrated circuit 18 at asecond dispensing station 34. Thesecond material 26 may dispensed in a manner which creates a fillet that encloses and seals thefirst material 24. By way of example, thesecond underfill material 26 may be dispensed at a temperature of approximately 80 to 120° C. - The first24 and second 26 underfill materials may be cured into a hardened state. The materials may be cured at a temperature of approximately 150° C. After the
underfill materials solder balls 22 may be attached to thesecond surface 16 of thesubstrate 12. - While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that this invention not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art.
Claims (16)
1. An integrated circuit package, comprising:
a substrate;
an integrated circuit mounted to said substrate;
a first underfill material attached to said substrate and said integrated circuit; and, a second underfill material that is attached to said integrated circuit and said substrate.
2. The package as recited in claim 1 , wherein said second underfill material seals said first underfill material.
3. The package a recited in claim 1 , wherein said first underfill material has an adhesion strength that is greater than an adhesion strength of said second underfill material.
4. The package as recited in claim 1 , wherein said first underfill material is an epoxy.
5. The package as recited in claim 4 , wherein said second underfill material is an anhydride epoxy.
6. The package as recited in claim 1 , further comprising a solder bump that is attached to said integrated circuit and said substrate.
7. A process for underfilling an integrated circuit that is mounted to a substrate, comprising:
dispensing a first underfill material which becomes attached to the integrated circuit and the substrate; and,
dispensing a second underfill material which become attached to the integrated circuit and the substrate.
8. The process as recited in claim 7 , wherein the first underfill material flows between the integrated circuit and the substrate.
9. A process as recited in claim 8 , wherein the substrate moves within an oven while the first underfill material flows between the integrated circuit and the substrate.
10. The process as recited in claim 7 , wherein the second underfill material is dispensed in a pattern which surrounds the first underfill material.
11. The process as recited in claim 7 , further comprising the step of heating the substrate before the first underfill material is dispensed.
12. The process as recited in claim 11 , further comprising the step of heating the first underfill material to a partial gel state.
13. The process as recited in claim 12 , wherein the substrate is heated to a temperature that is greater than a temperature of said partially gelled first underfill material.
14. The process as recited in claim 7 , further comprising the step of mounting the integrated circuit to the substrate with a solder bump before the first underfill material is dispensed.
15. A process for mounting and underfilling an integrated circuit to a substrate, comprising:
baking the substrate;
mounting an integrated circuit to the substrate;
dispensing a first underfill material onto the substrate, wherein the first underfill material flows between the integrated circuit and the substrate while the substrate moves through an oven; and,
dispensing a second underfill material around the first underfill material.
16. The process as recited in claim 15 , further comprising the step of mounting the integrated circuit to the substrate with a solder bump before the first underfill material is dispensed.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/261,849 US20020014688A1 (en) | 1999-03-03 | 1999-03-03 | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
JP2000603092A JP2002538626A (en) | 1999-03-03 | 2000-02-08 | Controlled collapsed chip connection (C4) integrated circuit package with two different underfill materials |
CNB00804578XA CN1191627C (en) | 1999-03-03 | 2000-02-08 | A controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
MXPA01008580A MXPA01008580A (en) | 1999-03-03 | 2000-02-08 | A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials. |
AU29860/00A AU2986000A (en) | 1999-03-03 | 2000-02-08 | A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
KR10-2001-7011227A KR100522383B1 (en) | 1999-03-03 | 2000-02-08 | Method of a controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
PCT/US2000/003242 WO2000052756A1 (en) | 1999-03-03 | 2000-02-08 | A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
US09/874,666 US7141448B2 (en) | 1999-03-03 | 2001-06-05 | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/261,849 US20020014688A1 (en) | 1999-03-03 | 1999-03-03 | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/874,666 Division US7141448B2 (en) | 1999-03-03 | 2001-06-05 | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Publications (1)
Publication Number | Publication Date |
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US20020014688A1 true US20020014688A1 (en) | 2002-02-07 |
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ID=22995146
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US09/261,849 Abandoned US20020014688A1 (en) | 1999-03-03 | 1999-03-03 | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
US09/874,666 Expired - Lifetime US7141448B2 (en) | 1999-03-03 | 2001-06-05 | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/874,666 Expired - Lifetime US7141448B2 (en) | 1999-03-03 | 2001-06-05 | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Country Status (7)
Country | Link |
---|---|
US (2) | US20020014688A1 (en) |
JP (1) | JP2002538626A (en) |
KR (1) | KR100522383B1 (en) |
CN (1) | CN1191627C (en) |
AU (1) | AU2986000A (en) |
MX (1) | MXPA01008580A (en) |
WO (1) | WO2000052756A1 (en) |
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US7141448B2 (en) * | 1999-03-03 | 2006-11-28 | Intel Corporation | Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
US20150255312A1 (en) * | 2014-03-05 | 2015-09-10 | International Business Machines Corporation | Low-stress dual underfill packaging |
US20170290521A1 (en) * | 2016-04-11 | 2017-10-12 | Paradromics, Inc. | Neural-interface probe and methods of packaging the same |
US11401620B2 (en) | 2017-03-30 | 2022-08-02 | Paradromics, Inc. | Method of producing patterned microwire bundles |
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Also Published As
Publication number | Publication date |
---|---|
WO2000052756A1 (en) | 2000-09-08 |
US7141448B2 (en) | 2006-11-28 |
AU2986000A (en) | 2000-09-21 |
KR20010108306A (en) | 2001-12-07 |
JP2002538626A (en) | 2002-11-12 |
CN1350702A (en) | 2002-05-22 |
MXPA01008580A (en) | 2002-04-24 |
KR100522383B1 (en) | 2005-10-19 |
US20020017728A1 (en) | 2002-02-14 |
CN1191627C (en) | 2005-03-02 |
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Owner name: INTEL CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:RAMALINGAM, SURESH;MURALI, VENKATESAN;COOK, DUANE;REEL/FRAME:009984/0174 Effective date: 19990513 |
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