US20020011666A1 - Selectively coating bond pads - Google Patents

Selectively coating bond pads Download PDF

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US20020011666A1
US20020011666A1 US09/382,930 US38293099A US2002011666A1 US 20020011666 A1 US20020011666 A1 US 20020011666A1 US 38293099 A US38293099 A US 38293099A US 2002011666 A1 US2002011666 A1 US 2002011666A1
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Prior art keywords
bond
coating
solder ball
gold
bond pads
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US09/382,930
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US6403457B2 (en
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Patrick W. Tandy
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US Bank NA
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Priority to US09/382,930 priority Critical patent/US6403457B2/en
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TANDY, PATRICK W.
Priority to US09/769,976 priority patent/US20010002734A1/en
Publication of US20020011666A1 publication Critical patent/US20020011666A1/en
Application granted granted Critical
Publication of US6403457B2 publication Critical patent/US6403457B2/en
Priority to US10/721,062 priority patent/US6998714B2/en
Priority to US11/250,036 priority patent/US20060030147A1/en
Assigned to U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON TECHNOLOGY, INC.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT reassignment MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: MICRON TECHNOLOGY, INC.
Assigned to U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: MICRON TECHNOLOGY, INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MICRON SEMICONDUCTOR PRODUCTS, INC., MICRON TECHNOLOGY, INC.
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
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Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Assigned to MICRON TECHNOLOGY, INC., MICRON SEMICONDUCTOR PRODUCTS, INC. reassignment MICRON TECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
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    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85444—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Definitions

  • This invention relates generally to coating bond pads in the fabrication of integrated circuits.
  • wire bond pads and solder ball bond pads are generally desirable to coat with nickel and gold.
  • these coating processes are implemented simultaneously on both types of bond pads.
  • Wire bond bond pads typically need more gold than solder ball bond pads. Too little gold causes wire bonding problems. Too much gold causes solder ball joint embrittlement.
  • a method of coating solder ball and wire bond pads includes masking the solder ball pads. Gold is coated on the wire bond pads with the solder ball pads masked.
  • FIG. 1 is a process flow for one embodiment of the present invention
  • FIG. 2 is an enlarged cross-sectional view of a solder ball and a wire bond pad after nickel plating
  • FIG. 3 is an enlarged cross-sectional view of the embodiment shown in FIG. 2 after the solder ball bond pad has been masked;
  • FIG. 4 is an enlarged cross-sectional view corresponding to the embodiment shown in FIG. 3 after a thicker gold coat has been applied;
  • FIG. 5 is an enlarged cross-sectional view after the solder ball bond pads have been unmasked
  • FIG. 6 is an enlarged cross-sectional view of the embodiment shown in FIG. 5 after a thinner gold coat has been applied;
  • FIG. 7 is an enlarged cross-sectional view of the finished structure in accordance with one embodiment of the present invention.
  • FIG. 8 is a process flow for another embodiment of the present invention.
  • FIG. 9 is an enlarged cross-sectional view of a solder ball and a wire bond bond pad after the wire bond bond pads have been coated with gold;
  • FIG. 10 is an enlarged cross-sectional view after the solder ball bond pads have been unmasked
  • FIG. 11 is an enlarged cross-sectional view after the wire bond bond pads have been masked
  • FIG. 12 is an enlarged cross-sectional view after the solder ball bond pads have been coated.
  • FIG. 13 is an enlarged cross-sectional view after the wire bond bond pads have been unmasked.
  • a process for differentially coating solder ball bond pads and wire bond pads, shown in FIG. 1, may begin, in one embodiment of the present invention, by nickel plating wire bond pads 26 and solder ball bond pads 24 as indicated in block 10 of FIG. 1.
  • coating is intended to encompass conventional electrolytic and electroless plating processes as well as aqueous immersion coating processes.
  • coating is intended to be broader than conventional plating processes and is intended to refer to causing a metal layer to bond on top of another metal material.
  • a solder ball bond pad 24 may be positioned on a support structure 20 which also may bear a wire bond bond pad 26 .
  • the solder ball bond pad 24 is illustrated as being larger than the wire bond bond pad.
  • the present invention is not limited in any way to any particular geometry of the bond pads.
  • the solder ball bond pad 24 has a nickel coating 28 coated on it and the wire bond bond pad 26 is coated with a nickel coating 30 .
  • solder ball bond pad 24 is then masked as indicated in block 12 of FIG. 1. This is illustrated by the coating 32 in FIG. 3. Any suitable masking material may be utilized as the coating 32 including patterned dry film resist.
  • a thicker gold coating is applied to the wire bond bond pad 26 , as indicated in block 14 .
  • No coating is applied to the solder ball bond pad 24 which is masked off.
  • the resulting thicker gold coating 34 shown in FIG. 4, may be on the order of 0.1 to about 0.4 microns in thickness.
  • solder ball bond pad 24 may be unmasked, as indicated in block 16 .
  • the mask 32 has been removed, for example using an etching technique.
  • a thinner gold coating may be applied as indicated in block 18 in FIG. 1.
  • a thinner gold coating 36 may be applied over the nickel coating 28 on the solder ball bond pad 24 .
  • the same coating may be added to the coating 34 applied to the wire bond bond pad 26 to form a composite gold layer 38 .
  • Any of a variety of coating techniques, including electroless coating, immersion, and electrolytic plating, may be utilized to form the thinner gold coating.
  • the coating is applied in two steps to the wire bond bond pads in the embodiments illustrated in FIGS. 1 - 6 , it is also possible to provide the wire bond gold coating in one single step and then to mask off the wire bond bond pads to provide the thinner gold coating only on the solder ball bond pads.
  • the solder ball bond pads may have a gold coating with a thickness on the order of 0.1 to about 0.3 microns.
  • One advantageous coating thickness is about 0.25 microns.
  • a suitable gold coating 38 thickness on the wire bond bond pads is about 0.5 microns.
  • the solder ball bond pad 24 may be copper or copper coated.
  • the wire bond bond pad 26 may be formed, for example, of aluminum. However, other materials which are compatible with gold coating techniques may also be used.
  • a package 52 made in accordance with the techniques described above includes a laminate core 20 .
  • the laminate core 20 may be formed of an insulating material having a plurality of internal trace layers (not shown). Interconnections may be formed between various trace layers and the bond pads 40 and 42 contained on a surface of the core 20 .
  • the bond pads 40 may be solder ball bond pads for coupling to solder balls (not shown).
  • the bond pads 42 may be wire bond bond pads for coupling to bonding wires 50 also wire bonded to a die 44 through an opening 46 in the laminate core 20 .
  • solder ball bond pads 40 and wire bond bond pads 42 on the same surface may be gold coated to different thicknesses, as described above, to achieve a more desirable performance.
  • solder ball and wire bond bond pads are nickel coated as indicated in block 60 . This step is illustrated in FIG. 2. Next, the solder ball bond pads are masked as indicated in block 62 and FIG. 3.
  • the wire bond bond pads 26 are coated as indicated in block 64 .
  • the wire bond bond pads 26 are coated in one step to the full desired thickness.
  • the wire bond bond pad coating is indicated at 76 in FIG. 9.
  • the masking layer over the solder ball bond pads is indicated at 32 .
  • solder ball bond pads are unmasked as indicated at block 66 in FIG. 8. As shown in FIG. 10, the mask 32 has been removed for example by etching.
  • the wire bond bond pads are masked as indicated in block 68 .
  • the mask 78 is shown in position over the wire bond bond pads 26 in FIG. 11.
  • solder ball bond pads 24 may then be coated as suggested in block 70 and as illustrated at 80 in FIG. 12.
  • the wire bond bond pads 26 may be unmasked (block 72 in FIG. 8). As shown in FIG. 13, the mask 78 has been removed. In some embodiments, different coating techniques may be used for solder ball versus wire bond bond pads.

Abstract

Solder ball bond pads and wire bond pads may be selectively coated so that the wire bond bond pads have a thicker gold coating than the solder ball bond pads. This may reduce the embrittlement of solder ball joints while providing a sufficient thickness of gold for the wire bonding process. In general, gold coatings are desirable on electrical contact surfaces to prevent oxidation. However, the thickness of gold which is necessary on solder ball bond pads may be less and excessive gold may be disadvantageous. Thus, by masking the solder ball bond pads during the gold coating of the wire bond bond pads, a differential gold thickness may be achieved which is more advantageous for each application.

Description

    BACKGROUND
  • This invention relates generally to coating bond pads in the fabrication of integrated circuits. [0001]
  • It is generally desirable to coat wire bond pads and solder ball bond pads with nickel and gold. Currently these coating processes are implemented simultaneously on both types of bond pads. Wire bond bond pads typically need more gold than solder ball bond pads. Too little gold causes wire bonding problems. Too much gold causes solder ball joint embrittlement. [0002]
  • As a result, in situations in which both types of bond pads are contained on the same structure, conventional processing provides either too much gold to suit the solder ball bond pads or too little gold to suit the wire bond pads. Certainly, providing excessive gold coatings is generally not cost effective. [0003]
  • Thus, there is a need for a better way to coat bond pads in fabricating structures with both solder ball and wire bond bond pads. [0004]
    • SUMMARY
  • In accordance with one aspect, a method of coating solder ball and wire bond pads includes masking the solder ball pads. Gold is coated on the wire bond pads with the solder ball pads masked. [0005]
  • Other aspects are set forth in the accompanying detailed description and claims.[0006]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a process flow for one embodiment of the present invention; [0007]
  • FIG. 2 is an enlarged cross-sectional view of a solder ball and a wire bond pad after nickel plating; [0008]
  • FIG. 3 is an enlarged cross-sectional view of the embodiment shown in FIG. 2 after the solder ball bond pad has been masked; [0009]
  • FIG. 4 is an enlarged cross-sectional view corresponding to the embodiment shown in FIG. 3 after a thicker gold coat has been applied; [0010]
  • FIG. 5 is an enlarged cross-sectional view after the solder ball bond pads have been unmasked; [0011]
  • FIG. 6 is an enlarged cross-sectional view of the embodiment shown in FIG. 5 after a thinner gold coat has been applied; [0012]
  • FIG. 7 is an enlarged cross-sectional view of the finished structure in accordance with one embodiment of the present invention; [0013]
  • FIG. 8 is a process flow for another embodiment of the present invention; [0014]
  • FIG. 9 is an enlarged cross-sectional view of a solder ball and a wire bond bond pad after the wire bond bond pads have been coated with gold; [0015]
  • FIG. 10 is an enlarged cross-sectional view after the solder ball bond pads have been unmasked; [0016]
  • FIG. 11 is an enlarged cross-sectional view after the wire bond bond pads have been masked; [0017]
  • FIG. 12 is an enlarged cross-sectional view after the solder ball bond pads have been coated; and [0018]
  • FIG. 13 is an enlarged cross-sectional view after the wire bond bond pads have been unmasked.[0019]
    • DETAILED DESCRIPTION
  • A process for differentially coating solder ball bond pads and wire bond pads, shown in FIG. 1, may begin, in one embodiment of the present invention, by nickel plating [0020] wire bond pads 26 and solder ball bond pads 24 as indicated in block 10 of FIG. 1. As used herein, the term “coating” is intended to encompass conventional electrolytic and electroless plating processes as well as aqueous immersion coating processes. Thus, the term “coating” is intended to be broader than conventional plating processes and is intended to refer to causing a metal layer to bond on top of another metal material.
  • Conventional techniques for nickel coating include immersion using a chemical reducing agent such as sodium hypophosphate to reduce nickel salts. Such coatings may result in alloys with four to twelve percent phosphorus. However, conventional electrolytic and electroless nickel plating processes may be utilized as well. [0021]
  • Referring to FIG. 2, a solder [0022] ball bond pad 24 may be positioned on a support structure 20 which also may bear a wire bond bond pad 26. In the illustrated embodiment, the solder ball bond pad 24 is illustrated as being larger than the wire bond bond pad. However, the present invention is not limited in any way to any particular geometry of the bond pads. The solder ball bond pad 24 has a nickel coating 28 coated on it and the wire bond bond pad 26 is coated with a nickel coating 30.
  • The solder [0023] ball bond pad 24 is then masked as indicated in block 12 of FIG. 1. This is illustrated by the coating 32 in FIG. 3. Any suitable masking material may be utilized as the coating 32 including patterned dry film resist.
  • Referring again to FIG. 1, a thicker gold coating is applied to the wire [0024] bond bond pad 26, as indicated in block 14. No coating is applied to the solder ball bond pad 24 which is masked off. The resulting thicker gold coating 34, shown in FIG. 4, may be on the order of 0.1 to about 0.4 microns in thickness.
  • Next the solder [0025] ball bond pad 24 may be unmasked, as indicated in block 16. As illustrated in FIG. 5, the mask 32 has been removed, for example using an etching technique. Thereafter, a thinner gold coating may be applied as indicated in block 18 in FIG. 1.
  • Thus, as shown in FIG. 6, a [0026] thinner gold coating 36 may be applied over the nickel coating 28 on the solder ball bond pad 24. The same coating may be added to the coating 34 applied to the wire bond bond pad 26 to form a composite gold layer 38. Any of a variety of coating techniques, including electroless coating, immersion, and electrolytic plating, may be utilized to form the thinner gold coating.
  • While the coating is applied in two steps to the wire bond bond pads in the embodiments illustrated in FIGS. [0027] 1-6, it is also possible to provide the wire bond gold coating in one single step and then to mask off the wire bond bond pads to provide the thinner gold coating only on the solder ball bond pads.
  • As a result of the processing described above, the solder ball bond pads may have a gold coating with a thickness on the order of 0.1 to about 0.3 microns. One advantageous coating thickness is about 0.25 microns. In general, it is desirable to provide a coating thickness on the solder ball bond pads which is sufficiently small to reduce solder ball joint embrittlement. It is also desirable to have a coating which is thick enough to prevent oxidation. [0028]
  • At the same time, it is desirable to provide a conventional thickness of gold on the wire bond bond pads to provide a good wire bond when using conventional wire bond bonding techniques. A [0029] suitable gold coating 38 thickness on the wire bond bond pads is about 0.5 microns.
  • In some embodiments of the present invention, the solder [0030] ball bond pad 24 may be copper or copper coated. The wire bond bond pad 26 may be formed, for example, of aluminum. However, other materials which are compatible with gold coating techniques may also be used.
  • Referring to FIG. 7, one embodiment of a [0031] package 52 made in accordance with the techniques described above includes a laminate core 20. The laminate core 20 may be formed of an insulating material having a plurality of internal trace layers (not shown). Interconnections may be formed between various trace layers and the bond pads 40 and 42 contained on a surface of the core 20. The bond pads 40 may be solder ball bond pads for coupling to solder balls (not shown). The bond pads 42 may be wire bond bond pads for coupling to bonding wires 50 also wire bonded to a die 44 through an opening 46 in the laminate core 20.
  • The solder [0032] ball bond pads 40 and wire bond bond pads 42 on the same surface may be gold coated to different thicknesses, as described above, to achieve a more desirable performance.
  • As illustrated in FIG. 8, in accordance with another embodiment of the present invention, the solder ball and wire bond bond pads are nickel coated as indicated in [0033] block 60. This step is illustrated in FIG. 2. Next, the solder ball bond pads are masked as indicated in block 62 and FIG. 3.
  • The wire [0034] bond bond pads 26 are coated as indicated in block 64. In this embodiment, the wire bond bond pads 26 are coated in one step to the full desired thickness. The wire bond bond pad coating is indicated at 76 in FIG. 9. The masking layer over the solder ball bond pads is indicated at 32.
  • Next the solder ball bond pads are unmasked as indicated at [0035] block 66 in FIG. 8. As shown in FIG. 10, the mask 32 has been removed for example by etching.
  • Referring again to FIG. 8, the wire bond bond pads are masked as indicated in [0036] block 68. The mask 78 is shown in position over the wire bond bond pads 26 in FIG. 11.
  • The solder [0037] ball bond pads 24 may then be coated as suggested in block 70 and as illustrated at 80 in FIG. 12. The wire bond bond pads 26 may be unmasked (block 72 in FIG. 8). As shown in FIG. 13, the mask 78 has been removed. In some embodiments, different coating techniques may be used for solder ball versus wire bond bond pads.
  • While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover all such modifications and variations as fall within the true spirit and scope of this present invention.[0038]

Claims (36)

What is claimed is:
1. A method of coating solder ball and wire bond bond pads comprising:
masking said solder ball bond pads; and
coating gold on said wire bond bond pads with said solder ball bond pads masked.
2. The method of claim 1 including providing a different gold coating thickness on said solder ball bond pads and said wire bond bond pads.
3. The method of claim 2 including providing a thicker gold coating on said wire bond bond pads than on said solder ball bond pads.
4. The method of claim 3 including providing a gold coating, on said wire bond bond pads, having a thickness of about 0.5 microns and providing a solder ball bond pad gold coating of approximately 0.1 to 0.3 microns in thickness.
5. The method of claim 1 including nickel coating said solder ball and said wire bond bond pads at the same time before coating said wire bond bond pads with gold.
6. The method of claim 1 including coating said wire bond bond pads with a first gold coating and coating both of said solder ball bond pads and said wire bond bond pads with a second gold coating.
7. The method of claim 6 wherein said second gold coating is thinner than said first gold coating.
8. The method of claim 1 including using an electroless plating technique to coat gold on said wire bond bond pads.
9. The method of claim 1 including forming a laminate structure having solder ball bond pads and wire bond bond pads on the same surface.
10. The method of claim 1 wherein said solder ball bond pads are gold coated in a single step.
11. The method of claim 10 including coating said solder ball bond pads and said wire bond bond pads while the other of said solder ball and wire bond bond pads is masked.
12. A method of coating two different types of bond pads on the same surface comprising:
masking off a first type of bond pad; and
coating a metal on the second type of bond pad with said first type of bond pad being masked.
13. The method of claim 12 including masking solder ball bond pads.
14. The method of claim 13 including coating metal on wire bond bond pads.
15. The method of claim 14 including coating gold on said wire bond bond pads.
16. The method of claim 15 including unmasking said solder ball bond pads and coating a metal on both said wire bond bond pads and said solder ball bond pads.
17. The method of claim 12 including providing different coating thicknesses on said first and second types of bond pads.
18. The method of claim 12 including coating gold on said second type of bond pad.
19. The method of claim 18 wherein said first type of bond pad is a solder ball bond pad and said second type of bond pad is a wire bond bond pad, coating gold on said wire bond bond pad to a thickness of about 0.5 microns and coating gold on said solder ball bond pads to a thickness of about 0.1 to about 0.3 microns.
20. The method of claim 19 including nickel coating said first and second types of bond pads at the same time before coating said wire bond bond pads with said metal.
21. The method of claim 12 including coating both said first and second types of bond pads with said metal after coating said metal on said second type of bond pad.
22. The method of claim 12 including masking off said second type of bond pad and coating metal on said first type of bond pad.
23. A method of forming solder ball and wire bond bond pads comprising:
forming a solder ball bond pad;
coating gold over said solder ball bond pad;
forming a wire bond bond pad; and
coating gold over said wire bond bond pad to a thickness greater than said gold coating over said solder ball bond pad.
24. The method of claim 23 including masking said solder ball bond pad and coating gold on said wire bond bond pad with said solder ball bond pad masked.
25. The method of claim 24 including providing a gold coating on said wire bond bond pad having a thickness of about 0.5 microns.
26. The method of claim 23 including providing a gold coating on said solder ball bond pad of approximately 0.1 to 0.3 microns in thickness.
27. The method of claim 23 including coating said wire bond bond pads with a first gold coating and coating both of said solder ball and said wire bond bond pads with a second gold coating.
28. The method of claim 23 including coating said solder ball bond pad to a thickness of approximately 0.25 microns.
29. A method of forming solder ball and wire bond bond pads comprising:
masking said solder ball bond pad;
coating gold over said wire bond bond pad;
masking said wire bond bond pad; and
coating gold over said solder ball bond pad.
30. The method of claim 29 including coating said wire bond bond pad with gold to a thickness greater than the gold coating over said solder ball bond pad.
31. A packaged integrated circuit device comprising:
a plurality of gold coated solder ball bond pads;
a plurality of gold coated wire bond bond pads; and
the gold coating on said solder ball bond pads being thinner than the gold coating on said wire bond bond pads.
32. The device of claim 31 wherein the thickness of the gold on said solder ball bond pads is sufficiently low to reduce the likelihood of solder ball joint embrittlement.
33. The device of claim 31 wherein said solder ball bond pads have a gold coating having a thickness of between about 0.1 and 0.3 microns.
34. The device of claim 33 wherein said solder ball bond pad gold coating has a thickness of about 0.25 microns.
35. The device of claim 33 wherein said wire bond bond pads have a gold coating thickness of approximately 0.5 microns.
36. The device of claim 31 wherein said solder ball bond pads and said wire bond bond pads are all contained on the same planar surface.
US09/382,930 1999-08-25 1999-08-25 Selectively coating bond pads Expired - Lifetime US6403457B2 (en)

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US09/382,930 US6403457B2 (en) 1999-08-25 1999-08-25 Selectively coating bond pads
US09/769,976 US20010002734A1 (en) 1999-08-25 2001-01-25 Selectively coating bond pads
US10/721,062 US6998714B2 (en) 1999-08-25 2003-11-24 Selectively coating bond pads
US11/250,036 US20060030147A1 (en) 1999-08-25 2005-10-13 Selectively coating bond pads

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US09/382,930 US6403457B2 (en) 1999-08-25 1999-08-25 Selectively coating bond pads

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US6403457B2 US6403457B2 (en) 2002-06-11

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US20010002734A1 (en) 2001-06-07
US6998714B2 (en) 2006-02-14
US20060030147A1 (en) 2006-02-09
US6403457B2 (en) 2002-06-11

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